JP2015173163A - heat dissipation device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance heat dissipation effect while maintaining the shape corresponding to the thinning of an electronic apparatus.SOLUTION: A heat dissipation device includes a plurality of elementary heat dissipation fins arranged radially to spread from the inlet side toward the outlet side, and having a width that is narrower on the inlet side where heat dissipation wind is blown in than on the outlet side where heat dissipation wind is blown out. The elementary heat dissipation fins are arranged while being deviated in the circulating direction of heat dissipation wind for adjoining elementary heat dissipation fins. In the elementary heat dissipation fins thus arranged, the inlet side corners of respective elementary heat dissipation fins are arranged linearly.

Description

  The present invention relates to a heat dissipation device.

  An electronic component included in an electronic device generates heat during its operation. Therefore, various cooling devices and cooling structures for cooling electronic components by radiating heat have been proposed. For example, a cooling structure is known that has a heat dissipating body attached to a heat generating body and a cooling fan provided facing the front end of the heat dissipating body, and the shape of the heat dissipating body is increased as the distance from the cooling fan increases. (For example, refer to Patent Document 1). Such a cooling structure is expected to enhance the heat dissipation effect.

Japanese Patent Laid-Open No. 7-249885

  However, since the cooling structure disclosed in Patent Document 1 is bulky, it is assumed that it is difficult to cope with the thinning of electronic devices.

  In one aspect, it is an object of the heat dissipation device disclosed in the present specification to enhance a heat dissipation effect while maintaining a shape that can cope with a reduction in thickness of an electronic device.

  The heat dissipating device disclosed in the present specification has a plurality of radial arrangements in which the width of the inlet side into which the heat radiation is blown is narrower than the width of the outlet side from which the heat radiation is blown, and is spread radially from the inlet side toward the outlet side Equipped with a single heat dissipation fin.

  According to the heat dissipating device disclosed in the present specification, the heat dissipating effect can be enhanced while maintaining a shape that can cope with the thinning of the electronic device.

FIG. 1 is a plan view of the heat dissipation device of the first embodiment. FIG. 2A is a perspective view of the heat dissipation device of the first embodiment as viewed from the outlet side of the radiant air, and FIG. 2B is a perspective view of the heat radiator of the first embodiment as viewed from the inlet side of the radiant air. FIG. 3 is a five-side view of a single heat dissipation fin in the heat dissipation device of the first embodiment, FIG. 3A is a plan view, FIG. 3B is a left side view, and FIG. 3C is a right side view. 3D is a front view and FIG. 3E is a rear view. FIG. 4A is a perspective view of the single heat radiating fin as viewed from the outlet side of the heat radiating air, and FIG. 4B is a perspective view of the single heat radiating fin as viewed from the inlet side of the heat radiation. FIG. 5 is an explanatory view schematically showing the arrangement of the single heat dissipating fins in the heat dissipating device of the first embodiment. 6 is an explanatory view illustrating a state where the heat dissipation device of the first embodiment is mounted on an electronic device. FIG. 7 is a plan view of a heat dissipation device of a comparative example. FIG. 8 is a plan view of the heat dissipation device of the second embodiment. FIG. 9 is a perspective view of the heat dissipation device of the second embodiment as viewed from the outlet side of the heat radiation. FIG. 10 is an explanatory view schematically showing the arrangement of the single heat dissipating fins in the heat dissipating device of the first embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. However, in the drawings, the dimensions, ratios, and the like of each part may not be shown so as to completely match the actual ones. Further, depending on the drawings, components that are actually present may be omitted for convenience of explanation, or dimensions may be exaggerated from the actual drawing.

(First embodiment)
A heat radiating device 100 according to the first embodiment will be described with reference to FIGS. 1 to 5. FIG. 1 is a plan view of a heat dissipation device 100 according to the first embodiment. 2A is a perspective view of the heat radiating device 1 of the first embodiment as viewed from the outlet 100out side of the radiating air, and FIG. 2B is a perspective view of the heat radiating device 100 of the first embodiment on the side of the radiant air inlet 100in. It is the perspective view seen from. 3 is a five-side view of the single heat radiation fin 1 in the heat dissipation device 100 of the first embodiment, FIG. 3A is a plan view, FIG. 3B is a left side view, and FIG. 3C is a right side view. 3D is a front view, and FIG. 3E is a rear view. Here, the front view is a view as seen from the inlet side of the single radiating fin 1, and the rear view is a view as seen from the outlet side of the single radiating fin 1. 4A is a perspective view of the single radiating fin 1 viewed from the outlet 1out side of the radiating air, and FIG. 4B is a perspective view of the single radiating fin 1 viewed from the inlet 1in side of the radiating air. FIG. 5 is an explanatory view schematically showing the arrangement of the single heat dissipating fins 1 in the heat dissipating device 100 of the first embodiment.

  First, a schematic configuration of the heat dissipation device 100 will be described. Referring to FIGS. 1, 2 </ b> A, and 2 </ b> B, the heat radiating device 100 is formed by connecting a plurality of single heat radiating fins 1 in the width direction. Here, the width direction is a direction along the width Wfinin indicating the dimension of the inlet 100in of the heat dissipation device 1 and the width Wfinout of the outlet 100out in FIG. Referring to FIG. 3A, in the single heat dissipating fin 1, the width Win on the inlet 1in side into which the heat radiation is blown is narrower than the width Wout on the outlet 1out side from which the heat radiation is blown. Such single heat dissipating fins 1 are arranged radially so as to spread from the inlet 1 in side toward the outlet 1 out side. Here, the single heat radiating fins 1 are arranged so as to be shifted from each other in the flow direction of the heat radiating air from the inlet 1 in to the outlet 1 out with respect to the adjacent single heat radiating fins 1. At this time, the single heat radiation fins 1 are arranged so that the corners 1L or the corners 1R on the inlet 1in side of the single heat radiation fins 1 are aligned in a straight line. The corner 1L is a corner located on the left side of the inlet 1in when the single heat dissipating fin 1 is viewed from the inlet 1in toward the outlet 1out. Similarly, the corner 1R is a corner located on the right side of the inlet 1in. Here, the radiating air is assumed to be blown out from the air outlet of the heat radiating fan 150 shown in phantom in FIG. Hereinafter, the single heat radiation fin 1 and the heat radiation device 100 will be described in detail.

  As described above, in the single radiating fin 1, the width Win on the inlet 1in side through which the radiating air is blown from the radiating fan 150 is narrower than the width Wout on the outlet 1out side from which the radiating air is blown. That is, in the plan view shown in FIG. 3A, the single heat radiation fin 1 has a trapezoidal shape. The single heat radiating fin 1 is formed by bending an aluminum plate material having excellent thermal conductivity, and includes a top plate portion 1a, a bottom plate portion 1b, and a side plate portion 1c. The material of the single heat radiating fin 1 is preferably excellent in thermal conductivity, but is not limited to aluminum, and may be made of, for example, copper or other materials. The single heat radiating fin 1 is formed by bending each part by drawing a plate material. Although the heat radiating device 100 may be manufactured by, for example, casting or extrusion, these manufacturing methods may require a mold and may be expensive. On the other hand, the heat radiating device 100 of the present embodiment is advantageous in terms of cost because it uses the single heat radiating fin 1 that can produce the same product in large quantities by drawing.

  The side facing the side plate portion 1c in the single heat radiating fin 1 does not form a wall, but is an open portion 1d that is open. The length of the single radiation fin 1, that is, the length from the inlet 1in to the outlet 1out is L0. The single radiating fin 1 includes a right corner 1R and a left corner 1L on the inlet 1in side. The single heat radiation fin 1 has an inclined surface in the middle of the inlet 1in and the outlet 1out. Thereby, the entrance 1in side is higher than the exit 1out by the step height h1. By providing the steps as described above, a space for arranging the heat pipe 20 corresponding to an example of a heat conducting member described later is secured. The single heat radiating fin 1 may not have such a step as long as the width Win of the inlet 1in is smaller than the width Wout of the outlet 1out.

  The heat dissipating device 100 is formed by arranging a plurality of single heat dissipating fins 1 having the same shape in the radial direction and extending radially from the inlet 1 in side toward the outlet 1 out side. By using the single radiating fin 1 having the same shape, mass productivity is excellent. Specifically, as shown in FIG. 5, the heat dissipating device 100 sequentially arranges the single heat dissipating fins 1 on the right side and the left side of the center single heat dissipating fin 1 center disposed with its center aligned with the center line c. Since the single heat radiating fin 1 has a trapezoidal shape, when the side plate portion 1c of one single heat radiating fin 1 and the open portion 1d of another adjacent single heat radiating fin 1 are arranged so as to be along, the shape that expands radially. It becomes. That is, the single heat radiating fin 1 located on the left side of the center single heat radiating fin 1 center is inclined to the left side with respect to the center line 1, and the single heat radiating fin 1 positioned on the right side of the central single heat radiating fin 1 center is On the other hand, it will be in the state inclined to the left side. In this way, the single heat dissipating fins 1 are arranged in a radially expanding shape. In the heat radiating device 1 of the present embodiment, the single heat radiating fins 1 are further arranged so as to be shifted from each other in the flow direction of the heat radiating air with respect to the adjacent single heat radiating fins 1. Specifically, as shown in FIG. 5, in the single heat radiating fin 1 disposed on the left side of the central single heat radiating fin 1 center disposed at the center of the heat radiating device 100, the corner 1 </ b> L is placed on the reference line Lbase. Position. On the other hand, in the single radiating fin 1 arranged on the right side of the central single radiating fin 1 center, the corner portion 1R is positioned on the reference line Lbase. The single heat radiation fins 1 are thus arranged so that the corners 1L or the corners 1R on the inlet 1in side of the single heat radiation fins 1 are aligned in a straight line. As a result, the heat radiating device 100 is formed in a substantially trapezoidal shape as shown in FIG. Thus, the space efficiency is improved by arranging the corner portions 1L or the corner portions 1R on the inlet 1in side of each single heat radiating fin 1 so as to be aligned in a straight line so that the shape of the heat dissipation device 100 is substantially trapezoidal. To do. Further, by making the inlet 100in of the heat radiating device 100 linear, the inlet 100in faces the air outlet 150a of the heat radiating fan 150, so that the distance between the inlet 100in and the air outlet 150a can be easily reduced in the entire area of the inlet 100in. Become. In the heat radiating device 100 of the present embodiment, the individual heat radiating fins 1 are separately joined to the heat pipe 20 so that the arrangement is maintained and is formed into a substantially trapezoidal shape. The adjacent single heat radiating fins 1 may be joined to each other by solder or other means and formed into a substantially trapezoidal shape. However, by connecting each single heat radiating fin 1 to the heat pipe 20, the single heat radiating fin 1 is used. The trouble of joining together can be saved. In addition, although the heat pipe 20 is heat-transferred with the heat medium with which it filled, the board | plate material with favorable heat conductivity may be sufficient.

  In such a heat dissipation device 100, the width of the inlet 100in is Wfinin and the width of the outlet 100out is Wfinout. The width Wfinout is wider than the width Wfinin. The length of the heat dissipation device 100, that is, the length from the inlet 100in to the outlet 100out is Lfin. As described above, in the heat dissipation device 100 of the present embodiment, the width Wfinout of the outlet 100out is wider than the width Wfinin of the inlet 100in, so that the flow of the heat radiation becomes smooth and the heat dissipation effect is improved.

  Next, with reference to FIG. 6, a state in which the heat dissipation device 100 of the present embodiment is mounted on the electronic device 200 will be described. The electronic device 200 is a tablet personal computer, but may be another electronic device including an electronic component to be cooled. The electronic device 200 includes a Central Processing Unit (CPU) 10 in a housing 200a. The CPU 10 generates heat when driven. That is, the CPU 10 is one of the components to be cooled and is required to be cooled. In addition, even if it is electronic components other than CPU10, what needs cooling can be made into cooling object. Therefore, the electronic device 200 includes the heat dissipation fan 150 and the heat dissipation device 100 in the housing 200a. The heat radiating device 100 is installed in a state in which the inlet 100in faces the air outlet 150a of the heat radiating fan 150. One end of the heat pipe 20 is installed in the heat dissipation device 100. The other end of the heat pipe 20 is installed on the CPU 10. The heat pipe 20 transmits the heat generated by the CPU 10 to the heat radiating device 100 side. The heat transmitted to the heat dissipation device 100 is released when the heat dissipation air blown out by the heat dissipation fan 150 passes through the heat dissipation device 100. Thereby, CPU10 is cooled. Since the heat pipe 20 is installed in a region lowered by one step on the outlet 100out side of the heat radiating device 100, the heat pipe 20 is accommodated in the housing 200a without being bulky in the height direction.

  The width Wfinout of the inlet 100in of the heat radiating device 100 is substantially the same as the width Wfunout of the outlet 150a of the heat radiating fan 150. Thereby, the wind blown by the heat radiating fan 150 can be introduced into the heat radiating device 100 without waste. Here, the heat radiating device 110 of the comparative example shown in FIG. 7 will be described. The heat radiating device 110 has a configuration in which the single heat radiating fins 111 are connected in the width direction, similarly to the heat radiating device 100 of the present embodiment. In the heat dissipation device 110, the width dimension of the inlet 110a and the width dimension of the outlet 110b are the same. This is because the single heat radiation fin 111 included in the heat radiation device 110 is rectangular unlike the single heat radiation fin 1 of the present embodiment. It is conceivable to increase the dimension in the width direction when trying to improve the heat dissipation effect of such a rectangular heat dissipation device 110 in the presence of restrictions on the dimension in the thickness direction of the casing 200a. However, when the size of the heat radiating fan 150 is limited, when the size of the heat radiating device 110 in the width direction is increased, the size of the heat radiating fan 150 extends to the outside of the outlet 150a of the heat radiating fan 150. The portion that extends to the outside of the blower outlet 150a is difficult to introduce the air blown from the heat radiating fan 150 and hardly contributes to the improvement of the heat radiating effect by the heat radiating device 110. Moreover, the part which extended to the outer side of the blower outlet 150a is disadvantageous also in terms of space efficiency in the housing | casing 200a.

  In contrast to the heat radiating device 110 of the comparative example, the heat radiating device 100 of the present embodiment can efficiently introduce the radiated air blown from the heat radiating fan 150 into the inside. Furthermore, since the heat dissipating device 100 has a trapezoidal shape that spreads radially toward the outlet 100out side, the flow of the heat dissipating air becomes smooth and the heat dissipating effect is improved.

  Thus, according to the heat radiating device 100 of the present embodiment, a smooth flow of the radiating air can be realized and the heat radiating drop can be improved even when the dimension in the thickness direction is restricted. That is, the heat dissipation device 100 of the present embodiment can enhance the heat dissipation effect while maintaining a shape that can cope with the thinning of the electronic device 200.

(Second Embodiment)
Next, the heat dissipation device 120 of the second embodiment will be described with reference to FIGS. 8 to 10. FIG. 8 is a plan view of the heat dissipation device 120 of the second embodiment. FIG. 9 is a perspective view of the heat dissipation device 120 of the second embodiment as viewed from the outlet 120out side of the heat radiation. FIG. 10 is an explanatory view schematically showing the arrangement of the single heat dissipating fins 1 in the heat dissipating device of the first embodiment. The heat dissipating device 100 of the first embodiment and the heat dissipating device 120 of the second embodiment differ in the arrangement of the single heat dissipating fins 1. As in the heat dissipation device 100 of the first embodiment, the heat dissipation device 120 of the second embodiment has a configuration in which trapezoidal single heat dissipation fins 1 are connected in the width direction. Moreover, the point arrange | positioned by joining to the heat pipe 20 is the same as that of 1st Embodiment. As shown in FIG. 10, the single heat radiation fins 1 in the heat dissipation device 120 are arranged without shifting the adjacent single heat radiation fins 1 in the flow direction of the heat radiation. In other words, the body heat radiation fins 1 are arranged radially to form a fan shape. In this case, except for both end portions of the heat radiating device 120, the position of the corner portion 1 </ b> L of one single heat radiating fin 1 basically matches the position of the corner portion 1 </ b> R of the adjacent single heat radiating fin 1. As a result, the inlet 120in and the outlet 120out of the heat dissipation device 120 each draw a continuous arc. Further, when the position on the inlet side of the center single heat dissipating fin 1 center is defined as a reference line Lbase, the end portion on the inlet side of the heat radiating device 120 is positioned below Lbase in the drawing. The dimensions of each part of the heat dissipation device 120 having such an arrangement of the single heat dissipation fins 1 are as follows when compared with the heat dissipation device 100 of the first embodiment. First, the width dimension Wfinin of the inlet 120in and the width dimension Wfinout of the outlet 120out are narrower than the corresponding dimensions of the heat dissipation device 100 of the first embodiment. On the other hand, the length of the heat dissipation device 120, that is, the length Lfin from the inlet 120in to the outlet 120out is longer than the corresponding dimension of the heat dissipation device 100 of the first embodiment. As described above, the heat dissipation device 100 of the first embodiment and the heat dissipation device 120 of the second embodiment have different outer dimensions. As described above, even if the external dimensions are different from those of the heat dissipation device 100 of the first embodiment, the heat dissipation device 120 of the second embodiment can also correspond to the thinning of the electronic device 200 as in the first embodiment. The heat dissipation effect can be enhanced while maintaining the above. For this reason, what is necessary is just to select suitably the thermal radiation apparatus 100 of 1st Embodiment, and the thermal radiation apparatus 120 of 2nd Embodiment according to the shape and dimension in the housing | casing 200a.

  Although the preferred embodiment of the present invention has been described in detail above, the present invention is not limited to the specific embodiment, and various modifications, within the scope of the gist of the present invention described in the claims, It can be changed.

1 single radiating fin 1 center central single radiating fin 1a top plate portion 1b bottom plate portion 1c side plate portion 1d open portion 1l left corner 1r right corner 1in inlet 1out outlet 10 CPU
20 heat pipe 100, 110, 120 heat radiating device 150 heat radiating fan 150a air outlet 200 electronic device 200a housing

Claims (6)

  A heat dissipating device comprising a plurality of single heat dissipating fins arranged radially so that the width of the inlet side into which the heat radiation is blown is narrower than the width of the outlet side from which the heat radiation is blown, and extends from the inlet side toward the outlet side.   2. The heat dissipating device according to claim 1, wherein the single heat dissipating fins are arranged so as to be shifted from each other in the flow direction of the heat dissipating air with respect to the adjacent single heat dissipating fins.   The heat dissipating device according to claim 2, wherein the single heat dissipating fins are arranged so that corners on the inlet side of the single heat dissipating fins are aligned in a straight line.   The heat dissipating device according to claim 1, wherein the single heat dissipating fins are arranged radially to form a fan shape.   The heat dissipating device according to claim 1, wherein the single heat dissipating fin is formed by bending a plate material. The heat dissipating device according to any one of claims 1 to 5, wherein the single heat dissipating fins are respectively joined and arranged on a heat conducting member that conducts heat from a component to be cooled.

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