JP2015103988A - Surface mounted crystal oscillator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To allow an automatic image recognition device to easily perform discrimination of a position of a specific external terminal provided on an outer bottom of a container body of a surface mounted crystal oscillator or accurate positioning of an IC chip packaged on an inner bottom face of a recess of the container body.SOLUTION: In a surface mounted crystal oscillator, a crystal piece 3 is packaged in one recess of a container body 1 that has an H-shaped cross section and is formed rectangular in a planar view, an IC chip 2 is packaged in another recess, and an external terminal 6 is provided on an outer bottom face 1e of the container body 1. A position of a packaged constituent member is discriminated or a constituent member to be packaged is positioned by a reference line part M formed in the container body 1.

Description

  The present invention relates to a surface-mount crystal oscillator, and in particular, the position of a specific external terminal provided on the outer bottom of a container body or the container body with reference to a marking line (reference line portion) formed on the container body. The present invention relates to a surface-mount crystal oscillator that can easily perform accurate positioning of an IC chip mounted in a recess formed on the surface.

  Since the surface-mount oscillator is small and lightweight, it is used as a frequency or time reference source in a portable electronic device represented by a mobile phone, for example. As one of such devices, an IC chip in which an oscillation circuit is integrated is accommodated in one recess of a container body (package) having recesses on both main surfaces, and a crystal piece is mounted on the other recess. There are surface-mount crystal oscillators of a mold cross-section structure type and a junction type in which a mounting substrate having a concave cross-section containing an IC chip is bonded to the bottom surface of a surface-mounted vibrator.

  As shown in FIG. 3A, a conventional surface-mount crystal oscillator, for example, the above-described H-shaped cross-sectional structure type has recesses on both main surfaces of the container body (package) 1, and one recess IC chip 2 and crystal piece 3 are mounted on the other recess.

  The container body 1 is formed of a three-layer laminated ceramic substrate having a bottom plate 1a disposed in a central region where concave portions are formed on both main surfaces thereof, and frame walls 1b and 1c disposed on upper and lower regions (both main surface sides). The IC chip 2 is mounted in one recess as a chip container, and the crystal piece 3 is mounted in the other recess. These components are divided into individual container bodies 1 after laminating ceramic sheets including the base electrode and firing them integrally.

  As shown in FIG. 3C, the inner bottom surface of one recess (IC housing) of the container body 1 is on both sides along the long side direction of the container body 1 having a rectangular shape in plan view. A total of six circuit terminals 4a to 4f, for example, three each, are provided in one four corners and a central region between the four corners. Here, the circuit terminals 4a to 4d provided at the four corners are, for example, a power supply, an output, a ground, and an AFC terminal, and the circuit terminals 4e and 4f provided in the central area are crystal terminals. Of the circuit terminals 4a to 4d provided at the four corners of the container body 1, the three circuit terminals 4a, 4b and 4c have the same shape in plan view, and the remaining one circuit terminal 4d extends therefrom. Different shapes including the wiring path 5 to be performed.

  Further, as shown in FIG. 3 (c), external terminals 6a to 6d as mounting terminals mounted on the set substrate at the customer are provided at the four corners of the opening end face of the one recess formed in the container body 1. Each of the external terminals 6a to 6d is formed in contact with the inner periphery of the short side that becomes the boundary with the inner bottom surface of the container body 1. One external terminal 6a among the external terminals 6a to 6d is different from the other three external terminals 6b to 6d in that the extension 13 serving as a positioning when the crystal oscillator is mounted is provided as the length of the container body 1. Has in the side direction. Here, the external terminals 6a to 6d are formed corresponding to the circuit terminals 4a to 4d at the four corners of the inner bottom surface of the container body 1, respectively. And it electrically connects to the external terminals 6a-6d by the wiring path 5 each extended from the circuit terminals 4a-4d. Here, casters 12 are formed at the four corners of the container body 1, and the side electrodes formed thereon electrically connect the wiring paths 5 extending from the circuit terminals 4 and the external terminals 6. It has become.

  Further, an arcuate cutout portion 7 for injecting the sealing resin 13 is provided on the inner periphery of the central region between the external terminals 6 provided in the long side direction of the opening end surface formed in the container main body 1.

  The IC chip 2 has IC terminals (not shown) at the four corners and the central region of the circuit function surface corresponding to the circuit terminals 4 a to 4 d provided on the inner bottom surface of the container body 1. And it adheres to the circuit terminal 4 by the flip chip bonding using the bump 8 joined on each IC terminal.

  In this case, for example, the image inspection apparatus recognizes the position of at least three circuit terminals 4a, 4b, and 4c indicated by the dotted frame in FIG. Position to match. At this time, one circuit terminal 4d having a different shape among the circuit terminals 4a to 4d serves as a positioning reference, prevents the IC chip 2 from being rotated by 180 degrees, and the IC chip 2 is attached to the container body 1 as prescribed. Mount on the inner bottom.

  Further, the crystal piece 3 has excitation electrodes (not shown) on both main surfaces and extraction electrodes on both ends of one end. And as shown to Fig.3 (a), it adheres to the crystal holding terminal which is not shown in figure of the inner bottom face of the other recessed part of the container main body 1 with the conductive adhesive 10. FIG. The crystal holding terminals are electrically connected to circuit terminals 4e and 4f serving as crystal terminals by a wiring path 5. Then, a metal cover 11 is seam welded to a metal ring (not shown) provided on the other opening end face of the container main body 1 to hermetically enclose the crystal piece 3 in the recess.

  Usually, after the crystal piece 3 is accommodated in the other recess of the container body 1 and hermetically sealed, the IC chip 2 is accommodated in the one recess of the container body 1. Then, a protective resin 13 as an underfill is injected into one or both of the notch portions 7 for resin injection provided on the opening end surface of the container body 1 to protect the circuit function surface of the IC chip 2. Yes.

JP 2009-27469 A

  However, in this type of conventional surface mount crystal oscillator described above, when the crystal oscillator is mounted on the set substrate, the marking formed on the metal cover placed on the container body is hidden and is difficult to recognize by the image inspection apparatus. There was a problem. Further, in the temperature compensated crystal oscillator, the marking is displayed on the electrode surface of the external terminal. However, with the miniaturization, it is extremely difficult to visually recognize the marking. Further, in this type of conventional surface mount crystal oscillator, it has been extremely difficult to prevent the “θ angle deviation” that occurs when the IC chip is mounted on the inner bottom surface of the container body 1.

  In order to solve the above-described problems, a surface-mount crystal oscillator according to the present invention has a crystal piece mounted in one recess of a rectangular container body having an H-shaped cross section and an IC chip mounted in the other recess. An external terminal is provided on the outer bottom surface of the container main body, and the position of the component member to be mounted is determined or positioned by a reference line portion formed on the container main body.

  In the crystal oscillator for surface mounting according to the present invention, the reference line portion formed on the container main body is a convex portion or a concave portion formed on a long side surface or a short side surface of the container main body.

  Furthermore, in the crystal oscillator for surface mounting according to the present invention, the reference line portion formed in the container main body is on the inner bottom surface of the concave portion or the outer bottom surface of the container main body on which the IC chip of the container main body is mounted. It is a linear marking line formed in a normal direction with respect to the center line in the long side direction of the container body.

  Furthermore, in the crystal oscillator for surface mounting according to the present invention, the constituent member is the external terminal provided on the outer bottom surface of the container body, and the reference line portion includes the specific external terminal. It is used for discrimination.

  Furthermore, in the surface-mount crystal oscillator of the present invention, the constituent member is the IC chip, and the reference line portion is the length of the container body of the IC chip mounted in the recess of the container body. It is used to prevent a θ angle shift with respect to the center line in the side direction.

  The automatic image recognition device can easily determine the position of a specific external terminal provided on the outer bottom of the container body of the surface mount crystal oscillator or accurately position the IC chip mounted on the inner bottom surface of the recess of the container body. become.

1 shows an embodiment of a crystal oscillator for surface mounting according to the present invention, FIG. 1 (a) is a front view seen from the long side direction of the container body, and FIG. 1 (b) is a bottom view of the container body. FIG. 1C is a bottom view of the container body and shows an embodiment in which the reference line part is provided on the short side surface of the container body. FIG. 2 (a) shows another embodiment of the surface-mount crystal oscillator according to the present invention. FIG. 2 (a) shows an embodiment in which the reference line portion is provided on the inner bottom surface of the recess for housing the IC chip, and FIG. The Example which provided the reference line part in the outer bottom face of the container main body is shown. FIG. 3A shows a conventional crystal oscillator for surface mounting, FIG. 3A is a longitudinal section in the long side direction of the container body, FIG. 3B is a plan view seen from the top surface of a metal cover (lid), and FIG. (C) It is the bottom view seen from the direction of the outer bottom face of a container main body.

  Embodiments of a surface-mount crystal oscillator according to the present invention will be described below with reference to the accompanying drawings.

  As shown in FIGS. 1 and 2 and FIG. 3 which is a conventional example thereof, one embodiment of the surface-mount crystal oscillator of the present invention has recesses on both main surfaces of a container body (package) 1 of the surface-mount crystal oscillator. The IC chip 2 is mounted in one recess, and the crystal piece 3 is mounted in the other recess.

  Similar to the conventional example, the container body 1 has a three-layer structure including a bottom plate 1a disposed in a central region where concave portions are formed on both principal surfaces thereof and frame walls 1b and 1c disposed on upper and lower regions (both principal surface sides). An IC chip 2 is mounted on one recess as an IC chip container, and a crystal piece 3 is mounted on the other recess.

  As shown in FIG. 1B, the inner bottom surface 1D of one recess (IC chip housing) of the container body 1 is on both sides along the long side direction of the container body 1 having a rectangular shape in plan view, A total of six circuit terminals 4a to 4f, for example, three each, are provided in the four corners of the container body 1 and the central region between the four corners. Here, the circuit terminals 4a to 4d provided at the four corners of the container body 1 are, for example, a power supply, an output, a ground, and an AFC terminal, and the circuit terminals 4e and 4f provided in the central region are crystal terminals. . Of the circuit terminals 4a to 4d provided at the four corners, the three circuit terminals 4a, 4b, and 4c have the same shape in plan view, and the remaining one circuit terminal 4d is a wiring path extending therefrom. 5 and different shapes.

  Further, as shown in FIGS. 1 (a) and 1 (b), external terminals 6a to 6a as mounting terminals fixed to the set substrate at the customer's end are provided at the four corners of the opening end face of the one recess formed in the container body 1. 6d is provided, and each of the external terminals 6a to 6d is formed in contact with the inner circumference of the short side that becomes the boundary with the inner bottom surface of the container body 1. Here, the external terminals 6a to 6d are formed corresponding to the circuit terminals 4a to 4d at the four corners of the inner bottom surface 1d of the container body 1, respectively. And it is electrically connected to external terminal 6a-6d by the wiring path 5 each extended from the circuit terminals 4a-4d.

  The IC chip 2 has IC terminals (not shown) at the four corners and the central region of the circuit function surface corresponding to the circuit terminals 4 a to 4 d provided on the inner bottom surface 1 d of the container body 1. And it adheres to the circuit terminal 4 by the flip chip bonding using the bump 8 joined on each IC terminal.

  In addition, as described above, in the surface-mount crystal oscillator having usually four external terminals shown in FIG. 1B, the external terminal 6a (# 1: Vcont), the external terminal 6b ( # 4: Vcc), external terminal 6c (# 2: GND), and external terminal 6d (# 3: OUTPUT) are provided and fixed to the container body 1 (package) by seam welding as shown in FIG. The metal cover (lid) 11 is marked with a marking M, and it is possible to easily determine that the external terminal located directly below the marking M is the external terminal 6a (# 1: Vcont).

  However, when the crystal oscillator is mounted on the set substrate, the marking M is hidden from the metal cover (lid) 11 and is difficult to be recognized by the image inspection apparatus.

  Further, in the TCXO (temperature compensated crystal oscillator), the marking M is displayed on the electrode surface of the external terminal 6 along with the miniaturization, but it is also very difficult to visually recognize the marking M.

  Therefore, in the surface mount crystal oscillator according to the present invention, as shown in FIGS. 1A and 1B, a protruding portion is provided as a marking line (reference line portion) on the side surface of the long side portion of the container body 1. (Protrusions) 15a or recesses 15b are formed so that the marking M can be completely recognized without being hidden by the metal cover (lid) 11 when being recognized by the image inspection apparatus from above the crystal oscillator.

  Therefore, for example, as shown in FIG. 1B, which is an outer bottom view of the container body 1, it is easily determined that the external terminal 6a on the right side of the recess 15b is an external terminal (# 1: Vcont). it can.

  In addition, as shown in FIG.1 (c), the convex part (projection part) 16a or the recessed part 16b is similarly formed in the side surface of the short side part of the container main body 1, and which external terminal 6 is an external terminal (# 1: Vcont) may be determined.

  Here, the convex part and the concave part as the reference line part described above can be easily formed when the laminated ceramic substrate constituting the container body 1 is fired and laminated and then cut into pieces of the crystal oscillator.

  One of the casters 12 provided at the four corners of the container main body 1 instead of forming a protrusion (protrusion) or a concave portion on the side of the short or long side of the container main body (package) 1. The external terminal (# 1: Vcont) may be discriminated by changing the cutting method (cross section) of the castellation 12 in plan view.

  Further, in another embodiment of the surface mount crystal oscillator of the present invention, when the IC chip 2 is mounted on the inner bottom surface of the container body 1, in order to prevent the “θ angle shift” shown in FIG. Instead of mounting the IC chip 2 by recognizing the positions of the circuit terminals 4a to 4d as in the prior art, a container for mounting the IC chip 2 as shown in FIG. 2 (a) or FIG. 2 (b). Marking lines (reference line portions) 20a and 20b are formed on the inner bottom surface 1d of the main body 1 or the outer bottom surface 1e of the container main body 1 by printing, engraving, etc. in the normal direction (right angle) of the center line in the long side direction of the container main body 1 To do.

  Then, when mounting the IC chip 2 on the inner bottom surface 1e of the container body 1, while confirming the orientation, vertical direction, etc. of the IC chip 2 with reference to these marking lines 20a, 20b by an image recognition device or the like, If the IC chip 2 is mounted, the automatic image recognition device visually corrects the mounting swing of the IC chip 2 on the container body 1 which is not shifted from the center line and is oriented in a predetermined vertical direction. Will be able to judge and recognize.

  In the above description of the embodiment of the crystal oscillator for surface mounting of the present invention, the embodiment in which one external terminal is provided at each of the four corners of the container body has been described. A surface-mount crystal oscillator having three or more external terminals in the direction can also be applied.

1. Container body (package)
2. IC chip3. Crystal piece4. Circuit terminal 5. Wiring path6. External terminal 7. Notch 8 Bump 10. Conductive adhesive 12. Castoration13. Sealing resin 15. Reference line part (convex part, concave part)
15a. Convex part (protruding part)
15b. Recess 20. Reference line (marking line)

Claims (5)

  A crystal oscillator for surface mounting in which a crystal piece is mounted in one recess of a rectangular container body having an H-shaped cross section and an IC chip is mounted in the other recess, and an external terminal is provided on the outer bottom surface of the container body A surface-mount crystal oscillator characterized in that the position of a component to be mounted is determined or positioned by a reference line portion formed on the container body.   The surface mount crystal oscillator according to claim 1, wherein the reference line portion formed on the container body is a convex portion or a concave portion formed on a side surface of a long side or a short side of the container main body.   The reference line portion formed on the container body is located on the inner bottom surface of the recess or the outer bottom surface of the container body on which the IC chip of the container body is mounted with respect to the center line in the long side direction of the container body. The surface-mount crystal oscillator according to claim 1, wherein the surface-mount crystal oscillator is a linear marking line formed in a normal direction.   The said component member is the said external terminal provided in the said outer bottom face of the said container main body, Comprising: The said reference line part is used for discriminating the said specific external terminal in this. 2. A crystal oscillator for surface mounting according to 1.   The component member is the IC chip, and the reference line portion prevents a θ angle shift of the IC chip mounted on the concave portion of the container body with respect to a center line in the long side direction of the container body. The surface-mount crystal oscillator according to claim 1, wherein the surface-mount crystal oscillator is used.