JP2015176953A - Thermally conductive sheet with release sheet - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thermally conductive sheet with a release sheet, in which the release sheet can be easily released from the thermally conductive sheet.SOLUTION: There is provided a thermally conductive sheet with a release sheet, including a thermally conductive sheet and a release sheet laminated on the thermally conductive sheet. The thermally conductive sheet with a release sheet is used for forming a semiconductor module including a module body, a heat dissipation member, and the thermally conductive sheet interposed between the module body and the heat dissipation member. The thermally conductive sheet includes an insulation layer containing inorganic fillers and a thermosetting resin. The release sheet has a release sheet body having an outer peripheral edge whose shape is substantially same with the shape of an outer peripheral edge of the thermally conductive sheet, is laminated on the thermally conductive sheet such that the outer peripheral edge of the release sheet body coincides with the outer peripheral edge of the thermally conductive sheet, and further has an extension part extending from the outer peripheral edge of the release sheet body to the outside.

Description

  The present invention relates to a thermally conductive sheet with a release sheet.

Conventionally, a thermal conductive sheet is used in which an inorganic filler (inorganic compound particles) is dispersed in a resin so that the thermal conductivity is improved as compared to the resin alone.
Among them, a heat conductive sheet of a type containing a thermosetting resin such as an epoxy resin and an inorganic filler and having the thermosetting resin in a semi-cured state is bonded to an adherend and thermally cured. It is widely used because it can exhibit excellent adhesiveness and it is difficult for the adhesiveness to decrease even when heat is applied after bonding.
The manufacturing method of such a heat conductive sheet is disclosed by the following patent document 1, for example.
Specifically, as shown in FIG. 6, the conventional thermal conductive sheet includes polymer sheets 102 a and 102 a ′ including an inorganic filler 103 and a polymer component 104, and a surface on which the support layer 101 is formed. It is manufactured by a method in which two opposite polymer surfaces 102b and 102b ′ are laminated by hot pressing so that the opposite surfaces face each other and a laminated body 102c is formed.

Since the heat conductive sheet described in Patent Document 1 is used by adhering a polymer layer to an adherend, at least one of the support layers is peeled off during use.
That is, in such a heat conductive sheet, the support layer has a function as a release sheet used to protect the adhesive surface of a general adhesive sheet.
In addition, the heat conductive sheet with a peeling sheet is produced by various methods other than the method described in Patent Document 1.

JP 2010-94887 A

  However, the conventional heat conductive sheet with a release sheet has a problem that it is difficult to release the release sheet from the heat conductive sheet.

  This invention is made | formed in view of such a problem, and makes it a subject to provide the heat conductive sheet with a peeling sheet which is easy to peel a peeling sheet from a heat conductive sheet.

The present invention is a thermally conductive sheet with a release sheet having a thermally conductive sheet and a release sheet laminated on the thermally conductive sheet,
A module body in which a semiconductor element is resin-molded, a metal heat radiation member exposed to the outside to dissipate heat generated by the semiconductor element, and the thermal conductivity interposed between the module body and the heat radiation member Used to form a semiconductor module comprising a sheet,
The thermally conductive sheet includes an inorganic filler and an insulating layer containing a thermosetting resin,
The release sheet has a release sheet body whose outer peripheral edge is substantially the same shape as the outer peripheral edge of the thermally conductive sheet, and the outer peripheral edge of the release sheet body coincides with the outer peripheral edge of the thermally conductive sheet. It exists in the heat conductive sheet with a peeling sheet which has further the extension part laminated | stacked on the said heat conductive sheet and extended outward from the outer periphery of the said peeling sheet main body.

  According to such an invention, when the release sheet is peeled from the heat conductive sheet, the release sheet is easily gripped by the extending portion, and thus there is an advantage that the release sheet is easily peeled.

  As described above, according to the present invention, it is possible to provide a thermally conductive sheet with a release sheet that easily peels the release sheet from the thermally conductive sheet.

The schematic plan view of the heat conductive sheet with a peeling sheet of one Embodiment. The schematic sectional drawing which showed the cross-section of the heat conductive sheet with a peeling sheet of one Embodiment. The schematic sectional drawing of the semiconductor module which showed the use condition of the heat conductive sheet typically. The schematic plan view of the stand used in order to adhere | attach a heat conductive sheet to a semiconductor module main body using the heat conductive sheet with a peeling sheet of one Embodiment. The schematic sectional drawing of the semiconductor module which showed the use condition of the heat conductive sheet of other embodiment typically. The schematic sectional drawing which shows the manufacturing method of the heat conductive sheet disclosed by patent document 1. FIG.

  Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings.

  The heat conductive sheet with a release sheet of this embodiment has a heat conductive sheet and a release sheet laminated on the heat conductive sheet. Moreover, the heat conductive sheet with a peeling sheet of this embodiment is used for formation of a semiconductor module. The semiconductor module is interposed between a module main body in which a semiconductor element is resin-molded, a metal heat dissipation member exposed to the outside to dissipate heat generated by the semiconductor element, and the module main body and the heat dissipation member. And the thermal conductive sheet. The said heat conductive sheet is equipped with the insulating layer containing an inorganic filler and a thermosetting resin. The release sheet has a release sheet main body whose outer peripheral edge is substantially the same shape as the outer peripheral edge of the thermally conductive sheet. The release sheet is laminated on the thermally conductive sheet such that the outer peripheral edge of the release sheet main body coincides with the outer peripheral edge of the thermally conductive sheet. The release sheet further has an extending portion extending outward from the outer peripheral edge of the release sheet main body.

First, the heat conductive sheet will be described.
The insulating layer of the heat conductive sheet is formed of the resin composition containing the thermosetting resin and the inorganic filler as described above.
Although the said thermosetting resin used as the base resin of the said resin composition is not specifically limited, For example, an epoxy resin, a phenol resin, etc. are mentioned.

  Examples of the epoxy resin include bisphenol A type epoxy resin, modified bisphenol A type epoxy resin, bisphenol F type epoxy resin, modified bisphenol F type epoxy resin, triphenylmethane type epoxy resin, cresol novolac type epoxy resin, biphenyl type epoxy resin. Various epoxy resins such as dicyclopentadiene type epoxy resin, phenol novolac type epoxy resin, and phenoxy resin can be used alone or in combination of two or more.

As the phenol resin, for example, dicyclopentadiene type phenol resin, novolac type phenol resin, cresol novolac resin, phenol aralkyl resin, triphenylmethane type phenol resin and the like are used.
Especially, a triphenylmethane type phenol resin is advantageous in heat resistance, and a phenol aralkyl resin is preferably used in the point which shows favorable adhesiveness between the heat radiating member.

In addition, when employ | adopting an epoxy resin as the said thermosetting resin, you may add the hardening | curing agent and hardening accelerator of the said epoxy resin to a thermosetting resin, and may adjust thermosetting.
As the curing agent, for example, amine-based curing agents such as diaminodiphenyl sulfone, dicyandiamide, diaminodiphenylmethane, and triethylenetetramine, acid anhydride-based curing agents, and the like can be used.
In addition, the novolac-type phenol resin or the like can be contained in the thermosetting resin as a curing agent for curing the epoxy resin.
Examples of the curing accelerator include imidazoles, amine-based curing accelerators such as triphenyl phosphate (TPP), and boron trifluoride monoethylamine.

  On the other hand, when a phenol resin is employed as the thermosetting resin, hexamethylenetetramine, various bifunctional or higher functional epoxy compounds, isocyanates, trioxane, cyclic formal and the like may be included as a curing agent for the phenol resin. .

  The inorganic filler is not particularly limited as long as the thermal conductivity is higher than that of the thermosetting resin. For example, boron nitride, aluminum nitride, silicon nitride, gallium nitride, aluminum oxide, silicon carbide, silicon dioxide, magnesium oxide, diamond, etc. Particles.

  The release sheet can be formed of a polymer film, a metal foil, a fiber sheet, or the like.

  Examples of the polymer film include polyester resins such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polybutylene naphthalate, polylactic acid, and polyarylate; polyolefin resins such as polyethylene and polypropylene; polyamide 6, polyamide 6,6, Aliphatic polyamide resins such as polyamide 11 and polyamide 12; Aromatic polyamide resins such as poly-p-phenylene terephthalamide and poly-m-phenylene isophthalamide; Chlorine resins such as polyvinyl chloride and polyvinylidene chloride; Polytetrafluoro Ethylene, tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer, tetrafluoroethylene-hexafluoropropylene copolymer, tetrafluoroethylene-ethylene copolymer It includes resin films made of polyvinyl alcohol resin; polyimide resins; polycarbonate resins, acrylic resins, polyphenylene sulfide resins; polyurethane resin polymer, fluorine-based resins such as polyvinylidene fluoride.

As said metal foil, metal foil which consists of metals, such as copper, aluminum, nickel, iron, and its alloy, for example is mentioned.
The metal foil may be a clad foil formed by bonding different metals or a plating foil plated with different metals.

  Examples of the fiber sheet include a polyester fiber nonwoven fabric, a pulp sheet, a glass mat, and a carbon fiber sheet.

As shown in FIG. 1, the heat conductive sheet 10 with a peeling sheet in this embodiment is formed so that it may become a rectangular shape in planar view.
In the following description, the long side direction of the thermal conductive sheet in plan view is also referred to as the left-right direction (in FIG. 1, the left direction is indicated by L and the right direction is indicated by R), and the thermal conductivity. The short side direction of the sheet is also referred to as the front-rear direction (in FIG. 1, the front direction is indicated by F and the rear direction is indicated by B).

The heat conductive sheet 14 is formed in a rectangular shape in plan view. The outer peripheral edge 14a of the heat conductive sheet 14 includes a right outer peripheral edge 14a1, a left outer peripheral edge 14a2, a front outer peripheral edge 14a4, and a rear outer peripheral edge 14a3. The right outer periphery 14a1 and the left outer periphery 14a2 face each other in the left-right direction. The front outer peripheral edge 14a4 and the rear outer peripheral edge 14a3 face each other in the front-rear direction.
The boundary portions between the left and right outer peripheral edges 14a1 and 14a2 and the front and rear outer peripheral edges 14a4 and 14a3 are rounded. That is, the shape of the heat conductive sheet 14 in plan view is strictly a rectangular shape with rounded corners.

  The release sheet main body 13b is formed in the same shape as the thermally conductive sheet 14 in plan view.

  The release sheet 13 has a rectangular extension portion 13a that extends outward from the center in the front-rear direction of the right outer periphery and the left outer periphery of the release sheet body 13b, one on each side. Further, the release sheet 13 has a rectangular extension 13a extending outward from the front outer periphery of the release sheet main body 13b, one on the left side and one on the right side of the center in the left-right direction. Yes. Furthermore, the release sheet 13 has a rectangular extension 13a extending outward from the rear outer periphery of the release sheet main body 13b, one on the left side and one on the right side of the center in the left-right direction. Yes. That is, the release sheet 13 has a total of six extending portions 13a.

The thermal conductive sheet 14 is formed such that the shape of the outer peripheral edge 14 a of the thermal conductive sheet 14 is twice rotationally symmetric. Further, the release sheet 13 is formed on the outer peripheral edge of the release sheet 13. The shape is formed so as to be rotationally symmetrical twice. By having such a configuration, the thermally conductive sheet 14 with a release sheet in the present embodiment can be attached to the semiconductor module body or the heat dissipation member even if the thermally conductive sheet 10 with the release sheet is rotated by 180 ° C. It has the advantage of being able to.
The 2-fold rotational symmetry means even-numbered rotational symmetry, and includes 4-fold rotational symmetry, 6-fold rotational symmetry, and the like.

  In the following, as an example showing one embodiment of the thermally conductive sheet with release sheet in the present embodiment, a heat conductive sheet with excellent electrical insulation and also usable as an insulating sheet and thermal conductivity with release sheet having the release sheet The property sheet will be described with reference to FIG.

The heat conductive sheet 14 having excellent electrical insulation (hereinafter also referred to as “insulating sheet 14”) has two insulating layers 11 and 12, as shown in FIG.
The thermally conductive sheet with a release sheet of the present embodiment (hereinafter also referred to as “insulation sheet with release sheet”) includes an insulating sheet 14 and a base material layer 13 that is a release sheet 13 for supporting the insulating sheet 14. It has.
That is, the thermal conductive sheet with release sheet 10 of the present embodiment is a sheet body having a three-layer laminated structure, and the first insulating layer 11 (hereinafter referred to as “first” of the two insulating layers 11 and 12). One side is constituted by the base layer 13 and the intermediate layer between the base layer 13 and the first insulating layer 11 is the second layer. It is comprised by the insulating layer 12 (henceforth "the 2nd insulating layer 12").

The 1st insulating layer 11 and the 2nd insulating layer 12 consist of the resin composition of this embodiment, and consist of the said resin composition made into B-stage (semi-hardened).
The insulating layers 11 and 12 of this embodiment are formed of the resin composition containing an inorganic filler, and are formed so as to exhibit excellent thermal conductivity.

  In addition, if it is going to make high filling with an inorganic filler, defects, such as a pinhole and a void, will be easy to be formed in the insulating layers 11 and 12, but the insulating sheet 10 of this embodiment is temporarily assumed by laminating two insulating layers. Even when a defective portion is formed, the defect is prevented from being continuous in the thickness direction of the insulating sheet.

The first insulating layer 11 and the second insulating layer 12 preferably have a total volume resistivity of 1 × 10 ¹³ Ω · cm or more so that the insulating sheet 14 can exhibit excellent electrical insulation. More preferably, it is 1 × 10 ¹⁴ Ω · cm or more.
The first insulating layer 11 and the second insulating layer 12 also preferably have an individual volume resistivity of 1 × 10 ¹³ Ω · cm or more, and more preferably 1 × 10 ¹⁴ Ω · cm or more.

In addition, the first insulating layer 11 and the second insulating layer 12 have heat conductivity when the resin composition is sufficiently cured (C-staged) in order to exhibit excellent thermal conductivity in the insulating sheet 14. It is preferable that the type and amount of the inorganic filler are adjusted so that the rate is 5 W / m · K or more, and the type and amount of the inorganic filler are adjusted so that the rate is 14 W / m · K or more. It is preferable that
In addition, about the heat conductivity of the molded object formed with the resin composition, it can measure normally with a xenon flash analyzer (For example, the product made from NETZSCH, "LFA-447 type").
This thermal conductivity can be measured by other laser flash methods or TWA methods without using a xenon flash analyzer. For example, the laser flash method is measured using “TC-9000” manufactured by ULVAC-RIKO. can do.
And in TWA method, it can measure using "ai-Phase mobile" by an eye phase company.

In addition, the 1st insulating layer 11 and the 2nd insulating layer 12 do not need to form with the same resin composition, and may differ in content of an inorganic filler.
Furthermore, it is not necessary for the first insulating layer 11 and the second insulating layer 12 to have the same thickness.
Each thickness of this 1st insulating layer 11 and the 2nd insulating layer 12 can be normally 25 micrometers-300 micrometers.

  The thickness of the base material layer 13 can usually be 5 μm to 500 μm.

  Then, the manufacturing method of the heat conductive sheet with a peeling sheet of this embodiment is demonstrated.

First, a base sheet is prepared.
As this base material sheet, it is preferable to prepare a long belt-like one in order to produce the thermal conductive sheet with release sheet 10 continuously and efficiently.

Next, the thermosetting resin is dissolved in an organic solvent capable of dissolving the thermosetting resin, and an inorganic filler having a higher thermal conductivity than the thermosetting resin such as boron nitride particles and metal oxide particles is added to the resin solution. Disperse to prepare a coating solution.
In this step, for example, a stirring device such as a ball mill, a planetary mixer, a homogenizer, or a three roll mill can be used.

Next, the said coating liquid is coated on a base material sheet.
In this process, a release sheet roll obtained by winding a long strip-like release sheet is continuously attached to a coating apparatus such as a gravure roll coater, a reverse roll coater, a kiss roll coater, a knife coater, a comma coater, or a direct coater. Can be implemented.

Next, the base material sheet coated with the coating liquid is introduced into a drying furnace, the organic solvent is removed, and a dry film of the coating liquid is formed on the base material sheet.
This step can be carried out, for example, by passing a belt-shaped substrate sheet coated with a coating solution through a general heating and drying furnace over a predetermined time.

Next, two base sheets with a dry film formed on one side are prepared, and the base sheets with the dry film formed thereon are overlapped so that the dry films face each other and hot pressed to dry two layers. The coating is laminated and integrated.
This step can be carried out, for example, by a method in which a belt-like substrate sheet having a dry film formed is supplied to a hot press for the length of one hot plate and sequentially hot pressed.

  And a laminated body is cut out to the predetermined shape of the heat conductive sheet with a peeling sheet of this embodiment. Although the cutting method is not particularly limited, for example, a punching method using a Thomson blade or the like can be employed.

  Next, the base material sheet on the one surface side is peeled off from the laminate, and the extended portion is formed by cutting out a two-layer dry film from a location corresponding to the extended portion using a rotary cutter or the like. Thereby, the heat conductive sheet with a peeling sheet of this embodiment can be formed.

Next, the semiconductor module of this embodiment will be described. For example, the semiconductor module of this embodiment includes a semiconductor module as shown in FIG.
First, the semiconductor module 100 of this embodiment will be described with reference to FIG.
FIG. 3 is a schematic view showing a cross section of the semiconductor module.
The semiconductor module 100 of this embodiment includes a module main body 100x in which a semiconductor element 30 is resin-molded, a metal heat radiation member 20 exposed to the outside to dissipate heat generated by the semiconductor element 30, the module main body 100x, and the module main body 100x. A heat conductive sheet 14 interposed between the heat dissipating members 20.

The module body 100x includes the semiconductor element 30 and a metal plate 40 that functions as a heat sink for the semiconductor element 30, and is fixed to the upper surface side of the metal plate 40 that is placed flat by solder 50. The semiconductor element 30 is included.
The semiconductor element 30 is smaller than the area of the upper surface of the metal plate 40. In the present embodiment, the semiconductor element 30 is mounted on the metal plate in a bare chip state.

The module main body 100x of the present embodiment includes a rectangular tube-shaped case 60 that forms an outer shell thereof, and the case 60 has a shape that is slightly larger than that of the metal plate 40 in a plan view and a shape in a front view. However, the insulating sheet 14, the metal plate 40, and the semiconductor element 30 are formed higher than the total height.
That is, the case 60 has a size capable of including all of the insulating sheet 14, the metal plate 40, and the semiconductor element 30.
The module body 100x further includes the case 60 disposed so as to surround the metal plate 40, and further includes a lead frame 70 that penetrates the side wall of the case 60 and extends inside and outside the case.

In addition, the module body 100x has an end portion of the lead frame 70 in the case electrically connected to the semiconductor element 30 by a bonding wire 80, and an empty space in the case is filled with sealing resin. The mold part 90 is formed.
In the present embodiment, the mold portion 90 has the semiconductor element 30 and the metal plate 40 embedded therein.
And the said insulating sheet 14 is distribute | arranged to the lower surface of the metal plate 40 used as the opposite side to the side in which the said semiconductor element 30 is mounted.
The insulating sheet 14 of the present embodiment has a shape corresponding to the lower surface of the metal plate 40 in a plan view, and the lower surface outer edge 40e of the metal plate 40 and the outer edge of the first insulating layer 11 are aligned. It is bonded to the lower surface of the metal plate 40.

Further, the insulating sheet 14 of the present embodiment is used for forming the semiconductor module 100 so that the lower surface side is exposed when the upper surface side is embedded in the mold part 90 and the heat radiating member 20 is not provided. .
That is, the semiconductor module 100 of this embodiment is formed such that the lower surface of the mold part 90 is substantially flush with the lower surface of the second insulating layer 12 of the insulating sheet 14.

  In the present embodiment, as the heat radiating member 20, a plate-like substrate portion 21 whose upper surface is a flat surface larger than the lower surface of the metal plate 40 and a plurality of fins are suspended from the lower surface of the substrate portion 21. A heat dissipating fin having a fin portion 22 is employed.

In the semiconductor module 100 of this embodiment, the B-staged first insulating layer 11 is bonded to the lower surface of the metal plate 40.
In order to adhere the insulating sheet to the lower surface of the metal plate, the thermally conductive sheet with a release sheet of the present embodiment is used.
Specifically, first, the module main body is placed on a table having a horizontal upper surface so that the metal plate is on the upper side. As shown in FIG. 4, a positioning portion 220 for determining the position of the thermally conductive sheet with the release sheet relative to the module body is provided around the base 210. The positioning unit 220 is configured to determine the position of the thermal conductive sheet 10 with the release sheet when the thermal conductive sheet 10 with the release sheet is stacked on the module body on the table 210. The positioning part 220 has a plurality of rod-like members 220a extending in the vertical direction. The positioning part 220 is configured such that when the thermally conductive sheet with release sheet 10 is disposed on the table 210, the extension part is sandwiched between two rod-like members for each extension part. ing. The distance between the two rod-like members sandwiching each extending portion is the same length as the width of the extending portion. Thereby, the position of the heat conductive sheet with a release sheet arranged on the table is determined.
Next, the first insulating layer 11 of the thermally conductive sheet with release sheet 10 is made into a B-stage, and the thermally conductive sheet with release sheet is placed on the module body so that the release sheet is on the upper side, and a metal plate The B-staged first insulating layer 11 is adhered to the substrate, and the release sheet is peeled off.
Further, the B-staged second insulating layer 12 is bonded to the substrate portion of the heat dissipation member.
And the heat conductive sheet 14 is heated and the insulating layers 11 and 12 are C-staged.
Here, although the heat conductive sheet 14 is bonded to the heat dissipation member after the heat conductive sheet 14 is bonded to the module body, the heat conductive sheet is bonded to the heat dissipation member after the heat conductive sheet 14 is bonded to the heat dissipation member. 14 may be adhered to the module body.

As described above, in the semiconductor module 100 of the present embodiment, the semiconductor element 30 is directly mounted on the metal plate 40, and the semiconductor element 30 and the metal plate 40 have substantially the same potential.
Therefore, the insulating sheet 14 forms a good heat transfer path between the metal plate 40 and the heat radiating member 20, and the electrical connection between the metal plate 40 and the heat radiating member 20 is interrupted. The semiconductor module 100 is provided as necessary.

  Since the insulating sheet 14 of this embodiment has excellent electrical insulation and thermal conductivity, it is possible to suppress an excessive increase in the junction temperature of the semiconductor element 30 during the operation of the semiconductor module 100. It can prevent 100 failures and prolong the service life.

Such an effect is not limited to the embodiment illustrated in FIG. 3 but also in the semiconductor module illustrated in FIG.
This will be described with reference to FIG.
FIG. 5 is a schematic diagram showing a cross section of the semiconductor module as in FIG. 3. In FIG. 5, the components denoted by the same reference numerals as in FIG. 3 are the same as those in FIG. The explanation will not be repeated more than necessary.

  The semiconductor module 100 ′ shown in FIG. 5 is an insulating layer single-layer sheet body in which the insulating sheet 14 ′ does not have a laminated structure, and a resin composition containing an inorganic filler is B-staged. This is different from the semiconductor module 100 of FIG.

  In addition, the semiconductor module 100 ′ has the insulating sheet 14 ′ formed in the same shape as the planar shape of the case 60 ′, and the mold part 90 ′ is substantially flush with the lower surface of the metal plate 40 ′. It differs from the semiconductor module 100 of FIG. 3 also in the point formed.

  The insulating sheet 10 ′ is used by being adhered to the lower surface of the module body 100x ′, which is the main part of the semiconductor module 100 ′ excluding the insulating sheet 14 ′, and insulates the metal plate 40 ′. Used to construct 100 '.

  Further, as shown in FIG. 5, the insulating sheet 10 'is used by being interposed between the module main body 100x' and the heat radiating member 20 '.

When forming the semiconductor module 100 ′ as shown in FIG. 5 using the insulating sheet 14 ′, the insulating sheet 14 ′ is used after first bonding the insulating sheet 14 ′ to the module body side. Further, the heat dissipating member 20 ′ may be bonded. Conversely, after the insulating sheet 14 ′ is once bonded to the upper surface of the substrate portion 21 ′ of the heat dissipating member 20 ′, the heat dissipating member with the insulating layer is produced. The heat dissipation member with an insulating layer may be bonded to the module main body 100x ′.
Further, the insulating sheet 14 ′ is bonded to the module body 100x ′ and the heat radiating member 20 ′ at the same time by, for example, hot pressing the insulating sheet 14 ′ between the module main body 100x ′ and the heat radiating member 20 ′. You may make it make it.

  Even in such a case, since the C-staged insulating sheet 14 ′ exhibits excellent electrical insulation and thermal conductivity, the semiconductor module 100 ′ including the insulating sheet 14 ′ as a constituent member has a useful life. Can be prolonged.

In addition, although detailed description is not repeated here any more, for example, in the embodiment illustrated in FIG. 5, the insulating sheet 14 ′ has two or more insulating layers in the same manner as illustrated in FIGS. It is also possible to have a base material layer other than the insulating layer.
Moreover, in this invention, the epoxy composition used as the formation material of an insulating sheet can be utilized also for formation of the said mold parts 90 and 90 ', the said cases 60 and 60', etc.
Furthermore, about a heat conductive sheet with a peeling sheet of this invention, a conventionally well-known technical matter can be suitably employ | adopted in the range in which the effect of this invention is not impaired remarkably.

10: Thermally conductive sheet with release sheet (insulating sheet with release sheet), 11: First insulating layer, 12: Second insulating layer, 14: Thermally conductive sheet, 15: Extension part,
20: member for heat dissipation, 30: semiconductor element, 40: metal plate, 100: semiconductor module, 100x: module body

Claims (3)

A thermally conductive sheet with a release sheet, comprising a thermally conductive sheet and a release sheet laminated on the thermally conductive sheet,
A module body in which a semiconductor element is resin-molded, a metal heat radiation member exposed to the outside to dissipate heat generated by the semiconductor element, and the thermal conductivity interposed between the module body and the heat radiation member Used to form a semiconductor module comprising a sheet,
The thermally conductive sheet includes an inorganic filler and an insulating layer containing a thermosetting resin,
The release sheet has a release sheet body whose outer peripheral edge is substantially the same shape as the outer peripheral edge of the thermally conductive sheet, and the outer peripheral edge of the release sheet body coincides with the outer peripheral edge of the thermally conductive sheet. A thermal conductive sheet with a release sheet, further comprising an extension portion laminated on the thermal conductive sheet and extending outward from an outer peripheral edge of the release sheet main body.   The said extension part is used for positioning of the said heat conductive sheet with respect to the said module main body or the said heat radiating member when sticking the said heat conductive sheet on the said module main body or the said heat radiating member. The thermally conductive sheet with a release sheet as described.   The thermal conductive sheet is formed such that the shape of the outer peripheral edge of the thermal conductive sheet is rotationally symmetric twice, and further, the shape of the outer peripheral edge of the release sheet is rotated twice. The thermally conductive sheet with a release sheet according to claim 1 or 2, which is formed so as to be symmetrical.

Images