JP2015136372A - Electrostatic atomization device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electrostatic atomization device having a simplified structure for attaining high heat radiation efficiency.SOLUTION: The electrostatic atomization device includes: an atomization electrode for generating charged fine particle water under electric discharge; a cooling structure for cooling the atomization electrode and generating dew condensation on the atomization electrode; and a base plate to mount the cooling structure on. The cooling structure includes a first thermoelectric element having a first cooling part connected to the atomization electrode, and a first heat radiation part for emitting heat generated resulting from cooling the atomization electrode. The base plate includes a first conductor area electrically connected to the first heat radiation part.

Description

  The present invention relates to an electrostatic atomizer that generates charged fine particle water.

  The electrostatic atomizer generates fine particle water charged under discharge. The produced fine particle water is suitable for uses such as deodorization and sterilization.

  The electrostatic atomizer includes an atomization electrode, a thermoelectric element that cools the atomization electrode, and a circuit board (see Patent Document 1). The atomization electrode includes a rod-shaped protrusion and a base portion wider than the protrusion. The wide base portion enables stable fixation of the atomizing electrode on the thermoelectric element.

JP 2011-67770 A

  The thermoelectric element of the above-described electrostatic atomizer includes a cooling end that contacts the base, a heat radiating end opposite to the cooling end, and a current-carrying member for supplying power to the thermoelectric element. While the cooling end is cold, the heat dissipation edge is hot. As a result of the use of the energizing member, the electrostatic atomizer is structurally complex.

  According to Patent Document 1, the energizing member also plays a role of heat dissipation. However, changes in the size and shape of the energizing member are restricted by design limitations such as the size of the space around the energizing member. Therefore, the conventional electrostatic atomizer has the subject that size reduction, simplification, adjustment of heat dissipation, etc. are not easy.

  An object of this invention is to provide the electrostatic atomizer which can achieve size reduction, simplification, heat dissipation adjustment, etc. easily.

  An electrostatic atomization apparatus according to one aspect of the present invention includes an atomization electrode that generates charged fine particle water under discharge, a cooling structure that cools the atomization electrode and causes condensation on the atomization electrode, And a substrate to which the cooling structure is attached. The cooling structure includes a first thermoelectric element having a first cooling part connected to the atomizing electrode and a first heat radiating part for releasing heat generated due to cooling of the atomizing electrode. The substrate includes a first conductor region electrically connected to the first heat radiating part.

  According to the above configuration, since the first conductor region is electrically connected to the first heat dissipation portion, the substrate not only has a function of supplying power to the thermoelectric element, but also promotes heat dissipation from the thermoelectric element. it can. Therefore, the electrostatic atomizer can achieve energization and heat dissipation of the thermoelectric element with a simplified structure.

  In the above configuration, the substrate may include a main surface on which the first conductor region is formed. The atomizing electrode may be an electrode rod extending along a central axis intersecting the main surface. The electrode rod may include a peripheral surface extending from the main surface along the central axis. The first cooling unit may face the peripheral surface.

  According to the said structure, since a 1st cooling part opposes a surrounding surface, the distance between a board | substrate and the front-end | tip of an electrode rod becomes short compared with a prior art. Therefore, the electrostatic atomizer is downsized.

  In the above configuration, the cooling structure may include a second thermoelectric element having a second cooling unit connected to the atomizing electrode and a second heat radiating unit that releases heat generated due to the cooling. Good. The first heat radiating portion, the first cooling portion, the second cooling portion, and the second heat radiating portion may be aligned on a straight line that intersects the central axis and extends along the main surface.

  According to the said structure, since a 1st cooling part and a 2nd cooling part are connected to the atomization electrode, the atomization electrode is cooled efficiently. The first heat dissipating part, the first cooling part, the second cooling part, and the second heat dissipating part are aligned on a straight line that intersects the central axis and extends along the main surface. Largely separated from the heat dissipation part. As a result, the efficiency of heat radiation from the first heat radiation part and the second heat radiation part can be maintained at a high level.

  In the above configuration, the electrostatic atomizer includes an annular electrode facing the atomizing electrode, a holding unit that holds the annular electrode, and a position determination unit that positions the holding unit at a predetermined position on the substrate, And a holding structure having The substrate may include a main surface on which the first conductor region is formed. The atomizing electrode may be an electrode rod extending along a central axis intersecting the main surface. In the predetermined position, the annular electrode may be arranged coaxially with the central axis.

  According to the above configuration, the holding portion is positioned at a predetermined position on the substrate by the position determining portion, so that the annular electrode is arranged coaxially with the central axis of the electrode rod. As a result of the coaxial relationship between the annular electrode and the electrode rod, an appropriate discharge is likely to occur between the annular electrode and the electrode rod for the generation of charged particulate water.

  The said structure WHEREIN: The said 1st thermoelectric element may straddle the opening area | region formed in the said board | substrate between the said 1st cooling part and the said 1st thermal radiation part.

  According to the above configuration, the opening region can make it difficult for heat energy to move through the substrate from the first heat radiating unit to the first cooling unit. As a result, the electrostatic atomizer can generate charged particulate water under high heat dissipation efficiency and high cooling efficiency.

  In the above configuration, the opening region may partially surround the atomizing electrode.

  According to the said structure, since an opening area | region partially surrounds the atomization electrode, the movement of the heat energy through a board | substrate from a 1st thermal radiation part to a 1st cooling part becomes difficult to occur. As a result, the electrostatic atomizer can generate charged particulate water under high heat dissipation efficiency and high cooling efficiency.

  In the above configuration, the substrate may include a main surface on which the first conductor region is formed. The atomizing electrode may include an insertion portion that is inserted into an opening formed in the substrate.

  According to the said structure, the atomization electrode is suitably fixed to a board | substrate by insertion of the insertion part to an opening part.

  The said structure WHEREIN: The said board | substrate may contain the 2nd conductor area | region spaced apart from the said 1st conductor area | region. The first cooling unit may be connected to the second conductor region.

  According to the above configuration, since the second conductor region to which the first cooling unit is connected is separated from the first conductor region, it is difficult for heat energy to move from the first heat radiating unit to the first cooling unit. .

  In the above configuration, the cooling structure may include a second thermoelectric element having a second cooling unit connected to the atomizing electrode and a second heat radiating unit that releases heat generated due to the cooling. Good. The second conductor region may include a first connection part connected to the first cooling part by solder and a second connection part connected to the second cooling part by solder. The first connection part and the second connection part may be arranged to generate a self-alignment effect between the atomizing electrode and the cooling structure.

  According to the said structure, since a 1st connection part and a 2nd connection part are arrange | positioned so that a self-alignment effect may be produced between an atomization electrode and a cooling structure, an atomization electrode and a cooling structure are It is attached to the substrate under high positional accuracy.

  The said structure WHEREIN: The said atomization electrode may be arrange | positioned on the opening part formed in the said board | substrate.

  According to the above configuration, since the opening is formed in the substrate at a position where the cooling action is easily received from the first cooling unit and the second cooling unit, the substrate is not unnecessarily cooled. Therefore, the atomization electrode is efficiently cooled by the first cooling unit and the second cooling unit. In addition, unwanted solder can be removed through the openings.

  In the above configuration, the electrostatic atomizer further includes an output unit that outputs electric power for operating the cooling structure, and a connector for transmitting the electric power from the output unit to the cooling structure. Also good. The cooling structure may include a second thermoelectric element having a second cooling unit connected to the atomizing electrode and a second heat radiating unit that releases heat generated due to the cooling. The first conductor region may include a first heat dissipation region connected to the first heat dissipation portion and a second heat dissipation region connected to the second heat dissipation portion. The connector may be connected to the first heat dissipation area and the second heat dissipation area.

  According to the above configuration, a structurally simple circuit for supplying power to the cooling structure is constructed.

  In the above configuration, the electrostatic atomizer further includes an output unit that outputs electric power for operating the cooling structure, and a wire structure for transmitting the electric power from the output unit to the cooling structure. May be. The cooling structure may include a second thermoelectric element having a second cooling unit connected to the atomizing electrode and a second heat radiating unit that releases heat generated due to the cooling. The first conductor region may include a first heat dissipation region connected to the first heat dissipation portion and a second heat dissipation region connected to the second heat dissipation portion. The wire structure may include a first wire connected to the output unit and the first heat dissipation region, and a second wire connected to the output unit and the second heat dissipation region.

  According to the above configuration, the thermal energy transmitted to the first heat radiation area is also released from the first wire. The thermal energy transmitted to the second heat radiation area is also released from the second wire. Therefore, the electrostatic atomizer can produce charged fine particle water under high heat dissipation efficiency.

  The electrostatic atomizer according to the present invention is advantageous in that it can easily achieve miniaturization, simplification, adjustment of heat dissipation, and the like.

It is a notional block diagram of the electrostatic atomizer of a 1st embodiment. It is a schematic perspective view of the electrostatic atomizer of 2nd Embodiment. It is a conceptual diagram showing the design of the solder position for obtaining the self-alignment effect. It is a schematic perspective view of the electrostatic atomizer of 3rd Embodiment. It is a schematic enlarged plan view of the printed circuit board around the electrode rod of the electrostatic atomizer shown in FIG. FIG. 5 is a schematic enlarged plan view of the electrostatic atomizer shown in FIG. 4. It is a schematic sectional drawing of the electrostatic atomizer of 4th Embodiment. FIG. 7 is a schematic enlarged perspective view of a printed circuit board around a region to which an electrode rod of the electrostatic atomizer shown in FIG. 6 is attached. It is a schematic sectional drawing of the electrostatic atomizer of 5th Embodiment. It is a schematic perspective view of the electrode bar attached to the printed circuit board of the electrostatic atomizer shown by FIG. It is a schematic perspective view of the electrostatic atomizer of 6th Embodiment. It is an enlarged plan view of the electrostatic atomizer shown by FIG. It is a schematic perspective view of the electrostatic atomizer of 7th Embodiment. It is an enlarged plan view of the electrostatic atomizer shown by FIG. It is a schematic block diagram showing the electric power supply path | route of the electrostatic atomizer of 8th Embodiment. It is a general | deployment perspective view of the electrostatic atomizer of 9th Embodiment. It is a schematic perspective view of the electrostatic atomizer shown by FIG. 15A. FIG. 15B is another schematic perspective view of the electrostatic atomizer shown in FIG. 15A. It is a schematic plan view of the electrostatic atomizer of 10th Embodiment. It is a general | schematic expansion | deployment perspective view of the electrostatic atomizer of 11th Embodiment. It is a schematic perspective view of the annular electrode held by the holding frame of the electrostatic atomizer shown in FIG. It is a general | schematic expansion | deployment perspective view of the electrostatic atomizer of 12th Embodiment.

  Various embodiments relating to electrostatic atomizers are described below with reference to the accompanying drawings. The electrostatic atomizer can be clearly understood by the following description. The terms representing directions such as “up”, “down”, “left” and “right” are merely for the purpose of clarifying the explanation. Accordingly, these terms should not be construed as limiting.

<First Embodiment>
FIG. 1 is a conceptual block diagram of the electrostatic atomizer 100 of the first embodiment. With reference to FIG. 1, the electrostatic atomizer 100 is demonstrated.

  The electrostatic atomizer 100 includes an atomization electrode 200, a cooling structure 300, and a substrate 400. The cooling structure 300 includes a thermoelectric element 310. The thermoelectric element 310 may be generally commercially available. The principle of this embodiment is not limited at all by the detailed structure of the thermoelectric element 310.

  Thermoelectric element 310 includes a cooling unit 311 and a heat dissipation unit 312. The cooling unit 311 may contact the atomizing electrode 200. Alternatively, the cooling unit 311 may be connected to the atomizing electrode 200 by solder. If the transfer of thermal energy and electrical energy between the cooling unit 311 and the atomizing electrode 200 occurs, the connection technology between the cooling unit 311 and the atomizing electrode 200 does not limit the principle of this embodiment at all. . In the present embodiment, the first thermoelectric element is exemplified by the thermoelectric element 310. The first cooling unit is exemplified by the cooling unit 311. The first heat radiating portion is exemplified by the heat radiating portion 312.

  The substrate 400 to which the thermoelectric element 310 is attached includes a conductor region 410. The conductor region 410 may be in contact with the heat radiating part 312. Alternatively, the conductor region 410 may be connected to the heat radiating part 312 with solder. As long as thermal energy and electrical energy are transmitted between the conductor region 410 and the heat radiating unit 312, the connection technique between the conductor region 410 and the heat radiating unit 312 does not limit the principle of this embodiment. In the present embodiment, the first conductor region is exemplified by the conductor region 410.

  Thermoelectric element 310 receives power transmitted through conductor region 410. As a result, the cooling unit 311 has a very low temperature. On the other hand, the heat radiation part 312 becomes very high temperature.

  As described above, the cooling unit 311 is connected to the atomizing electrode 200. Therefore, the atomization electrode 200 is cooled by the cooling unit 311. As a result, condensation occurs on the atomizing electrode 200. As a result of the dew condensation, dew condensation water adheres to the atomizing electrode 200. When the electrostatic atomizer 100 generates discharge using the atomizing electrode 200, charged fine particle water is generated. Various known techniques may be used as a technique for generating particulate water using electric discharge. The principle of this embodiment is not limited at all by the discharge generation technique.

  As described above, the heat radiating portion 312 is connected to the conductor region 410. The heat radiating unit 312 releases heat generated due to cooling of the atomizing electrode 200. Heat is transferred from the heat radiating portion 312 to the conductor region 410.

  The conductor region 410 may occupy a large area of the substrate 400. In this case, the conductor region 410 can efficiently dissipate heat.

Second Embodiment
The electrostatic atomizer of 1st Embodiment is provided with one thermoelectric element. Alternatively, the electrostatic atomizer may comprise a plurality of thermoelectric elements. The number of thermoelectric elements incorporated in the electrostatic atomizer does not limit the principle of the electrostatic atomizer. In the second embodiment, an electrostatic atomizer having a pair of thermoelectric elements is described. In addition, the electrostatic atomizer of 2nd Embodiment is constructed | assembled based on the design principle of the electrostatic atomizer demonstrated in relation to 1st Embodiment.

  FIG. 2 is a schematic perspective view of the electrostatic atomizer 100A of the second embodiment. With reference to FIG.1 and FIG.2, 100 A of electrostatic atomizers are demonstrated.

  The electrostatic atomizer 100A includes an electrode rod 200A, a first thermoelectric element 320, a second thermoelectric element 330, and a printed board 400A. The first thermoelectric element 320 and the second thermoelectric element 330 may be generally commercially available. The principle of the present embodiment is not limited by the detailed structure of the first thermoelectric element 320 and the second thermoelectric element 330. The set of the first thermoelectric element 320 and the second thermoelectric element 330 corresponds to the cooling structure 300 described with reference to FIG.

  The first thermoelectric element 320 includes a first cooling end 321 and a first heat radiating end 322. The first cooling end 321 may contact the electrode rod 200A. Alternatively, the first cooling end 321 may be connected to the electrode bar 200A by solder. If the transfer of thermal energy and electrical energy between the first cooling end 321 and the electrode rod 200A occurs, the connection technique between the first cooling end 321 and the electrode rod 200A does not change the principle of this embodiment. Not limited. The first thermoelectric element 320 corresponds to the thermoelectric element 310 described with reference to FIG. The first cooling end 321 corresponds to the cooling unit 311 described with reference to FIG. The first heat radiating end 322 corresponds to the heat radiating part 312 described with reference to FIG.

  The second thermoelectric element 330 includes a second cooling end 331 and a second heat radiating end 332. The second cooling end 331 may contact the electrode bar 200A. Alternatively, the second cooling end 331 may be connected to the electrode bar 200A by solder. If the transfer of thermal energy and electrical energy between the second cooling end 331 and the electrode rod 200A occurs, the connection technology between the second cooling end 331 and the electrode rod 200A does not change the principle of this embodiment. Not limited. In the present embodiment, the second cooling unit is exemplified by the second cooling end 331. The second heat radiating portion is exemplified by the second heat radiating end 332.

  The first thermoelectric element 320 and the second thermoelectric element 330 may be BiTe Peltier elements. One of the first thermoelectric element 320 and the second thermoelectric element 330 may be formed of a P-type thermoelectric material. The other of the first thermoelectric element 320 and the second thermoelectric element 330 may be formed of an N-type thermoelectric material.

  The printed circuit board 400A to which the first thermoelectric element 320, the second thermoelectric element 330, and the electrode rod 200A are attached includes an upper surface 420, a first heat radiation area 430, and a second heat radiation area 440. The first heat radiation area 430 and the second heat radiation area 440 are formed on the upper surface 420. The first heat radiating region 430 and the second heat radiating region 440 are formed of a material having excellent heat conduction characteristics and excellent conductivity. The first heat radiation area 430 and the second heat radiation area 440 may be thin film layers created by a printing technique used for manufacturing a general printed circuit board. In this case, the heat dissipation characteristics of the first heat dissipation region 430 and the second heat dissipation region 440 can be easily achieved by changing design parameters such as the area, shape, and thickness of the copper foil that forms the first heat dissipation region 430 and the second heat dissipation region 440. And adjusted appropriately. Therefore, the design (setting parameters such as area, shape, and thickness) of the first heat dissipation region 430 and the second heat dissipation region 440 is adjusted according to the performance required for the electrostatic atomizer 100A and other requirements. May be. Note that the principle of the present embodiment is not limited at all by the formation technology of the first heat dissipation region 430 and the second heat dissipation region 440.

  The printed circuit board 400A corresponds to the circuit board 400 described with reference to FIG. The set of the first heat radiation area 430 and the second heat radiation area 440 corresponds to the conductor area 410 described with reference to FIG. In the present embodiment, the main surface is exemplified by the upper surface 420.

  The first heat dissipation area 430 may contact the first heat dissipation end 322. Alternatively, the first heat dissipation region 430 may be connected to the first heat dissipation end 322 by solder. If the transmission of thermal energy and electrical energy between the first heat radiation region 430 and the first heat radiation end 322 occurs, the connection technique between the first heat radiation region 430 and the first heat radiation end 322 is the present embodiment. The principle of is not limited at all.

  The second heat radiation region 440 may contact the second heat radiation end 332. Alternatively, the second heat radiation area 440 may be connected to the second heat radiation end 332 by solder. If transmission of thermal energy and electrical energy between the second heat radiation region 440 and the second heat radiation end 332 occurs, the connection technology between the second heat radiation region 440 and the second heat radiation end 332 is the present embodiment. The principle of is not limited at all.

  In the present embodiment, the first heat dissipation area 430, the first thermoelectric element 320, the electrode rod 200A, the second thermoelectric element 330, and the second heat dissipation area 440 are used for the operation of the first thermoelectric element 320 and the second thermoelectric element 330. Forming a circuit for supplying power. The first cooling end 321 and the second cooling end 331 are very low temperature under power supply. On the other hand, the first heat radiating end 322 and the second heat radiating end 332 are very hot.

  As described above, the first cooling end 321 and the second cooling end 331 are connected to the electrode rod 200A. Accordingly, the electrode rod 200A is cooled by the first cooling end 321. As a result, condensation occurs on the electrode rod 200A. As a result of the dew condensation, dew condensation water adheres to the electrode rod 200A. When the electrostatic atomizer 100A generates discharge using the electrode rod 200A, charged fine particle water is generated. Various known techniques may be used as a technique for generating particulate water using electric discharge. The principle of this embodiment is not limited at all by the discharge generation technique. The electrode rod 200A corresponds to the atomizing electrode 200 described with reference to FIG.

  As described above, the first heat radiating end 322 is connected to the first heat radiating region 430. The first heat radiating end 322 releases heat generated due to cooling of the electrode rod 200A. Heat is transferred from the first heat radiating end 322 to the first heat radiating region 430.

  As described above, the second heat radiating end 332 is connected to the second heat radiating region 440. The second heat radiating end 332 releases heat generated due to the cooling of the electrode rod 200A. Heat is transferred from the second heat radiating end 332 to the second heat radiating region 440.

  FIG. 2 shows a center line CL that is substantially orthogonal to the top surface 420. The electrode rod 200A extends from the upper surface 420 along the center line CL. In the present embodiment, the center axis is exemplified by the center line CL. The central axis may not be perpendicular to the upper surface 420. The angle between the central axis and the top surface 420 may be appropriately determined depending on the design of the electrostatic atomizer and / or the design of the various devices in which the electrostatic atomizer is incorporated.

  The electrode rod 200 </ b> A includes a base 210 and a rod 220. The base 210 is installed on the upper surface 420. The rod 220 extends upward from the base 210 along the center line CL. Since the base 210 is thicker than the rod 220, the electrode bar 200A is stably installed on the printed circuit board 400A. The electrode rod 200A may be formed of a metal material such as brass, aluminum, copper, tungsten, or titanium. Alternatively, the electrode rod 200A may be formed of a material such as a resin material or a carbon material having high conductivity.

  Base 210 includes a peripheral surface 211 extending from upper surface 420 along center line CL. The first cooling end 321 and the second cooling end 331 are opposed to the peripheral surface 211. If the peripheral surface 211 is connected to the first cooling end 321 and the second cooling end 331 by soldering, the peripheral surface 211 may be covered with a plating material such as nickel or tin. In this case, the base 210 is appropriately connected to the first cooling end 321 and the second cooling end 331 by solder. Alternatively, the peripheral surface 211 may be covered with a plating material having good corrosion resistance such as gold or platinum. The surface treatment of the electrode rod 200A does not limit the principle of this embodiment at all.

  The rod 220 includes a body part 221 that extends upward from the base 210 and a head part 222 that is formed at the upper end of the body part 221. Since the base 210 is sandwiched between the first cooling end 321 and the second cooling end 331, the electrode bar 200A is effectively cooled. As a result, condensation occurs on the electrode rod 200A. The electrostatic atomizer 100 </ b> A generates a strong electric field at the head 222. As a result of the condensation, the condensed water adhering to the electrode rod 200A is attracted to the head portion 222 by a strong electric field to form a Taylor cone. Subsequent discharge converts the condensed water into charged fine particle water.

  Since the electrode bar 200A is directly connected to the printed circuit board 400A, the dimension along the center line CL (that is, the thickness dimension) is small. Therefore, the electrostatic atomizer 100A can be miniaturized.

  FIG. 2 shows a straight line AL orthogonal to the center line CL. The straight line AL is drawn along the upper surface 420. As shown in FIG. 2, the first heat radiating end 322, the first cooling end 321, the electrode rod 200 </ b> A, the second cooling end 331, and the second heat radiating end 332 are aligned on a straight line AL. Of these, the first heat radiating end 322 is farthest from the second heat radiating end 332. Therefore, the electrostatic atomizer 100A can generate charged fine particle water under high heat dissipation efficiency.

<Third Embodiment>
The positional accuracy of the atomizing electrode attached to the substrate affects the discharge. If the atomizing electrode is fixed to the substrate with solder, the position of the atomizing electrode can be adjusted appropriately under the self-alignment effect. The self-alignment effect is obtained by balancing the surface tension of the molten solder between a plurality of soldering positions. In 3rd Embodiment, the electrostatic atomizer which has the atomization electrode appropriately positioned under the self-alignment effect is described.

  FIG. 3 is a conceptual diagram showing the design of a solder position for obtaining a self-alignment effect. The design principle regarding the solder position for obtaining the self-alignment effect will be described with reference to FIGS.

  FIG. 3 shows the surface SS of the substrate, the virtual circle VC drawn in the surface SS, and the center point CP of the virtual circle VC. The area surrounded by the virtual circle VC may be considered as the arrangement area of the electrode rod 200A described with reference to FIG. The center point CP may be considered as an intersection of the upper surface 420 and the center line CL.

  FIG. 3 further shows six points P1 to P6 evenly distributed on the virtual circle VC. Six points P1 to P6 mean parts to be soldered. The term “equal” does not mean mathematically precise arc division. It is only necessary that the six points P1 to P6 are distributed on the virtual circle VC with sufficient accuracy for the self-alignment effect to occur.

  Some of the six points P1 to P6 may be selected as connection points used for connection between the atomizing electrode, the cooling structure, and the substrate. The remaining points may be selected as connection points utilized for the connection between the atomizing electrode and the substrate. If two thermoelectric elements are used as in the electrostatic atomizer 100A described with reference to FIG. 2, two of the six points P1 to P6 are between the atomization electrode, the cooling structure, and the substrate. It is selected as a connection point used for connection. The remaining four points are selected as connection points used for the connection between the atomization electrode and the substrate.

  The number of connection points for obtaining the self-alignment effect is not limited to six. The number of connection points is appropriately set according to the number of thermoelectric elements, requirements for connection strength between the atomizing electrode and the substrate, and other design matters. If four connection points are used, a square vertex inscribed in the virtual circle VC is set as the connection point. If three connection points are used, the vertices of an equilateral triangle inscribed in the virtual circle VC are set as connection points. That is, the designer draws a regular polygon having the number of vertices corresponding to the number of connection points, sets the center of gravity of the regular polygon to the position of the central axis of the atomization electrode, and sets the position of the vertex to the connection point. May be set as

  FIG. 4 is a schematic perspective view of the electrostatic atomizer 100B of the third embodiment. The electrostatic atomizer 100B is demonstrated with reference to FIG.1, FIG3 and FIG.4. A symbol used in common between the second embodiment and the third embodiment means that an element to which the common symbol is attached has the same function as that of the second embodiment. Therefore, description of 2nd Embodiment is used for these elements.

  Similar to the second embodiment, the electrostatic atomizer 100 </ b> B includes an electrode bar 200 </ b> A, a first thermoelectric element 320, and a second thermoelectric element 330. The electrostatic atomizer 100B further includes a printed circuit board 400B. The printed circuit board 400B corresponds to the circuit board 400 described with reference to FIG.

  Similar to the second embodiment, the printed circuit board 400 </ b> B includes an upper surface 420, a first heat dissipation region 430, and a second heat dissipation region 440. The printed circuit board 400B further includes a second conductor region (described later) spaced from the electrode rod 200A. The second conductor region is formed according to the design principle described with reference to FIG. The second conductor region includes solder connection between the electrode bar 200A and the printed board 400B, solder connection between the first thermoelectric element 320, the electrode bar 200A and the printed board 400B, and between the second thermoelectric element 330, the electrode bar 200A and the printed board 400B. Therefore, the second conductor region is formed around the electrode rod 200A.

  FIG. 5A is a schematic enlarged plan view of the printed circuit board 400B around the electrode rod 200A. FIG. 5B is a schematic enlarged plan view of the electrostatic atomizer 100B around the electrode rod 200A. The electrostatic atomizer 100B is further demonstrated with reference to FIG. 3 thru | or FIG. 5B.

  The printed circuit board 400B includes four conductor regions 451 to 454. The four conductor regions 451 to 454 are used as the second conductor region described above. Each of the four conductor regions 451 to 454 is separated from the first heat dissipation region 430 and the second heat dissipation region 440.

  FIG. 5A shows a virtual circle VC. A virtual circle VC indicates an arrangement area of the electrode rod 200A. The positions of the four conductor regions 451 to 454 substantially correspond to the vertices of the square inscribed in the virtual circle VC.

  5A and 5B show XY coordinates. The term “X-axis direction” means a direction in which the electrode rod 200A, the first thermoelectric element 320, and the second thermoelectric element 330 are aligned. The term “Y-axis direction” means a direction substantially orthogonal to the X-axis.

  A set of conductor regions 451 and 452 is aligned in the X-axis direction. A set of conductor regions 453 and 454 is aligned in the Y-axis direction. The balance of the surface tension of the melted solder in each of the conductor regions 451 and 452 appropriately adjusts the position of the electrode bar 200A in the X-axis direction under the self-alignment effect. The balance of the surface tension of the melted solder in each of the conductor regions 453 and 454 appropriately adjusts the position of the electrode bar 200A in the Y-axis direction under the self-alignment effect.

  The conductor region 451 is used for solder connection among the electrode rod 200A, the first cooling end 321 and the printed circuit board 400B. The conductor region 452 is used for solder connection among the electrode rod 200A, the second cooling end 331, and the printed circuit board 400B. A set of conductor regions 453 and 454 is used for connection between the electrode bar 200A and the printed circuit board 400B. In the present embodiment, the first connection portion is exemplified by the conductor region 451. The second connection portion is exemplified by the conductor region 452.

<Fourth embodiment>
The thermoelectric element cools not only the atomizing electrode, but also the area of the substrate around the atomizing electrode. The energy used for cooling the substrate means deterioration of the cooling efficiency for the atomizing electrode. In 4th Embodiment, the technique which improves the cooling efficiency with respect to the atomization electrode is demonstrated.

  FIG. 6 is a schematic cross-sectional view of the electrostatic atomizer 100C of the fourth embodiment. With reference to FIG. 6, the electrostatic atomizer 100C will be described. The code used in common between the third embodiment and the fourth embodiment means that the element to which the common code is attached has the same function as that of the third embodiment. Therefore, description of 3rd Embodiment is used for these elements.

  Similar to the third embodiment, the electrostatic atomizer 100 </ b> C includes an electrode rod 200 </ b> A, a first thermoelectric element 320, and a second thermoelectric element 330. The electrostatic atomizer 100C further includes a printed circuit board 400C. The printed circuit board 400C corresponds to the circuit board 400 described with reference to FIG.

  FIG. 7 is a schematic enlarged perspective view of the printed circuit board 400C around a region where the electrode bar 200A is attached. The electrostatic atomizer 100C will be further described with reference to FIGS.

  Similar to the third embodiment, the printed circuit board 400C includes an upper surface 420, a first heat radiation region 430, a second heat radiation region 440, and conductor regions 451 to 454. An opening 460 is formed in the printed circuit board 400C. The electrode rod 200 </ b> A is installed on the opening 460. The base 210 closes the opening 460.

  Since the opening 460 is formed in the printed circuit board 400C, the power consumed by the first thermoelectric element 320 and the second thermoelectric element 330 for cooling the printed circuit board 400C is reduced. Therefore, the electrode rod 200A is efficiently cooled.

  The conductor regions 451 to 454 are adjacent to the opening 460. Part of the solder used for solder connection of the electrode rod 200 </ b> A, the first thermoelectric element 320, and the second thermoelectric element 330 may appear in the opening 460. Excess solder that appears in the opening 460 may be removed through the opening 460. Since excess solder is removed, the mounting accuracy of the electrode rod 200A with respect to the printed circuit board 400C is improved. In addition, various problems caused by dropping of excess solder are less likely to occur.

<Fifth Embodiment>
The opening formed in the substrate may be used for fixing the atomizing electrode. In the fifth embodiment, an atomizing electrode fixing technique using an opening will be described.

  FIG. 8 is a schematic cross-sectional view of the electrostatic atomizer 100D of the fifth embodiment. With reference to FIG.1 and FIG.8, electrostatic atomizer 100D is demonstrated. The code | symbol used in common between 4th Embodiment and 5th Embodiment means that the element to which the said common code | symbol was attached | subjected has the same function as 4th Embodiment. Therefore, description of 4th Embodiment is used for these elements.

  Similarly to the fourth embodiment, the electrostatic atomizer 100D includes a first thermoelectric element 320, a second thermoelectric element 330, and a printed circuit board 400C. The electrostatic atomizer 100D further includes an electrode rod 200D. The electrode rod 200D corresponds to the atomizing electrode 200 described with reference to FIG.

  FIG. 9 is a schematic perspective view of an electrode bar 200D attached to the printed circuit board 400C. The electrode rod 200D will be described with reference to FIGS.

  Similar to the fourth embodiment, the electrode rod 200 </ b> D includes a base 210 and a rod 220. The electrode rod 200 </ b> D further includes a protrusion 230 that protrudes downward from the base 210. The protrusion 230 is inserted into the opening 460 formed in the printed circuit board 400C. In the present embodiment, the insertion portion is exemplified by the protrusion 230.

  If the cross section of the protrusion 230 substantially matches the shape of the opening 460, the electrode rod 200D may be fixed to the printed circuit board 400C without solder. Alternatively, the principles of this embodiment may be utilized with the solder connection technique described in connection with the third embodiment. If the base 210 is connected to the printed circuit board 400C, the first thermoelectric element 320, and the second thermoelectric element 330 by soldering after the protrusion 230 is inserted into the opening 460, the electrode bar 200D is connected to the printed circuit board 400C. It is firmly fixed to.

<Sixth Embodiment>
Thermal energy goes from the high temperature region to the low temperature region. Therefore, heat energy tends to flow from the heat radiating part to the cooling part. The movement of thermal energy from the heat radiating part to the cooling part may reduce the cooling efficiency for the atomizing electrode. In 6th Embodiment, the technique for reducing the movement of the thermal energy from a thermal radiation part to a cooling part is demonstrated.

  FIG. 10 is a schematic perspective view of an electrostatic atomizer 100E according to the sixth embodiment. The electrostatic atomizer 100E is demonstrated with reference to FIG.1 and FIG.10. The code | symbol used in common between 4th Embodiment and 6th Embodiment means that the element to which the said common code | symbol was attached | subjected has the same function as 4th Embodiment. Therefore, description of 4th Embodiment is used for these elements.

  Similarly to the fourth embodiment, the electrostatic atomizer 100E includes an electrode rod 200A, a first thermoelectric element 320, and a second thermoelectric element 330. The electrostatic atomizer 100E further includes a printed circuit board 400E. The printed circuit board 400E corresponds to the circuit board 400 described with reference to FIG.

  FIG. 11 is an enlarged plan view of the electrostatic atomizer 100E around the electrode rod 200A. The electrostatic atomizer 100E is further demonstrated with reference to FIG.10 and FIG.11.

  Similar to the fourth embodiment, the printed circuit board 400E includes an upper surface 420, a first heat dissipation region 430, a second heat dissipation region 440, and conductor regions 451 to 454. A first opening region 471 and a second opening region 472 are formed in the printed circuit board 400E. The first opening region 471 is formed between the first cooling end 321 and the first heat radiating end 322. The second opening region 472 is formed between the second cooling end 331 and the second heat radiating end 332. Therefore, the region where the electrode bar 200A is installed is sandwiched between the first opening region 471 and the second opening region 472.

  The first thermoelectric element 320 straddles the first opening region 471. As a result, the first cooling end 321 is close to the electrode rod 200A. The first heat radiating end 322 contacts the first heat radiating region 430. As described in relation to the third embodiment, the first cooling end 321 is fixed to the conductor region 451 by solder. Similarly, the first heat radiating end 322 is fixed to the first heat radiating region 430 by solder. In the present embodiment, the opening area is exemplified by the first opening area 471.

  Since the first opening region 471 exists, the heat energy resulting from the heat radiation from the first heat radiating end 322 is less likely to go to the first cooling end 321. Therefore, the first cooling end 321 can efficiently cool the electrode rod 200A.

  The second thermoelectric element 330 straddles the second opening region 472. As a result, the second cooling end 331 is close to the electrode rod 200A. The second heat radiating end 332 is in contact with the second heat radiating region 440. As described in relation to the third embodiment, the second cooling end 331 is fixed to the conductor region 452 by solder. Similarly, the second heat radiating end 332 is fixed to the second heat radiating region 440 with solder.

  Since the second opening region 472 exists, the thermal energy resulting from the heat radiation from the second heat radiating end 332 is less likely to go to the second cooling end 331. Therefore, the second cooling end 331 can efficiently cool the electrode rod 200A.

<Seventh embodiment>
Since the conductor region has a high thermal conductivity, the region of the substrate used as the conductor region tends to be hot as a whole. Therefore, it is preferable that the region where the atomizing electrode is installed is thermally isolated as much as possible from the region used as the conductor region. In 7th Embodiment, the technique for thermally isolating the area | region where an atomization electrode is installed is demonstrated.

  FIG. 12 is a schematic perspective view of the electrostatic atomizer 100F of the seventh embodiment. With reference to FIG.1 and FIG.12, the electrostatic atomizer 100F is demonstrated. The code | symbol used in common between 6th Embodiment and 7th Embodiment means that the element to which the said common code | symbol was attached | subjected has the same function as 6th Embodiment. Therefore, description of 6th Embodiment is used for these elements.

  Similarly to the sixth embodiment, the electrostatic atomizer 100F includes an electrode bar 200A, a first thermoelectric element 320, and a second thermoelectric element 330. The electrostatic atomizer 100F further includes a printed circuit board 400F. The printed circuit board 400F corresponds to the circuit board 400 described with reference to FIG.

  Similar to the sixth embodiment, the printed circuit board 400 </ b> F includes an upper surface 420, a first heat dissipation region 430, and a second heat dissipation region 440. In the following description, the upper surface 420 is divided into a first region 421, a second region 422, and a third region 423. The term “first region 421” means a wide region where the first heat dissipation region 430 and the second heat dissipation region 440 are formed. The term “second region 422” means an island region to which the electrode rod 200A is fixed. The term “third region 423” means a bridge region extending between the first region 421 and the second region 422.

  FIG. 13 is an enlarged plan view of the electrostatic atomizer 100 </ b> F around the second region 422. With reference to FIG.12 and FIG.13, the electrostatic atomizer 100F is further demonstrated.

  Similar to the sixth embodiment, conductor regions 451 to 454 are included. A substantially C-shaped opening region 470 is formed in the printed circuit board 400F. The open area 470 partially surrounds the second area 422. Therefore, the second area 422 is connected to the first area 421 only through the third area 423.

  Similar to the sixth embodiment, the first thermoelectric element 320 straddles the opening region 470. Therefore, heat transfer from the first heat radiating end 322 to the first cooling end 321 is less likely to occur.

  Similar to the sixth embodiment, the second thermoelectric element 330 straddles the opening region 470. Therefore, heat transfer from the second heat radiating end 332 to the second cooling end 331 is less likely to occur.

  The thermal energy released by the first heat radiating end 322 is transmitted to the first heat radiating region 430. The thermal energy released by the second heat radiating end 332 is transmitted to the second heat radiating region 440. Since the first heat radiating region 430 and the second heat radiating region 440 have high thermal conductivity, the first region 421 generally has a high temperature.

  As described above, the second region 422 is connected to the first region 421 only through the third region 423. Therefore, the heat transfer from the first region 421 to the second region 422 is substantially limited to the route via the third region 423. Therefore, the first cooling end 321 and the second cooling end 331 can efficiently cool the electrode rod 200A.

<Eighth Embodiment>
Utilization of the pair of heat radiation areas for power supply to the cooling structure contributes to structural simplification of the electrostatic atomizer. In the eighth embodiment, a technique for supplying power to a cooling structure using a pair of discharge regions will be described.

  FIG. 14 is a schematic block diagram showing a power supply path of the electrostatic atomizer 100G of the eighth embodiment. The electrostatic atomizer 100G is demonstrated with reference to FIG. The code used in common between the second embodiment and the eighth embodiment means that the element to which the common code is attached has the same function as that of the second embodiment. Therefore, description of 2nd Embodiment is used for these elements.

  Similar to the second embodiment, the electrostatic atomizer 100G includes an electrode bar 200A and a printed circuit board 400A. The electrostatic atomizer 100G further includes a cooling structure 300G and a controller 500. The cooling structure 300 </ b> G includes a first thermoelectric element 320 and a second thermoelectric element 330.

  The controller 500 outputs a current adjusted for proper operation of the cooling structure 300G. The controller 500 may include a sensor that detects the temperature of the electrode rod 200A and / or the cooling structure 300G. The control unit 500 may include an adjustment unit that adjusts the magnitude of the current in accordance with the output from the sensor. In the present embodiment, the output unit is exemplified by the control unit 500. The power is exemplified by a current output from the control unit 500.

  The control unit 500 may be a printed circuit formed integrally with the printed circuit board 400A. Alternatively, the control unit 500 may be a control circuit formed on a board provided separately from the printed board 400A. The principle of this embodiment is not limited at all by the structure of the control unit 500.

  The appropriately adjusted current is output to the first heat radiation area 430. Since the first heat dissipation region 430 is formed of a conductive material, current is input to the first heat dissipation end 322 that contacts the first heat dissipation region 430. Since the first cooling end 321 is connected to the electrode bar 200A, the current is then output from the first cooling end 321 to the electrode bar 200A.

  The electrode rod 200 </ b> A is connected to the second cooling end 331. Therefore, the current is input from the electrode rod 200 </ b> A to the second cooling end 331. Since the second heat radiating end 332 is connected to the second heat radiating region 440 made of a conductive material, the current is then output from the second heat radiating end 332 to the heat radiating region 440. Finally, the current returns from the second heat radiation area 440 to the control unit 500.

  As described above, a circuit for supplying power to the cooling structure 300G is easily formed. The direction of current shown in FIG. 14 does not limit the principle of this embodiment at all. The direction of the current may be opposite to the direction shown in FIG. The principle of the present embodiment is applicable to various electrostatic atomizers described in relation to the second to seventh embodiments.

<Ninth Embodiment>
The principle of the eighth embodiment allows the use of commonly available connectors. In the ninth embodiment, an electrostatic atomizer including a generally available connector is described.

  FIG. 15A is a schematic exploded perspective view of the electrostatic atomizer 100H of the ninth embodiment. FIG. 15B is a schematic perspective view of the electrostatic atomizer 100H. FIG. 15C is another schematic perspective view of the electrostatic atomizer 100H. With reference to FIG. 15A thru | or FIG. 15C, the electrostatic atomizer 100H is demonstrated. The code | symbol used in common between 7th Embodiment and 9th Embodiment means that the element to which the said common code | symbol was attached | subjected has the same function as 7th Embodiment. Therefore, description of 7th Embodiment is used for these elements.

  Similarly to the seventh embodiment, the electrostatic atomizer 100H includes an electrode rod 200A, a first thermoelectric element 320, a second thermoelectric element 330, and a printed board 400F. The electrostatic atomizer 100H further includes a connector 600. Connector 600 may be commercially available.

  The connector 600 includes a first terminal 610, a second terminal 620, and a holding block 630 that holds the first terminal 610 and the second terminal 620. The connector 600 is installed on the printed circuit board 400F so that the holding block 630 straddles the insulating region between the first heat radiation region 430 and the second heat radiation region 440. As a result, the first terminal 610 is connected to the first heat dissipation region 430. The second terminal 620 is connected to the second heat dissipation area 440.

  The first heat radiation area 430 and the second heat radiation area 440 can be formed under a general printing technique. Therefore, the first heat radiation area 430 and the second heat radiation area 440 may be designed in accordance with the shape of the connector 600 (for example, the positions of the first terminal 610 and the second terminal 620).

  The connector 600 may be connected to a control circuit (not shown (a control unit described in connection with the eighth embodiment)). As a result, power for operating the first thermoelectric element 320 and the second thermoelectric element 330 is appropriately supplied through the connector 600.

<Tenth Embodiment>
Instead of the connector described in relation to the ninth embodiment, a wire structure may be used for electrical connection between the control unit and the cooling structure. If the wire structure is formed using a wire having a high thermal conductivity, the wire structure will also contribute to the high heat dissipation efficiency of the electrostatic atomizer. In the tenth embodiment, an electrostatic atomizer having a wire structure is described.

  FIG. 16 is a schematic plan view of an electrostatic atomizer 100I according to the tenth embodiment. The electrostatic atomizer 100I is demonstrated with reference to FIG. The code | symbol used in common between 7th Embodiment and 10th Embodiment means that the element to which the said common code | symbol was attached | subjected has the same function as 7th Embodiment. Therefore, description of 7th Embodiment is used for these elements.

  Similarly to the seventh embodiment, the electrostatic atomizer 100I includes an electrode rod 200A, a first thermoelectric element 320, a second thermoelectric element 330, and a printed board 400F. The electrostatic atomizer 100I further includes a wire structure 650. The wire structure 650 includes a first wire 651 and a second wire 652. The first wire 651 is connected to the first heat dissipation area 430. The second wire 652 is connected to the second heat radiation area 440.

  The first wire 651 includes a connection end 653 connected to the first heat dissipation region 430 and a base end 654 on the opposite side of the connection end 653. The base end portion 654 may exist at a position away from the printed circuit board 400F. The first wire 651 may be connected to a control circuit (not shown (a control unit described in relation to the eighth embodiment)) at the base end 654. If the first wire 651 is a wire having a high thermal conductivity (for example, a copper wire), thermal energy is released not only from the first heat radiation area 430 but also from the first wire 651.

  The second wire 652 includes a connection end 655 connected to the second heat dissipation region 440 and a base end 656 on the opposite side of the connection end 655. The base end portion 656 may exist at a position away from the printed circuit board 400F. The second wire 652 may be connected to the control circuit described above at the base end 656. If the second wire 652 is a wire having a high thermal conductivity (for example, a copper wire), heat energy is released not only from the second heat radiation region 440 but also from the second wire 652.

  The wire structure 650 may serve not only to supply power to the first thermoelectric element 320 and the second thermoelectric element 330 but also to release heat from the first thermoelectric element 320 and the second thermoelectric element 330 in the air. . Therefore, the electrostatic atomizer 100I can generate charged particulate water under high heat dissipation efficiency.

<Eleventh embodiment>
The charged fine particle water is generated under a discharge phenomenon caused by an electric field concentrated on the tip of the atomizing electrode. In order to concentrate the electric field on the tip of the atomizing electrode, an annular electrode may be arranged opposite the atomizing electrode. If the atomizing electrode is arranged coaxially with respect to the annular electrode, a discharge suitable for the generation of particulate water is generated between the atomizing electrode and the annular electrode. In the eleventh embodiment, a technique for enabling a coaxial arrangement between the atomizing electrode and the annular electrode is described. It should be noted that the term “coaxial” does not mean a perfect match between the central axis of the atomizing electrode and the center of the annular electrode. The term “coaxial” means that the central axis of the atomizing electrode and the center of the annular electrode are sufficient between the atomizing electrode and the annular electrode to obtain a substantially uniform discharge centered on the atomizing electrode. It means the state of being close.

  FIG. 17 is a schematic exploded perspective view of the electrostatic atomizer 100J of the eleventh embodiment. With reference to FIG. 17, the electrostatic atomizer 100J is demonstrated. The code | symbol used in common between 9th Embodiment and 11th Embodiment means that the element to which the said common code | symbol was attached | subjected has the same function as 9th Embodiment. Therefore, description of 9th Embodiment is used for these elements.

  Similarly to the ninth embodiment, the electrostatic atomizer 100J includes an electrode bar 200A, a first thermoelectric element 320, a second thermoelectric element 330, and a connector 600. The electrostatic atomizer 100J further includes a printed circuit board 400J, a holding frame 700, and an annular electrode 800.

  Similar to the ninth embodiment, the printed circuit board 400 </ b> J includes a first heat dissipation region 430 and a second heat dissipation region 440. A substantially C-shaped opening region 470 is formed in the printed circuit board 400J.

  In addition to the opening region 470, four mounting holes 475 to 478 are formed in the printed circuit board 400J. The mounting holes 475 to 478 are used for mounting the holding frame 700 on the printed circuit board 400J.

  The holding frame 700 includes a frame portion 710 that holds the annular electrode 800, and four bosses 715 to 718 that protrude downward from the frame portion 710. The boss 715 is inserted into the mounting hole 475. The boss 716 is inserted into the mounting hole 476. The boss 717 is inserted into the mounting hole 477. The boss 718 is inserted into the mounting hole 478. Therefore, the frame portion 710 formed integrally with the bosses 715 to 718 is positioned at a predetermined position on the printed circuit board 400J. In the present embodiment, the holding structure is exemplified by the holding frame 700. The holding part is exemplified by a frame part 710. The position determining unit is exemplified by bosses 715 to 718. The holding structure is not limited to the fitting structure between the boss and the mounting hole. The holding structure may have various structures that can position the annular electrode at a predetermined position on the substrate. For example, if the substrate has a convex portion, the holding structure may have a concave portion complementary to the convex portion.

  FIG. 18 is a schematic perspective view of the annular electrode 800 held by the holding frame 700. With reference to FIG.17 and FIG.18, the electrostatic atomizer 100J is further demonstrated.

  The annular electrode 800 includes an annular portion 810 spirally wound around the center line CL <b> 1, and a holding line 820 that extends from the annular portion 810 and is held by the frame portion 710. FIG. 17 shows the center line CL of the electrode rod 200A. When the bosses 715 to 718 are inserted into the mounting holes 475 to 478, the center line CL1 coincides with the center line CL. Alternatively, the center line CL1 is arranged at a position close to the center line CL. That is, the coaxial structure of the annular electrode 800 and the electrode rod 200A is formed by inserting the bosses 715-718 into the mounting holes 475-478.

  The electrostatic atomizer 100J applies a high voltage to the annular electrode 800 through the holding wire 820. As a result, a high potential difference is caused between the annular portion 810 and the electrode rod 200A. The condensed water that collects at the upper end of the electrode rod 200A due to the discharge generated due to the high potential difference becomes charged fine particle water.

<Twelfth embodiment>
If an opening is formed in the conductor region, the thermal energy released from the thermoelectric element can be discharged into the air through the opening. In the twelfth embodiment, an electrostatic atomizer having an opening formed in a conductor region is described.

  FIG. 19 is a schematic exploded perspective view of the electrostatic atomizer 100K of the twelfth embodiment. With reference to FIG.1 and FIG.19, the electrostatic atomizer 100K is demonstrated. The code | symbol used in common between 7th Embodiment and 12th Embodiment means that the element to which the said common code | symbol was attached | subjected has the same function as 7th Embodiment. Therefore, description of 7th Embodiment is used for these elements.

  Similar to the seventh embodiment, the electrostatic atomizer 100 </ b> K includes an electrode bar 200 </ b> A, a first thermoelectric element 320, and a second thermoelectric element 330. The electrostatic atomizer 100K further includes a printed circuit board 400K. A substantially C-shaped opening region 470 is formed in the printed circuit board 400K.

  The printed circuit board 400K includes a first heat dissipation area 430K and a second heat dissipation area 440K. The first heat radiation area 430K plays a role of radiating the thermal energy emitted from the first thermoelectric element 320. The second heat radiating region 440K plays a role of radiating heat energy released from the second thermoelectric element 330. The printed circuit board 400K corresponds to the circuit board 400 described with reference to FIG. The first heat radiation area 430K and the second heat radiation area 440K correspond to the conductor area 410 described with reference to FIG.

  A plurality of heat radiation holes 480 are formed in the printed circuit board 400K. A part of the plurality of heat dissipation holes 480 is formed in the first heat dissipation region 430K. The remaining heat radiation holes 480 are formed in the second heat radiation region 440K. Since the heat radiation holes 480 are formed corresponding to the first heat radiation area 430K and the second heat radiation area 440K, heat is easily released from the first heat radiation area 430K and the second heat radiation area 440K into the air. Therefore, the electrostatic atomizer 100K can generate charged fine particle water under high heat dissipation efficiency.

  The principles of the various embodiments described above may be combined depending on the application of the electrostatic atomizer. Those skilled in the art can construct various apparatuses based on the disclosure of the above-described embodiment. For example, the addition of ribs and fins for promoting heat dissipation can be easily performed within the principle of the above-described embodiment.

  The principle of the present embodiment is suitably used for an apparatus that produces a beneficial effect such as deodorization or sterilization using discharge.

100 to 100K ··········· electrostatic atomizer 200 ··············. ······································································································・ ・ ・ ・ Cooling structure 311 ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ Cooling unit 312 ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ Heat dissipation unit 310 ... thermoelectric element 320 ... 1st thermoelectric element 321 ... ... 1st cooling end 322 ... 1st thermal radiation end 330 ... 2nd thermoelectric element 331・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ Second cooling end 332 ··································································· 2 Region 420 ··········································································· First heat dissipation region 440, 440K・ Second heat radiation area 451 to 454... Conductor area 460... ... Opening area 471 ... 1st opening area 472 ... 2nd Opening area 500 ... Control part 600 ... Connector 650 ... .... Wire structure 651 ... ... 1st wire 652 ... 2nd wire 700 ... Holding frame 710 ...・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ Frame parts 715 to 718 ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ Boss 800 ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ Annular electrode AL・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ Line CL ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ Center line

Claims (12)

An atomizing electrode that generates charged particulate water under discharge;
A cooling structure that cools the atomizing electrode and causes condensation on the atomizing electrode;
A substrate to which the cooling structure is attached,
The cooling structure includes a first thermoelectric element having a first cooling part connected to the atomizing electrode, and a first heat radiating part for releasing heat generated due to cooling of the atomizing electrode,
The electrostatic atomizer as claimed in claim 1, wherein the substrate includes a first conductor region electrically connected to the first heat radiating portion. The substrate includes a main surface on which the first conductor region is formed,
The atomizing electrode is an electrode bar extending along a central axis intersecting the main surface,
The electrode rod includes a peripheral surface extending from the main surface along the central axis,
The electrostatic atomizer according to claim 1, wherein the first cooling unit faces the peripheral surface. The cooling structure includes a second thermoelectric element having a second cooling part connected to the atomizing electrode and a second heat radiating part for releasing heat generated due to the cooling,
The first heat radiating portion, the first cooling portion, the second cooling portion, and the second heat radiating portion are aligned on a straight line that intersects the central axis and extends along the main surface. The electrostatic atomizer of Claim 2 to do. An annular electrode facing the atomizing electrode;
A holding structure having a holding portion for holding the annular electrode, and a position determining portion for positioning the holding portion at a predetermined position on the substrate,
The substrate includes a main surface on which the first conductor region is formed,
The atomizing electrode is an electrode bar extending along a central axis intersecting the main surface,
The electrostatic atomizer according to claim 1, wherein the annular electrode is arranged coaxially with the central axis at the predetermined position.   The said 1st thermoelectric element straddles the opening area | region formed in the said board | substrate between the said 1st cooling part and the said 1st thermal radiation part, The Claim 1 characterized by the above-mentioned. Electrostatic atomizer.   The electrostatic atomizer according to claim 5, wherein the opening region partially surrounds the atomizing electrode. The substrate includes a main surface on which the first conductor region is formed,
The electrostatic atomizer according to claim 1, wherein the atomizing electrode includes an insertion portion that is inserted into an opening formed in the substrate. The substrate includes a second conductor region spaced from the first conductor region;
The electrostatic atomizer according to claim 1, wherein the first cooling unit is connected to the second conductor region. The cooling structure includes a second thermoelectric element having a second cooling part connected to the atomizing electrode and a second heat radiating part for releasing heat generated due to the cooling,
The second conductor region includes a first connection portion connected to the first cooling portion by solder, and a second connection portion connected to the second cooling portion by solder,
The electrostatic mist according to claim 8, wherein the first connection part and the second connection part are arranged to generate a self-alignment effect between the atomization electrode and the cooling structure. Device.   The electrostatic atomizer according to claim 9, wherein the atomizing electrode is disposed on an opening formed in the substrate. An output unit for outputting electric power for operating the cooling structure;
A connector for transmitting the electric power from the output unit to the cooling structure;
The cooling structure includes a second thermoelectric element having a second cooling part connected to the atomizing electrode and a second heat radiating part for releasing heat generated due to the cooling,
The first conductor region includes a first heat dissipation region connected to the first heat dissipation portion, and a second heat dissipation region connected to the second heat dissipation portion,
The electrostatic atomizer according to claim 1, wherein the connector is connected to the first heat radiation area and the second heat radiation area. An output unit for outputting electric power for operating the cooling structure;
A wire structure for transmitting the electric power from the output unit to the cooling structure;
The cooling structure includes a second thermoelectric element having a second cooling part connected to the atomizing electrode and a second heat radiating part for releasing heat generated due to the cooling,
The first conductor region includes a first heat dissipation region connected to the first heat dissipation portion, and a second heat dissipation region connected to the second heat dissipation portion,
The wire structure includes a first wire connected to the output unit and the first heat dissipation region, and a second wire connected to the output unit and the second heat dissipation region. The electrostatic atomizer of Claim 1 or 2.

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