JP2015086376A - Curable epoxy resin composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a curable epoxy resin composition capable of forming a cured product having high heat, light and thermal shock resistances and particularly allowing improvement in conduction characteristics and moisture absorption reflow resistance of an optical semiconductor device at a high temperature.SOLUTION: A curable epoxy resin composition comprises an alicyclic epoxy compound (A), an isocyanuric acid derivative (B) having one or more oxirane rings in the molecule, and an organic aluminum compound (C). The isocyanuric acid derivative (B) having one or more oxirane rings in the molecule is preferably a compound represented by the formula (1-1).

Description

  The present invention relates to a curable epoxy resin composition, a cured product obtained by curing the curable epoxy resin composition, and an optical semiconductor device in which an optical semiconductor element is sealed with a cured product of the curable epoxy resin composition About.

  In recent years, the output of optical semiconductor devices has been increased, and high heat resistance and light resistance are required for a resin (encapsulant) that covers an optical semiconductor element in such an optical semiconductor device. Conventionally, as a sealing agent for forming a sealing material having high heat resistance, for example, a composition containing monoallyl diglycidyl isocyanurate and a bisphenol A type epoxy resin is known (see Patent Document 1). However, when the composition is used as a sealant for a high-output blue / white light semiconductor, the coloring of the sealant proceeds by light and heat emitted from the optical semiconductor element and should be output originally. As a result, the light is absorbed, and as a result, the intensity of the light output from the optical semiconductor device is lowered with time.

  3,4-epoxycyclohexylmethyl (3,4-epoxy) cyclohexanecarboxylate, 3,4 as a sealing agent that forms a cured product (sealing material) that has high heat resistance and light resistance and is not easily yellowed -Liquid alicyclic epoxy resins having an alicyclic skeleton such as an adduct of epoxycyclohexylmethyl (3,4-epoxy) cyclohexanecarboxylate and ε-caprolactone, 1,2,8,9-diepoxylimonene, etc. are known. ing. However, the cured products of these alicyclic epoxy resins are susceptible to various stresses, and cracks are generated when a thermal shock such as a cooling cycle (repeating heating and cooling periodically) is applied. Etc. had occurred.

  In addition, an optical semiconductor device (for example, a surface-mount type optical semiconductor device) generally undergoes a reflow process for bonding an electrode of the optical semiconductor device to a wiring board by soldering. In recent years, lead-free solder having a high melting point has been used as a solder as a bonding material, and heat treatment in a reflow process has become a higher temperature (for example, a peak temperature of 240 to 260 ° C.). . Under such circumstances, in the conventional optical semiconductor device, there is a problem of deterioration such that the sealing material is peeled off from the lead frame of the optical semiconductor device due to the heat treatment in the reflow process, or the sealing material is cracked. Has occurred.

  For this reason, the sealing material in the optical semiconductor device has high heat resistance and light resistance, and also has a characteristic that cracks are not easily generated when a thermal shock is applied (sometimes referred to as “thermal shock resistance”), and Further, there is a demand for characteristics in which cracks and peeling are unlikely to occur even when heat treatment is performed in the reflow process. In particular, in recent years, from the viewpoint of ensuring higher reliability of the sealing material, the optical semiconductor device is kept under high humidity conditions for a certain time (for example, 192 hours under conditions of 30 ° C. and 60% RH; 60 ° C., 60% RH). The above-mentioned cracks and peeling are not likely to occur even when heat treatment is performed in the reflow process after placing and absorbing moisture under the above conditions (such as 52 hours) (this characteristic is sometimes referred to as “moisture absorption reflow resistance”). ) Is also required.

JP 2000-344867 A

Accordingly, an object of the present invention is to have a high heat resistance, light resistance, and thermal shock resistance, and in particular, it is possible to form a cured product capable of improving the current-carrying characteristics and moisture absorption reflow resistance of an optical semiconductor device at high temperatures. The object is to provide a curable epoxy resin composition.
Another object of the present invention is to provide a cured product having high heat resistance, light resistance, and thermal shock resistance, and in particular, capable of improving current-carrying characteristics and moisture absorption reflow resistance at high temperatures of an optical semiconductor device. It is to provide.
In addition, another object of the present invention is to improve durability and quality, which is excellent in current-carrying characteristics at high temperature, further suppresses deterioration such as a decrease in luminous intensity when heat-treated in a reflow process after being stored under high humidity conditions. The object is to provide a high optical semiconductor device.

  As a result of intensive studies to solve the above problems, the present inventor has found that a curable epoxy resin composition comprising an alicyclic epoxy compound, an isocyanuric acid derivative having one or more oxirane rings in the molecule, and an organoaluminum compound. The present invention has found that a cured product having high heat resistance, light resistance, and thermal shock resistance can be formed, and in particular, a cured product capable of improving current-carrying characteristics and moisture absorption reflow resistance at high temperatures of an optical semiconductor device can be formed. Was completed.

  That is, the present invention includes a cycloaliphatic epoxy compound (A), an isocyanuric acid derivative (B) having one or more oxirane rings in the molecule, and an organoaluminum compound (C). An epoxy resin composition is provided.

［式中、Ｒ¹、Ｒ²は、同一又は異なって、水素原子又は炭素数１〜８のアルキル基を示す。］
で表される化合物である前記の硬化性エポキシ樹脂組成物を提供する。 Furthermore, the isocyanuric acid derivative (B) having one or more oxirane rings in the molecule is represented by the following formula (1-1):

[Wherein, R ¹ and R ² are the same or different and each represents a hydrogen atom or an alkyl group having 1 to 8 carbon atoms. ]
The said curable epoxy resin composition which is a compound represented by these is provided.

  Furthermore, the curable epoxy resin composition is provided in which the organoaluminum compound (C) is 9-octadecenyl acetoacetate aluminum diisopropylate.

  Furthermore, the curable epoxy resin composition is provided in which the alicyclic epoxy compound (A) is a compound having a cyclohexene oxide group.

で表される化合物である前記の硬化性エポキシ樹脂組成物を提供する。 Furthermore, the alicyclic epoxy compound (A) is represented by the following formula (I-1)

The said curable epoxy resin composition which is a compound represented by these is provided.

  Furthermore, the said curable epoxy resin composition containing a rubber particle is provided.

  Furthermore, the said curable epoxy resin composition containing a hardening | curing agent (D) and a hardening accelerator (E) is provided.

  Furthermore, the said curable epoxy resin composition containing a curing catalyst (F) is provided.

  The present invention also provides a cured product obtained by curing the curable epoxy resin composition.

  Furthermore, the said curable epoxy resin composition which is a resin composition for optical semiconductor sealing is provided.

  Moreover, this invention provides the optical semiconductor device by which the optical semiconductor element was sealed with the hardened | cured material of the said curable epoxy resin composition.

  Since the curable epoxy resin composition of the present invention has the above-described configuration, it has high heat resistance, light resistance, and thermal shock resistance by curing the resin composition. A cured product capable of improving characteristics and moisture absorption reflow resistance can be formed. For this reason, when the curable epoxy resin composition of the present invention is used as a resin composition for optical semiconductor encapsulation, deterioration such as a decrease in luminous intensity is unlikely to occur especially under severe conditions at high temperatures. It is possible to obtain an optical semiconductor device having high durability and high quality, which is less likely to deteriorate such as a decrease in luminous intensity even when heat treatment is performed in a reflow process after storage under conditions.

It is the schematic which shows one Embodiment of the optical semiconductor device by which the optical semiconductor element was sealed with the hardened | cured material of the curable epoxy resin composition of this invention. The left figure (a) is a perspective view, and the right figure (b) is a sectional view. It is an example of the surface temperature profile (temperature profile in one heat processing among two heat processing) of the optical semiconductor device in the solder heat resistance test of an Example.

<Curable epoxy resin composition>
The curable epoxy resin composition of the present invention comprises an alicyclic epoxy compound (A) and an isocyanuric acid derivative (B) having one or more oxirane rings in the molecule (referred to as “isocyanuric acid derivative (B)”). And an organoaluminum compound (C) as essential components (curable composition).

[Alicyclic epoxy compound (A)]
The alicyclic epoxy compound (A) in the curable epoxy resin composition of the present invention is a compound having at least an alicyclic (aliphatic ring) structure and an epoxy group (oxiranyl group) in the molecule (in one molecule). . As the alicyclic epoxy compound (A), specifically, (i) a compound having an epoxy group (alicyclic epoxy group) composed of two adjacent carbon atoms and oxygen atoms constituting the alicyclic ring, (Ii) A compound in which an epoxy group is directly bonded to the alicyclic ring with a single bond, and the like.

  The compound having an epoxy group (alicyclic epoxy group) composed of two adjacent carbon atoms and oxygen atoms constituting the alicyclic ring (i) is arbitrarily selected from known or commonly used compounds. Can be used. Especially, as said alicyclic epoxy group, a cyclohexene oxide group is preferable.

As the compound (i) having an epoxy group composed of two adjacent carbon atoms and oxygen atoms constituting the alicyclic ring, a compound having a cyclohexene oxide group is preferable from the viewpoint of transparency and heat resistance. In particular, a compound (alicyclic epoxy compound) represented by the following formula (I) is preferable.

  In the above formula (I), X represents a single bond or a linking group (a divalent group having one or more atoms). Examples of the linking group include divalent hydrocarbon groups, alkenylene groups in which part or all of carbon-carbon double bonds are epoxidized, carbonyl groups, ether bonds, ester bonds, carbonate groups, amide groups, and the like. And a group in which a plurality of are connected.

  Examples of the compound in which X in the above formula (I) is a single bond include 3,4,3 ′, 4′-diepoxybicyclohexane and the like.

  As said bivalent hydrocarbon group, a C1-C18 linear or branched alkylene group, a bivalent alicyclic hydrocarbon group, etc. are mentioned. Examples of the linear or branched alkylene group having 1 to 18 carbon atoms include a methylene group, a methylmethylene group, a dimethylmethylene group, an ethylene group, a propylene group, and a trimethylene group. Examples of the divalent alicyclic hydrocarbon group include 1,2-cyclopentylene group, 1,3-cyclopentylene group, cyclopentylidene group, 1,2-cyclohexylene group, 1,3-cyclopentylene group, And divalent cycloalkylene groups (including cycloalkylidene groups) such as cyclohexylene group, 1,4-cyclohexylene group, and cyclohexylidene group.

  Examples of the alkenylene group in the alkenylene group in which part or all of the carbon-carbon double bond is epoxidized (sometimes referred to as “epoxidized alkenylene group”) include, for example, a vinylene group, a propenylene group, and a 1-butenylene group. , A 2-butenylene group, a butadienylene group, a pentenylene group, a hexenylene group, a heptenylene group, an octenylene group, etc., and a linear or branched alkenylene group having 2 to 8 carbon atoms. In particular, the epoxidized alkenylene group is preferably an alkenylene group in which all of the carbon-carbon double bonds are epoxidized, more preferably 2 to 4 carbon atoms in which all of the carbon-carbon double bonds are epoxidized. Alkenylene group.

  The linking group X is particularly preferably a linking group containing an oxygen atom, specifically, —CO—, —O—CO—O—, —COO—, —O—, —CONH—, epoxidation. An alkenylene group; a group in which a plurality of these groups are linked; a group in which one or more of these groups are linked to one or more of divalent hydrocarbon groups, and the like. Examples of the divalent hydrocarbon group include those exemplified above.

Representative examples of the alicyclic epoxy compound represented by the above formula (I) include compounds represented by the following formulas (I-1) to (I-10), bis (3,4-epoxycyclohexylmethyl). ) Ether, 1,2-bis (3,4-epoxycyclohexane-1-yl) ethane, 1,2-epoxy-1,2-bis (3,4-epoxycyclohexane-1-yl) ethane, 2,2 -Bis (3,4-epoxycyclohexane-1-yl) propane and the like. In the following formulas (I-5) and (I-7), l and m each represent an integer of 1 to 30. R in the following formula (I-5) is an alkylene group having 1 to 8 carbon atoms, methylene group, ethylene group, propylene group, isopropylene group, butylene group, isobutylene group, s-butylene group, pentylene group, hexylene. And linear or branched alkylene groups such as a group, a heptylene group, and an octylene group. Among these, C1-C3 linear or branched alkylene groups, such as a methylene group, ethylene group, a propylene group, an isopropylene group, are preferable. N1 to n6 in the following formulas (I-9) and (I-10) each represent an integer of 1 to 30.

Examples of the compound (ii) in which the epoxy group is directly bonded to the alicyclic ring with a single bond include compounds represented by the following formula (II).

In formula (II), R ′ is a group (p-valent organic group) obtained by removing p hydroxyl groups (—OH) from the structural formula of a p-valent alcohol, and p and n each represent a natural number. Examples of the p-valent alcohol [R ′ (OH) _p ] include polyhydric alcohols (such as alcohols having 1 to 15 carbon atoms) such as 2,2-bis (hydroxymethyl) -1-butanol. p is preferably 1 to 6, and n is preferably 1 to 30. When p is 2 or more, n in each group in () (inside the outer parenthesis) may be the same or different. Specific examples of the compound represented by the above formula (II) include 1,2-epoxy-4- (2-oxiranyl) cyclohexane adduct of 2,2-bis (hydroxymethyl) -1-butanol [for example, , Trade name “EHPE3150” (manufactured by Daicel Corporation), etc.].

  In the curable epoxy resin composition of the present invention, the alicyclic epoxy compound (A) can be used singly or in combination of two or more. In addition, as the alicyclic epoxy compound (A), for example, commercially available products such as trade names “Celoxide 2021P” and “Celoxide 2081” (manufactured by Daicel Corporation) may be used.

  As the alicyclic epoxy compound (A), a compound represented by the above formula (I-1) [3,4-epoxycyclohexylmethyl (3,4-epoxy) cyclohexanecarboxylate; for example, trade name “Celoxide 2021P” (Daicel Co., Ltd.) etc. are particularly preferred.

  The content (blending amount) of the alicyclic epoxy compound (A) in the curable epoxy resin composition of the present invention is not particularly limited, but is 10 with respect to the total amount (100% by weight) of the curable epoxy resin composition. -95 weight% is preferable, More preferably, it is 15-92 weight%, More preferably, it is 20-90 weight%. By controlling the content of the alicyclic epoxy compound (A) within the above range, the curability of the curable epoxy resin composition tends to be further improved, and the heat resistance and mechanical strength of the cured product tend to be further improved. .

  In the curable epoxy resin composition of the present invention, the alicyclic epoxy compound (A) relative to the total amount (100% by weight) of the alicyclic epoxy compound (A), the isocyanuric acid derivative (B), and the organoaluminum compound (C). Although the ratio of is not specifically limited, 25 to 95 weight% is preferable, More preferably, it is 35 to 92 weight%, More preferably, it is 45 to 90 weight%. By setting the ratio of the alicyclic epoxy compound (A) to 25% by weight or more, the curability of the curable epoxy resin composition tends to be further improved, and the heat resistance of the cured product tends to be further improved. On the other hand, when the ratio of the alicyclic epoxy compound (A) is 95% by weight or less, the thermal shock resistance of the cured product tends to be further improved.

[Isocyanuric acid derivative (B)]
The isocyanuric acid derivative (B) in the curable epoxy resin composition of the present invention is a derivative of isocyanuric acid and is a compound having at least one oxirane ring in the molecule. The number of oxirane rings in the molecule of the isocyanuric acid derivative (B) may be one or more, and is not particularly limited, but is preferably 1 to 6, and more preferably 1 to 3.

As an isocyanuric acid derivative (B), the compound represented by following formula (1) is mentioned, for example.

In the formula (1), R ^X , R ^Y , and R ^Z (R ^{X to} R ^Z ) are the same or different and represent a hydrogen atom or a monovalent organic group. However, at least one of R ^{X to} R ^Z is a monovalent organic group containing an oxirane ring. Examples of the monovalent organic group include a monovalent aliphatic hydrocarbon group (for example, an alkyl group and an alkenyl group); a monovalent aromatic hydrocarbon group (for example, an aryl group); A cyclic group; a monovalent group formed by combining two or more of an aliphatic hydrocarbon group, an alicyclic hydrocarbon group, and an aromatic hydrocarbon group. The monovalent organic group may have a substituent (for example, a substituent such as a hydroxy group, a carboxy group, or a halogen atom). Examples of the monovalent organic group containing an oxirane ring include groups having an oxirane ring such as an epoxy group, a glycidyl group, a 2-methylepoxypropyl group, and a cyclohexene oxide group.

More specifically, as the isocyanuric acid derivative (B), a compound represented by the following formula (1-1) (monoallyl diglycidyl isocyanurate compound), a compound represented by the following formula (1-2) ( Diallyl monoglycidyl isocyanurate compound), a compound represented by the following formula (1-3) (triglycidyl isocyanurate compound), and the like.

In the above formula (1-1), formula (1-2), and formula (1-3) (formulas (1-1) to (1-3)), R ¹ and R ² are the same or different, A hydrogen atom or an alkyl group having 1 to 8 carbon atoms is shown. Examples of the alkyl group having 1 to 8 carbon atoms include methyl, ethyl, propyl, isopropyl, butyl, isobutyl, s-butyl, pentyl, hexyl, heptyl, and octyl groups. Examples thereof include a chain or branched alkyl group. Among these, a linear or branched alkyl group having 1 to 3 carbon atoms such as a methyl group, an ethyl group, a propyl group, and an isopropyl group is preferable. R ¹ and R ² in the above formulas (1-1) to (1-3) are particularly preferably hydrogen atoms.

  Representative examples of the compound represented by the above formula (1-1) include monoallyl diglycidyl isocyanurate, 1-allyl-3,5-bis (2-methylepoxypropyl) isocyanurate, 1- (2 -Methylpropenyl) -3,5-diglycidyl isocyanurate, 1- (2-methylpropenyl) -3,5-bis (2-methylepoxypropyl) isocyanurate and the like.

  Representative examples of the compound represented by the formula (1-2) include diallyl monoglycidyl isocyanurate, 1,3-diallyl-5- (2-methylepoxypropyl) isocyanurate, 1,3-bis ( 2-methylpropenyl) -5-glycidyl isocyanurate, 1,3-bis (2-methylpropenyl) -5- (2-methylepoxypropyl) isocyanurate and the like.

  Typical examples of the compound represented by the above formula (1-3) include triglycidyl isocyanurate, tris (2-methylepoxypropyl) isocyanurate, and the like.

  The isocyanuric acid derivative (B) may be modified in advance by adding a compound that reacts with an oxirane ring such as alcohol or acid anhydride.

  Among these, as the isocyanuric acid derivative (B), compounds represented by the above formulas (1-1) to (1-3) are preferable from the viewpoint of heat resistance and thermal shock resistance of the cured product, and more preferably the above formula. It is a compound represented by (1-1). In the curable epoxy resin composition of the present invention, the isocyanuric acid derivative (B) can be used alone or in combination of two or more. Examples of the isocyanuric acid derivative (B) include, for example, trade names “TEPIC” (manufactured by Nissan Chemical Industries, Ltd.); trade names “MA-DGIC”, “DA-MGIC” (above, Shikoku Kasei Kogyo Co., Ltd.) (Commercially available) can also be used.

  Although content (blending amount) of the isocyanuric acid derivative (B) in the curable epoxy resin composition of the present invention is not particularly limited, it is 5 to 120 parts by weight with respect to 100 parts by weight of the alicyclic epoxy compound (A). Is preferable, more preferably 8 to 110 parts by weight, still more preferably 10 to 105 parts by weight. By setting the content of the isocyanuric acid derivative (B) to 5 parts by weight or more, the adhesion of the cured product to the electrode and the thermal shock resistance tend to be further improved. On the other hand, if the content of the isocyanuric acid derivative (B) exceeds 120 parts by weight, the solubility of the isocyanuric acid derivative (B) in the curable epoxy resin composition is lowered, and the physical properties of the cured product may be adversely affected. .

  The ratio of the isocyanuric acid derivative (B) to the total amount (100% by weight) of the cationic polymerizable compound contained in the curable epoxy resin composition of the present invention is not particularly limited, but is preferably 1 to 60% by weight, more preferably It is 5-55 weight%, More preferably, it is 8-55 weight%. By setting the proportion of the isocyanuric acid derivative (B) to 1% by weight or more, the adhesion of the cured product to the electrode and the thermal shock resistance tend to be further improved. On the other hand, if the proportion of the isocyanuric acid derivative (B) exceeds 60% by weight, the solubility of the isocyanuric acid derivative (B) in the curable epoxy resin composition is lowered, and the physical properties of the cured product may be adversely affected.

[Organic aluminum compound (C)]
As the organoaluminum compound (C) in the curable epoxy resin composition of the present invention, a known or commonly used organoaluminum compound can be used, and is not particularly limited. For example, a known compound as an aluminum-based coupling agent is used. Can be used. Examples of the organoaluminum compound (C) include organoaluminum compounds having a non-chelate structure, organoaluminum compounds having a chelate structure (sometimes referred to as “aluminum chelate compounds”), aluminum oligomers, and the like.

  Specific examples of the organoaluminum compound having a non-chelate structure include aluminum ethylate, aluminum isopropylate, monosec-butoxyaluminum diisopropylate, aluminum sec-butyrate, and the like.

Specific examples of the organoaluminum compound (aluminum chelate compound) having the above chelate structure include, for example, an aluminum chelate compound represented by the following formula (2) [for example, 9-octadecenyl acetoacetate aluminum diisopropylate. , Ethyl acetoacetate aluminum diisopropylate, etc.], an aluminum chelate compound represented by the following formula (3) or formula (4) [for example, an aluminum chelate compound disclosed in International Publication No. 2000/078703], aluminum tris (Ethyl acetoacetate), aluminum monoacetylacetonate bis (ethylacetonate), aluminum tris (acetylacetonate) and the like.

In formula (2), R ³ and R ⁴ are the same or different and are a linear or branched alkyl group having 1 to 18 carbon atoms, or a linear or branched alkenyl group having 2 to 18 carbon atoms. Indicates a group. Examples of the linear or branched alkyl group having 1 to 18 carbon atoms include, for example, methyl group, ethyl group, propyl group, isopropyl group, s-propyl group, butyl group, isobutyl group, s-butyl group, t- Butyl, pentyl, hexyl, heptyl, octyl, 2-ethylhexyl, nonyl, decyl, undecyl, dodecyl, tridecyl, tetradecyl, pentadecyl, hexadecyl, heptadecyl, octadecyl, etc. Is mentioned. Examples of the linear or branched alkenyl group having 2 to 18 carbon atoms include vinyl group, 1-propenyl group, 2-propenyl group, 2-butenyl group, 3-butenyl group, hexenyl group and decenyl group. Can be mentioned. In formula (2), R ⁵ and R ⁶ are the same or different and are a linear or branched alkyl group having 1 to 18 carbon atoms, or a linear or branched chain having 1 to 18 carbon atoms. An alkenyl group of Examples of R ⁵ and R ⁶ include the same groups as R ³ (or R ⁴ ).

In Formula (3) and Formula (4), R ⁷ is a linear or branched alkylene group having 2 to 6 carbon atoms, a linear or branched alkenylene group having 2 to 6 carbon atoms, or a molecular weight. 72-300 polyoxyalkylene groups are shown. The alkylene group and alkenylene group may be a group in which at least one hydrogen atom is substituted with a hydroxy group. Examples of the alkylene group include an ethylene group, a propylene group, a trimethylene group, a tetramethylene group, and a hexamethylene group. Examples of the alkenylene group include an ethenylene group and a propenylene group. Examples of the polyoxyalkylene group include groups having a molecular weight of 72 to 300, such as a polyoxyalkylene group such as a polyoxyethylene group, a polyoxypropylene group, and a polyoxybutylene group.

Moreover, in Formula (3) and Formula (4), R < ⁸ > and R < ⁹ > are the same or different, and a C1-C18 linear or branched alkyl group, or C2-C18 direct A chain or branched alkenyl group is exemplified, and the same group as R ³ (or R ⁴ ) in the formula (2) is exemplified. In the formula (4), R ¹⁰ represents a linear or branched alkyl group having 1 to 18 carbon atoms, or a linear or branched alkenyl group having 2 to 18 carbon atoms. Examples thereof are the same groups as R ³ (or R ⁴ ) in 2).

Among them, the organoaluminum compound (C) is preferably an organoaluminum compound having a chelate structure, more preferably a compound represented by formula (2), formula (3), or formula (4), more preferably formula ( 2) (particularly, alkyl or alkenyl acetoacetate aluminum diisopropylate in which R ³ and R ⁴ in formula (2) are isopropyl groups and R ⁵ is a methyl group). The organoaluminum compound (C) can be produced by a known or conventional method. Moreover, as an organoaluminum compound (C), commercial items, such as a brand name "Plenact AL-M" (Ajinomoto Fine Techno Co., Ltd. product), can also be used, for example.

  Although content (blending amount) of the organoaluminum compound (C) in the curable epoxy resin composition of the present invention is not particularly limited, the total amount of the alicyclic epoxy compound (A) and the isocyanuric acid derivative (B) is 100 parts by weight. The amount is preferably 0.01 to 10 parts by weight, more preferably 0.1 to 5 parts by weight, and still more preferably 0.3 to 3 parts by weight. By setting the content of the organoaluminum compound (C) to 0.01 parts by weight or more, the adhesion of the cured product to the electrode and the thermal shock resistance tend to be further improved. On the other hand, when the content of the organoaluminum compound (C) is 10 parts by weight or less, the transparency of the cured product tends to be maintained at a high level.

[Curing agent (D)]
The curable epoxy resin composition of the present invention may further contain a curing agent (D). The curing agent (D) is a compound having a function of curing the curable epoxy resin composition by reacting with a compound having an epoxy group such as an alicyclic epoxy compound (A) or an isocyanuric acid derivative (B). . As the curing agent (D), a known or conventional curing agent can be used as a curing agent for epoxy resin, and is not particularly limited. For example, acid anhydrides (acid anhydride curing agents), amines ( Amine curing agents), polyamide resins, imidazoles (imidazole curing agents), polymercaptans (polymercaptan curing agents), phenols (phenolic curing agents), polycarboxylic acids, dicyandiamides, organic acid hydrazides, etc. Can be mentioned.

  As the acid anhydrides (acid anhydride curing agents) as the curing agent (D), known or commonly used acid anhydride curing agents can be used, and are not particularly limited. For example, methyltetrahydrophthalic anhydride (4 -Methyltetrahydrophthalic anhydride, 3-methyltetrahydrophthalic anhydride, etc.), methylhexahydrophthalic anhydride (such as 4-methylhexahydrophthalic anhydride, 3-methylhexahydrophthalic anhydride), dodecenyl succinic anhydride, methyl Endomethylenetetrahydrophthalic anhydride, phthalic anhydride, maleic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylcyclohexene dicarboxylic anhydride, pyromellitic anhydride, trimellitic anhydride, benzophenonetetracarboxylic anhydride, anhydrous Nadic acid, anhydrous methyl nadic acid, methyl hydride Dic anhydride, 4- (4-methyl-3-pentenyl) tetrahydrophthalic anhydride, succinic anhydride, adipic anhydride, sebacic anhydride, dodecanedioic anhydride, methylcyclohexene tetracarboxylic anhydride, vinyl ether-maleic anhydride Examples include acid copolymers and alkylstyrene-maleic anhydride copolymers. Among these, acid anhydrides [for example, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, dodecenyl succinic anhydride, methylendomethylenetetrahydrophthalic anhydride, etc.] that are liquid at 25 ° C. are preferable from the viewpoint of handleability. On the other hand, for a solid acid anhydride at 25 ° C., for example, by dissolving in a liquid acid anhydride at 25 ° C. to form a liquid mixture, the curing agent (D in the curable epoxy resin composition of the present invention (D ) Tends to be improved. As the acid anhydride curing agent, saturated monocyclic hydrocarbon dicarboxylic acid anhydrides (including those in which a substituent such as an alkyl group is bonded to the ring) are preferable from the viewpoint of heat resistance and transparency of the cured product.

  As the amines (amine-based curing agent) as the curing agent (D), a known or conventional amine-based curing agent can be used, and is not particularly limited. For example, ethylenediamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, Aliphatic polyamines such as dipropylenediamine, diethylaminopropylamine, polypropylenetriamine; mensendiamine, isophoronediamine, bis (4-amino-3-methyldicyclohexyl) methane, diaminodicyclohexylmethane, bis (aminomethyl) cyclohexane, N-amino Cycloaliphatic polyamines such as ethylpiperazine, 3,9-bis (3-aminopropyl) -3,4,8,10-tetraoxaspiro [5,5] undecane; m-phenylenediamine, p-phenylenediamine, tri 2,4-diamine, tolylene-2,6-diamine, mesitylene-2,4-diamine, 3,5-diethyltolylene-2,4-diamine, 3,5-diethyltolylene-2,6- Examples include mononuclear polyamines such as diamine, aromatic polyamines such as biphenylenediamine, 4,4-diaminodiphenylmethane, 2,5-naphthylenediamine, and 2,6-naphthylenediamine.

  As the phenols (phenolic curing agents) as the curing agent (D), known or conventional phenolic curing agents can be used, and are not particularly limited. For example, novolac type phenol resins, novolac type cresol resins, paraxylylene-modified phenols. Examples thereof include aralkyl resins such as resins, paraxylylene / metaxylylene-modified phenol resins, terpene-modified phenol resins, dicyclopentadiene-modified phenol resins, and triphenol propane.

  Examples of the polyamide resin as the curing agent (D) include a polyamide resin having one or both of a primary amino group and a secondary amino group in the molecule.

  As the imidazole (imidazole curing agent) as the curing agent (D), a known or commonly used imidazole curing agent can be used, and is not particularly limited. For example, 2-methylimidazole, 2-ethyl-4-methylimidazole 2-undecylimidazole, 2-heptadecylimidazole, 2-phenylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1 -Cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2-methylimidazolium isocyanurate, 2-phenylimidazolium isocyanate Nu 2,4-diamino-6- [2-methylimidazolyl- (1)]-ethyl-s-triazine, 2,4-diamino-6- [2-ethyl-4-methylimidazolyl- (1)] -Ethyl-s-triazine and the like.

  Examples of the polymercaptans (polymercaptan-based curing agent) as the curing agent (D) include liquid polymercaptans and polysulfide resins.

  Examples of polycarboxylic acids as the curing agent (D) include adipic acid, sebacic acid, terephthalic acid, trimellitic acid, carboxy group-containing polyester, and the like.

  Especially, as a hardening | curing agent (D), an acid anhydride (acid anhydride type hardening | curing agent) is preferable from a heat resistant and transparent viewpoint of hardened | cured material. In addition, the hardening | curing agent (D) can also be used individually by 1 type in the curable epoxy resin composition of this invention, and can also be used in combination of 2 or more type. Moreover, a commercial item can also be used as a hardening | curing agent (D). For example, as commercial products of acid anhydrides, trade names “Licacid MH-700” and “Licacid MH-700F” (manufactured by Shin Nippon Rika Co., Ltd.); trade name “HN-5500” (Hitachi Chemical Industries) Etc.).

  The content (blending amount) of the curing agent (D) in the curable epoxy resin composition of the present invention is not particularly limited, but is 100 parts by weight based on the total amount of compounds having an epoxy group contained in the curable epoxy resin composition. The amount is preferably 50 to 200 parts by weight, more preferably 80 to 150 parts by weight. More specifically, when acid anhydrides are used as the curing agent (D), 0.5% per equivalent of epoxy group in the compound having all epoxy groups contained in the curable epoxy resin composition of the present invention. It is preferable to use it at a ratio of ˜1.5 equivalents. By making content of a hardening | curing agent (D) into 50 weight part or more, hardening can fully be advanced and there exists a tendency for the toughness of hardened | cured material to improve more. On the other hand, when the content of the curing agent (D) is 200 parts by weight or less, coloring tends to be suppressed and a cured product having excellent hue tends to be obtained.

[Curing accelerator (E)]
When the curable epoxy resin composition of the present invention contains a curing agent (D), it is preferable to further contain a curing accelerator (E). A hardening accelerator (E) is a compound which has a function which accelerates | stimulates the reaction rate, when the compound which has an epoxy group reacts with a hardening | curing agent (D). The curing accelerator (E) may be a known or conventional curing accelerator, and is not particularly limited. For example, 1,8-diazabicyclo [5.4.0] undecene-7 (DBU) or a salt thereof (for example, , Phenol salt, octylate, p-toluenesulfonate, formate, tetraphenylborate salt, etc.); 1,5-diazabicyclo [4.3.0] nonene-5 (DBN) or a salt thereof (for example, phenol Salt, octylate, p-toluenesulfonate, formate, tetraphenylborate salt, etc.); benzyldimethylamine, 2,4,6-tris (dimethylaminomethyl) phenol, N, N-dimethylcyclohexylamine, etc. Tertiary amines; Imidazoles such as 2-ethyl-4-methylimidazole and 1-cyanoethyl-2-ethyl-4-methylimidazole; Acid esters; phosphines such as triphenylphosphine and tris (dimethoxy) phosphine; phosphonium compounds such as tetraphenylphosphonium tetra (p-tolyl) borate; organometallic salts such as zinc octylate, tin octylate and zinc stearate; Examples thereof include metal chelates such as aluminum acetylacetone complex.

  In addition, a hardening accelerator (E) can also be used individually by 1 type in a curable epoxy resin composition of this invention, and can also be used in combination of 2 or more type. Further, as the curing accelerator (E), trade names “U-CAT SA 506”, “U-CAT SA 102”, “U-CAT 5003”, “U-CAT 18X”, “U-CAT 12XD” ( (Developed product) (San Apro Co., Ltd.); trade names "TPP-K", "TPP-MK" (Hokuko Chemical Co., Ltd.); trade name "PX-4ET" (Nippon Chemical Industry ( It is also possible to use a commercial product such as a product manufactured by Co., Ltd.

  The content (blending amount) of the curing accelerator (E) in the curable epoxy resin composition of the present invention is not particularly limited, but the total amount of compounds having epoxy groups contained in the curable epoxy resin composition is 100 parts by weight. On the other hand, 0.01-5 weight part is preferable, More preferably, it is 0.03-3 weight part, More preferably, it is 0.03-2 weight part. By setting the content of the curing accelerator (E) to 0.01 parts by weight or more, a more efficient curing promoting effect tends to be obtained. On the other hand, by setting the content of the curing accelerator (E) to 5 parts by weight or less, coloring tends to be suppressed and a cured product excellent in hue tends to be obtained.

[Curing catalyst (F)]
The curable epoxy resin composition of the present invention may further contain a curing catalyst (F) (for example, instead of the curing agent (D)). The curing catalyst (F) is a curable epoxy resin composition by initiating and / or accelerating the curing reaction (polymerization reaction) of a cationic curable compound such as an alicyclic epoxy compound (A) or an isocyanuric acid derivative (B). It is a compound that has the function of curing an object. The curing catalyst (F) is not particularly limited. For example, a cationic polymerization initiator (photo cationic polymerization initiator, thermal cationic polymerization) that initiates polymerization by generating cationic species by performing light irradiation, heat treatment, or the like. Initiators, etc.), Lewis acid / amine complexes, Bronsted acid salts, imidazoles and the like.

  Examples of the photocationic polymerization initiator as the curing catalyst (F) include hexafluoroantimonate salts, pentafluorohydroxyantimonate salts, hexafluorophosphate salts, hexafluoroarsenate salts, and more specifically. For example, triarylsulfonium hexafluorophosphate (for example, p-phenylthiophenyldiphenylsulfonium hexafluorophosphate), sulfonium salt such as triarylsulfonium hexafluoroantimonate (particularly, triarylsulfonium salt); diaryl iodonium hexafluorophosphate , Diaryl iodonium hexafluoroantimonate, bis (dodecylphenyl) iodonium tetrakis (pentafluorophenyl) borate, iodo Iodonium salts such as um [4- (4-methylphenyl-2-methylpropyl) phenyl] hexafluorophosphate; phosphonium salts such as tetrafluorophosphonium hexafluorophosphate; pyridinium salts such as N-hexylpyridinium tetrafluoroborate It is done. Moreover, as a photocationic polymerization initiator, for example, trade name “UVACURE1590” (manufactured by Daicel Cytec Co., Ltd.); trade names “CD-1010”, “CD-1011”, “CD-1012” (above, the United States) Commercial products such as Sartomer); trade name “Irgacure 264” (manufactured by BASF); trade name “CIT-1682” (manufactured by Nippon Soda Co., Ltd.) can be preferably used.

  Examples of the thermal cationic polymerization initiator as the curing catalyst (F) include aryldiazonium salts, aryliodonium salts, arylsulfonium salts, allene-ion complexes, etc., and trade names “PP-33”, “CP-66”. "CP-77" (manufactured by ADEKA); trade name "FC-509" (manufactured by 3M); trade name "UVE1014" (manufactured by GE); trade name "Sun-Aid SI-60L" “Sun-Aid SI-80L”, “Sun-Aid SI-100L”, “Sun-Aid SI-110L”, “Sun-Aid SI-150L” (manufactured by Sanshin Chemical Industry Co., Ltd.); trade name “CG-24-61” ( Commercially available products such as BASF) can be preferably used. Further, as the thermal cationic polymerization initiator, a compound of a chelate compound of a metal such as aluminum or titanium and acetoacetic acid or diketone and a silanol such as triphenylsilanol, or a metal such as aluminum or titanium and acetoacetic acid or diketone Examples thereof include a compound of a chelate compound with a phenol and a phenol such as bisphenol S.

As the Lewis acid / amine complex as the curing catalyst (F), a known or commonly used Lewis acid / amine complex-based curing catalyst can be used, and is not particularly limited. For example, BF ₃ .n-hexylamine, BF ₃ · monoethylamine, BF ₃ · benzylamine, BF ₃ · diethylamine, BF ₃ · piperidine, BF ₃ · triethylamine, BF ₃ · aniline, BF ₄ - n-hexylamine, BF ₄ - monoethylamine, BF ₄ - benzylamine , BF ₄ · diethylamine, BF ₄ · piperidine, BF ₄ · triethylamine, BF ₄ · aniline, PF ₅ · ethylamine, PF ₅ · isopropylamine, PF ₅ · butylamine, PF ₅ · laurylamine, PF ₅ · benzylamine, AsF _5. Laurylamine etc. are mentioned.

  As the Bronsted acid salts as the curing catalyst (F), known or commonly used Bronsted acid salts can be used, and are not particularly limited. For example, aliphatic sulfonium salts, aromatic sulfonium salts, iodonium salts, phosphoniums. Examples include salts.

  As the imidazoles as the curing catalyst (F), known or conventional imidazoles can be used, and are not particularly limited. For example, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-undecyl Imidazole, 2-heptadecylimidazole, 2-phenylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2- Undecylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2-methylimidazolium isocyanurate, 2-phenylimidazolium isocyanurate, 2,4 - Mino-6- [2-methylimidazolyl- (1)]-ethyl-s-triazine, 2,4-diamino-6- [2-ethyl-4-methylimidazolyl- (1)]-ethyl-s-triazine, etc. Is mentioned.

  In the curable epoxy resin composition of the present invention, the curing catalyst (F) can be used alone or in combination of two or more. In addition, as above-mentioned, a commercial item can also be used as a curing catalyst (F).

  The content (blending amount) of the curing catalyst (F) in the curable epoxy resin composition of the present invention is not particularly limited, but is based on 100 parts by weight of the total amount of the cationic curable compound contained in the curable epoxy resin composition. 0.01 to 15 parts by weight, more preferably 0.01 to 12 parts by weight, still more preferably 0.05 to 10 parts by weight, and particularly preferably 0.05 to 8 parts by weight. By using the curing catalyst (F) within the above range, the curing rate of the curable epoxy resin composition is increased, and the heat resistance and transparency of the cured product tend to be improved in a balanced manner.

[Rubber particles]
The curable epoxy resin composition of the present invention may further contain rubber particles. Examples of the rubber particles include rubber particles such as particulate NBR (acrylonitrile-butadiene rubber), reactive terminal carboxy group NBR (CTBN), metal-free NBR, particulate SBR (styrene-butadiene rubber). The rubber particles are preferably rubber particles having a multilayer structure (core-shell structure) composed of a core portion having rubber elasticity and at least one shell layer covering the core portion. The rubber particles are particularly composed of a polymer (polymer) having (meth) acrylic acid ester as an essential monomer component, and a functional group capable of reacting with a compound having an epoxy group such as an alicyclic epoxy compound (A) on the surface. Rubber particles having a hydroxy group and / or a carboxy group (either one or both of a hydroxy group and a carboxy group) as a group are preferred. When there are no hydroxy groups and / or carboxy groups on the surface of the rubber particles, the cured product becomes clouded by a thermal shock such as a cold cycle and the transparency tends to decrease, which is not preferable.

  The polymer constituting the core portion having rubber elasticity in the rubber particles is not particularly limited, but (meth) acrylic acid esters such as methyl (meth) acrylate, ethyl (meth) acrylate, and butyl (meth) acrylate are used. The polymer is preferably contained as an essential monomer component. The polymer constituting the core portion having rubber elasticity includes, for example, aromatic vinyl such as styrene and α-methylstyrene; nitrile such as acrylonitrile and methacrylonitrile; conjugated diene such as butadiene and isoprene; ethylene, propylene, An α-olefin such as isobutene may be included as a monomer component.

  Among them, the polymer constituting the core portion having rubber elasticity is combined with one or more selected from the group consisting of aromatic vinyl, nitrile, and conjugated diene together with (meth) acrylic acid ester as a monomer component. It is preferable to include. That is, as the polymer constituting the core part, for example, (meth) acrylic acid ester / aromatic vinyl, (meth) acrylic acid ester / conjugated diene and other binary copolymers; (meth) acrylic acid ester / aromatic And terpolymers such as group vinyl / conjugated dienes. The polymer constituting the core portion may contain silicone such as polydimethylsiloxane and polyphenylmethylsiloxane, polyurethane, and the like.

  The polymer constituting the core part includes, as other monomer components, divinylbenzene, allyl (meth) acrylate, ethylene glycol di (meth) acrylate, diallyl maleate, triallyl cyanurate, diallyl phthalate, butylene glycol diacrylate, etc. A reactive crosslinking monomer having two or more reactive functional groups in the molecule may be contained.

  The core part of the rubber particles is a core part composed of a (meth) acrylic ester / aromatic vinyl binary copolymer (particularly butyl acrylate / styrene). It is preferable in that the rate can be easily adjusted.

The glass transition temperature of the polymer constituting the core part of the rubber particles is not particularly limited, but is preferably less than 60 ° C. (for example, −150 ° C. or more and less than 60 ° C.), more preferably −150 to 15 ° C., and even more preferably. Is −100 to 0 ° C. By setting the glass transition temperature of the polymer to 60 ° C. or less, there is a tendency that the crack resistance of the cured product (characteristics that hardly cause cracks with respect to various stresses) is further improved. In addition, the glass transition temperature of the polymer which comprises the said core part means the calculated value calculated by the formula of the following Fox (refer Bull. Am. Phys. Soc., 1 (3) 123 (1956)). Wherein the following Fox, Tg glass transition temperature (unit: K) of the polymer constituting the core portion indicates, W _i is the weight fraction of the monomer i for the monomer total amount constituting the polymer constituting the core portion Indicates the rate. Further, Tg _i is the glass transition temperature of the homopolymer of monomer i (unit: K) shows a. The following Fox formula shows the formula when the polymer constituting the core is a copolymer of monomer 1, monomer 2,..., And monomer n.
1 / Tg = W ₁ / Tg ₁ + W ₂ / Tg ₂ +... + W _n / Tg _n
As the glass transition temperature of the homopolymer, values described in various documents can be adopted, for example, values described in “POLYMER HANDBOOK 3rd edition” (published by John Wiley & Sons, Inc.) can be adopted. In addition, about the thing which is not described in literature, the value of the glass transition temperature measured by DSC method of the homopolymer obtained by superposing | polymerizing a monomer by a conventional method is employable.

  The core part of the rubber particles can be produced by a commonly used method. For example, it can be produced by a method of polymerizing the monomer by an emulsion polymerization method. In the emulsion polymerization method, the whole amount of the monomer may be charged all at once and polymerized, or after polymerizing a part of the monomer, the remainder may be added continuously or intermittently for polymerization. Further, a polymerization method using seed particles may be used.

  The polymer constituting the shell layer of the rubber particles is preferably a polymer different from the polymer constituting the core portion (polymer having a different monomer composition). Further, as described above, the shell layer preferably has a hydroxy group and / or a carboxy group as a functional group capable of reacting with a compound having an epoxy group such as an alicyclic epoxy compound (A). Thereby, especially with respect to the hardened | cured material which can improve adhesiveness in an interface with an alicyclic epoxy compound (A), and hardened the curable epoxy resin composition containing the rubber particle which has this shell layer. , Excellent crack resistance can be exhibited. Moreover, the fall of the glass transition temperature of hardened | cured material can also be prevented.

  The polymer constituting the shell layer is preferably a polymer containing (meth) acrylic acid ester such as methyl (meth) acrylate, ethyl (meth) acrylate, and butyl (meth) acrylate as an essential monomer component. . For example, when butyl acrylate is used as the (meth) acrylic acid ester in the core portion, as a monomer component of the polymer constituting the shell layer, for example, (meth) acrylic acid esters other than butyl acrylate (for example, ( (Meth) methyl acrylate, ethyl (meth) acrylate, butyl methacrylate, etc.) are preferably used. Examples of the monomer component that may be contained in addition to the (meth) acrylic acid ester include aromatic vinyl such as styrene and α-methylstyrene; nitrile such as acrylonitrile and methacrylonitrile. In the rubber particles, it is preferable that the monomer component constituting the shell layer includes the (meth) acrylic acid ester alone or in combination of two or more, and particularly includes at least aromatic vinyl. It is preferable in that the refractive index of the rubber particles can be easily adjusted.

  Further, the polymer constituting the shell layer forms a hydroxy group and / or a carboxy group as a functional group capable of reacting with a compound having an epoxy group such as an alicyclic epoxy compound (A) as a monomer component. Hydroxy group-containing monomers (for example, hydroxyalkyl (meth) acrylates such as 2-hydroxyethyl (meth) acrylate) and carboxy group-containing monomers (for example, α, β-unsaturated acids such as (meth) acrylic acid; It is preferable to contain an α, β-unsaturated acid anhydride such as maleic anhydride).

  It is preferable that the polymer which comprises the shell layer in the said rubber particle contains a 1 type, or 2 or more types selected from the said monomer in combination with (meth) acrylic acid ester as a monomer component. That is, the shell layer is formed of, for example, a ternary copolymer such as (meth) acrylic acid ester / aromatic vinyl / hydroxyalkyl (meth) acrylate, (meth) acrylic acid ester / aromatic vinyl / α, β-unsaturated acid. A shell layer composed of a polymer or the like is preferable.

  Further, the polymer constituting the shell layer includes, as the other monomer components, divinylbenzene, allyl (meth) acrylate, ethylene glycol di (meth) acrylate, diallyl maleate, trimethyl, as well as the above-described monomer. A reactive crosslinking monomer having two or more reactive functional groups may be contained in the molecule such as allyl cyanurate, diallyl phthalate, butylene glycol diacrylate.

  Although the glass transition temperature of the polymer which comprises the shell layer of the said rubber particle is not specifically limited, 60-120 degreeC is preferable, More preferably, it is 70-115 degreeC. By setting the glass transition temperature of the polymer to 60 ° C. or higher, the heat resistance of the cured product tends to be further improved. On the other hand, the crack resistance of hardened | cured material tends to improve more by making the glass transition temperature of the said polymer into 120 degrees C or less. In addition, the glass transition temperature of the polymer which comprises the said shell layer means the calculated value computed by the said Formula of Fox, For example, it can measure similarly to the glass transition temperature of the polymer which comprises the above-mentioned core.

  The rubber particles (rubber particles having a core-shell structure) can be obtained by covering the core portion with a shell layer. Examples of the method for coating the core part with the shell layer include a method of coating the surface of the core part having rubber elasticity obtained by the above method by applying a copolymer constituting the shell layer; And a method of graft polymerization using a core part having rubber elasticity obtained by the above as a trunk component and each component constituting the shell layer as a branch component.

  The average particle diameter of the rubber particles is not particularly limited, but is preferably 10 to 500 nm, and more preferably 20 to 400 nm. The maximum particle size of the rubber particles is not particularly limited, but is preferably 50 to 1000 nm, more preferably 100 to 800 nm. When the average particle size is 500 nm or less (or the maximum particle size is 1000 nm or less), the dispersibility of the rubber particles in the cured product is improved, and the crack resistance tends to be further improved. On the other hand, when the average particle diameter is 10 nm or more (or the maximum particle diameter is 50 nm or more), the crack resistance of the cured product tends to be further improved.

  Although the refractive index of the said rubber particle is not specifically limited, 1.40-1.60 are preferable, More preferably, it is 1.42-1.58. The difference between the refractive index of the rubber particles and the refractive index of the cured product obtained by curing the curable epoxy resin composition containing the rubber particles (the curable epoxy resin composition of the present invention) is ± 0.03. Is preferably within. By setting the difference in refractive index within ± 0.03, excellent transparency of the cured product is secured, and the optical intensity of the optical semiconductor device tends to be kept high.

  The refractive index of the rubber particles is, for example, by casting 1 g of rubber particles into a mold and compression molding at 210 ° C. and 4 MPa to obtain a flat plate having a thickness of 1 mm. From the obtained flat plate, a test piece having a length of 20 mm × width of 6 mm And using a multi-wavelength Abbe refractometer (trade name “DR-M2”, manufactured by Atago Co., Ltd.) in a state where the prism and the test piece are in close contact using monobromonaphthalene as an intermediate solution, It can be determined by measuring the refractive index at 20 ° C. and sodium D line.

  The refractive index of the cured product of the curable epoxy resin composition of the present invention is, for example, a test piece having a length of 20 mm × width of 6 mm × thickness of 1 mm from a cured product obtained by the heat curing method described in the section of cured product below. And using a multi-wavelength Abbe refractometer (trade name “DR-M2”, manufactured by Atago Co., Ltd.) in a state where the prism and the test piece are in close contact using monobromonaphthalene as an intermediate solution, It can be determined by measuring the refractive index at 20 ° C. and sodium D line.

  The content (blending amount) of the rubber particles in the curable epoxy resin composition of the present invention is not particularly limited, but is based on the total amount (100 parts by weight) of the compound having an epoxy group contained in the curable epoxy resin composition. The amount is preferably 0.5 to 30 parts by weight, more preferably 1 to 20 parts by weight. By setting the content of the rubber particles to 0.5 parts by weight or more, the crack resistance of the cured product tends to be further improved. On the other hand, when the content of the rubber particles is 30 parts by weight or less, the heat resistance of the cured product tends to be further improved.

[Additive]
In addition to the above, the curable epoxy resin composition of the present invention may contain various additives within a range that does not impair the effects of the present invention. For example, when a compound having a hydroxy group such as ethylene glycol, diethylene glycol, propylene glycol, or glycerin is contained as the additive, the reaction can be allowed to proceed slowly. Other silane coupling agents such as silicone-based and fluorine-based antifoaming agents, leveling agents, and γ-glycidoxypropyltrimethoxysilane and 3-mercaptopropyltrimethoxysilane, as long as the viscosity and transparency are not impaired. , Surfactants, inorganic fillers such as silica and alumina, flame retardants, colorants, antioxidants, ultraviolet absorbers, ion adsorbents, pigments, phosphors (eg YAG phosphor fine particles, silicate phosphors) Inorganic phosphor fine particles such as fine particles) and conventional additives such as mold release agents can be used.

  Although the curable epoxy resin composition of this invention is not specifically limited, It can prepare by stirring and mixing each said component in the state heated as needed. In addition, the curable epoxy resin composition of the present invention can be used as a one-component composition in which each component is mixed in advance, for example, two or more stored separately. These components can also be used as a multi-liquid composition (for example, a two-liquid system) that is used by mixing them at a predetermined ratio before use. The stirring / mixing method is not particularly limited, and for example, known or commonly used stirring / mixing means such as various mixers such as a dissolver and a homogenizer, a kneader, a roll, a bead mill, and a self-revolving stirrer can be used. Further, after stirring and mixing, defoaming may be performed under vacuum.

  Although not particularly limited, when rubber particles are blended in the curable epoxy resin composition of the present invention, the rubber particles are prepared by dispersing the rubber particles in the alicyclic epoxy compound (A) in advance (the composition is referred to as “rubber”). It is preferable to blend in a state of “sometimes referred to as a“ particle-dispersed epoxy compound ””. That is, when rubber particles are blended in the curable epoxy resin composition of the present invention, the curable epoxy resin composition of the present invention contains the rubber particle-dispersed epoxy compound, the isocyanuric acid derivative (B), and the organoaluminum compound ( It is preferable to prepare it by mixing C) and other components as necessary. Such a preparation method can particularly improve the dispersibility of the rubber particles in the curable epoxy resin composition. However, the blending method of the rubber particles is not limited to the above method, and may be a method of blending alone.

(Rubber particle dispersed epoxy compound)
The rubber particle-dispersed epoxy compound is obtained by dispersing the rubber particles in the alicyclic epoxy compound (A). The alicyclic epoxy compound (A) in the rubber particle-dispersed epoxy compound may be the total amount of the alicyclic epoxy compound (A) constituting the curable epoxy resin composition, or may be a partial amount. There may be. Similarly, the rubber particles in the rubber particle-dispersed epoxy compound may be the total amount of rubber particles constituting the curable epoxy resin composition, or may be a partial amount.

  The viscosity of the rubber particle-dispersed epoxy compound can be adjusted, for example, by using a reactive diluent in combination (that is, the rubber particle-dispersed epoxy compound may further contain a reactive diluent). As the reactive diluent, for example, an aliphatic polyglycidyl ether having a viscosity at room temperature (25 ° C.) of 200 mPa · s or less can be preferably used. Examples of the aliphatic polyglycidyl ether having a viscosity (25 ° C.) of 200 mPa · s or less include, for example, cyclohexanedimethanol diglycidyl ether, cyclohexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, and 1,6-hexanediol diglycidyl ether. , Trimethylolpropane triglycidyl ether, polypropylene glycol diglycidyl ether, and the like. The usage-amount of the said reactive diluent can be adjusted suitably, and is not specifically limited.

  The manufacturing method of the said rubber particle dispersion | distribution epoxy compound is not specifically limited, A well-known and usual method can be used. For example, after the rubber particles are dehydrated and dried to form powder, the rubber particles are mixed and dispersed in the alicyclic epoxy compound (A), or the emulsion of rubber particles and the alicyclic epoxy compound (A) are directly mixed. Subsequently, a method of dehydrating and the like can be mentioned.

  The curable epoxy resin composition of the present invention is preferably liquid (liquid) at 25 ° C. Although the viscosity in 25 degreeC of the curable epoxy resin composition of this invention is not specifically limited, 100-10000 mPa * s is preferable, More preferably, it is 200-9000 mPa * s, More preferably, it is 300-8000 mPa * s. By setting the viscosity at 25 ° C. to 100 mPa · s or more, workability at the time of casting tends to be improved, and the heat resistance of the cured product tends to be further improved. On the other hand, when the viscosity at 25 ° C. is 10000 mPa · s or less, workability at the time of casting tends to be improved, and defects derived from poor casting in the cured product tend not to occur. The viscosity at 25 ° C. of the curable epoxy resin composition is, for example, using a digital viscometer (model number “DVU-EII type”, manufactured by Tokimec Co., Ltd.), rotor: standard 1 ° 34 ′ × R24, temperature : Measured under conditions of 25 ° C. and rotation speed: 0.5 to 10 rpm.

<Hardened product>
By curing the curable epoxy resin composition of the present invention, a cured product having high transparency, heat resistance, and light resistance, particularly high adhesion to electrodes and excellent thermal shock resistance (curing of the present invention) A cured product obtained by curing the conductive epoxy resin composition may be referred to as “cured product of the present invention”). As the curing means, known or conventional means such as heat treatment or light irradiation treatment can be used. Although the temperature (curing temperature) at the time of making it harden | cure by heating is not specifically limited, 45-200 degreeC is preferable, More preferably, it is 50-190 degreeC, More preferably, it is 55-180 degreeC. In addition, the heating time (curing time) for curing is not particularly limited, but is preferably 30 to 600 minutes, more preferably 45 to 540 minutes, and still more preferably 60 to 480 minutes. When the curing temperature and the curing time are lower than the lower limit value in the above range, curing is insufficient. On the contrary, when the curing temperature and the curing time are higher than the upper limit value in the above range, the resin component may be decomposed. Although the curing conditions depend on various conditions, for example, when the curing temperature is increased, the curing time can be shortened, and when the curing temperature is decreased, the curing time can be appropriately increased. Moreover, hardening can also be performed in one step and can also be performed in two or more steps.

<Resin composition for optical semiconductor encapsulation>
The curable epoxy resin composition of the present invention is a resin composition for sealing an optical semiconductor element in an optical semiconductor device, that is, an optical semiconductor sealing resin composition (an optical semiconductor element sealing agent in an optical semiconductor device). ) Can be preferably used. By using the curable epoxy resin composition of the present invention as a resin composition for encapsulating an optical semiconductor, the optical semiconductor element is sealed with a cured product having high transparency, heat resistance and light resistance and excellent thermal shock resistance. A stopped optical semiconductor device is obtained. The optical semiconductor device is less likely to cause a decrease in light intensity even when a thermal shock or high-temperature heat is applied, and has high durability.

<Optical semiconductor device>
The optical semiconductor device of the present invention is an optical semiconductor device in which an optical semiconductor element is sealed with a cured product of the curable epoxy resin composition (resin composition for optical semiconductor sealing) of the present invention. The optical semiconductor element can be sealed, for example, by injecting the curable epoxy resin composition prepared by the above-described method into a predetermined mold and heat-curing under predetermined conditions. Thereby, the optical semiconductor device with which the optical semiconductor element was sealed with the hardened | cured material of the curable epoxy resin composition is obtained. The curing temperature and the curing time can be appropriately set within the same range as when the cured product is prepared.

  The curable epoxy resin composition of the present invention is not limited to the above-mentioned optical semiconductor element sealing application, for example, an adhesive, an electrical insulating material, a laminate, a coating, an ink, a paint, a sealant, a resist, a composite material, It can be used for various applications such as transparent substrates, transparent sheets, transparent films, optical elements, optical lenses, optical members, optical modeling, electronic paper, touch panels, solar cell substrates, optical waveguides, light guide plates, holographic memories, etc. .

  Hereinafter, the present invention will be described in more detail based on examples, but the present invention is not limited to these examples. In addition, "-" in Tables 1 and 2 means that the component was not blended. Moreover, the compounding quantity of the brand name "Plenact AL-M" in Tables 1 and 2 was shown by the compounding quantity of the product itself.

Production Example 1
(Manufacture of rubber particles)
In a 1 L polymerization vessel equipped with a reflux condenser, 500 g of ion-exchanged water and 0.68 g of sodium dioctylsulfosuccinate were charged, and the temperature was raised to 80 ° C. while stirring under a nitrogen stream. Here, a monomer mixture composed of 9.5 g of butyl acrylate, 2.57 g of styrene, and 0.39 g of divinylbenzene corresponding to about 5% by weight of the amount required to form the core portion of the rubber particles. Were added together and emulsified by stirring for 20 minutes, and then 9.5 mg of potassium peroxodisulfate was added and stirred for 1 hour to perform the first seed polymerization. Subsequently, 180.5 mg of potassium peroxodisulfate was added and stirred for 5 minutes. Here, the remaining amount (about 95% by weight) of butyl acrylate 180.5 g, styrene 48.89 g, divinylbenzene 7.33 g and 0.95 g sodium dioctyl sulfosuccinate required to form the core portion A monomer mixture obtained by dissolving sucrose was continuously added over 2 hours to perform seed polymerization for the second time, and then aged for 1 hour to obtain a core part.
Next, 60 mg of potassium peroxodisulfate was added and stirred for 5 minutes. Here, 0.3 g of sodium dioctylsulfosuccinate was dissolved in 60 g of methyl methacrylate, 1.5 g of acrylic acid and 0.3 g of allyl methacrylate. The monomer mixture was continuously added over 30 minutes to perform seed polymerization. Then, it aged for 1 hour and formed the shell layer which coat | covers a core part.
Next, the mixture was cooled to room temperature (25 ° C.) and filtered through a plastic mesh having an opening of 120 μm to obtain a latex containing rubber particles having a core-shell structure. The obtained latex was frozen at −30 ° C., dehydrated and washed with a suction filter, and then blown and dried at 60 ° C. overnight to obtain rubber particles. The resulting rubber particles had an average particle size of 254 nm and a maximum particle size of 486 nm.

The average particle size and the maximum particle size of the rubber particles are “Nanotrac ^™ ” type nanotrack particle size distribution measuring device (trade name “UPA-EX150”, manufactured by Nikkiso Co., Ltd.) based on the dynamic light scattering method. ) Was used to measure the sample, and in the obtained particle size distribution curve, the average particle size, which is the particle size when the cumulative curve becomes 50%, is the average particle size, and the frequency (%) of the particle size distribution measurement result is 0 The maximum particle size at the time of exceeding 0.000 was defined as the maximum particle size. In addition, as said sample, what disperse | distributed 1 weight part of rubber particle dispersion | distribution epoxy compounds obtained by the following manufacture example 2 to 20 weight part of tetrahydrofuran was used.

Production Example 2
(Manufacture of rubber particle-dispersed epoxy compounds)
10 parts by weight of the rubber particles obtained in Production Example 1 were dispersed in 80 parts by weight of a trade name “Celoxide 2021P” (manufactured by Daicel Corporation) using a dissolver while being heated to 60 ° C. in a nitrogen stream. (1000 rpm, 60 minutes) and vacuum degassing to obtain a rubber particle-dispersed epoxy compound (viscosity at 25 ° C .: 937 mPa · s).
The viscosity at 25 ° C. of the rubber particle-dispersed epoxy compound obtained in Production Example 2 (10 parts by weight of rubber particles dispersed in 80 parts by weight of celoxide 2021P) is a digital viscometer (trade name “DVU”). -EII type ", manufactured by Tokimec Co., Ltd.).

Production Example 3
(Manufacture of epoxy curing agent)
In the blending ratio (unit: parts by weight) shown in Table 1, the trade name “Rikacid MH-700” (manufactured by Shin Nippon Rika Co., Ltd.), the trade name “U-CAT 18X” (manufactured by San Apro Co., Ltd.), and ethylene Glycol (manufactured by Wako Pure Chemical Industries, Ltd.) is uniformly mixed and defoamed using a self-revolving stirrer (trade name “Awatori Nertaro AR-250”, manufactured by Shinky Co., Ltd.). An epoxy curing agent (sometimes referred to as “K agent”) was obtained.

Example 1
First, in the compounding ratio (unit: parts by weight) shown in Table 1, the trade name “Celoxide 2021P” (manufactured by Daicel Corporation) and the trade name “MA-DGIC” (manufactured by Shikoku Kasei Kogyo Co., Ltd.) An epoxy resin (mixture) was prepared by uniform mixing using a self-revolving stirrer (trade name “Awatori Nertaro AR-250”, manufactured by Shinkey Co., Ltd.). In addition, in order to dissolve MA-DGIC, the said mixing was implemented by stirring at 80 degreeC for 1 hour. Thereafter, the product name “Plenact AL-M” (Ajinomoto Fine Techno Co., Ltd.) was added to the epoxy resin obtained above so as to have the blending ratio (unit: parts by weight) shown in Table 1. Using an apparatus (trade name “Awatori Nertaro AR-250”, manufactured by Shinky Co., Ltd.), the mixture was uniformly mixed and degassed to prepare a mixture of an epoxy resin and an organoaluminum compound.
Next, the mixture obtained as described above and the epoxy curing agent obtained in Production Example 3 were mixed in a self-revolving stirrer (trade name “Awatori kneading” so that the blending ratio (unit: parts by weight) shown in Table 1 was obtained. Taro AR-250 "(manufactured by Shinky Co., Ltd.) was mixed uniformly and defoamed to obtain a curable epoxy resin composition.
Further, the curable epoxy resin composition obtained above was cast into an optical semiconductor lead frame (InGaN element, 3.5 mm × 2.8 mm) shown in FIG. 1, and then in an oven (resin curing oven) at 120 ° C. By heating for 5 hours, the optical semiconductor device with which the optical semiconductor element was sealed with the hardened | cured material of the said curable epoxy resin composition was obtained. In FIG. 1, 100 is a reflector (light reflecting resin composition), 101 is a metal wiring, 102 is an optical semiconductor element, 103 is a bonding wire, and 104 is a cured product (sealing material).

Examples 2-7, Comparative Examples 1-7
A curable epoxy resin composition was prepared in the same manner as in Example 1 except that the composition of the curable epoxy resin composition was changed to the composition shown in Table 1. In Example 7, the rubber particle-dispersed epoxy compound obtained in Production Example 2 was used as a constituent component of the epoxy resin.
Further, an optical semiconductor device was fabricated in the same manner as in Example 1.

Example 8
First, in the blending ratio (unit: parts by weight) shown in Table 2, the trade name “Celoxide 2021P” (manufactured by Daicel Corporation) and the trade name “MA-DGIC” (manufactured by Shikoku Kasei Kogyo Co., Ltd.) An epoxy resin (mixture) was prepared by uniform mixing using a self-revolving stirrer (trade name “Awatori Nertaro AR-250”, manufactured by Shinkey Co., Ltd.). In addition, in order to dissolve MA-DGIC, the said mixing was implemented by stirring at 80 degreeC for 1 hour. Thereafter, the product name “Plenact AL-M” (Ajinomoto Fine-Techno Co., Ltd.) was mixed with the epoxy resin obtained above so as to have the blending ratio (unit: parts by weight) shown in Table 2. Using an apparatus (trade name “Awatori Nertaro AR-250”, manufactured by Shinky Co., Ltd.), the mixture was uniformly mixed and degassed to prepare a mixture of an epoxy resin and an organoaluminum compound.
Next, the mixture obtained as described above and the trade name “Sun-Aid SI-100L” (manufactured by Sanshin Chemical Industry Co., Ltd.) are revolved so that the blending ratio (unit: parts by weight) shown in Table 2 is obtained. Using a stirrer (trade name “Awatori Nertaro AR-250”, manufactured by Shinky Co., Ltd.), the mixture was uniformly mixed and defoamed to obtain a curable epoxy resin composition.
Further, the curable epoxy resin composition obtained above was cast into an optical semiconductor lead frame (InGaN element, 3.5 mm × 2.8 mm) shown in FIG. 1, and then in an oven (resin curing oven) at 120 ° C. By heating for 5 hours, the optical semiconductor device with which the optical semiconductor element was sealed with the hardened | cured material of the said curable epoxy resin composition was obtained.

Examples 9-14, Comparative Examples 8-14
A curable epoxy resin composition was prepared in the same manner as in Example 8 except that the composition of the curable epoxy resin composition was changed to the composition shown in Table 2. In Example 14, the rubber particle-dispersed epoxy compound obtained in Production Example 2 was used as a constituent component of the epoxy resin.
Further, an optical semiconductor device was fabricated in the same manner as in Example 8.

<Evaluation>
The following evaluation tests were carried out on the optical semiconductor devices obtained in the examples and comparative examples.

[Energization test]
The total luminous flux of the optical semiconductor devices obtained in the examples and comparative examples was measured using a total luminous flux measuring machine, and this was defined as “total luminous flux for 0 hour”. Further, the total luminous flux after flowing a current of 30 mA through the optical semiconductor device for 100 hours in an 85 ° C. constant temperature bath was measured, and this was defined as “total luminous flux after 100 hours”. And luminous intensity retention was computed from the following formula. The results are shown in the column of “Luminance retention rate [%]” in Tables 1 and 2.
{Luminance retention (%)}
= {Total luminous flux after 100 hours (lm)} / {total luminous flux after 0 hours (lm)} × 100

[Solder heat resistance test]
The optical semiconductor devices (two used for each curable epoxy resin composition) obtained in the examples and comparative examples were left to stand for 192 hours under the conditions of 30 ° C. and 60% RH for moisture absorption treatment. Subsequently, the said optical semiconductor device was put into the reflow furnace, and it heat-processed on the following heating conditions. Thereafter, the optical semiconductor device was taken out in a room temperature environment and allowed to cool, and then again placed in a reflow furnace and heat-treated under the same conditions. That is, in the solder heat resistance test, the thermal history under the following heating conditions was given twice to the optical semiconductor device.
[Heating conditions (based on surface temperature of optical semiconductor device)]
(1) Preheating: 150 to 190 ° C. for 60 to 120 seconds (2) Main heating after preheating: 217 ° C. or more for 60 to 150 seconds, maximum temperature 260 ° C.
However, the rate of temperature increase when shifting from preheating to main heating was controlled to 3 ° C./second at the maximum.
FIG. 2 shows an example of a surface temperature profile (temperature profile in one of the two heat treatments) of the optical semiconductor device when heated by the reflow furnace.
Thereafter, the optical semiconductor device was observed using a digital microscope (trade name “VHX-900”, manufactured by Keyence Co., Ltd.), whether or not a crack having a length of 90 μm or more occurred in the cured product, and It was evaluated whether or not electrode peeling (peeling of the cured product from the electrode surface) occurred. Of the two optical semiconductor devices, the number of optical semiconductor devices having a crack of 90 μm or longer in the cured product is shown in the column of “Solder heat resistance test [number of cracks]” in Tables 1 and 2, The number of the generated optical semiconductor devices is shown in the column of “Solder heat resistance test [electrode peeling number]” in Tables 1 and 2.

[Thermal shock test]
The optical semiconductor devices obtained in the examples and comparative examples (two were used for each curable epoxy resin composition) were exposed in an atmosphere of −40 ° C. for 30 minutes, and then in an atmosphere of 120 ° C. A thermal shock with one cycle of exposure to 30 minutes was applied for 200 cycles using a thermal shock tester. Then, the length of the crack which arose in the hardened | cured material in an optical semiconductor device was observed using a digital microscope (brand name "VHX-900", the Keyence Co., Ltd. product), and hardening was carried out among two optical semiconductor devices. The number of optical semiconductor devices in which cracks having a length of 90 μm or more occurred in the object was measured. The results are shown in the column of “thermal shock test [number of cracks]” in Tables 1 and 2.

[Comprehensive judgment]
As a result of each test, what satisfy | filled all the following (1)-(4) was determined as (circle) (good). On the other hand, when any of the following (1) to (4) was not satisfied, it was determined as x (defective).
(1) Current test: luminous intensity retention of 80% or more (2) Solder heat resistance test: No. of optical semiconductor devices having cracks of 90 μm or more in cured product (3) Solder heat resistance test: The number of optical semiconductor devices in which electrode peeling occurred was zero (4) Thermal shock test: the number of optical semiconductor devices in which a crack having a length of 90 μm or more occurred in a cured product was zero. It is shown in the “determination” column.

In addition, the component used by the Example and the comparative example is as follows.
(Epoxy resin)
Celoxide 2021P: Trade name “Celoxide 2021P” [3,4-epoxycyclohexylmethyl (3,4-epoxy) cyclohexanecarboxylate], manufactured by Daicel Corporation TEPIC: Trade name “TEPIC” [triglycidyl isocyanurate], Nissan Chemical MA-DGIC manufactured by Kogyo Co., Ltd .: trade name “MA-DGIC” [monoallyl diglycidyl isocyanurate], DA-MGIC manufactured by Shikoku Kasei Kogyo Co., Ltd .: trade name “DA-MGIC” [diallyl monoglycidyl isocyanurate] YD-128 manufactured by Shikoku Kasei Kogyo Co., Ltd .: trade name “YD-128” [bisphenol A type epoxy resin], manufactured by Nippon Steel Chemical Co., Ltd. (organoaluminum compound)
Plenact AL-M: Trade name “Plenact AL-M” [9-octadecenyl acetoacetate aluminum diisopropylate], manufactured by Ajinomoto Fine Techno Co., Ltd. (epoxy curing agent)
MH-700: trade name “Licacid MH-700” [4-methylhexahydrophthalic anhydride / hexahydrophthalic anhydride = 70/30], manufactured by Shin Nippon Rika Co., Ltd. U-CAT 18X: trade name “U-CAT 18X "[curing accelerator], manufactured by San Apro Co., Ltd. Ethylene glycol: manufactured by Wako Pure Chemical Industries, Ltd. (curing catalyst)
Sun-Aid SI-100L: Trade name “Sun-Aid SI-100L” [curing catalyst], manufactured by Sanshin Chemical Industry Co., Ltd.

Test equipment ・ Resin curing oven ESPH Co., Ltd. GPH-201
-Thermostatic chamber ESPEC Co., Ltd. Small high temperature chamber ST-120B1
・ Total luminous flux measuring machine Optronic Laboratories Multi-spectral Radiation Measurement System OL771
・ Thermal shock tester Espec Co., Ltd. Small thermal shock device TSE-11-A
-Reflow furnace manufactured by Nippon Antom Co., Ltd., UNI-5016F

100: Reflector (resin composition for light reflection)
DESCRIPTION OF SYMBOLS 101: Metal wiring 102: Optical semiconductor element 103: Bonding wire 104: Hardened | cured material (sealing material)

Claims (11)

  A curable epoxy resin composition comprising an alicyclic epoxy compound (A), an isocyanuric acid derivative (B) having one or more oxirane rings in a molecule, and an organoaluminum compound (C). An isocyanuric acid derivative (B) having one or more oxirane rings in the molecule is represented by the following formula (1-1):

[Wherein, R ¹ and R ² are the same or different and each represents a hydrogen atom or an alkyl group having 1 to 8 carbon atoms. ]
The curable epoxy resin composition according to claim 1, which is a compound represented by the formula:   The curable epoxy resin composition according to claim 1 or 2, wherein the organoaluminum compound (C) is 9-octadecenyl acetoacetate aluminum diisopropylate.   The curable epoxy resin composition according to any one of claims 1 to 3, wherein the alicyclic epoxy compound (A) is a compound having a cyclohexene oxide group. The alicyclic epoxy compound (A) is represented by the following formula (I-1)

The curable epoxy resin composition according to claim 1, wherein the curable epoxy resin composition is a compound represented by the formula:   Furthermore, the curable epoxy resin composition of any one of Claims 1-5 containing a rubber particle.   Furthermore, the curable epoxy resin composition of any one of Claims 1-6 containing a hardening | curing agent (D) and a hardening accelerator (E).   Furthermore, the curable epoxy resin composition of any one of Claims 1-7 containing a curing catalyst (F).   Hardened | cured material obtained by hardening the curable epoxy resin composition of any one of Claims 1-8.   It is a resin composition for optical semiconductor sealing, The curable epoxy resin composition of any one of Claims 1-8.   An optical semiconductor device in which an optical semiconductor element is sealed with a cured product of the curable epoxy resin composition according to claim 10.

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