JP2015106541A - Substrate for led module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate for an LED module capable of building an LED lighting device having desired optical output without requiring large cost.SOLUTION: A substrate 10 for an LED module is configured by connecting n (≥2) pieces of unit substrates for mounting an LED and it is capable of multiple-patterning. At each of the n-pieces of unit substrates 11-18, at least a pair of electrodes 21a, 21b for power supply for supplying power, and a wiring pattern 22 for delivering the power supplied to at least the pair of electrodes 21a, 21b for power supply to LEDs 30a-30l mounted on the unit substrates are formed. Out of the n-pieces of unit substrates 11-18, at each of the two unit substrates arranged side by side, an electrode 24 for a jumper is formed for connecting a jumper 31a for striding over a cut portion 23 for cutting off the two unit substrates.

Description

  The present invention relates to an LED module substrate, and more particularly, to an LED module substrate capable of multi-sided configuration in which a plurality of unit substrates for mounting LEDs are connected.

  In the LED lighting device, an LED module is used as a light source. The LED module is a substrate on which LEDs are mounted.

  Conventionally, when a high light output is required in an LED lighting device, for example, in an LED lighting device for road lighting, a plurality of LED modules are used for one LED lighting device (see, for example, Patent Document 1). Thereby, a desired light output can be realized by adjusting the number of LED modules incorporated in the LED lighting device.

JP2013-62154A

  However, in an LED lighting device using a plurality of LED modules, it is necessary to connect the LED modules with wires in order to electrically connect the plurality of LED modules. Therefore, in this type of LED lighting device, there is a problem that it takes time and labor to connect the LED modules, and the cost of the connecting member is increased, which increases the cost as a whole. In particular, in the case of producing a small amount at the prototype stage, for example, when manufacturing 2 to 50 LED modules, the cost per LED module is increased unlike mass production.

  Therefore, the present invention has been made in view of such a point, and provides a substrate for an LED module that makes it possible to construct an LED lighting device having a desired light output without incurring a large cost. For the purpose.

  In order to achieve the above object, an LED module substrate according to an embodiment of the present invention is a multi-sided LED module substrate configured by connecting n (≧ 2) unit substrates for mounting LEDs. Each of the n unit boards has at least one pair of power supply electrodes for power supply and power supplied to the at least one pair of power supply electrodes mounted on the unit board. And a wiring pattern for delivering to the LED to be formed, and the LED module substrate is divided into the n unit substrates when the LED module substrate is divided into the cut portions of the LED module substrate. A pattern is not formed, and among the n unit substrates, each of the two unit substrates arranged adjacent to each other is provided with a jumper that straddles a cutting point that separates the two unit substrates. It is jumper electrode for formation, and the wiring pattern formed on the electrodes and the unit substrate the jumper is connected.

  Here, the n unit substrates are arranged side by side in a first direction, and each of the n unit substrates has two side edge regions located at both ends in a second direction orthogonal to the first direction. In addition, the jumper electrode may be formed.

  Further, when a group composed of m (≦ n) unit substrates continuous in the arrangement of the n unit substrates is used as a group substrate, m units constituting the group substrate for each group substrate. Jumpers for connecting the corresponding jumper electrodes formed on the unit substrate may be provided.

  Further, each of the n unit substrates may be provided with at least one of a hole and a notch for guiding a protrusion provided on a lens that covers an LED mounted on the unit substrate. .

  In each of the n unit substrates, the wiring pattern is separated into a first wiring pattern and a second wiring pattern, and the first wiring pattern and the second wiring pattern are connected to each other by a resistor jumper. Resistance jumper electrodes may be formed at a plurality of locations.

  Each of the n unit substrates is provided with a heat dissipation pattern that is a metal foil pattern for dissipating heat from the LEDs mounted on the unit substrate, and the heat dissipation pattern includes at least the unit heat sink. It may be formed on the substrate and directly below the LED.

  According to the LED module substrate of the present invention, it is possible to construct an LED lighting device having a desired light output without incurring a large cost.

  Therefore, the practical value of the present invention is extremely high nowadays when the demand for the light output intensity of the LED lighting device is diversified.

The top view of the board | substrate for LED modules (8 chamfering) in embodiment of this invention Equivalent circuit diagram (including LED) of the unit board constituting the LED module board Enlarged view of a part of the LED module substrate External view showing an example of a lens covering an LED mounted on the LED module substrate External view showing another example of a lens covering an LED mounted on the LED module substrate Enlarged view of the heat dissipation pattern of the LED module substrate The top view of the board | substrate for LED modules (4 chamfering) in embodiment of this invention Enlarged view of jumper on LED module substrate of FIG. Equivalent circuit diagram of each LED module shown in FIG. 5 (including LED) FIG. 5 is an enlarged view of a part of the LED module substrate of FIG. The top view of the board | substrate for LED modules (1 chamfering) in embodiment of this invention Equivalent circuit diagram of LED module substrate shown in FIG. 8A (including LED) The top view of the board | substrate for LED modules comprised from six unit substrates in the 1st modification of embodiment of this invention. The top view of the board | substrate for LED modules (8 chamfering) in the 2nd modification of embodiment of this invention. Equivalent circuit diagram (including LED) of the unit board constituting the LED module board Plan view of the LED module substrate (4 chamfers) Equivalent circuit diagram of each LED module shown in FIG. 10C (including LED) Plan view of the LED module substrate (1 chamfer) Equivalent circuit diagram of LED module substrate shown in FIG. 10E (including LED)

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Each of the embodiments described below shows a preferred specific example of the present invention. The numerical values, shapes, materials, constituent elements, arrangement positions and connecting forms of the constituent elements, steps, order of steps, and the like shown in the following embodiments are merely examples and are not intended to limit the present invention. In addition, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims indicating the highest concept of the present invention are described as optional constituent elements that constitute a more preferable embodiment.

  FIG. 1A is a plan view of LED module substrate 10 in the present exemplary embodiment. This LED module substrate 10 is an example of a multi-sided LED module substrate configured by connecting n (≧ 2) unit substrates for mounting LEDs. In this embodiment, eight LED module substrates are used. Unit substrates 11-18. The eight unit substrates 11 to 18 are arranged side by side in the first direction (X direction in FIG. 1A), and are separated by being cut at a location (cutting location) illustrated by a dotted line. In this figure, a case where the LED module substrate 10 is used by being divided into eight parts (that is, a case where eight surfaces are chamfered) is shown. In addition, the case where the board | substrate 10 for LED modules is used by another division | segmentation aspect (for example, 4 chamfering or 1 chamfering) is mentioned later.

  The LED module substrate 10 is, for example, a printed circuit board in which a copper foil wiring pattern is provided on the upper surface of a glass epoxy substrate. In the present embodiment, each unit substrate 11 to 18 is provided with a wiring pattern that connects twelve surface mount type LEDs 30a to 30l in series. That is, two rows of LEDs, each of which has six LEDs arranged in a straight line in a second direction (Y direction in FIG. 1A) orthogonal to the first direction, are connected in series for each unit substrate. That is, as shown in the equivalent circuit diagram of FIG. 1B, each unit substrate 11 to 18 is provided with a wiring pattern for mounting the 12 LEDs 30a to 30l connected in series.

  In addition, LED30a-30l of FIG. 1A is a surface mount type LED chip covered with sealing resin containing a fluorescent substance, for example. These LEDs 30a to 30l are illustrated for reference, and the LEDs 30a to 30l are not necessarily mounted as the LED module substrate 10. On the upper surface of the LED module substrate 10, two electrodes for soldering the LEDs are formed for each LED at locations where the LEDs 30 a to 30 l are mounted.

  FIG. 2 is an enlarged view of a part of the LED module substrate 10 in FIG. 1A. Each unit substrate 11 to 18 is formed with at least one pair of power supply electrodes for power supply (here, two pairs of power supply electrodes 21a and 21b). Further, each of the unit boards 11 to 18 includes LEDs 30a to which power supplied to the at least one pair of power supply electrodes (here, two pairs of power supply electrodes 21a and 21b) is mounted on the unit board. A wiring pattern 22 for delivery to 30 l is formed. When each of the unit substrates 11 to 18 is incorporated in the lighting device, a pair of power supply cables are soldered and connected to at least one of the two pairs of power supply electrodes 21a and 21b. Thereby, when this LED module substrate 10 is divided into eight, it becomes possible to supply power to the unit substrates 11 to 18.

  In addition, as shown in FIG. 2, a wiring pattern straddling the cut portion 23 is formed in the cut portion 23 of the LED module substrate 10 when the LED module substrate 10 is divided into eight unit substrates. Absent. Among the eight unit substrates 11 to 18, jumper electrodes 24 for connecting a jumper straddling the cut portion 23 that separates the two unit substrates to each of the two unit substrates arranged adjacent to each other. Is formed. The jumper electrode 24 and the wiring pattern 22 formed on the unit substrate are connected. The jumper electrodes 24 are formed in two side edge regions located at both ends in the Y direction of the unit substrates 11 to 18. As will be described later, by soldering a jumper to an appropriate portion of the jumper electrode 24 of the LED module substrate 10, the LED module substrate 10 may be divided into other division modes (for example, four-sided or one-sided ) And can be used for lighting devices.

  As shown in FIG. 2, each unit substrate 11 to 18 includes at least one of a hole and a notch for guiding a protrusion provided on a lens that covers each of the LEDs 30 a to 30 l on the unit substrate. Two (here, hole 27a and notch 27b) are provided. 3A and 3B are external views of lenses 50 a and 50 b that cover the LEDs mounted on the LED module substrate 10. In order to show the mounting direction of the lenses 50a and 50b, the X direction and the Y direction of the LED module substrate 10 are shown on the right side of FIGS. 3A and 3B. A lens 50a shown in FIG. 3A is a resin lens in which four recesses 51a and four protrusions 52a are formed to cover each of four LEDs arranged adjacent to each other. The emitted light is guided upward in the drawing. A lens 50b shown in FIG. 3B is a resin lens in which four recesses 51b and four protrusions 52b are formed to cover each of the four LEDs arranged adjacent to each other, and is emitted from the four LEDs. The emitted light is guided to the left side of the drawing. Each unit substrate 11 to 18 guides a total of 12 protrusions 52a (or 52b) provided on the three lenses 50a (or 50b) covering the 12 LEDs 30a to 30l mounted on the unit substrate. Six holes 27a and six notches 27b are provided. The notch 27b is a semi-cylindrical recess formed on the long side surface of each unit substrate 11-18. With such holes 27a and notches 27b, the lens 50a or 50b can be positioned on the unit substrates 11 to 18 and fixed securely. Whether the lens 50a shown in FIG. 3A or the lens 50b shown in FIG. 3B is used is determined depending on the use of the lighting device in which the unit substrate is incorporated. Moreover, the shape of the hole 27a and the notch 27b should just be a thing suitable for the lenses 50a and 50b, for example, may be circular, a triangle, or a rectangle.

  Further, as shown in FIG. 2, in the LED module substrate 10 in the present embodiment, the wiring patterns 22 in each of the unit substrates 11 to 18 include two wiring patterns (a first wiring pattern 22a and a second wiring pattern). 22b). In the first wiring pattern 22a and the second wiring pattern 22b, resistance jumper electrodes to be connected to each other by a resistance jumper are formed at a plurality of locations (that is, a plurality of pairs are formed redundantly). Specifically, a resistor jumper is used to connect the second wiring pattern 22b connected to the negative (−) power supply terminal of the power supply electrode 21a and the first wiring pattern 22a formed in the side edge region. Two pairs of resistance jumper electrodes 25a are provided. Furthermore, two pairs of resistors for connecting the second wiring pattern 22b connected to the plus (+) power supply terminal of the power supply electrode 21a and the first wiring pattern 22a formed in the side edge region with a resistor jumper. A resistor jumper electrode 25b is provided. Such two redundant pairs of resistance jumper electrodes 25a (and 25b) are provided so that one of two resistance jumpers in parallel connection can be selectively used. It is to do. This corresponds to which of the two types of lenses 50a and 50b described above is employed, and is for avoiding that the lens cannot be mounted on the unit substrate because the resistance jumper hits the lens. For example, when the lens 50a is mounted on the LED module substrate 10 out of the two types of lenses 50a and 50b, one of the two pairs of resistance jumpers is selected. On the other hand, when the lens 50b is mounted on the LED module substrate 10, the other of the two pairs of resistance jumpers is selected. Thereby, it can mount in the board | substrate 10 for LED modules, without a resistance jumper and a lens colliding.

  The resistor jumper functions as a fuse that connects 12 LEDs on adjacent unit substrates in series via the first wiring pattern 22a formed in the side edge region, and a fuse that is disconnected when a large current flows. It is a jumper that combines the functions of Moreover, the polarities of the power supply and the LED shown in FIGS. 1A, 1B, and 2 are examples, and may be reversed. For example, the LED is mounted so that the polarity of the LED mounted on the LED module substrate 10 is opposite to the illustrated polarity, and the power supplied to the plus (+) power terminal and the minus (−) power terminal is adjusted accordingly. What is necessary is just to change the polarity of.

  In addition, as shown in FIG. 2, in the LED module substrate 10 in the present embodiment, the eight unit substrates 11 to 18 each dissipate heat from the LEDs 30a to 30l mounted on the unit substrate. A heat radiation pattern 26, which is a metal foil pattern for this purpose, is formed. The heat dissipation pattern 26 is formed on the unit substrate and at least directly below the LEDs 30a to 30l. That is, as shown in the enlarged view of the heat dissipation pattern in FIG. 4, the heat dissipation pattern 26 includes two regions 26a and 26b positioned on the left and right with respect to the wiring pattern connecting the LEDs in series. It is the metal foil pattern connected through the area | region 26c which runs between electrodes. With such a heat dissipation pattern 26, the heat generated in the LEDs 30a to 30l is transmitted to the larger regions 26a and 26b via the region 26c of the heat dissipation pattern 26 that runs directly under the LEDs 30a to 30l, and the LEDs 30a to 30l efficiently dissipate heat. Is done.

  FIG. 5 is a plan view of the LED module substrate 10a in a four-chamfer case. That is, in this case, when the LED module substrate 10a is incorporated in the lighting device, the LED module substrate 10a is cut along the dotted line shown in FIG. LED modules 41 to 44 are manufactured.

  Here, in the LED module substrate 10a, a group composed of m (≦ n) unit substrates continuous in an array of n unit substrates is referred to as an assembled substrate (or LED module). When the LED module substrate 10a is used as m number of assembled substrates, for each of the n unit substrates, a corresponding jumper electrode formed on the m unit substrates constituting the assembled substrate is provided. A jumper for connection is provided. Here, in the present specification, when “jumper” is simply described, the “jumper” is a normal jumper different from the resistance jumper (for short-circuiting having a function of short-circuiting at least two locations without using a resistor). Jumper). In the LED module substrate 10a shown in FIG. 5, in order to connect two adjacent unit substrates for each of the four LED modules 41 to 44, there are two Jumpers 31a (a total of eight jumpers 31a) are provided. In the LED module substrate 10a shown in FIG. 5, the lowermost LED module 41 in the drawing also serves as a plus (+) power terminal and a minus (−) power terminal for power supply. In addition, a wire connector (specifically, Push End Wire Connector / Push-in Wire Connector) 31b is provided. Therefore, the LED module substrate 10a shown in FIG. 5 is provided with eight jumpers 31a and one wire connector 31b.

  FIG. 6A is an enlarged view of the jumper (here, a wire connector) 31a shown in FIG. FIG. 6B is an equivalent circuit diagram of each LED module 41 to 44 (equivalent circuit diagram including the LED). As shown in FIG. 6A, the jumper 31a has a function of short-circuiting two pairs of corresponding electrodes and a function of connecting a conductor cable to each short-circuited portion. In order to connect to the conductor cable, the jumper 31a has two insertion holes 32 for the conductor cables and two screws 33 for pressing the conductor cables inserted into the insertion holes 32 against the short-circuit portion. In each of the LED modules 41 to 44, the lead wires are inserted into and connected to the respective insertion holes 32 of the two jumpers 31a provided in both side edge regions, thereby being connected in series through the current path shown in FIG. In addition, current can be passed through 24 LEDs. That is, each LED module 41 to 44 is an LED module for mounting 24 LEDs connected in series as shown in FIG. 6B. In the present embodiment, as the jumper 31a, a wire connector having both the function of the jumper and the connection function of the conductor cable is used, but is not limited thereto. The connection between the jumper and the conductor cable may be performed separately.

  As for the connection between the conductor cable and the jumper 31a, the jumper 31a provided in the right side edge region as viewed in the drawing has a plus (+) sign in one of the two insertion holes 32 (whichever may be used). Connect the power supply cable (+ Vin in FIG. 5). On the other hand, in the jumper 31a provided in the left side edge region as viewed in the drawing, the minus (−) power supply cable (FIG. 5) is inserted into the insertion hole 32 located on the side of the two insertion holes 32. -Vin). As a result, power supply for each of the LED modules 41 to 44 (that is, power supply to 24 LEDs) becomes possible. For the LED module 41 located at the bottom of the drawing, power is supplied only from the wire connector 31b provided at the lower left (the lead cable for the plus (+) power source and the minus (− It is also possible to connect a power supply cable).

  FIG. 7 is an enlarged view of a part of the LED module substrate 10a in FIG. As can be seen from this figure, in such a four-chamfer case, a resistor jumper 35 for connecting two adjacent unit substrates is provided. In the example shown in FIG. 7, the resistance jumper 35 is provided on one (R2) of the two pairs (R1 and R2) of the two pairs of resistance jumper electrodes 25a close to the minus (−) power supply terminal. . Further, with respect to the two pairs of resistance jumper electrodes 25b close to the plus (+) power supply terminal, a resistance jumper 35 is provided on one (R4) of the two pairs (R3 and R4).

  By using the jumper 31a and the resistor jumper 35 as described above, the LED module substrate 10a can be used as a four-chamfer dividing into four LED modules each composed of two unit substrates.

  FIG. 8A is a plan view of the LED module substrate 10b in a one-chamfer case. FIG. 8B is an equivalent circuit diagram (equivalent circuit diagram in the case of including LEDs) of the LED module substrate 10b shown in FIG. 8A. In other words, in this case, the LED module substrate 10b is used as one LED module without being divided (in sheet units) when incorporated in the lighting device. The LED module substrate 10b shown in FIG. 8A is provided with 14 jumpers 31a and one wire connector 31b. By such a jumper 31a and wire connector 31b, as shown in the equivalent circuit diagram of FIG. 8B, a total of four sets of LEDs, one set of 24 LEDs connected in series, are connected in parallel.

  As for the power supply, it is only necessary to supply power only to the wire connector 31b provided at the lower left of the LED module substrate 10b. In other words, a plus (+) power supply cable (+ Vin in FIG. 8A) and a minus (−) power cable (−Vin in FIG. 8A) are connected to the two insertion holes 32 of the wire connector 31b. Just do it.

  As for the resistance jumper 35, as in the example shown in FIG. 7, the two pairs of resistance jumper electrodes 25a close to the minus (−) power terminal are connected to one of the two pairs (R1 and R2) (R2). A resistance jumper 35 is provided. Further, with respect to the two pairs of resistance jumper electrodes 25b close to the plus (+) power supply terminal, a resistance jumper 35 is provided on one (R4) of the two pairs (R3 and R4).

  By using the jumper 31a and the resistance jumper 35 as described above, the LED module substrate 10b can be used for the lighting device in units of sheets (as one LED module) without being divided.

  As described above, the LED module substrates 10, 10 a, and 10 b in the present embodiment are multi-sided LED module substrates configured by connecting n (≧ 2) unit substrates for mounting LEDs. It is. Each of the n unit substrates is mounted with at least one pair of power supply electrodes 21a and 21b for power supply and the power supplied to at least one pair of power supply electrodes 21a and 21b on the unit substrate. And a wiring pattern 22 to be delivered to the LED. Furthermore, the wiring pattern which straddles the said cutting location 23 is not formed in the cutting location 23 of the LED module substrate at the time of dividing | segmenting the LED module substrate 10, 10a and 10b into n unit substrates. A jumper electrode 24 for connecting a jumper 31a straddling the cut portion 23 separating the two unit substrates is connected to each of the two unit substrates arranged adjacent to each other among the n unit substrates. Is formed. The jumper electrode 24 and the wiring pattern 22 formed on the unit substrate are connected.

  Thereby, in LED module substrate 10, 10a, and 10b in this Embodiment, the power supply electrode is provided on each unit substrate, and the wiring pattern of each unit substrate is connected via the jumper. Therefore, even when the LED module substrates 10, 10 a, and 10 b in the present embodiment are divided into unit substrates and multi-sided, complicated wiring for connecting the unit substrates is performed manually. There is no need, and a wire as a connecting member is also unnecessary. As a result, it becomes easy to divide the LED module substrates 10, 10a and 10b into a desired number, and it is possible to construct an LED lighting device having a desired light output without incurring a large cost.

  Here, the n unit substrates are arranged side by side in the first direction, and each of the n unit substrates has jumpers on two side edge regions located at both ends in the second direction orthogonal to the first direction. A working electrode 24 is formed. Thereby, a jumper will be arrange | positioned in the side edge area | region of the board | substrates 10, 10a, and 10b for LED modules, and the operation | work which attaches a jumper to a jumper and connects a conducting wire cable becomes easy.

  In addition, when a set composed of m (≦ n) unit substrates that are continuous in the arrangement of n unit substrates is used as a set substrate, the set substrate is set for each set substrate in the n unit substrates. Jumpers 31a for connecting corresponding jumper electrodes 24 formed on m unit substrates are provided. Thereby, it becomes possible to divide | segment and use the LED module board | substrates 10, 10a, and 10b for the LED module comprised from m unit substrates.

  Further, each of the n unit substrates has a hole 27a and a notch 27b for guiding the protrusion 52a (or 52b) provided on the lens 50a (or 50b) covering the LED mounted on the unit substrate. At least one of them is provided. Thereby, the lens 50a (or 50b) can be positioned on each unit board | substrate 11-18, and can be fixed reliably.

  In each of the n unit substrates, the wiring pattern 22 is separated into the first wiring pattern 22a and the second wiring pattern 22b, and the first wiring pattern 22a and the second wiring pattern 22b are connected to each other by a resistor jumper 35. Resistance jumper electrodes 25a and 25b for mutual connection are formed at a plurality of locations. As a result, depending on which of the two types of lenses 50a and 50b is used, the location to be short-circuited by the resistance jumper can be selected from a plurality of locations, so that the problem that the resistance jumper hits the lens and the lens cannot be mounted on the unit substrate is avoided Is done.

  Each of the n unit substrates is provided with a heat radiation pattern 26 that is a metal foil pattern for radiating heat from the LED mounted on the unit substrate. The heat radiation pattern 26 is formed at least on the unit substrate and directly under the LED. Thereby, the heat generated in the LEDs 30a to 30l is transmitted to the heat radiation pattern 26 in a large area through the heat radiation pattern 26 that runs directly under the LEDs 30a to 30l, and the LEDs 30a to 30l are efficiently radiated.

  As mentioned above, although the board | substrate for LED modules which concerns on this invention was demonstrated based on embodiment, this invention is not limited to these embodiment. Unless it deviates from the meaning of the present invention, various modifications conceived by those skilled in the art are applied to the present embodiment, and other forms constructed by combining the components in the embodiment are also included in the present invention.

  For example, in the above-described embodiment, eight unit boards each having one unit board as an LED module, four sides board using two unit boards as LED modules, and eight unit boards (one sheet) as LED modules. Although an example of single chamfering is shown, the present invention is not limited to these chamfering. Two chamfers that use four unit substrates as LED modules may be used, or chamfering that LED modules of different sizes may be mixed. For example, chamfering may be performed so that an LED module configured with one unit substrate and an LED module configured with two unit substrates coexist.

  In the above embodiment, the LED module substrates 10, 10a, and 10b are configured by eight unit substrates. However, the number of unit substrates is not limited thereto. The present invention may be an LED module substrate composed of six unit substrates 61 to 66, like the LED module substrate 60 in the first modification shown in FIG.

  Furthermore, in the above-described embodiment, 12 LEDs are mounted on each unit substrate constituting the LED module substrate, but the number of LEDs mounted on each unit substrate is not limited to 12. For example, like the LED module substrate in the second modification shown in FIGS. 10A to 10F, the number of LEDs mounted on each unit substrate may be 48.

  FIG. 10A is a plan view of an LED module substrate (eight chamfering) in a second modification. Here, a plan view of an LED module substrate 70 composed of eight unit substrates 71 to 78 on which 48 LEDs are mounted is shown. The eight unit substrates 71 to 78 are separated by being cut at a location (cutting location) indicated by a dotted line. Each unit substrate 71 to 78 is provided with a wiring pattern for mounting 48 LEDs connected in series as shown in the equivalent circuit diagram of FIG. 10B.

  FIG. 10C is a plan view of the LED module substrate 70a of the second modified example in a four-chamfer case. That is, in this case, when the LED module substrate 70a is incorporated in the lighting device, the LED module substrate 70a is cut along the dotted line shown in FIG. LED modules 81-84 are produced. Each LED module 81 to 84 is an LED module for mounting 96 LEDs connected in series as shown in the equivalent circuit diagram of FIG. 10D.

  FIG. 10E is a plan view of the LED module substrate 70b of the second modified example in the one-chamfer case. FIG. 10F is an equivalent circuit diagram (an equivalent circuit diagram in the case of including LEDs) of the LED module substrate 70b shown in FIG. 10E. Here, a total of 4 sets of LEDs, each set of 96 LEDs connected in series, are connected in parallel.

  As described above, according to the LED module substrates 70, 70a, and 70b in the second modified example, since 48 LEDs are mounted on the unit substrate, the above-described embodiment in which 12 LEDs are mounted on the unit substrate. Compared with the form, high light output is realized. Therefore, by selecting the LED module substrate according to the application in the above-described embodiment and modifications, and further selecting the number of divisions as appropriate, it has a desired light output according to various applications. It becomes possible to construct an LED lighting device.

10, 10a, 10b, 60, 70, 70a, 70b LED module substrate 11-18, 61-66, 71-78 Unit substrate 21a, 21b Power supply electrode 22 Wiring pattern 22a First wiring pattern 22b Second wiring pattern 23 Cutting point 24 Jumper electrode 25a, 25b Resistance jumper electrode 26 Heat radiation pattern 26a-26c area (area of heat radiation pattern)
27a hole 27b notch 30a-30l LED
31a Jumper (wire connector)
31b Wire connector 32 Insertion hole 33 Screw 35 Resistance jumper 41-44, 81-84 LED module (assembled board)
50a, 50b Lens 51a, 51b Recess 52a, 52b Projection

Claims (6)

A multi-sided LED module substrate configured by connecting n (≧ 2) unit substrates for mounting LEDs,
Each of the n unit substrates includes at least one pair of power supply electrodes for supplying power and power supplied to the at least one pair of power supply electrodes to the LED mounted on the unit substrate. A wiring pattern for delivery is formed,
The LED module substrate cut portion when the LED module substrate is divided into the n unit substrates is not formed with a wiring pattern across the cut portion,
Of the n unit substrates, jumper electrodes for connecting jumpers straddling the cutting points for separating the two unit substrates are formed on each of the two unit substrates arranged adjacent to each other, The LED module substrate, wherein the jumper electrode and the wiring pattern formed on the unit substrate are connected. The n unit substrates are arranged in a first direction,
2. The LED module according to claim 1, wherein each of the n unit substrates has the jumper electrode formed in two side edge regions located at both ends in a second direction orthogonal to the first direction. substrate. Further, when a group composed of m (≦ n) unit substrates continuous in the arrangement of the n unit substrates is used as a group substrate, m units constituting the group substrate for each group substrate. The LED module substrate according to claim 2, wherein a jumper for connecting the corresponding jumper electrode formed on the substrate is provided. Further, each of the n unit substrates is provided with at least one of a hole and a notch for guiding a protrusion provided on a lens that covers an LED mounted on the unit substrate. The board | substrate for LED modules of any one of -3. In each of the n unit substrates, the wiring pattern is separated into a first wiring pattern and a second wiring pattern,
5. The LED module according to claim 1, wherein the first wiring pattern and the second wiring pattern are formed with a plurality of resistance jumper electrodes for mutual connection with a resistance jumper. Substrate. Each of the n unit substrates is formed with a heat dissipation pattern which is a metal foil pattern for dissipating heat from the LEDs mounted on the unit substrate.
The LED module substrate according to claim 1, wherein the heat dissipation pattern is formed at least on the unit substrate and directly below the LED.

Images