JP2015153795A - Substrate suction separation mechanism and vacuum device - Google Patents

Substrate suction separation mechanism and vacuum device Download PDF

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JP2015153795A
JP2015153795A JP2014023994A JP2014023994A JP2015153795A JP 2015153795 A JP2015153795 A JP 2015153795A JP 2014023994 A JP2014023994 A JP 2014023994A JP 2014023994 A JP2014023994 A JP 2014023994A JP 2015153795 A JP2015153795 A JP 2015153795A
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adsorption
substrate
suction
pedestal
desorption
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JP6226768B2 (en
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前平 謙
Ken Maehira
謙 前平
良太 嶽
Ryota Take
良太 嶽
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Ulvac Inc
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Ulvac Inc
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Abstract

PROBLEM TO BE SOLVED: To provide a technique that prevents damage of a substrate due to local concentration of stress to a substrate when the substrate is separated in a vacuum device or the like for holding the substrate with adhesion force, and prevents a device portion on the substrate from being adversely affected by static electricity occurring when the substrate is separated.SOLUTION: In a substrate suction separation mechanism 1, a feeding pedestal 3 for feeding a substrate 20 while the substrate 20 is disposed on a pedestal surface 4 is provided with a suction separation member 6 for sucking and separating the substrate 20. A suction area 61 and a non-suction area 62 are provided in proximity with each other in a curved surface area of the surface of the suction separation member 6. The suction separation member 6 is configured to be rotatable in the curving direction of the curved surface area so as to be disposed at a suction position where the surface of the suction area 61 is on the same plane as the pedestal surface 4 and at a non-suction position where the surface of the non-suction area 62 is separated from the pedestal surface 4.

Description

本発明は、例えば半導体製造工程、液晶ディスプレイ製造工程、プラズマディスプレイ製造工程等において、基板を搬送する際に粘着力によって基板を吸着し且つ離脱する技術に関する。   The present invention relates to a technique for adsorbing and releasing a substrate by an adhesive force when the substrate is transported, for example, in a semiconductor manufacturing process, a liquid crystal display manufacturing process, a plasma display manufacturing process, and the like.

従来、この種の装置としては、例えば真空槽内において基板を粘着力によって保持部に吸着して種々の処理を行うものが知られている。
例えば、リング状の粘着面によって基板を吸着保持する一方で、基板を粘着面から剥離する際に、膜を変形させて基板に対して押しつけるものや、剛体部を基板に対して押し付けるものが提案されている(例えば、特許文献1、2参照)。
また、可撓性ゴムからなる粘着パッドを基板に押し付けて基板を保持する一方で、粘着パッドを加圧膨張させて基板から剥離するものも提案されている(例えば、特許文献3参照)。
2. Description of the Related Art Conventionally, as this type of apparatus, for example, an apparatus that performs various processing by adsorbing a substrate to a holding portion with an adhesive force in a vacuum chamber is known.
For example, while adsorbing and holding a substrate with a ring-shaped adhesive surface, a device that deforms and presses against the substrate when peeling the substrate from the adhesive surface, or a device that presses the rigid body against the substrate is proposed (For example, see Patent Documents 1 and 2).
There has also been proposed a technique in which a pressure-sensitive adhesive pad made of flexible rubber is pressed against a substrate to hold the substrate, while the pressure-sensitive adhesive pad is pressure-expanded and peeled from the substrate (for example, see Patent Document 3).

しかし、このような従来技術では、基板を粘着面から剥離させる際に基板に対する局所的な応力集中によって基板の破損が生ずるという問題がある。
また、基板を粘着面から剥離させる際に発生する静電気によって、基板上のデバイス部分に対して悪影響を及ぼすという問題もある。
However, such a conventional technique has a problem that when the substrate is peeled off from the adhesive surface, the substrate is damaged due to local stress concentration on the substrate.
Another problem is that static electricity generated when the substrate is peeled from the adhesive surface adversely affects the device portion on the substrate.

特許第3882004号公報Japanese Patent No. 3882004 特許第3917651号公報Japanese Patent No. 3917651 特開2012−204709号公報JP 2012-204709 A

本発明は、このような従来の技術の課題を解決するためになされたもので、その目的とするところは、基板を粘着力によって保持する真空装置等において、基板を離脱させる際に基板に対する局所的な応力集中による基板の破損を防止するとともに、基板を離脱させる際に生ずる静電気によって基板上のデバイス部分に対する悪影響を防止する技術を提供することにある。   The present invention has been made to solve the above-described problems of the prior art, and the object of the present invention is to provide a local apparatus with respect to the substrate when the substrate is detached in a vacuum apparatus or the like that holds the substrate with adhesive force. It is an object of the present invention to provide a technique for preventing damage to a substrate due to a stress concentration and preventing an adverse effect on a device portion on the substrate due to static electricity generated when the substrate is detached.

上記目的を達成するためになされた本発明は、基板を台座面上に配置して搬送する搬送台座と、前記搬送台座に設けられ、基板の吸着及び離脱を行う吸着離脱部材とを有し、前記吸着離脱部材は、表面が曲面状に形成された曲面領域を有し、当該曲面領域に、吸着領域と非吸着領域とが隣接して設けられるとともに、前記吸着領域の表面が前記台座面に対して面一の位置となる吸着位置と、前記非吸着領域の表面が前記台座面から離間した位置となる非吸着位置とに配置されるように、前記吸着離脱部材が前記曲面領域の湾曲方向に回転可能に構成されている基板吸着離脱機構である。
本発明では、前記搬送台座の台座面に複数の開口部が設けられ、各開口部の内側に、前記吸着離脱部材がそれぞれ設けられている場合にも効果的である。
本発明では、前記吸着離脱部材は、断面が真円形状に形成され、当該吸着離脱部材が前記搬送台座の台座面に対して交差する方向に移動するように構成されている場合にも効果的である。
本発明では、前記吸着離脱部材は、断面が真円形状に形成され、当該真円の回転中心軸から偏芯させて設けた回転軸部を中心として回転するように構成されている場合にも効果的である。
本発明では、前記吸着離脱部材は、断面が長円形状に形成され、当該長円の回転中心軸の位置に設けた回転軸部を中心として回転するように構成されている場合にも効果的である。
一方、本発明は、真空槽と、前記真空槽内に配置され、前記いずれかの基板吸着離脱機構とを有し、前記真空槽内に設けられた駆動機構によって前記吸着離脱部材を動作させるように構成されている真空装置である。
The present invention made in order to achieve the above object has a transport pedestal for transporting the substrate disposed on the pedestal surface, and a suction detachment member provided on the transport pedestal for sucking and detaching the substrate, The adsorption / detachment member has a curved surface area having a curved surface, and the adsorption area and the non-adsorption area are provided adjacent to the curved area, and the surface of the adsorption area is on the pedestal surface. The suction / removal member is curved in the curved region so that the suction position is flush with the non-suction position where the surface of the non-suction region is spaced from the pedestal surface. 1 is a substrate adsorption / desorption mechanism configured to be rotatable.
The present invention is also effective when a plurality of openings are provided on the pedestal surface of the transport pedestal, and the adsorption / desorption member is provided inside each opening.
In the present invention, the adsorption / desorption member is also effective when the cross-section is formed in a perfect circle shape and the adsorption / desorption member is configured to move in a direction intersecting the pedestal surface of the transfer pedestal. It is.
In the present invention, the adsorption / detachment member may be configured so that the cross section is formed in a perfect circle shape and is rotated about a rotation shaft portion provided eccentrically from the rotation center axis of the perfect circle. It is effective.
In the present invention, the adsorption / desorption member is also effective when the cross section is formed in an oval shape and is configured to rotate around a rotation shaft portion provided at the position of the rotation center axis of the oval. It is.
On the other hand, the present invention includes a vacuum chamber and any one of the substrate adsorption / desorption mechanisms disposed in the vacuum chamber, and operates the adsorption / desorption member by a driving mechanism provided in the vacuum chamber. It is the vacuum device comprised.

本発明の基板吸着離脱機構の場合、吸着離脱部材の吸着領域の表面が台座面に対して面一となる吸着位置では、搬送台座の台座面上に基板が配置された場合に当該基板の裏側面と接触するから、この位置において基板を吸着離脱部材の吸着領域の表面に押し付けることにより、搬送台座の台座面上に基板を配置した状態で、吸着離脱部材の吸着領域の粘着力によって基板を吸着保持することができる。   In the case of the substrate adsorption / desorption mechanism of the present invention, in the adsorption position where the surface of the adsorption region of the adsorption / desorption member is flush with the pedestal surface, when the substrate is placed on the pedestal surface of the transfer pedestal, the back side of the substrate Since the substrate is in contact with the surface, by pressing the substrate against the surface of the adsorption area of the adsorption / desorption member at this position, the substrate is placed by the adhesive force of the adsorption area of the adsorption / desorption member in a state where the substrate is arranged on the pedestal surface of the conveyance base. Adsorption can be held.

一方、吸着位置から吸着離脱部材を曲面領域の湾曲方向に回転させると、吸着領域の表面と基板の裏側面との吸着部分のうち基板移動方向先端部側の吸着部分が吸着離脱部材の回転開始によって剥離した後、基板は、吸着離脱部材の回転に伴い曲面状の吸着領域の表面をあたかも転がるように移動するため、この回転動作の際に吸着離脱部材の吸着領域の表面から基板の裏側面に対して与えられる剪断力は、基板の裏側面に吸着させた平面状の吸着面を基板の裏側面に対して直交する方向に剥離する場合と比べて非常に小さい。   On the other hand, when the suction / removal member is rotated from the suction position in the curved direction of the curved surface region, the suction portion on the front side of the substrate moving direction of the suction portion between the surface of the suction region and the back side surface of the substrate starts to rotate the suction / removal member After the peeling, the substrate moves as if rolling on the surface of the curved adsorption area as the adsorption / desorption member rotates, so that during the rotation operation, the substrate moves away from the adsorption area surface of the adsorption / desorption member. The shearing force applied to the surface of the substrate is very small as compared with the case where the planar adsorption surface adsorbed on the back side surface of the substrate is peeled in the direction perpendicular to the back side surface of the substrate.

さらに、吸着離脱部材の曲面領域の湾曲方向への回転を継続すると、基板の裏側面と吸着離脱部材の吸着領域の表面との接触部分が、吸着領域から隣接する非吸着領域に向って移動して非吸着領域の表面に接触するようになるから、これにより基板と吸着離脱部材との間の粘着力が消滅する。   Furthermore, if the adsorption / desorption member continues to rotate in the curved direction, the contact portion between the back side surface of the substrate and the surface of the adsorption region of the adsorption / desorption member moves from the adsorption region toward the adjacent non-adsorption region. As a result, the adhesive force between the substrate and the adsorption / desorption member disappears.

この非吸着位置においては、吸着離脱部材の非吸着領域が台座面から離間していることから、例えばリフトピンやアーム等の搬送機構を用いることにより、基板を搬送台座から容易に離脱させることができる。   In this non-adsorption position, the non-adsorption region of the adsorption / removal member is separated from the pedestal surface, so that the substrate can be easily detached from the conveyance pedestal by using a conveyance mechanism such as a lift pin or an arm, for example. .

以上述べた本発明によれば、吸着離脱部材の吸着領域の表面に吸着された基板を吸着離脱部材から離脱させる際、吸着離脱部材の吸着領域の表面から基板の裏側面に対して与えられる剪断力は、基板の裏側面に吸着させた平面状の吸着面を基板の裏側面に対して直交する方向に剥離する従来技術と比べて非常に小さく、かつ、基板の裏側面と各吸着離脱部材の表面との接触部分が非吸着領域の表面に移行した状態では、基板と各吸着離脱部材との間の粘着力が消滅している(又は殆どない)ため、基板を搬送台座から離脱させる際に吸着離脱部材から基板に対する局所的な応力集中は発生せず、その結果、基板の破損を防止することができる。
また、これにより、基板を搬送台座から離脱させる際の摩擦力も従来技術と比べて非常に小さく静電気が殆ど発生しないことから、基板上のデバイス部分に対して悪影響を及ぼすことがない。
According to the present invention described above, when the substrate adsorbed on the surface of the adsorption region of the adsorption / desorption member is separated from the adsorption / desorption member, the shear applied from the surface of the adsorption region of the adsorption / desorption member to the back side surface of the substrate The force is very small compared to the conventional technology in which the flat suction surface adsorbed on the back side of the substrate is peeled in the direction orthogonal to the back side of the substrate, and the back side of the substrate and each adsorption / desorption member When the contact portion with the surface of the substrate moves to the surface of the non-adsorption region, the adhesive force between the substrate and each adsorption / desorption member has disappeared (or almost does not exist). Thus, local stress concentration from the adsorption / desorption member to the substrate does not occur, and as a result, damage to the substrate can be prevented.
Further, since the frictional force when the substrate is detached from the transport base is very small as compared with the prior art, almost no static electricity is generated, so that the device portion on the substrate is not adversely affected.

本発明において、搬送台座の台座面に複数の開口部が設けられ、各開口部の内側に、吸着離脱部材がそれぞれ設けられている場合には、複数の吸着離脱部材によってバランス良く基板を保持することができ、また、各吸着離脱部材を搬送台座内に収容することによって基板吸着離脱機構の小型化を図ることができる。   In the present invention, when a plurality of openings are provided on the pedestal surface of the transport pedestal, and a suction / removal member is provided inside each opening, the plurality of suction / removal members hold the substrate in a balanced manner. In addition, it is possible to reduce the size of the substrate adsorption / desorption mechanism by accommodating each adsorption / desorption member in the transport base.

本発明において、吸着離脱部材は、断面が真円形状に形成され、当該吸着離脱部材が搬送台座の台座面に対して交差する方向に移動するように構成されている場合には、例えば円柱形状の部材に粘着性のシートと非粘着性又は弱粘着性のシートを貼付することにより、本発明に用いる吸着離脱部材を容易に作成することができる。   In the present invention, the adsorption / desorption member is formed in a circular shape in cross section, and when the adsorption / desorption member is configured to move in a direction intersecting the pedestal surface of the conveyance pedestal, for example, a cylindrical shape By adhering an adhesive sheet and a non-adhesive or weakly adhesive sheet to this member, the adsorption / desorption member used in the present invention can be easily prepared.

本発明において、吸着離脱部材の断面が真円形状に形成され、当該真円の回転中心軸から偏芯させて設けた回転軸部を中心として回転するように構成されている場合、又は、吸着離脱部材の断面が長円形状に形成され、当該長円の回転中心軸の位置に設けた回転軸部を中心として回転するように構成されている場合には、吸着離脱部材を回転軸部を中心として回転させるだけで、吸着離脱部材の表面を台座面に対して交差する方向(例えば上下方向)へ移動させ、また、基板に対して吸着領域と非吸着領域との接触を切り換えることができるので、吸着離脱部材を駆動させる機構をより簡素な構成にすることができる。   In the present invention, when the cross section of the adsorption / detachment member is formed in a perfect circle shape and is configured to rotate around a rotation shaft portion provided eccentric from the rotation center axis of the perfect circle, or the adsorption When the section of the detachment member is formed in an oval shape and is configured to rotate around the rotation shaft provided at the position of the rotation center axis of the ellipse, the adsorption detachment member is By simply rotating as the center, the surface of the adsorption / desorption member can be moved in a direction intersecting the pedestal surface (for example, the vertical direction), and the contact between the adsorption region and the non-adsorption region can be switched with respect to the substrate. Therefore, the mechanism for driving the adsorption / desorption member can be made simpler.

そして、真空槽と、前記真空槽内に配置され、上述したいずれかの基板吸着離脱機構とを有し、前記真空槽内に設けられた駆動機構によって前記吸着離脱部材を動作させるように構成されている場合には、基板を離脱させる際に基板に対する局所的な応力集中による基板の破損を防止するとともに、基板を離脱させる際に生ずる静電気によって基板上のデバイス部分に対する悪影響を防止可能な真空装置を提供することができる。   And it has a vacuum chamber and one of the above-mentioned substrate adsorption / desorption mechanisms arranged in the vacuum chamber, and is configured to operate the adsorption / desorption member by a drive mechanism provided in the vacuum chamber. When the substrate is removed, the vacuum apparatus can prevent damage to the substrate due to local stress concentration on the substrate and prevent adverse effects on the device portion on the substrate due to static electricity generated when removing the substrate. Can be provided.

(a):本発明に係る基板吸着離脱機構の実施の形態の外観構成を示す平面図(b):同基板吸着離脱機構の内部構成を示す部分断面図(c):同基板吸着離脱機構の吸着離脱部材の斜視図(A): Plan view showing the external configuration of the embodiment of the substrate adsorption / desorption mechanism according to the present invention (b): Partial sectional view showing the internal configuration of the substrate adsorption / desorption mechanism (c): Perspective view of adsorption / detachment member (a)(b):本実施の形態における吸着離脱部材の移動範囲を示す説明図(A) (b): Explanatory drawing which shows the movement range of the adsorption | suction separation member in this Embodiment (a)〜(c):本実施の形態における基板吸着動作を示す説明図(A)-(c): Explanatory drawing which shows the board | substrate adsorption | suction operation | movement in this Embodiment. (a)〜(d):本実施の形態における基板離脱動作を示す説明図(A)-(d): Explanatory drawing which shows the board | substrate removal operation | movement in this Embodiment. (a)〜(c):本発明に用いる吸着離脱部材の他の例を示す側面図(A)-(c): Side view which shows the other example of the adsorption | suction separation member used for this invention. (a)〜(c):本発明に用いる吸着離脱部材の他の例を示す側面図(A)-(c): Side view which shows the other example of the adsorption | suction separation member used for this invention.

以下、本発明を実施するための形態について図面を参照して説明する。
図1(a)は、本発明に係る基板吸着離脱機構の実施の形態の外観構成を示す平面図、図1(b)は、同基板吸着離脱機構の内部構成を示す部分断面図、図1(c)は、同基板吸着離脱機構の吸着離脱部材の斜視図である。
また、図2(a)(b)は、本実施の形態における吸着離脱部材の移動範囲を示す説明図である。
Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.
FIG. 1A is a plan view showing an external configuration of an embodiment of a substrate adsorption / desorption mechanism according to the present invention, FIG. 1B is a partial cross-sectional view showing an internal configuration of the substrate adsorption / desorption mechanism, and FIG. (C) is a perspective view of an adsorption / desorption member of the substrate adsorption / desorption mechanism.
2 (a) and 2 (b) are explanatory diagrams showing the movement range of the adsorption / desorption member in the present embodiment.

図1(a)(b)に示すように、本実施の形態の基板吸着離脱機構1は、例えば真空槽2内で用いられるもので、基板20を搬送するための搬送台座3を有している。
なお、搬送台座3は、通常の場合、水平方向に向けて配置される。本明細書において部材等の上下関係について言及する場合には、図1(b)並びに図2(a)(b)の位置関係に基づくものとする。
As shown in FIGS. 1A and 1B, a substrate adsorption / desorption mechanism 1 according to the present embodiment is used in a vacuum chamber 2, for example, and has a transport base 3 for transporting a substrate 20. Yes.
In addition, the conveyance pedestal 3 is usually arranged in the horizontal direction. In this specification, when referring to the vertical relationship of members and the like, it is based on the positional relationship of FIG. 1 (b) and FIGS. 2 (a) and 2 (b).

搬送台座3は基板20の形状と対応するように形成された例えば矩形板状に形成され、その一方の面(ここでは表側面)側に形成された平面状の台座面4上に基板20を載置支持するように構成されている。   The transfer pedestal 3 is formed, for example, in the shape of a rectangular plate corresponding to the shape of the substrate 20, and the substrate 20 is placed on the flat pedestal surface 4 formed on one side (here, the front side). It is comprised so that mounting may be carried out.

搬送台座3には、複数(本実施の形態では6個)の孔部3aが貫通して設けられ、これら孔部3a内に、基板20を昇降させるためのリフトピン21が挿入されるようになっている。
また、搬送台座3の台座面4には、複数(本実施の形態では4個)の動作開口部5が設けられている。
A plurality of (six in this embodiment) hole portions 3a are provided through the transport base 3, and lift pins 21 for raising and lowering the substrate 20 are inserted into the hole portions 3a. ing.
A plurality (four in this embodiment) of operation openings 5 are provided on the pedestal surface 4 of the transport pedestal 3.

本実施の形態の動作開口部5は、例えば矩形形状に形成され、例えば動作開口部5に対して搬送台座3の台座面4と反対側(ここでは裏側面)に貫通するように形成された収容部50が設けられている。   The operation opening 5 of the present embodiment is formed in, for example, a rectangular shape, and is formed so as to penetrate, for example, the operation opening 5 on the side opposite to the pedestal surface 4 (here, the back side surface) of the transport pedestal 3. A housing part 50 is provided.

収容部50内には、それぞれ吸着離脱部材6が設けられている。
吸着離脱部材6は、表面が曲面状に形成された曲面領域を有するもので、本実施の形態では、断面が真円形状(例えば円柱形状)に形成されている。
In the accommodating part 50, the adsorption | suction removal member 6 is provided, respectively.
The adsorption / desorption member 6 has a curved surface area whose surface is formed in a curved surface shape. In the present embodiment, the cross section is formed in a perfect circle shape (for example, a cylindrical shape).

そして、各吸着離脱部材6の表面には、基板20を吸着するための吸着領域61と、基板20を離脱するための非吸着領域62が設けられている。
吸着領域61は、粘着性を有する弾性材料(例えばシリコーンゴム)からなる例えばシート状の部材によって構成されている。
On the surface of each adsorption / desorption member 6, an adsorption region 61 for adsorbing the substrate 20 and a non-adsorption region 62 for separating the substrate 20 are provided.
The adsorption region 61 is configured by, for example, a sheet-like member made of an elastic material having adhesiveness (for example, silicone rubber).

本明細書における「粘着性」は、当該粘着性を有する物質が基板等の部材の表面に接触した場合に、当該粘着性を有する物質と、当該基板等の部材の表面との間における分子間力によって生ずるものをいう。   In the present specification, “adhesiveness” refers to an intermolecular relationship between the adhesive substance and the surface of the member such as the substrate when the adhesive substance contacts the surface of the member such as the substrate. This is caused by power.

本実施の形態では、吸着領域61は、吸着離脱部材6の断面円の中心角が例えば90度程度となるように、吸着離脱部材6の長手方向に沿って設けられている。
そして、吸着離脱部材6の円柱の回転中心軸線を中心として回転対称となるように二つの吸着領域61が配置されている。
In the present embodiment, the adsorption region 61 is provided along the longitudinal direction of the adsorption / desorption member 6 so that the central angle of the cross-sectional circle of the adsorption / desorption member 6 is, for example, about 90 degrees.
And the two adsorption | suction area | regions 61 are arrange | positioned so that it may become rotationally symmetrical centering | focusing on the rotation center axis line of the cylinder of the adsorption | suction removal member 6. FIG.

一方、非吸着領域62は、粘着性を有しない材料又は吸着領域61より粘着性の弱い材料(例えばフッ素樹脂)からなる例えばシート状の部材によって構成されている。
非吸着領域62は、吸着離脱部材6の断面円の中心角が例えば90度程度となるように、吸着離脱部材6の長手方向に沿って設けられている。
そして、非吸着領域62は、吸着離脱部材6の回転中心軸線を中心として回転対称となるように二つ配置されている。
このような構成により、本実施の形態では、吸着離脱部材6の表面に、吸着領域61と非吸着領域62とが交互に隣接して連続的に配置されている。
On the other hand, the non-adsorption region 62 is configured by, for example, a sheet-like member made of a material having no adhesiveness or a material having a lower adhesiveness than the adsorption region 61 (for example, a fluororesin).
The non-adsorption region 62 is provided along the longitudinal direction of the adsorption / desorption member 6 so that the central angle of the cross-sectional circle of the adsorption / desorption member 6 is about 90 degrees, for example.
Two non-adsorption regions 62 are arranged so as to be rotationally symmetric about the rotation center axis of the adsorption / desorption member 6.
With such a configuration, in the present embodiment, the adsorption areas 61 and the non-adsorption areas 62 are alternately arranged adjacent to each other on the surface of the adsorption / desorption member 6.

各吸着離脱部材6は、その回転中心軸線の位置に設けた回転軸部63を有し、この回転軸部63を中心として回転可能な状態で搬送台座3の収容部50内に取り付けられている。
ここでは、各吸着離脱部材6は、回転軸部63が搬送台座3の台座面4(XY平面)と平行で、かつ、同一方向(図1(a)に示す矢印Y方向)に向けて配置されている。
Each adsorption / desorption member 6 has a rotation shaft portion 63 provided at the position of the rotation center axis, and is attached in the accommodating portion 50 of the transport base 3 so as to be rotatable around the rotation shaft portion 63. .
Here, each adsorption | suction separation member 6 is arrange | positioned toward the same direction (arrow Y direction shown to Fig.1 (a)), and the rotating shaft part 63 is parallel to the base surface 4 (XY plane) of the conveyance base 3. FIG. Has been.

また、図2(a)(b)に示すように、各吸着離脱部材6は、搬送台座3の収容部50内において、図示しないガイドに沿って搬送台座3の台座面4と交差する例えば直交する方向(矢印Z方向)に移動可能に設けられている。   Further, as shown in FIGS. 2A and 2B, each adsorption / desorption member 6 intersects the pedestal surface 4 of the conveyance pedestal 3 along a guide (not shown) in the accommodating portion 50 of the conveyance pedestal 3, for example, orthogonally. It is provided to be movable in the direction of movement (arrow Z direction).

この場合、各吸着離脱部材6は、後述する駆動機構22の駆動力により、その上方側の頂部が搬送台座3の動作開口部5(台座面4)に対して下方となる位置(図2(a)参照)から、搬送台座3の動作開口部5(台座面4)に対して上方となる位置(図2(b)参照)まで移動するように構成されている。   In this case, each adsorption / desorption member 6 is positioned such that the top on the upper side is below the operation opening 5 (the pedestal surface 4) of the transport pedestal 3 due to the driving force of the drive mechanism 22 described later (FIG. 2 ( a)) to a position (see FIG. 2B) that is above the operation opening 5 (base surface 4) of the transport base 3.

また、各吸着離脱部材6は、搬送台座3の両側部側の回転軸部63aが、搬送台座3の両側部から突き出すようにその長さが設定されている。
さらに、各吸着離脱部材6の回転軸部63aの先端部には、それぞれ動力伝達機構64が設けられている。
Further, the length of each adsorption / detachment member 6 is set so that the rotation shafts 63 a on both sides of the transport pedestal 3 protrude from both sides of the transport pedestal 3.
Furthermore, a power transmission mechanism 64 is provided at the tip of the rotation shaft 63a of each adsorption / detachment member 6.

これら動力伝達機構64は、例えば真空槽2内に設けられた駆動機構22からそれぞれ回転動力及び搬送台座3の台座面4に対して直交する方向の動力が伝達されるように構成されている。
なお、これら駆動機構22及び動力伝達機構64としては、例えば歯車列や永久磁石又は電磁石を用いることができる。
These power transmission mechanisms 64 are configured such that, for example, rotational power and power in a direction perpendicular to the pedestal surface 4 of the transport base 3 are transmitted from the drive mechanism 22 provided in the vacuum chamber 2.
As the drive mechanism 22 and the power transmission mechanism 64, for example, a gear train, a permanent magnet, or an electromagnet can be used.

図3(a)〜(c)は、本実施の形態における基板吸着動作を示す説明図である。
本実施の形態において、基板20の吸着を行う場合には、例えば上述した真空槽2内に搬送台座3を搬入して所定の位置に配置する。
FIGS. 3A to 3C are explanatory views showing the substrate suction operation in the present embodiment.
In the present embodiment, when the substrate 20 is sucked, for example, the transport pedestal 3 is carried into the vacuum chamber 2 and placed at a predetermined position.

そして、真空槽2内の駆動機構22を各吸着離脱部材6の動力伝達機構64に連結し、駆動機構22からの動力が動力伝達機構64を介して各吸着離脱部材6に伝達されるようにする(図1(a)参照)。   Then, the drive mechanism 22 in the vacuum chamber 2 is connected to the power transmission mechanism 64 of each adsorption / desorption member 6 so that the power from the drive mechanism 22 is transmitted to each adsorption / desorption member 6 via the power transmission mechanism 64. (See FIG. 1 (a)).

さらに、駆動機構22を動作させ、吸着離脱部材6の吸着領域61を搬送台座3の台座面4側に向けるとともに、吸着離脱部材6を搬送台座3の台座面4に対して直交する方向に移動し、図3(a)に示すように、吸着離脱部材6の吸着領域61の表面の中央部分(頂部)が、搬送台座3の動作開口部5の内側において台座面4と面一(実際上は台座面4から若干上方の位置)となるように位置を設定する(吸着位置)。   Further, the drive mechanism 22 is operated so that the suction region 61 of the suction / removal member 6 is directed toward the pedestal surface 4 side of the transport base 3 and the suction / removal member 6 is moved in a direction orthogonal to the base surface 4 of the transport base 3. As shown in FIG. 3A, the central portion (top) of the surface of the suction region 61 of the suction / removal member 6 is flush with the pedestal surface 4 inside the operation opening 5 of the transport pedestal 3 (in practice) Is set to a position slightly above the pedestal surface 4 (suction position).

この状態で、図示しない搬送ロボットを用い、図3(b)に示すように、基板20を搬送台座3の台座面4上の所定の位置に配置する。これにより、基板20の裏側面が各吸着離脱部材6の吸着領域61の表面に接触する。   In this state, using a transfer robot (not shown), the substrate 20 is placed at a predetermined position on the pedestal surface 4 of the transfer pedestal 3 as shown in FIG. Thereby, the back side surface of the substrate 20 contacts the surface of the suction region 61 of each suction / detachment member 6.

次いで、例えば搬送台座3の下方から真空槽2内の真空排気を行うことにより、基板20に対して下方側の力を作用させ、図3(c)に示すように、各吸着離脱部材6の吸着領域61の表面に対して基板20の裏側面を押し付ける。   Next, for example, by evacuating the vacuum chamber 2 from below the transfer pedestal 3, a downward force is applied to the substrate 20, and as shown in FIG. The back side surface of the substrate 20 is pressed against the surface of the suction region 61.

これにより、各吸着離脱部材6の吸着領域61が弾性変形して押しつぶされ、その反力によって基板20の裏側面が各吸着離脱部材6の吸着領域61の表面に粘着保持される。また、基板20の裏側面が搬送台座3の台座面4に密着する。
この状態で、基板吸着離脱機構1を図示しない処理室内に移動し、基板20の表側面に対して例えば蒸着等の所定の処理を行う。
As a result, the suction region 61 of each suction / detachment member 6 is elastically deformed and crushed, and the reaction force causes the back side surface of the substrate 20 to be adhered and held on the surface of the suction region 61 of each suction / detachment member 6. Further, the back side surface of the substrate 20 is in close contact with the pedestal surface 4 of the transfer pedestal 3.
In this state, the substrate adsorption / desorption mechanism 1 is moved into a processing chamber (not shown), and a predetermined process such as vapor deposition is performed on the front side surface of the substrate 20.

なお、基板吸着離脱機構1の表裏を反転しても、基板20が各吸着離脱部材6から離脱することはないように、基板20の裏側面と各吸着離脱部材6の吸着領域61との間の粘着力を設定することが好ましい。   In addition, even if the front and back of the substrate adsorption / desorption mechanism 1 are reversed, the substrate 20 is not separated from each adsorption / desorption member 6 between the back side surface of the substrate 20 and the adsorption region 61 of each adsorption / desorption member 6. It is preferable to set the adhesive strength.

図4(a)〜(d)は、本実施の形態における基板離脱動作を示す説明図である。
本実施の形態において、基板吸着離脱機構1から基板20の離脱を行う場合には、基板20を吸着した状態(図3(c)に示す状態)の基板吸着離脱機構1を例えば上述した真空槽2内に搬入して所定の位置に配置する。
4 (a) to 4 (d) are explanatory views showing the substrate separation operation in the present embodiment.
In the present embodiment, when the substrate 20 is detached from the substrate adsorption / desorption mechanism 1, the substrate adsorption / desorption mechanism 1 in the state where the substrate 20 is adsorbed (the state shown in FIG. 3 (c)) is used, for example, in the vacuum chamber described above. 2 is carried in and arranged at a predetermined position.

そして、真空槽2内の駆動機構22を各吸着離脱部材6の動力伝達機構64に連結し、駆動機構22からの動力が動力伝達機構64を介して各吸着離脱部材6に伝達されるようにする(図1(a)参照)。   Then, the drive mechanism 22 in the vacuum chamber 2 is connected to the power transmission mechanism 64 of each adsorption / desorption member 6 so that the power from the drive mechanism 22 is transmitted to each adsorption / desorption member 6 via the power transmission mechanism 64. (See FIG. 1 (a)).

この状態で、駆動機構22の駆動力により、各吸着離脱部材6を、図3(c)に示す吸着位置から上方の例えば同じ高さ位置に移動し、図4(a)に示すように、基板20の裏側面を搬送台座3の台座面4から離間させる。   In this state, due to the driving force of the drive mechanism 22, each suction / detachment member 6 is moved from the suction position shown in FIG. 3C to, for example, the same height position above, as shown in FIG. The back side surface of the substrate 20 is separated from the base surface 4 of the transport base 3.

そして、各吸着離脱部材6を回転軸部63を中心として、同一方向(例えば図中時計回り方向)へ回転させる。
これにより、基板20の裏側面が各吸着離脱部材6の吸着領域61の表面に接触しながら吸着離脱部材6の回転方向側に水平移動する。
And each adsorption | suction separation member 6 is rotated to the same direction (for example, clockwise direction in a figure) centering on the rotating shaft part 63. As shown in FIG.
As a result, the back side surface of the substrate 20 moves horizontally to the rotation direction side of the adsorption / desorption member 6 while contacting the surface of the adsorption region 61 of each adsorption / desorption member 6.

この場合、各吸着離脱部材6の吸着領域61の表面は曲面(凸面)状に形成されているため、吸着領域61の表面と基板20の裏側面との吸着部分のうち基板移動方向先端部側の吸着部分が吸着離脱部材6の回転開始によって剥離した後、基板20は、吸着離脱部材6の回転に伴い曲面状の吸着領域61の表面をあたかも転がるように移動するため、この回転動作の際に吸着離脱部材6の吸着領域61の表面から基板20の裏側面に対して与えられる剪断力は、基板20の裏側面に吸着させた平面状の吸着面を基板20の裏側面に対して直交する方向に剥離する場合と比べて非常に小さい。   In this case, since the surface of the suction region 61 of each suction / detachment member 6 is formed in a curved surface (convex surface), the front end side in the substrate movement direction of the suction portion between the surface of the suction region 61 and the back side surface of the substrate 20. The substrate 20 moves as if it rolls on the surface of the curved suction region 61 as the suction / removal member 6 rotates after the suction portion of the suction / removal member 6 starts to rotate. The shearing force applied to the back side surface of the substrate 20 from the surface of the suction region 61 of the suction / detachment member 6 is perpendicular to the back side surface of the substrate 20 with the planar suction surface adsorbed on the back side surface of the substrate 20. It is very small compared with the case where it peels in the direction.

さらに、各吸着離脱部材6の回転により、基板20の裏側面と各吸着離脱部材6の吸着領域61の表面との接触部分が、吸着領域61から隣接する非吸着領域62に向って移動するから、基板20の裏側面と各吸着離脱部材6の表面との接触部分が吸着領域61の表面から非吸着領域62の表面に移行した時点(図4(b)参照)で、各吸着離脱部材6の回転を停止する(非吸着位置)。
この状態では、基板20の裏側面は各吸着離脱部材6の非吸着領域62に接触しているため、基板20と各吸着離脱部材6との間の粘着力が消滅している(又は殆どなくなる)。
Further, the rotation of each adsorption / desorption member 6 causes the contact portion between the back side surface of the substrate 20 and the surface of the adsorption region 61 of each adsorption / desorption member 6 to move from the adsorption region 61 toward the adjacent non-adsorption region 62. When the contact portion between the back side surface of the substrate 20 and the surface of each adsorption / desorption member 6 moves from the surface of the adsorption region 61 to the surface of the non-adsorption region 62 (see FIG. 4B), each adsorption / desorption member 6. Stops rotating (non-adsorption position).
In this state, since the back side surface of the substrate 20 is in contact with the non-adsorption region 62 of each adsorption / desorption member 6, the adhesive force between the substrate 20 and each adsorption / desorption member 6 has disappeared (or almost disappeared). ).

その後、図4(c)に示すように、搬送台座3の各孔部3aを介してリフトピン21を上昇させ、基板20を持ち上げて各吸着離脱部材6から離間させる。
さらに、図示しない搬送ロボットを用い、図4(d)に示すように、基板20をリフトピン上から移動して退避させ、例えば真空槽2から搬出させる。
Thereafter, as shown in FIG. 4C, the lift pins 21 are raised through the holes 3 a of the transport base 3, and the substrate 20 is lifted and separated from the suction / detachment members 6.
Further, using a transfer robot (not shown), as shown in FIG. 4D, the substrate 20 is moved away from the lift pins and retracted, for example, from the vacuum chamber 2.

以上述べた本実施の形態によれば、吸着離脱部材6の吸着領域61の表面に吸着された基板20を吸着離脱部材6から離脱させる際、吸着離脱部材6の吸着領域61の表面から基板20の裏側面に対して与えられる剪断力は、基板20の裏側面に吸着させた平面状の吸着面を基板20の裏側面に対して直交する方向に剥離する場合と比べて非常に小さく、かつ、基板20の裏側面と各吸着離脱部材6の表面との接触部分が非吸着領域62の表面に移行した状態では、基板20と各吸着離脱部材6との間の粘着力が消滅している(又は殆どない)ため、基板20を搬送台座3から離脱させる際に吸着離脱部材6から基板20に対する局所的な応力集中は発生せず、その結果、基板20の破損を防止することができる。
また、これにより、基板20を搬送台座3から離脱させる際の摩擦力も従来技術と比べて非常に小さく静電気が殆ど発生しないことから、基板20上のデバイス部分に対して悪影響を及ぼすことがない。
According to the present embodiment described above, when the substrate 20 adsorbed on the surface of the adsorption region 61 of the adsorption / desorption member 6 is desorbed from the adsorption / desorption member 6, the substrate 20 is removed from the surface of the adsorption region 61 of the adsorption / desorption member 6. The shearing force applied to the back side surface of the substrate 20 is very small compared to the case where the planar suction surface adsorbed on the back side surface of the substrate 20 is peeled in a direction perpendicular to the back side surface of the substrate 20, and In a state where the contact portion between the back side surface of the substrate 20 and the surface of each adsorption / desorption member 6 has moved to the surface of the non-adsorption region 62, the adhesive force between the substrate 20 and each adsorption / desorption member 6 disappears. Therefore, when the substrate 20 is detached from the transport pedestal 3, local stress concentration from the adsorption / desorption member 6 to the substrate 20 does not occur, and as a result, the substrate 20 can be prevented from being damaged.
In addition, since the friction force when the substrate 20 is detached from the transport base 3 is very small as compared with the prior art, almost no static electricity is generated, and the device portion on the substrate 20 is not adversely affected.

図5(a)〜(c)及び図6(a)〜(c)は、本発明に用いる吸着離脱部材の他の例を示す側面図であり、以下上記実施の形態と対応する部分には同一の符号を付してその詳細な説明を省略する。
図5(a)〜(c)に示すように、本例の吸着離脱部材6Aは、断面形状を上記実施の形態と同一の真円形状とし、回転軸部63を円柱の回転中心軸線Oから偏芯させて設けたものである。
5 (a) to 5 (c) and FIGS. 6 (a) to 6 (c) are side views showing other examples of the adsorption / desorption member used in the present invention. The same reference numerals are assigned and detailed description thereof is omitted.
As shown in FIGS. 5A to 5C, the adsorption / desorption member 6A of the present example has a cross-sectional shape that is the same as that of the above-described embodiment, and the rotation shaft portion 63 extends from the rotation center axis O of the cylinder. It is provided eccentrically.

このような構成を有する本例においては、吸着離脱部材6Aの回転に伴い、回転中心である回転軸部63と吸着離脱部材6Aの表面との距離が変化する。
そこで、本例では、例えば図5(a)に示すように、吸着離脱部材6Aの吸着領域61の表面の例えば中央部分と回転軸部63との距離が最も小さくなるように吸着領域61を配置するとともに、この吸着領域61に隣接して非吸着領域62を配置するように構成する。
In this example having such a configuration, the distance between the rotation shaft portion 63 that is the center of rotation and the surface of the adsorption / desorption member 6A changes as the adsorption / desorption member 6A rotates.
Therefore, in this example, as shown in FIG. 5A, for example, the suction region 61 is arranged so that the distance between, for example, the central portion of the surface of the suction region 61 of the suction / detachment member 6A and the rotation shaft portion 63 is the smallest. In addition, the non-adsorption region 62 is arranged adjacent to the adsorption region 61.

そして、吸着離脱部材6Aの吸着領域61の例えば中央部分の表面が搬送台座3の台座面4と面一(実際上は台座面4から若干上方の位置)となるように吸着位置を設定する。
この状態において、基板20を搬送台座3の台座面4上に配置し、基板20の裏側面を吸着離脱部材6Aの吸着領域61に接触させる。
Then, the suction position is set so that the surface of, for example, the central portion of the suction region 61 of the suction / removal member 6A is flush with the base surface 4 of the transport base 3 (actually a position slightly above the base surface 4).
In this state, the board | substrate 20 is arrange | positioned on the base surface 4 of the conveyance base 3, and the back side surface of the board | substrate 20 is made to contact the adsorption | suction area | region 61 of 6 A of adsorption | suction removal members.

そして、上述したように、例えば搬送台座3の下方から真空槽2内の真空排気を行うことにより、吸着離脱部材6Aの吸着領域61に対して基板20の裏側面を押し付け、基板20の裏側面を吸着離脱部材6Aの吸着領域61に粘着保持させる。   Then, as described above, the back side surface of the substrate 20 is pressed against the suction region 61 of the suction / detachment member 6 </ b> A, for example, by evacuating the vacuum chamber 2 from below the transport base 3. Is adhered and held in the suction region 61 of the suction / detachment member 6A.

一方、吸着離脱部材6Aから基板20の離脱を行う場合には、上述した駆動機構22を吸着離脱部材6Aの動力伝達機構64に連結し(図1(a)参照)、吸着離脱部材6Aを例えば図中時計回り方向へ回転させる。   On the other hand, when the substrate 20 is detached from the adsorption / desorption member 6A, the drive mechanism 22 described above is connected to the power transmission mechanism 64 of the adsorption / desorption member 6A (see FIG. 1A), and the adsorption / desorption member 6A is, for example, Rotate clockwise in the figure.

これにより、図5(b)に示すように、吸着離脱部材6Aの回転に伴い、その表面の頂部が搬送台座3の台座面4に対して離間する方向即ち上方に移動する。
これにより、基板20は、その裏側面が吸着離脱部材6Aの吸着領域61に接触しながら、吸着離脱部材6Aの回転方向に斜め上方に移動する。
そして、基板20の裏側面との接触部分が吸着離脱部材6Aの吸着領域61から非吸着領域62に移行した時点(図5(c)参照)で、吸着離脱部材6Aの回転を停止する(非吸着位置)。
As a result, as shown in FIG. 5B, the top of the surface moves away from the pedestal surface 4 of the transport pedestal 3, that is, upward, as the adsorption / desorption member 6 </ b> A rotates.
As a result, the substrate 20 moves obliquely upward in the rotation direction of the adsorption / desorption member 6A while its back side surface is in contact with the adsorption region 61 of the adsorption / desorption member 6A.
Then, when the contact portion with the back side surface of the substrate 20 shifts from the adsorption region 61 of the adsorption / desorption member 6A to the non-adsorption region 62 (see FIG. 5C), the rotation of the adsorption / desorption member 6A is stopped (non-existence). Adsorption position).

この状態では、基板20の裏側面は吸着離脱部材6Aの非吸着領域62に接触しており、基板20は吸着離脱部材6Aには吸着されていないから、図示しない搬送機構を用いて基板20を吸着離脱部材6Aから離脱させる。
その後、吸着離脱部材6Aを例えば反時計回り方向へ回転させることにより、図5(a)に示す吸着位置に戻すようにする。
In this state, the back side surface of the substrate 20 is in contact with the non-adsorption region 62 of the adsorption / desorption member 6A, and the substrate 20 is not adsorbed by the adsorption / desorption member 6A. It is made to detach | leave from the adsorption | suction separation member 6A.
Thereafter, the suction / removal member 6A is rotated counterclockwise, for example, to return to the suction position shown in FIG.

このような構成を有する本例によれば、上記実施の形態と同様の効果に加え、吸着離脱部材6Aを回転軸部63を中心として回転させるだけでその表面を上下方向に移動させ、また、基板20に対して吸着領域61と非吸着領域62との接触を切り換えることができるので、吸着離脱部材6Aを駆動させる機構をより簡素な構成にすることができる。   According to this example having such a configuration, in addition to the same effects as in the above embodiment, the surface of the adsorption / desorption member 6A is moved in the vertical direction only by rotating around the rotation shaft portion 63, and Since the contact between the adsorption region 61 and the non-adsorption region 62 can be switched with respect to the substrate 20, the mechanism for driving the adsorption / removal member 6A can be simplified.

一方、図6(a)〜(c)に示す吸着離脱部材6Bは、本体部の断面形状を長円(例えば楕円)形状に形成したものである。この場合、回転軸部63の回転中心は、長円の回転中心軸線Oに一致させている。
このような構成を有する本例においても、図5(a)〜(c)に示す例と同様に、吸着離脱部材6Bの回転に伴い、回転中心である回転軸部63と吸着離脱部材6Bの表面との距離が変化する。
On the other hand, the adsorption / desorption member 6B shown in FIGS. 6 (a) to 6 (c) has an oval (for example, elliptical) cross-sectional shape of the main body. In this case, the rotation center of the rotation shaft portion 63 is made to coincide with the ellipse rotation center axis O.
Also in this example having such a configuration, as in the example shown in FIGS. 5A to 5C, the rotation shaft 63 and the adsorption / desorption member 6 </ b> B, which are the rotation centers, are rotated along with the rotation of the adsorption / desorption member 6 </ b> B. The distance to the surface changes.

本例では、例えば図6(a)に示すように、吸着離脱部材6Bの吸着領域61の表面の例えば中央部分と回転軸部63との距離が最も小さくなるように吸着領域61を配置するとともに、この吸着領域61に隣接して非吸着領域62を配置するように構成する。
そして、吸着離脱部材6Bの吸着領域61の例えば中央部分の表面が搬送台座3の台座面4と面一(実際上は台座面4から若干上方の位置)となるように吸着位置を設定する。
In this example, for example, as shown in FIG. 6A, the suction region 61 is arranged so that the distance between, for example, the central portion of the surface of the suction region 61 of the suction / detachment member 6B and the rotation shaft portion 63 is minimized. The non-adsorption region 62 is arranged adjacent to the adsorption region 61.
Then, the suction position is set so that the surface of, for example, the central portion of the suction region 61 of the suction / removal member 6B is flush with the base surface 4 of the transport base 3 (actually slightly above the base surface 4).

このような構成において、基板20を搬送台座3に保持する場合には、基板20を搬送台座3の台座面4上に配置し、基板20の裏側面を吸着離脱部材6Bの吸着領域61に接触させる。
そして、上述したように、例えば搬送台座3の下方から真空排気を行うことにより、吸着離脱部材6Bの吸着領域61に対して基板20の裏側面を押し付け、基板20の裏側面を吸着離脱部材6Bの吸着領域61に粘着保持させる。
In such a configuration, when the substrate 20 is held on the transport pedestal 3, the substrate 20 is disposed on the pedestal surface 4 of the transport pedestal 3, and the back side surface of the substrate 20 is in contact with the suction region 61 of the suction detachment member 6B. Let
Then, as described above, for example, by performing vacuum evacuation from below the transport base 3, the back side surface of the substrate 20 is pressed against the suction region 61 of the suction / removal member 6B, and the back side surface of the substrate 20 is pressed against the suction / removal member 6B. The adsorption area 61 is adhered and held.

一方、吸着離脱部材6Bから基板20の離脱を行う場合には、上述した駆動機構22を吸着離脱部材6Bの動力伝達機構64に連結し(図1(a)参照)、吸着離脱部材6Bを例えば図中時計回り方向へ回転させる。   On the other hand, when the substrate 20 is detached from the adsorption / desorption member 6B, the drive mechanism 22 described above is connected to the power transmission mechanism 64 of the adsorption / desorption member 6B (see FIG. 1A), and the adsorption / desorption member 6B is, for example, Rotate clockwise in the figure.

これにより、図6(b)に示すように、吸着離脱部材6Bの回転に伴い、その表面の頂部が搬送台座3の台座面4に対して離間する方向即ち上方に移動する。
これにより、基板20は、その裏側面が吸着離脱部材6Bの吸着領域61に接触しながら、吸着離脱部材6Bの回転方向に斜め上方に移動する。
そして、基板20の裏側面との接触部分が吸着離脱部材6Bの吸着領域61から非吸着領域62に移行した時点(図6(c)参照)で、吸着離脱部材6Bの回転を停止する(非吸着位置)。
As a result, as shown in FIG. 6B, the top of the surface moves away from the pedestal surface 4 of the transport pedestal 3, that is, upward, as the adsorption / desorption member 6 </ b> B rotates.
As a result, the substrate 20 moves obliquely upward in the rotation direction of the adsorption / desorption member 6B while its back side surface is in contact with the adsorption region 61 of the adsorption / desorption member 6B.
Then, when the contact portion with the back side surface of the substrate 20 shifts from the adsorption region 61 of the adsorption / desorption member 6B to the non-adsorption region 62 (see FIG. 6C), the rotation of the adsorption / desorption member 6B is stopped (non-extraction). Adsorption position).

この状態では、基板20の裏側面が吸着離脱部材6Bの非吸着領域62に接触しており、基板20は吸着離脱部材6Bには吸着されていないから、図示しない搬送機構を用いて基板20を吸着離脱部材6Bから離脱させる。
その後、吸着離脱部材6Bを例えば反時計回り方向へ回転させることにより、図6(a)に示す吸着位置に戻すようにする。
In this state, the back side surface of the substrate 20 is in contact with the non-adsorption region 62 of the adsorption / desorption member 6B, and the substrate 20 is not adsorbed by the adsorption / desorption member 6B. It is made to detach | leave from the adsorption | suction separation member 6B.
Thereafter, the suction / removal member 6B is rotated counterclockwise, for example, to return to the suction position shown in FIG.

このような構成を有する本例によれば、上記実施の形態と同様の効果に加え、吸着離脱部材6Bを回転軸部63を中心として回転させるだけで、吸着離脱部材6Bの表面を上下方向に移動させ、また、基板20に対して吸着領域61と非吸着領域62との接触を切り換えることができるので、吸着離脱部材6Bを駆動させる機構をより簡素な構成にすることができる。   According to this example having such a configuration, in addition to the same effects as those of the above embodiment, the surface of the adsorption / desorption member 6B can be moved in the vertical direction only by rotating the adsorption / desorption member 6B around the rotation shaft 63. Further, since the contact between the adsorption region 61 and the non-adsorption region 62 can be switched with respect to the substrate 20, the mechanism for driving the adsorption / desorption member 6B can be made simpler.

なお、本発明は上述の実施の形態に限られることなく、種々の変更を行うことができる。
例えば、上記実施の形態では、吸着離脱部材の断面形状を真円又は長円形状としたが、本発明はこれに限られず、吸着離脱部材の表面が曲面状に形成された曲面領域を有していればよく、例えば断面形状が半円形状のものや、球状の吸着離脱部材を用いることもできる。
The present invention is not limited to the above-described embodiment, and various changes can be made.
For example, in the above-described embodiment, the cross-sectional shape of the adsorption / desorption member is a perfect circle or an ellipse, but the present invention is not limited to this, and has a curved region in which the surface of the adsorption / desorption member is formed in a curved shape. For example, a semicircular cross-sectional shape or a spherical adsorption / desorption member may be used.

また、図5(a)〜(c)に示す例と、図6(a)〜(c)に示す例を組み合わせることもできる。すなわち、吸着離脱部材の断面形状を長円形状とし、回転軸部を長円の回転中心軸から偏芯させて設けることもできる。
また、吸着離脱部材の数、並びに、吸着離脱部材に設ける吸着領域と非吸着領域の数や形状は上記実施の形態のものは限られず、基板の大きさや形状に応じて適宜変更することができる。
Moreover, the example shown to Fig.5 (a)-(c) and the example shown to Fig.6 (a)-(c) can also be combined. That is, the cross-sectional shape of the adsorption / desorption member may be an oval shape, and the rotation shaft portion may be provided eccentric from the oval rotation center axis.
Further, the number of adsorption / desorption members, and the number and shape of adsorption regions and non-adsorption regions provided in the adsorption / desorption member are not limited to those in the above-described embodiment, and can be appropriately changed according to the size and shape of the substrate. .

さらに、本発明は、真空中のみならず、大気中やガス中においても使用することができる。
この場合、基板を吸着離脱部材の吸着領域に押し付けるには、機械的な押圧機構を用いるとよい。
Furthermore, the present invention can be used not only in a vacuum, but also in the atmosphere and gas.
In this case, a mechanical pressing mechanism may be used to press the substrate against the suction area of the suction / removal member.

1…基板吸着離脱機構
2…真空槽
3…搬送台座
4…台座面
5…動作開口部
6…吸着離脱部材
20…基板
21…リフトピン
22…駆動機構
50…収容部
61…吸着領域
62…非吸着領域
63…回転軸部
64…動力伝達機構
DESCRIPTION OF SYMBOLS 1 ... Substrate adsorption | suction removal mechanism 2 ... Vacuum tank 3 ... Conveyance base 4 ... Base surface 5 ... Operation | movement opening part 6 ... Adsorption / detachment member 20 ... Substrate 21 ... Lift pin 22 ... Drive mechanism 50 ... Storage part 61 ... Adsorption area | region 62 ... Non-adsorption Area 63 ... Rotating shaft 64 ... Power transmission mechanism

Claims (6)

基板を台座面上に配置して搬送する搬送台座と、
前記搬送台座に設けられ、基板の吸着及び離脱を行う吸着離脱部材とを有し、
前記吸着離脱部材は、表面が曲面状に形成された曲面領域を有し、当該曲面領域に、吸着領域と非吸着領域とが隣接して設けられるとともに、前記吸着領域の表面が前記台座面に対して面一の位置となる吸着位置と、前記非吸着領域の表面が前記台座面から離間した位置となる非吸着位置とに配置されるように、前記吸着離脱部材が前記曲面領域の湾曲方向に回転可能に構成されている基板吸着離脱機構。
A transport pedestal for placing and transporting the substrate on the pedestal surface;
An adsorption / detachment member that is provided on the transfer pedestal and that adsorbs and detaches the substrate;
The adsorption / detachment member has a curved surface area having a curved surface, and the adsorption area and the non-adsorption area are provided adjacent to the curved area, and the surface of the adsorption area is on the pedestal surface. The suction / removal member is curved in the curved region so that the suction position is flush with the non-suction position where the surface of the non-suction region is spaced from the pedestal surface. A substrate adsorption / desorption mechanism configured to be rotatable.
前記搬送台座の台座面に複数の開口部が設けられ、各開口部の内側に、前記吸着離脱部材がそれぞれ設けられている請求項1記載の基板吸着離脱機構。   The substrate adsorption / desorption mechanism according to claim 1, wherein a plurality of openings are provided on a pedestal surface of the transfer pedestal, and the adsorption / desorption member is provided inside each opening. 前記吸着離脱部材は、断面が真円形状に形成され、当該吸着離脱部材が前記搬送台座の台座面に対して交差する方向に移動するように構成されている請求項1又は2のいずれか1項記載の基板吸着離脱機構。   The said adsorption | suction separation member is formed so that a cross section may be formed in a perfect circle shape, and the said adsorption | suction separation member may be moved in the direction which cross | intersects the base surface of the said conveyance base. 4. A substrate adsorption / desorption mechanism according to the item. 前記吸着離脱部材は、断面が真円形状に形成され、当該真円の回転中心軸から偏芯させて設けた回転軸部を中心として回転するように構成されている請求項1乃至3のいずれか1項記載の基板吸着離脱機構。   4. The adsorption / detachment member according to claim 1, wherein the adsorption / detachment member is formed in a perfect circle shape and is configured to rotate around a rotation shaft portion that is eccentric from a rotation center axis of the perfect circle. A substrate adsorption / desorption mechanism according to claim 1. 前記吸着離脱部材は、断面が長円形状に形成され、当該長円の回転中心軸の位置に設けた回転軸部を中心として回転するように構成されている請求項1乃至3のいずれか1項記載の基板吸着離脱機構。   The adsorption / detachment member has an elliptical cross section, and is configured to rotate around a rotation shaft provided at a position of a rotation center axis of the ellipse. 4. A substrate adsorption / desorption mechanism according to the item. 真空槽と、
前記真空槽内に配置され、請求項1乃至5のいずれか1項記載の基板吸着離脱機構とを有し、
前記真空槽内に設けられた駆動機構によって前記吸着離脱部材を動作させるように構成されている真空装置。
A vacuum chamber;
The substrate adsorption / desorption mechanism according to any one of claims 1 to 5, which is disposed in the vacuum chamber,
The vacuum apparatus comprised so that the said adsorption | suction separation member may be operated with the drive mechanism provided in the said vacuum chamber.
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05275893A (en) * 1992-03-26 1993-10-22 Reyoon Kogyo:Kk Holding device and transport and fixing devices with it built-in
JP2001274225A (en) * 2000-03-24 2001-10-05 Tokyo Electron Ltd Treatment apparatus
JP2003273508A (en) * 2002-03-14 2003-09-26 Hitachi Industries Co Ltd Assembly method for board and its device
JP2012023104A (en) * 2010-07-12 2012-02-02 Olympus Corp Substrate-setting device
JP2013055093A (en) * 2011-09-01 2013-03-21 Creative Technology:Kk Adhesive chuck device and adhesion holding method of work-piece

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05275893A (en) * 1992-03-26 1993-10-22 Reyoon Kogyo:Kk Holding device and transport and fixing devices with it built-in
JP2001274225A (en) * 2000-03-24 2001-10-05 Tokyo Electron Ltd Treatment apparatus
JP2003273508A (en) * 2002-03-14 2003-09-26 Hitachi Industries Co Ltd Assembly method for board and its device
JP2012023104A (en) * 2010-07-12 2012-02-02 Olympus Corp Substrate-setting device
JP2013055093A (en) * 2011-09-01 2013-03-21 Creative Technology:Kk Adhesive chuck device and adhesion holding method of work-piece

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