JP2015107501A - Die handling method and metal die handling method apparatus in turret punch press - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a die handling method in a turret punch press that can surely prevent interference of a special die with a work clamper in a turret punch press.SOLUTION: A die handling method in a turret punch press enables a die (K) which has the possibility of preventing an action of a turret punch press (51) in a state of installation on a turret (2), out of dies (K) installed on the turret (2) of a turret punch press (51) to be classified as a special die (Ks) and handled for provision to processing by keeping resident on the turret (2) only when the special die (Ks) is designated as a die (Ka) provided for processing on the command (PG1) of a processing program (PG).

Description

  The present invention relates to a mold handling method and a mold handling apparatus in a turret punch press. In particular, the present invention relates to a mold handling method and a mold handling apparatus in a turret punch press capable of suitably performing mold management when a special mold having special specifications is included in a mold used in a turret punch press.

When there are special molds with special specifications among multiple types of molds installed in the turret punch press turret station, the turret punch press should be handled in consideration of the existence of the special mold. There is a need to.
The special specification is a specification remarkably different from other molds, and corresponds to a case where the mold has a shape protruding to the feed clearance between the lower surface of the turret and the pass line, for example. Molds with special specifications are classified as special molds and managed separately from other molds.

If a mold (special mold) protruding to the feed clearance is mounted on the turret station, the work clamper moving inside the feed clearance and the special mold may interfere with each other.
When a special mold is used, the movement path of the work clamper is generally instructed by a machining program so as to avoid interference between the work clamper and the special mold.
In addition, if it is limited to specific operations such as mold selection operation and repositioning operation, the operation system is controlled to execute avoidance operation to avoid interference between workpiece clamp and special mold without commanding by machining program. A method for doing this is known, and an example is disclosed in Patent Document 1 relating to the application of the present applicant.

  In Patent Document 1, when a repositioning command is given based on a machining program to a control unit that controls the operation of the turret punch press, the control unit determines which mold is attached to the currently selected turret station. Determine whether it is a special mold. If it is determined that the mold is a special mold, the turret is rotated to a position where it does not interfere with the special mold and the work clamper, and the special mold is temporarily retracted from the movement path of the work clamper. ing.

JP 2001-018020 A

  By the way, the turret is generally provided with a large number (for example, 58 places) of stations so that as many molds as possible can be resident without shortage for processing.

In a turret provided with a large number of stations, the stations are very close to each other.
Therefore, the interference between the work clamper and the special mold is not limited to the case where the special mold itself is used for processing, but the normal mold installed in the station near the station where the special mold is installed. It can also occur when subjected to processing.

  In this case, whether or not the retraction operation is necessary, and the content of the retraction operation (rotation direction and rotation angle) when it is determined that the retraction operation is necessary are the position of the station where the special mold is mounted and the movement range of the work clamper And the control becomes complicated.

Also, depending on the work position, the position of the station where the special mold is mounted, the position of the work clamper, etc., the work clamper and special mold May not be able to avoid the interference.
Therefore, it is desired that interference can be reliably avoided regardless of the balance between the positions.

  Therefore, the problem to be solved by the present invention is to provide a mold handling method and a mold handling apparatus in a turret punch press that can reliably prevent interference between a special mold and a work clamper in the turret punch press with simple control. There is to do.

In order to solve the above problems, the present invention has the following procedure and configuration.
1) Among the dies that are attached to the turret of the turret punch press, dies that may interfere with the operation of the turret punch press when attached to the turret are classified as special dies.
This is a die handling method in a turret punch press in which the special die is designated so as to be used for machining by being stationed on the turret only when it is designated as a die for machining by a command of a machining program.
2) Handling the die in the turret punch press according to 1), wherein the resident special die is handled so as to be removed from the turret when not designated by a command of a machining program subsequent to the machining program. Is the method.
3) Special mold determination unit for determining whether or not a mold mounted on the turret of the turret punch press is a special mold that may interfere with the operation of the turret punch press when mounted on the turret. A control unit having
The controller is
A turret punch that is handled by the turret so that it can be used for the machining only when it is specified by the machining program command that the mold determined by the special mold judgment unit is the special mold. It is a mold handling device in a press.
4) The control unit handles the mold resident in the turret so as to be withdrawn from the turret when not designated by a command of a machining program subsequent to the machining program. It is a mold handling device in the turret punch press.

  According to the present invention, it is possible to reliably prevent interference between the special mold and the work clamper by simple control.

It is a typical top view for demonstrating the turret punch press 51 carrying the Example of the metal mold | die handling apparatus which concerns on embodiment of this invention. 6 is a schematic side view for explaining a special die Ks mounted on the turret 2 of the turret punch press 51. FIG. 4 is a block diagram for explaining the configuration of a turret punch press 51. FIG. It is a flowchart for demonstrating the basic process of the metal mold | die movement performed with the turret punch press 51. FIG. It is a flowchart for demonstrating the batch process of the metal mold | die movement performed with the turret punch press 51. FIG. It is a flowchart for demonstrating the batch process of a metal mold | die movement in case the turret punch press 51 is a multi-function machine.

  An example of a mold handling apparatus according to an embodiment of the present invention will be described with reference to FIGS. 1 to 6 using a turret punch press 51 on which the mold handling apparatus is mounted.

First, an overall schematic configuration of the turret punch press 51 will be described with reference to FIGS. 1 and 2.
The turret punch press 51 has a main body 1 and a control device CT.
The main body 1 includes a turret 2, an X axis part 4 for moving a plurality of work clampers 3 for clamping the work W in the X direction, a Y axis part 5 for moving the X axis part 4 in the Y direction, and a plurality of brushes 6a. (See FIG. 2).

The workpiece W is supported from below by a plurality of brushes 6a.
The operations of the X-axis part 4 and the Y-axis part 5 are controlled by the control device CT and move the workpiece W supported by the brush 6a on the XY two-dimensional plane (on the horizontal plane).
The turret 2 is provided with a plurality of stations 2a to which the mold K can be attached and detached. Here, the mold K is composed of, for example, a combination of a punch and a die.
The turret punch press 51 has a ram (not shown) that moves up and down. The turret punch press 51 moves up and down with respect to the die in conjunction with the lifting and lowering operation of the ram, and is inserted between the punch and the die by the work clamper 3. Drilling or the like is performed on the workpiece W.

In the vicinity of the main body 1 of the turret punch press 51, a rack 7 in which a plurality of dies K can be stationed and stored is disposed.
The rack 7 is provided with a plurality of rack stations 7h in which a mold K can be loaded in a matrix. The mold K received from the mold loading / unloading port 7c provided in the rack 7 is loaded into a predetermined rack station 7h by the in-rack mold moving device 7d.

A buffer turret 8 is disposed between the turret 2 and the rack 7.
The buffer turret 8 has a plurality of buffer stations 8a to which the mold K can be attached and detached, and is rotatable. The buffer turret 8 functions as a temporary storage place (temporary location) for the so-called mold K.

The movement of the mold K between the rack 7 and the buffer turret 8 is performed by an in-rack mold moving device 7d.
A mold moving device 9 for moving the mold K between the buffer turret 8 and the turret 2 is installed between the buffer turret 8 and the main body 1.
The operations of the in-rack mold moving device 7d and the mold moving device 9 are controlled by the control device CT.
Further, the rotation operations of the turret 2 and the buffer turret 8 are also controlled by the control device CT.
An output unit 10 is connected to the control device CT, and information related to processing including an operation state is output to the outside by an image or sound.

  A turret punch press system 51 </ b> S is configured including the main body 1, the control device CT, the rack 7, the buffer turret 8, and the mold moving device 9.

Next, the special mold Ks will be described.
FIG. 2 is a diagram illustrating a state in which the special mold Ks of the mold K is mounted on the station 2a of the turret 2.
A gap between the position of the lower surface 2b of the turret 2 and the upper end position (also the position of the pass line PL) of the brush 6a is a feed clearance Vc.

The mold K attached to the turret 2 does not protrude downward from the lower surface 2b of the turret 2 when attached to the station 2a as a normal specification.
On the other hand, there is a mold having a protruding portion Ks1 protruding downward as shown in FIG.

For example, in the repositioning operation, the work clamper 3 may enter the feed clearance Vc.
As shown in FIG. 2, the protrusion amount (vertical distance) of the protrusion Ks1 of the mold K having the protrusion Ks1 is defined as the protrusion amount L1, and the thickness (vertical distance) of the work clamper 3 is defined as the thickness L2. Then
Lc−L2 ≦ L1
In this case, interference between the protrusion Ks1 and the work clamper 3 may occur.
Therefore, when a margin for safety is set as the clearance Ls and the protrusion amount L1 of the protrusion Ks1 of the mold K having the protrusion Ks1 is equal to or larger than a predetermined protrusion amount,
Lc-L2-Ls ≦ L1
If the condition is satisfied, the mold K is classified and managed as a special mold Ks that requires attention in handling with respect to interference.
The control device CT of the mold handling apparatus C handles the special mold Ks based on a processing procedure described later.

The protrusion amount L1 is calculated on the basis of the distance from the reference contact part that defines the vertical position when the mold K is mounted on the turret 2 to the tip.
The reference contact portion is, for example, the lower surface of the flange that protrudes outward from the side surface of the mold K. The vertical distance from the lower surface to the lower tip is defined as a flange lower dimension, which is managed by being included in mold unique information JK2 and quasi mold unique information JK2a (see FIG. 3) described later.

A display K1 made of a two-dimensional barcode or the like is provided on the outer surface of the mold K mounted on the station 2a of the turret 2 so as to be visible, including the one having the protrusion Ks1 described above.
From this display K1, mold ID information JK1 (see FIG. 3) for specifying the mold K is obtained.

  The rack 7 includes a reader 7a for reading the display K1, a mold information input / output unit 7b for an operator to input information, a mold loading / unloading port 7c, and an in-rack mold moving device 7d. (See FIG. 3).

Next, the configuration of the turret punch press 51 will be described with reference mainly to FIG. 3 which is a block diagram.
In FIG. 3, a drive unit such as a servo motor that performs operations of the ram, the X-axis unit 4, the Y-axis unit 5, the turret 2, the buffer turret 8, and the mold moving device 9 is collectively referred to as a drive unit M.

As shown in FIG. 3, a turret punch press 51, an external program server 31 and a mold ID server 32 are connected by wire or wirelessly. This connection may be via an internet line.
The control device CT of the turret punch press 51 includes an information processing unit 21, an operation control unit 22, a storage unit 23, a PMC ladder 24, and a CNC control unit 25.

  The information processing unit 21 includes an output control unit 21a, a program analysis unit 21b, and a station determination unit 21c. In addition, the information processing unit 21 has various application groups (not shown).

The mold ID information JK1 is supplied to the information processing unit 21 from the reader 7a of the rack 7.
The processing program PG stored in the program server 31 is supplied from the program server 31 to the information processing unit 21. The machining program PG includes a mold command PG1 which is a machining command specifying a mold Ka to be used for each machining process.

The mold ID server 32 stores mold unique information JK2 of the mold K that can be used in the turret punch press 51.
The mold unique information JK2 includes, for example, information such as a mold unique ID number, shape information, dimension information, and manufacturing history information. The dimension information includes the above-described flange lower dimension corresponding to the protrusion amount L1.
In response to a request RQ1 from the information processing unit 21 side, the mold ID server 32 is a semi-mold unique information JK2a in which manufacturing information and the like are deleted from the mold unique information JK2 of the mold K designated by the request RQ1. Is supplied to the information processing unit 21.

The operation control unit 22 includes a press control unit 22a, a mold movement plan generation unit 22b, a mold replacement operation control unit 22c, a mold verification unit 22d, and a special mold determination unit 22e.
The press control unit 22a manages and controls the lifting / lowering operation of the ram based on the processing program PG and controls the entire press processing operation.
The mold movement plan generation unit 22b and the mold exchange operation control unit 22c move the mold K between the rack 7, the buffer turret 8, and the turret 2 based on the mold command PG1 of the machining program PG. Controls the entire mold change operation.
The mold collation unit 22d determines whether or not the turret 2 and the buffer turret 8 have predetermined molds with reference to a mounting mold information table 23b (described later).
The special mold determination unit 22e determines whether or not the mold Ka designated by the mold command PG1 of the machining program PG is the special mold Ks, and provides the result to the mold replacement operation control unit 22c.

The storage unit 23 includes a machining program information table 23a and a mounting mold information table 23b.
The machining program information table 23 a stores a plurality of machining programs PG supplied from the program server 31 through the information processing unit 21 for continuous machining.
In the mounting mold information table 23b, a turret punch press system internal mold management number (hereinafter referred to as management number JK3), mold ID information JK1, quasi-mold specific information JK2a, and a mold that moves during operation are machine The mold location information JK4 indicating where it is located is stored.

The PMC ladder 24 organizes the states of the operation control unit 22 and the CNC control unit 25, various signals, and the like.
The CNC control unit 25 manages the numerical control of the operation command to the drive unit M.

By the turret punch press 51 having the above-described configuration, press working is executed in the following general procedure.
The operator loads a mold K that can be used with the turret punch press 51 in a plurality of rack stations 7 h of the rack 7 in advance. In the rack 7, the plurality of rack stations 7h provided in a matrix are specified by specifying rows and columns.
The row and column of the rack station 7h are associated with the management number JK3.
Therefore, the operator loads the mold K to be loaded into the mold loading / unloading port 7c, and instructs the management number JK3 at the mold information input / output unit 7b.
When the operator completes the loading completion operation, the display K1 is read by the reader 7a and stored in the rack station 7h by the mold moving device 7d in the rack.

The mold ID information JK1 is output from the reader 7a to the information processing unit 21.
When the information processing unit 21 receives the mold ID information JK1, the information processing unit 21 outputs a request RQ1 to the mold ID server 32 and acquires the quasi-mold specific information JK2a.
From the mold information input / output unit 7b, the management number JK3 and the mold location information JK4 are output to the information processing unit 21.
The information processing section 21 associates the received mold ID information JK1, the semi-mold specific information JK2a, the management number JK3 and the mold location information JK4, and stores them in the mounting mold information table 23b.
When using a mold without the display K1 with the turret punch press 51, the operator inputs information such as shape and dimensions from the mold information input / output unit 7b, and enters from the mold entry / exit port 7c.
The information processing section 21 associates the input information such as the shape and dimensions with the management number JK3 and the mold location information JK4 and stores them in the mounting mold information table 23b.

When the mold K is unloaded from the rack 7, when an operator instructs the management number JK3 of the mold K to be unloaded and performs a unloading operation, the mold K is moved to the mold by the in-rack mold moving device 7d. It is taken out to the entrance / exit 7c. At the same time, the mold ID information JK1, the semi-mold unique information JK2a, and the mold location information JK4 associated with the management number JK3 are updated by the information processing unit 21.
That is, information that enables real-time determination of which mold K is loaded in which rack station 7h of the rack 7 is stored in the mounting mold information table 23b.

When executing press working on the workpiece W, the control device CT obtains the machining program PG from the program server 31 and stores it in the storage unit 23.
The CNC control unit 25 controls the drive unit M so as to move the position of the workpiece W according to a command of the machining program PG. During this control, the operation control unit 22 and the PMC ladder 24 also perform various signal communications to process the actual workpiece W.

The program analysis unit 21b of the information processing unit 21 extracts a mold K necessary for a series of machining from a mold command PG1 included in the machining program PG. The station determination unit 21c determines which station 2a of the turret 2 is mounted with the mold K to be processed with reference to the mounting mold information table 23b.
The mold movement plan generation unit 22b of the operation control unit 22 supplies the mold K to be used for processing extracted by the program analysis unit 21b from the rack 7 to the turret 2 via the buffer turret 8, and from the turret 2. A mold movement plan KPN including withdrawal to the rack 7 via the buffer turret 8 is generated.

  According to the mold movement plan KPN, the movement of the mold K is basically executed for each mold command PG1 of the machining program PG together with the determination as to whether or not the mold K needs to be replaced in the turret 2. Further, even when the press working is stopped for a certain period, it is executed individually or collectively.

  In the case where the turret punch press 51 is a multi-function machine that enables processing other than press processing (for example, laser processing), the turret punch press 51 is mounted on the turret 2 while the processing operation shifts from press processing to another processing. The existing molds K are exchanged collectively.

  The press control unit 22a of the operation control unit 22 controls the press operation such as the raising / lowering operation of the ram based on the machining program PG. This pressing operation is executed in conjunction with a positioning operation for rotating the turret 2 to position the die Ka designated by the die command PG1 at a predetermined processing position. Thereby, press working using the mold Ka specified by the mold command PG1 is performed.

  The mold exchanging operation control unit 22c of the operation control unit 22 uses a mold turret 8 between the rack 7 and the turret 2 via the buffer turret 8 based on the mold movement plan KPN created by the mold movement plan generation unit 22b. The operations of the in-rack mold moving device 7d and the mold moving device 9 are controlled so that K is moved.

  The mold exchanging operation control unit 22c sequentially updates the mold location information JK4 as the mold K moves.

The special mold determination unit 22e of the operation control unit 22 determines whether or not the mold Ka specified by the mold command PG1 of the machining program PG and attached to the turret 2 is the special mold Ks. This is supplied to the mold exchanging operation control unit 22c.
The mold exchanging operation control unit 22c executes mold exchanging operation control based on the determination result supplied from the special mold determining unit 22e.

Next, details of the mold exchanging operation will be described with reference to FIGS. 4 to 6 which are flowcharts. This description includes a determination in consideration of the presence of the special mold Ks.
First, with reference to FIG. 4, the procedure of the basic process operation of mold replacement (hereinafter also referred to as basic process) will be described. This basic process is a procedure for mounting only the mold Ka designated by the mold command PG1 to the turret 2, and execution is instructed by the mold movement plan KPN.

<Basic processing>
First, when a mold command PG1 for performing machining by designating a mold Ka is received according to the machining program PG (Step 1), the mold collation unit 22d sends the mold Ka to the station 2aa designated by the mold movement plan KPN. Is determined with reference to the mounting die information table 23b (Step 2).

  When the determination of (Step 2) is negative (No), the mold verification unit 22d refers to the mounting mold information table 23b to determine whether or not a mold K other than the mold Ka is mounted on the station 2aa. (Step 3).

When the determination of (Step 3) is negative (No), the mold replacement operation control unit 22c receives the determination result and attaches the specified mold Ka to the station 2aa (Step 4).
In this case, since the mold Ka is made to wait in the buffer turret 8 in advance based on the mold movement plan KPN, the mold Ka is moved from the buffer turret 8 to the station 2aa of the turret 2 by the mold moving device 9. .

When the determination of (Setp3) is positive (Yes), in response to the determination result, the mold exchanging operation control unit 22c uses the mold moving device 9 to remove the mold K attached to the station 2aa and remove the buffer turret. 8 is moved (Step 5).
Next, the mold exchanging operation control unit 22c causes the mold moving device 9 to move and mount the mold Ka to the vacant station 2aa according to the procedure of (Step 4). Thereafter, the procedure proceeds to (Step 6).

  When the determination of (Step 2) is positive (Yes) and when (Step 4) is passed, the special mold determination unit 22e determines whether or not the special mold Ks is attached to any station 2a of the turret 2. The determination is made with reference to the mold location information JK4 and the quasi-mold specific information JK2a in the mounting mold information table 23b (Step 6).

When the determination of (Step 6) is negative (No), the press control unit 22a starts processing with the designated mold Ka attached to the station 2aa (Step 7).
When the determination of (Step 6) is positive (Yes), the special mold determination unit 22e indicates whether or not the special mold Ks attached to the turret 2 is the specified mold Ka. Judgment is made with reference to JK4 and quasi-die specific information JK2a (Step 8).

When the determination of (Step 8) is negative (No), the mold replacement operation control unit 22c receives the determination result and removes the special mold Ks attached to the turret 2 by the mold moving device 9 (Step 9). ).
Next, the special mold determination unit 22e determines whether another special mold Ks is still attached to the turret 2 (Step 10). If the determination is positive (Yes), the mold replacement operation control unit 22c. Performs the removal operation of (Step 9) by the mold moving device 9.
The steps (Step 9) and (Step 10) are repeatedly executed until the special mold Ks attached to the turret 2 runs out.

  When the determination of (Step 8) is positive (Yes), the process proceeds to (Step 10), and the special mold Ks is removed until there is no special mold Ks other than the special mold Ks designated as the mold Ka. Is done.

  When the determination of (Step 6) is negative (No) and when the determination of (Step 10) is negative (No), that is, the turret 2 has a special metal other than the special metal Ks specified by the metal mold command PG1. When the mold Ks no longer exists, the process proceeds to (Step 7), and press working with the mold Ka designated by the press control unit 22a is executed.

  In the above procedure, the procedure excluding (Step 7) is the process A. Process A is also executed as a batch process (part 1) described later as a routine.

The mold K removed in (Step 5) and (Step 9) is withdrawn to the buffer turret 8.
On the other hand, the special mold Ks provided for use in (Step 7) is removed in (Step 9) in the next mold command PG1, and is withdrawn to the buffer turret 8.
That is, the special mold Ks specified by the mold command PG1 is mounted on the station 2aa of the turret 2 at (Step 4), and then the basic process (Step 5) or (Step 9) according to the next mold command PG1 is performed. Until it is removed at, resident in the turret 2 is allowed.

In the above basic process, the turret 2 is set to the special mold non-mounted state in which the special mold Ks is not normally mounted, and only when designated by the mold command PG1, the turret of the special mold Ks. 2 is allowed.
In other words, in the basic process, a mold that does not have the protruding portion Ks1 is treated as a resident mold that can reside in the turret 2, and has a protruding portion Ks1 that has a protruding amount L1 that is a predetermined value or more. The mold Ks is treated as a non-resident mold that does not reside in the turret 2.

The determination in Step 6 shown in FIG. 4 is based on the assumption that the special mold Ks is attached to the turret 2. This corresponds to the case where the special mold Ks is designated as the mold Ka to be used for processing in the previous mold command PG1. Even if the special mold Ks is attached to the turret 2, if it is not designated as the mold Ka to be used for processing, it is all removed from the turret 2 before processing.
In this way, the control device CT handles the special mold Ks so as to be mounted on the station 2a of the turret 2 for processing only when the special mold Ks is designated as the mold Ka to be processed by the processing program PG.

  Thereby, the interference between the special mold Ks and the work clamper 3 can be prevented without commanding on the machining program PG.

Next, with reference to FIG. 5, (part 1) and (part 2) of the procedure of the collective exchange operation of the mold K (hereinafter also referred to as collective processing) set in the mold movement plan KPN will be described. To do. This batch process is a process in which all or a part of the mold Kb used in the processing extracted based on the processing command included in the processing program is collectively mounted on the turret 2.
The mold Kb includes a mold Ka designated by the mold command PG1. Hereinafter, it is also referred to as a use mold Kb.
The mold exchanging operation control unit 22a performs batch processing by using the idle time in press processing (part 1), or when the turret punch press 51 is a multifunction machine, the processing shifts from press processing to another processing. Execute using the time during the operation (part 2).
Which of the basic processing and the batch processing (part 1) is executed according to the mold command PG1 is instructed by the mold movement plan KPN.

<Batch processing (part 1)>
In the batch process (part 1), the process A performed in the basic process is executed as the previous stage (Step 21).
When the process A is executed, the mold collation unit 22d determines whether or not the used mold Kb extracted by the mold movement plan KPN exists in the buffer turret 8 with the mold location information JK4 in the mounted mold information table 23b. The determination is made with reference to the quasi-die specific information JK2a (Step 22).

  When the determination of (Step 22) is negative (No), the press control unit 22a performs press working with the designated mold Ka attached to the station 2aa (Step 23). Thus, when the used mold Kb is not waiting in the buffer turret 8, the collective mold K is not moved.

  When the determination of (Step 22) is positive (Yes), the special mold determination unit 22e refers to the mold location information JK4 and the quasi-mold specific information JK2a, and the used mold Kb in the buffer turret 8 is special. It is determined whether or not the mold is Ks (Step 24).

  When the determination of (Step 24) is negative (No), the mold collation unit 22d is set in the mold movement plan KPN, and the station 2ab to which the used mold Kb in the turret 2 is mounted is a station other than the used mold Kb. Whether or not the mold K is mounted is determined with reference to the mold location information JK4 and the quasi-mold specific information JK2a (Step 25).

  When the determination of (Step 25) is negative (No), the mold replacement operation control unit 22c receives the determination result and first attaches the used mold Kb to the station 2ab (Step 26).

When the determination of (Step 25) is positive (Yes), the determination result is received, and the mold exchanging operation control unit 22c removes the mold K attached to the station 2ab by the mold moving device 9, and the buffer turret. 8 is moved (Step 27).
Next, the mold exchanging operation control unit 22c causes the mold moving device 9 to move and mount the mold Kb to the vacant station 2ab according to the procedure of (Step 26).

  When the determination of (Step 24) is positive (Yes) and when (Step 26) is passed, the special mold determination unit 22e determines whether there is another use mold Kb in the buffer turret 8 or not, and the mold location information JK4. And quasi-die specific information JK2a are referred to (Step 28).

If the determination of (Step 28) is positive (Yes), the process returns to (Step 24), and the movement of the used mold Kb from the buffer turret 8 to the turret 2 is repeatedly performed until there is no used mold Kb in the buffer turret 8. .
When the determination of (Step 28) is negative (No), the press control unit 22a starts machining with the designated mold Ka attached to the station 2aa (Step 23).

  In the above procedure, the procedure excluding (Step 21) and (Step 23) is the process B. The process B is also executed in a batch process (part 2) described below as a routine.

<Batch processing (2)>
As described above, when the turret punch press 51 is a multi-function machine, the mold Kb used between the buffer turret 8 and the turret 2 while the processing operation is shifted from the press processing to another processing. Can be moved collectively.
FIG. 6 is a flowchart for explaining batch processing (part 2) in the case where the turret punch press 51 as an example is a multi-function machine capable of laser processing.

  When a laser processing mode command to shift from press processing to laser processing is received (step 31), processing B of batch processing (part 1) is executed (Step 32). Thereby, the collective movement of the used mold Kb is executed.

  The batch processing (No. 1) described above is performed when there is a free time during which a plurality of molds can be moved during press working, etc., and the plurality of molds are moved between the buffer turret 8 and the turret 2. It is processing. Further, the batch processing (part 2) is performed when the turret punch press 51 is a multi-function machine capable of performing other processing (for example, laser processing) while the processing shifts from press processing to other processing. It is a process that runs on time.

In these batch processes, the turret 2 is put into a special die non-attachment state in which the special die Ks is not attached, and when it is designated by the die command PG1 and based on the machining program PG, the die movement plan KPN. The special mold Ks is allowed to be mounted on the turret 2 only when it is extracted as the used mold Kb.
Also in this batch processing, the mold K that does not have the protrusion Ks1 is treated as a resident mold that can reside in the turret 2, and the special mold Ks that has the protrusion Ks1 and whose protrusion amount L1 is a predetermined value or more. Is treated as a non-resident mold that does not reside in the turret 2.
Thereby, even if collective processing is executed, interference between the special mold Ks and the work clamper 3 is avoided.

The control device CT described above treats the special mold Ks as a non-resident mold. That is, the control device CT handles the special mold Ks so as not to be mounted on the turret 2 except when designated by the mold command PG1.
Further, if the special mold Ks is attached to the turret 2, the control device CT removes the special mold Ks from the turret 2 to the buffer turret 8 unless the special mold Ks is designated by the mold command PG1. Handle as if moving.

According to the embodiment of the present invention, not only the repositioning operation and the like, but the special mold when the normal mold mounted on the station adjacent to the station on which the special mold is mounted is used for processing. Can be prevented without a special mold withdrawal command in the machining program, and the actual machining ratio of the turret punch press can be maximized.
In addition, since the interference can be prevented without being affected by the balance between the processing position, the position of the station where the special mold is mounted, the position of the work clamper, etc., the control of the avoidance operation is simplified.
In a turret punch press equipped with an automatic die change function, when a special die is withdrawn according to a machining program command to prevent interference, the work clamper and special die due to a setting error in the machine that creates the machining program There is concern about the occurrence of interference. On the other hand, since the embodiment of the present invention does not use the command of the machining program, the concern is eliminated.

The embodiment of the present invention is not limited to the above-described configuration, and may be another modified example without departing from the gist of the present invention.
The control device CT is not limited to that provided in the turret punch press 51 together with the main body 1. For example, it may be provided outside the turret punch press 51 and may be communicable with the main body 1 wirelessly or by wire.
The special mold Ks is not limited to the one having the protrusion Ks1. Any material that can be distinguished from other molds in terms of specifications or functions and should be handled as a non-resident mold.

DESCRIPTION OF SYMBOLS 1 Main-body part 2 Turret, 2a, 2aa, 2ab Station, 2b Lower surface 3 Work clamper 4 X-axis part, 5 Y-axis part 6 Table, 6a Brush 7 Rack, 7a Reader, 7b Mold information input / output part 7c Mold entry / exit Mouth 7d In-rack mold moving device, 7h Rack station 8 Buffer turret, 8a Buffer station 9 Mold moving device 10 Output unit 21 Information processing unit 21a Output control unit, 21b Program analysis unit 21c Station determination unit 22 Operation control unit 22a Press Control unit, 22b Mold movement plan generation unit 22c Mold exchange operation control unit, 22d Mold verification unit 22e Special mold determination unit 23 Storage unit 23a Machining program information table, 23b Mounting mold information table 24 PMC ladder 25 CNC control Department 31 Program server 32 Mold ID server 51 Turret punch press, 51S Turret punch press system C Mold handling device, CT controller ha HMI application JK1 Mold ID information, JK2 Mold unique information JK2a Semi-mold unique information, JK3 Control number JK4 Mold location information K Mold Mold, Ka (mold specified in the mold command), Kb Mold used KPN Mold movement plan Ks Special mold, Ks1 Projection K1 Display Lc (Feed clearance Vc) Vertical distance, Ls clearance L1 Projection amount , L2 thickness, L3 distance M Drive unit PG Machining program, PG1 Mold command PL Pass line RQ1 Required Vc Feed clearance W Workpiece

Claims (4)

Of the molds attached to the turret of the turret punch press, the mold that may interfere with the operation of the turret punch press in the state of being attached to the turret is classified as a special mold,
A mold handling method in a turret punch press in which the special mold is handled so as to reside in the turret and be used for the machining only when the special mold is designated as a mold for machining by a command of a machining program.   2. The method of handling a die in a turret punch press according to claim 1, wherein the stationed special die is handled so as to be removed from the turret when not designated by a command of a machining program subsequent to the machining program. It has a special mold determination unit that determines whether or not the mold attached to the turret of the turret punch press is a special mold that may interfere with the operation of the turret punch press when attached to the turret. With a control unit,
The controller is
A turret that is handled by the special mold determining unit, which is determined to be the special mold, is resident in the turret and used for the processing only when it is specified to be processed by a command of a processing program. Mold handling equipment in punch press.   4. The turret according to claim 3, wherein the control unit handles the mold resident in the turret so as to be withdrawn from the turret when not designated by a command of a machining program subsequent to the machining program. 5. Mold handling equipment in punch press.

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