JP2015087519A - Imaging device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a printed circuit board attachment method capable of improving assembly operability without entailing a size increase of devices.SOLUTION: An imaging device includes: an electronic component including a DIP (Dual-in-line package) terminal; a printed circuit board on which the electronic component is mounted; a mount section to which a lens is detachably attached; a holding member of the mount section; a main body chassis fastened to the holding member; a battery chamber provided integrally with the main body chassis; and a guide groove provided in the holding member. The printed circuit board can be assembled so as to arrange the electronic component between the holding member and the battery chamber by inserting the DIP terminal into the guide groove.

Description

  The present invention relates to an imaging apparatus, and more particularly to a method for assembling a printed wiring board.

  In recent years, as the functionality of imaging devices such as digital still cameras and video cameras has increased, the number of components mounted has increased. Various components are also mounted on the printed wiring board inside the camera, and the internal structure of the imaging apparatus is complicated.

  On the other hand, there is a demand for a small imaging device in the market, and device arrangement has been devised so that a complicated structure can be assembled without a gap.

  Patent Document 1 discloses a configuration that achieves both downsizing and reliability by efficiently disposing a main capacitor in a space beside the lens mount.

JP 2009-175313 A

  However, when the printed wiring board or the like is to be arranged with high efficiency in the imaging apparatus having a complicated internal structure as described above, the assemblability may be impaired.

  Specifically, there is a possibility that the assembling procedure may be restricted, or an assembly in which the index is not visible is required, which may cause an assembly error or damage or peeling of the mounted component on the printed wiring board.

  For example, in an assembly configuration as disclosed in Patent Document 1, a printed wiring board is assembled in a battery chamber to form a unit, and then it can be fastened to a mirror box, but it is printed after the battery chamber and the mirror box are fastened. There is a possibility that it is difficult / impossible to assemble the wiring board.

  If there are restrictions on the assembly procedure, there may be inconveniences in the selection of the assembly factory and logistics, and there will also be restrictions on the procedure of disassembly work for repair and adjustment.

  If the assembly procedure is unacceptable, there is a fear that the equipment needs to be enlarged in order to enable assembly in a different procedure / in order to improve the assemblability.

  Accordingly, an object of the present invention is to provide a printed board assembling method with improved assembling workability without increasing the size of the apparatus.

In order to achieve the above object, the present invention provides:
Electronic components with DIP (Dual-in-line package) terminals;
A printed wiring board on which the electronic component is mounted;
A lens detachable mount,
A holding member of the mount part;
A main body chassis fastened to the holding member;
A battery compartment provided integrally with the main body chassis;
An imaging apparatus having a guide groove in the holding member,
By inserting the DIP terminal into the guide groove,
The printed wiring board can be assembled so that the electronic component is disposed between the holding member and the battery chamber.

  ADVANTAGE OF THE INVENTION According to this invention, the printed circuit board assembly method which improved assembly workability | operativity can be provided, without causing the enlargement of an apparatus.

1 is an external perspective view of an imaging apparatus according to an embodiment of the present invention. 1 is a perspective view of an internal configuration of an imaging apparatus according to an embodiment of the present invention. It is the disassembled perspective view seen from the front side of the imaging device in the embodiment of the present invention. It is a simplified diagram showing a strobe substrate arrangement in an embodiment of the present invention. It is a horizontal sectional view showing a strobe substrate assembly procedure in an embodiment of the present invention. It is a front view of the strobe board in the embodiment of the present invention. It is a simplified diagram showing the arrangement position of the guide groove in the embodiment of the present invention.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[Example 1]
FIG. 1 is a diagram showing an external appearance of a digital single-lens reflex camera as an embodiment of an imaging apparatus of the present invention. FIG. 1 (a) is a perspective view seen from the front side (subject side) of the camera, and FIG. It is the perspective view which looked at the camera from the back side (photographer side).

  In FIG. 1, reference numeral 1 denotes a camera body. The camera body 1 is provided with a grip 11 protruding forward so that a user can easily hold the camera stably at the time of shooting.

  Reference numeral 12 denotes a mirror box disposed in the camera housing, and the photographic light flux that has passed through the photographic lens is guided here. A main mirror 13 is disposed inside the mirror box 12. The main mirror 13 is held at an angle of 45 ° with respect to the photographing optical axis in order to guide the photographing light flux toward the viewfinder eyepiece window 14 via the penta roof mirror 401 (illustrated in FIG. 2), and imaging. In order to guide in the direction of the element 501 (illustrated in FIG. 3), it can be held in a position retracted from the photographing light beam.

  A camera built-in strobe unit 15 that pops up with respect to the camera body is provided at the upper center of the camera, and irradiates the subject with illumination light.

  Reference numeral 16 denotes a lens mount unit which can mount a photographing lens unit (not shown) on the camera body.

  The mount contact 17 has a function of supplying a power to the photographic lens unit side while interposing a control signal, a status signal, a data signal, etc. between the camera body and the photographic lens unit.

  2 and 3 are perspective views showing the internal structure of the camera. 2 is a perspective view seen from the front side of the camera, and FIG. 3 is an exploded perspective view seen from the front side of the camera.

  Reference numeral 100 denotes a main body chassis serving as a skeleton of the camera main body. In this embodiment, the main body chassis is a resin molded part integrated with the battery chamber 100a.

  On the subject side of the main body chassis 100, a mount unit 16, a mirror box 12, and a shutter unit 300 are arranged in this order from the subject side. A finder unit 400 is disposed above the mirror box.

  The viewfinder unit 400 includes a penta roof mirror 401 and provides a subject image to a photographer.

  On the photographer side of the main body chassis 100, an image pickup unit 500 and a printed wiring board 600 on which a main integrated circuit that operates as a central processing unit is mounted.

  The imaging unit 500 is adjusted and fixed so that the imaging surface of the imaging element 501 is parallel to the mounting surface of the mount unit 16 that is a reference to which the photographic lens unit is mounted with a predetermined distance.

  In a single-lens reflex camera, a wide variety of photographic lens units can be mounted, and a heavy lens unit may be mounted. Therefore, the holding member of the lens mount unit 16 is not particularly limited so that the adjustment amount described above does not go wrong. Strength is required.

  In this embodiment, the mirror box 12 is a holding member for the mount portion 16.

  An A / D conversion board 502 is disposed on the back surface of the imaging unit 500, and converts an analog signal from the imaging element 501 into a digital signal.

  A driving unit 300a, which is a part of the shutter unit 300, is disposed on the right side of the mirror box as viewed from the front of the camera.

  The driving unit 300 a drives the shutter unit 300, the main mirror 13, and the strobe unit 15.

  A flash board 700 is disposed on the subject side of the battery chamber 100a.

  On the strobe board 700, a battery terminal 701 and a strobe drive circuit are mounted. In this embodiment, a main capacitor 702 and a sub capacitor 703 are mounted as a part of the strobe driving circuit.

  In order to realize a high-performance strobe with a large amount of light emission, a relatively large capacitor is mounted on the strobe substrate 700. Therefore, in this embodiment, the main capacitor 702 is disposed so as to be positioned inside the grip 11, and the sub capacitor 703 is disposed so as to be positioned between the mirror box 12 and the battery chamber 100a. As a result, since the internal space of the camera can be used efficiently, an increase in the size of the camera body can be avoided.

  Further, by disposing the main capacitor 702 and the sub capacitor 703 in the vicinity of the battery, the wiring length can be kept short, and the power loss can be reduced.

  In this embodiment, the sub-capacitor 703 is a DIP (Dual-in-line package) type aluminum electrolytic capacitor, and soldering is performed after inserting a DIP lead portion (hereinafter referred to as a DIP terminal) into the substrate. Therefore, the mounting strength (peeling strength) is higher than that of surface mount components. In addition, the DIP terminal 703a protruding from the board on the opposite side to the mounting surface is in a so-called cantilever state, but the root side (board side) of the DIP terminal is thickly reinforced by soldering. It is possible to have an amount of bending stiffness.

  Next, the configuration and assembly method of the strobe substrate 700 will be described in detail with reference to FIGS.

  FIG. 4 is a simplified diagram showing only the main parts related to the assembly of the strobe board 700 and omitting other elements. 4A is a front view seen from the front side of the camera, and FIG. 4B is a perspective view seen from the grip lower side before the strobe board is assembled.

  As shown in FIG. 4 (b), the mirror box 12 is composed of a composite shape of a cylindrical portion that receives the mount portion 16 and a rectangular parallelepiped portion.

  In this embodiment, the cylindrical portion of the mirror box 12 has a guide groove 12a, and a triangular reinforcing rib 12b is provided over the rectangular parallelepiped portion of the mirror box 12 so as to be continuous with the side wall of the guide groove 12a. doing.

  FIGS. 5A to 5D are horizontal sectional views taken along the sectional line AA in FIG. 4A, and show the procedure for assembling the strobe board in the order of (a) to (d).

  First, FIG. 5A is a horizontal sectional view before assembling the strobe board 700 corresponding to FIG.

  Next, as shown in FIGS. 5B and 5C, the DIP terminal 703a of the sub capacitor is inserted through the guide groove 12a. At this time, the movement of the strobe substrate 700 in the front-rear direction of the paper surface is restricted by the side wall of the guide groove 12a and the reinforcing rib 12b connected thereto.

  Further, as shown in FIG. 5 (c), after the DIP terminal 703a is inserted to a position where the strobe board 700 hits the mirror box 12, the strobe board 700 is rotated until it becomes horizontal in the figure, and FIG. As shown, the sub capacitor 703 is disposed between the mirror box 12 and the battery chamber 100a.

  By assembling according to the above procedure, a simple assembling work following the guide is possible.

  At this time, since the DIP terminal 703a used as an index has high bending rigidity as described above, even when pressure is applied during assembly work, the possibility of deformation and breakage is low, and efficient work with high yield can be expected.

  Further, the reinforcing rib 12b has an effect of increasing the strength of the lens mount portion and maintaining the adjustment amount of the distance between the lens unit and the image sensor 501 even when a strong impact is applied to the camera.

  FIG. 6 is a front view of the strobe board 700 viewed from the front side of the camera.

  On the mounting surface of the strobe board 700 on the front side of the camera, as shown in FIG. 6, no components are mounted or only low-profile parts are mounted in the area of the dotted line portion C where the camera mount portion is projected onto the strobe board. It is preferable to implement.

  As a result, the problem of peeling of mounted parts that occurs during assembly can be reduced, and efficient work with a high yield can be expected.

  FIG. 7 is a simplified diagram showing the positional relationship between the DIP terminal 703a, the mirror box 12, and the battery chamber 100a when viewed from the direction of arrow B in FIG. 5 (b) or FIG. 5 (c). Only the part is illustrated, and other elements are omitted.

  In order to enable further downsizing, it is preferable to provide a guide groove 100b in the battery chamber 100a as shown in FIG.

  At this time, as shown in FIG. 7, the distance between the DIP terminal 703a and the guide groove 12a and the reinforcing rib 12b connected thereto is defined as d1 and d2, and the distance between the sub capacitor 703 main body and the guide groove 100b is defined as D1 and D2.

  In this embodiment, the width of the guide groove 100b is set wider than that of the guide groove 100a, and the positional relationship is set so that D1, D2, d1, and d2 have a relationship of “D1> d1, D2> d2.” Yes.

  If such setting is made, the DIP terminal 703a having high bending rigidity hits the guide groove 12a or the reinforcing rib 12b connected to the guide capacitor 12a before the sub capacitor 703 when the strobe board 700 is assembled. It is possible to reduce the possibility of

  With the above configuration, it is possible to provide a strobe substrate assembling method with improved assembling workability without increasing the size of the device.

  As mentioned above, although preferable embodiment of this invention was described, this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.

DESCRIPTION OF SYMBOLS 1 Imaging device (camera) main body 7 Mirror box 12 Holding member (mirror box)
12a Guide groove 16 Mount part 100 Main body chassis 100a Battery compartment 700 Printed wiring board (strobe board)
702 Electronic components (main capacitors)
703 Electronic components (sub capacitors)
703a DIP terminal

Claims (5)

An electronic component (703) having a DIP (Dual-in-line package) terminal (703a);
A printed wiring board (700) on which the electronic component (703) is mounted;
A mount part (16) which is detachable from the lens;
A holding member (12) of the mount (16);
A body chassis (100) fastened to the holding member (12);
A battery chamber (100a) provided integrally with the main body chassis (100);
An imaging apparatus having a guide groove (12a) in the holding member (12),
By inserting the DIP terminal (703a) into the guide groove (12a),
The imaging apparatus, wherein the printed wiring board (700) can be assembled so that the electronic component (703) is disposed between the holding member (12) and the battery chamber (100a). Further, the holding member (12) has a reinforcing rib (12b),
The imaging device according to claim 1, wherein a side wall of the guide groove (12a) is continuous with a reinforcing rib (12b). The printed circuit board (700) is a board on which a strobe driving circuit is mounted, and the electronic component (703) is a capacitor for causing the strobe device to emit light. The imaging device described. In the mounting surface on the front side of the camera in the printed wiring board (700),
The imaging apparatus according to any one of claims 1 to 3, wherein no component is mounted on the region where the mount portion (16) is projected, or only a low-profile component is mounted. Furthermore, the battery chamber (100a) has a guide groove (100b) wider than the guide groove (12a),
At the time of mounting the printed wiring board (700),
For the distance between the DIP terminal (703a) and the guide groove (12a),
The imaging apparatus according to any one of claims 1 to 4, wherein a positional relationship is set so that a distance between the main body of the electronic component (703) and the guide groove (100b) becomes wider.