JP2015138962A - Process liquid nozzle and application processing unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a process liquid nozzle which removes foreign objects in a process liquid to inhibit clogging of the process liquid nozzle and thereby properly supplies the process liquid from the process liquid nozzle to a substrate.SOLUTION: A process liquid nozzle 132 includes: an upper block 200; a lower block 201; a solvent circulation space 202 formed in an inner space of the upper block 200 and the lower block 201; a solvent flow passage 245 which connects a solvent discharge port 244 with the circulation space 202; a filter 260 which is provided at an upper part of the flow passage 245, collects foreign objects in the solvent, and removes the foreign objects; and a fixing member 261 which fixes the filter 260 in a vertical direction. The fixing member 261 includes: a body part 262 which fixes the filter 260 with a lower surface; and a protrusion part 264 which protrudes from an upper surface of the body part 262 and contacts with a ceiling surface 211 of the circulation space 202.

Description

  The present invention relates to a processing liquid nozzle that supplies a processing liquid to a substrate, and a coating processing apparatus including the processing liquid nozzle.

  In recent years, for example, in semiconductor device manufacturing processes, semiconductor wafers (hereinafter referred to as “wafers”) have been increasing in diameter. Further, in a specific process such as mounting, wafer thinning is required. For example, if a thin wafer having a large diameter is transported or polished as it is, the wafer may be warped or cracked. For this reason, for example, in order to reinforce the wafer, the wafer is attached to, for example, a wafer that is a support substrate or a glass substrate.

  Such bonding of the wafer and the support substrate is performed by interposing an adhesive between the wafer and the support substrate using, for example, a bonding system described in Patent Document 1. The bonding system includes, for example, a coating device that applies an adhesive to a wafer, a heat treatment device that heats the wafer to which the adhesive is applied, and a bonding device that presses and bonds the wafer and the support substrate via the adhesive. Have.

  In the bonding apparatus, when the wafer and the support substrate are pressed, the adhesive protrudes from between the wafer and the support substrate. The adhesive that protrudes in this way may adversely affect the transfer process and processing process of the wafer and the support substrate. For example, when an adhesive adheres to a transport device that transports a wafer and a support substrate in the transport process, the adhesive adheres to another wafer or support substrate. Further, in the processing step, an adhesive may adhere to a processing apparatus that performs a predetermined processing on the wafer and the support substrate. In such a case, the wafer and the support substrate cannot be bonded appropriately. Therefore, it has been proposed to remove the adhesive on the outer peripheral portion of the wafer by supplying the solvent of the adhesive from the solvent nozzle to the outer peripheral portion of the wafer to which the adhesive has been applied.

JP 2013-58569 A

  However, foreign matters may be mixed in the solvent, and the foreign matter may clog the solvent nozzle described in Patent Document 1. This problem is particularly noticeable when the diameter of the solvent nozzle is small. In such a case, the adhesive on the outer periphery of the wafer cannot be removed properly.

  In addition, as a result of investigations by the inventors, it has been found that such foreign matters are generated due to various causes. For example, a part of the solvent supply pipe connected to the solvent nozzle may be peeled off to generate foreign matter. Further, for example, when the supply pipe is replaced from the solvent nozzle during regular maintenance, foreign matter may be mixed into the solvent nozzle. Furthermore, for example, the sealing material provided between the solvent nozzle and the joint of the supply pipe may be peeled off to generate foreign matter. Thus, it is difficult to specify the source of the foreign matter.

  The present invention has been made in view of such points, and an object thereof is to remove foreign substances in the processing liquid to suppress clogging of the processing liquid nozzle and to appropriately supply the processing liquid from the processing liquid nozzle to the substrate. To do.

  In order to achieve the above object, the present invention provides a processing liquid nozzle for supplying a processing liquid to a substrate, comprising a hollow nozzle body, a flow space for processing liquid formed in the nozzle body, and the nozzle A treatment liquid discharge port formed in the lower part of the main body is connected to the flow space, and a treatment liquid flow passage penetrating the nozzle body in the vertical direction is provided in the upper part of the flow passage. A filter that collects and removes foreign matter; and a fixing member that fixes the filter in a vertical direction between the nozzle body, and the fixing member includes a main body portion that fixes the filter on a lower surface; And a protrusion that protrudes from the upper surface of the main body and abuts against the ceiling surface of the circulation space.

  According to the present invention, since the filter is provided inside the processing liquid nozzle, the foreign matter in the processing liquid can be removed immediately before the processing liquid is supplied from the processing liquid nozzle to the substrate. That is, the foreign matter can be removed regardless of the source of the foreign matter. Therefore, clogging of the treatment liquid nozzle can be suppressed.

  In addition, the fixing member fixes the filter by the protrusions coming into contact with the ceiling surface of the circulation space. As a normal method for fixing the filter, for example, screw fixing or fitting fixing may be considered. In such a case, foreign matter is generated by sliding. In this regard, according to the present invention, when the filter is fixed, the protrusions only come into contact with the ceiling surface of the circulation space, so that the generation of foreign matters can be suppressed. Therefore, clogging of the processing liquid nozzle can be more reliably suppressed, and the processing liquid can be appropriately supplied from the processing liquid nozzle to the substrate.

  The ceiling surface of the circulation space may be inclined vertically downward from the central portion toward the outer peripheral portion.

  The tip of the protrusion may have a hemispherical shape.

  According to another aspect of the present invention, there is provided a processing liquid nozzle for supplying a processing liquid to a substrate, comprising a hollow nozzle body, a processing liquid circulation space formed in the nozzle body, and a lower portion of the nozzle body. The formed treatment liquid discharge port is connected to the flow space, and the treatment liquid flow path that penetrates the nozzle body in the vertical direction, and provided in the flow path, collects foreign substances in the treatment liquid. The filter is fixed in a vertical direction between the filter to be removed and the nozzle body, and includes a fixing member provided with a magnetic body, and a magnet that draws the fixing member across the filter. .

  The magnet may be disposed outside the flow passage.

  The filter and the fixing member may be respectively disposed on the upper part of the flow passage. Or the said filter and the said fixing member may each be arrange | positioned inside the said flow path.

  The circulation space may be formed below the upper end of the flow passage, and may have a foreign matter collection space for sinking and collecting foreign matter in the processing liquid.

  The foreign matter collection space may be formed such that the sedimentation speed of foreign matter in the foreign matter collection space is larger than the flow rate of the treatment liquid in the circulation space.

  The outflow area of the processing liquid in the foreign matter collection space may be determined so that the sedimentation speed is greater than the circulation speed. Moreover, the depth in the foreign matter collection space may be determined so that the settling velocity is larger than the circulation velocity.

  The nozzle body may be provided with a plurality of treatment liquid supply pipes for supplying a treatment liquid to the circulation space.

  The nozzle body may be provided with an exhaust pipe that exhausts the inside of the circulation space.

  Another aspect of the present invention is a coating processing apparatus that includes the processing liquid nozzle and applies an adhesive for bonding substrates to the surface of one substrate, and holds and rotates the substrate. And an adhesive nozzle that supplies an adhesive to the center of the substrate held by the rotation holding portion, and the processing liquid supplied from the processing liquid nozzle is a solvent for the adhesive, The treatment liquid nozzle is characterized in that an adhesive solvent is supplied onto the outer peripheral portion of the substrate coated with the adhesive by the adhesive nozzle, and the adhesive on the outer peripheral portion is removed.

  According to the present invention, it is possible to remove foreign substances in the processing liquid, suppress clogging of the processing liquid nozzle, and appropriately supply the processing liquid from the processing liquid nozzle to the substrate.

It is a top view which shows the outline of a structure of the joining system concerning this Embodiment. It is a side view which shows the outline of the internal structure of the joining system concerning this Embodiment. It is a side view of a to-be-processed wafer and a support wafer. It is a longitudinal cross-sectional view which shows the outline of a structure of a coating processing apparatus. It is a cross-sectional view which shows the outline of a structure of a coating processing apparatus. It is a perspective view which shows the outline of a structure of a solvent nozzle. It is a longitudinal cross-sectional view which shows the outline of a structure of a solvent nozzle. It is a perspective view of the longitudinal section which shows the outline of a structure of a lower block, a filter, and a fixing member. It is explanatory drawing which shows the flow of the solvent in the inside of a solvent nozzle. It is explanatory drawing which shows a mode that the adhesive agent on the outer peripheral part of a to-be-processed wafer is removed. It is a perspective view of the longitudinal section which shows the outline of a structure of the lower block, filter, and fixing member concerning other embodiment. It is a perspective view of the longitudinal section which shows the outline of a structure of the nozzle part, filter, and fixing member concerning other embodiment. It is a perspective view of the longitudinal section which shows the outline of a structure of the nozzle part, filter, and fixing member concerning other embodiment. It is a perspective view of the longitudinal section which shows the outline of a structure of the nozzle part, filter, and fixing member concerning other embodiment. It is a longitudinal cross-sectional view which shows the outline of a structure of the solvent nozzle concerning other embodiment.

  Embodiments of the present invention will be described below. FIG. 1 is a plan view showing the outline of the configuration of the joining system 1 according to the present embodiment. FIG. 2 is a side view illustrating the outline of the internal configuration of the joining system 1.

In the bonding system 1, as shown in FIG. 3, for example, a processing target wafer W as a substrate and a support wafer S as a substrate are bonded via an adhesive G. Hereinafter, in the processing target wafer W, a surface bonded to the support wafer S via the adhesive G is referred to as a “bonding surface W _J ” as a surface, and a surface opposite to the bonding surface W _J is defined as a “back surface”. It is referred to as “non-bonding surface W _N ”. Similarly, in the support wafer S, a surface bonded to the processing target wafer W via the adhesive G is referred to as a “bonding surface S _J ” as a surface, and a surface opposite to the bonding surface S _J is defined as a “back surface”. It is referred to as “non-joint surface S _N ”. And in the joining system 1, the to-be-processed wafer W and the support wafer S are joined, and the superposition | polymerization wafer T is formed. Note that wafer W is a wafer as a product, for example, joint surface W _J A plurality of electronic circuit is formed on the non-bonding surface W _N is polished. The support wafer S is a wafer having the same diameter as that of the wafer W to be processed and supporting the wafer W to be processed. In this embodiment, the case where a wafer is used as the support substrate will be described, but another substrate such as a glass substrate may be used.

As shown in FIG. 1, the bonding system 1 includes cassettes C _W , C _S , and C _T that can accommodate, for example, a plurality of wafers W to be processed, a plurality of support wafers S, and a plurality of superposed wafers T, respectively. The loading / unloading station 2 for loading / unloading and the processing station 3 including various processing apparatuses for performing predetermined processing on the processing target wafer W, the supporting wafer S, and the overlapped wafer T are integrally connected. .

The loading / unloading station 2 is provided with a cassette mounting table 10. The cassette mounting table 10 is provided with a plurality of, for example, four cassette mounting plates 11. The cassette mounting plates 11 are arranged in a line in the X direction (vertical direction in FIG. 1). These cassette mounting plates 11, cassettes _C W to the outside of the interface system _1, C S, when loading and unloading the _{C T,} a cassette _{C W,} C S, can be placed on _{C T} . Thus, the carry-in / out station 2 is configured to be capable of holding a plurality of wafers W to be processed, a plurality of support wafers S, and a plurality of superposed wafers T. The number of cassette mounting plates 11 is not limited to the present embodiment, and can be arbitrarily determined. One of the cassettes may be used for collecting defective wafers. That is, this is a cassette that can separate from a normal superposed wafer T a wafer in which a defect occurs in the joining of the processing target wafer W and the supporting wafer S due to various factors. In the present embodiment, among the plurality of cassettes C _T, using a one cassette C _T for the recovery of the fault wafer, and using the other cassette C _T for the accommodation of a normal bonded wafer T.

In the loading / unloading station 2, a wafer transfer unit 20 is provided adjacent to the cassette mounting table 10. The wafer transfer unit 20 is provided with a wafer transfer device 22 that is movable on a transfer path 21 extending in the X direction. The wafer transfer device 22 is also movable in the vertical direction and around the vertical axis (θ direction), and includes cassettes C _W , C _S , and C _T on each cassette mounting plate 11 and a third of the processing station 3 to be described later. The to-be-processed wafer W, the support wafer S, and the superposed wafer T can be transferred to and from the transition devices 50 and 51 of the processing block G3.

  The processing station 3 is provided with a plurality of, for example, three processing blocks G1, G2, and G3 including various processing apparatuses. For example, a first processing block G1 is provided on the front side of the processing station 3 (X direction negative direction side in FIG. 1), and on the back side of the processing station 3 (X direction positive direction side in FIG. 1). A second processing block G2 is provided. Further, a third processing block G3 is provided on the processing station 3 on the side of the loading / unloading station 2 (the Y direction negative direction side in FIG. 1).

  For example, in the first processing block G1, bonding devices 30 to 33 for pressing and bonding the processing target wafer W and the supporting wafer S via the adhesive G are provided in this order from the loading / unloading station 2 side in the Y direction. They are arranged side by side. The number and arrangement of the joining devices 30 to 33 can be arbitrarily set.

  The joining devices 30 to 33 include a delivery unit (not shown) for delivering the wafer W to be processed, the support wafer S, and the overlapped wafer T to the outside, and a reversing unit for inverting the front and back surfaces of the support wafer S ( (Not shown), a bonded portion (not shown) that presses and bonds the wafer to be processed W and the support wafer S via the adhesive G, and a delivery portion, a reversing portion, and a bonded portion. And a transport unit (not shown) for transporting the wafer W, the support wafer S, and the overlapped wafer T.

  For example, in the second processing block G2, as shown in FIG. 2, a coating processing apparatus 40 that applies the adhesive G to the processing target wafer W and further removes the adhesive G on the outer peripheral portion of the processing target wafer W; A heat treatment apparatus 41 to 43 for heating the wafer W to be processed to which the adhesive G is applied to a predetermined temperature and a similar heat treatment apparatus 44 to 46 toward the loading / unloading station 2 side (Y direction in FIG. 2). They are arranged in this order in the negative direction). The heat treatment apparatuses 41 to 43 and the heat treatment apparatuses 44 to 46 are provided in three stages in this order from the bottom. The number of heat treatment apparatuses 41 to 46 and the arrangement in the vertical direction and the horizontal direction can be arbitrarily set.

  The heat treatment apparatuses 44 to 46 include a heating unit (not shown) that heats the wafer W to be processed, and a temperature adjusting unit (not shown) that adjusts the temperature of the wafer W to be processed. The configuration of the coating processing apparatus 40 will be described later.

  For example, in the third processing block G3, transition devices 50 and 51 for the processing target wafer W, the supporting wafer S, and the overlapped wafer T are provided in two stages in this order from the bottom.

  As shown in FIG. 1, a wafer transfer region 60 is formed in a region surrounded by the first processing block G1 to the third processing block G3. For example, a wafer transfer device 61 is disposed in the wafer transfer region 60. Note that the pressure in the wafer transfer region 60 is equal to or higher than atmospheric pressure, and the wafer to be processed W, the support wafer S, and the superposed wafer T are transferred in a so-called atmospheric system in the wafer transfer region 60.

  The wafer transfer device 61 has, for example, a transfer arm that can move around the vertical direction, horizontal direction (Y direction, X direction), and vertical axis. The wafer transfer device 61 moves within the wafer transfer region 60, and moves to a predetermined device in the surrounding first processing block G1, second processing block G2, and third processing block G3. S and superposed wafer T can be conveyed.

  The above joining system 1 is provided with a controller 70 as shown in FIG. The control unit 70 is, for example, a computer and has a program storage unit (not shown). The program storage unit stores a program for controlling processing of the processing target wafer W, the supporting wafer S, and the overlapped wafer T in the bonding system 1. The program storage unit also stores a program for controlling the operation of drive systems such as the above-described various processing apparatuses and transfer apparatuses to realize the below-described joining process in the joining system 1. The program is recorded on a computer-readable storage medium H such as a computer-readable hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnetic optical desk (MO), or a memory card. May have been installed in the control unit 70 from the storage medium H.

  Next, the configuration of the above-described coating processing apparatus 40 will be described. As shown in FIG. 4, the coating processing apparatus 40 has a processing container 100 capable of sealing the inside. A loading / unloading port (not shown) for the wafer W to be processed is formed on the side surface of the processing container 100 on the wafer transfer region 60 side, and an opening / closing shutter (not shown) is provided at the loading / unloading port.

  A spin chuck 110 serving as a rotation holding unit that holds and rotates the wafer W to be processed is provided at the center of the processing container 100. The spin chuck 110 has a horizontal upper surface, and a suction port (not shown) for sucking the wafer W to be processed is provided on the upper surface, for example. The wafer W to be processed can be sucked and held on the spin chuck 110 by suction from the suction port.

  Below the spin chuck 110, for example, a chuck driving unit 111 including a motor is provided. The spin chuck 110 can be rotated at a predetermined speed by the chuck driving unit 111. Further, the chuck driving unit 111 is provided with an elevating drive source such as a cylinder, and the spin chuck 110 is movable up and down.

  Around the spin chuck 110, there is provided a cup 112 that receives and collects the liquid scattered or dropped from the wafer W to be processed. Connected to the lower surface of the cup 112 are a discharge pipe 113 for discharging the collected liquid and an exhaust pipe 114 for evacuating and exhausting the atmosphere in the cup 112.

  As shown in FIG. 5, a rail 120 extending along the Y direction (left and right direction in FIG. 5) is formed on the X direction negative direction (downward direction in FIG. 5) side of the cup 112. The rail 120 is formed, for example, from the outer side of the cup 112 in the Y direction negative direction (left direction in FIG. 5) to the outer side in the Y direction positive direction (right direction in FIG. 5). An arm 121 is attached to the rail 120.

  As shown in FIGS. 4 and 5, the arm 121 supports an adhesive nozzle 122 that supplies a liquid adhesive G to the wafer W to be processed. The arm 121 is movable on the rail 120 by a nozzle driving unit 123 shown in FIG. As a result, the adhesive nozzle 122 can move from the standby portion 124 installed on the outer side of the cup 112 on the positive side in the Y direction to above the central portion of the wafer W to be processed in the cup 112, and further to the wafer W to be processed. It can move in the radial direction of the wafer W to be processed. The arm 121 can be moved up and down by a nozzle driving unit 123 and the height of the adhesive nozzle 122 can be adjusted.

  As shown in FIG. 4, an adhesive supply pipe 125 that supplies the adhesive G to the adhesive nozzle 122 is connected to the adhesive nozzle 122. The adhesive supply pipe 125 communicates with an adhesive supply source 126 that stores the adhesive G therein. Further, the adhesive supply pipe 125 is provided with a supply device group 127 including a valve for controlling the flow of the adhesive G, a flow rate adjusting unit, and the like.

  In addition, as shown in FIG. 5, a rail 130 extending along the Y direction (left-right direction in FIG. 5) is formed between the cup 112 and the rail 120. The rail 130 is formed, for example, from the outside of the cup 112 in the Y direction negative direction (left direction in FIG. 5) to the vicinity of the center of the cup 112. An arm 131 is attached to the rail 130.

  As shown in FIGS. 4 and 5, the arm 131 supports a solvent nozzle 132 as a processing liquid nozzle that supplies a solvent of the adhesive G as a processing liquid to the wafer W to be processed. The arm 121 is movable on the rail 130 by a nozzle driving unit 133 shown in FIG. Thereby, the solvent nozzle 132 can move from the standby part 134 installed on the outer side of the Y direction negative direction of the cup 112 to above the outer peripheral part of the wafer W to be processed in the cup 112, and further on the wafer W to be processed. Can be moved in the radial direction of the wafer W to be processed. The arm 131 can be moved up and down by a nozzle driving unit 133 and the height of the solvent nozzle 132 can be adjusted.

  As shown in FIG. 4, the solvent nozzle 132 is connected with a solvent supply pipe 135 as a processing liquid supply pipe for supplying the solvent of the adhesive G to the solvent nozzle 132. As will be described later, the solvent supply pipe 135 branches into two when connected to the solvent nozzle 132. The solvent supply pipe 135 communicates with a solvent supply source 136 that stores the solvent of the adhesive G therein. Further, the solvent supply pipe 135 is provided with a supply device group 137 including a valve for controlling the flow of the solvent of the adhesive G, a flow rate adjusting unit, and the like. For example, an organic thinner is used as the solvent for the adhesive G.

  In the present embodiment, the arm 121 that supports the adhesive nozzle 122 and the arm 131 that supports the solvent nozzle 132 are attached to separate rails 120 and 130, respectively, but may be attached to the same rail. Good. In addition, the adhesive nozzle 122 and the solvent nozzle 132 are supported by separate arms 121 and 131, respectively, but may be supported by the same arm.

  In addition, the operation of each unit in the coating processing apparatus 40 is controlled by the control unit 70 described above.

  Next, the configuration of the solvent nozzle 132 will be described. The solvent nozzle 132 has the upper block 200 and the lower block 201 as shown in FIG.6 and FIG.7. The lower block 201 is fitted into a groove 131 a formed in the arm 131, and the solvent nozzle 132 is supported by the arm 131.

  The upper block 200 and the lower block 201 are integrated to form a hollow nozzle body in the present invention. A circulation space 202 through which a solvent flows is formed inside the nozzle body in which the upper block 200 and the lower block 201 are integrated. The distribution space 202 is formed by combining an upper space 210 of the upper block 200 described later and a lower space 230 of the lower block 201.

  In the upper block 200, an upper space 210 that is recessed upward from the lower surface is formed. The ceiling surface 211 of the upper space 210 (distribution space 202) is inclined vertically downward from the central portion toward the outer peripheral portion. An exhaust port 212 for exhausting the inside of the circulation space 202 is formed at the center of the ceiling surface 211. In addition, the outer edge portion of the ceiling surface 211 is stepped downward, and solvent supply ports 213 for supplying the solvent to the circulation space 202 are formed at two locations on the outer edge portion, for example.

  A pipe joint 221 for connecting the exhaust pipe 220 is connected to the upper surface of the upper block 200. The exhaust pipe 220 communicates with the exhaust port 212 via a pipe joint 221. Since the ceiling surface 211 is inclined, bubbles in the solvent flowing through the circulation space 202 are collected at the center of the ceiling surface 211 and are discharged from the exhaust pipe 220 through the exhaust port 212.

  A plurality of, for example, two pipe joints 222 for connecting the solvent supply pipe 135 are provided on the upper surface of the upper block 200. The solvent supply pipe 135 communicates with the solvent supply port 213 through the pipe joint 222. Then, the solvent is supplied from the solvent supply pipe 135 to the circulation space 202 through the solvent supply port 213.

  As shown in FIGS. 6 to 8, the lower block 201 has a lower space 230 that is recessed downward from the upper surface. As described above, the lower space 230 and the upper space 210 of the upper block 200 are combined to form the circulation space 202. The lower space 230 (distribution space 202) has a foreign matter collection space 231 for sinking and collecting foreign matter in the solvent. The foreign matter collection space 231 is formed around a business trip unit 240 described later and below the inflow port 242 (the upper end of the flow passage 245). A specific design method for the foreign matter collection space 231 will be described later. The lower block 201 may be provided with a foreign matter discharge pipe (not shown) for discharging the foreign matter collected in the foreign matter collection space 231.

  In the lower block 201, a business trip part 240 protruding from the bottom surface is formed at the center of the lower space 230. On the upper surface of the business trip part 240, a groove part 241 in which a filter 260 and a fixing member 261 described later are disposed is formed. An inlet 242 through which the solvent flows from the circulation space 202 is formed on the bottom surface of the groove portion 241. Further, the lower block 201 is formed with a nozzle portion 243 that protrudes downward from the center portion of the lower surface. A solvent discharge port 244 is formed on the lower surface of the nozzle portion 243. The diameter of the discharge port 244 is, for example, 0.1 mm or less. An inflow port 242 and an outlet 244 are connected to the business trip section 240 and the nozzle section 243, and a solvent flow passage 245 that penetrates the business trip section 240 and the nozzle section 243 in the vertical direction is formed. Note that the upper portion of the flow passage 245 has a tapered shape whose diameter decreases from the inflow port 242.

  An annular ring 250 protruding outward from the side surface is provided on the side surface of the lower block 201. The upper surface of the ring 250 is in contact with the upper block 200, and an annular sealing material 251 such as a resin O-ring is provided on the upper surface.

  The solvent nozzle 132 further includes a filter 260 that collects and removes foreign substances in the solvent, and a fixing member 261 that fixes the filter 260. The filter 260 and the fixing member 261 are disposed in the groove portion 241 of the lower block 201. In addition, since the solvent passes through the filter 260 at a predetermined flow rate, if the fixing is loose, the filter 260 may move, for example, vibrate. In such a case, foreign matter may be generated by the movement of the filter 260. Therefore, the filter 260 needs to be appropriately fixed by the fixing member 261.

  For the filter 260, for example, a mesh plate having a plurality of holes with a diameter of several tens of μm and a thickness of several tens of μm is used. The diameter of the hole in the filter 260 can be arbitrarily set according to the expected diameter of the foreign matter. The filter 260 is disposed so as to cover the inlet 242 of the flow passage 245.

  The fixing member 261 has a resin main body 262 that fixes the filter 260 on the lower surface. A through hole 263 for allowing the solvent to flow is formed in the center of the main body 262. In addition, the fixing member 261 has a resin protrusion 264 that protrudes from the upper surface of the main body 262. Two protrusions 264 are provided around the through hole 263. The tip 264a of the protrusion 264 has a hemispherical shape. In addition, the front-end | tip part 264a should just be substantially hemispherical shape, and the point should just be rounded.

  And the projection part 264 contact | abuts to the ceiling surface 211 of the upper space 210 (circulation space 202), and the fixing member 261 fixes the filter 260 to a perpendicular direction between the business trip parts 240. FIG. At this time, since the contact area between the protrusion 264 and the ceiling surface 211 is small, the generation of foreign matter can be suppressed. Further, if the tip portion of the protrusion 264 is flat and square, the tip portion 264a of the present embodiment may be rounded although the tip portion may be scraped off when contacting the ceiling surface 211. Therefore, generation | occurrence | production of this foreign material can be suppressed. In addition, since the ceiling surface 211 is inclined vertically downward from the central portion toward the outer peripheral portion, the protruding portion 264 can follow the inclination of the ceiling surface 211, and the protruding portion 264 can be prevented from buckling. Then, the behavior of the protrusion 264 is stabilized, and the filter 260 can be reliably fixed by the fixing member 261.

  The fixing member 261 is disposed in the groove portion 241 with a gap provided between the outer side surface 262a of the main body portion 262 and the inner side surface 241a of the groove portion 241 of the business trip portion 240 shown in FIG. For this reason, a foreign material does not generate | occur | produce when the fixing member 261 and the business trip part 240 slide.

  Next, the structure of the foreign material collection space 231 described above will be described. The foreign matter collection space 231 is a space for allowing foreign matter in the solvent flowing through the circulation space 202 to settle. First, the flow of the solvent in the solvent nozzle 132 will be described. As shown in FIG. 9, the solvent supplied from the solvent supply pipe 135 to the circulation space 202 rises through the foreign substance collection space 231, and then passes through the through hole 263, the filter 260, the inlet 242, and the passage 245 of the fixing member 261. Are sequentially discharged and discharged from the discharge port 244 (a dotted line arrow in FIG. 9 is a distribution route of the solvent).

  The foreign matter collection space 231 is formed such that the sedimentation rate of foreign matter in the foreign matter collection space 231 is larger than the circulation rate of the solvent in the circulation space 202. Thus, as a parameter for making the sedimentation rate of the foreign material larger than the circulation rate of the solvent, there is an outflow area A of the foreign material collection space 231 when the solvent flows out from the foreign material collection space 231. In the present embodiment, the outflow area A can be restated as the area of the foreign matter collection space 231 in plan view. Then, by adjusting the outflow area A, the sedimentation rate of the foreign matter is made larger than the circulation rate of the solvent. Specifically, when the outflow area A is large, the flow rate of the solvent flowing out from the foreign matter collection space 231 is reduced, and thus foreign matters are easily settled in the foreign matter collection space 231.

  Moreover, as a parameter for making the sedimentation rate of the foreign material larger than the circulation rate of the solvent, there is a depth D of the foreign material collection space 231. For example, if the depth D of the foreign material collection space 231 is small, the solvent supplied from the solvent supply pipe 135 to the circulation space 202 may collide with the bottom surface of the lower block 201 (the bottom surface of the foreign material collection space 231). In such a case, the flow of the solvent in the foreign matter collection space 231 is disturbed, and the foreign matter cannot be appropriately settled. Therefore, it is necessary to ensure the depth D of the foreign matter collection space 231 in order to make the foreign matter settling speed larger than the circulation speed of the solvent without disturbing the flow of the solvent in the foreign matter collection space 231.

  Further, in order to make the sedimentation rate of the foreign matter larger than the circulation rate of the solvent, it is also effective to supply the solvent from the plurality of solvent supply ports 213 to the circulation space 202. In such a case, by distributing and supplying the solvent to the distribution space 202, the distribution speed of the solvent in the distribution space 202 can be reduced. If it does so, it will become easy to settle a foreign material in the foreign material collection space 231.

  And the shape of the foreign material collection space 231 is optimized by performing a simulation or conducting an experiment, for example. In other words, the shape of the foreign matter collection space 231, the shape of the solvent supply port 213 and the solvent supply port 213 are satisfied as long as the condition that the sedimentation rate of the foreign matter is made larger than the flow rate of the solvent without disturbing the flow of the solvent flowing out from the foreign matter collection space 231. The number, arrangement, and shape (number, arrangement, and shape of the solvent supply pipe 135) can be arbitrarily designed.

  That is, the shape of the foreign material collection space 231 is not limited to the present embodiment. Further, the number of solvent supply ports 213 (the number of solvent supply pipes 135) is not limited to the present embodiment, and may be one or three or more. Further, the solvent supply port 213 is formed on the upper surface of the circulation space 202, but the present invention is not limited to this. For example, the solvent supply port 213 is formed on the side surface of the circulation space 202 and supplies the solvent from the side of the circulation space 202. You may make it do. Further, the diameter of the solvent supply port 213 may be made larger than the diameter of the solvent supply pipe 135, and the speed of the solvent supplied to the circulation space 202 may be reduced.

  In addition, when the inventors performed a simulation using the solvent nozzle 132 of the present embodiment, it was possible to remove foreign matters having a diameter of 80 μm or more in the foreign matter collection space 231.

  Next, a method for joining the processing target wafer W and the supporting wafer S performed using the joining system 1 configured as described above will be described.

First, a cassette C _W housing a plurality of the processed the wafer _W, the cassette C _S accommodating a plurality of support wafer _S, and an empty cassette C _T is a predetermined cassette mounting plate 11 of the carry-out station 2 Placed. Thereafter, the wafer _W to be processed in the cassette CW is taken out by the wafer transfer device 22 and transferred to the transition device 50 of the third processing block G3 of the processing station 3. At this time, the wafer W to be processed is transported with its non-bonding surface W _N facing downward.

Next, the processing target wafer W is transferred to the coating processing apparatus 40 by the wafer transfer apparatus 61. The wafer W to be processed loaded into the coating processing apparatus 40 is transferred from the wafer transfer apparatus 61 to the spin chuck 110 and is sucked and held. At this time, the non-bonding surface W _N of the wafer W is held by suction.

Subsequently, the arm 121 moves the adhesive nozzle 122 of the standby unit 124 to above the center of the wafer W to be processed. Thereafter, while rotating the wafer W by the spin chuck 110, and supplies the adhesive G from the adhesive nozzles 122 on the bonding surface W _J of wafer W. Supplied adhesive G is diffused into the entire surface of the bonding surface W _J of wafer W by the centrifugal force, the adhesive G is applied to the bonding surface W _J of the wafer W.

Thereafter, the adhesive nozzle 122 is moved to the standby part 124, and the solvent nozzle 132 of the standby part 134 is moved above the outer peripheral part of the wafer W to be processed by the arm 131. At this time, the solvent nozzle 132 as shown in FIG. 10, the outer surface _{W S} a predetermined distance from L to be processed the wafer W, are arranged, for example, the position of 5Mm～7.5Mm. The distance L is determined by the control unit 70, for example, the type of the adhesive G, the target film thickness of the adhesive G applied to the wafer W to be processed, the heat treatment temperature for heating the wafer W to be processed, or the wafer W to be processed. It is determined based on the pressure for pressing the support substrate.

Thereafter, while rotating the wafer W by the spin chuck 110, and supplies the solvent adhesive G from the solvent nozzle 132 to the outer peripheral portion W _E of the wafer W. Solvent supplied adhesive G flows over the outer peripheral portion W _E of the wafer W toward the outer surface W _S by centrifugal force. Adhesive G on the outer peripheral portion W _E of the wafer W is removed by the adhesive G.

  At this time, as shown in FIG. 9, in the solvent nozzle 132, the solvent is supplied from the solvent supply pipe 135 to the circulation space 202, and the foreign matter in the solvent settles and is collected in the foreign matter collection space 231. Furthermore, when the solvent flows into the flow passage 245 from the circulation space 202, the filter 260 collects foreign matters in the solvent. Then, the solvent from which the foreign matter has been removed is discharged from the discharge port 244. In such a case, the foreign matter in the solvent is collected in two stages by the foreign matter collection space 231 and the filter 260, so that the foreign matter can be reliably removed. For this reason, clogging of the solvent nozzle 132 can be suppressed.

  Next, the wafer W to be processed is transferred to the heat treatment apparatus 41 by the wafer transfer apparatus 61. In the heat treatment apparatus 41, first, the processing target wafer W is heated to a predetermined temperature, for example, 100 ° C. to 300 ° C. by the heating unit. By performing such heating, the adhesive G on the processing target wafer W is heated and the adhesive G is cured. Thereafter, the temperature of the wafer to be processed W is adjusted to a predetermined temperature by the temperature adjusting unit.

Next, the wafer W to be processed is transferred to the bonding apparatus 30 by the wafer transfer device 61. In the bonding apparatus 30, at the junction, a state where the bonding surface W _J of wafer W is facing upward, i.e. wafer W in a state where the adhesive G is facing upward is held in the first holding portion .

While the processing in the coating processing apparatus 40, the processing in the heat treatment apparatus 41, and the processing in the bonding apparatus 30 are performed on the processing target wafer W, the supporting wafer S is processed following the processing target wafer W. Is called. The support wafer S is transferred to the bonding apparatus 30 by the wafer transfer device 61. In the bonding apparatus 30, the front and back surfaces of the support wafer S are reversed by the reversing unit. That is, the bonding surface S _J of the support wafer S is directed downward. Thereafter, the joint support wafer S is held in the second holding portion in a state where the bonding surface S _J is directed downward of the support wafer S.

In the bonding apparatus 30, when the processing target wafer W and the supporting wafer S are respectively held by the first holding unit and the second holding unit, the horizontal position and the vertical position of the processing target wafer W and the supporting wafer S are obtained. after adjusting the, it is abutted against the joint surface S _J of the joint surface W _J and support wafer S to be processed the wafer W, is adhered by the adhesive G for supporting wafer S and the object wafer W. Further, the wafer to be processed W and the support wafer S are pressed while being heated at a predetermined temperature, for example, 200 ° C., so that the wafer to be processed W and the support wafer S are more firmly bonded and bonded.

Next, the superposed wafer T in which the wafer W to be processed and the support wafer S are bonded is transferred to the heat treatment apparatus 42 by the wafer transfer apparatus 61. In the heat treatment apparatus 42, the temperature of the superposed wafer T is adjusted to a predetermined temperature, for example, normal temperature (23 ° C.). Thereafter, bonded wafer T is transferred to the transition unit 51 by the wafer transfer apparatus 61, as by the wafer transfer apparatus 22 of the subsequent unloading station 2 is transported to the cassette C _T of predetermined cassette mounting plate 11. In this way, a series of bonding processing of the processing target wafer W and the supporting wafer S is completed.

According to the above embodiment, since the foreign matter collection space 231 and the filter 260 are provided inside the solvent nozzle 132, the foreign matter in the solvent is removed immediately before the solvent is supplied from the solvent nozzle 132 to the wafer W to be processed. Can be removed. That is, the foreign matter can be removed regardless of the source of the foreign matter. In addition, since the foreign matter is collected in two stages by the foreign matter collecting space 231 and the filter 260 in this way, the foreign matter can be reliably removed. Therefore, even when the diameter of the discharge port 244 is small as in the present embodiment, clogging of the solvent nozzle 132 can be suppressed, and the solvent can be appropriately supplied from the solvent nozzle 132 to the wafer W to be processed. Furthermore, since a solvent that does not contain the foreign matter can be supplied to be processed the wafer W, it is possible to appropriately remove the adhesive G on the outer peripheral portion W _E of the processing target wafer W.

  Further, the fixing member 261 of the filter 260 fixes the filter 260 by the protrusion 264 coming into contact with the ceiling surface 211 of the circulation space 202. And since the front-end | tip part 264a of the projection part 264 has hemispherical shape, the front-end | tip part 264a is not scraped by contacting with the ceiling surface 211. FIG. Therefore, when fixing the filter 260, the protrusion 264 contacts the ceiling surface 211 with a small contact area, and the tip 264a is not scraped by the contact, so that the generation of foreign matter can be suppressed. Therefore, clogging of the solvent nozzle 132 can be more reliably suppressed.

  Furthermore, since the ceiling surface 211 of the circulation space 202 is inclined vertically downward from the central portion toward the outer peripheral portion, the protruding portion 264 of the fixing member 261 follows the inclination of the ceiling surface 211 and the protruding portion 264 is buckled. Can be suppressed. Therefore, the filter 260 can be appropriately fixed by the fixing member 261.

  Further, the foreign matter collection space 231 is formed so that the sedimentation rate of the foreign matter in the foreign matter collection space 231 is larger than the circulation rate of the solvent in the circulation space 202 by adjusting the outflow area A and the depth D thereof. Is done. Moreover, by providing a plurality of solvent supply pipes 135, the solvent is dispersedly supplied to the circulation space 202, and the circulation speed of the solvent in the circulation space 202 can be reduced. Therefore, the foreign matter can be appropriately settled and collected in the foreign matter collecting space 231.

  In the solvent nozzle 132 of the above embodiment, the structure of the fixing member 261 that fixes the filter 260 is not limited to this embodiment. For example, the filter 260 may be fixed using a magnet. Hereinafter, an embodiment using such a magnet will be described with reference to FIGS.

  As shown in FIG. 11, the solvent nozzle 132 has a fixing member 300 instead of the fixing member 261 of the above embodiment. The fixing member 300 is made of a magnetic material such as metal. In addition, a through hole 301 for allowing the solvent to flow is formed in the central portion of the fixing member 300.

  In the business trip part 240 of the lower block 201, holes 310 are formed, for example, at two locations outside the flow passage 245. A magnet 312 supported by the support member 311 is fitted into each hole 310. The other configuration of the solvent nozzle 132 is the same as the configuration of the solvent nozzle 132 of the above embodiment, and thus the description thereof is omitted.

  In such a case, the fixing member 300 is attracted to the magnet 312 in a state where the fixing member 300 and the filter 260 are disposed in the groove portion 241 of the business trip part 240, and the filter 260 is fixed by the fixing member 300. That is, the fixing member 300 does not contact the ceiling surface 211 of the circulation space 202 and fixes the filter 260 in a non-contact state. Therefore, the generation of foreign matters when the filter 260 is fixed can be more reliably suppressed.

  Moreover, if the magnet 312 is removed, the fixing member 300 and the filter 260 can be easily removed, and maintenance of the solvent nozzle 132 can be easily performed.

  As shown in FIGS. 12 and 13, the solvent nozzle 132 has a holding part 320 and a nozzle part 321 instead of the business trip part 240 and the nozzle part 243 of the above embodiment. The holding part 320 is formed with a groove part 322 in which the filter 260 and the fixing member 300 are disposed. The fixing member 300 is made of a magnetic material as in the example shown in FIG. In the example of FIGS. 12 and 13, the filter 260 and the fixing member 300 have a substantially circular shape in plan view, but the planar shape is not limited to this, and is substantially rectangular as in the above embodiment. It may be.

  The nozzle part 321 extends vertically downward from the holding part 320. Inside the nozzle portion 321, a solvent flow passage 245 similar to that of the above embodiment is formed. An inflow port 242 is formed at the upper end of the flow passage 245 (the bottom surface of the groove 322), and a discharge port 244 is formed at the lower end of the flow passage 245.

  A magnet 331 supported by the support member 330 is provided outside the nozzle portion 321. A through hole 332 is formed in the central portion of the support member 330, and the nozzle portion 321 is fitted into the through hole 332. The other configuration of the solvent nozzle 132 is the same as the configuration of the solvent nozzle 132 of the above embodiment, and thus the description thereof is omitted.

  In such a case, the fixing member 300 is attracted to the magnet 331 in a state where the fixing member 300 and the filter 260 are disposed in the groove portion 322 of the holding portion 320, and the filter 260 is fixed by the fixing member 300. That is, the fixing member 300 fixes the filter 260 in a non-contact state. Therefore, the generation of foreign matters when the filter 260 is fixed can be more reliably suppressed.

  Further, the magnet 331 is embedded in the support member 330, and the structure is simple. For this reason, manufacture of the solvent nozzle 132 is easy, and also quality is stabilized.

  In the above embodiment, the filter 260 is provided in the upper part of the flow passage 245. However, the filter 260 may be provided in the flow passage 245 as shown in FIG. The solvent nozzle 132 has a nozzle portion 340 instead of the nozzle portion 321 of the above embodiment. A solvent flow passage 245 is formed inside the nozzle portion 340, and the nozzle portion 340 includes a magnet 341 that surrounds the flow passage 245. In addition, the filter 260 and the fixing member 300 made of a magnetic material are integrally formed and disposed inside the flow passage 245. The other configuration of the solvent nozzle 132 is the same as the configuration of the solvent nozzle 132 of the above embodiment, and thus the description thereof is omitted.

  In such a case, in a state where the fixing member 300 and the filter 260 are disposed inside the flow passage 245, the fixing member 300 is attracted to the magnet 341, and the filter 260 is fixed. That is, the fixing member 300 does not contact the side surface of the flow passage 245 and fixes the filter 260 in a non-contact state. Therefore, the generation of foreign matters when the filter 260 is fixed can be more reliably suppressed.

  Although the solvent nozzle 132 of the above embodiment is provided with the foreign substance collection space 231 therein, the foreign substance collection space 231 may be omitted. That is, the foreign matter in the solvent may be removed only by the filter 260.

  As shown in FIG. 15, the flow space 202 of the solvent nozzle 132 is formed only directly above the fixing member 261 without the foreign matter collection space 231. Further, the solvent supply port 213 for supplying the solvent to the circulation space 202 is formed at one place in the center of the ceiling surface 211 of the circulation space 202. Accordingly, the solvent supply pipe 135 connected to the upper block 200 is also one. The other configuration of the solvent nozzle 132 is the same as the configuration of the solvent nozzle 132 of the above embodiment, and thus the description thereof is omitted.

  In this case, the solvent supplied from the solvent supply pipe 135 to the circulation space 202 sequentially passes through the circulation space 202, the through hole 263 of the fixing member 261, the filter 260, the inflow port 242, and the flow passage 245, and then from the discharge port 244. Discharged. And when a solvent passes the filter 260, the foreign material in the said solvent is collected and removed. Therefore, clogging of the solvent nozzle 132 can be suppressed, and the solvent can be appropriately supplied from the solvent nozzle 132 to the wafer W to be processed.

  Here, when the foreign substance collection space 231 is formed in the solvent nozzle 132 as in the above embodiment, the foreign substance can be collected in two stages of the foreign substance collection space 231 and the filter 260, so that the foreign substance removal capability is improved. . On the other hand, when the foreign matter collection space 231 is not formed in the solvent nozzle 132 as in the present embodiment, the foreign matter is removed only by the filter 260, but the structure of the foreign matter collection space 231 can be simplified. Therefore, the production of the solvent nozzle 132 is easy and the quality is stable. Therefore, the presence / absence of the foreign matter collection space 231 may be selected according to the required foreign matter removal capability.

  In the example shown in FIG. 15, instead of the fixing member 261, the filter 260 may be fixed using a magnet as shown in FIGS. 11 to 14.

In the above-described embodiment, the wafer to be processed W and the support wafer S are bonded in a state where the wafer to be processed W is disposed on the lower side and the support wafer S is disposed on the upper side. The support wafer S may be disposed upside down. In such a case, the adhesive G is applied to the bonding surface S _J of the support wafer S, also reversing the front and rear surfaces of the processing target wafer W. And the support wafer S and the to-be-processed wafer W are joined. However, from the viewpoint of protecting the electronic circuit and the like on the processing target wafer W, it is preferable to apply the adhesive G on the processing target wafer W.

  Further, in the above embodiment, the adhesive G is applied to either the processing target wafer W or the support wafer S in the coating processing apparatus 40, but the adhesive is applied to both the processing target wafer W and the support wafer S. G may be applied.

  Although the case where the solvent nozzle 132 in the coating processing apparatus 40 is used as the processing liquid nozzle of the present invention has been described in the above embodiment, the processing liquid nozzle of the present invention can be applied to other processes. For example, in the photolithography process, the processing liquid nozzle of the present invention can be applied to an EBR nozzle (Edge Bead Remover nozzle) that cleans the outer periphery of the wafer with a rinsing liquid when a resist liquid is applied to the wafer. Or the process liquid nozzle of this invention is applicable also to the nozzle which apply | coats another coating liquid to a wafer. Furthermore, the present invention can also be applied to a case where the substrate is another substrate such as an FPD (flat panel display) other than a wafer or a mask reticle for a photomask.

  However, in the bonding process between the wafer W to be processed and the support wafer S via the adhesive G as in the above embodiment, it is required when the adhesive G on the outer peripheral portion of the wafer W to be processed is removed by the solvent nozzle 132. Accuracy is extremely high. Accordingly, it is important to appropriately supply the solvent from the solvent nozzle 132 to the wafer W to be processed, and the present invention is particularly useful when the solvent nozzle 132 is used as the processing liquid nozzle.

  The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to such examples. It is obvious for those skilled in the art that various modifications or modifications can be conceived within the scope of the idea described in the claims, and these naturally belong to the technical scope of the present invention. It is understood.

DESCRIPTION OF SYMBOLS 1 Joining system 40 Coating processing apparatus 110 Spin chuck 122 Adhesive nozzle 132 Solvent nozzle 135 Solvent supply pipe 200 Upper block 201 Lower block 202 Distribution space 210 Upper space 211 Ceiling surface 220 Exhaust pipe 230 Lower space 231 Foreign matter collection space 242 Inlet 244 Discharge port 245 Flow path 260 Filter 261 Fixing member 262 Main body 264 Protrusion 300 Fixing member 312, 331, 341 Magnet G Adhesive S Support wafer T Superposition wafer W Processed wafer

Claims (14)

A processing liquid nozzle for supplying a processing liquid to a substrate,
A hollow nozzle body;
A flow space for the treatment liquid formed inside the nozzle body,
A flow path for the processing liquid that connects the discharge port of the processing liquid formed in the lower part of the nozzle body and the circulation space, and penetrates the nozzle body in the vertical direction,
A filter provided at an upper portion of the flow path to collect and remove foreign substances in the processing liquid;
A fixing member that fixes the filter in the vertical direction between the nozzle body and
The fixing member is
A main body for fixing the filter on the lower surface;
A treatment liquid nozzle, comprising: a protrusion protruding from an upper surface of the main body and abutting against a ceiling surface of the circulation space. The processing liquid nozzle according to claim 1, wherein a ceiling surface of the circulation space is inclined vertically downward from a central portion toward an outer peripheral portion. The treatment liquid nozzle according to claim 1, wherein a tip of the protrusion has a hemispherical shape. A processing liquid nozzle for supplying a processing liquid to a substrate,
A hollow nozzle body;
A flow space for the treatment liquid formed inside the nozzle body,
A flow path for the processing liquid that connects the discharge port of the processing liquid formed in the lower part of the nozzle body and the circulation space, and penetrates the nozzle body in the vertical direction,
A filter that is provided in the flow path and collects and removes foreign substances in the processing liquid;
Fixing the filter in the vertical direction between the nozzle body and a fixing member provided with a magnetic body;
And a magnet for attracting the fixing member with the filter interposed therebetween. The processing liquid nozzle according to claim 4, wherein the magnet is disposed outside the flow passage. The processing liquid nozzle according to claim 4, wherein the filter and the fixing member are respectively disposed in an upper part of the flow passage. The processing liquid nozzle according to claim 4, wherein the filter and the fixing member are respectively disposed inside the flow passage. The said circulation space is formed below the upper end of the said flow path, and has a foreign material collection space for sinking and collecting the foreign material in a process liquid, The one of Claims 1-7 characterized by the above-mentioned. The treatment liquid nozzle according to one item. The processing according to claim 8, wherein the foreign matter collection space is formed such that a sedimentation rate of foreign matter in the foreign matter collection space is larger than a circulation rate of the treatment liquid in the circulation space. Liquid nozzle. The processing liquid nozzle according to claim 9, wherein an outflow area of the processing liquid in the foreign matter collection space is determined so that the settling speed is larger than the circulation speed. 11. The treatment liquid nozzle according to claim 9, wherein a depth in the foreign matter collecting space is determined so that the settling speed is larger than the circulation speed. 12. The processing liquid nozzle according to claim 1, wherein the nozzle body is provided with a plurality of processing liquid supply pipes for supplying a processing liquid to the circulation space. The treatment liquid nozzle according to claim 1, wherein an exhaust pipe for exhausting the inside of the circulation space is provided in the nozzle body. A coating processing apparatus comprising the processing liquid nozzle according to any one of claims 1 to 13, and applying an adhesive for bonding substrates to the surface of one substrate,
A rotation holding unit for holding and rotating the substrate;
An adhesive nozzle that supplies an adhesive to the center of the substrate held by the rotation holding unit,
The treatment liquid supplied from the treatment liquid nozzle is an adhesive solvent,
The treatment liquid nozzle supplies an adhesive solvent onto the outer peripheral portion of the substrate to which the adhesive has been applied by the adhesive nozzle, and removes the adhesive on the outer peripheral portion. .

Images