JP2015172177A - Adhesive polyorganosiloxane composition, and optical semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an adhesive polyorganosiloxane composition that exhibits good adhesiveness with respect to heat resistant plastics such as polyphthalic acid amide resin (PPA).SOLUTION: The adhesive polyorganosiloxane composition contains: (A) 100 parts by mass of polyorganosiloxane comprising an alkenyl group containing a trifunctional type siloxane unit comprising an aryl group; (B) polyorganohydrogen siloxane that corresponds to 0.5-2.5 hydrogen atoms per an alkenyl group in the component (A); (C) a platinum-based catalyst; and (D) (a) a siloxane unit that comprises an epoxy group and (b) a bifunctional siloxane unit that comprises an alkenyl group, and 0.05-10 parts by mass of an adhesiveness-imparting agent having 1000-15000 Mw.

Description

  The present invention relates to an adhesive polyorganosiloxane composition and an optical semiconductor device, and in particular, an adhesive polyorganosiloxane having good adhesion to a heat-resistant plastic such as a polyphthalamide resin (hereinafter referred to as PPA). The present invention relates to an optical semiconductor device having a composition and a cured product of the composition as a sealing material or the like.

  Silicone (polyorganosiloxane) compositions such as silicone rubber and silicone gel are used in various applications because they form cured products with excellent properties such as weather resistance, heat resistance, hardness, and elongation. .

  For example, in an LED device including a light emitting element such as a light emitting diode (LED), as a material for sealing the light emitting element or a material for forming a lens disposed in an optical path from the light emitting element, heat resistance and A polyorganosiloxane composition excellent in ultraviolet resistance and the like is used. In particular, an addition reaction type polyorganosiloxane composition that cures by hydrosilylation is cured in a short time by heating and does not generate a by-product during curing, and is therefore widely used as a sealing material for LED devices.

  However, the conventional addition reaction type polyorganosiloxane composition has low adhesion itself, and in particular, noble metals such as silver (Ag) and gold (Au) used as frames and electrodes of LED devices, Adhesiveness to heat-resistant plastics such as PPA used as reflectors and supporting substrates was insufficient. Therefore, by adding an silane compound having an epoxy group such as γ-glycidoxypropylmethyldimethoxysilane or γ-glycidoxypropyltrimethoxysilane to the addition reaction type polyorganosiloxane composition, the adhesiveness is improved. (For example, refer to Patent Document 1).

  However, since the silane compound is easy to volatilize at a low molecular weight, it is easily volatilized by heating in the step of forming and curing the polyorganosiloxane composition to form a sealing layer or the like. Further, even after the sealing layer is formed, the silane compound is volatilized and is easily lost from the sealing layer due to heat generated from the light emitting element and heating during application of the temperature cycle. Therefore, the adhesiveness of the sealing layer is lowered, and there is a problem that peeling occurs between the base material such as PPA and the sealing layer.

  Moreover, the polyorganosiloxane composition for LED containing the silane coupling agent, the hydrosilyl group and / or the siloxane having an alkoxysilyl group and a (meth) acryloxy group, an organic functional group such as an epoxy group as an adhesion imparting component Has also been proposed (see, for example, Patent Document 2). However, this composition is also not sufficient in terms of long-term adhesion to PPA and the like.

JP 2010-248384 A JP 2009-269968 A

  The present invention has been made to solve such problems, and has good adhesiveness to heat-resistant plastics such as PPA, etc., and generates heat from the light-emitting elements and heat during temperature cycling. It is an object of the present invention to provide an adhesive polyorganosiloxane composition that is suitable for use as a sealing material for optical semiconductor devices and the like without causing a decrease in the adhesiveness.

The adhesive polyorganosiloxane composition of the present invention comprises (A) 100 parts by mass of a polyorganosiloxane having an alkenyl group bonded to a silicon atom and containing a trifunctional siloxane unit having an aryl group, and (B) silicon. A polyorganohydrogensiloxane having hydrogen atoms bonded to atoms, in an amount such that the amount of hydrogen atoms in this component is 0.1 to 4.0 per alkenyl group in component (A). (C) a platinum-based catalyst is represented by a catalytic amount, and (D) (a) Formula: R ¹ SiO _3/2 (wherein R ¹ represents a monovalent organic group having an epoxy group). A trifunctional siloxane unit and a bifunctional siloxane represented by the formula: R ¹ R ² SiO _2/2 (wherein R ¹ is as defined above, R ² represents an alkyl group or an alkoxy group). Unit and formula: R ¹ R ^It has at least one epoxy group selected from the group consisting of monofunctional siloxane units represented by ² ₂ SiO _1/2 (wherein R ¹ and R ² are the same as those described above). A siloxane unit and a formula (b): R ³ ₂ SiO _2/2 (wherein R ³ represents a monovalent hydrocarbon group selected from an alkenyl group, an alkyl group and an aryl group, at least one of which is an alkenyl group) And an adhesiveness-imparting agent composed of a polyorganosiloxane having a weight average molecular weight of 1000 to 15000, each of which contains a bifunctional siloxane unit having an alkenyl group. It is characterized by.

  The optical semiconductor device of the present invention is characterized by having a cured product obtained by curing the adhesive polyorganosiloxane composition of the present invention.

  In the following description, an “alkenyl group bonded to a silicon atom” may be simply referred to as an “alkenyl group”. In addition, “hydrogen atom bonded to a silicon atom” may be simply referred to as “hydrogen atom”.

  According to the adhesive polyorganosiloxane composition of the present invention, the adhesive polyorganosiloxane composition has good adhesiveness to heat-resistant plastics such as PPA, and the good adhesiveness is a temperature caused by heat generation or application of a temperature cycle. It does not decline with the rise. Therefore, an optical semiconductor device such as an LED device in which a sealing layer is formed from a cured product of this polyorganosiloxane composition has good adhesion between the sealing layer and the plastic substrate, and peels off at the interface between them. Is less likely to occur and is highly reliable.

It is a graph which shows the profile of the temperature rising temperature for investigating adhesiveness in the package test (1) of the polyorganosiloxane composition obtained in Examples 1 to 6 and Comparative Examples 1 and 2 of the present invention.

  Embodiments of the present invention will be described below.

[Adhesive agent]
The adhesion imparting agent of component (D) contains (a) a siloxane unit having an epoxy group and (b) a bifunctional siloxane unit having an alkenyl group, and has a weight average molecular weight (hereinafter referred to as Mw) of 1000. It is an adhesiveness imparting agent comprising a polyorganosiloxane which is ˜15000.
Here, (a) the siloxane unit having an epoxy group includes a trifunctional siloxane unit represented by the formula (1): R ¹ SiO _3/2 and a formula (2): R ¹ R ² SiO _2/2 . It is at least one selected from the group consisting of a bifunctional siloxane unit represented and a monofunctional siloxane unit represented by the formula (3): R ¹ R ² ₂ SiO _1/2 . In these formulas, R ¹ represents a monovalent organic group having an epoxy group, and R ² represents an alkyl group or an alkoxy group.

(B) The bifunctional siloxane unit having an alkenyl group is a unit represented by the formula (4): R ³ ₂ SiO _2/2 . In the formula (4), R ³ represents a monovalent hydrocarbon group selected from an alkenyl group, an alkyl group and an aryl group, and at least one of the two R ³ is an alkenyl group.

  The polyorganosiloxane containing (a) a siloxane unit having an epoxy group and (b) a bifunctional siloxane unit having an alkenyl group and having an Mw in the above-described range is a polyorganosiloxane having an alkenyl group in the molecule. When blended with an addition reaction type polyorganosiloxane composition containing a polyorganohydrogensiloxane having a hydrogen atom in the molecule as a base polymer, the composition has good compatibility with the base polymer and is uniformly mixed. In the curing, the alkenyl group of the bifunctional siloxane unit reacts with the hydrogen atom of the polyorganohydrogensiloxane contained in the composition and is bonded to the base polymer through this reaction. Therefore, this polyorganosiloxane is not lost by volatilization due to heat-curing of the composition, heat generation after curing, heating in the temperature cycle, etc., and noble metals such as gold and silver, and plastics such as PPA On the other hand, the high adhesiveness derived from an epoxy group is shown.

  Hereinafter, the siloxane unit constituting the polyorganosiloxane that is an adhesion-imparting agent will be further described.

<(A) Siloxane unit having epoxy group>
(A) The siloxane unit having an epoxy group includes a trifunctional siloxane unit represented by the formula (1): R ¹ SiO _3/2 (hereinafter referred to as a T1 ^ep unit), and a formula (2): R ^1. A bifunctional siloxane unit represented by R ² SiO _2/2 (hereinafter referred to as D1 ^ep unit) and a monofunctional siloxane unit represented by formula (3): R ¹ R ² ₂ SiO _1/2 (Hereinafter referred to as M1 ^ep unit). At least one siloxane unit selected from the group consisting of:

In the formulas (1) to (3), R ¹ represents a monovalent organic group having an epoxy group. Examples of the monovalent organic group having an epoxy group include an epoxyalkyl group and a glycidoxyalkyl group. From the viewpoint of easy synthesis of the polyorganosiloxane that is an adhesiveness-imparting agent, R ¹ is preferably a glycidoxyalkyl group, particularly preferably a γ-glycidoxypropyl group.

Further, in the equation (1) ~ (3), R 2 represents an alkyl group or an alkoxy group. Examples of the alkyl group include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a tert-butyl group, a hexyl group, a cyclohexyl group, and an octyl group, and a methyl group is more preferable. Examples of the alkoxy group include a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, a butoxy group, an isobutoxy group, and a tert-butoxy group, and a methoxy group is more preferable.

(A) The siloxane unit having an epoxy group may be at least one of the T1 ^ep unit, the D1 ^ep unit, and the M1 ^ep unit, but the resulting adhesion-imparting agent (polyorganosiloxane) is less likely to volatilize. Thus, it is preferable to contain at least a T1 ^ep unit.

<(B) Bifunctional siloxane unit having an alkenyl group>
(B) The bifunctional siloxane unit having an alkenyl group is a unit represented by the formula (4): R ³ ₂ SiO _2/2 . In the formula (4), R ³ represents a monovalent hydrocarbon group selected from an alkenyl group, an alkyl group and an aryl group, and at least one of the two R ³ is an alkenyl group. Examples of the alkenyl group include a vinyl group, an allyl group, a butenyl group, a pentenyl group, and a hexenyl group, and a vinyl group is more preferable. Examples of the alkyl group include the same alkyl groups as those exemplified for R ² in the formulas (1) to (3). Examples of the aryl group include a phenyl group and a tolyl group. The group other than the alkenyl group for R ³ is preferably an alkyl group, and particularly preferably a methyl group. Hereinafter, the bifunctional siloxane unit having an alkenyl group represented by the formula (4) will be referred to as a D1 ^vi unit.

<Other siloxane units>
The polyorganosiloxane that is an adhesion-imparting agent contains at least one unit selected from (a) T1 ^ep unit, D1 ^ep unit, and M1 ^ep unit, and (b) D1 ^vi unit, ): A trifunctional siloxane unit represented by R ⁴ SiO _3/2 and / or a bifunctional siloxane unit represented by formula (6): R ⁴ ₂ SiO _2/2 .

In Formula (5) and Formula (6), R ⁴ represents an alkyl group or an aryl group. Examples of the alkyl group and the aryl group are the same as those described above. R ⁴ is preferably an alkyl group, and particularly preferably a methyl group. Hereinafter, the trifunctional siloxane unit represented by the formula (5) is referred to as T1 unit, and the bifunctional siloxane unit represented by the formula (6) is referred to as D1 unit.

In the polyorganosiloxane that is an adhesiveness-imparting agent, the composition ratio of each siloxane unit, that is, (a) at least one selected from T1 ^ep unit, D1 ^ep unit, and M1 ^ep unit (hereinafter referred to as T1 ^ep unit). The molar ratio of (b) D1 ^vi unit to other units (T1 unit and / or D1 unit) is not particularly limited, but from the viewpoint of imparting adhesiveness to the polyorganosiloxane composition, (a) The proportion of T1 ^ep units and the like is preferably 5 to 50 mol% of all units. Further, from the viewpoint of the reactivity with respect to the addition reaction type polyorganosiloxane composition, it is preferable that the ratio of (b) D1 ^vi unit is 1 to 40 mol% of the total unit.

<Preparation method>
The adhesiveness imparting agent can be prepared, for example, by the method shown below.
That is, a trifunctional silane represented by the formula: R ¹ Si (OR ² ) ₃ , a bifunctional silane represented by the formula: R ¹ R ² Si (OR ² ) ₂ , and a formula: R ¹ R ² a silane compound having at least one epoxy group selected from monofunctional silane represented by ^₂ Si (OR _2), ^wherein: _R 3 2 Si silane compound having an alkenyl group represented by (OR ²⁾ And, if necessary, reacting a trifunctional silane represented by the formula: R ⁴ Si (OR ² ) ₃ and / or a bifunctional silane represented by the formula: R ⁴ ₂ Si (OR ² ) ₂ The container is charged, the solution is made basic, heated, partially hydrolyzed, and then subjected to a condensation reaction.

In the above formula, R ¹ is a monovalent organic group having an epoxy group, R ² is an alkyl group, R ³ is a monovalent hydrocarbon group selected from an alkenyl group, an alkyl group and an aryl group, and R ⁴ is an alkyl group or An aryl group is shown. Examples of these groups include the same groups as those described above. Preferred groups are the same as described above.

  Subsequently, after distilling alcohol off from the obtained reaction mixture, the liquid is neutralized. Thereafter, the low molecular weight component is removed from the reaction mixture, and the solvent removal and concentration are performed to obtain a polyorganosiloxane that is an adhesion-imparting agent.

  The Mw of the polyorganosiloxane thus obtained is in the range of 1000 to 15000. When the Mw of the polyorganosiloxane is less than 1000, in the heating step when curing the polyorganosiloxane composition containing this adhesion-imparting agent, or by heating during curing or temperature cycling, etc. It tends to volatilize, resulting in decreased adhesion. Moreover, when Mw exceeds 15000, the uniform mixing | blending to a composition is difficult and the effect of improving adhesiveness is hard to appear.

[Adhesive polyorganosiloxane composition]
The adhesive polyorganosiloxane composition of the embodiment of the present invention comprises (A) 100 parts by mass of a polyorganosiloxane having an alkenyl group and (B) a polyorganohydrogensiloxane having a hydrogen atom in the component (A). The amount of the hydrogen atom in the component is 0.1 to 4.0 per alkenyl group of (C), (C) a catalytic amount of a platinum-based catalyst, and (D) the above-described adhesion-imparting agent. It contains 0.05 to 10 parts by mass, respectively.
Hereinafter, each component will be described.

<(A) component>
The polyorganosiloxane having an alkenyl group as component (A) is a base polymer of the adhesive polyorganosiloxane composition. It is preferable to use a polyorganosiloxane having two or more alkenyl groups in one molecule.

  Examples of the molecular structure of component (A) include linear and cyclic. The structure such as linear or cyclic may have a branch, but the main chain is basically composed of repeating diorganosiloxane units, and both ends of the molecular chain are blocked with triorganosiloxy groups Are preferred.

  (A) As an alkenyl group couple | bonded with the silicon atom in a component, it is 2-8 carbon atoms, More preferably, it is 2-8 carbon atoms, such as a vinyl group, an allyl group, a butenyl group, a pentenyl group, a hexenyl group, a heptenyl group. There are four. A vinyl group is particularly preferable. When the polyorganosiloxane having an alkenyl group as component (A) is linear, the alkenyl group may be bonded to the silicon atom only at either the molecular chain end or the middle, but the molecular chain end It may be bonded to the silicon atom both in the middle and the middle.

  Examples of organic groups bonded to silicon atoms other than alkenyl groups in component (A) include alkyl groups, particularly methyl groups, ethyl groups, propyl groups, butyl groups, pentyl groups, hexyl groups, cyclohexyl groups, heptyl groups, and the like. An alkyl group having 1 to 10 carbon atoms; an aryl group, particularly an aryl group having 6 to 14 carbon atoms such as a phenyl group, a tolyl group, a xylyl group and a naphthyl group; an aralkyl group such as a benzyl group and a phenethyl group; a chloromethyl group , An unsubstituted or halogen-substituted monovalent hydrocarbon group such as a halogenated alkyl group such as 3-chloropropyl group and 3,3,3-trifluoropropyl group. In particular, a methyl group or a phenyl group is preferable.

  The viscosity (25 ° C.) of the component (A) excluding polyorganosiloxane AA to be described later is preferably 100 to 100,000 mPa · s, particularly preferably 500 to 10,000 mPa · s. When the viscosity (25 ° C.) of component (A) is within this range, the workability of the resulting composition is good and the physical properties of the cured product obtained from this composition are good. .

  Specific examples of the component (A) include molecular chain both ends trimethylsiloxy group-capped dimethylsiloxane / methylvinylsiloxane copolymer, molecular chain both ends trimethylsiloxy group-capped methylvinylpolysiloxane, molecular chain both ends trimethylsiloxy group-capped dimethyl Siloxane / methylvinylsiloxane / methylphenylsiloxane copolymer, dimethylpolysiloxane blocked with dimethylvinylsiloxy group at both ends of molecular chain, dimethylvinylsiloxy group-blocked methylvinylpolysiloxane with molecular chain at both ends, dimethylvinylsiloxy group-blocked dimethyl with molecular chain at both ends Siloxane / methyl vinyl siloxane copolymer, both ends of molecular chain dimethyl vinyl siloxy group blocked dimethyl siloxane / methyl vinyl siloxane / methyl phenyl siloxane copolymer, tri chain siloxy at both ends of molecular chain Blocked dimethylpolysiloxane.

Moreover, the copolymer which has a siloxane unit shown below can also be illustrated.
That is,
A siloxane unit represented by the formula: R ⁵ ₃ SiO _1/2 (R ⁵ is an unsubstituted or substituted monovalent hydrocarbon group other than an alkenyl group; the same shall apply hereinafter), and the formula: R ⁵ ₂ R ⁶ A siloxane unit represented by SiO _1/2 (R ⁶ is an alkenyl group; the same shall apply hereinafter), a siloxane unit represented by the formula: R ⁵ ₂ SiO _2/2 , and a formula: SiO _4/2 . A copolymer comprising siloxane units,
From a siloxane unit represented by the formula: R ⁵ ₃ SiO _1/2 , a siloxane unit represented by the formula: R ⁵ ₂ R ⁶ SiO _1/2 , and a siloxane unit represented by the formula: SiO _4/2 A copolymer,
From a siloxane unit represented by the formula: R ⁵ ₂ R ⁶ SiO _1/2 , a siloxane unit represented by the formula: R ⁵ ₂ SiO _2/2 , and a siloxane unit represented by the formula: SiO _4/2 A copolymer,
It consists of a siloxane unit represented by the formula: R ⁵ R ⁶ SiO _2/2 and a siloxane unit represented by the formula: R ⁵ SiO _3/2 or a siloxane unit represented by the formula: R ⁶ SiO _3/2. A copolymer etc. are mentioned.

R ⁵ in the above formula is an alkyl group such as a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group or a heptyl group; an aryl group such as a phenyl group, a tolyl group, a xylyl group or a naphthyl group; Examples thereof include aralkyl groups such as benzyl group and phenethyl group; and halogenated alkyl groups such as chloromethyl group, 3-chloropropyl group and 3,3,3-trifluoropropyl group. Examples of R ⁶ in the above formula include a vinyl group, an allyl group, a butenyl group, a pentenyl group, a hexenyl group, and a heptenyl group.
These polymers or copolymers can be used alone or in combination of two or more.

  Furthermore, as the component (A), an alkenyl group-containing polyorganosiloxane containing an aryl group-containing trifunctional siloxane unit (hereinafter referred to as polyorganosiloxane AA) can also be used. In this polyorganosiloxane, the number of alkenyl groups in one molecule is not particularly limited, but is preferably 2 or more. Hereinafter, polyorganosiloxane AA will be described.

<Polyorganosiloxane AA>
In the polyorganosiloxane AA, the alkenyl group bonded to the silicon atom has 2 to 8 carbon atoms such as vinyl group, allyl group, butenyl group, pentenyl group, hexenyl group, heptenyl group, more preferably 2 to 2 carbon atoms. There are four. A vinyl group is particularly preferable. Such an alkenyl group may be bonded to either one of the molecular chain terminal and the middle silicon atom, or may be bonded to both the molecular chain terminal and the middle silicon atom.

  Examples of the aryl group contained in the trifunctional siloxane unit include those having 6 to 14 carbon atoms such as a phenyl group, a tolyl group, a xylyl group, and a naphthyl group. A phenyl group is particularly preferable.

  Polyorganosiloxane AA has an organic group bonded to a silicon atom in addition to the alkenyl group and aryl group. Examples of the organic group other than the alkenyl group and the aryl group include an alkyl group having 1 to 10 carbon atoms such as a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a cyclohexyl group, and a heptyl group; Examples thereof include a halogenated alkyl group such as a methyl group, a 3-chloropropyl group and a 3,3,3-trifluoropropyl group. A methyl group is preferred.

In polyorganosiloxane AA, the ratio of trifunctional siloxane units having an aryl group to all structural units is not particularly limited, but from the viewpoint of handling workability of the composition before curing and mechanical strength of the cured product, A ratio of 20 to 60 mol% is preferable, and a ratio of 30 to 55 mol% is more preferable. In particular, as polyorganosiloxane AA, polyorganosiloxane containing a trifunctional siloxane unit represented by the formula: C ₆ H ₅ SiO _3/2 (hereinafter referred to as T ^Ph unit) in a proportion of 20 to 60 mol%. It is preferable to have. As for the content rate of T ^Ph unit with respect to all the structural units, 30-55 mol% is more preferable.

The polyorganosiloxane AA preferably contains a bifunctional siloxane unit in addition to the trifunctional siloxane unit having an aryl group. Moreover, it is preferable that a part of bifunctional type siloxane unit contains the said alkenyl group (for example, vinyl group).
And as polyorganosiloxane AA, the bifunctional siloxane unit represented by the formula: CH ₃ (CH ₂ = CH) SiO _2/2 (hereinafter, referred to as D ^Vi unit) is 10 with respect to all structural units. It is preferable to use at least two types of polyorganosiloxanes: a polyorganosiloxane containing in a proportion of not more than mol% and a polyorganosiloxane containing D ^Vi units in a proportion exceeding 10 mol%. When polyorganosiloxane AA has such two types of polyorganosiloxane, there are effects such as easy adjustment of the hardness and elastic modulus of the cured product.

  The viscosity (25 ° C.) of the polyorganosiloxane AA is preferably 50,000 to 6,000,000 mPa · s, and more preferably 200,000 to 3,000,000 mPa · s. When the viscosity (25 ° C.) of the polyorganosiloxane AA is within this range, the workability of the composition obtained is good and the physical properties of the cured product obtained from this composition are good. .

<(B) component>
The polyorganohydrogensiloxane which is the component (B) reacts with the component (A) and acts as a crosslinking component. The molecular structure of the component (B) is not particularly limited, and various polyorganohydrogensiloxanes such as linear, cyclic, branched, and three-dimensional network (resin) can be used.

  When polyorganosiloxane AA is used as component (A), polyorganohydrogensiloxane of component (B) is 2 or more, preferably 3 or more hydrogen atoms bonded to silicon atoms, ie hydrosilyl, in one molecule. It preferably has a group (Si—H group). When the polyorganohydrogensiloxane as the component (B) is linear, these Si-H groups are located in both of the molecular chain terminal and the intermediate part, or in both of them. May be. The use of polyorganohydrogensiloxane having Si-H groups at both ends of the molecular chain is preferred in that the viscosity of the composition before curing can be lowered and the hardness of the cured product can be adjusted appropriately. Moreover, 2-1,000 are preferable and, as for the number (polymerization degree) of the silicon atom in 1 molecule of (B) component, 3-100 are more preferable.

  When polyorganosiloxane AA is used as component (A), the number of hydrogen atoms in one molecule of polyorganohydrogensiloxane as component (B) is preferably 1 or more, more preferably 2 or more. And as for the number (polymerization degree) of the silicon atom in 1 molecule of (B) component, 2-30 are preferable, More preferably, it is 3-15.

Whether the polyorganosiloxane AA is used as the component (A) or other alkenyl group-containing polyorganosiloxane is used, the component (B) has an average composition formula: R ⁷ _p H _q SiO _{(4- p-q) / 2} (wherein R ⁷ is an unsubstituted or substituted monovalent hydrocarbon group having 1 to 14 carbon atoms, more preferably 1 to 10 carbon atoms, excluding an alkenyl group. p and q Is 0.7 ≦ p ≦ 2.1, 0.001 ≦ q ≦ 1.0, and 0.8 ≦ p + q ≦ 3.0, more preferably 1.0 ≦ p + q ≦ 2.5. It is preferable to use a polyorganohydrogensiloxane represented by the following formula:

Examples of R ⁷ include a methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, t-butyl group, pentyl group, neopentyl group, hexyl group, cyclohexyl group, octyl group, nonyl group, and decyl group. Alkyl groups such as phenyl groups, aryl groups such as tolyl groups, xylyl groups, naphthyl groups; aralkyl groups such as benzyl groups, phenylethyl groups, phenylpropyl groups; some or all of the hydrogen atoms in these hydrocarbon groups Examples include groups substituted with a halogen atom, such as chloromethyl group, 3-chloropropyl group, bromoethyl group, 3,3,3-trifluoropropyl group. R ⁷ is preferably an alkyl group or an aryl group, more preferably a methyl group or a phenyl group.

  Specific examples of the component (B) include molecular chain both ends trimethylsiloxy group-blocked methylhydrogenpolysiloxane, molecular chain both ends trimethylsiloxy group-blocked dimethylsiloxane / methylhydrogensiloxane copolymer, molecular chain both ends trimethylsiloxy group. Blocked dimethylsiloxane / methylhydrogensiloxane / methylphenylsiloxane copolymer, dimethylhydrogensiloxy group-blocked dimethylpolysiloxane at both ends of the molecular chain, dimethylhydrogensiloxy group-blocked dimethylsiloxane / methylhydrogensiloxane copolymer at both ends of the molecular chain , Dimethylhydrogensiloxy group-blocked dimethylhydrogensiloxy copolymer with both ends of molecular chain, dimethylhydrogensiloxy group-blocked methylphenyl poly with molecular chain at both ends Rokisan, both molecular terminals with dimethylhydrogensiloxy groups at diphenyl polysiloxane and the like.

Moreover, the copolymer which has a siloxane unit shown below as (B) component can also be illustrated.
That is,
A siloxane unit represented by the formula: R ⁵ ₃ SiO _1/2 (R ⁵ is as described above), a siloxane unit represented by the formula: R ⁵ ₂ HSiO _1/2 , and a formula: SiO _4/2 A copolymer comprising siloxane units represented by:
A copolymer comprising a siloxane unit represented by the formula: R ⁵ ₂ HSiO _1/2 and a siloxane unit represented by the formula: SiO _4/2 ;
Copolymer comprising a siloxane unit represented by the formula: R ⁵ HSiO _2/2 and a siloxane unit represented by the formula: R ⁵ SiO _3/2 or a siloxane unit represented by the formula: HSiO _3/2 Is mentioned.
These polymers or copolymers can be used alone or in combination of two or more.

In particular, when polyorganosiloxane AA is used as component (A), from the viewpoint of compatibility with component (A), polyorganohydrogensiloxane having T ^Ph units or D ^Ph2 units is used as component (B). It is preferable to include. The D ^Ph2 unit is a bifunctional siloxane unit represented by the formula: (C ₆ H ₅ ) ₂ SiO _2/2 .

  The blending amount of the polyorganohydrogensiloxane as the component (B) is the effective curing amount of the component (A). When the alkenyl group-containing polyorganosiloxane other than the polyorganosiloxane AA is used as the component (A), , (B) component has 0.1 to 4.0 Si-H groups per alkenyl group (for example, vinyl group) in component (A), more preferably 1.0 to 3.0. It mix | blends so that it may become. If it is less than 0.1, the curing reaction does not proceed, and it may be difficult to obtain a cured product. If it exceeds 4.0, a large amount of unreacted Si—H groups remain in the cured product. Therefore, the physical properties of the cured product may change over time.

  In addition, when polyorganosiloxane AA is used as the component (A), the amount of the component (B) is such that the Si-H group of the component (B) is an alkenyl group (for example, vinyl group) in the component (A). The amount is 0.5 to 2.5, more preferably 0.7 to 2.0. If the number is less than 0.5, the curing reaction does not proceed and it may be difficult to obtain a cured product. If the number exceeds 2.5, a large amount of unreacted Si-H groups remain in the cured product. Therefore, the physical properties of the cured product may change over time.

<(C) component>
The platinum-based catalyst that is the component (C) is a catalyst that promotes the addition reaction (hydrosilylation reaction) between the alkenyl group in the component (A) and the Si—H group in the component (B). As the component (C), for example, chloroplatinic acid, an alcohol solution of chloroplatinic acid, a platinum complex having an olefin, a vinyl group-containing siloxane, or an acetylene compound as a ligand can be used.

  The amount of component (C) is not particularly limited as long as it is an amount effective as a catalyst for the hydrosilylation reaction, but it is 0. 0 in terms of platinum with respect to the total amount of component (A) and component (B). 1 to 1,000 ppm, more preferably 1 to 500 ppm, and still more preferably 1 to 20 ppm. When the blending amount is within this range, the addition reaction is promoted, so that sufficient curing can be obtained and it is economically advantageous.

<(D) component>
(D) A component is a component which provides adhesiveness to the polyorganosiloxane composition of embodiment of this invention. Component (D) contains the above-described adhesion-imparting agent, that is, (a) at least one siloxane unit selected from T1 ^ep unit, D1 ^ep unit, and M1 ^ep unit, and (b) D1 ^vi unit. Polyorganosiloxanes having Mw of 1000 to 15000 are used.

  (D) The compounding quantity of a component shall be 0.05-10 mass parts with respect to 100 mass parts of said (A) component. Even if there is too much compounding quantity of (D) component, there exists a possibility of not contributing to the improvement of adhesiveness. (D) The more preferable compounding quantity of a component is 0.1-5 mass parts.

  In addition to the components (A), (B), (C), and (D) described above, known additives can be blended in the composition of the embodiment of the present invention as necessary. For example, reinforcing fillers such as fumed silica, non-reinforcing fillers such as calcium carbonate, calcium silicate, titanium dioxide, ferric oxide, carbon black, zinc oxide, wavelength adjusting agents, and the like. It can mix | blend suitably in the range which is not impaired. When used as a sealing material for an LED device, blending of fumed silica, a wavelength adjusting agent or the like is preferable.

  Moreover, when using polyorganosiloxane AA as (A) component, (E) the isocyanurate compound which has an alkoxy group can be mix | blended. (E) As an isocyanurate compound having an alkoxy group, for example, an isocyanuric acid derivative having one or more alkoxysilyl groups represented by [Chemical Formula 1] to [Chemical Formula 4] can be exemplified. These isocyanuric acid derivatives may be used alone or in combination of two or more.

  These isocyanuric acid derivatives can be produced by hydrosilylating 1,3,5-triallyl isocyanurate and alkyl dialkoxysilane in the presence of a platinum catalyst.

  (E) As for the compounding quantity of a component, 0.05-5 mass parts is preferable with respect to 100 mass parts of (A) component, and 0.1-3 mass parts is more preferable. (E) By mix | blending a component, adhesiveness with PPA etc. of hardened | cured material can further be improved.

  The adhesive polyorganosiloxane composition of the embodiment is prepared by uniformly mixing the above-described components, but the curability can be arbitrarily adjusted by adding a reaction inhibitor. Curing reaction inhibitors include acetylene alcohols such as 3-methyl-1-butyn-3-ol, 2-phenyl-3-butyn-2-ol, and maleic acid derivatives such as diallyl maleate. . By using such a reaction inhibitor, it can be used as one liquid.

Moreover, it can also be divided and stored in two liquids so that curing does not proceed, and the two liquids can be mixed and cured during use. In the case of the two-component mixing type, it is necessary to avoid using the same envelope for the polyorganohydrogensiloxane (B) component and the platinum catalyst (C) component because of the risk of dehydrogenation reaction. .
The viscosity of the adhesive polyorganosiloxane composition of the embodiment thus obtained is preferably in the range of 100 to 50,000 mPa · s, particularly 300 to 10,000 mPa · s, as measured by a rotational viscometer at 25 ° C. The range of is preferable.

  The composition of the embodiment is cured by heating as necessary. The curing conditions are not particularly limited, but are usually cured at 40 to 200 ° C., preferably 60 to 170 ° C. for 1 minute to 10 hours, preferably about 30 minutes to 6 hours.

  The cured product has sufficient rubber hardness, and has good adhesion to noble metals such as Ag and Au and heat resistant plastics such as PPA. Further, the adhesiveness does not deteriorate due to heat generated from the light emitting element, heating during a temperature cycle, or the like. Therefore, for example, it is suitable as a sealing material for light emitting elements and a material for functional lenses in LED devices. An LED device in which a sealing layer is formed of a cured product of such a polyorganosiloxane composition has good adhesion between the sealing layer and a base material such as PPA and does not easily peel off at the interface. Is excellent.

EXAMPLES Hereinafter, although an Example is given and this invention is demonstrated concretely, this invention is not limited to these Examples.
In the following description, M unit, M ^vi unit, ^MH unit, D unit, D ^Vi unit, ^DH unit, D ^Ph2 unit, T unit, T ^Ph unit and Q unit are each represented by the following formulae. Represents a siloxane unit. The methyl group may be represented by Me, the phenyl group by Ph, and the vinyl group by Vi.
M unit ………… (CH ₃ ) ₃ SiO _1/2
M ^vi unit ………… (CH ₃ ) ₂ (CH ₂ ═CH) SiO _1/2
^MH unit ………… (CH ₃ ) ₂ HSiO _1/2
D unit ………… (CH ₃ ) ₂ SiO _2/2
D ^Vi unit ………… (CH ₃ ) (CH ₂ ═CH) SiO _2/2
^DH unit ………… (CH ₃ ) HSiO _2/2
D ^Ph2 unit ………… (C ₆ H ₅ ) ₂ SiO _2/2
T unit ............ _CH 3 SiO _3/2
T ^Ph unit ………… C ₆ H ₅ SiO _3/2
Q unit ………… SiO _4/2
Further, the viscosity is a value at 25 ° C. unless otherwise specified.

[Preparation of adhesiveness-imparting agent]
First, adhesion imparting agents (D1) to (D6) were respectively prepared as shown below.

(Synthesis Example 1)
In a 2-liter reaction vessel, 185.9 g (0.788 mol) of γ-glycidoxypropyltrimethoxysilane, 347.1 g (2.888 mol) of dimethyldimethoxysilane, and 178.5 g (1 of methyltrimethoxysilane) 313 mol), 34.7 g (0.263 mol) of methylvinyldimethoxysilane, and 105 g of toluene, 1.02 g of 6N sodium hydroxide (NaOH) aqueous solution and ion-exchanged water (ion added at this stage) The exchange water is indicated as ion exchange water (1).) 53 g was added and stirred.

  When the mixture in the reaction vessel was heated until the liquid temperature reached 30 ° C., the four kinds of silane compounds (γ-glycidoxypropyltrimethoxysilane, dimethyldimethoxysilane, methyltrimethoxysilane, and The partial hydrolysis reaction of the methoxy group of (methylvinyldimethoxysilane) started and exotherm started. Even after the heating was stopped, the exotherm continued, and the reaction mixture became transparent and heated to 50 ° C. When the temperature began to decrease while continuing stirring, 60 g of ion-exchanged water (the ion-exchanged water added at this stage is indicated as ion-exchanged water (2)) was added, and the partial hydrolysis reaction was further continued. . After the addition of ion-exchanged water (2), the reaction mixture immediately became transparent and uniform, and heat generation started, and the temperature was raised to 60 ° C. Thereafter, the inside of the reaction vessel was heated to a reflux temperature (66 ° C.) using an oil bath. The heated reflux state was continued for 1 hour and then cooled to room temperature.

  Next, 500 g of toluene was added to the obtained reaction mixture, and the mixture was heated again to the reflux temperature to distill away methanol as a reaction product together with toluene. When the distillation of methanol was completed and a reflux state was reached at the boiling point of toluene, the solution was cooled to room temperature.

  To the reaction mixture thus obtained, 0.72 g of glacial acetic acid was added and stirred for 1 hour to neutralize the previously added sodium hydroxide. Thereafter, while heating to the reflux temperature again using an oil bath, nitrogen was passed through the reaction vessel, the solvent was removed under reduced pressure of 80 ° C./25 mmHg, and concentration was performed until no distillate was produced. Next, after cooling the liquid in the reaction vessel, filtration was performed using Celite (trade name, manufactured by World Minerals Inc., USA) to obtain an adhesion-imparting agent (D1).

(Synthesis Examples 2-3)
The same amounts of γ-glycidoxypropyltrimethoxysilane, dimethyldimethoxysilane, methyltrimethoxysilane, methylvinyldimethoxysilane, and toluene as in Synthesis Example 1 were charged in a reaction vessel, respectively. Then, the same operations as in Synthesis Example 1 were performed except that ion exchange water (1) and ion exchange water (2) having the masses shown in Table 1 were added to change the degree of partial hydrolysis and condensation reaction, thereby providing adhesion. Agents (D2) to (D3) were obtained.

(Synthesis Example 4)
γ-glycidoxypropyltrimethoxysilane 212.5 g (0.900 mol), dimethyldimethoxysilane 577.0 g (4.800 mol), methylvinyldimethoxysilane 39.7 g (0.300 mol) and toluene 105 g Were each charged into a reaction vessel, and the same operation as in Synthesis Example 1 was performed to obtain an adhesion-imparting agent (D4). In addition, also in this synthesis example 4, like the synthesis examples 2-3, the extent of partial hydrolysis and condensation reaction by adding the mass of ion exchange water (1) and ion exchange water (2) shown in Table 1 Was changed from Synthesis Example 1.

(Synthesis Example 5)
The same amounts of γ-glycidoxypropyltrimethoxysilane, dimethyldimethoxysilane, methyltrimethoxysilane, methylvinyldimethoxysilane, and toluene as in Synthesis Example 1 were charged in a reaction vessel, respectively. Then, the same operations as in Synthesis Example 1 were performed except that ion exchange water (1) and ion exchange water (2) having the masses shown in Table 1 were added to change the degree of partial hydrolysis and condensation reaction, thereby providing adhesion. Agent (D5) was obtained.

(Synthesis Example 6)
In a 2 liter reaction vessel, 124.0 g (0.525 mol) of γ-glycidoxypropyltrimethoxysilane, 119.0 g (0.875 mol) of methyltrimethoxysilane, and 256.6 g of diphenyldimethoxysilane (1 0.050 mol), 105.2 g (0.875 mol) of dimethyldimethoxysilane, 23.1 g (0.175 mol) of methylvinyldimethoxysilane, and 105 g of toluene, respectively. And operation similar to the synthesis example 1 was performed, and the adhesiveness imparting agent (D6) was obtained.

Next, the copolymerization composition ratios of the adhesion-imparting agents (D1) to (D6) obtained in Synthesis Examples 1 to 6, respectively, were determined using ¹ H-NMR (manufactured by BURKER, apparatus name: ARX) using deuterated chloroform as a solvent. -400).

で表される３官能型シロキサン単位（以下、Ｔ^ｅｐ単位と示す。）と、Ｔ単位と、Ｄ単位と、Ｄ^ｖｉ単位、およびメトキシ基（以下、ＯＭｅと示す。）をそれぞれ有し、各単位およびメトキシ基のモル存在比（ｔ1：ｔ2：ｄ1：ｄ2：ｅ）は、それぞれ表１に示す通りであることがわかった。 As a result of the measurement, the adhesion-imparting agents (D1) to (D3) and (D5)
Formula: RSiO _3/2
(In the formula, R is a γ-glycidoxypropyl group represented by the following chemical formula.)

Each having a trifunctional siloxane unit represented by the following (hereinafter referred to as T ^ep unit), T unit, D unit, D ^vi unit, and methoxy group (hereinafter referred to as OMe). The molar abundance ratios of units and methoxy groups (t1: t2: d1: d2: e) were found to be as shown in Table 1, respectively.

The adhesion-imparting agent (D4) does not contain the T unit, has a T ^ep unit, a D unit, a D ^vi unit, and a methoxy group (OMe). T1, d1, d2 and e in the ratio (t1: d1: d2: e) were as shown in Table 1, respectively.
Furthermore, the adhesion-imparting agent (D6) has a T ^ep unit, a T unit, a D unit, a D ^vi unit, a D ^Ph unit, and a methoxy group (OMe). As shown in Table 1, the molar abundance ratio (t1: t2: d1: d2: d3: e) was 15: 25: 25: 5: 30: 15.

  Furthermore, the weight-average molecular weight (Mw), number-average molecular weight (Mn), dispersity (Mw / Mn), non-volatile content (mass%), viscosity (mPa) of the obtained adhesion-imparting agents (D1) to (D6). S), epoxy equivalent (g / eq), epoxy group content (mmol / g), yield and yield were measured respectively. These measured values are shown in Table 1 together with the amount of starting material used.

Mw and Mn are measured by using a gel permeation chromatography (GPC) apparatus (manufactured by Tosoh Corporation, apparatus name: HLC-8220 GPC) using THF (tetrahydrofuran) as a solvent, and are values converted to polystyrene. The dispersity is a numerical value representing the molecular weight distribution, and is obtained by weight average molecular weight (Mw) / number average molecular weight (Mn). The closer the degree of dispersion is to 1, the narrower the molecular weight distribution. The nonvolatile content (% by mass) is a value measured under heating conditions of 150 ° C. × 1 hour, and the viscosity is a measured value at 25 ° C. Furthermore, the yield was calculated by the following formula.
Yield (%) = Yield (g) / Theoretical hydrolysis substance amount (g) × 100
However, the theoretical hydrolyzed substance amount (g) is the sum of the hydrolyzed substance quantity (number of moles × hydrolysate molecular weight) of each silane as a starting material.

Example 1
(A1) 70.54 parts by mass (hereinafter simply referred to as “parts”) of linear dimethylpolysiloxane (viscosity 3000 mPa · s) blocked at both ends of the molecular chain with dimethylvinylsiloxy groups;
(A2) Linear dimethylpolysiloxane (viscosity 3000 mPa · s) in which both ends of the molecular chain are blocked with dimethylvinylsiloxy groups, and branched methylpolyester represented by the average unit formula: M ₅ M ^vi Q ₈ 22.95 parts of a 6: 4 (non-volatile) mixture with siloxane (Mn = 2760, Mw / Mn = 1.27);
(B1) unit ^{_{formula: M H D H 3 D 7}} M H represented by methylhydrogenpolysiloxane 5.00 parts having silicon-bonded hydrogen atoms in the molecular chain terminal and intermediate portion ((A) component Molar ratio (H / Vi) = 1.65) of SiH group in component (B) to vinyl group in (C), platinum complex solution having tetramethyltetravinylcyclotetrasiloxane as a ligand ( (Pt content 1.8% by mass) 0.015 part, 2-phenyl-3-butyn-2-ol as a reaction inhibitor, both ends of the molecular chain blocked with dimethylvinylsiloxy groups A polyorganosiloxane composition was prepared by mixing 1.5 parts of a siloxane (viscosity 3000 mPa · s) solution (1% by mass) and 3.03 parts of the adhesion-imparting agent (D1) obtained in Synthesis Example 1. .

Examples 2-6, Comparative Examples 1-2
(A1), (A2), and (A3) linear dimethylpolysiloxane (viscosity 10,000 mPa · s) having both ends of the molecular chain blocked with dimethylvinylsiloxy groups, and (A4) molecule used in Example 1 Linear dimethylpolysiloxane (viscosity 10,000 mPa · s) blocked at both chain ends with dimethylvinylsiloxy groups, and branched methylpolysiloxane (average unit formula: M ₅ M ^vi Q ₈ ) ( 4: 6 (nonvolatile content) mixture with Mn = 2760, Mw / Mn = 1.27), (B1) used in Example 1, (B2) unit formula: MD ^H ₁₂ D ₂₈ M Methyl hydrogen polysiloxane having a hydrogen atom bonded to silicon in the middle part of the molecular chain, platinum complex solution having the same (C) tetramethyltetravinylcyclotetrasiloxane as a ligand as in Example 1 (Pt content 1.8% by mass) and a reaction inhibitor were blended in proportions shown in Table 2, respectively. Furthermore, as an adhesion imparting agent, the adhesion imparting agents (D-2) to (D-5) or γ-glycidoxypropyltrimethoxysilane obtained in Synthesis Examples 2 to 5 (epoxy group content 4.51 mmol) / G) was blended in the proportions shown in Table 2 to prepare polyorganosiloxane compositions.

  Thus, the viscosity of the polyorganosiloxane composition obtained in Examples 1 to 6 and Comparative Examples 1 and 2 was measured at 25 ° C. using a rotational viscometer. Moreover, the thermogravimetric analysis (TGA) of the obtained polyorganosiloxane composition was performed as shown below. Further, a package test (1) was performed on the polyorganosiloxane composition to examine the adhesiveness at elevated temperature. The results are shown in the lower column of Table 2.

[TGA measurement]
A sample of the polyorganosiloxane composition was allowed to stand at 150 ° C. for 1 hour, and the weight reduction rate was measured with a TGA apparatus (manufactured by Seiko Instruments Inc., apparatus name: TG / DTA6200).

[Package test (1)]
A sample of the polyorganosiloxane composition was filled in a PPA reflector of a 5050 type LED package (manufactured by Sayo Seiki Co., Ltd.), heated at 80 ° C. for 1 hour, and then heated at 150 ° C. for 5 hours to be cured. Next, after aging for 168 hours in an atmosphere of 85 ° C. and 85% RH, the temperature was raised by heating with the profile shown in FIG. That is, the temperature was raised from 40 ° C. at a rate of 4.7 ° C./second for about 30 seconds, held at 180 ° C. for 1 minute, and further heated at a rate of 4.5 ° C./second for 20 seconds, at 270 ° C. for 10 seconds. Held for 2 seconds. And the temperature which a composition peels from the reflector made from PPA was calculated | required.

From Table 1 and Table 2, the following can be understood.
That is, (a) a T ^ep unit that is a siloxane unit having an epoxy group and (b) a D ^vi unit that is a bifunctional siloxane unit having an alkenyl group, each having an Mw in the range of 1000 to 15000 The polyorganosiloxane compositions of Examples 1 to 6 obtained by blending the property imparting agents (D1) to (D4) with the addition reaction type polyorganosiloxane composition are γ-glycidoxy as an adhesion imparting agent. Compared with the polyorganosiloxane composition of Comparative Examples 1 and 2 in which propyltrimethoxysilane or an adhesion-imparting agent (D-5) having an Mw of 1000 or less was blended, the weight loss rate due to TGA was greatly reduced. It can be seen that almost no volatilization of the adhesion-imparting agent by heating occurred.
And while the sealing layer which consists of the polyorganosiloxane composition of Comparative Examples 1 and 2 has peeled off at the interface with the base material (reflector) made of PPA in the heating step after curing, it was carried out It can be seen that peeling was not observed in the sealing layers made of the polyorganosiloxane compositions of Examples 1 to 6, and good adhesion to PPA was maintained.

  Next, another example in which an alkenyl group-containing polyorganosiloxane containing a trifunctional siloxane unit having an aryl group is used as a base polymer will be described.

[Synthesis of Intermediate Product AA (Silicone Resin Having Methoxy Group)]
To a mixture of (Aa1) dimethyldichlorosilane 129 g (1 mol), (Aa2) diphenyldichlorosilane 253 g (1 mol), and (Aa3) phenyltrichlorosilane 212 g (1 mol), an aqueous methanol solution consisting of 38 g of water and 237 g of methanol was added dropwise. And co-hydrolyzed. After completion of the dropwise addition, the mixture was heated at a reflux temperature of 60 to 70 ° C. for 30 minutes to complete the cohydrolysis reaction. Thereafter, the reaction mixture was cooled, 254 g of methanol was added and stirred for 15 minutes, and then allowed to stand for 30 minutes for liquid separation. A mixed solution of hydrochloric acid and methanol was separated into the upper layer, and a reaction product was separated into the lower layer.

Next, 254 g of methanol was added to the reaction product in the lower layer and distilled by heating, and the hydrochloric acid content in the reaction product was distilled off together with methanol. Thus, the average unit formula: (Me ₂ SiO _2/2 ) ₃₀ (Me ₂ SiO _1/2 OMe) ₄ (Ph ₂ SiO _2/2 ) ₃₀ (Ph ₂ SiO _1/2 OMe) ₃ (PhSiO _3/2 ) Silicone resin AA having a methoxy group represented by ₂₇ {PhSiO _1/2 (OMe) ₂ } ₃ (PhSiO _2/2 OMe) ₃ was obtained.

In the average unit formula representing the silicone resin AA, (aa1) unit: (Me ₂ SiO _2/2 ) ₃₀ (Me ₂ SiO _1/2 OMe) ₄ is formed from the starting material (Aa1), and (aa2) unit: (Ph ₂ SiO _2/2 ) ₃₀ (Ph ₂ SiO _1/2 OMe) ₃ is produced from the starting material (Aa2), and (aa3) unit: (PhSiO _3/2 ) ₂₇ {PhSiO _1/2 (OMe) ₂ } ₃ (PhSiO _2/2 OMe) ₃ is produced from the starting material (Aa3). The molar ratio of each unit is (aa1) :( aa2) :( aa3) = 34: 33: 33≈1: 1: 1.

[Synthesis of Intermediate Product BB (Silicone Resin Having Methoxy Group)]
To a mixture of (Aa1) dimethyldichlorosilane 129 g (1 mol), (Aa2) diphenyldichlorosilane 253 g (1 mol), (Aa3) phenyltrichlorosilane 635 g (3 mol), an aqueous methanol solution consisting of 53 g of water and 330 g of methanol was added dropwise. And co-hydrolyzed. After completion of the dropwise addition, the mixture was heated at a reflux temperature of 60 to 70 ° C. for 30 minutes to complete the cohydrolysis reaction. Thereafter, the reaction mixture was cooled, 254 g of methanol was added and stirred for 15 minutes, and then allowed to stand for 30 minutes for liquid separation. A mixed solution of hydrochloric acid and methanol was separated into the upper layer, and a reaction product was separated into the lower layer.

Next, 435 g of methanol was added to the lower layer reaction product, followed by distillation by heating, and the hydrochloric acid content in the reaction product was distilled off together with methanol. Thus, the average unit formula: (Me ₂ SiO _2/2 ) ₁₇ (Me ₂ SiO _1/2 OMe) ₃ (Ph ₂ SiO _2/2 ) ₁₆ (Ph ₂ SiO _1/2 OMe) ₄ (PhSiO _3/2 ) A silicone resin BB having a methoxy group represented by ₅₄ {PhSiO _1/2 (OMe) ₂ } ₃ (PhSiO _2/2 OMe) ₃ was obtained.

In the average unit formula representing the silicone resin BB, (aa1) unit: (Me ₂ SiO _2/2 ) ₁₇ (Me ₂ SiO _1/2 OMe) ₃ is formed from the starting material (Aa1), and (aa2) unit: (Ph ₂ SiO _2/2 ) ₁₆ (Ph ₂ SiO _1/2 OMe) ₄ is produced from the starting material (Aa2), and (aa3) unit: (PhSiO _3/2 ) ₅₄ {PhSiO _1/2 (OMe) ₂ } ₃ (PhSiO _2/2 OMe) ₃ is produced from the starting material (Aa3). The molar ratio of each unit is (aa1) :( aa2) :( aa3) = 20: 20: 60 = 1: 1: 3.

[Synthesis of Intermediate Product CC (Polymethylsiloxane Having Vinyl Groups at Terminal and Side Chains)]
In a 5-liter reaction vessel, 339.0 g (1.14 mol) of octamethylcyclotetrasiloxane, 1.6 g (0.0086 mol) of divinyltetramethyldisiloxane, and 57.7 g of tetramethyltetravinylcyclotetrasiloxane ( 0.17 mol) was added, and 0.02 g of potassium hydroxide corresponding to 50 ppm of the total mass (400 g) was added and stirred. And it heated at 130 degreeC, stirring, and performed ring-opening polymerization for 6 hours.

  After the ring-opening polymerization was completed, the mixture was sufficiently cooled, and 1 g of trimethylsilyl chloride was added and stirred sufficiently to deactivate potassium hydroxide. The intermediate product CC was thus obtained. Next, xylene is added to dilute the resin component concentration of the intermediate product CC to 60% or less, and then a solution obtained by dissolving 5 g of NaCl in 20 g of water (hereinafter referred to as a water / NaCl solution) is added to the diluted solution and heated. And deoxidation was performed. When the mixed solution of the xylene solution of the intermediate product CC and the water / NaCl solution reached 60 ° C. or higher, stirring was stopped and liquid separation was performed. After the xylene solution of the intermediate product CC in the upper layer was fractionated, a 20 g / 20 g / 5 g solution of water / methanol / NaCl was added to the fractionated solution and heated for washing. In this operation, the volatile low-molecular siloxane having 20 or less D units contained in the xylene solution of the intermediate product CC was extracted and removed.

  When the mixed solution of the xylene solution of the intermediate product CC and the water / methanol / NaCl solution reached 60 ° C. or higher, stirring was stopped and liquid separation was performed, and the xylene solution of the intermediate product CC in the upper layer was collected. The xylene solution of the separated intermediate product CC contains a small amount of methanol and water together with a volatile low-molecular siloxane having a D unit number of 20 or less, and a 20 g / 5 g solution of water / NaCl is further added. Then, heat washing was performed. When the mixed solution reached 60 ° C. or higher, stirring was stopped and liquid separation was performed. After the xylene solution of the intermediate product CC in the upper layer was collected, the collected solution was heated to reflux for dehydration. Subsequently, after cooling, it filtered and desolvated by heating under reduced pressure. In this way, polymethylsiloxane having vinyl groups at the terminals and side chains, which was an intermediate product CC, was obtained.

Thus the obtained intermediate product CC, the number of moles of each unit calculated from the charged amount, D units 4.58 ((339.0 / 296) × 4), M vi units are 0.017 ((1 .6 / 186) × 2) and D ^Vi unit is 0.671 ((57.7 / 344) × 4), and the molar ratio is D unit: M ^vi unit: D ^Vi unit = 539: 2: 79. It becomes.
Therefore, it can be seen that the obtained intermediate product CC is a polymethylsiloxane having a vinyl group at the terminal and side chain, represented by the average unit formula: M ^vi D ₅₃₉ D ^Vi ₇₉ M ^vi .

Synthesis Example 7 [Synthesis of Silicone Resin A-1]
(First step)
200 g of xylene was added to 200 g of the intermediate product AA (silicone resin having a methoxy group), diluted, and 0.6 g of an aqueous cesium hydroxide solution of 50% by mass (shown as 50%, the same applies hereinafter) and 50 g of water. And heated to hydrolyze. In the infrared absorption spectrum measurement, the reaction was continued until characteristic absorption derived from a methoxy group having a wave number of 2830 cm ⁻¹ disappeared.
Thus, a cerium hydroxide-containing xylene of a silicone resin polymer having no methoxy group, represented by the average unit formula: (Me ₂ SiO _2/2 ) ₃₄ (Ph ₂ SiO _2/2 ) ₃₃ (PhSiO _3/2 ) ₃₃ A solution was obtained.

(Second step)
To 85 g of the resin content of the reaction product obtained in the first step, 10 g of polymethylsiloxane (Vi amount 1.73 mmol / g) having vinyl groups at both ends and side chains, which is an intermediate product CC, and cyclic polymethyl 5 g of vinyl siloxane (MeViSiO _2/2 ) ₄ (Vi amount: 11.6 mmol / g) was added, and the mixture was reacted at xylene reflux temperature for 5 hours to perform graft polymerization and equilibration. After cooling, 0.3 g of trimethylchlorosilane was added for neutralization, and then the xylene solution was washed with water, and the water layer was removed by a liquid separation operation (water washing operation). The water washing operation was repeated, and after the aqueous layer became neutral, water remaining in the xylene layer was removed by azeotropic distillation with xylene. The xylene layer thus dehydrated was filtered, and then xylene was distilled off under reduced pressure to obtain silicone resin A-1.

This silicone resin A-1 is converted into a charge base and is represented by an average unit formula: (Me ₂ SiO _2/2 ) ₃₄ (Ph ₂ SiO _2/2 ) ₃₃ (PhSiO _3/2 ) ₃₃ Siloxane G, polymethylsiloxane H having vinyl groups at both ends and side chains represented by the formula: M ^vi D ₅₃₉ D ^Vi ₇₉ M ^vi , and organosiloxane represented by the formula: (MeViSiO _2/2 ) ₄ It is obtained by reacting I with a mass ratio (%) of G: H: I = 85: 10: 5.

  In the second step, polymethylsiloxane having vinyl groups at both ends and side chains and cyclic methylvinylsiloxane are split, and graft polymerization is performed on the reaction product obtained in the first step, whereby silicone resin A- 1 has been obtained.

The copolymer composition ratio of the obtained silicone resin A-1 was measured using ¹ H-NMR (manufactured by BRUKER, apparatus name: ARX-400) using deuterated chloroform as a solvent. As a result of the measurement, it was found that the silicone resin A-1 is represented by an average composition formula: T ^Ph _25.42 D ^Ph2 _25.42 D _40.07 D ^Vi _9.04 M ^Vi _0.05 .

  The viscosity of the obtained silicone resin A-1 was 140 Pa · s, and the nonvolatile content measured by heating at 150 ° C. for 1 hour was 99.1% by mass (hereinafter simply referred to as “%”. The heating weight loss rate was 1.0%. Mw was 2240, and the dispersity (Mw / Mn) was 2.018. The number of vinyl groups in one molecule of this silicone resin A-1 is 1.7 on average from the value of Mw.

Synthesis Example 8 [Synthesis of Silicone Resin A-2]
(First step)
300 g of xylene was added to 300 g of the intermediate product AA (silicone resin having a methoxy group) for dilution, and 0.7 g of a 50% cesium hydroxide aqueous solution and 200 g of water were added thereto, followed by heating for hydrolysis. In the infrared absorption spectrum measurement, the reaction was continued until characteristic absorption derived from a methoxy group having a wave number of 2830 cm ⁻¹ disappeared.

(Second step)
85 g of the resin product of the reaction product obtained in the first step, 5 g of polymethylsiloxane (Vi amount 1.73 mmol / g) having vinyl groups at both ends and side chains, which are the intermediate product CC, and cyclic polymethyl Graft polymerization and equilibration were performed by adding 10 g of vinylsiloxane (MeViSiO _2/2 ) ₄ (Vi amount 11.6 mmol / g) and reacting at xylene reflux temperature for 5 hours. After cooling, 0.5 g of trimethylchlorosilane was added for neutralization, and then the xylene solution was washed with water, and the water layer was removed by a liquid separation operation (water washing operation). The water washing operation was repeated, and after the aqueous layer became neutral, water remaining in the xylene layer was removed by azeotropic distillation with xylene. The xylene layer thus dehydrated was filtered, and then xylene was distilled off under reduced pressure to obtain silicone resin A-2.

This silicone resin A-2 is converted to a charge base, and is represented by an average unit formula: (Me ₂ SiO _2/2 ) ₃₄ (Ph ₂ SiO _2/2 ) ₃₃ (PhSiO _3/2 ) ₃₃ Siloxane G, polymethylsiloxane H having vinyl groups at both ends and side chains represented by the formula: M ^vi D ₅₃₉ D ^Vi ₇₉ M ^vi , and organosiloxane represented by the formula: (MeViSiO _2/2 ) ₄ It is obtained by reacting I with a mass ratio (%) of G: H: I = 85: 5: 10.

  In the second step, polymethylsiloxane, which is an intermediate product BB having vinyl groups at both ends and side chains, and cyclic methylvinylsiloxane split, and graft polymerization is performed on the reaction product obtained in the first step. Thus, silicone resin A-2 was obtained.

As a result of measuring the copolymer composition ratio of the obtained silicone resin A-2 in the same manner as in Synthesis Example 7, the silicone resin A-2 has an average composition formula: T ^Ph _25.67 D ^Ph2 _25.67 D _33.45 D It was found to be represented by ^Vi _15.18 M ^Vi _0.03 .

  The viscosity of the obtained silicone resin A-2 was 259 Pa · s, the nonvolatile content measured by heating at 150 ° C. for 1 hour was 99.6%, Mw was 2970, and the dispersity (Mw / Mn) was 2.244. there were. The number of vinyl groups in one molecule of the silicone resin A-2 is 3.7 on average from Mw.

Synthesis Example 9 [Synthesis of Silicone Resin A-3]
(First step)
200 g of xylene was added to 200 g of the intermediate product BB to dilute, and 0.6 g of 50% aqueous cesium hydroxide solution and 50 g of water were added thereto, followed by heating for hydrolysis. In the infrared absorption spectrum measurement, the reaction was continued until characteristic absorption derived from a methoxy group having a wave number of 2830 cm ⁻¹ disappeared.
Thus, a cerium hydroxide-containing xylene of a silicone resin polymer having no methoxy group represented by the average unit formula: (Me ₂ SiO _2/2 ) ₂₀ (Ph ₂ SiO _2/2 ) ₂₀ (PhSiO _3/2 ) ₆₀ A solution was obtained.

(Second step)
85 g of the resin product of the reaction product obtained in the first step, 5 g of polymethylsiloxane (Vi amount 1.73 mmol / g) having vinyl groups at both ends and side chains, which are the intermediate product CC, and cyclic polymethyl Graft polymerization and equilibration were performed by adding 10 g of vinylsiloxane (MeViSiO _2/2 ) ₄ (Vi amount 11.6 mmol / g) and reacting at xylene reflux temperature for 5 hours. After cooling, 0.3 g of trimethylchlorosilane was added for neutralization, and then the xylene solution was washed with water, and the water layer was removed by a liquid separation operation (water washing operation). The water washing operation was repeated, and after the aqueous layer became neutral, water remaining in the xylene layer was removed by azeotropic distillation with xylene. After the xylene layer thus dehydrated was filtered, xylene was distilled off under reduced pressure to obtain silicone resin A-3.

This silicone resin A-3 is an organo represented by the average unit formula: (Me ₂ SiO _2/2 ) ₂₀ (Ph ₂ SiO _2/2 ) ₂₀ (PhSiO _3/2 ) ₆₀ in terms of the amount charged. Siloxane G, polymethylsiloxane H having vinyl groups at both ends and side chains represented by the formula: M ^vi D ₅₃₉ D ^Vi ₇₉ M ^vi , and organosiloxane represented by the formula: (MeViSiO _2/2 ) ₄ It is obtained by reacting I with a mass ratio (%) of G: H: I = 85: 5: 10.

  In the second step, polymethylsiloxane having vinyl groups at both ends and side chains and cyclic methylvinylsiloxane are split, and graft polymerization is performed on the reaction product obtained in the first step, whereby silicone resin A- 3 is obtained.

As a result of measuring the copolymer composition ratio of the obtained silicone resin A-3 in the same manner as in Synthesis Example 7, the silicone resin A-3 has an average composition formula: T ^Ph _46.77 D ^Ph2 _15.59 D _22.54 D It was found to be represented by ^Vi _15.07 M ^Vi _0.03 .

  The obtained silicone resin A-3 was solid at room temperature, the non-volatile content measured by heating at 150 ° C. for 1 hour was 99.8%, Mw was 2458, and the dispersity (Mw / Mn) was 1.940. there were. The number of vinyl groups in one molecule of the silicone resin A-3 is 3.1 on average from Mw.

Synthesis Example 10 [Synthesis of Silicone Resin A-4]
(First step)
200 g of xylene was added to 200 g of the intermediate product BB for dilution, and 0.6 g of 50% cesium hydroxide aqueous solution and 50 g of water were added thereto, followed by heating for hydrolysis. In the infrared absorption spectrum measurement, the reaction was continued until characteristic absorption derived from a methoxy group having a wave number of 2830 cm ⁻¹ disappeared.
Thus, a cerium hydroxide-containing xylene solution of a silicone resin polymer having no methoxy group represented by the average unit formula: (Me ₂ SiO _2/2 ) ₂₀ (Ph ₂ SiO _2/2 ) ₂₀ (PhSiO _3/2 ) ₆₀ Got.

(Second step)
14.5 g of polymethylsiloxane (Vi amount 1.73 mmol / g) having vinyl groups at both ends and side chains as the intermediate product CC is added to 76.5 g of the resin content of the reaction product obtained in the first step. And 9 g of cyclic polymethylvinylsiloxane (MeViSiO _2/2 ) ₄ (Vi amount: 11.6 mmol / g) were added and reacted at xylene reflux temperature for 5 hours for graft polymerization and equilibration. After cooling, 0.3 g of trimethylchlorosilane was added for neutralization, and then the xylene solution was washed with water, and the water layer was removed by a liquid separation operation (water washing operation). The water washing operation was repeated, and after the aqueous layer became neutral, water remaining in the xylene layer was removed by azeotropic distillation with xylene. The xylene layer thus dehydrated was filtered, and then xylene was distilled off under reduced pressure to obtain silicone resin A-4.

This silicone resin A-4 is converted to a charge base and is represented by an average unit formula: (Me ₂ SiO _2/2 ) ₂₀ (Ph ₂ SiO _2/2 ) ₂₀ (PhSiO _3/2 ) ₆₀ Siloxane G, polymethylsiloxane H having vinyl groups at both ends and side chains represented by the formula: M ^vi D ₅₃₉ D ^Vi ₇₉ M ^vi , and organosiloxane represented by the formula: (MeViSiO _2/2 ) ₄ It is obtained by reacting I with a mass ratio (%) of G: H: I = 76.5: 14.5: 9.

  In the second step, polymethylsiloxane having a vinyl group at both ends and side chains, which is an intermediate product CC, and cyclic methylvinylsiloxane split, and graft polymerization is performed on the reaction product obtained in the first step. Thus, silicone resin A-4 was obtained.

As a result of measuring the copolymerization composition ratio of the obtained silicone resin A-4 in the same manner as in Synthesis Example 7, the silicone resin A-4 has an average composition formula: T ^Ph _39.71 D ^Ph2 _13.24 D _32.27 D It was found to be represented by ^Vi _14.71 M ^Vi _0.07 .

  The viscosity of the obtained silicone resin A-4 was 30 Pa · s, the non-volatile content measured by heating at 150 ° C. for 1 hour was 99.0%, Mw was 2143, and the dispersity (Mw / Mn) was 1. 710. The number of vinyl groups in one molecule of the silicone resin A-4 is 2.8 on average from Mw.

Synthesis Example 11 [Synthesis of Silicone Resin A-5]
(First step)
200 g of xylene was added to 200 g of the intermediate product BB to dilute, and 0.6 g of 50% aqueous cesium hydroxide solution and 50 g of water were added thereto, followed by heating for hydrolysis. In the infrared absorption spectrum measurement, the reaction was continued until characteristic absorption derived from a methoxy group having a wave number of 2830 cm ⁻¹ disappeared.
Thus, a cerium hydroxide-containing xylene solution of a silicone resin polymer having no methoxy group represented by the average unit formula: (Me ₂ SiO _2/2 ) ₂₀ (Ph ₂ SiO _2/2 ) ₂₀ (PhSiO _3/2 ) ₆₀ Got.

(Second step)
To 85 g of the resin content of the reaction product obtained in the first step, 10 g of polymethylsiloxane (Vi amount 1.73 mmol / g) having vinyl groups at both ends and side chains, which is an intermediate product CC, and cyclic polymethyl 5 g of vinyl siloxane (MeViSiO _2/2 ) ₄ (Vi amount: 11.6 mmol / g) was added, and the mixture was reacted at xylene reflux temperature for 5 hours to perform graft polymerization and equilibration. After cooling, 0.3 g of trimethylchlorosilane was added for neutralization, and then the xylene solution was washed with water, and the water layer was removed by a liquid separation operation (water washing operation). The water washing operation was repeated, and after the aqueous layer became neutral, water remaining in the xylene layer was removed by azeotropic distillation with xylene. The xylene layer thus dehydrated was filtered, and then xylene was distilled off under reduced pressure to obtain silicone resin A-5.

This silicone resin A-5 is an organo represented by the average unit formula: (Me ₂ SiO _2/2 ) ₂₀ (Ph ₂ SiO _2/2 ) ₂₀ (PhSiO _3/2 ) ₆₀ in terms of the amount charged. Siloxane G, polymethylsiloxane H having vinyl groups at both ends and side chains represented by the formula: M ^vi D ₅₃₉ D ^Vi ₇₉ M ^vi , and organosiloxane represented by the formula: (MeViSiO _2/2 ) ₄ It is obtained by reacting I with a mass ratio (%) of G: H: I = 85: 10: 5.

  In the second step, polymethylsiloxane having vinyl groups at both ends and side chains and cyclic methylvinylsiloxane are split, and graft polymerization is performed on the reaction product obtained in the first step, whereby silicone resin A- 5 is obtained.

As a result of measuring the copolymer composition ratio of the obtained silicone resin A-5 in the same manner as in Synthesis Example 7, the silicone resin A-5 has an average composition formula: T ^Ph _46.32 D ^Ph2 _15.44 D _29.21 D It was found to be represented by ^Vi _8.97 M ^Vi _0.05 .

  The viscosity of the resulting silicone resin A-5 was 291 Pa · s, the non-volatile content measured by heating at 150 ° C. for 1 hour was 99.7%, Mw was 2151, and the dispersity (Mw / Mn) was 1. 717. The number of vinyl groups in one molecule of the silicone resin A-5 is 1.6 on average from Mw.

Synthesis Example 12 [Synthesis of polyorganohydrogensiloxane B3]
A reaction vessel was charged with 402 g (3 mol) of tetramethyldisiloxane, 100 g of concentrated hydrochloric acid, 240 g of ion-exchanged water, and 200 g of ethanol, and cooled to 15 ° C. or lower with stirring. When cooling was completed, 793 g (4 mol) of phenyltrimethoxysilane was added dropwise at a rate of 250 g / hour. Since an exotherm began with the start of hydrolysis, cooling was continued so that the temperature of the reaction mixture did not exceed 15 ° C.

  After completion of the dropwise addition of phenyltrimethoxysilane, hydrolysis was continued for 4 hours, and then diluted by adding 918 g of xylene. After dilution, the mixture was stirred for 1 hour and then allowed to stand for liquid separation. The upper layer is a xylene solution of polyorganohydrogensiloxane. 200 g of ion-exchanged water was added to the separated xylene solution, heated and washed with water, and then allowed to stand to separate again.

  After adding 100 g of methanol and 100 g of ion-exchanged water to the upper layer and performing washing with water again, the mixture was left standing and separated. Subsequently, the upper layer liquid was heated to reflux to remove residual ion-exchanged water and methanol, followed by filtration, and the solvent and concentration were performed under reduced pressure. Finally, the mixture was heated to 150 ° C. while introducing nitrogen, and the solvent and volatile fraction were removed while adjusting the degree of vacuum to a range of 1 to 50 mmHg using a vacuum pump to obtain 785 g of polyorganohydrogensiloxane. B2 was obtained.

From the amount of charged components, the amount of effective hydrogen, and the measurement results of gas chromatography, the obtained polyorganohydrogensiloxane B3 is a polyphenylhydrogensiloxane having a branched structure represented by the formula: ^MH ₆ T ^Ph ₄ I found out.

  Mw of the obtained polyorganohydrogensiloxane B3 was 918, and the measured hydrogen content was 0.668% against the theoretical hydrogen content of 0.654%.

Synthesis Example 13 [Synthesis of (E) alkoxy group-containing isocyanurate]
In the presence of a catalytic amount of Pt catalyst, 64 g of 1,3,5-triallyl isocyanurate (manufactured by Nippon Kasei Co., Ltd., trade name: TAIC) and 34 g of methyldimethoxysilane were subjected to a hydrosilylation reaction for 2 hours. Thus, an isocyanuric acid derivative having one methyldimethoxysilyl group and two vinyl groups represented by [Chemical Formula 6], and an isocyanuric having two methyldimethoxysilyl groups and one vinyl group represented by [Chemical Formula 7]. A mixture with the acid derivative was obtained.

Example 7
Silicone resin A-1 (average composition formula: T ^Ph _25.42 D ^Ph2 _25.42 D _40.07 D ^Vi _9.04 M ^Vi _0.05 represented by Synthesis Example 7) 50 Part of the silicone resin A-2 obtained in Synthesis Example 8 (average composition formula: T ^Ph _25.67 D ^Ph2 _25.67 D _33.45 D ^Vi _15.18 M ^Vi _0.03 In a mixture with 50 parts of (siloxane), 19.1 parts of polyorganohydrogensiloxane B3 represented by the unit formula: ^MH ₆ T ^Ph ₄ obtained in Synthesis Example 12 (based on the vinyl group in component (A)) (B) molar (equivalent) ratio of SiH groups in component (H / Vi) = 1.28), (C) platinum complex solution having tetramethyltetravinylcyclotetrasiloxane as a ligand (Pt content 1. %) 0.02 parts, and the resulting unit formula in Synthesis Example ^1: addition of _{^{T ep 15 T 25 D 55 D}} vi 5 1.1 parts of adhesion promoter D1 of which _(OMe) represented by _15, respectively And kneaded to obtain a polyorganosiloxane composition.

Examples 8-25
Each component shown in Table 3 and Table 4 was blended in the proportions shown in the same table, and a polyorganosiloxane composition was prepared in the same manner as in Example 7.
In Tables 3 and 4, the H / Vi ratio indicates the molar ratio between hydrogen atoms bonded to silicon atoms and vinyl groups bonded to silicon atoms in the components (A) and (B).
Moreover, each component is as follows.
Silicone Resin A-3: The average composition formula obtained in Synthesis Example 9: T ^Ph _46.77 D ^{Ph 2} _15.59 D _22.54 D ^Vi _15.07 M ^Vi _0.03 Siloxane Silicone Resin A-4 ............ Average compositional formula obtained in Synthesis Example 10: T ^Ph _39.71 D ^Ph2 _13.24 D _32.27 D ^Vi _14.71 M ^Vi _0.07 Poly Organosiloxane Silicone Resin A-5 ............ Average composition obtained in Synthesis Example 11: T ^Ph _46.32 D ^Ph2 _15.44 D _29.21 D ^Vi _8.97 M ^Vi _0.05 polyorganosiloxane organohydrogensiloxane B4 ............ unit formula: M ^H D ^Ph2 M diphenyl siloxane adhesion promoter represented by ^H D6 ......... The resulting unit formula in Synthesis Example _{^{6: T ep 15 T 25 D}} Ph 30 D 25 D vi 5 (OMe) 15 with an adhesive imparting agents represented

で表されるＳｉＨ基含有シロキサンオリゴマーと、γ−メタクリロキシプロピルトリメトキシシランとの１：２付加反応生成物である。また、γ−グリシドキシプロピルトリメトキシシランとしては、ＴＳＬ８３５０（モメンティブ社の商品名）を使用した。そして、表５におけるＨ／Ｖｉ比は、（Ａ）成分と（Ｂ）成分における、ケイ素原子に結合した水素原子とケイ素原子に結合したビニル基とのモル比を示す。 Comparative Examples 3-5
The components shown in Table 5 were blended in the proportions shown in the same table, and a polyorganosiloxane composition was obtained in the same manner as in Example 7.
In Table 5, the Si group-containing adhesion promoter is

Is a 1: 2 addition reaction product of a SiH group-containing siloxane oligomer represented by γ-methacryloxypropyltrimethoxysilane. As γ-glycidoxypropyltrimethoxysilane, TSL8350 (trade name of Momentive) was used. And H / Vi ratio in Table 5 shows the molar ratio of the hydrogen atom couple | bonded with the silicon atom and the vinyl group couple | bonded with the silicon atom in (A) component and (B) component.

  Thus, the viscosity and refractive index of the polyorganosiloxane composition obtained in Examples 7 to 25 and Comparative Examples 3 to 5 were measured as follows. In addition, after the polyorganosiloxane compositions obtained in Examples 7 to 25 and Comparative Examples 3 to 5 were cured by heating at 150 ° C. for 3 hours, the physical properties (hardness, tensile strength, elongation and Transmittance) was measured according to JISK6253 “Test method for uncured and cured silicone rubber” and the like. Further, a package test (2) was performed as described below, and the adhesion to a substrate made of PPA resin was examined. The results of these measurements and tests are shown in the lower columns of Tables 3-5.

[viscosity]
The viscosity of the polyorganosiloxane composition before curing was measured using a rotational viscometer at 23 ° C. ± 2 ° C.

[Refractive index]
About the polyorganosiloxane composition before hardening, the refractive index of the sodium D line | wire (wavelength 589nm) was measured using the multiwavelength Abbe refractometer (The product made by Atago Co., Ltd .; apparatus name; DR-M2-1550). The measurement was performed at 25 ° C.

[Package test (2)]
(Presence or absence of peeling from PPA)
After drying the 3528 type LED package at 150 ° C. for 2 hours, a sample of a polyorganosiloxane composition was filled into a base material made of PPA resin (Kuraray Co., Ltd., trade name: Genestar) using a syringe. The sample was cured by heating at 100 ° C. for 2 hours and then at 150 ° C. for 3 hours. After cooling at room temperature, the presence or absence of peeling of the cured product from the PPA resin was examined using a microscope (60 to 80 times). Then, the number of samples (n) was 10, and the number of peeling was counted.

  Furthermore, about the polyorganosiloxane composition obtained in Examples 17-25, after performing the said package test (2), the test shown below was done and the peeling after MSL3 reflow was investigated.

(Peeling after MSL3 reflow)
Using the LED package with the sample filled and cured used in the peel test from the PPA, IPC / JEDEC J-STD-020D. The MSL3 test according to 1 was conducted. In this test, the sample filled and cured LED package was dried at 125 ° C. for 24 hours, and then left in a 60 ° C./60% RH chamber for 40 hours to absorb moisture under Level 3 conditions. After moisture absorption, it was allowed to stand at room temperature for 15 minutes and put into a reflow oven (maximum 260 ° C.) (about 5 minutes per cycle). After cooling at room temperature for 5 minutes, it was put into the reflow oven again, and this was repeated a total of 3 times. Subsequently, it cooled to room temperature and the presence or absence of peeling from the PPA resin of hardened | cured material was investigated using the microscope (60-80 times). And the number of samples in which peeling was seen among 10 pieces was counted.

From Tables 3 to 5, the following can be understood. That is, with respect to an addition reaction type polyorganosiloxane composition containing a trifunctional siloxane unit having a phenyl group ( ^TPh unit) and a polyorganosiloxane having a vinyl group as a base polymer, the siloxane unit having an epoxy group Example 7 obtained by blending an adhesion imparting agent D1 or D6 each containing a certain T ^ep unit and a D ^vi unit which is a bifunctional siloxane unit having a vinyl group and having a Mw in the range of 1000 to 15000 The polyorganosiloxane composition of ˜25 is a comparative example in which γ-glycidoxypropyltrimethoxysilane or the like is blended as a polyorganosiloxane composition in Comparative Example 3 in which an adhesion imparting agent is not blended, or an adhesion imparting agent. Compared with 4-5 polyorganosiloxane compositions, it has excellent adhesion to PPA. That is, while the sealing layer made of the cured product of the polyorganosiloxane composition of Comparative Examples 3 to 5 peeled off at the interface with the base material made of PPA, the polyorgano of Examples 7 to 25 No peeling was observed in the sealing layer made of a cured product of the siloxane composition, indicating excellent adhesion to PPA.

In particular, in the polyorganosiloxane compositions of Examples 17 to 25, silicone resins A-3 to A-5 having a high content of T ^Ph units are used as the component (A). Is also highly reliable.

  According to the adhesive polyorganosiloxane composition containing the adhesiveness-imparting agent, it exhibits good adhesiveness to heat-resistant plastics such as PPA, and the adhesiveness is the heat generated from the light emitting element and the temperature cycle. It is not lowered by heating at the time. Therefore, the adhesive polyorganosiloxane composition of the present invention is highly reliable and useful as a sealing material for semiconductor devices such as LED devices.

Claims (12)

(A) 100 parts by mass of a polyorganosiloxane having an alkenyl group bonded to a silicon atom and containing a trifunctional siloxane unit having an aryl group;
(B) A polyorganohydrogensiloxane having a hydrogen atom bonded to a silicon atom, the amount of the hydrogen atom in the component is 0.1 to 4.0 per alkenyl group in the component (A). And the amount
(C) a platinum catalyst and a catalyst amount;
(D) (a) a trifunctional siloxane unit represented by the formula: R ¹ SiO _3/2 (wherein R ¹ represents a monovalent organic group having an epoxy group), and the formula: R ¹ R ² SiO _2/2 (wherein R ¹ is as defined above, R ² represents an alkyl group or an alkoxy group), and a formula: R ¹ R ² ₂ SiO _{1 / 2} (wherein R ¹ and R ² are the same as above), at least one siloxane unit having an epoxy group selected from the group consisting of monofunctional siloxane units;
(B) Formula: R ³ ₂ SiO _2/2 (wherein R ³ represents a monovalent hydrocarbon group selected from an alkenyl group, an alkyl group and an aryl group, and at least one is an alkenyl group). Each of the present invention contains 0.05 to 10 parts by mass of an adhesion-imparting agent comprising a polyorganosiloxane having a bifunctional siloxane unit having an alkenyl group and having a weight average molecular weight of 1000 to 15000. An adhesive polyorganosiloxane composition characterized.   2. The adhesive polyorganosiloxane composition according to claim 1, wherein in (D) the adhesion-imparting agent, the (a) siloxane unit having an epoxy group has a glycidoxyalkyl group bonded to a silicon atom. 3. object. The (D) adhesion-imparting agent has a trifunctional siloxane unit represented by the formula: R ¹ SiO _3/2 as the siloxane unit (a) having an epoxy group. Or the adhesive polyorganosiloxane composition of 2. The (D) adhesion-imparting agent is a trifunctional siloxane unit represented by the formula: R ⁴ SiO _3/2 (wherein R ⁴ represents an alkyl group or an aryl group), and / or the formula: R ^The bifunctional siloxane unit represented by ⁴ ₂ SiO _2/2 (wherein R ⁴ is the same as above) is further contained. Adhesive polyorganosiloxane composition. The component (A) includes a polyorganosiloxane containing a trifunctional siloxane unit represented by the formula: C ₆ H ₅ SiO _3/2 in a proportion of 20 to 60 mol% with respect to the entire structural unit. The adhesive polyorganosiloxane composition according to any one of claims 1 to 4, wherein: The component (A) is a polyorganosiloxane containing a bifunctional siloxane unit represented by the formula: CH ₃ (CH ₂ ═CH) SiO _2/2 in a proportion of 10 mol% or less based on the entire constituent units. And at least a polyorganosiloxane containing a bifunctional siloxane unit represented by the formula: CH ₃ (CH ₂ ═CH) SiO _2/2 in a proportion exceeding 10 mol% with respect to the entire constituent units, The adhesive polyorganosiloxane composition according to any one of claims 1 to 5, comprising two types of polyorganosiloxanes. The component (A) includes a polyorganosiloxane containing a trifunctional siloxane unit represented by the formula: C ₆ H ₅ SiO _3/2 in a proportion of 30 to 55 mol% with respect to the entire structural unit. The adhesive polyorganosiloxane composition according to claim 6. The component (B) includes a branched polyorganohydrogensiloxane having a trifunctional siloxane unit represented by the formula: C ₆ H ₅ SiO _3/2 . 2. The adhesive polyorganosiloxane composition according to 1.   The adhesive polyorgano according to any one of claims 1 to 8, wherein the component (B) contains a polyorganohydrogensiloxane having hydrogen atoms bonded to silicon atoms at both ends of the molecular chain. Siloxane composition.   Furthermore, (E) 0.05-5 mass parts of isocyanurate compounds which have an alkoxy group are contained, The adhesive polyorganosiloxane composition of any one of Claims 1-9 characterized by the above-mentioned.   An optical semiconductor device comprising a cured product obtained by curing the adhesive polyorganosiloxane composition according to claim 1.   The optical semiconductor device according to claim 11, wherein the cured product contains a phosphor.

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