JP2015111081A - Alignment device, and thin film forming device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device that improves the accuracy of alignment between a substrate and an alignment object to which alignment and vacuum processing are repeatedly performed.SOLUTION: An alignment device determines the optimal intensity of illumination for each alignment object 7 and the alignment distance to an imaging device 13, and stores in association with identification marks of the alignment objects 7. The alignment device determines and stores the intensity of illumination and alignment distance from the identification marks during the alignment; and photographs the object alignment marks with the imaging device 13 with the determined intensity of illumination and alignment distance to perform the alignment. The capability of the alignment in the optimal conditions improves the accuracy of the alignment.

Description

  The present invention relates to a technical field of an alignment apparatus, and more particularly to an alignment apparatus that repeatedly uses an alignment object to be aligned with a substrate and a thin film forming apparatus provided with the alignment apparatus.

  In the in-line method in which a substrate is arranged on each of a plurality of transfer trays and a thin film is formed on the surface of the substrate by transferring the transfer tray, when aligning the substrate and the transfer tray, the lighting device uses the transfer tray, mask, and substrate. The alignment mark is imaged by an imaging device, and relative alignment between the substrate and the transfer tray or mask is performed by image analysis.

However, since the transport tray and the mask are repeatedly used, the surface condition such as the surface roughness and the surface color is different for each transport tray and mask.
In addition, the mechanical accuracy at the time of creating the thickness, distortion method, and the like differs for each transport tray and mask.

  For this reason, the position, height, mask appearance, and brightness are different when the transport tray or mask is observed with the imaging device, so that the sharpness of the image obtained by the imaging device is different. The accuracy will be different.

As in the following cited patent document, there is a technique for measuring the illuminance and distance at the time of alignment and controlling it to be a reference value, but measuring the illuminance and distance at each alignment is a processing time. Cannot be said to be desirable.
There is a need for a technique capable of accurately performing alignment between an alignment target object such as a transfer tray and a mask, which is repeatedly aligned with the substrate, and the substrate.

JP 2010-25669 A

  The present invention was created to solve the above-described problems of the prior art, and provides a technique for improving the alignment accuracy between an alignment object and a substrate in which alignment and vacuum processing are repeatedly performed.

In order to solve the above problems, the present invention is an alignment apparatus that performs an alignment process for aligning a substrate provided with a substrate alignment mark and an alignment object provided with an object alignment mark. Each alignment object is provided with an identification mark corresponding to the alignment object on a one-to-one basis, and the alignment apparatus includes the substrate alignment of the substrate disposed in the alignment apparatus. An image pickup device for picking up an image of the mark and the object alignment mark of the alignment object arranged in the alignment apparatus from a plurality of the alignment objects; and an image of the imaged substrate alignment mark From the relative position between a certain board mark image and an object mark image which is an image of the imaged object alignment mark, the substrate and the alignment pair A control device that moves the object relative to perform the alignment step, an illumination device that illuminates the object alignment mark during the alignment step, and a detection device that detects the identification mark. In addition, when the alignment process is performed by illuminating the object alignment mark by emitting light from the illuminating device in advance, the value of the illumination intensity with which the alignment object is to be illuminated by the illuminating device is the position An illumination relationship is provided for each target object and the illumination intensity corresponding to the identification mark is obtained from the identification mark, and the control device performs the alignment before performing the alignment step. Detecting the identification mark of the positioning object in which a step is performed, obtaining the illumination intensity from the detected identification mark, causing the illumination device to emit light at the obtained illumination intensity, and A configuration position coupling device to perform the allowed steps.
In the present invention, when the alignment step is performed in advance, the size of the alignment distance, which is the distance between the imaging device and the alignment object, is obtained for each alignment object, A distance relationship for obtaining the alignment distance corresponding to the identification mark is provided from the identification mark, and the control device detects the alignment position from the detected identification mark before performing the alignment step. The positioning device is configured to perform the positioning step by obtaining a distance and separating the imaging device and the positioning target object from the obtained positioning distance.
The present invention is an alignment apparatus for performing an alignment process for aligning a substrate provided with a substrate alignment mark and an alignment object provided with an object alignment mark, and each alignment object Each of which is provided with a one-to-one identification mark corresponding to the alignment object, and the alignment apparatus includes the substrate alignment mark of the substrate disposed in the alignment apparatus, and a plurality of the alignment marks. An imaging device that images the object alignment mark of the alignment object arranged in the alignment apparatus from among the objects, and a substrate mark image that is an image of the captured substrate alignment mark Further, the substrate and the alignment target object are relatively moved from a relative position between the target mark image which is an image of the target object alignment mark. A control device that performs the alignment step, an illumination device that illuminates the object alignment mark during the alignment step, and a detection device that detects the identification mark, and the alignment step is performed in advance. When performing, the size of the alignment distance, which is the distance between the imaging device and the alignment object, is determined for each alignment object, and the identification mark corresponds to the identification mark. A distance relationship for obtaining the alignment distance is provided, and the control device detects and detects the identification mark of the alignment object on which the alignment step is performed before performing the alignment step. The alignment device is configured to perform the alignment step by determining the alignment distance from the identification mark and separating the alignment distance between the imaging device and the alignment object.
In the present invention, the identification mark is provided at a position where the imaging device can capture an image, the detection device is configured by the imaging device, and the identification mark is obtained from an identification image that is an image of the captured identification mark. It is the alignment apparatus comprised so that it might be.
The present invention is the alignment apparatus, wherein the alignment object is a tray on which the substrate is arranged.
The present invention is the alignment apparatus, wherein the alignment object is a mask having a window portion formed of a through hole and disposed on the surface of the substrate.
The present invention comprises the alignment apparatus described above, a film forming source that is disposed in a vacuum chamber and emits fine particles of a thin film material, the substrate on which the alignment step has been performed, and the alignment object. A transfer device that moves the transfer object, the alignment object faces the film forming source, the fine particles reach the substrate in the transfer object, and a thin film is formed on the substrate A thin film forming apparatus in which a thin film forming process is performed.
This invention has the conveyance apparatus of the 2nd example which conveys the said alignment object to the said alignment apparatus, and the said conveyance object in which the said thin film formation process was performed is the said board | substrate and the said alignment object. The alignment object separated and separated is returned to the alignment apparatus by the transfer device of the second example, and the substrate on which the thin film forming step has not been performed and the alignment object returned. And a thin film forming apparatus configured to perform the alignment step.

  For a plurality of alignment objects with different surface states, the optimum light emission intensity for obtaining a clear image is obtained, and when illuminating with the illuminance corresponding to each alignment object at the time of alignment, the imaging result of the imaging device Thus, each alignment object and the substrate can be accurately aligned.

  In addition, for a plurality of alignment objects having different mechanical states such as thickness and distortion, an imaging position between the alignment object and the imaging device from which a clear image can be obtained is obtained. In addition, if an image is captured at an imaging position corresponding to each positioning object, each positioning object and the substrate can be accurately aligned.

The figure for demonstrating the alignment apparatus of this invention, and a thin film formation apparatus Plan view of the thin film forming apparatus

Reference numeral 3 in FIGS. 1 and 2 represents a thin film forming apparatus of the present invention.
FIG. 1 is a sectional view showing the inside, and FIG. 2 is a plan view showing connections between vacuum chambers.
The thin film forming apparatus 3 has a plurality of vacuum chambers 11 _{1 to} 11 ₅ .
Each vacuum chamber 11 ₁ to 11 _5, the vacuum evacuation device 42 is connected, inside of each vacuum chamber 11 ₁ to 11 ₅ is in a vacuum atmosphere.
A vacuum tank 11A of another vacuum processing apparatus is disposed in the front stage of the thin film forming apparatus 3, and the inside of the vacuum tank 11A in the front stage is also in a vacuum atmosphere.

The plurality of vacuum chambers 11 _{1 to} 11 ₅ are connected in series, and a gate valve 41A is provided between the preceding vacuum chamber 11A and the front vacuum chamber 11 ₁ of the thin film forming apparatus 3, The gate valve 41A is opened, and the gate valve 41A is passed through the substrate disposed inside the preceding vacuum chamber 11A, and carried into the front vacuum chamber 11 ₁ of the thin film forming apparatus 3.

The _first vacuum chamber 111 is provided with an alignment device 28, and the substrate that has been loaded is first placed in the alignment device 28.
In the alignment device 28 of the thin film forming apparatus 3, a substrate holding device 22 is provided inside the vacuum chamber 11 ₁ , and the loaded substrate is placed on the substrate holding device 22. Reference numeral 4 in FIG. 1 indicates a substrate disposed on the substrate holding device 22.

The head of the internal or external of the vacuum chamber 11 _first illumination device 12 is arranged to illuminate the interior of the head of the vacuum chamber 11 _1. Here, the illuminating device 12 is provided inside the top vacuum chamber 11 ₁ .
In the thin film forming apparatus 3, an alignment object 7 that is aligned with the substrate 4 is disposed.

  In the thin film forming apparatus 3, a mounting table 24 is disposed below the substrate holding device 22, and a transport tray on which the substrate 4 is disposed is disposed on the mounting table 24. In this thin film forming apparatus 3, reference numeral 6 indicates a transport tray. A mask holding device 26 is disposed above the substrate holding device 22, and the substrate 4 is patterned on the mask holding device 26. A mask for forming a thin film is disposed. In the thin film forming apparatus 3, the mask is the alignment object 7.

The alignment object 7 used in the thin film forming apparatus 3 is provided with an object alignment mark, and the substrate 4 arranged on the substrate holding device 22 is provided with a substrate alignment mark.
The positioning device 28 is provided with one or a plurality of imaging devices (cameras) 13 and a camera moving device 23, and a control device 10 such as a computer is provided outside the top vacuum chamber 11 _1. Is provided.

The imaging device 13 is attached to a camera moving device 23, and the imaging device 13 can be moved relative to the leading vacuum chamber 11 ₁ by the operation of the camera moving device 23.
The imaging device 13 and the camera moving device 23 are connected to the control device 10, and the camera moving device 23 moves the imaging device 13 according to a signal input from the control device 10, and the imaging device 13 is moved. The image captured at the selected position is output to the control device 10.

Here, the imaging device 13 is disposed outside the leading vacuum chamber 11 ₁ , and the imaging device 13 is a transparent window provided in the leading vacuum chamber 11 ₁ at a position moved by the camera moving device 23. 18, the alignment object 7 provided in the alignment device 28 and the substrate alignment mark provided on the substrate 4 and the substrate alignment mark are arranged so as to be imaged.

  The image captured by the imaging device 13 includes a portion of the substrate 4 that includes the substrate alignment mark and a portion of the alignment target object 7 that includes the object alignment mark, and the captured image includes The object mark image, which is an image of the object alignment mark, and the substrate mark image, which is an image of the substrate alignment mark, are included.

When an image including the object mark image and the substrate mark image output from the imaging device 13 is input to the control device 10, the control device 10 detects the actual alignment target object 7 and the substrate 4 when imaged. Find the relative position between.
The control device 10 stores a reference position that is a preset relative position between the substrate 4 and the alignment object 7, and compares the obtained relative position with the stored reference position. A position error such as an error angle, an error amount, and an error direction of a relative position with respect to the reference position is obtained.

The relative position between the alignment object 7 and the substrate 4 can be changed.
In the alignment device 28, the mask holding device 26 is configured to cause the alignment object (mask) 7 to translate and rotate in a horizontal plane and to move up and down in the vertical direction. The relative relationship in the horizontal plane between the substrate 7 and the substrate 4 and the distance in the vertical direction can be changed.

The control device 10 relatively moves the alignment object 7 and the substrate 4 by the relative movement device so as to eliminate the obtained position error in a state where the alignment object 7 and the substrate 4 are separated from each other. Perform alignment.
Reference numeral 29 in FIG. 1 schematically shows a relative movement device. In the thin film forming apparatus 3, the relative movement device 29 moves the mask holding device 26 to move the alignment object 7, which is a mask, to the horizontal plane. by rotational movement and linear movement in the inner, it is moved to the position if the object 7 at the beginning of the vacuum chamber 11 inside _1.

Between each vacuum chamber 11 ₁ to 11 _5, a gate valve 41 _{1-41 4} is provided, when moving the position if the object 7 between the vacuum chamber 11 ₁ to 11 _5, a gate valve 41 _{1-41 4} is emptied.
After alignment, the substrate 4 and the alignment object 7 move in order through the second and subsequent vacuum chambers 11 _{2 to} 11 ₅ , and a thin film is formed on the surface of the substrate 4 and the alignment object 7. The alignment object 7 is returned to the alignment device 28 in a state where the formed thin film is not peeled off, and alignment is performed again.

The substrates 4 thus aligned and moved are carried one by one from the outside of the top vacuum chamber 11 ₁ . On the other hand, a plurality of alignment objects 7 are prepared in places other than the vacuum chambers 11 _{1 to} 11 ₅ , and the image of the object mark image obtained by the imaging device 13 has a definition of the alignment object 7. Different for each.

  Therefore, in order to obtain conditions for obtaining a clear object mark image by the imaging device 13 for each alignment object 7, first, each alignment object 7 is aligned with the substrate 4. Before, each alignment object 7 is arranged in the alignment device 28, and the alignment object (mask) 7 is arranged in the mask holding device 26 arranged in alignment with the substrate 4.

  In this state, the illumination device 12 is energized to emit light, and the object alignment mark is imaged by the imaging device 13 while illuminating the alignment object 7 with the generated irradiation light, thereby obtaining an object mark image.

  Since the sharpness of the object mark image varies depending on the intensity with which the alignment object 7 is illuminated by the illumination device 12, the control device 10 determines the intensity of the light with which the alignment object 7 is illuminated by the illumination device 12. Each alignment object 7 is imaged by changing the illumination intensity, and the illumination intensity, which is the intensity of light by the illuminating device 12 when the object mark image is clearly obtained, is set to each alignment object 7. Ask every time. Here, the illumination intensity when the object mark image is most clearly obtained is obtained.

  When the illumination intensity can be changed by changing the light emission intensity according to the energization amount, the illumination device 12 may store the energization amount as the illumination intensity instead of the illumination intensity, or a shutter provided in the illumination device 12 For example, when the illumination intensity of the alignment object 7 can be changed while the emission intensity of the illumination device 12 is kept constant, the opening degree of the shutter or the like may be stored as the illumination intensity instead of the illumination intensity.

Each alignment object 7 is provided with a different identification mark for each alignment object 7 at a position where it can be imaged by the imaging device 13.
When obtaining the illumination intensity for each alignment object 7, the identification mark of the alignment object 7 for which the illumination intensity is obtained is also imaged, and an identification image that is an image of the imaged identification mark is obtained.

  A storage device 17 is connected to the control device 10, and the illumination intensity obtained for each positioning object 7 is associated with the identification mark obtained from the identification image, and is identified by the identification mark from the identification mark. An illumination relationship for obtaining the illumination intensity of the alignment object 7 is created and stored in the storage device 17.

Further, the sharpness of the object mark image changes depending on the distance between the alignment object 7 and the imaging device 13 when the object is imaged.
The positioning device 28 is configured so that the distance in the vertical direction between the imaging device 13 and the positioning object 7 can be changed by the moving device. Here, the camera moving device 23 is connected to the imaging device 13. The moving device changes the distance between the alignment object 7 and the distance between the imaging device 13 and the alignment object 7 can be changed when imaging the object alignment mark.

  In order to obtain a condition for obtaining a clear object mark image by the imaging device 13 for each positioning object 7, the distance between the positioning object 7 arranged in the positioning device 28 and the imaging device 13 is changed. Then, the object alignment mark is imaged by the imaging device 13, and the distance when a clear object mark image is obtained is obtained as the alignment distance.

  Here, the distance when the clearest object mark image is obtained is defined as the alignment distance, and is associated with the identification mark obtained from the identification image, and the alignment object 7 specified by the identification mark is identified from the identification mark. The distance relationship for obtaining the position alignment distance is created and stored in the storage device 17.

  The mounting table 24 is configured to be movable in the vertical direction, the mounting table 24 is used as a moving device, the substrate 4 is used as a positioning object 7, and the positioning device 7 is moved in the vertical direction by the moving device. The distance to the alignment object 7 may be changed to obtain the alignment distance.

  When determining both the illumination intensity and the alignment distance for each alignment object 7, first determine the illumination intensity, and then illuminate each alignment object 7 with the illumination intensity, The alignment distance can be obtained, or the illumination intensity can be obtained after obtaining the alignment distance first.

  First, after obtaining the illumination intensity at the set position distance, repeatedly obtaining the position distance with the obtained illumination intensity and obtaining the illumination intensity at the obtained position distance, The illumination intensity and the alignment distance can be obtained.

  In this case, first, after obtaining the alignment distance with the set illumination intensity, the illumination intensity is obtained with the obtained alignment distance, and the alignment distance is obtained with the obtained illumination intensity to be accurate. The illumination intensity and the alignment distance can be obtained.

In forming a thin film to the substrate 4 is first placed with the substrate 4 carried into the beginning of the vacuum chamber 11 _1, the position if the object 7 located at the top of the vacuum chamber 11 ₁ to a position coupling device 28 Then, the object mark image is obtained by the imaging device 13, the illumination device 12 is set so that the alignment object 7 is illuminated with the obtained illumination intensity, and the distance between the imaging device 13 and the alignment object 7 is set. , And the substrate alignment mark and the object alignment mark are imaged by the imaging device 13, and the alignment between the substrate 4 and the alignment object 7 is performed so that the distance error is smaller than a predetermined value. Do.

At the time of alignment, the transfer tray 6 is disposed on the mounting table 24 positioned below the substrate 4. When the mask which is the alignment object 7 and the substrate 4 are aligned, the horizontal direction Are placed on the transport tray 6 and moved to the _second vacuum chamber 112 which is a reversing chamber, and fixed to each other to form the transport object 36, and then upside down. Then, it is moved to the _third vacuum chamber 11 ₃ , which is a film forming chamber, and placed on the transfer device 43. Reference numerals 37 and 4 </ b> A indicate a conveyance object and a substrate that are reversed and arranged in the conveyance device 43.

  The conveyance object 37 in this state is such that the alignment object 7 is located at the lower end, the substrate 4A and the conveyance tray 6 are arranged on the alignment object 7 in this order, and the conveyance object 37 is conveyed When the alignment object 7 is conveyed by the apparatus 43 and faces the film forming source 25, the thin film material fine particles pass through the opening of the alignment object 7 and form a patterned thin film on the surface of the substrate 4A.

Then, the transport object 37 is carried into the fourth vacuum chamber 11 ₄ is an outlet-side reversing chamber is separated is inverted, the separated substrate 4B is fifth next stage of the vacuum from the vacuum chamber 11 ₅ It is moved to the tank 11B.

On the side of the top-fifth vacuum chamber 11 ₁ to 11 ₅ are arranged sixth vacuum chamber 11 ₆ is a transfer chamber elongate, one end of the sixth vacuum chamber 11 _6, the other end Are connected to the fifth vacuum chamber 11 ₅ and the first vacuum chamber 11 ₁ by gate valves 41 ₅ and 41 ₆ , respectively.
The gate valves 41 ₅ and 41 ₆ are opened, and the separated positioning object 7 and the transport tray 6 are carried into the _sixth vacuum chamber 11 ₆ and moved.

In the middle of the sixth vacuum chamber 11 _6, is connected to the mask stocker chamber 45 through the gate valve 41 _7, while the gate valve 41 ₇ to drilled, conveying the sixth vacuum chamber 11 ₆ the location portion of the case the object 7 in conjunction is transported to the mask stocker chamber 45, the position if the object 7 which surface is cleaned carried from the mask stocker chamber 45 sixth vacuum chamber 11 _6, sixth together with the conveying tray 6 by the second conveying device disposed in the vacuum chamber 11 in ₆ of the position if the object 7 is moved inside the sixth vacuum chamber 11 _6, back to the beginning of the vacuum chamber 11 in ₁ When carried in, the alignment object 7 and the transport tray 6 are returned to the alignment device 28 and arranged in the alignment device 28.

The positioning object 7 arranged in the positioning device 28 is imaged with an identification mark, the identification mark obtained from the identification image is collated with the lighting relationship and the positional relationship, and the illumination intensity and the positioning distance are obtained. Alignment is performed with the loaded substrate 4.
As described above, the alignment device 28 of the thin film forming apparatus 3 captures the object alignment mark of the alignment object 7 with the optimum illumination intensity and alignment distance, so that a clear object mark image is obtained.

  The control device 10 sets in advance a relative position between the actual substrate 4 and the alignment target object 7 when the image is taken from the relative position between the object mark image and the substrate mark image input from the imaging device 13. It is possible to accurately obtain a positioning error such as an error angle, an error amount, an error direction, etc. between the relative position of the substrate 4 and the positioning object 7.

In the thin film forming apparatus 3, the identification mark is detected from the identification image obtained by imaging the shape of the identification mark by the imaging device 13, and the alignment target is distinguished. It is also possible to detect the identification mark without imaging the identification mark, for example, by configuring the label, recognizing the magnetic pattern of the identification mark, and detecting the identification mark. However, in terms of cost, it is desirable to detect the identification mark from the identification image.
In the above example, the alignment target 7 is used as the mask. However, an apparatus for positioning the conveyance tray 6 with the substrate 4 as the alignment target 7 is also included in the present invention.

3. Thin film forming apparatus 4, 4A, 4B ... Substrate 7 ... Positioning object (mask)
6 ... Tray 10 ... Control device 11 _{1 to} 11 ₆ ... Vacuum chamber 12 ... Illumination device 13 ... Imaging device 17 ... Storage device 25 ... Deposition source 28 ... Positioning device 29 ... Relative Mobile device

Claims (8)

An alignment apparatus for performing an alignment process for aligning a substrate provided with a substrate alignment mark and an alignment target provided with an object alignment mark,
Each alignment object is provided with an identification mark corresponding to the alignment object on a one-to-one basis,
The positioning device is
Imaging the substrate alignment mark of the substrate arranged in the alignment apparatus and the object alignment mark of the alignment object arranged in the alignment apparatus from among the plurality of alignment objects. An imaging device;
From the relative position between the substrate mark image that is the image of the imaged substrate alignment mark and the object mark image that is the image of the imaged object alignment mark, the substrate and the alignment object are A control device for performing the positioning step by relatively moving;
An illumination device that illuminates the object alignment mark during the alignment step;
A detection device for detecting the identification mark;
Have
When the alignment device is preliminarily illuminated to illuminate the object alignment mark and perform the alignment step, the value of the illumination intensity with which the alignment object is to be illuminated by the illumination device is the alignment object. It is obtained for each object, and from the identification mark, an illumination relationship is provided in which the illumination intensity corresponding to the identification mark is obtained,
The control device detects the identification mark of the alignment object on which the alignment step is performed before performing the alignment step, and determines the illumination intensity from the detected identification mark,
An alignment apparatus configured to perform the alignment step by causing the illumination apparatus to emit light at the determined illumination intensity. In advance, when performing the alignment step, the size of the alignment distance, which is the distance between the imaging device and the alignment object, is determined for each alignment object, and is determined from the identification mark. , A distance relationship for obtaining the positional distance corresponding to the identification mark is provided,
The controller determines the alignment distance from the detected identification mark before performing the alignment step, and separates the imaging apparatus and the alignment object from the determined alignment distance to determine the alignment distance. The alignment apparatus according to claim 1, wherein the alignment apparatus is configured to perform an alignment process. An alignment apparatus for performing an alignment process for aligning a substrate provided with a substrate alignment mark and an alignment target provided with an object alignment mark,
Each alignment object is provided with an identification mark corresponding to the alignment object on a one-to-one basis,
The positioning device is
Imaging the substrate alignment mark of the substrate arranged in the alignment apparatus and the object alignment mark of the alignment object arranged in the alignment apparatus from among the plurality of alignment objects. An imaging device;
From the relative position between the substrate mark image that is the image of the imaged substrate alignment mark and the object mark image that is the image of the imaged object alignment mark, the substrate and the alignment object are A control device for performing the positioning step by relatively moving;
An illumination device that illuminates the object alignment mark during the alignment step;
A detection device for detecting the identification mark;
Have
In advance, when performing the alignment step, the size of the alignment distance, which is the distance between the imaging device and the alignment object, is determined for each alignment object, and is determined from the identification mark. , A distance relationship for obtaining the positional distance corresponding to the identification mark is provided,
The control device detects the identification mark of the alignment object on which the alignment step is performed before performing the alignment step, and obtains the alignment distance from the detected identification mark,
An alignment apparatus configured to perform the alignment step by separating the alignment distance obtained for the imaging device and the alignment object. The identification mark is provided at a position where it can be imaged by the imaging device,
The detection device includes the imaging device,
The positioning device according to any one of claims 1 to 3, wherein the identification mark is obtained from an identification image that is an image of the imaged identification mark.   The alignment apparatus according to any one of claims 1 to 4, wherein the alignment object is a tray on which the substrate is arranged.   The alignment apparatus according to any one of claims 1 to 4, wherein the alignment object is a mask having a window portion including a through hole and disposed on a surface of the substrate. The alignment apparatus according to any one of claims 1 to 6,
A film forming source that is disposed in a vacuum chamber and emits fine particles of a thin film material;
A transfer device that moves a transfer object composed of the substrate and the alignment object subjected to the alignment step;
The thin film forming apparatus in which the alignment target is faced to the film forming source, the fine particles reach the substrate in the transport target, and a thin film is formed on the substrate. A transport device of a second example for transporting the positioning object to the positioning device;
The transport object subjected to the thin film forming step is separated into the substrate and the alignment object,
The separated positioning object is returned to the positioning device by the transport device of the second example,
The thin film forming apparatus according to claim 7, wherein the alignment step is performed on the substrate on which the thin film formation step has not been performed and the returned alignment target.

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