JP2015099753A - Led light bulb - Google Patents

Led light bulb Download PDF

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JP2015099753A
JP2015099753A JP2013240216A JP2013240216A JP2015099753A JP 2015099753 A JP2015099753 A JP 2015099753A JP 2013240216 A JP2013240216 A JP 2013240216A JP 2013240216 A JP2013240216 A JP 2013240216A JP 2015099753 A JP2015099753 A JP 2015099753A
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led
translucent substrate
light
substrate
led bulb
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慶典 呉
Yoshinori Go
慶典 呉
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Stanley Electric Co Ltd
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Stanley Electric Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide an LED light bulb capable of acquiring light distribution characteristic the same as that of an incandescent lamp by radiating light evenly in all directions without involving restraint on a mounting direction, and capable of preventing deterioration of a light amount and durability life of an LED by enhancing heat radiation properties.SOLUTION: An LED light bulb 1 is configured in which: LEDs 5 are mounted on a center part of a translucent substrate 4 in which a circuit pattern 8 is formed and circuit components 6 are mounted on both end parts respectively; heat sinks 7 for covering the circuit components 6 are arranged at both end parts of the translucent substrate 4 respectively; a base 2 is attached to each heat sink 7 respectively; and a cylindrical globe 3 for covering the translucent substrate 4 and the LEDs 5 mounted on it is laid between the bases 2.

Description

本発明は、LED(発光ダイオード)を光源とするヒューズ型のLED電球に関するものである。   The present invention relates to a fuse-type LED bulb using an LED (light emitting diode) as a light source.

例えば、車両のルームランプには、フィラメントが発光するヒューズ型の白熱電球が専ら使用されてきたが、近年、省電力で高輝度、且つ、長寿命であるLEDを光源として用いたLED電球が使用されてきている。   For example, fuse-type incandescent bulbs that emit light from filaments have been used exclusively for vehicle room lamps. In recent years, LED bulbs that use low-power, high-brightness, and long-life LEDs as light sources have been used. Has been.

例えば、特許文献1には、図7に示すようなLED電球101が提案されている。即ち、図7は特許文献1において提案されたLED電球の斜視図であり、図示のLED電球101は、基板104上に複数のLED105を実装し、各LED105からの照射光を本体部分を構成するレンズ部材110によって拡散し、LED105による発熱対策として、レンズ部材110の側壁に放熱孔110aを形成したり、基板104を熱伝導率の高いアルミニウム材で構成している。   For example, Patent Document 1 proposes an LED bulb 101 as shown in FIG. That is, FIG. 7 is a perspective view of the LED bulb proposed in Patent Document 1, and the illustrated LED bulb 101 has a plurality of LEDs 105 mounted on a substrate 104 and constitutes a main body portion with irradiation light from each LED 105. As a countermeasure against heat generated by the LED 105 by being diffused by the lens member 110, a heat radiating hole 110a is formed in the side wall of the lens member 110, or the substrate 104 is made of an aluminum material having high thermal conductivity.

特開2011−230751号公報JP 2011-230751 A

ところで、フィラメントを用いる白熱電球は、極性を有していないために左右の何れを嵌め込んでも点灯するが、LED電球において極性を無くすには、必要な回路部品の点数が多くなり、基板のLEDの実装面上に多くの回路部品を配置すると、発光部の面積が小さくなってしまう。この問題を解決するために回路部品を基板の発光面とは反対側の裏面に配置する構成を採用すると、回路部品からの熱伝導経路が長くなって放熱性が悪くなるという問題が発生する。   By the way, an incandescent bulb using a filament does not have polarity, so it can be lit regardless of whether the right or left is fitted. However, in order to eliminate polarity in an LED bulb, the number of necessary circuit components increases, and the LED on the board When many circuit components are arranged on the mounting surface, the area of the light emitting portion is reduced. In order to solve this problem, if a configuration in which the circuit component is disposed on the back surface opposite to the light emitting surface of the substrate is employed, there arises a problem that the heat conduction path from the circuit component becomes long and the heat dissipation performance is deteriorated.

又、特許文献1において提案されたLED電球101のように、基板104に不透光性のものを使用すると、裏面側の配光が得られず、白熱電球とは異なる指向性の強い発光となってしまう。そして、極性の無いLED電球とした場合には、左右の何れを嵌め込んでも点灯するが、発光させたい方向にLEDの光出射方向が向くようにLED電球を取り付ける必要があり、LED電球の取り付けに制約を伴うという問題もある。   In addition, when a non-transparent substrate 104 is used as in the LED bulb 101 proposed in Patent Document 1, light distribution on the back side cannot be obtained, and light emission with strong directivity different from that of an incandescent bulb is obtained. turn into. And when it is set as a non-polar LED bulb, it lights up regardless of which of the left and right sides is fitted, but it is necessary to attach the LED bulb so that the light emission direction of the LED is directed to the direction of light emission. There is also a problem that involves restrictions.

本発明は上記問題に鑑みてなされたもので、その目的とする処は、取付方向に制約を伴うことなく、全方位に均一に光を照射して白熱電球と同等の配光特性を得ることができるとともに、放熱性を高めてLEDの光量と耐久寿命の低下を防ぐことができるLED電球を提供することにある。   The present invention has been made in view of the above problems, and the intended process is to obtain light distribution characteristics equivalent to an incandescent bulb by irradiating light uniformly in all directions without any restrictions on the mounting direction. It is possible to provide an LED light bulb that can increase heat dissipation and prevent a reduction in the light amount and durability of the LED.

上記目的を達成するため、請求項1記載の発明に係るLED電球は、回路パターンが形成された透光性基板の中央部にLEDを、両端部に回路部品をそれぞれ実装し、前記回路部品を覆うヒートシンクを前記導光性基板の両端部にそれぞれ配置し、各ヒートシンクに口金をそれぞれ被着し、前記透光性基板とこれに実装された前記LEDを覆う筒状のグローブを前記口金間に架設して構成されることを特徴とする。   In order to achieve the above object, an LED bulb according to the first aspect of the present invention includes an LED mounted on a central portion of a light-transmitting substrate on which a circuit pattern is formed, and circuit components mounted on both ends. Covering heat sinks are disposed at both ends of the light guide substrate, and bases are respectively attached to the heat sinks, and a cylindrical glove covering the translucent substrate and the LEDs mounted thereon is interposed between the bases. It is constructed by erection.

請求項2記載の発明は、請求項1記載の発明において、前記透光性基板にキャビディを形成し、該キャビティ内に前記LEDを直接実装したことを特徴とする。   According to a second aspect of the present invention, in the first aspect of the present invention, cavities are formed on the light-transmitting substrate, and the LEDs are directly mounted in the cavities.

請求項3記載の発明は、請求項1又は2記載の発明において、LED電球を車載用のルームランプとして使用することを特徴とする。   The invention described in claim 3 is characterized in that, in the invention described in claim 1 or 2, the LED bulb is used as a vehicle-mounted room lamp.

請求項1記載の発明によれば、透光性基板にLEDを実装したため、該LEDからの光は透光性基板を透過して全方位に向けて出射し、全方位に均一に光を照射することができ、白熱電球と同等の配光特性が得られる。そして、回路部品を透光性基板の両端部に振り分けて配置したため、大きな発光面積を確保して幅広の発光領域を得ることができる。   According to the first aspect of the present invention, since the LED is mounted on the translucent substrate, the light from the LED is transmitted through the translucent substrate and emitted in all directions, and the light is irradiated uniformly in all directions. Light distribution characteristics equivalent to incandescent bulbs can be obtained. Since the circuit components are arranged and arranged on both ends of the translucent substrate, a large light emitting area can be secured and a wide light emitting region can be obtained.

又、極性を無くすための回路部品を透光性基板の両端部に振り分けて配置し、ヒートシンクを各回路基板を覆うように配置したため、回路部品が発生する熱のヒートシンクへの伝導経路が短縮され、ヒートシンクへと効率良く熱が伝導し、ヒートシンクへと伝導した熱は口金から周囲に放熱される。そして、LEDが発生する熱は、透光性基板からヒートシンクを経て口金へと伝導して口金から周囲に放熱されるため、LEDが効率良く冷却されてその温度上昇が低く抑えられ、該LEDの光量と耐久寿命の低下が防がれる。   In addition, circuit components for eliminating the polarity are arranged on both ends of the translucent board, and the heat sink is arranged so as to cover each circuit board, so the conduction path of the heat generated by the circuit parts to the heat sink is shortened. The heat is efficiently conducted to the heat sink, and the heat conducted to the heat sink is dissipated from the base to the surroundings. The heat generated by the LED is conducted from the translucent substrate through the heat sink to the base and dissipated from the base to the surroundings, so that the LED is efficiently cooled and its temperature rise is kept low. Decrease in light intensity and durability is prevented.

更に、前述のようにLED電球からは全方位に均一に光が照射されるため、当該LED電球は、その取付方向に制約を受けず、何れの方向にも取り付けることができるために取付性が高められる。   Furthermore, as described above, since light is emitted uniformly from all directions from the LED bulb, the LED bulb is not restricted in its mounting direction and can be mounted in any direction, so that the mounting performance is good. Enhanced.

請求項2記載の発明によれば、透光性基板に形成されたキャビディ内にLEDを直接実装したため、LEDが発生する熱が透光性基板へと直接伝導し、最終的には口金から周囲へと効果的に放熱され、LEDの温度上昇が一層効果的の抑えられてその発光効率と耐久寿命が高められる。   According to the second aspect of the present invention, since the LED is directly mounted in the cavity formed on the translucent substrate, the heat generated by the LED is directly conducted to the translucent substrate, and finally from the base to the surroundings. The heat is effectively dissipated and the temperature rise of the LED is suppressed more effectively, and the luminous efficiency and the durability life are increased.

請求項3記載の発明によれば、本発明に係るLED電球を車載用のルームランプとして使用して、必要な光量を確保することができる。   According to the third aspect of the present invention, the necessary amount of light can be ensured by using the LED bulb according to the present invention as a vehicle-mounted room lamp.

本発明に係るLED電球の側面図である。It is a side view of the LED bulb which concerns on this invention. 本発明に係るLED電球のLEDと回路部品が実装された透光性基板の正面図である。It is a front view of the translucent board | substrate with which LED of LED bulb concerning this invention and circuit components were mounted. 本発明に係るLED電球の透光性基板の長手方向両端をヒートシンクに嵌め込んで固定した状態を示す正面図である。It is a front view which shows the state which fitted and fixed the longitudinal direction both ends of the translucent board | substrate of the LED bulb which concerns on this invention to the heat sink. 本発明に係るLED電球の透光性基板の長手方向両端をヒートシンクに嵌め込んで固定した状態を示す斜視図である。It is a perspective view which shows the state which fitted and fixed the longitudinal direction both ends of the translucent board | substrate of the LED bulb which concerns on this invention to the heat sink. 本発明に係るLED電球のグローブを取り外した状態を示す側面図である。It is a side view which shows the state which removed the glove | globe of the LED bulb which concerns on this invention. 図5のA−A線断面図である。It is the sectional view on the AA line of FIG. 特許文献1において提案されたLED電球の斜視図である。It is a perspective view of the LED bulb proposed in patent document 1.

以下に本発明の実施の形態を添付図面に基づいて説明する。   Embodiments of the present invention will be described below with reference to the accompanying drawings.

図1は本発明に係るLED電球の側面図、図2は同LED電球のLEDと回路部品が実装された透光性基板の正面図、図3はLED電球の透光性基板の長手方向両端をヒートシンクに嵌め込んで固定した状態を示す正面図、図4は同斜視図、図5は同LED電球のグローブを取り外した状態を示す側面図、図6は図5のA−A線断面図である。   FIG. 1 is a side view of an LED bulb according to the present invention, FIG. 2 is a front view of a translucent substrate on which the LED and circuit components of the LED bulb are mounted, and FIG. 3 is both longitudinal ends of the translucent substrate of the LED bulb. FIG. 4 is a perspective view, FIG. 5 is a side view showing a state in which the globe of the LED bulb is removed, and FIG. 6 is a cross-sectional view taken along line AA in FIG. It is.

本発明に係るLED電球1は、図1に示すように、有底筒状の金属製の左右一対の口金2と両口金2部間に架設された円筒状のグローブ3によって形成される密閉空間内に、図2に示す矩形平板状の透光性基板4、該透光性基板4に直接実装された6つのLED5、同透光性基板4の左右両端部に振り分けて配置された複数の回路部品6、透光性基板4の左右両端部に前記回路基板4を覆うように配置された一対のヒートシンク(図3及び図4参照)等を収容して構成されている。   As shown in FIG. 1, an LED bulb 1 according to the present invention is a sealed space formed by a pair of left and right metal caps 2 having a bottomed cylindrical shape and a cylindrical globe 3 installed between two cap portions. 2, a rectangular flat plate-like light-transmitting substrate 4 shown in FIG. 2, six LEDs 5 directly mounted on the light-transmitting substrate 4, and a plurality of the light-transmitting substrates 4 arranged at both right and left ends. The circuit component 6 and the translucent substrate 4 are configured to accommodate a pair of heat sinks (see FIGS. 3 and 4) disposed so as to cover the circuit substrate 4 at both left and right ends.

前記透光性基板4は、透明なガラスやセラミックス、サファイア等によって構成されており、この透光性基板4の一方の面(表面)の中央部分には、図2に示すように円形のキャビティ4aが形成されている。そして、この透光性基板4のキャビティ4a内には、6つの前記LED5が同一円周上に等角度ピッチで配置され、これらのLED5は、ダイボンド等の熱伝導性接着剤等によって透光性基板4の表面に直接接着されている。   The translucent substrate 4 is made of transparent glass, ceramics, sapphire or the like, and a circular cavity is formed at the center of one surface (front surface) of the translucent substrate 4 as shown in FIG. 4a is formed. And in the cavity 4a of this translucent board | substrate 4, six said LED5 is arrange | positioned by equiangular pitch on the same periphery, and these LED5 is translucent by heat conductive adhesives, such as a die bond. It is directly bonded to the surface of the substrate 4.

又、透光性基板4には、Au、Ag、Cu等から成る回路パターン8が形成されており、該回路パターン8には複数の前記回路部品6が電気的に接続され、同回路パターン8の端部には、透光性基板4の左右両端部に配置された電極取出部8aが形成されている(図2参照)。ここで、電極取出部8aがAu以外の金属で構成されている場合には、該電極取出部8aの表面にはAuメッキが施されている。ここで、回路パターン8は、スパッタ、印刷、FR4基板の貼り付け等によって形成される。又、透光性基板4の左右両端部に搭載された複数の前記回路部品6は、当該LED電球1の極性を無くすための回路を構成するためのものである。   Further, a circuit pattern 8 made of Au, Ag, Cu or the like is formed on the translucent substrate 4, and a plurality of the circuit components 6 are electrically connected to the circuit pattern 8. The electrode extraction part 8a arrange | positioned at the right-and-left both ends of the translucent board | substrate 4 is formed in this edge part (refer FIG. 2). Here, when the electrode extraction part 8a is made of a metal other than Au, the surface of the electrode extraction part 8a is Au plated. Here, the circuit pattern 8 is formed by sputtering, printing, attaching an FR4 substrate, or the like. Further, the plurality of circuit components 6 mounted on the left and right ends of the translucent substrate 4 are for configuring a circuit for eliminating the polarity of the LED bulb 1.

そして、透光性基板4に形成された回路パターン8と各LED5とは、ワイヤーボンディングによって電気的に接続されている。尚、回路パターン8と各LED5との電気的な接続をFC(フリップチップ)によって行うようにしても良い。   And the circuit pattern 8 and each LED5 which were formed in the translucent board | substrate 4 are electrically connected by wire bonding. The electrical connection between the circuit pattern 8 and each LED 5 may be performed by FC (flip chip).

又、図3及び図4に示すように、透光性基板4の左右両端部には、熱伝導性の高いAlによって円柱ブロック状に一体成形された前記ヒートシンク7が前記回路部品6を覆うように配置されている。具体的には、図6に示すように、各ヒートシンク7の中央部には矩形の嵌合孔7aが形成されており、この嵌合孔7aに、透光性基板5の端部を回路部品6と共に嵌め込むことによって、各ヒートシンク7が透光性基板4の端部にそれぞれ固定される。このとき、透光性基板4の左右の端部は、ヒートシンク7に直接接触して熱的な導通が取られている。   As shown in FIGS. 3 and 4, the heat sink 7 integrally formed in a cylindrical block shape with Al having high thermal conductivity covers the circuit component 6 at both the left and right ends of the translucent substrate 4. Is arranged. Specifically, as shown in FIG. 6, a rectangular fitting hole 7a is formed at the center of each heat sink 7, and the end of the translucent substrate 5 is connected to the fitting part 7a as a circuit component. Each heat sink 7 is fixed to the end of the translucent substrate 4 by being fitted together with 6. At this time, the left and right end portions of the translucent substrate 4 are in direct contact with the heat sink 7 to be thermally conductive.

上述のようにして透光性基板4とヒートシンク7が結合一体化されると、図5及び図6に示すように、導電性金属によって有底筒状に成形された前記口金2が左右の各ヒートシンク7の外周にそれぞれ嵌め込まれて固定され、両口金2の間に透明な前記グローブ3を架設することによって、図1に示すヒューズ型のLED電球1が得られる。尚、図6に示すように、透光性基板4の回路パターン8に形成された左右の電極取出部8aか(図2参照)らはリード線9がそれぞれ引き出されており、各リード線9は、各口金2の底面にハンダ付け等によってそれぞれ電気的に接続されている。   When the translucent substrate 4 and the heat sink 7 are combined and integrated as described above, the base 2 formed into a bottomed cylindrical shape with conductive metal is formed on each of the left and right sides as shown in FIGS. A fuse-type LED bulb 1 shown in FIG. 1 is obtained by installing the globe 3 between the caps 2 so as to be fitted and fixed to the outer periphery of the heat sink 7. As shown in FIG. 6, lead wires 9 are led out from the left and right electrode extraction portions 8 a (see FIG. 2) formed in the circuit pattern 8 of the translucent substrate 4. Are electrically connected to the bottom surface of each base 2 by soldering or the like.

以上のように構成されたLED電球1の口金2が不図示のソケットに嵌め込まれ、不図示の電源からソケットを介してLED電球1に電流が供給されると、その電流は、リード線10から回路パターン8を経て各LED5に供給されるため、各LED5が起動されて発光する。尚、ここでは車載用のルームランプとして、必要な光量を満たすために120mA程度の電流を流している。   When the base 2 of the LED bulb 1 configured as described above is fitted into a socket (not shown) and current is supplied to the LED bulb 1 from the power source (not shown) via the socket, the current is supplied from the lead wire 10. Since each LED 5 is supplied via the circuit pattern 8, each LED 5 is activated to emit light. Here, as an in-vehicle room lamp, a current of about 120 mA is passed in order to satisfy a necessary light quantity.

而して、本実施の形態に係るLED電球1においては、透光性基板4に複数のLED5を実装したため、各LED5からの光は透光性基板4を透過してほぼ全方位に向かって出射し、全方位に均一に光を照射することができる。このため、このLED電球1によれば、白熱電球と同等の配光特性が得られる。そして、本実施の形態では、当該LED電球1の極性を無くすための回路部品6を透光性基板4の両端部に振り分けて配置したため、大きな発光面積を確保して幅広の発光領域を得ることができる。   Thus, in the LED bulb 1 according to the present embodiment, since the plurality of LEDs 5 are mounted on the translucent substrate 4, the light from each LED 5 is transmitted through the translucent substrate 4 toward almost all directions. The light can be emitted and irradiated uniformly in all directions. For this reason, according to this LED bulb 1, the light distribution characteristic equivalent to an incandescent bulb is obtained. And in this Embodiment, since the circuit component 6 for eliminating the polarity of the said LED bulb 1 was distributed and arrange | positioned at the both ends of the translucent board | substrate 4, a large light emission area is ensured and a wide light emission area | region is obtained. Can do.

又、本発明に係るLED電球1においては、極性を無くすための回路部品6を透光性基板4の両端部に振り分けて配置し、ヒートシンク7を各回路部品6を覆うように配置したため、回路部品6が発生する熱のヒートシンク7への伝導経路が短縮され、LED5で発生した熱は、図6に矢印にて示すように、ヒートシンク7へと効率良く伝導し、ヒートシンク7へと伝導した熱は口金2から周囲に放熱される。このため、各LED5が効率良く冷却されてその温度上昇が低く抑えられ、該LED5の光量と耐久寿命の低下が防がれる。特に、本実施の形態では、透光性基板4に形成されたキャビティ4a内にLED5を直接実装したため、LED5が発生する熱が透光性基板4へと直接伝導し、最終的には口金2から周囲へと効果的に放熱され、これによってLED5の温度上昇が一層効果的の抑えられてその発光効率と耐久寿命が高められる。   Further, in the LED bulb 1 according to the present invention, the circuit components 6 for eliminating the polarity are arranged separately on both ends of the translucent substrate 4, and the heat sink 7 is arranged so as to cover each circuit component 6. The conduction path of the heat generated by the component 6 to the heat sink 7 is shortened, and the heat generated by the LED 5 is efficiently conducted to the heat sink 7 and is conducted to the heat sink 7 as indicated by arrows in FIG. Is radiated from the base 2 to the surroundings. For this reason, each LED5 is cooled efficiently, the temperature rise is suppressed low, and the fall of the light quantity and durable life of this LED5 is prevented. In particular, in the present embodiment, since the LED 5 is directly mounted in the cavity 4a formed in the translucent substrate 4, the heat generated by the LED 5 is directly conducted to the translucent substrate 4, and finally the base 2 The heat is effectively radiated from the surroundings to the surroundings, whereby the temperature rise of the LED 5 is further effectively suppressed, and the light emission efficiency and the durability life are increased.

更に、前述のようにLED電球1からは全方位に均一に光が照射されるため、当該LED電球1は、その取付方向に制約を受けず、何れの方向にも取り付けることができるために取付性が高められる。   Furthermore, as described above, since the LED bulb 1 is uniformly irradiated with light in all directions, the LED bulb 1 is not limited by its installation direction and can be installed in any direction. Sexuality is enhanced.

1 LED電球
2 口金
3 グローブ
4 透光性基板
4a 透光性基板のキャビティ
5 LED
6 回路部品
7 ヒートシンク
7a ヒートシンクの嵌合孔
8 回路パターン
8a 回路パターンの電極取出部
9 リード線
DESCRIPTION OF SYMBOLS 1 LED bulb 2 Base 3 Globe 4 Translucent substrate 4a Cavity of translucent substrate 5 LED
6 Circuit component 7 Heat sink 7a Heat sink fitting hole 8 Circuit pattern 8a Circuit pattern electrode lead-out 9 Lead wire

Claims (3)

回路パターンが形成された透光性基板の中央部にLEDを、両端部に回路部品をそれぞれ実装し、前記回路部品を覆うヒートシンクを前記導光性基板の両端部にそれぞれ配置し、各ヒートシンクに口金をそれぞれ被着し、前記透光性基板とこれに実装された前記LEDを覆う筒状のグローブを前記口金間に架設して構成されることを特徴とするLED電球。   An LED is mounted on the center of the translucent substrate on which the circuit pattern is formed, circuit components are mounted on both ends, and heat sinks covering the circuit components are disposed on both ends of the light guide substrate, respectively. An LED light bulb comprising: a base globe, and a cylindrical glove that covers the translucent substrate and the LED mounted on the base plate, and is constructed between the bases. 前記透光性基板にキャビディを形成し、該キャビティ内に前記LEDを直接実装したことを特徴とする請求項1記載のLED電球。   2. The LED bulb according to claim 1, wherein a cavity is formed on the translucent substrate, and the LED is directly mounted in the cavity. 車載用のルームランプとして使用されることを特徴とする請求項1又は2記載のLED電球。。
The LED bulb according to claim 1 or 2, wherein the LED bulb is used as a vehicle-mounted room lamp. .
JP2013240216A 2013-11-20 2013-11-20 Led light bulb Pending JP2015099753A (en)

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