JP2015081777A - Circuit board inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve precision in quality inspection for a connection state between the electronic part and the conductive pattern which are mounted on the circuit board.SOLUTION: The circuit board inspection device includes: a magnetic field detection part 4 for detecting the strength of the magnetic field generated when a detection signal Ss is supplied to the conductive pattern of a circuit board; and a processing part 7 for executing the quality inspection of a connection state between the electronic part and the conductive pattern on the basis of the strength of the magnetic field detected in a state where a magnetic field detection part 4 faces a specified position on the electronic part and executing a specifying process for previously specifying a specified position on the basis of the strength of the magnetic field detected by the magnetic field detection part 4 by controlling the movement of the magnetic field detection part 4 by a movement mechanism 5. The processing part 7 sequentially moves the magnetic field detection part 4 to each opposite position facing each divided section dividing the surface of the electronic part into a plurality of sections and executes a magnetic field strength specifying process for specifying the strength of the magnetic field for each opposite position, and specifies the divided section that is determined to satisfy the specified condition in which the specified strength of the magnetic field is previously specified as the specified position in the specifying process.

Description

  The present invention relates to a circuit board inspection apparatus configured to be able to perform a quality inspection of a connection state between an electronic component mounted on a circuit board and a conductor pattern of the circuit board.

  As this type of circuit board inspection apparatus, a circuit board inspection apparatus disclosed by the applicant in the following Patent Document 1 is known. This circuit board inspection apparatus has a predetermined position on an electronic component (integrated circuit) mounted on a circuit board (a formation position of a pad for connection with a conductor pattern formed on the back surface of the electronic component). In a state where the magnetic field sensor is positioned above, the quality of the connection state between the electronic component and the conductor pattern of the circuit board can be inspected based on the magnetic field intensity detected by the magnetic field sensor.

JP 2006-343103 A (page 3-4, FIG. 1-2)

  However, the conventional circuit board inspection apparatus has the following problems to be improved. That is, in this circuit board inspection apparatus, when performing a pass / fail inspection of the connection state, it is necessary to detect the magnetic field intensity by positioning the magnetic field sensor at a predetermined position (specified position) on the electronic component. In this case, since the magnetic field strength varies depending on the position on the electronic component, it is preferable to define the position where the magnetic field strength is detected as the specified position in order to perform an accurate pass / fail inspection. However, since the conventional circuit board inspection apparatus does not have such a function of defining the specified position, the position of the pad in the electronic component, the position of the conductor pattern to which the pad is connected, etc. The work of defining based on the design drawing of the board is performed manually, and the specified position is input to the circuit board inspection apparatus. As described above, the conventional circuit board inspection apparatus has a problem that it is difficult to improve inspection efficiency because it does not have a function of defining a specified position, and the improvement is desired. .

  The present invention has been made in view of such problems, and provides a circuit board inspection apparatus capable of improving the inspection efficiency of the quality inspection of the connection state between the electronic component mounted on the circuit board and the conductor pattern. The main purpose.

  In order to achieve the above object, a circuit board inspection apparatus according to claim 1, wherein the magnetic field strength of a magnetic field generated when an inspection signal is supplied to an inspection point on a conductor pattern on a circuit board on which an electronic component is mounted. The electronic component and the conductor based on the magnetic field intensity detected by the magnetic field detection unit in a state where the magnetic field detection unit is detected and the magnetic field detection unit faces a predetermined position on the electronic component. A circuit board inspection apparatus comprising: an inspection unit that performs a pass / fail inspection of a connection state with a pattern; and a movement mechanism that moves the magnetic field detection unit, and controls movement of the magnetic field detection unit by the movement mechanism A processing unit that executes a defining process that predefines the defined position used in the quality inspection based on the magnetic field intensity detected by the magnetic field detecting unit, In the defining process, the magnetic unit sequentially moves the magnetic field detection unit to each opposed position facing each divided section obtained by dividing the surface of the electronic component into a plurality of magnetic fields, and specifies the magnetic field strength at each opposed position An intensity specifying process is executed, and the divided section determined that the specified magnetic field intensity satisfies a specified condition defined in advance is defined as the specified position.

  The circuit board inspection apparatus according to claim 2 is the circuit board inspection apparatus according to claim 1, wherein the processing unit has one division section set as a reference section from among the division sections in the defining process. The magnetic field strength specifying process is executed at the opposite position of the reference section, and any one of the divided sections adjacent to the reference section is selected as a comparison section, and the magnetic field strength specifying process is executed at the facing position of the comparison section. Then, the comparison magnetic field strength as the magnetic field strength at the opposed position of the comparison section is compared with the reference magnetic field strength as the magnetic field intensity at the opposed position of the reference section, and the comparison is performed in the comparison process. When it is determined that the magnetic field strength is equal to or lower than the reference magnetic field strength, another one of the divided sections adjacent to the reference section is newly compared with the reference section. When the comparison process is executed by selecting the image as the image, and it is determined in the comparison process that the comparison magnetic field strength is greater than the reference magnetic field strength, the comparison section is set as a new reference section, and the comparison process is performed. When the comparison magnetic field strength is determined to be equal to or lower than the reference magnetic field strength in all of the comparison processes executed by selecting all the divided sections adjacent to the reference section as the comparison section in the comparison process, The reference section is determined as the divided section that satisfies the specified condition.

  The circuit board inspection apparatus according to claim 3 is the circuit board inspection apparatus according to claim 1, wherein the processing unit is configured to perform the magnetic field strength specifying process in all the opposed positions of the divided sections in the defining process. And the divided section corresponding to the facing position determined to have the highest magnetic field strength among the specified magnetic field strengths is determined as the divided section satisfying the specified condition.

  In the circuit board inspection apparatus according to claim 1, the processing unit sequentially moves the magnetic field detection unit to each facing position facing each divided section obtained by dividing the surface of the electronic component into a plurality of parts in the prescribed processing, and for each facing position. A magnetic field strength specifying process for specifying the magnetic field strength is executed, and a divided section determined to have the specified magnetic field strength satisfying a predetermined specified condition is specified as a specified position at which the magnetic field detection unit is positioned at the time of inspection. For this reason, according to this circuit board inspection apparatus, it is possible to automatically specify a specified position where a magnetic field strength is detected as a preferable specified position for performing an accurate pass / fail inspection. Therefore, according to this circuit board inspection apparatus, it is possible to omit the work of specifying the specified position on the electronic component or the circuit board design drawing based on the design data of the board, etc. As a result, it is mounted on the circuit board. The inspection efficiency of the quality inspection of the connection state between the electronic component and the conductor pattern can be sufficiently improved.

  In the circuit board inspection apparatus according to claim 2, the processing unit compares the comparison magnetic field strength at the facing position of the comparison section adjacent to the reference section and the reference magnetic field strength at the facing position of the reference section in the defining process. When the comparison process determines that the comparison magnetic field strength is equal to or less than the reference magnetic field strength, another comparison section is selected and the comparison process is executed. In the comparison processing, the comparison magnetic field strength is determined to be greater than the reference magnetic field strength. When this is done, the comparison section is set as a new reference section and the comparison process is executed. In each of the comparison processes executed by selecting each divided section adjacent to the reference section as the comparison section in the comparison process, the comparison magnetic field strength is When it is determined that the reference magnetic field intensity is equal to or less than the reference magnetic field strength, the reference section is determined as a divided section that satisfies the specified condition. When the processing unit executes such processing, it is possible to specify a divided section having a high magnetic field strength without executing the magnetic field strength specifying process for all the divided sections. Therefore, according to this circuit board inspection apparatus, for example, the magnetic field strength specifying process is performed a smaller number of times as compared with the configuration in which the magnetic field strength specifying process is executed for all the divided sections to specify the divided section having the largest magnetic field strength. As a result, it is possible to specify a divided section having a high magnetic field strength, and as a result, it is possible to further improve the inspection efficiency of the quality inspection of the connection state between the electronic component and the conductor pattern.

  In the circuit board inspection apparatus according to claim 3, the processing unit executes the magnetic field strength specifying process at all the opposing positions of the divided sections in the defining process, and the magnetic field strength is the highest among the specified magnetic field strengths. The divided section corresponding to the facing position determined to be high is determined as the divided section that satisfies the specified condition. For this reason, according to the circuit board inspection apparatus, for example, when there are a plurality of divided sections having a large magnetic field strength on the surface of the electronic component, it is possible to reliably identify the divided section having the largest magnetic field strength among them. it can.

1 is a configuration diagram showing a configuration of a circuit board inspection device 1. FIG. 1 is a configuration diagram showing a configuration of a circuit board 100. FIG. It is the 1st explanatory view explaining the procedure of regulation processing. It is the 2nd explanatory view explaining the procedure of regulation processing. It is the 3rd explanatory view explaining the procedure of regulation processing. It is the 4th explanatory view explaining the procedure of regulation processing. It is the 5th explanatory view explaining the procedure of regulation processing.

  Hereinafter, an embodiment of a circuit board inspection apparatus will be described with reference to the drawings.

  First, the configuration of the circuit board inspection apparatus 1 shown in FIG. 1 as an example of the circuit board inspection apparatus will be described. The circuit board inspection apparatus 1 is configured to be able to perform a quality inspection of the connection state between the electronic component 103 mounted on the circuit board 100 shown in FIG. 2 and the conductor pattern 102 of the circuit board 100, for example.

  As an example, the circuit board 100 includes a substrate 101, a conductor pattern 102 formed on the surface of the substrate 101, and an electronic component 103 mounted on the substrate 101, as shown in FIG. ing.

  On the other hand, the circuit board inspection apparatus 1 includes a signal output unit 2, a probing mechanism 3, a magnetic field detection unit 4, a moving mechanism 5, a storage unit 6, and a processing unit 7, as shown in FIG.

  The signal output unit 2 outputs the inspection signal Sa according to the control of the processing unit 7. The probing mechanism 3 performs a probing process for probing (contacting) the probe 21 connected to the signal output unit 2 with respect to an inspection point (probing point) outside the figure defined on the conductor pattern 102. Execute according to the control.

  For example, the magnetic field detection unit 4 includes an MR element (magnetoresistance effect element), and is generated when an inspection signal Sa is supplied to an inspection point on the conductor pattern 102 of the circuit board 100. The magnetic field strength M of the magnetic field to be detected is detected, and a detection signal Ss is output. In this case, the circuit board inspection apparatus 1 includes two MR elements arranged so that the magnetic sensing directions (the arrangement directions in which the MR elements detect the magnetic field best) differ from each other by 90 °. It is configured.

  The moving mechanism 5 moves the magnetic field detection unit 4 above the circuit board 100 according to the control of the processing unit 7. The storage unit 6 stores board data Db that can specify the shape of the substrate 101 and the conductor pattern 102 that constitute the circuit board 100 and the arrangement position of the electronic component 103, and electronic component data De that can specify the shape of the electronic component 103. To do. Further, the storage unit 6 stores specified position data Dr and specified magnetic field strength data Dm, which will be described later, generated by the processing unit 7.

  The processing unit 7 controls the output of the inspection signal Sa by the signal output unit 2. Further, the processing unit 7 controls the probing process by the probing mechanism 3. Further, the processing unit 7 controls the movement of the magnetic field detection unit 4 by the moving mechanism 5. The processing unit 7 functions as an inspection unit, and the magnetic field intensity of the magnetic field detected by the magnetic field detection unit 4 in a state where the magnetic field detection unit 4 faces the specified position Pr (see FIG. 6) on the electronic component 103. Based on M (detection signal Ss output from the magnetic field detection unit 4), a quality inspection of the connection state between the electronic component 103 and the conductor pattern 102 is performed.

  Further, the processing unit 7 predefines the above-mentioned prescribed position Pr used in the pass / fail inspection based on the magnetic field intensity M detected by the magnetic field detection unit 4 (prior to the inspection of the circuit board 100 to be inspected). Execute.

  Next, a method for performing a pass / fail inspection of the connection state between the electronic component 103 of the circuit board 100 and the conductor pattern 102 using the circuit board inspection apparatus 1, and the operation of each part constituting the circuit board inspection apparatus 1 at that time This will be described with reference to the drawings.

  Prior to the pass / fail inspection of the circuit board 100 to be inspected, the circuit board inspection apparatus 1 is used to define the specified position Pr (the position on the electronic component 103 at which the magnetic field detection unit 4 faces when performing the pass / fail inspection). The specified process is executed. Specifically, first, a circuit board 100 (hereinafter also referred to as “non-defective circuit board 100”) in which the conductor pattern 102 is not disconnected or short-circuited and the conductor pattern 102 and the electronic component 103 are well connected. It is made to hold | maintain to the board | substrate holding part outside a figure. Next, an operation unit (not shown) is operated to instruct the start of the regulation process. In response to this, the processing unit 7 executes the defining process.

  In this defining process, the processing unit 7 first reads the board data Db and the electronic component data De from the storage unit 6, and the electronic components on the board 101 of the non-defective circuit board 100 based on these data Db and De. The position of 103 and the shape (planar shape) of the electronic component 103 are specified.

  Subsequently, as illustrated in FIG. 2, the processing unit 7 divides the surface of the electronic component 103 (a planar region in a state in which the electronic component 103 is viewed in plan) into a plurality of squares having a predetermined length as one side. It is divided into sections B1 to B35 (hereinafter also referred to as “divided sections B” when not distinguished). Next, the processing unit 7 controls the probing mechanism 3 to cause the probe 21 to probe the inspection points outside the figure defined on the conductor pattern 102 of the non-defective circuit board 100. Subsequently, the processing unit 7 controls the signal output unit 2 to output the inspection signal Sa. As a result, the inspection signal Sa is supplied to the inspection point of the conductor pattern 102 via the probe 21. Further, along with the supply of the inspection signal Sa, a magnetic field is generated at the conductor pattern 102 and the connection terminals of the electronic component 103 connected to the conductor pattern 102.

  Next, the processing unit 7 controls the moving mechanism 5 to sequentially move the magnetic field detection unit 4 to each facing position (position above the reference section Bs) facing each divided section B, so that a magnetic field for each facing position is obtained. Execute the magnetic field intensity specifying process that specifies the intensity M based on the detection signal Ss output from the magnetic field detection unit 4, and set the divided section B that has been determined that the specified magnetic field intensity M satisfies the specified condition as the specified position. It is defined as Pr.

  Specifically, the processing unit 7 sets one divided section B (for example, the divided section B13 illustrated in FIG. 3) in each divided section B as the reference section Bs. Subsequently, the processing unit 7 performs a magnetic field intensity specifying process (a detection signal output from the magnetic field detection unit 4 by moving the magnetic field detection unit 4 to the facing position at the facing position facing the divided section B13 as the reference section Bs). The process of specifying the magnetic field strength M at the opposite position based on Ss) is executed. In this case, the magnetic field strength M specified by the magnetic field strength specifying process at the position facing the reference section Bs is also referred to as “reference magnetic field strength Ms” hereinafter.

  Next, the processing unit 7 selects any one of the divided sections B (divided sections B1 to B3, B12, B14, and B15 to B17 illustrated in FIG. 3) adjacent to the reference section Bs (surrounding the reference section Bs). The divided section B (for example, the divided section B14 shown in the figure) is selected as the comparison section Bc, and the magnetic field strength specifying process is executed at a position opposite to the divided section B14 as the comparison section Bc. In this case, the magnetic field strength M specified by the magnetic field strength specifying process at the position facing the comparison section Bc is also referred to as “comparative magnetic field strength Mc” hereinafter. Subsequently, the processing unit 7 performs a comparison process for comparing the comparative magnetic field strength Mc with the reference magnetic field strength Ms.

  When the processing unit 7 determines that the comparison magnetic field strength Mc is equal to or less than the reference magnetic field strength Ms in the above comparison processing, the processing unit 7 performs the other divisions B1 to B3, B12, B14, and B15 to B17 adjacent to the reference division Bs. One divided section B (a divided section B other than the divided section B14, for example, the divided section B17) is selected as a new comparison section Bc, and a comparison process (second comparison process) is executed to perform a new comparison. The comparison magnetic field strength Mc and the reference magnetic field strength Ms for the section Bc are compared.

  In this case, when the processing unit 7 determines that the comparison magnetic field strength Mc is equal to or less than the reference magnetic field strength Ms in the second comparison process, the processing unit 7 is still another one of the divided sections B1 to B3, B12, B14, and B15 to B17. One divided section B is selected as a new comparison section Bc, and a comparison process (third comparison process) is executed. In other words, as long as the comparison magnetic field strength Mc is determined to be equal to or less than the reference magnetic field strength Ms in the comparison process, the processing unit 7 repeatedly performs the comparison process by changing the divided section B as the comparison section Bc.

  On the other hand, when the processing unit 7 determines in the comparison processing that the comparative magnetic field strength Mc for the divided section B17 (see FIG. 4) as the comparative section Bc is larger than the reference magnetic field strength Ms, for example, as shown in FIG. Then, the divided section B17 is set as a new reference section Bs, and the comparison process is executed. In this comparison process, as described above, any one of the divided sections B adjacent to the new reference section Bs (the divided sections B11 to B13, B16, B18, and B25 to B27 shown in the figure). The section B is selected as the comparison section Bc, the magnetic field strength specifying process is executed, and the comparison process for comparing the comparison magnetic field strength Mc for the comparison section Bc with the reference magnetic field strength Ms for the reference section Bs is executed. Hereinafter, the processing unit 7 repeatedly executes such comparison processing.

  Next, in the comparison process, for example, the processing unit 7 has a comparison magnetic field strength Mc for the divided section B18 (see FIG. 4) as the comparison section Bc larger than a reference magnetic field strength Ms for the divided section B17 as the reference section Bs. 5, as shown in FIG. 5, the divided section B18 is set as a new reference section Bs, and one of the divided sections B10 to B12, B17, B19, and B24 to B26 adjacent to the reference section Bs. One divided section B is selected as the comparison section Bc and the comparison process is executed.

  Subsequently, the processing unit 7 selects the divided sections B10 to B12, B17, B19, and B24 to B26 as the comparison sections Bc one by one and performs the comparison magnetic field in all the comparison processes (all of the eight comparison processes). When the intensity Mc is determined to be equal to or less than the reference magnetic field strength Ms, the divided section B18 as the reference section Bs at that time (hereinafter, the reference section Bs is also referred to as “the last reference section Bs”) satisfies the specified condition. Is determined. In this case, the magnetic field intensity M for the divided section B18 that has become the last reference section Bs by repeating the comparison process as described above is all set as the reference section Bs or selected as the comparison section Bc so far. It can be said that it is the maximum value among the magnetic field strengths M for the divided sections B. That is, it is understood that the divided section B18 having a sufficiently large magnetic field strength M can be specified by repeating the comparison process as described above.

  Next, as illustrated in FIG. 6, the processing unit 7 sets the divided section B18 (specifically, the center of the divided section B18) as the reference section Bs determined as the divided section B that satisfies the specified condition as the specified position Pr. The specified position data Dr indicating the specified position Pr is generated and stored in the storage unit 6. Further, the processing unit 7 generates the prescribed magnetic field strength data Dm indicating the magnetic field strength M for the prescribed position Pr (that is, the magnetic field strength M for the divided section B18 and hereinafter also referred to as “the prescribed magnetic field strength Mr”). And stored in the storage unit 6.

  Subsequently, the processing unit 7 controls the moving mechanism 5 to move the magnetic field detection unit 4 to the initial position. Further, the processing unit 7 controls the signal output unit 2 to stop the output of the inspection signal Sa, and controls the probing mechanism 3 to move the probe 21 to the initial position.

  Next, when another inspection point is defined on the conductor pattern 102, the processing unit 7 controls the probing mechanism 3 to cause the probe 21 to probe the inspection point and to control the signal output unit 2. Then, the inspection signal Sa is output. Subsequently, the processing unit 7 executes the above-described defining process to define the specified position Pr, generates the specified position data Dr and the specified magnetic field strength data Dm, and stores them in the storage unit 6. Thereafter, the processing unit 7 performs the same processing for each inspection point to define the specified position Pr, generates the specified position data Dr and the specified magnetic field strength data Dm, and stores them in the storage unit 6. Thus, the regulation process ends.

  Next, a quality inspection of the connection state between the electronic component 103 and the conductor pattern 102 on the circuit board 100 to be inspected is performed. Specifically, the circuit board 100 to be inspected is held by the board holding unit (not shown), and then the operation unit (not shown) is operated to instruct the start of the pass / fail inspection. In response to this, the processing unit 7 performs a pass / fail inspection.

  In this pass / fail inspection, the processing unit 7 controls the probing mechanism 3 to probe the probe 21 with respect to the inspection points defined on the conductor pattern 102, and then controls the signal output unit 2, The inspection signal Sa is output. As a result, the inspection signal Sa is supplied to the inspection point of the conductor pattern 102 via the probe 21, and a magnetic field is generated at the connection terminal of the conductor pattern 102 and the electronic component 103 with the supply of the inspection signal Sa.

  Next, the processing unit 7 reads the specified position data Dr and the specified magnetic field strength data Dm from the storage unit 6. Subsequently, the processing unit 7 controls the moving mechanism 5 to move the magnetic field detection unit 4 to a position facing the specified position Pr specified by the specified position data Dr. At this time, the magnetic field detector 4 detects the magnetic field intensity M and outputs a detection signal Ss. Next, the processing unit 7 specifies the magnetic field strength M for the specified position Pr based on the detection signal Ss output from the magnetic field detection unit 4. Subsequently, the processing unit 7 compares the specified magnetic field strength M with the specified magnetic field strength Mr for the specified position Pr on the non-defective circuit board 100 indicated by the specified magnetic field strength data Dm.

  Here, when there is a portion where the connection state between the connection terminal of the circuit board 100 and the conductor pattern 102 is poor and the inspection signal Sa does not flow, when the inspection signal Sa is supplied to the non-defective circuit board 100 The magnetic field strength M is reduced or increased as compared with the above. Therefore, the processing unit 7 is mounted on the circuit board 100 to be inspected when the magnetic field strength M at the specified position Pr in the specified circuit board 100 to be inspected is outside the range reference range with the specified magnetic field strength Mr as the center value. It is determined that the connection state between the electronic component 103 and the conductor pattern 102 is defective. Next, the processing unit 7 displays the determination result (inspection result) on a display unit outside the drawing.

  Subsequently, the processing unit 7 controls the moving mechanism 5 to move the magnetic field detection unit 4 to the initial position. Further, the processing unit 7 controls the signal output unit 2 to stop the output of the inspection signal Sa, and controls the probing mechanism 3 to move the probe 21 to the initial position.

  Next, when another inspection point is defined on the conductor pattern 102, the processing unit 7 controls the probing mechanism 3 to cause the probe 21 to probe the inspection point and to control the signal output unit 2. Then, the inspection signal Sa is output. Subsequently, the processing unit 7 performs the above-described pass / fail inspection.

  As described above, in the circuit board inspection apparatus 1, the processing unit 7 sequentially moves the magnetic field detection unit 4 to each facing position facing each divided section B obtained by dividing the surface of the electronic component 103 into a plurality of parts in the regulation process. The magnetic field intensity specifying process for specifying the magnetic field intensity M for each facing position is executed, and the magnetic field detection unit 4 is positioned at the time of inspecting the divided section B determined that the specified magnetic field intensity M satisfies a predetermined regulation condition. It is specified as the specified position Pr to be made. For this reason, according to the circuit board inspection apparatus 1, it is possible to automatically specify the specified position Pr where the magnetic field strength M is detected as a preferable specified position Pr for performing an accurate pass / fail inspection. Therefore, according to the circuit board inspection apparatus 1, it is possible to omit the work of defining the specified position Pr in the electronic component or circuit board design drawing based on the board design data, etc. The inspection efficiency of the pass / fail inspection of the connection state between the electronic component 103 and the conductor pattern 102 can be sufficiently improved.

  Further, in the circuit board inspection apparatus 1, the processing unit 7 determines the comparison magnetic field strength Mc at the facing position of the comparison section Bc adjacent to the reference section Bs and the reference magnetic field strength Ms at the facing position of the reference section Bs in the defining process. When the comparison process for comparison is executed and the comparison magnetic field strength Mc is determined to be equal to or lower than the reference magnetic field intensity Ms in the comparison process, another comparison section Bc is selected and the comparison process is executed. When it is determined that the magnetic field intensity is greater than the magnetic field strength Ms, the comparison section Bc is set as a new reference section Bs and the comparison process is executed. In the comparison process, each divided section B adjacent to the reference section Bs is selected as the comparison section Bc. When the comparison magnetic field strength Mc is determined to be equal to or less than the reference magnetic field strength Ms in all the comparison processes executed in the same manner, the reference section Bs is defined. Determining a dividing partition B satisfying matter. When the processing unit 7 executes such processing, it is possible to specify the divided section B having a large magnetic field strength M without executing the magnetic field strength specifying process for all the divided sections B. For this reason, for example, the magnetic field strength M is large by a small number of magnetic field strength specifying processes compared to the configuration in which the magnetic field strength specifying process is executed for all the divided sections B to specify the divided section B having the largest magnetic field strength M. As a result of specifying the divided section B, it is possible to further improve the inspection efficiency of the quality inspection of the connection state between the electronic component 103 and the conductor pattern 102.

  The circuit board inspection apparatus is not limited to the above configuration. For example, the processing unit 7 executes the magnetic field strength specifying process for all the divided sections B in the specified process, and determines the divided sections B that are determined to have the highest magnetic field strength M among the specified magnetic field strengths M as the specified conditions. It is also possible to adopt a configuration for determining that the divided section B satisfies the above. According to this configuration, for example, when there are a plurality of divided sections B having a large magnetic field strength M on the surface of the electronic component 103, the divided section B having the largest magnetic field strength M can be reliably identified from among them. . In this case, as shown in FIG. 7, the magnetic field intensity is detected by sequentially moving the magnetic field detector 4 to the opposing position of the adjacent divided section B, starting from the opposing position of the divided section B located at the end of the circuit board 100. By executing the specific process, the specified process can be efficiently performed.

  In addition, when the magnetic field strength M is equal to or larger than a predetermined value in the process of executing the magnetic field strength specifying process by sequentially moving the magnetic field detection unit 4 to each facing position facing each divided partition B, the divided partition B It is also possible to adopt a configuration in which it is determined that the divided section B satisfies the specified condition and is specified at the specified position Pr.

  Further, the example using the magnetic field detection unit 4 provided with two MR elements arranged so that the magnetic sensing directions are different from each other by 90 ° has been described. However, the configuration using the magnetic field detection unit 4 provided with only one MR element is described. Can also be adopted. In this case, two magnetic field strength specifying processes are performed in which the direction of the magnetic field detection unit 4 (MR element) is changed by 90 ° at the position facing one divided section B, and the two magnetic field strength specifying processes are specified. The comparison process can also be performed using the total value or average value of the magnetic field strengths M. Further, instead of the MR element, a magnetic field detection unit 4 constituted by other magnetic field detection elements (for example, a magnetic impedance element (MI element), a flux gate sensor, etc.) can be used.

  Further, in the defining process, the example in which the surface of the electronic component 103 is divided by the square divided section B has been described above. However, the shape of the divided section B is an arbitrary shape such as a quadrilateral other than a square or a polygon other than a square. Can be adopted. Further, the sizes of the divided sections B are not necessarily the same as each other, and may be different.

DESCRIPTION OF SYMBOLS 1 Circuit board inspection apparatus 2 Signal output part 4 Magnetic field detection part 5 Moving mechanism 7 Processing part 100 Circuit board 102 Conductor pattern 103 Electronic component B Division | segmentation division Bc Comparison division Bs Reference division M Magnetic field strength Mc Comparison magnetic field strength Ms Reference magnetic field strength Pr Regulation | regulation Position Sa Inspection signal Ss Detection signal

Claims (3)

A magnetic field detector for detecting a magnetic field intensity of a magnetic field generated when an inspection signal is supplied to an inspection point on a conductor pattern on a circuit board on which the electronic component is mounted; and a pre-defined rule on the electronic component An inspection unit for performing a pass / fail inspection of the connection state between the electronic component and the conductor pattern based on the magnetic field intensity detected by the magnetic field detection unit with the magnetic field detection unit facing the position A circuit board inspection device,
A moving mechanism for moving the magnetic field detector;
A processing unit that controls the movement of the magnetic field detection unit by the moving mechanism and executes a defining process that preliminarily defines the defined position used in the pass / fail inspection based on the magnetic field intensity detected by the magnetic field detection unit; Prepared,
In the defining process, the processing unit sequentially moves the magnetic field detection unit to each facing position facing each divided section obtained by dividing the surface of the electronic component into a plurality of parts, and specifies the magnetic field strength for each facing position. A circuit board inspection apparatus that executes a magnetic field strength specifying process and defines the divided section determined as the specified position satisfying a predetermined specified condition as the specified position. In the regulation process, the processing unit
The magnetic field strength specifying process is executed at the facing position of one divided section set as a reference section from among the divided sections, and any one of the divided sections adjacent to the reference section is selected as a comparison section. The magnetic field strength specifying process is executed at the facing position of the comparison section, and the reference magnetic field strength as the magnetic field strength at the facing position of the comparison section and the reference magnetic field strength as the magnetic field strength at the facing position of the reference section Execute a comparison process that compares
When it is determined in the comparison process that the comparison magnetic field strength is equal to or less than the reference magnetic field strength, the other division section adjacent to the reference section is selected as the new comparison section, and the comparison process is executed.
When it is determined in the comparison process that the comparison magnetic field strength is greater than the reference magnetic field strength, the comparison section is set as a new reference section, and the comparison process is executed.
When the comparison magnetic field strength is determined to be equal to or less than the reference magnetic field strength in all the comparison processes executed by selecting all the divided sections adjacent to the reference section as the comparison section in the comparison process, the reference section The circuit board inspection apparatus according to claim 1, wherein the circuit board inspection apparatus determines that the divided section satisfies the specified condition. In the regulation process, the processing unit
The magnetic field strength specifying process is executed at all of the facing positions of the divided sections, and the divided sections corresponding to the facing positions determined to have the highest magnetic field strength among the specified magnetic field strengths are defined as the specified condition. The circuit board inspection apparatus according to claim 1, wherein the circuit board inspection apparatus determines that the divided section is satisfied.

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