JP2015136576A - Tube joint device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a tube joint device capable of preventing problems such as a time-out error and poor jointing from being caused because a used cut member is left in the device.SOLUTION: A tube joint device 1 includes an attitude maintenance part 604 that prevents the occurrence of toppling and the like of a used wafer WF2 by maintaining an attitude of the used wafer WF2 used for blowout.

Description

  The present invention relates to a tube joining device used for joining tubes.

  As a technique for joining resin tubes and the like, there is conventionally known a joining method in which the ends of each resin tube are melted, and the melted ends are pressed against each other. Such a technique is widely used in various industrial fields. As an example, application to medical techniques such as a peritoneal dialysis method has been attempted.

  The peritoneal dialysis method uses a tube (catheter) embedded in the abdominal cavity of a patient to put a predetermined dialysate into the body, and then removes water and waste products transferred to the dialysate through the peritoneum. Is the method. When the dialysate is put into the body, the tube embedded in the patient is joined in a liquid-tight manner to the back tube containing the dialysate. Also, when the dialysate is drained from the body, the tube embedded in the patient is joined to the drain back tube in a fluid-tight manner.

  As described above, since one of the tubes to be joined is embedded in the abdominal cavity of the patient, careful attention must be paid to the work so that each tube is not contaminated during the joining work. In view of such a point, for example, as described in Patent Document 1, a tube joining apparatus has been developed that enables two plastic tubes to be fused and automatically joined in a sterile state. Has been. In this apparatus, since the melted ends of the two tubes are exchanged and joined, there is no concern about bacterial contamination during joining, and the sterility of the dialysate and the like in the tube and bag can be maintained. Further, in this apparatus, fusing of each end portion of the two tubes is performed using a heated plate-shaped metal wafer. Wafers are sequentially fed one by one from a cassette mounted on the bonding apparatus to a predetermined position and, after being used for fusing, are sent to a discharge position where they can be removed from the apparatus.

Japanese Patent No. 2710038

  When the above-described bonding apparatus is used, an operation of removing the wafer from the apparatus is performed every time the bonding operation is completed. If a used wafer is continuously removed without being removed from the equipment due to forgetting to remove it, etc., the wafer remaining in the equipment will hold the wafer when performing cutting operations with each part of the equipment, for example, a wafer. This is because a problem such as a timeout error or poor bonding may occur due to interference with a holder or the like that moves up and down. The main cause of interference between the wafer and each part of the apparatus is that after the plate-shaped wafer is sent to the discharge position, the posture of the wafer is not maintained, the wafer falls down, and the wafer is placed within a movable range such as a holder. It is thought to be the cause.

  An object of the present invention is to provide a tube joining apparatus that can prevent problems such as a time-out error and poor joining due to a used cutting member remaining in the apparatus.

  In the tube joining apparatus of the present invention, the end portion of the first tube and the end portion of the second tube are fused by the heated plate-shaped cutting member, and then the fused end portion of the first tube and the second portion A tube joining apparatus that replaces and joins the melted ends of the tube, and includes a housing including a holding unit that holds the first tube and the second tube, and a plurality of the housings, The accommodating portion configured to be able to accommodate the cutting member, and the accommodating to the first position for waiting the cutting member when fusing the first tube and the second tube held by the holding portion A moving mechanism for moving the used cutting member used for fusing to a second position where the cutting member can be taken out of the housing after the fusing operation by moving the cutting member housed in a section; The above In second position, and a posture of the used of the cutting member, and a position holding portion to which the cutting member is held in position when being moved to the second position from the first position.

  According to the tube joining apparatus according to the present invention, when the used cutting member used for fusing is in the second position where the cutting member can be taken out from the apparatus, the tube cutting apparatus is moved to the second position. Is maintained as it is by the posture holding portion, and thus the used cutting member does not take an inadvertent posture such as falling down at the second position. For this reason, even when the fusing operation proceeds with the used cutting member remaining in the second position, interference between each part of the apparatus movable during the fusing operation and the used cutting member is prevented. As a result, it is possible to prevent problems such as a time-out error and poor bonding due to the remaining used cutting member remaining at the second position.

  In addition, a posture holding portion is provided in the holder portion that moves the cutting member toward and away from each tube, and the used cutting member is within the movable range of the holder portion by holding the posture of the used cutting member. When it is comprised so that it may be prevented from being located, it becomes possible to prevent suitably that interference with the holder part which is movable at the time of fusing work, and a used cutting member arises.

  In addition, when it is configured to further include a holder position detection sensor that detects the movable state of the holder unit by contact-noncontact with the posture holding unit provided in the holder unit, the posture holding unit is in a movable state of the holder unit. Therefore, it is possible to suitably detect the movable state of the holder unit while preventing the complication of the apparatus configuration by providing the detection unit with the detection end.

  In addition, the posture is held by the posture holding unit so that the rear end portion of the used cutting member moved to the second position faces the front end portion of the cutting member at the first position. In this case, when the used cutting member is moved to the second position, the unused cutting member is pushed out with the front end of the unused cutting member abutting against the rear end of the used cutting member. Therefore, the used cutting member can be moved smoothly and easily to the second position.

  Further, the posture holding unit holds the posture so that the used cutting member is aligned on the linear extension of the first position by contacting the outer surface of the used cutting member moved to the second position. In this case, it is possible to more reliably align the rear end portion of the used cutting member and the front end portion of the unused cutting member, so that the used cutting member is moved to the second position. Can be performed more smoothly.

It is a perspective view showing a tube joining device concerning an embodiment of the present invention. It is the side view which looked at the tube joining apparatus shown in FIG. 1 from the J1 direction. It is the side view which looked at the tube joining apparatus shown in FIG. 1 from the J2 direction. It is a bottom view of the tube joining apparatus shown in FIG. 5A is a diagram illustrating a configuration example of the operation panel unit provided on the front side of the housing illustrated in FIG. 1, and FIG. 5B is provided on the top surface of the housing illustrated in FIG. It is a figure which shows the structural example of the displayed display part. It is a perspective view which shows the state which opened the clamp cover part shown in FIG. 1 in the RT direction from the housing | casing. It is a perspective view which shows the internal structure example of the clamp cover part seen from the arrow SS direction shown in FIG. 6, and the internal structure example of a housing | casing side clamp part. It is the perspective view seen from another angle which shows the internal structure example of a clamp cover part, and the internal structure example of a housing | casing side clamp part. It is a figure which expands and shows the internal structure of the clamp cover part shown in FIG. 7, and the internal structure of a housing | casing side clamp part. It is a perspective view which shows the example of schematic arrangement | positioning of the component arrange | positioned in the housing | casing of a tube joining apparatus. It is a figure which shows the electric block of the control system of a tube joining apparatus. 12A to 12C are perspective views showing the wafer cassette insertion portion of the housing, the vicinity of the wafer cassette takeout button, and the wafer cassette. FIG. 13A is a perspective view showing the bottom surface portion of the wafer cassette, and FIG. 13B is a perspective view showing the top surface portion of the wafer cassette. It is a side view which shows the example of the positional relationship of a fan, each tube arrange | positioned at the housing | casing side clamp part, and a wafer. It is a figure which shows typically the tube joined by the tube joining apparatus which concerns on embodiment. FIGS. 16A to 16C are diagrams schematically illustrating a state in which a tube is set in a housing-side clamp unit included in the tube bonding apparatus. FIGS. 17A and 17B are diagrams schematically illustrating a state in which a tube is set in a housing-side clamp unit included in the tube bonding apparatus. FIGS. 18A to 18D are diagrams schematically showing each process of fusing and joining work by the tube joining apparatus. FIG. 19A is an enlarged view showing each tube after joining, and FIG. 19B is a diagram schematically showing an arrangement state of each tube after joining. It is a top view which shows the moving mechanism and wafer cassette storage unit which move a cutting member. FIG. 21A is an external perspective view of the holder portion viewed from the left side, and FIG. 21B is an external perspective view of the holder portion viewed from the right side. 22A is a side view schematically showing the state before the holder portion is moved, and FIG. 22B is a view when the holder portion is moved and an unused cutting member is moved to the fusing position. It is a side view which shows a mode typically. FIG. 23A is a side view schematically showing a state in which the holder section is moved and the used cutting member is moved from the fusing position to the standby position, and FIG. 23B is an unused cutting. It is a side view which shows typically a mode at the time of moving a member to a holder part and moving a used cutting member to a discharge position. FIG. 24A is a side view schematically showing a state in which the holder section is moved and the unused cutting member is moved to the fusing position with the used cutting member remaining in the discharge position. FIG. 24B schematically shows a state where the used holder is moved and the used cutting member is moved from the fusing position to the standby position with the used holder remaining in the discharge position. FIG. FIG. 25A is a perspective view showing a state in which the cutting member interferes with the holder during the lowering operation when the proportional tube joining apparatus is used, and FIG. 25B is the lowering operation with the cutting member. It is a side view which shows a mode that an inner holder part interferes. FIG. 26A is an enlarged perspective view showing the main part of the tube joining apparatus according to the modification, and FIG. 26B is an enlarged perspective view showing the periphery of the discharge position of the tube joining apparatus according to the modification. It is.

  Embodiments of the present invention will be described below with reference to the drawings. In addition, the dimension ratio of drawing is exaggerated on account of description, and may differ from an actual ratio.

  FIG. 1 is a schematic perspective view showing a tube bonding apparatus according to the present embodiment. FIG. 2 is a side view of the tube joining apparatus viewed from the direction of arrow J1 shown in FIG. FIG. 3 is a side view of the tube joining apparatus viewed from the direction of arrow J2 shown in FIG. FIG. 4 is a perspective view of the tube bonding apparatus as seen from the bottom surface side.

  The tube joining apparatus 1 melts and melts the ends of a plurality of tubes T1 and T2 (hereinafter referred to as the first tube T1 and the second tube T2) and pressurizes the melted ends in a sterile state. To be joined. In this embodiment, the dialysate tube (corresponding to the first tube T1) of the peritoneal dialysate bag and the tube on the patient's peritoneal catheter side (corresponding to the second tube T2) used when performing peritoneal dialysis. The tube joining device will be described through an example applied to a medical device used for joining.

  As shown in FIGS. 18 and 19, the tube bonding apparatus 1 melts the end of the first tube T1 and the end of the second tube T2 with a heated wafer WF (corresponding to a plate-like cutting member). After that, the melted end of the first tube T1 and the melted end of the second tube T2 are exchanged and joined.

  Each structure of the tube joining apparatus 1 is demonstrated.

  A preferable use environment of the tube joining apparatus 1 is, for example, an environmental temperature of 10 to 40 ° C. and a relative humidity of 30 to 85%. However, the use environment is not particularly limited as long as the ends of the tubes T1 and T2 can be pressure welded.

  As shown in FIGS. 1, 2, and 3, the tube joining device 1 includes, for example, a housing 2 and a tube set used to assist the set when the tubes T <b> 1 and T <b> 2 are set in the device 1. It can be configured to have the auxiliary tool 4.

  The housing 2 has a size of, for example, 135 mm (width) × 99 mm (height) × 268 mm (depth) and a weight of about 2.4 kg.

  The housing 2 includes an upper housing portion 2W, a lower housing portion 2V combined with the upper housing portion 2W, and an openable / closable clamp lid 3 provided on the upper side of the upper housing portion 2W. Yes. The housing 2 including the clamp lid 3 and the tube setting auxiliary tool 4 are made of, for example, hard plastic, but there is no particular limitation on the material or the like.

  The housing | casing 2 accommodates each component of the tube joining apparatus 1 so that it may mention later. The clamp lid portion 3 is disposed on the upper portion of the housing 2.

  The tube set auxiliary tool 4 is detachably attached to the housing 2. The housing 2 and the clamp lid portion 3 can be constituted by, for example, a bright color having a relatively high brightness, specifically, cream or white. In addition, in order for a user (a person or patient who actually uses the tube joining device) to visually distinguish each of the housing 2, the clamp lid 3, and the tube set auxiliary unit 4. The tube set auxiliary tool 4 can be configured in, for example, an orange color. However, the color of each said part is not specifically limited, It can select arbitrarily.

  As shown in FIGS. 1 to 4, the housing 2 is configured by a case having a bottom surface portion 2A, a front surface portion 2B, a right side surface portion 2C, a left side surface portion 2D, a back surface portion 2E, and an upper surface portion 2F. Yes. As shown in the figure, the case has a substantially rectangular parallelepiped shape that is chamfered.

  As shown in FIG. 4, installation members 2G are attached to the four corners of the bottom surface portion 2A. These installation members 2G can be formed of, for example, circular plastic or rubber non-slip members. The tube joining apparatus 1 having a relatively large weight is placed so as not to slide with respect to an installation surface such as a desk surface by using these installation members 2G. Thereby, it can prevent that position shift arises in the tube joining apparatus 1 at the time of the operation | work which joins two tube T1, T2, etc., and it becomes possible to implement joining operation in the stable state.

  For example, a lid member 2H for battery replacement can be provided on the bottom surface portion 2A. The lid member 2H can be detachably attached by a fixing member such as a screw 2I, for example. If the screw 2I is removed and the lid member 2H is removed, the battery BA indicated by the broken line in FIG. 4 can be replaced. The lid member 2H can be disposed, for example, closer to the back surface portion 2E than the front surface portion 2B. The lid member 2H is disposed at a position away from the exhaust opening 6 of the fan FN.

  As shown in FIG. 4, a voice opening 5 and an exhaust opening 6 are formed in the bottom surface 2A. The voice opening 5 and the exhaust opening 6 are formed, for example, between the battery replacement lid member 2H and the front portion 2B.

  The sound opening 5 is composed of a plurality of elongated through holes 5A, and the exhaust opening 6 is composed of a plurality of elongated through holes 6A.

  Inside the bottom surface 2A, a speaker SP and a fan FN as an exhaust device are arranged as indicated by a broken line. The fan FN also has a function as a cooling fan that cools the wafer WF after finishing the bonding operation.

  The voice opening 5 is provided for outputting voice guidance, warning sound, or the like generated by the speaker SP to the outside of the housing 2. Thereby, the user can hear clearly the voice guidance, warning sound, etc. which the speaker SP generate | occur | produces.

  The exhaust opening 6 is provided to forcibly exhaust heat generated inside the casing 2 and gas passing through the casing 2 to the outside of the casing 2 when the cooling fan FN operates. Thereby, the heat | fever in the housing | casing 2 and the gas which passes the inside can be discharged | emitted from the bottom face part 2A side to the exterior of the housing | casing 2 instead of the side parts 2C and 2D.

  As shown in FIG. 4, a plurality of ribs 2J are also formed on the bottom surface 2A of the housing 1 in parallel to the Y direction. These ribs 2J have a function as a guide portion when the tube setting auxiliary tool 4 is detachably attached to the housing 2. Details of the tube set auxiliary tool 4 will be described later.

  Next, the operation panel unit 7 and the display unit 8 will be described with reference to FIG.

  FIG. 5A illustrates an example of the operation panel unit 7 provided on the front surface 2B side of the housing 2 illustrated in FIG. FIG. 5B shows an example of the display portion 8 provided on the upper surface portion 2F of the housing 2 shown in FIG.

  The operation panel unit 7 shown in FIG. 5A includes a [power] switch button 7B, a [power] lamp 7C, a [charging] lamp 7D, a [join] button 7E, and a [join] lamp 7F. [Wafer removal] lamp 7G is provided.

  [Power] lamp 7C, [Charging] lamp 7D, [Join] lamp 7F, and [Wafer removal] lamp 7G are display lamps that indicate various states in operation panel unit 7. Each lamp can be composed of, for example, a green LED (light emitting diode) lamp.

  The [Power] switch button 7 </ b> B is a button that is pressed to turn on the tube joining apparatus 1. [Power] lamp 7C is turned on by pressing [Power] switch button 7B.

  The [Join] button 7E starts a fusing-joining operation in which the user melts and cuts the ends of the two tubes T1 and T2, and replaces the ends of the tubes T1 and T2 to perform pressure bonding. It is a button to be pressed. [Join] lamp 7F is turned on when [Join] button 7E is pressed. Further, the [Join] lamp 7F may be configured to blink to warn the user that the tube joining apparatus 1 is in a failure state when the tube joining apparatus 1 fails.

  [During charging] The lamp 7D is lit when the battery BA shown in FIG. 4 is charged from the commercial AC power supply side.

  [Wafer take-out] lamp 7G is such that after the joining of the two tubes T1 and T2, the user can take out the used wafer WF from the housing 2 and discharge it as will be described later. Lights up or flashes when the condition is reached.

  5B includes a [close cover] lamp 8B, a [wafer cassette replacement] lamp 8C, a [wafer defect] lamp 8D, a [requires charge] lamp 8E, and a [room temperature inappropriate] lamp. 8F and an [apparatus failure] lamp 8G.

  [Device failure] The lamp 8G is a warning lamp for notifying that the tube joining device 1 has failed. [Device failure] The lamp 8G can be constituted by, for example, a red LED lamp. Other lamps are configured as alarm display lamps, and can be configured by, for example, yellow LED lamps.

  Referring again to FIGS. 1 and 2, the side surface 2 </ b> C of the housing 2 is provided with a wafer cassette insertion portion 20 and a wafer cassette removal button 21.

  Wafer cassette insertion portion 20 is configured by a rectangular opening for removably inserting wafer cassette WC shown in FIG. In a state where the wafer cassette WC is inserted into the housing 2 through the wafer cassette insertion unit 20, the user presses the wafer cassette eject button 21 with a finger, so that the wafer cassette WC is inserted into the housing 2 through the wafer cassette insertion unit 20. Can be taken out. Although the wafer cassette WC will be described later, the wafer cassette WC is constituted by a container in which a plurality of wafers WF used for fusing the tubes T1 and T2 are accommodated.

  As shown in FIG. 3, a volume adjustment volume 22 and a voice message changeover switch 23 are provided on the left side surface portion 2 </ b> D of the housing 2.

  The user can adjust the volume of the voice message according to his / her preference by sliding the volume adjustment volume 22. Further, when the user slides the voice message changeover switch 23 from, for example, a “no” state to a “present” state, a predetermined voice message can be output from the speaker SP shown in FIG. For example, if the user sets the voice message changeover switch 23 to the “no” state, for example, a predetermined buzzer sound can be output from the speaker SP.

  Next, the tubes T1 and T2 to be joined will be described.

  FIG. 15 illustrates two tubes T <b> 1 and T <b> 2 that are joined by the tube joining apparatus 1. As each tube T1, T2, it is possible to select a tube made of vinyl chloride, for example. However, the material of each tube T1, T2 should just be what can be mutually joined by fusing and pressurization, and is not limited in that limit. For example, the materials of the tubes T1 and T2 may be different from each other.

  In the example shown in FIG. 15, the first tube T1 has a connector CT at its tip. The first tube T1 is connected to the dialysate tube TBL of the dialysate bag BL via the branch pipe 9. Further, the first tube T1 is connected to the drain tube THL of the drain bag HL via the branch pipe 9.

  The tube T2 can be configured to include, for example, the extension tube 10 and the protection tube 11. The extension tube 10 is connected to the peritoneal catheter 15 via the connecting tube 12, the silicone tube 13, and the catheter joint 14. The peritoneal catheter 15 is inserted into the abdominal cavity of the patient M.

  As shown in FIG. 15, the tube joining apparatus 1 includes a joining portion C1 and a tube T2 of the tube T1 in a state where the joining portion C1 indicated by the oblique line of the first tube T1 and the joining portion C2 indicated by the oblique line of the tube T2 are stacked. The bonded portion C2 is melted using a heated wafer WF as will be described later (see FIG. 18A). After melting, the melted end of the tube T1 and the melted end of the tube T2 are melted. The parts are interchanged and pressed to join (see FIGS. 18C and 18D).

  Next, the clamp lid part 3 installed in the housing | casing 2 is demonstrated.

  The clamp lid portion 3 has a function of sandwiching and holding two tubes T1 and T2 with a case-side clamp portion 50 described later when performing a fusing operation. As shown in FIG. 1, the clamp lid 3 can be disposed between the operation panel unit 7 and the display unit 8, for example.

  FIG. 6 is a perspective view showing the housing 1 in a state where the clamp lid 3 is opened in the direction of the arrow RT shown in FIG. FIG. 7 is a perspective view showing the inside of the housing 1 and the inside of the clamp lid 3 as seen from the direction of the arrow SS shown in FIG.

  As shown in FIGS. 1 and 2, the clamp lid portion 3 includes a clamp plate 30, a clamp operation portion 31, and a covering cover 32.

  The clamp operation unit 31 is used when the user opens and closes the clamp lid unit 3 with fingers. In order to easily distinguish the clamp operation unit 31 from the clamp plate 30 and the covering cover 32 by visual observation, for example, the clamp operation unit 31 can be colored green, and the clamp plate 30 and the covering cover 32 can be colored. Can be colored, for example, cream or white.

  As shown in FIG. 1, a confirmation seal 30 </ b> S schematically showing the insertion state of the two tubes T <b> 1 and T <b> 2 can be attached to the surface of the clamp plate 30. Whether or not the two tubes T1 and T2 are correctly sandwiched between the clamp lid portion 3 and the housing side clamp portion 50 by visually checking the confirmation seal 30S when using the tube joining apparatus 1 Can be easily confirmed.

  As shown in FIGS. 1 and 6, the clamp plate 30 of the clamp lid 3 can be opened from the closed state shown in FIG. 1 to the angle exceeding 90 degrees shown in FIG. 6 around the central axis CL. It is attached to the housing 2.

  The covering cover 32 of the clamp lid 3 is attached to the housing 2 so as to be rotatable about the central axis CL1. The protrusion 32T provided on the covering cover 32 is fitted into a guide groove 30R provided on the clamp plate 30. By providing the protrusion 32T and the guide groove 30R, when the clamp plate 30 opens with respect to the housing 2 to an angle exceeding 90 degrees shown in FIG. It is configured to be lifted following the movement of the robot.

  As shown in FIGS. 1 and 6, the clamp operation portion 31 is attached to the tip portion 30 </ b> D of the clamp plate 30 via a predetermined pin (not shown). The clamp operation unit 31 is pivotally supported by this pin so as to be rotatable about the central axis CL2.

  As shown in FIG. 6, the clamp operation unit 31 has a pair of engagement claws 31 </ b> M that are arranged at predetermined intervals in the width direction. The housing 2 is provided with a pair of protruding portions 33 that are arranged at predetermined intervals in the width direction. Each protrusion 33 of the clamp operation unit 31 is configured to be able to be hooked and fixed to each engagement claw 31M of the housing 2.

  As shown in FIG. 6, when the user holds the clamp operation part 31 with his / her finger and rotates it in the direction of the arrow RS around the central axis CL with the clamp lid part 3 open, as shown in FIG. Moreover, the housing side clamp part 50 is covered from the upper side by the clamp plate 30. Then, when the user holds the clamp operation part 31 with his / her finger and rotates it in the direction of the arrow RG about the central axis CL2, the pair of engaging claws 31M shown in FIG. It is meshed with the formed protrusion 33. Thereby, the clamp lid part 3 closes the housing | casing side clamp part 50 provided in the housing | casing 2 from the top. As a result, the clamp lid portion 3 is mechanically fixed so as not to be accidentally opened during the joining of the tubes T1 and T2.

  Next, with reference to FIG. 6 and FIG. 7, each component arrange | positioned inside the clamp board 30 and each component arrange | positioned inside the housing | casing side clamp part 50 are demonstrated.

  Inside the clamp plate 30, a first tube pressing member 35, a first storage member 36, and a second storage member 37 that are used to press the first tube T <b> 1 when joined are disposed.

  The first tube pressing member 35, the first housing member 36, and the second housing member 37 can be formed of, for example, hard plastic, but the material is not particularly limited. The first tube pressing member 35 is provided at a position separated from the first housing member 36 so as to form a predetermined gap 38 between the first tube holding member 35 and the first housing member 36.

  The first housing member 36 has two recesses, a recess 36A and a recess 36B. Similarly, the second housing member 37 has two recesses, a recess 37A and a recess 37B.

  Inside the housing side clamp portion 50, a first tube sandwiching portion 51 used for sandwiching the first tube T1 when joining, and a second tube T2 used for sandwiching the second tube T2 when joining. Two tube sandwiching portions 52 are arranged.

  The first tube sandwiching portion 51 has a first protrusion 51A and a second protrusion 51B. As shown in FIG. 7, the first protrusion 51A and the second protrusion 51B have a sandwiching interval SD for sandwiching the first tube T1 and the second tube T2 between the protrusions 51A and 51B so as not to be crushed. It is arranged facing each other so as to be formed.

  The second tube sandwiching portion 52 has a first protrusion 52A and a second protrusion 52B. As shown in FIG. 7, the first protrusion 52A and the second protrusion 52B have a sandwiching interval SD for sandwiching the first tube T1 and the second tube T2 between the protrusions 52A and 52B so as not to be crushed. It is arranged facing each other so as to be formed.

  In the state where the clamp lid 3 is closed, each of the first protrusion 51A and the second protrusion 51B of the first tube sandwiching part 51 provided in the housing side clamp part 50 is a recess 37A provided on the clamp plate 30 side. , 37B. Similarly, the first protrusion 52A and the second protrusion 52B of the second tube sandwiching part 52 provided in the housing side clamp part 50 are respectively stored in the recesses 36A and 36B provided on the clamp plate 30 side. The

  Between the 1st tube clamping part 51 and the 2nd tube clamping part 52, the 2nd tube pressing member 53 used in order to hold down the 2nd tube T2 at the time of joining is arrange | positioned.

  The second tube pressing member 53 is provided in the housing-side clamp portion 50 so as to correspond to the first tube pressing member 35 on the clamp plate 30 side. The first tube pressing member 35 and the second tube pressing member 53 each have a semicylindrical space. As shown in FIG. 1, in a state where the clamp lid portion 3 is closed, the second tube pressing member 53 provided on the housing side clamp portion 50 and the first tube pressing member 35 provided on the clamp plate 30 side overlap. . When overlapped, the first tube pressing member 35 and the second tube pressing member 53 form a cylindrical space between the two members that can accommodate the first tube T1 and the second tube T2.

  The first tube pressing member 35 and the second housing member 37 can be configured as an integrated member. Similarly, the 2nd tube pressing member 53 and the 1st tube clamping part 51 can be comprised with the integrated member.

  Here, as shown in FIG. 7, for example, a gear 55 can be formed around the first tube pressing member 35 and the second tube pressing member 53. The gear 55 is configured to mesh with a gear 56G of a clamp motor 56 that drives an operation of replacing the positions of the ends of the tubes T1 and T2 after the tubes T1 and T2 are melted.

  When the clamp motor 56 is operated by a command from the control unit 100 (see FIG. 11) to rotate the gear 56G, the first tube pressing member 35 and the second tube pressing member 53 are connected to the second housing member 37. The first tube sandwiching portion 51 rotates in the normal direction by 180 degrees or in the reverse direction by 180 degrees in a state where the first tube sandwiching portion 51 is integrated. While this rotation is performed, the melted first tube T1 and second tube T2 are held by the first tube pressing member 35 and the second tube pressing member 53. Then, the position of the end portion of the first tube T1 after the fusing and the position of the end portion of the second tube T2 are reversed up and down by 180 degrees (see FIG. 18C). Thereby, before the fusing, the second tube T2 is located on the upper side, the first tube T1 is located on the lower side, and after fusing, the melted end of the first tube T1 is located on the upper side, The melted end of the second tube T2 is located on the lower side.

  As shown in FIG. 7, a wafer insertion gap 57 into which the wafer W is movably inserted is formed between the second tube pressing member 53 and the second tube sandwiching portion 52.

  FIG. 8 is a perspective view showing the internal structure of the clamp lid part 3 and the internal structure of the housing side clamp part 50 as seen from another angle.

  The first housing member 36 of the clamp lid portion 3 and the second tube sandwiching portion 52 of the housing side clamp portion 50 constitute a fixed clamp unit 71 for sandwiching and fixing the two tubes T1 and T2. With respect to the fixed clamp unit 71, the first tube pressing member 35 and the second housing member 37 of the clamp lid portion 3, and the second tube pressing member 53 and the first tube sandwiching portion 51 of the housing side clamp portion 50 are used. Thus, a movable clamp unit 72 is configured.

  The movable clamp unit 72 and the fixed clamp unit 71 sandwich and fix two tubes T1 and T2. Then, after fusing, the movable clamp unit 72 rotates the two tubes T1 and T2 by 180 degrees with respect to the fixed clamp unit 71 which is a fixed portion. This rotation operation is driven by the clamp motor 56 as described above.

  As shown in FIG. 8, slope portions 2 </ b> P and 2 </ b> R are formed on the left and right positions of the upper surface 2 </ b> F of the housing 2. For example, a display label 2X indicating that the first tube T1 on the dialysate bag side is inserted is attached to the slope portion 2P. On the other hand, a display label 2Y indicating that the second tube T2 on the stomach side of the patient is inserted is attached to the slope portion 2R.

  As shown in FIGS. 6 and 8, a take-out port 58 through which the wafer WF used for fusing is communicated with the inside and outside of the housing 2 is provided near the operation panel portion 7 of the housing 2. . The outlet 58 is disposed on an extension of a gap 57 (see FIG. 7) formed between the second tube pressing member 53 and the second tube sandwiching portion 52. Since the take-out port 58 is thus provided on the extended line of the gap 57 through which the wafer WF passes, the user can easily take out the wafer WF guided to the take-out port 58 with his / her finger.

  As shown in FIG. 8, a circular hole 59 is formed in the vicinity of the take-out port 58. Further, a rod-shaped interlock 60 is disposed in the circular hole 59.

  The interlock 60 is constituted by a rod of an electromagnetically driven solenoid 61, for example. The solenoid 61 ascends from the state indicated by the broken line in FIG. 8 in the Z1 direction indicated by the solid line in response to a command transmitted from the control unit 100. The front end portion of the clamp operation unit 31 is pressed by the raised interlock 60. As a result, for example, while the two tubes T1 and T2 are melted and joined, it is possible to more reliably maintain the closed state so that the clamp lid 3 does not open.

  The solenoid detection sensor 89 shown in FIG. 8 can be configured by, for example, a photocoupler having a light emitting unit 89A that emits light 89L and a light receiving unit 89B that can receive the light 89L. The solenoid detection sensor 89 detects the open / closed state of the clamp lid 3. The detection result is transmitted to the control unit 100 (see FIG. 11).

  FIG. 9 is an enlarged perspective view showing the internal structure of the clamp lid part 3 and the internal structure of the housing side clamp part 50 shown in FIG.

  As shown in FIG. 9, a bottom portion formed at a position lower than each of the protrusions 52A and 52B is provided between the first protrusion 52A and the second protrusion 52B of the second tube sandwiching portion 52. A circular hole 74 is formed at the bottom. And the tube detection pin 75 for detecting the set state of each tube T1, T2 is arrange | positioned at the circular hole part 74. As shown in FIG.

  When each of the tubes T1 and T2 is fitted into a fitting groove 51C formed between the first protrusion 51A and the second protrusion 51B and a fitting groove 52C formed between the first protrusion 52A and the second protrusion 52B, The tube detection pin 75 is pushed in a direction orthogonal to the paper surface of FIG. The tube detection pin 75 detects that each of the tubes T1 and T2 has been correctly fitted based on the force received when being pressed. As shown in FIG. 14, the distal end portion 75A of the tube detection pin 75 is configured as a portion for receiving two tubes T1 and T2. A magnet 91 is attached to the rear end portion 75B of the tube detection pin 75. Between the rear end portion 75B of the tube detection pin 75 and the housing 2, a spring 92 for pushing up the tube detection pin 75 in the Z1 direction is disposed.

  FIG. 10 is a perspective view showing a schematic arrangement example of the components arranged in the housing 2 of the tube bonding apparatus 1.

  As shown in FIG. 10, in the housing 2, a main substrate 80, a DC input substrate 81, a wafer cassette storage unit 82, a wafer feed unit 83, a fixed clamp unit 71, a movable clamp unit 72, A solenoid 61, a speaker SP, a fan FN, and a battery BA are accommodated.

  For example, the DC input board 81 is preferably arranged at a position as far as possible from the main board 80. This is to prevent noise from the DC input board 81 from affecting the circuit elements mounted on the main board 80.

  Next, the function of the control unit 100 of the tube bonding apparatus 1 will be described with reference to FIG. FIG. 11 shows an electrical block of the tube joining apparatus 1.

  As shown in FIG. 11, the tube joining apparatus 1 includes a control unit 100 that comprehensively controls the operation of each unit of the apparatus. The control unit 100 includes a CPU such as a microcomputer, a ROM for storing a control program for the entire apparatus executed by the CPU and various data, and a RAM for temporarily storing measurement data and various data as a work area. .

  The control unit 100 receives power supply from the battery BA on the DC input board 81 side. The DC input board 81 has a jack 84 and a changeover switch 85. The jack 84 is connected to the connection pin 86P of the charger 86, thereby receiving a predetermined DC power source obtained by AC / DC conversion from the commercial AC power source. The charger 86 and the jack 84 are also shown in FIG.

  The changeover switch 85 shown in FIG. 11 connects the jack 84 and the battery BA. The DC power source from the charger 86 is used for charging the battery BA. The DC power charged in the battery BA is supplied to the control unit 100.

  As shown in FIG. 11, a temperature sensor 87 such as a thermistor is electrically connected to the control unit 100. The temperature sensor 87 detects the ambient temperature (outside air temperature) around the housing 2 and supplies outside air temperature information TF to the control unit 100. The controller 100 refers to the outside air temperature information TF when heating the tubes T1 and T2. For example, when each outside air temperature is lower than a predetermined temperature, the controller 100 heats the two tubes T1 and T2. Processing such as lengthening the time is executed. In addition, the control unit 100 performs operation control so as to notify the patient of the environmental temperature through the speaker SP, for example.

  As shown in FIG. 11, the [power switch] button 7B, the [join] button 7E, and the lamps 7C, 7D, 7F, and 7G of the operation panel unit 7 shown in FIG. Is electrically connected.

  As shown in FIG. 11, the speaker SP is electrically connected to the control unit 100 via the voice synthesis unit 88. The speaker SP utters voice guidance or the like that is determined in advance by a command from the control unit 100.

  The volume adjustment volume 22 and the voice message changeover switch 23 are electrically connected to the control unit 100. When the voice message selector switch 23 is “present”, voice guidance can be issued from the speaker SP, and when the voice message selector switch 23 is “none”, a buzzer (not shown) can be sounded.

  As shown in FIG. 11, the [close cover] lamp 8B, the [wafer cassette replacement] lamp 8C, the [wafer defect] lamp 8D, and the [required charge] of the display unit 8 shown in FIG. The lamp 8E, the [room temperature inappropriate] lamp 8F, and the [apparatus failure] lamp 8G are configured to be lit or blinking according to a command from the control unit 100.

  As shown in FIG. 11, the solenoid 61 of the interlock 60 shown in FIG. 8 operates according to a command from the control unit 100. Specifically, as illustrated in FIG. 8, when the interlock 60 of the solenoid 61 is at the lower end position 60 </ b> L, the interlock 60 blocks light 89 </ b> L from the light emitting unit 89 </ b> A as indicated by a broken line. The unit 89B transmits a “signal that the clamp lid unit 3 is not interlocked” to the control unit 100. On the other hand, when the interlock 60 of the solenoid 61 is at the upper end position 60H, the interlock 60 does not block the light 89L from the light emitting unit 89A as indicated by the solid line, so that the light receiving unit 89B includes the control unit 100. “A signal indicating that the clamp lid 3 is interlocked” is transmitted. Thereby, the control unit 100 grasps the locked state or the unlocked state of the clamp lid unit 3.

  As illustrated in FIG. 11, the hall sensor 90 of the housing-side clamp unit 50 is electrically connected to the control unit 100 and configured to transmit a detection result to the control unit 100. As shown in FIGS. 9 and 14, when the first tube T1 and the second tube T2 are sequentially fitted in the fitting groove 52C between the first projection 52A and the second projection 52B, the tube T1 and the tube T2 The tube detection pin 75 is pushed in the Z2 direction against the force of the spring 92. Since the tube detection pin 75 is lowered by this pushing, the magnetic force of the magnet 91 is detected by the hall sensor 90. The hall sensor 90 then transmits a signal notifying the controller 100 that “the two tubes T1 and T2 have been correctly fitted”. If the tubes T1 and T2 are not sufficiently fitted in the fitting groove 52C, or only one of the tubes is fitted, the Hall sensor 90 cannot detect the magnetic force of the magnet 91. At this time, the hall sensor 90 transmits a signal to notify the control unit 100 that “the two tubes T1 and T2 are not properly fitted”.

  As shown in FIG. 11, the housing-side clamp unit 50 includes a micro switch 93. The micro switch 93 is a sensor that detects the open / close state of the clamp lid 3. As shown in FIG. 1, when the micro switch 93 is held around the center axis CL in the direction of the arrow RS by holding the clamp operating portion 31 of the clamp lid portion 3 with a finger as shown in FIG. It is detected that the plate 30 has closed the housing side clamp part 50. As the micro switch 93, for example, when the housing side clamp unit 50 is closed, a mechanical sensor that detects that the housing 2 is closed by contact with an arbitrary position of the housing 2, or the housing side It is possible to use a known sensor such as an electric sensor that detects the closing based on the position of the clamp unit 50.

  As shown in FIG. 11, the wafer cassette storage unit 82 includes a wafer presence / absence sensor 101 and a wafer remaining amount detection sensor 102. Wafer presence / absence sensor 101 is a sensor that detects whether or not wafer WF remains in wafer cassette WC shown in FIG. The remaining wafer detection sensor 102 is a sensor that detects how many wafers WF are left in the wafer cassette WC shown in FIG. 1, that is, the remaining number of wafers WF. As the wafer presence / absence sensor 101 and the wafer remaining amount detection sensor 102, for example, a known photosensor or the like can be used.

  A wafer feeding unit 83 shown in FIG. 11 is a unit for linearly moving the wafer WF in the wafer cassette WC to a predetermined standby position PS1. The wafer feed unit 83 includes a motor 103, a motor drive 104, a forward end sensor 105, an intermediate sensor 106, and a reverse end sensor 107. Upon receiving a command from the control unit 100, the motor drive 104 drives the motor 103 to linearly move the wafers in the wafer cassette WC one by one to the standby position PS1. The details of the wafer feeding unit 83 will be described later.

  As shown in FIG. 11, the controller 100 is electrically connected to each of the wafer heater 110, the motor drive 111, the cam motor sensor 112, the clamp motor sensor 113, the wafer current detector 115, the wafer voltage detector 116, and the fan FN. It is connected to the. When the motor drive 111 receives a command from the control unit 100, the motor drive 111 drives the cam motor 117 and the clamp motor 56 in order to blow and join the tubes T1 and T2.

  A cam motor 117 shown in FIG. 11 performs an operation of moving the wafer WF up and down and an operation of bringing two tubes together. The operation of moving the wafer WF up and down performed by the cam motor 117 is an operation of raising the wafer WF from the standby position PS1 to the fusing position PSm positioned above it, and conversely lowering the wafer WF from the fusing position PSm to the standby position PS1. (See FIGS. 21 and 22). The cam motor 117 performs an operation of bringing the tubes T1 and T2 together after fusing the two tubes T1 and T2. This close-up operation means that after the wafer WF is lowered from the fusing position PSm to the standby position PS1, the end where the fusing of the first tube T1 and the end of the fusing of the second tube T2 are fused are connected to the other tube. It is the operation | movement which press-bonds by bringing near to the edge part which melted | melted. An example of the operation of the cam motor 117 will be described later.

  The clamp motor 56 performs a 180 degree rotation of the movable clamp unit 72 illustrated in FIG. 7 and a return rotation after the 180 degree rotation.

  The cam motor sensor 112 is composed of, for example, a photo sensor that detects a cam position and an origin. The clamp motor sensor 113 is configured by, for example, a photo sensor that detects an origin when the movable clamp unit 72 is rotated.

  Wafer heater 110 is provided to heat the wafer according to a command from control unit 100. During energization, the wafer current detector 115 detects the wafer current value supplied to the wafer. Further, the wafer voltage detection unit 116 detects the wafer voltage value supplied to the wafer.

  Next, the wafer cassette storage unit 82 and the wafer cassette WC will be described with reference to FIGS.

  FIG. 12 shows the wafer cassette insertion part 20 of the housing 2, the peripheral part of the wafer cassette eject button 21, and the wafer cassette WC. FIG. 13A is a perspective view showing the lower surface side of the wafer cassette WC, and FIG. 13B is a perspective view showing the upper surface side of the wafer cassette WC.

  The wafer cassette insertion part 20 and the wafer cassette takeout button 21 are arranged in the wafer cassette storage unit 82 shown in FIG.

  As shown in FIG. 12A, the upper surface 120 of the wafer cassette WC is provided with an arrow 21Y indicating the insertion direction. The user inserts the wafer cassette WC into the wafer cassette insertion portion 20 as shown in FIG. Thereafter, when the wafer WF is used up, and the wafer WF in the wafer cassette WC disappears, the user presses the wafer cassette take-out button 21 with a finger as shown in FIG. 12C to remove the empty wafer cassette WC. It can be taken out from the wafer cassette insertion portion 20.

  As shown in FIGS. 13A and 13B, the wafer cassette WC is configured as a container for accommodating a plurality of wafers WF. The wafer cassette WC is preferably made of a transparent plastic so that the internal wafer WF can be visually confirmed.

  Wafer cassette WC includes upper surface portion 120, bottom surface portion 121, front surface portion 122, side surface portions 123 and 124, and back surface portion 125.

  Wafers WF are arranged one by one inside the front portion 122. Then, as shown in FIG. 13B, by pushing the pushing member 126 against the wafer WF in the Y1 direction, one wafer WF is moved from the inside of the wafer cassette WC one by one along the Y1 direction. And pushed to a predetermined standby position PS1. Details of the movement operation of the wafer WF will be described later.

  As shown in FIGS. 13A and 13B, two springs 128 and a spring receiving member 129 are accommodated in the wafer cassette WC. One end of each of the two springs is supported on the inner surface of the back surface portion 125 of the wafer cassette WC. On the other hand, the other end portions of the two springs are supported by a spring receiving member 129. The spring receiving member 129 has a misalignment preventing portion 130 for preventing the springs 128 from shifting.

  The two springs 128 press the plurality of wafers WF against the inner surface of the front portion 122 via the spring receiving member 129. When each wafer WF is held by the two springs 128 and the pushing member 126 is pressed in the Y1 direction against the wafer WF located on the front portion 122 side, one wafer WF located on the outermost side. Only the wafer cassette WC is taken out along the Y1 direction.

  As shown in FIG. 13A, a wafer WF used as a cutting member is a copper metal plate (thickness: formed in a substantially rectangular shape) that can be heated by a wafer heater 110 (see FIGS. 11 and 14). About 0.3 mm, width: about 34 mm, height about 13 mm). The wafer WF has two contact points 131 connected to the wafer heater 110 when heated.

  Next, the tube set auxiliary tool 4 will be described.

  The tube set auxiliary tool 4 can be attached to the housing 2 as needed by the user. The tube setting auxiliary tool 4 has a guide function for ensuring that the user can reliably hold the two tubes T1 and T2 in the housing 2 as shown in FIG. Yes. As shown in FIG. 12C, when the user holds the two tubes T1 and T2 in a sandwiched manner, the user can easily and quickly perform the work.

  As shown in FIGS. 2, 3, and 4, the tube setting auxiliary tool 4 includes a first side portion 135, a second side portion 136, and a back surface connection portion 137.

  As shown in FIG. 2, the first side portion 135 has a claw portion 135A and branch portions 135B and 135C. The claw portion 135 </ b> A is configured to be attachable to the peripheral portion of the operation panel portion 7 of the housing 2.

  As shown in FIG. 3, the second side portion 136 has a claw portion 136A, branch portions 136B and 136C, and a U-shaped receiving portion 138 for receiving a tube. The claw portion 136 </ b> A is configured to be attachable to the peripheral portion of the operation panel portion 7 of the housing 2. As shown in FIG. 12C, the receiving part 138 receives two tubes T1 and T2. In addition, as shown in FIG. 3, by providing a space between the branching part 136B and the branching part 136C, the volume adjustment volume 22 can be exposed, and the user can easily operate the volume adjustment volume 22. Yes.

  As shown in FIG. 4, the back surface connection part 137 of the tube setting auxiliary tool 4 has a first connection part 137A and a second connection part 137B. An opening 137C through which the installation member 2G is passed is formed in the first connection portion 137A. The second connecting portion 137B is provided with a protrusion 137D that matches the height of the installation member 2G. Thereby, the housing | casing 2 can be installed in the state which floated only the predetermined space | interval, for example with respect to the desk surface etc. with the four installation members 2G and the two protrusion parts 137D.

  Between the first connecting portion 137A and the second connecting portion 137B of the tube setting auxiliary tool 4, the sound opening 5 and the exhaust opening 6 are exposed, and the exhaust opening of the fan FN which is an exhaust device. 6A and the opening part 144 which open | releases the audio | voice opening part 5A for speaker SP are formed. For this reason, the fan FN can reliably release the gas and heat inside the housing 2 to the outside of the housing 2 through the opening 6. In addition, since the voice guidance, warning sound, etc. generated by the speaker SP can be reliably output to the outside of the housing 2 through the opening 5, it is easy to hear without any voice guidance, warning sound, etc.

  Next, with reference to FIG. 14, the positional relationship between the fan FN, the two tubes T1 and T2 in the housing-side clamp unit 50, and the wafer WF will be described.

  FIG. 14 schematically shows a state before and after cutting the tubes T1 and T2 fixedly held by the clamp lid portion 3 and the housing-side clamp portion 50 with the wafer WF sent out from the wafer cassette WC.

  The wafer WF is fed from the wafer cassette WC in the Y1 direction by operating the moving mechanism 500 (see FIG. 20) provided in the wafer feeding unit 83 shown in FIG. 10, and is placed at the standby position PS1.

  As shown in FIG. 14, when the wafer WF is disposed at the standby position PS1, the two contact points 131 of the wafer WF are connected to the wafer heater 110. Then, the wafer heater 110 generates heat by energizing the contact point according to a command from the control unit 100. The wafer WF is heated by this heat generation. A fan FN is arranged below the heated wafer WF.

  When the tubes T1 and T2 are melted, the tubes T1 and T2 are fitted in the fitting grooves 51C and 52C shown in FIG. 9 while being stacked in the Z2 direction. Then, as shown in FIG. 14, when the wafer WF is raised from the standby position PS1 to the fusing position PS2, the two tubes T1 and T2 are fused by the wafer WF. At this time, the plasticizer which is a constituent material of the two tubes T1 and T2 is vaporized to generate gas. The gas is discharged to the outside of the housing 2 from the exhaust opening 6 of the bottom surface portion 2A along the discharge path indicated by the arrow MY by the fan FN that is rotationally driven. For this reason, even if a plastic product or the like is placed in the vicinity of the housing 2, the plasticizer gas is not directly blown against the plastic product, so that there is no adverse effect such as a part of the plastic product melting. .

  Next, with reference to FIGS. 16-19, the operation | work process which joins two tube T1, T2 is demonstrated. 16 and 17 are diagrams schematically showing a process of setting the tubes T1 and T2 in the tube joining apparatus 1, and FIGS. 18 and 19 schematically show a flow of fusing-joining work by the tube joining apparatus 1. FIG.

  In starting the fusing operation by the tube joining apparatus 1, the interlock 60 is in a state of being retracted and stored in the housing 2 (a state indicated by a broken line in FIG. 8). First, the user grasps the clamp operation unit 31 of the tube joining apparatus 1 and lifts it in the direction of the arrow RT shown in FIG. Then, as shown in FIG. 6, the clamp lid portion 3 is separated from the housing side clamp portion 50, and the housing side clamp portion 50 is opened to the outside.

  Next, as shown in FIG. 16A, a tube T1 is prepared. Then, as shown in FIG. 16B, the joining portion C1 of the tube T1 is fitted into the fitting groove 51C and the fitting groove 52C of the housing side clamp part 50 (see also FIG. 9). At this time, the first tube T1 is fitted in the X1 direction from the fitting groove 52C side. By this operation, the portion of the tube T1 on the connector CT side is disposed on the U-shaped receiving portion 138 of the tube setting auxiliary tool 4, and the connector CT is positioned outside the receiving portion 138.

  Next, as shown in FIG. 16C, a second tube T2 to be joined to the first tube T1 is prepared. In addition, as the 2nd tube T2, what has the junction part 141 already formed in the case of the last joining can be used before the said joining operation | work, for example. The cross section of the joint 141 is formed in a circular shape.

  Next, as shown in FIG. 17A, the second tube T2 is stacked on the upper side of the first tube T1. The second tube T <b> 2 is set so that the joint portion 141 of the tube T <b> 2 is aligned with the tip of the positioning protrusion 140 provided on the housing-side clamp unit 50.

  The second tube T2 is fitted into the fitting grooves 51C and 52C of the housing side clamp part 50. At this time, the second tube T2 is fitted in the X2 direction from the fitting groove 51C side. Accordingly, as shown in FIG. 17B, the second tube T2 is stacked along the Z1 direction on the upper side of the first tube T1. In this state, the tubes T1 and T2 are pushed in the direction of the arrow RZ to be securely fixed in the fitting grooves 51C and 52C.

  Next, the user performs an operation of closing the clamp lid portion 3 in the opened state as shown in FIG. When the clamp operation part 31 is grasped and the clamp lid part 3 is rotated along the RS direction shown in FIG. 6, the clamp lid part 3 is closed. Accordingly, as shown in FIG. 18A, the tubes T1 and T2 are disposed between the first tube sandwiching portion 51 and the second housing member 37, and between the second tube sandwiching portion 52 and the first housing member. 36, respectively.

  Then, the wafer WF is moved from the wafer cassette WC to the standby position PS1 positioned below the tubes T1 and T2, as shown in FIG. 18B. At this time, the wafer WF is heated to, for example, about 300 ° C. by the heating of the wafer heater 110 shown in FIG. The heated wafer WF is raised along the Z1 direction from a standby position PS1 indicated by a broken line to a fusing position PSm indicated by a solid line, as shown in FIG. 18B, by an operation of a cam motor 117 described later. As a result, the tubes T1 and T2 are fused by the wafer WF.

  Subsequently, as shown in FIG. 18C, the clamp motor 56 shown in FIG. 7 is operated by a command from the control unit 100, and the clamp motor 56 rotates the gear 56G. Then, the 1st tube pressing member 35 comprised integrally with the 2nd accommodating member 37, and the 2nd tube pressing member 53 comprised integrally with the 1st tube clamping part 51 are the 1st tube. While holding T1 and the second tube T2, rotate 180 degrees. As a result, the melted end of the first tube T1 is disposed on the upper side, and the melted end of the second tube T2 is disposed on the lower side.

  Next, as shown in FIG. 18D, the wafer WF is lowered from the fusing position PSm to the standby position PS1 along the Z2 direction, and the tubes T1 and T2 positioned on the side rotated 180 degrees are moved in the X2 direction. Pressed. As a result, one end of the first tube T1 that is melted by the wafer WF and is located on the side rotated by 180 degrees is the other end of the second tube T2 that is located on the non-rotated side. To be bonded with pressure. In addition, one end of the second tube T2 that is melted by the wafer WF and is rotated 180 degrees is connected to the other end of the first tube T1 that is positioned on the non-rotated side. On the other hand, it is pressed and joined. Next, the tubes T1 and T2 are cooled to complete the joining.

  After the bonding is completed, the used wafer WF used for fusing is discharged to the take-out port 58 by the moving mechanism 500 described later. The user can pick up the used wafer WF with a finger and take it out from the take-out port 58.

  Thereafter, the user grasps the clamp operation unit 31 and lifts it in the direction of the arrow RT shown in FIG. Then, as shown in FIG. 6, the clamp lid 3 is separated from the housing-side clamp 50. A user removes each tube T1, T2 after joining as shown to FIG. 19 (A), (B) from the housing side clamp part 50, and isolate | separates it. As described above, the tube T1 on the dialysate bag BL side shown in FIG. 15 and the tube T2 on the user M side can be joined aseptically and simply.

  Next, a moving mechanism 500 that moves the wafer WF accommodated in the wafer cassette WC to the standby position PS1 and the discharge position PS2 will be described with reference to FIG. FIG. 20 is a plan view of the moving mechanism 500 and the wafer cassette storage unit 82.

  A moving mechanism 500 shown in FIG. 20 is located in the wafer feeding unit 83 in the housing 2 and is arranged in the vicinity of the wafer cassette storage unit 82 and the take-out port 58.

  As described above, the wafer cassette WC is stored in the wafer cassette storage unit 82. The moving mechanism 500 pushes the unused wafers WF in the wafer cassette WC one by one in the Y1 direction and sends them to the standby position PS1. Furthermore, the moving mechanism 500 moves the used wafer WF used for fusing to the take-out port 58. In the following description, for convenience, a wafer before being used for fusing is referred to as an unused wafer WF1, a wafer used for fusing is referred to as a used wafer WF2, and these wafers are collectively referred to as a wafer WF.

  As shown in FIG. 20, the moving mechanism 500 includes a wafer moving operation unit 501, a wafer feed position detecting unit 502, and a holder unit 503. The wafer movement operation unit 501 is provided along the Y1 direction at a position facing the wafer cassette storage unit 82.

  The structure of the wafer movement operation unit 501 will be described.

  The wafer movement operation unit 501 includes a moving body (slider) 510, a first base 511, a second base 512, a feed screw 513, a guide bar 514, and a motor 103. The first base portion 511 and the second base portion 512 are erected in the Z1 direction on the bottom chassis 2N of the housing 2 so as to face each other with a gap therebetween.

  The guide bar 514 is a thin member having a circular cross section that is fixed between the first base portion 511 and the second base portion 512. One end of the feed screw 513 is rotatably attached to the first base 511, and the other end of the feed screw 513 is rotatably attached to the second base 512. A gear 515 is attached to one end of the feed screw 513. The gear 515 meshes with another gear 516 fixed to the output shaft of the motor 103. When the control unit 100 gives a command to the motor drive 104, the motor 103 rotates the feed screw 513 in the reverse direction to the normal direction via the gears 515 and 516.

  The feed screw 513 and the guide bar 514 are provided along the Y1 direction and are arranged in parallel to each other. The moving body 510 has a female screw portion 517 and a cylindrical receiving member 518. The feed screw 513 is engaged with the female screw portion 517, and the guide bar 514 passes through the receiving member 518.

  The moving body 510 has a position indicating member 520 and a pressing member 530. The position indicating member 520 faces the X1 direction, and the pressing member 530 faces the Y1 direction.

  The pressing member 530 is configured by a plate-shaped metal member extending in a plane along the Y1 direction and the Z1 direction. The thickness is configured to be slightly thinner than the thickness of wafer WF (about 0.3 mm). Further, the pressing member 530 is disposed so as to protrude from the moving body 510 in the Y1 direction. The pressing member 530 is attached at a position close to the wafer cassette storage unit 82 of the moving body 510.

  As the moving body 510 moves in the Y1 direction, the pressing member 530 of the moving body 510 linearly moves the unused wafers WF1 one by one along the Y1 direction from the cassette WC stored in the wafer cassette storage unit 82. Send out.

  The holder part 503 shown in FIG. 20 is arranged on the extension line of the pressing member 530 along the Y1 direction. The holder 503 guides the wafer WF1 in the Y1 direction and positions it at the standby position PS1 while supporting the lower end surface of the wafer WF1 pushed out in the Y1 direction from the wafer cassette WC. For this reason, the holder part 503 has a groove having a U-shaped cross section, and the groove width is slightly larger than the thickness (about 0.3 mm) of the wafer WF1. The holder unit 503 also has a function of guiding the used wafer WF2 to the take-out port 58.

  Next, the wafer feed position detection unit 502 of the moving mechanism 500 will be described.

  The wafer feed position detection unit 502 includes three sensors: a forward end sensor 105, an intermediate sensor 106, and a reverse end sensor 107. Each of these sensors 105, 106, and 107 can be configured by, for example, a known photosensor.

  As shown in FIG. 20, the forward end sensor 105 includes a light emitting unit 105A that generates light 105L and a light receiving unit 105B that receives the light 105L. The intermediate sensor 106 includes a light emitting unit 106A that generates the light 106L and a light receiving unit 106B that receives the light 106L. The reverse end sensor 107 includes a light emitting unit 107A that generates light 107L and a light receiving unit 107B that receives the light 107L.

  The light emitting part 105A of the forward end sensor 105, the light emitting part 106A of the intermediate sensor 106, and the light emitting part 107A of the backward end sensor 107 can be constituted by, for example, infrared light emitting diodes. Further, the light receiving unit 105B of the forward end sensor 105, the light receiving unit 106B of the intermediate sensor 106, and the light receiving unit 107B of the backward end sensor 107 can be configured by, for example, phototransistors. In addition, the light emitting unit 105A and the light receiving unit 105B, the light emitting unit 106A and the light receiving unit 106B, and the light emitting unit 107A and the light receiving unit 107 can be configured by, for example, an integrated reflective photosensor molded in a small resin. . Note that the forward end sensor 105, the intermediate sensor 106, and the reverse end sensor 107 can be configured by, for example, a transmissive photosensor.

  The light 105L generated by the light emitting unit 105A of the advance end sensor 105 is reflected by the position indicating member 520 and received by the light receiving unit 105B when the position indicating member 520 of the moving body 510 reaches the advance end position PM1. . Similarly, the light 106L generated by the light emitting unit 106A of the intermediate sensor 106 is reflected by the position indicating member 520 and received by the light receiving unit 106B when the position indicating member 520 of the moving body 510 reaches the intermediate position PM2. Is done. Similarly, the light 107L generated by the light emitting portion 107A of the reverse movement end sensor 107 is reflected by the position indication member 520 when the position indication member 520 of the moving body 510 reaches the reverse movement end position PM3, thereby receiving light. The light is received by the unit 107B.

  When the light receiving unit 105B of the forward end sensor 105, the light receiving unit 106B of the intermediate sensor 106, and the light receiving unit 107B of the backward end sensor 107 receive the lights 105L, 106L, and 107L, respectively, the received light signals 105S, 106S, and 107S are controlled by the control unit. 100. Thereby, the control unit 100 can confirm the position of the position indicating member 520 of the moving body 510 in the Y1 direction, that is, the pushing position of the wafer WF in the Y1 direction.

  Next, the wafer WF positioning operation by the moving mechanism 500 will be described.

  As described above, when joining the tubes T1 and T2 using the tube joining apparatus 1, the user opens the clamp lid portion 3 as shown in FIG. And each tube T1, T2 is set to the housing | casing side clamp part 50. FIG.

  In addition, as a preparatory work before starting the bonding, a work of setting the wafer cassette WC in the wafer cassette storage unit 82 is performed. As shown in FIG. 20, at the stage where the wafer cassette WC is set, the moving body 510 of the wafer moving operation unit 501 provided in the moving mechanism 500 is positioned at the reverse drive position PM3. Thereby, the rear end portion 530R of the wafer WF1 stored in the wafer cassette WC is disposed at a position where it abuts against the front end portion 530T of the pressing member 530 of the wafer moving operation unit 501 provided in the moving mechanism 500.

  When the control unit 100 gives a command to the motor drive 104, the motor 103 causes the feed screw 513 to rotate forward via the gears 515 and 516. Thereby, the moving body 510 starts linear movement in the Y1 direction along the guide bar 514. Then, the front end portion 530T of the pressing member 530 pushes the unused wafers WF1 in the wafer cassette WC one by one in the Y1 direction and positions them at the standby position PS1.

  When the unused wafer WF1 is sent to the standby position PS1 by the pressing member 530, the position indicating member 520 provided on the moving body 510 moves forward in the Y1 direction, so that the position of the position indicating member 520 is the reverse end sensor 107, intermediate The sensor 106 and the forward end sensor 105 are detected in this order. When the reverse end sensor 107, the intermediate sensor 106, and the forward end sensor 105 detect the position indicating member 520, the light receiving signals 107S, 106S, and 105S are sent to the control unit 100. Thereby, the control unit 100 can confirm the position of the position indicating member 520 of the moving body 510 in the Y1 direction, that is, the push-out position of the wafer WF1 in the Y1 direction.

  As shown in FIG. 20, when the unused wafers WF1 are pushed out one by one in the Y1 direction and positioned at the standby position PS1, the control unit 100 energizes the wafer heater 110. As a result, the wafer heater 110 energizes and heats the wafer WF through two contact points 131 (see FIG. 13A) provided on the wafer WF to raise the temperature to a predetermined temperature.

  Thereafter, the control unit 100 issues a command to the motor drive 111 shown in FIG. As a result, the cam motor 117 is driven, and the holder portion 503 on which the wafer WF1 is placed is pushed up in the Z1 direction. Then, the wafer WF1 is lifted from the standby position PS1 in the Z1 direction and positioned at the fusing position PSm. At this time, the two tubes T1 and T2 are fused. Details of the operation of the holder unit 503 will be described later.

  Next, the control unit 100 issues a command to the motor drive 111, drives the cam motor 117, and moves the holder unit 503 carrying the used wafer WF2 used for fusing from the fusing position PSm to the standby position PS1 Z2. Lower along direction.

  Next, as shown in FIG. 18C, when the first tube T1 and the second tube T2 are simultaneously rotated by 180 °, the melted end portion of the first tube T1 and the second tube T2 are melted. After the replaced end portions are replaced, the respective end portions are pressure bonded.

  The used wafer WF2 that has returned to the standby position PS1 is further moved in the Y1 direction by the pressing member 530 to be pushed out to the take-out port 58 (see FIGS. 1 and 6). Then, the user can pick up the used wafer WF2 with his / her finger so that the used wafer WF2 can be taken out from the casing 2 without dropping.

  After fusing the two tubes T1 and T2 and performing pressure bonding, when the control unit 100 gives a command to the motor drive 104 shown in FIG. 11 to reversely rotate the feed screw 513, the moving body 510 and the pressing member 530 moves linearly along the Y2 direction and returns to the reverse drive position PM3.

  Here, in the state in which the position indicating member 520 is detected by the backward movement sensor 107, the tip end portion 530T of the pressing member 530 has not started to push the unused wafer WF1, so that the unused wafer WF1 is not in the wafer cassette WC. From Y1 to Y1. Therefore, at this time, the wafer cassette WC can be taken out from the wafer cassette storage unit 82.

  On the other hand, in a state where the position indicating member 520 is detected by the intermediate sensor 106, the pressing member 530 and the unused wafer WF1 are hooked on the wafer cassette WC, so that the wafer cassette WC is taken out from the wafer cassette storage unit 82. I can't. Similarly, in a state where the position indicating member 520 is detected by the forward end sensor 105, the pressing member 530 is hooked on the wafer cassette WC, so that the wafer cassette WC cannot be taken out from the wafer cassette storage unit 82.

  As described above, since the reverse movement end sensor 107, the intermediate sensor 106, and the forward movement end sensor 105 are arranged at intervals from each other in the Y1 direction, the wafer cassette WC can be taken out from the wafer cassette storage unit 82. Timing can be detected. And the guidance which shows the timing which can take out this wafer cassette WC can be displayed on the display part 8 so that it may illustrate in FIG. 20, for example.

  The tube bonding apparatus 1 according to the present embodiment prevents the occurrence of a time-out error and a bonding failure caused by leaving a used wafer WF2 used for fusing as described later on the apparatus. It has a configuration capable of appropriately maintaining the posture of the used wafer WF2.

  In general, the tube joining apparatus 1 includes a housing 2 including a housing-side clamp unit 50 (corresponding to a holding unit) that holds the first tube T1 and the second tube T2, and the housing 2 includes a plurality of tubes 2. Wafer cassette storage unit 82 (corresponding to a storage unit) configured to be able to store the wafer WF and the first tube T1 and the second tube T2 held by the housing-side clamp unit 50 when the wafer is melted. The wafer WF stored in the wafer cassette storage unit 82 is moved to a standby position PS1 (corresponding to the first position) for waiting for the WF, and after the fusing operation, the discharge position PS2 from which the wafer WF can be taken out from the housing 2. A moving mechanism 500 for moving the used wafer WF2 used for fusing (corresponding to the second position), and a discharge position; In down PSm, the attitude of the used cutting member WF2, the cutting member WF2 has a posture holding portion 604 for holding the position when moved from the standby position PS1 to the discharge position PS2.

  As shown in FIGS. 21A and 21B, the posture holding unit 604 moves the cutting member WF sent to the standby position PS1 closer to and away from the first tube T1 and the second tube T2. The movable holder portion 503 is provided.

  The holder part 503 and the attitude | position holding | maintenance part 604 are demonstrated with reference to FIGS. FIG. 21 is a schematic perspective view of the holder portion 503, and FIGS. 22 to 24 are views showing the holder portion 503 in a simplified side view from the left side.

  FIG. 21 shows a state where the unused wafer WF1 is held in the holder portion 503 and the used wafer WF2 used for fusing is moved to the discharge position PS2 located on the front side of the holder portion 503. It is.

  As shown in FIGS. 21 and 22A, the holder portion 503 includes a main body portion 601 in which a U-shaped groove (not shown) on which the lower end surface of the unused wafer WF1 is placed, A support member 602 that supports the main body 601 to be movable up and down with respect to a predetermined position of the housing 2; a bearing 603 that is in contact with a cam 651 shown in FIG. The posture holding unit 604 described above is included.

  The main body portion 601 of the holder portion 503 is provided with a plurality of support portions 602a, 602b, and 602c that support the wafer WF1 placed on the main body portion 601 in an upright state. The support part 602a supports the wafer WF1 by sandwiching the tip part of the wafer WF1 between the support part 602b. The support portion 602c accommodates and holds the rear end portion of the wafer WF1. Although not shown in the drawing, a predetermined entry hole for allowing the wafer WF1 to enter the main body 601 by sliding movement is provided in the rear end 601R of the main body 601 of the holder 503. The unused wafer WF1 moved by the moving mechanism 500 described above is placed on the main body 601 through the entry hole.

  The posture holding unit 604 provided in the holder unit 503 is made of metal processed into a flat plate shape. The posture holding unit 604 is installed at the distal end 503F of the main body 601. The posture holding portion 604 is formed with a planar side surface portion 604a that comes into contact with the outer surface of the wafer WF2 to be held in posture. The posture holding unit 604 is only required to be configured to hold the used wafer WF2 in a predetermined posture as will be described later. To that extent, the material, the outer shape, the dimensions, the installation position, the installation The number is not particularly limited.

  As shown in FIG. 21, the used wafer WF2 is supported by the side surface portion 604a of the posture holding portion 604, so that the used wafer WF2 is almost the same as the wafer WF1 before use positioned at the standby position PS1 even in the discharge position PS2. Take the same attitude. In addition, since the posture holding unit 604 is disposed at the front end portion 601F of the main body unit 601, while the used wafer WF2 is supported by the posture holding unit 604, the rear end 530R of the used wafer WF2 is It is positioned so as to face the front end portion 530F of the unused wafer WF1. Furthermore, since the side surface portion 604a of the posture holding portion 604 contacts the outer side surface of the used wafer WF2, it is possible to prevent the used wafer WF2 from being displaced in the width direction (X1, X2 direction). The used wafer WF2 is aligned on the linear extension of the position PS1.

  The bearing portion 603 provided in the holder portion 503 slides along the outer surface of the cam 651 as the cam 651 shown in FIG. As the bearing portion 603 slides, the holder portion 503 moves up and down in a predetermined direction (Z1 and Z2 directions). When the holder 503 moves up in the Z1 direction at a predetermined timing due to the change in the surface shape of the cam 651, the tubes T1 and T2 are blown when the wafer WF reaches the fusing position PSm. When the cam 651 is rotated after the fusing is completed, the holder portion 503 is lowered in the Z2 direction at a predetermined timing due to a change in the surface shape of the cam 651, and the wafer WF is returned to the standby position PS1. As described above, the holder 503 holding the wafer WF moves up and down, so that the wafer WF moves toward and away from the tubes T1 and T2.

  The rotation operation of the cam 651 is performed based on a command transmitted from the control unit 100 to the cam motor 117. The control unit 100 controls the timing for rotating and stopping the cam 651, the rotation speed of the cam 651, and the like.

  In order to make it possible to accurately control the lifting and lowering operation of the holder unit 503 by the control unit 100, for example, a holder position detection sensor 661 as shown in FIG. 22 is provided. The holder position detection sensor 661 can be configured by a known sensor that can detect a contact / non-contact state with the posture holding unit 604 provided in the holder unit 503.

  When the posture holding unit 604 is in contact with the holder position detection sensor 661, it is detected that the holder unit 503 is in a lowered state, and when the posture holding unit 604 is not in contact with the holder position detection sensor 661, the holder unit It is detected that 503 is in the raised state. The detection result is transmitted to the control unit 100. The control unit 100 feedback-controls the rotation operation of the cam 651 based on the transmitted detection result. The configuration of the holder position detection sensor 661 is not particularly limited as long as the operation state of the holder unit 503 can be detected. For example, the holder position detection sensor 661 can be configured by a known photosensor or the like. In the illustrated example, the position of the holder 604 is detected by the lower end portion of the posture holding unit 604 being in contact-non-contact with the holder position detection sensor 661. You may comprise so that the operation state may be detected when parts other than a lower end part contact the holder position detection sensor 661.

  Next, an operation example in which the wafer WF is sent to the holder unit 503 and then sent to the takeout port 58 will be described with reference to FIGS. In the present embodiment, the discharge position PS2 at which the used wafer WF1 can be taken out from the tube bonding apparatus 1 is set near the take-out port 58. That is, the used wafer WF2 is held in such a manner that the used wafer WF2 takes a predetermined attitude when the used wafer WF2 is moved to the take-out port 58.

  As shown in FIG. 22A, when starting the fusing-joining operation of the two tubes T1, T2, an unused wafer WF1 is sent from the wafer cassette WC to the holder unit 503 by the moving mechanism 500 shown in FIG. It is done. The unused wafer WF1 is positioned at the standby position PS1 before starting fusing. At this time, the wafer WF1 is heated via the two contacts 131 provided on the wafer WF1.

  Next, as shown in FIG. 22B, a command is transmitted from the control unit 100 to the cam motor 117 to rotate the cam 651. When the cam 651 rotates, the holder portion 503 in contact with the cam 651 is lifted through the bearing portion 603. As a result, the wafer WF moves closer to the tubes T1 and T2 and is positioned at the fusing position PSm. When the holder portion 503 is lifted, the tubes T1 and T2 held above the holder portion 503 are fused by the wafer WF.

  Next, as shown in FIG. 23A, when the cam 651 is rotated again, a lowering operation in which the holder portion 503 moves away from the tubes T1 and T2 according to the surface shape of the cam 651 is started. The used wafer WF2 used for fusing is positioned at the standby position PS1.

  After the fusing-bonding operation is completed, an unused wafer WF1 is sent from the wafer cassette WC to the holder unit 503 by the moving mechanism 500 shown in FIG. At this time, as shown in FIG. 23B, the front end portion 530F of the unused wafer WF1 is abutted against the rear end portion 530R of the used wafer WF2. The unused wafer WF1 moves forward as it is in contact with the used wafer WF2. As a result, the used wafer WF 2 is sent out to the vicinity of the take-out port 58 through a predetermined transfer path 611 provided in the housing 2. The used wafer WF2 is held at the discharge position PS2 set near the take-out port 58 by the posture holding portion 604 provided in the holder portion 503 while the posture is sent from the standby position PS1. .

  As described above, the wafer WF is positioned at each position in the housing 2 and then moved to the take-out port 58.

  When the fusing-joining operation for another tube is continued after the fusing-joining operation is finished, the used wafer WF2 is removed from the take-out port 58, and then the [joining] shown in FIG. The button 7E is pressed by the user. When the [Join] button 7E is pressed, a fusing operation with an unused wafer WF1 sent from within the wafer cassette WC is started. Here, when the [bonding] button 7E is pressed and the fusing operation proceeds with the used wafer WF2 remaining in the take-out port 58, a problem such as the following comparison may occur.

  FIG. 25A shows a casing 902 of the tube joining apparatus according to the proportionality, and FIG. 25B shows a side view of the holder portion 903 according to the proportionality. Each figure shows a state in which the fusing operation has progressed with the used wafer WF2 left on the apparatus.

  As shown in FIGS. 25A and 25B, the used wafer WF2 is pushed out by the unused wafer WF1 and moves substantially linearly along a predetermined transfer path 906 in the housing 902. After the movement, if the posture is not held by the posture holding unit 604 or the like, it falls down in the housing 2 as indicated by an arrow d1 in FIG. When such a fall occurs, the used wafer WF2 is placed in an unintended place included in the movable range of the holder unit 903 (the range in which the holder unit 903 can move when the holder unit 903 is moved up and down). End up. When the fusing operation with the unused wafer WF1 proceeds in such a state, the holder portion 903 and the used wafer WF2 interfere with each other. In the illustrated example, a state in which the holder portion 903 during the downward movement indicated by the arrow d2 interferes with the used wafer WF2 is shown. When the holder 903 and the used wafer WF2 interfere with each other, problems such as a time-out error and bonding failure occur. The interference between the holder unit 903 and the used wafer WF2 can also occur during the ascending operation in which the holder unit 903 is lifted.

  In the tube joining apparatus 1 according to the present embodiment, the used wafer WF2 in the discharge position PS2 is placed by the attitude holding unit 604 provided in the holder unit 503 as shown in FIG. The posture is properly maintained. For this reason, even when the used wafer WF2 is left at the discharge position PS2, the used wafer WF2 does not inadvertently fall down, and the movable range of the holder portion 503, that is, the holder portion 503, is not affected. The used wafer WF2 is not placed at a position that hinders the operation. Accordingly, if the holder unit 503 moves up with the used wafer WF2 remaining at the discharge position PS2 as shown in FIG. 24A, or the holder 503 as shown in FIG. Even when the part 503 performs the lowering operation, the holder part 503 and the used wafer WF2 do not interfere with each other.

  As described above, according to the tube bonding apparatus 1 according to the present embodiment, when the used wafer WF2 used for fusing is at the discharge position PS2 where the wafer WF can be taken out from the apparatus, it moves to the discharge position PS2. Since the posture when held is held as it is by the posture holding portion 604, the used wafer WF2 does not take an inadvertent posture such as falling down at the discharge position PS2. For this reason, even when the fusing operation proceeds with the used wafer WF2 remaining at the discharge position PS2, interference between each part of the apparatus that is movable during the fusing operation and the used wafer WF2 is prevented. As a result, it is possible to prevent problems such as time-out errors and poor bonding caused by the remaining used wafer WF2 remaining at the discharge position PS2.

  In addition, the holder 503 for moving the wafer WF toward and away from the tubes T1 and T2 is provided with a posture holding unit 604. By holding the posture of the used wafer WF2, the holder 503 can be moved within a movable range. When the used wafer WF2 is configured to be prevented from being positioned at the same time, it is possible to suitably prevent interference between the holder portion 503 movable during the fusing operation and the used wafer WF2.

  In addition, since it further includes a holder position detection sensor 661 that detects the movable state of the holder unit 503 by contact-noncontact with the posture holding unit 604 provided in the holder unit 503, the posture holding unit 604 is in a movable state of the holder unit 503. Therefore, it is possible to suitably detect the movable state of the holder unit 503 while preventing the complicated configuration of the apparatus by providing the holder unit 503 with the detection end. Become.

  Further, the rear end 601R of the used wafer WF2 moved to the discharge position PS1 by the posture holding unit 604 is used so as to face the front end 601F of the unused wafer WF1 in the standby position PS1. When the attitude of the used wafer WF2 is maintained, the movement of the used wafer WF2 to the discharge position PS2 is caused to abut the front end 601F of the unused wafer WF1 against the rear end 601R of the used wafer WF2. Since it can be performed by extruding the unused wafer WF1 in the state, it is possible to smoothly and easily move the used wafer WF2 to the discharge position PS2.

  Further, the posture holding unit 604 holds the posture so that the used wafer WF2 is aligned on the linear extension of the standby position PS1 by contacting the outer surface of the used wafer WF2 moved to the discharge position PS2. In this case, since it becomes possible to more reliably align the rear end portion 530R of the used wafer WF2 and the front end portion 530F of the unused wafer WF1, the movement of the used wafer WF2 to the discharge position PS2 is possible. Can be performed more smoothly.

<Modification>
Next, a tube joining apparatus according to a modification will be described. In addition, about the member and structure which were already demonstrated, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

  In the tube bonding apparatus 1 according to the embodiment described above, the example in which the posture holding unit 604 that holds the posture of the used wafer WF2 is provided in the holder unit 503 has been described, but the position where the posture holding unit 604 is provided is used. The position is not particularly limited as long as the position of the completed wafer WF2 can be maintained. For example, as shown in FIGS. 26A and 26B, the housing 2 may be provided with a posture holding portion 704.

  The posture holding unit 704 according to the modification is provided in a predetermined transport path 611 between the holder unit 503 and the take-out port 58. The posture holding unit 704 can be configured by, for example, a columnar member that contacts the outer surface of the used wafer WF2 and prevents the used wafer WF2 from falling down. However, the shape, installation position, number of installations, and the like of the posture holding unit 704 can be changed as long as the posture of the used wafer WF2 can be held.

  The material of the material constituting the posture holding unit 704 is not particularly limited, but the used wafer WF2 moved to the discharge position PS2 can easily enter between the housing 2 and the posture holding unit 704. For example, it can be configured by a member that can be elastically deformed.

  As shown in the present modification, even when the posture holding unit 704 is provided on the housing 2 side, the posture of the wafer WF2 can be suitably held at the discharge position PS2. In addition, it is also possible to combine the configuration in which the posture holding unit 604 is provided in the holder unit 503 described in the above-described embodiment and the configuration in which the posture holding unit 604 is provided on the housing 2 side described in the modification.

  As described above, the tube joining apparatus according to the present invention has been described through the embodiment and the modification. However, the present invention is not limited to the configuration described in the embodiment and the modification, and is appropriately based on the description of the claims. It is possible to modify.

  For example, the configuration of the housing and each part of the tube joining device can be changed according to the use and purpose of the device, the design convenience, and the like, and is not limited to the illustrated configuration. In addition, although the example in which the second position where the posture of the used wafer is held is set near the take-out opening provided in the housing has been described, the second position is appropriately changed according to the configuration of the apparatus. Is possible.

  Further, for example, the posture of the used wafer when held by the posture holding unit is used when the fusing-bonding operation is performed in a state where the used wafer is left in the second position. Any posture may be used as long as the operation of each part of the apparatus is not hindered by the wafer. Therefore, as described with reference to the drawings and the like, the posture does not have to be maintained so as to be aligned in relation to an unused wafer. Further, in the description of the embodiment, the example in which the posture is held so as to prevent the interference between the holder unit that performs the lifting operation and the used wafer has been described, but interference may occur between other parts of the apparatus. It is also possible to configure so as to prevent this.

  Moreover, the tube used as joining object should just be a tube used as the object which switches the position of an edge part after fusing and performs pressure joining, and is not limited to the tube used for peritoneal dialysis.

1 Tube joining device,
2 housing,
3 Clamp lid,
50 Housing side clamp (holding part),
58 outlet,
82 Wafer cassette storage unit (storage unit),
100 control unit,
500 moving mechanism,
503 Holder part,
530F front end of wafer (front end of cutting member),
530R wafer rear end (rear end of cutting member),
604, 704 posture holding unit,
PS1 standby position (first position),
PS2 discharge position (second position),
PSm fusing position,
T1 first tube,
T2 second tube,
WF wafer (cutting member),
WF1 unused wafer,
WF2 Used wafer.

Claims (5)

After fusing the end of the first tube and the end of the second tube with the heated plate-shaped cutting member, the fusing end of the first tube and the fusing end of the second tube It is a tube joining device that replaces and joins,
A housing including a holding portion for holding the first tube and the second tube;
An accommodating portion provided in the housing and configured to accommodate a plurality of the cutting members;
When the first tube and the second tube held by the holding portion are fused, the cutting member accommodated in the accommodating portion is moved to a first position where the cutting member is waited for fusing. Later, a moving mechanism for moving the used cutting member used for fusing to a second position where the cutting member can be removed from the housing;
A tube having a posture holding unit for holding the posture of the used cutting member at the second position in the posture when the cutting member is moved from the first position to the second position; Joining device. A holder part movable so as to move the cutting member sent to the first position toward and away from the first tube and the second tube;
The posture holding portion is provided at least on the holder portion, and prevents the used cutting member from being positioned within the movable range of the holder portion by holding the posture of the used cutting member. The tube joining apparatus according to claim 1.   The tube joining apparatus according to claim 2, further comprising a holder position detection sensor that detects a movable state of the holder part by contact-non-contact with the posture holding part provided in the holder part.   The posture holding portion is arranged such that a rear end portion of the used cutting member moved to the second position is arranged to face a front end portion of the cutting member at the first position. The tube joining apparatus of any one of Claims 1-3 which hold | maintains.   The posture holding unit contacts the outer surface of the used cutting member moved to the second position so that the used cutting member is aligned on a linear extension of the first position. The tube joining apparatus according to claim 4, wherein the posture is maintained.