JP2015170629A - Adjusting jig for film-like substrate holding unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an adjusting jig for a film-like substrate holding unit that can easily adjust the position of each suction unit which is conformed with the shape of the film-like substrate.SOLUTION: An adjusting jig 100 for a film-like substrate holding unit 26 has a unit mounting unit 103 for mounting the film-like substrate holding unit 26, and a substrate setting unit 104 which can set a film-like substrate 3. The substrate setting unit 104 is provided with a scale member 105 for indicating the position of a crimp tool 23 which is viewed from the film-like substrate holding unit 26 mounted in the unit mounting unit 103.

Description

  The present invention relates to an adjustment jig for a film-like substrate holding unit that sucks and holds a film-like substrate.

  Conventionally, as a bonding apparatus for crimping a film-like substrate having an external connection terminal group formed on an edge portion to the substrate, a device equipped with a crimping head integrally provided with a crimping tool and a suction portion for holding the film-like substrate. Are known. In this bonding apparatus, the line portion on which the external connection terminal group is formed is adsorbed by a crimping tool, and the portion extending from the edge portion is adsorbed by a plurality of adsorbing portions to hold the film-like substrate. Since the plurality of adsorbing portions are arranged at positions corresponding to the shape of the film-like substrate, even a film-like substrate having a complicated shape can be reliably adsorbed (for example, Patent Document 1).

JP 2000-77898 A

  However, in the bonding apparatus described in Patent Document 1, it is necessary to prepare a dedicated pressure-bonding head in accordance with the shape of the film-like substrate (film-like substrate to be pressure-bonded) to be pressure-bonded to the substrate. For this reason, in the patent application No. 2013-48609, the present applicant removably attaches a film-like substrate holding unit having a suction portion whose position can be freely changed according to the shape of the film-like substrate to the pressure bonding head. A new bonding device with a configuration was proposed. According to this bonding apparatus, when the shape of the film-like substrate to be substrate is changed, the film-like substrate holding unit in which the position of the suction portion is adjusted in accordance with the shape of the changed film-like substrate. There is an advantage that it only needs to be attached to the crimping head, but in order to improve the operating rate of the bonding device, the position of each suction part of the film-like substrate holding unit can be easily adjusted according to the shape of the film-like substrate. It is necessary to.

  Then, an object of this invention is to provide the jig for adjustment of the film-like board | substrate holding unit which can perform easily the position adjustment of each adsorption | suction part matched with the shape of the film-like board | substrate.

  The adjustment jig for the film-like substrate holding unit of the present invention includes a unit mounting portion for mounting the film-like substrate holding unit, and a reference portion indicating the position of the crimping tool as viewed from the film-like substrate holding unit attached to the unit mounting portion. And a substrate setting portion capable of setting a film-like substrate or a simulated substrate imitating the film-like substrate at a predetermined position based on the reference portion.

  According to the present invention, it is possible to easily adjust the position of each suction portion in accordance with the shape of the film-like substrate.

The principal part side view of the bonding apparatus in one embodiment of this invention The perspective view which shows the crimping | compression-bonding head and film-like board | substrate holding unit with which the bonding apparatus in one embodiment of this invention is provided. The partial exploded perspective view which shows the crimping | compression-bonding head and film-like board | substrate holding unit in one embodiment of this invention (A) (b) Side view which shows the crimping | compression-bonding head and film-like board | substrate holding unit in one embodiment of this invention. The perspective view of the film-like board | substrate holding unit in one embodiment of this invention The partial cross section front view of the film-like board | substrate holding unit in one embodiment of this invention (A) (b) (c) Partial sectional view of the free arm provided in the film-like substrate holding unit according to the embodiment of the present invention. The fragmentary sectional view of the free arm with which the film-like board | substrate holding unit in one embodiment of this invention is provided (A) (b) (c) (d) The top view of the film-like board | substrate holding unit in one embodiment of this invention (A) (b) The figure explaining the procedure which crimps | bonds a film-form board | substrate to a board | substrate with the bonding apparatus in one embodiment of this invention. (A) (b) The figure explaining the procedure which crimps | bonds a film-form board | substrate to a board | substrate with the bonding apparatus in one embodiment of this invention. The perspective view of the jig | tool for adjustment of the film-like board | substrate holding unit in one embodiment of this invention The partial exploded perspective view of the jig for adjustment of the film-like substrate holding unit in one embodiment of the present invention The figure which shows the state which is performing the position adjustment of the adsorption | suction part with which a film-like board | substrate holding unit is equipped with the jig | tool for adjustment of the film-like board | substrate holding unit in one embodiment of this invention

  Before explaining the adjustment jig for the film-like substrate holding unit in the present invention, first, the bonding apparatus 1 shown in FIG. 1 will be explained. This bonding apparatus 1 is an apparatus for crimping (bonding) an external connection terminal group 3 a formed on an edge portion of a film-like substrate 3 to a film-like substrate crimping portion 2 a provided at an end of the substrate 2. A film-like substrate holding unit 26, which will be described later, used in the crimping operation is an object to be adjusted by the adjustment jig for the film-like substrate holding unit of the present invention.

  In FIG. 1, a bonding apparatus 1 is provided on a substrate holding stage 11 for holding a substrate 2 and behind the substrate holding stage 11 in the front-rear direction (left-right direction in FIG. 1; Y-axis direction), and is not shown in the form of a film. The film-like substrate 3 supplied from the substrate supply unit can be freely moved in the horizontal plane in the upper area of the relay stage 12, the substrate holding stage 11, and the relay stage 12 that are temporarily placed before the film 2 is pressure-bonded to the substrate 2. A pressure-bonding head 13 that sucks the film-like substrate 3 placed on the relay stage 12 and press-bonds it to the substrate 2 on the substrate holding stage 11, and is provided in a region between the substrate holding stage 11 and the relay stage 12. A backup stage 14 and a backup stage for supporting the lower surface side of the substrate 2 when the film-like substrate 3 is crimped to the substrate 2 by the crimping head 13. 4, a recognition mark (not shown) provided near the external connection terminal group 3a of the film-like substrate 3 adsorbed by the pressure-bonding head 13 and the substrate 2 on the substrate holding stage 11 are provided. The camera 15 which images the recognition mark (not shown) formed in the film-form board | substrate to-be-bonded part 2a from the downward direction is provided.

  In FIG. 1, the substrate holding stage 11 is moved in the horizontal plane direction and the vertical direction by the substrate holding stage moving mechanism 11M, and the relay stage 12 is moved in the horizontal plane direction by the relay stage moving mechanism 12M. The crimping head 13 is moved in a horizontal plane by a head moving mechanism 13M, a crimping tool lifting mechanism 22 provided on the head base 21, and a crimping tool 23 lifted and lowered with respect to the head base 21 by the crimping tool lifting mechanism 22. A mounting part lifting cylinder 24 attached to the back (rear) side of the crimping tool 23, a mounting part 25 lifted and lowered by the mounting part lifting cylinder 24, and a film-like substrate holding unit 26 detachably attached to the mounting part 25. It consists of

  The crimping tool 23 is attached to the lower end of the piston rod 22a of the crimping tool lifting mechanism 22, and includes a heater block 23a incorporating a heater, a tool body 23b, and a tool body holding portion 23c for fixing the tool body 23b to the heater block 23a. Consists of. The tool body 23b is heated to a temperature necessary for thermocompression bonding by heat conduction from the heater block 23a. The crimping tool 23 is moved up and down by the downward and downward movement of the piston rod 22 a of the crimping tool lifting mechanism 22.

  2, 3, and 4 (a) and 4 (b), the mounting portion 25 is vertically upward from the rear edge of the horizontal portion 31 and the horizontal portion 31 coupled to the lower end of the piston rod 24 a of the mounting portion lifting cylinder 24. It has the vertical part 32 extended and provided. The back surface 32R of the vertical portion 32 is processed vertically and flatly. A pair of alignment pins 33 are provided at both ends of the vertical portion 32 in the left-right direction (a direction orthogonal to the paper surface of FIG. 1; the X-axis direction) extending rearward.

  3, 4 (a), 4 (b), and 5, the film-like substrate holding unit 26 has a base portion 41 that is attached to the back surface 32 </ b> R side of the vertical portion 32 of the attachment portion 25. 41 is attached with two types of arms (fixed arm 42 and universal arm 43) as a plurality of arms each having a suction portion for sucking and holding the film-like substrate 3 at the tip. The base portion 41 includes a contact portion 51 having a flat front surface 51F and an arm connecting portion 52 that is connected to the lower end of the contact portion 51 and extends in the left-right direction (X-axis direction). A fixed arm 42 extends forward in the Y direction at the center of the arm connecting portion 52, and a fixed suction portion 54 is provided on the lower surface side of the front end portion. The arm 43 is attached to both ends of the arm connecting portion 52. The film-like substrate holding unit 26 is attached with the front surface 51F of the contact portion 51 being in close contact with the back surface 32R of the vertical portion 32 of the attachment portion 25.

  A pair of cutout portions 55 are provided at both left and right ends of the contact portion 51 of the base portion 41, and the contact portion 51 is provided with the pair of cutout portions 55 in the vertical portion 32 of the mounting portion 25. The pair of alignment pins 33 are inserted into the vertical portion 32 of the mounting portion 25 so as to be positioned in a contact state. In this state, the pair of screw holes 32a provided on the back surface 32R side of the vertical portion 32 of the attachment portion 25 and the pair of through holes 56 provided through the contact portion 51 are matched. When the threaded portion 57S of the penetrated mounting bolt 57 is screwed into the screw hole 32a, the contact portion 51 (that is, the film-like substrate holding unit 26) is fixed to the mounting portion 25 to be in an attached state (FIG. 4 ( a) → FIG. 4B).

  3, 5, and 6, the free arm 43 of the film-like substrate holding unit 26 includes a first link 61 and a second link 62. One end portion of the first link 61 is connected to the left and right end portions of the arm connecting portion 52 of the base portion 41 by the first shaft member 63, and one end portion of the second link 62 is connected to the first link by the second shaft member 64. It is connected to the other end of 61. A movable suction portion 65 is provided on the lower surface of the other end portion of the second link 62.

  The first link 61 of each universal arm 43 is rotatable with respect to the base portion 41 by a first shaft member 63, and the second link 62 is rotatable with respect to the first link 61 by a second shaft member 64. is there. That is, in the present embodiment, the film-like substrate holding unit 26 includes a plurality of free arms 43 having one end provided on the base portion 41 and a movable suction portion 65 that sucks the film-like substrate 3 at the other end. Each of the free arms 43 has one end rotatably attached to the base 41 by the first shaft member 63 and a second shaft as a joint provided between the one end and the other end. The member 64 can be bent freely.

  7A is a cross-sectional view of the portion of the free arm 43 (D portion indicated by a broken line in FIG. 6), and FIGS. 7B and 7C are taken from the direction of arrows V-V in FIG. 7A. FIG. 6 and 7A, a nut 63N is screwed into the upper thread portion 63S of the first shaft member 63, and the operator can loosen the nut 63N and the base portion 41 (arm connecting portion) 52), the first link 61 can be fixed to the base portion 41 by adjusting the posture of the first link 61 and then tightening the nut 63N. Further, in FIG. 8, which is a partial cross-sectional view of a portion indicated by a broken line E in FIGS. 6 and 6, a nut 64 </ b> N is screwed to the upper thread portion 64 </ b> S of the second shaft member 64, and the operator The second link 62 can be fixed to the first link 61 by adjusting the posture of the second link 62 relative to the first link 61 in a state where the nut 64N is loosened, and then tightening the nut 64N.

  In FIG. 1, a vacuum source 70 is provided outside the bonding apparatus 1, and the vacuum source 70 is connected to a crimping tool inner pipe line (not shown) provided in the crimping tool 23 through a pipe line 71. It is connected to a pipe (not shown) in the mounting part provided inside the mounting part 25. The crimping tool inner pipe line has a suction opening 23d at the lower end of the tool main body 23b, and the attachment part inner pipe line is provided with two suction ports 32b (FIG. 3) opened to the back surface 32R side of the vertical part 32 of the attachment part 25. Yes.

  5 and 6, the base portion 41 of the film-like substrate holding unit 26 is provided with two openings 41 a that connect to the two suction ports 32 b in a state where the base portion 41 is attached to the attachment portion 25. . The control of the vacuum pressure supplied from the vacuum source 70 to the suction opening 23 d of the crimping tool 23 and the control of the vacuum pressure supplied to the two suction ports 32 b of the attachment unit 25 are performed by the pneumatic pressure control unit 72 interposed in the pipe 71. (FIG. 1).

  In FIG. 6, the base part 41 of the film-like substrate holding unit 26 is provided with a first base-part suction path 81a connected to one opening 41a and a second base-part suction path 82a connected to the other opening 41a. Yes. The first in-base suction path 81a is connected to a fixed-arm suction path 81b extending through the fixed arm 42, and the second in-base suction path 82a is connected to a free-arm suction path 82b extending through each of the free arms 43. ing. The fixed suction portion 54 provided on the fixed arm 42 is connected to the suction path 81b in the fixed arm, and the movable suction portion 65 provided on the free arm 43 extends in the free arm 43. 82b is connected.

  In this way, the first suction passage 81a in the base portion and the suction passage 81b in the fixed arm are connected to one suction port 32b formed in the attachment portion 25 through one opening 41a provided in the base portion 41 ( The second internal suction path 82a and the universal arm suction path 82b of each universal arm 43 are attached through the other opening 41a provided in the base 41. An internal suction path (referred to as a second internal suction path 82) connected to the other suction port 32b formed in the portion 25 is formed.

  That is, in the present embodiment, the base portion 41 has an opening 41a connected to the suction port 32b formed in the mounting portion 25, and the suction portion (fixed suction portion) is connected to the base portion 41 and the free arm 43 from the opening 41a. 54 and the movable suction portion 65) are provided with internal suction paths (first internal suction path 81 and second internal suction path 82).

  In FIG. 6, the in-arm suction path 82 b in each of the arm 43 has a first shaft member communication path 83 provided in the first shaft member 63 and a second shaft member provided in the second shaft member 64. An internal communication passage 84 is included (see also FIGS. 7A and 8). As shown in FIG. 7A, the first shaft member communication passage 83 communicates with the axial passage 83a extending in the axial direction in the first shaft member 63, and the lower end of the axial passage 83a. A lower through-passage 83b extending through the first shaft member 63 in an orthogonal direction, and an upper through-hole extending through the first shaft member 63 in a direction orthogonal to the axial direction in communication with the upper end of the axial passage 83a It consists of a groove 83d formed around the outer surface of the first shaft member 63 in communication with the openings at both ends of the passage 83c and the upper through passage 83c. The axial passage 83a is a second in-base suction that extends in the arm connecting portion 52 of the base portion 41 via the lower through-passage 83b when the first shaft member 63 is positioned at a predetermined rotational position with respect to the base portion 41. While communicating with the path 82a, it communicates with a suction path 82b in the free arm extending through the first link 61 through the upper through path 83c and the groove 83d (FIGS. 7A and 7B).

  As shown in FIG. 8, the second shaft member internal communication passage 84 communicates with the axial passage 84a extending in the axial direction in the second shaft member 64 and the upper end of the axial passage 84a and is orthogonal to the axial direction. An upper through-passage 84b extending through the second shaft member 64, an upper groove 84c formed around the outer surface of the second shaft member 64 in communication with both end openings of the upper through-passage 84b, and an axial passage The lower through-passage 84d that communicates with the lower end of 84a and extends through the second shaft member 64 in a direction orthogonal to the axial direction and the both end openings of the lower through-passage 84d communicates with the outer surface of the second shaft member 64. It consists of a lower groove 84e formed around. The axial passage 84a communicates with the in-arm suction passage 82b extending through the first link 61 through the upper through passage 84b and the upper groove 84c, while extending through the second link 62 through the lower through passage 84d and the lower groove 84e. It communicates with the suction path 82b in the free arm.

  Thus, the second in-base suction path 82 a formed in the base 41 and the in-arm suction path 82 b in the first link 61 are connected by the first shaft member communication path 83, and the first link 61. The universal arm suction path 82b in the inner link and the universal arm suction path 82b in the second link 62 are connected by the second shaft member communication path 84. As shown in FIG. Depending on the rotational position of the first shaft member 63, the second base-portion suction passage 82a and the lower through-passage 83b do not communicate with each other, and therefore the second base-portion suction passage 82a and the universal arm suction passage 82b are not connected. . For this reason, it is possible to block the second internal suction path 82 by positioning the first shaft member 63 at a predetermined rotational position with respect to the base portion 41 (specifically, the arm connecting portion 52).

  The worker fixes the first link 61 to the base portion 41 and fixes the second link 62 to the first link 61 as described above, so that the movable suction portion provided at the end of each universal arm 43 is fixed. The two movable suction portions 65 can be arranged in a desired arrangement by moving 65 within a certain region. Since the suction opening 23 d of the crimping tool 23 attracts the edge portion directly above the external connection terminal group 3 a on the upper surface of the film-like substrate 3, the fixed suction part 54 and the movable suction part 65 are provided on the crimping tool 23. The arrangement is such that the suction opening 23d sucks the edge portion immediately above the external connection terminal group 3a and sucks and holds the other portion (the portion extending from the edge portion) in a balanced manner. Is done.

  Here, as for the free arm 43 that does not want the film-like substrate 3 to be attracted by the movable attracting portion 65, as described above, by positioning the first shaft member 63 at a predetermined rotational position with respect to the base portion 41, The second internal suction path 82 is blocked. Further, when the suction from the fixed suction portion 54 is not desired, the first base-portion suction path 81a is blocked from the above-described air pressure control portion 72. FIGS. 9A and 9B show an example in which the film-like substrate 3 is sucked and held by the fixed suction portion 54 and the two movable suction portions 65, and FIG. 9C shows the fixed suction portion. An example in which the film-like substrate 3 is sucked and held by the two movable suction portions 65 without performing suction by the portion 54 is shown. FIG. 9D shows an example in which the film-like substrate 3 is sucked and held by the fixed suction portion 54 and one movable suction portion 65. As described above, in the film-like substrate holding unit 26 in the present embodiment, the movable suction portion 65 can be moved to an arbitrary position to be arranged according to the shape of the film-like substrate 3.

  When the operator arranges the two movable suction portions 65 according to the shape of the film-like substrate 3 as described above, the worker attaches the film-like substrate holding unit 26 to the attachment portion 25. When attaching the film-like substrate holding unit 26 to the attachment portion 25, the operator attaches the pair of notch portions 55 provided at the left and right ends of the contact portion 51 of the base portion 41 as described above. By positioning a pair of alignment pins 33 provided extending rearward from the back surface 32R of the vertical portion 32, the film-like substrate holding unit 26 can be positioned with respect to the attachment portion 25. At this time, the pair of alignment pins 33 function as a guide portion that guides the base portion 41 toward the attachment portion 25 when the base portion 41 of the film-like substrate holding unit 26 is attached to the attachment portion 25. The attachment of the film-like substrate holding unit 26 to the attachment portion 25 can be performed very easily. Further, since the operator can attach the film-like substrate holding unit 26 to the attachment portion 25 by groping, the film-like substrate holding unit 26 can be attached from the front side of the pressure-bonding head 13 without going around the back side of the pressure-bonding head 13. Attachment to the attachment portion 25 can be performed.

  As described above, in the present embodiment, the film-like substrate holding unit 26 includes a plurality of suction portions (the fixed suction portion 54 and the movable suction portion 65) arranged at positions corresponding to the shape of the film-like substrate 3, and is crimped. It is configured to be detachably attached to the head 13. The crimping head 13 is provided with a mounting portion 25, and the film-like substrate holding unit 26 is provided with a base portion 41 that is detachably attached to the mounting portion 25 and a movable suction portion 65 at the tip thereof. A plurality of (here, two) free arms 43 are provided. The attachment portion 25 includes a pair of alignment pins 33 as guide portions for guiding the base portion 41 when the base portion 41 is attached.

  When the film-like substrate 3 on the relay stage 12 is crimped to the substrate 2 held on the substrate holding stage 11, the crimping head 13 moves above the relay stage 12 and the suction opening 23 d of the crimping tool 23 and the film. The suction portion (the fixed suction portion 54 and the movable suction portion 65) of the film-like substrate holding unit 26 is positioned at the target suction position of the film-like substrate 3 (FIG. 10A). Then, the film-like substrate holding unit 26 is lowered by the operation of the mounting portion elevating cylinder 24 (FIG. 10B), and the film-like substrate 3 is sucked by the fixed suction portion 54 and the movable suction portion 65 (FIG. 10B). ).

  When the film-like substrate holding unit 26 sucks the film-like substrate 3, the film-like substrate 3 is raised by the operation of the mounting portion elevating cylinder 24 to bring the film-like substrate 3 into contact with the lower end of the tool body 23 b. The crimping tool 23 sucks the edge portion directly above the external connection terminal group 3a on the upper surface of the film-like substrate 3 at the suction opening 23d. As a result, the film-like substrate 3 is sucked and held by the film-like substrate holding unit 26 and the crimping tool 23. Next, the crimping head 13 moves to position the external connection terminal group 3 a on the lower surface of the attracted film-like substrate 3 above the camera 15. Next, the camera 15 images the external connection terminal group 3a (FIG. 11A). A recognition device (not shown) recognizes the position of the external connection terminal group 3a by performing image recognition of the image data obtained by the imaging of the camera 15. The crimping head 13 moves based on the recognition result by the recognition device, and positions the external connection terminal group 3 a of the film-like substrate 3 above the film-like substrate crimping portion 2 a of the substrate 2. Then, the crimping tool 23 descends (FIG. 11B) and presses the external connection terminal group 3 a of the film-like substrate 3 against the film-like substrate crimping portion 2 a of the substrate 2. Thereby, the film-like substrate 3 is pressure-bonded to the substrate 2 (FIG. 11B).

  As described above, the bonding apparatus 1 according to the present embodiment includes the pressure bonding head 13 provided with the pressure bonding tool 23 and the film-shaped substrate 3 that is detachable from the pressure bonding head 13 and is to be pressure-bonded to the substrate 2 (the film shape to be pressure-bonded). A film-like substrate holding unit 26 provided with suction parts (fixed suction part 54 and movable suction part 65) for sucking and holding the substrate 3) is provided. For this reason, when the shape of the film-like substrate 3 to be crimped is changed, it can be easily and quickly handled by simply attaching the film-like substrate holding unit 26 corresponding to the changed shape of the film-like substrate 3 to the crimping head 13. can do.

  The above-described film-like substrate holding unit 26 can adjust the position of the movable suction portion 65 to the position corresponding to the shape of the film-like substrate 3 by the free arm 43, but at the position corresponding to the shape of the film-like substrate 3. It is also possible to use the film-like substrate holding unit 26 having only the fixed arm 42 so that the movable suction portion 65 is positioned.

  Next, an adjustment jig (hereinafter referred to as an adjustment jig 100) of the film-like substrate holding unit 26 will be described with reference to FIGS. The adjustment jig 100 is used to adjust the position of the movable suction portion 65 that is the movable-side suction portion of the film-like substrate holding unit 26. The adjustment jig 100 includes a rectangular base 101, a support member 102 provided on the base 101, a unit mounting part 103 provided on the support member 102, a plate-like substrate set part 104 attached to the base 101, and a substrate A scale member 105 as a reference member provided on the set unit 104 and two limiting members 106 provided on the base 101 are provided.

  The support member 102 has a column portion 102a extending upward from the center end portion of the base portion 101 rearward in the y-axis direction, and a horizontal portion 102b extending forward from the upper end of the column portion 102a in the y-axis direction. The unit mounting portion 103 is formed of a member on a rectangular flat plate extending in the xz plane, and is fixed to the front end of the horizontal portion 102b of the support member 102. The substrate setting unit 104 is configured by a rectangular flat plate-like member, and can be detachably attached to the upper surface of the base 101 by sliding in the y-axis direction with respect to the base 101. The unit mounting portion 103 is provided with a pair of alignment pins 133 and a pair of screw holes 132a in the same manner as the vertical portion 32 of the pressure-bonding head 13 of the bonding apparatus 1, and the operator holds the film-like substrate holding unit 26. It can be mounted on the unit mounting portion 103 in the manner of being attached to the crimping head 13 (FIG. 13). As described above, the unit mounting portion 103 is a member for mounting the film-like substrate holding unit 26, and the base 101 is a member for fixing the unit mounting portion 103 to the base 101.

  A scale member 105 is fixed to the substrate setting unit 104. The orientation of the scale member 105 is adjusted so that the edge 105a of the scale member 105 is parallel to the x-axis when the substrate setting unit 104 is attached to the base 101 (FIGS. 13 and 11).

  As shown in FIGS. 12 and 13, a reference line 104 a extending in the y-axis direction is drawn at the center of the substrate setting unit 104. A scale is engraved on the upper surface of the scale member 105, and the scale member 105 is provided on the substrate setting portion 104 so that the center thereof coincides with the reference line 104a.

  Here, the edge 105 a and the scale of the scale member 105 serve as an alignment reference for the film-like substrate 3 set on the substrate setting unit 104. This alignment reference indicates the relative positional relationship between the film-like substrate holding unit 26 and the crimping tool 23 in the bonding apparatus 1. That is, the edge 105 a and the scale of the scale member 105 serve as a reference portion indicating the position of the crimping tool 23 as viewed from the film-like substrate holding unit 26 attached to the unit attachment portion 103. Accordingly, when the film-like substrate 3 is set on the substrate setting portion 104 in accordance with the edge 105a and the scale of the scale member 105, the relative relationship between the film-like substrate holding unit 26 attached to the unit attachment portion 103 and the film-like substrate 3 is obtained. The positional relationship is reproduced with the actual relative positional relationship in the bonding apparatus 1.

  As described above, in the adjustment jig 100 according to the present embodiment, the edge 105 a and the scale of the scale member 105 provided in the substrate setting portion 104 are crimped as viewed from the film-like substrate holding unit 26 attached to the unit attachment portion 103. This is a reference portion indicating the position of the tool 23. In addition, as a reference | standard part, it may replace with the scale member 105 and you may substitute for the line (including the line provided by uneven | corrugated shape) provided in the board | substrate set part 104. FIG.

  When the film-like substrate holding unit 26 is actually attached to the bonding apparatus 1 in a state where the film-like substrate holding unit 26 is attached to the unit mounting portion 103, the left and right free arms 43 are connected to the bonding device 1. When there is a possibility of interference with a member on the side, it is provided as a restricting portion that restricts the movement range of the left and right universal arms 43.

  When the operator uses the adjustment jig 100 to adjust the position of the movable suction portion 65 of the film-like substrate holding unit 26, first, the substrate setting portion 104 is removed with the substrate setting portion 104 removed from the base portion 101. The film-like substrate 3 to be crimped is set on. In more detail, the operator brings the tip of the crimped portion 3b where the external connection terminal group 3a is formed into contact with the edge 105a of the scale member 105 so as to align the position in the y-axis direction, While viewing, the film-like substrate 3 is set on the substrate setting portion 104 by aligning the position of the bonded portion 3b in the y-axis direction (arrow A in FIG. 13). And the board | substrate set part 104 in which the film-like board | substrate 3 was set is mounted | worn with the base 101 (arrow B shown in FIG. 13). Next, the operator attaches the film-like substrate holding unit 26 to the unit attachment portion 103, and attaches the substrate setting portion 104 with the film-like substrate 3 set on the upper surface to the base portion 101. This completes the preparation. Note that after the film-like substrate holding unit 26 is attached to the unit attachment portion 103, the substrate setting portion 104 on which the film-like substrate 3 is set may be attached to the base 101.

  Here, a configuration in which the substrate setting portion 104 is fixed to the base portion 101 (or the substrate setting portion 104 and the base portion 101 are integrated) is also conceivable, but in this case, the support member 102 is disposed above the substrate setting portion 104 (further, The film-like substrate holding unit 26) is located and is difficult to work. Therefore, in order to facilitate the work, it is preferable that the substrate setting unit 104 is detachably attached to the base 101 as in the present embodiment. Furthermore, as shown in the present embodiment, if the substrate setting unit 104 can be slidably mounted on the base 101, the film-like substrate holding unit 26 is mounted on the unit mounting portion 103. Even in the state, the substrate setting unit 104 can be easily attached to the base 101. Even when the substrate setting unit 104 is slidable with respect to the base 101, the substrate setting unit 104 does not have to be detachable with respect to the base 101. The above-described effects can be sufficiently obtained simply by being slidably attached to 101.

  When the preparation is completed as described above, the operator moves the left and right arm 43 to adjust the position of the movable suction portion 65 with respect to the film-like substrate 3 set on the substrate setting portion 104 (FIG. 9). Then, the film-like substrate holding unit 26 whose position has been adjusted is removed from the unit mounting portion 103 of the adjustment jig 100 and mounted on the vertical portion 32 of the bonding apparatus 1.

  Here, in the position adjusting operation of the movable suction portion 65, the movement range of the left and right universal arms 43 is limited by the limiting member 106 (FIG. 14). For this reason, when the film-like substrate holding unit 26 for which the position adjustment of the movable suction portion 65 has been completed is subsequently attached to the bonding apparatus 1, the left and right universal arms 43 do not interfere with members on the bonding apparatus 1 side.

  As described above, in the adjustment jig 100 of the film-like substrate holding unit 26 in the present embodiment, the relative positional relationship between the film-like substrate holding unit 26 and the film-like substrate 3 in the bonding apparatus 1 can be reproduced. The operator can adjust the position of the movable suction portion 65 in accordance with the shape of the film substrate 3.

  Further, the adjustment jig 100 is provided with a limiting member 106 as a limiting portion, and the movable portion (left and right universal arms 43) of the film-like substrate holding unit 26 attached to the bonding apparatus 1 is on the bonding apparatus 1 side. Since the range that does not interfere with the member is defined in advance on the adjustment jig 100, the position of the movable suction portion 65 can be adjusted more accurately.

  In the above-described embodiment, the film-like substrate 3 to be pressure-bonded is set in the substrate setting unit 104, but a simulated substrate simulating the film-like substrate 3 instead of the film-like substrate 3 May be set. In the above-described embodiment, there are a plurality of suction portions (movable suction portions 65) that are targets of position adjustment of the film-like substrate holding unit 26. However, there is a single suction portion that is a target of position adjustment. The present invention can also be applied to a substrate holding unit.

  Provided is a jig for adjusting a film-like substrate holding unit, which can easily adjust the position of each suction portion in accordance with the shape of the film-like substrate.

3 Film Substrate 13 Crimp Head 23 Crimp Tool 26 Film Substrate Holding Unit 65 Movable Suction Unit (Suction Unit)
DESCRIPTION OF SYMBOLS 100 Adjustment jig | tool 101 Base part 103 Unit mounting part 104 Substrate setting part 105 Scale member (reference | standard member)
106 Restriction member (restriction part)

Claims (5)

A film-like substrate used for adjusting the position of the suction portion of a film-like substrate holding unit that is detachably attached to a crimping head equipped with a crimping tool and has a suction portion that sucks and holds a film-like substrate to be crimped. A holding unit adjustment jig,
A unit mounting portion for mounting the film-like substrate holding unit;
A reference portion indicating the position of the crimping tool as seen from the film-like substrate holding unit attached to the unit attachment portion;
A jig for adjusting a film-like substrate holding unit, comprising: a substrate set portion capable of setting a film-like substrate or a simulated substrate imitating the film-like substrate at a predetermined position based on the reference portion.   The jig for adjusting a film-like substrate holding unit according to claim 1, further comprising a restricting portion for restricting a moving range of the suction portion of the film-like substrate holding unit attached to the unit attaching portion.   3. The adjustment jig for a film-like substrate holding unit according to claim 1, wherein the reference portion is formed by a line formed in the substrate set portion or a reference member provided in the substrate set portion.   The adjustment of the film-like substrate holding unit according to any one of claims 1 to 3, further comprising a base for fixing the unit mounting portion, wherein the substrate set portion is detachably mounted to the base. Jig.   The adjustment of the film-like substrate holding unit according to any one of claims 1 to 3, further comprising: a base portion that fixes the unit mounting portion, wherein the substrate setting portion is slidably mounted to the base portion. Jig.

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