JP2015162332A - Method of manufacturing capacitive input switch and capacitive input switch - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a capacitive input switch in which a resin body, a transmission side conductive sheet, and a reception side conductive sheet can be aligned easily, while eliminating the risk of interfering with high accuracy detection of a mutual capacitance sensor, and to provide a capacitive input switch.SOLUTION: In a method of manufacturing a capacitive input switch integrating a support panel and a capacitive sensor by using a molding die 1, a transmission side conductive sheet 21 for mutual capacitance sensor is inserted into the male mold 2 of the molding die 1, a reception side conductive sheet 28 for mutual capacitance sensor is inserted into the female mold 5, and a molten molding resin material is ejected, under high pressure, into a cavity 7 formed by closing the male mold 2 and female mold 5, thus manufacturing a capacitive input switch in which the support panel and mutual capacitance sensor are integrated. A reception side conductive pattern of the mutual capacitance sensor is positioned on the surface side of the capacitive input switch facing the outside.

Description

  The present invention relates to a method for manufacturing a capacitive input switch used in portable devices, information devices, in-vehicle devices, and the like, and a capacitive input switch.

  Conventionally, when manufacturing a capacitive input switch, as shown in FIG. 12, for example, a resin body 40 is formed into a flat plate or the like, and a capacitive sensor is formed on both the front and back surfaces of the resin body 40. A thin transmission-side conductive sheet 21 and a reception-side conductive sheet 28 for the mutual capacitance sensor 20 are bonded to each other so that the reception-side conductive sheet 28 is positioned on the surface side facing the outside of the resin body 40, and then the resin A protective cover layer 15 that covers the receiving conductive sheet 28 is laminated on the surface of the body 40 (see Patent Documents 1 and 2).

  The transmission-side conductive sheet 21 is formed of a thin insulating film 22 attached to the back surface of the resin body 40 and a transmission-side conductive pattern in which a plurality of transmission-side detection electrodes are arranged on the insulating film 22. . The reception-side conductive sheet 28 is formed of a thin insulating film 29 adhered to the surface of the resin body 40 and a reception-side conductive pattern in which a plurality of reception-side detection electrodes are arranged on the insulating film 29. The reception side detection electrode of the reception side conductive pattern faces the transmission side detection electrode of the transmission side conductive pattern through the resin body 40 to form a capacitor. The protective cover layer 15 is formed with a certain thickness from the viewpoint of protecting the reception-side conductive sheet 28, and a finger or an operation pen comes into contact with the surface.

  Such a capacitive input switch has a finger or an operating pen in contact with the surface of the protective cover layer 15, and when the finger or the operating pen comes close to any receiving-side detection electrode of the receiving-side conductive sheet 28, the finger or the like Is detected as a change in the magnitude of a signal received by the receiving side detection electrode, and the position of a finger or the like is detected as coordinate data by detecting this change.

JP 2012-138594 A JP 2009-130283 A

  The conventional capacitance type input switch is manufactured as described above, and the insulating film 22 of the transmitting side conductive sheet 21 and the insulating film 29 of the receiving side conductive sheet 28 which are thin and flexible on both surfaces of the molded resin body 40 are formed. Since each of them is attached while being positioned later, there is a problem that it is difficult to accurately align the resin body 40, the transmission-side conductive sheet 21, and the reception-side conductive sheet 28.

  In particular, when the resin body 40 is three-dimensionally molded from the viewpoint of improving the designability, it is necessary to bend the transmission-side conductive sheet 21 and the reception-side conductive sheet 28 according to the shape of the resin body 40. 40, the transmission-side conductive sheet 21 and the reception-side conductive sheet 28 are bent and adhered to each other, so that the transmission-side conductive sheet 21 and the reception-side conductive sheet 28 to be adhered are wrinkled or misaligned. It is very difficult to position the sensor 20 with high accuracy.

  Moreover, unlike the self-capacitance sensor, the mutual capacitance sensor 20 can detect coordinates with high accuracy even if there are a plurality of proximity points. The resin body 40 needs to be thick and uniform according to the thickness of the thick protective cover layer 15, and the distance (distance) between the transmission-side conductive sheet 21 and the reception-side conductive sheet 28 needs to be uniform. However, when the resin body 40 is three-dimensionally molded into a complicated shape, the thickness of the resin body 40 may be non-uniform. In this case, the mutual capacitance sensor 20 may not be detected with high accuracy. May come.

  The present invention has been made in view of the above, and can easily align the resin body, the transmission-side conductive sheet, and the reception-side conductive sheet, and hinders high-accuracy detection of the mutual capacitance sensor. It is an object of the present invention to provide a method for manufacturing a capacitance type input switch and a capacitance type input switch that can effectively eliminate such a risk.

In the present invention, in order to solve the above-described problem, a method of manufacturing a capacitance-type input switch in which a resin body and a capacitance sensor are integrated using a molding die,
Set the transmission side conductive sheet for the mutual capacitance sensor in the first mold of the molding die and set the reception side conductive sheet for the mutual capacitance sensor in the second die of the molding die. The first and second molds are clamped and the molded resin material melted into the cavity space between them is injected at a high pressure, so that the capacitive input switch integrated with the resin body and the mutual capacitance sensor is obtained. The reception-side conductive pattern of the mutual capacitance sensor is located on the operated surface side facing the outside of the capacitance-type input switch.

In addition, a light-transmitting protective layer covering the receiving-side conductive pattern is laminated on at least the operated surface side of the manufactured capacitive input switch, and the thickness thereof is double the thickness of the resin body, or more than double It can be a thickness.
In addition, the first mold is a male mold and the second mold is a female mold. By clamping the male mold and the female mold, the resin body and the mutual capacitance sensor are integrated in a capacitance type. The input switch can be three-dimensionally formed.

Further, a transmission side conductive sheet for the mutual capacitance sensor is formed from a sheet inserted into the first mold of the molding die and a transmission side conductive pattern formed on the sheet, and the transmission side conductive sheet is formed. A pattern is formed from a transmission side detection electrode formed on a sheet and a transmission side wiring line extending from the transmission side detection electrode,
A reception side conductive sheet for a mutual capacitance sensor is formed from a sheet inserted into a second mold of the molding die and a reception side conductive pattern formed on the sheet, and the reception side conductive pattern is , Formed from a receiving side detection electrode formed on the sheet and a receiving side wiring line extending from the receiving side detection electrode,
When three-dimensionally molding a capacitive input switch with a resin body and a mutual capacitive sensor into a substantially hat-shaped cross section, the transmission side detection electrode of the transmission side conductive pattern is used as the inner ceiling of the capacitive input switch. The transmission side wiring line is positioned on the internal ceiling side or the inner surface of the peripheral wall of the capacitive input switch, and the reception side detection electrode of the reception side conductive pattern is positioned on the external ceiling side of the capacitive input switch. In addition, the receiving side wiring line can be extended to the peripheral edge on the outer peripheral surface side of the capacitance type input switch so as to be separated from the transmitting side wiring line of the transmitting side conductive pattern.

In addition, when a capacitive input switch in which the resin body and the mutual capacitance sensor are integrated is three-dimensionally formed into a substantially hat-shaped cross section, a plurality of bosses penetrating the transmission side conductive sheet are formed on the inner ceiling of the resin body. Can be formed at intervals, and the circuit board can be fixed to the plurality of bosses.
In order to solve the above-mentioned problems, the present invention is characterized by being manufactured by the method for manufacturing a capacitance-type input switch according to claim 1, 2, or 3.

  Here, the resin body, the transmission-side conductive sheet, and the reception-side conductive sheet in the claims may be transparent, opaque, or translucent. The resin body includes at least various cases, housings, panel members, concave shapes, and the like. In addition, the transmission side conductive sheet and the reception side conductive sheet include insulating sheets and films. The capacitance type input switch can be three-dimensionally formed into a cross-sectional tray shape, a hat shape, a hemispherical shell shape, a C shape, a U shape, or the like according to the shape of the resin body. Further, the first and second molds of the molding die may be contacted and separated in the vertical direction or may be contacted and separated in the lateral direction.

  According to the present invention, when manufacturing the capacitance type input switch, the transmission side conductive sheet for the mutual capacitance sensor is inserted into the first die of the molding die, and the second die is mutually connected. The receiving side conductive sheet for the capacitance sensor is inserted, the first and second molds are clamped, and then a fluid molded resin material melt-kneaded into the molding die is injected at a high pressure.

  Then, the injected molding resin material is filled in the cavity spaces of the first and second molds, stops flowing, and is cooled and solidified by taking heat away from the molding die. By cooling and solidifying the molding resin material, a capacitive input switch in which the resin body and the mutual capacitance sensor are integrated is manufactured, and the transmission side conductive pattern of the mutual capacitance sensor is formed on the side not facing the outside of the resin body. Are integrated, and the receiving side conductive pattern of the mutual capacitance sensor is integrated on the operated surface side facing the outside of the resin body.

  According to the present invention, the resin body, the transmission-side conductive sheet, and the reception-side conductive sheet can be easily aligned by being integrally formed. In addition, it is possible to effectively eliminate the possibility of hindering the highly accurate detection of the mutual capacitance sensor.

  According to the second aspect of the present invention, even when the resin body is three-dimensionally formed into a complicated shape and has a curved surface or an uneven surface, wrinkles or misalignment occurs between the transmitting side conductive sheet and the receiving side conductive sheet. The transmission-side conductive sheet and the reception-side conductive sheet can be positioned with high accuracy.

  According to the third aspect of the present invention, the transmission side wiring line of the transmission side conductive pattern and the reception side wiring line of the reception side conductive pattern are not formed at the same place, but are received at a place away from the transmission side wiring line. Since the side wiring line is formed, the connection to the outside of the receiving side wiring line is hardly hindered, and the degree of freedom of connection of the receiving side wiring line can be improved.

It is a section explanatory view showing typically an embodiment of a manufacturing method of a capacitance type input switch concerning the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective explanatory view schematically showing an embodiment of a capacitive input switch according to the present invention. It is a plane explanatory view showing typically an embodiment of a capacitance type input switch concerning the present invention. It is a section explanatory view showing typically an embodiment of a capacity type input switch concerning the present invention. It is an internal back view which shows typically the embodiment of the capacitive input switch which concerns on this invention. It is a section explanatory view showing typically the capacitance type input switch provided with the protection cover layer in the embodiment of the capacitance type input switch concerning the present invention. It is a section explanatory view showing typically a 2nd embodiment of a capacitance type input switch concerning the present invention. It is an internal back view which shows typically 2nd Embodiment of the capacitive input switch which concerns on this invention. It is a plane explanatory view showing a 3rd embodiment of an electrostatic capacity type input switch concerning the present invention typically. It is a section explanatory view showing typically a 3rd embodiment of a capacitance type input switch concerning the present invention. It is an internal back view which shows typically 3rd Embodiment of the capacitive input switch which concerns on this invention. It is sectional explanatory drawing which shows the conventional electrostatic capacitance type input switch typically.

  Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. A manufacturing method of a capacitance type input switch according to the present embodiment uses a molding die 1 as shown in FIGS. , A method of manufacturing a capacitive input switch in which the support panel 10 and the capacitive sensor are integrated, and a thin transmission-side conductive sheet 21 for the mutual capacitive sensor 20 on the male mold 2 of the molding die 1. And a thin receiving-side conductive sheet 28 for the mutual capacitance sensor 20 is inserted into the female die 5 of the molding die 1, and the male die 2 and the female die 5 are clamped to provide the cavity space 7. The support panel 10 and the mutual capacitance sensor 20 are injection-molded into an integral capacitance type input switch by filling the molded resin material.

  The male mold 2 and the female mold 5 of the molding die 1 are integrated by fitting a plurality of guide pins and guide pin bushes, and the male mold 2 contacts and separates from the female mold 5 from below as shown in FIG. Cavity space 7 that forms a capacitive input switch between the male mold 2 and the female mold 5 by clamping the male mold 2 and the female mold 5 with a high pressure. Are partitioned. The male mold 2 and the female mold 5 are made of predetermined tool steel, ceramics, or the like, each having a temperature adjusting cooling water groove cut out, and cooling water having a constant temperature flows through each cooling water groove.

  As shown in FIG. 1, in the male mold 2, the core portion 3 on which the transmission-side conductive sheet 21 is mounted and the movable mold plate are integrated, and the movable mold plate is screwed to the reinforcing receiving plate. The receiving plate is screwed to the movable mounting plate for connection with the molding machine via the spacer block, the plurality of protruding pins, and the protruding plate. The manufactured transmission-side conductive sheet 21 is inserted and mounted on the cavity forming surface 4 of the core portion 3 that defines the cavity space 7 between the male mold 2 and the female mold 5.

  On the cavity forming surface 4 of the male mold 2, a plurality of positioning projections that penetrate the transmitting-side conductive sheet 21 and are positioned in the front-rear and left-right directions are provided as necessary. In this case, a boss forming hole for the support panel 10 is drilled in each positioning projection, and a short cylindrical pin is erected at the center of the inner bottom surface of the boss forming hole.

  As shown in FIG. 1, the female mold 5 is formed by integrating a recessed cavity portion 6 forming a support panel 10 and a fixed-side mold plate, and the fixed-side mold plate is fixed-side mounted for connection to a molding machine. Screwed onto the plate. The manufactured reception-side conductive sheet 28 is inserted and positioned in the cavity portion 6, and a sprue bush and a locating ring fitting hole forming a casting port are drilled in the fixed-side mounting plate.

  As shown in FIGS. 2 to 6, the support panel 10 of the capacitance type input switch is three-dimensionally formed into a substantially hat-shaped bent section using a predetermined resin-containing molding resin material, and is used in an electronic device (not shown). Set. The resin of the molding resin material is not particularly limited, but, for example, polycarbonate, polybutylene terephthalate, modified polyphenylene ether, cycloolefin copolymer (COC), cycloolefin polymer (COP), ABS resin, acrylic having excellent strength and the like. Examples thereof include resins. Various fillers, such as a reinforcing agent and a flame retardant, are mix | blended with a molding resin material as needed.

  Inside the support panel 10 not facing the outside, a circuit board is screwed and fixed with screws or the like, and an electronic circuit of the circuit board and a part of the mutual capacitance sensor 20 are electrically connected. Although not shown, the circuit board is made of, for example, a printed wiring board, and a predetermined electronic circuit such as a capacitance detection circuit that converts a change in capacitance into a digital signal is patterned on the surface, and a microcontroller or the like. These electronic components are appropriately mounted and integrated with the support panel 10.

  In addition, by disposing a plurality of positioning protrusions, boss forming holes, and cylindrical pins on the male mold 2, a plurality of bosses penetrating the transmission-side conductive sheet 21 are spaced from each other on the substantially flat inner ceiling 11 of the support panel 10. The circuit board can be screwed to the plurality of bosses via screws or the like. In this case, from the viewpoint of making the thickness of the support panel 10 uniform, the plurality of bosses are preferably formed in an array at locations away from the peripheral wall 12 of the support panel 10 and the peripheral portion 13 of the peripheral wall 12.

  As shown in FIG. 6, a light-transmitting protective cover layer 15 to be contacted with a finger or an operation pen is closely laminated on the surface 14 side (operated surface side) facing the outside of the support panel 10. The The protective cover layer 15 has a thickness that is twice or more than the thickness of the support panel 10 from the viewpoint of reliably covering and protecting the receiving-side conductive sheet 28. Characters, figures, symbols are used as necessary. A decorative pattern consisting of etc. is printed. The protective cover layer 15 is integrated during the injection molding of the capacitance type input switch, or is bonded after the injection molding of the capacitance type input switch.

  As shown in FIGS. 4 to 6, the transmission-side conductive sheet 21 for the mutual capacitance sensor 20 includes, for example, a thin insulating film 22 that can be bent, and a transmission-side conductive pattern 23 that is thinly formed on the insulating film 22. Are formed in a two-layer structure. The insulating film 22 is not particularly limited. For example, polyethylene terephthalate (PET), polycarbonate, polyethylene naphthalate, polyimide, polyamide, excellent in dimensional stability, chemical resistance, optical properties, quality stability, etc. A thin transparent film made of acrylic resin and cycloolefin polymer is used and integrated with the internal ceiling 11 of the support panel 10.

  As shown in FIG. 5, the transmission-side conductive pattern 23 has a plurality of transmission-side detection electrode arrays 24 arranged in a predetermined pattern on the surface of the insulating film 22, and is narrow and short at the end of each transmission-side detection electrode array 24. A transmission side wiring line 26 is connected, and a transmission side connection terminal 27 connected to the electronic circuit of the circuit board is formed on the transmission side wiring line 26. Examples of the material for the transmission-side conductive pattern 23 include metals (Al, copper, etc.), silver paste, carbon, and the like. When the transmission side conductive pattern 23 is required to be light transmissive, ITO, CNT, light transmissive silver nanowire, light transmissive conductive polymer (polypyrrole, polyaniline, etc.), etc. are selected and used. .

  The plurality of transmission side detection electrode arrays 24 are arranged in parallel at a predetermined interval in the Y direction, for example, and are located on the inner ceiling 11 of the support panel 10. Each transmission-side detection electrode row 24 is formed by, for example, a plurality of transmission-side detection electrodes 25 arranged in a row in the X direction, and each transmission-side detection electrode 25 is formed by an inkjet method, a screen printing method, a gravure printing method, or the like. Thus, a thin film such as a planar rhombus or a half rhombus is formed. Further, the transmission side connection terminal 27 is made of, for example, carbon or the like, and is integrally formed at an end portion of the transmission side wiring line 26 located on the inner ceiling 11 of the support panel 10 and screwed and fixed in the support panel 10. The electronic circuit lands are electrically connected via an elastically deformable conductive elastomer or the like.

  As shown in FIGS. 3, 4, and 6, the reception-side conductive sheet 28 for the mutual capacitance sensor 20 includes, for example, a thin insulating film 29 that can be bent and a capacitor that is thinly patterned on the insulating film 29. The receiving side conductive pattern 30 is provided in a two-layer structure, and the receiving side conductive pattern 30 is covered with the protective cover layer 15. As the insulating film 29, a thin transparent film is used like the insulating film 22 of the transmission side conductive sheet 21, but it is formed longer and longer than the insulating film 22 and is integrated with the surface 14 of the support panel 10.

  As shown in FIG. 3, the reception-side conductive pattern 30 includes a plurality of reception-side detection electrode arrays 31 arranged in a predetermined pattern on the surface of the insulating film 29, and an elongated reception at the end of each reception-side detection electrode array 31. A side wiring line 33 is connected, and a reception side connection terminal 34 connected to an electronic circuit of an external circuit board is formed on the reception side wiring line 33. The reception-side conductive pattern 30 is formed of the same material as the transmission-side conductive pattern 23. When light transmission is required, ITO, CNT, light-transmitting silver nanowire, light-transmitting conductive polymer (Such as polypyrrole or polyaniline) is selected.

  The plurality of reception-side detection electrode arrays 31 are arranged in parallel at a predetermined interval in the X direction, for example, and are integrated with the substantially flat ceiling surface 14 of the support panel 10. Each reception-side detection electrode array 31 is formed by, for example, a plurality of reception-side detection electrodes 32 connected in a line in the Y direction, and each reception-side detection electrode 32 is formed by an inkjet method, a screen printing method, a gravure printing method, or the like. Accordingly, the transmission-side detection electrode 25 is adjacently opposed to the transmission-side detection electrode 25 via the support panel 10, and a capacitor is provided between the reception-side detection electrode 32 and the transmission-side detection electrode 25 that are adjacent to each other. Is formed.

  As shown in FIG. 3, the plurality of reception-side wiring lines 33 extend from the ceiling of the support panel 10 to the peripheral portion 13 of the peripheral wall surface 14, and the plurality of transmission-side wiring lines 26 to 60 of the transmission-side conductive pattern 23. They are separated by an angle of more than ° (for example, 60 °, 90 °, 135 °, 180 °, etc.). The reception side connection terminal 34 is integrally formed at the end of the reception side wiring line 33 using, for example, carbon, and is electrically connected to the land of the electronic circuit on the circuit board located outside.

  In the above configuration, when manufacturing the capacitance type input switch, first, the transmitting side conductive sheet 21 is inserted and positioned in the opened male mold 2 of the molding die 1, and the female mold 5 is positioned. The receiving side conductive sheet 28 is inserted and positioned, the male mold 2 and the female mold 5 of the molding die 1 are clamped at a high pressure, and the molding machine is brought into contact with the nozzle touch part of the female mold 5. A fluid molding resin material melted and kneaded into a molding die 1 from a molding machine is injected at a high speed and a high pressure. When the transmission-side conductive sheet 21 and the reception-side conductive sheet 28 are inserted, it is preferable to form these 21 and 28 by vacuum molding, compression molding, or the like.

  When manufacturing a capacitive input switch with a protective cover layer 15, a transparent sheet for the protective cover layer 15 and a receiving conductive sheet 28 are overlaid and inserted into the female mold 5, and the receiving conductive sheet 28 is received. May be opposed to the transmission-side conductive sheet 21. Alternatively, the transparent sheet for the protective cover layer 15 and the receiving conductive sheet 28 may be integrally formed, and then the receiving conductive sheet 28 may be inserted into the female mold 5. Examples of the transparent sheet for the protective cover layer 15 include a transparent film made of polycarbonate or acrylic.

  When the molding resin material melted and kneaded into the molding die 1 is injected at a high speed and high pressure, the molding resin material passes through the sprue and runner of the molding die 1 sequentially from the nozzle of the molding machine 2 and the male die 2. The cavity space 7 between the mold 5 and the female mold 5 is filled, the flow is stopped in the cavity space 7, the mold 1 for cooling is solidified by cooling, and the male mold 2 and the female mold 5 are separated. It is cooled and solidified indirectly by circulating cooling water.

  By cooling and solidifying the molding resin material, a three-dimensional three-dimensional capacitance type input switch is manufactured, and the transmission side conductive pattern 23 of the mutual capacitance sensor 20 is integrated with the inner ceiling 11 side of the support panel 10. The reception-side conductive pattern 30 of the mutual capacitance sensor 20 is integrated with the ceiling surface 14 side facing the outside of the support panel 10. At this time, the thickness of the support panel 10 is set to be 1/2 of the thickness of the protective cover layer 15 or less than 1/2 in consideration of improvement in detection accuracy of the mutual capacitance sensor 20 and formability. The

  After manufacturing the capacitive input switch, the male mold 2 and the female mold 5 are opened, and the capacitive input switch that is in close contact with the male mold 2 is projected by a plurality of projecting pins, thereby allowing the capacitive input. Remove the switch. When the protective cover layer 15 is laminated on the extracted capacitive input switch, a transparent sheet for the protective cover layer 15 may be stacked on the surface 14 of the support panel 10 and adhered.

  In such a capacitance type input switch, after the transmission side conductive pattern 23 and the reception side conductive pattern 30 are connected to the electronic circuits of different circuit boards, a finger or the like contacts the surface of the protective cover layer 15. When the finger or the like is in proximity to any reception side detection electrode 32 of the reception side conductive sheet 28, the position of the finger or the like is detected as a change in the magnitude of the signal received by the reception side detection electrode 32, By detecting this change, the position of a finger or the like is detected as coordinate data.

  At this time, the reception side wiring line 33 of the reception side conductive pattern 30 and the transmission side wiring line 26 of the transmission side conductive pattern 23 are not opposed to each other via the support panel 10, but the reception side wiring line 33 is not the transmission side. Since the wiring line 26 is rotated at an angle of 90 ° and separated from the wiring line 26, space and position restrictions are imposed on the operation of connecting the receiving side connection terminal 34 of the receiving side wiring line 33 to the electronic circuit of the circuit board. Absent.

  According to the above configuration, the transmission-side conductive sheet 21 and the reception-side conductive sheet 28, which are difficult to handle on the molded support panel 10, are attached to the molding die 1 instead of being attached later. 21 and the reception side conductive sheet 28 are inserted and integrated with the resin support panel 10 by injection molding, so that the support panel 10, the transmission side conductive sheet 21, and the reception side conductive sheet 28 are aligned with high precision, The appearance can be arranged well.

  In addition, even when the support panel 10 is not a simple two-dimensional molding but a complicated three-dimensional molding and has a bent surface, a curved surface, and an uneven surface, the transmission-side conductive sheet 21 and the reception-side conductive sheet 28 may be damaged. The transmission-side conductive sheet 21 and the reception-side conductive sheet 28 can be positioned with high accuracy without causing any positional deviation. Therefore, it is possible to detect a finger or the like with high accuracy and to reliably connect the mutual capacitance sensor 20 to an external electronic circuit.

  Further, since the molding resin material is injected at a high speed and a high pressure, the molding resin material can be filled to every corner of the cavity space 7 of the male mold 2 and the female mold 5, and the thickness of the three-dimensional support panel 10 can be reduced. It becomes possible to make uniform with high accuracy. Therefore, the interval (distance) between the transmission side conductive sheet 21 and the reception side conductive sheet 28 can be made uniform, and highly accurate detection of the mutual capacitance sensor 20 can be greatly expected.

  Further, when high-accuracy detection is expected by the mutual capacitance sensor 20, the support panel 10 is thick with a uniform thickness according to the thickness of the thick protective cover layer 15, and the transmission side conductive sheet 21 and the reception side The distance from the conductive sheet 28 must be uniform and large. According to this embodiment, even when the support panel 10 is three-dimensionally formed into a complicated shape, the thickness of the support panel 10 is not uneven, and the support panel 10 is formed into a uniform thick wall. can do. Thereby, since the space | interval of the transmission side conductive sheet 21 and the reception side conductive sheet 28 can be made uniform and large, the highly accurate detection of the mutual capacitance sensor 20 can be expected.

  Further, since the transmission-side conductive pattern 23 and the electronic circuit of the circuit board are electrically connected via a conductive elastomer or the like, it is necessary to extend the insulating film 22 and the transmission-side wiring line 26 while bending them to the peripheral wall 12 of the support panel 10. In addition to realizing space saving, the transmission side wiring line 26 does not erroneously detect a finger or the like. Further, when the electrical connection using the conductive elastomer or the like is performed, the transmission side detection electrode 25 and the capacitance detection circuit of the circuit board are brought as close as possible, and the change in capacitance is digital signal in this proximity state. If the analog wiring portion is converted to the analog wiring portion, it is possible to reduce the analog wiring portion that is vulnerable to noise, and therefore a great reduction in malfunction can be expected.

  Next, FIGS. 7 and 8 show a second embodiment of the present invention. In this case, a plurality of transmission-side wiring lines 26 of the transmission-side conductive pattern 23 are connected to a capacitance-type input switch. Each of the peripheral walls 12 extends to the peripheral edge 13 of the inner surface (back surface), and the transmission-side connection terminals 27 are integrally formed at the end of each transmission-side wiring line 26.

The insulating film 22 of the transmission-side conductive sheet 21 is formed to be enlarged greatly and long in accordance with the extension of the plurality of transmission-side wiring lines 26. The other parts are the same as those in the above embodiment, and the description thereof is omitted.
In the present embodiment, it is obvious that the same effects as those in the above embodiment can be expected, and that the patterns and connections of the transmission-side wiring lines 26 can be diversified.

  Next, FIGS. 9 to 11 show a third embodiment of the present invention. In this case, a plurality of transmission-side detection electrode arrays 24 of the transmission-side conductive pattern 23 and their transmission-side detection electrodes 25 are connected. A plurality of reception-side detection electrode rows of the reception-side conductive pattern 30 are formed in a thick band-shaped thin film, and the band-like transmission-side detection electrode row 24 and the transmission-side detection electrode row 24 are arranged adjacent to each other with a slight gap. 31 and the reception side detection electrode 32 are formed in a thin thin film, and the reception side detection electrode row 31 and the reception side detection electrode row 31 are arranged adjacent to each other with a wide gap. .

The plurality of transmission-side wiring lines 26 of the transmission-side conductive pattern 23 are extended to the inner peripheral edge 13 of the peripheral wall 12 of the capacitive input switch as necessary, and transmitted to the end of each transmission-side wiring line 26. The side connection terminal 27 is integrally formed. The other parts are the same as those in the above embodiment, and the description thereof is omitted.
In the present embodiment, it is obvious that the same effects as those of the above embodiment can be expected, and that the transmission side conductive pattern 23 and the reception side conductive pattern 30 can be diversified.

  Note that the support panel 10 of the above embodiment may be a flat plate having rigidity or a curved plate. In the above embodiment, the transmission-side conductive sheet 21 is formed by laminating the transmission-side conductive pattern 23 on the insulating film 22, but a light-transmitting protective layer that covers the transmission-side conductive pattern 23 is formed on the insulating film 22. It is good also as the multilayer structure which adhered. Similarly, the reception-side conductive sheet 28 may have a multilayer structure in which an insulating film 29 is adhered to a light-transmitting protective layer that covers the reception-side conductive pattern 30.

  In addition, after the plurality of transmission-side detection electrode arrays 24 and reception-side detection electrode arrays 31 are applied by material coating or vapor deposition, pattern etching may be performed by a dry etching method or a wet etching method. Further, the transmission-side detection electrode 25 and the reception-side detection electrode 32 can be formed into a planar circle, an ellipse, a rectangle, or the like, respectively. Further, the transmission-side detection electrode 25 and the reception-side detection electrode 32 may be formed in a substantially comb-like shape on the plane, and the transmission-side detection electrode 25 and the reception-side detection electrode 32 may be opposed to each other via the support panel 10. it can.

  Manufacturing method of capacitive input switch and capacitive input switch according to the present invention are in the field of manufacturing portable devices such as mobile phones, home appliances, information devices such as notebook computers, in-vehicle center panels and steering switches. Used in.

1 Mold 2 Male (first mold)
3 Core part 5 Female type (second type)
6 Cavity part 7 Cavity space 10 Support panel (resin body)
DESCRIPTION OF SYMBOLS 11 Internal ceiling 12 Perimeter wall 13 Peripheral part 14 Surface 15 Protective cover layer 20 Mutual capacitance sensor 21 Transmission side conductive sheet 22 Insulating film (sheet)
23 Transmission side conductive pattern 25 Transmission side detection electrode 26 Transmission side wiring line 27 Transmission side connection terminal 28 Reception side conductive sheet 29 Insulating film (sheet)
30 reception side conductive pattern 32 reception side detection electrode 33 reception side wiring line 34 reception side connection terminal 40 resin body

Claims (4)

A method of manufacturing a capacitive input switch using a molding die and manufacturing a capacitive input switch in which a resin body and a capacitive sensor are integrated,
Set the transmission side conductive sheet for the mutual capacitance sensor in the first mold of the molding die and set the reception side conductive sheet for the mutual capacitance sensor in the second die of the molding die. The first and second molds are clamped and the molded resin material melted into the cavity space between them is injected at a high pressure, so that the capacitive input switch integrated with the resin body and the mutual capacitance sensor is obtained. A method of manufacturing a capacitance type input switch, comprising: manufacturing and positioning a reception side conductive pattern of a mutual capacitance sensor on an operated surface side facing the outside of the capacitance type input switch.   The first type is a male type and the second type is a female type. By clamping the male and female types, the resin body and the mutual capacitance sensor are integrated into a capacitive input switch. The method of manufacturing a capacitive input switch according to claim 1, wherein the capacitor is three-dimensionally molded. A transmission side conductive sheet for a mutual capacitance sensor is formed from a sheet inserted into a first mold of a molding die and a transmission side conductive pattern formed on the sheet, and the transmission side conductive pattern is formed. The transmission side detection electrode formed on the sheet and the transmission side wiring line extending from the transmission side detection electrode;
A reception side conductive sheet for a mutual capacitance sensor is formed from a sheet inserted into a second mold of the molding die and a reception side conductive pattern formed on the sheet, and the reception side conductive pattern is , Formed from a receiving side detection electrode formed on the sheet and a receiving side wiring line extending from the receiving side detection electrode,
When three-dimensionally molding a capacitive input switch with a resin body and a mutual capacitive sensor into a substantially hat-shaped cross section, the transmission side detection electrode of the transmission side conductive pattern is used as the inner ceiling of the capacitive input switch. The transmission side wiring line is positioned on the internal ceiling side or the inner surface of the peripheral wall of the capacitive input switch, and the reception side detection electrode of the reception side conductive pattern is positioned on the external ceiling side of the capacitive input switch. 3. The capacitance-type input switch according to claim 1, wherein the reception-side wiring line is extended to a peripheral edge on the outer peripheral wall side of the capacitance-type input switch and separated from the transmission-side wiring line of the transmission-side conductive pattern. Production method.   A capacitive input switch manufactured by the method of manufacturing a capacitive input switch according to claim 1, 2 or 3.

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