JP2015107608A - Holder of power supply and fixing of semiconductor light emitting device and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To ensure insulation and the positional accuracy of an insert component in an insert molding.SOLUTION: A method for manufacturing a holder 30 is provided in which an insert metal material 31 is covered with an insulating resin 32 and which is used for fixing and power supply of a chip on board type semiconductor light emitting device 20. The holder 30 comprises thin parts 326, 328 where the thickness of a resin 32 is thin, and thick parts 327, 329 where the thickness of the resin 32 is thick. A molten resin is injected in a state where the insert metal material 31 is held in cavities 65, 66 using holing pins 71-76 (S10, S20). After the holding pins 71, 73, 75 located at parts where the thin parts 326, 328 are formed are retreated, the injection pressure is increased and the molten resin is injected (S30, S40). After the holding pins 72, 74, 76 located at parts where the thick parts 327, 329 are formed are retreated, the injection pressure is further increased and the molten resin is injected (S50, S60).

Description

  The present invention relates to a holder for feeding and fixing a semiconductor light emitting device and a method for manufacturing the same.

  Patent Document 1 discloses a power supply attachment used for power supply and fixation of a semiconductor light emitting device. A light emitting module fed from a power feeding attachment includes a substrate and a semiconductor light emitting element such as a light emitting diode (LED) chip. The power supply attachment to which the light emitting module is connected is attached to the heat radiator by a clip. The power feeding attachment is made of a resin material except for the conductive portion. The power supply attachment is formed by insert molding.

  In general insert molding, the molten resin is injected into the cavity while the insert part is held by the holding pin in the cavity of the mold, and the holding pin is retracted after the resin is cured. Therefore, when the power feeding attachment is formed by insert molding, a hole is formed in the resin by a holding pin, and a conductive portion is exposed from the hole, so that there is a problem that insulation is not ensured.

  Patent Documents 2 and 3 disclose an insert molding method for preventing an insert part from being exposed. In this method, after the molten resin is filled into the cavity, the holding pin that holds the insert part in a state where the resin in the cavity is semi-cured is retracted, and the molten resin is further filled into the cavity. By doing in this way, the part currently hold | maintained with the holding | maintenance pin of insert components is covered with resin.

JP 2007-317589 A JP 2006-327096 A JP 2003-127185 A

  The method in which the molten resin is further filled into the cavity after the holding pin is retracted has a problem that the position accuracy of the insert component is lowered because the insert component is not held by the holding pin when the resin is filled after the holding pin is retracted. It was.

  The present invention has been made to solve such problems, and an object of the present invention is to ensure insulation and positional accuracy of insert parts in an insert molded product.

  The holder manufacturing method according to the present invention is used for fixing and supplying power to a chip-on-board type semiconductor light-emitting device including a light-emitting portion in which a semiconductor light-emitting element is disposed, and an insert metal material is covered with an insulating resin. It is the manufacturing method of the holder which is a molded article. The holder includes a thin portion where the insulating resin covering the insert metal material is thin, and a thick portion where the insulating resin covering the insert metal material is thicker than the thin portion. The insert metal material is formed using a first holding pin disposed at a portion where the thin portion in the cavity is to be formed and a second holding pin disposed at a portion where the thick portion in the cavity is to be formed. While being held in the cavity, the molten resin is injected into the cavity at a first injection pressure. After the molten resin is injected into the cavity at the first injection pressure, the first holding pin is retracted. After retracting the first holding pin, the molten resin is injected into the cavity at a second injection pressure higher than the first injection pressure. After the molten resin is injected into the cavity at the second injection pressure, the second holding pin is retracted. After retracting the second holding pin, the molten resin is injected into the cavity at a third injection pressure higher than the second injection pressure.

  The holder according to the present invention is an insert-molded product that is used for fixing and supplying power to a chip-on-board type semiconductor light-emitting device including a light-emitting portion in which a semiconductor light-emitting element is arranged, and an insert metal material is covered with an insulating resin. It is a certain holder, Comprising: The thin part where the thickness of the insulating resin which covers the said insert metal material is thin, and the thick part where the thickness of the insulating resin which covers the said insert metal material is thicker than the said thin part.

  According to the present invention, it is possible to ensure insulation and positional accuracy of insert parts in an insert molded product.

It is a front view of the holder concerning the comparative example 1. It is a rear view of the holder concerning the comparative example 1. It is sectional drawing of the holder concerning the comparative example 1. FIG. It is a conceptual diagram which shows the manufacturing method of the holder concerning the comparative example 1. It is a conceptual diagram which shows the manufacturing method of the holder concerning the comparative example 1. It is a conceptual diagram which shows the manufacturing method of the holder concerning the comparative example 2. It is a conceptual diagram which shows the manufacturing method of the holder concerning the comparative example 2. 1 is an exploded perspective view of an illumination lamp according to a first embodiment. It is a front view of the holder concerning Embodiment 1. FIG. It is a rear view of the holder concerning Embodiment 1. FIG. It is sectional drawing of the holder concerning Embodiment 1. FIG. 3 is a flowchart of a method for manufacturing a holder according to the first embodiment. FIG. 3 is a conceptual diagram showing a method for manufacturing a holder according to the first embodiment. FIG. 3 is a conceptual diagram showing a method for manufacturing a holder according to the first embodiment. FIG. 3 is a conceptual diagram showing a method for manufacturing a holder according to the first embodiment. FIG. 3 is a conceptual diagram showing a method for manufacturing a holder according to the first embodiment. FIG. 3 is a conceptual diagram showing an example of injection gate arrangement according to the first exemplary embodiment. It is a conceptual diagram which shows the other example of the injection gate arrangement | positioning concerning Embodiment 1. FIG. FIG. 6 is a conceptual diagram showing still another example of the injection gate arrangement according to the first exemplary embodiment. It is sectional drawing of the holder concerning Embodiment 2. FIG. It is a conceptual diagram which shows the manufacturing method of the holder concerning Embodiment 2. FIG.

  Hereinafter, specific embodiments will be described in detail with reference to the drawings. For clarity of explanation, the following description and drawings are simplified as appropriate.

(Comparative Example 1)
First, the structure of the holder according to Comparative Example 1 examined by the inventors will be described.
FIG. 1A is a front view showing the surface 130 a side of the holder 130. FIG. 1B is a rear view showing the back surface 130 b side of the holder 130. The holder 130 is an insert-molded product in which a metal material 131 that is an insert part is covered with an insulating resin material 132. On both the front surface 130 a side and the back surface 130 b side of the holder 131, the metal material 131 is exposed through a hole 135 formed by a holding pin formed in the resin material 132.

  FIG. 2 is a cross-sectional view of the holder 130. A positioning hole 911 that penetrates the metal member 131 is formed. The hole 135 by the holding pin formed in the portion on the surface 130a side of the resin material 132, the positioning hole 911, and the hole 135 by the holding pin formed in the portion on the back surface 130b side of the resin material 132 are formed from the front surface 130a to the back surface 130b. A through hole penetrating the holder 130 is formed.

The manufacturing method of the holder concerning the comparative example 1 is demonstrated.
Referring to FIG. 3A, a cavity 165 for forming the holder 130 is formed between the movable-side mold 161 and the fixed-side mold 162. The metal material 131 is held in the cavity 165 by using the holding pins 171 protruding from the mold 161 into the cavity 165 and the holding pins 172 protruding from the mold 162 into the cavity 165. The tip of the holding pin 171 is inserted into the single positioning hole 911 from the die 161 side, and the tip of the holding pin 172 is inserted from the die 162 side.

  Referring to FIG. 3B, molten resin material 132 is injected into cavity 165 while holding metal material 131 using holding pins 171 and 172. When the holding pins 171 and 172 are retracted after the resin material 132 is cured, the holes 135 formed by the holding pins are formed in the resin material 132 as shown in FIGS. 1A, 1B, and 2, and insulation is not ensured. In order to ensure insulation, it is necessary to fill the hole 135 by the holding pin with an insulating material after the holder 130 is taken out of the molds 161 and 162.

(Comparative Example 2)
Next, the manufacturing method of the holder concerning the comparative example 2 which inventors examined is demonstrated.
The manufacturing method of the holder according to the comparative example 2 is the same as the manufacturing method of the holder according to the comparative example 1 until the molten resin material 132 is injected into the cavity 165, but the subsequent processes are different.

  Referring to FIG. 4A, the holding pins 171 and 172 are retracted while the resin material 132 in the cavity 165 is semi-cured. Referring to FIG. 4B, by further injecting molten resin material 132 into cavity 165, the gap formed by retracting holding pins 171 and 172 can be filled with semi-cured resin material 132. . According to the method for manufacturing a holder according to Comparative Example 2, insulation is ensured. However, since the metal material 131 is not held by the holding pins 171 and 172 when the resin material 132 is ejected after the holding pins 171 and 172 are retracted, the positional accuracy of the metal material 131 is lowered.

(Embodiment 1)
Hereinafter, the holder and the manufacturing method according to the first embodiment will be described.
First, the illumination lamp provided with the holder concerning Embodiment 1 is demonstrated.

  Referring to FIG. 5, the illumination lamp 1 according to the first embodiment includes a base 10, a chip-on-board (COB) type semiconductor light emitting device 20, a holder 30, a reflector 40, and a cap 50. The semiconductor light emitting device 20 includes a substrate 21, a light emitting unit 22 on which a semiconductor light emitting element such as a light emitting diode (LED) is disposed, and an electrode 23 for supplying power to the semiconductor light emitting element. The light emitting unit 22 and the electrode 23 are formed on the surface 21 a of the substrate 21. The holder 30 is formed in a disc shape. A light emitting portion exposure hole 322 that penetrates the holder 30 is formed at the center of the holder 30. The light emitting unit 22 and the light emitting unit exposure hole 322 are circular.

  The holder 30 is used for fixing and supplying power to the semiconductor light emitting device 20. With the light emitting unit 22 exposed from the light emitting unit exposure hole 322, the electrode 23 is connected to the power feeding unit of the holder 30. The holder 30 is fixed to the heat sink 11 with screws (not shown) in a state where the semiconductor light emitting device 20 is disposed between the heat sink 11 provided in the base 10 and the holder 30. Thereby, the holder 30 fixes the semiconductor light emitting device 20 to the heat sink 11. The holder 30 is formed with a screw hole through which a screw is passed, but is omitted in FIG.

  The light generated by the light emitting unit 22 is output to the outside through the lens 51 of the cap 50 after being reflected by the reflector 40 or without being reflected by the reflector 40. Further, the heat generated in the light emitting unit 22 is radiated through the heat sink 11. In order to improve optical characteristics, the holder 30 is preferably thin.

Next, the configuration of the holder 30 according to the first embodiment will be described in detail.
6A is a front view showing the surface 30a side of the holder 30. FIG. FIG. 1B is a rear view showing the back surface 30 b side of the holder 30. The holder 30 is an insert molded product in which a metal material 31 that is an insert part is covered with an insulating resin material 32. A light emitting portion exposure hole 322 is formed at the center of the holder 30. Further, the holder 30 is formed with a screw hole 323 as a through hole through which a screw for fixing the holder 30 to the heat sink 11 is passed.

  A recess 324 in which the semiconductor light emitting device 20 is to be disposed is formed in the resin material 32 on the back surface 30b side. The metal material 31 is exposed from the opening 325 formed in the recess 324. A portion exposed from the opening 325 of the metal material 31 is electrically connected to the electrode 23 of the semiconductor light emitting device 20. That is, when the semiconductor light emitting device 20 is fixed using the holder 30, the back surface 30 b is disposed on the semiconductor light emitting device 20 side, and the front surface 30 a is disposed on the opposite side of the semiconductor light emitting device 20 (the reflector 40 side). . The metal material 31 functions as a power supply unit that supplies power to the semiconductor light emitting device 20. Further, the holder 30 has a function of insulating the semiconductor light emitting device 20 from the metal reflector 40 and screws.

  In addition, the holding pin position 35 has shown the position where the holding pin was arrange | positioned, when shape | molding the holder 30 by insert molding. The metal material 31 is not exposed at the holding pin position 35 on either the front surface 30 a side or the back surface 30 b side of the holder 30. Therefore, insulation is ensured.

  FIG. 7 is a cross-sectional view of the holder 30. The metal material 31 is a plate-like component. The thickness direction of the metal material 31 coincides with the thickness direction of the holder 30. Corresponding to the holding pin position 35, a positioning hole 311 penetrating the metal material 31 is formed. The holder 30 also includes a thin portion 326 in which the resin material 32 covering the metal material 31 is thin, and a thick portion 327 in which the resin material 32 covering the metal material 31 is thick. The thin portion 326 is disposed on the front surface 30a side, and the thick portion 327 is disposed on the back surface 30b side. The thickness t2 of the thick portion 327 is larger than the thickness t1 of the thin portion 326. The holder 30 includes the thin wall portion 326 and the thick wall portion 327 in order to ensure the insulation so that the metal material 31 is not exposed at the holding pin position 35 while ensuring the positional accuracy of the metal material 31 that is the insert part. Is important to. The reason will become clear from the following explanation.

Next, the manufacturing method of the holder concerning Embodiment 1 is demonstrated.
FIG. 8 is a flowchart of the method for manufacturing the holder according to the first embodiment. The method for manufacturing a holder according to the first embodiment includes steps S10 to S60.

  Step S10 will be described with reference to FIG. 9A. A cavity 65 for forming the holder 30 is formed between the molds 61 and 62 that move relatively in the mold moving direction 91. For example, the mold 61 is the movable side, and the mold 62 is the fixed side. The cavity 65 is formed in a disc shape corresponding to the shape of the holder 30. The thickness direction of the cavity 65 (that is, the thickness direction of the holder 30 formed in the cavity 65) coincides with the mold moving direction 91. A holding pin 71 that can move in the mold moving direction 91 with respect to the mold 61 and a holding pin 72 that can move in the mold moving direction 91 with respect to the mold 62 are provided.

  The metal material 31 is held in the cavity 65 using the holding pin 71 protruding from the mold 61 into the cavity 65 and the holding pin 72 protruding from the mold 62 into the cavity 65. At this time, the holding pins 71 and 72 are arranged at the holding pin position 35 described above. The tip of the holding pin 71 is inserted into the single positioning hole 311 from the mold 61 side, and the tip of the holding pin 72 is inserted from the mold 62 side. Here, the metal material 31 is held such that the distance t2 in the mold movement direction 91 from the metal material 31 to the mold 92 is longer than the distance t1 in the mold movement direction 91 from the metal material 31 to the mold 61. Is done. The distances t1 and t2 correspond to the thicknesses t1 and t2, respectively. Accordingly, the holding pin 71 is disposed at a portion where the thin portion 326 in the cavity 65 is to be formed and holds the metal material 31. The holding pin 72 is arranged at a portion where the thick portion 327 in the cavity 65 is to be formed and holds the metal material 31.

  Step S20 will be described with reference to FIG. 9B. In a state where the metal material 31 is held using the holding pins 71 and 72, the molten resin material 32 is injected into the cavity 65 at the first injection pressure. As the resin material of the holder 30, an insulating thermoplastic resin is used. In particular, a thermoplastic white resin having a reflectance of 90% or more is preferable. For example, high heat resistant polybutylene terephthalate (PBT) is preferable. Since a resin having a high melting point generally has high fluidity, it is suitable for the holder manufacturing method according to the present embodiment.

  Thermoplastic resins include, for example, polyvinyl chloride, polyvinylidene chloride, polyvinyl alcohol, polystyrene, styrene / acrylonitrile copolymer, styrene / butadiene / acrylonitrile copolymer, high density polyethylene, medium density polyethylene, low density polyethylene, ethylene Vinyl acetate copolymer, polypropylene, polyacetal, polymethyl methacrylate, modified acrylic, cellulose acetate, polycarbonate, polyethylene terephthalate, nylon 6, nylon 66, polyurethane, ethylene trifluoride chloride, tetrafluoroethylene, tetrafluoroethylene-6 These are propylene fluoride copolymer, tetrafluoroethylene / perfluoroalkoxyethylene copolymer, tetrafluoroethylene ethylene copolymer, and vinylidene fluoride.

  Steps S30 and S40 will be described with reference to FIG. 9C. After step S20, the holding pin 71 is moved while the resin material 32 in the cavity 65 is semi-cured (step S30). Specifically, the holding pin 71 is retracted from the metal material 31. Thereafter, the molten resin material 32 is injected into the cavity 65 at a second injection pressure higher than the first injection pressure (step S40). Thereby, the space formed by retracting the holding pin 71 can be filled with the semi-cured resin material 32. As a result, insulation on the surface 30a side is ensured. In step S40, since the metal material 31 is held by the holding pins 72, the displacement of the metal material 31 is prevented.

  Since the distance t1 is shorter than the distance t2, the resin material 32 between the metal material 31 and the metal mold 61 starts to harden when the temperature of the metal molds 61 and 62 is lowered by, for example, 10 ° C. to 30 ° C. after step S40. The resin material 32 between the metal material 31 and the mold 62 is kept in a semi-cured state.

  Steps S50 and S60 will be described with reference to FIG. 9D. After lowering the temperatures of the dies 61 and 62, the holding pin 72 is moved (step S50). Specifically, the holding pin 72 is retracted from the metal material 31. Thereafter, the molten resin material 32 is injected into the cavity 65 at a third injection pressure higher than the second injection pressure (step S60). Thereby, the space formed by retracting the holding pin 72 can be filled with the semi-cured resin material 32. Thereby, the insulation of the back surface 30b side is ensured. In addition, since the metal material 31 is held by the resin material 32 on the mold 61 side that has started to be cured in step S60, the displacement of the metal material 31 is prevented.

  According to the present embodiment, the insulating properties of both surfaces (the front surface 30a and the back surface 30b) of the holder 30 and the metal material 31 can be obtained without filling the holes by the holding pins with the insulating material after the insert molded product is taken out from the mold. Position accuracy can be ensured.

  Further, since the resin material 32 (thin wall portion 326) between the metal material 31 and the mold 61 is cured first, the resin movement between the metal material 31 and the mold 61 is minimized in step S60. Therefore, in the thin portion 326, welds and flow marks are minimized. Therefore, the thick portion 327 is disposed on the back surface 30b side (the semiconductor light emitting device 20 side), and the thin portion 326 is disposed on the front surface 30a side (the opposite side of the semiconductor light emitting device 20) which is the product design surface of the holder 30. Thus, the appearance of the holder 30 can be improved.

  Next, an injection gate that injects the molten resin material 32 into the cavity 65 in steps S20, S40, and S60 will be described. The number of injection gates may be one or more, but by increasing the number of injection gates, insufficient filling (short-circuiting) of the thin portion 326 can be prevented, and the quality of the product can be improved. In addition, as described above, when the injection is performed while lowering the temperatures of the molds 61 and 62, if the temperature of the molds 61 and 62 is remarkably lowered, the curing of the resin is accelerated, so that the resin filling of the thin portion 326 is likely to be insufficient. However, if the number of injection gates is plural, the resin moving distance becomes small, so that insufficient resin filling can be prevented. Hereinafter, the case where the number of injection gates is 2, 3, and 4 will be described in detail.

  FIG. 10A is a conceptual diagram showing an injection gate arrangement when the number of injection gates is two. FIG. 10A shows the holder 30 to be formed in the cavity 65 instead of showing the cavity 65. Here, a straight line connecting the center C of the cavity 65 and the injection gate 81 is represented by L1, and a straight line connecting the center C and the injection gate 82 is represented by L2. Since the cavity 65 (holder 30) has a disk shape, the injection gates 81 and 82 are arranged around the center C at equal angular intervals (specifically, 180 ° intervals) when viewed in the thickness direction of the cavity 65. However, it is preferable for reducing the moving distance of the resin.

  In addition, it is important that the injection gates 81 and 82 are arranged avoiding the screw holes 323 and the holding pins 71 and 72. This is because if the injection gates 81 and 82 are arranged in the vicinity of the screw hole 323 and the holding pins 71 and 72, insufficient resin filling is likely to occur. Therefore, it is preferable that the injection gates 81 and 82 are arranged so that the straight lines L1 and L2 do not pass through the portion where the screw hole 323 is to be formed or the holding pin position 35 when viewed in the thickness direction of the cavity 65.

  FIG. 10B is a conceptual diagram showing the injection gate arrangement when the number of injection gates is three. In FIG. 10B, instead of showing the cavity 65, the holder 30 to be formed in the cavity 65 is shown. Here, a straight line connecting the center C of the cavity 65 and the injection gate 81 is represented by L1, a straight line connecting the center C and the injection gate 82 is represented by L2, and a straight line connecting the center C and the injection gate 83 is represented by L3. ing. Since the cavity 65 (holder 30) has a disk shape, the injection gates 81 to 83 are arranged around the center C at equal angular intervals (specifically, 120 ° intervals) when viewed in the thickness direction of the cavity 65. However, it is preferable for reducing the moving distance of the resin.

  In addition, it is important to arrange the injection gates 81 to 83 while avoiding the screw holes 323 and the holding pins 71 and 72. Accordingly, it is preferable that the injection gates 81 to 83 are arranged so that the straight lines L1 to L3 do not pass through the portion where the screw hole 323 is to be formed or the holding pin position 35 when viewed in the thickness direction of the cavity 65.

  FIG. 10C is a conceptual diagram showing an injection gate arrangement when the number of injection gates is four. In FIG. 10C, instead of showing the cavity 65, the holder 30 to be formed in the cavity 65 is shown. Here, a straight line connecting the center C of the cavity 65 and the injection gate 81 is represented by L1, a straight line connecting the center C and the injection gate 82 is represented by L2, and a straight line connecting the center C and the injection gate 83 is represented by L3. A straight line connecting the center C and the injection gate 84 is represented by L4. Since the cavity 65 (holder 30) has a disk shape, the injection gates 81 to 84 are arranged around the center C at equal angular intervals (specifically, 90 ° intervals) when viewed in the thickness direction of the cavity 65. However, it is preferable for reducing the moving distance of the resin.

  It is also important to arrange the injection gates 81 to 84 while avoiding the screw holes 323 and the holding pins 71 and 72. Therefore, it is preferable that the injection gates 81 to 84 are arranged so that the straight lines L1 to L4 do not pass through the portion where the screw hole 323 is to be formed or the holding pin position 35 when viewed in the thickness direction of the cavity 65.

  Further, when the shape of the holder 30 is line symmetric (for example, left / right symmetric, vertically symmetric), the cavity 65 is formed in line symmetry with respect to an axis of symmetry passing through the center C of the cavity 65 when viewed in the thickness direction of the cavity 65. Is done. In this case, as shown in FIGS. 10A and 10C, 2 and 4 are preferable as the number of injection gates. By setting the number of injection gates to 2 or 4, the injection pressure to the metal material 31 as an insert part acts in a line symmetry. Therefore, even when injection is performed after the holding pins 71 and 72 are retracted, the displacement of the metal material 31 can be minimized.

(Embodiment 2)
Next, a holder and a manufacturing method thereof according to the second embodiment will be described. In the following description, descriptions of matters common to the first embodiment may be omitted.

  FIG. 11 is a cross-sectional view of a part of the holder 30 according to the second embodiment. The holder 30 according to the second embodiment includes a thin portion 328 where the thickness of the resin material 32 covering the metal material 31 is thin, and a thick portion 329 where the thickness of the resin material 32 covering the metal material 31 is thick. For example, the thin portion 328 and the thick portion 329 respectively correspond to the inner portion and the outer portion in the radial direction of the disc-shaped holder 30. The thin portion 328 is formed on both the front surface 30a side and the back surface 30b side, and the thick wall portion 329 is formed on both the front surface 30a side and the back surface 30b side. The thickness t5 of the thick portion 329 on the front surface 30a side is larger than both the thickness t3 of the thin portion 328 on the front surface 30a side and the thickness t4 of the thin portion 328 on the back surface 30b side. The thickness t6 of the thick portion 329 on the back surface 30b side is larger than both the thicknesses t3 and t4. Although FIG. 11 shows a case where a step is formed between the thin portion 328 and the thick portion 329, the thickness of the resin material 32 may change smoothly from the thin portion 328 to the thick portion 329. .

With reference to FIG. 12, step S10-60 concerning Embodiment 2 is demonstrated.
First, step S10 will be described. A cavity 66 for forming the holder 30 is formed between the molds 63 and 64 that move relatively in the mold moving direction 93. For example, the mold 63 is a movable side, and the mold 64 is a fixed side. The cavity 66 is formed in a disc shape corresponding to the shape of the holder 30. The thickness direction of the cavity 66 (that is, the thickness direction of the holder 30 formed in the cavity 66) coincides with the mold moving direction 93. Holding pins 73 and 74 movable in the mold moving direction 93 with respect to the mold 63 and holding pins 75 and 76 movable in the mold moving direction 93 with respect to the mold 64 are provided.

  The metal material 31 is held in the cavity 66 using holding pins 73 and 74 protruding from the mold 63 into the cavity 66 and holding pins 75 and 76 protruding from the mold 64 into the cavity 66. At this time, the holding pins 73 to 76 are arranged at the holding pin position 35. The tip of the holding pin 73 is inserted into the single positioning hole 311 from the mold 63 side, and the tip of the holding pin 75 is inserted from the mold 64 side. The tip of the holding pin 74 is inserted into the other positioning hole 311 from the mold 63 side, and the tip of the holding pin 76 is inserted from the mold 64 side.

  Here, at the positions of the holding pins 73 and 74, the distance t3 in the mold movement direction 93 from the metal material 31 to the mold 63 and the distance t4 in the mold movement direction 93 from the metal material 31 to the mold 64 are: Each corresponds to the thickness t3 and t4. On the other hand, at the positions of the holding pins 75 and 76, the distance t5 in the mold movement direction 93 from the metal material 31 to the mold 63 and the distance t6 in the mold movement direction 93 from the metal material 31 to the mold 64 are respectively It corresponds to the thickness t5 and t6. Therefore, the holding pins 73 and 75 are arranged at a portion where the thin portion 328 in the cavity 66 is to be formed, and hold the metal material 31. The holding pins 74 and 76 are arranged at a portion where the thick portion 329 in the cavity 66 is to be formed, and hold the metal material 31.

  In step S20, the molten resin material 32 is injected into the cavity 66 at the first injection pressure in a state where the metal material 31 is held using the holding pins 73 to 76. After step S20, the holding pins 73 and 75 are moved while the resin material 32 in the cavity 66 is semi-cured (step S30). Specifically, the holding pins 73 and 75 are retracted from the metal material 31. Thereafter, the molten resin material 32 is injected into the cavity 66 at a second injection pressure higher than the first injection pressure (step S40). Thus, the gap formed by retracting the holding pins 73 and 75 can be filled with the semi-cured resin material 32. In step S40, since the metal material 31 is held by the holding pins 74 and 76, displacement of the metal material 31 is prevented.

  When the temperature of the molds 63 and 64 is lowered by, for example, 10 ° C. to 30 ° C. after step S40, the resin material of the thin wall portion 328 starts to harden, but the resin material of the thick wall portion 329 is kept in a semi-cured state. .

  After lowering the temperatures of the dies 63 and 64, the holding pins 74 and 76 are moved (step S50). Specifically, the holding pins 74 and 76 are retracted from the metal material 31. Thereafter, the molten resin material 32 is injected into the cavity 66 at a third injection pressure higher than the second injection pressure (step S60). Accordingly, the gap formed by retracting the holding pins 74 and 76 can be filled with the semi-cured resin material 32. In step S60, the metal material 31 is held by the resin material 32 of the thin-walled portion 328 that has started to harden, so that the displacement of the metal material 31 is prevented.

  According to the present embodiment, since the metal material 31 is held from both sides by the holding pins 74 and 76 in step S40, the positional accuracy of the metal material 31 is further improved.

  Note that the present invention is not limited to the above-described embodiment, and can be changed as appropriate without departing from the spirit of the present invention. For example, the holder 30 is not limited to a disc shape, and may be a rectangular plate shape.

11 Heat sink 20 Semiconductor light emitting device 22 Light emitting part 30 Holder 31 Metal material 32 Resin material 322 Light emitting part exposed hole 323 Screw hole 326, 328 Thin part 327, 329 Thick part 35 Holding pin position 65, 66 Cavity 71-76 Holding pin 81 ~ 84 Injection gate C Cavity center L1 ~ L4 Straight line

Claims (9)

A method of manufacturing a holder, which is an insert molded product in which an insert metal material is covered with an insulating resin, is used for fixing and supplying power to a chip-on-board type semiconductor light-emitting device including a light-emitting portion in which a semiconductor light-emitting element is disposed. There,
The holder includes a thin part with a thin insulating resin covering the insert metal material, and a thick part with a thicker insulating resin covering the insert metal material than the thin part,
The insert metal material is formed using a first holding pin disposed at a portion where the thin portion in the cavity is to be formed and a second holding pin disposed at a portion where the thick portion in the cavity is to be formed. While being held in the cavity, the molten resin is injected into the cavity at a first injection pressure,
After injecting the molten resin into the cavity at the first injection pressure, the first holding pin is retracted,
After retracting the first holding pin, the molten resin is injected into the cavity at a second injection pressure higher than the first injection pressure,
After injecting the molten resin into the cavity at the second injection pressure, the second holding pin is retracted,
A method of manufacturing a holder, wherein after the second holding pin is retracted, molten resin is injected into the cavity at a third injection pressure higher than the second injection pressure. A light emitting portion exposure hole penetrating the holder is formed,
The holder fixes the semiconductor light emitting device to the fixing target such that the light emitting portion is exposed from the light emitting portion exposure hole in a state where the semiconductor light emitting device is disposed between the holder and the fixing target.
The thick portion is disposed on the semiconductor light emitting device side,
The method for manufacturing a holder according to claim 1, wherein the thin portion is disposed on an opposite side of the semiconductor light emitting device. When injecting molten resin into the cavity at the first injection pressure, injecting molten resin into the cavity at the second injection pressure, and injecting molten resin into the cavity at the third injection pressure When injecting molten resin into the cavity from a plurality of injection gates,
The holder is formed in a disc shape,
The cavity is formed in a disk shape corresponding to the shape of the holder,
The method for manufacturing a holder according to claim 1, wherein the plurality of injection gates are arranged at equiangular intervals around the center of the cavity when viewed in the thickness direction of the disk shape of the cavity. The plurality of injection gates so that a plurality of straight lines respectively connecting the center of the cavity and the plurality of injection gates do not pass through the positions of the first holding pin and the second holding pin when viewed in the thickness direction. The method for manufacturing a holder according to claim 3. A screw hole penetrating the holder is formed;
The plurality of injection gates are arranged so that a plurality of straight lines respectively connecting the center of the cavity and the plurality of injection gates do not pass through a portion where the screw hole is to be formed when viewed in the thickness direction. The manufacturing method of the holder of Claim 3 or 4. When viewed in the thickness direction, the cavity is formed in line symmetry with respect to an axis of symmetry passing through the center of the cavity,
The method of manufacturing a holder according to any one of claims 3 to 5, wherein the number of the plurality of injection gates is 2 or 4. The method for manufacturing a holder according to any one of claims 1 to 6, wherein a thermoplastic white resin having a reflectance of 90% or more is used as the resin material of the holder. A holder, which is an insert molded product in which an insert metal material is covered with an insulating resin, is used for fixing and supplying power to a chip-on-board type semiconductor light-emitting device including a light-emitting portion in which a semiconductor light-emitting element is disposed,
A thin portion where the thickness of the insulating resin covering the insert metal material is thin;
A holder provided with a thick part in which the thickness of the insulating resin covering the insert metal material is thicker than the thin part. A light emitting portion exposure hole penetrating the holder is formed,
The holder fixes the semiconductor light emitting device to the fixing target such that the light emitting portion is exposed from the light emitting portion exposure hole in a state where the semiconductor light emitting device is disposed between the holder and the fixing target.
The thick portion is disposed on the semiconductor light emitting device side,
The holder according to claim 8, wherein the thin portion is disposed on an opposite side of the semiconductor light emitting device.

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