JP2015169492A - Electronic device, signal detection method of electronic device, electronic apparatus and moving body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a gyro sensor as an electronic device that causes reduction in detection error due to an oscillation leakage phenomena and the like, and causes increase in detection accuracy.SOLUTION: A gyro sensor 100 as an electronic device comprises: a base substrate 10 that serves as a first base substrate; a support unit 12 that is connected to the base substrate 10, is oscillatable along a plane surface including a first axis and second axis and has a first electrode; a detection unit 50 that is supported by the support unit 12, is oscillatable along a third axis and has a second electrode; a monitor electrode 56 that is disposed so as to face the first electrode, serving as a third electronode; and a detection fixing electrode 55 that is disposed so as to face the second electrode, serving as a fourth electrode.

Description

  The present invention relates to an electronic device, a signal detection method for the electronic device, an electronic apparatus, and a moving object.

  In recent years, functional elements using, for example, silicon MEMS (Micro Electro Mechanical System) technology have been developed as vibration devices. And the gyro sensor (capacitance type MEMS gyro sensor element) which detects angular velocity using the gyro element as an example of this functional element is indicated. As an example of such a gyro sensor, a vibration system structure that is provided on the XY plane of three axes (X axis, Y axis, Z axis) orthogonal to each other and that vibrates (displaces) in the X axis direction. A body, a substrate that supports the body, a drive unit for the vibration system structure, and a detection unit that detects an angular velocity around the Y axis (see, for example, Patent Document 1).

  The gyro sensor described in Patent Document 1 includes a drive unit including a frame-shaped (frame-shaped) support unit, a spring unit is provided on the outside of the support unit, and a rotating shaft is provided on the support unit on the inside of the support unit. An electrostatic capacitance type MEMS gyro sensor element (hereinafter referred to as “gyro sensor element”) provided with a detection unit connected via the terminal is used. In this gyro sensor element, a drive unit vibrating in the X-axis direction receives an angular velocity around the Y-axis and vibrates in the Z-axis direction, and the detection unit detects a change in capacitance due to the vibration in the Z-axis direction. Angular velocity can be detected.

JP 2012-173055 A

  In the gyro element as described above, the shape of the silicon structure constituting the gyro element, for example, causes a processing error in the shape processing, so that the cross-sectional shape that should originally be a square or a rectangle is formed in a parallelogram, for example. It may be done. Thus, when the cross-sectional shape of the silicon structure is a parallelogram, the drive vibration in the drive unit that vibrates in the X-axis direction generates a component (oblique vibration) that vibrates in the direction perpendicular to the oblique side of the cross section. This oblique vibration in the drive part has a vibration component in the Z-axis direction, so that the drive part drive vibration is transmitted to the detection part, the so-called vibration mole phenomenon, the oblique vibration is transmitted to the detection part, and the detection part is angular velocity. This causes a so-called quadrature phenomenon that vibrates in the Z-axis direction, which is the vibration direction for detecting the vibration. Due to this phenomenon, a signal with a quadrature component is generated, and the detection unit may detect the angular velocity even if no angular velocity is generated, or an error may occur in the detected angular velocity. . That is, the angular velocity detection accuracy may be reduced.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 In an electronic device according to this application example, two axes orthogonal to each other are defined as a first axis and a second axis, and an axis parallel to a normal line of the surface including the first axis and the second axis Is a third axis, a first base, a support connected to the first base, capable of vibrating along a plane including the first axis and the second axis, and having a first electrode; A detection unit supported by the support unit and capable of vibrating along the third axis, having a second electrode, a third electrode arranged to face the first electrode, and the second And a fourth electrode disposed so as to face the electrode.

  According to this application example, an original detection signal and an oblique vibration component (hereinafter referred to as a “quadrature component”) output from at least one of the second electrode of the detection unit and the fourth electrode facing the second electrode. And a signal including a quadrature component output from at least one of the first electrode provided on the support portion and the third electrode opposed thereto. An original detection signal from which the quadrature component has been removed can be obtained by performing arithmetic processing on these two signals. Thereby, an electronic device with improved detection accuracy can be obtained.

  Application Example 2 In the electronic device according to the application example described above, it is preferable that at least one of the third electrode and the fourth electrode is provided on the first base.

  According to this application example, at least one of the third electrode and the fourth electrode is provided on the first base body that connects the support portion, whereby the third electrode and the second electrode in a plan view as viewed from the third axial direction. The arrangement area of the four electrodes can be reduced, and the electronic device can be reduced in size.

  Application Example 3 In the electronic device according to the application example described above, the electronic device includes a second substrate connected to the first substrate, and at least one of the third electrode and the fourth electrode is provided on the second substrate. It is preferable that

  According to this application example, at least one of the third electrode and the fourth electrode is provided on the second base connected to the first base, so that the third electrode in a plan view as viewed from the third axial direction. And it becomes possible to make the arrangement | positioning area | region of a 4th electrode small, and size reduction of an electronic device is realizable.

  Application Example 4 In the electronic device according to the application example described above, it is preferable that the support portion is provided in a frame shape that substantially surrounds the detection portion in a plan view as viewed from the third axis direction.

  According to this application example, by providing the support portion in a frame shape that substantially surrounds the detection portion, the area of the third electrode provided therein can be increased, and the third electrode and the first electrode facing each other can be obtained. More signals can be generated. As a result, the amount of data used for the arithmetic processing increases, and the correction accuracy can be increased.

  Application Example 5 In the electronic device according to the application example described above, it is preferable that a drive resonance frequency for vibrating the support unit is higher than a resonance frequency of the detection unit.

  According to this application example, by making the resonance frequency of the detection unit higher than the drive resonance frequency (decreasing the detuning frequency), the vibration directions of the support unit and the detection unit are reversed. As a result, the current flowing out from at least one of the first electrode and the third electrode is reversed in polarity from the current flowing out from at least one of the second electrode and the fourth electrode. Then, the area and interval (gap) of each electrode are adjusted in consideration of the resonance magnification so that the absolute values of the two currents are equal, and the capacitance change by the first electrode and the third electrode, The capacitance change by the second electrode and the fourth electrode is adjusted. By doing so, it is possible to obtain an original detection signal from which the quadrature component is removed without performing the arithmetic processing by using the third electrode and the fourth electrode as the same electrode.

  Application Example 6 In the electronic device according to the application example described above, the first signal output from at least one of the first electrode and the third electrode, and the output from at least one of the second electrode and the fourth electrode. It is preferable to include an arithmetic processing unit that performs arithmetic processing based on the first signal and the second signal and outputs a third signal based on the arithmetic result.

  According to this application example, the first signal including the original detection signal and the quadrature component output from at least one of the second electrode of the detection unit and the fourth electrode facing the second electrode, and the support unit is provided. A second signal including a quadrature component output from at least one of the second electrode and the fourth electrode facing the second electrode can be obtained. And the 3rd signal which performed the process which subtracts the 2nd signal from the 1st signal by the arithmetic processing part is output. With this third signal, an original detection signal from which the quadrature component has been removed can be obtained, and an electronic device with improved detection accuracy can be obtained.

  Application Example 7 In the electronic device according to the application example, it is preferable that the arithmetic processing unit includes an adjustment unit that adjusts an amplitude of at least one of the first signal and the second signal.

  According to this application example, the adjustment unit included in the arithmetic processing unit adjusts (amplifies) the amplitude of at least one of the first signal and the second signal having different amplitudes, and matches the amplitudes of both signals. An original detection signal from which the quadrature component has been removed can be obtained by adding the first signal and the second signal having the same amplitude.

  Application Example 8 In an electronic device according to this application example, two axes orthogonal to each other are defined as a first axis and a second axis, and an axis parallel to a normal line of a plane including the first axis and the second axis Is the third axis, is connected to the first base, and can be vibrated along the first axis, and is supported by the support having the first electrode, A detector that can vibrate along the second axis, has a second electrode, a third electrode that is arranged to face the first electrode, and a face that faces the second electrode. And a fourth electrode.

  According to this application example, the signal including the original detection signal of the vibration along the second axis and the quadrature component output from at least one of the second electrode of the detection unit and the fourth electrode opposed thereto, and the support It is possible to obtain a signal including a quadrature component output from at least one of the first electrode provided in the section and the third electrode facing the first electrode. An original detection signal from which the quadrature component has been removed can be obtained by performing arithmetic processing on these two signals. Thereby, an electronic device with improved detection accuracy can be obtained.

  [Application Example 9] In the signal detection method for an electronic device according to this application example, two axes orthogonal to each other are defined as a first axis and a second axis, and a normal of a plane including the first axis and the second axis When the third axis is an axis parallel to the first axis, the first axis and the second axis can be vibrated along a plane, and a support section having a first electrode is supported by the support section, A detector that can vibrate along the third axis, has a second electrode, a third electrode that is arranged to face the first electrode, and a face that faces the second electrode. And a fourth electrode, wherein the vibration component in the third axial direction of the support portion is output from at least one of the first electrode and the third electrode. A first step of obtaining a first signal that is, the second electrode and the first signal A second step of acquiring a second signal output from at least one of the electrodes; a third step of performing a calculation process for removing a signal corresponding to the first signal from the second signal and outputting a detection signal; It is characterized by providing.

  According to this application example, in the first step, a first signal including a quadrature component output from at least one of the first electrode provided on the support portion and the third electrode facing the first electrode is acquired. In the second step, a second signal including an original detection signal and a quadrature component (diagonal vibration component) output from at least one of the second electrode of the detection unit and the fourth electrode facing the second electrode is acquired. . Then, in the third step, a calculation process for removing a signal corresponding to the first signal (a signal that is a vibration component in the third axis direction of the support portion) from the second signal is performed and output as a detection signal. As a result, the original detection signal from which the quadrature component has been removed can be obtained. Thereby, an electronic device with improved detection accuracy can be obtained.

  [Application Example 10] In the signal detection method for an electronic device according to this application example, two axes orthogonal to each other are defined as a first axis and a second axis, and a normal of a plane including the first axis and the second axis When the third axis is an axis parallel to the first axis, vibration is possible along the first axis, the support part having the first electrode, and the vibration supported along the second axis, supported by the support part. A detection unit having a second electrode, a third electrode disposed to face the first electrode, and a fourth electrode disposed to face the second electrode. A signal detection method for an electronic device comprising: a first signal that is output from at least one of the first electrode and the third electrode and that is a vibration component in the third axial direction of the support portion. The first step and at least one of the second electrode and the fourth electrode. A second step of acquiring a second signal to be output; and a third step of performing a calculation process for removing a signal corresponding to the first signal from the second signal and outputting a detection signal. It is characterized by that.

  According to this application example, in the first step, a first signal including a quadrature component output from at least one of the first electrode provided on the support portion and the third electrode facing the first electrode is acquired. In the second step, a second signal including an original detection signal and a quadrature component (diagonal vibration component) output from at least one of the second electrode of the detection unit and the fourth electrode facing the second electrode is acquired. . Then, in the third step, a calculation process for removing a signal corresponding to the first signal (a signal that is a vibration component in the third axis direction of the support portion) from the second signal is performed and output as a detection signal. As a result, the original detection signal from which the quadrature component has been removed can be obtained. Thereby, an electronic device with improved detection accuracy can be obtained.

  Application Example 11 An electronic apparatus according to this application example includes the electronic device according to any one of the application examples described above.

  According to this application example, an electronic device with higher detection accuracy is obtained by obtaining an original detection signal from which a quadrature component (oblique vibration component) has been removed. Can do.

  Application Example 12 A moving object according to this application example includes the electronic device according to any one of the application examples described above.

  According to this application example, since an electronic device with improved detection accuracy is obtained by obtaining an original detection signal from which a quadrature component (diagonal vibration component) has been removed, a moving body with more stable characteristics can be provided. Can do.

The top view which shows typically the gyro sensor which concerns on 1st Embodiment. Sectional drawing which shows typically the gyro sensor which concerns on 1st Embodiment. It is a figure explaining operation | movement of the gyro sensor which concerns on 1st Embodiment, (a) is a top view, (b) is sectional drawing. It is a figure explaining operation | movement of the gyro sensor which concerns on 1st Embodiment, (a) is a top view, (b) is sectional drawing. The signal detection method of the gyro sensor which concerns on 1st Embodiment is shown, (a) is sectional drawing which illustrates a signal detection method typically, (b) is a schematic flowchart of a signal detection method. The wave form diagram explaining the modification of a signal processing method. The top view which shows typically the gyro sensor which concerns on 2nd Embodiment. Sectional drawing which shows typically the gyro sensor which concerns on 2nd Embodiment. The top view which shows typically the gyro sensor which concerns on 3rd Embodiment. Sectional drawing which shows typically the gyro sensor which concerns on 3rd Embodiment. FIG. 9 is a schematic plan view for explaining the operation of a gyro sensor according to a third embodiment. FIG. 9 is a schematic plan view for explaining the operation of a gyro sensor according to a third embodiment. Sectional drawing which shows typically the gyro sensor which concerns on 4th Embodiment. The perspective view which shows typically the structure of the mobile personal computer as an example of an electronic device. The perspective view which shows typically the structure of the mobile telephone as an example of an electronic device. The perspective view which shows typically the structure of the digital still camera as an example of an electronic device. The perspective view which shows typically the structure of the motor vehicle as an example of a mobile body.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. The embodiments described below do not unduly limit the contents of the present invention described in the claims. In addition, not all of the configurations described below are essential constituent requirements of the present invention.

1. Gyro sensor 1-1. Configuration of Gyro Sensor According to First Embodiment First, a first embodiment of a gyro sensor as an electronic device according to the present invention will be described with reference to the drawings. FIG. 1 is a plan view schematically showing the gyro sensor 100 according to the first embodiment. 2A and 2B are diagrams schematically showing the gyro sensor 100 according to the first embodiment. FIG. 2A is a cross-sectional view taken along line AA in FIG. 1, and FIG. 2B is a cross-sectional view taken along line BB in FIG. It is sectional drawing. In FIG. 1 and FIG. 2, the X axis (first axis) and the Y axis (second axis), the X axis (first axis), and the Y axis (second axis) are used as three axes orthogonal to each other. A Z axis (third axis) parallel to the normal of the plane to be included is shown.

As shown in FIGS. 1 and 2, the gyro sensor 100 includes a base body 10 as a first base body and a gyro element 5 as a functional element. The gyro element 5 as a functional element includes a vibrating body 20, an elastic support body 30, and a drive unit 40.
The gyro element 5 is accommodated in a cavity 82 surrounded by a base body 10 as a first base body and a lid body 80 as a second base body. The gyro element 5 is provided with a vibrating body 20 through a recess 14 provided in the base 10 and a gap. The vibrating body 20 is supported by the fixing portion 17 provided on the first surface 11 of the base body 10 (on the base body 10) via the elastic support body 30.
In the gyro sensor 100, the detection unit 50 of the vibrating body 20 constituting the gyro element 5 is a gyro sensor element (capacitance MEMS gyro sensor element) that detects an angular velocity around the Y axis.
For convenience, FIG. 1 shows the base body 10 and the lid body 80 in a perspective view. Further, viewing from the normal direction of the first surface 11 (see FIG. 2), which is a base surface on which the vibrating body 20 of the base body 10 is provided, that is, viewing the vibrating body 20 supported by the base body 10 from above. Hereinafter, it is referred to as “plan view”.

The material of the base 10 is, for example, glass or silicon. As shown in FIG. 2, the base 10 has a first surface 11 and a second surface 11 b opposite to the first surface 11. A recess 14 is provided in the first surface 11. Above the recess 14, the vibrating body 20 (the detection unit 50 and the support unit 12), the elastic support 30, and the drive unit 40 (the movable electrode unit for driving 41, and the fixed electrode unit for driving 42) via a gap. ) Is provided. By the recess 14, the vibrating body 20, the elastic support body 30, and a part of the driving unit 40 (the driving movable electrode unit 41) can be moved in a desired direction without being obstructed by the base body 10.
The planar shape (shape when viewed from the Z-axis direction) of the recess 14 of the present embodiment is a rectangle, but is not particularly limited. The recess 14 is formed by, for example, a photolithography technique and an etching technique.

As shown in FIG. 2, the base 10 has a fixing portion 17 that is appropriately provided on the first surface 11 according to the form of the vibrating body 20. The fixing portion 17 is a portion that supports (i.e., joins) one end 15 of the elastic support 30 that supports the vibrating body 20 and supports the vibrating body 20 via the elastic support 30.
As shown in FIGS. 1 and 2, one end 15 (fixed portion 17) of the elastic support body 30 may be disposed so as to sandwich the vibrating body 20 in the X-axis direction. Further, the one end 15 of the elastic support 30 may be arranged so as to sandwich the vibrating body 20 in the Y-axis direction. That is, two or four ends 15 of the elastic support 30 may be provided.

  A method of fixing (joining) the first surface 11 (base 10) of the fixing portion 17 to the elastic support 30 and the driving fixed electrode portion 42, which will be described later, is not particularly limited. Is glass, and the material of the vibrator 20 or the like is silicon, anodic bonding can be applied.

  The vibrating body 20 is supported on the first surface 11 of the base body 10 (on the base body 10) via an elastic support body 30. The vibrating body 20 includes a detection unit 50 and a support unit 12 connected to the detection unit 50. The material of the vibrating body 20 is, for example, silicon imparted with conductivity by doping impurities such as phosphorus and boron. The vibrating body 20 is formed, for example, by processing a silicon substrate (not shown) by a photolithography technique and an etching technique.

  The vibrating body 20 is supported by the fixing portion 17 via the elastic support 30 by the one end 15 of the elastic support 30 and is disposed apart from the base body 10. More specifically, the vibrating body 20 is provided above the recess 14 formed in the base body 10 via a gap. The vibrating body 20 includes, for example, a frame-shaped (frame-shaped) support portion 12. The vibrating body 20 may have a shape that is symmetrical with respect to a center line (not shown) (a straight line along the X axis or a straight line along the Y axis).

  The support portion 12 is provided in a frame shape (frame shape) so as to surround a detection portion 50 described later. An elastic support body 30 to be described later is connected to the support portion 12. As described above, the support portion 12 is given conductivity by doping silicon with an impurity such as phosphorus or boron, and also has a function as a first electrode.

  A monitor electrode 56 as a third electrode is provided so as to face the support portion 12 with a gap and substantially overlap a region where the support portion 12 is arranged in a plan view. Specifically, the monitor electrode 56 has a substantially frame shape (frame shape), like the support portion 12. The monitor electrode 56 as the third electrode is provided on the bottom surface 13 of the recess 14 provided on the first surface 11 of the substrate 10.

  The support unit 12 and the monitor electrode 56 detect vibration in the Z-axis direction (displacement of the support unit 12 in the Z-axis direction) generated in the support unit 12 due to a change in capacitance between the support unit 12 and the monitor electrode 56. be able to. Specifically, when the support unit 12 vibrates in the Z-axis direction with a DC voltage applied to the support unit 12 (first electrode), the distance between the support unit 12 and the monitor electrode 56 changes, and the support unit The electrostatic capacitance between 12 and the monitor electrode 56 changes. By detecting the change in the capacitance as a change in the current of the monitor electrode 56 (third electrode), the vibration of the support portion 12 in the Z-axis direction can be obtained.

  When the support portion 12 is provided in a frame shape substantially surrounding the detection portion 50 in a plan view as viewed from the Z-axis direction, the area of the monitor electrode 56 provided in the frame shape facing the support portion 12 is reduced. It is possible to increase the number of signals that can be obtained from the monitor electrode 56. As a result, the amount of data used for the arithmetic processing increases, and the correction accuracy can be increased.

  The elastic support 30 is configured to be able to displace the vibrating body 20 in the X-axis direction. More specifically, the elastic support body 30 has a shape extending from the one end 15 of the elastic support body 30 to the vibrating body 20 in the direction along the X axis and extending in the X axis direction while reciprocating in the Y axis direction. doing. One end 15 of the elastic support 30 is joined (fixed) to the fixing portion 17 (the first surface 11 of the base body 10). The other end of the elastic support body 30 is connected to the support portion 12 of the vibrating body 20. In the present embodiment, four elastic supports 30 are provided so as to sandwich the vibrating body 20 in the X-axis direction.

  The material of the elastic support 30 is, for example, silicon imparted with conductivity by being doped with impurities such as phosphorus and boron. The elastic support 30 is formed, for example, by integrally processing a silicon substrate (not shown) together with the vibrating body 20 by a photolithography technique and an etching technique.

The detection unit 50 is provided inside the support unit 12 of the vibrating body 20 (on the center side of the vibrating body 20) in plan view. In other words, the detection unit 50 is provided on the opposite side of the support unit 12 from the arrangement side of the drive unit 40 described later.
The detection unit 50 includes a first flap plate 51 and a second flap plate 53 as movable electrodes, a first beam portion 52 connected to the first flap plate 51, and a second beam connected to the second flap plate 53. And a fixed electrode for detection 55 as a fourth electrode. As described above, the first flap plate 51 and the second flap plate 53 are provided with conductivity by doping impurities such as phosphorus and boron into silicon, and also have a function as a second electrode. ing.

  The first flap plate 51 is connected to the first beam portion 52 at a connection portion located at the center portion of the first beam portion 52 in the X-axis direction. The first beam portion 52 is provided along one extending portion of the support portion 12 along the X axis, and extends along the Y axis of the support portion 12 and is opposed to each other. Both ends are connected to the extended portion. The end opposite to the end connected to the first beam portion 52 of the first flap plate 51 is a free end. The first flap plate 51 can swing in the Z-axis direction with the first beam portion 52 as a rotation axis.

The second flap plate 53 is connected to the second beam portion 54 at a connection portion located at the center portion of the second beam portion 54 in the X-axis direction. The second beam portion 54 includes an extension portion of one support portion 12 located on the first beam portion 52 side (+ Y axis direction) and the other side located on the opposite side (−Y axis direction) across the detection portion 50. It is provided along the extending part of the support part 12.
Both ends of the second beam portion 54 are connected to the inside of the two extending portions facing each other along the Y-axis direction of the support portion 12. The end opposite to the end connected to the second beam portion 54 of the second flap plate 53 is a free end. The second flap plate 53 can swing in the Z-axis direction with the second beam portion 54 as a rotation axis. The free ends of the first flap plate 51 and the second flap plate 53 are arranged so as to face the inner side in the Y-axis direction, and are provided so as to face each other with a gap.

  The detection fixed electrode 55 as the fourth electrode is opposed to the first flap plate 51 and the second flap plate 53 with a gap, and the first flap plate 51 and the second flap plate 53 are arranged in a plan view. It is provided so as to substantially overlap the region. The detection fixed electrode 55 is provided on the bottom surface 13 of the recess 14 provided on the first surface 11 of the substrate 10.

The monitor electrode 56 and the detection fixed electrode 55 provided on the bottom surface 13 of the recess 14 of the substrate 10 are formed by forming a transparent electrode material such as ITO (indium tin oxide) or ZnO (zinc oxide) by sputtering or the like. Then, it is formed by patterning by a photolithography method, an etching method or the like. The monitor electrode 56 and the detection fixed electrode 55 are not limited to transparent electrode materials, but are gold (Au), gold alloy, platinum (Pt), aluminum (Al), aluminum alloy, silver (Ag), silver alloy, Chromium (Cr), chromium alloy, copper (Cu), molybdenum (Mo), niobium (Nb), tungsten (W), iron (Fe), titanium (Ti), cobalt (Co), zinc (Zn), zirconium ( A metal material such as Zr) can be used. In addition, when the substrate 10 is a semiconductor material such as silicon, it is preferable that an insulating layer is provided between the detection fixed electrode 55 or the monitor electrode 56. As the insulating layer, for example, SiO ₂ (silicon oxide), AlN (aluminum nitride), SiN (silicon nitride), or the like can be used.

  The detection unit 50 detects the vibration in the Z-axis direction generated in the vibrating body 20 (the first flap plate 51 and the second flap plate 53) by the capacitance change when the gyro element 5 receives an angular velocity centered on the Y axis. The angular velocity can be calculated. Specifically, the first flap plate 51 and the second flap plate 53 vibrate in the Z-axis direction (swing) in a state where a DC voltage is applied to the first flap plate 51 and the second flap plate 53 (second electrode). Then, the distance between the first flap plate 51 and the second flap plate 53 and the detection fixed electrode 55 is changed, and the static between the first flap plate 51 and the second flap plate 53 and the detection fixed electrode 55 is changed. The capacitance changes. The angular velocity can be obtained by detecting the capacitance change as a current change of the detection fixed electrode 55 (fourth electrode). This operation will be described in detail later.

  The drive unit 40 has a mechanism that can excite the vibrating body 20. Note that the configuration and number of the drive units 40 are not particularly limited as long as the vibrator 20 can be excited. For example, the drive unit 40 may be provided directly on the vibrating body 20. As shown in FIG. 1, the driving unit 40 includes a driving movable electrode unit 41 connected to the outer side of the vibrating body 20 (supporting unit 12) in the Y-axis direction, a driving movable electrode unit 41 and a predetermined amount on the base 10. The fixed electrode portion 42 for driving is arranged to face each other with a distance. Although not shown, the drive unit 40 may have a mechanism for exciting the vibrating body 20 by an electrostatic force or the like without being directly connected to the vibrating body 20 and may be disposed outside the vibrating body 20.

  A plurality of drive movable electrode portions 41 may be connected to the vibrating body 20 and provided. In the illustrated example, the driving movable electrode portion 41 extends from the vibrating body 20 in the + Y axis direction (or −Y axis direction), and extends from the trunk portion in the + X axis direction and the −X axis direction. And a plurality of branches that are provided on a comb-like electrode.

  The driving fixed electrode portion 42 is disposed outside the driving movable electrode portion 41. The driving fixed electrode portion 42 is bonded (fixed) to the first surface 11 of the base 10. In the example shown in the figure, a plurality of driving fixed electrode portions 42 are provided, and are arranged to face each other via the driving movable electrode portion 41. When the drive movable electrode portion 41 has a comb-like shape, the shape of the drive fixed electrode portion 42 may be a comb-like electrode corresponding to the drive movable electrode portion 41.

  The driving movable electrode portion 41 and the driving fixed electrode portion 42 are electrically connected to a power source (not shown). When a voltage is applied to the drive movable electrode portion 41 and the drive fixed electrode portion 42, an electrostatic force (electrostatic force) can be generated between the drive movable electrode portion 41 and the drive fixed electrode portion 42. . Thereby, the elastic support body 30 can be expanded and contracted along the X axis, and the vibrating body 20 can be vibrated along the X axis.

  The material of the drive unit 40 is, for example, silicon imparted with conductivity by being doped with impurities such as phosphorus and boron. The drive unit 40 is formed by, for example, integrally processing a silicon substrate (not shown) together with the vibrator 20 by a photolithography technique and an etching technique.

  The lid body 80 as the second base is provided on the base 10 as the first base. The base 10 and the lid 80 can constitute a package as shown in FIGS. 2 (a) and 2 (b). The base body 10 and the lid body 80 can form a cavity 82, and can accommodate the gyro element 5 including the vibrating body 20 and the like in the cavity 82. The cavity 82 may be sealed in, for example, an inert gas (for example, nitrogen gas) atmosphere or a vacuum atmosphere.

  The material of the lid 80 is, for example, silicon or glass. The method for joining the lid 80 and the base 10 is not particularly limited. For example, when the base 10 is made of glass and the lid 80 is made of silicon, the base 10 and the lid 80 are made of an anode. Can be joined. Further, the joint portion between the base body 10 and the lid 80 may be filled with an adhesive member or the like.

1-2. Operation of Gyro Sensor According to First Embodiment Next, the operation of the gyro sensor 100 will be described with reference to the drawings. 3 and 4 are diagrams for schematically explaining the operation of the gyro sensor 100. FIGS. 3 (a) and 4 (a) are schematic plan views, and FIG. 3 (b) and FIG. 4 (b) is a cross-sectional view taken along the line C-C in FIGS. 3 (a) and 4 (a). 3 and 4, the X axis, the Y axis, and the Z axis are illustrated as three axes orthogonal to each other. For convenience, FIGS. 3 and 4 simply show the components of the gyro sensor 100.

  In the vibration mode of the gyro sensor 100, the vibrating body 20 is moved along the X axis by the electrostatic force generated between the driving fixed electrode portion 42 and the driving movable electrode portion 41 in the driving portion 40 connected to the support portion 12. Can reciprocate. More specifically, an alternating voltage is applied between the driving fixed electrode portion 42 and the driving movable electrode portion 41. Thereby, the vibrating body 20 including the first flap plate 51 and the second flap plate 53 can be vibrated along the X axis at a predetermined frequency.

In the example shown in FIGS. 3A and 3B, the vibrating body 20 is alternately displaced in the α1 direction (+ X axis direction) and the α2 direction (−X axis direction) at a predetermined frequency.
As shown in FIGS. 4A and 4B, when an angular velocity ω around the Y axis is applied to the gyro sensor 100 in a state where the vibrating body 20 is vibrating along the X axis, the Z axis direction The first flap plate 51 and the second flap plate 53 constituting the detection unit 50 connected to the vibrating body 20 are made to have a first beam portion 52 and a second beam portion 54 as rotation axes, respectively. It swings (displaces) in the axial direction (the β1 and β2 directions in the figure).

  When the first flap plate 51 and the second flap plate 53 are displaced along the Z axis, the distance between the first flap plate 51 and the second flap plate 53 and the detection fixed electrode 55 changes. Therefore, the electrostatic capacitance between the first flap plate 51 and the second flap plate 53 and the detection fixed electrode 55 changes. In the gyro sensor 100, a DC voltage is applied to the first flap plate 51 and the second flap plate 53, and a change in capacitance between the first flap plate 51 and the second flap plate 53 and the detection fixed electrode 55 is fixed for detection. By detecting the change in the current of the electrode 55, the angular velocity ω around the Y axis can be obtained.

1-3. Signal Detection Method of Gyro Sensor According to First Embodiment Next, a signal detection method in the gyro sensor 100 according to the first embodiment will be described with reference to FIG. FIG. 5 shows a signal detection method of the gyro sensor according to the first embodiment, FIG. 5 (a) is a cross-sectional view schematically explaining the signal detection method, and FIG. 5 (b) is an outline of the signal detection method. It is a flowchart which shows a flow.

  As described above, the vibrating body 20 is in a state in which vibration (arrow 211) reciprocating along the X-axis direction is performed by the drive unit 40 (see FIG. 1) (not shown). A signal detection method when an angular velocity around the Y axis is applied to the vibrating body 20 (gyro sensor 100) in this state will be described. The signal detection method of the gyro sensor according to the first embodiment of the present invention is a signal detection method in which a parasitic signal due to a parasitic vibration in the Z-axis direction causing an angular velocity detection error is removed and detection accuracy is improved.

  Prior to the description of the signal detection method of the gyro sensor according to the first embodiment, the parasitic vibration in the Z-axis direction in the gyro sensor 100 (gyro element 5) will be described. As for the shape of the silicon structure constituting the gyro element 5 (see FIG. 1) including the vibrating body 20 and the like, a cross-sectional shape that should originally be a square or a rectangle is parallel four sides due to, for example, a processing error in dry etching processing. It may be formed into a shape or the like. As described above, since the cross-sectional shape of the silicon structure is a parallelogram, the drive vibration in the drive unit 40 (see FIG. 1) that vibrates in the X-axis direction is a component that vibrates in the direction orthogonal to the oblique side of the cross section (oblique angle). Vibration). This oblique vibration has a vibration component in the Z-axis direction, and the drive vibration of the drive unit 40 is applied to the detection unit 50 (see FIG. 1) such as the first flap plate 51 and the second flap plate 53 in the Z-axis direction. This causes a so-called vibration leakage phenomenon that is transmitted as a vibration component. And the diagonal vibration by this vibration mole phenomenon will be transmitted to the detection part 50, and the detection part 50 will vibrate to the Z-axis direction which is a vibration direction which detects an angular velocity, and what is called a quadrature (Quadrature) phenomenon will be produced. Due to this quadrature phenomenon, a signal having a quadrature component (vibration component in the Z-axis direction) is generated, and the detection unit 50 detects the angular velocity even when the angular velocity is not generated. It may cause an error.

Hereinafter, a signal detection method of the gyro sensor 100 according to the present invention will be described. The gyro sensor 100 includes an arithmetic processing unit 205 that performs arithmetic processing on the acquired first signal and second signal, an amplifying element 206 as an adjusting unit, and the like.
First, in the first step, a change in capacitance between the support part 12 (first electrode) and the monitor electrode 56 (third electrode) facing the support part 12 is detected, and the vibration of the support part 12 in the Z-axis direction is detected. (Arrow 214) The first signal 204 as a component signal is acquired (step S101). Specifically, when the support unit 12 vibrates in the Z-axis direction with a DC voltage applied to the support unit 12 (first electrode) constituting the vibrating body 20 (arrow 214), the support unit 12 and the monitor electrode 56 are used. The capacitance between the support portion 12 and the monitor electrode 56 changes. The change in capacitance is detected from the wiring 201 as a change in current of the monitor electrode 56 (third electrode), and the first signal 204 is acquired. The vibration (arrow 214) in the Z-axis direction of the support portion 12 is a parasitic vibration component (also referred to as a quadrature component) such as an oblique vibration component that does not originally occur, and the second signal 202 acquired in the second step described later. This is a vibration component that becomes a noise component (parasitic vibration component).

  The first signal 204 acquired in the first step may be transmitted to the arithmetic processing unit 205 as an amplified signal (first signal) 207 amplified through an amplifying element 206 as an adjustment unit. By amplifying the first signal in this way, the amplitudes of the first signal 204 and the second signal 202 having different amplitudes are matched. Then, in a third step to be described later, the original detection signal from which the quadrature component has been removed by adding (amplifying) the amplified signal 207 and the second signal 202 which are the first signals having the same amplitude. 210 (third signal) can be easily obtained.

  Next, in the second step, the first flap plate 51 (second electrode) and the second flap plate 53 (second electrode), and the detection fixed electrode 55 facing the first flap plate 51 and the second flap plate 53. A change in capacitance with the (fourth electrode) is detected, and a second signal 202 is acquired as a vibration (arrow 212) component signal in the Z-axis direction of the first flap plate 51 and the second flap plate 53 (step S102). ). At this time, the first flap plate 51 (second electrode) and the second flap plate 53 (second electrode) are in a state of receiving an angular velocity ω around the Y axis and oscillating in the Z axis direction. Specifically, the first flap plate 51 (second electrode) and the second flap plate 53 are arranged in the Z-axis direction in a state where a DC voltage is applied to the first flap plate 51 and the second flap plate 53 as the second electrode. When it vibrates (arrow 212), the distance between the first flap plate 51 (second electrode) and the second flap plate 53 and the detection fixed electrode 55 changes. As a result, the capacitance between the first flap plate 51 (second electrode) and the second flap plate 53 (second electrode) and the detection fixed electrode 55 changes, and the change in capacitance is detected by the detection fixed electrode 55. The second signal 202 is acquired by detecting the current change of the (fourth electrode) from the wiring 203. The second signal 202 receives an original vibration component generated in the first flap plate 51 and the second flap plate 53 due to the Coriolis force in the Z-axis direction due to the angular velocity ω around the Y-axis, and an oblique vibration component that is not originally generated. And other parasitic vibration components (also referred to as quadrature components).

  Next, in a third step, the arithmetic processing unit 205 performs arithmetic processing on the acquired amplified signal 207 (first signal) and second signal 202 of the first signal 204 to remove parasitic vibration components (quadrature components). The detected signal 210 is output (step S103). Specifically, from the current value of the second signal 202, the amplified signal 207 (first signal) of the first signal 204, which is a vibration component in the Z-axis direction of the support portion 12 according to the parasitic vibration component (quadrature component). For example, the quadrature component is removed by adding the amplified signal 207 (first signal) of the first signal 204 and the second signal 202 so as to remove the current value. Then, the original detection signal 210 from which the quadrature component has been removed can be output, and the gyro element 5 with improved detection accuracy can be obtained by the detection signal 210.

  In addition, the 1st flap board 51 and the 2nd flap board 53 which comprise the detection part 50 are connected to the support part 12 via the 1st beam part 52 and the 2nd beam part 54, respectively. The support portion 12, the first flap plate 51, and the second flap plate 53 can vibrate in the Z-axis direction at their respective resonance frequencies. And the support part 12, the 1st flap board 51, and the 2nd flap board 53 are the amplitude ratio (resonance magnification :) of the vibration amplitude of the support part 12, and the vibration amplitude of the 1st flap board 51 and the 2nd flap board 53. The resonance phenomenon may cause a resonance phenomenon. Due to this resonance phenomenon, the vibration in the Z-axis direction generated in the support portion 12 by the parasitic vibration component (quadrature component) resonates with the first flap plate 51 and the second flap plate 53, and the first flap plate 51 and the second flap plate 53. The vibration amplitude of the parasitic vibration component of the flap plate 53 is increased. Thereby, the detection accuracy of the vibration component at the original angular velocity to be detected by the first flap plate 51 and the second flap plate 53 is lowered.

  However, the vibration amplitude of the support portion 12 and the vibration amplitudes of the first flap plate 51 and the second flap plate 53 have a relationship related to the resonance magnification. The resonance magnification is determined by the detuning frequency which is the difference between the resonance frequency fd of the support portion 12 and the resonance frequency fs of the detection portion 50. Therefore, in the gyro element 5 capable of managing the driving frequency, the area of the support portion 12 and the first flap plate 51 and the second flap plate 53 is a signal due to the parasitic vibration component (quadture component) of the support portion 12. By amplifying in consideration of the ratio and the resonance magnification, the parasitic vibration component (quadrature component) in the detection unit 50 can be canceled.

  Further, the resonance frequency fd for vibrating the support unit 12 can be made larger than the resonance frequency fs of the detection unit 50. As described above, the relationship between the resonance frequency fd that vibrates the support unit 12 and the resonance frequency fs of the detection unit 50 (the detuning frequency is set to minus) makes the vibration direction of the support unit 12 and the detection unit 50 vibrate. Is reversed. As a result, the current I (2) flowing out from the monitor electrode 56 and the current I (1) flowing out from the detection fixed electrode 55 shown in FIG. 6A are generated from the monitor electrode 56 as shown in FIG. 6B. The positive and negative of the current I (3) flowing out and the current I (1) flowing out from the detection fixed electrode 55 are reversed. Then, the area and interval (gap) of each electrode are adjusted in consideration of the resonance magnification so that the absolute values of the two currents are equal to each other, and the capacitance change by the support unit 12 and the monitor electrode 56 and the first change. The capacitance change by the 1st flap board 51, the 2nd flap board 53, and the detection fixed electrode 55 is adjusted. By doing so, it is possible to obtain an original detection signal from which the quadrature component is removed without performing arithmetic processing, with the monitor electrode 56 and the detection fixed electrode 55 as the same electrode.

  According to the gyro sensor 100 according to the first embodiment as described above, the detection fixed electrode 55 (the fourth electrode) facing the first flap plate 51 and the second flap plate 53 (the second electrode) constituting the detection unit 50. A signal (second signal 202) including an original detection signal of vibration along the Z axis and an oblique vibration component (hereinafter also referred to as “quadrature component”) output from the electrode), and the support portion 12 (first electrode). ) And a signal including the quadrature component (the first signal 204) output from the monitor electrode 56 facing to (). The original detection signal 210 from which the quadrature component has been removed can be obtained by performing arithmetic processing on these two signals. This makes it possible to obtain the gyro sensor 100 (gyro element 5) with improved detection accuracy.

1-4. Configuration of Gyro Sensor According to Second Embodiment A second embodiment of a gyro sensor as an electronic device using a gyro element as a functional element according to the present invention will be described with reference to the drawings. FIG. 7 is a plan view schematically showing the gyro sensor 102 according to the second embodiment. FIG. 8 is a DD cross-sectional view of FIG. 7 schematically showing the gyro sensor 102 according to the second embodiment. 7 and 8, the X axis (first direction), the Y axis (second direction), and the Z axis (third direction) are illustrated as three axes orthogonal to each other. The gyro sensor 102 according to the second embodiment has a configuration in which two gyro elements 5 of the gyro sensor 100 according to the first embodiment are arranged in parallel in the X-axis direction. Therefore, in the following, the same components as those in the first embodiment described above are denoted by the same reference numerals, and the description thereof is omitted.

  As shown in FIGS. 7 and 8, the gyro sensor 102 of the second embodiment includes a base 10 as a first base and a gyro element 5b as a functional element. The gyro element 5b as a functional element includes a vibrating body 20b, an elastic support body 30, and a driving unit 40. The vibrating body 20b includes a first vibrating body 21 and a second vibrating body 22 that are arranged side by side along the X-axis direction. Note that each of the first vibrating body 21 and the second vibrating body 22 has the same configuration as the vibrating body 20 of the first embodiment described above.

  The gyro element 5b is accommodated in a cavity 82 surrounded by a base body 10 as a first base body and a lid body 80 as a second base body. The gyro element 5b is provided above the base 10 via a gap (concave portion 14). The gyro element 5 b is supported via an elastic support 30 on a fixing portion 17 provided on the first surface 11 of the base 10 (on the base 10). In the gyro sensor 102, the detection unit 150 constituting the gyro element 5b is a gyro sensor element (capacitance MEMS gyro sensor element) that detects an angular velocity around the Y axis. For convenience, FIG. 7 shows the base body 10 and the lid 80 in a perspective view. Further, viewing from the normal direction of the first surface 11 (see FIG. 8), which is the base surface of the base body 10 on which the vibration body 20b is provided, that is, viewing the vibration body 20b supported by the base body 10 from above. Hereinafter, it is referred to as “plan view”.

  The material of the base 10 is, for example, glass or silicon. As shown in FIG. 8, the base 10 has a first surface 11 and a second surface 11 b opposite to the first surface 11. A recess 14 is provided in the first surface 11. Above the recess 14, the vibrating body 20 b (the first vibrating body 21, the second vibrating body 22, and the vibrating body connecting portion 26), the elastic support body 30, and the driving unit 40 are provided via a gap. . By the recess 14, the vibrating body 20 b can be moved in a desired direction without being obstructed by the base 10. The planar shape (the shape when viewed from the Z-axis direction) of the recess 14 is not particularly limited, but is a rectangle in this embodiment. The recess 14 is formed by, for example, a photolithography technique and an etching technique.

  As shown in FIG. 8, the base 10 has a fixing portion 17 that is appropriately provided on the first surface 11 according to the form of the vibrating body 20 b. The fixing portion 17 is a portion that supports (i.e., joins) one end of the elastic support 30 that supports the vibrating body 20 b and supports the vibrating body 20 b via the elastic support 30. As shown in FIGS. 7 and 8, one end (fixed portion 17) of the elastic support body 30 may be disposed so as to sandwich the first vibrating body 21 and the second vibrating body 22 in the X-axis direction. . Further, as shown in FIG. 7, one end (fixed portion 17) of the elastic support body 30 may be disposed so as to sandwich the first vibrating body 21 and the second vibrating body 22 in the Y-axis direction. That is, one end (fixing portion 17) of the elastic support 30 may be provided at two or four locations.

  The first vibrating body 21 and the second vibrating body 22 constituting the vibrating body 20 b are juxtaposed in the direction along the X axis (first axial direction) and are connected by the vibrating body connecting portion 26. Further, the first vibrating body 21 and the second vibrating body 22 are supported by the fixing portion 17 via the elastic support body 30 and are arranged apart from the base body 10. More specifically, the first vibrating body 21 and the second vibrating body 22 are provided above the base body 10 via a gap (concave portion 14). The first vibrating body 21 and the second vibrating body 22 include, for example, a frame-like (hook-shaped) support portion 12 (first electrode). As shown in FIG. 7, the first vibrating body 21 and the second vibrating body 22 are symmetric with respect to a line (straight line along the Y axis) connecting the center of the vibrating body connecting portion 26 that is a boundary line between them. The shape which becomes may be sufficient. The material of the vibrating body 20b is, for example, silicon provided with conductivity by doping impurities such as phosphorus and boron. The vibrating body 20b is formed, for example, by processing a silicon substrate (not shown) by a photolithography technique and an etching technique. Since the first vibrating body 21 and the second vibrating body 22 have the same configuration as the vibrating body 20 described in the first embodiment, detailed description thereof is omitted.

  The first vibrating body 21 and the second vibrating body 22 are opposed to the support portion 12 (first electrode) with a gap, and the third vibrating body 21 and the second vibrating body 22 are substantially overlapped with a region where the support portion 12 is disposed in a plan view. A monitor electrode 156 as an electrode is provided. Specifically, the monitor electrode 156 has a substantially frame shape (frame shape), like the support portion 12. The monitor electrode 156 as the third electrode is bonded (fixed) to the bottom surface 13 of the recess 14 provided on the first surface 11 of the base 10. Note that the configuration of the support unit 12 and the monitor electrode 156 and the relationship (action) between the support unit 12 and the monitor electrode 156 are the same as those in the first embodiment, and thus the description thereof is omitted.

  The vibrating body connecting portion 26 is configured to be able to displace the first vibrating body 21 and the second vibrating body 22 in the Z-axis direction. More specifically, the vibrating body connecting portion 26 extends between the first vibrating body 21 and the second vibrating body 22 from the support portion 12 in the direction along the X axis and reciprocates in the Y axis direction. It has a shape that extends in the axial direction. In the vibration body connecting portion 26, an end portion of the elastic body 28 extending from the center portion in the X-axis direction is connected to the base body 10 by the second fixing portion 16. Thereby, the 1st vibrating body 21 and the 2nd vibrating body 22 can vibrate in a mutually opposite phase in the Z-axis direction. The configuration of the elastic body 28 is not limited as long as it can be elastically deformed by a predetermined spring constant in the direction along the X axis.

  The elastic support 30 is configured to be able to displace the vibrating body 20b in the X-axis direction. Specifically, the elastic support body 30 extends in the direction along the X axis from one end connected to the fixed portion 17 to the vibrating body 20b (the first vibrating body 21 or the second vibrating body 22), and extends in the Y axis direction. It has a shape that extends in the X-axis direction while reciprocating. One end of the elastic support 30 is joined (fixed) to the fixing portion 17 (the first surface 11 of the base body 10). The other end of the elastic support 30 is connected to the support portion 12 of the vibrating body 20b (the first vibrating body 21 or the second vibrating body 22). In the illustrated example, four elastic supports 30 are provided so as to sandwich the vibrating body 20b in the X-axis direction.

  The material of the elastic support 30 is, for example, silicon imparted with conductivity by being doped with impurities such as phosphorus and boron. The elastic support 30 is formed, for example, by integrally processing a silicon substrate (not shown) together with the vibrating body 20b by a photolithography technique and an etching technique.

  The drive unit 40 has a mechanism that can excite the vibrating body 20b. Note that the configuration and number of the drive units 40 are not particularly limited as long as the first vibrating body 21 or the second vibrating body 22 can be excited. For example, the drive unit 40 may be provided directly on the vibrating body 20b. As shown in FIG. 7, the drive unit 40 includes a drive movable electrode unit 41 connected to the outside of the vibrating body 20 b (support unit 12) in the Y-axis direction, and a predetermined distance from the drive movable electrode unit 41. The fixed electrode part 42 for a drive arrange | positioned oppositely. Although not shown, the drive unit 40 may have a mechanism for exciting the vibrating body 20b by electrostatic force or the like without being directly connected to the vibrating body 20b, and may be disposed outside the vibrating body 20b. The driving movable electrode portion 41 and the driving fixed electrode portion 42 that constitute the driving portion 40 are the same as those in the first embodiment described above, and thus detailed description of the configuration and effects thereof is omitted.

  The detection unit 150 is provided inside the support unit 12 that constitutes the first vibrating body 21 and the second vibrating body 22. In other words, the detection unit 150 is provided on the opposite side of the support unit 12 from the arrangement side of the drive unit 40. The detection unit 150 includes a first flap plate 151 and a second flap plate 153 as movable electrodes, a first beam portion 152 connected to the first flap plate 151, and a second beam connected to the second flap plate 153. Part 154 and a fixed electrode for detection 155 as a fourth electrode. As described above, the first flap plate 151 and the second flap plate 153 are made conductive by doping impurities such as phosphorus and boron into silicon, and also have a function as a second electrode. ing. For the first flap plate 151, the second flap plate 153, the first beam portion 152, the second beam portion 154, and the detection fixed electrode 155, the first flap plate 51, the second flap plate 51 in the first embodiment described above, and the like. Since the configuration is the same as the flap plate 53, the first beam portion 52, the second beam portion 54, and the detection fixed electrode 55, a detailed description thereof will be omitted.

  As in the first embodiment described above, the detection unit 150 detects vibration in the Z-axis direction that occurs in the vibrating body 20b (the first flap plate 151 and the second flap plate 153) when the gyro element 5b receives acceleration. The angular velocity can be calculated by detecting the change in capacitance.

  The lid 80 as the second base is provided on the base 10. The base body 10 and the lid body 80 can constitute a package as shown in FIG. The base body 10 and the lid body 80 can form a cavity 82, and can accommodate the gyro element 5 b including the vibrating body 20 b and the like in the cavity 82. The cavity 82 may be sealed in, for example, an inert gas (for example, nitrogen gas) atmosphere or a vacuum atmosphere.

  The material of the lid 80 is, for example, silicon or glass. The method for joining the lid 80 and the base 10 is not particularly limited. For example, when the base 10 is made of glass and the lid 80 is made of silicon, the base 10 and the lid 80 are made of an anode. Can be joined. Further, the joint portion between the base body 10 and the lid 80 may be filled with an adhesive member or the like.

1-5. Operation of Gyro Sensor According to Second Embodiment Next, the operation of the gyro sensor 102 will be briefly described. In the vibration mode of the gyro sensor 102, the first vibrating body 21 and the second vibrating body 22 are excited by the drive unit 40 and can be driven to vibrate in opposite phases (reverse phases) along the X axis. More specifically, a first alternating voltage is applied between the driving movable electrode portion 41 and the driving fixed electrode portion 42 provided on the first vibrating body 21 to drive the driving movable electrode of the second vibrating body 22. A second alternating voltage that is 180 degrees out of phase with the first alternating voltage is applied between the portion 41 and the driving fixed electrode portion. Thereby, the 1st vibrating body 21 and the 2nd vibrating body 22 can be vibrated along a X-axis with a mutually opposite phase (reverse phase) and a predetermined frequency. That is, the first vibrating body 21 and the second vibrating body 22 connected to each other along the X axis vibrate in mutually opposite phases along the X axis. That is, the first vibrating body 21 and the second vibrating body 22 are displaced in opposite directions along the X axis.

  When an angular velocity ω about the Y axis is applied to the gyro sensor 102 in a state where the first vibrating body 21 and the second vibrating body 22 are vibrating along the X axis, Coriolis force is applied, and the first flap plate 151 The second flap plate 153 displaces (vibrates) in the direction along the Z axis with the first beam portion 152 and the second beam portion 154 as rotation axes, respectively. That is, the first flap plate 151 and the second flap plate 153 connected to the first vibrating body 21 and the first flap plate 151 and the second flap plate 153 connected to the second vibrating body 22 are arranged on the Z axis. Are displaced in opposite directions.

  The first flap plate 151 and the second flap plate 153 are displaced along the Z axis, whereby the distance between the first flap plate 151 and the second flap plate 153 and the detection fixed electrode 155 changes. Therefore, the electrostatic capacitance between the first flap plate 151 and the second flap plate 153 and the detection fixed electrode 55 changes. In the gyro sensor 102, a voltage is applied to the first flap plate 151 and the second flap plate 153 and the detection fixed electrode 155, whereby the first flap plate 151, the second flap plate 153 and the detection fixed electrode 155 are connected. The amount of change in the capacitance between them can be detected, and the angular velocity ω around the Y axis can be obtained.

  The gyro sensor 102 according to the second embodiment has the following effects in addition to the effects of the gyro sensor 100 of the first embodiment described above. In the gyro sensor 102 according to the second embodiment, two vibrating bodies, a first vibrating body 21 and a second vibrating body 22, are provided side by side through a vibrating body connecting portion 26. The respective vibrators (the first vibrator 21 and the second vibrator 22) arranged in this way are driven to vibrate in opposite directions, and the angular velocity is determined based on the measured value measured for each vibrator. By calculating, it is possible to cancel acceleration applied linearly. Therefore, the gyro sensor 102 can more accurately detect the angular velocity ω around the Y axis without being affected by acceleration or the like.

1-6. Configuration of Gyro Sensor According to Third Embodiment A third embodiment of a gyro sensor as an electronic device using a gyro element as a functional element according to the present invention will be described with reference to the drawings. FIG. 9 is a plan view schematically showing the gyro sensor 104 according to the third embodiment. FIG. 10 is a cross-sectional view taken along line EE in FIG. 9 schematically showing the gyro sensor 104 according to the second embodiment. 9 and 10, the X axis (first axis direction), the Y axis (second axis direction), and the Z axis (third axis direction) are illustrated as three axes orthogonal to each other. In the following description, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  As shown in FIGS. 9 and 10, the gyro sensor 104 includes a base 10 as a first base and a gyro element 5c. The gyro element 5c includes a vibrating body 20c, an elastic support body 30, a driving unit 40, a detection unit 250, and a monitor unit 260. In the gyro sensor 104, the detection unit 250 constituting the gyro element 5c is a gyro sensor element (capacitive MEMS gyro sensor element) that detects an angular velocity around the Z axis. For convenience, FIG. 9 shows the base body 10 and the lid body 80 in a transparent manner. Further, viewing from the normal direction of the first surface 11 (see FIG. 10), which is a base surface on which the vibrating body 20c of the base body 10 is provided, that is, viewing the vibrating body 20c supported by the base body 10 from above. Hereinafter, it is referred to as “plan view”.

  The material of the base 10 as the first base is, for example, glass or silicon. As shown in FIG. 10, the base 10 has a first surface 11 and a second surface 11 b opposite to the first surface 11. A recess 14 is provided in the first surface 11. Above the recess 14, the vibrating body 20 c (the first vibrating body 21, the second vibrating body 22, and the vibrating body connecting portion 26) and the elastic support body 30 are provided via a gap. By the recess 14, the vibrating body 20 c can be moved in a desired direction without being obstructed by the base 10. The planar shape (the shape when viewed from the Z-axis direction) of the recess 14 is not particularly limited, but is a rectangle in this embodiment. The recess 14 is formed by, for example, a photolithography technique and an etching technique.

  As shown in FIG. 10, the base 10 has a fixing portion 17 that is appropriately provided on the first surface 11 according to the form of the vibrating body 20 c. The fixing portion 17 is a portion that supports (becomes) one end of the elastic support 30 that supports the vibrating body 20 c and supports the vibrating body 20 c via the elastic support 30. As illustrated in FIGS. 9 and 10, the fixing portion 17 may be disposed so as to sandwich the vibrating body 20 c in the X-axis direction.

  The first surface 11 (base 10) of the fixing portion 17, the elastic support 30, the driving fixed electrode portion 42, the first detecting fixed electrode portion 254, the second detecting fixed electrode portion 255, and the monitor electrode 256, which will be described later. For example, when the material of the base 10 is glass and the material of the vibrating body 20c is silicon, anodic bonding can be applied.

  As shown in FIG. 10, the gyro element 5c is accommodated in a cavity 82 surrounded by a base body 10 as a first base body and a lid body 80 as a second base body. Further, the gyro element 5c is provided with a vibrating body 20c via a recess 14 provided in the base 10 and a gap. The vibrating body 20 c is supported on the first surface 11 of the base body 10 (on the base body 10) via the elastic support body 30.

  The material of the vibrating body 20c is, for example, silicon provided with conductivity by doping impurities such as phosphorus and boron. The vibrating body 20c is formed, for example, by processing a silicon substrate (not shown) by a photolithography technique and an etching technique.

  The vibrating body 20 c is supported by the fixing portion 17 via the elastic support body 30 and is disposed apart from the base body 10. The vibrating body 20c can have, for example, a frame shape (frame shape), and the vibrating body 20c includes the support portion 12.

  The monitor unit 260 includes a first electrode 257 and a monitor electrode 256. The first electrode 257 extends from the two frame parts in the X-axis direction of the frame-shaped support part 12 constituting the vibrating body 20c along the X-axis direction, and is arranged side by side in the Y-axis direction. The monitor electrode 256 is provided on the bottom surface 13 of the recess 14 provided on the first surface 11 of the base 10. The monitor electrode 256 is opposed to the first electrode 257 with a gap and is provided in parallel.

  The first electrode 257 and the monitor electrode 256 generate vibration in the Y-axis direction (displacement of the support portion 12 in the Y-axis direction) generated in the support portion 12 due to a change in capacitance between the first electrode 257 and the monitor electrode 256. Can be detected. Specifically, when the support unit 12 vibrates in the Y-axis direction with a DC voltage applied to the support unit 12 (first electrode), the first electrode 257 and the monitor electrode 256 extending from the support unit 12 The distance between the first electrode 257 and the monitor electrode 256 changes. By detecting the change in the capacitance as a change in the current of the monitor electrode 256 (third electrode), the vibration of the support portion 12 in the Y-axis direction can be obtained.

  The elastic support 30 is configured to be able to displace the vibrating body 20c in the X-axis direction. More specifically, the elastic support body 30 has a shape extending in the direction along the X axis from one end connected to the fixed portion 17 to the vibrating body 20c, and extending in the X axis direction while reciprocating in the Y axis direction. Have. One end of the elastic support 30 is joined (fixed) to the fixing portion 17 (the first surface 11 of the base body 10). Further, the other end of the elastic support 30 is connected to the vibrating body 20c. In the illustrated example, four elastic supports 30 are provided so as to sandwich the vibrating body 20c in the X-axis direction.

  The material of the elastic support 30 is, for example, silicon imparted with conductivity by being doped with impurities such as phosphorus and boron. The elastic support 30 is formed, for example, by integrally processing a silicon substrate (not shown) together with the vibrating body 20c by photolithography technique and etching technique.

  The detection unit 250 is connected to the vibrating body 20c. The detection unit 250 is provided inside the support unit 12 of the vibrating body 20c. The detection unit 250 includes a detection base 65, a detection support unit 251, a detection spring unit 252, a detection movable electrode unit 253 as a second electrode, and a first detection fixed electrode unit 254 as a fourth electrode. And a second detection fixed electrode portion 255.

  The detection spring portion 252 is disposed inside the support portion 12. The detection spring portion 252 connects the detection base portion 65 and the vibrating body 20c (support portion 12). More specifically, one end of the detection spring portion 252 is connected to the detection base portion 65. The other end of the detection spring portion 252 is connected to the vibrating body 20c (support portion 12). The detection spring portion 252 is configured to be able to displace the detection support portion 251 in the Y-axis direction. More specifically, the detection spring portion 252 has a shape that extends in the Y-axis direction while reciprocating in the X-axis direction. The detection movable electrode portion 253 is disposed inside the support portion 12 and connected to the detection base portion 65. In the illustrated example, the detection movable electrode portion 253 extends from the detection base portion 65 along the X axis.

  The first detection fixed electrode portion 254 and the second detection fixed electrode portion 255 are provided on the bottom surface 13 of the recess 14 provided on the first surface 11 of the base 10. In the illustrated example, a plurality of first detection fixed electrode portions 254 and second detection fixed electrode portions 255 are provided, and are arranged to face each other via the detection movable electrode portion 253. In other words, the first detection fixed electrode portion 254 and the second detection fixed electrode portion 255 are arranged so as not to overlap the detection movable electrode portion 253 in plan view.

  The material of the detection unit 250 excluding the first detection fixed electrode unit 254 and the second detection fixed electrode unit 255 is, for example, silicon imparted with conductivity by doping impurities such as phosphorus and boron. The detection unit 250 excluding the first detection fixed electrode unit 254 and the second detection fixed electrode unit 255, for example, integrally processes a silicon substrate (not shown) together with the vibrating body 20c by photolithography technology and etching technology. It is formed by doing.

  The drive unit 40 is provided on the opposite side of the detection unit 250 with respect to the vibrating body 20c support unit 12 in plan view. Accordingly, the first detection fixed electrode portion 254, the second detection fixed electrode portion 255, and the drive unit 40 can be arranged so as not to overlap each other. The drive unit 40 has a mechanism that can excite the vibrating body 20c. The configuration and number of the drive units 40 are not particularly limited as long as the vibrating body 20c can be excited. For example, the drive unit 40 may be provided directly on the vibrating body 20c. As shown in FIG. 9, the driving movable electrode portion 41 is connected to the outside of the vibrating body 20c, and the driving fixed electrode portion 42 is disposed to face the driving movable electrode portion 41 with a predetermined distance. It may be. Although not shown, the drive unit 40 may have a mechanism for exciting the vibrating body 20c by electrostatic force or the like without being directly connected to the vibrating body 20c, and may be disposed outside the vibrating body 20c. The driving movable electrode portion 41 and the driving fixed electrode portion 42 that constitute the driving portion 40 are the same as those in the first embodiment described above, and thus detailed description of the configuration and effects thereof is omitted.

  The lid 80 as the second base is provided on the base 10. The base body 10 and the lid body 80 can constitute a package as shown in FIG. The base body 10 and the lid body 80 can form a cavity 82, and the vibrating body 20 c can be accommodated in the cavity 82. For example, the joint portion between the base body 10 and the lid 80 may be filled with an adhesive member or the like. In this case, the cavity 82 may be sealed in, for example, an inert gas (for example, nitrogen gas) atmosphere or a vacuum atmosphere.

  The material of the lid 80 is, for example, silicon or glass. The method for joining the lid 80 and the base 10 is not particularly limited. For example, when the base 10 is made of glass and the lid 80 is made of silicon, the base 10 and the lid 80 are made of an anode. Can be joined.

1-7. Operation of Gyro Sensor According to Third Embodiment Next, the operation of the gyro sensor 104 according to the third embodiment will be described with reference to the drawings. FIG. 11A, FIG. 11B, FIG. 12A, and FIG. 12B are diagrams for schematically explaining the operation of the gyro sensor 104. FIG. 11 and 12, the X axis, the Y axis, and the Z axis are illustrated as three axes orthogonal to each other. For convenience, in FIG. 11 and FIG. 12, each configuration of the gyro sensor 104 is illustrated in a simplified manner.

  As described above, in the vibration mode of the gyro sensor 104, the vibrating body 20c is excited by the driving unit 40 and can be driven to vibrate. More specifically, a first alternating voltage is applied between the driving movable electrode portion 41 and the driving fixed electrode portion 42 provided on the vibrating body 20c. Thereby, the vibrating body 20c can be vibrated along the X axis at a predetermined frequency.

  In the example shown in FIG. 11A, the vibrating body 20c is displaced in the α1 direction (−X axis direction). In the example shown in FIG. 11B, the vibrating body 20c is displaced in the α2 direction. Similarly, the part connected to the vibrating body 20c of the detection unit 250 is displaced along the X axis with the vibration of the vibrating body 20c.

  As shown in FIGS. 12A and 12B, when an angular velocity ω around the Z axis is applied to the gyro sensor 104 in a state where the vibrating body 20c vibrates along the X axis, the Coriolis force is applied. The detector 250 is displaced along the Y axis. That is, the detection unit 250 coupled to the vibrating body 20c is displaced along the Y axis. In the example shown in FIG. 12A, the detection unit 250 is displaced in the β1 direction. In the example shown in FIG. 12B, the detection unit 250 is displaced in the β2 direction.

  When the detection unit 250 is displaced along the Y axis, the distance L between the detection movable electrode unit 253 and the first detection fixed electrode unit 254 changes. As a result, the capacitance between the detection movable electrode portion 253 and the first detection fixed electrode portion 254 changes. In the gyro sensor 104, a voltage is applied to the detection movable electrode portion 253 and the first detection fixed electrode portion 254, and a change in capacitance between the detection movable electrode portion 253 and the first detection fixed electrode portion 254 is performed. By detecting the amount as a change amount of the current value, the angular velocity ω around the Z axis can be obtained.

  Also in the gyro sensor 104 according to the third embodiment, it is possible to apply a signal detection method similar to that of the gyro sensor 100 according to the first embodiment described above. A description of this signal detection method is omitted.

  According to the gyro sensor 104 according to the third embodiment, the angular velocity ω around the Z axis can be detected. In addition, it has the same effect as the gyro sensor 100 of the first embodiment described above. As a specific example, the gyro sensor 104 includes a first detection fixed electrode portion 254 and a second detection fixed electrode as fourth electrodes facing the detection movable electrode portion 253 as the second electrode constituting the detection portion 250. Obtaining a signal (second signal) that is output from the electrode unit 255 and includes an original detection signal of vibration along the Y axis and an oblique vibration component (hereinafter also referred to as “quadrature component”) along the X axis. Can do. In addition, the gyro sensor 104 can obtain a signal including a quadrature component (first signal) output from the monitor electrode 256 as the third electrode facing the first electrode 257. An original detection signal from which the quadrature component has been removed can be obtained by performing arithmetic processing on these two signals. As a result, it is possible to obtain the gyro sensor 104 (gyro element 5c) with improved detection accuracy.

2. Next, a method for manufacturing the gyro sensors 100, 102, and 104 according to the present embodiment will be briefly described. In this description, the gyro sensor 100 according to the first embodiment will be described as an example with reference to FIG. 1 and FIG. In this description, the same reference numerals as those in FIGS. 1 and 2 are given.

  First, the recess 14 is formed in the first surface 11 of the substrate (base 10). At this time, a groove (not shown) can be formed around the recess 14. The recess 14 and the groove are formed by, for example, a photolithography technique and an etching technique. Thereby, it is possible to prepare the base body 10 in which the concave portion 14 is provided on the first surface 11.

  Next, although not shown, wiring (including the detection fixed electrode 55 and the monitor electrode 56) for forming the drive unit 40 and the detection unit 50 can be formed on the base 10 including the inside of the recess 14. The wiring is formed by, for example, forming a film by a sputtering method, a CVD (Chemical Vapor Deposition) method, or the like and then patterning the film by a photolithography technique and an etching technique.

  Next, the vibrating body 20, the elastic support body 30, the drive unit 40, and the like are formed on the base body 10. More specifically, it is formed by placing (bonding) a silicon substrate (not shown) on the first surface 11 of the base 10, thinning the silicon substrate, and then patterning. The patterning is performed by a photolithography technique and an etching technique. The bonding between the silicon substrate and the substrate 10 is performed by, for example, anodic bonding. In this step, the driving fixed electrode portion 42, the driving portion 40, and the detection portion 50 can be formed on the first surface 11.

As shown in FIG. 2, the base body 10 and the lid body 80 are joined, and the vibrating body 20 is accommodated in a cavity 82 surrounded by the base body 10 and the lid body 80. The base 10 and the lid 80 are joined by, for example, anodic joining.
Through the above steps, the gyro sensor 100 can be manufactured.

3. Configuration of Gyro Sensor According to Fourth Embodiment A fourth embodiment of a gyro sensor as an electronic device using a gyro element as a functional element according to the present invention will be described with reference to the drawings. FIG. 13 is a cross-sectional view schematically showing the gyro sensor 106 according to the fourth embodiment. The cutting position in FIG. 13 is the same as that in FIG. In FIG. 13, the X axis (first axis direction), the Y axis (second axis direction), and the Z axis (third axis direction) are illustrated as three axes orthogonal to each other. The gyro sensor 106 according to the fourth embodiment has a configuration in which the configuration of the gyro sensor 100 according to the first embodiment is different from the arrangement of the monitor electrode as the third electrode and the detection fixed electrode as the fourth electrode. is there. Therefore, the following description will be focused on the configuration different from that of the first embodiment described above, and the same configuration will be denoted by the same reference numeral and the description thereof will be omitted.

  A gyro sensor 106 according to the fourth embodiment shown in FIG. 13 includes a base 10 as a first base and a gyro element 5 as a functional element. The gyro element 5 includes a vibrating body 20 (see FIG. 1), an elastic support body 30, and a drive unit 40 (see FIG. 1). Since the structures of the base 10 and the gyro element 5 are the same as those of the first embodiment, detailed description thereof will be omitted below.

  The gyro element 5 is accommodated in a cavity 82 surrounded by a base body 10 as a first base body and a lid body 80 as a second base body. The gyro element 5 is provided above the base 10 via a gap (concave part 14). The gyro element 5 is supported via a resilient support 30 on a fixing portion 17 provided on the first surface 11 of the base 10 (on the base 10). In the gyro sensor 106, the detection unit 50 constituting the gyro element 5 is a gyro sensor element (capacitive MEMS gyro sensor element) that detects an angular velocity around the Y axis.

  The base 10 has a first surface 11 and a second surface 11 b opposite to the first surface 11. A recess 14 is provided in the first surface 11. Above the recess 14, a gyro element 5 such as a vibrating body (not shown) and an elastic support body 30 is provided via a gap. The recess 14 allows the gyro element 5 to move in a desired direction without being obstructed by the base 10. Hereinafter, viewing from the normal direction of the first surface 11 that is the base surface of the base body 10 on which the vibration body 20 is provided, that is, viewing the vibration body 20 supported by the base body 10 from above is referred to as “plan view”. "

  The vibrating body 20 (see FIG. 1) is supported by the fixing portion 17 via the one end 15 of the elastic support body 30 and is disposed apart from the base body 10. As in the first embodiment, the vibrating body 20 is provided with, for example, a frame-shaped (frame-shaped) support portion 12 (first electrode). The material of the vibrating body 20 is, for example, silicon imparted with conductivity by doping impurities such as phosphorus and boron. The vibrating body 20 is formed, for example, by processing a silicon substrate (not shown) by a photolithography technique and an etching technique. Since the vibrating body 20 has the same configuration as that of the first embodiment described above, a detailed description thereof will be omitted.

  The lid 80 as the second base is opposed to the support portion 12 (first electrode) with a gap, and as a third electrode so as to substantially overlap the region where the support portion 12 is arranged in plan view. A monitor electrode 56a is provided. Specifically, the monitor electrode 56 a has a substantially frame shape (frame shape), like the support portion 12. The monitor electrode 56 a as the third electrode is provided on the inner surface of the lid body 80. Note that the configuration of the support portion 12 and the monitor electrode 56a and the relationship (action) between the support portion 12 and the monitor electrode 56a are the same as those in the first embodiment, and a description thereof will be omitted.

  The first flap plate 51 and the second flap plate 53 as movable electrodes constituting the detection unit 50 (see FIG. 1) are provided inside the support unit 12. And the fixed electrode 55a for a detection as a 4th electrode is provided so that the 1st flap board 51 and the 2nd flap board 53 may be opposed. The detection fixed electrode 55a as the fourth electrode is opposed to the first flap plate 51 and the second flap plate 53, and at least partially overlaps with the first flap plate 51 and the second flap plate 53 in plan view. It is provided on the inner surface of the lid 80. Similar to the first embodiment described above, the detection unit 50 has a Z-axis direction generated in the vibrating body 20 (the first flap plate 51 and the second flap plate 53) when the gyro element 5 receives acceleration. The angular velocity can be calculated by detecting the vibration of the motor by the change in capacitance.

  The lid 80 as the second base is provided on the base 10. The base 10 and the lid 80 can constitute a package. The base body 10 and the lid body 80 can form a cavity 82, and the gyro element 5 can be accommodated in the cavity 82. The cavity 82 may be sealed in, for example, an inert gas (for example, nitrogen gas) atmosphere or a vacuum atmosphere. Further, the lid 80 as the second substrate is formed with the monitor electrode 56a as the third electrode and the detection fixed electrode 55a as the fourth electrode on the inner surface which is the surface facing the substrate 10 as described above. Can do. The monitor electrode 56a and the detection fixed electrode 55a can be formed, for example, by patterning a conductive layer formed by a sputtering method or the like by a photolithography method or the like.

  The material of the lid 80 is, for example, silicon or glass. The method for joining the lid 80 and the base 10 is not particularly limited. For example, when the base 10 is made of glass and the lid 80 is made of silicon, the base 10 and the lid 80 are made of an anode. Can be joined. Further, the joint portion between the base body 10 and the lid 80 may be filled with an adhesive member or the like.

  The operation of the gyro sensor 106 is the same as that of the gyro sensor 100 of the first embodiment described above. Therefore, although explanation here is omitted, the gyro sensor 106 of the fourth embodiment has the same effect as the gyro sensor 100 of the first embodiment.

  In the first to fourth embodiments described above, as the configuration of the vibrating body 20, the vibrating body 20 has one configuration, and the first vibrating body 21 and the second vibrating body 22 have two configurations. As an example, the configuration of the vibrating body 20 may be a configuration in which three or more first to nth vibrating bodies are used.

  In the above description, the gyro elements 5, 5b, and 5c used in the gyro sensors 100, 102, 104, and 106 that detect the angular velocity are described as an example of the functional element. However, the functional element is not limited to this. The form of the functional element is not particularly limited as long as it operates in a cavity 82 sealed in a reduced pressure state or an inert gas atmosphere. For example, the functional element is used for an acceleration detection element or a pressure gauge used in an acceleration sensor. Various functional elements such as a pressure detecting element, a vibrator, a microactuator and the like can be used.

4). Next, an electronic device according to the present embodiment will be described with reference to the drawings. The electronic device according to the present embodiment includes any of the gyro sensors 100, 102, 104, and 106 according to the present invention. Hereinafter, an electronic apparatus including the gyro sensor 100 according to the present invention will be described as an example.

  FIG. 14 is a perspective view schematically showing a mobile (or notebook) personal computer 1100 as the electronic apparatus according to the present embodiment. As shown in FIG. 14, a personal computer 1100 includes a main body portion 1104 having a keyboard 1102 and a display unit 1106 having a display portion 1108. The display unit 1106 has a hinge structure portion with respect to the main body portion 1104. It is supported so that rotation is possible. Such a personal computer 1100 has a built-in gyro sensor 100.

  FIG. 15 is a perspective view schematically showing a mobile phone (including PHS) 1200 as the electronic apparatus according to the present embodiment. As shown in FIG. 15, the cellular phone 1200 includes a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206, and a display unit 1208 is disposed between the operation buttons 1202 and the earpiece 1204. . Such a cellular phone 1200 incorporates the gyro sensor 100.

  FIG. 16 is a perspective view schematically showing a digital still camera 1300 as an electronic apparatus according to the present embodiment. In addition, in FIG. 16, the connection with an external apparatus is also shown simply. Here, a conventional camera sensitizes a silver halide photographic film with a light image of a subject, whereas a digital still camera 1300 photoelectrically converts a light image of a subject with an image sensor such as a CCD (Charge Coupled Device). An imaging signal (image signal) is generated.

  A display unit 1310 is provided on the back of a case (body) 1302 in the digital still camera 1300, and is configured to perform display based on an imaging signal from the CCD. The display unit 1310 displays a subject as an electronic image. Functions as a viewfinder. A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the back side in the drawing) of the case 1302. When the photographer confirms the subject image displayed on the display unit 1310 and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory 1308.

  In the digital still camera 1300, a video signal output terminal 1312 and an input / output terminal 1314 for data communication are provided on the side surface of the case 1302. A television monitor 1430 is connected to the video signal output terminal 1312 and a personal computer 1440 is connected to the input / output terminal 1314 for data communication, if necessary. Further, the imaging signal stored in the memory 1308 is output to the television monitor 1430 or the personal computer 1440 by a predetermined operation. Such a digital still camera 1300 incorporates the gyro sensor 100.

  The personal computer 1100, the mobile phone 1200, and the digital still camera 1300 as electronic devices as described above do not impede the exchange of vibration energy between the two vibrating bodies in the driving system in which the two vibrating bodies vibrate in opposite phases and are capacitively coupled. It is possible to have the gyro sensor 100 that can prevent deterioration of characteristics due to the above.

  In addition to the personal computer 1100 (mobile personal computer) shown in FIG. 14, the mobile phone 1200 shown in FIG. 15, and the digital still camera 1300 shown in FIG. Inkjet ejection device (for example, inkjet printer), laptop personal computer, TV, video camera, head mounted display, video tape recorder, various navigation devices, pager, electronic notebook (including communication function), electronic dictionary, calculator, Electronic game machines, word processors, workstations, videophones, TV monitors for crime prevention, electronic binoculars, POS terminals, medical devices (eg electronic thermometers, blood pressure monitors, blood glucose meters, electrocardiogram measuring devices, ultrasound examinations) Device, an electronic endoscope), a fish finder, various measurement devices, gauges (e.g., vehicles, aircraft, rockets, instruments and a ship), attitude control such as a robot or a human body, and the like flight simulators.

5. FIG. 17 is a perspective view schematically showing an automobile as an example of a mobile object according to the present embodiment. The automobile 506 is equipped with a gyro sensor 100 using the functional element (gyro element 5) according to the present invention. For example, as shown in the figure, an automobile 506 as a moving body includes an electronic control unit 508 that incorporates a gyro sensor 100 using a functional element (gyro element 5) and controls a tire 509 and the like on a vehicle body 507. Has been. The gyro sensor 100 includes keyless entry, immobilizer, car navigation system, car air conditioner, anti-lock brake system (ABS), airbag, tire pressure monitoring system (TPMS), engine The present invention can be widely applied to electronic control units (ECUs) such as controls, battery monitors for hybrid vehicles and electric vehicles, and vehicle body attitude control systems.

  The above-described embodiments are examples, and the present invention is not limited to these. For example, the embodiments can be appropriately combined.

  The present invention includes configurations that are substantially the same as the configurations described in the embodiments (for example, configurations that have the same functions, methods, and results, or configurations that have the same objects and effects). In addition, the invention includes a configuration in which a non-essential part of the configuration described in the embodiment is replaced. In addition, the invention includes a configuration that achieves the same effect as the configuration described in the embodiment or a configuration that can achieve the same object. Further, the invention includes a configuration in which a known technique is added to the configuration described in the embodiment.

  5, 5b, 5c ... Gyro element, 10 ... Base as first base, 11 ... First surface, 11b ... Second surface, 12 ... Supporting portion as first electrode, 13 ... Bottom, 14 ... Recess, 15 ... One end of the elastic support, 16 ... second fixing part, 17 ... fixing part, 20 ... vibrating body, 21 ... first vibrating body, 22 ... second vibrating body, 26 ... vibrating body connecting part, 28 ... elastic body, 30 DESCRIPTION OF SYMBOLS ... Elastic support, 40 ... Drive part, 41 ... Movable electrode part for drive, 42 ... Fixed electrode part for drive, 50 ... Detection part, 51 ... 1st flap as 2nd electrode, 52 ... 1st beam part, 53 2nd flap as 2nd electrode, 54 ... 2nd beam part, 55 ... Fixed electrode for detection as 4th electrode, 56 ... Monitor electrode as 3rd electrode, 80 ... Lid body as 2nd base, 82 ... Cavity, 100, 102, 104, 106 ... Gyrocene as an electronic device -506 ... Automobile as a moving body, 1100 ... Personal computer as an electronic device, 1102 ... Keyboard, 1104 ... Main unit, 1106 ... Display unit, 1108 ... Display unit, 1200 ... Mobile phone as electronic device, 1202 ... Operation Button 1204 ... Earpiece, 1206 ... Mouthpiece, 1208 ... Display unit, 1300 ... Digital still camera as an electronic device, 1302 ... Case, 1304 ... Light receiving unit, 1306 ... Shutter button, 1308 ... Memory, 1310 ... Display unit , 1312 ... Video signal output terminal, 1314 ... Input / output terminal, 1430 ... TV monitor, 1440 ... Personal computer.

Claims (12)

When two axes orthogonal to each other are defined as a first axis and a second axis, and an axis parallel to the normal of the surface including the first axis and the second axis is defined as a third axis,
A first substrate;
A support portion connected to the first base body, capable of vibrating along a plane including the first axis and the second axis, and having a first electrode;
A detection unit supported by the support unit, capable of vibrating along the third axis, and having a second electrode;
A third electrode disposed to face the first electrode;
A fourth electrode disposed to face the second electrode;
An electronic device comprising:   The electronic device according to claim 1, wherein at least one of the third electrode and the fourth electrode is provided on the first base. A second substrate connected to the first substrate;
The electronic device according to claim 1, wherein at least one of the third electrode and the fourth electrode is provided on the second base.   The said support part is provided in the frame shape which substantially surrounds the said detection part by planar view seen from the said 3rd axis direction, The Claim 1 thru | or 3 characterized by the above-mentioned. Electronic devices.   5. The electronic device according to claim 1, wherein a drive resonance frequency for vibrating the support portion is greater than a resonance frequency of the detection portion. A first signal output from at least one of the first electrode and the third electrode;
A second signal output from at least one of the second electrode and the fourth electrode,
6. The method according to claim 1, further comprising: an arithmetic processing unit that performs arithmetic processing based on the first signal and the second signal and outputs a third signal based on the arithmetic result. The electronic device according to one item.   The electronic device according to claim 6, wherein the arithmetic processing unit includes an adjustment unit that adjusts an amplitude of at least one of the first signal and the second signal. When two axes orthogonal to each other are defined as a first axis and a second axis, and an axis parallel to the normal of the surface including the first axis and the second axis is defined as a third axis,
A first substrate;
A support portion connected to the first base body, capable of vibrating along the first axis, and having a first electrode;
A detection unit supported by the support unit, capable of vibrating along the second axis, and having a second electrode;
A third electrode disposed to face the first electrode;
A fourth electrode disposed to face the second electrode;
An electronic device comprising: When two axes orthogonal to each other are defined as a first axis and a second axis, and an axis parallel to the normal of the surface including the first axis and the second axis is defined as a third axis,
A support portion having a first electrode capable of vibrating along a plane including the first axis and the second axis;
A detection unit supported by the support unit, capable of vibrating along the third axis, and having a second electrode;
A third electrode disposed to face the first electrode;
A signal detection method for an electronic device comprising: a fourth electrode arranged to face the second electrode;
A first step of obtaining a first signal which is a vibration component in the third axial direction of the support portion, which is output from at least one of the first electrode and the third electrode;
A second step of obtaining a second signal output from at least one of the second electrode and the fourth electrode;
A third step of performing a calculation process for removing a signal corresponding to the first signal from the second signal and outputting a detection signal;
A signal detection method for an electronic device, comprising: When two axes orthogonal to each other are defined as a first axis and a second axis, and an axis parallel to the normal of the surface including the first axis and the second axis is defined as a third axis,
A support portion capable of vibrating along the first axis and having a first electrode;
A detection unit supported by the support unit, capable of vibrating along the second axis, and having a second electrode;
A third electrode disposed to face the first electrode;
A signal detection method for an electronic device comprising: a fourth electrode arranged to face the second electrode;
A first step of obtaining a first signal which is a vibration component in the third axial direction of the support portion, which is output from at least one of the first electrode and the third electrode;
A second step of obtaining a second signal output from at least one of the second electrode and the fourth electrode;
A third step of performing a calculation process for removing a signal corresponding to the first signal from the second signal and outputting a detection signal;
A signal detection method for an electronic device, comprising:   An electronic apparatus comprising the electronic device according to any one of claims 1 to 8.   A moving body comprising the electronic device according to any one of claims 1 to 8.

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