JP2009175313A - Imaging apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an imaging apparatus improved in the reliability of a main capacitor for a built-in strobe light. <P>SOLUTION: The imaging apparatus includes: an imaging unit 400 having an imaging element 33 for converting an optical image of an object into an electric signal; a mirror box 511 storing a main mirror, mounted on the imaging unit 400 with an imaging element mounting part 511a; a mount part 508 fixed on the mirror box 511 with a lens provided detachably; and a main capacitor 811 mounted on a power source substrate 810 so as to be used for light emission of a strobe device. The main capacitor 811 is disposed between the imaging element mounting part 511a and the mount part 508. Two pairs of terminal parts 811a, 811b of the main capacitor 811 are mounted on the power source substrate 810. At least one of the two pairs of the terminal parts 811a, 811b is disposed behind a projecting part 508a in the mount part 508. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

    The present invention relates to an imaging apparatus, and more particularly, to an imaging apparatus including a main capacitor that supplies power to a strobe device.

  In recent years, imaging devices such as digital still cameras and video cameras have become highly functional, and the number of components to be mounted has increased, and the internal structure of the imaging device has become complicated. In an image pickup apparatus having a built-in strobe, it has become necessary to mount a large-capacity main capacitor as the performance of the strobe increases.

  For this reason, unless the main capacitor having a large volume is efficiently arranged, the image pickup apparatus is increased in size. In addition, the electric charge accumulated in the main capacitor may cause electric shock or destruction of an electric circuit when the camera is disassembled. For this reason, the imaging apparatus needs to have a structure that easily discharges electric charges.

    Here, Japanese Patent Laying-Open No. 2004-20609 (Patent Document 1) discloses a configuration in which a main capacitor is divided into a plurality of parts and arranged with a step along the shape of the exterior.

Japanese Patent Laying-Open No. 2001-242512 (Patent Document 2) discloses a configuration in which a discharge conductive region is provided on a printed board on which a main capacitor is mounted, and the discharge conductive region appears when an exterior member is removed.
JP 2004-20609 A Japanese Patent Laid-Open No. 2001-242512

    However, in the configuration of Japanese Patent Application Laid-Open No. 2004-20609 (Patent Document 1), the exterior member of the camera and the terminal portion of the main capacitor are close to each other. For this reason, when pressure is applied to the exterior member and it is bent and deformed, the terminal portion of the capacitor and the exterior member come into contact with each other, and there is a fear that a short circuit occurs depending on the material of the exterior member.

    Further, in the configuration of Japanese Patent Laid-Open No. 2001-242512 (Patent Document 2), an insulating member is disposed between the discharge conductive region and the exterior member, and an opening for inserting a discharge tool that is freely opened and closed on the insulating member. Is provided. For this reason, such a configuration is disadvantageous in terms of layout flexibility and product cost.

    Accordingly, the present invention provides an imaging apparatus in which the reliability of the main capacitor for the built-in strobe is improved.

    An image pickup apparatus according to one aspect of the present invention includes an image pickup unit including an image pickup device that converts an optical image of a subject into an electric signal, a main mirror, and a mirror box attached to the image pickup unit by an image pickup device mounting portion. And a mount unit fixed to the mirror box and capable of attaching and detaching a lens, and a main capacitor mounted on a strobe board and used for causing the strobe device to emit light, and the main capacitor is mounted on the image sensor. And the two pairs of terminal portions of the main capacitor are mounted on the strobe substrate, and at least one of the two pairs of terminal portions is behind a protruding portion in the mount portion. Is arranged.

  Other objects and features of the present invention are illustrated in the following examples.

    According to the present invention, it is possible to provide an imaging apparatus in which the reliability of the main capacitor for the built-in strobe is improved.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
(Electrical configuration of imaging device)
First, the electrical configuration of the imaging apparatus in the present embodiment will be described. FIG. 1 is a block diagram illustrating a main electrical configuration of the imaging apparatus according to the present embodiment. Specifically, FIG. 1 shows a configuration of a digital single-lens reflex camera as an imaging device. In addition, the same code | symbol as FIG. 1 is attached | subjected to the part which is common in FIG. 2 thru | or FIG. 7 mentioned later.

    Reference numeral 100 denotes a microcomputer (hereinafter referred to as “MPU”). The microcomputer 100 is built in the camera body 1 a and operates as a central processing unit of the camera 1. The MPU 100 controls the operation of the camera 1 and executes various processes and instructions for each element of the camera 1.

    Reference numeral 100a denotes an EEPROM. The EEPROM 100a operates as a storage device built in the MPU 100. In this embodiment, the EEPROM 100a can store time information of the time measuring circuit 109 and other information.

    Connected to the MPU 100 are a mirror drive circuit 101, a focus detection circuit 102, a shutter drive circuit 103, a video signal processing circuit 104, a switch sense circuit 105, a photometry circuit 106, and a strobe drive circuit 113. The strobe drive circuit 113 controls the operation of the strobe unit 504 (strobe device).

    The MPU 100 is connected to a liquid crystal display drive circuit 107, a battery check circuit 108, a time measurement circuit 109, a power supply circuit 110, and a piezoelectric element drive circuit 111. These circuits operate under the control of the MPU 100.

    The MPU 100 communicates with the lens control circuit 201 in the photographing lens unit 200a via the mount contact 507. The mount contact 507 also has a function of transmitting a signal to the MPU 100 when the photographing lens unit 200a is connected to the camera body 1a. Accordingly, the lens control circuit 201 starts communication with the MPU 100 and drives the photographing lens 200 and the diaphragm 204 in the photographing lens unit 200 a via the AF driving circuit 202 and the diaphragm driving circuit 203. In FIG. 1, only one photographing lens 200 is shown for the sake of convenience, but actually the photographing lens 200 is composed of a large number of lens groups.

    The AF drive circuit 202 is configured by a stepping motor, for example. The AF driving circuit 202 changes the position of the focus lens in the photographing lens 200 under the control of the lens control circuit 201 and adjusts so that the photographing light beam is focused on the image sensor 33.

    The aperture driving circuit 203 is configured by, for example, auto iris. The aperture driving circuit 203 changes the aperture 204 under the control of the lens control circuit 201 to obtain an optical aperture value.

    Reference numeral 512 denotes a main mirror. The main mirror 512 guides the photographic light beam passing through the photographic lens 200 to the penta roof mirror 22 while being held at an angle of 45 ° with respect to the photographic optical axis 50 shown in FIG. The main mirror 512 transmits a part of the photographing light flux that passes through the photographing lens 200 and guides it to the sub mirror 30. The sub mirror 30 guides the imaging light flux that has passed through the main mirror 512 to the focus detection sensor unit 31.

    The mirror drive circuit 101 drives the main mirror 512, and is composed of, for example, a DC motor and a gear train. The mirror drive circuit 101 moves the main mirror 512 between a position where the subject image can be observed by the finder and a position where the subject image is retracted from the photographing light beam. When the main mirror 512 is driven by the mirror drive circuit 101, the sub mirror 30 also moves between a position for guiding the imaging light beam to the focus detection sensor unit 31 and a position for retracting from the imaging light beam.

    The focus detection sensor unit 31 is composed of a field lens, a reflection mirror, a secondary imaging lens, a diaphragm, a line sensor composed of a plurality of CCDs, and the like arranged in the vicinity of an imaging surface (not shown). Perform focus detection. A signal output from the focus detection sensor unit 31 is supplied to the focus detection circuit 102. The signal supplied to the focus detection circuit 102 is converted into a subject image signal by the focus detection circuit 102 and transmitted to the MPU 100.

    The MPU 100 performs a focus detection calculation by a phase difference detection method based on the subject image signal. Further, the MPU 100 obtains the defocus amount and the defocus direction, and drives the focus lens in the photographing lens 200 to the in-focus position via the lens control circuit 201 and the AF drive circuit 202 based on these.

    The penta roof mirror 22 converts and reflects the photographing light beam reflected by the main mirror 512 into an erect image. The photographer can observe the subject image from the viewfinder eyepiece window 520 through the viewfinder optical system 18. The penta roof mirror 22 also guides a part of the photographing light flux to the photometric sensor 46. The photometric circuit 106 obtains an output signal from the photometric sensor 46, converts the output signal into a luminance signal in each area on the observation surface, and outputs the luminance signal to the MPU 100. The MPU 100 calculates an exposure value based on the luminance signal.

    When the photographer observes the subject image with the viewfinder, the shutter front curtain of the shutter unit 32 (mechanical focal plane shutter) is in the light shielding position, and the shutter rear curtain of the shutter unit 32 is in the exposure position. Next, at the time of shooting, the shutter front curtain travels from the light shielding position to the exposure position, passes through the light from the subject, and images are picked up by the image sensor 33. After the desired shutter time elapses, the shutter rear curtain completes the photographing by performing a light shielding traveling from the exposure position to the light shielding position. The shutter unit 32 is driven and controlled by a shutter drive circuit 103 that has received a command from the MPU 100.

    The imaging unit 400 includes an optical low-pass filter 410, an optical low-pass filter holding member 420, a piezoelectric element 430 that is a piezoelectric member, and an imaging element 33, which are configured as a unit. The image sensor 33 converts an optical image of a subject into an electrical signal (photoelectric conversion). In this embodiment, a CMOS sensor is used as the image sensor 33. However, instead of this, an imaging device of another form such as a CCD may be employed.

    The optical low-pass filter 410 disposed in front of the image sensor 33 is a single birefringent plate made of quartz and has a rectangular shape. The piezoelectric element 430 is a single-plate piezoelectric element (piezo element). The piezoelectric element 430 is configured to be vibrated by the piezoelectric element driving circuit 111 that has received an instruction from the MPU 100 and transmit the vibration to the optical low-pass filter 410.

    The clamp / CDS (correlated double sampling) circuit 34 performs basic analog processing before executing A / D conversion. The clamp / CDS circuit 34 can also change the clamp level. The AGC 35 (automatic gain adjusting device) performs basic analog processing before executing A / D conversion. The AGC 35 can also change the AGC basic level. The A / D converter 36 converts the analog signal output from the image sensor 33 into a digital signal.

    The video signal processing circuit 104 performs overall image processing by hardware such as gamma / knee processing, filter processing, and information synthesis processing for monitor display on the digitized image data. Image data for monitor display from the video signal processing circuit 104 is displayed on the color liquid crystal monitor 529 (liquid crystal display device) via the color liquid crystal drive circuit 112.

  Further, the video signal processing circuit 104 can store image data in the buffer memory 37 through the memory controller 38 in accordance with an instruction from the MPU 100. Further, the video signal processing circuit 104 can also perform image data compression processing such as JPEG.

    When continuous shooting is performed, such as continuous shooting, the video signal processing circuit 104 can temporarily store image data in the buffer memory 37 and sequentially read unprocessed image data through the memory controller 38. Thus, the video signal processing circuit 104 can sequentially perform image processing and compression processing regardless of the speed of the image data input from the A / D converter 36.

    The memory controller 38 has a function of storing the image data input from the external interface 40 in the external memory 39 and outputting the image data stored in the external memory 39 from the external interface 40. The external interface 40 corresponds to the video signal output jack 841, the remote operation jack 842, and the USB connector 801 in FIG. As the external memory 39, a flash memory that can be attached to and detached from the camera body 1a is used.

    The switch sense circuit 105 transmits an input signal to the MPU 100 according to the operation state of each switch. Switch SW1 (510a) is turned on by the first stroke (half-pressed) of release button 510. The switch SW2 (510b) is turned on by the second stroke (full press) of the release button 510. When the switch SW2 (510b) is turned on, an instruction to start shooting is transmitted to the MPU 100. In addition, a main operation dial 503, a shooting mode setting dial 502, and a power switch 501 are connected to the switch sense circuit 105.

    The liquid crystal display driving circuit 107 drives the in-finder liquid crystal display 41 in accordance with an instruction from the MPU 100.

    The battery check circuit 108 performs a battery check according to an instruction from the MPU 100 and transmits the detection result to the MPU 100. The power source 42 supplies power to each element of the camera 1 such as the MPU 100.

The time measuring circuit 109 measures the time and date from when the power switch 501 is turned off to when it is turned on, and transmits the measurement result to the MPU 100 in accordance with an instruction from the MPU 100.
(Appearance structure of imaging device)
Next, the external configuration of the image pickup apparatus in the present embodiment will be described.

    2 and 3 are external views of the image pickup apparatus (digital single-lens reflex camera) in the present embodiment. FIG. 2 is a perspective view as seen from the front side of the image pickup apparatus (camera), and shows a state in which the taking lens unit is removed. FIG. 3 is a perspective view of the imaging device (camera) as seen from the photographer side (back side).

    In FIG. 2, 1a is a camera body. The camera body 1a is provided with a grip 513 that protrudes forward so that the user can easily hold the camera 1a stably during shooting. Reference numeral 501 denotes a power switch of the camera 1. When the power switch 501 is operated, the camera 1 is activated or stopped.

    Reference numeral 511 denotes a mirror box arranged inside the camera body 1a (inside the camera casing). An imaging light beam that has passed through the imaging lens is guided to the mirror box 511. A main mirror 512 is accommodated in the mirror box 511. The main mirror 512 takes a first state in which the photographing light beam is guided in the direction of the penta roof mirror 22 (see FIG. 1) and is held at an angle of 45 ° with respect to the photographing optical axis in the photographing light beam. Further, the main mirror 512 takes a second state where the main mirror 512 is held at a position retracted from the photographing light flux in order to guide the photographing light flux toward the image sensor 33 (see FIG. 1). The main mirror 512 is driven by the mirror drive circuit 101 (see FIG. 1) to move so as to take either the first state or the second state.

    A camera built-in strobe unit 504 (strobe device) that pops up with respect to the camera body 1a is provided in the upper center of the camera body 1a. The camera built-in flash unit 504 irradiates the subject with illumination light.

    A shooting mode setting dial 502 for the photographer to set the shooting mode of the camera 1 is provided on the upper left side of the camera body 1a when viewed from the front (rightward when viewed from the back). With the shooting mode setting dial 502, it is possible to select an auto shooting mode according to the shooting scene, a manual shooting mode in which each of the shutter speed and the lens aperture value is set according to the photographer's will, and the like. Further, by operating the main operation dial 503, the shutter speed and the lens aperture value can be set according to the operation mode at the time of shooting.

    Reference numerals 505a and 505b denote strap attachment members for attaching the strap to the camera body 1a. The strap attachment members 505a and 505b are configured such that the strap string can be hooked in a hole provided in a substantially central portion.

    Reference numeral 508 denotes a mount unit. The mount unit 508 fixes a detachable photographic lens unit (not shown) to the camera body 1a. Reference numeral 506 denotes a lens lock release button. By pressing the lens lock release button 506, the photographing lens unit can be detached from the camera body 1a.

    Reference numeral 507 denotes a mount contact. The mount contact 507 performs communication such as a control signal, a status signal, and a data signal between the camera body 1a and the photographing lens unit. The mount contact 507 also has a function of supplying power to the taking lens unit. For this reason, the photographing lens unit can operate without requiring a unique power source. Further, the mount contact 507 may be configured to perform not only electrical communication but also optical communication.

    On the upper side of the grip 513 of the camera, a release button 510 is arranged as a start switch for starting shooting. In the release button 510, the switch SW1 (510a) is turned ON by the first stroke, and the shooting preparation operation (focus adjustment operation and photometry operation) is started. Also, the release button 510 is turned on by the switch SW2 (510b) by the second stroke, and the photographing operation is started.

    Reference numeral 509 denotes a storage port for storing an external memory (not shown) that records a captured image taken by the camera 1.

    As shown in FIG. 3, on the back side of the camera body 1a, a finder eyepiece window 520, a color liquid crystal monitor 529 capable of displaying pre-photographing information and setting contents of the camera 1, a photographed image, and the like are provided. ing.

    On the rear side of the camera body 1a, there are an AF frame selection button 522, an AE lock button 523, a playback button 526 for performing operations such as playback of the captured image, and an erase button 524 for performing operations such as deletion of the captured image. Has been placed. On the back side of the camera body 1a, an easy direct button 527 for performing operations such as printing of a photographed image, an exposure correction setting button 528, and a MENU button 530 for performing operations such as calling a menu screen are arranged. Yes. Further, a DISP button 531 for performing operations such as switching between display / non-display of the color liquid crystal monitor 529 and a selection / decision button 525 for making decisions at various settings are also arranged on the back side of the camera body 1a. .

    Further, an ISO sensitivity setting button 521 for shifting to a mode in which the photographer can select an ISO sensitivity setting at the time of photographing is provided on the right side as viewed from the upper rear surface of the camera body 1a.

    A video signal output jack 841, a remote operation jack 842, and a USB connector 801 are housed on the side surface of the camera body 1a opposite to the grip 513 as external interfaces (see FIG. 6).

The exterior member 514 of the camera 1 is made of metal or conductive resin. However, instead of this, a configuration in which a conductive material is applied to the inside of the exterior member 514 may be employed.
(Internal configuration of imaging device)
Next, the internal configuration of the image pickup apparatus in the present embodiment will be described.

    4 to 7 are perspective views showing the internal configuration of the image pickup apparatus (camera) in this embodiment. 4 and 5 are perspective views seen from the front side and the back side of the camera, respectively. 6 and 7 are exploded perspective views as seen from the front side and the back side of the camera, respectively.

    A mount unit 508, a mirror box 511, and a shutter unit 32 are arranged in this order from the subject side on the subject side (front side) of the main body chassis 300 that is a skeleton of the camera body 1a. A finder unit 600 is disposed above the mirror box 511. The viewfinder unit 600 includes a penta roof mirror 22 and provides a subject image to a photographer.

    An image pickup unit 400, a first digital board 800, and an interface board 840 are disposed on the photographer side (back side) of the main body chassis 300. The image pickup unit 400 is fixed to an image pickup element attachment portion 511a of a mirror box 511 that serves as a reference to which the photographing lens unit is attached. At this time, the image pickup unit 400 is adjusted so that the image pickup surface of the image pickup element 33 is separated from the mount unit 508 by a predetermined distance and parallel to the mount unit 508.

    An A / D conversion board 830 is disposed on the back surface of the imaging unit 400. For example, an A / D converter 36 is disposed on the A / D conversion board 830. The A / D converter 36 converts the analog signal output from the image sensor 33 into a digital signal.

    When viewed from the front of the camera body 1a, a drive unit 32a, which is a part of the shutter unit 32, is disposed on the right side of the mirror box 511. The drive unit 32 a drives the shutter unit 32, drives the main mirror 512 and the sub mirror 30, and drives the strobe unit 504.

    A battery chamber 700 is disposed on the left side of the mirror box 511. A battery serving as a power source for the camera 1 is stored in the battery chamber 700.

    A power supply substrate 810 (strobe substrate) is disposed on the subject side (front side) of the battery chamber 700, that is, in the vicinity of the mount portion 508 of the battery chamber 700.

    The power supply substrate 810 is disposed on one side (subject side) of the battery chamber 700, and has a battery terminal 812 connected to the battery and a power supply circuit 110 (DC / DC conversion circuit) that generates a predetermined power supply voltage from the battery. Have

    A second digital board 820 is disposed on the photographer side (back side) of the battery chamber 700. The second digital board 820 is disposed between the battery chamber 700 and the first digital board 800. A slot 821 for inserting the external memory 39 is mounted on the second digital board 820.

    A first digital board 800 is disposed further on the photographer side (back side) of the second digital board 820. The first digital board 800 is arranged on the other side (photographer side) opposite to one side (subject side) of the battery chamber 700, and a power supply voltage is supplied to the first digital board 800 from the power supply circuit 110. An input MPU 100 is provided.

    As described above, the imaging apparatus according to the present exemplary embodiment is configured such that the second digital substrate 820 is disposed between the first digital substrate 800 and the battery chamber 700.

    The main body chassis 300 has a crank-shaped bent portion 300a. In the vicinity of the bent portion 300a, the battery chamber 700 is attached to the main body chassis 300.

    On the power supply substrate 810, a battery terminal 812, a power supply circuit 110, and a strobe drive circuit 113 are disposed. As described above, the battery terminal 812, the power supply circuit 110, and the strobe driving circuit 113 are disposed on the same substrate. Since these are arranged on the same substrate, the length of the wiring can be suppressed and the loss of power can be suppressed.

    In addition, a main capacitor 811 that is a part of the strobe driving circuit 113 is disposed on the power supply substrate 810. The main capacitor 811 is mounted on the power supply substrate 810 (strobe substrate) so as to be positioned between the mirror box 511 and the battery chamber 700. The main capacitor 811 is used for causing the strobe unit 504 (strobe device) to emit light.

    The second digital board 820 is provided with a circuit that is less affected by noise from the power supply circuit 110 such as the slot 821 for using the external memory 39 and the piezoelectric element driving circuit 111. In addition, the plurality of electronic components of the second digital board 820 are all mounted on the surface opposite to the battery chamber 700 (photographer side). A wiring layer of the second digital substrate 820 is interposed between the plurality of electronic components and the battery chamber 700. Thus, in this embodiment, a plurality of electronic components are mounted on the second digital board 820, and all these electronic components are on the surface opposite to the battery chamber 700 (photographer side). Has been implemented.

    The first digital substrate 800 is substantially L-shaped, and is provided with an MPU 100, a video signal processing circuit 104, a color liquid crystal driving circuit 112, and the like. As described above, the imaging apparatus according to the present exemplary embodiment includes the color liquid crystal monitor 529, and the video signal processing circuit 104 provided on the first digital substrate 800 outputs image data displayed on the color liquid crystal monitor 529. Generate.

    A USB connector 801 is disposed at the end opposite to the grip 513. According to such a configuration, it is possible to perform high-speed communication between the USB connector 801 and the MPU 100 on the same substrate.

The interface board 840 is provided with a video signal output jack 841 and a remote operation jack 842.
(Main capacitor)
Next, the configuration of the main capacitor 811 will be described with reference to FIGS. FIG. 8 shows the arrangement of the main capacitors in this embodiment. FIG. 9 shows the arrangement of the terminal portions of the main capacitor.

    As shown in FIG. 8, the main capacitor 811 is disposed between the image sensor mounting portion 511 a of the mirror box 511 and the mount portion 508. The main capacitor 811 is disposed between the mirror box 511 and the battery chamber 700 for storing the battery.

    The main capacitor 811 has two pairs of terminal portions 811a and 811b extending from the top of the main capacitor 811 and serving as positive and negative terminals. Two pairs of terminal portions 811a and 811b of the main capacitor 811 are bent toward the subject side of the camera 1 and connected to the power supply substrate 810 (strobe substrate). In this way, the main capacitor 811 is mounted on the power supply board 810.

    A mirror box 511 that houses the main mirror has an image sensor mounting portion 511a. The mirror box 511 is attached to the image pickup unit 400 by the image pickup element attachment portion 511a.

    The mount portion 508 is formed in a circular shape when viewed from the subject side so that the lens can be attached and detached. Further, the mount portion 508 is fixed to a rectangular parallelepiped mirror box 511 behind the mount portion 508. For this reason, the mount portion 508 has a protruding portion 508 a protruding from the mirror box 511. The protruding portion 508a corresponds to a left portion of the mount portion 508 when viewed from the subject side.

    As shown in FIG. 9, a power supply substrate 810 (strobe substrate) is disposed on the side surface of the battery chamber 700 in the vicinity of the mount portion 508. That is, the power supply board 810 is disposed on the subject side surface of the battery chamber 700. The power supply board 810 is provided with a power supply circuit including a battery terminal 812 connected to the battery and a power supply circuit 110.

    The terminal portion 811b of the main capacitor 811 is disposed behind the protruding portion 508a in the mount portion 508. That is, when the main capacitor 811 is viewed from the direction of the mount portion 508 (subject side), the terminal portion 811b is disposed so as to overlap the mount portion 508. In order to represent this state, in FIG. 9, the terminal part 811b is shown with the dotted line.

    Thus, in this embodiment, at least one of the two pairs of terminal portions 811a and 811b of the main capacitor 811 is disposed behind the protruding portion 508a in the mount portion 508. Further, as shown in FIG. 2, the exterior member 514 has a smooth curved surface from the mount portion 508 to the root of the grip 513. Accordingly, a space exists between the exterior member 514 near the protrusion 508a and the power supply substrate 810. Therefore, even when pressure is applied to the exterior member 514 of the camera 1 due to gripping or the like, the contact between the terminal portions 811a and 811b of the main capacitor 811 and the exterior member 514 can be prevented. As a result, it is possible to prevent the main capacitor 811 and the exterior member 514 from being short-circuited.

    As described above, according to the imaging apparatus of the present embodiment, it is possible to provide an imaging apparatus in which the reliability of the main capacitor for the built-in strobe is improved.

    In particular, in this embodiment, since the main capacitor can be efficiently arranged in the imaging apparatus, the imaging apparatus can be reduced in size. Further, since the terminal portion of the main capacitor is hidden in the mount portion, it is possible to prevent the terminal portion from being short-circuited.

    In the present embodiment, the main capacitor is disposed in the vicinity of the battery. For this reason, the loss at the time of accumulating an electric charge in a capacitor can be controlled.

    In this embodiment, both the battery terminal and the power supply circuit are mounted on the power supply board. For this reason, electrical loss can be suppressed. Further, by disposing the power supply substrate on the side surface on the mount side of the battery chamber, it is possible to easily discharge from the main capacitor terminal portion on the power supply substrate with the exterior member removed. Further, by using a conductive exterior member, it is possible to reduce the influence of electromagnetic waves on the operation of the imaging device.

    The embodiment of the present invention has been specifically described above. However, the present invention is not limited to the matters described in the above embodiments, and can be appropriately changed without departing from the technical idea thereof.

It is a block diagram which shows the main electrical structures of the imaging device in a present Example. It is the external appearance perspective view which looked at the imaging device in a present Example from the front side. It is the external appearance perspective view which looked at the imaging device in a present Example from the back side. It is the internal structure perspective view seen from the front side of the imaging device in a present Example. It is the internal structure perspective view seen from the back side of the imaging device in a present Example. It is the disassembled perspective view seen from the front side of the imaging device in a present Example. It is the disassembled perspective view seen from the back side of the imaging device in a present Example. It is a figure which shows arrangement | positioning of the main capacitor | condenser in a present Example. It is a figure which shows arrangement | positioning of the terminal part of the main capacitor | condenser in a present Example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1: Camera, 1a: Camera main body, 22: Pentada mirror, 30: Sub mirror, 31: Focus detection sensor unit, 32: Mechanical focal plane shutter, 33: Image sensor, 34: Clamp / CDS (correlated double sampling) circuit , 35: AGC circuit (automatic gain adjustment device), 36: A / D converter, 37: buffer memory, 38: memory controller, 39: external memory, 40: external interface, 41: liquid crystal display in viewfinder, 42: Power: 43: Main switch 46: Photometric sensor 100: MPU 100a: EEPROM 101: Mirror drive circuit 102: Focus detection circuit 103: Shutter drive circuit 104: Video signal processing circuit 105: Switch sense circuit 106: Photometry circuit, 107: Liquid crystal display drive circuit, 108: Battery Check circuit, 109: time measurement circuit, 110: power supply circuit, 111: piezoelectric element drive circuit, 112: color liquid crystal drive circuit, 113: strobe drive circuit, 200: photographing lens, 200a: photographing lens unit, 201: lens control Circuit: 202: AF driving unit, 203: Aperture driving unit, 204: Aperture, 300: Main body chassis, 400: Imaging unit, 410: Optical low-pass filter, 420: Optical low-pass filter holding member, 430: Piezoelectric element, 501: Power supply Switch, 502: Shooting mode setting dial, 503: Main operation dial, 504: Strobe unit, 505a, 505b: Strap attachment part, 506: Lens unlock button, 507: Mount contact, 508: Mount part, 508a: Projection part, 509: External memory housing lid, 5 0: Release button, 511: Mirror box, 512: Main mirror, 513: Grip, 514: Exterior member, 520: Viewfinder eyepiece window, 521: ISO sensitivity setting button, 522: AF frame selection button, 523: AE lock button, 524: Delete button, 525: Enter button, 526: Playback button, 527: Easy direct button, 528: Exposure compensation setting button, 529: Color liquid crystal monitor, 530: MENU button, 531: DISP button, 700: Battery compartment, 701 : Metal plate, 800: First digital board, 801: USB connector, 810: Power supply board, 811: Main capacitor, 812: Battery terminal, 820: Second digital board, 821: Slot, 841: For video signal output Jack, 842: For remote operation Jack

Claims (4)

An imaging unit including an imaging device that converts an optical image of a subject into an electrical signal;
A mirror box that houses the main mirror and is attached to the imaging unit by the imaging element mounting portion;
A mount portion fixed to the mirror box and capable of attaching and detaching a lens;
A main capacitor mounted on the strobe board and used to emit light from the strobe device,
The main capacitor is disposed between the image sensor mounting portion and the mount portion,
Two pairs of terminal portions of the main capacitor are mounted on the strobe board,
At least one of the two pairs of terminal portions is disposed behind a projecting portion of the mount portion.     The imaging apparatus according to claim 1, wherein the capacitor is disposed between the mirror box and a battery chamber for storing a battery.   The imaging apparatus according to claim 2, wherein the strobe substrate has a battery terminal connected to the battery and a power supply circuit, and is disposed on a side surface of the battery chamber in the vicinity of the mount portion.     4. The exterior member of the imaging device is made of metal or conductive resin, or a conductive material is applied to the inside of the exterior member. 5. Imaging device.