JP2015135519A - Optically variable security device and method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optically variable security device.SOLUTION: Provided is a security device comprising at least first and second superposed optically variable effect generating structures (3-5, 3'-5'). Each of the structures has a surface relief microstructure. The second optically variable effect generating structure is viewable through the first structure.

Description

  The present invention relates to a security device and a method for manufacturing such a security device. Such security devices are used to protect the security of documents, tokens of value, and other items.

  Traditionally, such securities are used in financial transactions and take the form of banknotes, checks, bonds, traveler's checks, and vouchers. More recently, secure securities and security devices themselves have been used to provide confidence in goods and / or services. Security devices are applied to packaging, labels, and certificates associated with commodities such as software, entertainment media, high value consumer goods, and fast moving consumer goods.

  In both modern and traditional applications, the essential problem remains the same: it is easily recognized by the general public and provides a secure means of counterfeiting. The use of optically variable devices has been found to be a particularly effective way to meet these criteria. Furthermore, it is generally accepted that the wider the range of technologies involved in the production of security devices, the harder it is to forge. A number of diffractive optically variable identification devices (DOVIDs) intended to function as thermally activated transfer structures (eg hot foils) or label devices (applied under pressure) are: Its manufacture requires specialized knowledge in photophysics, materials science, chemistry, embossing, transformation, and often printing technology.

  The use of DOVID as a security device has become increasingly widespread in recent years, and thus the underlying component technology / science is increasingly accessible to those who may be counterfeiters. This is especially the case when the attack is carried out as an organized crime. In contrast, the holographic industry increasingly requires increasingly large capital investments and strict production / manufacturing controls for special equipment to reproduce, increasingly complex, open, secret and machine readable Features are included in the DOVID.

  According to a first aspect of the invention, the security device includes at least first and second superimposed optical variable effect generating structures, each structure having a surface relief microstructure, the second optical The variable effect generating structure can be seen through the first structure.

  According to a second aspect of the invention, a method of manufacturing a security device comprises providing at least first and second superimposed optical variable effect generating structures, each structure having a surface relief microstructure. So that the second optical variable effect generating structure can be seen through the first structure.

  A new type of security device has been devised that can be easily authenticated but very difficult to counterfeit. This is to provide two (or more) superimposed optically variable effect generating structures configured so that the structure underneath or each of them can be viewed through one or more underlying structures. Accompany.

  However, the prior art, for example, European Patent No. 576173 and US Pat. No. 5,606,433, is intended to produce a composite structure in which the laminated volume hologram is reproduced at several wavelengths determined by the number of layers superimposed. Known in the specification. Specifically, this is required because volume holograms function by Bragg reflection and therefore only regenerate incident light of a specific color wavelength and angle of incidence.

  The present invention enhances the visual sophistication, security and differentiation of diffractive or holographic images present in DOVID.

  Currently, safe OVD production must be one step ahead of counterfeiters using increasingly complex market demands and low-end production techniques (eg, low-spec dot matrix and interference masking methods). There is a double pressure of not becoming. As a result, the creation provider combines several complementary creation techniques at the mastering stage of the primary microstructure (most commonly used to overlay the dot-matrix image on a classic 3D or 2D / 3D hologram Alternatively, limited efforts have been made to mechanically recombine image components generated using different techniques to construct the final composite image.

  The present invention provides new devices and methods for combining two or more separately oriented optically variable microstructures (OVMs) that can be image-generating or machine-readable into a single film assembly. Basically, this method involves superposing or laminating two or more optical / interferometric uncoupled microstructure subassemblies.

In a preferred example, the top or first OVM subassembly that defines the first OVM relief (OVM1) is tightly coated with a reflection enhancing layer, which takes one of the following forms: Can:
1) a discontinuous reflective metal coating (with a substantially demetallated substantial area or transparent window), or ₂ ) a continuous thickness-optimized HRI material (eg ZnS, TiO ₂ ) Transparent coating.

  The lower OVM subassembly defines a reflective Opaque layer or metal-coated second OVM relief (OVM2) that can be selectively demetalized (or with a reflective HRI material).

  The desired appearance of the proposed DOVID is such that the DOVID is one complex single metallized OVM, and this OVM microstructure is generated by superimposing two separate creation processes. It should be noted that it seems. The creation process should be chosen so that it does not appear that the DOVID is simply composed of two separate microstructured layers laminated together.

  To date, in the holographic industry, each of the major production providers specializes in one of the limited number of production techniques available to produce optically variable microstructures (OVM) that produce images. There was a trend. Examples of such fabrication techniques include classic two-step rainbow holography, dot matrix interferometry, lithographic interferometry, and e-beam lithography.

  It is preferred to make OVM1 and OVM2 using two distinctly different fabrication techniques, such as e-beam lithography and two-step rainbow holography.

  In a further embodiment, one of the optical microstructures exists as a volume Bragg plane, and thus the associated optical variable layer functions as a volume hologram. Examples of volume holograms can be found in EP 516173 and US Pat. No. 5,606,433. Physically, this microstructure exists as a periodic distribution of planar regions with locally altered (increased or reduced) refractive index, with each layer scattering some of the light propagating through that layer. When light of a certain wavelength (eg, at or near the original recording wavelength) and incident angle (at or near the original reference beam recording angle) propagates through this layer, then it is scattered / scattered from each plane. All of the reflected partial amplitudes are in phase and interfere constructively. This is known as the Bragg effect.

  It goes without saying that the microstructure is of a volume and multi-planar nature so that there is no need (or benefit) of a reflection enhancing coating. However, to ensure that the image obtained from the volume hologram does not have to compete with the light backscattered by the substrate, typically the volume hologram that will be adhered to the substrate. The side is covered with a dark opaque film (typically black). Of course, opaque colorants may be added to the adhesive or adhesive layer. Due to the thickness of the photopolymer layer and the associated PET support layer (eg 15 μm and 50 μm for DuPont's Omnidex® material, respectively), the composite assembly (OVM1 + OVM2) inevitably requires a hot stamp device. Or it will be understood that it is applied as a die-cut label rather than as a thermal roll-on device.

  The device can be applied in two different ways to the substrate or article to be protected. First, heat activated transfer from a carrier foil (eg, hot-wheeling / stamping, roll-on, etc.) or application as a label utilizing non-heat activated adhesives. Examples of substrates or articles to which the security device according to the present invention can be applied include banknotes, checks, bonds, traveler's checks, stamps, authentication certificates, high value packaging goods and vouchers.

  Several examples of devices and methods according to the present invention will now be described with reference to the accompanying drawings.

It is sectional drawing of the 1st example regarding the embodiment of thermal transfer, and shows the state before the transfer process is completed. Fig. 2 shows an example of Fig. La after transfer. 2 shows a first example of the first OVM shown in FIG. 2 shows a second example of the first OVM shown in FIG. FIG. 2 is a schematic cross-sectional view of the second OVM shown in FIG. Figure 2 shows a series of steps in stacking two OVM structures together. Figure 2 shows a series of steps in stacking two OVM structures together. FIG. 4b is similar to FIG. 4a but shows the use of a UV lamp. It is a modification of the example of FIG. It is a schematic sectional drawing of the example of a label device. Fig. 4 shows a device formed by sequentially manufacturing each layer to produce a transfer foil. Figure 2 shows a schematic cross-sectional view of a label device formed by sequentially providing layers. Further examples are shown. Further examples are shown. Further examples are shown. Further examples are shown. Further examples are shown.

[Thermal transfer device]
First, the method of manufacturing the layer assembly necessary to allow the device / invention to function as a thermal transfer structure will be described (see FIGS. 1a and 1b).

[Manufacture of OVM1 subassembly]
On top of a carrier layer 1, typically 16-50 μm PET, a wax release layer 2, typically 0.01-0.1 μm thick, is applied, followed by a thermoformable lacquer layer 3. Applied to a thickness of 1-2 μm. The optical microstructure 4 is then embossed in the thermoformable layer 3. This optical microstructure is then covered with a reflection enhancement layer 5. Two types of reflection enhancing layers are suitable for this application.

The first option (FIG. 2a) is a transparent high refractive index (HRI) layer of dielectric material (eg ZnS, TiO ₂ , ZrO ₂ deposited to a thickness of about 0.2-0.6 μm). The microstructure 4 is vacuum-coated.

  The second option (FIG. 2b) is to first vacuum coat the microstructure 4 with an essentially opaque aluminum layer 5A and then selectively demetallize the region 5B of the OVM area, which is the microstructure. Can be made to fit the image. Demetallization is typically accomplished by using a print mask and etch approach or by printing the etchant directly.

  It should be noted that the use of OPP (biaxially oriented polypropylene) carrier 1 eliminates the need for the embossing lacquer. The optical microstructure can be embossed directly into the OPP. The rest of the OVM1 subassembly manufacturing process remains unchanged.

[Manufacture of OVM2 subassembly]
A second foil assembly similar to OVM 1 with carrier 1 ′ and release layer 2 ′ is produced (FIG. 3). The release layer 2 'is weaker or looser than the release layer 2 of the OVM 1 (to facilitate the joining of the two subassemblies). A lacquer layer 3 'is further provided. The foil structure is then embossed with a second optically variable microstructure 4 'and coated with an opaque reflective metal coating 5' (typically 30-60 nm thick aluminum).

The subassembly is then covered with an optically clear adhesive layer or laminate 6 weighing a few g / m ² . Suitable materials for this adhesive layer 6 are UV curable adhesives such as COATES UV CC E50 and self-curing adhesives based on, for example, acrylic / isocyanate curable urethanes.

[Lamination of two subassemblies]
Next, the two subassemblies OVM1 and OVM2 must be stacked together. This involves passing the two subassemblies through a pair of lamination nip rollers 20 to transfer the transferable layer of the OVM2 subassembly (ie, layers 3'-6 below the release layer) of the OVM1 subassembly. It is necessary to transfer to the back (FIGS. 4a, 4b) and then peel off the carrier 1 ′ of OVM2.

  If the laminating adhesive 6 is a UV curable composition, the composite foil assembly can be irradiated with UV just before passing through the nip roller 20 and the UV source 21 is always on the OVM 1 side of the composite assembly (see FIG. 5). Alternatively, the nip roller 20 ′ on the OVM 1 side of the laminate can be made of a material that transmits UV light, and the UV source 21 is placed inside the circumference (FIG. 6).

Finally, the back of the composite assembly is coated with a heat activated adhesive 9 such as DLRH RK14 (coating weight 1.5-3 g / m ² ) and then it is rewound. This will allow for thickening and hot stamping.

  For hot stamping foil, the total thickness of the transfer assembly is preferably 7-8 μm or less to help clean tear and peel. For roll-on stripe applications this can be increased to 10 μm.

  In use, the structure shown in FIG. 1a is brought into contact with a substrate 10 such as securities and the adhesive 9 is thermally activated using a hot stamping die or the like. After activation, the carrier 1 is peeled off as a result of the presence of the wax release layer 2, leaving the device secured to the substrate 10 as shown in FIG. 1b.

  The above configuration can be further modified to form a label device. The structure of such a device is shown in FIG. The structure of the wax release layer 2 remains essentially unchanged except that the wax release layer 2 is not present in the OVM1 subassembly and the carrier 1 is transparent. It is also possible to integrate the carrier and embossing layer into one material / layer, typically when using PVC or OPP.

The manufacture of such a label device differs from hot stamping products in two respects. During the production of the OVM 1, the wax release layer 2 is not present and the embossing lacquer 3 is optional as described above. Second, the heat activated adhesive 9 is replaced with a pressure sensitive adhesive 9 '. A suitable pressure sensitive adhesive such as NA 1197 (National Adhesives) should be applied at a coating weight of 10-15 g / m ² .

[Another manufacturing method]
In another approach, the two subassemblies do not take the approach of being glued together after being manufactured separately. Rather, the complete assembly is manufactured by applying and processing each layer sequentially, resulting in the structure shown in FIG. 8 for hot foil applications and FIG. 9 for label applications. These are described in more detail below.

[Hot foil]
As mentioned above, the OVM1 subassembly is manufactured using layers 1 to 5 (FIG. 2a). The embossing lacquer 11 is then applied by gravure coating on the back of the reflection enhancement layer 5 (HRI or demet) and then the second optical microstructure 4 ′ is embossed (FIG. 8). The embossing lacquer 11 preferably has a glass transition temperature (T _g ) considerably lower than that of the lacquer 3 that supports the first optically variable microstructure 4. Another approach is to use a UV curable monomer composition rather than an embossing lacquer. In that case, the second optically variable relief can be cast into a UV curable monomer and cured. Such a method is described in more detail in US Pat. No. 4,758,296. Next, the second optically variable relief 4 ′ is vacuum coated with a metal such as aluminum 5 ′ (a typical thickness of aluminum is 30-60 nm) and then heat activated adhesive 9 (eg, DLRH). RK14). The final product is then rewound in a state where it can be applied to the substrate 10.

[label]
Two approaches have been identified for the production of labels. The first approach (FIG. 9) differs from the heat activated transfer structure only in that the wax release layer 2 is not in the OVM 1 assembly and a pressure sensitive adhesive 9 'is used instead of the heat activated adhesive 9. Yes.

  Another approach (not shown) is to use an optically clear polymer film (typically 25-100 μm thick) where it has suitable thermoplastic properties (such as a suitable glass transition temperature). The optical microstructure is directly embossed on what is referred to as its lower surface. Suitable polymers include polypropylene and PVC, but polyester is less preferred due to its high glass transition temperature. Polyesters with unfavorable thermoplastic properties include polyesters, or more specifically, liquid crystal polymers can be coated on the bottom with a suitable thermoplastic film or lacquer (1-5 μm thick) before embossing. is necessary.

  The lacquer is embossed with an OVM1 microstructure, and then a substantially opaque metal layer is vacuum deposited on the microstructure. It is usual to coat with a thickness of 10 to 100 nm, in particular 30 to 60 nm. Aluminum is typically used, but copper or any clearly colored alloy can also be used. This metal layer can then be selectively demetallated as needed.

The OVM2 subassembly is then laminated onto glassine paper coated with 10-20 g / m ² of pressure sensitive adhesive. The top surface of the OVM2 subassembly is then coated with an optically clear laminating adhesive (this adhesive can be heat, UV or self-curing as described above). Finally, the OVM1 subassembly is transferred to the top surface of the OVM2 subassembly (from its carrier) by passing through the nip while activating the laminating adhesive through the action of heat or UV light.

[Additional enhancement of printing or coating]
It will be appreciated that the device can be further enhanced by incorporating additional materials into or between the appropriate layers. All embodiments described in European Patent No. 497837 are hereby incorporated by reference. Various reinforcement methods described in EP 497837 can be incorporated between the microstructure and the reflection enhancement layer in OVM1 or OVM2.

  In addition, dyes or pigments can be incorporated into the laminating adhesive. Such pigments can provide coloring or luminescent effects (phosphorescence and fluorescence). Such materials are well known in the security industry and it is well known to use materials that exhibit Stokes or anti-Stokes shift. Finally, other optically variable materials such as photochromic materials and thermochromic materials can be used in the laminating adhesive.

  As previously mentioned, the present invention is a laminate composed of two or more surfaces / layers of a microstructure whose optically variable generation effect appears to be derived from a single optical effect generation microstructure. Create structure.

  It should be noted that OVM1 and OVM2 can each be generated by a single production technique, eg, classical holography. However, each of the microstructures can be generated separately using two or more different fabrication techniques and can therefore be created very safely per se. Thus, in principle, a device with a unique optical appearance can be created by visually integrating the optically variable effects generated by OVM1 and OVM2 into a single microstructure on the surface, Even counterfeiters and highly skilled holographers will find it difficult to reproduce.

In a preferred embodiment, OVM 1 is about 4 with a fully transparent high refractive index (HRI) dielectric material 5 (typically ZnS, TiO ₂ or ZrO ₂ all having a refractive index of about ₂ ). The thickness of the HRI layer on the diffractive relief, as opposed to a mirror-smooth interface, which is tightly coated with an optical thickness of 1 / wavelength (ie, about 100 nm for a refractive index of 2) Is not critical. In this preferred embodiment, OVM1 is inherently less than OVM2 because the reflectivity of HRI is relatively low when compared to a nearly opaque aluminum film (eg, at most 1/6 the brightness). It is important to have a high diffraction brightness. That is, the OVM 1 should be composed of a pure grating structure that has minimal diffusion of diffracted light and no depth effect. The preferred fabrication methods for generating OVM1 in this case are dot matrix interferometry, lithographic interferometry and e-beam lithography (lithographic interferometry and e-beam lithography). Includes production techniques such as Kinegram (R) and Exelgram (R). OVM2 should preferably generate some form of iridescence or virtually / apparent depth effect, which contrasts and is complementary to the optical variable effect generated by OVM1. Therefore, OVM2 is preferably a classical hologram (model, 2D-3D), zero-order diffractive device (ZOD), or Fresnel structure (diffractive and reflective hybrid effect) acting at the lowest harmonic. In order to balance the brightness, further colorants or dyes can be incorporated into the laminating adhesive and the regeneration from OVM2 can be spectrally filtered (colored).

  A second preferred embodiment is as follows. The uniformly transparent HRI reflection enhancement layer 5 is replaced with a selectively metallized coating of aluminum (FIG. 2b), so the OVM 1 does not necessarily have to be very bright in nature. Thus, OVM1 can be obtained by fabrication techniques that produce diffractive diffraction (such as OVM2 in the above embodiment) as well as non-diffusive diffraction (such as OVM1 in the above embodiment). In general, it is particularly desirable that the selective metallization matches the image pattern provided by OVM1.

Two such examples are as follows:
1. OVM1 and OVM2 are complementary ZODs. For example, on the back of the OVM 1, the metallization can be provided in the form of a De La Rue head on a transparent perimeter. OVM1 can be manufactured to regenerate green pearl luster when oriented vertically and brown when oriented horizontally. On the other hand, the OVM 2 can be provided to reproduce brown when oriented vertically and to reproduce green when oriented horizontally. Therefore, the entire device has the appearance of a green head on a brown background when facing vertically and the appearance of a brown head on a green background when facing horizontally. This simple swap-over effect is a strong authentication feature.
2. Designers of diffractive optically variable devices generated with Kinegram (R) and Exelgram (R) and other forms of interferometric and incoherent lithography often have basic gratings from a manufacturing standpoint. It utilizes the fact that orthogonal images can be easily created by changing the orientation (azimuth) of the structure by ± 90 °. In the vertical orientation, the first graphic image is diffracted into the viewer's eye, while rotating the device 90 ° (about an axis perpendicular to the plane) produces a second graphic image (horizontal Orientation), diffracted or relayed into the viewer's eyes. This orthogonal image switching is a very powerful feature.

  In contrast, in classic two-stage rainbow holograms, the ability to change orientation (azimuth) is suppressed and it is difficult to create a truly orthogonal image. Therefore, an important aspect for some examples of the present invention is the design feature that OVM1 and OVM2 contain orthogonal holographic images created by classical holography. Of course, either or both of the microstructures can include other fabrication techniques (eg, dot-matrix overlay).

  A further example utilizing the OVM2 volume hologram is shown in FIG. It consists essentially of a lower assembly (OVM2), which includes a photopolymer Bragg or volume hologram layer provided on a Mylar® PET support layer that is adhered to the substrate of the protective article. The The upper assembly (OVM1) is from a lacquer or thermoplastic material embossed with an OVM1 microstructure that is vacuum coated with a transparent high refractive index coating and then transferred-laminated or adhered to the upper surface of the lower assembly (ie, photopolymer) Composed. This assembly is transparent or at least translucent as it is, so that any printed or photographic information on the substrate can be viewed. If desired, the colorant can be added to the adhesive or can be added to a colored (optionally opaque) primer layer between the support layer (PET) and the adhesive.

The manufacturing method for this assembly is as follows:
1) Manufacture of OVM2 subassembly 1) First, a volume hologram is recorded in the photopolymerizable layer 30, and then the resulting Bragg structure is stabilized or cured by exposure to light (typically actinic radiation or UV) Is done. Optionally, the hologram can then be subjected to subsequent heat treatment to increase its brightness or reproduction efficiency. The exposed surface of the 10-200 μm thick support layer 32 can have the appearance of a continuous colored opaque coating or as a printed colored pattern (covering most of the surface so as not to reduce the adhesive strength) A primer coating (not shown) that can be provided can optionally be provided. Alternatively, dyes can be incorporated into the support layer to provide opacity and / or color. After curing, the top protective sheet or layer (typically weakly bonded 20 μm PET) that prevents the photopolymerization process from being harmed by oxygen may be removed and the two subassemblies ultimately You may hold | maintain until it laminates | stacks.
2) The volume hologram is then laminated to glassine release paper coated with an adhesive (pressure sensitive). That is, the adhesive is in contact with the support layer. The adhesive should be of a type that forms a very strong bond with the PET support layer 32 and is resistant to chemical attack. Alternatively, a thermoplastic or lacquer layer 36 (0.5-5 μm thick) provided on a release agent-coated carrier 38 (typically polyester, thickness 12-50 μm, in particular 25 μm) is coated with OVM1 The OVM1 subassembly is made by embossing the surface relief microstructure 34. Alternatively, the carrier 38 may or may not match a transparent reflection enhancement layer (HRI) 40 or a translucent reflection enhancement layer (eg, an optically variable image provided by OVM1). Metallization) can be vacuum coated. Finally, the structure is coated with a laminating adhesive or adhesive layer 42 that can be heat activated (hot-stamping), pressure activated or UV curable adhesive.
3) Finally, transfer the OVM1 subassembly onto the photopolymer surface 30 of the OVM2 subassembly (facing the peelable carrier). It may be an important security design feature that the images provided by OVM1 and OVM2 maintain a predetermined spatial relationship or precise overlay during the lamination process. Similarly, if the OVM1's reflection enhancement layer 40 takes the form of selective metallization, it is desirable that this metallization closely match the image obtained with the optical effects provided by OVM1 and / or OVM2. There is a case. Finally, in that case, a continuous sheet or web of images or holograms can be stamped into a label unit, and the matrix that is no longer needed is stripped off. The resulting label can be adhered to the substrate 46 via the pressure sensitive adhesive 44 by a normal transfer process.

A second embodiment is shown in FIG. 11, which essentially differs from the previous embodiment with respect to the configuration of the OVM1 subassembly. Specifically, OVM 1 is not embossed into a transferable lacquer, but instead is directly embossed into a support / carrier layer 48 that is not release coated. The configuration steps are as follows:
[Manufacture of OVM2 subassembly]
1) As described above.
2) Not applicable. That is, this time, the lamination to the adhesive-coated glassine paper or release sheet 46 is performed after the two subassemblies are integrated.
[Manufacture of OVM1 subassembly]
3) Emboss OVM1 microstructure directly to support / carrier layer 48 (eg PVC, polycarbonate, OPP or less suitable PET, 10-100 μm thick) or carrier coated with embossable lacquer The layer is now embossed without the release layer. The carrier has a typical thickness range of 12-50 μm, preferably 12-25 μm.
4) Next, the reflective enhancement layer 36 (HRI or partially metallized) is vacuum coated.
5) Next, the laminating adhesive 42 (which is heat activated, pressure activated or UV cured) is coated.
6) The two subassemblies are then laminated together by passing them through a pair of nip rollers with the photopolymer side of the OVM2 subassembly oriented to contact the adhesive or laminating adhesive of the OVM1 subassembly. Is done. Earlier, when describing the fabrication of an assembly comprising two surface relief microstructures, it relates to the case where the laminating adhesive is thermally activated or acts via (e.g., UV cured) photopolymer crosslinking. Having described a particular lamination process / system, it will not be repeated here. Optionally, the PET support layer 32 may be provided with a colored primer layer as a continuous coating or a patterned discontinuous coating. Finally, this composite structure can be laminated on glassine paper 46 coated with adhesive 44 (pressure sensitive) and die-cut as before.
7) It should also be noted that there are configuration options at this stage (which can be done if the photopolymer hologram layer is weakly adhered to the support layer). After lamination, the volume hologram support layer can be peeled off. The composite assembly is then laminated to an adhesive coated glassine paper. UV curable materials are often difficult to bond, so it may be necessary to develop specially formulated pressure sensitive adhesives or to provide an intermediate primer layer between the volume hologram and the adhesive is there.

  It is also possible to build a composite device without having to stack the two devices together (FIG. 12). In this case, an OVM2 subassembly comprising a volume hologram 30 and an underlying support layer 32 is selected and the surface of the volume hologram is coated with an embossable thermoplastic or UV polymerizable coating 50. A surface relief structure suitable for this coating is then embossed by the action of heat and pressure. Alternatively, the surface relief can be formed using casting and curing techniques. If the surface relief structure of OVM1 can be protected by a topcoat or varnish 52, then it is necessary to provide the surface relief with a reflection enhancing layer, such as HRI or partial metallization.

  Finally, the adhesive 44 is provided directly on the volume hologram (OVM2) support layer or indirectly by being laminated on the release sheet 46 coated with the adhesive as described above.

  The proposed construction method for manufacturing the second embodiment is for making a layer assembly suitable for use as a holographic thread for incorporation into banknotes (paper and polymer), security labels, etc. It will be understood that it can also be used. In essence, it means eliminating the provision of the final adhesive coat. Two possible thread structures are shown in FIGS. 13 and 14, which in the former (FIG. 13) have the photopolymeric PET support layer 32 held as one of the outwardly facing layers. In contrast, the latter (FIG. 14) is distinguished in that the photopolymer 30 is one of the outwardly facing layers.

  In FIG. 13, it is desirable that the thickness of the entire assembly be 45 μm or less, and therefore the individual thicknesses of the two outwardly facing polymer support layers are preferably on the order of 10-15 μm. The layer is preferably 10-20 μm. The same overall thickness limitation applies to the structure of FIG. 14, but this is more easily accomplished because the volume hologram support layer is missing.

  Finally, the concept of the present invention is obtained by a visually integrated image concept, such as a combination of diffractive or holographic surface relief images and volume / Bragg holograms. It must be stressed that there is no. Thus, for example, in some of the described embodiments, the order of the volume hologram and its support layer is reversed so that the volume hologram is closest to the substrate and the support layer is closest to the OVM1 subassembly. Sometimes it is desirable. Also, although PET has been mentioned as a support layer, it can be substituted with any optical polymer material having the desired optical / mechanical properties.

  The numerical values specified for the layer thickness and coating weight are not to be expected as inclusive, and therefore function in accordance with the concepts of the present invention but are outside the scope specified herein. Structures having thicknesses and compositions are still considered to be within the scope of the present invention.

Claims (31)

  A security device comprising at least a first and a second superimposed optical variable effect generating structure, each structure having a surface relief microstructure, wherein the second optical variable effect generating structure is the first A security device that can be seen through one structure.   The device of claim 1, wherein the first optical variable effect generating structure includes a discontinuous metal layer.   The device of claim 1, wherein the first optical variable effect generating structure includes a reflective layer formed of a high refractive index dielectric material.   The first optical variable effect generating structure includes a substantially pure grating structure in combination with a high refractive index dielectric layer, and the second optical variable effect generating structure includes a classical hologram, zero-order diffraction The security device of claim 3, comprising one of a device or a Fresnel structure.   The device according to claim 1, wherein the first and second optical variable effect generating structures comprise complementary zero-order diffractive devices.   6. A device according to any one of the preceding claims, wherein the first and second optical variable effect generating structures generate orthogonal holographic images, typically created by classical holography.   The device according to claim 1, wherein the second optical variable effect generating structure includes an opaque reflective layer.   The device according to claim 1, wherein the first and second optical variable effect generating structures are stacked on each other.   9. A device according to any preceding claim, wherein the first and second surface relief microstructures have been created by different processes.   The first and second surface relief microstructures are created by one of dot matrix interferometry, lithographic interferometry, e-beam lithography, and classic rainbow lithography. The device according to any one of claims 1 to 9.   The device according to claim 1, further comprising a carrier layer supporting the first and second optical variable effect generating structures.   The device of claim 11, wherein the carrier layer is secured to the first and second optical variable effect generating structures via a release layer.   The device according to claim 1, wherein one or more optically variable effect generating structures are formed in each lacquer layer.   The device according to claim 1, wherein at least one of the optical variable effect generating structures is formed in a polymer material.   The device according to claim 1, further comprising an adhesive layer so that the device can be fixed to a substrate.   16. A device according to any one of the preceding claims, further comprising a layer of the optical variable effect generating structure or a dye or pigment provided between the layers.   17. A device according to any one of the preceding claims, further comprising one or more additional optical variable effect generating structures provided between the first and second optical variable effect generating structures. .   A method of manufacturing a security device, comprising providing at least first and second superimposed optically variable effect generating structures, each structure having a surface relief microstructure, whereby the second A method of manufacturing a security device, wherein an optically variable effect generating structure is visible through the first structure.   19. The method of claim 18, wherein each optical variable effect generating structure is formed by embossing a corresponding surface relief microstructure into an embossed layer.   20. A method according to claim 19, wherein the embossing layer comprises an embossing lacquer or polymer.   21. A method according to any one of claims 18 to 20, wherein each microstructure is obtained from a different creation process.   The method of claim 21, wherein the creation process is selected from dot matrix interferometry, lithographic interferometry, e-beam lithography, and classical rainbow lithography.   23. The method of any one of claims 18-22, further comprising providing a partially reflective layer on the surface relief microstructure of the first optical variable effect generating structure.   24. The method of claim 23, wherein the partially reflective layer is formed by a high refractive index dielectric material or discontinuous metallization.   25. A method according to any one of claims 18 to 24, wherein the first and second optical variable effect generating structures are manufactured separately and then joined together.   The method according to claim 25, wherein the first and second optical variable effect generating structures are laminated to each other by an intermediate laminating adhesive (fixing step).   The laminating adhesive is UV curable, and the fixing step includes irradiating the laminating adhesive with UV through the first optical variable effect generating structure to activate the adhesive. Item 27. The method according to Item 26.   28. A method according to any one of claims 18 to 27, wherein the first and second optical variable effect generating structures are provided on a carrier.   28. The method of claim 27, wherein a release layer is provided between the carrier and the first and second optical variable effect generating structures.   A security device carrying a security device according to any one of claims 1 to 17, or a security device manufactured according to any one of claims 18 to 29.   32. The security of claim 30, including securities such as banknotes.

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