JP2015182415A - mold apparatus and molding method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To unify temperature distribution of a mold body, improve molding quality, and increase productivity of moldings.SOLUTION: A mold apparatus comprises: a pair of openable/closable mold bodies which constitute a cavity 6 into which a resin material is charged; a first temperature adjustment circuit 11 and a second temperature adjustment circuit 12 which are arranged in at least one mold body 5a along the cavity 6 and through which temperature adjustment medium is allowed to flow; and a temperature adjustment device 13 which allows the temperature adjustment medium to flow simultaneously into the first and second temperature adjustment circuits 11 and 12. At least part of the first temperature adjustment circuit 11 and the second temperature adjustment circuit 12 extends adjacently to each other. An inlet 11a of the temperature adjustment medium of the first temperature adjustment circuit 11 and an outlet 12b of the temperature adjustment medium of the second temperature adjustment circuit 12 are adjacent to each other, and an outlet 11b of the temperature adjustment medium of the first temperature adjustment circuit 11 and an inlet 12a of the temperature adjustment medium of the second temperature adjustment circuit 12 are adjacently arranged.

Description

  The present invention relates to a mold apparatus for performing molding by filling a resin material into a cavity and a molding method using the mold apparatus.

As represented by injection molding, a technology for manufacturing a molded product with high accuracy by filling a resin material in a mold and curing it is currently applied to casing parts of various products. . In the injection molding method, the resin material melted in the cylinder of the injection machine is filled into a cavity processed into a desired shape in the mold, and the resin material cooled and solidified in the cavity is taken out from the mold. Thus, a desired molded product can be obtained. One important element of the injection molding method is temperature control of the mold. The reason is that the temperature control of the mold greatly affects the molding quality and productivity.
First, with regard to quality, weld lines that occur at the junction of resin materials, uneven transfer of resin materials to the mold surface, sink marks that occur due to cooling conditions, and warpage deformation that occurs due to uneven shrinkage of molded products The appearance of the product will be poor. Such appearance defects are likely to occur when there is a problem in the temperature control of the mold.
Next, regarding productivity, the cooling time for cooling and solidifying the molten resin material in the mold occupies a large weight in the molding time in the injection molding method. If there is a part where the temperature control of the mold is insufficient, the cooling and solidification time of that part becomes long, and the molding time is extended, which becomes a main factor that deteriorates the productivity. Also, when crystallized resin is used as the plastic material, the control of the crystallinity by controlling the temperature of the mold greatly affects the physical properties and molding shrinkage of the plastic material after molding. It becomes even more important.

  As described above, temperature control of the mold in the injection molding method is an important factor that greatly affects molding quality and productivity. A general method for temperature control of a mold is to form a temperature control circuit in the mold and circulate a temperature control medium such as water or oil in the temperature control circuit to control the temperature of the mold. Control is performed. However, processing of the temperature control circuit may be difficult, and a mold structure that can withstand the injection pressure of the resin material during molding is required, so a temperature control circuit structure that always prioritizes temperature control efficiency is realized. There are cases where it is not possible. The problems of molding quality and productivity due to mold temperature control have been important problems.

  On the other hand, strictly speaking, the temperature control of the mold in the injection molding method differs in desirable temperature control for each process. For example, in the filling step of filling the molten resin material into the mold, it is desirable to suppress an increase in the viscosity of the molten resin material by increasing the temperature of the mold. Thereby, not only can the filling pressure be reduced, but also effects such as prevention of the generation of weld lines and improvement of the transferability of the resin material to the mold surface can be obtained, and the appearance quality of the molded product is improved. However, in the cooling process in which the resin material is cooled and solidified in the mold, if the mold temperature is high, not only does the cooling time take a long time, but the productivity decreases, and the molded product deforms at the time of mold release. Occur. As a countermeasure for solving such a problem, a method of performing temperature control suitable for each process by changing the temperature of the temperature control medium during the filling process and the temperature of the temperature control medium during the cooling process has been proposed. . However, even when such a temperature control method is used, it is difficult to quickly change the temperature of a mold having a large heat capacity. Therefore, even if improvement in molding quality can be realized, there is a problem that it takes time to perform temperature control of the mold and productivity is lowered.

Therefore, Patent Document 1 discloses a technique aimed at eliminating restrictions on the workability of the mold temperature control circuit and improving the mold temperature control performance. Patent Document 1 describes a mold formed by sintering metal powder using laser light. As shown in FIG. 10, inside the mold 105, a temperature control circuit 111 that is formed simultaneously with the formation of the mold 105 is provided. The temperature control circuit 111 is formed in a spiral shape along the periphery of the cavity 106 of the mold. Since the shaping of the temperature control circuit 111 is completed simultaneously with the shaping of the mold 105, the degree of freedom in designing the temperature control circuit 111 is improved and the temperature adjustment circuit 111 can be manufactured in a short period of time. Further, by forming a resin layer on the inner wall of the temperature control circuit 111, the seepage of cooling water from the temperature control circuit 111 is prevented.
In this structure, the spiral temperature control circuit 111 is formed, so that the temperature control is performed along the periphery of the cavity 106 filled with the resin material as compared with the temperature control circuit formed by using conventional machining. It becomes possible to do. For this reason, improvement in temperature control performance can be expected.

Japanese Patent Laid-Open No. 11-348045

However, in the structure described in Patent Document 1 described above, as shown in FIG. 10, the temperature control circuit 111 is formed in a spiral shape, so that the entire length of the temperature control circuit 111 becomes long. For this reason, the temperature adjustment medium that has entered the temperature adjustment circuit 11 flows along the temperature adjustment circuit 111 and is affected by the temperature of the resin material in the cavity 106 before being discharged from the temperature adjustment circuit 111. The temperature will change.
Therefore, a temperature difference occurs between the temperature of the temperature adjustment medium near the inlet 111 a of the temperature adjustment circuit 111 and the temperature of the temperature adjustment medium near the outlet 111 b of the temperature adjustment circuit 111. As a result, a difference occurs in the surface temperature of the mold 105, and uniform temperature control cannot be performed. Therefore, the appearance of the molded product is partially different due to the temperature difference of the mold 105, and further the productivity is reduced. There is a problem.

  Therefore, an object of the present invention is to provide a mold apparatus and a molding method that can achieve uniform temperature distribution of a mold body, improve molding quality, and increase the productivity of a molded product.

In order to achieve the above-described object, a mold apparatus according to the present invention constitutes a cavity filled with a resin material, and is disposed along a cavity in a pair of mold bodies that can be opened and closed, and at least one mold body. A first temperature control circuit and a second temperature control circuit through which the temperature control medium is flown, and a temperature control device for simultaneously flowing the temperature control medium through the first and second temperature control circuits. The first temperature control circuit and the second temperature control circuit extend at least partially adjacent to each other. The inlet of the temperature control medium of the first temperature control circuit and the outlet of the temperature control medium of the second temperature control circuit are adjacent to each other, and the outlet of the temperature control medium of the first temperature control circuit and the second temperature control circuit The inlet of the temperature control medium is disposed adjacent to the temperature control medium.
In the present invention, “adjacent” is not limited to the state of being in contact with each other, but also includes the state of being separated by about 10 mm.

  A molding method according to the present invention is a molding method in which injection molding is performed using the above-described mold apparatus, and a temperature control medium is simultaneously supplied to the first and second temperature control circuits, and the mold body is set to a predetermined temperature. And a molding step of injecting a resin material into the temperature-controlled cavity after the temperature adjustment step and cooling and solidifying the resin material.

  According to the present invention, the temperature distribution of the mold can be made uniform, the molding quality can be improved, and the productivity of the molded product can be increased.

It is sectional drawing which shows the metal mold apparatus of the 1st Embodiment of this invention. It is a top view which shows the 1st and 2nd temperature control circuit of the stationary-side metal mold | die with which the metal mold apparatus of the 1st Embodiment of this invention is provided. It is a figure which shows the relationship between the position of the 1st and 2nd temperature control circuit in the 1st Embodiment of this invention, and the temperature of a temperature control medium. It is sectional drawing which shows the metal mold apparatus of the 2nd Embodiment of this invention. It is a top view which shows the metal mold apparatus of the 2nd Embodiment of this invention. It is sectional drawing which shows the metal mold apparatus of the 3rd Embodiment of this invention. It is a top view which shows the metal mold apparatus of the 3rd Embodiment of this invention. It is sectional drawing which shows the metal mold apparatus of the 4th Embodiment of this invention. It is sectional drawing which shows the metal mold apparatus of the 5th Embodiment of this invention. It is sectional drawing for demonstrating the technique relevant to this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the embodiments described below are technically preferable for carrying out the present invention, but the scope of the invention is not limited to the following embodiments.

(First embodiment)
A first embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a cross-sectional view of the mold apparatus according to the first embodiment. In FIG. 2, the top view of the 1st and 2nd temperature control circuit of the stationary-side metal mold | die with which the metal mold apparatus of 1st Embodiment is provided is shown.
As shown in FIG. 1, the mold apparatus of 1st Embodiment comprises the cavity 6 with which a resin material is filled, and the fixed side metal mold | die 5a and the movable side metal mold | die 5b as a pair of mold body which can be opened and closed. It has. In addition, the mold apparatus according to the first embodiment is arranged in a cavity 6 in each of the pair of fixed-side mold 5a and movable-side mold 5b, and a set of first molds in which a temperature control medium flows. A temperature control circuit 11 and a second temperature control circuit 12, and a temperature controller 13 as a temperature control device that allows a temperature control medium to flow through the first and second temperature control circuits 11 and 12 simultaneously are provided. In the following description, the pair of fixed mold 5a and movable mold 5b are also simply referred to as mold 5.
The fixed mold 5a is attached to the side from which the molten resin material is injected from an injection machine (not shown). The movable mold 5b is provided so as to be movable back and forth with respect to the fixed mold 1 by an opening / closing mechanism (not shown).
The cavity 6 is formed in the contact area between the fixed mold 5a and the movable mold 5b corresponding to the shape of the molded product. The molten resin material is injected and filled into the cavity 6 via a spool runner 15 provided on the fixed mold 5a side. In the following description, the surface that forms the cavity 6 in the fixed mold 5a and the movable mold 5b is referred to as a cavity surface 6a. That is, the cavity 6 is a space surrounded by the cavity surface 6a.

As shown in FIGS. 1 and 2, the fixed mold 5 a includes first and second temperature control circuits 11 and 12 that form two paths for flowing the temperature control medium. Similarly, the movable mold 5b includes first and second temperature control circuits 11 and 12 that form two paths for flowing a temperature control medium.
Each of the first and second temperature control circuits 11 and 12 includes inlets 11a and 12a to which a temperature control medium is supplied, and outlets 11b and 12b from which the temperature control medium is discharged, and each of the inlets 11a. , 12a and the respective outlets 11b, 12b are connected to the temperature controller 13.
As shown in FIG. 2, the first temperature control circuit 11 and the second temperature control circuit 12 partially extend adjacent to each other, and a portion extending adjacent to each other is a distance from the cavity 6. Are arranged equally.
The temperature control medium inlet 11a of the first temperature control circuit 11 and the temperature control medium outlet 12b of the second temperature control circuit 12 are disposed adjacent to each other. Further, the temperature control medium outlet 11 b of the first temperature control circuit 11 and the temperature control medium inlet 12 a of the second temperature control circuit 12 are disposed adjacent to each other. In other words, as for the 1st and 2nd temperature control circuits 11 and 12, each inlet 11a and 12a and each outlet 11b and 12b are arrange | positioned mutually reversely.

The temperature control medium supplied from the temperature controller 13 flows from the inlets 11a and 12a of the first and second temperature control circuits 11 and 12, flows through the first and second temperature control circuits 11 and 12, and exits. 11b and 12b, and returned to the temperature controller 13 again. Thus, the temperature of the mold 5 is controlled by circulating the temperature control medium through the first and second temperature control circuits 11 and 12.
As the temperature control medium flows through the first and second temperature control circuits 11 and 12, the molten resin material filled in the cavity 6 and the temperature control medium flowing through the first and second temperature control circuits 11 and 12 are used. Heat exchange with the Here, the main parts constituting the first and second temperature control circuits 11 and 12 provided in the fixed mold 5a are both disposed at substantially the same distance from the cavity surface 6a.

Further, in the fixed side mold 5a and the movable side mold 5b, both ends forming the inlet 11a and the outlet 11b of the first temperature control circuit 11 have a distance from the cavity 6 in the opening / closing direction of the movable side mold 5b. Switching is performed via a distance switching portion 16 that is an inclined road inclined with respect to an orthogonal plane. Thereby, both ends of the first temperature control circuit 11 and both ends of the second temperature control circuit 12 are arranged at appropriate positions so that the inlet 11a and the outlet 12b and the outlet 11b and the inlet 12a do not overlap. Adjacent to each other.
Similarly, in the fixed-side mold 5a and the movable-side mold 5b, the first temperature control circuit 11 is such that the folded portion located on the side opposite to the inlet 11a and the outlet 11b has a distance to the cavity 6 as well. Switching is performed via the switching portion 16. Thus, the folded portion of the first temperature control circuit 11 and the folded portion of the second temperature control circuit 12 are arranged so as not to intersect.

In FIG. 2, the top view of the 1st and 2nd temperature control circuits 11 and 12 about the fixed side metal mold | die 5a is shown. As shown in FIG. 2, the first and second temperature control circuits 11, 12 are in a range that is wider than the projected area of the cavity surface 6 a indicated by a broken line on the surface orthogonal to the opening / closing direction of the movable mold 5 b. It is formed over. The first temperature control circuit 11 and the second temperature control circuit 12 have circuit patterns that meander in a plurality of rows so that the temperature control medium flows in positions corresponding to the corners of the cavity surface 6a without stagnation. Is formed. Each of the first and second temperature control circuits 11 and 12 is arranged at equal intervals at least immediately below the cavity surface 6a with the portions constituting the first and second temperature control circuits 11 and 12 being alternately sandwiched therebetween. ing.
A partition plate 18 is provided between the first temperature control circuit 11 and the second temperature control circuit 12 as a partition member that partitions each other. Therefore, the 1st temperature control circuit 11 and the 2nd temperature control circuit 12 are divided | segmented by the partition plate 18 which comprises a side wall. The thickness of the partition plate 18 is desirably as thin as possible within a range that maintains the mechanical strength of the mold 5, and the thickness is about 2 mm as a reference. The reason is that each temperature control medium flowing through each of the first and second temperature control circuits 11 and 12 aims to change in temperature under the influence of the mutual temperature during heat exchange in the molding process. is there.

This point will be described in detail with reference to FIG. In FIG. 3, the figure of the relationship between the position in the 1st and 2nd temperature control circuits 11 and 12 in embodiment and the temperature of a temperature control medium is shown. In FIG. 3, the vertical axis indicates the temperature of the temperature adjustment medium, and the horizontal axis indicates the position in the first and second temperature adjustment circuits 11 and 12. With reference to FIG. 3, the relationship between the position in each of the first and second temperature control circuits 11 and 12 and the temperature of the temperature control medium will be considered.
When only one of the first and second temperature control circuits 11 and 12 is used alone, the temperature control medium that has entered from the inlets 11a and 12a is affected by the temperature of the resin material in the cavity 6, and the outlet As the temperature approaches 11b and 12b, the temperature of the temperature control medium gradually increases. In particular, as the first and second temperature control circuits 11 and 12 are faithfully formed along the shape of the cavity 6 and the total length of each temperature control circuit 11 and 12 becomes longer, the temperature of the temperature control medium increases. As a result, a temperature difference occurs between the vicinity of the inlets 11a and 12a on the cavity surface 6a and the vicinity of the outlets 11b and 12b on the cavity surface 6a, which causes a defective appearance of the molded product and a decrease in productivity.
However, as in the case of the mold 5 in the present embodiment, the first and second temperature control circuits 11 and 12 in which the inlets 11a and 12a and the outlets 11b and 12b are arranged opposite to each other are arranged close to each other. The above-described temperature difference is suppressed. In the present embodiment, as shown in FIG. 3, the first temperature control circuit 11 and the second temperature control circuit 11 and the second temperature control circuit 11 are affected by the temperature of each temperature control medium flowing through the first and second temperature control circuits 11 and 12. The temperature of each temperature control medium in the vicinity of the inlets 11a and 12a and in the vicinity of the outlets 11b and 12b is made uniform with the temperature control circuit 12. As a result, it is possible to prevent a temperature difference from occurring on the cavity surface 6a, so that the appearance and productivity of the molded product are improved.

Note that the temperature distribution shown in FIG. 3 is an example in the case where the temperature control media to be passed through the first temperature control circuit 11 and the second temperature control circuit 12 are set to the same temperature. The temperature distribution varies depending on the shape of the cavity, the temperature of the resin material during molding, the molding cycle, the structure of the temperature control circuit, and the like. For this reason, in consideration of these influences, the temperature of the temperature control medium flowing through the first temperature control circuit 11 and the second temperature are adjusted as necessary for the purpose of making the temperature of the mold 5 uniform. The temperature of the temperature adjustment medium that flows through the adjustment circuit 12 may be set to a different temperature.
In the present embodiment, the configuration having the first and second temperature control circuits 11 and 12 that are two systems will be described as an example, but the configuration is not limited to the configuration having only two systems of temperature control circuits. If necessary, a configuration having three or more temperature control circuits may be applied. The layer thickness formed by each of the first and second temperature control circuits 11 and 12 with respect to the opening / closing direction (direction orthogonal to the parting surface) of the movable mold 5b is 2 of the total thickness of the cavity 6. It is set with the double as a guide. The layer thickness of the temperature control circuit may be appropriately determined in consideration of the thermal control characteristics for the molded product, the fluidity of the temperature control medium, and the like. Moreover, as an example of the distance from the temperature control circuit to the cavity surface 6a, it is set to about 2 mm to 10 mm.

Further, the mold 5 in this embodiment includes a ring-shaped seal portion 18 that hermetically seals the spool runner 15 and the first and second temperature control circuits 11 and 12. The thickness of the seal portion 18 in the radial direction is about 1 mm as a guide. However, when the injection pressure is applied as in the spool runner 15 shown in the present embodiment, it is necessary to consider the amount of deflection due to the injection pressure. is there. Further, as shown in FIG. 1 (a), a part of the flow path constituting member constituting the inflow path such as the spool / runner 15 of the fixed mold 5a is provided through the temperature control circuits 11 and 12. It is called a penetrating member.
In a penetrating region where the penetrating member penetrates the temperature control circuits 11 and 12, a seal portion 18 is provided for sealing the first and second temperature control circuits 11 and 12 and the penetrating member. The seal portion 18 prevents the resin material and the temperature control medium from leaking around the penetrating member and the first and second temperature control circuits 11 and 12. The penetrating member is not limited to the flow path constituting member constituting the spool / runner 15. As a modification, although not shown, when an eject pin that penetrates the temperature control circuit is arranged in the mold, a seal portion is provided to seal the temperature control circuit and the through hole through which the eject pin moves. .

Further, inside the first and second temperature control circuits 11 and 12 included in the fixed side mold 5a and the movable side mold 5b, as shown in FIG. A plurality of support columns 19 are provided to connect the wall surface on the side separated from the cavity 6. The support column 19 maintains the distance (height) of the first and second temperature control circuits 11 and 12 with respect to the direction approaching and separating from the cavity 6, for example, the opening and closing direction of the movable mold, and the first and second The load applied to the second temperature control circuits 11 and 12 is supported.
The first and second temperature control circuits 11 and 12 are configured to maintain a constant cross-sectional area without changing the cross-sectional area in the entire circuit from the inlets 11a and 12a to the outlets 11b and 12b. It is desirable. For example, as shown in FIGS. 1C and 1D, the columns 19 that form hexagonal columns are arranged at a predetermined interval on the surface orthogonal to the opening and closing direction of the movable mold 5b. Accordingly, the first and second temperature control circuits 11 and 12 have a constant cross-sectional area over the entire first and second temperature control circuits 11 and 12 in a cross section orthogonal to the flow direction of the temperature control medium. it can. As shown in FIG.1 (d), each support | pillar 19 is arrange | positioned at predetermined intervals a and 2a.
Here, the temperature control circuit including a plurality of support columns inside is often difficult to process by general machining. For this reason, as a method of forming the first and second temperature control circuits 11 and 12 in the present embodiment, the target shape is obtained by laminating a metal powder with a laser at a predetermined thickness of about 50 μm. It is formed using the powder additive manufacturing method. In particular, the modeling device made by Matsuura Machinery Co., Ltd., which combines powder additive manufacturing and machining, can perform additive manufacturing while finishing the mold surface during additive manufacturing in a good state by machining, Suitable for powder additive manufacturing methods for mold applications.

As a material for forming the fixed mold 5a and the movable mold 5b, a general mold material, for example, a steel material (S50C, SKD61, SUS420, SKD11) can be used. However, considering processing using the powder additive manufacturing method described above, it is desirable to select a material suitable for the powder additive manufacturing method. An example of a material suitable for the powder additive manufacturing method is maraging steel. Sufficient durability as a mold can be ensured by performing an aging treatment after forming. As an example of the aging treatment conditions, it is held at 480 ° C. for 3 hours.
The first and second temperature control circuits 11 and 12 are arranged so as to cover the surface of the cavity 6 and allow the temperature control medium to flow at a position away from the cavity surface 6a by a certain distance.

  Next, the support | pillar 19 formed in the inside of the 1st and 2nd temperature control layer circuits 11 and 12 is demonstrated. The material of the support column 19 is basically formed of the same material as the mold material when formed using the above-described powder additive manufacturing method. The cross-sectional shape of the column 19 can be circular, square, hexagonal or the like, and is not particularly limited. It is desirable that the plurality of support columns 19 are basically formed in the same size and the same shape and are arranged at equal intervals. The reason is that when the size and arrangement density of the support columns 19 are different, a temperature distribution is generated when the temperature control medium is circulated through the first and second temperature control circuits 11 and 12 to control the temperature of the mold 5. This is because it becomes difficult to properly control the temperature of the mold 5.

  Further, the purpose of arranging the support column 19 in the first and second temperature control circuits 11 and 12 is to prevent the mold 5 from being deformed by the injection pressure at the time of molding. With regard to the arrangement of the support columns 19, an appropriate value is selected in consideration of the material and shape of the molded product, the material and shape of the mold, and the target temperature control, on the assumption that the mold 5 does not deform. It is desirable. As an example, ABS (Acrylonitrile Butadiene Styrene) resin is used as a molding material, the maximum pressure during molding is 50 MPa, and maraging steel is used as a mold material. Consider the case of 186 GPa. In this case, the distance from the molded product to each of the first and second temperature control circuits 11 and 12 is 2.5 mm, that is, the mold plate thickness between the cavity surface 6a and each of the temperature control circuits 11 and 12 is 2. Set to 5 mm. When the amount of mold deflection between the columns 19 is 0.2% or less of the mold plate thickness, the interval between the columns 19 is preferably 11 mm or less. Further, the ratio of the cross-sectional areas of the plurality of support columns 19 in the projected area of the first and second temperature control circuits 11 and 12 projected onto the surface orthogonal to the opening and closing direction of the movable mold 5b is 20%. It is desirable to set this as a guideline. In the following, the projected area refers to the area projected on the surface orthogonal to the opening / closing direction of the movable mold 5b.

  Next, a resin material that fills the cavity 6 and forms a molded product will be described. In the case where an amorphous resin is used, ABS (acrylonitrile butadiene styrene) resin, polycarbonate resin, polystyrene resin, acrylic resin, or the like can be used. When a crystalline resin is used, a polyamide resin, a polyethylene resin, a liquid crystal polymer, polylactic acid, or the like can be used. These materials can be used in combination of two or more. Further, for the purpose of increasing the elastic modulus of the molded product or imparting flame retardancy to the resin material, an inorganic filler such as glass fiber or an organic filler such as silicone may be added to the resin material.

  As a temperature control medium for circulating the first and second temperature control circuits 11 and 12, a fluid such as water or oil, which is a general temperature control medium, is used and is controlled to a desired temperature using a temperature controller. Used. At this time, the temperature of the temperature control medium varies depending on the performance of the temperature controller, but when water is used, a temperature up to about 140 ° C. can be applied. When it is necessary to control the temperature at a temperature of 140 ° C. or higher, it is common to use oil as the temperature control medium.

  As described above, according to the mold apparatus of the first embodiment, each of the first and second temperature control circuits 11 and 12 that are respectively included in the movable mold 5a and the fixed mold 5b are simultaneously flowed. By exchanging heat between the temperature control media, the temperature of each temperature medium can be made uniform. That is, in the first and second temperature control circuits 11 and 12, it is possible to prevent a temperature difference between the temperature control medium near the inlets 11a and 12a and the temperature control medium near the outlets 11b and 12b. Thereby, the temperature distribution of the entire mold 5 can be made uniform, and the temperature control performance of the mold 5 at the time of molding can be improved. As a result, it is possible to prevent appearance defects, warpage deformation, and the like of the molded product due to the temperature distribution difference of the mold 5, improve the molding quality, and increase the productivity of the molded product.

Next, a mold apparatus according to another embodiment will be described with reference to the drawings. In other embodiments, the same components as those of the mold apparatus of the first embodiment are denoted by the same reference numerals as those of the first embodiment, and description thereof is omitted.
(Second Embodiment)
Next, a mold apparatus according to a second embodiment will be described with reference to the drawings. FIG. 4 shows a cross-sectional view of the mold apparatus of the second embodiment. FIG. 5 is a plan view of the mold apparatus according to the second embodiment.
FIG. 4 shows the distance between the first temperature control circuit 21 and the cavity 6 with respect to the arrangement of the first and second temperature control circuits 21 and 22 included in the fixed mold 5a and the movable mold 5b. The structural example which varied the distance of the 2nd temperature control circuit 22 and the cavity 6 is shown.

Specifically, of the first and second temperature control circuits 21 and 22 provided in the fixed mold 5a, one of the first temperature control circuits 21 is disposed close to the cavity 6 and the other The second temperature control circuit 22 is remote from the cavity 6. The 1st temperature control circuit 21 and the 2nd temperature control circuit 22 have the part extended adjacent to the position where the distance from the cavity 6 differs.
Regarding the inlets 21a and 22a and outlets 21b and 22b of the temperature control medium for the first and second temperature control circuits 21 and 22, the inlet 21a of the first temperature control circuit 21 and the outlet 22b of the second temperature control circuit 22 Are adjacent. Further, the outlet 21b of the first temperature control circuit 21 and the inlet 22a of the second temperature control circuit 22 are disposed adjacent to each other. In other words, as for the 1st and 2nd temperature control circuits 21 and 22, each inlet 21a and 22a and each outlet 21b and 22b are arrange | positioned mutually reversely.
As with the fixed side mold 5a, the first temperature control circuit 21 of the first and second temperature control circuits 11 and 12 is also arranged close to the cavity 6 in the movable mold 5b. The other second temperature control circuit 22 is remote from the cavity 6. Moreover, as for the 1st and 2nd temperature control circuits 21 and 22, each inlet 21a and 22a and each outlet 21b and 22b are arrange | positioned mutually reversely.

Here, for the fixed mold 5a, a plan view of the first temperature control circuit 21 arranged in the vicinity is shown in FIG. 5A, and a plan view of the second temperature control circuit 22 remotely arranged is shown in FIG. Shown in (b). First, as shown in FIG. 5 (a), the first temperature control circuit 21 covers an area wider than the projected area of the cavity surface 6a on the surface orthogonal to the opening / closing direction of the movable mold 5b. Is formed. Further, the first temperature control circuit 21 is formed with a circuit pattern that meanders in a plurality of rows so that the temperature control medium flows without remaining in the positions corresponding to the corners of the cavity surface 6a. As for the 1st temperature control circuit 21, each part arranged in multiple rows is divided | segmented by the partition plate 18 which comprises a side wall.
On the other hand, as shown in FIG. 5B, the second temperature control circuit 22 remotely arranged in the fixed-side mold 5a has the first temperature control medium in which the inlet 22a and the outlet 22b of the temperature control medium are arranged close to each other. The temperature control circuit 21 has the same structure as that of the first temperature control circuit 21 except that the inlet 21a and the outlet 21b of the control circuit 21 are arranged in reverse.

  Further, the first temperature control circuit 21 arranged in proximity and the second temperature control circuit 22 arranged remotely are kept at a certain distance from each other at least within the projection area of the cavity 6. Is formed. More preferably, the separation distance between the first temperature control circuit 21 arranged in proximity and the second temperature control circuit 22 arranged remotely is set to 10 mm or less. In other words, each part of the 1st temperature control circuit 21 and the 2nd temperature control circuit 22 is formed so that the separation distance with respect to the opening-and-closing direction of the movable mold 5b may be 10 mm or less. The reason for this is that each of the first temperature control circuit 21 and the second temperature control circuit that are remotely arranged are arranged between each temperature control medium during heat exchange with the mold 5 in the molding process. This is because it is desirable to arrange them as close as possible because they aim to change the temperature under the influence of the temperature. In the second embodiment, configurations other than those described above are the same as those in the first embodiment.

  Also in the mold apparatus of the second embodiment, as in the first embodiment, each temperature control medium is near the inlets 21a, 22a and the outlets 21b, 22b of the first and second temperature control circuits 21, 22. Can be made uniform. As a result, the temperature of the entire cavity surface 6a is made uniform, so that the appearance of the molded product can be improved and the productivity can be increased.

(Third embodiment)
Next, the mold apparatus of 3rd Embodiment is demonstrated in detail with reference to drawings. FIG. 6 shows a cross-sectional view of the mold apparatus of the third embodiment. In FIG. 7, the top view of the metal mold | die apparatus of 3rd Embodiment is shown.
In FIG. 6, in the fixed side mold 5 a and the movable side mold 5 b, the first and second temperature control circuits 31 and 32 that are adjacent to each other extend from the first temperature control circuit 31. The second temperature adjustment circuit 32 has a portion closer to the cavity 6 than the second temperature adjustment circuit 32, and a portion where the second temperature adjustment circuit 32 is closer to the first temperature adjustment circuit 31. In other words, the 1st and 2nd temperature control circuits 31 and 32 have shown the structural example which the distance with respect to the cavity surface 6a reverses in the middle of each temperature control circuit 31 and 32. FIG.
Inside the fixed mold 5 a, the first and second temperature control circuits 31, 32 have their distances to the cavity 6 reversed in the middle of each temperature control circuit 31, 32 via the distance switching portion 36. It has changed to do. Thereby, in the both ends of the 1st and 2nd temperature control circuits 31 and 32, the proximity | contact arrangement | positioning and the remote arrangement | positioning interchange each other.

  Specifically, as shown in FIG. 6, in each of the first and second temperature control circuits 31 and 32 provided in the fixed mold 5 a, the upstream portion is disposed close to the cavity 6. The downstream portion is remote from the cavity 6. Moreover, as shown in FIG. 6, as for the 1st and 2nd temperature control circuits 31 and 32, each inlet 31a and 32a and each outlet 31b and 32b are arrange | positioned mutually reversely. The first and second temperature control circuits 31 and 32 included in the movable mold 5b are also configured in the same manner as the fixed mold 5b.

FIG. 7A is a plan view of the first and second temperature control circuits 31 and 32 included in the fixed mold 5a. 7B, the circuit pattern of the first temperature control circuit 31 is extracted and shown in FIG. 7C, and the circuit pattern of the second temperature control circuit 32 is extracted and shown in FIG. This will be described in more detail with reference to FIGS.
The temperature control medium that has entered from the inlet 31 a of the first temperature control circuit 31 flows through the upstream side portion that is disposed close to the first temperature control circuit 31, passes through the distance switching portion 36, and passes through the first temperature control medium. A remotely located downstream part of the circuit 31 is reached. In this way, the temperature control medium supplied to the first temperature control circuit 31 is separated from the cavity 6 in the middle of the first temperature control circuit 31, and the outlet 31 b of the first temperature control circuit 31 as it is. Is circulated back to the temperature controller 13. The second temperature adjustment circuit 32 has the same configuration as that of the first temperature adjustment circuit 31 except that the inlet 32a and the outlet 32b are symmetrically arranged with respect to the first temperature adjustment circuit 31.

The circuit patterns of the temperature control circuits 31 and 32 in the movable mold 5b are not shown, but are formed in the same manner as the circuit patterns of the temperature control circuits 31 and 32 in the fixed mold 5a. As a result, in the vicinity of the inlets 31a and 32a of the first and second temperature control circuits 31 and 32 where the temperature of the temperature control medium is close to the set temperature, the distance to the cavity 6 is made closer and closer. Further, in the portion from the middle of the path of the first and second temperature control circuits 31 and 32 to the outlets 31b and 32b of the first and second temperature control circuits 31 and 32, the temperature of the temperature control medium is the mold. Since the temperature rises easily from the set temperature due to the influence of the temperature of the resin material injected into 5, the distance to the cavity 6 is set apart from each other. Further, in the first and second temperature control circuits 31 and 32 that are two systems, the inlet 31a and the outlet 32b are adjacent to each other, and the inlet 32a and the outlet 31b are adjacent to each other.
With the configuration described above, the temperature of the cavity 6 can be adjusted in a state where the temperature adjustment medium is close to the set temperature and the temperature is not increased on the side of the inlets 31a and 32a arranged close to each other with the distance to the cavity 6 close. At the same time, the temperature control media flowing through the first and second temperature control circuits 31 and 32 are affected by each other, thereby having a temperature equalizing action, and the temperature of the entire cavity 6 can be uniformly controlled. Become. Note that the plurality of support columns 19 described above may also be provided inside the distance switching portion 36. In the third embodiment, configurations other than those described above are the same as those in the first embodiment.
Also in the mold apparatus of the third embodiment, the temperature of the entire cavity surface 6a is made uniform as in the first embodiment, so that the appearance of the molded product can be improved and the productivity can be increased.

(Fourth embodiment)
Next, a mold apparatus according to a fourth embodiment will be described in detail with reference to the drawings. FIG. 8 shows a cross-sectional view of the mold apparatus of the fourth embodiment. FIG. 8A shows a cross section of the mold apparatus, and FIGS. 8B and 8C show enlarged cross sectional views of the heat insulating layer.
As shown in FIG. 8A, the mold apparatus according to the fourth embodiment has an inner structure of the fixed mold 5a and the movable mold 5b as compared with the configuration of the second embodiment shown in FIG. The difference is that the heat insulating layer 41 is formed. In the fourth embodiment, the same components as those of the second embodiment are denoted by the same reference numerals as those of the second embodiment, and the description thereof is omitted.

The heat insulating layer 41 is formed in parallel to the first and second temperature control circuits 21 and 22 on the opposite side of the cavity 6 with respect to the positions of the first and second temperature control circuits 21 and 22. .
The purpose of forming the heat insulating layer 41 is to make the temperature of the mold 5 uniform by efficiently transmitting the temperature of the temperature control medium circulating in the first and second temperature control circuits 21 and 22 to the cavity 6. Is to plan. Therefore, the heat insulating layer 41 is formed over as wide a range as possible so as to include the projected area of the cavity 6 projected onto the surface orthogonal to the opening / closing direction of the movable mold 5b. Is desirable. The heat insulating layer 41 is required to have a high heat insulating effect, withstand a clamping force and an injection pressure at the time of molding, and not to be deformed or to be accommodated in a minute deformation.

As an example of the cross-sectional structure of the heat insulating layer 41, it may be formed in a structure similar to the first and second temperature control circuits 21 and 22, as shown in FIG. The heat insulating layer 41 includes a space provided along the first and second temperature control circuits 21 and 22, a wall surface on the side close to the cavity 6, and a wall surface on the side separated from the cavity 6 in the space. And a plurality of support columns 19 to be connected. In the case of this structure, the heat insulating layer 41 is thermally insulated by a space that is a hollow portion other than the support column 19.
As another example of the structure of the heat insulating layer 41, as shown in FIG. 8 (c), the support columns 19 are arranged so as to be thin and wide enough not to bend by the weight of the mold 5 at the time of mold manufacture. To do. The hollow portion of the heat insulating layer 41 may be configured as a heat insulating layer by filling and curing a thermosetting resin such as an epoxy resin having a thermal conductivity lower than that of a metal as a heat insulating material. In the case of this structure, it is desirable to form a seal portion (not shown) in a portion where the penetrating member such as the spool / runner 15 penetrates the heat insulating layer 41 as in the case of forming the temperature control circuit. In the fourth embodiment, configurations other than those described above are the same as those in the second embodiment.
Also in the mold apparatus of the fourth embodiment, the temperature of the entire cavity surface 6a is made uniform as in the first embodiment, so that the appearance of the molded product can be improved and the productivity can be increased.

(Fifth embodiment)
Next, a mold apparatus according to a fifth embodiment will be described in detail with reference to the drawings. FIG. 9 shows a cross-sectional view of the mold apparatus of the fifth embodiment. FIG. 9A is a cross-sectional view showing the structure when the first and second temperature control circuits are applied to a mold having a box-like cavity 6. FIG. 9B is a cross-sectional view showing the corners of the first and second temperature control circuits.
As shown in FIG. 9A, one of the first and second temperature control circuits 51, 52 provided in the fixed mold 5 a is brought close to the cavity 6. The other second temperature control circuit 52 is disposed in the proximity, and is remote from the cavity 6. The first and second temperature control circuits 51 and 52 are formed by being bent along the shape of the cavity 6. Moreover, as for the 1st and 2nd temperature control circuits 51 and 52, each inlet 51a and 52a and each outlet 51b and 52b are arrange | positioned mutually reversely. As shown in FIG. 9A, the movable mold 5b is also configured in the same manner as the fixed mold 5a.
In the present embodiment, the range within 5 mm from the end face of the parting surface 50 of the mold 5 is an area where the first and second temperature control circuits 51 and 52 are not formed. The reason is that, when a temperature control circuit is disposed in the vicinity of the parting surface 50, it is difficult to ensure sufficient mold strength that can withstand molding. Regarding the range in which the temperature control circuit is arranged with respect to the parting surface 50, although it depends on the shape of the cavity and the shape of the mold, it is generally desirable not to form the temperature control circuit in a range of about 2 mm to 5 mm. .

The first and second temperature control circuits 51 and 52 are formed in a shape that follows the corners and curved surfaces of the cavity 6. As a result, temperature control at the corners of the molded product can be improved, and molding quality and productivity can be improved. For example, regarding the improvement in quality, the warp of the molded product in which the inside of the side surface of the molded product is inclined due to insufficient cooling of the corner can be improved by improving the cooling performance of the corner of the molded product. Regarding the improvement of productivity, it is possible to shorten the cooling time of the molded product by improving the cooling performance.
As for the arrangement of the support 19, it is desirable to arrange the support 19 inside the corners of the first and second temperature control circuits 51 and 52 as shown in FIG. The support columns 19 arranged at the corners in the first and second temperature control circuits 51 and 52 may be formed so as to connect the wall surface close to the cavity 6 and the wall surface separated from the cavity 6. desirable. The interval and basic shape for forming the pillars 19 inside the corners are the same as those of the pillars 19 arranged in the straight portions in the first and second temperature control circuits 51 and 52. In addition, it is desirable to form the support | pillar 19 arrange | positioned in this corner | angular part in the 1st and 2nd temperature control circuits 51 and 52 of the fixed mold 5a and the movable mold 5b, respectively. Further, as shown in FIG. 9B, not only the corners bent in the cross section parallel to the opening and closing direction of the movable mold 5b but also the corners bent in the plane parallel to the parting surface 50. It is desirable to form the portions in the same manner. In the fifth embodiment, configurations other than those described above are the same as those in the first embodiment.
In the mold apparatus of the fifth embodiment as well, the temperature of the entire cavity surface 6a is made uniform as in the first embodiment, so that the appearance of the molded product can be improved and the productivity can be increased.

The mold apparatus of the present invention is not limited to the above-described embodiment, and the configurations of the above-described embodiments can be freely combined. Further, if necessary, a plurality of temperature control circuits can be used as compared with the present embodiment.
Further, in the embodiment, the circuit pattern of the temperature control circuit is configured to meander so that each part forms a plurality of rows. However, the circuit pattern is not limited to this arrangement, and other circuit patterns such as a spiral shape may be used. It may be configured.

(Forming method of embodiment)
A molding method for producing a molded product using the mold apparatus of this embodiment will be described in detail. A molding process using a mold apparatus having a plurality of temperature control circuits will be described as an example using the mold apparatus of the second embodiment shown in FIG.
First, for temperature control of the mold 5, the temperature control medium 13 controlled to a predetermined temperature is circulated through the first and second temperature control circuits 21 and 22 simultaneously using the temperature controller 13. That is, for the fixed mold 5 a, the temperature control medium flows from the temperature controller 13 into the inlet 21 a of the first temperature control circuit 21 and is discharged from the outlet 22 b of the first temperature control circuit 21. Is returned to the temperature controller 13 to control the temperature. At the same time as flowing the temperature control medium to the first temperature control circuit 21, the temperature control medium flows in from the inlet 22a of the second temperature control circuit 22 arranged opposite to the inlet 21a of the first temperature control circuit 21. The temperature control medium discharged from the outlet 22b of the second temperature control circuit 22 is returned to the temperature controller 13 again, and temperature control is performed. As a result, the temperature of the cavity 6 is controlled by both the first temperature control circuit 21 and the second temperature control circuit 22 that are remotely arranged in the fixed mold 5a. Similarly to the fixed mold 5a, the movable mold 5b also causes the temperature control media to flow in opposite directions in the first and second temperature control circuits 21 and 22, which are two systems. Temperature control is performed.
Here, each of the first and second temperature control circuits 21 and 22 included in the fixed mold 5a and the first and second temperature control circuits 21 and 22 included in the movable mold 5b are circulated. The temperature of the temperature control medium is basically set to the same temperature for the purpose of making the mold temperature uniform. However, the temperature distribution of the mold changes depending on the shape of the cavity, the temperature of the resin material during molding, the molding cycle, the structure of the temperature control circuit, and the like. For this reason, in consideration of these influences, the temperature of the temperature control medium supplied to the first temperature control circuit 21 and the temperature control supplied to the second temperature control circuit 22 for the purpose of making the mold temperature uniform. The temperature of the medium may be set to a different temperature. Further, a temperature control medium that is passed through the first and second temperature control circuits 21 and 22 of the fixed mold 5a for the purpose of adjusting the amount of warpage of the molded product and the transferability of the resin material to the mold surface. And the temperature of the temperature control medium flowing through the first and second temperature control circuits 21 and 22 of the movable mold 5b may be set to different temperatures.
Next, the fixed mold 5a and the movable mold 5b are closed with a predetermined clamping force, and the molten resin material is pressurized and injected through the spool runner 15, thereby causing the resin material into the cavity 6. Inject. Subsequently, the resin material filled in the cavity 6 is cured by cooling.

  In the case of the mold structure related to the present invention, the temperature adjustment medium is affected by the temperature of the resin material filled in the mold, so that the temperature of the temperature adjustment medium increases as it approaches the outlet of the temperature adjustment circuit. In particular, the temperature adjustment circuit is faithfully formed in accordance with the shape of the cavity, and the temperature of the temperature adjustment medium increases as the distance of the temperature adjustment circuit increases. As a result, a temperature difference occurs between the cavity surface near the inlet and the outlet of the temperature control circuit, which causes a defective molding appearance and a decrease in productivity.

  On the other hand, in the mold apparatus of the present embodiment, the shapes of the first and second temperature control circuits are the same, and the inlet and the outlet are arranged in reverse between the first and second temperature control circuits. . Since the two first and second temperature control circuits are arranged adjacent to each other, the temperature control medium is influenced by the temperature of each temperature control medium flowing through each temperature control circuit. The temperature of the preparation medium is made uniform. As a result, it is possible to prevent the temperature difference of the cavity surface 6a from occurring and to cool uniformly in the cooling process, thereby improving the appearance of the molded product and increasing the productivity. After completion of the cooling step, the mold is opened, and the molded product that has been cooled is taken out of the cavity 6 to obtain a molded product molded using the mold apparatus of the present embodiment.

Next, in the resin material filling step, a molding method in the case of circulating two types of temperature control media for the purpose of improving the filling property and transferability of the resin material will be described. First, the temperature control medium controlled to the first temperature is circulated through the first and second temperature control circuits in the mold. The method of circulating the temperature control medium through the first and second temperature control circuits is as described above. As a guideline for the first temperature of the temperature control medium, it is desirable that the upper limit is the melting temperature of the resin material and the mold temperature is controlled in the range of the heat deformation temperature or more of the resin material. At this time, as a setting example of the first temperature of the temperature control medium, when water is used as the temperature control medium, about 140 ° C. becomes a standard, and when oil is used, about 200 ° C. becomes a standard. By performing mold temperature control at such a temperature, it is possible to obtain an effect of preventing appearance defects such as weld lines from occurring at the joining portion of the flowing resin material in the molded product. Furthermore, since the temperature of the resin material can be prevented from lowering when the resin material is filled, the flow resistance of the resin material in the mold is reduced, and the resin material that is normally difficult to fill is smoothly filled, and the thin shape, etc. It is possible to obtain an effect that the molded product can be molded. Such an effect is more effective as the mold temperature is closer to the melting temperature of the resin material. Further, when the first and second temperature control circuits of the mold apparatus according to the present embodiment are used, the mold temperature control by the temperature control medium having the first temperature as compared with the mold related to the present invention. The stabilization time is shortened and productivity is improved.
Subsequently, after the filling of the resin material is completed, the temperature control medium having the first temperature is circulated through the first and second temperature control circuits, and then the temperature control medium having the second temperature is supplied to the first and second temperature control circuits. Switch to temperature control to circulate in the control circuit.
As an example of a method for switching the temperature of the temperature control medium, the temperature of the temperature control medium can be switched in accordance with the timing of the molding process by using two types of temperature controllers having different temperature settings. The second temperature of the temperature control medium can be changed according to the purpose. For example, when the main purpose is to improve the molding quality in the resin filling process described above, the second temperature of the temperature control medium is the cooling temperature of the resin material by a general mold (for example, the resin material used is ABS resin). In some cases, the temperature can be set to 40 ° C. to 60 ° C., and in the case of polycarbonate, the temperature can be set to 80 ° C. to 100 ° C., and the pressure holding step, the cooling step, the removing step, and the mold closing step can be sequentially performed. After the mold closing process, a series of molding processes is completed by switching to the temperature control medium at the first temperature in preparation for the filling of the next resin material.

Next, an example where a crystallized resin is used will be described. For example, when a molded product is molded using a crystallized resin such as polylactic acid, there is a problem that when the crystallinity is low, the mechanical properties of the resin after molding are lowered and sufficient strength cannot be secured. As a countermeasure, it is desired to mold at a mold temperature that promotes the progress of crystallization. However, in this case, the mold temperature becomes high and the cooling time becomes long, so that there is a disadvantage that productivity is lowered.
Therefore, an example of performing temperature control of a mold using the mold of this embodiment at the time of molding using such a crystallized resin will be specifically described. In this case, the temperature control of the mold is performed by switching the cooling process after filling the resin material into two stages. First, in the initial stage of the cooling process in which the curing of the resin material has hardly progressed, the mold temperature is set to 90 to 100 ° C. at which crystallization of polylactic acid is likely to proceed. Subsequently, after the crystallization of the resin material proceeds, the mold temperature control is switched to a low temperature of about room temperature to about 50 ° C., and the process is sequentially shifted from the cooling process to the removal process and the mold closing process. Even in such molding, when the temperature control circuit of the mold apparatus of the present embodiment is used, the temperature distribution of the mold can be made uniform as compared with the conventional mold apparatus. A molded article with stable crystallization and high quality can be obtained.
Note that the molding method using the mold apparatus of the present invention is not limited to the above-described example, and the above-described examples can be freely combined, and a plurality of temperature adjustments can be performed as compared with the present embodiment. It is also possible to use a circuit.

[Appendix 1]
A cavity that is filled with a resin material, and a pair of molds that can be opened and closed;
A first temperature control circuit and a second temperature control circuit, which are arranged along at least one mold body along the cavity and through which a temperature control medium flows;
A temperature control device for simultaneously flowing a temperature control medium to each of the first and second temperature control circuits,
The first temperature control circuit and the second temperature control circuit extend at least partially adjacent to each other,
The inlet of the temperature control medium of the first temperature control circuit and the outlet of the temperature control medium of the second temperature control circuit are adjacent to each other, and the outlet of the temperature control medium of the first temperature control circuit and the The mold apparatus with which the inlet of the said temperature control medium of a 2nd temperature control circuit is arrange | positioned adjacently.
[Appendix 2]
The mold apparatus according to appendix 1, wherein portions of the first temperature control circuit and the second temperature control circuit that extend adjacent to each other have the same distance from the cavity.
[Appendix 3]
The mold apparatus according to appendix 1, wherein portions of the first temperature control circuit and the second temperature control circuit that extend adjacent to each other have different distances from the cavity.
[Appendix 4]
The portions of the first temperature control circuit and the second temperature control circuit that extend adjacent to each other are such that the respective inlet sides of the first and second temperature control circuits are connected to the first and second temperature control circuits. The mold apparatus according to appendix 3, wherein the mold apparatus is disposed closer to the cavity than each outlet side of the tuning circuit.
[Appendix 5]
The mold apparatus according to any one of appendices 1 to 4, wherein the first and second temperature control circuits are respectively formed on both of the pair of mold bodies.
[Appendix 6]
The mold apparatus according to appendix 3 or 4, wherein the first temperature control circuit and the second temperature control circuit have a separation distance of 10 mm or less.
[Appendix 7]
In the first and second temperature control circuits, a plurality of support columns are provided to connect a wall surface close to the cavity and a wall surface separated from the cavity. The mold apparatus as described in any one.
[Appendix 8]
The first and second temperature control circuits have corners bent along the shape of the cavity,
The inside of the corner is provided with a plurality of support columns connecting a wall surface on the side close to the cavity and a wall surface on the side separated from the cavity, according to any one of appendices 1 to 7. Mold equipment.
[Appendix 9]
The projection area of the first and second temperature control circuits is larger than the projection area of the cavity on a plane orthogonal to the opening / closing direction of the pair of molds, according to any one of appendixes 1 to 8. Mold equipment.
[Appendix 10]
The one mold body includes a penetrating member disposed through the first and second temperature control circuits,
The mold apparatus according to any one of appendices 1 to 9, wherein a seal portion for sealing the periphery of the penetrating member is provided in the first and second temperature control circuits.
[Appendix 11]
The mold apparatus according to any one of appendices 1 to 10, wherein a partition member is provided between the first temperature control circuit and the second temperature control circuit.
[Appendix 12]
The first and second temperature control circuits have a predetermined cross section in a cross section perpendicular to the flow direction of the temperature control medium, so that a cross-sectional area is constant over the entire first and second temperature control circuits. 8. The mold apparatus according to appendix 7, wherein the post having a shape is arranged.
[Appendix 13]
The mold apparatus according to attachment 12, wherein the support column is a hexagonal column.
[Appendix 14]
Appendices 1 to 13, wherein a heat insulating layer is formed in parallel to the first and second temperature control circuits on the side opposite to the cavity with respect to the positions of the first and second temperature control circuits. The mold apparatus as described in any one of these.
[Appendix 15]
The heat insulating layer connects a space provided along the first and second temperature control circuits, a wall surface close to the cavity, and a wall surface separated from the cavity in the space. The mold apparatus according to appendix 14, comprising a plurality of support columns.
[Appendix 16]
The mold apparatus according to appendix 15, wherein the heat insulating layer is filled with a heat insulating material in the space.
[Appendix 17]
The mold apparatus according to appendix 16, wherein the heat insulating material is an epoxy resin.
[Appendix 18]
A molding method for performing injection molding using the mold apparatus according to any one of appendices 1 to 17,
A temperature adjustment step of simultaneously flowing a temperature adjustment medium to each of the first and second temperature adjustment circuits to adjust the temperature of the mold to a predetermined temperature; and
And a molding step of injecting a resin material into the temperature-controlled cavity after the temperature adjustment step, and cooling and solidifying the resin material.
[Appendix 19]
Item 19. The molding method according to appendix 18, wherein in the temperature adjustment step, the temperature of each temperature adjustment medium flowing through the first temperature adjustment circuit and the second temperature adjustment circuit is made different.
[Appendix 20]
The molding step includes a first step of adjusting the temperature by flowing a temperature adjusting medium having a first temperature through the first and second temperature adjusting circuits when the resin material is injected into the cavity, and a temperature adjusting step. A second step of switching the temperature of the medium from the first temperature to the second temperature, and the temperature adjusting medium of the second temperature when the resin material filled in the cavity is cooled and solidified, A molding method according to appendix 18 or 19, comprising: a third step of adjusting the temperature by flowing through the second temperature control circuit.
[Appendix 21]
The molding step includes a first step of adjusting the temperature by filling a resin material in the cavity and then flowing a temperature adjusting medium having a first temperature through the first and second temperature adjusting circuits, and the first step. And a second step of switching the temperature of the temperature control medium flowing through the second temperature control circuit from the first temperature to the second temperature, and the second step when the resin material filled in the cavity is cooled and solidified. A molding method according to appendix 18 or 19, comprising a third step of adjusting the temperature by flowing a temperature adjusting medium of the temperature through the first and second temperature adjusting circuits.
[Appendix 22]
Note that in at least one of the temperature adjustment step, the first step, and the third step, one mold body and the other mold body of the pair of mold bodies are temperature-controlled at different temperatures. The molding method according to any one of 18 to 21.

5a Fixed mold 5b Movable mold 3 Spool / runner 6 Cavity 11 First temperature control circuit 11a Inlet 11b Outlet 12 Second temperature control circuit 12a Inlet 12b Outlet 13 Temperature controller

Claims (10)

A cavity that is filled with a resin material, and a pair of molds that can be opened and closed;
A first temperature control circuit and a second temperature control circuit, which are arranged along at least one mold body along the cavity and through which a temperature control medium flows;
A temperature control device for simultaneously flowing a temperature control medium to each of the first and second temperature control circuits,
The first temperature control circuit and the second temperature control circuit extend at least partially adjacent to each other,
The inlet of the temperature control medium of the first temperature control circuit and the outlet of the temperature control medium of the second temperature control circuit are adjacent to each other, and the outlet of the temperature control medium of the first temperature control circuit and the The mold apparatus with which the inlet of the said temperature control medium of a 2nd temperature control circuit is arrange | positioned adjacently.   2. The mold apparatus according to claim 1, wherein portions of the first temperature control circuit and the second temperature control circuit that extend adjacent to each other have the same distance from the cavity.   2. The mold apparatus according to claim 1, wherein portions of the first temperature control circuit and the second temperature control circuit that extend adjacent to each other have different distances from the cavity.   The portions of the first temperature control circuit and the second temperature control circuit that extend adjacent to each other are such that the respective inlet sides of the first and second temperature control circuits are connected to the first and second temperature control circuits. The mold apparatus according to claim 3, wherein the mold apparatus is disposed closer to the cavity than each outlet side of the tuning circuit.   The mold apparatus according to claim 3 or 4, wherein a distance between adjacent portions of the first temperature control circuit and the second temperature control circuit that are adjacent to each other is 10 mm or less.   The first and second temperature control circuits are provided with a plurality of support columns that connect a wall surface close to the cavity and a wall surface separated from the cavity. The mold apparatus of any one of these. The first and second temperature control circuits have corners bent along the shape of the cavity,
The mold apparatus according to claim 6, wherein a plurality of support columns are provided inside the corner portion to connect a wall surface on the side close to the cavity and a wall surface on the side separated from the cavity.   The heat insulation layer is formed in parallel with the 1st and 2nd temperature control circuits on the opposite side to the cavity with respect to the position of the 1st and 2nd temperature control circuits. 8. The mold apparatus according to any one of 7 above. A molding method for injection molding using the mold apparatus according to any one of claims 1 to 8,
A temperature adjustment step of simultaneously flowing a temperature adjustment medium to each of the first and second temperature adjustment circuits to adjust the temperature of the mold to a predetermined temperature; and
And a molding step of injecting a resin material into the temperature-controlled cavity after the temperature control step, and cooling and solidifying the resin material.   The molding method according to claim 9, wherein in the temperature adjustment step, the temperature of each temperature adjustment medium that flows through each of the first temperature adjustment circuit and the second temperature adjustment circuit is made different.

Images