JP2015076534A - Liquid treatment apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cup structure which can be easily and accurately replaced and has a high level of freedom in shape and arrangement choice.SOLUTION: A liquid treatment apparatus (1) comprises: a substrate holder (2) that horizontally holds a substrate (W) and rotates it around a vertical axis; a treatment liquid feeder (7) that feeds treatment liquid to the substrate (W); an outer cup (5) that covers the circumference of the substrate (W); a first inner cup constituent member (30) having a projection (31) so disposed on the rear side of the substrate (W) that its tip protrudes toward the rear side of the substrate (W); and a second inner cup constituent member (40) formed on the outer circumference side of the first inner cup constituent member (30) as a separate element from the first inner cup constituent member (30) and having an inclined face (41) inclining from the lower periphery of the substrate (W) toward its outside.

Description

  The present invention relates to a liquid processing apparatus that supplies a processing liquid to a substrate such as a semiconductor wafer while rotating the substrate to perform a predetermined liquid processing.

  In a photolithography process used in the manufacture of semiconductor devices, a resist coating process for applying a resist solution on a semiconductor wafer (hereinafter referred to as “wafer”) to form a resist film, and exposing the resist film to a predetermined pattern An exposure process and a development process for developing the exposed resist film are performed, and a predetermined resist pattern is formed on the wafer.

  In the resist coating process and the developing process, a resist solution or a developing solution as a processing solution is supplied from the nozzle to the center of the rotating wafer surface, and the processing solution is diffused radially outward by centrifugal force. A so-called spin processing method is often used in which the entire surface is covered with a processing solution.

  For example, as disclosed in Patent Document 1, a liquid processing apparatus that uses a spin processing method includes a spin chuck that holds and rotates a wafer, an outer cup that surrounds the periphery of the wafer, and exhaust and cooperating with the outer cup. It has an inner cup that defines the drainage path. The inner cup has an inclined portion that inclines from the lower peripheral edge of the wafer toward the outside in order to guide the airflow generated by the rotation during the liquid processing or the processing liquid shaken off from the wafer to the drainage port or the exhaust port. Yes.

  Further, in such a liquid processing apparatus, an air flow is generated on the front surface or the back surface of the wafer when rotating, and is discharged out of the cup by the exhaust means. In order to reduce the exhaust amount of the exhaust means, the inner cup is formed with a protrusion for limiting the exhaust amount on the back side of the wafer to be small.

  In a liquid processing apparatus used for a development process or the like, when processing a wafer by stopping or rotating the wafer at a low rotation to form a liquid film of the processing liquid on the substrate, the processing liquid on the surface of the wafer W is transferred to the edge of the substrate. In some cases, the back surface of the substrate may wrap around. For this reason, in a liquid processing apparatus such as a developing apparatus, there is a case where a function of preventing the protrusion from entering the back surface of the wafer is added to the protruding portion.

Japanese Patent Laid-Open No. 11-8192

  The conventional inner cup is fixed to, for example, a chuck base provided below the chuck, and is removed once again after periodic cleaning to remove adhered droplets and adhered substances on the inclined portion or the like. Although it is necessary to attach it, since the inner cup is large, attaching the inner cup accurately and horizontally requires skill and takes a lot of work time.

  In addition, since the optimum conditions for the shape of each part of the inner cup, that is, the shape of the protruding part and the angle and dimension of the inclined part differ depending on the processing process, an inner cup structure that can freely set these shapes is desired. It was.

  The present invention has been made under such circumstances, and an object thereof is to provide an inner cup structure that is easy to remove and attach and has a high degree of freedom in setting the shape and the like.

  In order to solve the above problems, a liquid processing apparatus of the present invention surrounds a substrate holding unit that horizontally holds a substrate and rotates the substrate around a vertical axis, a processing liquid supply unit that supplies the processing liquid to the substrate, and the periphery of the substrate. An outer cup, a first inner cup constituent member provided on the back side of the substrate and having a protruding portion whose front end protrudes upward; and an outer peripheral side of the first inner cup constituent member; A second inner cup component member formed separately from the cup component member and having an inclined surface inclined downward from the lower peripheral edge portion of the substrate to the outside thereof (Claim 1) is provided.

Moreover, you may comprise the liquid processing apparatus of Claim 1 as follows.
A base is further provided below the substrate holding portion, and the first inner cup constituent member and the second inner cup constituent member are detachably attached to the base, respectively.
The first inner cup constituent member and the second inner cup constituent member are arranged to be separated from each other in the radial direction of the substrate, and the first inner cup constituent member, the outer peripheral surface, and the second inner cup constituent member A drainage path for the treatment liquid is formed with the inner peripheral surface of the liquid crystal (claim 3).
The protrusion has an inclined surface that is inclined downward in the outer circumferential direction.
A drainage port is formed below the drainage path (Claim 5).
-A hollow part is formed in the said 1st inner cup structural member (Claim 6).
A back surface cleaning liquid supply unit for supplying a processing liquid to the back surface of the substrate is attached to the first inner cup constituent member (Claim 7).
A first height adjusting mechanism for adjusting the height of the first inner cup component is provided (claim 8).
A second height adjusting mechanism for adjusting the height of the second inner cup component is provided (claim 9).

  According to the liquid processing apparatus of the present invention, the inner cup structure includes the first inner cup constituent member having the protruding portion and the second inner cup constituent member formed separately from the first inner cup constituent member. Since it comprised with the inner cup structural member, when exchanging any one or both of a 1st inner cup structural member and a 2nd inner cup structural member, a highly accurate attachment becomes easy in a short time. Further, by separating the inner cup structure into the first inner cup constituent member and the second inner cup constituent member, it becomes possible to increase the degree of freedom of the shape of the inner cup structure. .

  Further, in the liquid processing apparatus of the present invention, the first inner cup is formed by replacing the first inner cup component and the second inner cup component, and using the gap as a drainage path. The processing liquid collected by the protrusions of the constituent members can be reliably drained (Claim 3).

  Furthermore, since the protruding portion has an inclined surface that is inclined downward in the outer peripheral direction, the processing liquid collected by the protruding portion can be quickly flowed downward and the rebound of the processing liquid to the periphery can be reduced (claims). 4).

  Furthermore, by forming a drainage port below the drainage path formed by the first inner cup component member and the second inner cup component member, the processing liquid collected by the protruding portion is quickly discharged. (Claim 5).

  And a hollow part is formed in the 1st inner cup structural member, and the component of liquid processing apparatuses, such as piping, can be stored in this hollow part, and space can be reduced (Claim 6).

  In addition, since the back surface cleaning liquid supply unit is provided in the first inner cup constituent member, it is possible to reduce the space, and also when the second inner cup constituent member is removed for maintenance or the like, the back surface cleaning liquid supply unit is removed. Or readjustment is not required (Claim 7)

  Since the height of the first inner cup constituent member and the second inner cup constituent member can be adjusted independently of each other, it is possible to easily cope with various processing conditions (claim 8.9).

It is a top view of the liquid processing apparatus concerning 1st Embodiment of this invention. It is sectional drawing of the liquid processing apparatus concerning 1st Embodiment of this invention. It is an enlarged view for demonstrating the detail of the liquid processing apparatus concerning 1st Embodiment of this invention. It is sectional drawing of the liquid processing apparatus concerning 2nd Embodiment of this invention. It is a figure for demonstrating operation | movement of the cup washing | cleaning mechanism of the liquid processing apparatus concerning 2nd Embodiment of this invention. It is an enlarged view for demonstrating the detail of the liquid processing apparatus concerning 2nd Embodiment of this invention.

<First Embodiment>
A first embodiment in which a liquid processing apparatus according to the present invention is applied to a development processing apparatus will be described with reference to FIGS. As shown in FIGS. 1 to 3, the development processing apparatus 1 includes a spin chuck 2 as a substrate holding unit that holds the wafer W horizontally by vacuum suction. The spin chuck 2 can be rotated around the vertical axis by a rotation drive unit 3 connected from below. A processing cup 4 is provided so as to surround the spin chuck 2, and the processing cup 4 includes an outer cup 5 and an inner cup 6. Further, a developing solution supply nozzle 7 a and a rinsing solution supply nozzle 7 b as processing solution supply units for supplying a developing solution and a rinsing solution as processing solutions to the wafer W are provided above the wafer W.

  The inner cup 6 is provided below the wafer W held by the spin chuck 2, and the first inner cup component 30 and the second inner cup configuration provided on the outer periphery of the first inner cup component 30. It is comprised with the member 40.

  The first inner cup constituting member 30 is formed in an annular shape provided on the upper portion of the annular base body 35 so as to protrude upward toward the back surface of the wafer W at a position facing the back surface side peripheral portion of the wafer W. A protrusion 31 is provided. In the present embodiment, the protruding portion 31 reduces the exhaust amount on the back side of the wafer W by restricting the air flow generated on the back side of the wafer W from flowing out of the wafer W when the wafer W rotates. The developing solution and the rinsing liquid as the processing liquid supplied from the processing liquid nozzle 7 (developing liquid supply nozzle 7a, rinsing liquid supply nozzle 7b) to the front surface of the wafer W wrap around the back surface of the wafer W. It has both functions of preventing entry into the central region on the back surface of the wafer W, for example, the region near the spin chuck 2.

  The first inner cup constituting member 30 can be attached to and detached from the chuck base 11 as a base by an engagement mechanism such as a screw so that the first inner cup constituting member 30 is located 20 to 50 mm inside from the end of the wafer W in the center direction. The tip of the protruding portion 31 of the first inner cup constituting member 30 is configured to be 0 to 30 mm from the end of the wafer W in the horizontal direction and 1 mm or less in the vertical direction. By bringing the protrusion 31 close to the back surface of the wafer W, the flow path of the air flow on the back surface side of the wafer W is narrowed to reduce the discharge amount of the air flow generated by the rotation to the processing cup 4 and the wafer W. The liquid film of the treatment liquid that has flowed from the front surface side to the back surface can be dammed up.

  The second inner cup constituting member 40 is detachably attached to the chuck base 11 by an engagement mechanism such as a screw so as to be positioned on the outer peripheral portion of the first inner cup constituting member 30, and the rear surface side peripheral portion of the wafer W And an annular inclined wall 41 that is inclined outward and downward from a position that is closely opposed to each other, and an annular vertical wall 42 that is continuous with the lower edge of the inclined wall 41 and extends downward, and is spilled from the wafer W. The processing liquid is guided to the liquid receiving part 51. The first and second inner cup constituting members 30 and 40 are attached to the chuck base 11 via a height adjusting mechanism (not shown). The first and second inner cup constituting members 30 and 40 are The mounting height in the vertical direction can be independently adjusted with respect to the chuck base 11 (wafer W).

  The first inner cup constituting member 30 includes a base body 35 having an annular and vertical inner peripheral wall 32 and an outer peripheral wall 33 that respectively form an inner peripheral surface and an outer peripheral surface thereof, and an upper portion of the base body 35. A hollow portion 36 is formed between the inner peripheral wall 32 and the outer peripheral wall 33 of the base body 35.

  In addition, an inner inclined wall 31b that descends inward from the top 31a of the protrusion 31 and an outer inclined wall 31c that inclines toward the outer direction are provided, and the inner periphery of the base body 35 extends from the lower end of the inner inclined wall 31b. It is formed so as to be continuous with the inner peripheral wall 32 that forms a surface, and with the outer peripheral wall 33 that forms the outer peripheral surface of the outer inclined wall 31 c and the base body 35.

  On the other hand, the inner peripheral side of the second inner cup constituent member 40 has a vertical wall (inner peripheral wall) 43 that descends vertically downward from the upper end of the inclined wall 41, and the outer peripheral wall 33 of the first inner cup constituent member 30 and The vertical wall 43 of the second inner cup component 40 is configured to have a predetermined gap (for example, several millimeters). As a result, the annular space (circular groove shape) defined by the outer inclined wall 31c, the outer peripheral wall 33 of the first inner cup constituting member 30 and the inner peripheral wall 43 of the second inner cup constituting member 40 is not filled with the treatment liquid. It functions as a discharge path 60. In addition, since the outer peripheral side of the protrusion 31 of the first inner cup component 30 is inclined like the outer inclined wall 31c, the processing liquid that has entered the back surface of the wafer W is blocked by the protrusion 31. After that, it is easy to flow to the lower discharge path 60 along the outer inclined wall 31c, and to the member on the outer peripheral side of the first inner cup constituting member 30, such as the second inner cup constituting member 40, etc. The rebound of the processing liquid is reduced. Further, since the inner peripheral side of the protruding portion 31 is also inclined like the inner inclined wall 31b, a part of the processing liquid that has entered the back surface of the wafer W has overcome the protruding portion 31. Even when it enters the inside, it flows downward along the inner inclined wall 31b, so that the processing liquid does not adhere to the region inside the protrusion 31 of the wafer W, the spin chuck 2, and the like.

  Further, a discharge port 61 is formed in the annular space defined by the first inner cup constituting member 30 and the second inner cup constituting member 40, that is, below the discharge path 60. The processing liquid that wraps around to the side and is blocked by the protrusion 31 of the first inner cup component 30 is discharged from the discharge port 61 to the discharge pipe 62 via the discharge path 60. There may be a plurality of discharge ports 61 instead of one, and the discharge ports 61 may be arranged concentrically below the discharge path 60. Furthermore, you may make it provide the groove | channel which is not illustrated which connects the one drain outlet 61 or the several drain outlet 61 to a concentric circle. Further, the groove and the groove communicating with the discharge port 61 may be provided on the surface of the chuck base 11 inside the protruding portion 31.

  Further, the chuck base 11 has a back surface cleaning liquid supply nozzle 80 as a back surface cleaning liquid supply mechanism for supplying a cleaning liquid to the back surface of the wafer W, and supplies a rinsing liquid or the like to the back surface of the wafer W. The back surface cleaning liquid supply nozzle 80 supplies a back surface cleaning liquid (back rinse) liquid to the inner peripheral position from the first inner cup constituting member 30. When supplying the back rinse, the wafer W rotates. Since the number is increased, the liquid film on the back surface of the wafer W supplied by the back surface cleaning liquid supply nozzle 80 is sufficiently thin, and between the protruding portion 31 of the first inner cup constituting member 30 and the back surface of the wafer W. Can pass through. In other words, the gap between the protruding portion 31 of the first inner cup constituting member 30 and the back surface of the wafer W is a liquid of the processing liquid that comes around from the surface of the wafer W when the rotation is stopped at 0 to 200 rpm or when the rotation is low. The back rinse liquid film is formed so as to be smaller than the film thickness, for example, larger than the thickness of the back rinse liquid film formed on the back surface of the wafer W when the back rinse liquid is supplied while rotating at a high rotation speed of 1000 rpm or more.

  The back surface cleaning liquid supply nozzle 80 is connected to a back surface cleaning liquid supply source 82 by a pipe 81, and the pipe 81 has one or a plurality of openings 34 provided in the inner peripheral wall 32 of the first inner cup component 30. Through the hollow portion 36 formed inside the first inner cup constituting member 30 and connected to the lower portion of the hollow portion 36 or the back surface cleaning liquid supply source 82. Therefore, the pipes on the chuck base 11 can be arranged in an orderly manner. In addition, the inner cup 6 is separated into the first inner cup constituting member 30 and the second inner cup constituting member 40 and configured separately, and the replacement frequency is lower than that of the second inner cup constituting member 40. Even when the second inner cup constituent member 40 is replaced by periodic maintenance or the like by providing a mechanism such as a pipe 81 of back rinse liquid in the hollow portion 36 formed in the lower first inner cup constituent member 30. The first inner cup constituting member 30 is fixed, and there is no need to move the member accommodated in the hollow portion 36.

  Next, the control unit 100 provided in the development processing apparatus 1 will be described. The control unit 100 includes, for example, a computer, and includes a program for performing development processing in addition to a data processing unit including a memory and a CPU. In this program, the loaded wafer W is held by the spin chuck 2, and after developing processing, cleaning processing and drying processing are performed, and then the wafer W is unloaded from the developing processing apparatus 1. Step groups are set up to control the transport schedule and the operation of each series of parts. These programs (including programs related to processing parameter input operations and display) are stored in a storage medium such as a hard disk, a compact disk, a magnetic optical disk, or a memory card and installed in the control unit 100.

  Next, a series of development steps performed in the development processing apparatus 1 as a liquid processing apparatus will be described. A resist film is formed, and the exposed wafer W is transported onto the spin chuck 2 by transport means and lifting pins (not shown), and is attracted and held horizontally by the spin chuck 2.

  Subsequently, the developing nozzle 7a moves from the standby area onto the wafer W, and moves along the radial direction of the wafer W while discharging the developer. When the developer is deposited on the entire surface of the wafer W, the developing nozzle 7a returns to the standby area, and the cleaning nozzle 7b moves from the standby area to the center of the wafer W. At this time, the processing liquid supplied to the front surface of the wafer W is accumulated on the front side of the wafer W, and a part of the processing liquid flows around the back surface of the wafer W. Is contacted with the protruding portion 31 and discharged from the discharge port 61 via the discharge path 60 formed between the first inner cup component member 30 and the second inner cup component member 40. .

  Subsequently, the spin chuck 2 rotates at, for example, 500 rpm, and pure water as a processing liquid is discharged from the cleaning nozzle 7 b toward the center of the wafer W. The discharged pure water flows so as to spread from the center of the wafer W toward the peripheral edge due to centrifugal force, and reaches the surface of the wafer W to wash away the developer. At this time, an air flow is generated on the back surface of the wafer W from the central portion to the outside, and a part of the air flows through the gap between the protruding portion 31 and the back surface of the wafer W. It is recirculated inward by the protrusion 31 of the cup component 30, and as a result, the discharge of airflow generated on the back surface of the wafer W is reduced. Thereafter, the supply of the rinse is stopped, the wafer W is rotated at a high speed, for example, 2000 rpm, the cleaning liquid remaining on the wafer W is spun off, the wafer W is dried, and the cleaning nozzle 7b returns to the standby area, and the processing is performed. finish.

  According to the development processing apparatus 1, the inner cup 6 includes the first inner cup constituting member 30 having the protruding portion 31 provided so that the tip thereof is close to the back surface of the wafer W, and the first inner cup 6. By separating and forming the second inner cup constituting member 40 having the inclined wall 41 for guiding the processing liquid which is arranged on the outer peripheral side of the cup constituting member 30 and spills from the wafer W downward, from the wafer W. The treatment liquid that has been shaken off is appropriately flowed downward to reliably prevent the treatment liquid or the mist of the treatment liquid from entering the inside of the projecting portion 31, and in the case of periodic maintenance or malfunction, the first is necessary. Only the inner cup constituent member 30 or the second inner cup constituent member 40 can be exchanged, and maintenance and replacement work can be easily performed. Further, by forming the first inner cup constituent member 30 and the second inner cup constituent member 40 separately, the shape of the first inner cup constituent member 30 and the second inner cup constituent member 40 The shapes and dimensions of the inclined wall 41 and the vertical wall 42 can be used in appropriate combinations according to processing conditions.

<Second Embodiment>
Next, a second embodiment in which the liquid processing apparatus according to the present invention is applied to a coating apparatus for applying a resist solution to the wafer W will be described with reference to FIGS. Similar to the first embodiment, the coating apparatus 101 includes a spin chuck 102 as a holding mechanism that holds the wafer W horizontally by vacuum suction. The spin chuck 102 can be moved up and down by a rotation driving unit 103 connected from below, and can rotate around a vertical axis. A processing cup 104 surrounding the spin chuck 102 and a coating nozzle 107 as a processing liquid supply nozzle for coating the wafer W with a coating liquid are provided, which are the same as in the first embodiment, and will be described. Omitted.

  In the second embodiment, the outer cup 105 and the inner cup 106 constituting the processing cup 104 are constituted by the first inner cup constituting member 130 and the second inner cup constituting member 140 as in the first embodiment. Has been. As in the first embodiment, the second inner cup constituting member 140 is a process in which a resist solution or a thinner as a processing solution supplied from the coating nozzle 107 is spilled from an end portion of the wafer W as the wafer W rotates. The liquid is guided to the liquid receiving part 151.

  The first inner cup constituting member 130 is provided with a base body 135 and a projecting portion 131 on the base body. The base body 135 connects the annular outer peripheral wall 131b that forms the outer peripheral surface of the protrusion 131, the annular inner peripheral wall 131c that forms the inner peripheral surface, the upper end of the outer peripheral wall 131b, and the upper end of the inner peripheral wall 131c. The upper wall 131a is provided, and the protruding portion 131 is provided on the outermost peripheral side of the base body 135. The protruding part 131 is not formed on the inner peripheral side upper part of the base body 135, and the inner peripheral side upper part of the first inner cup constituting member 130 is notched. The space in the upper part on the inner side of the base body 135 generated by the cutout functions as a part of the storage space when the cup cleaning member 190 (described later) stands by.

  The chuck base 102 has a back rinse supply mechanism 180 as a back surface cleaning liquid supply unit that supplies a cleaning liquid to the back surface of the wafer W, and supplies a cleaning liquid such as a solvent to the back surface of the wafer W to clean the back surface of the wafer W. It is supposed to be. The cup cleaning member 190 is for cleaning the processing cup 104 when the wafer W is not processed. When the cup cleaning member 190 is on standby (when not in use), the spin chuck 102 It is comprised so that it may stand by in the space inside the 1st inner cup structural member 130 below. For this reason, the cup cleaning member 190 has a hole through which the spin chuck 102 can pass at the center thereof, and also has a lifting mechanism (not shown) that can lift and lower the cup cleaning member 190 in the vertical direction.

  When cleaning the cleaning cup 104, as shown in FIG. 5, the cup cleaning member 190 rises to a processing position above the spin chuck 102, and in this state, the back rinse liquid supply nozzle 180 backs the chuck cleaning member 190. A cleaning liquid is supplied toward the periphery. The cleaning liquid supplied to the back surface of the cup cleaning member 190 is reflected and supplied to the outer cup 105 and the inner cup 106. As a result, the outer cup 105 and the inner cup 106 can be cleaned. An annular opening (not shown) or a plurality of concentrically arranged openings are formed on the inner peripheral side of the peripheral edge of the back surface of the cup cleaning member 190. The cup cleaning member 190 is formed during the process shown in FIG. Is positioned at the standby position, the processing liquid supplied from the back rinse liquid supply nozzle 180 reaches the back surface of the wafer W.

  Details of the first inner cup constituting member 130 of the coating apparatus 101 according to the second embodiment will be described with reference to FIG. As shown in FIG. 6, the first inner cup constituting member 130 is provided with a bevel cleaning liquid supply nozzle 170 as a back surface cleaning liquid supply unit that supplies a cleaning liquid to the bevel portion on the back surface of the wafer W. One or a plurality of cylindrical hollow portions are formed in the first inner cup constituting member 130 in a direction perpendicular to the base body 135 from above the protrusion 131, and a bevel cleaning nozzle 170 as a bevel cleaning liquid supply mechanism is formed in the hollow portion. Is arranged. The bevel cleaning nozzle 170 has a discharge port at the top end thereof and is connected to a cleaning liquid supply source 172 and a cleaning liquid supply pipe 171. In this embodiment, the bevel cleaning supply nozzle 171 is housed in the hollow portion (gap) in the first inner cup component 130, but is placed on the first inner cup component 130 or the like. It doesn't matter.

  Next, the operation of the coating apparatus 101 to which the liquid processing apparatus according to the second embodiment is applied will be described.

  First, in a state where the wafer W is held horizontally by the spin chuck 102, a resist is dropped from the coating nozzle 107, and the resist is applied to the surface of the rotating wafer W by using the spin chuck 102, and then the resist is rotated. The resist applied on the wafer W is expanded in the outer peripheral direction of the wafer W by increasing the number. At this time, the resist is shaken off from the wafer W and the excess resist is guided from the wafer W to the liquid receiving portion 151 by the inclined wall 141 and the vertical wall 142 of the second inner cup constituting member 140.

  Thereafter, before the resist applied to the wafer W is dried, the cleaning liquid is supplied from the bevel cleaning nozzle 171 from the lower end surface, the side end surface, and the peripheral end portion of the wafer W inward, for example, 2 to 5 mm. The resist adhering to the substrate is removed (bevel cleaning step). After the resist on the bevel portion of the wafer W is removed, the supply of the cleaning liquid from the bevel cleaning nozzle 170 is stopped, and the spin chuck 102 is rotated at the same rotation speed (for example, 2000 rpm) as in the bevelling process to perform primary drying. After performing the primary drying for a predetermined time, the spin chuck 102 is rotated at a low speed (for example, 1000 rpm), the cleaning liquid is supplied from the back surface cleaning nozzle 180 to the back surface of the wafer W, and the resist adhering to the back surface is removed (back surface cleaning). Process). After performing the back rinse for removing the resist adhering to the back surface for a predetermined time, the supply of the cleaning liquid from the back surface cleaning nozzle 180 is stopped, and then the spin chuck 102 is rotated at a high speed (for example, 2000 rpm) and attached on the wafer W. The cleaning liquid to be shaken off is dried and dried (secondary drying step), and the resist coating is completed.

  During each of the above processes, the wafer W rotates at a desired number of rotations during each process, so that an air flow is generated on the back side of the wafer W, and a part of the air flow is generated by the first inner cup constituting member 130. Although the air is exhausted between the protrusion 131 and the back surface of the wafer W, the remaining airflow is returned to the inside by the protrusion 131 of the first inner cup constituting member 130, and as a result, the airflow from the back surface of the wafer W is Reduced.

  Although the present invention has been described above with reference to some embodiments, the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the matters included in the appended claims. It is.

  For example, in each of the above-described embodiments, the case where the shape of the first inner cup constituent member is different has been described, but it is also effective when the shape of the second inner cup constituent member is different. For example, when the radial exhaust is made uniform by changing the length of the inclined wall, the vertical wall of the second inner cup constituent member or the distance from the outer cup according to the distance from the exhaust port, the rotation of the treatment process is performed. It is necessary to prepare and change the cup body under various conditions such as the number. In such a case, the second inner cup constituent member of various shapes is prepared in advance, and the second inner cup is prepared according to the processing conditions. By exchanging only the cup components, the replacement work can be performed accurately in a short time. Moreover, you may make it change the material and surface treatment state of a 1st inner cup structural member and a 2nd inner cup structural member, and you may make it use according to a process chemical | medical solution and process conditions.

  In the above-described embodiment, the development processing apparatus and the resist coating apparatus have been described as examples. However, the present invention is not limited to these. An etching apparatus that supplies an etchant to the substrate, and a cleaning apparatus that supplies the cleaning liquid to the substrate and cleans the substrate. In addition, the present invention can be applied to a liquid processing apparatus that supplies a processing liquid to a substrate while rotating the substrate, such as a device that applies an adhesive to the substrate. In this embodiment, the case where a semiconductor wafer is used has been described. However, the present invention can be applied to substrates having various shapes such as a rectangular mask substrate and an FPD substrate.

DESCRIPTION OF SYMBOLS 1,101: Liquid processing apparatus 2,102: Spin tick 3,103: Rotation drive part 4,104: Processing cup 5,105: Outer cup 6,106: Inner cup 7: Processing liquid supply nozzle 11: Chuck base 30 130: first inner cup constituting member 31, 131: protrusion 35, 135: base body 40, 140: second inner cup constituting member 41, 141: inclined wall 42, 142: vertical wall 80, 180: back surface cleaning Supply nozzle 100: computer (control unit)
180: Back surface cleaning nozzle 181: Bevel cleaning nozzle 190: Cup cleaning member W: Wafer W (substrate)

Claims (9)

A substrate holding unit for horizontally holding the substrate and rotating it around the vertical axis;
A processing liquid supply unit for supplying a processing liquid to the substrate;
An outer cup that surrounds the periphery of the substrate; a first inner cup component member that is provided on the back surface side of the substrate and has a protruding portion that is provided so that the tip protrudes from the back surface of the substrate;
A second inner cup configuration having an inclined surface which is formed separately from the first inner cup component on the outer peripheral side of the first inner cup component and which is inclined downward from the lower peripheral edge of the substrate to the outside. A liquid processing device that has components.   The liquid processing apparatus according to claim 1, further comprising a base below the substrate holding portion, wherein the first inner cup constituent member and the second inner cup constituent member are detachably attached to the base. .   The first inner cup constituent member and the second inner cup constituent member are spaced apart from each other in the radial direction of the substrate, and the first inner cup constituent member, the outer peripheral surface, and the second inner cup constituent member The liquid processing apparatus according to claim 1, wherein a drainage path for the processing liquid is formed with the inner peripheral surface.   4. The liquid processing apparatus according to claim 1, wherein the protrusion has an inclined surface that is inclined downward in an outer peripheral direction. 5.   The liquid processing apparatus according to claim 3, wherein a liquid discharge port is provided below the liquid discharge path.   The liquid processing apparatus according to claim 1, wherein a hollow portion is formed inside the first inner cup constituent member.   The liquid processing apparatus according to claim 1, wherein a back surface cleaning liquid supply unit that supplies a processing liquid to the back surface of the substrate is attached to the first inner cup constituent member.   The liquid processing apparatus according to claim 2, further comprising a first height adjusting mechanism that adjusts a height of the first inner cup component.   The liquid processing apparatus according to claim 2, further comprising a second height adjustment mechanism that adjusts a height of the second inner cup component.

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