JP2015178902A5 - - Google Patents

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Publication number
JP2015178902A5
JP2015178902A5 JP2015050136A JP2015050136A JP2015178902A5 JP 2015178902 A5 JP2015178902 A5 JP 2015178902A5 JP 2015050136 A JP2015050136 A JP 2015050136A JP 2015050136 A JP2015050136 A JP 2015050136A JP 2015178902 A5 JP2015178902 A5 JP 2015178902A5
Authority
JP
Japan
Prior art keywords
section
rigid
length
solid wall
conduction path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015050136A
Other languages
English (en)
Japanese (ja)
Other versions
JP6511301B2 (ja
JP2015178902A (ja
Filing date
Publication date
Priority claimed from US14/219,041 external-priority patent/US9788459B2/en
Application filed filed Critical
Publication of JP2015178902A publication Critical patent/JP2015178902A/ja
Publication of JP2015178902A5 publication Critical patent/JP2015178902A5/ja
Application granted granted Critical
Publication of JP6511301B2 publication Critical patent/JP6511301B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2015050136A 2014-03-19 2015-03-13 熱分離体 Active JP6511301B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/219,041 US9788459B2 (en) 2014-03-19 2014-03-19 Thermal stand-off with tortuous solid-wall thermal conduction path
US14/219,041 2014-03-19

Publications (3)

Publication Number Publication Date
JP2015178902A JP2015178902A (ja) 2015-10-08
JP2015178902A5 true JP2015178902A5 (enExample) 2018-03-08
JP6511301B2 JP6511301B2 (ja) 2019-05-15

Family

ID=52780817

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015050136A Active JP6511301B2 (ja) 2014-03-19 2015-03-13 熱分離体

Country Status (5)

Country Link
US (1) US9788459B2 (enExample)
EP (1) EP2921809B1 (enExample)
JP (1) JP6511301B2 (enExample)
CN (1) CN104930301B (enExample)
RU (1) RU2675972C2 (enExample)

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3282011A (en) * 1962-04-25 1966-11-01 Johns Manville Thermal insulating structure
US3705411A (en) * 1970-12-02 1972-12-05 Mc Donnell Douglas Corp Shock and thermal isolation package for thermionic battery
FR2217628B1 (enExample) * 1973-02-15 1975-03-07 Commissariat Energie Atomique
US3916941A (en) * 1974-04-24 1975-11-04 E Systems Inc Throttle valve assembly
JPS6174998A (ja) * 1984-09-19 1986-04-17 株式会社　テイエルブイ スチ−ムトラツプの運転時間積算計
CA1328724C (en) 1988-04-15 1994-04-26 David K. Benson Compact vacuum insulation
FR2631691B1 (fr) * 1988-05-20 1990-07-13 Commissariat Energie Atomique Dispositif de transmission de chaleur sous vide par des grains
US5003744A (en) * 1989-07-31 1991-04-02 Innovative Building Products, Inc. Glass-block panels with improved thermal conduction characteristics
US6131364A (en) * 1997-07-22 2000-10-17 Alumet Manufacturing, Inc. Spacer for insulated windows having a lengthened thermal path
US6144030A (en) * 1997-10-28 2000-11-07 Raytheon Company Advanced small pixel high fill factor uncooled focal plane array
US6002588A (en) * 1997-12-04 1999-12-14 Lockheed Martin Corporation Thermally conductive vibration isolators
PL351929A1 (en) * 1999-04-29 2003-07-14 Rockwool Int Insulating product containing mounting means, and method of making and mounting thereof
KR100294317B1 (ko) * 1999-06-04 2001-06-15 이정현 초소형 냉각 장치
GB9920330D0 (en) * 1999-08-28 1999-11-03 Norfrost Ltd Freezers
US6493233B1 (en) * 2001-08-21 2002-12-10 Intel Corporation PCB-to-chassis mounting schemes
US6631078B2 (en) * 2002-01-10 2003-10-07 International Business Machines Corporation Electronic package with thermally conductive standoff
US7485860B2 (en) * 2003-03-28 2009-02-03 Bae Systems Information And Electronic Systems Integration Inc. Thermoelectric bridge IR detector
FR2854277B1 (fr) * 2003-04-24 2005-08-05 Commissariat Energie Atomique Detecteur thermique de rayonnement electromagnetique a structure alveolee
US7057895B2 (en) * 2003-06-30 2006-06-06 Intel Corporation Thermal standoff for close proximity thermal management
RU2280294C2 (ru) * 2004-10-11 2006-07-20 Юрий Васильевич Таланин Силовой блок
DE102005052683B4 (de) * 2005-10-27 2012-05-31 Visteon Global Technologies Inc. Mehrkanalflachrohr für Wärmeübertrager
TW200847857A (en) * 2007-05-29 2008-12-01 Acbel Polytech Inc Heat dissipation structure of electronic components
WO2010132381A1 (en) 2009-05-13 2010-11-18 Husky Injection Molding Systems Ltd Hot-runner system having non-structurally supportive heat insulator including visible material
CN101706029B (zh) * 2009-12-07 2011-09-21 中国科学院西安光学精密机械研究所 一种小空间间隙隔热装置
US9230877B2 (en) * 2012-12-21 2016-01-05 Intel Corporation Methods of forming serpentine thermal interface material and structures formed thereby

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