JP2015130409A - Light-emitting device, light-emitting module, projector, communication apparatus, manufacturing method of light-emitting device, and manufacturing method of light-emitting module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device that can accurately recognize a place where light is emitted even when the position of an end surface is varied.SOLUTION: The light-emitting device includes a multilayer substrate 41, a first emitting unit 16b that emits light 17 from a first side face 41a of the multilayer substrate 41, and a first element mark 18 that has a part of the shape in planar view viewed from the thickness direction of the multilayer substrate 41 including the first side face 41a. The first element mark 18 has a first optical axis side 18b parallel to the optical axis 17a of the light 17.

Description

  The present invention relates to a light emitting device, a light emitting module, a projector, a communication device, a method for manufacturing a light emitting device, and a method for manufacturing a light emitting module.

  Super luminescent diodes (hereinafter also referred to as “SLDs”), semiconductor lasers, and the like are used as light sources for projectors and light sources for optical communication. The light source is used in combination with an optical system such as a lens or an optical fiber.

  An optical module using a semiconductor laser element is disclosed in Patent Document 1. According to this, a semiconductor laser element and an optical fiber are installed on the substrate. A V-groove is formed in the substrate, and the optical fiber is installed along the V-groove. The semiconductor laser element and the substrate are provided with alignment marks. And when installing a semiconductor laser element in a board | substrate, an imaging camera and a robot are utilized. An image of a mark for alignment is picked up by an imaging camera, and the position of the mark is recognized. Then, the position of the semiconductor laser element and the position of the substrate are recognized using the image of the alignment mark. Next, the robot was controlled to install the semiconductor laser element at a predetermined position on the substrate.

Japanese Patent Laid-Open No. 11-52195

  In Patent Document 1, a mark is placed on a semiconductor laser element, and a relative position to the optical axis is set for the mark. Therefore, the position of the optical axis can be recognized using the mark. In the manufacturing process of a semiconductor laser element or the like, a base material such as a silicon wafer is used. And the light emitting device is formed in a plurality of grids on the base material. Then, the base material is divided into light emitting devices. When gallium, indium, or phosphorus is used for the light emitting layer, these substances are water-soluble. Therefore, if the base material is cut while flowing pure water through the diamond blade, the light emitting layer is damaged. For this reason, when dividing | segmenting a base material, the method of cleaving along the crystal plane of a base material is performed.

  In the cleavage method, the divided surfaces vary in positions in the optical axis direction. Variations also occur in the position in the optical axis direction with respect to the mark. There is a place where light is emitted on the divided surface, and it is necessary to recognize the divided surface when aligning with the optical component. Therefore, there has been a demand for a light-emitting device that can accurately recognize a place where light is emitted even if the position of the surface formed by the division varies.

  The present invention has been made to solve the above-described problems, and can be realized as the following forms or application examples.

[Application Example 1]
A light-emitting device according to this application example, wherein the substrate, an emission unit that emits light from the side surface of the substrate, and a part of the shape including a side surface of the substrate in a plan view as viewed from the thickness direction of the substrate And.

  According to this application example, the light emitting device includes the substrate. The emitting unit emits light from the side surface of the substrate. The light emitting device has a mark, and part of the shape of the mark includes the side surface of the substrate in a plan view as viewed from the thickness direction of the substrate. Therefore, the position of the side surface of the substrate can be recognized by looking at the mark. And since light is inject | emitted from the side surface of a board | substrate, the position where light is inject | emitted in the optical axis direction of light can be recognized. Since the light emitting device is formed by being divided from the base material, variation occurs in the position of the side surface of the light emitting device. Since the mark indicates the position of the side surface, it is possible to accurately recognize the location where light is emitted using the mark even if the position of the side surface varies.

[Application Example 2]
In the light emitting device according to the application example described above, a part of the shape of the mark is parallel to the optical axis of the light.

  According to this application example, part of the shape of the mark is parallel to the optical axis of the light. Accordingly, since the mark indicates the direction of the optical axis, the direction of the optical axis can be accurately recognized using the mark.

[Application Example 3]
In the light emitting device according to the application example, the substrate includes an electrode for inputting a current, and the mark is a part of the electrode.

  According to this application example, the light emitting device includes an electrode for inputting a current. The mark is a part of the electrode. Therefore, a mark can be formed when forming an electrode. As a result, the mark can be formed with higher productivity than when the step of forming the electrode and the step of forming the mark are separated.

[Application Example 4]
In the light emitting device according to the application example described above, the substrate has a plurality of layers including a base substrate, and the mark is formed by unevenness of the base substrate.

  According to this application example, the substrate is a substrate in which a plurality of layers are stacked. By patterning the base substrate into the shape of the mark, unevenness in the shape of the mark can be formed on each layer stacked on the base substrate. Therefore, when forming the base substrate, irregularities corresponding to the marks can be formed. As a result, the mark can be formed with higher productivity than when the step of forming the layer and the step of forming the mark are separated.

[Application Example 5]
In the light emitting device according to the application example described above, the substrate includes a light emitting layer, and the mark is formed by unevenness of the light emitting layer.

  According to this application example, the substrate is a substrate including a light emitting layer. By patterning the light emitting layer into the shape of the mark, irregularities in the shape of the mark can be formed in each layer stacked on the light emitting layer. Accordingly, it is possible to form the unevenness corresponding to the mark when forming the light emitting layer. As a result, the mark can be formed with higher productivity than when the step of forming the light emitting layer and the step of forming the mark are separated.

[Application Example 6]
In the light emitting device according to the application example described above, the substrate includes an insulating layer, and the mark is formed by unevenness of the insulating layer.

  According to this application example, the substrate is a substrate including an insulating layer. By patterning the insulating layer into the shape of the mark, unevenness in the shape of the mark can be formed in the layer stacked on the insulating layer. Therefore, when the insulating layer is formed, irregularities corresponding to the marks can be formed. As a result, the mark can be formed with higher productivity than when the step of forming the insulating layer and the step of forming the mark are separated.

[Application Example 7]
In the light emitting device according to the application example described above, a plurality of the marks are provided.

  According to this application example, a plurality of marks are provided on the substrate. The relative position between the mark and the optical axis has a predetermined positional relationship. Therefore, the direction of the optical axis can be recognized from the direction of the line connecting two marks among the plurality of marks. And the accuracy of the direction of the line which connects two marks improves, so that two marks are separated. Therefore, the direction of the optical axis can be recognized with higher accuracy than when there is one mark.

[Application Example 8]
A method for manufacturing a light emitting device according to this application example, wherein an injection part is installed on a base material, a mark is installed on the base material, and the base material is arranged along a dividing line passing through the mark and the injection part. Is divided.

  According to this application example, the injection part and the mark are installed on the base material. Then, the base material is divided along a dividing line passing through the mark and the emission part. Therefore, the end of the emission part and a part of the mark are located on the dividing line. As a result, the position of the end of the emitting portion can be accurately recognized using the position of the mark in the direction orthogonal to the dividing line.

[Application Example 9]
A light emitting module according to this application example, comprising: a base substrate on which a first mark is installed; and a light emitting device installed on the base substrate, wherein the light emitting device emits light from a side surface of the substrate. And a second mark in which a part of the shape includes a side surface of the substrate in a plan view as viewed from the thickness direction of the substrate.

  According to this application example, the light emitting module includes the base substrate and the light emitting device. A first mark is provided on the base substrate, and a second mark is provided on the light emitting device. Therefore, the light emitting device can be installed with high positional accuracy with respect to the base substrate using the first mark and the second mark. The emission unit emits light from the side surface of the substrate. The light emitting device has a second mark, and a part of the shape of the second mark includes the side surface of the substrate in a plan view as viewed from the thickness direction of the substrate. Therefore, the position of the side surface of the substrate can be recognized by looking at the second mark. And since light is inject | emitted from the side surface of a board | substrate, the position where light comes out in the optical axis direction of light can be recognized. Since the light emitting device is formed by being divided from the base material, variation occurs in the position of the side surface of the light emitting device. Since the second mark indicates the position of the side surface, it is possible to accurately recognize the location where light is emitted to the base substrate using the second mark even when the position of the side surface varies. Therefore, even when the position of the side surface varies, the location of the injection portion relative to the base substrate can be installed with high accuracy.

[Application Example 10]
A method of manufacturing a light emitting module according to this application example, wherein an injection part is installed on a base material, a mark is installed on the base material, and the base material is placed along a dividing line passing through the mark and the injection part. A light emitting device is divided to form an alignment mark, a positioning mark is set on the base substrate, and the light emitting device is set on the base substrate using the positioning mark and the divided mark.

  According to this application example, the injection part and the mark are installed on the base material. Then, the base material is divided along a dividing line passing through the mark and the emission part. Therefore, the end of the emission part and a part of the mark are located on the dividing line. As a result, the position of the end of the emitting portion can be accurately recognized using the position of the mark in the direction orthogonal to the dividing line. An alignment mark is set on the base substrate. Then, the light emitting device is installed on the base substrate using the alignment mark and the divided marks. As a result, the injection unit can be installed on the base substrate with high positional accuracy.

[Application Example 11]
A projector according to this application example, wherein the light-emitting device according to any one of the above, a lens that collects light emitted from the light-emitting device, and light collected by the lens according to image information A light modulation device that modulates the light and a projection device that projects an image formed by the light modulation device.

  According to this application example, the lens collects the light emitted from the light emitting device. The light modulation device modulates the collected light. The projection device projects the modulated light. The light emitting device can place a light emitting place with high positional accuracy. Therefore, the alignment of the light emitting device can be easily performed using the mark. As a result, the projector of this application example can be a projector including a light emitting device that can be easily positioned.

[Application Example 12]
A communication apparatus according to this application example, comprising: a base substrate; a light emitting device installed on the base substrate; and an optical fiber installed on the base substrate, wherein the light emitting device emits light from a side surface of the substrate. The injection part which inject | emits, and the mark in which a part of shape is planar view seen from the thickness direction of the said board | substrate includes the side surface of the said board | substrate, It is characterized by the above-mentioned.

  According to this application example, the light emitting device and the optical fiber are installed on the base substrate. Light emitted from the light emitting device enters the optical fiber. By using the mark, the light emitting device can place the light emitting place on the base substrate with high positional accuracy. Therefore, alignment for aligning the positions of the optical fiber and the light emitting device can be easily performed. As a result, the communication device of this application example can be a communication device including a light emitting device whose installation position can be easily adjusted.

FIG. 2 is a block diagram illustrating a structure of an optical system of the projector according to the first embodiment. (A) is a schematic plan view which shows the structure of an optical module, (b) is a schematic sectional side view which shows the structure of an optical module. (A) is a typical sectional side view which shows the structure of a light emitting device, (b) is a schematic top view which shows the structure of a light emitting module. The schematic diagram for demonstrating the manufacturing method of a light-emitting device. The schematic diagram for demonstrating the manufacturing method of a light-emitting device. The schematic diagram for demonstrating the manufacturing method of a light-emitting device. In connection with the second embodiment, (a) is a schematic plan view of an essential part showing the structure of a light emitting device, and (b) is a schematic side sectional view showing the structure of the light emitting device. In connection with the third embodiment, (a) is a schematic plan view of an essential part showing the structure of a light emitting device, and (b) is a schematic side sectional view showing the structure of the light emitting device. In connection with the fourth embodiment, (a) is a schematic plan view of an essential part showing the structure of a light emitting device, and (b) is a schematic side sectional view showing the structure of the light emitting device. In connection with the fifth embodiment, (a) is a schematic plan view of an essential part showing the structure of a light emitting device, and (b) is a schematic side sectional view showing the structure of the light emitting device. In connection with the sixth embodiment, (a) is a schematic plan view of an essential part showing the structure of a light emitting device, and (b) is a schematic side sectional view showing the structure of the light emitting device. In connection with the seventh embodiment, (a) is a schematic plan view showing the structure of a communication device, and (b) is a schematic side view showing the structure of the communication device. The principal part expansion schematic diagram for demonstrating the cutting method of the board | substrate in a comparative example.

Hereinafter, embodiments will be described with reference to the drawings. In addition, each member in each drawing is illustrated with a different scale for each member in order to make the size recognizable on each drawing.
(First embodiment)
In the present embodiment, characteristic examples of a light emitting device, a light emitting module in which the light emitting device is installed, a projector in which the light emitting module is installed, and a method for manufacturing the light emitting module will be described with reference to FIGS. FIG. 1 is a block diagram showing the structure of the optical system of the projector.

  As shown in FIG. 1, the projector 1 includes a cross dichroic prism 2 located in the center of the drawing. A red optical system 3 is installed on the upper side of the cross dichroic prism 2 in the drawing, and a green optical system 4 is installed on the left side of the cross dichroic prism 2 in the drawing. A blue optical system 5 is installed below the cross dichroic prism 2 in the figure.

  The red optical system 3 emits a red image to the cross dichroic prism 2, and the green optical system 4 emits a green image to the cross dichroic prism 2. The blue optical system 5 emits a blue image to the cross dichroic prism 2.

  In the red optical system 3, a liquid crystal light valve 6 as a light modulator, a uniformizing optical system 7, and a red light source 8 as a light emitting device are installed in order from the side closer to the cross dichroic prism 2. The green optical system 4 and the blue optical system 5 have the same configuration as the red optical system 3. In the green optical system 4, a liquid crystal light valve 6, a uniformizing optical system 7, and a green light source 9 as a light emitting device are installed in order from the side closer to the cross dichroic prism 2. In the blue optical system 5, a liquid crystal light valve 6, a uniformizing optical system 7, and a blue light source 10 as a light emitting device are installed in order from the side closer to the cross dichroic prism 2.

  The red light source 8 is a light emitting module that emits red light, and the green light source 9 is a light emitting module that emits green light. The blue light source 10 is a light emitting module that emits blue light.

  The homogenizing optical system 7 includes a hologram 7a and a field lens 7b as a lens. The homogenizing optical system 7 makes the illuminance distribution of the light emitted from the red light source 8, the green light source 9, and the blue light source 10 uniform.

  The liquid crystal light valve 6 has a function of controlling transmission and blocking of light. The liquid crystal light valve 6 has a structure in which liquid crystal is sandwiched between opposing transparent plates. A transparent electrode in the form of a matrix is disposed on the transparent plate, and the liquid crystal is driven by an electric signal. Light is polarized by the liquid crystal. Further, the liquid crystal light valve 6 includes a polarizing plate, and transmits light polarized in a specific direction. By driving the liquid crystal with an electrical signal corresponding to image information, the liquid crystal light valve 6 can change the distribution of light passing therethrough to the distribution of light corresponding to the image. Controlling the light distribution in response to an electrical signal is called light modulation. Accordingly, the liquid crystal light valve 6 is a light modulation device and is a device for forming an image.

  The cross dichroic prism 2 is formed by bonding four right-angle prisms. On the inner surface of the cross dichroic prism 2, a dielectric multilayer film that reflects red light and a dielectric multilayer film that reflects blue light are arranged in a cross shape. These dielectric multilayer films combine three colors of light to form light representing a color image. Therefore, the cross dichroic prism 2 is a color light combining means.

  A projection lens 11 as a projection device is installed on the right side of the cross dichroic prism 2 in the figure, and a screen 12 is installed on the right side of the projection lens 11 in the figure. Then, the light synthesized by the cross dichroic prism 2 is projected onto the screen 12 by the projection lens 11, and an enlarged image is displayed. The projection lens 11 is a projection device, and the screen 12 is a display surface.

  In the above example, a transmissive liquid crystal light valve is used as the light modulation device. However, a light valve other than liquid crystal may be used, or a reflective light valve may be used. Examples of such a light valve include a reflection type liquid crystal light valve and a digital micromirror device (Digital Micromirror Device). Further, the configuration of the projection optical system is appropriately changed depending on the type of light valve used.

  Alternatively, an image display device such as a scanning projector that scans light from the red light source 8, the green light source 9, and the blue light source 10 on a screen may be used. In this apparatus as well, an image having a desired size can be displayed on the display surface using the red light source 8, the green light source 9, and the blue light source 10 using the scanning unit.

  Next, an optical module used for the red light source 8 will be described. The green light source 9 and the blue light source 10 have the same structure as the red light source 8, and a description thereof is omitted. FIG. 2A is a schematic plan view showing the structure of the optical module. FIG. 2B is a schematic side cross-sectional view showing the structure of the optical module, and is a view seen from the cross-sectional side along the line AA in FIG.

  As shown in FIG. 2, the light emitting module 13 includes a base substrate 14. The base substrate 14 has a bottomed rectangular tube shape, and includes a bottom portion 14a and a side wall portion 14b standing around the bottom portion 14a. The bottom portion 14a has a rectangular plate shape, and the longitudinal direction is the X direction. A direction perpendicular to the X direction in the planar direction of the bottom portion 14a is defined as a Y direction. The direction in which the side wall portion 14b is erected in the thickness direction of the bottom portion 14a is defined as the Z direction.

  Examples of the material of the base substrate 14 include Cu, Al, Mo, W, Si, C, Be, Au, a compound thereof (for example, AlN, BeO), and an alloy (for example, CuMo). it can. Further, the base substrate 14 can also be configured from a combination of these examples, for example, a multilayer structure of a copper (Cu) layer and a molybdenum (Mo) layer.

  A submount 15 is installed in the middle of the bottom portion 14 a, and a light emitting device 16 is installed on the submount 15. The thermal conductivity of the submount 15 is, for example, larger than the thermal conductivity of the light emitting device 16 and smaller than the thermal conductivity of the base substrate 14. The thermal conductivity of each of the base substrate 14 and the submount 15 is, for example, 140 W / mK or more. Examples of the material of the submount 15 include AlN, CuW, SiC, BeO, CuMo, CMC in which Cu and Mo are stacked, and the like. The submount 15 prevents warpage of the light emitting device 16 caused by a difference in coefficient of thermal expansion between the base substrate 14 and the light emitting device 16.

  The light-emitting device 16 has a rectangular parallelepiped shape that is long in the X direction, and is a super luminescent diode (super luminescent diode, hereinafter also referred to as “SLD”) that emits light 17 in the X direction and the −X direction. . In the present embodiment, the case where the light emitting device 16 is an InGaAlP-based (red) SLD will be described. Unlike a semiconductor laser, an SLD can prevent laser oscillation by suppressing the formation of a resonator due to end face reflection. As a result, speckle noise can be reduced. In the light emitting device 16, a place where the light 17 is emitted in the + X direction is a first emission part 16b as an emission part, and a place where the light 17 is emitted in the −X direction is a second emission part 16c as an emission part.

  In the light emitting device 16, a first element mark 18 as a second mark and a mark and a second element mark 21 as a mark and a mark are provided on the upper surface 16 a facing the Z direction. The first element mark 18 is located in the + X direction and the + Y direction of the upper surface 16a. The second element mark 21 is located in the −X direction and the −Y direction of the upper surface 16a.

  When the bottom portion 14a is viewed from the Z direction, a first base mark 22 as a first mark is provided on the bottom portion 14a on the + X side of the first element mark 18. Similarly, when the bottom portion 14a is viewed from the Z direction, a second base mark 23 as a first mark is provided on the bottom portion 14a on the −X side of the second element mark 21. The first element mark 18 to the second base mark 23 are marks used when the light emitting device 16 is installed on the base substrate 14.

  A first recess 14 c is formed on the + X direction side of the light emitting device 16. The first recess 14c has a quadrangular shape when viewed from the Z direction, and a first reflecting mirror 24 having a quadrangular surface on the bottom 14a side is installed in the first recess 14c. By installing the first reflecting mirror 24 according to the shape of the first recess 14c, the first reflecting mirror 24 is installed at a predetermined position. Similarly, a second recess 14 d is formed on the −X direction side of the light emitting device 16. The second recess 14d has a quadrangular shape when viewed from the Z direction, and a second reflecting mirror 25 having a quadrangular surface on the bottom 14a side is installed in the second recess 14d. By installing the second reflecting mirror 25 according to the shape of the second recess 14d, the second reflecting mirror 25 is installed at a predetermined position.

  The reflectance of the first reflecting mirror 24 and the second reflecting mirror 25 with respect to the light 17 is preferably higher than 50% and not higher than 100%. Examples of the material of the first reflecting mirror 24 and the second reflecting mirror 25 include Al, Ag, Au, and the like. For example, only the materials of the surfaces of the first reflecting mirror 24 and the second reflecting mirror 25 may be the above materials (for example, Al, Ag, Au).

  The first reflecting mirror 24 and the second reflecting mirror 25 have a triangular prism shape. And the angle which the optical axis 17a of the light 17 inject | emitted from the light emitting device 16 makes with the reflective surface of the 1st reflective mirror 24 is 45 degree | times. The light 17 emitted from the light emitting device 16 in the + X direction is reflected by the first reflecting mirror 24 and travels in the + Z direction. Similarly, the angle formed by the optical axis 17a of the light 17 emitted from the light emitting device 16 and the reflecting surface of the second reflecting mirror 25 is 45 degrees. Light 17 emitted from the light emitting device 16 in the −X direction is reflected by the second reflecting mirror 25 and travels in the + Z direction. Accordingly, the light 17 emitted from the light emitting module 13 travels in the + Z direction.

  A lid portion 26 is installed on the + Z direction side of the side wall portion 14b. The lid portion 26 is also referred to as a lid. 2A is a view in which the lid portion 26 is omitted for easy viewing. The lid portion 26 seals the light emitting device 16 provided in the concave portion 27 by sealing the concave portion 27 surrounded by the side wall portion 14 b of the base substrate 14. The material of the lid portion 26 is a material that is transparent to the wavelength of the light 17. Thereby, at least a part of the light 17 is transmitted through the lid portion 26. The material of the cover part 26 is not specifically limited, For example, quartz, glass, quartz, a plastic etc. can be used. These can be appropriately selected according to the wavelength of the light 17 emitted from the light emitting device 16. Thereby, the absorption loss of the light 17 can be reduced.

  A through electrode 28 is provided on the bottom 14 a on the −Y direction side of the light emitting device 16. The upper surface 16a of the light emitting device 16 and the through electrode 28 are connected by a connection member 29 such as wire bonding.

  FIG. 3A is a schematic side cross-sectional view showing the structure of the light-emitting device, as viewed from the cross-sectional side along the line BB in FIG. As shown in FIG. 3A, the first electrode 30 is provided on the submount 15. The first electrode 30 is provided with a convex portion 30a protruding in the Z direction in the middle of the Y direction. The convex portion 30 a is installed over the entire width of the light emitting device 16 in the X direction.

  An insulating layer 31 is provided on the + Y direction side and the −Y direction side with the convex portion 30a interposed therebetween. A contact layer 32 is provided so as to overlap the convex portion 30 a and the insulating layer 31. The contact layer 32 is in contact with the convex portion 30a. A first cladding layer 33 is provided so as to overlap the contact layer 32, and an active layer 34 is provided so as to overlap the first cladding layer 33. A portion of the active layer 34 facing the convex portion 30a is a gain region 35 that emits light. The center of the gain region 35 is the optical axis 17a.

  A second clad layer 36 is placed over the active layer 34, and a base substrate 37 is placed over the second clad layer 36. A second electrode 38 serving as an electrode is placed on the base substrate 37, and the first element mark 18 and the second element mark 21 are placed on the second electrode 38. A connection member 29 is connected to the second electrode 38, and the connection member 29 electrically connects the second electrode 38 and the through electrode 28. A substrate laminated from the first electrode 30 to the second electrode 38 is a laminated substrate 41 as a substrate.

  The first electrode 30 is electrically connected to the first cladding layer 33 through the contact layer 32. The first electrode 30 is one electrode for driving the light emitting device 16, and the first electrode 30 and the second electrode 38 are portions for inputting and outputting current. As the 1st electrode 30, the thing laminated | stacked in order of the Cr layer, the AuZn layer, and Au layer from the contact layer 32 side etc. can be used, for example. The planar shape of the contact surface between the protrusion 30 a of the first electrode 30 and the contact layer 32 is the same as the planar shape of the gain region 35. The current path between the first electrode 30 and the second electrode 38 is determined by the planar shape of the contact surface between the first electrode 30 and the contact layer 32. As a result, the planar shape of the gain region 35 is determined.

The insulating layer 31 is formed on the −Z direction side of the contact layer 32 other than the location facing the gain region 35. That is, the insulating layer 31 has an opening below the gain region 35, and the first electrode 30 and the contact layer 32 are in contact with each other in the opening. As the insulating layer 31, for example, a SiN layer, a SiO ₂ layer, a polyimide layer, or the like can be used. The insulating layer 31 has a function of limiting a place where current flows between the first electrode 30 and the contact layer 32 to the convex portion 30a.

  The contact layer 32 is formed between the first cladding layer 33 and the convex portion 30 a of the first electrode 30. The contact layer 32 is not particularly limited as long as it is in a layer in ohmic contact with the first electrode 30. The contact layer 32 may be a second conductivity type semiconductor. In the present embodiment, for example, a p-type GaAs layer is used for the contact layer 32.

  The first cladding layer 33 is formed between the contact layer 32 and the active layer 34. As the first cladding layer 33, for example, a second conductivity type (for example, p-type) AlGaInP layer or the like can be used. When a p-type first cladding layer 33 is used, a pin diode is configured by disposing an active layer 34 that is not doped with impurities and an n-type second cladding layer 36. Each of the first cladding layer 33 and the second cladding layer 36 is a layer having a larger forbidden band width and a smaller refractive index than the active layer 34.

  The active layer 34 constitutes a laminated structure sandwiched between the first cladding layer 33 and the second cladding layer 36. The active layer 34 has a function of amplifying light. The first cladding layer 33 and the second cladding layer 36 have a function of confining injected carriers (electrons and holes) and light with the active layer 34 interposed therebetween. The active layer 34 has, for example, a multiple quantum well (MQW) structure in which three quantum well structures each composed of an InGaP well layer and an InGaAlP barrier layer are stacked.

  The shape of the active layer 34 can be, for example, a rectangular parallelepiped or a cube. In the active layer 34, the first side surface which is the side surface on the + X direction side and the second side surface which is the side surface on the −X direction side face each other and are parallel to each other. The first side surface and the second side surface are surfaces that are not in contact with the first cladding layer 33 or the second cladding layer 36 in the interface of the active layer 34. In the laminated structure, the first side surface and the second side surface are exposed surfaces. A laminated structure of the first cladding layer 33, the active layer 34, and the second cladding layer 36 is sandwiched between the contact layer 32 and the base substrate 37.

  The gain region 35 is a part of the active layer 34 and is a place where current flows through the active layer 34. The gain region 35 can generate light 17 and the light 17 can receive gain within the gain region 35. The planar shape of the gain region 35 is not particularly limited, but is, for example, a rectangle in this embodiment. Light 17 is emitted from the first side surface 41a and the second side surface 41b.

  The second cladding layer 36 is disposed in contact with the active layer 34. As the second cladding layer 36, for example, an n-type AlGaInP layer or the like can be used. Although not shown, a buffer layer may be formed between the base substrate 37 and the second cladding layer 36. As the buffer layer, for example, an n-type GaAs layer, an InGaP layer, or the like can be used.

  As the base substrate 37, for example, an n-type first conductivity type GaAs substrate or the like can be used.

  The second electrode 38 is installed on the entire surface of the base substrate 37 and is electrically connected to the base substrate 37. The second electrode 38 is electrically connected to the second cladding layer 36 via the base substrate 37. The second electrode 38 is an electrode for driving the light emitting device 16, and is a part that inputs and outputs current together with the first electrode 30. As the second electrode 38, for example, a layer in which a Cr layer, an AuGe layer, a Ni layer, and an Au layer are stacked in this order from the base substrate 37 side can be used.

  A forward bias voltage of a pin diode is applied between the first electrode 30 and the second electrode 38. As a result, recombination of electrons and holes occurs in the gain region 35 of the active layer 34, and light emission occurs due to the recombination. Stimulated emission occurs in a chain manner starting from the generated light 17, and the light travels through the gain region 35 to amplify the light intensity. The light emitting device 16 emits light 17 from both the + X direction and the −X direction.

  FIG. 3B is a schematic plan view showing the structure of the light emitting module. As shown in FIG. 3B, the first element mark 18 and the second element mark 21 are provided on the second electrode 38. The first element mark 18 and the second element mark 21 are recessed by removing a part of the second electrode 38. Accordingly, the first element mark 18 and the second element mark 21 are part of the second electrode 38. When the second electrode 38 is formed, the first element mark 18 and the second element mark 21 can be formed. As a result, the first element mark 18 and the second element mark 21 are more productive than when the step of forming the second electrode 38 and the step of forming the first element mark 18 and the second element mark 21 are separated. Can be formed.

  Of the side surfaces of the multilayer substrate 41, the side surface on the + X direction side is defined as a first side surface 41a, and the −X direction side surface is defined as a second side surface 41b. The 1st injection part 16b is located in the 1st side 41a, and the 2nd injection part 16c is located in the 2nd side 41b. The first end side 18a that is the side on the + X direction side of the first element mark 18 in the planar shape viewed from the Z direction includes the first side surface 41a. Similarly, the second end side 21a that is the side on the −X direction side of the second element mark 21 includes the second side surface 41b. That is, the first element mark 18 and the second element mark 21 partially include the side surface of the multilayer substrate 41.

  In the planar shape viewed from the Z direction, the first end side 18a on the + X direction side of the first element mark 18 is on the same line as the first side surface 41a. Accordingly, by looking at the first element mark 18, the position of the light 17 on the first side surface 41a in the direction of the optical axis 17a can be recognized. And since light is inject | emitted from the 1st side surface 41a, the position where the light 17 goes out in the direction of the optical axis 17a of the light 17 can be recognized. Since the multilayer substrate 41 is formed by being divided from the mother board, variations occur in the position of the first side surface 41a. Since the first element mark 18 indicates the position of the first side face 41a, it is possible to accurately recognize the location where the light 17 is emitted using the first element mark 18 even if the position of the first side face 41a varies. it can.

  Also in the second element mark 21, the positional relationship between the second element mark 21 and the second side surface 41b is the same. Accordingly, since the second element mark 21 indicates the position of the second side surface 41b, even if the position of the second side surface 41b varies, the location where the light 17 is emitted is accurately recognized using the second element mark 21. be able to.

  The side on the −Y direction side of the first element mark 18 is defined as a first optical axis side 18b. The first optical axis side 18 b is a part of the shape of the first element mark 18. The first optical axis side 18 b is parallel to the optical axis 17 a of the light 17. Since the first optical axis side 18 b indicates the direction of the optical axis 17 a of the light 17, the direction of the optical axis 17 a of the light 17 can be accurately recognized using the first element mark 18. Similarly, the + Y direction side of the second element mark 21 is defined as a second optical axis side 21b. The second optical axis side 21 b is a part of the shape of the second element mark 21. The second optical axis side 21 b is parallel to the optical axis 17 a of the light 17. Since the second optical axis side 21b indicates the direction of the optical axis 17a of the light 17, the direction of the optical axis 17a of the light 17 can be accurately recognized using the second element mark 21.

  A plurality of marks of the first element mark 18 and the second element mark 21 are provided on the multilayer substrate 41. The relative positions of the first element mark 18, the second element mark 21 and the optical axis 17 a of the light 17 have a predetermined positional relationship set in advance. Therefore, the direction of the optical axis 17a of the light 17 can be recognized from the direction of the line connecting the first element mark 18 and the second element mark 21. As the first element mark 18 and the second element mark 21 are separated from each other, the accuracy in the direction of the line connecting the first element mark 18 and the second element mark 21 is improved. Therefore, the direction of the optical axis of the light 17 can be recognized with higher accuracy than when there is one mark.

  Next, the manufacturing method will be described in detail with reference to FIGS. 4-6 is a schematic diagram for demonstrating the manufacturing method of a light emitting module. As shown in FIG. 4A, a mother board 42 as a base material is prepared. The mother board 42 is a board having a size capable of arranging a plurality of base boards 37. The size of the mother board 42 is not particularly limited, but in the present embodiment, for example, 18 base substrates 37 are arranged in 3 rows and 6 columns.

  On the mother board 42, the second cladding layer 36, the active layer 34, the first cladding layer 33, and the contact layer 32 are epitaxially grown in this order. As a method of epitaxial growth, for example, a MOCVD (Metal Organic Chemical Deposition) method, an MBE (Molecular Beam Epitaxy) method, or the like can be used.

  As shown in FIG. 4B, an insulating layer 31 having an opening is formed on the contact layer 32. The insulating layer 31 is formed by, for example, a CVD (Chemical Vapor Deposition) method. The opening is formed, for example, by patterning the insulating part by photolithography technique and etching technique so that the contact layer 32 is exposed. A plurality of openings are provided with a planned cutting line 43 serving as a dividing line for cutting the mother board 42 in the plane direction.

  Next, the first electrode 30 is formed on the exposed contact layer 32 and insulating layer 31. Next, the second electrode 38 is formed on the lower surface of the mother board 42 in the drawing. The first electrode 30 and the second electrode 38 are formed by, for example, a vacuum evaporation method. The order of forming the first electrode 30 and the second electrode 38 is not particularly limited.

  As shown in FIG. 4C, the first element mark 18 and the second element mark 21 are provided on the second electrode 38. The first element mark 18 and the second element mark 21 are connected to each other. The first element mark 18 and the second element mark 21 are placed with the planned cutting line 43 in between. For example, the first element mark 18 and the second element mark 21 can be formed by patterning an insulating portion by a photolithography technique and an etching technique. The planned cutting line 43 is a line passing through the first injection part 16b and the second injection part 16c.

  As shown in FIG. 5A, the first electrode 30 side of the mother board 42 is bonded to the resin sheet 44. The resin sheet 44 is fixed to a frame (not shown). Next, the scrubbing wheel 45 is rolled along the planned cutting line 43 on the second electrode 38. As a result, a crack 46 is formed along the planned cutting line 43 in the mother board 42. The planned cutting lines 43 are set in a lattice shape, and the cracks 46 are also formed in a lattice shape.

  As shown in FIG. 5B, pressure is applied to the mother board 42 so that tension acts on the second electrode 38 side of the mother board 42. Since the crack is formed in the planned cutting line 43, the mother board 42 is cut along the planned cutting line 43. The laminated substrate 41 is formed from the mother board 42, and the cleaved surfaces become the first side surface 41a and the second side surface 41b. At this time, the mark formed by joining the first element mark 18 and the second element mark 21 sandwiches the planned cutting line 43, so that it is divided into the first element mark 18 and the second element mark 21. Thereby, a part of the first side surface 41 a becomes a part of the shape of the first element mark 18, and a part of the second side surface 41 b becomes a part of the shape of the second element mark 21. The planned cutting line 43 is a line passing through the first injection part 16b and the second injection part 16c. That is, the mother board 42 is divided along a planned cutting line 43 that passes through the first element mark 18, the second element mark 21, the first injection part 16 b and the second injection part 16 c.

  As shown in FIG. 5C, the first electrode 30 of the multilayer substrate 41 is mounted on the submount 15. As a mounting method, in addition to soldering, a conductive resin bonding method can be used. The light emitting device 16 is completed through the above steps.

  As shown in FIG. 6A, the base substrate 14 having the first recess 14c and the second recess 14d is formed by, for example, cutting. Next, the through electrode 28 is formed on the base substrate 14. A through hole is formed in the bottom portion 14a by a known method. Next, an insulating member is arrange | positioned so that the side surface inside a through-hole may be covered. The insulating member is formed so as not to block the through hole. The insulating member is formed by, for example, a CVD method. Next, a rod-shaped terminal is inserted inside the insulating member. It is also possible to use a method in which an insulating member formed around a rod-shaped terminal is inserted into the through hole.

  Next, the first base mark 22 and the second base mark 23 are installed on the surface of the bottom portion 14a on the Z direction side. For the first base mark 22 and the second base mark 23, various methods such as offset printing and printing using an inkjet method can be used.

  As illustrated in FIG. 6B, the light emitting device 16 is mounted on the bottom portion 14 a of the base substrate 14 using an assembly apparatus 47 such as a robot. The base substrate 14 and the submount 15 can be joined using a joining member 51 such as solder paste or conductive resin adhesion. The assembling apparatus 47 includes a robot hand 48, a first imaging device 49, and a second imaging device 50. The robot hand 48 includes a vacuum pump and can adsorb and hold the light emitting device 16. The first imaging device 49 and the second imaging device 50 are provided with an autofocus device, and it is possible to individually focus on marks at a distant place. First, the joining member 51 is installed on the base substrate 14 where the submount 15 is installed. Various printing methods and syringes can be used to install the joining member 51.

  Next, the assembling apparatus 47 causes the robot hand 48 to grip the light emitting device 16 and moves the light emitting device 16 to a location facing the joining member 51. Next, the assembling apparatus 47 causes the first imaging device 49 to image the first element mark 18 and the first base mark 22. The assembling apparatus 47 accurately recognizes the position of the first emitting portion 16b and the direction of the optical axis 17a of the light 17 from the position and orientation of the first end side 18a and the first optical axis side 18b of the first element mark 18.

  Next, the assembling device 47 causes the second imaging device 50 to image the second element mark 21 and the second base mark 23. The assembling apparatus 47 accurately recognizes the position of the second emitting portion 16c and the direction of the optical axis 17a of the light 17 from the position and orientation of the second end side 21a and the second optical axis side 21b of the second element mark 21.

  The assembling apparatus 47 calculates the position where the light emitting device 16 is to be installed from the first base mark 22 and the second base mark 23. Then, the assembling apparatus 47 controls the robot hand 48 so as to install the light emitting device 16 on the base substrate 14 so that the first injection unit 16b and the second injection unit 16c are close to the positions where installation is planned. Therefore, the light emitting device 16 is installed with high positional accuracy with respect to the base substrate 14 in the X direction and the Y direction.

  The direction of the optical axis 17a may be recognized from the direction of the line connecting the first element mark 18 and the second element mark 21. As the first element mark 18 and the second element mark 21 are separated from each other, the accuracy of the direction of the line connecting the first element mark 18 and the second element mark 21 is improved. Therefore, the direction of the optical axis 17a can be recognized with high accuracy.

  Next, the bonding member 51 is heated to fix the submount 15 to the base substrate 14. As a result, as shown in FIG. 6C, the light emitting device 16 is mounted on the base substrate 14 with high positional accuracy.

  Next, as shown in FIG. 6D, the through electrode 28 and the second electrode 38 of the light emitting device 16 are connected by the connection member 29. This step is performed by, for example, wire bonding.

  Next, as shown in FIG. 6E, the first reflecting mirror 24 is pressed against the first recess 14c to be installed and fixed. Similarly, the second reflecting mirror 25 is installed by being pressed against the second recess 14d. The first reflecting mirror 24 and the second reflecting mirror 25 may be fixed using an adhesive. The first reflecting mirror 24 and the second reflecting mirror 25 may increase the reflectivity by forming a film on the surface by vapor deposition, for example. The step of connecting the through electrode 28 and the second electrode 38 and the step of installing the first reflecting mirror 24 and the second reflecting mirror 25 may be switched in order.

  Next, the lid portion 26 is bonded to the base substrate 14 in a nitrogen atmosphere, for example. Thereby, the light emitting device 16 is sealed. The light emitting module 13 is completed through the above steps.

As described above, this embodiment has the following effects.
(1) According to this embodiment, the first emission unit 16 b and the second emission unit 16 c emit light from the side surface of the multilayer substrate 41. Part of the shape of the first element mark 18 and the second element mark 21 includes the first side surface 41 a and the second side surface 41 b of the multilayer substrate 41 in a plan view as viewed from the thickness direction of the multilayer substrate 41. Therefore, the positions of the first side surface 41 a and the second side surface 41 b of the multilayer substrate 41 can be recognized by looking at the first element mark 18 and the second element mark 21. And since the light 17 is inject | emitted from the 1st side surface 41a and the 2nd side surface 41b of the laminated substrate 41, the position where the light 17 goes out in the direction of the optical axis 17a of the light 17 can be recognized. Since the light emitting device 16 is formed separately from the mother board 42, the positions of the first side surface 41a and the second side surface 41b of the light emitting device 16 vary. Since the first element mark 18 and the second element mark 21 indicate the positions of the side surfaces, even if the positions of the first side surface 41a and the second side surface 41b vary, the first element mark 18 and the second element mark 21 are used. The place where the light 17 emits light can be accurately recognized.

  (2) According to the present embodiment, the first optical axis side 18 b that is a part of the first element mark 18 is parallel to the optical axis 17 a of the light 17. Accordingly, since the first element mark 18 indicates the direction of the optical axis 17a, the direction of the optical axis 17a can be accurately recognized using the first element mark 18. Similarly, the second element mark 21 has a second optical axis side 21b, which is a part of the shape, parallel to the optical axis 17a of the light 17. Accordingly, since the second element mark 21 indicates the direction of the optical axis 17a, the direction of the optical axis 17a can be accurately recognized using the second element mark 21.

  (3) According to this embodiment, the light emitting device 16 includes the second electrode 38 that sends electricity to the active layer 34. The first element mark 18 and the second element mark 21 are part of the second electrode 38. Therefore, the first element mark 18 and the second element mark 21 can be formed when the second electrode 38 is formed. As a result, the first element mark 18 and the second element mark 21 are more productive than when the step of forming the second electrode 38 and the step of forming the first element mark 18 and the second element mark 21 are separated. Can be formed.

  (4) According to this embodiment, the first element mark 18 and the second element mark 21 are provided on the multilayer substrate 41. The relative positions of the first element mark 18 and the second element mark 21 and the optical axis 17a have a predetermined positional relationship set in advance. Therefore, the direction of the optical axis 17 a can be recognized from the direction of the line connecting the first element mark 18 and the second element mark 21. And the accuracy of the direction of the line which connects the 1st element mark 18 and the 2nd element mark 21 improves, so that two marks are separated. Therefore, the direction of the optical axis 17a can be recognized with higher accuracy than when there is one mark.

  (5) According to the present embodiment, the mother board 42 is divided along the planned cutting line 43 that passes through the first element mark 18 and the second element mark 21, and the first emission part 16 b and the second emission part 16 c. Therefore, the first emission part 16b and the second emission part 16c and the first element mark 18 and a part of the second element mark 21 are positioned on the planned cutting line 43. As a result, the positions of the first emission part 16b and the second emission part 16c can be accurately recognized using the positions of the first element mark 18 and the second element mark 21 in the direction orthogonal to the planned cutting line 43.

  (6) According to the present embodiment, the light emitting device 16 is installed on the base substrate 14 using the first base mark 22, the second base mark 23, the first element mark 18, and the second element mark 21. By using the positions of the first element mark 18 and the second element mark 21 in the direction orthogonal to the planned cutting line 43, the positions of the first emission part 16b and the second emission part 16c can be accurately recognized. As a result, the first injection unit 16b and the second injection unit 16c can be installed on the base substrate 14 with high positional accuracy.

(Second Embodiment)
Next, an embodiment of a light emitting device will be described with reference to FIG. Fig.7 (a) is a principal part schematic top view which shows the structure of a light-emitting device. FIG. 7B is a schematic side cross-sectional view showing the structure of the light emitting device, and is a schematic cross-sectional view taken along the line CC in FIG. 7A. This embodiment is different from the first embodiment in that an alignment mark is provided on the first electrode. Note that description of the same points as in the first embodiment is omitted.

  That is, in this embodiment, as shown in FIG. 7, the light emitting device 54 includes a laminated substrate 55 and is installed on the submount 15. The laminated substrate 55 includes a second electrode 56, a base substrate 37, a second cladding layer 36, an active layer 34, a first cladding layer 33, a contact layer 32, an insulating layer 31, and a first electrode as an electrode in order from the submount 15 side. 57 are stacked. The first electrode 57 is provided with a convex portion 57 a in the middle of the Y direction, and the convex portion 57 a is in contact with the contact layer 32.

  A portion of the active layer 34 that faces the convex portion 57 a is a gain region 35 that emits light 17. Light 17 is emitted from the first side surface 55 a that is the end surface of the laminated substrate 55 on the + X direction side. A place where the light 17 is emitted from the first side surface 55a is defined as a first emission portion 54b. The first emission part 54 b is located in the gain region 35.

  The first electrode 57 is provided with a first element mark 58 as a mark. The first end side 58a which is the side on the + X direction side of the first element mark 58 in the planar shape viewed from the Z direction includes the first side surface 55a. The first element mark 58 includes a first side surface 55 a whose part is the side surface of the multilayer substrate 55.

  In the planar shape viewed from the Z direction, the first end side 58a on the + X direction side of the first element mark 58 is on the same line as the first side surface 55a. Accordingly, by viewing the first element mark 58, the position of the light 17 on the first side surface 55a in the direction of the optical axis 17a can be recognized. And since light is inject | emitted from the 1st side surface 55a, the position where the light 17 goes out in the direction of the optical axis 17a of the light 17 can be recognized. Since the multilayer substrate 55 is formed by being divided from the mother board, the position of the first side surface 55a varies. Since the first element mark 58 indicates the position of the first side surface 55a, it is possible to accurately recognize the location where the light 17 is emitted using the first element mark 58 even if the position of the first side surface 55a varies. it can.

  The side on the −Y direction side of the first element mark 58 is defined as a first optical axis side 58b. The first optical axis side 58 b is a part of the shape of the first element mark 58. The first optical axis side 58 b is parallel to the optical axis 17 a of the light 17. Since the first optical axis side 58b indicates the direction of the optical axis 17a of the light 17, it is possible to accurately recognize the direction of the optical axis 17a of the light 17 using the first element mark 58.

As described above, this embodiment has the following effects.
(1) According to the present embodiment, the light emitting device 54 has the first element mark 58, and a part of the shape of the first element mark 58 in the plan view as viewed from the thickness direction of the multilayer substrate 55 is the multilayer substrate 55. The first side surface 55a is included. Therefore, the position of the first side surface 55 a of the multilayer substrate 55 can be recognized by looking at the first element mark 58. Since the first element mark 58 indicates the position of the first side surface 55a, the location of the first emitting portion 54b where the light 17 is emitted using the first element mark 58 even if the position of the first side surface 55a varies. It can be recognized accurately.

  (2) According to the present embodiment, the first optical axis side 58b, which is a part of the shape of the first element mark 58, is parallel to the optical axis 17a of the light 17. Accordingly, since the first element mark 58 indicates the direction of the optical axis 17a, the direction of the optical axis 17a can be accurately recognized using the first element mark 58.

  (3) According to this embodiment, the light emitting device 54 includes the first electrode 57 that sends electricity to the active layer 34. The first element mark 58 is a part of the first electrode 57. Accordingly, the first element mark 58 can be formed when the first electrode 57 is formed. As a result, the first element mark 58 can be formed with higher productivity than when the step of forming the first electrode 57 and the step of forming the first element mark 58 are separated.

(Third embodiment)
Next, an embodiment of a light emitting device will be described with reference to FIG. Fig.8 (a) is a principal part schematic top view which shows the structure of a light-emitting device. FIG. 8B is a schematic side cross-sectional view showing the structure of the light-emitting device, and is a schematic cross-sectional view taken along the line DD in FIG. This embodiment is different from the first embodiment in that a recess corresponding to the alignment mark of the second electrode is provided in the base substrate. Note that description of the same points as in the first embodiment is omitted.

  That is, in the present embodiment, as illustrated in FIG. 8, the light emitting device 61 includes a multilayer substrate 62, and the multilayer substrate 62 is installed on the submount 15. The laminated substrate 62 includes a first electrode 30, an insulating layer 31, a contact layer 32, a first cladding layer 33, an active layer 34, a second cladding layer 36, a base substrate 63, and a second electrode as an electrode in order from the submount 15 side. 64 are laminated. The first electrode 30 is provided with a convex portion 30 a in the middle of the Y direction, and the convex portion 30 a is in contact with the contact layer 32.

  A portion of the active layer 34 facing the convex portion 30 a is a gain region 35 that emits light 17. Light 17 is emitted from the first side surface 62 a that is the end surface of the laminated substrate 62 on the + X direction side. A place where the light 17 is emitted from the first side face 62a is defined as a first emission part 61b.

  The base substrate 63 has a recess 63a as an unevenness on the surface in the Z direction. The recess 63a can be formed using a photolithography method and an etching method. The second electrode 64 is formed with a first element mark 65 as a mark recessed in the shape of the recess 63a. The second electrode 64 is formed by vapor deposition, sputtering, CVD, or the like. Accordingly, the first element mark 65 has a shape that follows the shape of the recess 63a. That is, the first element mark 65 is formed by the recess 63 a of the base substrate 63. In the planar shape viewed from the Z direction, the first end side 65a that is the side on the + X direction side of the first element mark 65 includes the first side surface 62a. The first element mark 65 includes a first side surface 62 a whose part is the side surface of the multilayer substrate 62.

  In the planar shape viewed from the Z direction, the first end side 65a on the + X direction side of the first element mark 65 is on the same line as the first side surface 62a. Therefore, by looking at the first element mark 65, the position of the light 17 on the first side surface 62a in the direction of the optical axis 17a can be recognized. And since the light 17 is inject | emitted from the 1st side surface 62a, the position of the 1st emission part 61b from which the light 17 emits in the direction of the optical axis 17a of the light 17 can be recognized. Since the multilayer substrate 62 is formed separately from the mother board, variation occurs in the position of the first side surface 62a. Since the first element mark 65 indicates the position of the first side surface 62a, it is possible to accurately recognize the location where the light 17 is emitted using the first element mark 65 even if the position of the first side surface 62a varies. it can.

  The side on the −Y direction side of the first element mark 65 is defined as a first optical axis side 65b. The first optical axis side 65 b is a part of the shape of the first element mark 65. The first optical axis side 65 b is parallel to the optical axis 17 a of the light 17. Since the first optical axis side 65 b indicates the direction of the optical axis 17 a of the light 17, the direction of the optical axis 17 a of the light 17 can be accurately recognized using the first element mark 65.

As described above, this embodiment has the following effects.
(1) According to the present embodiment, the light emitting device 61 has the first element mark 65, and a part of the shape of the first element mark 65 in the plan view viewed from the thickness direction of the multilayer substrate 62 is The first side surface 62a is included. Therefore, the position of the first side surface 62 a of the multilayer substrate 62 can be recognized by looking at the first element mark 65. Since the first element mark 65 indicates the position of the first side face 62a, the location of the first emitting portion 61b where the light 17 is emitted using the first element mark 65 even if the position of the first side face 62a varies. It can be recognized accurately.

  (2) According to the present embodiment, the first optical axis side 65 b that is a part of the shape of the first element mark 65 is parallel to the optical axis 17 a of the light 17. Accordingly, since the first element mark 65 indicates the direction of the optical axis 17a, the direction of the optical axis 17a can be accurately recognized using the first element mark 65.

  (3) According to this embodiment, the base substrate 63 serving as the basis of the multilayer substrate 62 is provided. The shape of the first element mark 65 is formed by the recess 63 a of the base substrate 63. When the base substrate 63 is formed, the recess 63a corresponding to the first element mark 65 can be formed. As a result, the first element mark 65 can be formed with higher productivity than when the step of forming the base substrate 63 and the step of forming the first element mark 65 are separated.

(Fourth embodiment)
Next, an embodiment of a light emitting device will be described with reference to FIG. Fig.9 (a) is a principal part schematic top view which shows the structure of a light-emitting device. FIG. 9B is a schematic side cross-sectional view showing the structure of the light-emitting device, and is a schematic cross-sectional view taken along the line EE in FIG. This embodiment is different from the first embodiment in that a recess corresponding to the alignment mark is provided on the base substrate. Note that the description of the same points as in the second embodiment will be omitted.

  That is, in the present embodiment, as shown in FIG. 9, the light emitting device 68 includes a multilayer substrate 69, and the multilayer substrate 69 is installed on the submount 15. The laminated substrate 69 includes, in order from the submount 15 side, a second electrode 56, a base substrate 70, a second cladding layer 71, an active layer 72, a first cladding layer 73, a contact layer 74, an insulating layer 75, and a first electrode as an electrode. 76 is laminated. The first electrode 76 is provided with a convex portion 76 a in the middle of the Y direction, and the convex portion 76 a is in contact with the contact layer 74.

  A portion of the active layer 72 that faces the convex portion 76 a is a gain region 35 that emits light 17. Light 17 is emitted from the first side surface 69 a that is the end surface of the laminated substrate 69 on the + X direction side. A place where the light 17 is emitted from the first side surface 69a is defined as a first emission portion 68b.

  The base substrate 70 has a recess 70a as an unevenness on the surface in the Z direction. On the Z direction side of the recess 70a, a recess 71a in which the second cladding layer 71 is recessed is formed at a location facing the recess 70a. Further, a recess 72a in which the active layer 72 is recessed is formed at a position facing the recess 71a on the Z direction side of the recess 71a. Further, a recess 73a in which the first cladding layer 73 is recessed is formed on the Z direction side of the recess 72a at a location facing the recess 72a. Further, a recess 74a in which the contact layer 74 is recessed is formed on the Z direction side of the recess 73a at a location facing the recess 73a. Further, a recess 75a in which the insulating layer 75 is recessed is formed on the Z direction side of the recess 74a at a location facing the recess 74a. Furthermore, a first element mark 77 is formed on the Z direction side of the recess 75a as a mark in which the first electrode 76 is recessed at a location facing the recess 75a.

  The recess 70a can be formed using a photolithography method and an etching method. The second cladding layer 71, the active layer 72, the first cladding layer 73, the contact layer 74, the insulating layer 75, and the first electrode 76 are formed by vapor deposition, sputtering, CVD, or the like. Therefore, the first element mark 77 has a shape that follows the shape of the recess 70a. That is, the first element mark 77 is formed by the recess 70 a of the base substrate 70. The first end side 77a which is the side on the + X direction side of the first element mark 77 in the planar shape viewed from the Z direction includes a first side surface 69a. The first element mark 77 includes a first side surface 69 a in which a part of the shape is a side surface of the multilayer substrate 69.

  In the planar shape viewed from the Z direction, the first end side 77a on the + X direction side of the first element mark 77 is on the same line as the first side surface 69a. Accordingly, by looking at the first element mark 77, the position of the light 17 on the first side surface 69a in the direction of the optical axis 17a can be recognized. And since light is inject | emitted from the 1st side surface 69a, the position of the 1st emission part 68b from which the light 17 emits in the direction of the optical axis 17a of the light 17 can be recognized. Since the multilayer substrate 69 is formed separately from the mother board, variations occur in the position of the first side surface 69a. Since the first element mark 77 indicates the position of the first side surface 69a, it is possible to accurately recognize the location where the light 17 is emitted using the first element mark 77 even if the position of the first side surface 69a varies. it can.

  The side on the −Y direction side of the first element mark 77 is defined as a first optical axis side 77b. The first optical axis side 77 b is a part of the shape of the first element mark 77. The first optical axis side 77 b is parallel to the optical axis 17 a of the light 17. Since the first optical axis side 77 b indicates the direction of the optical axis 17 a of the light 17, the direction of the optical axis 17 a of the light 17 can be accurately recognized using the first element mark 77.

As described above, this embodiment has the following effects.
(1) According to this embodiment, the light emitting device 68 has the first element mark 77, and a part of the shape of the first element mark 77 in the plan view as viewed from the thickness direction of the multilayer substrate 69 is The first side surface 69a is included. Therefore, the position of the first side surface 69 a of the multilayer substrate 69 can be recognized by looking at the first element mark 77. Since the first element mark 77 indicates the position of the first side surface 69a, the position of the first emitting portion 68b where the light 17 is emitted using the first element mark 77 even if the position of the first side surface 69a varies. It can be recognized accurately.

  (2) According to the present embodiment, the first optical axis side 77 b, which is a part of the first element mark 77, is parallel to the optical axis 17 a of the light 17. Accordingly, since the first element mark 77 indicates the direction of the optical axis 17a, the direction of the optical axis 17a can be accurately recognized using the first element mark 77.

  (3) According to the present embodiment, the multilayer substrate 62 includes the base substrate 70 serving as a basis. The shape of the first element mark 77 is formed by the recess 70 a of the base substrate 70. When the base substrate 70 is formed, a recess 70 a corresponding to the first element mark 77 can be formed. As a result, the first element mark 77 can be formed with higher productivity than when the step of forming the base substrate 70 and the step of forming the first element mark 77 are separated.

(Fifth embodiment)
Next, an embodiment of a light emitting device will be described with reference to FIG. FIG. 10A is a schematic plan view of an essential part showing the structure of the light emitting device. FIG. 10B is a schematic side cross-sectional view illustrating the structure of the light emitting device, and is a schematic cross-sectional view taken along the line FF in FIG. This embodiment is different from the first embodiment in that a recess corresponding to the alignment mark is provided in the insulating layer. Note that the description of the same points as in the second embodiment will be omitted.

  That is, in the present embodiment, as illustrated in FIG. 10, the light emitting device 80 includes a multilayer substrate 81, and the multilayer substrate 81 is installed on the submount 15. In the laminated substrate 81, the second electrode 56, the base substrate 37, the second cladding layer 36, the active layer 34, the first cladding layer 33, the contact layer 32, the insulating layer 82, and the first electrode 76 are laminated in order from the submount 15 side. Has been. The first electrode 76 is provided with a convex portion 76 a in the middle of the Y direction, and the convex portion 76 a is in contact with the contact layer 32.

  A portion of the active layer 34 that faces the convex portion 76 a is a gain region 35 that emits light 17. Light 17 is emitted from the first side surface 81 a which is the end surface of the laminated substrate 81 on the + X direction side. A place where the light 17 is emitted from the first side surface 81a is defined as a first emitting portion 80b.

  The insulating layer 82 has a recess 82a on the surface in the Z direction. A first element mark 83 is formed on the Z direction side of the recess 82a as a mark in which the first electrode 76 is recessed at a location facing the recess 82a.

  The recess 82a can be formed by using a photolithography method and an etching method. The first electrode 76 is formed by vapor deposition, sputtering, CVD, or the like. Accordingly, the first element mark 83 has a shape that follows the shape of the recess 82a. That is, the first element mark 83 is formed by the recess 82 a of the insulating layer 82.

  A first element mark 83 is provided on the first electrode 76. The first end side 83a that is the side on the + X direction side of the first element mark 83 in the planar shape viewed from the Z direction includes the first side surface 81a. Therefore, the first element mark 83 includes the first side surface 81 a in which a part of the shape is the side surface of the multilayer substrate 81.

  In the planar shape viewed from the Z direction, the first end side 83a on the + X direction side of the first element mark 83 is on the same line as the first side surface 81a. Accordingly, by looking at the first element mark 83, the position of the light 17 on the first side surface 81a in the direction of the optical axis 17a can be recognized. And since light is inject | emitted from the 1st side surface 81a, the position of the 1st emission part 80b from which the light 17 emits in the direction of the optical axis 17a of the light 17 can be recognized. Since the multilayer substrate 81 is formed separately from the mother board, variations occur in the position of the first side surface 81a. Since the first element mark 83 indicates the position of the first side surface 81a, it is possible to accurately recognize the location where the light 17 is emitted using the first element mark 83 even if the position of the first side surface 81a varies. it can.

  The side on the −Y direction side of the first element mark 83 is defined as a first optical axis side 83b. The first optical axis side 83 b is a part of the shape of the first element mark 83. The first optical axis side 83 b is parallel to the optical axis 17 a of the light 17. Since the first optical axis side 83b indicates the direction of the optical axis 17a of the light 17, the direction of the optical axis 17a of the light 17 can be accurately recognized using the first element mark 83.

As described above, this embodiment has the following effects.
(1) According to this embodiment, the light emitting device 80 has the first element mark 83, and a part of the shape of the first element mark 83 in the plan view when viewed from the thickness direction of the multilayer substrate 81 is the multilayer substrate 81. The first side surface 81a is included. Therefore, the position of the first side surface 81 a of the multilayer substrate 81 can be recognized by looking at the first element mark 83. Since the first element mark 83 indicates the position of the first side surface 81a, the location of the first emitting portion 80b where the light 17 is emitted using the first element mark 83 even if the position of the first side surface 81a varies. It can be recognized accurately.

  (2) According to the present embodiment, the first optical axis side 83 b, which is a part of the shape of the first element mark 83, is parallel to the optical axis 17 a of the light 17. Accordingly, since the first element mark 83 indicates the direction of the optical axis 17a, the direction of the optical axis 17a can be accurately recognized using the first element mark 83.

  (3) According to this embodiment, the light emitting device 80 includes the first electrode 76 that sends electricity to the active layer 34. The shape of the first element mark 83 is formed by the recess 82 a of the insulating layer 82. When forming the insulating layer 82, the recess 82a corresponding to the first element mark 83 can be formed. As a result, the first element mark 83 can be formed with higher productivity than when the step of forming the insulating layer 82 and the step of forming the first element mark 83 are separated.

(Sixth embodiment)
Next, an embodiment of a light emitting device will be described with reference to FIG. Fig.11 (a) is a principal part schematic top view which shows the structure of a light-emitting device. FIG. 11B is a schematic side cross-sectional view showing the structure of the light-emitting device, and is a schematic cross-sectional view taken along the line GG in FIG. This embodiment is different from the first embodiment in that a recess corresponding to the alignment mark is provided in the active layer. Note that the description of the same points as in the second embodiment will be omitted.

  That is, in the present embodiment, as shown in FIG. 11, the light emitting device 86 includes a multilayer substrate 87, and the multilayer substrate 87 is installed on the submount 15. The laminated substrate 87 includes, in order from the submount 15 side, the second electrode 56, the base substrate 37, the second cladding layer 36, the active layer 88 as the light emitting layer, the first cladding layer 73, the contact layer 74, the insulating layer 75, the first layer. An electrode 76 is stacked. The first electrode 76 is provided with a convex portion 76 a in the middle of the Y direction, and the convex portion 76 a is in contact with the contact layer 74.

  A portion of the active layer 88 facing the convex portion 76 a is a gain region 35 that emits light 17. Light 17 is emitted from the first side surface 87 a which is the end surface of the laminated substrate 87 on the + X direction side. A place where the light 17 is emitted from the first side surface 87a is defined as a first emitting portion 86b.

  The active layer 88 is formed with a hole 88a as an unevenness. On the Z direction side of the hole 88a, a recess 73a in which the first cladding layer 73 is recessed is formed at a location facing the hole 88a. Further, a recess 74a in which the contact layer 74 is recessed is formed on the Z direction side of the recess 73a at a location facing the recess 73a. Further, a recess 75a in which the insulating layer 75 is recessed is formed on the Z direction side of the recess 74a at a location facing the recess 74a. Further, a first element mark 89 is formed on the Z direction side of the recess 75a as a mark in which the first electrode 76 is recessed at a location facing the recess 75a.

  The hole 88a can be formed by using a photolithography method and an etching method. The first cladding layer 73, the contact layer 74, the insulating layer 75, and the first electrode 76 are formed by vapor deposition, sputtering, CVD, or the like. Accordingly, the first element mark 89 has a shape that follows the shape of the hole 88a. That is, the first element mark 89 is formed by the hole 88 a of the active layer 88. The first end side 89a that is the side on the + X direction side of the first element mark 89 in the planar shape viewed from the Z direction includes the first side surface 87a. The first element mark 89 includes a first side surface 87 a in which a part of the shape is the side surface of the multilayer substrate 87.

  In the planar shape viewed from the Z direction, the first end side 89a on the + X direction side of the first element mark 89 is on the same line as the first side surface 87a. Accordingly, by looking at the first element mark 89, the position of the light 17 on the first side surface 87a in the direction of the optical axis 17a can be recognized. And since light is inject | emitted from the 1st side surface 87a, the position of the 1st emission part 86b from which the light 17 emits in the direction of the optical axis 17a of the light 17 can be recognized. Since the laminated substrate 87 is formed separately from the mother board, variations occur in the position of the first side surface 87a. Since the first element mark 89 indicates the position of the first side surface 87a, it is possible to accurately recognize the location where the light 17 is emitted using the first element mark 89 even if the position of the first side surface 87a varies. it can.

  The side on the −Y direction side of the first element mark 89 is defined as a first optical axis side 89b. The first optical axis side 89 b is a part of the shape of the first element mark 89. The first optical axis side 89 b is parallel to the optical axis 17 a of the light 17. Since the first optical axis side 89b indicates the direction of the optical axis 17a of the light 17, it is possible to accurately recognize the direction of the optical axis 17a of the light 17 using the first element mark 89.

As described above, this embodiment has the following effects.
(1) According to the present embodiment, the light emitting device 86 has the first element mark 89, and a part of the shape of the first element mark 89 in the plan view when viewed from the thickness direction of the multilayer substrate 87 is the multilayer substrate 87. A first side 87a is included. Therefore, the position of the first side surface 87 a of the multilayer substrate 87 can be recognized by looking at the first element mark 89. Since the first element mark 89 indicates the position of the first side surface 87a, the location of the first emitting portion 86b where the light 17 is emitted using the first element mark 89 even if the position of the first side surface 87a varies. It can be recognized accurately.

  (2) According to the present embodiment, the first element mark 89 has a first optical axis side 89 b which is a part of the shape, parallel to the optical axis 17 a of the light 17. Accordingly, since the first element mark 89 indicates the direction of the optical axis 17a, the direction of the optical axis 17a can be accurately recognized using the first element mark 89.

  (3) According to the present embodiment, the multilayer substrate 87 includes the active layer 88. The shape of the first element mark 89 is formed by the hole 88 a of the active layer 88. When forming the active layer 88, a hole 88a corresponding to the first element mark 89 can be formed. As a result, the first element mark 89 can be formed with higher productivity than when the step of forming the active layer 88 and the step of forming the first element mark 89 are separated.

(Seventh embodiment)
Next, an embodiment of a communication apparatus in which a light emitting device is installed will be described with reference to FIG. FIG. 12A is a schematic plan view showing the structure of the communication device, and FIG. 12B is a schematic side view showing the structure of the communication device. The light emitting device described above is installed in the communication apparatus of this embodiment. In addition, description is abbreviate | omitted about the same point as said embodiment.

  That is, in the present embodiment, as shown in FIG. 12, a communication device 91 as a communication device includes a base substrate 92. The base substrate 92 has a plate shape and has a rectangular planar shape. The longitudinal direction of the rectangle is the X direction, and the direction orthogonal to the X direction on the plane is the Y direction. The thickness direction of the base substrate 92 is defined as the Z direction.

  A support plate 93 is installed in the middle of the base substrate 92, and a light emitting device 94 is installed on the support plate 93. Any of the light emitting devices 16, 54, 61, 68, 80, and 86 described above is used as the light emitting device 94. In the light emitting device 94, a surface on the + X direction side is a first side surface 94a, and a surface on the −X direction side is a second side surface 94b. The first side surface 94a is provided with a first injection portion 94c as an injection portion, and the second side surface 94b is provided with a second injection portion 94d as an injection portion. Light 17 is emitted from the first emission part 94c and the second emission part 94d.

  A first element mark 95 as a mark is disposed on the + X direction side of the light emitting device 94, and a second element mark 96 as a mark is disposed on the −X direction side. In the plan view as viewed from the Z direction, the first element mark 95 has a part of the shape including the first side surface 94a, and the second element mark 96 has a part of the shape including the second side surface 94b.

  On the base substrate 92, a first base mark 92 a is installed in the + X direction of the first element mark 95, and a second base mark 92 b is installed in the −X direction of the second element mark 96. The first element mark 95, the second element mark 96, the first base mark 92a, and the second base mark 92b are used for alignment between the base substrate 92 and the light emitting device 94.

  On the optical axis 17 a of the light 17, a first convex lens 97, an optical filter 98, and a connector 99 are installed on the + X direction side of the light emitting device 94, and an optical fiber 100 is installed in the connector 99. The light 17 emitted from the first emission part 94 c of the light emitting device 94 passes through the first convex lens 97 and is condensed. The light 17 then passes through the optical filter 98 and enters the optical fiber 100, and travels through the optical fiber 100.

  A collimating lens 101 and a reflecting mirror 102 are installed on the −X direction side of the light emitting device 94. The light 17 emitted from the second emission part 94d of the light emitting device 94 passes through the collimator lens 101 and becomes parallel light. Next, the light 17 is reflected by the reflecting mirror 102, passes through the collimating lens 101, and is collected. The condensed light 17 enters the light emitting device 94, passes through the light emitting device 94, and is emitted from the first emitting portion 94c.

As described above, this embodiment has the following effects.
(1) According to this embodiment, the light emitting device 94 and the optical fiber 100 are installed on the base substrate 92. Light 17 emitted from the light emitting device 94 enters the optical fiber 100. By using the first element mark 95, the second element mark 96, the first base mark 92a, and the second base mark 92b, the light emitting device 94 can place the light 17 emission place on the base substrate 92 with high positional accuracy. . Therefore, the alignment of the optical fiber 100 and the light emitting device 94 can be easily performed. As a result, the communication device 91 can be a communication device including the light emitting device 94 that can be easily aligned.

(Comparative example)
FIG. 13 is an enlarged schematic view of a main part for explaining a substrate dividing method in a comparative example. A cutting line 43 is set on the mother board 42 so as to be orthogonal to the gain region 35. A positioning mark 105 is provided on the mother board 42. The distance between the mark 105 and the first side surface 106 when the side surface cut along the planned cutting line 43 becomes the first side surface 106 is defined as a first distance 106a. At this time, the light 17 is emitted from the emission unit 106b.

  On another occasion, the distance between the mark 105 and the second side surface 107 when the side surface cut along the planned cutting line 43 becomes the second side surface 107 is defined as a second distance 107a. At this time, the light 17 is emitted from the emission unit 107b. Since the emission part that emits the light 17 is located on the first side face 106 or the second side face 107, the distance from the mark 105 to the emission part in the direction of the optical axis 17a is the first distance 106a or the second distance 107a. Therefore, the distance from the mark 105 to the injection portion is affected by the position of the side surface formed by cutting. In the first to sixth embodiments, the mark reaches the side surface. Accordingly, since the distance from the mark to the injection portion is not affected by the cutting, the alignment of the injection portion can be accurately performed using the mark.

Note that the present embodiment is not limited to the above-described embodiment, and various changes and improvements can be added by those having ordinary knowledge in the art within the technical idea of the present invention. A modification will be described below.
(Modification 1)
In the first embodiment, the first element mark 18 and the second element mark 21 are recessed, but a protruding shape may be used. The first element mark 18 and the second element mark 21 may be uneven. Also at this time, the shapes of the first element mark 18 and the second element mark 21 can be confirmed as viewed from the Z direction. The contents are the first element mark 58 of the second embodiment, the first element mark 65 of the third embodiment, the first element mark 77 of the fourth embodiment, and the fifth embodiment. The present invention can also be applied to the first element mark 83 and the first element mark 89 in the sixth embodiment.

  In the third embodiment, the recess 63 a is formed in the base substrate 63. The base substrate 63 may be formed with a convex portion or an uneven portion. At any time, the first element mark 65 can be formed on the second electrode 64. Also in the fourth embodiment, the recess 70 a is formed in the base substrate 70. The base substrate 70 may be formed with a convex portion or an uneven portion. At any time, the first element mark 77 can be formed on the first electrode 76.

  Similarly, in the fourth embodiment, the concave portion 70a of the base substrate 70 may be protruded or uneven. In the fifth embodiment, the concave portion 82a of the insulating layer 82 may be protruded or uneven. In the sixth embodiment, any one of the second cladding layer 36, the active layer 88, and the first cladding layer 73 may have a protruding shape or an uneven shape. Also at this time, the shape of the mark can be confirmed when viewed from the Z direction. You may make it the form which is easy to manufacture.

(Modification 2)
In the first embodiment, the optical axis 17a is orthogonal to the first side surface 41a and the second side surface 41b. The optical axis 17a may cross the first side surface 41a and the second side surface 41b obliquely. Also at this time, the first optical axis side 18b and the second optical axis side 21b are made parallel to the optical axis 17a. Thereby, the position of the 1st injection | emission part 16b and the optical axis 17a can be recognized using the 1st element mark 18. FIG. Similarly, the position of the second emitting portion 16c and the optical axis 17a can be recognized using the second element mark 21. This content can also be applied to the second to sixth embodiments.

(Modification 3)
In the first embodiment, the light emitting device 16 is provided with two marks, the first element mark 18 and the second element mark 21. When the position of the light emitting device 16 can be adjusted with respect to the base substrate 14 even with one mark, only one of the first element mark 18 and the second element mark 21 may be provided and the other may be omitted. The light emitting device 16 can be manufactured with high productivity by reducing the number of marks. This content can also be applied to the second to sixth embodiments.

(Modification 4)
In the sixth embodiment, the hole 88 a is formed in the active layer 88. The active layer 88 may be formed with concave portions, convex portions, and concave and convex portions. In addition, in addition to the active layer 88, a concave portion, a convex portion, or a concave and convex portion may be formed in the second cladding layer 36 or the first cladding layer 73. Also at this time, the first element mark 89 can be formed on the first electrode 76.

  DESCRIPTION OF SYMBOLS 1 ... Projector, 6 ... Liquid crystal light valve as a light modulator, 7b ... Field lens as a lens, 8 ... Red light source as a light-emitting device, 9 ... Green light source as a light-emitting device, 10 ... Blue light source as a light-emitting device, DESCRIPTION OF SYMBOLS 11 ... Projection lens as a projection apparatus, 14, 63, 70, 92 ... Base board | substrate, 16b, 94c ... 1st injection | emission part as an injection | emission part, 16c, 94d ... 2nd injection | emission part as an injection | emission part, 16, 54, 61, 68, 80, 86, 94 ... light emitting device, 17 ... light, 17a ... optical axis, 18 ... second mark and first element mark as mark, 21 ... second mark and second element mark as mark, 22 ... a first base mark as a first mark, 23 ... a second base mark as a first mark, 38, 64 ... a second electrode as an electrode, 41 ... a substrate 41a ... a first side as a side, 41b ... a second side as a side, 42 ... a mother board as a base material, 43 ... a cutting line as a dividing line, 57,76 ... first as an electrode Electrodes 58, 65, 77, 83, 89, 95... First element mark as mark, 63a, 70a. A hole, 91 ... a communication device as a communication device, 96 ... a second element mark as a mark, 100 ... an optical fiber.

Claims (12)

A substrate,
An emission part for emitting light from the side surface of the substrate;
A light emitting device, comprising: a mark having a part of a shape including a side surface of the substrate in a plan view as viewed from the thickness direction of the substrate. The light-emitting device according to claim 1,
A part of the shape of the mark is parallel to the optical axis of the light. The light-emitting device according to claim 1 or 2,
The substrate includes an electrode for inputting current,
The light emitting device, wherein the mark is a part of the electrode. The light-emitting device according to claim 1 or 2,
The substrate has a plurality of layers including a base substrate;
The light-emitting device, wherein the mark is formed by unevenness of the base substrate. The light-emitting device according to claim 4,
The light-emitting device, wherein the substrate includes a light-emitting layer, and the mark is formed by unevenness of the light-emitting layer. The light-emitting device according to claim 4,
The substrate includes an insulating layer, and the mark is formed by unevenness of the insulating layer. The light-emitting device according to claim 1,
A light emitting device, wherein a plurality of the marks are installed. Install the injection part in the base material,
A mark is set on the base material,
A method of manufacturing a light emitting device, wherein the base material is divided along a dividing line passing through the mark and the emitting portion. A base substrate on which a first mark is installed;
A light emitting device installed on the base substrate,
The light emitting device includes an emission unit that emits light from a side surface of the substrate;
A light emitting module comprising: a second mark, a part of the shape of which includes a side surface of the substrate in a plan view as viewed from the thickness direction of the substrate. Install the injection part in the base material,
A mark is set on the base material,
Dividing the base material along a dividing line passing through the mark and the emission part to form a light emitting device,
Place the alignment mark on the base board,
A method of manufacturing a light emitting module, wherein the light emitting device is installed on the base substrate using the alignment mark and the divided marks. The light emitting device according to any one of claims 1 to 7,
A lens for collecting the light emitted from the light emitting device;
A light modulation device that modulates light collected by the lens according to image information;
A projection device for projecting an image formed by the light modulation device;
Including a projector. A base substrate;
A light emitting device installed on the base substrate;
An optical fiber installed on the base substrate,
The light emitting device includes an emission unit that emits light from a side surface of the substrate;
A communication device comprising: a mark having a part of a shape including a side surface of the substrate in a plan view as viewed from the thickness direction of the substrate.

Images