CN104051290B - Engagement device and film-form substrate holding unit - Google Patents
Engagement device and film-form substrate holding unit Download PDFInfo
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- CN104051290B CN104051290B CN201310741059.1A CN201310741059A CN104051290B CN 104051290 B CN104051290 B CN 104051290B CN 201310741059 A CN201310741059 A CN 201310741059A CN 104051290 B CN104051290 B CN 104051290B
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- film
- form substrate
- holding unit
- base portion
- substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/78981—Apparatus chuck
- H01L2224/78982—Shape
Abstract
The present invention provides a kind of engagement device of the situation of the alteration of form for the film-form substrate that can simply and rapidly tackle the object being crimped on substrate.The engagement device of the present invention possesses：Crimp head（13）, it possesses film-form substrate（3）External connection terminal group（3a）It is crimped on substrate（2）On crimping tool（23）And make crimping tool（23）The crimping tool elevating mechanism of lifting（22）；Film-form substrate holding unit（26）, it is in outside terminal for connecting group（3a）Positioned at crimping tool（23）Lower section in the state of keep film-form substrate（3）.Film-form substrate holding unit（26）Possess it is multiple configuration with film-form substrate（3）The corresponding position of shape adsorption section（54、65）, and disassembly ease be installed on crimp head（13）.
Description
Technical field
The present invention relates to will be crimped in marginal portion formed with external connection with the film-form substrate of terminal group on substrate
Engagement device and the film-form substrate holding unit that is used in the engagement device.
Background technology
At present, as will be crimped in marginal portion formed with external connection with the film-form substrate of terminal group on substrate
Engagement device, it is known to possess the composition by crimping tool and the crimp head for keeping the adsorption section of film-form substrate to be wholely set.
In the engagement device, the line part formed with external connection terminal group is adsorbed by crimping tool, passes through multiple adsorption sections
Adsorb from the part of marginal portion extension to keep film-form substrate.Because multiple adsorption sections are configured in the shape with film-form substrate
The corresponding position of shape, even so the film-form substrate of complicated shape also can be adsorbed reliably（For example, patent document
1）.
Patent document 1：（Japan）JP 2000-77898 publications
But in the engagement device that patent document 1 is recorded, matching is crimped on the film-form substrate of the object on substrate
Shape and prepared special crimp head.Therefore, whole crimp head must just be changed whenever the alteration of form of film-form substrate.
In addition, the replacement operation of crimp head needs multiple processes such as the adjustment of the depth of parallelism and the position adjustment of adsorption section, existing to make
The problem of work long hours of engagement device stop.
The content of the invention
Therefore, it is an object of the invention to provide a kind of the thin of object that can simply and rapidly tackle and be crimped on substrate
The engagement device of the situation of the alteration of form of membranaceous substrate.
In addition, it is an object of the invention to provide it is a kind of can film-form substrate corresponding with variously-shaped film-form substrate
Holding unit.
The engagement device of the present invention will be crimped in marginal portion formed with external connection with the film-form substrate of terminal group
On substrate, wherein, possess：Crimp head, it has is crimped on institute by the external connection of the film-form substrate with terminal group
State the crimping tool on substrate and make the crimping tool lowering or hoisting gear of the crimping tool lifting；Film-form substrate holding unit,
It keeps the film-form substrate in the state of the external connection is located at the lower section of the crimping tool with terminal group, described
Film-form substrate holding unit possesses multiple configurations in the adsorption section of position corresponding with the shape of the film-form substrate, and tears open
Dress is arranged on the crimp head freely.
In addition, the present invention film-form substrate holding unit, possess by marginal portion formed with external connection end
The film-form substrate of subgroup is crimped in the engagement device of the crimp head on substrate, keeps the film-form substrate, wherein, tool
It is standby：Base portion, it is arranged on the installation portion that the crimp head possesses；Multiple arms, one end is located at the base portion by it, another
One end has an adsorption section for adsorbing the film-form substrate, the multiple arm it is at least one, its described one end passes through axle
Part is rotatably installed relative to the base portion, in the joint portion between the one end and described the other end
Bend freely.
In the present invention, crimp head is set and possesses configuration in the multiple of position corresponding with the shape of film-form substrate
The film-form substrate holding unit of adsorption section, film-form substrate holding unit disassembly ease is arranged in crimp head, therefore,
In the case of the alteration of form of the film-form substrate for the object being crimped on substrate, only crimp head installation with change after it is thin
Film-form holding unit corresponding to the shape of membranaceous substrate can just tackle simply and rapidly.
In addition, in the present invention, it is at least one relative to pedestal in multiple arms that film-form substrate holding unit possesses
Portion rotates and bent freely freely, can make to rotate freely relative to the base portion and bend the absorption of arm freely in joint portion
Portion is mobile to optional position and makes the position of multiple adsorption sections corresponding to the shape of film-form substrate, therefore, even in being crimped on
Also film-form substrate holding unit can be equally used in the case of the alteration of form of the film-form substrate of object on substrate.
Brief description of the drawings
Fig. 1 is the major part side view of the engagement device in an embodiment of the present invention；
Fig. 2 is to represent crimp head and film-form substrate holding unit that the engagement device in an embodiment of the present invention possesses
Stereogram；
Fig. 3 is to represent that the exploded of crimp head and film-form substrate holding unit in an embodiment of the present invention is three-dimensional
Figure；
Fig. 4（a）、（b）It is the side for representing crimp head and film-form substrate holding unit in an embodiment of the present invention
Figure；
Fig. 5 is the stereogram of the film-form substrate holding unit in an embodiment of the present invention；
Fig. 6 is the part section front elevation of the film-form substrate holding unit in an embodiment of the present invention；
Fig. 7（a）、（b）、（c）It is the free arm that the film-form substrate holding unit in an embodiment of the present invention possesses
Fragmentary cross-sectional view；
Fig. 8 is the fragmentary cross-sectional view for the free arm that the film-form substrate holding unit in an embodiment of the present invention possesses；
Fig. 9（a）、（b）、（c）、（d）It is the plan of the film-form substrate holding unit in an embodiment of the present invention；
Figure 10 is the block diagram for the control system for representing the engagement device in an embodiment of the present invention；
Figure 11（a）、（b）It is that film-form substrate is crimped on base by explanation by the engagement device in an embodiment of the present invention
The figure of order on plate；
Figure 12（a）、（b）It is that film-form substrate is crimped on base by explanation by the engagement device in an embodiment of the present invention
The figure of order on plate.
Description of symbols
1：Engagement device
2：Substrate
3：Film-form substrate
3a：External connection terminal group
13：Crimp head
22：Crimping tool elevating mechanism（Crimping tool lowering or hoisting gear）
23：Crimping tool
24：Installation portion lift cylinders（Installation portion lowering or hoisting gear）
25：Installation portion
26：Film-form substrate holding unit
32b：Inhalation port
33：Alignment pin（Guide portion）
41：Base portion
41a：Opening（Suction opening）
42：Fixed arm（Arm）
43：Free arm（Arm）
54：Adsorption section
65：Adsorption section
63：First axle part（Axle portion part）
64：Second shaft section（Joint portion）
81：First inside attraction road（Internal attraction road）
82：Second inside attraction road（Internal attraction road）
Embodiment
Hereinafter, embodiments of the present invention are illustrated referring to the drawings.Engagement device 1 shown in Fig. 1 is that will be formed in
The external connection of the marginal portion of film-form substrate 3 is crimped on the film-form substrate quilt located at the end of substrate 2 with terminal group 3a
Pressure contact portion 2a device, it possesses：Substrate holder 11, it keeps substrate 2；Trunk desk 12, it is located at substrate holder 11
Fore-and-aft direction（Fig. 1 paper left and right directions.It is set to Y direction）Rear, from film-form substrate supply unit (not shown) supply
The film-form substrate 3 given is crimped on before substrate 2 temporarily mounting film-form substrate 3；Crimp head 13, its interior direction movement along the horizontal plane
Freely the film-form substrate 3 of trunk desk 12 is placed in located at substrate holder 11 and the upper area of trunk desk 12, absorption simultaneously
It is crimped on the substrate 2 for being held in substrate holder 11；Supporting station 14, it is located between substrate holder 11 and trunk desk 12
Region, the side below supporting substrates 2 when being crimped film-form substrate 3 on a substrate 2 by crimp head 13；Camera 15, its
It is provided adjacent at the rear of supporting station 14, shoots the external connection of the film-form substrate 3 for the state that crimp head 13 is adsorbed from below
With the distinguishing mark near terminal group 3a and it is formed at portion is crimped by the film-form substrate for the substrate 2 that substrate holder 11 is kept
2a distinguishing mark.
In Fig. 1, substrate holder 11 passes through substrate holder travel mechanism 11M interior direction and above-below direction along the horizontal plane
Mobile, trunk desk 12 by relaying table transferring mechanism 12M, move along the horizontal plane by interior direction.Crimp head 13, which has, passes through head moving machine
Head pedestal 21 that structure 13M is moved in the horizontal plane, the crimping tool elevating mechanism 22 located at head pedestal 21, by crimping tool liter
Descending mechanism 22 and relative to head pedestal 21 lift crimping tool 23, be installed on crimping tool 23 rear side installation portion lift
Cylinder 24, by installation portion lift cylinders 24 film-form of installation portion 25 is installed on and the installation portion 25 lifted and disassembly ease
Substrate holding unit 26.
Crimping tool 23 by be installed on crimping tool elevating mechanism 22 piston rod 22a lower ends built with heating heat
The heat block 23a of device, tool body 23b, the tool body maintaining part 23c structures being fixed on tool body 23b on heat block 23a
Into.Tool body 23b is heated to by the heat transfer from heat block 23a to carry out being thermally compressed required temperature.Crimping tool
23 are lifted by the piston rod 22a of crimping tool elevating mechanism 22 expanding-contracting action downwards.
In Fig. 2, Fig. 3 and Fig. 4, installation portion 25 has what is combined with the piston rod 24a of installation portion lift cylinders 24 lower end
Horizontal part 31 and the vertical component effect 32 being extended from the trailing edge of horizontal part 31 to vertical direction.The back side 32R of vertical component effect 32 is added
Work is into vertical and flat.In the left and right directions of vertical component effect 32（The direction orthogonal with Fig. 1 paper）Both ends rearward extend
Provided with a pair of alignment pins 33.
In Fig. 3, Fig. 4 and Fig. 5, film-form substrate holding unit 26 has the back of the body for the vertical component effect 32 for being installed on installation portion 25
The base portion 41 of face 32R sides, in base portion 41, it is used to adsorb the adsorption section for keeping film-form substrate 3 as being provided with front end
Multiple arms, 43 two kinds of arms of fixed arm 42 and free arm are installed.Base portion 41 is by with by the abutting of 51F before flat processing
Portion 51 and it is connected with the lower end of abutting part 51 and in left-right direction（The direction orthogonal with Fig. 1 paper.It is set to X-direction）Prolong
The arm linking part 52 stretched is formed.In the central portion of arm linking part 52, fixed arm 42 is to extension in front of Y-direction, in its leading section
Following side possesses adsorption section 54.In addition, free arm 43 is installed at the both ends of arm linking part 52.Film-form substrate holding unit
26 make the back side 32R of 51F and the vertical component effect 32 of installation portion 25 before abutting part 51 be brought into close contact and be installed.
A pair of notches portion 55 is provided with the left and right ends of the abutting part 51 of base portion 41, abutting part 51 is by making to cut for this pair
The insert of oral area 55 is located at foregoing a pair of alignment pins 33 of the vertical component effect 32 of installation portion 25, so as to the vertical component effect with installation portion 25
32 states abutted are positioned.In this condition, located at installation portion 25 vertical component effect 32 back side 32R sides screwed hole 32a
Alignd with the through hole 56 for penetrating abutting part 51 and setting, so make the threaded portion 57S of the installation bolt 57 of insertion through hole 56
After being threaded into hole 32a, abutting part 51（That is film-form substrate holding unit 26）As being fixed on what installation portion 25 was installed
State（Fig. 4（a）→ Fig. 4（b））.
In Fig. 3, Fig. 5 and Fig. 6, the free arm 43 of film-form substrate holding unit 26 is by the first joining beam 61 and the second joining beam
62 are formed.The one end of first joining beam 61 is connected by the left and right end portions of first axle part 63 and the arm linking part 52 of base portion 41
Knot, the one end of the second joining beam 62 are linked by the other end of the joining beam 61 of second shaft section 64 and first.In the second joining beam 62
The lower surface of the other end be provided with adsorption section 65.
First joining beam 61 of each free arm 43 is rotated freely by first axle part 63 relative to base portion 41, the second joining beam
62 are rotated freely by second shaft section 64 relative to the first joining beam 61.I.e., in the present embodiment, film-form substrate keeps single
Member 26 possesses one end and is located at base portion 41, and the other end has multiple free arms of the adsorption section 65 of adsorbent thin film shape substrate 3
43, each free arm 43 turns into following and formed：One end is rotatably pacified by first axle part 63 relative to base portion 41
Dress, bends freely in the second shaft section 64 as joint portion between one end and the other end.
Fig. 7（a）It is the part of free arm 43（Fig. 6 dotted line D parts）Profile, Fig. 7（b）、（c）It is from Fig. 7（a）To regarding
The profile that V-V is observed.In Fig. 6 and Fig. 7（a）In, the threaded portion 63S in the upper end of first axle part 63 has screwed up nut
63N, operator in the state of nut 63N is unscrewed by adjusting the first joining beam 61 relative to base portion 41（Arm linking part 52）
Posture, clamp nut 63N by the first joining beam 61 so as to being fixed on base portion 41 afterwards.In addition, in Fig. 6 and Fig. 6 dotted lines E
Partial fragmentary cross-sectional view is in Fig. 8, and the threaded portion 64S in the upper end of second shaft section 64 has screwed up nut 64N, and operator is led to
Cross in the state of nut 64N is unscrewed and adjust posture of second joining beam 62 relative to the first joining beam 61, afterwards clamp nut 64N
And the second joining beam 62 can be fixed on the first joining beam 61.
In Fig. 1, vacuum source 70 is provided with the outside of engagement device 1, the vacuum source 70 crimps via pipeline 71 with being located at
Pipeline in crimping tool in instrument 23（It is not shown）And the pipeline in the installation portion of the inside of installation portion 25（It is not shown）Phase
Even.Pipeline has in tool body 23b lower end in crimping tool adsorbs opening 23d, and pipeline possesses in installation portion in installation portion
Two inhalation port 32b of the back side 32R side openings of 25 vertical component effect 32（Fig. 3）.
In Fig. 5 and Fig. 6, installed in the base portion 41 of film-form substrate holding unit 26 provided with two in base portion 41
The opening 41a being connected in the state of installation portion 25 with above-mentioned two inhalation port 32b.Supplied from vacuum source 70 to crimping tool
The control and supply of 23 absorption opening 23d vacuum pressure to two inhalation port 32b of installation portion 25 vacuum pressure
Control the air-pressure controlling portion 72 by being clipped on pipeline 71（Fig. 1）Carry out.
In figure 6, the first base being connected with an opening 41a is provided with the base portion 41 of film-form substrate holding unit 26
Attraction road 82a in attraction road 81a and the second base portion being connected with another opening 41a in portions.Attraction road in first base portion
81a with attraction road 81b is connected in the fixed arm of extension in the fixed arm 42, in the second base portion attraction road 82a with each freedom
Attraction road 82b is connected in the free arm of extension in arm 43.Moreover, the attraction road in the adsorption section 54 of fixed arm 42 and fixed arm
81b is connected, and is connected located at the adsorption section 65 of free arm 43 with attraction road 82b in the free arm extended in the free arm 43.
So, attraction road 81b is formed by located at the one of base portion 41 in attraction road 81a and fixed arm in the first base portion
Opening 41a and the inside attraction road that is connected with being formed at an inhalation port 32b of installation portion 25（Referred to as the first inside attraction road
81）, attraction road 82b is formed by located at base portion 41 in the free arm of attraction road 82a and each free arm 43 in the second base portion
Another opening 41a and the inside attraction road that is connected with being formed at another inhalation port 32b of installation portion 25（Inside referred to as second
Attraction road 82）.
I.e., in embodiments, base portion 41 has the opening being connected with being formed at the inhalation port 32b of installation portion 25
41a, it is provided with base portion 41 and free arm 43 from opening 41a and adsorption section（Adsorption section 54 and adsorption section 63）The inside of connection
Attraction road（First inside attraction road 81 and the second inside attraction road 82）.
In figure 6, attraction road 82b includes the first axle in first axle part 63 in the free arm in each free arm 43
Access 83 and the access 84 in the second shaft section in second shaft section 64 in part（Also referring to Fig. 7（a）And Fig. 8）.
Such as Fig. 7（a）It is shown, in first axle part access 83 by axially extended in first axle part 63 axial passageway 83a, with
Axial passageway 83a lower end connection and the bottom insertion road for penetrating first axle part 63 along direction orthogonal to the axial direction and extending
83b, the top for being connected with axial passageway 83a upper end and penetrating first axle part 63 along direction orthogonal to the axial direction and extending are passed through
Path 83c and the groove 83d structures for connecting with top insertion road 83c both ends open and being formed around the outer surface of first axle part 63
Into.Axial passageway 83a is by making first axle part 63 be located relative to the defined rotation position of base portion 41, so as under
Portion insertion road 83b connects with attraction road 82a in the second base portion extended in the arm linking part 52 of base portion 41, the opposing party
Face, connected by top insertion road 83c and groove 83d with attraction road 82b in the free arm extended in the first joining beam 61（Fig. 7（a）
And Fig. 7（b））.
As shown in figure 8, access 84 is by the axial passageway that is axially extended in second shaft section 64 in second shaft section
84a, connect with axial passageway 84a upper end and penetrated along the top that direction insertion second shaft section 64 orthogonal to the axial direction extends
Road 84b, the upper slot 84c for connecting with top insertion road 84b both ends open and being formed around the outer surface of second shaft section 64, with
Axial passageway 84a lower end connection and the bottom insertion road 84d extended along direction insertion second shaft section 64 orthogonal to the axial direction
And the lower channel 84e for connecting with bottom insertion road 84d both ends open and being formed around the outer surface of second shaft section 64 is formed.
Axial passageway 84a by top insertion road 84b and upper slot 84c and with the attraction road in the free arm of extension in the first joining beam 61
82b is connected, on the other hand, by bottom insertion road 84d and lower channel 84e and with the second joining beam 62 in the free arm of extension
Attraction road 82b is connected.
So, it is formed in the free arm in the second base portion in base portion 41 in attraction road 82a and the first joining beam 61
Attraction road 82b is connected by access 83 in first axle part, attraction road 82b and second in the free arm in the first joining beam 61
Attraction road 82b is connected by access in second shaft section 84 in free arm in bar 62, such as Fig. 7（c）It is shown, according to first axle
Part 63 makes attraction road 82a in the second base portion not connected with bottom insertion road 83b relative to the rotation position of base portion 41,
Therefore, attraction road 82b is not connected in attraction road 82a and free arm in the second base portion.Therefore, by making the phase of first axle part 63
For base portion 41（Specifically it is arm linking part 52）Positioned at defined rotation position, the second inside attraction road can be blocked
82。
As described above, operator is fixed on first by the way that the first joining beam 61 is fixed on into base portion 41, by the second joining beam 62
Joining beam 61, so as to make to move with to two adsorption sections in certain area located at the adsorption section 65 of the end of each free arm 43
65 carry out desired configure.External connection in the upper surface of the absorption opening 23d adsorbent thin film shapes substrate 3 of crimping tool 23 is used
The marginal portion of terminal group 3a surface, so adsorption section 54 and adsorption section 65 are set as following configuration：Crimping tool 23
Absorption opening 23d absorption external connection terminal group 3a surface marginal portion, in the part of absorption in addition（From
The part of marginal portion extension）When can evenly adsorb and keep film-form substrate 3.
Here, on being not intended to by the free arm 43 of the adsorbent thin film shape substrate 3 of adsorption section 65, as it was previously stated, by making
One axle portion part 63 is located at defined rotation position relative to base portion 41, so as to block the second inside attraction road 82.In addition, not
In the case of wishing the absorption from adsorption section 54, attraction road in the first base portion is blocked from foregoing air-pressure controlling portion 72
81a.Fig. 9（a）And Fig. 9（b）Represent in the case of keeping film-form substrate 3 by adsorption section 54 and two absorption of adsorption section 65
Example, Fig. 9（c）Represent to keep film-form base by two absorption of adsorption section 65 in the state of the absorption without adsorption section 54
The example of the situation of plate 3.In addition, Fig. 9（d）Represent to keep film-form substrate 3 by the absorption of the adsorption section 65 of adsorption section 54 and one
The example of situation.So, in film-form substrate holding unit 26 in the present embodiment, adsorption section can be made（Adsorption section 54
And adsorption section 63）To optional position movement with carry out corresponding to film-form substrate 3 shape configuration.
As described above, operator has carried out making adsorption section（Adsorption section 54 and two adsorption sections 65）With film-form substrate 3
Shape accordingly configuration after, film-form substrate holding unit 26 is arranged on installation portion 25.Kept by film-form substrate
Unit 26 be arranged on installation portion 25 on when, as described above, operator by make located at base portion 41 abutting part 51 left and right
Insert from a pair of rearward extended the back side 32R of the vertical component effect 32 of installation portion 25 contrapositions in a pair of notches portion 55 at both ends
Pin 33, thus allow for positioning of the film-form substrate holding unit 26 relative to installation portion 25.Now, protected in film-form substrate
When holding the base portion 41 of unit 26 and being installed on installation portion 25, a pair of alignment pins 33 guide as by base portion 41 to the side of installation portion 25
Guide portion and work, therefore, operator can easily carry out film-form substrate holding unit 26 to installation portion 25
Installation.In addition, film-form substrate holding unit 26 gropingly can be also arranged on installation portion 25 by operator, therefore, no
With around the rear side for entering crimp head 13, film-form substrate holding unit 26 is can be carried out to installation from the face side of crimp head 13
The installation in portion 25.
So, in the present embodiment, film-form substrate holding unit 26 possess it is multiple configuration with film-form substrate 3
The adsorption section of position corresponding to shape（Adsorption section 54 and adsorption section 65）, and disassembly ease be installed on crimp head 13.Crimping
First 13 are provided with installation portion 25, and film-form substrate holding unit 26 is installed on the base portion 41 of installation portion 25 with possessing disassembly ease
And there are the multiple of adsorption section 65 located at base portion 41 and in tip（It is two herein）Free arm 43.Moreover, installation portion 25 has
It is standby at installation pedestal portion 41 as guide base portion 41 guide portion a pair of alignment pins 33.
The lifting action of crimping tool 23 can be carried out by the action of crimping tool elevating mechanism 22, installation portion 25
（That is film-form substrate holding unit 26）Lifting action can be by being used as the installation portion lift cylinders 24 of installation portion lowering or hoisting gear
Action carry out, but because installation portion lift cylinders 24 lift with the lifting of crimping tool 23, so film-form substrate is protected
The lifting action of unit 26 is held by the lifting action of the crimping tool 23 based on crimping tool elevating mechanism 22 and based on installation
The combination of the lifting of the installation portion 25 of portion's lift cylinders 24 is carried out.
In Fig. 10, by the mobile control of the substrate holder travel mechanism 11M substrate holders 11 carried out, by trunk desk
Travel mechanism 12M carry out trunk desk 12 mobile control, by the head moving mechanism 13M crimp heads 13 carried out mobile control,
The elevating control of the crimping tool 23 carried out by crimping tool elevating mechanism 22, the film-form base carried out by installation portion lift cylinders 24
Plate holding unit 26 relative to crimping tool 23 elevating control, from air-pressure controlling portion 72 carry out to crimping tool 23
Absorption opening 23d and film-form substrate holding unit 26 adsorption section（Adsorption section 54 and adsorption section 65）Vacuum pressure supply
The control device 90 that control and the shooting action control carried out by camera 15 possess by engagement device 1 is carried out.In addition,
Sent by the view data that the shooting action of camera 15 obtains to control device 90, in the Image recognizing section of control device 90
Image recognition is carried out in 90a.
From via substrate holder 11 keep substrate 2 and by film-form substrate 3 be placed in trunk desk 12 state will
In the case that film-form substrate 3 crimps on a substrate 2, control device 90 carry out head moving mechanism 13M action control first and
Crimp head 13 is moved, makes absorption opening 23d and the adsorption section of film-form substrate holding unit 26 of crimping tool 23（Adsorption section
54 and adsorption section 65）It is located at the top of the target affinity position of the relative film-form substrate 3 for being placed in trunk desk 12 respectively（Figure 11
（a））.Then, act installation portion lift cylinders 24, decline film-form substrate holding unit 26（Figure 11（b）Shown in arrow
Mark A）, make the adsorption section of film-form substrate holding unit 26（Adsorption section 54 and adsorption section 65）With the upper table of film-form substrate 3
Face contacts.Then, the control in air-pressure controlling portion 72, adsorbent thin film shape substrate 3 are carried out（Figure 11（b））.
After adsorbent thin film shape substrate 3, control device 90 acts installation portion lift cylinders 24 so that film-form substrate is protected
Hold unit 26 to rise, make film-form substrate 3 and crimping tool 23（Specifically it is tool body 23b）Lower end in contact.Then,
The control in air-pressure controlling portion 72 is carried out, in the upper surface of the absorption opening 23d adsorbent thin film shapes substrate 3 of crimping tool 23
The marginal portion of external connection terminal group 3a surface.Thus, film-form substrate 3 by film-form substrate holding unit 26 and
After the absorption of crimping tool 23 is kept, head moving mechanism 13M action control is carried out, crimp head 13 is moved, makes the thin of absorption
The external connection of the lower surface of membranaceous substrate 3 terminal group 3a is located in the state of the top of camera 15, carries out being based on camera
15 external connection terminal group 3a shooting（Figure 12（a））.Control device 90 obtained by the shooting of camera 15
The image recognition of view data after grasping external connection terminal group 3a position, move crimp head 13, make film-form
The film-form substrate that the external connection of substrate 3 is located at substrate 2 with terminal group 3a is crimped portion 2a top.Then, crimping work is made
Tool elevating mechanism 22 is acted so that crimping tool 23 declines（Figure 12（b）Shown in arrow mark B.Film-form substrate keeps single
Member 26 together declines with crimping tool 23）, the external connection of film-form substrate 3 is pressed against to the film of substrate 2 with terminal group 3a
Shape substrate is crimped on portion 2a.Thus, film-form substrate 3 is crimped on a substrate 2（Figure 12（b））.
It is as described above, possess in engagement device 1 in the present embodiment crimp head 13, have it is multiple configuration with it is thin
The adsorption section of position corresponding to the shape of membranaceous substrate 3（Adsorption section 54 and adsorption section 65）Film-form substrate holding unit 26,
Film-form substrate holding unit 26 is dismantled and assembled to be arranged in crimp head 13 freely.Therefore, object on a substrate 2 is being crimped
In the case of the alteration of form of film-form substrate 3, only installed in crimp head 13 corresponding with the shape of the film-form substrate 3 after change
Film-form substrate holding unit 26 just can simply and rapidly tackle.
In addition, the film-form substrate holding unit 26 in present embodiment can be by the position of its adsorption section 65 by free arm 43
Put and adjust to position corresponding with the shape of film-form substrate 3, but also can use only to have and be located at adsorption section 65 and film
The film-form substrate holding unit 26 of fixed arm 42 made of the mode of position corresponding to the shape of shape substrate 3.
If in addition, make the installation portion lowering or hoisting gear that installation portion 25 lifts installed in can be moved in the same manner as crimp head 13
Then be not necessarily mounted on device crimping tool 23 and with crimping tool 23 while the part of lifting, but embodiment described above that
Sample, if installation portion lowering or hoisting gear（Installation portion lift cylinders 24）Together lifted installed in crimping tool 23 and with crimping tool 23
Part, then installation portion lowering or hoisting gear need not be controlled synchronous with the lifting of crimping tool 23, therefore preferably.It is in addition, described above
Embodiment is such, if installation portion lowering or hoisting gear by crimping tool elevating mechanism 22 with crimping tool 23 together to be lifted
Mode be configured, then the lifting travel for the installation portion 25 that installation portion lowering or hoisting gear itself is carried out is shorter, so can
Make installation portion lowering or hoisting gear, the even integral miniaturization of crimp head 13.
In addition, as explained above ground, in engagement device 1 in the present embodiment, keeping the film of film-form substrate 3
It is at least one in multiple arms that film-form substrate holding unit 26 possesses in shape substrate holding unit 26（Two free arms 43）
Rotate relative to base portion 41 and bend freely freely, the adsorption section of the free arm 43 can be made（Adsorption section 65）To optional position
It is mobile to exercise multiple adsorption sections to enter（Adsorption section 54 and adsorption section 65）Position corresponding with the shape of film-form substrate 3 match somebody with somebody
Put.Therefore, can equally be used in the case of the alteration of form of the film-form substrate 3 of the object even in crimping on a substrate 2
Film-form substrate holding unit 26.In addition, fixed arm 42 is one in the present embodiment, free arm 43 is two, but solid
In the case that fixed arm 42 is at least one, free arm 43 is at least one, in the case of no fixed arm 42, free arm
43 at least two.
In addition, in the above-described embodiment, the base portion 41 of film-form substrate holding unit 26（I.e. film-form substrate is protected
Hold unit 26）Disassembly ease it is installed on the part lifted by crimp head 13（Specifically installation portion 25）It is but if thin
Membranaceous substrate holding unit 26 is installed on and need not be then installed in crimp head 13 on the part lifted by crimp head 13.In addition,
In the above-described embodiment, film-form substrate holding unit 26 turns into crimp head 13（Specifically installation portion 25）On tear open
The structure of dress freely, but this is not essential, and can also be fixed relative to crimp head 13.But if film-form substrate holding unit
26 it is dismantled and assembled be arranged on freely in crimp head 13, then even in crimping object on a substrate 2 film-form substrate 3 shape
In the case of change, film-form substrate corresponding with the shape of the film-form substrate 3 after change only is installed in crimp head 13 and kept
Unit 26 can just tackle simply and rapidly, therefore preferably.
Industrial utilizability
The present invention provides a kind of shape for the film-form substrate that can simply and rapidly tackle the object being crimped on substrate
The engagement device for the situation that shape changes.
In addition, the present invention provides a kind of film-form substrate holding unit for corresponding to variously-shaped film-form substrate.
Claims (7)
1. a kind of engagement device, substrate will be crimped on the film-form substrate of terminal group formed with external connection in marginal portion
On, it is characterised in that possess：
Crimp head, it has crimping of the external connection of the film-form substrate with terminal group crimping on the substrate
Instrument and the crimping tool lowering or hoisting gear for making the crimping tool lifting；
Film-form substrate holding unit, it is located in the external connection with terminal group in the state of the lower section of the crimping tool
The film-form substrate is kept,
The film-form substrate holding unit possesses suction of multiple configurations in position corresponding with the shape of the film-form substrate
Attached portion, and disassembly ease be arranged on the crimp head,
Installation portion is provided with the crimp head, the film-form substrate holding unit is installed on the installation with possessing disassembly ease
The base portion in portion and multiple arms located at the base portion and in front end with the adsorption section.
2. engagement device as claimed in claim 1, it is characterised in that
The installation portion possesses the guide portion that the base portion is guided when installing the base portion.
3. engagement device as claimed in claim 1 or 2, it is characterised in that
The crimp head possesses the installation portion lowering or hoisting gear for making the installation portion lifting.
4. engagement device as claimed in claim 1 or 2, it is characterised in that
The crimp head possesses the installation portion lowering or hoisting gear for making the installation portion lifting, and the installation portion lowering or hoisting gear passes through described
Crimping tool lowering or hoisting gear together lifts with the crimping tool.
5. a kind of film-form substrate holding unit, possessing in film-form of the marginal portion formed with external connection terminal group
Substrate is crimped in the engagement device of the crimp head on substrate, keeps the film-form substrate, it is characterised in that possess：
Base portion, it is arranged on the crimp head possessed installation portion；
Multiple arms, one end is located at the base portion by it, has the adsorption section for adsorbing the film-form substrate in the other end,
The multiple arm it is at least one, its described one end is rotatably pacified by axle portion part relative to the base portion
Dress, bends freely in the joint portion between the one end and described the other end, and the base portion has with being formed at
The suction opening of the inhalation port connection of the installation portion, is provided with from the suction opening and institute in the base portion and the arm
State the inside attraction road of adsorption section connection.
6. film-form substrate holding unit as claimed in claim 5, it is characterised in that
, can will be relative to the base portion by making the axle portion part be located at defined rotation position relative to the base portion
The internal attraction road for rotating freely and the arm freely being bent in the joint portion is blocked.
7. the film-form substrate holding unit as described in claim 5 or 6, it is characterised in that
It is installed on the crimp head to the base portion disassembly ease.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-048609 | 2013-03-12 | ||
| JP2013048609A JP6023984B2 (en) | 2013-03-12 | 2013-03-12 | Bonding equipment |
| JP2013048610A JP5974304B2 (en) | 2013-03-12 | 2013-03-12 | Film substrate holding unit |
| JP2013-048610 | 2013-03-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104051290A CN104051290A (en) | 2014-09-17 |
| CN104051290B true CN104051290B (en) | 2018-03-09 |
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ID=51503970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310741059.1A Active CN104051290B (en) | 2013-03-12 | 2013-12-27 | Engagement device and film-form substrate holding unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104051290B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6467622B2 (en) * | 2014-10-20 | 2019-02-13 | パナソニックＩｐマネジメント株式会社 | Component crimping device |
| CN110544655B (en) * | 2019-09-03 | 2021-09-14 | 云谷（固安）科技有限公司 | Binding device and binding method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6311966B1 (en) * | 1998-10-19 | 2001-11-06 | Akio Morishito | Workpiece absorption carrier unit and absorption head |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0752112Y2 (en) * | 1991-12-24 | 1995-11-29 | セントラル硝子株式会社 | Glass plate transfer device |
| JP4060455B2 (en) * | 1998-09-01 | 2008-03-12 | 芝浦メカトロニクス株式会社 | Component mounting equipment |
| JP5587638B2 (en) * | 2010-03-04 | 2014-09-10 | 株式会社石亀工業 | Universal chuck |
-
2013
- 2013-12-27 CN CN201310741059.1A patent/CN104051290B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6311966B1 (en) * | 1998-10-19 | 2001-11-06 | Akio Morishito | Workpiece absorption carrier unit and absorption head |
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| Publication number | Publication date |
|---|---|
| CN104051290A (en) | 2014-09-17 |
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Effective date of registration: 20151110 Address after: Osaka Japan Applicant after: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT Co.,Ltd. Address before: Osaka Japan Applicant before: Matsushita Electric Industrial Co.,Ltd. |
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