JP2015126152A - Method for manufacturing printed circuit board having electrical component connection unit and electric circuit arrangement including printed circuit board obtained thereby - Google Patents

Method for manufacturing printed circuit board having electrical component connection unit and electric circuit arrangement including printed circuit board obtained thereby Download PDF

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Publication number
JP2015126152A
JP2015126152A JP2013270714A JP2013270714A JP2015126152A JP 2015126152 A JP2015126152 A JP 2015126152A JP 2013270714 A JP2013270714 A JP 2013270714A JP 2013270714 A JP2013270714 A JP 2013270714A JP 2015126152 A JP2015126152 A JP 2015126152A
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Prior art keywords
printed circuit
circuit board
electrical component
connection unit
component connection
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JP2013270714A
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Japanese (ja)
Inventor
慎司 澤井
Shinji Sawai
慎司 澤井
善夫 梅本
Yoshio Umemoto
善夫 梅本
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Sumitomo Wiring Systems Ltd
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Sumitomo Wiring Systems Ltd
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Priority to JP2013270714A priority Critical patent/JP2015126152A/en
Priority to PCT/JP2014/082444 priority patent/WO2015098481A1/en
Publication of JP2015126152A publication Critical patent/JP2015126152A/en
Abandoned legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0097Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/0909Preformed cutting or breaking line
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09127PCB or component having an integral separable or breakable part
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1509Horizontally held PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494Heating methods for reflowing of solder

Abstract

PROBLEM TO BE SOLVED: To provide a new method for manufacturing a printed circuit board including an electrical component connection unit, capable of automatically mounting an electrical component connection unit on the printed circuit board by reflow-soldering without requiring a conveyance jig even when the electrical component connection unit is provided over the approximately full length of an edge part of the printed circuit board in the width direction, and an electric circuit arrangement including the printed circuit board obtained by the new manufacturing method.SOLUTION: A method for manufacturing a printed circuit board including an electrical component connection unit comprises: the printed circuit board preparation step of preparing a printed circuit board 12 having a pair of waste boards 80 and 80 supported by a conveyance rail 90 and removably coupled; the reflow step of supporting the pair of waste boards 80 and 80 by the conveyance rail 90 in the state of mounting an electrical component connection unit 18 on a mounting part 16 to convey the printed circuit board 12 to a reflow furnace; and the removal step of removing the waste boards 80 after the reflow step.

Description

本発明は、プリント基板に対して電気部品接続ユニットをリフロー半田付けにより自動実装する場合のプリント基板の製造方法と、かかる製造方法により得られたプリント基板が内蔵された電気回路装置に関するものである。   The present invention relates to a printed circuit board manufacturing method in the case where an electrical component connection unit is automatically mounted on a printed circuit board by reflow soldering, and an electric circuit device in which the printed circuit board obtained by the manufacturing method is incorporated. .

従来から、自動車の電装系に用いられる電気接続箱や制御ユニット等の電気回路装置には、コネクタやヒューズが装着される電気部品接続ユニットが実装されたプリント基板が内蔵されており、各種の電気部品が外部から接続可能とされている。   Conventionally, electrical circuit devices such as electrical junction boxes and control units used in automobile electrical systems have built-in printed circuit boards on which electrical component connection units to which connectors and fuses are mounted are mounted. Parts can be connected from the outside.

ところで、このような電気回路装置として、例えば、特開2012−115052号公報(特許文献1)に記載の如く、プリント基板の一方の端縁部の幅方向の略全長に亘って、プリント基板の側方からコネクタやヒューズ等の外部の部品が接続される側方接続型電気部品接続ユニットを設けたものが知られている。このように、プリント基板の端縁部を巧く利用して電気部品接続ユニットを実装することで、電気回路装置の小型化・高密度化が図られるようになっている。   By the way, as such an electric circuit device, as described in, for example, Japanese Patent Application Laid-Open No. 2012-115052, (Patent Document 1), the printed circuit board has a substantially entire length in the width direction of one edge portion of the printed circuit board. A device provided with a side connection type electrical component connection unit to which external components such as a connector and a fuse are connected from the side is known. In this way, the electric circuit device can be miniaturized and densified by skillfully utilizing the edge portion of the printed circuit board to mount the electrical component connection unit.

ところが、このように、電気部品接続ユニットをプリント基板に対して、リフロー半田付け工程により自動実装する際に、プリント基板の搬送装置への取付代を確保し難いという問題があった。すなわち、リフロー半田付け工程により電気部品接続ユニットをプリント基板に自動実装する場合、相互に離隔して平行に延びる一対の搬送レールにプリント基板の両端部を係止させてリフロー炉を通過させることとなる。その際、プリント基板の端縁部の幅方向全長に亘って電気部品接続ユニットが設けられた構造では、プリント基板の両端部にまで半田付け領域が設けられていることから、搬送レールへのプリント基板の載置が困難となるのである。   However, as described above, when the electrical component connection unit is automatically mounted on the printed circuit board by the reflow soldering process, there is a problem that it is difficult to secure a mounting cost of the printed circuit board to the transfer device. That is, when the electrical component connection unit is automatically mounted on the printed circuit board by the reflow soldering process, both ends of the printed circuit board are locked to a pair of conveyance rails that are spaced apart from each other and extend in parallel, and passed through the reflow furnace. Become. At that time, in the structure where the electrical component connection unit is provided over the entire length in the width direction of the edge of the printed circuit board, the soldering area is provided up to both ends of the printed circuit board. This makes it difficult to place the substrate.

これに対して、搬送治具を用いてプリント基板の両端部を把持し、かかる搬送治具を搬送レールに支持されることが提案されているが、搬送治具を用いる分だけコスト高となると共に、搬送治具に対応して搬送レール幅を広げたり、プリント基板の搬送治具への装着という人為的な作業が必要となることから、人為的なミスが発生するおそれがある。   On the other hand, it has been proposed to hold both ends of the printed circuit board using a transport jig and to support the transport jig on the transport rail, but the cost is increased by using the transport jig. At the same time, since a manual work such as increasing the width of the transport rail corresponding to the transport jig or mounting the printed circuit board on the transport jig is required, a human error may occur.

特開2012−115052号公報JP 2012-115052 A

本発明は、上述の事情を背景に為されたものであって、その解決課題は、プリント基板の端縁部の幅方向略全長に亘って電気部品接続ユニットを設けた場合でも、搬送治具を必要とすることなく、電気部品接続ユニットをプリント基板にリフロー半田付けにより自動実装することができる、電気部品接続ユニットを備えたプリント基板の新規な製造方法に関する。本発明はまた、かかる新規な製造方法により得られたプリント基板が内蔵された電気回路装置にも関する。   The present invention has been made in the background of the above-mentioned circumstances, and the problem to be solved is that even when the electrical component connection unit is provided over the entire length in the width direction of the edge portion of the printed circuit board, the conveying jig is provided. The present invention relates to a novel method for manufacturing a printed circuit board having an electrical component connection unit, which can automatically mount the electrical component connection unit on the printed circuit board by reflow soldering. The present invention also relates to an electric circuit device incorporating a printed circuit board obtained by such a novel manufacturing method.

電気部品接続ユニットを備えたプリント基板の製造方法に関する本発明の第1の態様は、電気部品接続ユニットを備えたプリント基板の製造方法であって、端縁部の幅方向の略全長に亘って広がる実装部と、前記端縁部の前記幅方向両端部に直交する両側縁部に対して、搬送レールに支持される一対の捨て基板が切除可能に連結されているプリント基板を準備するプリント基板準備工程と、前記実装部に前記電気部品接続ユニットを搭載した状態で、前記一対の捨て基板を前記搬送レールに支持させて前記プリント基板をリフロー炉に搬送するリフロー工程と、前記リフロー工程の後に前記捨て基板を切除する切除工程と、を含むことを特徴とする。   A first aspect of the present invention relating to a method for manufacturing a printed circuit board including an electrical component connection unit is a method for manufacturing a printed circuit board including an electrical component connection unit, which covers substantially the entire length in the width direction of the edge portion. A printed circuit board that prepares a printed circuit board in which a pair of discarded boards supported by a transport rail are removably connected to a widened mounting part and both side edge parts orthogonal to the both ends in the width direction of the edge part After the reflow process, a reflow process in which the pair of discarded boards are supported by the transport rails and the printed circuit board is transported to a reflow furnace in a state where the electrical component connection unit is mounted on the mounting portion. A cutting step of cutting the discarded substrate.

本発明の電気部品接続ユニットを備えたプリント基板の製造方法によれば、プリント基板の端縁部に設けた実装部の幅方向両端部分に直交するプリント基板の両側縁部に、一対の捨て基板を切除可能に連結している。これにより、リフロー工程において、搬送治具を用いることなく、搬送レールにプリント基板を支持させることができる。それ故、別部品の搬送治具を排除して製造コストの低減を図ることができる。また、予めプリント基板に設けられた捨て基板を利用して搬送レールにプリント基板を支持させることができることから、搬送レール幅の変更や搬送治具のプリント基板への装着等、人為的な作業を排除することができ、それに伴うミスの発生を未然に防止することができる。それ故、電気部品接続ユニットをプリント基板にリフロー半田付けにより自動実装する工程の、効率化や確実性の向上を図ることができる。   According to the method of manufacturing a printed circuit board provided with the electrical component connection unit of the present invention, a pair of discarded substrates is provided on both side edges of the printed circuit board perpendicular to both widthwise end portions of the mounting portion provided on the edge of the printed circuit board. Are removably connected. Thereby, in a reflow process, a printed circuit board can be supported on a conveyance rail, without using a conveyance jig. Therefore, it is possible to reduce the manufacturing cost by eliminating a separate component conveying jig. In addition, since the printed circuit board can be supported on the transport rail using a discarded board provided in advance on the printed circuit board, human work such as changing the width of the transport rail or mounting the transport jig on the printed circuit board can be performed. It is possible to eliminate the occurrence of mistakes associated therewith. Therefore, it is possible to improve efficiency and reliability of the process of automatically mounting the electrical component connection unit on the printed circuit board by reflow soldering.

プリント基板が内蔵された電気回路装置に関する本発明の第1の態様は、端縁部の幅方向の略全長に亘って広がる実装部に対して、電気部品接続ユニットがリフロー半田付けにより実装されてなるプリント基板が内蔵された電気回路装置であって、前記プリント基板が、前記第1の態様に記載の電気部品接続ユニットを備えたプリント基板の製造方法によって得られたものである、ことを特徴とする。   A first aspect of the present invention relating to an electric circuit device with a built-in printed circuit board is that an electrical component connecting unit is mounted by reflow soldering on a mounting portion that extends over substantially the entire length of the edge portion in the width direction. An electric circuit device having a printed circuit board built therein, wherein the printed circuit board is obtained by the method for manufacturing a printed circuit board including the electrical component connection unit according to the first aspect. And

プリント基板が内蔵された電気回路装置に係る本発明によれば、プリント基板が、本発明の製造方法に従って得られたものであることから、本発明の製造方法と同様、電気部品接続ユニットをプリント基板にリフロー半田付けにより自動実装する工程の、効率化や確実性の向上を図ることができ、電気回路装置全体の低コスト化や接続信頼性の向上を図ることができる。   According to the present invention relating to the electric circuit device incorporating the printed circuit board, since the printed circuit board is obtained according to the manufacturing method of the present invention, the electrical component connection unit is printed as in the manufacturing method of the present invention. It is possible to improve the efficiency and reliability of the process of automatically mounting on the substrate by reflow soldering, and to reduce the cost of the entire electric circuit device and improve the connection reliability.

プリント基板が内蔵された電気回路装置に関する本発明の第2の態様は、前記第1の態様に記載されたプリント基板が内蔵された電気回路装置において、前記プリント基板が、一側面が開口部とされた矩形箱体形状のケースに対して収納されており、前記ケースの前記開口部が前記電気部品接続ユニットによって覆蓋されていると共に、前記プリント基板の前記端縁部の幅方向で対向する前記ケースの一対の対向側面が、前記端縁部の幅方向寸法よりも僅かに大きな対向面間距離で、前記プリント基板の両側縁部の延出方向に延びているものである。   A second aspect of the present invention relating to an electric circuit device incorporating a printed circuit board is the electric circuit device incorporating the printed circuit board described in the first aspect, wherein the printed circuit board has an opening on one side surface. The rectangular box-shaped case is housed, and the opening of the case is covered with the electrical component connecting unit, and is opposed in the width direction of the edge portion of the printed circuit board. A pair of opposing side surfaces of the case extend in the extending direction of both side edge portions of the printed board with a distance between the opposing surfaces slightly larger than the widthwise dimension of the end edge portion.

本態様によれば、プリント基板を収容する矩形箱体形状のケースの開口部が電気部品接続ユニットによって覆蓋されていると共に、プリント基板の前記端縁部の幅方向で対向する一対の対向側面が、端縁部の幅方向寸法よりも僅かに大きな対向面間距離で互いに平行に延出している。これにより、電気回路装置を少ない部品点数で構成できると共に、外形形状をコンパクト化できる。   According to this aspect, the opening of the rectangular box-shaped case that accommodates the printed circuit board is covered with the electrical component connecting unit, and the pair of opposed side surfaces that face each other in the width direction of the edge portion of the printed circuit board are provided. , They extend in parallel with each other at a distance between the facing surfaces that is slightly larger than the widthwise dimension of the edge. Thus, the electric circuit device can be configured with a small number of parts, and the outer shape can be made compact.

特に、プリント基板の端縁部の幅方向で対向する前記ケースの一対の対向側面が、前記端縁部の幅方向寸法よりも僅かに大きな対向面間距離で配設されていることから、プリント基板をこれ以上大きくすることができない制約がある。このような場合でも、プリント基板に設けられた捨て基板を利用して、プリント基板の端縁部の幅方向の略全長に亘って広がる電気部品接続ユニットを、搬送レールに支持させることができ、リフロー半田付けによる自動実装を効率的且つ人為的なミスを伴うことなく行うことが可能となるのである。それ故、電気回路装置の小型化と実装工程の効率化の両立を図ることができる。   In particular, the pair of opposing side surfaces of the case facing each other in the width direction of the edge portion of the printed circuit board are disposed at a distance between the facing surfaces that is slightly larger than the width direction dimension of the edge portion. There is a restriction that the substrate cannot be made larger. Even in such a case, using the discarded board provided on the printed circuit board, the electric component connection unit extending over the substantially entire length in the width direction of the edge part of the printed circuit board can be supported on the transport rail, Automatic mounting by reflow soldering can be performed efficiently and without human error. Therefore, it is possible to achieve both the miniaturization of the electric circuit device and the efficiency of the mounting process.

本発明においては、プリント基板の幅方向両端部分に直交するプリント基板の両側縁部に、一対の捨て基板を切除可能に連結している。これにより、リフロー工程において搬送治具を用いることなく搬送レールにプリント基板を支持させることができるので、製造コストを低減できる。また、搬送レール幅の変更や搬送治具のプリント基板への装着等、人為的な作業を排除することができることから、それに伴うミスの発生を未然に防止できると共に、リフロー工程の効率化や確実性の向上を図ることができる。   In the present invention, a pair of discarded substrates is connected to both side edges of the printed circuit board orthogonal to both end portions in the width direction of the printed circuit board so as to be excised. Thereby, since a printed circuit board can be supported on a conveyance rail, without using a conveyance jig in a reflow process, manufacturing cost can be reduced. In addition, since manual work such as changing the width of the transfer rail and mounting the transfer jig on the printed circuit board can be eliminated, the associated mistakes can be prevented and the reflow process can be made more efficient and reliable. It is possible to improve the performance.

本発明の一実施形態としての電気回路装置の組付途中状態を示す斜視図。The perspective view which shows the assembly | attachment middle state of the electric circuit apparatus as one Embodiment of this invention. 図1に示す電気回路装置の平面図。The top view of the electric circuit apparatus shown in FIG. 図1に示す電気回路装置の底面図。The bottom view of the electric circuit apparatus shown in FIG. 図1に示す電気回路装置の組付状態を示す平面図。The top view which shows the assembly | attachment state of the electric circuit apparatus shown in FIG. 図1に示す側方接続型コネクタを下方から見た斜視図。The perspective view which looked at the side connection type connector shown in FIG. 1 from the downward direction. 図1に示すプリント基板の側方接続型コネクタ等を実装する前の状態を示す平面図。The top view which shows the state before mounting the side connection type connector etc. of the printed circuit board shown in FIG. 図6に示すプリント基板に側方接続型コネクタ等を実装した後のリフロー工程を説明するための平面図。The top view for demonstrating the reflow process after mounting a side connection type connector etc. on the printed circuit board shown in FIG.

以下、本発明の実施形態について、図面を参照しつつ説明する。   Embodiments of the present invention will be described below with reference to the drawings.

先ず、図1〜4に、本発明の一実施形態としてのプリント基板が内蔵された電気回路装置10を示す。電気回路装置10は、例えば、自動車のバッテリーなどの電源と各種電装品などの負荷との間に配されて、各種電装品への電源供給の制御を行う電気接続箱として用いられており、プリント基板12と、プリント基板12の端縁部14の実装部16に設けられた電気部品接続ユニットである側方接続型コネクタ18と、ケース20と、を備えて構成されている。そして、プリント基板12に設けられた側方接続型コネクタ18に対して、一側面22が開口部24とされた矩形箱体形状のケース20をプリント基板12側から外挿装着することによって、プリント基板12がケース20内に収納されると共にケース20の開口部24が側方接続型コネクタ18によって覆蓋された状態で、ケース20が側方接続型コネクタ18に組み付けられるようになっている。なお、以下の説明において、上方とは、図1中の上方、下方とは、図1中の下方、前方とは、図1中の左方、後方とは、図1中の右方を言うものとする。   First, FIG. 1 to FIG. 4 show an electric circuit device 10 incorporating a printed circuit board as one embodiment of the present invention. The electric circuit device 10 is, for example, arranged between a power source such as an automobile battery and a load such as various electrical components, and is used as an electrical junction box for controlling power supply to various electrical components. The circuit board 12 includes a side connection connector 18 that is an electrical component connection unit provided on the mounting portion 16 of the edge portion 14 of the printed circuit board 12, and a case 20. Then, a rectangular box-shaped case 20 having one side 22 as an opening 24 is attached to the side connection connector 18 provided on the printed circuit board 12 from the printed circuit board 12 side. The case 20 is assembled to the side connection connector 18 in a state where the substrate 12 is housed in the case 20 and the opening 24 of the case 20 is covered with the side connection connector 18. In the following description, “upper” means the upper side in FIG. 1, “lower” means the lower side in FIG. 1, “front” means the left side in FIG. 1, and “rear” means the right side in FIG. Shall.

側方接続型コネクタ18は、図5に示されているように、全体として長手矩形ブロック形状を呈しており、例えばポリプロピレン(PP)、ポリアミド(PA)等の合成樹脂により射出成形等によって一体形成されている。側方接続型コネクタ18の後面26には、複数の端子保持部28が突設されており、端子保持部28には多数の接続端子挿通孔30が後方に向かって開口形成されている。また、側方接続型コネクタ18は、複数の接続端子32を備えている。これらの接続端子32はL字の屈曲形状とされており、一端側34がプリント基板12の図示しない導電路に半田付けにより接続されている一方、他端側36が接続端子挿通孔30に収容・保持されるようになっている。一方、側方接続型コネクタ18の前面38には、複数のコネクタ収容部40が前方に向かって開口形成されており、コネクタ収容部40の内部には接続端子32の他端側36が突設されている。そして、コネクタ収容部40に、外部の電気部品である図示しない相手側コネクタが収容されることにより、接続端子32を介して、プリント基板12と相手側コネクタが電気的に接続されるようになっている。   As shown in FIG. 5, the side-connecting connector 18 has a long rectangular block shape as a whole, and is integrally formed by injection molding or the like with a synthetic resin such as polypropylene (PP) or polyamide (PA). Has been. A plurality of terminal holding portions 28 protrude from the rear surface 26 of the side connection type connector 18, and a number of connection terminal insertion holes 30 are formed in the terminal holding portion 28 so as to open rearward. In addition, the side connection connector 18 includes a plurality of connection terminals 32. These connection terminals 32 have an L-shaped bent shape, and one end side 34 is connected to a conductive path (not shown) of the printed circuit board 12 by soldering, while the other end side 36 is accommodated in the connection terminal insertion hole 30.・ It is designed to be held. On the other hand, a plurality of connector housing portions 40 are formed in the front surface 38 of the side connection type connector 18 so as to open toward the front, and the other end side 36 of the connection terminal 32 protrudes inside the connector housing portion 40. Has been. Then, when a mating connector (not shown), which is an external electrical component, is housed in the connector housing portion 40, the printed circuit board 12 and the mating connector are electrically connected via the connection terminal 32. ing.

さらに、側方接続型コネクタ18の上面42の長手方向両側には、それぞれロック爪44が外方に突出して形成されていると共に、ロック爪44を挟む両側には、一対の案内部46,46が形成されている。案内部46,46は、側方接続型コネクタ18の上面42から外方に突出すると共に、突出端縁部が直角に屈曲された逆L字の断面形状をもって、ロック爪44とは逆側に向かって延出されている。   Further, lock claws 44 are formed to protrude outwardly on both longitudinal sides of the upper surface 42 of the side connection type connector 18, and a pair of guide portions 46, 46 are located on both sides of the lock claws 44. Is formed. The guide portions 46, 46 protrude outward from the upper surface 42 of the side connection type connector 18, and have a reverse L-shaped cross-sectional shape with a protruding end edge bent at a right angle, and are opposite to the lock claw 44. It is extended toward.

加えて、側方接続型コネクタ18の上面42の長手方向両端部には、それぞれ係合溝部48が、L字断面形状で側方接続型コネクタ18の後面26から前面38に向かって延出されていると共に、側方接続型コネクタ18の上面42及び後面26に対して開口されて形成されている。さらに、側方接続型コネクタ18の上面42の長手方向中央部には、側方接続型コネクタ18の上面42及び後面26に対して開口する係合溝部50が、逆T字の断面形状をもって延出されている。   In addition, engaging groove portions 48 are extended from the rear surface 26 of the side connection type connector 18 toward the front surface 38 in an L-shaped cross section at both longitudinal ends of the upper surface 42 of the side connection type connector 18. In addition, the side connection connector 18 is formed to be open to the upper surface 42 and the rear surface 26. Further, an engaging groove portion 50 opened to the upper surface 42 and the rear surface 26 of the side connection type connector 18 extends in the center of the longitudinal direction of the upper surface 42 of the side connection type connector 18 with an inverted T-shaped cross section. Has been issued.

一方、図5に示されているように、プリント基板12への実装の際に側方接続型コネクタ18のプリント基板12側に位置する底壁部52にも、側方接続型コネクタ18の上面42と対向する位置において、側方接続型コネクタ18の上面42に形成されていたものと同じ構造のもの、すなわちロック爪54及びロック爪54を挟む両側に設けられた一対の案内部56,56と、係合溝部58と、係合溝部60と、が突設されている。   On the other hand, as shown in FIG. 5, the top surface of the side connection type connector 18 is also formed on the bottom wall portion 52 located on the printed circuit board 12 side of the side connection type connector 18 when mounted on the printed circuit board 12. 42, a pair of guide portions 56, 56 provided on both sides of the lock claw 54 and the lock claw 54 having the same structure as that formed on the upper surface 42 of the side connection connector 18. And the engaging groove part 58 and the engaging groove part 60 are protrudingly provided.

加えて、側方接続型コネクタ18の底壁部52の中央部分には、3箇所に下方に向かって突出する割りピン62が設けられている。割りピン62は、略半円断面形状で且つ突出端部が拡径されている一対の突起を円弧部分がやや距離を隔てて対向するように配置したものであり、後述するプリント基板12のピン挿通孔74に割りピン62の突出端部を押し込むことにより一対の突起の突出端部が対向方向に弾性変形して挿通され、挿通後は弾性復帰することにより突出端部の拡径部がプリント基板12のピン挿通孔74の外縁部に係合して、側方接続型コネクタ18の底壁部52がプリント基板12に固定されるようになっている。また、側方接続型コネクタ18の底壁部52の長手方向両端部には、後方に向かって略矩形状に突出する載置補助片64が設けられており、側方接続型コネクタ18をプリント基板12上に安定して保持することができるようになっている。   In addition, the center portion of the bottom wall portion 52 of the side connection type connector 18 is provided with split pins 62 protruding downward at three locations. The split pin 62 is formed by arranging a pair of protrusions having a substantially semicircular cross-sectional shape and a protruding end portion having an enlarged diameter so that the arc portions face each other with a slight distance therebetween. By pushing the protruding end portion of the split pin 62 into the insertion hole 74, the protruding end portions of the pair of protrusions are elastically deformed in the opposing direction, and after insertion, the expanded diameter portion of the protruding end portion is printed by elastic recovery. The bottom wall 52 of the side connection type connector 18 is fixed to the printed circuit board 12 by engaging with the outer edge of the pin insertion hole 74 of the circuit board 12. In addition, mounting auxiliary pieces 64 projecting in a substantially rectangular shape toward the rear are provided at both ends in the longitudinal direction of the bottom wall portion 52 of the side connection type connector 18, and the side connection type connector 18 is printed. It can be stably held on the substrate 12.

図2〜3に示されているように、プリント基板12は略矩形の板形状とされており、プリント基板12の表面66及び裏面68に対して、図示のようなリレー70(図1及び図2参照)のほか、集積回路等の半導体素子や、抵抗素子その他の電気回路素子等が適宜実装されている。また、プリント基板12の端縁部14には、端縁部14の幅方向の略全長に亘って広がる実装部16が構成されている。実装部16には、端縁部14に沿って多数の端子挿通孔72が2列に亘って貫設されていると共に3箇所にピン挿通孔74が貫設されており、また3箇所においてプリント基板12が略矩形状に切り欠かれた切欠部76が形成されている。   As shown in FIGS. 2 to 3, the printed circuit board 12 has a substantially rectangular plate shape, and a relay 70 (shown in FIG. 1 and FIG. 1) with respect to the front surface 66 and the back surface 68 of the printed circuit board 12. 2), a semiconductor element such as an integrated circuit, a resistance element and other electric circuit elements are appropriately mounted. Further, the end edge portion 14 of the printed circuit board 12 is configured with a mounting portion 16 that extends over substantially the entire length of the end edge portion 14 in the width direction. The mounting portion 16 has a large number of terminal insertion holes 72 penetrating in two rows along the edge portion 14, and pin insertion holes 74 penetrating at three locations. A cutout 76 is formed by cutting the substrate 12 into a substantially rectangular shape.

次に、図6及び図7を用いて、側方接続型コネクタ18を備えたプリント基板12の製造方法に関する本発明の一実施形態について説明する。はじめに、図6に示されているように、シート状の基板78を準備する。基板78は、一対のプリント基板12,12と一対の捨て基板80,80とそれらを連結する連結部82を含んで構成されている。より詳細には、シート状の基板78において、一対のプリント基板12,12は、端縁部14の対辺となるもう一方の端縁部84において連結部82によって切除可能に連結されている一方、一対のプリント基板12,12の端縁部14の幅方向両端部に直交する両側縁部86,86において一対の捨て基板80,80に対して連結部82によって切除可能に連結されている。加えて、一対の捨て基板80,80の長手方向両端部には貫通孔88が設けられている。このような構成のプリント基板12が、プリント基板準備工程において準備される。   Next, an embodiment of the present invention relating to a method for manufacturing the printed circuit board 12 including the side connection type connector 18 will be described with reference to FIGS. 6 and 7. First, as shown in FIG. 6, a sheet-like substrate 78 is prepared. The board 78 includes a pair of printed boards 12 and 12, a pair of discarded boards 80 and 80, and a connecting portion 82 for connecting them. More specifically, in the sheet-like substrate 78, the pair of printed circuit boards 12 and 12 are removably connected by the connecting portion 82 at the other end edge portion 84 which is the opposite side of the end edge portion 14. The pair of printed circuit boards 12 and 12 are removably connected to the pair of discarded boards 80 and 80 at the side edges 86 and 86 perpendicular to both ends in the width direction of the edge 14 of the pair of printed circuit boards 12 and 12. In addition, through holes 88 are provided at both ends in the longitudinal direction of the pair of discarded substrates 80, 80. The printed circuit board 12 having such a configuration is prepared in the printed circuit board preparation step.

続いて、図7に示されているように、一対のプリント基板12,12の端縁部14に設けられた実装部16に側方接続型コネクタ18を搭載する。この際、側方接続型コネクタ18に設けられた接続端子32の一端側34が実装部16に設けて予め半田が塗布された端子挿通孔72に挿通されると共に、側方接続型コネクタ18の底壁部52に設けられた割りピン62が実装部16に設けられたピン挿通孔74に挿通される。この結果、側方接続型コネクタ18の底壁部52に突設されている、ロック爪54及びロック爪54を挟む両側に設けられた一対の案内部56,56と係合溝部58と係合溝部60とが、プリント基板12に形成された切欠部76から下方に向かって突出されるようになっている(図3参照)。併せて、一対のプリント基板12,12の表面66及び裏面68に対して、図示のようなリレー70のほか、集積回路等の半導体素子や、抵抗素子その他の電気回路素子等を搭載する。そして、このようにして構成された基板78の一対の捨て基板80,80を一対の搬送レール90,90上に載置する。搬送レール90には突起92が設けられており、かかる突起92を捨て基板80に設けられた貫通孔88に嵌め込むことにより、一対の捨て基板80,80が一対の搬送レール90,90に支持されて、プリント基板12を含む基板78が図示しないリフロー炉に搬送されるようになっている。この結果、側方接続型コネクタ18に設けられた接続端子32の一端側34やリレー70等の部品がプリント基板12にリフロー半田付けされるのである。このような一連の作業が、リフロー工程において実行されるのである。   Subsequently, as shown in FIG. 7, the side connection type connector 18 is mounted on the mounting portion 16 provided on the end edge portion 14 of the pair of printed circuit boards 12 and 12. At this time, one end side 34 of the connection terminal 32 provided in the side connection type connector 18 is inserted into the terminal insertion hole 72 provided in the mounting portion 16 and pre-applied with solder, and The split pin 62 provided in the bottom wall portion 52 is inserted into the pin insertion hole 74 provided in the mounting portion 16. As a result, the locking claw 54 and the pair of guide portions 56, 56 provided on both sides of the locking claw 54 and the engaging groove 58 are projected from the bottom wall portion 52 of the side connection type connector 18. A groove 60 projects downward from a notch 76 formed in the printed circuit board 12 (see FIG. 3). In addition, a semiconductor element such as an integrated circuit, a resistance element, and other electric circuit elements are mounted on the front surface 66 and the rear surface 68 of the pair of printed circuit boards 12 and 12 in addition to the relay 70 as illustrated. Then, the pair of discarded substrates 80, 80 of the substrate 78 configured in this way is placed on the pair of transport rails 90, 90. The transport rail 90 is provided with a protrusion 92, and the pair of discard substrates 80, 80 are supported by the pair of transport rails 90, 90 by fitting the protrusion 92 into a through hole 88 provided in the discard substrate 80. Thus, the substrate 78 including the printed circuit board 12 is transferred to a reflow furnace (not shown). As a result, components such as one end side 34 of the connection terminal 32 provided on the side connection type connector 18 and the relay 70 are reflow soldered to the printed circuit board 12. Such a series of operations is performed in the reflow process.

リフロー工程の後、連結部82で折り曲げるなどして基板78から一対の捨て基板80,80を切除する切除工程が実行される。このようにして構成された一対のプリント基板12,12をさらに連結部82で折り曲げるなどして、一対のプリント基板12,12を分割することができる。これにより、本実施形態の製造方法に従う側方接続型コネクタ18を備えたプリント基板12の製造が完了する。   After the reflow process, an excision process is performed in which the pair of discarded substrates 80 and 80 are excised from the substrate 78 by bending at the connecting portion 82 or the like. The pair of printed circuit boards 12 and 12 can be divided by, for example, further bending the pair of printed circuit boards 12 and 12 thus configured at the connecting portion 82. Thereby, manufacture of the printed circuit board 12 provided with the side connection type connector 18 according to the manufacturing method of this embodiment is completed.

図1〜4に示されているように、電気回路装置10のケース20は前方に開口する有底箱体形状を有している一方、ケース20の開口部24は正面視において側方接続型コネクタ18の後面26と略同一の長手矩形状に形成されており、例えばポリプロピレン(PP)、ポリアミド(PA)等の合成樹脂により射出成形等によって一体形成されている。より詳細には、図1及び図2に示されているように、プリント基板12の端縁部14の幅方向で対向するケース20の一対の対向側面94,94が、プリント基板12の端縁部14の幅方向寸法:L1よりも僅かに大きな対向面間距離:L2で、プリント基板12の両側縁部86,86の延出方向に延びて構成されている。   As shown in FIGS. 1 to 4, the case 20 of the electric circuit device 10 has a bottomed box shape opening forward, while the opening 24 of the case 20 is a side connection type in a front view. The connector 18 is formed in a substantially rectangular shape that is substantially the same as the rear surface 26 of the connector 18, and is integrally formed of, for example, a synthetic resin such as polypropylene (PP) or polyamide (PA) by injection molding or the like. More specifically, as shown in FIGS. 1 and 2, a pair of opposing side surfaces 94, 94 of the case 20 that face each other in the width direction of the end edge portion 14 of the printed circuit board 12 are formed on the edge of the printed circuit board 12. The width direction dimension of the portion 14 is set to extend in the extending direction of the side edge portions 86 and 86 of the printed board 12 with a distance L2 between the facing surfaces slightly larger than L1.

ケース20の上壁部96の前端部には、2つの係合枠98,98が形成されている。係合枠98は、ケース20の上壁部96の前端部が略矩形状に切り欠かれた切欠部100から前方に延出して形成されている一方、中央部には側方接続型コネクタ18のロック爪44と係合する係合孔102が貫設されている。また、ケース20の上壁部96の前端部の内面の中央部には、内方に向かって略T字形状で突出する図示しない係合突起が設けられている一方、ケース20の上壁部96の前端部の内面の両端部には、内方に向かって略L字形状で突出する係合突部104がそれぞれ設けられている(図1参照)。   Two engaging frames 98 and 98 are formed on the front end portion of the upper wall portion 96 of the case 20. The engagement frame 98 is formed by extending the front end portion of the upper wall portion 96 of the case 20 forward from the cutout portion 100 cut out in a substantially rectangular shape, while the side connection type connector 18 is formed in the center portion. An engagement hole 102 that engages with the lock pawl 44 is provided. In addition, an engaging projection (not shown) that protrudes inward in a substantially T shape is provided at the center of the inner surface of the front end portion of the upper wall portion 96 of the case 20, while the upper wall portion of the case 20 is provided. Engagement projections 104 projecting in an approximately L-shape toward the inside are provided on both ends of the inner surface of the front end portion of 96 (see FIG. 1).

同様に、ケース20の底壁部106の前端部にも、係合枠98と同形状の2つの係合枠108,108が形成されている。また、ケース20の底壁部106の前端部の内面の中央部と両端部にもそれぞれ、略T字形状で突出する図示しない係合突起と略L字形状で突出する係合突部110が設けられている(図1参照)。加えて、ケース20の底壁部106には、固定用ロック部112が形成されており、他の電気接続箱等に設けられた図示しない固定用係合部等の共通の別部品に装着・固定する際に用いられる。   Similarly, two engagement frames 108, 108 having the same shape as the engagement frame 98 are formed at the front end portion of the bottom wall portion 106 of the case 20. Further, an engagement protrusion 110 (not shown) that protrudes in a substantially T shape and an engagement protrusion 110 that protrudes in a substantially L shape are also provided at the center and both ends of the inner surface of the front end portion of the bottom wall portion 106 of the case 20. Provided (see FIG. 1). In addition, a fixing lock portion 112 is formed on the bottom wall portion 106 of the case 20, and is attached to another common component such as a fixing engagement portion (not shown) provided in another electrical connection box or the like. Used when fixing.

そして、図1〜4に示されているように、このような構成とされたケース20を、プリント基板12が組み付けられた側方接続型コネクタ18に対して、プリント基板12側から外挿装着する。これにより、ケース20の上壁部96及び底壁部106の前端部がそれぞれ側方接続型コネクタ18の案内部46,56に挿し入れられると共に、ケース20の図示しない係合突起と係合突部104,110がそれぞれ側方接続型コネクタ18の係合溝部50,60、48,58に挿し入れられるようになっている。次に、ケース20をさらに側方接続型コネクタ18側に向って押し込むことにより、ケース20が側方接続型コネクタ18に設けられた案内部46,56及び係合溝部50,60、48,58によってガイドされて、ケース20に形成された係合枠98,108の係合孔102,102に対して、側方接続型コネクタ18に設けられたロック爪44,54がロック嵌合されて、側方接続型コネクタ18に対してケース20が固定される。これにより、プリント基板12がケース20に収容保持された状態で、ケース20と側方接続型コネクタ18が相互に組み付けられて、電気回路装置10が形成されるのである。   As shown in FIGS. 1 to 4, the case 20 having such a configuration is extrapolated from the printed circuit board 12 side to the side connection type connector 18 to which the printed circuit board 12 is assembled. To do. As a result, the front end portions of the upper wall portion 96 and the bottom wall portion 106 of the case 20 are inserted into the guide portions 46 and 56 of the side connection type connector 18, respectively, and the engagement protrusions (not shown) of the case 20 are engaged with the engagement protrusions. The portions 104 and 110 are inserted into the engaging groove portions 50, 60, 48, and 58 of the side connection type connector 18, respectively. Next, the case 20 is pushed further toward the side connection type connector 18, whereby the case 20 is provided with the guide portions 46 and 56 and the engagement groove portions 50, 60, 48 and 58 provided in the side connection type connector 18. The lock claws 44 and 54 provided in the side connection type connector 18 are locked and engaged with the engagement holes 102 and 102 of the engagement frames 98 and 108 formed in the case 20. A case 20 is fixed to the side connection type connector 18. Thereby, in a state where the printed circuit board 12 is accommodated and held in the case 20, the case 20 and the side connection type connector 18 are assembled together to form the electric circuit device 10.

このような構造とされた本実施形態の電気回路装置10によれば、シート状の基板78において、一対のプリント基板12,12の端縁部14の幅方向両端部分に直交するプリント基板12の両側縁部86,86には、一対の捨て基板80,80が連結部82によって切除可能に連結されている。加えて、一対の捨て基板80,80の長手方向両端部には貫通孔88が設けられている。これにより、リフロー工程において、搬送レール90に設けられた突起92が捨て基板80に設けられた貫通孔88に嵌まるように、一対の捨て基板80,80を一対の搬送レール90,90に載置することで、捨て基板80が搬送レール90に支持されて、プリント基板12を含む基板78が図示しないリフロー炉に搬送できるようになっている。それ故、別部品の搬送治具を排除して製造コストの低減を図ることができる。また、予めプリント基板12に設けられた一対の捨て基板80,80を利用して搬送レール90にプリント基板12を支持させることができることから、搬送レール幅の変更や搬送治具の基板への装着等、人為的な作業を排除することができ、それに伴うミスの発生を未然に防止することができる。それ故、側方接続型コネクタ18をプリント基板12にリフロー半田付けにより自動実装する工程の、効率化や確実性の向上を図ることができる。   According to the electrical circuit device 10 of the present embodiment having such a structure, in the sheet-like substrate 78, the pair of printed circuit boards 12, 12 of the printed circuit board 12 perpendicular to both end portions in the width direction of the edge portions 14 thereof. A pair of discarded substrates 80 and 80 are connected to the side edge portions 86 and 86 by a connecting portion 82 so as to be excised. In addition, through holes 88 are provided at both ends in the longitudinal direction of the pair of discarded substrates 80, 80. Thus, in the reflow process, the pair of discarded substrates 80, 80 are mounted on the pair of transport rails 90, 90 so that the protrusions 92 provided on the transport rail 90 fit into the through holes 88 provided in the discarded substrate 80. As a result, the discarded substrate 80 is supported by the transport rail 90, and the substrate 78 including the printed circuit board 12 can be transported to a reflow furnace (not shown). Therefore, it is possible to reduce the manufacturing cost by eliminating a separate component conveying jig. Further, since the printed circuit board 12 can be supported on the transport rail 90 by using a pair of discarded boards 80, 80 provided in advance on the printed circuit board 12, the width of the transport rail is changed and the mounting of the transport jig to the circuit board is performed. Thus, it is possible to eliminate human work and prevent the occurrence of mistakes associated therewith. Therefore, it is possible to improve the efficiency and reliability of the process of automatically mounting the side connection type connector 18 on the printed circuit board 12 by reflow soldering.

また、プリント基板12を収容する矩形箱体形状のケース20の開口部24が側方接続型コネクタ18によって覆蓋されていることから、電気回路装置10を少ない部品点数で構成できる。加えて、プリント基板12の端縁部14の幅方向で対向するケース20の一対の対向側面94,94の対向面間距離:L2が、プリント基板12の端縁部14の幅方向寸法:L1よりも僅かに大きい(L2>L1)ことから、電気回路装置10をコンパクトに形成することができる。但し、このような場合には、プリント基板12をこれ以上大きくすることができない制約があるが、プリント基板12に設けられた捨て基板80を利用することで搬送レール90にプリント基板12を支持させることができる。   Moreover, since the opening part 24 of the rectangular box-shaped case 20 that accommodates the printed circuit board 12 is covered with the side connection type connector 18, the electric circuit device 10 can be configured with a small number of components. In addition, the distance L2 between the pair of facing side surfaces 94, 94 of the case 20 facing each other in the width direction of the edge 14 of the printed circuit board 12 is L2 in the width direction of the edge 14 of the printed circuit board 12: L1. Therefore, the electric circuit device 10 can be made compact. However, in such a case, there is a restriction that the printed board 12 cannot be made larger, but the printed board 12 is supported on the transport rail 90 by using the discarded board 80 provided on the printed board 12. be able to.

以上、本発明の実施形態について詳述してきたが、本発明はその具体的な記載によって限定されない。例えば、本実施形態では、電気部品接続ユニットとして側方接続型コネクタ18を例示して説明を行ったが、これ以外に電気部品接続ユニットとして側方接続型ヒューズユニットや上方から電気部品が装着されるタイプの電気部品接続ユニットでも、本発明が同様に適用可能である。   As mentioned above, although embodiment of this invention was explained in full detail, this invention is not limited by the specific description. For example, in the present embodiment, the side connection type connector 18 is described as an example of the electrical component connection unit. However, in addition to this, the side connection type fuse unit or the electrical component is mounted from above as the electrical component connection unit. The present invention can be similarly applied to a type of electrical component connecting unit.

10:電気回路装置、12:プリント基板、14:端縁部、16:実装部、18:側方接続型コネクタ(電気部品接続ユニット)、20:ケース、22:一側面、24:開口部、80:捨て基板、86:側縁部、90:搬送レール、94:対向側面 10: Electrical circuit device, 12: Printed circuit board, 14: Edge portion, 16: Mounting portion, 18: Side connection connector (electrical component connection unit), 20: Case, 22: One side surface, 24: Opening portion, 80: Discarded substrate, 86: Side edge, 90: Transport rail, 94: Opposite side surface

Claims (3)

電気部品接続ユニットを備えたプリント基板の製造方法であって、
端縁部の幅方向の略全長に亘って広がる実装部と、前記端縁部の前記幅方向両端部に直交する両側縁部に対して、搬送レールに支持される一対の捨て基板が切除可能に連結されているプリント基板を準備するプリント基板準備工程と、
前記実装部に前記電気部品接続ユニットを搭載した状態で、前記一対の捨て基板を前記搬送レールに支持させて前記プリント基板をリフロー炉に搬送するリフロー工程と、
前記リフロー工程の後に前記捨て基板を切除する切除工程と、
を含むことを特徴とする電気部品接続ユニットを備えたプリント基板の製造方法。
A method of manufacturing a printed circuit board including an electrical component connection unit,
A pair of discarded substrates supported by the transport rail can be cut out from the mounting portion that extends over substantially the entire length in the width direction of the end edge portion and both side edge portions that are orthogonal to the both end portions in the width direction of the end edge portion. A printed circuit board preparation step of preparing a printed circuit board connected to
A reflow step of transporting the printed circuit board to a reflow furnace by supporting the pair of discarded boards on the transport rail in a state where the electrical component connection unit is mounted on the mounting portion;
An excision step of excising the discarded substrate after the reflow step;
A method for manufacturing a printed circuit board comprising an electrical component connection unit.
端縁部の幅方向の略全長に亘って広がる実装部に対して、電気部品接続ユニットがリフロー半田付けにより実装されてなるプリント基板が内蔵された電気回路装置であって、
前記プリント基板が、前記請求項1に記載の電気部品接続ユニットを備えたプリント基板の製造方法によって得られたものである、ことを特徴とするプリント基板が内蔵された電気回路装置。
An electrical circuit device including a printed circuit board in which an electrical component connection unit is mounted by reflow soldering on a mounting portion that extends over substantially the entire length in the width direction of the edge portion,
An electric circuit device having a built-in printed circuit board, wherein the printed circuit board is obtained by the method for producing a printed circuit board comprising the electrical component connecting unit according to claim 1.
前記プリント基板が、一側面が開口部とされた矩形箱体形状のケースに対して収納されており、前記ケースの前記開口部が前記電気部品接続ユニットによって覆蓋されていると共に、前記プリント基板の前記端縁部の幅方向で対向する前記ケースの一対の対向側面が、前記端縁部の幅方向寸法よりも僅かに大きな対向面間距離で、前記プリント基板の両側縁部の延出方向に延びている請求項2に記載のプリント基板が内蔵された電気回路装置。   The printed circuit board is housed in a rectangular box-shaped case having an opening on one side surface, the opening of the case is covered with the electrical component connecting unit, and the printed circuit board A pair of opposing side surfaces of the case facing each other in the width direction of the edge portion are in the extending direction of both side edges of the printed circuit board with a distance between the facing surfaces slightly larger than the width direction dimension of the edge portion. An electric circuit device incorporating the printed circuit board according to claim 2.
JP2013270714A 2013-12-27 2013-12-27 Method for manufacturing printed circuit board having electrical component connection unit and electric circuit arrangement including printed circuit board obtained thereby Abandoned JP2015126152A (en)

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PCT/JP2014/082444 WO2015098481A1 (en) 2013-12-27 2014-12-08 Production method for printed circuit board equipped with electric-component connection unit, and electric circuit device having printed circuit board obtained by said production method embedded therein

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Citations (5)

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JPH0797699B2 (en) * 1990-06-18 1995-10-18 富士通株式会社 Warp prevention method and warp prevention jig for parent printed circuit board
JP2003174240A (en) * 2001-12-04 2003-06-20 Alps Electric Co Ltd Circuit board and its manufacturing method
JP2004228470A (en) * 2003-01-27 2004-08-12 Alps Electric Co Ltd Manufacturing method for circuit board
JP2009224696A (en) * 2008-03-18 2009-10-01 Nec Infrontia Corp Printed circuit board transporting mechanism and reflow equipment
JP2012115052A (en) * 2010-11-25 2012-06-14 Sumitomo Wiring Syst Ltd Electric connection box

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JP5333849B2 (en) * 2009-07-10 2013-11-06 住友電装株式会社 Electrical junction box

Patent Citations (5)

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Publication number Priority date Publication date Assignee Title
JPH0797699B2 (en) * 1990-06-18 1995-10-18 富士通株式会社 Warp prevention method and warp prevention jig for parent printed circuit board
JP2003174240A (en) * 2001-12-04 2003-06-20 Alps Electric Co Ltd Circuit board and its manufacturing method
JP2004228470A (en) * 2003-01-27 2004-08-12 Alps Electric Co Ltd Manufacturing method for circuit board
JP2009224696A (en) * 2008-03-18 2009-10-01 Nec Infrontia Corp Printed circuit board transporting mechanism and reflow equipment
JP2012115052A (en) * 2010-11-25 2012-06-14 Sumitomo Wiring Syst Ltd Electric connection box

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