JP2015128801A - Polishing device of plate-like body, polishing method of plate-like body and manufacturing method of plate-like body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a polishing device of a plate-like body, a polishing method of the plate-like body and a manufacturing method of the plate-like body capable of corresponding to the polishing of the large-size plate-like body and capable of preventing breakage and cracking from occurring on the plate-like body during the polishing.SOLUTION: A plurality of polishing heads 16 are arranged in a conveyance direction A of a glass plate G and a conveyance path R of the glass plate G is divided into two in the width direction and is arranged so as to be partitioned into a set first polishing lane L1 and second polishing lane L2. Thereby, the polishing heads can correspond to the polishing of the glass plate G of a large-size. Further, a pressing roller 18 is placed between the polishing heads 16 having the different polishing lanes which are provided on the upstream side and the downstream side of the conveyance direction A of the glass plate G. Thereby, the floating of the glass plate G can be prevented and the breakage and the cracking on the glass plate G can be prevented from occurring.

Description

  The present invention relates to a plate-like body polishing apparatus, a plate-like body polishing method, and a plate-like body manufacturing method.

  As a method for polishing the surface of the plate-like body, a method is known in which the plate-like body is conveyed along a certain conveyance path and the surface of the plate-like body is polished in the course of the conveyance.

  For example, in Patent Document 1, a polishing tool provided with a circular polishing pad having a diameter larger than the width of a glass plate that is a plate-like body is disposed on the conveyance path of the glass plate, and the polishing tool rotates and revolves. However, a method of polishing the surface of the glass plate by pressing against the surface of the glass plate being conveyed is disclosed.

  Further, in Patent Document 2, a plurality of polishing tools including a circular polishing pad having a diameter smaller than the width of a glass plate that is a plate-like body are arranged in a staggered manner along the conveyance direction of the glass plate (so-called, Zigzag alignment (zigzag alignment), a method of polishing the surface of the glass plate by pressing each polishing tool against the surface of the glass plate being conveyed while rotating and revolving.

JP 2001-293656 A JP 2007-190657 A

  However, in the case of the method of Patent Document 1, when the size of the glass plate is increased, the size of the polishing tool is increased accordingly, so that there is a problem that it is difficult to cope with polishing of a large size glass plate.

  On the other hand, the method of Patent Document 2 can cope with polishing of a large-sized glass plate. However, compared with the method of Patent Document 1, there is a problem that the glass plate is likely to be cracked or cracked. is there.

  The present invention has been made in view of such circumstances, and is a plate-like body that can cope with polishing of a large-sized plate-like body and can prevent cracking and cracking of the plate-like body during polishing. An object of the present invention is to provide a polishing apparatus, a method for polishing a plate-like body, and a method for producing a plate-like body.

  Means for solving the problems are as follows.

  A first aspect is a polishing apparatus for a plate-like body in which a plurality of plate-like bodies conveyed on a predetermined conveyance path by a conveying means are continuously polished by a plurality of polishing means arranged along the conveyance direction of the plate-like body. Are distributed and arranged on a first polishing lane and a second polishing lane set by dividing the conveyance path into two in the width direction, and arranged on the upstream side and the downstream side in the conveyance direction of the plate-like body. A polishing apparatus for a plate-like body, in which pressing means for pressing the plate-like body being conveyed to the conveyance means is disposed between the polishing means having different polishing lanes.

  According to this aspect, the polishing means is distributed and arranged in the first polishing lane and the second polishing lane that are set by dividing the conveyance path into two in the width direction. Thereby, even a small-size polishing means can cope with polishing of a large-sized plate. In addition, a pressing unit is disposed between polishing units having different polishing lanes on the upstream side and the downstream side in the conveyance direction of the plate-like body. Thereby, it can prevent that a crack and a crack arise during grinding | polishing. This is based on the following reason. When the polishing means is distributed and arranged in the first polishing lane and the second polishing lane, the plate-like body is polished by each polishing means on one side half of the surface. During polishing, since the polishing tool is pressed against only one half of the plate-like body, floating occurs at the end where the polishing tool is not pressed. When the polishing tool is pressed against the plate-like body in which the float is generated as described above, the plate-like body may be cracked or cracked. By disposing the pressing means, the plate-like body can be prevented from floating, and the plate-like body can be transferred to the next polishing means in a flat state. Thereby, the crack of a plate-shaped body and a crack can be prevented.

  According to a second aspect, in the plate-like body polishing apparatus according to the first aspect, the region where the polishing means is disposed is divided into a plurality of blocks along the conveying direction of the plate-like body. In this embodiment, the first polishing lane and the second polishing lane are alternately arranged.

  According to this aspect, the polishing means is alternately arranged in the first polishing lane and the second polishing lane in units of blocks. That is, the polishing means belonging to the same block are arranged in the same polishing lane, and when the block is switched, the polishing lane in which the polishing means is arranged is switched. As a result, the pressing means is arranged at the boundary of each block. Thereby, the installation number of pressing means can be reduced. Further, by arranging the polishing means in this way, the plate-like body can be continuously polished by a plurality of polishing means, and the polishing power can be improved. That is, by continuously polishing the same portion of the plate-like body with a plurality of polishing means, the temperature of the polishing portion can be kept high. As a result, the temperature of the slurry can be kept high, and the polishing power can be improved. In addition, by arranging a plurality of polishing means in succession in the same polishing lane, the polishing means can be maintained (dressing, replacement, etc.) by itself and the operation efficiency can be improved (staggered arrangement (the polishing means are one by one). In the case of an arrangement configuration in which the first polishing lane and the second polishing lane are alternately arranged), it is necessary to always perform maintenance with two adjacent polishing means as a set.

  According to a third aspect, in the plate-like body polishing apparatus according to the second aspect, the polishing tool of the polishing means is a circular shape having a diameter smaller than the width of the plate-like body, and rotates and revolves.

  According to this aspect, the plate-like body can be polished using the polishing tool having a size smaller than the size of the plate-like body.

  The fourth aspect is the plate-like body polishing apparatus according to the third aspect, wherein the direction of rotation and revolution of the polishing tool is set to be uniform for each block, and the direction of rotation of the polishing tool is that of the plate-like body. It is an aspect set in the direction from the inner side to the outer side in the width direction of the plate-like body on the upstream side in the transport direction.

  According to this aspect, the direction of rotation and revolution of the polishing tool is set in units of blocks, and the direction of rotation of the polishing tool is in the width direction of the plate-like body on the upstream side of the conveying direction of the plate-like body. It is set in the direction from the inside to the outside. Thereby, the float of the edge part of the width direction of a plate-shaped body can further be prevented. That is, when the polishing tool rotates in the direction from the inner side to the outer side in the width direction of the plate-like body on the upstream side in the conveyance direction of the plate-like body (the entrance side of the plate-like body), The force which presses a plate-shaped body toward can be made to act, and the floating of the edge part of the width direction of a plate-shaped body can be prevented.

  According to a fifth aspect, in the plate-like body polishing apparatus according to the fourth aspect, the revolution phase of the polishing tool is set to be equal for each block, and the revolution phase of the polishing tool is shifted by 180 degrees in adjacent blocks. This is the mode set.

  According to this aspect, the revolution phase of the polishing tool is set to be equal for each block, and the revolution phase of the polishing tool is set to be shifted by 180 degrees in adjacent blocks. Thereby, in the switching of a block, the load which acts on a plate-shaped body can be canceled, and a plate-shaped body can be conveyed smoothly.

  According to a sixth aspect of the present invention, there is provided a polishing method for a plate-like body in which a plurality of plate-like bodies conveyed on a predetermined conveyance path by the conveyance means are continuously polished by a plurality of polishing means arranged along the conveyance direction of the plate-like body. The pressing means for distributing and arranging the polishing means to the first polishing lane and the second polishing lane set by dividing the width into two in the width direction and pressing the plate-like body being transferred to the transfer means, This is a polishing method for a plate-like body arranged between polishing means having different polishing lanes arranged on the upstream side and the downstream side in the conveyance direction of the shape-like body.

  According to this aspect, the polishing means is distributed and arranged in the first polishing lane and the second polishing lane that are set by dividing the conveyance path into two in the width direction. Thereby, it can respond to grinding | polishing of a large sized plate-shaped object. In addition, a pressing unit is disposed between polishing units having different polishing lanes on the upstream side and the downstream side in the conveyance direction of the plate-like body. Thereby, it can prevent that a crack and a crack arise during grinding | polishing.

  According to a seventh aspect, in the method for polishing a plate-like body according to the sixth aspect, the region where the polishing means is disposed is divided into a plurality of blocks along the conveying direction of the plate-like body, and the polishing means is divided into blocks. In this embodiment, the first polishing lane and the second polishing lane are alternately arranged.

  According to this aspect, the polishing means is alternately arranged in the first polishing lane and the second polishing lane in units of blocks. Thereby, the installation number of pressing means can be reduced. Further, the polishing power can be improved.

  The eighth aspect is an aspect in which in the method for polishing a plate-like body according to the seventh aspect, the polishing tool of the polishing means is a circle having a diameter smaller than the width of the plate-like body and rotates and revolves.

  According to this aspect, the plate-like body can be polished using the polishing tool having a size smaller than the size of the plate-like body.

  According to a ninth aspect, in the plate-like body polishing method according to the eighth aspect, the rotation direction and revolution direction of the polishing tool are set to be equal to each other in units of blocks, and the rotation direction of the polishing tool is transferred to the plate-like body. It is an aspect set in the direction from the inner side to the outer side in the width direction of the plate-like body on the upstream side in the direction.

  According to this aspect, the direction of rotation and revolution of the polishing tool is set in units of blocks, and the direction of rotation of the polishing tool is in the width direction of the plate-like body on the upstream side of the conveying direction of the plate-like body. It is set in the direction from the inside to the outside. Thereby, the float of the edge part of the width direction of a plate-shaped body can further be prevented.

  According to a tenth aspect, in the method for polishing a plate-like body according to the ninth aspect, the revolution phase of the polishing tool is set to be equal for each block, and the revolution phase of the polishing tool is shifted by 180 degrees in adjacent blocks. This is a mode of setting.

  According to this aspect, the revolution phase of the polishing tool is set to be equal for each block, and the revolution phase of the polishing tool is set to be shifted by 180 degrees in adjacent blocks. Thereby, in the switching of a block, the load which acts on a plate-shaped body can be canceled, and a plate-shaped body can be conveyed smoothly.

  An eleventh aspect is a method for manufacturing a plate-like body, which includes a step of polishing the plate-like body by the plate-like body polishing method according to any one of the sixth to tenth aspects.

  According to this aspect, it can prevent that a crack and a crack arise in a plate-shaped object at a grinding | polishing process, and can improve productivity.

  ADVANTAGE OF THE INVENTION According to this invention, it can respond to grinding | polishing of a large sized plate-shaped object, and can prevent that a crack and a crack arise in a plate-shaped object during grinding | polishing.

Top view showing one embodiment of a polishing apparatus Side view showing an embodiment of a polishing apparatus An enlarged plan view of a part of the polishing head arrangement area (A)-(C) are top views which show the modification of arrangement | positioning of a polishing head. The top view which shows the example of arrangement of the polishing head and the pressing roller when rough polishing and finish polishing Conceptual diagram of how to set the direction of rotation and revolution of the polishing tool

  Hereinafter, preferred embodiments for carrying out the present invention will be described in detail with reference to the accompanying drawings.

<Configuration of polishing equipment>
1 and 2 are a plan view and a side view, respectively, showing an embodiment of a polishing apparatus according to the present invention.

  A polishing apparatus 10 shown in FIGS. 1 and 2 is a polishing apparatus that continuously polishes a surface G1 of a glass plate G, which is an example of a plate-like body, and mainly includes a conveying device (conveying means) 12 that conveys the glass plate G; A plurality of polishing heads (polishing means) 16 for continuously polishing the surface G1 of the glass plate G by pressing the rotating circular polishing tool 14 against the surface G1 of the glass plate G being conveyed, and the glass plate G being conveyed And a slurry supply device (not shown) for supplying slurry containing abrasive grains such as cerium oxide to the surface G1 of the glass plate being conveyed in the region where the polishing head 16 is disposed. Configured.

<Conveyor>
The transport device 12 includes a track (not shown) laid along the transport path of the glass plate G, and a table 20 that holds the plurality of glass plates G horizontally and travels on the track. The

  The table 20 has a long shape extending along the transport direction, and has a horizontal glass placement surface 20A on the upper surface portion. A back pad 22 made of urethane resin having a certain thickness is laid on the glass mounting surface 20A.

  The glass plate G is placed in alignment with the glass placement surface 20 </ b> A via the back pad 22. At this time, the surface is placed on the glass placement surface 20A with the main surface to be polished (this surface is referred to as surface G1) facing upward in the vertical direction. Each glass plate G placed on the glass placement surface 20 </ b> A has its back surface (main surface opposite to the main surface to be polished) adsorbed to the back pad 22 and held on the table 20.

  The table 20 is driven by a table driving means (not shown) and travels on the track at a constant speed. As shown in FIG. 1, the size of the table 20 is not limited to a long shape, and may be a short shape on which one or a plurality of glass plates G can be placed.

  By causing the table 20 on which the glass plate G is placed to travel along the track at a constant speed, the glass plate G is transported at a constant speed along the transport path.

<Polishing head>
The polishing head 16 includes a circular polishing tool 14, and presses a rotating, preferably rotating and revolving circular polishing tool 14 against the surface G 1 of the glass plate G being conveyed against the surface G 1 of the glass plate G, The surface G1 of the plate G is polished.

  A plurality of the polishing heads 16 are arranged at a desired interval along the conveyance direction A of the glass plate G, and the conveyance path of the glass plate G is set to be divided into two in the width direction (direction perpendicular to the conveyance direction A). The first and second polishing lanes L1 and L2 are distributed and arranged. The arrangement of the polishing head 16 will be described in detail later.

  The polishing tool 14 includes a circular polishing tool body 14A and a circular polishing pad 14B mounted on the lower surface of the polishing tool body 14A. The polishing pad 14B has a diameter D smaller than the width of the glass plate G (the length in the direction orthogonal to the conveyance direction A) GW. The polishing tool 14 is installed on the conveyance path of the glass plate G so that the polishing surface of the polishing pad 14B and the surface of the glass plate G are parallel to each other.

  The polishing head 16 includes a rotation drive mechanism (not shown) that rotates and revolves the polishing tool 14, and an advance / retreat drive mechanism (not shown) that moves the polishing tool 14 forward and backward in the vertical direction of the surface of the glass plate G.

  In this type of polishing apparatus, a mechanism for rotating and revolving the polishing tool 14 and a mechanism for moving the polishing tool 14 back and forth in the vertical direction are well-known, and the description of the configuration is omitted.

  The polishing tool 14 is driven by the rotation drive mechanism, rotates around the rotation center OA (= center of the polishing tool 14), and revolves around the revolution center OB (see FIG. 3).

  Further, the polishing tool 14 is driven by an advance / retreat drive mechanism, moves up and down in the vertical direction, and moves between the polishing position and the retracted position. When the polishing tool 14 is positioned at the polishing position, the polishing pad 14B is pressed against the surface G1 of the glass plate G being conveyed, and when the polishing tool 14 is positioned at the retracted position, the polishing pad 14B is separated from the glass plate G.

  The surface G1 of the glass plate G is polished by pressing the polishing tool 14 against the surface G1 of the glass plate G supplied with the slurry with a constant pressing force while rotating and revolving.

<Position of polishing head>
FIG. 3 is an enlarged plan view of a part of the arrangement area of the polishing head.

  As described above, a plurality of polishing heads 16 are arranged at desired intervals along the conveyance direction A of the glass plate G, and the first is set by dividing the conveyance path of the glass plate G into two in the width direction. The polishing lane L1 and the second polishing lane L2 are distributed and arranged.

  Here, the conveyance path R of the glass plate G (a region indicated by hatching in FIG. 3) is a path through which the glass plate G passes, and the width RW is the same as the width GW of the glass plate G. The glass plate G is transported by the table 20 so that the center thereof moves on the center line CL0 of the transport path R.

  The conveyance path R of the glass plate G is configured with a straight line in the arrangement region Z of the polishing head 16 (see FIG. 1). The first polishing lane L1 and the second polishing lane L2 are set by dividing the conveyance path R of the glass plate G into two equal parts in the width direction. Therefore, the first polishing lane L1 and the second polishing lane L2 are set to have the same width, and are set symmetrically across the center line CL0 of the transport path R.

  The polishing head 16 disposed in the first polishing lane L1 is disposed such that the revolution center OB of the polishing tool 14 is positioned on the center line CL1 of the first polishing lane L1.

  The polishing head 16 disposed in the second polishing lane L2 is disposed such that the revolution center OB of the polishing tool 14 is positioned on the center line CL2 of the second polishing lane L2.

  The polishing head 16 is distributed and arranged in the first polishing lane L1 and the second polishing lane L2, and the distribution is performed as follows.

  That is, as shown in FIG. 1, the region where the polishing head 16 is disposed is divided into a plurality of blocks along the conveying direction A of the glass plate G, and the polishing head 16 is divided into the first polishing lane L1 and the second polishing block in units of blocks. Are alternately arranged in the polishing lane L2. In the polishing apparatus 10 of the present embodiment, the region in which the polishing head 16 is arranged is divided into four blocks B1 to B4, and the polishing heads 16 belonging to the odd blocks B1 and B3 are arranged in the first polishing lane L1, and the even number The polishing heads 16 belonging to the blocks B2 and B4 are arranged in the second polishing lane L2. As a result, the polishing heads 16 are alternately arranged in the first polishing lane L1 and the second polishing lane L2 in units of blocks. In each of the blocks B1 to B4, four polishing heads are arranged.

  By disposing the polishing head 16 in this way, the glass plate G is polished on the surface G1 one side at a time during the conveyance process.

<Presser roller>
The pressing roller 18, which is an example of a pressing unit, is pressed against and brought into contact with the surface G 1 of the glass plate G being transported in the arrangement area Z of the polishing head 16 to press the surface G 1 of the glass plate G being transported. The pressure roller 18 is rotatably supported and rotates as the glass plate G moves.

  The pressing roller 18 has a length equal to or greater than the width of the glass plate G so as to be in contact with the entire region in the width direction of the surface G1 of the glass plate G, and is disposed orthogonal to the conveying direction A of the glass plate G.

  The material of the pressing roller 18 may be any material having a lower hardness than the glass plate G so as not to damage the glass plate G, and is made of, for example, a foamed resin.

  Further, the pressing roller 18 is disposed at the next position. That is, between the adjacent polishing heads 16 and the polishing heads 16, the polishing lanes arranged between the upstream polishing head 16 and the downstream polishing head 16 in the conveyance direction A of the glass plate G are different. It is disposed between the polishing heads 16.

  As shown in FIG. 1, in the polishing head 16, the polishing lanes arranged in units of blocks are switched, so that the pressing roller 18 is arranged at the boundary of each block.

  Thus, by placing the pressing roller 18 between the polishing heads 16 having different polishing lanes arranged on the upstream side and the downstream side in the conveyance direction A of the glass plate G, the glass plate G can be prevented from being lifted, It is possible to prevent the glass plate G from being cracked or cracked.

  Further, by arranging the pressing roller 18 in this way, the slurry can be managed in units of blocks. Moreover, it is possible to prevent the slurry containing polishing scraps (the cullet of the glass plate G, the fragments of the polishing pad 14B, and the used abrasive grains) from flowing out to the next block.

<Slurry supply device>
The slurry supply device (not shown) supplies the slurry to the surface G1 of the glass plate G being conveyed in the arrangement region Z of the polishing head 16.

  In this type of polishing apparatus, the means for supplying the slurry is well known, so the description of the configuration is omitted.

  As described above, in the polishing apparatus 10 of the present embodiment, since the pressing roller 18 is disposed between the blocks, the supply of slurry is managed for each block.

<< Glass plate polishing method using polishing apparatus >>
First, the glass plate G to be polished is set on the table 20. The glass plate G is placed side by side on the glass placement surface 20 </ b> A of the table 20. Each glass plate G placed is attracted to the back pad 22 and held on the table 20.

  Next, the table 20 is moved at a constant speed along the track. Further, the polishing tool 14 of each polishing head 16 is rotated and revolved and moved to the polishing position.

  By moving the table 20, the glass plate G is conveyed horizontally along the conveyance path.

  Since the glass plate G eventually reaches the arrangement region Z of the polishing head 16, the slurry is supplied to the surface G1 of the glass plate G when the glass plate G reaches the arrangement region Z of the polishing head 16.

  The glass plate G is polished by pressing the polishing pad 14B of the polishing tool 14 that rotates and revolves on the surface G1 in the course of being conveyed through the arrangement region Z of the polishing head 16, and the surface G1 is polished. At this time, the glass plate G is polished one half by one side on the surface G1 by the polishing head 16 that is distributed and arranged in the first polishing lane L1 and the second polishing lane L2.

  By the way, when the surface G1 of the glass plate G is polished one side at a time in this way, the glass plate G is lifted at the end where the polishing tool 14 is not pressed. Then, when the polishing tool 14 is pressed against the glass plate G that has floated in this way, the glass plate G may be cracked or cracked.

  However, in the polishing apparatus 10 of the present embodiment, since the pressing roller 18 is disposed at a position where the polishing lane is switched, the glass plate G can be transferred to the next polishing head 16 in a flat state. Thereby, it is possible to prevent the glass plate G from being cracked or cracked.

  As described above, according to the polishing apparatus 10 of the present embodiment, even when the polishing head 16 is distributed to the first polishing lane L1 and the second polishing lane L2, and the glass plate G is polished. The glass plate G can be polished without causing cracks or cracks.

  Further, the polishing head 16 is distributed to the first polishing lane L1 and the second polishing lane L2, and the glass plate G is polished, so that the glass plate G can be enlarged even with a small-sized polishing means. Can be easily handled.

  In addition, by arranging a plurality of polishing heads 16 continuously in the same polishing lane, the glass plate G can be continuously polished, and the polishing power can be improved. That is, by continuously polishing the same portion of the glass plate G with the plurality of polishing heads 16, the temperature of the polishing portion can be kept high. As a result, the temperature of the slurry can be kept high, and the polishing power can be improved.

  Further, by arranging a plurality of polishing means in succession in the same polishing lane, the polishing head 16 can be maintained alone and the operation efficiency can be improved. For example, as shown in FIG. 1, normally, four polishing heads 16 are used to polish one half of the glass plate G, but one of the four polishing heads 16 is excluded from the polishing apparatus 10 for maintenance. Then, one half of the glass plate G may be polished using the remaining three polishing heads 16.

  Further, by arranging the polishing head 16 in a block form, when the glass plate G is broken, the cause can be easily identified. For example, when a slurry containing cullet is found in the third block B3 among the four blocks B1 to B4, it can be determined that the glass plate G is broken in the third block B3.

<Modification>
<Arrangement of polishing head and pressing roller>
4A to 4C are plan views showing modifications of the arrangement of the polishing head.

  In the example shown in FIG. 4A, the polishing heads 16 are alternately arranged in the first polishing lane L1 and the second polishing lane L2 one by one along the transport direction A (so-called staggered arrangement). . In this case, a pressing roller 18 is disposed between the polishing heads 16. That is, the pressing roller 18 is disposed between the polishing heads 16 having different polishing lanes between the polishing head 16 on the upstream side in the conveyance direction A of the glass plate G and the polishing head 16 on the downstream side. In the case of a staggered arrangement, a pressing roller 18 is arranged between the polishing heads 16.

  In the example shown in FIG. 4B, the arrangement area Z of the polishing head 16 is equally divided into eight blocks B1 to B8, and the two polishing heads 16 are divided into the first polishing lane L1 and the second polishing in block units. They are alternately arranged in the lane L2. Thus, the number of blocks to be divided can be set as appropriate.

  In the example shown in FIG. 4C, the number of polishing heads 16 belonging to each block is changed. Four polishing heads 16 are arranged in each of the blocks B1 and B2, and two polishing heads 16 are arranged in each of the blocks B3 to B6. Thus, the number of polishing heads 16 belonging to each block can be set as appropriate.

<Rough polishing and finish polishing>
The polishing head can perform rough polishing and finish polishing by changing the polishing pad to be used. In the final polishing, a polishing pad (soft polishing pad) having a lower hardness than the rough polishing is used.

  FIG. 5 is a plan view showing an arrangement example of the polishing head and the pressing roller when rough polishing and finish polishing are performed.

  In the figure, reference numeral 16A denotes a polishing head that performs rough polishing, and reference numeral 16B denotes a polishing head that performs final polishing. A polishing pad for rough polishing is attached to the polishing tool body of the polishing tool in the polishing head 16A that performs rough polishing. Further, a polishing pad for finish polishing is mounted on the polishing tool body of the polishing tool in the polishing head 16B that performs finish polishing.

  The polishing head 16A that performs rough polishing is disposed at a desired interval in a region ZA on the upstream side in the conveyance direction A of the glass plate. Four polishing heads 16A are arranged in each of the blocks BA1 to BA4, and two polishing heads 16A are arranged in each of the blocks BA5 and BA6.

  Further, the polishing head 16B for performing the final polishing is disposed at a desired interval in the downstream region ZB. Two polishing heads 16B are arranged in each of the blocks BB1 to BB4, and one polishing head 16B is arranged in each of the blocks BB5 and BB6.

  An area for rough polishing (area where the polishing head 16B for rough polishing is disposed) ZA and an area for final polishing (area where the polishing head 16B for final polishing is disposed) ZB are continuous, and each polishing head 16A and 16B are arrange | positioned with a desired space | interval along the conveyance direction A of the glass plate G. FIG.

  The area ZA where rough polishing is performed is divided into six blocks BA1 to BA6, and the polishing heads 16A are alternately arranged in the first polishing lane L1 and the second polishing lane L2 in units of blocks.

  The area ZB where final polishing is performed is also divided into six blocks BB1 to BB6, and the polishing heads 16B are alternately arranged in the first polishing lane L1 and the second polishing lane L2 in units of blocks.

  The pressing roller 18 is disposed at the boundary between the area ZA where rough polishing is performed and the area ZB where final polishing is performed, and is disposed at the boundary of each block in each of the areas ZA and ZB.

  In this way, also in the case of performing rough polishing and finish polishing, the pressing roller 18 is disposed between the polishing heads 16A and 16B having different polishing lanes arranged on the upstream side and the downstream side in the conveyance direction A of the glass plate G. By doing so, the glass plate can be prevented from cracking or cracking.

  In general, in the final polishing, the polishing pressure is lower than that in the rough polishing, so that the risk of cracking and cracking in the glass plate is lower than in the rough polishing. Therefore, it is possible to omit the pressing roller 18 in the area ZA where the finish polishing is performed. That is, the pressing roller 18 can be omitted in a region where polishing is performed using a polishing pad having a certain hardness or less. In such a region, the polishing heads can be arranged in a staggered manner.

<Direction of rotation and revolution>
In the above embodiment, the direction in which the polishing tool 14 rotates and the direction in which the polishing tool 14 rotates are not particularly mentioned, but the direction in which the polishing tool 14 rotates and the direction in which the polishing tool 14 rotates are set as follows. It is preferable.

  FIG. 6 is a conceptual diagram of a method for setting the rotation direction and the revolution direction of the polishing tool.

  In the figure, reference numeral OA is the rotation center of the polishing tool 14, and reference numeral OB is the revolution center of the polishing tool 14. Further, the direction of the arrow indicated by reference sign WA is the rotation direction of the polishing tool 14, and the direction of the arrow indicated by reference sign WB is the revolution direction of the polishing tool 14.

  When the polishing heads 16 are alternately arranged in the first polishing lane L1 and the second polishing lane L2 in units of blocks, the polishing heads 16 belonging to the blocks B1 and B2 are rotated in the rotation direction WA and the revolution of the polishing tool 14. Align and set the direction WB. That is, the polishing heads 16 belonging to the same block are set so as to rotate in the same rotation direction WA and revolve in the same revolution direction WB.

  The direction of rotation WA and the direction of revolution WB are set to be opposite to each other. However, the rotation direction WA and the revolution direction WB may be set to be the same direction.

  Further, on the upstream side in the conveying direction A of the glass plate G (the entrance side of the glass plate G), the rotation direction WA is set so that the polishing tool 14 rotates in the direction from the inner side to the outer side in the width direction of the glass plate G. Set.

  Here, the entrance side of the glass plate G means a front region when the polishing tool 14 is divided into two parts in the front-rear direction along the conveyance direction A of the glass plate G (the rear side is the exit side). In this region, the direction of rotation WA of the polishing tool 14 is set in the direction from the inner side to the outer side in the width direction of the glass plate G.

  As a result, the rotation direction WA and the revolution direction WB of the polishing tool 14 are opposite to each other between the polishing head 16 disposed in the first polishing lane L1 and the polishing head 16 disposed in the second polishing lane L2. That is, the polishing head 16 disposed in the first polishing lane L1 has the rotation direction WA set in the clockwise direction and the revolution direction WB set in the counterclockwise direction, and the polishing head 16 disposed in the second polishing lane L2. The head 16 is set so that the rotation direction WA is counterclockwise and the revolution direction WB is clockwise.

  In this way, by setting the direction WA of rotation of the polishing tool 14 in the direction from the inner side to the outer side in the width direction of the glass plate G on the upstream side in the conveying direction A of the glass plate G, the polishing plate 14 is polished with respect to the glass plate G during polishing. Thus, a force for pressing the glass plate G from the inside to the outside of the glass plate G can be applied. Thereby, the float of the edge part of the width direction of the glass plate G can further be suppressed. This also prevents the slurry from entering between the glass plate G and the back pad during polishing.

<Phase of revolution>
When the polishing heads 16 are alternately arranged on the first polishing lane L1 and the second polishing lane L2 one by one (when arranged in a staggered manner), the adjacent polishing heads 16 have a revolution phase of 180 degrees. It is preferable to set by shifting each. Thereby, the load which acts on the glass plate G between each polishing head 16 can be offset, and the glass plate G can be smoothly conveyed along a conveyance path.

  When the polishing heads 16 are alternately arranged in the first polishing lane L1 and the second polishing lane L2 in block units, the phase of revolution of each polishing head 16 is set as follows. That is, the phases are set to be equal to each other, that is, the phase difference between the polishing heads 16 belonging to the same block is set to 0 degree, and the phases are set to be shifted by 180 degrees in adjacent blocks. Thereby, the load which acts on the glass plate G by switching of a block can be canceled, and the glass plate G can be conveyed smoothly along a conveyance path.

<Abrasive tool>
The material and hardness of the polishing pad constituting the polishing tool are appropriately selected according to the purpose of polishing. That is, a polishing tool for rough polishing is used for rough polishing, and a polishing tool for final polishing is used for final polishing.

  In addition, the size (diameter) of the polishing pad constituting the polishing tool, the revolution radius of the polishing tool, the rotation speed of the polishing tool, the revolution speed of the polishing tool, the polishing pressure, etc. depend on the polishing target, polishing speed, purpose of polishing, etc. Is set as appropriate.

<Plate-like body>
The polishing apparatus and method of the present invention are particularly effective when polishing a large glass plate (for example, a rectangular shape having a side of 1000 mm or more) as a plate-like object to be polished. In particular, it works effectively when polishing a glass plate of the seventh generation (1900 × 2200 mm) or more.

  Further, the polishing apparatus and method of the present invention is a thin glass plate (thickness of about 0.3 to 1.1 mm, preferably about 0.4 to 0.7 mm, such as a glass plate for a flat panel display. This is particularly effective when polishing a glass plate.

  In addition, this invention is applicable also when grind | polishing a general glass plate, metal, or resin-made plate-like objects for building materials, mirrors, etc. as grinding | polishing object.

  Moreover, when making a glass plate into grinding | polishing object, the manufacturing method and glass composition are not specifically limited.

<Glass plate manufacturing method>
The glass plate manufacturing process consists of a molding step for forming molten glass into a strip-shaped glass plate in chronological order, a cutting step for cutting the strip-shaped glass plate into a glass plate of a desired size, and chamfering for chamfering the edges of the cut glass plate. A polishing process for polishing the main surface of the glass plate, a cleaning step for cleaning the glass plate, an inspection step for inspecting the glass plate, and the like. By applying the polishing method of the present invention in the polishing step, it is possible to prevent the glass plate from being cracked or cracked in the polishing step, and the productivity can be improved.

  DESCRIPTION OF SYMBOLS 10 ... Polishing device, 12 ... Conveying device, 14 ... Polishing tool, 14A ... Polishing tool main body, 14B ... Polishing pad, 16 ... Polishing head, 16A ... Polishing head for rough polishing, 16B ... Polishing head for final polishing, 18 ... Pressing roller, 20 ... Table, 20A ... Glass placement surface, 22 ... Back pad, G ... Glass plate, G1 ... Glass plate surface, GW ... Glass plate width, R ... Conveyance path, RW ... Conveyance path width , L1 ... first polishing lane, L2 ... second polishing lane, CL0 ... center line of transport path, CL1 ... center line of first polishing lane, CL2 ... center line of second polishing lane, D ... polishing Pad diameter, OA ... center of rotation of polishing tool, OB ... center of revolution of polishing tool, WA ... direction of rotation of polishing tool, WB ... direction of revolution of polishing tool, Z ... area of polishing head, ZA ... for rough polishing Polishing head placement area, ZB ... Polishing head arrangement area for polishing, B1 to B8... Block that divides the polishing head arrangement area, BA1 to BA6... Block that divides the polishing head arrangement area, BB1 to BB6. block

Claims (11)

In a plate-like polishing apparatus that continuously polishes a plate-like body conveyed on a predetermined conveyance path by a conveying means by a plurality of polishing means arranged along the conveyance direction of the plate-like body,
The polishing means is distributed and arranged in a first polishing lane and a second polishing lane set by dividing the conveyance path into two in the width direction,
A plate-like shape in which pressing means for pressing the plate-like member being conveyed against the conveying unit is arranged between the polishing units having different polishing lanes arranged on the upstream side and the downstream side in the conveying direction of the plate-like member. Body polishing equipment.   The region where the polishing means is disposed is divided into a plurality of blocks along the conveying direction of the plate-like body, and the polishing means alternates between the first polishing lane and the second polishing lane in units of blocks. The plate-shaped body polishing apparatus according to claim 1, which is disposed on the surface.   3. The plate-like polishing apparatus according to claim 2, wherein the polishing tool of the polishing means has a circular shape having a diameter smaller than the width of the plate-like body, and rotates and revolves.   The direction of rotation and revolution of the polishing tool is set in units of the block, and the direction of rotation of the polishing tool is on the inner side in the width direction of the plate-like body on the upstream side of the conveying direction of the plate-like body. The polishing apparatus for a plate-like body according to claim 3, wherein the polishing apparatus is set in a direction from the outer side to the outer side.   The polishing of the plate-shaped body according to claim 4, wherein the phase of revolution of the polishing tool is set to be equal for each block, and the phase of revolution of the polishing tool is set to be shifted by 180 degrees in the adjacent block. apparatus. In the polishing method for a plate-like body, in which a plurality of plate-like bodies that are conveyed along a predetermined conveyance path by the conveyance means are continuously polished by a polishing means that is arranged along the conveyance direction of the plate-like body,
Distributing and arranging the polishing means in a first polishing lane and a second polishing lane set by dividing the conveyance path into two in the width direction,
A plate-like member disposed between the polishing means, which has different pressing lanes on the upstream side and the downstream side in the conveyance direction of the plate-like body, and the pressing means for pressing the plate-like body being transferred to the transfer unit. Body polishing method.   An area where the polishing means is disposed is divided into a plurality of blocks along the conveying direction of the plate-like body, and the polishing means is alternately arranged on the first polishing lane and the second polishing lane in units of blocks. The method for polishing a plate-like body according to claim 6, which is disposed on the surface.   The polishing tool for a plate according to claim 7, wherein the polishing tool of the polishing means is a circle having a diameter smaller than the width of the plate, and rotates and revolves.   The direction of rotation and revolution of the polishing tool is set in units of the block, and the direction of rotation of the polishing tool is set on the upstream side of the transport direction of the plate from the inside in the width direction of the plate. The method for polishing a plate-like body according to claim 8, wherein the method is set in a direction toward the outside.   The method for polishing a plate-like body according to claim 9, wherein the phase of revolution of the polishing tool is set to be equal for each block, and the phase of revolution of the polishing tool is shifted by 180 degrees in the adjacent block. .   The manufacturing method of the plate-shaped object which has the process of grind | polishing a plate-shaped object with the polishing method of the plate-shaped object as described in any one of Claims 6-10.

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