JP2015180871A5 - - Google Patents

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Publication number
JP2015180871A5
JP2015180871A5 JP2015042968A JP2015042968A JP2015180871A5 JP 2015180871 A5 JP2015180871 A5 JP 2015180871A5 JP 2015042968 A JP2015042968 A JP 2015042968A JP 2015042968 A JP2015042968 A JP 2015042968A JP 2015180871 A5 JP2015180871 A5 JP 2015180871A5
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Japan
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green sheet
ceramic green
electrode
lid
container body
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JP2015042968A
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English (en)
Japanese (ja)
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JP6516513B2 (ja
JP2015180871A (ja
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Publication of JP2015180871A5 publication Critical patent/JP2015180871A5/ja
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JP2015042968A 2014-03-06 2015-03-04 ワイヤレス温度センサ及びその製造方法 Expired - Fee Related JP6516513B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015042968A JP6516513B2 (ja) 2014-03-06 2015-03-04 ワイヤレス温度センサ及びその製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014043932 2014-03-06
JP2014043932 2014-03-06
JP2015042968A JP6516513B2 (ja) 2014-03-06 2015-03-04 ワイヤレス温度センサ及びその製造方法

Publications (3)

Publication Number Publication Date
JP2015180871A JP2015180871A (ja) 2015-10-15
JP2015180871A5 true JP2015180871A5 (cg-RX-API-DMAC10.html) 2018-02-08
JP6516513B2 JP6516513B2 (ja) 2019-05-22

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JP2015042968A Expired - Fee Related JP6516513B2 (ja) 2014-03-06 2015-03-04 ワイヤレス温度センサ及びその製造方法

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JP (1) JP6516513B2 (cg-RX-API-DMAC10.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6852289B2 (ja) * 2016-06-20 2021-03-31 富士電機株式会社 ワイヤレスセンサシステム
KR20210005335A (ko) * 2019-07-03 2021-01-14 주식회사 에스아이피 무선 데이터 송신형 센서 시스템
CN114754892A (zh) * 2022-04-26 2022-07-15 苏州光声纳米科技有限公司 一种分体插装式声表面波温度传感器

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004515757A (ja) * 2000-12-08 2004-05-27 ザ ジョンズ ホプキンズ ユニバーシティ ワイヤレス多機能センサープラットフォーム、該プラットフォームを有するシステム及びその使用方法
JP2006259156A (ja) * 2005-03-16 2006-09-28 Fuji Xerox Co Ltd 画像形成装置
US8730681B2 (en) * 2011-09-23 2014-05-20 Infineon Technologies Ag Power semiconductor module with wireless saw temperature sensor

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