JP2015131383A - cutting plate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cutting plate for facilitating management and storage, by reducing the number of sheets.SOLUTION: A characteristic of a cutting plate 10 is in that nozzle fixing parts 14a etc. and slurry supply grooves 15a etc. are formed correspondingly to a plurality of crystal ingots 60 fixed at different cutting angles θa etc, to crystal ingot fixing parts 13a etc. According to the cutting plate 10, the plurality of nozzle fixing parts 14a etc, and the slurry supply grooves 15a etc. are formed correspondingly to the plurality of crystal ingots 60 fixed at the different cutting angles θa etc. to a cutting wire 81, so that since the number of sheets can be reduced more than when preparing one sheet by one sheet with every cutting angles θa etc., the management and the storage can be facilitated.

Description

  The present invention relates to a cutting plate used when, for example, a crystal wafer is cut out from a crystal ingot by a multi-wire saw.

  Since there is a correlation between the frequency temperature characteristics of the crystal resonator and the crystal cutting angle accuracy, high accuracy is required for crystal cutting. Conventionally, a multi-band saw has been used for crystal cutting, but in recent years, a multi-wire saw has been used due to its high processing accuracy. Further, in recent years, a large-diameter wafer has been developed in the same manner as a silicon wafer in quartz, and a down-cut method is being adopted because of high cutting accuracy with respect to a large-diameter wafer (see Patent Document 1). The down-cut method is a method of cutting with a wire from below the workpiece, and the cutting accuracy is high because the wire does not entrain a piece of the workpiece.

JP 2010-274371 A

  In a process of cutting a quartz wafer from a quartz ingot using a down-cut type multi-wire saw, a jig called a “cutting plate” is used. The cutting plate is shown in FIG. A crystal ingot 60 is installed on the lower surface of the cutting plate 50 indicated by an imaginary line, and a slurry supply nozzle 70 is installed on the nozzle fixing portion 51 on the upper surface of the cutting plate 50. The crystal ingot 60 is cut from below by a plurality of cutting wires 81 parallel to each other. The slurry supply nozzle 70 has a casing 71 and a discharge port 72, and discharges a cutting slurry (not shown) from the discharge port 72. The discharge port 72 has a linear shape along the longitudinal direction of the casing 71. Further, the crystal ingot 60 is fixed to the lower surface of the cutting plate 50 so that the main surface 61 of the crystal ingot 60 has a constant cutting angle θ with respect to the cutting wire 81 when viewed from above the cutting wire 81. The Further, the nozzle fixing portion 51 is formed in a concave shape on the upper surface of the cutting plate 50 and fixes the casing 71 so that the discharge port 72 of the slurry supply nozzle 70 is parallel to the main surface 61 of the crystal ingot 60. .

  The cutting plate 50 is fixed to a multi-wire saw body (not shown), and the cutting wire 81 travels in the direction of the arrow 811. That is, the cutting wire 81 travels in the direction of the arrow 811, receives supply of the cutting slurry from the discharge port 72 of the slurry supply nozzle 70, and cuts the crystal ingot 60 little by little while rubbing the lower surface of the crystal ingot 60. go.

  X, Y, and Z in the figure are crystal axes of the crystal ingot 60. The cutting angle θ is an angle formed between the Z axis, which is a normal line of the main surface 61, and the cutting wire 81, and counterclockwise from the Z axis is positive and clockwise is negative. For example, the AT cut has a cutting angle θ of 35 °, and the BT cut has a cutting angle θ of −49 °.

  The distance d from the discharge port 72 of the slurry supply nozzle 70 to the main surface 61 of the crystal ingot 60 is preferably as short as possible. This is because if the distance d is long, the cutting slurry supplied from the discharge port 72 does not reach the main surface 61 of the crystal ingot 60 sufficiently. The distance d is preferably the same at all positions within the main surface 61. When the distance d varies depending on the position in the main surface 61, the cutting slurry at the cutting point discharged from the slurry supply nozzle 70 and attached to the cutting wire 81 differs for each cutting wire 81 with respect to the time to reach the crystal ingot 60. As a result, the supply amount of the cutting slurry varies, resulting in variations in processing accuracy. For this reason, if there are n types of cutting angles θ of the quartz ingot 60 to be installed, it is necessary to prepare n plates for which the nozzle fixing portions 51 are formed corresponding to them.

  However, since one cutting plate 50 is required for each cutting angle θ, a large number of cutting plates 50 are required, so that management and storage are difficult.

  Therefore, an object of the present invention is to provide a cutting plate that can be easily managed and stored by making it possible to reduce the number of sheets.

The cutting plate according to the present invention comprises:
A lower surface on which a workpiece to be cut from below by a plurality of cutting wires is installed;
An upper surface on which a slurry supply nozzle that has a housing and a discharge port along a longitudinal direction of the housing and discharges a cutting slurry from the discharge port is installed;
A workpiece fixing portion for fixing the workpiece to the lower surface such that the main surface of the workpiece has a constant cutting angle;
A nozzle fixing portion that is formed on the upper surface and fixes the casing so that the discharge port is parallel to the main surface of the workpiece;
A slurry supply groove that is formed through the lower surface of the nozzle fixing portion and supplies the cutting slurry discharged from the discharge port to the cutting wire;
In the cutting plate provided,
The nozzle fixing portion and the slurry supply groove are formed in a plurality corresponding to the plurality of workpieces to be fixed at different cutting angles with respect to the workpiece fixing portion.
It is characterized by that.

  According to the cutting plate according to the present invention, a plurality of nozzle fixing portions and slurry supply grooves are formed corresponding to a plurality of workpieces fixed at different cutting angles, so that one sheet is provided for each cutting angle. Since the number of sheets can be reduced as compared with the case of preparation, management and storage can be facilitated.

It is a top view which shows the plate for cutting of Embodiment 1, and its 1st usage method. It is a top view which shows the plate for cutting of Embodiment 1, and its 2nd usage method. It is sectional drawing corresponded in the III-III line in FIG.1 and FIG.2, and shows the state before installing a crystal ingot and a slurry supply nozzle in the cutting plate. It is sectional drawing corresponded in the III-III line in FIG.1 and FIG.2, and shows the cutting | disconnection operation | movement after installing a crystal ingot and a slurry supply nozzle in the cutting plate. It is a schematic plan view for demonstrating the subject of this invention.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention (hereinafter referred to as “embodiments”) will be described with reference to the accompanying drawings. In the present specification and drawings, the same reference numerals are used for substantially the same components. The shapes depicted in the drawings are drawn so as to be easily understood by those skilled in the art, and thus do not necessarily match the actual dimensions and ratios.

  FIG. 1 is a plan view showing a cutting plate of Embodiment 1 and its first method of use (AT cut). FIG. 2 is a plan view showing the cutting plate of Embodiment 1 and its second method of use (BT cut). 3 and 4 are cross-sectional views corresponding to the line III-III in FIGS. 1 and 2. Hereinafter, description will be given based on these drawings. The “crystal ingot” in the first embodiment is an example of the “workpiece” in the claims.

  The cutting plate 10 of the first embodiment includes a lower surface 11 and an upper surface 12, crystal ingot fixing portions 13a and 13b, nozzle fixing portions 14a and 14b, slurry supply grooves 15a and 15b, and the like.

  A crystal ingot 60 is installed on the lower surface 11, and a slurry supply nozzle 70 is installed on the upper surface 12. The crystal ingot 60 is cut from below by a plurality of cutting wires 81 that are linear and parallel to each other. The slurry supply nozzle 70 has a rod-shaped casing 71 and a linear discharge port 72 along the longitudinal direction of the casing 71, and discharges a cutting slurry 73 (FIG. 4) from the discharge port 72. The crystal ingot fixing portion 13a (FIG. 1) lowers the crystal ingot 60 so that the main surface 61 of the crystal ingot 60 has a constant cutting angle θa with respect to the cutting wire 81 when viewed from above the cutting wire 81. 11 is fixed. The crystal ingot fixing portion 13 b (FIG. 2) lowers the crystal ingot 60 so that the main surface 61 of the crystal ingot 60 has a constant cutting angle θb with respect to the cutting wire 81 when viewed from above the cutting wire 81. 11 is fixed. The nozzle fixing portions 14 a and 14 b are each formed in a concave shape on the upper surface 12, and the discharge port 72 is parallel to the main surface 61 of the crystal ingot 60 in plan view from the viewpoint of uniform supply of the above-described cutting slurry. The housing 71 is fixed as described above. The slurry supply grooves 15a and 15b are formed through the bottom surface 16 from the bottom surface 16 of the nozzle fixing portions 14a and 14b, respectively, and the cutting slurry 73 (FIG. 4) discharged from the discharge port 72 is supplied to the cutting wire 81. Supply.

  Here, the crystal ingot fixing part 13a (FIG. 1), the nozzle fixing part 14a and the slurry supply groove 15a are for AT cutting, and the crystal ingot fixing part 13b (FIG. 2), the nozzle fixing part 14b and the slurry supply groove 15b are BT. It is for cutting. That is, the cutting plate 10 is characterized in that the “nozzle fixing portion 14a and the slurry supply groove 15a” and the “nozzle fixing portion 14b and the slurry supply groove 15b” have different cutting angles θa and θb in the crystal ingot fixing portions 13a and 13b. The plurality of crystal ingots 60 are fixed to each other.

  The “nozzle fixing portion 14a and slurry supply groove 15a” and the “nozzle fixing portion 14b and slurry supply groove 15b” are formed in the cutting plate 10 so as to intersect each other. In addition, “nozzle fixing portion and slurry supply groove” corresponding to other cutting angles may be further intersected. Three sets of “nozzle fixing portion 14a and slurry supply groove 15a” and “nozzle fixing portion 14b and slurry supply groove 15b” formed so as to intersect each other are provided. These may be one set, two sets, or four or more sets. The cutting angle θa is an angle for obtaining an AT cut, and the cutting angle θb is an angle for obtaining a BT cut.

  Next, each component will be described in more detail.

  The cutting plate 10 is made of, for example, a flat metal material such as aluminum, and has nozzle fixing portions 14a and 14b and slurry supply grooves 15a and 15b formed by, for example, end milling. Moreover, the cutting plate 10 fixes the crystal ingot 60 cut | disconnected by predetermined thickness so that it may not move with the pressing force of the cutting wire 81, for example, is raised or lowered by the hydraulic mechanism which is not shown in figure.

  The nozzle fixing portions 14 a and 14 b have shapes and sizes that fit with the casing 71 of the slurry supply nozzle 70. The slurry supply grooves 15a and 15b are linear through holes formed in the bottom surface 16 of the nozzle fixing portions 14a and 14b, and do not interfere with the cutting slurry 73 (FIG. 4) flowing out from the discharge port 72 of the slurry supply nozzle 70. Thus, it is formed larger than the discharge port 72. The crystal ingot fixing portions 13a and 13b are regions formed of a part of the lower surface 11, and are regions where the crystal ingot 60 is fixed. The crystal ingot 60 is affixed to the crystal ingot fixing parts 13a and 13b via, for example, an affixing glass 13c (FIG. 3).

  In addition to the casing 71 and the discharge port 72, the slurry supply nozzle 70 includes a slurry supply pipe 74, a fixture 75 that fixes the pipe 74 to the casing 71, and the like. The casing 71 may have a rectangular parallelepiped shape as illustrated, but may have a cylindrical shape, for example. The discharge port 72 may be a straight through hole as shown in the figure, but may be a plurality of small holes arranged in a straight line, for example. The cutting slurry 73 (FIG. 4) is a general suspension containing an abrasive.

  The quartz ingot 60 is a Lambert artificial quartz, for example. Lambert artificial quartz is an artificial quartz crystal whose X and Z or Z 'planes have been flattened and parallelized by cutting, rough polishing, polishing, etc. so as to match the specified dimensions and orientation from the as-grown state. Say.

  Next, a multi-wire saw 80 in which the cutting plate 10 is used will be described mainly based on FIG.

  The multi-wire saw 80 includes a cutting wire 81, a first bobbin 82 for feeding or winding the cutting wire 81, a second bobbin 83 for winding or feeding the cutting wire 81, and a plurality of rollers on which the cutting wire 81 is wound a plurality of times. 84, 85, 86, a cutting plate 10 for fixing the crystal ingot 60 cut by the cutting wire 81, and the like. The cutting wire 81 is wound a plurality of times around the plurality of rollers 84, 85, 86 from the first bobbin 82 and is connected to the second bobbin 83.

  When the cutting wire 81 is fed out from the first bobbin 82, travels in the direction of the arrow 811, is wound up by the second bobbin 83, and is completely wound up by the second bobbin 83, the second time is reversed. It is fed out from the bobbin 83, travels in the direction of the arrow 812, and is taken up by the first bobbin 82.

  At this time, the crystal ingot 60 fixed to the cutting plate 10 is pressed against a plurality of cutting wires 81 stretched between the rollers 85 and 86 while supplying the cutting slurry 73 to thereby obtain a predetermined value. It is possible to cut a plurality of quartz wafers with a thickness of. Further, the plurality of rollers 84, 85, 86 have grooves provided at predetermined intervals on the outer peripheral surfaces thereof. The cut thickness of the crystal wafer is determined by the interval between the grooves.

  Note that when the cutting wire 81 travels in the direction of the arrow 811, the cutting slurry 73 does not have to be supplied from the rightmost slurry supply nozzle 70 in FIG. 4. Similarly, when the cutting wire 81 is traveling in the direction of the arrow 812, the cutting slurry 73 may not be supplied from the leftmost slurry supply nozzle 70 in FIG. This is because the cutting slurry 73 discharged from the slurry supply nozzle 70 is attached to the cutting wire 81 and the quartz ingot 60 is cut by the attached cutting slurry 73.

  Next, the operation and effect of the cutting plate 10 will be described.

  (1) According to the cutting plate 10, a plurality of nozzle fixing portions 14 a,... And a slurry supply groove corresponding to the plurality of crystal ingots 60 fixed at different cutting angles θa,. By forming 15a,..., It is possible to reduce the number of sheets as compared with the case where one sheet is prepared for each cutting angle θa,. It can be simplified.

  (2) When the “nozzle fixing portion 14a and the slurry supply groove 15a” and the “nozzle fixing portion 14b and the slurry supply groove 15b” are formed so as to intersect each other, the “nozzle fixing portion 14a and the slurry supply groove 15a” And “nozzle fixing portion 14b and slurry supply groove 15b” can be reduced compared to the case where they are formed so as not to cross each other, and thus the cutting plate 10 can be reduced in size.

  (3) When a plurality of “nozzle fixing portions 14a and slurry supply grooves 15a” and “nozzle fixing portions 14b and slurry supply grooves 15b” formed so as to intersect with each other are provided, And the slurry supply groove 15a "and the nozzle plate 14b and the slurry supply groove 15b on the other side can be used to manufacture crystal wafers having a plurality of cutting angles simultaneously with a single cutting plate 10. It can be suitably used for multi-product production.

  Next, the cutting plate 10 of Embodiment 1 will be summarized.

  As shown in FIG. 5, when the crystal ingot 60 is attached to the cutting plate 50, it is necessary to appropriately supply the cutting slurry to the cutting point in order to improve the accuracy of the cutting angle θ. Therefore, it is necessary to install the nozzle fixing portion 51 at a different angle corresponding to the cutting angle θ. Therefore, the cutting plate 50 is required for each cutting angle θ. For example, at least two cutting plates 50 are required for AT cut and BT cut.

  On the other hand, in the cutting plate 10 of the first embodiment, in order to supply the cutting slurry 73 evenly and accurately to the cutting point, the plurality of nozzle fixing portions 14a,. Slurry supply grooves 15a are provided. In other words, nozzle fixing portions 14a,... And slurry supply grooves 15a,... Corresponding to the required cut angles are provided in the cutting plate 10, and the crystal ingots 60 are attached to the crystal ingot fixing portions 13a,. Specifically, the slurry supply nozzle 70 is fitted into the nozzle fixing portion 14a, and the crystal ingot 60 is attached to the crystal ingot fixing portion 13a. Alternatively, the slurry supply nozzle 70 is fitted into the nozzle fixing portion 14b, and the crystal ingot 60 is attached to the crystal ingot fixing portion 13b. According to the cutting plate 10 of the first embodiment, since it is not necessary to produce one piece for each cutting angle θa,..., It can be stored in a small space and the number of pieces to be managed is reduced. Further, the nozzle fixing portions 14a and 14b are respectively formed in a concave shape on the upper surface 12, and slurry supply grooves 15a and 15b are formed so that the discharge port 72 is parallel to the main surface 61 of the crystal ingot 60 in plan view. Therefore, since there is little variation in the supply amount of the cutting slurry 73 to the quartz ingot 60, a quartz wafer with little variation in processing accuracy can be provided.

  As described above, the present invention has been described with reference to the above embodiment, but the present invention is not limited only to the configuration and operation of the above embodiment, and can be made by those skilled in the art within the scope of the present invention. Of course, it includes various possible variations and modifications.

  For example, in the present invention, a sapphire, a single crystal, a piezoelectric wafer, a semiconductor wafer, a mask material, or the like can be used as a workpiece in addition to quartz. Further, in the present invention, any cut such as CT cut or DT cut in addition to AT cut and BT cut can be supported as the crystal cutting angle.

10 Cutting plate 11 Lower surface 12 Upper surface 13a, 13b Crystal ingot fixing part (workpiece fixing part)
13c Glass 14a, 14b Nozzle fixing part 16 Bottom face 15a, 15b Slurry supply groove 50 Cutting plate 51 Nozzle fixing part 60 Crystal ingot (workpiece)
61 Main surface 70 Slurry supply nozzle 71 Housing 72 Discharge port 73 Slurry for cutting 74 Piping 75 Fixing fixture 80 Multi-wire saw 81 Cutting wire 811, 812 Arrow (traveling direction)
82 First bobbin 83 Second bobbin 84, 85, 86 Multiple rollers

Claims (4)

A lower surface on which a workpiece to be cut from below by a plurality of cutting wires is installed;
An upper surface on which a slurry supply nozzle that has a housing and a discharge port along a longitudinal direction of the housing and discharges a cutting slurry from the discharge port is installed;
A workpiece fixing portion for fixing the workpiece to the lower surface such that the main surface of the workpiece has a constant cutting angle;
A nozzle fixing portion that is formed on the upper surface and fixes the casing so that the discharge port is parallel to the main surface of the workpiece;
A slurry supply groove that is formed through the lower surface of the nozzle fixing portion and supplies the cutting slurry discharged from the discharge port to the cutting wire;
In the cutting plate provided,
The nozzle fixing portion and the slurry supply groove are formed in a plurality corresponding to the plurality of workpieces to be fixed at different cutting angles with respect to the workpiece fixing portion.
A cutting plate characterized by that. The plurality of nozzle fixing portions and the slurry supply grooves are formed so as to intersect each other.
The cutting plate according to claim 1. A plurality of sets of the nozzle fixing portions and the slurry supply grooves formed so as to intersect with each other are further provided.
The cutting plate according to claim 2. The workpiece is quartz, and the different cutting angles are an angle for obtaining an AT cut and an angle for obtaining a BT cut.
The cutting plate according to claim 1, 2 or 3.

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