JP2015149408A - Collective printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a collective printed wiring board in which a warp, caused by the heat during component mounting, can be reduced even in a case of thin printed wiring board.SOLUTION: A collective printed wiring board 100 includes a plurality of individual printed wiring boards 1, a dummy board 2 arranged to surround the plurality of individual printed wiring boards 1 in a plan view, and a plurality of coupling portions 3, each coupling the adjoining individual printed wiring boards 1 or an adjoining individual printed wiring board 1 and the dummy board 2. In the first side 21 on the outer periphery of the dummy board 2, a first notch 5 for opening a part of the first side 21 is formed. In the second side 22 on the outer periphery of the dummy board 2 facing the first side 21, a second notch 6 for opening a part of the second side 22 is formed.

Description

  The present invention relates to an aggregate printed wiring board including a plurality of individual printed wiring boards.

  Conventionally, as shown in FIG. 3, an aggregate printed wiring board 100x including a plurality of individual printed wiring boards 1x arranged in a matrix is known. The collective printed wiring board 100x is a rectangular discarded board portion 2x arranged so as to surround the plurality of individual printed wiring boards 1x in a plan view, and the individual printed wiring boards 1x adjacent to each other, or the adjacent individual prints. And a plurality of connecting portions 4 for connecting the wiring board 1x and the discarding plate portion 2x. The discard board portion 2x is provided for the purpose of improving the strength of the collective printed wiring board 100x and improving the reliability during component mounting or transportation.

  In such a collective printed wiring board 100x, components can be soldered together on a plurality of individual printed wiring boards 1x by reflow, so that the work efficiency of component mounting can be improved. Then, after mounting the components, the connecting portion 4 is cut to divide the plurality of individual printed wiring boards 1x one by one.

  As such a collective printed wiring board, for example, the one described in Patent Document 1 is also known.

Japanese Patent Application Laid-Open No. 2000-228566

  For the purpose of reducing the thickness of products, it is required to reduce the thickness of the aggregate printed wiring board 100x. However, when the above-described conventional collective printed wiring board 100x is thin, it is warped by heat applied during reflow after components are mounted on one surface by reflow. In the case of the assembly printed wiring board 100x warped, it is difficult to perform solder printing on the other surface when components are mounted on both surfaces, and the reliability is insufficient even when the components are mounted only on one surface. Further, it is difficult to divide the individual printed wiring board 1x by the automatic divider. Furthermore, when the warp of the collective printed wiring board 100x is corrected by applying a force, the mounted components fall off, or excessive stress is applied to the solder portion, resulting in a reduction in product quality. As described above, in the conventional collective printed wiring board 100x, when the thickness is small, warpage occurs due to heat at the time of component mounting, and thus the thickness cannot be reduced.

  Therefore, an object of the present invention is to provide a collective printed wiring board that can reduce warpage due to heat during component mounting even when the thickness is small.

A first collective printed wiring board according to an aspect of the present invention includes:
A plurality of individual printed wiring boards;
A discarded board portion disposed so as to surround the plurality of individual printed wiring boards in a plan view;
The individual printed wiring boards that are adjacent to each other, or a plurality of connecting portions that connect the individual printed wiring boards adjacent to each other and the discarding plate portion,
A first notch that opens a part of the first side is formed on the first side of the outer periphery of the discard plate part,
A second notch that opens a part of the second side is formed on the second side of the outer periphery of the discard plate portion facing the first side.

In the first collective printed wiring board,
A third cutout portion is formed in the discard plate portion at a distance from the first cutout portion in the direction of the second side, and the direction from the second cutout portion to the first side is formed. A fourth cutout portion may be formed at the interval.

In the first collective printed wiring board,
The interval may be equal to or less than the width of the connecting portion.

In the first collective printed wiring board,
The first side and the second side are parallel;
The first and third cutout portions are formed to extend in a direction perpendicular to the first side,
The second and fourth cutouts may be formed extending in a direction perpendicular to the second side.

In the first collective printed wiring board,
A support portion coupled to the discard plate portion so as to divide the region surrounded by the discard plate portion into a plurality of regions;
Each of the individual printed wiring boards may be provided in any of the areas partitioned by the discard board part and the support part.

In the first collective printed wiring board,
The support portion may have a cross shape.

In the first collective printed wiring board,
The direction perpendicular to the first side may be a direction conveyed by a reflow apparatus during reflow.

The second collective printed wiring board according to another aspect of the present invention,
A plurality of individual printed wiring boards;
Two discarded plate portions arranged so as to sandwich the plurality of individual printed wiring boards in a first direction in plan view;
The individual printed wiring boards that are adjacent to each other, or a plurality of connecting portions that connect the individual printed wiring boards adjacent to each other and the discarding plate portion,
Of the sides parallel to the first direction of the individual printed wiring boards located at both ends of the second direction orthogonal to the first direction, the sides that are not adjacent to the other individual printed wiring boards are: It is exposed.

In the second collective printed wiring board,
A support portion provided between the two discard plate portions and connecting the two discard plate portions;
Each of the individual printed wiring boards may be provided in any of the areas partitioned by the two discard board portions and the support portion.

In the second collective printed wiring board,
The second direction may be a direction conveyed by a reflow device during reflow.

In the second collective printed wiring board,
The support portion may have a cross shape.

In the first or second set printed wiring board,
Patterns for mounting components may be provided on both surfaces of the plurality of individual printed wiring boards.

  According to the present invention, the first notch that opens a part of the first side is formed on the first side of the outer periphery of the discarding plate part, and the second side facing the first side of the outer periphery of the discarding plate unit In addition, since the second notch that opens a part of the second side is formed, the stress generated by the heat applied at the time of component mounting is effectively reduced in the first and second notches. To be released. Therefore, even when the thickness is small, it is possible to reduce warping due to heat during component mounting.

1 is a plan view of a collective printed wiring board according to a first embodiment of the present invention. It is a top view of the collective printed wiring board which concerns on the 2nd Embodiment of this invention. It is a top view of the conventional collective printed wiring board.

  Embodiments of the present invention will be described below with reference to the drawings. These embodiments do not limit the present invention.

  As used herein, the shape and geometric conditions and the degree thereof are specified, for example, terms such as “parallel”, “vertical”, “same”, etc., without being bound to a strict meaning, Interpretation should include the extent to which similar functions can be expected.

(First embodiment)
FIG. 1 is a plan view of a collective printed wiring board 100 according to the first embodiment of the present invention. As shown in FIG. 1, a collective printed wiring board 100 includes a plurality of individual printed wiring boards 1 arranged in a matrix and a discarded board arranged so as to surround the plurality of individual printed wiring boards 1 in a plan view. A portion 2, a support portion 3, and a plurality of connecting portions 4 are provided.

  Each individual printed wiring board 1 has the same structure. The external shape of each individual printed wiring board 1 is rectangular in plan view, but is not limited thereto. Although a pattern for mounting components is provided on both surfaces of the plurality of individual printed wiring boards 1, the pattern is not shown in FIG. 1 for clarity of explanation.

  The outer shape of the discard plate portion 2, that is, the outer shape of the collective printed wiring board 100 is rectangular in plan view. A first cutout portion 5 that opens a part of the first side 21 is formed on the first side 21 on the outer periphery of the discard plate portion 2. In the illustrated example, four first cutout portions 5 are provided along the first side 21.

A second notch 6 that opens a part of the second side 22 is formed on the second side 22 facing the first side 21 on the outer periphery of the discard plate part 2. In the illustrated example, four second cutout portions 6 are provided along the second side 22.
The first side 21 and the second side 22 of the discard plate part 2 are parallel.

  Further, the third notch portion 7 is formed in the discard plate portion 2 with a gap d1 from the first notch portion 5 to the second side 22. The first and third cutout portions 5 and 7 are formed to extend in a direction perpendicular to the first side 21.

  Further, a fourth cutout portion 8 is formed in the discard plate portion 2 with a gap d1 from the second cutout portion 6 in the direction of the first side 21. The second and fourth cutout portions 6 and 8 are formed to extend in a direction perpendicular to the second side 22.

  The first and third cutout portions 5 and 7 are formed so as to have a symmetrical positional relationship with the second and fourth cutout portions 6 and 8. The widths of the first to fourth cutout portions 5 to 8 in the direction parallel to the first side 21 may be equal to each other or different from each other.

  The support portion 3 is connected to the discard plate portion 2 so as to partition the region surrounded by the discard plate portion 2 into a plurality of regions 9. In the illustrated example, the support portion 3 has a cross shape, and the support portion 3 divides a region surrounded by the discard plate portion 2 into four rectangular regions 9.

  Each individual printed wiring board 1 is provided in any one of the regions 9 partitioned by the discard board portion 2 and the support portion 3. In the example shown in the figure, six individual printed wiring boards 1 are arranged in a matrix in each region 9.

  The plurality of connecting portions 4 connect the individual printed wiring boards 1 adjacent to each other, the adjacent individual printed wiring boards 1 and the discarding plate portions 2, or the adjacent individual printed wiring boards 1 and the support portions 3. In the illustrated example, one connecting portion 4 is connected to each side of the individual printed wiring board 1. Thereby, the slit 10 is formed so that each individual printed wiring board 1 may be enclosed in parts other than the connection part 4. FIG. The third and fourth cutout portions 7 and 8 are each connected to the closest slit 10.

  The aforementioned distance d1 may be equal to or smaller than the width w1 of the connecting portion 4 and may be larger than the width w1 of the connecting portion 4. The width w1 may be different for each connecting portion 4, but in this case, the interval d1 may be equal to or smaller than the width w1 of the narrowest connecting portion 4 and is larger than the width W1 of the widest connecting portion 4. Also good.

  In such a collective printed wiring board 100, components can be soldered together on a plurality of individual printed wiring boards 1 by reflow. Here, the direction perpendicular to the first side 21 or the direction perpendicular to the second side 22 is a direction in which the collective printed wiring board 100 is conveyed by the reflow apparatus during reflow. Then, after mounting the components, the individual printed wiring board 1 is divided one by one by cutting the connecting portion 4.

  Thus, according to the present embodiment, the first cutout portion 5 that opens a part of the first side 21 is formed on the first side 21 on the outer periphery of the discard plate portion 2. A second notch 6 that opens a part of the second side 22 is formed on the second side 22 on the outer periphery. Thereby, when the collective printed wiring board 100 expands due to heat applied during component mounting (reflow), the first and second cutout portions 5 and 6 are contracted, so that stress is easily concentrated. The expansion of the part 2 can be absorbed. That is, the stress generated by heat is effectively released by the first and second cutout portions 5 and 6. That is, the stress can escape at the first and second cutout portions 5 and 6.

  Therefore, even when the aggregate printed wiring board 100 is thin, it is possible to reduce warpage due to heat during component mounting.

  In addition, the stress generated by heat is released by the third and fourth cutout portions 7 and 8. Therefore, warpage can be further reduced.

  When the distance d1 is equal to or less than the width w1 of the connecting portion 4, the first to fourth cutout portions 5 to 8 are perpendicular to the first side 21 while maintaining the strength of the collective printed wiring board 100. Can be greatly formed in any direction. Therefore, since the stress is more easily released at the first to fourth cutout portions 5 to 8, the warpage can be further prevented.

  Furthermore, since the support part 3 is provided, the strength of the collective printed wiring board 100 can be improved, and the reliability at the time of component mounting or transportation can be improved.

  The direction perpendicular to the first side 21 or the direction perpendicular to the second side 22 is a direction in which the aggregate printed wiring board 100 is conveyed by the reflow apparatus during reflow. That is, the 1st and 2nd notch parts 5 and 6 are not provided in the edge | side parallel to the conveyance direction of the outer periphery of the discard board part 2. As shown in FIG. Therefore, when the substrate transport conveyor of the reflow apparatus has a structure in which the aggregate printed wiring board 100 is supported and transported from both sides by a plurality of pins (claws) facing each other, these pins are notched in the first and second notches. There is no fear of meshing with the parts 5 and 6. Accordingly, when the pins engage with the first and second cutout portions 5 and 6 during reflow, the collective printed wiring board 100 is tilted, or the pins of the board transfer conveyor are moved to the first and second cutout portions 5 and 6. There is no fear that it will not come off. That is, the reliability at the time of component mounting can be improved.

In addition, curvature can be reduced more, so that there are many 1st to 4th notch parts 5-8.
Moreover, if the reduction amount of curvature is sufficient, the 3rd and 4th notch parts 7 and 8 do not need to be provided.

Further, the shape of the support portion 3 is not limited to the cross shape described above, and may be any shape. For example, a rectangle may be used. If the strength of the collective printed wiring board 100 is sufficient, the support part 3 may not be provided. Even in these cases, warpage due to heat at the time of component mounting can be reduced.
Furthermore, a pattern for mounting components may be provided only on one side of the plurality of individual printed wiring boards 1.

(Second Embodiment)
FIG. 2 is a plan view of the collective printed wiring board 100a according to the second embodiment of the present invention. As shown in FIG. 2, the collective printed wiring board 100a sandwiches the plurality of individual printed wiring boards 1 arranged in a matrix and the plurality of individual printed wiring boards 1 in a plan view in the y direction (first direction). The two discarded plate portions 2a, the support portion 3, and the plurality of connecting portions 4 are provided.

Since the plurality of individual printed wiring boards 1 are the same as those in the first embodiment, description thereof is omitted.
Of the sides parallel to the y direction of each individual printed wiring board 1 located at both ends in the x direction (second direction) orthogonal to the y direction, the side 11 that is not adjacent to the other individual printed wiring board 1 is exposed. doing. That is, the discarding board portions 2a are not provided at both ends in the x direction of the collective printed wiring board 100a.

  The support portion 3 is provided between the two discard plate portions 2a and connects the two discard plate portions 2a. Similar to the first embodiment, in the illustrated example, the support portion 3 has a cross shape. Each individual printed wiring board 1 is provided in any one of the areas 9 a defined by the two discard board portions 2 a and the support portion 3. Similar to the first embodiment, in the illustrated example, six individual printed wiring boards 1 are provided in a matrix in each region 9a.

  The plurality of connecting portions 4 connect the individual printed wiring boards 1 adjacent to each other, or the adjacent individual printed wiring boards 1 and the discarding plate portions 2a, or the adjacent individual printed wiring boards 1 and the support portions 3 to each other. In the illustrated example, one connecting portion 4 is connected to each side except the side 11 of the individual printed wiring board 1. Thereby, the slit 10 is formed so that each individual printed wiring board 1 may be enclosed in parts other than the connection part 4 and the edge | side 11. FIG.

  Thus, according to the present embodiment, the discard plate portions 2a are not provided at both ends in the x direction of the collective printed wiring board 100a. As a result, the stress generated by the heat applied during component mounting (during reflow) is effectively released at both ends of the collective printed wiring board 100 in the x direction. That is, the stress can escape to both ends of the collective printed wiring board 100 in the x direction.

  Therefore, even when the aggregate printed wiring board 100a is thin, warpage due to heat at the time of component mounting can be reduced.

  Further, the number of the individual printed wiring boards 1 can be increased under the condition that the area of the collective printed wiring board 100a is the same as the area of the collective printed wiring board 100 of the first embodiment.

  Moreover, since the support part 3 is provided, the strength of the collective printed wiring board 100a can be improved, and the reliability at the time of component mounting or transportation can be improved.

  Further, the x direction is a direction in which the collective printed wiring board 100a is conveyed by the reflow apparatus during reflow. Therefore, when the substrate transport conveyor of the reflow apparatus has a structure in which the collective printed wiring board 100a is supported and transported from both sides by a plurality of pins (claws) facing each other at a distance, these individual printed wirings adjacent to each other There is no fear of meshing with the slits 10 between the plates 1. Therefore, there is no possibility that the collective printed wiring board 100a is tilted or the pins cannot be detached from the slit 10 during reflow. That is, the reliability at the time of component mounting can be improved.

Note that the shape of the support portion 3 is not limited to the cross shape described above, and may be any shape. For example, a rectangle may be used. If the strength of the aggregate printed wiring board 100a is sufficient, the support part 3 may not be provided. Even in these cases, warpage due to heat at the time of component mounting can be reduced.
Moreover, the pattern for mounting components may be provided only on one side of the plurality of individual printed wiring boards 1.

  The aspect of the present invention is not limited to the individual embodiments described above, and includes various modifications that can be conceived by those skilled in the art, and the effects of the present invention are not limited to the contents described above. That is, various additions, modifications, and partial deletions can be made without departing from the concept and spirit of the present invention derived from the contents defined in the claims and equivalents thereof.

DESCRIPTION OF SYMBOLS 1 Individual printed wiring board 2 and 2a Discarding board part 3 Support part 4 Connection part 5 1st notch part 6 2nd notch part 7 3rd notch part 8 4th notch part 9 and 9a Area | region 10 Slit 11 Side 21 not adjacent to another individual printed wiring board First side 22 Second side 100, 100a Collected printed wiring board

Claims (12)

A plurality of individual printed wiring boards;
A discarded board portion disposed so as to surround the plurality of individual printed wiring boards in a plan view;
The individual printed wiring boards that are adjacent to each other, or a plurality of connecting portions that connect the individual printed wiring boards adjacent to each other and the discarding plate portion,
A first notch that opens a part of the first side is formed on the first side of the outer periphery of the discard plate part,
2. A printed circuit board as set forth in claim 1, wherein a second notch that opens a part of the second side is formed on a second side of the outer periphery of the discard plate that faces the first side.   A third cutout portion is formed in the discard plate portion at a distance from the first cutout portion in the direction of the second side, and the direction from the second cutout portion to the first side is formed. The assembled printed wiring board according to claim 1, wherein a fourth cutout portion is formed at a distance from each other. The first side and the second side are parallel;
The first and third cutout portions are formed to extend in a direction perpendicular to the first side,
The collective printed wiring board according to claim 2, wherein the second and fourth cutout portions are formed to extend in a direction perpendicular to the second side. A support portion coupled to the discard plate portion so as to divide the region surrounded by the discard plate portion into a plurality of regions;
The collective print according to any one of claims 1 to 3, wherein each of the individual printed wiring boards is provided in any of the areas partitioned by the discarding plate portion and the support portion. Wiring board.   The collective printed wiring board according to claim 4, wherein the support portion has a cross shape.   The collective printed wiring board according to claim 1, wherein the direction perpendicular to the first side is a direction conveyed by a reflow apparatus during reflow.   The collective printed wiring board according to claim 1, wherein the interval is equal to or less than a width of the connecting portion. A plurality of individual printed wiring boards;
Two discarded plate portions arranged so as to sandwich the plurality of individual printed wiring boards in a first direction in plan view;
The individual printed wiring boards that are adjacent to each other, or a plurality of connecting portions that connect the individual printed wiring boards adjacent to each other and the discarding plate portion,
Of the sides parallel to the first direction of the individual printed wiring boards located at both ends of the second direction orthogonal to the first direction, the sides that are not adjacent to the other individual printed wiring boards are: An aggregate printed wiring board characterized by being exposed. A support portion provided between the two discard plate portions and connecting the two discard plate portions;
9. The collective printed wiring board according to claim 8, wherein each of the individual printed wiring boards is provided in any one of the regions partitioned by the two discarded board portions and the support portion.   The collective printed wiring board according to claim 9, wherein the support portion has a cross shape.   The collective printed wiring board according to any one of claims 8 to 10, wherein the second direction is a direction conveyed by a reflow apparatus during reflow. The collective printed wiring board according to claim 1, wherein a pattern for mounting a component is provided on both surfaces of the plurality of individual printed wiring boards.

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