JP2015155983A - Method for manufacturing substrate with columnar formation object - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a substrate with a columnar formation object, by which a columnar formation object having a large height and a high aspect ratio can be formed with high positional accuracy.

SOLUTION: The method for manufacturing a substrate with a columnar formation object includes: a photosensitive resin layer formation step of forming a photosensitive resin layer on a substrate; and an exposure development step of exposing the photosensitive resin layer and then developing the layer to form a columnar formation object. In the photosensitive resin layer formation step, the photosensitive resin layer is formed by disposing a photosensitive resin composition into a pattern by a screen printing process.

COPYRIGHT: (C)2015,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a substrate with a columnar product capable of forming a columnar product having a high height and aspect ratio with high positional accuracy.

  In recent years, electronic devices constructed by stacking a plurality of substrates for electronic devices have been improved in functionality or have improved functionality by increasing the distance between substrates compared to conventional electronic devices. Things have been developed in various fields.

For example, in the field of display devices, liquid crystal lenses are being developed as the above-described electronic elements. The liquid crystal lens is used for three-dimensional display in a display device, and more specifically, used for a naked-eye three-dimensional display method. The liquid crystal lens has a substrate having two electrodes and a liquid crystal layer formed between the two substrates, and changes the orientation of the liquid crystal in the liquid crystal layer by applying a voltage between the electrodes. The lens function is given by In the liquid crystal lens, in order to ensure the lens thickness, the distance (cell gap) between the two substrates is required to be within a range of 30 μm to 100 μm.
Also, in the field of semiconductors and printed circuit boards, in order to prevent damage to the semiconductor layer and conductive layer formed on the substrate, a configuration in which a plurality of substrates are arranged in an overlapping manner is used. It is necessary to provide a sufficient distance.

  In the above-described electronic device, as a method of holding a predetermined distance between substrates, in a liquid crystal lens, for example, as shown in Patent Document 1 and Patent Document 2, a bead spacer or a columnar spacer is provided between substrates having two electrodes. Is being considered.

JP 2006-293241 A JP 2012-173517 A

However, when a bead spacer is used for forming the liquid crystal lens, it is difficult to dispose the bead spacer at a predetermined position in the liquid crystal lens, and it is difficult to perform a good display. Further, there is a problem that it is difficult to form a columnar spacer having a height corresponding to the cell gap in the liquid crystal lens.
Further, in the field of semiconductors and the field of printed circuit boards, columnar resin formations having a sufficient height have not been obtained.

  Furthermore, the height ratio required for the columnar formation desired in the above-described electronic device and the height ratio to the width of the lower base (hereinafter, “the ratio of the height to the width of the lower base” may be the aspect ratio). Is higher than the height and aspect ratio of conventional columnar formations.

  The main object of the present invention is to provide a method for manufacturing a substrate with a columnar product that can form a columnar product having a high height and aspect ratio with high positional accuracy.

  In order to solve the above problems, the present invention forms a columnar formed product by exposing a photosensitive resin layer to a photosensitive resin layer forming step of forming a photosensitive resin layer on a substrate and developing the photosensitive resin layer. An exposure and development step, wherein the photosensitive resin layer forming step forms the photosensitive resin layer by arranging the photosensitive resin composition in a pattern by a screen printing method. Provided is a method for manufacturing a substrate with a columnar formation.

According to the present invention, a columnar formed product having a high height and aspect ratio can be easily formed by forming the columnar formed product by the photosensitive resin layer forming step and the exposure and developing step.
In addition, since the photosensitive resin layer forming step is to form the photosensitive resin layer in a pattern using a screen printing method, the amount of the photosensitive resin composition to be discarded can be reduced, and cost reduction and development time can be reduced. Shortening can be achieved.
Furthermore, the columnar shaped product can be formed with high positional accuracy by including the exposure and developing step.

  In this invention, it is preferable that the said photosensitive resin layer formation process forms the said photosensitive resin layer by arrange | positioning the said photosensitive resin composition so that 2 or more may be laminated | stacked on the thickness direction. This is because a columnar formed product having a high height and aspect ratio can be easily formed.

  The present invention includes a photosensitive resin layer forming step for forming a photosensitive resin layer on a substrate, and an exposure development step for forming a columnar formed product by developing after exposing the photosensitive resin layer. The photosensitive resin layer forming step forms the photosensitive resin layer by arranging two or more dry film-shaped photosensitive resin compositions in the thickness direction. A method for manufacturing a substrate with a formed article is provided.

According to the present invention, a columnar formed product having a high height and aspect ratio can be easily formed by forming the columnar formed product by the photosensitive resin layer forming step and the exposure and developing step.
Moreover, a thick photosensitive resin layer can be easily formed by using a dry film-like photosensitive resin composition. For this reason, a columnar formed product having a high height can be easily formed.
Furthermore, the columnar shaped product can be formed with high positional accuracy by including the exposure and developing step.

  In this invention, it is preferable that the said photosensitive resin layer formation process arrange | positions so that two or more photosensitive resin compositions from which the hardening property with respect to exposure light differs may be laminated | stacked in the thickness direction. This is because a columnar formed product having a high height and aspect ratio can be easily formed.

  The present invention includes a photosensitive resin layer forming step for forming a photosensitive resin layer on a substrate, and an exposure development step for forming a columnar formed product by developing after exposing the photosensitive resin layer. The method for producing a substrate with a columnar product is characterized in that the photosensitive resin layer forming step forms the photosensitive resin layer by arranging the photosensitive resin composition in a pattern by a discharge method. I will provide a.

According to the present invention, a columnar formed product having a high height and aspect ratio can be easily formed by forming the columnar formed product by the photosensitive resin layer forming step and the exposure and developing step.
In addition, since the photosensitive resin layer forming step uses a discharge method to form the photosensitive resin layer in a pattern, the amount of the photosensitive resin composition to be discarded can be reduced, thereby reducing costs and developing time. Can be achieved.
Furthermore, the columnar shaped product can be formed with high positional accuracy by including the exposure and developing step.

  In the present invention, the photosensitive resin composition preferably contains fine particles. This is because it becomes easy to increase the thickness of the photosensitive resin layer.

  In the present invention, the height of the columnar formed product is preferably in the range of 30 μm to 100 μm. It is because the effect that the columnar shaped product having a high height and aspect ratio of the present invention can be easily obtained can be exhibited more effectively.

  In the present invention, the substrate with a columnar product is preferably a liquid crystal lens substrate, and the columnar product is preferably used for fixing the thickness between two substrates constituting the liquid crystal lens. . It is because the effect that the columnar shaped product having a high height and aspect ratio of the present invention can be easily obtained can be exhibited more effectively.

  In this invention, there exists an effect that the manufacturing method of the board | substrate with a columnar formation which can form a columnar formation with high height and an aspect ratio with sufficient position accuracy can be provided.

It is process drawing which shows an example of the manufacturing method of the columnar formation of the 1st embodiment of this invention. It is explanatory drawing explaining the photosensitive resin layer formation process in the manufacturing method of the columnar formation of the 1st embodiment of this invention. It is explanatory drawing explaining the columnar formation in the manufacturing method of the columnar formation of the 1st embodiment of this invention. It is process drawing which shows an example of the manufacturing method of the columnar formation of the 2nd embodiment of this invention. It is process drawing which shows an example of the manufacturing method of the columnar formation of the 3rd embodiment of this invention. It is explanatory drawing explaining the photosensitive resin layer formation process in the manufacturing method of the columnar molded product of the 3rd embodiment of this invention.

The present invention relates to a method for manufacturing a substrate with columnar formations.
Hereinafter, the manufacturing method of the board | substrate with a columnar formation of this invention is demonstrated.

The method for manufacturing a substrate with a columnar product according to the present invention includes a photosensitive resin layer forming step of forming a photosensitive resin layer on a substrate, and forming the columnar product by exposing the photosensitive resin layer and developing the photosensitive resin layer. An exposure developing step, wherein the photosensitive resin layer forming step forms the photosensitive resin layer by arranging the photosensitive resin composition in a pattern by a screen printing method. (First embodiment) In the photosensitive resin layer forming step, the photosensitive resin layer is formed by arranging two or more dry film photosensitive resin compositions in the thickness direction. Aspect (second embodiment) and a mode in which the photosensitive resin layer forming step forms the photosensitive resin layer by disposing the photosensitive resin composition in a pattern by a discharge method (third embodiment). ) Can be roughly divided into three embodiments.
Hereinafter, the manufacturing method of the substrate with a columnar product of the present invention will be described separately for each embodiment.

A. First Embodiment First, a first embodiment of the method for producing a substrate with columnar formation according to the present invention will be described. The method for manufacturing a substrate with columnar products according to this aspect is a method for manufacturing the substrate with columnar products, wherein the photosensitive resin layer forming step arranges the photosensitive resin composition in a pattern by a screen printing method. Thus, the photosensitive resin layer is formed.

The manufacturing method of such a substrate with a columnar product according to this aspect will be described with reference to the drawings. FIG. 1 is a process diagram showing an example of a method for manufacturing a substrate with columnar formations according to this embodiment. As illustrated in FIG. 1, in the method for manufacturing a substrate with columnar products according to this embodiment, a substrate 2 on which a transparent electrode layer 4 is formed is prepared, and a photosensitive resin composition 3 ′ is obtained by a screen printing method using a screen S. 'Is arranged in a pattern (FIG. 1 (a)) to form the photosensitive resin layer 3' (FIG. 1 (b)), and to the photosensitive resin layer 3 'formed in a pattern Then, the exposure light L is irradiated through the mask M (FIG. 1 (c)), and the columnar product 3 is formed by applying and developing a developing solution to obtain the substrate 1 with the columnar product ( FIG. 1 (d)).
1A and 1B show the photosensitive resin layer forming step, and FIGS. 1C and 1D show the exposure and development step.
In this example, the columnar product 3 is formed with respect to the substrate 2 on which the transparent electrode layer 4 is formed, and the substrate with columnar product 1 is used as a substrate with a columnar product for a liquid crystal lens. It is something that can be done.

According to this aspect, since the photosensitive resin layer forming step is to form the photosensitive resin layer in a pattern using a screen printing method, compared with the case where the photosensitive resin layer is formed on the entire surface of the substrate. Thus, the amount of the photosensitive resin composition discarded can be reduced, and the cost can be reduced.
Further, the development time can be shortened, and when the photosensitive resin composition contains a solvent, the drying time of the solvent can be shortened. For this reason, it can aim at suppression of the variation in the shape of the columnar formation by productivity improvement and suppression of drying nonuniformity.

Moreover, it can be made easy to laminate | stack two or more photosensitive resin compositions by being a screen printing method. Here, when exposure is performed on a thick photosensitive resin layer, it becomes difficult to sufficiently cure the portion in the vicinity of the substrate where the exposure light is difficult to reach, and the reverse taper type in which the vicinity of the substrate is excessively removed is formed. There is a tendency to develop. In addition, if the amount of exposure light energy is increased and the vicinity of the substrate is sufficiently cured, curing also proceeds around the area irradiated with the exposure light, and the pattern tends to be developed to a pattern larger than the desired pattern in plan view. is there. For this reason, when the height of the target columnar formed product is high, a high aspect ratio may not be stably formed.
On the other hand, two or more photosensitive resin compositions can be easily stacked and arranged by screen printing, so that two photosensitive resin compositions having different easiness to cure with respect to exposure light can be obtained in the thickness direction. Arrangement so as to be laminated can also be easily performed. Therefore, the photosensitivity to exposure light of the photosensitive resin composition that constitutes a portion near the substrate where exposure light is difficult to reach and the photosensitive resin composition that constitutes the photosensitive resin layer surface side where exposure light is easy to reach is adjusted. can do. As a result, the difference in the degree of curing between the vicinity of the substrate and the vicinity of the surface side can be reduced by exposure in the exposure and development process. Accordingly, it is possible to suppress the vicinity of the substrate of the photosensitive resin layer from being an excessively developed reverse-tapered columnar product, and it is possible to easily form a product having a small difference between the width of the upper base and the width of the lower base.
For this reason, it is possible to stably form a columnar formed article having a high height and aspect ratio.

Further, by forming a columnar product on the patterned photosensitive resin layer by exposure and development, a photosensitivity formed by the screen printing method as compared with the case of forming the columnar product only by the screen printing method. The area of the conductive resin layer in plan view can be increased. For this reason, the malfunction that the photosensitive resin composition does not escape from the mesh of the screen and the columnar formed product cannot be stably formed can be suppressed.
Furthermore, by performing exposure and development through a mask, the columnar formed product can be formed with higher positional accuracy.
For this reason, it is possible to form a columnar shaped article having a high height and aspect ratio with high positional accuracy.

The manufacturing method of the substrate with columnar product of this aspect includes a photosensitive resin layer forming step and an exposure development step.
Hereafter, each process of the manufacturing method of the board | substrate with a columnar formation of this aspect is demonstrated in detail.

1. Photosensitive resin layer forming step The photosensitive resin layer forming step in this embodiment is a step of forming a photosensitive resin layer on a substrate, and the above photosensitive resin composition is arranged in a pattern by a screen printing method. This is a step of forming a conductive resin layer.

(1) Photosensitive resin composition The photosensitive resin composition used in this step is arranged in a pattern by a screen printing method, and forms the photosensitive resin layer.

As such a photosensitive resin composition, any photosensitive resin layer can be used as long as it can form a photosensitive resin layer that can be cured with respect to exposure light with a desired thickness. Can be used.
Specifically, those containing a monomer, a polymer and a photopolymerization initiator can be used.

(A) Monomer Examples of the monomer include allyl acrylate, benzyl acrylate, butoxyethyl acrylate, butoxyethylene glycol acrylate, cyclohexyl acrylate, dicyclopentanyl acrylate, 2-ethylhexyl acrylate, glycerol acrylate, glycidyl acrylate, and 2-hydroxyethyl. Acrylate, 2-hydroxypropyl acrylate, isobornyl acrylate, isodexyl acrylate, isooctyl acrylate, lauryl acrylate, 2-methoxyethyl acrylate, methoxyethylene glycol acrylate, phenoxyethyl acrylate, stearyl acrylate, ethylene glycol diacrylate, diethylene glycol di Acrylate, 1,4- Butanediol diacrylate, 1,5-pentanediol diacrylate, 1,6-hexanediol diacrylate, 1,3-propanediol acrylate, 1,4-cyclohexanediol diacrylate, 2,2-dimethylolpropane diacrylate, Glycerol diacrylate, tripropylene glycol diacrylate, glycerol triacrylate, trimethylolpropane triacrylate, polyoxyethylated trimethylolpropane triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, triethylene glycol diacrylate, polyoxypropyltri Methylolpropane triacrylate, butylene glycol diacrylate, 1,2,4-butantrio Lutriacrylate, 2,2,4-trimethyl-1,3-pentanediol diacrylate, diallyl fumarate, 1,10-decanediol dimethyl acrylate, dipentaerythritol hexaacrylate, dipentaerythritol pentaacrylate, and the above acrylate Substituted with a methacrylate group, γ-methacryloxypropyltrimethoxysilane, 1-vinyl-2-pyrrolidone, 2-hydroxyethylacryloyl phosphate, tetrahydrofurfuryl acrylate, dicyclopentenyl acrylate, dicyclopentenyloxyethyl acrylate , 3-butanediol diacrylate, neopentyl glycol diacrylate, polyethylene glycol diacrylate, hydroxypivalic acid ester Luneopentyl glycol diacrylate, phenol-ethylene oxide modified acrylate, phenol-propylene oxide modified acrylate, N-vinyl-2-pyrrolidone, bisphenol A-ethylene oxide modified diacrylate, pentaerythritol diacrylate monostearate, tetraethylene glycol di Acrylate, polypropylene glycol diacrylate, trimethylolpropane propylene oxide modified triacrylate, isocyanuric acid ethylene oxide modified triacrylate, trimethylolpropane ethylene oxide modified triacrylate, pentaerythritol pentaacrylate, pentaerythritol hexaacrylate, pentaerythritol tetraacrylate, etc. The aclay Monomers, those obtained by substituting these acrylate groups with methacrylate groups, urethane acrylate oligomers obtained by bonding acrylate groups to oligomers having a polyurethane structure, polyester acrylate oligomers obtained by bonding acrylate groups to oligomers having a polyester structure, epoxy groups An epoxy acrylate oligomer in which an acrylate group is bonded to an oligomer having an epoxy group, a urethane methacrylate oligomer in which a methacrylate group is bonded to an oligomer having a polyurethane structure, a polyester methacrylate oligomer in which a methacrylate group is bonded to an oligomer having a polyester structure, and an epoxy group Epoxy methacrylate oligomer with methacrylate group bonded to oligomer, with acrylate group That polyurethane acrylates, polyester acrylates having an acrylate group, an epoxy acrylate resin having an acrylate group, a polyurethane methacrylate having a methacrylate group, an epoxy methacrylate resins having a polyester methacrylate, and methacrylate groups having methacrylate group. These monomers may be used alone or in combination of two or more. In the present invention, commercially available monomers can also be used. For example, SR399 (manufactured by Sartomer Co., Ltd.), Aronix M-400 (manufactured by Toagosei Co., Ltd.), and Aronix M-450 (manufactured by Toagosei Co., Ltd.) ) Is preferred.

The content of the monomer is not particularly limited as long as a predetermined columnar formed product can be formed. Specifically, the content of the monomer is in the range of 60% by mass to 95% by mass in the solid content of the photosensitive resin composition. In particular, it is preferably in the range of 65% by mass to 93% by mass, particularly in the range of 70% by mass to 90% by mass.
In addition, solid content means all components other than the solvent in the photosensitive resin composition.

(B) Polymer As the polymer, for example, ethylene-vinyl acetate copolymer, ethylene-vinyl chloride copolymer, ethylene vinyl copolymer, polystyrene, acrylonitrile-styrene copolymer, ABS resin, polymethacrylic acid resin, Ethylene methacrylate resin, polyvinyl chloride resin, chlorinated vinyl chloride, polyvinyl alcohol, cellulose acetate propionate, cellulose acetate butyrate, nylon 6, nylon 66, nylon 12, polyethylene terephthalate, polybutylene terephthalate, polycarbonate, polyvinyl acetal, Polyether ether ketone, polyether sulfone, polyphenylene sulfide, polyarylate, polyvinyl butyral, epoxy resin, phenoxy resin, polyimide resin, Polyamideimide resin, polyamic acid resin, polyetherimide resin, phenol resin, urea resin, etc., and polymerizable monomers such as methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, n-propyl acrylate, n-propyl methacrylate, Isopropyl acrylate, isopropyl methacrylate, sec-butyl acrylate, sec-butyl methacrylate, isobutyl acrylate, isobutyl methacrylate, tert-butyl acrylate, tert-butyl methacrylate, n-pentyl acrylate, n-pentyl methacrylate, n-hexyl acrylate, n-hexyl Methacrylate, 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, n One kind of octyl acrylate, n-octyl methacrylate, n-decyl acrylate, n-decyl methacrylate, 2-hydroxyethyl methacrylate, benzyl methacrylate, styrene, α-methylstyrene, N-vinyl-2-pyrrolidone, glycidyl (meth) acrylate Examples thereof include polymers or copolymers composed of at least one of acrylic acid, methacrylic acid, dimer of acrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, vinyl acetic acid, and acid anhydrides thereof. It is done. These polymers may be used alone or in combination of two or more. In the present invention, commercially available polymers can also be used. For example, Epicoat 180S70 (manufactured by Yuka Shell Epoxy Co., Ltd.), Aronix M-5600 (manufactured by Toagosei Co., Ltd.), Aronix M-6200 (Toagosei Co., Ltd.) Alonix M-7100 (manufactured by Toagosei Co., Ltd.) and Aronix M-9050 (manufactured by Toagosei Co., Ltd.) are preferred.

  The content of the polymer is not particularly limited as long as a columnar formed product can be formed. Specifically, the content of the polymer is in the range of 5% by mass to 40% by mass in the solid content of the photosensitive resin composition. It is preferable to be in the range of 7% by mass to 35% by mass, particularly in the range of 10% by mass to 30% by mass.

(C) Photopolymerization initiator The photopolymerization initiator is a compound that generates free radicals by exposure light, and specifically includes benzophenone, methyl o-benzoylbenzoate, 4,4-bis (dimethylamine). ) Benzophenone, 4,4-bis (diethylamine) benzophenone, α-amino-acetophenone, 4,4-dichlorobenzophenone, 4-benzoyl-4-methyldiphenyl ketone, dibenzyl ketone, fluorenone, 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2-hydroxy-2-methylpropiophenone, p-tert-butyldichloroacetophenone, thioxanthone, 2-methylthioxanthone, 2-chlorothioxanthone, 2-isopropylthioxanthone, diethylthioxone Tontone, benzyldimethyl ketal, benzylmethoxyethyl acetal, benzoin methyl ether, benzoin butyl ether, anthraquinone, 2-tert-butylanthraquinone, 2-amylanthraquinone, β-chloroanthraquinone, anthrone, benzanthrone, dibenzsuberon, methyleneanthrone, 4-azido Benzylacetophenone, 2,6-bis (p-azidobenzylidene) cyclohexane, 2,6-bis (p-azidobenzylidene) -4-methylcyclohexanone, 2-phenyl-1,2-butadion-2- (o-methoxycarbonyl) ) Oxime, 1-phenyl-propanedione-2- (o-ethoxycarbonyl) oxime, 1,3-diphenyl-propanetrione-2- (o-ethoxycarbonyl) oxy 1-phenyl-3-ethoxy-propanetrione-2- (o-benzoyl) oxime, Michler's ketone, 2-methyl-1 [4- (methylthio) phenyl] -2-morpholinopropan-1-one, 2- Benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone, naphthalenesulfonyl chloride, quinolinesulfonyl chloride, n-phenylthioacridone, 4,4-azobisisobutyronitrile, diphenyl disulfide, benzthiazole Photoreductive dyes such as disulfide, triphenylphosphine, camphorquinone, Adeka N1717, carbon tetrabromide, tribromophenylsulfone, benzoin peroxide, eosin, methylene blue, and reducing agents such as ascorbic acid and triethanolamine Combination The can be exemplified. In this embodiment, these photopolymerization initiators can be used alone or in combination of two or more.

  The content of the photopolymerization initiator is not particularly limited as long as desired photosensitivity can be imparted to the photosensitive resin layer. Specifically, the content of the photopolymerization initiator is 0.5% by mass to 5% in the solid content of the photosensitive resin composition. It is preferable to be within the range of 0.0 mass%, particularly within the range of 1.0 mass% to 4.0 mass%, and particularly within the range of 1.5 mass% to 3.0 mass%.

(D) Other Although the said photosensitive resin composition contains a monomer, a polymer, and a photoinitiator normally, it can contain a solvent and an additive as needed.

  The solvent may be the same as that used in general resin compositions, specifically, alcohols such as methanol, ethanol, n-propanol, isopropanol, ethylene glycol, propylene glycol, α- Or terpenes such as β-terpineol, etc., ketones such as acetone, methyl ethyl ketone, cyclohexanone, N-methyl-2-pyrrolidone, aromatic hydrocarbons such as toluene, xylene, tetramethylbenzene, cellosolve, methyl cellosolve, ethyl cellosolve , Carbitol, methyl carbitol, ethyl carbitol, butyl carbitol, propylene glycol monomethyl ether, propylene glycol monoethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol Glycol ethers such as ethyl ether, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, ethyl acetate, butyl acetate, cellosolve acetate, ethyl cellosolve acetate, butyl cellosolve acetate, carbitol acetate, ethyl carbitol acetate, butyl carbitol Examples thereof include acetates such as acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, and 3-methoxybutyl acetate.

  The content of the solvent is not particularly limited as long as the photosensitive resin composition can be stably disposed, and is appropriately set according to the viscosity necessary for coating. .

  As said additive, a leveling agent, a crosslinking agent, a hardening | curing agent, a polymerization accelerator, a viscosity modifier etc. can be mentioned, for example. Known additives can be used for these additives.

The viscosity of the photosensitive resin composition is not particularly limited as long as it can be applied by a screen printing method. For example, the viscosity at 25 ° C. is in the range of 50 Pa · s to 200 Pa · s. can do.
The viscosity can be measured based on JIS K7117-2. Specifically, the viscosity can be measured by a cone plate method using a rheometer manufactured by Anton Paar.
The viscosity can be adjusted by the content of the solvent.

  The color of the photosensitive resin composition can be appropriately set according to the use of the columnar formed product, and may be transparent or non-transparent. When used as a product, it is preferably transparent.

(2) Substrate The substrate can be appropriately selected according to the use of the electronic element, and is not particularly limited. Moreover, as said board | substrate, it may have transparency and does not need to have transparency.

  When the substrate with a columnar product produced by the production method of this embodiment is used as a substrate for a liquid crystal lens, the substrate preferably has transparency, for example, the total light transmittance is preferably 80% or more. 90% or more is more preferable. Here, the total light transmittance of the substrate can be measured according to JIS K7361-1 (a test method for the total light transmittance of a plastic-transparent material).

  Examples of the substrate include inflexible rigid materials such as quartz glass, Pyrex (registered trademark) glass, and synthetic quartz plates, or flexible materials such as resin films and optical resin plates. Can be used.

  The thickness of the substrate is not particularly limited as long as a columnar formed product can be formed. For example, when the substrate with the columnar formed product is used as a liquid crystal lens substrate, the thickness is in a range of 0.05 mm to 1.1 mm. It is preferable to be within.

  In the substrate, for example, when the substrate with columnar formation is used as a substrate for a liquid crystal lens, a transparent electrode layer may be formed on one surface. The said transparent electrode layer may be formed on a board | substrate before arrangement | positioning of the said photosensitive resin layer, and the commercially available board | substrate with which the transparent electrode layer was formed previously may be used.

(3) Photosensitive resin layer formation process This process is a process of forming the said photosensitive resin layer by arrange | positioning the photosensitive resin composition in a pattern form by the screen-printing method.
As a method for forming such a photosensitive resin layer, a general screen printing method can be used. Specifically, a method of forming a photosensitive resin layer by placing a photosensitive resin composition on a screen and placing the photosensitive resin composition on the substrate through a screen mesh while pressing with a squeegee or the like is used. Can do.
Further, a metal mask or a mesh mask can be used as the screen.

The number of times that the photosensitive resin composition is arranged in this step may be one, but it is preferably two or more times in the same place.
In this step, among the above, the photosensitive resin layer is arranged by laminating two or more of the photosensitive resin compositions in the thickness direction, that is, by laminating and arranging the photosensitive resin compositions twice or more. In particular, the number of stacked layers is preferably in the range of 2 to 4, that is, the number of stacked layers is preferably in the range of 2 to 4 times, and in particular, the number of stacked layers is 2 That is, it is preferable that the number of stacking arrangements is two. By arranging two or more photosensitive resin compositions in the thickness direction, two or more photosensitive resin compositions having different easiness of curing with respect to exposure light are stacked in the thickness direction as the photosensitive resin composition. Thus, it is possible to easily arrange them. For this reason, a columnar shaped product having a high height and aspect ratio can be easily formed.
Moreover, it is because the thickness of the photosensitive resin composition arrange | positioned each time can be made thin, and it becomes easy to discharge | emit the photosensitive resin composition from the mesh | network of a screen. For this reason, it is possible to form the photosensitive resin layer at a desired position, and furthermore, it is possible to stably form the columnar formed product at the desired position.
Furthermore, it is because it can be made simple by the number of lamination | stacking being in the said range.
Note that FIG. 2 shows that when the number of arrangements is two, the photosensitive resin composition layer 3′a disposed first and the photosensitive resin composition layer 3′b disposed second are The example arrange | positioned in the same location is shown.
Note that the reference numerals in FIG. 2 indicate the same members as those in FIG.

  In the case where the photosensitive resin composition is arranged so as to be laminated twice or more in the thickness direction, the kind of the photosensitive resin composition to be laminated may be made of the same material. Are preferably photosensitive resin compositions having different easiness of curing with respect to exposure light, and in particular, the photosensitive resin composition disposed on the substrate side is a photosensitive resin disposed on the surface side of the photosensitive resin layer. It is preferable that the resin composition is harder than the exposure light than the photosensitive resin composition. This is because it becomes easy to reduce the difference in the degree of curing between the vicinity of the substrate and the vicinity of the surface side by exposure in the exposure and development process. Further, because of this, it is possible to easily form a columnar formed product having a high height and aspect ratio.

The method of making the photosensitive resin composition disposed on the substrate side easy to cure is not particularly limited as long as it is a method capable of obtaining a desired ease of curing, but is disposed on the substrate side. As a photosensitive resin composition to be used, a method using a resin having a longer curing reaction wavelength or a method having a higher sensitivity than the photosensitive resin composition disposed on the surface side of the photosensitive resin layer is used. Is preferred. Since long-wavelength light is easily transmitted to the deep part of the photosensitive resin layer compared to single-wavelength light, the photosensitive resin composition disposed on the substrate side is one having a long curing reaction wavelength, This is because the use of long-wavelength light as the exposure light can easily reduce the difference in the degree of curing between the vicinity of the substrate and the vicinity of the surface side.
In addition, by using a material having excellent sensitivity, it is possible to sufficiently cure even when it is located in the vicinity of the substrate where exposure light is difficult to reach.

That the reaction wavelength of curing of the photosensitive resin composition is a long wavelength means that the peak wavelength of light that causes curing of the photosensitive resin composition is on the long wavelength side.
The method of setting the reaction wavelength for curing the photosensitive resin composition to a long wavelength is not particularly limited as long as it can stably form a columnar formed product having a high height and aspect ratio. However, there can be mentioned, for example, a method in which the strongest peak of the photopolymerization initiator, which is the strongest peak among the wavelength peaks absorbed by the photopolymerization initiator, is a long wavelength. In addition, in a photoinitiator, the main reaction of a photoradical reaction arises normally by irradiating the wavelength of the strongest absorption peak mentioned above.
In this step, the strongest absorption peak of the photopolymerization initiator is preferably in the range of 310 nm to 380 nm, particularly preferably in the range of 315 nm to 375 nm, and particularly in the range of 320 nm to 370 nm. It is preferable to be within. This is because when the peak of the reaction wavelength is within the above-described range, it can be sufficiently transmitted to the vicinity of the substrate and the polymerization reaction can be sufficiently advanced.
The absorption peak of the photopolymerization initiator can be obtained by dissolving the photopolymerization initiator in a solvent and measuring the absorption spectrum by using a spectrophotometer such as Hitachi spectrophotometer U-3900.

The method for making the photosensitive resin composition excellent in sensitivity is not particularly limited as long as it is a method capable of stably forming a columnar formed product having a high height and aspect ratio. And a method for increasing the content of a photopolymerization initiator and a sensitizer.
In addition, about content of the said photoinitiator and a sensitizer, it sets suitably according to the target height, an aspect-ratio, etc.

The thickness of the photosensitive resin layer formed by this step is not particularly limited as long as it can form a columnar formed product having a desired height. Specifically, the height can be the same as the height of the columnar product formed by the exposure and development process.
In addition, the thickness of the said photosensitive resin layer means the thickness after drying removal of a solvent, when the photosensitive resin composition contains a solvent.
Moreover, the thickness of the said photosensitive resin layer means the thickness of the whole photosensitive resin layer, when forming by laminating | stacking two or more photosensitive resin compositions. Moreover, as the thickness of the photosensitive resin composition layer laminated and arranged each time, any thickness can be used as long as it can be a photosensitive resin layer having a desired thickness, but the same is preferable at each time. For example, when the number of times of stacking is two, it is usually preferable that two layers of the photosensitive resin composition having the same thickness are stacked.

  The shape of the patterned photosensitive resin layer formed in this step in plan view is not particularly limited as long as it can form a columnar formed product, and may be a circular shape, a rectangular shape such as a triangle or a quadrangle, and the like. However, the shape is preferably similar to the shape of the columnar formation in plan view. Moreover, although the said shape may be two or more types, it is preferable that it is one type. This is because, by setting the developing speed from the side surface direction of the photosensitive resin layer to the same level in the exposure and developing step, it is possible to reduce the variation in the shape of the columnar formed product.

  The size of the patterned photosensitive resin layer in plan view may be any size as long as it can form a columnar formed product, but one columnar formed product can be obtained from one pattern of the photosensitive resin layer. Preferably there is. This is because the shape of the columnar formed product can be reduced in variation.

In this step, it is preferable to perform a drying treatment after the photosensitive resin composition is arranged. The drying process can be the same as the process used in a general method for forming a resin layer, and thus description thereof is omitted here.
Moreover, when the arrangement | positioning frequency of the said photosensitive resin composition is 2 times or more, the said drying process may be performed for every arrangement | positioning of the said photosensitive resin composition, and after arrangement | positioning of all the photosensitive resin layers. It may be performed all at once.
In this step, in particular, when the photosensitive resin composition is disposed so as to be laminated in the thickness direction, the drying process is performed on the layer of the photosensitive resin composition on the substrate side. It is preferable to arrange the photosensitive resin composition for the next time. It is because the layer of the photosensitive resin composition can be laminated stably.

2. Exposure development process The exposure development process in this aspect is a process of forming the columnar formed product by exposing the photosensitive resin layer and developing it.

The exposure light used in this step is not particularly limited as long as it includes light having a wavelength that can be cured by exposing the photosensitive resin layer. The exposure light can be irradiated using a light source in a known exposure apparatus.
The exposure method used in this step can be the same as that used in general photolithography. Specifically, a method of irradiating the photosensitive resin layer with exposure light through a photomask using a known exposure apparatus can be mentioned. The photomask is not particularly limited as long as a columnar formed product can be formed, and can be the same as a general photomask.

In this step, the photosensitive resin layer is developed after the exposure of the photosensitive resin layer.
The developer for the photosensitive resin layer is not particularly limited as long as the photosensitive resin layer can be developed in a predetermined pattern, and examples thereof include water and an aqueous alkaline solution (KOH or K ₂ CO ₃ ).

  In this step, if necessary, a baking treatment for baking the columnar formed product may be performed after the development. The baking treatment can be the same as the method used in the general method for forming a resin layer, and thus description thereof is omitted here.

The height of the columnar product is appropriately set according to the use of the columnar product, but is preferably in the range of 30 μm to 100 μm, and more preferably in the range of 33 μm to 95 μm. In particular, it is preferable to be in the range of 37 μm to 90 μm.
It is because the effect by using the manufacturing method of this aspect can be exhibited more effectively by being the said height. In addition, because of the height, when the columnar formed product is a columnar formed product for a liquid crystal lens, the cell gap of the liquid crystal lens can be favorably maintained. Moreover, it is because it is easy to make a favorable aspect ratio.
Note that “the height of the columnar formed product” refers to a vertical distance from the upper base to the lower base of the columnar formed product.
Further, the “upper bottom of the columnar formed product” refers to a surface of the columnar formed product on the side opposite to the substrate side. The “bottom bottom of the columnar formed product” refers to the surface of the columnar formed product on the substrate side.
Specifically, the height of the columnar formed product is a distance indicated by q in FIGS. 3 (a) to 3 (d).

The absolute value of the difference between the width of the upper base and the width of the lower base of the columnar product is appropriately set according to the use of the columnar product, but is preferably 5.0 μm or less. However, it is preferably 4.5 μm or less, and particularly preferably 4.0 μm or less.
This is because when the absolute value of the difference between the width of the upper base and the width of the lower base is within the above range, sufficient strength can be imparted to the columnar formed product.
Note that the “width of the upper bottom of the columnar formation” refers to the straight line extending along the horizontal direction with the substrate at the top of the columnar formation, and the respective side surfaces of the columnar formation in the front shape of the columnar formation. The distance between two intersections with a straight line extending along. Specifically, it refers to the distance indicated by r in FIGS.
In addition, the “width of the bottom bottom of the columnar formation” refers to 2 of the substrate surface on which the columnar formation is formed and the straight line extending along each side surface of the columnar formation in the front shape of the columnar formation. The distance between two intersections. That is, “the width of the bottom of the columnar formed product” refers to a distance between two intersections between the surface of the substrate itself and the two straight lines described above. Further, when the columnar formation is formed on the substrate through another layer, the “width of the lower bottom of the columnar formation” is 2 of the surface of the other layer and the two straight lines described above. The distance between two intersections. Specifically, it refers to the distance indicated by s in FIGS.

The width of the lower base of the columnar product is appropriately set according to the use of the columnar product, but is preferably in the range of 20 μm to 50 μm, for example, 25 μm to 47 μm. It is preferably within the range, and particularly preferably within the range of 30 μm to 45 μm.
It is because it is easy to make it a thing with a high aspect ratio by being in the said range, and it is because the effect by using the manufacturing method of this aspect can be exhibited more effectively. Moreover, it is because it is excellent in the intensity | strength of a columnar formation, and can make it easy to form a columnar formation.
In addition, when the columnar formation is a columnar formation for a liquid crystal lens, the liquid crystal lens can be hardly seen by an observer, and a good display can be achieved in a display device using the liquid crystal lens. Because it becomes.

The aspect ratio of the columnar formed product is appropriately set according to the use of the columnar formed product, but is preferably within the range of 1.7 to 2.3, and more preferably 1.8 to 2.3. It is preferably within the range of 2.2, and particularly preferably within the range of 1.9 to 2.1.
It is because the effect by using the manufacturing method of this aspect can be exhibited more effectively because the aspect ratio is within the above-described range. Moreover, it is because it can have sufficient intensity | strength.
For this reason, for example, when the columnar formed product is used as a columnar formed product for a liquid crystal lens, the cell gap can be maintained satisfactorily, and a good display can be achieved in a display device using the liquid crystal lens. It is. Moreover, it is because the said columnar formation can be formed stably.

The shape of the columnar formed product in plan view varies depending on the type of the columnar formed product, and examples thereof include a circular shape, an elliptical shape, and a polygonal shape such as a quadrangular shape. In this step, a shape having a small difference between the long side and the short side is preferable, and a circular shape or a square shape is preferable.
This is because, for example, when the columnar formed product is used as a columnar formed product for a liquid crystal lens, disorder of alignment of the liquid crystal in the liquid crystal layer can be satisfactorily suppressed.

As the front shape of the columnar shaped product, any shape can be used as long as it can have a desired height, an absolute value of a difference between the width of the upper base and the width of the lower base, and an aspect ratio. ) And FIG. 3B, the width r of the upper base and the width s of the lower base may be equivalent, and the width r of the upper base is lower than the width of the lower base as shown in FIG. It may be a forward taper shape smaller than the width s, or an inverse taper shape where the upper base width r is larger than the lower base width s. Further, as shown in FIGS. 3A and 3B, when the width r of the upper base and the width s of the lower base are equal, the side surface is perpendicular to the substrate as shown in FIG. Even if it is a barrel shape in which the width t between the upper base and the lower base is larger than the width r of the upper base and the width s of the lower base as shown in FIG. Good. In this step, it is particularly preferable that the front shape of the columnar formed product is a vertical shape.
This is because the columnar formed product can be excellent in strength and the like. For this reason, for example, when the columnar formed product is used as a columnar formed product for a liquid crystal lens, the cell gap can be maintained satisfactorily, and a good display can be obtained in a display device using the liquid crystal lens. Because it becomes.

  The planar view shape and front shape of the columnar formed product can be confirmed using, for example, a scanning electron microscope (SEM). Further, the height, the width of the upper base, the width of the lower base, the width of other portions, and the like of the columnar formation can be calculated based on the measured values of the observation image of the SEM. A general scanning electron microscope (SEM) can be used.

The use of the columnar product can be appropriately selected according to various electronic elements. For example, a columnar product for a liquid crystal lens for maintaining a cell gap in a liquid crystal lens, or a distance between substrates in a printer wiring board A member for holding the substrate constant, a member for holding the distance between the substrates constant in the semiconductor laminated substrate, a member for forming a micro flow path in the ink jet printer, a rib material in the plasma display, in the organic electroluminescence element A cathode separator can be mentioned.
As the columnar formed product, among other things, it is a columnar formed product for a liquid crystal lens, that is, the substrate with the columnar formed product formed by the manufacturing method of this embodiment is a substrate for a liquid crystal lens, and the columnar formed product is a liquid crystal lens. It is preferably used for fixing the thickness between the two substrates constituting the lens. This is because the effect that the columnar shaped product having a high height and aspect ratio of this embodiment can be easily obtained can be more effectively exhibited. Further, as a result, the cell gap can be maintained well.

3. Other Steps The method for producing a substrate with columnar formed article of this embodiment includes a photosensitive resin layer forming step and an exposure development step, but may include other steps as necessary.
As such other processes, for example, in the photosensitive resin layer forming process, the photosensitive resin layer is formed by arranging two or more of the photosensitive resin compositions in the thickness direction. In this case, it may have a pre-curing step for curing the photosensitive resin composition on the substrate side before the photosensitive resin composition on the surface side of the photosensitive resin layer is arranged. By curing the photosensitive resin composition constituting the vicinity of the substrate where exposure light is difficult to reach before the exposure development process, the difference in the degree of curing between the vicinity of the substrate and the vicinity of the surface side is caused by exposure in the exposure development process. This is because it can be made small, and a columnar formed product having a high height and aspect ratio can be easily formed. Further, it is easy to use the same material as the photosensitive resin composition, and the cost can be reduced. In addition, about the exposure light in such a pre-curing process, it can be made to be the same as that of the content as described in the above-mentioned "2. Exposure development process."
In addition, when the substrate with columnar formation is a substrate for a liquid crystal lens, before the photosensitive resin layer forming step, a step of forming a transparent electrode layer on the substrate or a light shielding portion having a predetermined pattern on the substrate is formed. The process to do can be mentioned. Moreover, the process of forming an alignment film on the transparent electrode layer in which the columnar product was formed after the exposure and development process can be exemplified.
Note that the transparent electrode layer, the light-shielding portion, and the alignment film are the same as those generally used for liquid crystal lenses, and thus description thereof is omitted here.

B. Second Embodiment Next, a second embodiment of the method for manufacturing a substrate with columnar product according to the present invention will be described. The manufacturing method of the substrate with columnar formation according to this aspect is the above-described manufacturing method of the substrate with columnar formation, in which the photosensitive resin layer forming step is performed by adding a dry film-shaped photosensitive resin composition in the thickness direction. The photosensitive resin layer is formed by arranging the layers as described above.

The manufacturing method of such a substrate with a columnar product according to this aspect will be described with reference to the drawings. FIG. 4 is a process diagram showing an example of a method for manufacturing a substrate with columnar formations according to this embodiment. As illustrated in FIG. 4, in the method for manufacturing a substrate with a columnar product according to this embodiment, a substrate 2 on which a transparent electrode layer 4 is formed is prepared, and a dry film-like photosensitive resin composition (3 ″ a and 3 ″ b) is arranged so that two or more layers are laminated in the thickness direction (FIG. 4 (a)), thereby including a photosensitive resin composition layer 3′a and a photosensitive resin composition layer 3′b. The photosensitive resin layer 3 ′ is formed (FIG. 4B), the exposure light L is irradiated to the photosensitive resin layer 3 ′ through the mask M (FIG. 4C), and the developer is applied. By applying and developing, a columnar product 3 formed by laminating two layers of the first columnar product 3a and the second columnar product 3b is formed (FIG. 4D). ).
4B shows the photosensitive resin layer forming step, and FIGS. 4C and 4D show the exposure and development step.
In this example, the columnar product 3 is formed with respect to the substrate 2 on which the transparent electrode layer 4 is formed, and the substrate with columnar product 1 is used as a substrate with a columnar product for a liquid crystal lens. It is something that can be done. Moreover, the case where the photosensitive resin composition (3 ″ a and 3 ″ b) having different photosensitivity between the substrate side and the surface side is used.

According to this aspect, the photosensitive resin layer forming step forms the photosensitive resin layer by arranging two or more dry film photosensitive resin compositions in the thickness direction. A thick photosensitive resin layer can be easily formed. For this reason, a columnar formed product having a high height can be easily formed.
In addition, since the photosensitive resin composition in the form of a dry film is laminated, it is easy to arrange two or more photosensitive resin compositions that are different in ease of curing with respect to exposure light in the thickness direction. Thus, it is possible to easily form a columnar formed product with a small difference between the width of the upper base and the width of the lower base.
For this reason, a columnar shaped product having a high height and aspect ratio can be stably formed.
Furthermore, the columnar shaped product can be formed with high positional accuracy by including the exposure and developing step.
From the above, it becomes possible to form a columnar shaped product having a high height and aspect ratio with high positional accuracy.

The manufacturing method of the substrate with columnar product of this aspect includes a photosensitive resin layer forming step and an exposure development step.
Hereafter, each process of the manufacturing method of the board | substrate with a columnar formation of this aspect is demonstrated in detail.
The exposure and development process and other processes can be the same as the contents described in the section “A. First embodiment”, and thus the description thereof is omitted here.

The photosensitive resin layer forming step in this embodiment is a step of forming a photosensitive resin layer on a substrate, and the above photosensitive resin layer is arranged by laminating two or more dry film-like photosensitive resin compositions in the thickness direction. Forming a functional resin layer.
The substrate can be the same as that described in the section “A. First Embodiment”, and the description thereof is omitted here.

1. Photosensitive resin composition The photosensitive resin composition used in this step is in the form of a dry film.
Here, the dry film shape means that the film is processed into a film shape. As such a dry film-like photosensitive resin composition, for example, a liquid photosensitive resin composition applied onto a support and the solvent removed by drying can be used.
As a component contained in such a photosensitive resin composition, a monomer, a polymer, and a photoinitiator can be mentioned, and a solvent and an additive may be included. About each said component, since it can be made to be the same as that of the content as described in the term of the said "A. 1st embodiment", description here is abbreviate | omitted.
Moreover, as content of the solvent contained in the said photosensitive resin composition, what is necessary is just the thing which can make the said photosensitive resin composition into a dry film form, and it is so preferable that it is small, For example, 20 mass% or less In particular, it is preferably 10% by mass or less, and particularly preferably 5% by mass or less.

2. Photosensitive resin layer forming step This step is a step of arranging two or more dry film-like photosensitive resin compositions in the thickness direction.
As an arrangement method of such a photosensitive resin composition, only a dry film-like photosensitive resin composition may be arranged on a substrate, or a dry film-like photosensitive layered on a support. What is transcribe | transferred on a resin composition board | substrate, ie, what arrange | positions by removing a support body, after arrange | positioning a photosensitive resin composition with a support body on a board | substrate may be used.
Further, when the substrate is a long flexible material, a sheet-like photosensitive resin composition may be disposed, but a long dry film-shaped photosensitive resin composition is rolled. You may arrange | position on a board | substrate with a toe roll.

  The number of times the photosensitive resin composition is arranged may be any number as long as a laminate of two or more photosensitive resin compositions can be arranged, that is, a photosensitive resin composition laminated two or more times. Although it may be arranged at a time or may be arranged twice or more, it is usually one in which the photosensitive resin composition is laminated one by one.

  About the kind of material of the photosensitive resin composition laminated | stacked and arrange | positioned in this process, the number of lamination | stacking of the photosensitive resin composition, the thickness of a photosensitive resin layer, and a drying process, the said "A. 1st embodiment" section. The contents can be the same as described.

C. 3rd embodiment Next, the 3rd embodiment of the manufacturing method of the board | substrate with a columnar formation of this invention is demonstrated. The manufacturing method of the substrate with columnar formations according to this aspect is the manufacturing method of the substrate with columnar formations, in which the photosensitive resin layer forming step arranges the photosensitive resin composition in a pattern by a discharge method. Thus, the photosensitive resin layer is formed.

The manufacturing method of such a substrate with a columnar product according to this aspect will be described with reference to the drawings. FIG. 5 is a process diagram showing an example of a method for manufacturing a substrate with columnar formations according to this aspect. As illustrated in FIG. 5, in the method for manufacturing the substrate with columnar formation according to this aspect, the substrate 2 on which the transparent electrode layer 4 is formed is prepared, and the photosensitive resin composition 3 ″ is formed into a pattern by a discharge method. By arranging (FIG. 5 (a)), the photosensitive resin layer 3 ′ is formed (FIG. 5 (b)), and the photosensitive resin layer 3 ′ formed in a pattern is interposed through a mask M. The columnar product 3 is formed by irradiating the exposure light L (FIG. 5C), applying a developing solution, and developing (FIG. 5D).
5A and 5B show the photosensitive resin layer forming step, and FIGS. 5C and 5D show the exposure and developing step.
In this example, the columnar product 3 is formed with respect to the substrate 2 on which the transparent electrode layer 4 is formed, and the substrate with columnar product 1 is used as a substrate with a columnar product for a liquid crystal lens. It is something that can be done.

According to this aspect, the photosensitive resin layer forming step is to form the photosensitive resin layer in a pattern by a discharge method, so that compared to the case where the photosensitive resin layer is formed on the entire surface of the substrate, The amount of the photosensitive resin composition to be discarded can be reduced, and the cost can be reduced.
Further, the development time can be shortened, and when the photosensitive resin composition contains a solvent, the drying time of the solvent can be shortened. For this reason, it can aim at suppression of the variation in the shape of the columnar formation by productivity improvement and suppression of drying nonuniformity.

Moreover, after forming the photosensitive resin layer by the said photosensitive resin layer formation process like this aspect, and obtaining the columnar formation by the said exposure image development process, the photosensitive which becomes a columnar formation only by the discharge method. A columnar shaped product can be obtained after forming a photosensitive resin layer having a wider area in plan view as compared to forming a conductive resin layer.
For this reason, compared with the case where the photosensitive resin layer used as a columnar formation is formed only by the discharge method, a photosensitive resin layer with a high height can be formed easily. As a result, a columnar formed product having a high height can be easily formed.
Furthermore, compared with the case where the photosensitive resin layer which becomes a columnar formed product is formed only by the discharge method, the required level of the positional accuracy of the discharged photosensitive resin composition can be lowered. As a result, it is possible to relax the required discharge characteristics for the photosensitive resin composition, and it is possible to widen the material selectivity. Therefore, application of a high viscosity material or a material having a high surface tension, addition of fine particles, and the like are facilitated, and a columnar formed product having a high height and aspect ratio can be stably formed.
Furthermore, the columnar formed product can be formed with higher positional accuracy by having the exposure and developing step.

The manufacturing method of the substrate with columnar product of this aspect includes a photosensitive resin layer forming step and an exposure development step.
Hereafter, each process of the manufacturing method of the board | substrate with a columnar formation of this aspect is demonstrated in detail.
The exposure and development process and other processes can be the same as the contents described in the section “A. First embodiment”, and thus the description thereof is omitted here.

The photosensitive resin layer forming step in this embodiment is a step of forming the photosensitive resin layer on the substrate, and the step of forming the photosensitive resin layer by arranging the photosensitive resin composition in a pattern by a discharge method. It is.
The substrate can be the same as that described in the section “A. First Embodiment”, and the description thereof is omitted here.

1. Photosensitive resin composition The photosensitive resin composition used in this step is arranged in a pattern by a discharge method, and forms the photosensitive resin layer.
As a component contained in such a photosensitive resin composition, a monomer, a polymer, and a photoinitiator can be mentioned, and a solvent and an additive may be included. Each of these components can be the same as that described in the section “A. First Embodiment”, and will not be described here.
In this step, fine particles may be contained as a component of the photosensitive resin composition. This is because the formation of a thick photosensitive resin layer can be facilitated by including the fine particles.

The average particle diameter of the fine particles is not particularly limited as long as a columnar formed product having a desired height can be formed, and those having a height equal to or less than the columnar formed product can be used.
In this step, it is preferable that the height is more than half of the height of the columnar formed product, and particularly within the range of 90 to 100 when the height of the columnar formed product is 100. It is preferable. This is because a thick photosensitive resin layer can be easily formed. Moreover, it is because the said columnar formation can be made excellent in intensity | strength.
Specifically, when the height of the columnar formed product is in the range of 30 μm to 100 μm, the average particle diameter can be set in the range of 1 μm to 100 μm.
Here, an average particle diameter is an average particle diameter by microscopic observation. The average particle diameter by microscopic observation is obtained, for example, by performing microscopic observation at a magnification of 100, measuring 100 particle diameters of arbitrary fine particles with image processing software or the like, and averaging the number. The particle diameter refers to the average value of the major axis diameter and minor axis diameter of the fine particles.

The fine particle material is not particularly limited as long as it can stably form a columnar formed product and does not have conductivity. For example, a resin material such as an acrylic resin, silica or the like Inorganic materials can be used.
Further, the material of the fine particles may or may not have transparency, but it has transparency when the columnar formation is used as a columnar formation for a liquid crystal lens. It is preferable.

  The shape of the fine particles is not particularly limited as long as a desired photosensitive resin layer and a columnar formed product can be formed, and a fiber shape or a spherical shape can be used. Further, the shape of the fine particles may include different shapes, but a uniform shape is preferable. This is because the columnar formed product can have a small variation in shape.

  The content of the fine particles is not particularly limited as long as a desired photosensitive resin layer and a columnar formed product can be formed, but is in a range of 0.1% by mass to 20% by mass in the solid content. In particular, the content is preferably in the range of 0.1% by mass to 10% by mass. This is because when the content is within the above-described range, the ejection stability can be improved.

  The viscosity of the photosensitive resin composition is not particularly limited as long as it can be discharged by a discharge method. For example, the viscosity at 25 ° C. is in the range of 0.01 mPa · s to 1000 Pa · s. Especially, it is preferable to be within the range of 0.1 Pa · s to 100 Pa · s. It is because it can discharge stably by being in the said range. Moreover, it is because leveling of the photosensitive resin composition can be suppressed and formation of a thick photosensitive resin layer is easy.

2. Photosensitive resin layer formation process This process is a process of forming the said photosensitive resin layer by arrange | positioning the photosensitive resin composition in pattern form by the discharge method.
The discharge method may be any method in which a photosensitive resin composition is applied in a pattern from a nozzle, and examples thereof include an inkjet method, a dispenser method, and an electric field jet method.
As a discharging method in this step, when a photosensitive resin composition having a high viscosity, for example, a viscosity at 25 ° C. of 0.1 Pa · s or more is used, a dispenser method, an electric field jet method, or the like is used. It is preferable to use the electric field jet method. This is because even if the photosensitive resin composition has a high viscosity, it can be stably applied.

  Moreover, as a discharge method in this process, you may discharge in the state which heated the photosensitive resin composition. This is because the photosensitive resin composition at the time of discharge can have a low viscosity and can be easily discharged.

As the frequency | count of arrangement | positioning of the photosensitive resin composition in this process, 1 time may be sufficient, but it may be 2 times or more in the same location.
In this step, when the photosensitive resin composition contains fine particles, the number of times is preferably determined according to the average particle size of the fine particles. For example, when the average particle diameter of the fine particles is larger than half of the height of the columnar formed product, it is preferable that the fine particles be used once.

In this step, the photosensitive resin composition may be applied to the bank portion formed on the substrate by a discharge method so as to be stored in a predetermined region.
More specifically, a bank portion having an opening surrounding the region for forming the photosensitive resin layer on the substrate is formed, and the photosensitive resin layer is applied to the inside of the opening of the bank portion. There may be. This is because the photosensitive resin layer can be stably formed. Further, it is because a thick photosensitive resin layer can be easily formed by being surrounded by the bank portion.

The bank portion may remain on the substrate with columnar formations, but is preferably removed. This is because the formation of the photosensitive resin layer and the columnar formed product is easy.
In this step, it is particularly preferable that it can be used repeatedly. This is because the bank portion can be used repeatedly such as a mask, so that the process can be simplified. In addition, the cost can be reduced.
When the bank portion is to be removed, the timing for removing the bank portion may be after the photosensitive resin composition is arranged, that is, after the formation of the photosensitive resin layer. Either before or after the drying treatment of the layer, or after the formation of the columnar formation.
FIG. 6 shows an example of a method for forming a photosensitive resin layer using a mask as the bank portion. As illustrated in FIG. 6A, a bank (mask) 5 having an opening 5a is disposed on the substrate 2, and a photosensitive resin composition 3 ″ is applied into the opening 5a by a discharge method. After forming the photosensitive resin layer 3 ′ (FIG. 6B), the bank portion (mask) is removed to obtain the photosensitive resin layer 3 ′ formed on the substrate 2 (FIG. 6). 6 (c)).
In addition, about the code | symbol in FIG. 6, since it shows the member same as FIG. 1, description here is abbreviate | omitted.

As the material of the bank portion, it is preferable that the opening portion is less deformed, and a resin or an inorganic material that does not have conductivity can be used when it remains on the substrate with columnar formations. . Moreover, when it is removed from the substrate with columnar formations, it may have conductivity, and a resin, an inorganic material, a metal material, or the like can be used.
In this step, in particular, when the bank portion is repeatedly used like a mask, it is preferably one having low adhesion to the photosensitive resin composition. This is because the photosensitive resin layer and the columnar formed product can be made less peeled when the bank portion is removed. Specifically, a fluororesin such as Teflon (registered trademark) or a resin whose surface is coated with a fluororesin can be preferably used.

  The plan view shape and size of the opening of the bank are not particularly limited as long as a desired photosensitive resin layer can be formed, and the plan view shape and size of the patterned photosensitive resin layer are not particularly limited. And can be similar.

  In this step, the material type of the photosensitive resin composition to be laminated, the shape and size of the patterned photosensitive resin layer in plan view, the thickness of the photosensitive resin layer, and the drying treatment are described above. The contents can be the same as those described in the section “First Embodiment”.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has substantially the same configuration as the technical idea described in the claims of the present invention, and any device that exhibits the same function and effect is the present invention. It is included in the technical scope of the invention.

  Hereinafter, the present invention will be described in more detail with reference to examples and comparative examples.

[Example 1]
(Preparation of copolymer resin solution)
In a polymerization tank, 63 parts by mass of methyl methacrylate (MMA), 12 parts by mass of acrylic acid (AA), 6 parts by mass of 2-hydroxyethyl methacrylate (HEMA), and 88 parts by mass of diethylene glycol dimethyl ether (DMDG) are charged. After stirring and dissolving, 7 parts by mass of 2,2′-azobis (2-methylbutyronitrile) was added and dissolved uniformly. Then, it stirred at 85 degreeC under nitrogen stream for 2 hours, and also was made to react at 100 degreeC for 1 hour. Further, 7 parts by mass of glycidyl methacrylate (GMA), 0.4 parts by mass of triethylamine, and 0.2 parts by mass of hydroquinone were added to the obtained solution, and the mixture was stirred at 100 ° C. for 5 hours to obtain a copolymer resin solution ( A solid content of 50%) was obtained.

(Preparation of photosensitive resin composition 1)
Each composition shown below was mixed and the photosensitive resin composition 1 was obtained.

<Composition of photosensitive resin composition 1>
・ Dipentaerythritol pentaacrylate (Sartomer SR399)
59 parts by mass-The above copolymer resin solution (solid content 50%) 14.5 parts by mass-Irgacure 369 (BASF) 1.5 parts by mass-Diethylene glycol dimethyl ether 25 parts by mass

(Production of substrate with columnar formation)
As the substrate, a glass substrate (Corning 1737 glass) having a size of 300 mm × 400 mm and a thickness of 0.7 mm was prepared. After this substrate was washed according to a conventional method, the above-described transparent resin composition 1 was arranged in a pattern by a screen printing method and dried to obtain a photosensitive resin layer having a thickness of 50 μm.
As the screen, a metal mask having a circular shape with an opening having a diameter of 100 μm, a pitch of 200 μm, and a thickness of 50 μm was used.

A photomask was placed at a distance of 100 μm from the surface of the coating film, and irradiated with ultraviolet rays for 10 seconds (exposure amount: 100 mJ / cm ² ) using a 2.0 kW ultrahigh pressure mercury lamp by a proximity aligner. Subsequently, it was immersed in a 0.05 wt% potassium hydroxide aqueous solution (liquid temperature 23 ° C.) for 1 minute for alkali development to remove only the uncured portion of the coating film. Then, the said board | substrate was heat-processed for 30 minutes in 200 degreeC atmosphere, and the columnar formation was obtained.
As the photomask, a metal mask having a circular shape with an opening having a diameter of 50 μm and a pitch of 200 μm was used.

[Example 2]
The following compositions were mixed to obtain photosensitive resin compositions 2 and 3 in the form of dry films, and then the obtained photosensitive resins 2 and 3 in the form of dry films were laminated on the substrate in this order. A columnar product was obtained in the same manner as in Example 1 except that the photosensitive resin layer was formed.

<Composition of photosensitive resin composition 2>
・ Dipentaerythritol pentaacrylate (Sartomer SR399)
59 parts by mass-The above copolymer resin solution (solid content 50%) 14.5 parts by mass-Irgacure 369 (BASF) 1.5 parts by mass-Diethylene glycol dimethyl ether 25 parts by mass

<Composition of photosensitive resin composition 3>
・ Dipentaerythritol pentaacrylate (Sartomer SR399)
59 parts by mass-Copolymer resin solution (solid content 50%) 14.5 parts by mass-Irgacure 907 (BASF) 1.5 parts by mass-Diethylene glycol dimethyl ether 25 parts by mass

[Example 3]
After obtaining the photosensitive resin composition 4 by mixing the respective compositions shown below, the obtained photosensitive resin composition 4 has a circular shape with a diameter of 100 μm, a pitch of 200 μm, and a thickness by an inkjet method. A columnar formed product was obtained in the same manner as in Example 1 except that the photosensitive resin layer having a thickness of 50 μm was arranged in a pattern.

<Composition of photosensitive resin composition 4>
・ Dipentaerythritol pentaacrylate (Sartomer SR399)
59 parts by mass-The above copolymer resin solution (solid content 50%) 14.5 parts by mass-Irgacure 369 (BASF) 1.5 parts by mass-Diethylene glycol dimethyl ether 25 parts by mass

[Example 4]
After obtaining the photosensitive resin composition 5 by mixing the respective compositions shown below, the obtained photosensitive resin composition 5 is formed into a circular shape having a diameter of 100 μm, a pitch of 200 μm, and a thickness by an inkjet method. A columnar shaped product was obtained in the same manner as in Example 1 except that the photosensitive resin layer having a thickness of 50 μm was arranged in a pattern.

<Composition of photosensitive resin composition 5>
・ Dipentaerythritol pentaacrylate (Sartomer SR399)
59 parts by mass-The above copolymer resin solution (solid content 50%) 14.5 parts by mass-Irgacure 369 (manufactured by BASF) 1.5 parts by mass-25 parts by mass of diethylene glycol dimethyl ether-Fine particles (diameter 10-20 μm, Adelite by ADEKA) AT) 1 part by weight

[Comparative Example 1]
Example 1 except that the screen has a circular shape with an opening of 100 μm, a pitch of 200 μm, and a columnar product is directly formed using a metal mask with a thickness of 50 μm, followed by no development. A columnar product was formed in the same manner as described above.

[Comparative Example 2]
A columnar formed product was formed in the same manner as in Example 2 except that a photosensitive resin layer having a thickness of 50 μm was formed only from the photosensitive resin composition 2 in the form of a dry film.

[Comparative Example 3]
A columnar formed product was formed in the same manner as in Example 2 except that a photosensitive resin layer having a thickness of 50 μm was formed only from the photosensitive resin composition 3 in the form of a dry film.

[Comparative Example 4]
Except for forming a columnar formed product having a circular shape with an opening diameter of 150 μm, a pitch of 200 μm, and a thickness of 50 μm directly by an inkjet method, and thereafter performing development, the same as in Example 3 was performed. As a result, a columnar formation was formed.

[Evaluation]
Table 1 shows the shape of the columnar product in the obtained substrate with columnar product. In addition, the following numerical value shows the average of 10 columnar formations selected arbitrarily.
In Table 1, Δ (upper base-lower base) indicates the absolute value of the difference between the width of the upper base and the width of the lower base.
The shapes in Table 1 are all height values, aspect ratios, and absolute values of the difference between the upper and lower base widths of 50 μm ± 10 μm, 1.5 ± 0.5, and 5 μm or less, respectively. Among the 10 columnar formations arbitrarily selected, the evaluation is made as ○ when the number is 9 or more, △ when it is 5 or more, and × when it is less than 5 It was.

DESCRIPTION OF SYMBOLS 1 ... Substrate with columnar formation 2 ... Substrate 3 ... Columnar formation 3 '... Photosensitive resin layer 4 ... Transparent electrode layer 5 ... Bank

Claims (8)

A photosensitive resin layer forming step of forming a photosensitive resin layer on the substrate;
An exposure development step of forming a columnar formed product by developing after exposing the photosensitive resin layer, and
The method for producing a substrate with a columnar product, wherein the photosensitive resin layer forming step forms the photosensitive resin layer by arranging the photosensitive resin composition in a pattern by a screen printing method. .   The said photosensitive resin layer formation process forms the said photosensitive resin layer by arrange | positioning so that two or more of the said photosensitive resin composition may be laminated | stacked on the thickness direction, The said photosensitive resin layer is formed. Manufacturing method of substrate with columnar formation. A photosensitive resin layer forming step of forming a photosensitive resin layer on the substrate;
An exposure development step of forming a columnar formed product by developing after exposing the photosensitive resin layer, and
Columnar formation characterized in that the photosensitive resin layer forming step forms the photosensitive resin layer by arranging two or more dry film-shaped photosensitive resin compositions in the thickness direction. Manufacturing method of substrate with objects.   The said photosensitive resin layer formation process arrange | positions so that two or more photosensitive resin compositions from which the hardening property with respect to exposure light differs may be laminated | stacked in the thickness direction. The manufacturing method of the board | substrate with a columnar formation as described in 2. A photosensitive resin layer forming step of forming a photosensitive resin layer on the substrate;
An exposure development step of forming a columnar formed product by developing after exposing the photosensitive resin layer, and
The method for producing a substrate with a columnar formed article, wherein the photosensitive resin layer forming step forms the photosensitive resin layer by arranging a photosensitive resin composition in a pattern by a discharge method.   The method for manufacturing a substrate with columnar formation according to claim 5, wherein the photosensitive resin composition contains fine particles.   The method for manufacturing a substrate with columnar formation according to any one of claims 1 to 6, wherein a height of the columnar formation is in a range of 30 µm to 100 µm. The columnar formed substrate is a liquid crystal lens substrate,
The method for manufacturing a substrate with columnar formation according to claim 7, wherein the columnar formation is used for fixing a thickness between two substrates constituting a liquid crystal lens.

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