JP2015168758A - Crosslinkable composition, production method of cured product, and cured product - Google Patents
Crosslinkable composition, production method of cured product, and cured product Download PDFInfo
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- JP2015168758A JP2015168758A JP2014044477A JP2014044477A JP2015168758A JP 2015168758 A JP2015168758 A JP 2015168758A JP 2014044477 A JP2014044477 A JP 2014044477A JP 2014044477 A JP2014044477 A JP 2014044477A JP 2015168758 A JP2015168758 A JP 2015168758A
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- carbon atoms
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- resin
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- 239000000203 mixture Substances 0.000 title claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000011347 resin Substances 0.000 claims abstract description 34
- 229920005989 resin Polymers 0.000 claims abstract description 34
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 22
- 150000001875 compounds Chemical class 0.000 claims abstract description 22
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 21
- 239000003960 organic solvent Substances 0.000 claims abstract description 15
- 125000001931 aliphatic group Chemical group 0.000 claims abstract description 10
- 125000002723 alicyclic group Chemical group 0.000 claims abstract description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 4
- 125000002947 alkylene group Chemical group 0.000 claims description 3
- 239000003431 cross linking reagent Substances 0.000 abstract description 6
- 239000011342 resin composition Substances 0.000 abstract description 6
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 48
- -1 2-heptenyl) group Chemical group 0.000 description 38
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 21
- 238000012360 testing method Methods 0.000 description 18
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 15
- 230000015572 biosynthetic process Effects 0.000 description 14
- 238000003786 synthesis reaction Methods 0.000 description 14
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 12
- 238000006243 chemical reaction Methods 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 11
- 239000000047 product Substances 0.000 description 11
- 229940125904 compound 1 Drugs 0.000 description 10
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 9
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 8
- 238000005259 measurement Methods 0.000 description 8
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- 238000003860 storage Methods 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 6
- AICOOMRHRUFYCM-ZRRPKQBOSA-N oxazine, 1 Chemical compound C([C@@H]1[C@H](C(C[C@]2(C)[C@@H]([C@H](C)N(C)C)[C@H](O)C[C@]21C)=O)CC1=CC2)C[C@H]1[C@@]1(C)[C@H]2N=C(C(C)C)OC1 AICOOMRHRUFYCM-ZRRPKQBOSA-N 0.000 description 6
- 238000010992 reflux Methods 0.000 description 6
- 238000013112 stability test Methods 0.000 description 6
- 229940126062 Compound A Drugs 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- 239000003973 paint Substances 0.000 description 5
- 238000005160 1H NMR spectroscopy Methods 0.000 description 4
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 4
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 4
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- WQDUMFSSJAZKTM-UHFFFAOYSA-N Sodium methoxide Chemical compound [Na+].[O-]C WQDUMFSSJAZKTM-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- OKRNLSUTBJUVKA-UHFFFAOYSA-N n,n,n',n'-Tetrakis(2-hydroxyethyl)adipamide Chemical compound OCCN(CCO)C(=O)CCCCC(=O)N(CCO)CCO OKRNLSUTBJUVKA-UHFFFAOYSA-N 0.000 description 4
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 4
- 125000006040 2-hexenyl group Chemical group 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- 239000001361 adipic acid Substances 0.000 description 3
- 229960000250 adipic acid Drugs 0.000 description 3
- 235000011037 adipic acid Nutrition 0.000 description 3
- 125000003342 alkenyl group Chemical group 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 125000000304 alkynyl group Chemical group 0.000 description 3
- 238000007112 amidation reaction Methods 0.000 description 3
- 238000001723 curing Methods 0.000 description 3
- 230000006837 decompression Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- PRAYXGYYVXRDDW-UHFFFAOYSA-N piperidin-2-ylmethanol Chemical compound OCC1CCCCN1 PRAYXGYYVXRDDW-UHFFFAOYSA-N 0.000 description 3
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 2
- WYGWHHGCAGTUCH-UHFFFAOYSA-N 2-[(2-cyano-4-methylpentan-2-yl)diazenyl]-2,4-dimethylpentanenitrile Chemical compound CC(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)C WYGWHHGCAGTUCH-UHFFFAOYSA-N 0.000 description 2
- YYROPELSRYBVMQ-UHFFFAOYSA-N 4-toluenesulfonyl chloride Chemical compound CC1=CC=C(S(Cl)(=O)=O)C=C1 YYROPELSRYBVMQ-UHFFFAOYSA-N 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-WFGJKAKNSA-N Dimethyl sulfoxide Chemical compound [2H]C([2H])([2H])S(=O)C([2H])([2H])[2H] IAZDPXIOMUYVGZ-WFGJKAKNSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 2
- JGFZNNIVVJXRND-UHFFFAOYSA-N N,N-Diisopropylethylamine (DIPEA) Chemical compound CCN(C(C)C)C(C)C JGFZNNIVVJXRND-UHFFFAOYSA-N 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- 150000001278 adipic acid derivatives Chemical group 0.000 description 2
- 230000002862 amidating effect Effects 0.000 description 2
- 230000009435 amidation Effects 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- ZXOYHFNGXIKXGI-UHFFFAOYSA-N dimethyl hexanedioate 2,2-dimethylhexanedioic acid Chemical compound COC(=O)CCCCC(=O)OC.CC(C)(CCCC(O)=O)C(O)=O ZXOYHFNGXIKXGI-UHFFFAOYSA-N 0.000 description 2
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229910000027 potassium carbonate Inorganic materials 0.000 description 2
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- YFUMMJNKHHASQS-UHFFFAOYSA-N (2,3,4,5,6-pentafluorophenyl)azanium;trifluoromethanesulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)F.[NH3+]C1=C(F)C(F)=C(F)C(F)=C1F YFUMMJNKHHASQS-UHFFFAOYSA-N 0.000 description 1
- SCZNXLWKYFICFV-UHFFFAOYSA-N 1,2,3,4,5,7,8,9-octahydropyrido[1,2-b]diazepine Chemical compound C1CCCNN2CCCC=C21 SCZNXLWKYFICFV-UHFFFAOYSA-N 0.000 description 1
- BDNKZNFMNDZQMI-UHFFFAOYSA-N 1,3-diisopropylcarbodiimide Chemical compound CC(C)N=C=NC(C)C BDNKZNFMNDZQMI-UHFFFAOYSA-N 0.000 description 1
- SGUVLZREKBPKCE-UHFFFAOYSA-N 1,5-diazabicyclo[4.3.0]-non-5-ene Chemical compound C1CCN=C2CCCN21 SGUVLZREKBPKCE-UHFFFAOYSA-N 0.000 description 1
- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 description 1
- JVYDLYGCSIHCMR-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)butanoic acid Chemical compound CCC(CO)(CO)C(O)=O JVYDLYGCSIHCMR-UHFFFAOYSA-N 0.000 description 1
- OZGSEIVTQLXWRO-UHFFFAOYSA-N 2,4,6-trichlorobenzoyl chloride Chemical compound ClC(=O)C1=C(Cl)C=C(Cl)C=C1Cl OZGSEIVTQLXWRO-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- MFGOFGRYDNHJTA-UHFFFAOYSA-N 2-amino-1-(2-fluorophenyl)ethanol Chemical compound NCC(O)C1=CC=CC=C1F MFGOFGRYDNHJTA-UHFFFAOYSA-N 0.000 description 1
- 125000004974 2-butenyl group Chemical group C(C=CC)* 0.000 description 1
- 125000000069 2-butynyl group Chemical group [H]C([H])([H])C#CC([H])([H])* 0.000 description 1
- YEKPNMQQSPHKBP-UHFFFAOYSA-N 2-methyl-6-nitrobenzoic anhydride Chemical compound CC1=CC=CC([N+]([O-])=O)=C1C(=O)OC(=O)C1=C(C)C=CC=C1[N+]([O-])=O YEKPNMQQSPHKBP-UHFFFAOYSA-N 0.000 description 1
- 125000006024 2-pentenyl group Chemical group 0.000 description 1
- FPQQSJJWHUJYPU-UHFFFAOYSA-N 3-(dimethylamino)propyliminomethylidene-ethylazanium;chloride Chemical compound Cl.CCN=C=NCCCN(C)C FPQQSJJWHUJYPU-UHFFFAOYSA-N 0.000 description 1
- VHYFNPMBLIVWCW-UHFFFAOYSA-N 4-Dimethylaminopyridine Chemical compound CN(C)C1=CC=NC=C1 VHYFNPMBLIVWCW-UHFFFAOYSA-N 0.000 description 1
- 0 CC*C1N(C)C(C)C(*)C1* Chemical compound CC*C1N(C)C(C)C(*)C1* 0.000 description 1
- 239000004971 Cross linker Substances 0.000 description 1
- QOSSAOTZNIDXMA-UHFFFAOYSA-N Dicylcohexylcarbodiimide Chemical compound C1CCCCC1N=C=NC1CCCCC1 QOSSAOTZNIDXMA-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 description 1
- VCUFZILGIRCDQQ-KRWDZBQOSA-N N-[[(5S)-2-oxo-3-(2-oxo-3H-1,3-benzoxazol-6-yl)-1,3-oxazolidin-5-yl]methyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical group O=C1O[C@H](CN1C1=CC2=C(NC(O2)=O)C=C1)CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F VCUFZILGIRCDQQ-KRWDZBQOSA-N 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- 238000005481 NMR spectroscopy Methods 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
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- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- LCKIEQZJEYYRIY-UHFFFAOYSA-N Titanium ion Chemical compound [Ti+4] LCKIEQZJEYYRIY-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- 239000003377 acid catalyst Substances 0.000 description 1
- 125000005073 adamantyl group Chemical group C12(CC3CC(CC(C1)C3)C2)* 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- FJDQFPXHSGXQBY-UHFFFAOYSA-L caesium carbonate Chemical compound [Cs+].[Cs+].[O-]C([O-])=O FJDQFPXHSGXQBY-UHFFFAOYSA-L 0.000 description 1
- 229910000024 caesium carbonate Inorganic materials 0.000 description 1
- HUCVOHYBFXVBRW-UHFFFAOYSA-M caesium hydroxide Inorganic materials [OH-].[Cs+] HUCVOHYBFXVBRW-UHFFFAOYSA-M 0.000 description 1
- PFKFTWBEEFSNDU-UHFFFAOYSA-N carbonyldiimidazole Chemical compound C1=CN=CN1C(=O)N1C=CN=C1 PFKFTWBEEFSNDU-UHFFFAOYSA-N 0.000 description 1
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 1
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- 239000001913 cellulose Substances 0.000 description 1
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- 239000000919 ceramic Substances 0.000 description 1
- FZFAMSAMCHXGEF-UHFFFAOYSA-N chloro formate Chemical compound ClOC=O FZFAMSAMCHXGEF-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- BGRWYRAHAFMIBJ-UHFFFAOYSA-N diisopropylcarbodiimide Natural products CC(C)NC(=O)NC(C)C BGRWYRAHAFMIBJ-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- RIFGWPKJUGCATF-UHFFFAOYSA-N ethyl chloroformate Chemical compound CCOC(Cl)=O RIFGWPKJUGCATF-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- YVSCCMNRWFOKDU-UHFFFAOYSA-N hexanedioic acid Chemical compound OC(=O)CCCCC(O)=O.OC(=O)CCCCC(O)=O YVSCCMNRWFOKDU-UHFFFAOYSA-N 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- 150000007529 inorganic bases Chemical class 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- GJRQTCIYDGXPES-UHFFFAOYSA-N iso-butyl acetate Natural products CC(C)COC(C)=O GJRQTCIYDGXPES-UHFFFAOYSA-N 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- FGKJLKRYENPLQH-UHFFFAOYSA-M isocaproate Chemical compound CC(C)CCC([O-])=O FGKJLKRYENPLQH-UHFFFAOYSA-M 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- OQAGVSWESNCJJT-UHFFFAOYSA-N isovaleric acid methyl ester Natural products COC(=O)CC(C)C OQAGVSWESNCJJT-UHFFFAOYSA-N 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- PSHKMPUSSFXUIA-UHFFFAOYSA-N n,n-dimethylpyridin-2-amine Chemical compound CN(C)C1=CC=CC=N1 PSHKMPUSSFXUIA-UHFFFAOYSA-N 0.000 description 1
- XTAZYLNFDRKIHJ-UHFFFAOYSA-N n,n-dioctyloctan-1-amine Chemical compound CCCCCCCCN(CCCCCCCC)CCCCCCCC XTAZYLNFDRKIHJ-UHFFFAOYSA-N 0.000 description 1
- YKYONYBAUNKHLG-UHFFFAOYSA-N n-Propyl acetate Natural products CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 1
- MGEGQAUINMTPGX-UHFFFAOYSA-N n-phenylaniline;trifluoromethanesulfonic acid Chemical compound [O-]S(=O)(=O)C(F)(F)F.C=1C=CC=CC=1[NH2+]C1=CC=CC=C1 MGEGQAUINMTPGX-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229920003050 poly-cycloolefin Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006149 polyester-amide block copolymer Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- LPNYRYFBWFDTMA-UHFFFAOYSA-N potassium tert-butoxide Chemical compound [K+].CC(C)(C)[O-] LPNYRYFBWFDTMA-UHFFFAOYSA-N 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 229940090181 propyl acetate Drugs 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- QLULGIRFKAWHOJ-UHFFFAOYSA-N pyridin-4-ylboronic acid Chemical class OB(O)C1=CC=NC=C1 QLULGIRFKAWHOJ-UHFFFAOYSA-N 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 description 1
- QDRKDTQENPPHOJ-UHFFFAOYSA-N sodium ethoxide Chemical compound [Na+].CC[O-] QDRKDTQENPPHOJ-UHFFFAOYSA-N 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
本発明は、ヒドロキシアルキルアミドと、有機溶剤と、カルボキシ基を有する樹脂とからなる架橋性組成物、およびその組成物を加熱することでなる硬化物に関する。 The present invention relates to a crosslinkable composition comprising a hydroxyalkylamide, an organic solvent, and a resin having a carboxy group, and a cured product obtained by heating the composition.
架橋剤を用いて樹脂組成物を硬化させることで、樹脂の耐熱性、機械特性、密着性、耐湿性、耐薬品性などを向上させることは様々な用途で幅広く用いられている。 It is widely used in various applications to improve the heat resistance, mechanical properties, adhesion, moisture resistance, chemical resistance, etc. of a resin by curing the resin composition using a crosslinking agent.
樹脂としてカルボキシ基を有する樹脂を使用する場合は、カルボキシ基と反応しうる官能基からなる架橋剤が用いられる。その官能基は、たとえば、イソシアネート基、ブロックイソシアネート基、エポキシ基、β−ヒドロキシアルキルアミド基、などが挙げられる。 When using resin which has a carboxy group as resin, the crosslinking agent which consists of a functional group which can react with a carboxy group is used. Examples of the functional group include an isocyanate group, a blocked isocyanate group, an epoxy group, and a β-hydroxyalkylamide group.
β−ヒドロキシアルキルアミドもカルボキシ基と反応する架橋剤である(特許文献1)。反応時の副生成物は水のみであり、硬化物に与える影響も少なく、作業者や環境にはまったく影響がないメリットがある。また、150℃で硬化させることが可能である。現在市販されているβ−ヒドロキシアルキルアミドとして、エムスケミー社のPrimid XL−552などが挙げられ、主に粉体塗料の架橋剤として用いられている(特許文献2)。 β-hydroxyalkylamide is also a crosslinking agent that reacts with a carboxy group (Patent Document 1). The only by-product during the reaction is water, and there is little effect on the cured product, and there is a merit that there is no effect on the worker or the environment. Further, it can be cured at 150 ° C. Currently available commercially available β-hydroxyalkylamides include Primid XL-552 manufactured by Ems Chemie, and are mainly used as a crosslinking agent for powder coatings (Patent Document 2).
上記記載の市販されているβ−ヒドロキシアルキルアミドを形成するカルボン酸またはその誘導体については、アジピン酸の両端にジエタノールアミンが縮合した構造の4官能型のものである。しかし、市販品は有機溶剤に対する溶解性が非常に悪く、液体塗料として用いられている例は少ない。多数のヒドロキシ基からなる化合物であることや、分子構造全体の結晶性および極性の高さが溶解性を悪化させていると考えられる。ヒドロキシ基が多いため、水性塗料への応用例は一部みられる(特許文献3)が、溶剤系の塗料に応用されている例は見られない。溶解性が悪く均一に混合できていない塗料では膜物性の一部が低下、または、その物性が安定しないといった問題が発生する。 The commercially available carboxylic acid or derivative thereof forming β-hydroxyalkylamide described above is a tetrafunctional type having a structure in which diethanolamine is condensed on both ends of adipic acid. However, commercial products have very poor solubility in organic solvents, and few examples are used as liquid paints. It is considered that the compound is composed of a large number of hydroxy groups, and the crystallinity and polarity of the entire molecular structure deteriorate the solubility. Since there are many hydroxy groups, some examples of application to water-based paints are seen (Patent Document 3), but no examples of application to solvent-based paints are found. If the paint has poor solubility and cannot be mixed uniformly, there is a problem that a part of the film physical properties are lowered or the physical properties are not stable.
本発明は上記の現状に鑑みてなされたものであり、有機溶媒に対する溶解性に優れ、カルボキシ基と低い温度で反応する架橋剤である化合物を含む架橋性樹脂組成物、および、その硬化物を提供することを目的とする。 The present invention has been made in view of the above-described situation, and has a crosslinkable resin composition containing a compound that is a crosslinker that has excellent solubility in an organic solvent and reacts with a carboxy group at a low temperature, and a cured product thereof. The purpose is to provide.
本発明者は、以上の諸問題点を考慮し解決すべく鋭意研究を重ねた結果、本発明に至った。 The inventor of the present invention has arrived at the present invention as a result of intensive studies to solve the above problems in consideration.
すなわち本発明は、下記一般式(1)で表される化合物と、有機溶剤と、カルボキシ基を有する樹脂とからなる架橋性組成物に関する。 That is, the present invention relates to a crosslinkable composition comprising a compound represented by the following general formula (1), an organic solvent, and a resin having a carboxy group.
一般式(1)
(式中、Xは、n価の炭素数4以上の直鎖の脂肪族炭化水素基、あるいは、n価の炭素数6以上の脂環式炭化水素基を表し、
nは2〜6の整数である。
Aは、下記一般式(2)、または、下記一般式(3)で表される基を表す。)
(In the formula, X represents an n-valent straight-chain aliphatic hydrocarbon group having 4 or more carbon atoms or an n-valent alicyclic hydrocarbon group having 6 or more carbon atoms,
n is an integer of 2-6.
A represents a group represented by the following general formula (2) or the following general formula (3). )
一般式(2)
(式中、R1〜R4は、それぞれ独立に、水素原子、または、下記一般式(4)で表される基を表し、
R1〜R4のうち、少なくとも1つは、下記一般式(4)で表される基である。)
(In the formula, R 1 to R 4 each independently represent a hydrogen atom or a group represented by the following general formula (4);
At least one of R 1 to R 4 is a group represented by the following general formula (4). )
一般式(3)
(式中、R5〜R9は、それぞれ独立に、水素原子、または、下記一般式(4)で表される基を表し、
R5〜R9のうち、少なくとも1つは、下記一般式(4)で表される基である。)
(Wherein R 5 to R 9 each independently represents a hydrogen atom or a group represented by the following general formula (4);
At least one of R 5 to R 9 is a group represented by the following general formula (4). )
一般式(4)
(式中、Yは直接結合、または、炭素数1〜3のアルキレン基を表す。) (In the formula, Y represents a direct bond or an alkylene group having 1 to 3 carbon atoms.)
更に本発明は、Xが炭素数6〜12の直鎖の脂肪族炭化水素基であることを特徴とする、上記架橋性組成物に関する。 Furthermore, the present invention relates to the above crosslinkable composition, characterized in that X is a linear aliphatic hydrocarbon group having 6 to 12 carbon atoms.
更に本発明は、上記架橋性組成物を加熱してなる硬化物の製造方法に関する。 Furthermore, this invention relates to the manufacturing method of the hardened | cured material formed by heating the said crosslinkable composition.
更に本発明は、上記製造方法で得られる硬化物に関する。 Furthermore, this invention relates to the hardened | cured material obtained with the said manufacturing method.
本発明により、有機溶媒に対する溶解性に優れ、カルボキシ基と低温で反応する架橋剤である化合物を含む樹脂組成物、その硬化物を提供することができた。 INDUSTRIAL APPLICABILITY According to the present invention, it is possible to provide a resin composition containing a compound that is a crosslinking agent that has excellent solubility in an organic solvent and reacts with a carboxy group at a low temperature, and a cured product thereof.
以下、詳細にわたって本発明を説明する。 Hereinafter, the present invention will be described in detail.
一般式(1)におけるXは、n価の炭素数4以上の直鎖の脂肪族炭化水素基、あるいは、n価の炭素数6以上の脂環式炭化水素基を表し、nは2〜6の整数であり、Aは、一般式(2)、または、一般式(3)で表される基を表す。 X in the general formula (1) represents an n-valent straight-chain aliphatic hydrocarbon group having 4 or more carbon atoms or an n-valent alicyclic hydrocarbon group having 6 or more carbon atoms, and n is 2 to 6 And A represents a group represented by the general formula (2) or the general formula (3).
一般式(1)におけるXの、直鎖の脂肪族炭化水素基としては、アルキル基、アルケニル基、および、アルキニル基のいずれかからn−1個の水素原子が結合手になったものが挙げられ、本発明ではこれらを、n価のアルキル基、n価のアルケニル基、および、n価のアルキニル基とする。 Examples of the linear aliphatic hydrocarbon group represented by X in the general formula (1) include those in which n-1 hydrogen atoms are bonded from any one of an alkyl group, an alkenyl group, and an alkynyl group. In the present invention, these are an n-valent alkyl group, an n-valent alkenyl group, and an n-valent alkynyl group.
ここで、炭素数4以上の2価以上のアルキル基としては、1,4−ブチル基、1,5−ペンチル基、1,6−ヘキシル基、1,7−ヘプチル基、1,8−オクチル基、1,9−ノニル基、1,6−デシル基、1,10−デシル基、1,11−ウンデシル基、1,12−ドデシル基、1,13−トリデシル基、1,14−テトラデシル基、1,15−ペンタデシル基、1,16−ヘキサデシル基、1,17−ヘプタデシル基、1,18−オクタデシル基、1,19−ノナデシル基、1,20−イコシル基、1,3,6−ヘキシル基、1,4,7−ヘプチル基、1,2,8−オクチル基、1,3,9−ノニル基、1,3,4,6−ヘキシル基、1,4,6,7−ヘプチル基、1,4,5,6,7−ヘプチル基、1,2,3,4,5,6−ヘキシル基などが挙げられる。 Here, the divalent or higher alkyl group having 4 or more carbon atoms includes 1,4-butyl group, 1,5-pentyl group, 1,6-hexyl group, 1,7-heptyl group, 1,8-octyl group. Group, 1,9-nonyl group, 1,6-decyl group, 1,10-decyl group, 1,11-undecyl group, 1,12-dodecyl group, 1,13-tridecyl group, 1,14-tetradecyl group 1,15-pentadecyl group, 1,16-hexadecyl group, 1,17-heptadecyl group, 1,18-octadecyl group, 1,19-nonadecyl group, 1,20-icosyl group, 1,3,6-hexyl Group, 1,4,7-heptyl group, 1,2,8-octyl group, 1,3,9-nonyl group, 1,3,4,6-hexyl group, 1,4,6,7-heptyl group 1,4,5,6,7-heptyl group, 1,2,3,4,5,6-hexyl And the like.
また、炭素数4以上の2価以上のアルケニル基としては、1,4−(2−ブテニル)基、1,5−(2−ペンテニル)基、1,6−(2−ヘキセニル)基、1,7−(2−ヘプテニル)基、1,8−(2−オクテニル)基、1,9−(2−ノネニル)基、1,10−(2−デセニル)基、1,11−(2−ウンデセニル)基、1,12−(2−ドデセニル)基、1,13−(2−トリデセニル)基、1,14−(2−テトラデセニル)基、1,15−(2−ペンタデセニル)基、1,16−(2−ヘキサデセニル)基、1,17−(2−ヘプタデセニル)基、1,18−(2−オクタデセニル)基、1,19−(2−ノナデセニル)基、1,3,6−(2−ヘキセニル)基、1,4,7−(3−ヘプセニル)基、1,2,8−(4−オクテニル)基、1,3,9−(5−ノネニル)基、1,3,4,6−(2−ヘキセニル)基、1,4,6,7−(3−ヘプセニル)基、1,4,5,6,7−(3−ヘプセニル)基などが挙げられる。 The divalent or higher alkenyl group having 4 or more carbon atoms includes 1,4- (2-butenyl) group, 1,5- (2-pentenyl) group, 1,6- (2-hexenyl) group, 1 , 7- (2-heptenyl) group, 1,8- (2-octenyl) group, 1,9- (2-nonenyl) group, 1,10- (2-decenyl) group, 1,11- (2- Undecenyl) group, 1,12- (2-dodecenyl) group, 1,13- (2-tridecenyl) group, 1,14- (2-tetradecenyl) group, 1,15- (2-pentadecenyl) group, 1, 16- (2-hexadecenyl) group, 1,17- (2-heptadecenyl) group, 1,18- (2-octadecenyl) group, 1,19- (2-nonadecenyl) group, 1,3,6- (2 -Hexenyl) group, 1,4,7- (3-heptenyl) group, 1,2,8- (4-octeni) ) Group, 1,3,9- (5-nonenyl) group, 1,3,4,6- (2-hexenyl) group, 1,4,6,7- (3-heptenyl) group, 1,4, Examples include 5,6,7- (3-heptenyl) group.
また、炭素数4以上の2価以上のアルキニル基としては、1,4−(2−ブチニル)基、1,5−(2−ペンチニル)基、1,6−(2−ヘキシニル)基、1,7−(2−ヘプシニル)基、1,8−(2−オクチニル)基、1,9−(2−ノニル)基、1,10−(2−デシニル)基、1,11−(2−ウンデシニル)基、1,12−(2−ドデシニル)基、1,13−(2−トリデシニル)基、1,14−(2−テトラデシニル)基、1,15−(2−ペンタデシニル)基、1,16−(2−ヘキサデシニル)基、1,17−(2−ヘプタデシニル)基、1,18−(2−オクタデシニル)基、1,19−(2−ノナデシニル)基、1,3,6−(2−ヘキシニル)基、1,4,7−(3−ヘプシニル)基、1,2,8−(4−オクシニル)基、1,3,9−(5−ノニル)基、1,3,4,6−(2−ヘキシニル)基、1,4,6,7−(3−ヘプシニル)基、1,4,5,6,7−(3−ヘプシニル)基などが挙げられる。 The divalent or higher alkynyl group having 4 or more carbon atoms includes 1,4- (2-butynyl) group, 1,5- (2-pentynyl) group, 1,6- (2-hexynyl) group, 1 , 7- (2-Hepsinyl) group, 1,8- (2-octynyl) group, 1,9- (2-nonyl) group, 1,10- (2-decynyl) group, 1,11- (2- Undecynyl) group, 1,12- (2-dodecynyl) group, 1,13- (2-tridecynyl) group, 1,14- (2-tetradecynyl) group, 1,15- (2-pentadecynyl) group, 1, 16- (2-hexadecynyl) group, 1,17- (2-heptadecynyl) group, 1,18- (2-octadecynyl) group, 1,19- (2-nonadecynyl) group, 1,3,6- (2 -Hexynyl) group, 1,4,7- (3-hepsinyl) group, 1,2,8- (4-octynyl) Group, 1,3,9- (5-nonyl) group, 1,3,4,6- (2-hexynyl) group, 1,4,6,7- (3-hepsinyl) group, 1,4,5 , 6,7- (3-hepsinyl) group and the like.
一般式(1)における脂環式炭化水素基としては、シクロアルキル基、デカヒドロナフチル基、アダマンチル基などの1価の基からn−1個の水素原子が結合手になったものが挙げられる。 Examples of the alicyclic hydrocarbon group in the general formula (1) include those in which n-1 hydrogen atoms are bonded from a monovalent group such as a cycloalkyl group, a decahydronaphthyl group, and an adamantyl group. .
ここで、炭素数6以上の2価以上の脂環式炭化水素基としては、1,1−シクロヘキシル基、1,2−シクロヘキシル基、1,3−シクロヘキシル基、1,4−シクロヘキシル基、1,2,4−シクロヘキシル基、1,3,5−シクロヘキシル基、1,2,4,5−シクロヘキシル基、1、2,3,4,5,6−シクロヘキシル基、2,6−デカヒドロナフチル基、1,3−アダマンチル基、1、3、5ーアダマンチル基などが挙げられる。 Here, examples of the divalent or higher alicyclic hydrocarbon group having 6 or more carbon atoms include 1,1-cyclohexyl group, 1,2-cyclohexyl group, 1,3-cyclohexyl group, 1,4-cyclohexyl group, 1 , 2,4-cyclohexyl group, 1,3,5-cyclohexyl group, 1,2,4,5-cyclohexyl group, 1,2,3,4,5,6-cyclohexyl group, 2,6-decahydronaphthyl Group, 1,3-adamantyl group, 1,3,5-adamantyl group and the like.
一般式(1)中のXにおいて、好ましくは、炭素数6〜20の直鎖の脂肪族炭化水素基であり、より好ましくは、炭素数6〜12の直鎖の脂肪族炭化水素基である。炭素数20を超えるとロウ状固体となり、有機溶剤や樹脂への溶解性が低下する恐れがある。 X in the general formula (1) is preferably a linear aliphatic hydrocarbon group having 6 to 20 carbon atoms, and more preferably a linear aliphatic hydrocarbon group having 6 to 12 carbon atoms. . When the number of carbon atoms exceeds 20, a waxy solid is formed, and the solubility in organic solvents and resins may be reduced.
一般式(1)中のnにおいて、好ましくは、n=2であり、さらに好ましくは、n=2であって炭素数6〜12の直鎖の脂肪族炭化水素基の両末端の水素原子が結合手になったものである。 In the general formula (1), n is preferably n = 2, and more preferably n = 2, and the hydrogen atoms at both ends of the linear aliphatic hydrocarbon group having 6 to 12 carbon atoms are It became a bond.
一般式(4)中における、炭素数1〜3のアルキレン基としては、メチル基、エチル基、プロピル基、イソプロピル基から、1個の水素原子を除いてできる二価の基を挙げることができる。 Examples of the alkylene group having 1 to 3 carbon atoms in the general formula (4) include a divalent group formed by removing one hydrogen atom from a methyl group, an ethyl group, a propyl group, and an isopropyl group. .
本発明で用いられる一般式(1)で表される化合物の代表例を、以下の表1に示すが、本発明は、この代表例に限定されるものではない。 Although the representative example of the compound represented by General formula (1) used by this invention is shown in the following Table 1, this invention is not limited to this representative example.
表1
本発明の一般式(1)で表される化合物は、2価以上のカルボン酸またはその誘導体と、ヒドロキシル基を有するアミンとをアミド化することで製造することができる。 The compound represented by the general formula (1) of the present invention can be produced by amidating a divalent or higher carboxylic acid or a derivative thereof with an amine having a hydroxyl group.
ヒドロキシル基を有するアミンと、カルボン酸またはその誘導体とをアミド化する方法は様々あるが、カルボン酸の場合は水、カルボン酸エステルの場合はアルコール、カルボン酸無水物またはハロゲン化物の場合は酸を取り除くことで反応を進行させることができる。水やアルコールの場合は加熱または減圧、あるいはその両方により反応系外へ留去することが容易である。酸の場合はトリエチルアミン、トリブチルアミン、ジメチルベンジルアミン、ピリジン、ジメチルアミノピリジン、1,8−ジアザビシクロ[5.4.0]−7−ウンデセン、水酸化ナトリウム、水酸化カリウム、炭酸ナトリウム、炭酸カリウムなどの塩基によって取り除くことができる。 There are various methods for amidating an amine having a hydroxyl group with a carboxylic acid or a derivative thereof. Water is used for carboxylic acid, alcohol is used for carboxylic acid ester, and acid is used for carboxylic acid anhydride or halide. The reaction can proceed by removing it. In the case of water or alcohol, it can be easily distilled out of the reaction system by heating and / or decompression. In the case of acid, triethylamine, tributylamine, dimethylbenzylamine, pyridine, dimethylaminopyridine, 1,8-diazabicyclo [5.4.0] -7-undecene, sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate, etc. Can be removed by
上記アミド化の際に触媒を使用することができる。たとえば、硫酸、塩酸、硝酸、メタンスルホン酸、p−トルエンスルホン酸などの酸触媒、水酸化ナトリウム、水酸化カリウム、水酸化セシウム、炭酸ナトリウム、炭酸カリウム、炭酸セシウムなどの無機塩基触媒、トリエチルアミン、ジイソプロピルエチルアミン、トリブチルアミン、トリオクチルアミン、テトラメチルエチレンジアミン、N,N−ジメチルエタノールアミン、N,N−ジメチルベンジルアミン、ピリジン、4−(ジメチルアミノ)ピリジン、イミダゾール、N−メチルイミダゾール、1,8−ジアザビシクロ[5.4.0]−7−ウンデセン、1,5−ジアザビシクロ[4.3.0]−5−ノネンなどのアミン類や、ナトリウムメトキシド、ナトリウムエトキシド、カリウム−tert−ブトキシドなどのアルコキシド類をはじめとする有機塩基触媒、鉄(III)、ジルコニウム(IV)、スカンジウム(III)、チタン(IV)、スズ(IV)、ハフニウム(IV)などの金属イオンを含む塩や錯体、ジフェニルアンモニウムトリフラート、ペンタフルオロフェニルアンモニウムトリフラートなどのアンモニウム塩、などが挙げられる。 A catalyst can be used in the amidation. For example, an acid catalyst such as sulfuric acid, hydrochloric acid, nitric acid, methanesulfonic acid, p-toluenesulfonic acid, inorganic base catalyst such as sodium hydroxide, potassium hydroxide, cesium hydroxide, sodium carbonate, potassium carbonate, cesium carbonate, triethylamine, Diisopropylethylamine, tributylamine, trioctylamine, tetramethylethylenediamine, N, N-dimethylethanolamine, N, N-dimethylbenzylamine, pyridine, 4- (dimethylamino) pyridine, imidazole, N-methylimidazole, 1,8 -Amines such as diazabicyclo [5.4.0] -7-undecene, 1,5-diazabicyclo [4.3.0] -5-nonene, sodium methoxide, sodium ethoxide, potassium tert-butoxide, etc. Alkoxide Organic base catalysts such as iron (III), zirconium (IV), scandium (III), titanium (IV), tin (IV), salts and complexes containing metal ions such as hafnium (IV), diphenylammonium triflate And ammonium salts such as pentafluorophenylammonium triflate.
上記アミド化反応において、必要に応じて溶媒や触媒を使用することができる。使用する溶媒は、アルコール、アミン、カルボン酸など反応基質と反応する溶媒以外であれば使用できる。たとえば、ヘキサン、ヘプタン、オクタン、シクロヘキサン、ベンゼン、トルエン、エチルベンゼン、キシレン、酢酸エチル、酢酸ブチル、酢酸イソブチル、メチルエチルケトン(MEK)、メチルイソブチルケトン、テトラヒドロフラン(THF)、シクロヘキサノン、ジクロロメタン、クロロホルム、ジメチルスルホキシド、ジメチルホルムアミド、ジメチルアセトアミド、などが挙げられる。 In the amidation reaction, a solvent or a catalyst can be used as necessary. The solvent to be used can be used as long as it is other than a solvent that reacts with a reaction substrate such as alcohol, amine, or carboxylic acid. For example, hexane, heptane, octane, cyclohexane, benzene, toluene, ethylbenzene, xylene, ethyl acetate, butyl acetate, isobutyl acetate, methyl ethyl ketone (MEK), methyl isobutyl ketone, tetrahydrofuran (THF), cyclohexanone, dichloromethane, chloroform, dimethyl sulfoxide, Examples include dimethylformamide, dimethylacetamide, and the like.
特にカルボン酸とのアミド化において、縮合剤を用いて行うことができる。縮合剤とは、カルボン酸またはアミンを活性化させ、エステル化反応を温和な条件で行うことができると同時に、副生成物の水は縮合剤と結合して別の化合物となるため、触媒作用と水除去作用を兼ね備えた化合物である。このような縮合剤としては、たとえば、ジシクロヘキシルカルボジイミド、ジイソプロピルカルボジイミド、p−トルエンスルホニルクロリド、1−エチル−3−(N,N−ジメチルアミノプロピル)カルボジイミド塩酸塩、カルボニルジイミダゾール、クロロギ酸エチル、クロロギ酸イソブチル、2,4,6−トリクロロ安息香酸クロリド、2−メチル−6−ニトロ安息香酸無水物、O−(7−アザベンゾトリアゾール−1−イル)−N,N,N’,N’−テトラメチルウロニウムヘキサフルオロホスファート、4−ボロノピリジニウム塩、などが挙げられる。 In particular, the amidation with carboxylic acid can be performed using a condensing agent. A condensing agent activates a carboxylic acid or an amine, and the esterification reaction can be carried out under mild conditions. At the same time, the by-product water is combined with the condensing agent to form another compound. And a compound having a water removing action. Such condensing agents include, for example, dicyclohexylcarbodiimide, diisopropylcarbodiimide, p-toluenesulfonyl chloride, 1-ethyl-3- (N, N-dimethylaminopropyl) carbodiimide hydrochloride, carbonyldiimidazole, ethyl chloroformate, chloroformate Acid isobutyl, 2,4,6-trichlorobenzoic acid chloride, 2-methyl-6-nitrobenzoic anhydride, O- (7-azabenzotriazol-1-yl) -N, N, N ′, N′— Tetramethyluronium hexafluorophosphate, 4-boronopyridinium salt, and the like.
本発明の一般式(1)で表される化合物は、有機溶剤に可溶であることが特徴である。 The compound represented by the general formula (1) of the present invention is characterized by being soluble in an organic solvent.
ここでの有機溶剤としては、たとえば、メタノール、エタノール、プロパノール、イソプロパノール、ブタノール、イソブタノール、sec−ブタノール、tert−ブタノール、アセトン、メチルエチルケトン、メチルイソブチルケトン、テトラヒドロフラン(THF)、シクロヘキサノン、酢酸メチル、酢酸エチル、酢酸プロピル、酢酸ブチル、ベンゼン、トルエン、エチルベンゼン、キシレン、シクロヘキサン、ヘキサン、オクタン、シクロロメタン、クロロホルム、ジメチルホルムアミド、ジメチルアセトアミド、アセトニトリル、ジメチルスルホキシド、などが挙げられる。 Examples of the organic solvent here include methanol, ethanol, propanol, isopropanol, butanol, isobutanol, sec-butanol, tert-butanol, acetone, methyl ethyl ketone, methyl isobutyl ketone, tetrahydrofuran (THF), cyclohexanone, methyl acetate, and acetic acid. Examples include ethyl, propyl acetate, butyl acetate, benzene, toluene, ethylbenzene, xylene, cyclohexane, hexane, octane, cyclomethane, chloroform, dimethylformamide, dimethylacetamide, acetonitrile, dimethylsulfoxide, and the like.
本発明の架橋性組成物は、さらに、必要に応じて、非反応性樹脂、熱硬化性樹脂、光硬化性樹脂、併用する硬化剤、光開始剤、増感剤、レベリング剤、紫外線吸収剤、光安定剤、酸化防止剤、無機フィラー、接着付与剤、などの添加剤を加えてもよい。 The crosslinkable composition of the present invention further comprises a non-reactive resin, a thermosetting resin, a photocurable resin, a curing agent used in combination, a photoinitiator, a sensitizer, a leveling agent, and an ultraviolet absorber, if necessary. Additives such as a light stabilizer, an antioxidant, an inorganic filler, and an adhesion-imparting agent may be added.
本発明の架橋性組成物を、各種基材の片面または両面に塗布し、もしくは金型等を用いて成形後、必要に応じて加熱乾燥後、100〜200℃において加熱硬化させることで目的の硬化物を得ることができる。基材としては、たとえば、ガラス、セラミック、ポリカーボネート、ポリエステル、ウレタン、アクリル、ポリアセテートセルロース、ポリアミド、ポリイミド、ポリスチレン、エポキシ樹脂、ポリオレフィン、ポリシクロオレフィン、ポリビニルアルコール、ステンレス等の各種金属、などが挙げられる。 The crosslinkable composition of the present invention is applied to one or both surfaces of various base materials, or after molding using a mold or the like, followed by heat drying as necessary, and then heat curing at 100 to 200 ° C. A cured product can be obtained. Examples of the base material include glass, ceramic, polycarbonate, polyester, urethane, acrylic, polyacetate cellulose, polyamide, polyimide, polystyrene, epoxy resin, polyolefin, polycycloolefin, polyvinyl alcohol, various metals such as stainless steel, and the like. It is done.
本発明の架橋性組成物の加熱硬化温度として、好ましくは、100℃〜180℃であり、より好ましくは100℃〜150℃であり、更に好ましくは100℃〜140℃で加熱することである。 The heat curing temperature of the crosslinkable composition of the present invention is preferably 100 ° C to 180 ° C, more preferably 100 ° C to 150 ° C, and further preferably 100 ° C to 140 ° C.
次に、本発明のカルボキシ基を有する樹脂は、樹脂の末端および/または側鎖にカルボキシ基からなる樹脂である。樹脂は直鎖、分岐、星状を問わない。たとえば、カルボキシ基末端の樹脂としては、ポリエステル、ポリアミド、ポリエステルアミド、ポリエーテルエステル、アクリル、ポリブタジエン、ポリイソプレンなどが挙げられ、側鎖にカルボキシ基を有する樹脂としては、アクリル、ポリウレタンなどが挙げられる。 Next, the resin having a carboxy group of the present invention is a resin comprising a carboxy group at the terminal and / or side chain of the resin. The resin may be linear, branched or star-shaped. For example, examples of the resin having a carboxy group terminal include polyester, polyamide, polyesteramide, polyether ester, acrylic, polybutadiene, and polyisoprene. Examples of the resin having a carboxy group in the side chain include acrylic and polyurethane. .
以下に実施例をもって本発明を具体的に説明するが、本発明はこれらに限定されるものではない。なお、特に断りのない限り「%」は「重量%」を、「部」は「重量部」を意味する。 EXAMPLES The present invention will be specifically described below with reference to examples, but the present invention is not limited to these examples. Unless otherwise specified, “%” means “% by weight” and “parts” means “parts by weight”.
実施例中のNMR測定はすべて、JEOL社製のJNM−ECX400Pを用いて1H−NMR測定をDMSO−d6中で行った。数平均分子量(Mn)と重量平均分子量(Mw)は東ソー社製のGPC−8020によって測定したポリスチレン換算の値である。 All NMR measurements in the examples, the the 1 H-NMR measurement using a JEOL Co. JNM-ECX400P were performed in DMSO-d6. The number average molecular weight (Mn) and the weight average molecular weight (Mw) are values in terms of polystyrene measured by GPC-8020 manufactured by Tosoh Corporation.
実施例中のIR測定はすべて、PerkinElmer社製のSpectrum Oneを用いて行った。 All IR measurements in the examples were performed using Spectrum One manufactured by PerkinElmer.
以下、実施例における化合物番号は表1における化合物番号を示す。 Hereinafter, the compound numbers in the examples indicate the compound numbers in Table 1.
合成例1 化合物1の合成I
攪拌機、温度計、滴下装置、ディーンスターク管、還流冷却器、ガス導入管を備えた反応容器に、アジピン酸(ヘキサン二酸)146部、2−ピペリジンメタノール230部、水酸化カリウム2部、トルエン200部を入れ、ディーンスターク管にはトルエンを満たし、窒素を吹き込みながら加熱還流させ、共沸によって生成する水を除去した。4時間後、トルエンをすべて除去し、1H−NMR測定、IR測定を行って目的物が生成していることを確認した。50℃まで降温した後、得られた均一な淡黄色透明の溶液を取り出した。
Synthesis Example 1 Synthesis 1 of Compound 1
In a reaction vessel equipped with a stirrer, thermometer, dropping device, Dean-Stark tube, reflux condenser, gas introduction tube, 146 parts of adipic acid (hexanedioic acid), 230 parts of 2-piperidinemethanol, 2 parts of potassium hydroxide, toluene 200 parts were added, and the Dean-Stark tube was filled with toluene and heated to reflux while blowing nitrogen to remove water produced by azeotropy. After 4 hours, all the toluene was removed, and 1 H-NMR measurement and IR measurement were performed to confirm that the target product was produced. After the temperature was lowered to 50 ° C., the obtained uniform pale yellow transparent solution was taken out.
合成例2 化合物1の合成II
窒素雰囲気下、攪拌機、温度計、ディーンスターク管、還流冷却器、減圧装置を備えた反応容器に、アジピン酸ジメチル(ヘキサン二酸ジメチル)174部、2−ピペリジンメタノール230部、ナトリウムメトキシド3部を入れ、常圧状態で内温が90℃になるまで加熱攪拌した。内温が90℃に達したら、500hPaの減圧状態で2時間加熱攪拌し、生成するメタノールを留去しながら反応を進行させた。2時間後、200hPaの減圧状態でさらに1時間加熱攪拌し、残存するメタノールを全て留去した。1H−NMR測定、IR測定を行って目的物が生成していることを確認した。50℃まで降温した後、得られた均一な淡黄色透明の溶液を取り出した。
Synthesis Example 2 Synthesis of Compound 1 II
In a nitrogen atmosphere, in a reaction vessel equipped with a stirrer, thermometer, Dean-Stark tube, reflux condenser, and decompression device, 174 parts dimethyl adipate (dimethyl hexanedioate), 230 parts 2-piperidinemethanol, 3 parts sodium methoxide And stirred under normal pressure until the internal temperature reached 90 ° C. When the internal temperature reached 90 ° C., the mixture was heated and stirred for 2 hours under a reduced pressure of 500 hPa, and the reaction was allowed to proceed while distilling off the produced methanol. After 2 hours, the mixture was further heated and stirred for 1 hour under a reduced pressure of 200 hPa, and all remaining methanol was distilled off. 1 H-NMR measurement and IR measurement were performed to confirm that the target product was produced. After the temperature was lowered to 50 ° C., the obtained uniform pale yellow transparent solution was taken out.
合成例3 化合物1の合成III
窒素雰囲気下、攪拌機、温度計、ディーンスターク管、還流冷却器、減圧装置を備えた反応容器に、アジピン酸ジメチル(ヘキサン二酸ジメチル)174部、2−ピペリジンメタノール230部、1,8−ジアザビシクロ[5.4.0]−7−ウンデセン8部を入れ、常圧状態で内温が90℃になるまで加熱攪拌した。内温が90℃に達したら、500hPaの減圧状態で2時間加熱攪拌し、生成するメタノールを留去しながら反応を進行させた。2時間後、200hPaの減圧状態でさらに1時間加熱攪拌し、残存するメタノールを全て留去した。1H−NMR測定、IR測定を行って目的物が生成していることを確認した。50℃まで降温した後、得られた均一な淡黄色透明の溶液を取り出した。
Synthesis Example 3 Synthesis of Compound 1 III
Under a nitrogen atmosphere, in a reaction vessel equipped with a stirrer, thermometer, Dean-Stark tube, reflux condenser, and decompression device, 174 parts of dimethyl adipate (dimethyl hexanedioate), 230 parts of 2-piperidinemethanol, 1,8-diazabicyclo [5.4.0] -7-Undecene (8 parts) was added and stirred under normal pressure until the internal temperature reached 90 ° C. When the internal temperature reached 90 ° C., the mixture was heated and stirred for 2 hours under a reduced pressure of 500 hPa, and the reaction was allowed to proceed while distilling off the produced methanol. After 2 hours, the mixture was further heated and stirred for 1 hour under a reduced pressure of 200 hPa, and all remaining methanol was distilled off. 1 H-NMR measurement and IR measurement were performed to confirm that the target product was produced. After the temperature was lowered to 50 ° C., the obtained uniform pale yellow transparent solution was taken out.
化合物2〜21についても、上記合成例と同様の操作により合成した。 Compounds 2 to 21 were also synthesized by the same operation as in the above synthesis example.
樹脂合成例1 カルボキシ基を有する樹脂の合成1
攪拌機、温度計、滴下装置、還流冷却器、ガス導入管を備えた反応容器にメチルエチルケトンを500部入れ、窒素を吹き込みながら70℃で1時間加熱攪拌した。その後、ブチルアクリレート374.4部、アクリル酸25.6部、2,2’−アゾビス(2,4−ジメチルバレロニトリル)11.4部、メチルエチルケトン100部を混合した溶液を滴下装置から2時間かけて滴下した。さらに70℃で2時間反応させ、2,2’−アゾビス(2,4−ジメチルバレロニトリル)1.1部とメチルエチルケトン10部からなる溶液を加え、さらに1時間攪拌した。できた樹脂溶液は固形分NV=39.1%、数平均分子量Mn=16,000、重量平均分子量Mw=34,000、酸価AV=50.2mgKOH/gであった。
Resin Synthesis Example 1 Synthesis of Resin Having Carboxy Group 1
500 parts of methyl ethyl ketone was put into a reaction vessel equipped with a stirrer, a thermometer, a dropping device, a reflux condenser, and a gas introduction tube, and heated and stirred at 70 ° C. for 1 hour while blowing nitrogen. Thereafter, a solution in which 374.4 parts of butyl acrylate, 25.6 parts of acrylic acid, 11.4 parts of 2,2′-azobis (2,4-dimethylvaleronitrile) and 100 parts of methyl ethyl ketone were mixed from a dropping device over 2 hours. And dripped. The mixture was further reacted at 70 ° C. for 2 hours, a solution consisting of 1.1 parts of 2,2′-azobis (2,4-dimethylvaleronitrile) and 10 parts of methyl ethyl ketone was added, and the mixture was further stirred for 1 hour. The resulting resin solution had a solid content NV = 39.1%, a number average molecular weight Mn = 16,000, a weight average molecular weight Mw = 34,000, and an acid value AV = 50.2 mgKOH / g.
樹脂合成例2 カルボキシ基を有する樹脂の合成2
攪拌機、温度計、還流冷却器、ガス導入管を備えた反応容器に、クラレポリオールP−1010(クラレ(株)社製 水酸基価112mgKOH/g)を1002部、ジメチロールブタン酸237部、イソホロンジイソシアネート576部、メチルエチルケトン1815部を仕込み、窒素気流下で80℃まで昇温した。その後ジブチル錫ジラウレートを0.1部加えた。4時間反応させたのち、IRを測定し2270cm-1付近のイソシアネート由来のピークが消失したことを確認した。できた樹脂溶液は固形分NV=39.9%、数平均分子量Mn=23,000、重量平均分子量Mw=51,000、酸価AV=50.0mgKOH/gであった。
Resin synthesis example 2 Synthesis of resin having carboxy group 2
In a reaction vessel equipped with a stirrer, thermometer, reflux condenser, and gas introduction tube, 1002 parts of Kuraray polyol P-1010 (hydroxyl value 112 mg KOH / g, manufactured by Kuraray Co., Ltd.), 237 parts of dimethylolbutanoic acid, isophorone diisocyanate 576 parts and 1815 parts of methyl ethyl ketone were charged and heated to 80 ° C. under a nitrogen stream. Thereafter, 0.1 part of dibutyltin dilaurate was added. After reacting for 4 hours, IR was measured, and it was confirmed that an isocyanate-derived peak near 2270 cm −1 disappeared. The resulting resin solution had a solid content NV = 39.9%, a number average molecular weight Mn = 23,000, a weight average molecular weight Mw = 51,000, and an acid value AV = 50.0 mgKOH / g.
まず、本願発明の架橋性組成物について、有機溶媒に対する溶解性を試験した。 First, the crosslinkable composition of the present invention was tested for solubility in organic solvents.
実施例1
化合物1を10部、溶剤60部、樹脂合成例1で合成した樹脂溶液から溶剤を取り除いた樹脂40部を混合した。溶剤としてメチルエチルケトン(MEK)、酢酸エチル、トルエンを用いた。このときに均一な液体として得られたものは○、濁りのあるものは△、固体が沈殿した場合は×とした。
Example 1
10 parts of Compound 1, 60 parts of solvent, and 40 parts of resin obtained by removing the solvent from the resin solution synthesized in Resin Synthesis Example 1 were mixed. Methyl ethyl ketone (MEK), ethyl acetate, and toluene were used as the solvent. At this time, the product obtained as a uniform liquid was evaluated as “◯”, the cloudy product as “Δ”, and the solid precipitated as “X”.
実施例2〜21
化合物1の代わりに、化合物2〜21を使用した以外は、実施例1と同様に試験を行った。
Examples 2 to 21
The test was performed in the same manner as in Example 1 except that compounds 2 to 21 were used instead of compound 1.
比較例1
化合物1の代わりに、化合物A(Primid XL−552(エムスケミー社製のアジピン酸置換β−ヒドロキシアルキルアミド))を用いた以外は、実施例1と同様に試験を行った。
Comparative Example 1
The test was performed in the same manner as in Example 1 except that Compound A (Primid XL-552 (adipic acid-substituted β-hydroxyalkylamide manufactured by Ems Chemie)) was used instead of Compound 1.
実施例1〜21および比較例1の結果を表2にまとめた。 The results of Examples 1 to 21 and Comparative Example 1 are summarized in Table 2.
表2
本願発明の架橋性組成物である実施例1〜21は、一般式(1)で表される化合物がMEK、酢酸エチル、トルエンのどの有機溶剤を用いても高い溶解度を示したのに対し、従来用いられてきた化合物Aを用いた組成物である比較例1は、化合物Aがいずれの有機溶剤にもほとんど溶解しなかった。 In Examples 1-21, which are the crosslinkable compositions of the present invention, the compound represented by the general formula (1) showed high solubility regardless of which organic solvent such as MEK, ethyl acetate, and toluene was used. In Comparative Example 1, which is a composition using Compound A that has been conventionally used, Compound A was hardly dissolved in any organic solvent.
実施例22
化合物1を用いた架橋性組成物の硬化性試験(1)および保存安定性試験(1)を行った。
Example 22
The curability test (1) and the storage stability test (1) of the crosslinkable composition using Compound 1 were conducted.
硬化性試験(1)は次のように行った。化合物1と樹脂合成例1のカルボキシ基を有する樹脂溶液を、化合物1のヒドロキシ基と、カルボキシ基を有する樹脂のカルボキシ基とのモル比が1:1になるように配合し架橋性組成物を作製した。この溶液1gをアルミ容器に入れた。この容器を120℃、150℃、180℃のオーブンにそれぞれ1時間入れ、樹脂を硬化させた。硬化膜を、金属メッシュで覆い、メチルエチルケトンで24時間浸した。その後、アルミ容器を60℃で3時間乾燥し、アルミ容器への硬化膜の残存率を測定した。膜の残存率が0〜20%の膜を×、21〜40%の膜を△、41〜80%の膜を○、81〜100%の膜を◎とした。 The curability test (1) was performed as follows. A crosslinkable composition was prepared by blending the resin solution having a carboxy group of Compound 1 and Resin Synthesis Example 1 so that the molar ratio of the hydroxy group of Compound 1 to the carboxy group of the resin having a carboxy group was 1: 1. Produced. 1 g of this solution was placed in an aluminum container. The container was placed in an oven at 120 ° C., 150 ° C., and 180 ° C. for 1 hour to cure the resin. The cured film was covered with a metal mesh and immersed in methyl ethyl ketone for 24 hours. Thereafter, the aluminum container was dried at 60 ° C. for 3 hours, and the residual rate of the cured film in the aluminum container was measured. The film having a film remaining rate of 0 to 20% was evaluated as x, the film of 21 to 40% as Δ, the film as 41 to 80% as ◯, and the film as 81 to 100% as ◎.
保存安定性試験(1)は次のように行った。硬化性試験(1)で用いた架橋性組成物の粘度を測定した。その後、40℃で1週間保存し、1週間後の粘度を測定した。試験前の粘度と比較して粘度変化が5%以内のものを○、5%以上増加したものを×とした。 The storage stability test (1) was performed as follows. The viscosity of the crosslinkable composition used in the curability test (1) was measured. Thereafter, it was stored at 40 ° C. for 1 week, and the viscosity after 1 week was measured. When the viscosity change was within 5% compared to the viscosity before the test, the case where the viscosity was 5% or more was rated as x.
実施例23〜42
化合物1の代わりに、化合物2〜21を使用した以外は、実施例22と同様に試験を行った。
Examples 23-42
The test was performed in the same manner as in Example 22 except that compounds 2 to 21 were used instead of compound 1.
比較例2
化合物1の代わりに、化合物A(Primid XL−552、エムスケミー社製のアジピン酸置換β−ヒドロキシアルキルアミド)を用いた以外は、実施例43と同様に試験を行った。
Comparative Example 2
A test was conducted in the same manner as in Example 43 except that Compound A (Primid XL-552, adipic acid-substituted β-hydroxyalkylamide manufactured by Ems Chemie) was used instead of Compound 1.
実施例22〜42および比較例2の結果を表3にまとめた。 The results of Examples 22 to 42 and Comparative Example 2 are summarized in Table 3.
表3
実施例22〜42は硬化試験(1)、保存安定性試験(1)全てにおいて良好であった。 Examples 22 to 42 were good in all of the curing test (1) and the storage stability test (1).
比較例2は市販のアジピン酸にβ−ヒドロキシアルキルアミドが置換した誘導体を使用した例であるが、比較例1の結果にあるように、メチルエチルケトン(MEK)に対する溶解性が乏しく、硬化性試験(1)おいても、本発明の化合物と比較して硬化性が劣るという結果が得られた。 Comparative Example 2 is an example in which a commercially available adipic acid substituted with β-hydroxyalkylamide was used. As shown in Comparative Example 1, the solubility in methyl ethyl ketone (MEK) was poor, and the curability test ( Even in 1), the result that the curability was inferior compared with the compound of the present invention was obtained.
実施例43
化合物1を用いた架橋性組成物の硬化性試験(2)、保存安定性試験(2)を行った。
Example 43
The curability test (2) and the storage stability test (2) of the crosslinkable composition using Compound 1 were conducted.
硬化性試験(2)は次のように行った。化合物1と樹脂合成例2のカルボキシ基を有する樹脂溶液を、化合物1のヒドロキシ基と、カルボキシ基を有する樹脂のカルボキシ基とのモル比が1:1になるように配合し架橋性組成物を作製した。この溶液1gをアルミ容器に入れた。この容器を120℃、150℃、180℃のオーブンにそれぞれ1時間入れ、樹脂を硬化させた。硬化膜を、金属メッシュで覆い、メチルエチルケトンで24時間浸した。その後、アルミ容器を60℃で3時間乾燥し、アルミ容器への硬化膜の残存率を測定した。膜の残存率が0〜20%の膜を×、21〜40%の膜を△、41〜80%の膜を○、81〜100%の膜を◎とした。 The curability test (2) was performed as follows. A crosslinkable composition was prepared by blending the resin solution having a carboxy group of compound 1 and resin synthesis example 2 so that the molar ratio of the hydroxy group of compound 1 to the carboxy group of the resin having a carboxy group was 1: 1. Produced. 1 g of this solution was placed in an aluminum container. The container was placed in an oven at 120 ° C., 150 ° C., and 180 ° C. for 1 hour to cure the resin. The cured film was covered with a metal mesh and immersed in methyl ethyl ketone for 24 hours. Thereafter, the aluminum container was dried at 60 ° C. for 3 hours, and the residual rate of the cured film in the aluminum container was measured. The film having a film remaining rate of 0 to 20% was evaluated as x, the film of 21 to 40% as Δ, the film as 41 to 80% as ◯, and the film as 81 to 100% as ◎.
保存安定性試験(2)は次のように行った。硬化性試験(2)で用いた架橋性組成物の粘度を測定した。その後、40℃で1週間保存し、1週間後の粘度を測定した。試験前の粘度と比較して粘度変化が5%以内のものを○、5%以上増加したものを×とした。 The storage stability test (2) was performed as follows. The viscosity of the crosslinkable composition used in the curability test (2) was measured. Thereafter, it was stored at 40 ° C. for 1 week, and the viscosity after 1 week was measured. When the viscosity change was within 5% compared to the viscosity before the test, the case where the viscosity was 5% or more was rated as x.
実施例44〜63
化合物1の代わりに、化合物2〜21を使用した以外は、実施例43と同様に試験を行った。
Examples 44-63
The test was performed in the same manner as in Example 43 except that compounds 2 to 21 were used instead of compound 1.
比較例3
化合物1の代わりに、化合物A(Primid XL−552、エムスケミー社製のアジピン酸置換β−ヒドロキシアルキルアミド)を用いた以外は、実施例85と同様に試験を行った。
Comparative Example 3
The test was performed in the same manner as in Example 85 except that Compound A (Primid XL-552, adipic acid-substituted β-hydroxyalkylamide manufactured by Ems Chemie) was used instead of Compound 1.
実施例43〜63および比較例3の結果を表4にまとめた。 The results of Examples 43 to 63 and Comparative Example 3 are summarized in Table 4.
表4
実施例43〜63は硬化性試験(2)、保存安定性試験(2)全てにおいて良好であった。 Examples 43 to 63 were good in all of the curability test (2) and the storage stability test (2).
比較例3は市販のアジピン酸にβ−ヒドロキシアルキルアミドが置換した誘導体を使用した例であるが、比較例1の結果にあるように、メチルエチルケトン(MEK)に対する溶解性が乏しく、硬化性試験(2)おいても、本発明の化合物と比較して硬化性が劣るという結果が得られた。 Comparative Example 3 is an example in which a commercially available adipic acid substituted with β-hydroxyalkylamide was used. As shown in Comparative Example 1, the solubility in methyl ethyl ketone (MEK) was poor, and the curability test ( Even in 2), the result that the curability was inferior compared with the compound of the present invention was obtained.
以上のことから、本発明の一般式(1)で表される化合物を用いた架橋性組成物は、有機溶剤に対する溶解性、硬化性、保存安定性に優れていることが明らかとなった。 From the above, it became clear that the crosslinkable composition using the compound represented by the general formula (1) of the present invention is excellent in solubility in organic solvents, curability, and storage stability.
本発明の樹脂組成物は、熱硬化性の印刷インキ、塗料、コーティング剤、粘接着剤、成形材料、光硬化性材料に使用することができる。 The resin composition of the present invention can be used for thermosetting printing inks, paints, coating agents, adhesives, molding materials, and photocurable materials.
Claims (4)
一般式(1)
nは、2〜6の整数であり、
Aは、下記一般式(2)、または、下記一般式(3)で表される基を表す。)
一般式(2)
一般式(3)
一般式(4)
General formula (1)
n is an integer of 2 to 6,
A represents a group represented by the following general formula (2) or the following general formula (3). )
General formula (2)
General formula (3)
General formula (4)
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JP2013151639A (en) * | 2011-12-28 | 2013-08-08 | Toyo Ink Sc Holdings Co Ltd | Crosslinkable composition |
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