JP2015099878A - Component mounting machine circuit board structure - Google Patents

Component mounting machine circuit board structure Download PDF

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Publication number
JP2015099878A
JP2015099878A JP2013240027A JP2013240027A JP2015099878A JP 2015099878 A JP2015099878 A JP 2015099878A JP 2013240027 A JP2013240027 A JP 2013240027A JP 2013240027 A JP2013240027 A JP 2013240027A JP 2015099878 A JP2015099878 A JP 2015099878A
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Prior art keywords
circuit board
circuit
component mounting
board structure
mounting machine
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JP2013240027A
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JP6448898B2 (en
Inventor
緒方 雄二
Yuji Ogata
雄二 緒方
達也 大村
Tatsuya Omura
達也 大村
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Hanwha Techwin Co Ltd
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Samsung Techwin Co Ltd
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Priority to JP2013240027A priority Critical patent/JP6448898B2/en
Priority to KR1020140002089A priority patent/KR101932203B1/en
Priority to CN201410571649.9A priority patent/CN104661506B/en
Publication of JP2015099878A publication Critical patent/JP2015099878A/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408Incorporating a pick-up tool
    • H05K13/0409Sucking devices
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061Tools for holding the circuit boards during processing; handling transport of printed circuit boards

Abstract

PROBLEM TO BE SOLVED: To miniaturize a component mounting machine circuit board structure having a plurality of circuit boards.SOLUTION: A component mounting machine circuit board structure 50 comprises: a tabular first circuit board 51; a tabular second circuit board disposed at a distance from this first circuit board 51; and a third circuit board 53 disposed to surround the space between the first circuit board 51 and the second circuit board 52, and made of a flexible circuit board electrically connected to the first circuit board 51 and the second circuit board 52.

Description

本発明は、基板に部品を実装するための部品実装機の回路基板構造に関する。   The present invention relates to a circuit board structure of a component mounter for mounting components on a substrate.

一般的に部品実装機は、ノズル等の保持具を有する部品保持ヘッドにより、部品を部品供給部からピックアップし保持して基板上に移送し、基板上の所定位置に実装するように構成されている。   In general, a component mounter is configured to pick up and hold a component from a component supply unit, transfer it onto a substrate, and mount it at a predetermined position on the substrate by a component holding head having a holder such as a nozzle. Yes.

かかる部品保持ヘッドの一つとして、そのヘッド本体に、複数の保持具を有するロータリーヘッドが垂直軸周りに回転可能に取り付けられた、ロータリー式の部品保持ヘッドが知られており、特許文献1には、非接触式のエネルギ・データ伝達手段を備えたロータリー式の部品保持ヘッドが開示されている(段落0034〜段落0036及び図1参照)。   As one of such component holding heads, there is known a rotary type component holding head in which a rotary head having a plurality of holders is attached to the head body so as to be rotatable around a vertical axis. Discloses a rotary type component holding head provided with a non-contact type energy data transmission means (see paragraphs 0034 to 0036 and FIG. 1).

このような部品保持ヘッドは、ヘッド本体からの制御信号を受信してノズル等の動作を制御したり、ヘッド本体との間でデータのやり取りをしたりするために、多数の電子部品を具備しており、これらの電子部品は回路基板に搭載されるのが一般的である。また、回路基板に搭載すべき電子部品は多数に上ることから、回路基板が複数枚必要になることも多い。従来、このように回路基板が複数枚必要である場合は、例えば図5に示すように、回路基板101〜103を上下方向に複数段配置した回路基板構造とするのが一般的であった。   Such a component holding head includes a large number of electronic components in order to receive control signals from the head body and control the operation of nozzles and the like and to exchange data with the head body. In general, these electronic components are mounted on a circuit board. In addition, since there are many electronic components to be mounted on the circuit board, a plurality of circuit boards are often required. Conventionally, when a plurality of circuit boards are required as described above, for example, as shown in FIG. 5, a circuit board structure in which a plurality of circuit boards 101 to 103 are arranged in the vertical direction is generally used.

このような回路基板を上下方向に複数段配置する回路基板構造においては、回路基板101〜103に搭載された電子部品が相互に干渉しないように、回路基板101〜103を上下方向に間隔をおいて配置する必要があり、図5の回路基板構造では、複数の支持バー104及び基板間コネクタ105を用いることによって回路基板101〜103を上下方向に間隔をおいて配置している。しかし、この回路基板構造では、回路基板101〜103のほかに支持バー104が必要であり、回路基板構造の大型化を招く。また、図5のように回路基板101〜103を貫通させて支持バー104を設けた場合、回路基板101〜103に電子部品を搭載できる実効面積(以下、単に「実効面積」という。)が小さくなる。更に、図5の回路基板構造において、回路基板101〜103間は基板間コネクタ105によって連結して電気的に接続する必要があり、この基板間コネクタ105も回路基板101〜103の実効面積を小さくする要因となっている。このように回路基板101〜103の実効面積が小さくなると、必要な実効面積を確保するために回路基板の枚数を増やさざるを得ず、ますます回路基板構造の大型化を招く。   In such a circuit board structure in which a plurality of circuit boards are arranged in the vertical direction, the circuit boards 101 to 103 are spaced apart in the vertical direction so that electronic components mounted on the circuit boards 101 to 103 do not interfere with each other. In the circuit board structure of FIG. 5, the circuit boards 101 to 103 are arranged at intervals in the vertical direction by using a plurality of support bars 104 and inter-board connectors 105. However, this circuit board structure requires the support bar 104 in addition to the circuit boards 101 to 103, leading to an increase in the size of the circuit board structure. Further, when the support bar 104 is provided by penetrating the circuit boards 101 to 103 as shown in FIG. 5, an effective area (hereinafter simply referred to as “effective area”) on which electronic components can be mounted on the circuit boards 101 to 103 is small. Become. Further, in the circuit board structure of FIG. 5, the circuit boards 101 to 103 need to be connected and electrically connected by the board-to-board connector 105. The board-to-board connector 105 also reduces the effective area of the circuit boards 101 to 103. Is a factor. Thus, if the effective area of the circuit boards 101 to 103 is reduced, the number of circuit boards must be increased in order to ensure the necessary effective area, and the circuit board structure is further increased in size.

特表2006−515715号公報JP-T-2006-515715

本発明が解決しようとする課題は、複数枚の回路基板を有する部品実装機の回路基板構造の小型化を図ることにある。   The problem to be solved by the present invention is to reduce the size of the circuit board structure of a component mounter having a plurality of circuit boards.

本発明の一観点によれば、基板に部品を実装するための部品実装機の回路基板構造であって、平板状の第1の回路基板と、この第1の回路基板と間隔をおいて配置された平板状の第2の回路基板と、前記第1の回路基板と前記第2の回路基板との間の空間を取り囲むように配置され、前記第1の回路基板及び前記第2の回路基板に電気的に接続されたフレキシブル回路基板からなる第3の回路基板と、を有する部品実装機の回路基板構造が提供される。   According to one aspect of the present invention, there is provided a circuit board structure of a component mounter for mounting a component on a board, the first circuit board having a flat plate shape, and the first circuit board disposed at a distance from the first circuit board. A flat plate-like second circuit board and a space between the first circuit board and the second circuit board so as to surround the first circuit board and the second circuit board. There is provided a circuit board structure of a component mounting machine having a third circuit board made of a flexible circuit board electrically connected to the circuit board.

本発明においては、前記第1の回路基板及び前記第2の回路基板に、部品実装機の回転部の回転中心軸を挿通可能な貫通孔を形成されている回路基板構造とすることができる。また、前記第1の回路基板及び前記第2の回路基板は平行に配置されるとともに平面視で同一の外郭形状を有し、前記第3の回路基板が前記第1の回路基板及び前記第2の回路基板の外郭に沿うように配置されている回路基板構造とすることもできる。更に、前記第1の回路基板、前記第2の回路基板及び前記第3の回路基板が、1枚のフレキシブル回路基板からなる回路基板構造とすることもできる。   In this invention, it can be set as the circuit board structure by which the through-hole which can penetrate the rotation center axis | shaft of the rotation part of a component mounting machine is formed in the said 1st circuit board and the said 2nd circuit board. The first circuit board and the second circuit board are arranged in parallel and have the same outline shape in plan view, and the third circuit board is the first circuit board and the second circuit board. A circuit board structure arranged along the outline of the circuit board can also be used. Furthermore, the first circuit board, the second circuit board, and the third circuit board may have a circuit board structure including a single flexible circuit board.

本発明では、平板状の第1の回路基板と第2の回路基板との間の空間を取り囲むようにフレキシブル回路基板からなる第3の回路基板を配置することで、第1の回路基板と第2の回路基板との間の空間を第3の回路基板の配置スペースとして有効利用している。これにより、相互に間隔をおいて配置する平板状の回路基板の枚数を減らすことができ、回路基板構造の小型化を図ることができる。例えば図5の回路基板構造では平板状の回路基板を3枚使用しているが、本発明によれば、そのうち1枚をフレキシブル回路基板からなる第3の回路基板とすることで、平板状の回路基板は2枚に減らすことができ、特に上下方向の寸法において回路基板構造を小型化することができる。   In the present invention, the first circuit board and the first circuit board are arranged by arranging the third circuit board made of the flexible circuit board so as to surround the space between the flat first circuit board and the second circuit board. The space between the two circuit boards is effectively used as the arrangement space for the third circuit board. Thereby, the number of flat circuit boards arranged at intervals can be reduced, and the circuit board structure can be reduced in size. For example, in the circuit board structure of FIG. 5, three flat circuit boards are used, but according to the present invention, one of them is a third circuit board made of a flexible circuit board. The number of circuit boards can be reduced to two, and the circuit board structure can be miniaturized especially in the vertical dimension.

本発明に係る回路基板構造を適用した部品実装機の部品保持ヘッドの構成を概念的に示す図である。It is a figure which shows notionally the structure of the component holding head of the component mounting machine to which the circuit board structure based on this invention is applied. 図1で使用した回路基板構造の構成を示し、(a)はその斜視図、(b)は展開図である。The structure of the circuit board structure used in FIG. 1 is shown, (a) is its perspective view, and (b) is a developed view. 本発明に係る回路基板構造の他の実施例を示す展開図である。It is an expanded view which shows the other Example of the circuit board structure based on this invention. 本発明に係る回路基板構造の更に他の実施例を示す正面図である。It is a front view which shows other Example of the circuit board structure which concerns on this invention. 従来の部品実装機の回路基板構造の構成を概念的に示す図である。It is a figure which shows notionally the structure of the circuit board structure of the conventional component mounting machine.

以下、本発明に係る回路基板構造を部品実装機の部品保持ヘッドに適用した実施例に基づき本発明の実施の形態を説明する。図1は、その部品実装機の部品保持ヘッドの構成を概念的に示す図である。   Hereinafter, an embodiment of the present invention will be described based on an example in which a circuit board structure according to the present invention is applied to a component holding head of a component mounter. FIG. 1 is a diagram conceptually showing the configuration of a component holding head of the component mounter.

図1に示す部品保持ヘッドは、部品実装機において部品供給部から電子部品をピックアップし保持してプリント基板上に移送し、プリント基板上の所定位置に実装する。この部品保持ヘッドは、固定配置されたヘッド本体10と、このヘッド本体10に対して垂直軸20周りに回転可能に取り付けられたロータリーヘッド30と、ヘッド本体10とロータリーヘッド30との間に配置された非接触伝送装置40と、ロータリーヘッド30側に配置された回路基板構造50とを備える。   The component holding head shown in FIG. 1 picks up and holds an electronic component from a component supply unit in a component mounting machine, transfers it to the printed circuit board, and mounts it on a predetermined position on the printed circuit board. The component holding head is disposed between the head main body 10 that is fixedly arranged, the rotary head 30 that is rotatably attached to the head main body 10 around the vertical axis 20, and the head main body 10 and the rotary head 30. And the circuit board structure 50 disposed on the rotary head 30 side.

ヘッド本体10は、ロータリーヘッド30を回転させるサーボモータ11及びロータリーヘッド30に配置されているノズル31の昇降を制御するサーボモータ12を内蔵している。また、図1では省略しているが、ヘッド本体10は、サーボモータ11、12やロータリーヘッド30の回転動作を制御するメインコントローラも内蔵している。   The head main body 10 includes a servo motor 11 that rotates the rotary head 30 and a servo motor 12 that controls the raising and lowering of the nozzles 31 arranged in the rotary head 30. Although omitted in FIG. 1, the head main body 10 also incorporates a main controller that controls the rotation operations of the servo motors 11 and 12 and the rotary head 30.

ロータリーヘッド30は外形が略円柱状のバレル形状を有し、その中心を垂直軸20が貫通している。サーボモータ11の回転によりロータリーヘッド30は、ヘッド本体10に対して垂直軸20周りのR方向に回転する。また、ロータリーヘッド30には、電子部品を保持する保持具としてのノズル31が、周方向に沿って複数配置されている。各ノズル31は、ロータリーヘッド30に内蔵されたサーボモータ等からなるアクチュエータ(図示省略)により、それぞれ軸線周りのT方向に回転可能であり、サーボモータ12により軸線方向に沿ったZ方向に移動可能に装着されている。   The rotary head 30 has a barrel shape whose outer shape is substantially cylindrical, and the vertical shaft 20 passes through the center thereof. The rotation of the servo motor 11 causes the rotary head 30 to rotate in the R direction around the vertical axis 20 with respect to the head body 10. The rotary head 30 is provided with a plurality of nozzles 31 as holders for holding electronic components along the circumferential direction. Each nozzle 31 can be rotated in the T direction around the axis by an actuator (not shown) made of a servo motor or the like built in the rotary head 30, and can be moved in the Z direction along the axis by the servo motor 12. It is attached to.

非接触伝送装置40は、第1コア41及び第2コア42と、電力伝送のためのコイルとして第1コイル43及び第2コイル44と、信号伝送のためのコイルとして第3コイル45及び第4コイル46とを備えている。第1コア41はヘッド本体10側に一体的に配置され、第2コア42はロータリーヘッド30側に一体的に配置されている。第1コア41及び第2コア42は同一の形状を有し、上下対称となるように一定のギャップGを持って対向配置されている。   The non-contact transmission device 40 includes a first core 41 and a second core 42, a first coil 43 and a second coil 44 as coils for power transmission, and a third coil 45 and a fourth coil as coils for signal transmission. And a coil 46. The first core 41 is integrally disposed on the head body 10 side, and the second core 42 is integrally disposed on the rotary head 30 side. The first core 41 and the second core 42 have the same shape and are opposed to each other with a certain gap G so as to be vertically symmetrical.

このような構成において非接触伝送装置40は、第1コイル43と第2コイル44との間の電磁誘導により、ヘッド本体10からロータリーヘッド30に非接触式で電力を伝送し、また、第3コイル45と第4コイル46との間の電磁誘導により、ヘッド本体10とロータリーヘッド30との間で電磁誘導により非接触式で信号を伝送する。なお、非接触式で電力及び信号を伝送する方式としては電磁誘導方式のほかに電界誘導方式を採用することもできる。   In such a configuration, the non-contact transmission device 40 transmits electric power from the head body 10 to the rotary head 30 in a non-contact manner by electromagnetic induction between the first coil 43 and the second coil 44, and the third By electromagnetic induction between the coil 45 and the fourth coil 46, a signal is transmitted between the head body 10 and the rotary head 30 in a non-contact manner by electromagnetic induction. In addition to the electromagnetic induction method, an electric field induction method can be adopted as a method for transmitting power and signals in a non-contact manner.

次に、回路基板構造50の構成を説明する。図2は図1で使用した回路基板構造50の構成を示し、(a)はその斜視図、(b)は展開図である。   Next, the configuration of the circuit board structure 50 will be described. 2 shows the configuration of the circuit board structure 50 used in FIG. 1, wherein (a) is a perspective view and (b) is a developed view.

回路基板構造50は、第1の回路基板51、第2の回路基板52及び第3の回路基板53を有する。   The circuit board structure 50 includes a first circuit board 51, a second circuit board 52, and a third circuit board 53.

第1の回路基板51及び第2の回路基板52はいずれも平板状であり、例えばガラスエポキシ基板からなる。本実施例では、第1の回路基板51及び第2の回路基板52は平面視で同一の外郭形状(円形)を有し、上下方向に間隔をおいて平行に配置されている。また、第1の回路基板51及び第2の回路基板52には、図1で説明したロータリーヘッド30の回転中心軸としての垂直軸20を挿通可能な円形の貫通孔51a,52aが形成されている。貫通孔51a,52aの中心は垂直軸20の中心軸線上に位置し、直径は垂直軸20の直径より若干大きい。これらの貫通孔51a,52aに垂直軸20を挿通させることで、回路基板構造50はロータリーヘッド52とともに垂直軸20周りに回転可能となる。   The first circuit board 51 and the second circuit board 52 are both flat and are made of, for example, a glass epoxy board. In the present embodiment, the first circuit board 51 and the second circuit board 52 have the same outer shape (circular shape) in plan view, and are arranged in parallel in the vertical direction. The first circuit board 51 and the second circuit board 52 are formed with circular through holes 51a and 52a through which the vertical shaft 20 as the rotation center axis of the rotary head 30 described in FIG. Yes. The centers of the through holes 51 a and 52 a are located on the central axis of the vertical shaft 20, and the diameter is slightly larger than the diameter of the vertical shaft 20. By inserting the vertical shaft 20 into the through holes 51 a and 52 a, the circuit board structure 50 can rotate around the vertical shaft 20 together with the rotary head 52.

第3の回路基板53はフレキシブル回路基板(以下「FPC」という。)からなり、第1の回路基板51と第2の回路基板52との間の空間を取り囲むように配置される。本実施例では、第1の回路基板51及び第2の回路基板52は、上述のとおり平行に配置されるとともに平面視で同一の外郭形状(円形)を有しているので、第3の回路基板53は、第1の回路基板51及び第2の回路基板52の外郭に沿うように円筒状に配置されている。この第3の回路基板53は第1の回路基板51及び第2の回路基板52に電気的に接続される。本実施例では、第3の回路基板53の一端が基板間コネクタ54aを介して第1の回路基板51に電気的に接続され、第3の回路基板53の他端が基板間コネクタ54bを介して第2の回路基板52に電気的に接続されている。なお、FPCからなる第3の回路基板53を保護するために、第3の回路基板53を囲むように樹脂ケースを設けることもできる。   The third circuit board 53 is formed of a flexible circuit board (hereinafter referred to as “FPC”), and is disposed so as to surround the space between the first circuit board 51 and the second circuit board 52. In the present embodiment, the first circuit board 51 and the second circuit board 52 are arranged in parallel as described above and have the same outer shape (circular shape) in plan view, so that the third circuit The substrate 53 is arranged in a cylindrical shape so as to follow the outline of the first circuit substrate 51 and the second circuit substrate 52. The third circuit board 53 is electrically connected to the first circuit board 51 and the second circuit board 52. In this embodiment, one end of the third circuit board 53 is electrically connected to the first circuit board 51 through the inter-board connector 54a, and the other end of the third circuit board 53 is connected through the inter-board connector 54b. And electrically connected to the second circuit board 52. In order to protect the third circuit board 53 made of FPC, a resin case can be provided so as to surround the third circuit board 53.

以上のように、回路基板構造50においては、第1の回路基板51と第2の回路基板52との間の空間を取り囲むように第3の回路基板53を配置することで、第1の回路基板51と第2の回路基板52との間の空間を第3の回路基板31の配置スペースとして有効利用している。これにより、平板状の回路基板を3枚使用している図5の回路基板構造と同等の実効面積を得ることができ、図5の回路基板構造に比べ、特に上下方向の寸法において回路基板構造を小型化することができる。なお、第1の回路基板51及び第2の回路基板52は平板状であるので、大きい電子部品はこれらの平板状の回路基板に搭載し、第3の回路基板32には比較的小さい電子部品を搭載するようにすれば、全ての電子部品を問題なく搭載することができる。   As described above, in the circuit board structure 50, the third circuit board 53 is disposed so as to surround the space between the first circuit board 51 and the second circuit board 52, whereby the first circuit The space between the board 51 and the second circuit board 52 is effectively used as the arrangement space for the third circuit board 31. As a result, an effective area equivalent to that of the circuit board structure of FIG. 5 using three flat circuit boards can be obtained, and the circuit board structure has a particularly vertical dimension as compared with the circuit board structure of FIG. Can be miniaturized. Since the first circuit board 51 and the second circuit board 52 are flat, large electronic components are mounted on these flat circuit boards, and the third circuit board 32 has relatively small electronic components. If all the electronic components are mounted, the electronic components can be mounted without any problem.

図3は、本発明に係る回路基板構造の他の実施例を示す展開図である。すなわち、図3は、図2(b)と同様に回路基板構造を展開した状態を示す。   FIG. 3 is a development view showing another embodiment of the circuit board structure according to the present invention. That is, FIG. 3 shows a state in which the circuit board structure is developed as in FIG.

図2の回路基板構造50では、第1の回路基板51及び第2の回路基板52と第3の回路基板53とを基板間コネクタ54a,54bによって電気的に接続したが、図3の回路基板構造60では基板間コネクタをなくすために、第1の回路基板61、第2の回路基板62及び第3の回路基板63を1枚の連続したFPCによって構成し、これを折り込むことにより回路基板構造を形成するようにしている。すなわち、第1の回路基板61及び第2の回路基板62を第3の回路基板63に対して直角に折り返すとともに第3の回路基板63を円筒状に折り曲げることで、図2(a)と同じ形状の回路基板構造60を得ることができる。   In the circuit board structure 50 of FIG. 2, the first circuit board 51, the second circuit board 52, and the third circuit board 53 are electrically connected by the inter-board connectors 54a and 54b. In the structure 60, in order to eliminate the board-to-board connector, the first circuit board 61, the second circuit board 62, and the third circuit board 63 are constituted by one continuous FPC, and the circuit board structure is formed by folding this. To form. That is, the first circuit board 61 and the second circuit board 62 are folded at a right angle with respect to the third circuit board 63, and the third circuit board 63 is folded into a cylindrical shape, which is the same as FIG. A circuit board structure 60 having a shape can be obtained.

このように図3の回路基板構造60では、回路基板間を電気的に接続するための基板間コネクタが不要であるので、図2の回路基板構造50において基板間コネクタ54a,54bが占めていた領域にも電子部品を搭載でき、結果として回路基板構造をより小型化することができる。   As described above, in the circuit board structure 60 of FIG. 3, the board-to-board connectors for electrically connecting the circuit boards are unnecessary, and therefore, the board-to-board connectors 54a and 54b are occupied in the circuit board structure 50 of FIG. Electronic components can also be mounted in the area, and as a result, the circuit board structure can be further miniaturized.

図4は、本発明に係る回路基板構造の更に他の実施例を示す正面図である。図2の回路基板構造50では第1の回路基板51及び第2の回路基板51は平面視で同一の外郭形状を有していたが、本発明はこれに限定されるものではない。   FIG. 4 is a front view showing still another embodiment of the circuit board structure according to the present invention. In the circuit board structure 50 of FIG. 2, the first circuit board 51 and the second circuit board 51 have the same outer shape in plan view, but the present invention is not limited to this.

図4(a)の回路基板構造70は、第1の回路基板71よりも第2の回路基板72が小さく、FPCからなる第3の回路基板73を第2の回路基板72の外郭に沿って円筒状に配置した例である。また、図4(b)の回路基板構造80は、第1の回路基板81よりも第2の回路基板82が大きく、FPCからなる第3の回路基板83を第1の回路基板81及び第2の回路基板82の外郭に沿って逆円錐台状に配置した例である。ただし、回路基板構造の製作のしやすさ、安定性等を考慮すると、図2のような形状の回路基板構造とすることが好ましい。なお、図4(a),(b)においては回路基板間を電気的に接続するための基板間コネクタは省略して示している。   In the circuit board structure 70 of FIG. 4A, the second circuit board 72 is smaller than the first circuit board 71, and the third circuit board 73 made of FPC extends along the outline of the second circuit board 72. This is an example of a cylindrical arrangement. 4B is larger in the second circuit board 82 than the first circuit board 81, and the third circuit board 83 made of FPC is replaced with the first circuit board 81 and the second circuit board 82. This is an example in which the circuit board 82 is arranged in an inverted truncated cone shape along the outline of the circuit board 82. However, considering the ease of manufacturing the circuit board structure, stability, etc., it is preferable to use a circuit board structure having a shape as shown in FIG. In FIGS. 4A and 4B, an inter-board connector for electrically connecting circuit boards is omitted.

10 ヘッド本体
11,12 サーボモータ
20 垂直軸
30 ロータリーヘッド
31 ノズル(保持具)
40 非接触伝送装置
41 第1コア
42 第2コア
43 第1コイル
44 第2コイル
45 第3コイル
46 第4コイル
50,60,70,80 回路基板構造
51,61,71,81 第1の回路基板
52,62,72,82 第2の回路基板
53,63,73,83 第3の回路基板
54a,54b 基板間コネクタ
10 Head body 11, 12 Servo motor 20 Vertical axis 30 Rotary head 31 Nozzle (holder)
40 Non-contact transmission device 41 1st core 42 2nd core 43 1st coil 44 2nd coil 45 3rd coil 46 4th coil 50, 60, 70, 80 Circuit board structure 51, 61, 71, 81 1st circuit Boards 52, 62, 72, 82 Second circuit boards 53, 63, 73, 83 Third circuit boards 54a, 54b Inter-board connectors

Claims (4)

基板に部品を実装するための部品実装機の回路基板構造であって、
平板状の第1の回路基板と、
この第1の回路基板と間隔をおいて配置された平板状の第2の回路基板と、
前記第1の回路基板と前記第2の回路基板との間の空間を取り囲むように配置され、前記第1の回路基板及び前記第2の回路基板に電気的に接続されたフレキシブル回路基板からなる第3の回路基板と、
を有する部品実装機の回路基板構造。
A circuit board structure of a component mounting machine for mounting components on a board,
A flat first circuit board;
A flat plate-like second circuit board spaced from the first circuit board;
The flexible circuit board is disposed so as to surround a space between the first circuit board and the second circuit board, and is electrically connected to the first circuit board and the second circuit board. A third circuit board;
The circuit board structure of the component mounting machine which has this.
前記第1の回路基板及び前記第2の回路基板に、部品実装機の回転部の回転中心軸を挿通可能な貫通孔が形成されている、請求項1に記載の部品実装機の回路基板構造。   The circuit board structure of a component mounting machine according to claim 1, wherein a through-hole through which a rotation center axis of a rotating part of the component mounting machine can be inserted is formed in the first circuit board and the second circuit board. . 前記第1の回路基板及び前記第2の回路基板は平行に配置されるとともに平面視で同一の外郭形状を有し、前記第3の回路基板が前記第1の回路基板及び前記第2の回路基板の外郭に沿うように配置されている、請求項1又は2に記載の部品実装機の回路基板構造。   The first circuit board and the second circuit board are arranged in parallel and have the same outline shape in plan view, and the third circuit board is the first circuit board and the second circuit. The circuit board structure of the component mounting machine according to claim 1, wherein the circuit board structure is arranged along an outline of the board. 前記第1の回路基板、前記第2の回路基板及び前記第3の回路基板が、1枚のフレキシブル回路基板からなる、請求項1から3のいずれかに記載の部品実装機の回路基板構造。   The circuit board structure of the component mounting machine according to any one of claims 1 to 3, wherein the first circuit board, the second circuit board, and the third circuit board are formed of a single flexible circuit board.
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CN201410571649.9A CN104661506B (en) 2013-11-20 2014-10-23 The board structure of circuit of component placement machine

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JPS56167575U (en) * 1980-05-12 1981-12-11
JPS5972757U (en) * 1982-11-08 1984-05-17 松下電器産業株式会社 printed wiring board
JP2001156407A (en) * 1999-11-25 2001-06-08 Natl Inst Of Advanced Industrial Science & Technology Meti Zigzag three-dimensional structure circuit device
JP2002353571A (en) * 2001-05-29 2002-12-06 Denso Corp Structure for wiring board
JP2004134695A (en) * 2002-10-15 2004-04-30 Victor Co Of Japan Ltd Mounted printed wiring board and motor equipped therewith
JP2005197493A (en) * 2004-01-08 2005-07-21 Ihi Aerospace Co Ltd Circuit board assembly
JP2006515715A (en) * 2003-01-24 2006-06-01 シーメンス アクチエンゲゼルシヤフト Multi mounting head
JP2008091684A (en) * 2006-10-03 2008-04-17 Yamaha Motor Co Ltd Servo amplifier and surface mounting machine
JP2009123895A (en) * 2007-11-14 2009-06-04 Yamaha Motor Co Ltd Device for inspecting characteristics of feeder, surface mounting machine and truck

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56167575U (en) * 1980-05-12 1981-12-11
JPS5972757U (en) * 1982-11-08 1984-05-17 松下電器産業株式会社 printed wiring board
JP2001156407A (en) * 1999-11-25 2001-06-08 Natl Inst Of Advanced Industrial Science & Technology Meti Zigzag three-dimensional structure circuit device
JP2002353571A (en) * 2001-05-29 2002-12-06 Denso Corp Structure for wiring board
JP2004134695A (en) * 2002-10-15 2004-04-30 Victor Co Of Japan Ltd Mounted printed wiring board and motor equipped therewith
JP2006515715A (en) * 2003-01-24 2006-06-01 シーメンス アクチエンゲゼルシヤフト Multi mounting head
JP2005197493A (en) * 2004-01-08 2005-07-21 Ihi Aerospace Co Ltd Circuit board assembly
JP2008091684A (en) * 2006-10-03 2008-04-17 Yamaha Motor Co Ltd Servo amplifier and surface mounting machine
JP2009123895A (en) * 2007-11-14 2009-06-04 Yamaha Motor Co Ltd Device for inspecting characteristics of feeder, surface mounting machine and truck

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