JP2015076591A - Feedthrough capacitor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a feedthrough capacitor capable of preventing occurrence of surface leakage.SOLUTION: Inside an element assembly 10, which has a pair of side faces 10a and 10b, a pair of end faces 10c and 10d and a pair of main faces 10e and 10f and is constituted of a dielectric ceramic, first inner electrodes 20 and second inner electrodes 22 are alternately laminated through dielectric layers 24. First terminal electrodes 30 and 32 are formed on the end faces 10c and 10d of the element assembly 10. Second terminal electrodes 34 and 36 are formed on the side faces 10a and 10b of the element assembly 10. On a surface, where the distance between the first terminal electrodes 30 and 32 and the second terminal electrodes 34 and 36 is the shortest, of the element assembly 10, are formed both insulator film region in which insulator layers 40 are formed and an element assembly-surface exposed region 42 in which the insulator layers 40 are not formed.

Description

  The present invention relates to a feedthrough capacitor, and more particularly to a feedthrough capacitor in which surface leakage is unlikely to occur.

  Feedthrough capacitors are used for noise suppression of electronic components. For example, as shown in Patent Document 1, the feedthrough capacitor has a pair of signal terminal electrodes and a pair of ground terminal electrodes, and has an external terminal as compared with a general capacitor (a pair of terminal electrodes only). There are many numbers.

  In recent years, feedthrough capacitors have also been miniaturized in order to reduce the size and thickness of electronic components. For this reason, the distance between a signal terminal electrode and a ground terminal electrode has become closer. Therefore, surface leakage occurs between these terminal electrodes on the surface of the feedthrough capacitor body, and desired characteristics may not be obtained.

JP-A-1-206615

  The present invention has been made in view of such a situation, and an object thereof is to provide a feedthrough capacitor capable of preventing occurrence of surface leakage.

In order to achieve the above object, the feedthrough capacitor according to the present invention comprises:
An element body having a pair of side surfaces, a pair of end surfaces, and a pair of main surfaces, and made of a dielectric ceramic;
A first internal electrode disposed in the element body and drawn out to the pair of end faces;
A second internal electrode disposed in the element body and drawn out to the pair of side surfaces;
A first terminal electrode formed on an end surface of the element body and connected to the first internal electrode;
A feedthrough capacitor having a second terminal electrode formed on a side surface of the element body and connected to the second internal electrode,
On the surface of the element body that is the shortest distance between the first terminal electrode and the second terminal electrode, an insulating film region where an insulating film is formed, and an element body surface exposed region where the insulating film is not formed Both are formed.

  In general, surface leakage current is likely to occur on the surface of the feedthrough capacitor element body, which is the shortest distance between the first terminal electrode serving as the signal terminal electrode and the second terminal electrode serving as the ground terminal electrode. In particular, the tendency has become remarkable with the miniaturization and thinning of capacitors.

  In the feedthrough capacitor according to the present invention, an insulating film is formed between the first terminal electrode serving as the signal terminal electrode and the second terminal electrode serving as the ground terminal electrode. It is possible to suppress the occurrence of surface leakage current in Further, since the element body surface exposed region where the insulating film is not formed is formed together with the insulating film region, adhesion of dust and the like is suppressed, and surface leakage due to dust can be prevented.

  If the first terminal electrode and the second terminal electrode are connected by an insulating film without forming an element body surface exposed region, the surface of the insulating film is caused by dust or the like attached to the surface. Leakage current is generated. In the present invention, by providing the element body surface exposed region to which dust does not easily adhere, surface leakage due to dust can be prevented. That is, the insulating film is not continuously formed between the first terminal electrode and the second terminal electrode on the shortest path between the first terminal electrode and the second terminal electrode that causes surface leakage (element exposed portion). Therefore, surface leakage due to dust can be prevented.

  Preferably, the insulating film is formed so as not to connect the first terminal electrode and the second terminal electrode on the surface of the element body that is the shortest distance between the first terminal electrode and the second terminal electrode. It is.

Preferably, the insulating film is formed so as to cover a surface of the element body located at a boundary between the surface of the element body and the first terminal electrode,
The insulating film is formed so as to cover the surface of the element body located at the boundary between the surface of the element body and the second terminal electrode;
The exposed surface of the element body is formed on the surface of the element body located between the insulating film near the first terminal electrode and the insulating film near the second terminal electrode.

  With this configuration, surface leakage current can be more effectively prevented. At the boundary between the surface of the element body and the terminal electrode, that is, at the edge of the terminal electrode, the electric field concentrates along with the voltage application of the terminal electrode, and avalanche, positive corona discharge and inter-terminal discharge continue to occur, resulting in surface leakage. Is considered to occur. By disposing the insulating film at the edge portions of both the first terminal electrode and the second terminal electrode, surface leakage current can be more effectively prevented.

  Preferably, the insulating film is formed on the surface of the element body with a thickness that does not protrude outward from the outer surfaces of the first terminal electrode and the second terminal electrode. With this configuration, mountability when the feedthrough capacitor is mounted on a circuit board or the like by soldering or the like is improved.

  Preferably, the insulating film is formed across the main surface to the side surface at a corner portion of the element body where the main surface and the side surface of the element body intersect. Since the insulating film is formed across the corners, the stress at the corners of the element body can be relieved. In addition, since the insulating film covers the roundness of the element body, it is possible to reduce nozzle suction errors and image recognition errors during mounting.

  Preferably, on the side surface of the element body, the insulating film is formed along the second terminal electrode on the surface of the element body located at a boundary between the surface of the element body and the second terminal electrode. . Generally, on the side surface of the element body, the lead portion of the second internal electrode connected to the second terminal electrode is easily exposed on the surface of the element body on both sides of the second terminal electrode, from which moisture and the like are exposed. Easy to enter. However, by forming the insulating film along the second terminal electrode, it is possible to prevent moisture from entering the internal electrode.

  Preferably, in the pair of main surfaces, both the insulating film region and the element body surface exposed region are formed on the surface of the element body. By applying the structure of the present invention to both the pair of main surfaces, it becomes possible to mount on either main surface, and there is no need to worry about the direction during mounting, and the mounting workability is excellent.

FIG. 1 is a perspective view of a multilayer feedthrough capacitor according to an embodiment of the present invention. FIG. 2 is a side view of the capacitor shown in FIG. FIG. 3 is a sectional view taken along line III-III shown in FIG. 4 is a cross-sectional view taken along line IV-IV shown in FIG. 5A is an exploded perspective view showing the manufacturing process of the capacitor body shown in FIG. 1, and FIG. 5B is a perspective view of the ground terminal electrode shown in FIG. 5A. FIG. 6 is a perspective view of a multilayer feedthrough capacitor according to another embodiment of the present invention. FIG. 7 is an exploded perspective view showing a manufacturing process of a capacitor body in a multilayer feedthrough capacitor according to still another embodiment of the present invention.

  Hereinafter, the present invention will be described based on embodiments shown in the drawings.

First Embodiment As shown in FIG. 1, a multilayer feedthrough capacitor 2 according to an embodiment of the present invention has a capacitor body 10. The capacitor body 10 has a pair of side surfaces 10a and 10b, a pair of end surfaces 10c and 10d, and a pair of main surfaces 10e and 10f, and has a rectangular parallelepiped shape. The side surfaces 10e and 10f face the Y-axis direction, and the main surface faces the Z-axis direction. Further, the end faces 10c and 10d face each other in the X axis direction. Note that the X axis, the Y axis, and the Z axis are perpendicular to each other.

  The capacitor body 10 is made of a dielectric ceramic. As shown in FIGS. 3 to 5, a layered first internal electrode 20 as a signal internal electrode is connected to the ground via an inner dielectric layer 24. It has a laminated structure in which layered second internal electrodes 22 as internal electrodes are alternately laminated. On the outer side in the stacking direction (Z-axis direction), an outer dielectric layer 26 having a thickness larger than that of the inner dielectric layer 24 is stacked.

  As shown in FIG. 5A, the outer dielectric layer 26 is formed by laminating a plurality of green sheets and firing together with the other green sheets to be the dielectric layer 24 and the electrode layers to be the internal electrodes 20 and 22. Is obtained.

  The dielectric material constituting the inner dielectric layer 24 and the outer dielectric layer 26 is not particularly limited as long as it is insulative. For example, a dielectric such as calcium titanate, strontium titanate, barium titanate, zirconium titanate or the like. Materials are illustrated. Further, the material of the internal electrodes 20 and 22 is not particularly limited, and examples thereof include palladium base alloys such as Ni, Ni alloy, silver-palladium alloy, Cu, Ag, and the like.

  As shown in FIGS. 3, 4, and 5 (A), the first internal electrode 20 has a width in the Y-axis direction that is narrower than the width in the Y-axis direction of the element body 10, and is exposed on the side surfaces 10 a and 10 b. Instead, it extends along the X-axis direction and is exposed on the end faces 10c and 10d of the element body 10. As shown in FIG. 3, first terminal electrodes 30 and 32 as signal terminal electrodes are formed on the end faces 10 c and 10 d of the element body 10, respectively, and are exposed to the end faces 10 c and 10 d. The lead ends of the electrodes are connected to the inner surfaces of the first terminal electrodes 30 and 32, respectively.

  As shown in FIG. 4, FIG. 5A and FIG. 5B, the second internal electrode 22 is provided corresponding to the position of the first internal electrode 20 via the inner dielectric layer 24, and X The length in the axial direction is shorter than that of the first internal electrode 20, and it is not exposed to the end faces 10c and 10d in the X-axis direction. Instead, as shown in FIG. 4 and FIG. 5 (B), the lead part 23 is formed at the center of the second internal electrode 22 in the X-axis direction so as to protrude on both sides in the Y-axis direction. The leading end of each lead portion 23 is exposed to the side surfaces 10a and 10b of the element body 10.

  As shown in FIG. 1, second terminal electrodes 34 and 36 as ground terminal electrodes are formed on both side surfaces 10a and 10b of the element body 10, respectively. Inside the terminal electrodes 34 and 36, the tips of the lead portions 23 of the second internal electrode 22 shown in FIGS. 4 and 5A are connected. The width of the lead portion 23 in the X-axis direction is preferably equal to or less than the width of the second terminal electrodes 34 and 36 in the X-axis direction.

  As shown in FIG. 1, the second terminal electrodes 34 and 36 are formed at substantially the center position in the X-axis direction on the side surfaces 10 a and 10 b of the element body 10, extend in the Z-axis direction, and the side surfaces 10 a and 10 b In the corner | angular part with main surface 10e, 10f, it is formed over the main surfaces 10e, 10f side. Semicircular end portions 35 and 37 located on the main surfaces 10e and 10f are formed at the end portions in the Z-axis direction of the second terminal electrodes 34 and 36, respectively. By providing the semicircular end portions 35 and 37 in this way, the adhesion strength between the second terminal electrode 34 and the element body 10 can be improved, and the entry of moisture and the like into the inside can be suppressed. .

  Cover portions 31 and 33 are continuously formed on the first terminal electrode 30 and the second terminal electrode 32 so as to cover the end portions in the X-axis direction on the side surfaces 10a and 10b and the main surfaces 10e and 10f. is there. By forming these cover portions 31 and 33 integrally with the terminal electrodes 30 and 32, the adhesion strength with the element body 10 can be improved and the ingress of moisture into the inside can be suppressed.

  The terminal electrodes 30, 32, 34, and 36 are not particularly limited, but are made of, for example, Cu, Ni, Ag, Au, Pd, or the like. The terminal electrodes 30, 32, 34, and 36 are formed on the outer surface of the element body 10 by baking, plating, printing, CVD, PDV, or the like.

  In the present embodiment, the insulating film 40 is formed on the surface (side surfaces 10a, 10b and main surfaces 10e, 10f) of the element body 10 that is the shortest distance between the first terminal electrodes 30, 32 and the second terminal electrodes 34, 36. Both the insulating film region to be formed and the element body surface exposed region 42 in which the insulating film 40 is not formed are formed. The insulating film 40 has the first terminal electrodes 30, 32 and the second terminal electrodes 34, 36 on the surface of the element body 10 that is the shortest distance between the first terminal electrodes 30, 32 and the second terminal electrodes 34, 36. It is formed so as not to contact.

  In the present embodiment, the shortest distance W0 (see FIG. 2) between the first terminal electrodes 30 and 32 and the second terminal electrodes 34 and 36 is not particularly limited, but has become shorter as the element body 10 becomes smaller. For example, 0.1 to 0.3 mm. Further, the width W3 in the X-axis direction (width between the electrodes) in the element body surface exposed region 42 is preferably 0.06 to 0.24 mm. Further, the widths W1 and W2 (widths between the electrodes) in the X-axis direction of the pair of insulating films 40 located between the electrodes may be different or the same, and preferably 0.02 to 0.12 mm. . In the illustrated example, the two insulating films 40 are formed on the surface of the element body with the shortest distance W0. However, the present invention is not limited to this, and may be single or three or more. Accordingly, the number of the element body surface exposed regions 42 may be plural. The ratio of the width W3 to the shortest distance W0 (W3 / W0) is preferably 0.2 to 2.4.

The insulating film 40 is made of, for example, epoxy resin, phenol resin, silicon resin, or the like, and is formed in an intermittent pattern in the X, Y, and Z axis directions as shown in FIG. Preferably, the insulating film 40 is a ceramic paste film such as SiC, Al ₂ O ₃ , BN, ZrO ₂ , and has a higher insulating property than the element body 10. The formation method of the insulating film 40 is not particularly limited, and examples thereof include pattern coating using an insulating paste, a CVD method, and a PVD method. The insulating film 40 may be formed on the surface of the element body 10 after the terminal electrodes 30, 32, 34, 36 are formed, or before the terminal electrodes 30, 32, 34, 36 are formed. It may be formed on the surface.

  In general, on the surface of the element body 10 of the feedthrough capacitor 2 that is the shortest distance between the first terminal electrodes 30 and 32 serving as signal terminal electrodes and the second terminal electrodes 34 and 36 serving as ground terminal electrodes, Surface leakage current is likely to occur. In particular, the tendency has become remarkable with the miniaturization and thinning of capacitors.

  In the feedthrough capacitor 2 according to the present embodiment, since the insulating film 40 is formed between the first terminal electrodes 30 and 32 and the second terminal electrodes 34 and 36, the surface between these electrodes is formed. Generation of leakage current can be suppressed. In addition, since the element body surface exposed region 42 where the insulating film 40 is not formed is formed together with the insulating film region, adhesion of dust and the like is suppressed, and surface leakage due to dust can be prevented.

  In addition, if the first terminal electrodes 30 and 32 and the second terminal electrodes 34 and 36 are communicated with each other through the insulating film 40 without forming the element body surface exposed region 42, they adhere to the surface of the insulating film 40. A surface leakage current is generated due to dust and the like. In the present embodiment, by providing the element body surface exposed region 42 to which dust is difficult to adhere, surface leakage due to dust can be prevented. That is, the insulating film 40 is located between the first terminal electrodes 30 and 32 and the second terminal electrodes 34 and 36 on the shortest path between the first terminal electrodes 30 and 32 and the second terminal electrodes 34 and 36 that cause surface leakage. Therefore, the surface leakage due to dust can be prevented.

  In the present embodiment, the insulating film 40 is formed so as to cover the surface of the element body 10 located at the boundary between the surface of the element body 10 and the first terminal electrodes 30 and 32. An insulating film 40 is formed so as to cover the surface of the element body 10 located at the boundary between the first terminal electrode 34 and the second terminal electrode 34. Further, an element body surface exposed region 42 is formed on the surface of the element body 10 located between the insulating film 40 near the first terminal electrodes 30 and 32 and the insulating film 40 near the second terminal electrodes 34 and 36. It is.

  With this configuration, surface leakage current can be more effectively prevented. At the boundary between the surface of the element body 10 and the terminal electrodes 30 to 36, that is, at the edge portions of the terminal electrodes 30 to 36, the electric field concentrates as the voltage is applied to the terminal electrodes 30 to 36, and avalanche, positive corona discharge and terminal It is considered that surface leakage is caused by the continuous discharge. By disposing the insulating film 40 at the edge portions of both the first terminal electrodes 30 and 32 and the second terminal electrodes 34 and 36, surface leakage current can be more effectively prevented.

  In the present embodiment, the insulating film 40 is formed on the surface of the element body 10 with a thickness that does not protrude outward from the outer surfaces of the first terminal electrodes 30 and 32 and the second terminal electrodes 34 and 36. With this configuration, mountability when the feedthrough capacitor is mounted on a circuit board or the like by soldering or the like is improved.

  As shown in FIG. 1, in this embodiment, the main surface 10e, 10f of the element body 10 and the side surfaces 10a, 10b cross the corners of the element body 10 from the main surfaces 10e, 10f to the side surfaces 10a, 10b. Thus, an insulating film 40 is formed. Since the insulating film 40 is formed across the corners, the stress at the corners of the element body 10 can be relieved. Further, as shown in FIG. 4, the insulating film 40 covers the roundness of the element body 10, and it is possible to reduce nozzle adsorption errors and image recognition errors during mounting.

  As shown in FIGS. 1 and 3, in the present embodiment, in a pair of main surfaces 10e and 10f, an insulating film region in which an insulating film 40 is formed on the surface of the element body 10 and an element body surface exposed region. 42 and both are formed. By applying the structure of the present embodiment to both the pair of main surfaces 10e and 10f, it becomes possible to mount a substrate or the like on any of the main surfaces 10e and 10f, and there is no need to worry about directionality during mounting. Excellent mounting workability.

Second Embodiment A multilayer feedthrough capacitor 2a according to a second embodiment of the present invention is the same as the above-described first embodiment except for the following, and a description of common portions is omitted.

  As shown in FIG. 6, on the side surfaces 10 a and 10 b of the element body 10, the second terminal electrodes 34 and 36 are formed on the surface of the element body 10 located at the boundary between the surface of the element body 10 and the second terminal electrodes 34 and 36. An insulating film 40a is formed along the line. In general, on the side surface of the element body 10, the lead portions 23 (see FIG. 5) of the second internal electrode 22 connected to the second terminal electrodes 34 and 36 are on both sides in the X-axis direction of the second terminal electrodes 34 and 36. Therefore, it is easy to be exposed on the surface of the element body 34, and moisture or the like easily enters from there. However, by forming the insulating film 40 a along the second terminal electrodes 34 and 36, it is possible to effectively prevent moisture from entering the internal electrode 22.

  In the present embodiment, the insulating film 40a is positioned not only on both sides in the X-axis direction of the second terminal electrodes 34 and 36 but also on the entire circumference of the electrodes 34 and 36 including the semicircular ends 35 and 37. Each of the body surfaces to be covered is covered. Further, not only the second electrodes 34 and 36 but also the first electrodes 30 and 32, the surface of the element body 10 extends along the edge portions at the edge portions (boundaries with the element body) of the cover portions 31 and 33. The insulating film 40b may be continuously covered.

  The present invention is not limited to the above-described embodiment, and can be variously modified within the scope of the present invention.

  For example, the internal electrode pattern and the terminal electrode formation pattern in the feedthrough capacitors 2 and 2a are not limited to the above-described embodiment, and can be variously modified. For example, as shown in FIG. 7, the pattern of the first internal electrode 20a inside the capacitor body 10A may be designed to be narrower than the Y-axis direction width of the first internal electrode 20 shown in FIG. Further, as shown in FIG. 7, the X-axis direction width of the lead portion 23a in the second internal electrode 22a is designed wider than the Y-axis direction width of the lead portion 23 in the second internal electrode 22 shown in FIG. You may do it.

  In the example shown in FIG. 7, the pattern of the terminal electrode formed on the outer surface of the element body is determined in accordance with the pattern shape of the internal electrodes 20a, 22a and the lead portion 23a.

2, 2a ... multilayer feedthrough capacitors 10, 10A ... capacitor body 10a, 10b ... side face 10c, 10d ... end face 10e, 10f ... main face 20, 20a ... first internal electrode 22, 22a ... second internal electrode 23, 23a ... Lead portion 24 ... inner dielectric layer 26 ... outer dielectric layer 30, 32 ... first terminal electrodes 34, 36 ... second terminal electrodes 40, 40a, 40b ... insulating film 42 ... element body surface exposed region

Claims (7)

An element body having a pair of side surfaces, a pair of end surfaces, and a pair of main surfaces, and made of a dielectric ceramic;
A first internal electrode disposed in the element body and drawn out to the pair of end faces;
A second internal electrode disposed in the element body and drawn out to the pair of side surfaces;
A first terminal electrode formed on an end surface of the element body and connected to the first internal electrode;
A feedthrough capacitor having a second terminal electrode formed on a side surface of the element body and connected to the second internal electrode,
On the surface of the element body that is the shortest distance between the first terminal electrode and the second terminal electrode, an insulating film region where an insulating film is formed, and an element body surface exposed region where the insulating film is not formed A feedthrough capacitor formed by both.   The insulating film is formed so as not to connect the first terminal electrode and the second terminal electrode on the surface of the element body that is the shortest distance between the first terminal electrode and the second terminal electrode. The feedthrough capacitor according to claim 1. The insulating film is formed so as to cover the surface of the element body located at the boundary between the surface of the element body and the first terminal electrode;
The insulating film is formed so as to cover the surface of the element body located at the boundary between the surface of the element body and the second terminal electrode;
2. The element body surface exposed region is formed on a surface of the element body located between the insulating film near the first terminal electrode and the insulating film near the second terminal electrode. Or the feedthrough capacitor of 2.   The penetration according to claim 1, wherein the insulating film is formed on the surface of the element body with a thickness that does not protrude outward from the outer surfaces of the first terminal electrode and the second terminal electrode. Capacitor.   5. The feedthrough capacitor according to claim 1, wherein the insulating film is formed from the main surface to the side surface at a corner portion of the element body where a main surface and a side surface of the element body intersect. .   2. The insulating film is formed along the second terminal electrode on a side surface of the element body on a surface of the element body located at a boundary between the surface of the element body and the second terminal electrode. The feedthrough capacitor according to any one of?   The feedthrough capacitor according to any one of claims 1 to 6, wherein, in the pair of main surfaces, both the insulating film region and the element body surface exposed region are formed on a surface of the element body.

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