JP2015073993A - Soldering method of aluminium material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technique capable of advantageously improving quality of a joint part by the use of ultrasonic soldering of aluminum material.SOLUTION: When performing joint between aluminum materials or joint between aluminum material and metal material other than aluminum material by using soldering, the soldering is performed by actuating ultrasonic waves to a joint portion of the aluminum material or a neighborhood portion of the joint portion in such a state as to preliminarily heat the joint portion of the aluminum material at a temperature of 0.5 to 2.0 times of a melting point of solder to be used.

Description

  The present invention relates to a soldering method for an aluminum material, and more particularly to a method for advantageously realizing joining of aluminum materials or joining of an aluminum material and other metal materials by ultrasonic soldering. Here, the aluminum material is a material made of aluminum or an aluminum alloy, and as a metal material other than the aluminum material, for example, steel, stainless steel, copper, brass, nickel, which can be conventionally soldered, is used. And materials such as molybdenum.

  Conventionally, when trying to solder an aluminum material, there has been a problem that the solder is not wetted by a strong oxide film on the surface. As an improvement measure, a method of performing soldering while applying ultrasonic waves is known. In this method, cavitation caused by ultrasonic vibration is caused by the surface of the aluminum material immersed in the molten solder. By destroying the oxide film, revealing an active metal surface, and by rapidly alloying such a metal surface and solder, an effective solder layer is formed on the surface of the aluminum material, It is believed that a strong bond is formed.

  For example, as a prior art related to ultrasonic soldering between aluminum castings, there is JP-A-11-324789. In this prior art, after preheating a cylinder block body and a sealing member made of aluminum casting, It has been shown that soldering is employed, and in that example, preheating is performed at 250 ° C. for 30 minutes. However, in this prior art, it is also recommended to omit preheating in order to prevent a decrease in material strength due to preheating, and the effect of the preheating is not always clear, and it is not stable in the quality of soldering sealability. There was no.

JP-A-11-324789

  Here, the present invention has been made against the background of such circumstances, the place to be solved is to reconfirm the importance of preheating and clarify the conditions, aluminum material It is an object of the present invention to provide a technique that can advantageously improve the quality of a joint by ultrasonic soldering.

  And, in order to solve the above-mentioned problems, the present invention can be suitably implemented in various aspects as listed below, and each aspect described below can be implemented in any combination. It can be adopted. It should be noted that the aspects and technical features of the present invention are not limited to those described below, and can be recognized based on the description of the entire specification and the inventive concept disclosed in the drawings. Should be understood.

(1) A method in which joining of aluminum materials or joining of an aluminum material and other metal materials is performed by soldering, and the joining portion of the aluminum material is previously set to a melting point of 0.degree. A method of soldering an aluminum material, characterized in that, in a state heated to a temperature of 5 to 2.0 times, soldering is performed by applying an ultrasonic wave to a bonding portion or a vicinity thereof.

(2) The soldering of the two materials is performed after the solder is attached to the joining surface at the joining portion of the aluminum material under the conditions of the preheating temperature and the ultrasonic action described above. The soldering method of the aluminum material as described in aspect (1).

(3) After the joining of the two materials, the joining portion is heated to a temperature of 1.0 to 2.0 times the melting point of the solder to re-melt the solder. The soldering method of the aluminum material as described in 1) or aspect (2).

(4) The soldering of the aluminum material according to any one of the aspects (1) to (3), wherein the ultrasonic wave is applied at a frequency within a range of 10 to 500 kHz. Method.

(5) Any one of the aspects (1) to (4), wherein the joining surface of the aluminum material is previously treated by any one of acid cleaning, alkali cleaning, and cutting. The soldering method of the aluminum material as described in one.

(6) The above aspects (1) to (1), wherein the joining surface of the aluminum material is previously provided with fine irregularities by any one of chemical treatment, mechanical treatment, and anodizing treatment. The method for soldering an aluminum material according to any one of the above aspects (4).

  According to such a configuration in accordance with the present invention, the cavitation caused in the molten solder by the ultrasonic wave applied to the joining surface at the joining portion of the aluminum material preheated at the optimum temperature is oxidized on the joining surface. It effectively destroys the film, revealing an active new metal surface, and as a result, alloying with the solder is advantageously promoted. As a result, the quality of the sealability after soldering can be advantageously stabilized, and further, since the temperature is relatively low, the softening of the material is prevented, and the joint is less strained. A joining portion is obtained, and further, joining that does not require flux and shielding gas is made possible.

It is a perspective view showing an example of a product to be ultrasonically soldered according to the present invention. FIG. 2 is an enlarged partial cross-sectional explanatory view showing an ultrasonic soldering portion of the product shown in FIG. 1. It is a section expanded partial explanatory view showing one form which ultrasonically solders two materials.

  Hereinafter, in order to clarify the configuration of the present invention more specifically, embodiments of the present invention will be described in detail with reference to the drawings.

  First, FIG. 1 shows an example of a container-like product to which the present invention is applied. In this case, the container-shaped product 10 is composed of a rectangular box-shaped container main body 12 and a plate-shaped lid body 14 of a predetermined thickness that is fitted into the opening and soldered, and the side wall is formed. An inflow pipe 16 and an outflow pipe 18 for circulating a fluid such as cooling water are provided so as to penetrate. Further, as shown in FIG. 2, the lid body 14 is dropped and fitted into a stepped portion 20 provided in the upper opening of the container body 12, where ultrasonic soldering is performed according to the present invention. It is to be given. Specifically, as shown in FIG. 3, a predetermined solder 22 is attached to the stepped portion 20 and the corner portion of the lid body, which are the joining surfaces of the joint portions of the container main body 12 and the lid body 14, and fitted. Thereafter, the fitting portions of the container main body 12 and the lid body 14 are joined by an ultrasonic soldering operation.

  In the present invention, the container body 12 and the lid body 14 to be ultrasonically soldered as described above are each made of an aluminum material made of aluminum or an aluminum alloy, and one of them is The other is made of an aluminum material, and the other is made of a metal material made of a material other than the aluminum material, such as steel, stainless steel, copper, brass, nickel, molybdenum, etc., and they are joined.

  Further, as the solder applied to the joint portion between the container body 12 and the lid body 14, various known solder materials (alloys) can be appropriately selected and used. For example, Sn— There is a Pb-based 63% Sn-37% Pb alloy (melting point: 183 ° C.), and as a lead-free solder, an Sn-Ag-based Sn-3.0% Ag-0.5% Cu alloy (melting point: 217) ° C), Sn-0.3% Ag-0.7% Cu alloy (melting point: 217 ° C), Sn-Cu-based Sn-0.7% Cu alloy (melting point: 227 ° C), Sn-Zn-based Sn-8% Zn-3% Bi alloy (melting point: 187-196 ° C.).

  In the present invention, when ultrasonic soldering is performed between the container body 12 and the lid body 14 using such solder, the joint portion of the container body 12 and the lid body 14 is previously set to the melting point of the solder used. In the state heated to a temperature of 0.5 to 2.0 times, soldering is performed by applying ultrasonic waves to such a joined portion or a portion in the vicinity thereof. The joining between 12 and the lid 14 is advantageously realized.

  In the preheating of the container body 12 and the lid 14 prior to such ultrasonic soldering, if the preheating temperature is less than 0.5 times the melting point of the solder used, the preheating effect is sufficiently obtained. It is difficult to cause stable sealing by soldering. Further, when the preheating temperature exceeds 2.0 times the melting point of the solder to be used, the temperature of the container body 12 and the lid body 14 becomes too high, the material is easily softened, and is less than 0.5 times. As in the case of the preheating temperature, there is a possibility that stable sealing by soldering cannot be obtained.

  Moreover, as a heating means for preheating at least the joining part of the container body 12 and the lid body 14, when heating them as a whole, a hot plate, an infrared heating furnace, a high-frequency heating furnace or the like is used. If the vicinity of the (joint part) is locally heated, it is possible to preheat to a predetermined temperature using laser heating.

  Further, such solder is supplied to the joint part by various known methods. For example, the lid 14 is fitted into the container body 12 and ultrasonic waves are supplied to the joint part while supplying the solder. In addition to the technique of performing ultrasonic soldering by applying the solder, the solder is applied in advance to the joining surface of the container body 12 and the lid body 14 to a predetermined thickness, and then the lid body 14 is fitted into the container body 12. A method of ultrasonic soldering them is also advantageously employed. In that case, a preheating operation and an ultrasonic wave application operation similar to those described above are applied to the joint surfaces of the container body 12 and the lid body 14, and in this state, a predetermined solder is attached, and then the container body 12 And the lid body 14 are assembled and ultrasonic soldering is performed, whereby the sealing performance between the container body 12 and the lid body 14 by soldering can be further improved. It becomes.

  In addition, the application (action) of the ultrasonic wave to the joint part of the container body 12 and the lid body 14 can be performed using a known ultrasonic oscillator, and a commercially available ultrasonic soldering apparatus (for example, Kuroda Techno Co., Ltd.). It can also be carried out using a company-made sun bonder.

  In applying such ultrasonic waves, generally, a frequency of 10 to 500 kHz, preferably 25 to 400 kHz is employed. If the frequency is lower than 10 kHz, cavitation in molten solder due to application of ultrasonic waves is less likely to be caused, and therefore, it is difficult to effectively enjoy the effect of applying ultrasonic waves, and the frequency exceeds 500 kHz. When the frequency is reached, the effect of application of ultrasonic waves becomes saturated, and the ultrasonic generator becomes large and economically undesirable.

  Further, in accordance with the present invention, the joint surface between the container body 12 and the lid 14 to be ultrasonically soldered may be cut by a known pickling treatment, alkali washing treatment, or mechanical cutting in order to reduce the thickness of the oxide film. It is desirable that processing such as processing is performed, and furthermore, as a means for securing the bonding strength by soldering due to the anchor effect, these bonding surfaces are previously subjected to chemical processing such as etching or machine such as shot peening. It is also effective to form fine irregularities on the surface by mechanical treatment or anodizing treatment.

  And, in this way, in the joined product (joint) obtained by ultrasonic soldering at least the joining part of the container main body 12 and the lid body 14 in a state of being heated to a predetermined preheating temperature. After that, it is desirable to remelt the solder existing in the joint by heating the joint (joint) to a temperature 1.0 to 2.0 times the melting point of the solder used. As a result, the sealing performance of the joint (joint portion) can be further improved.

  The exemplary embodiments of the present invention have been described in detail above. However, the embodiments are merely examples, and the present invention is limited in any way by specific descriptions according to such embodiments. It should be understood that it is not interpreted. The present invention can be implemented in a mode with various changes, modifications, improvements, and the like based on the knowledge of those skilled in the art, and such a mode of implementation does not depart from the spirit of the present invention. It should be understood that both belong to the category of the present invention.

  Hereinafter, representative examples of the present invention will be shown to clarify the present invention more specifically, but the present invention is not limited by the description of such examples. That should also be understood.

Example 1
The container body (12) shown in FIG. 1 is prepared using a JIS A1050 aluminum material in a thickness of 2 mm and an external size of 75 mm (length) × 75 mm (width) × 12 mm (height), and a lid. The body 14 was prepared by using the same material and the same thickness so that there was a 1 mm gap in the step (20) of the container body (12). Also, a solder wire made of Sn—Zn Sn-8% Zn-3% Bi alloy (melting point: 190 ° C.) was prepared as solder.

  And in the form which inserted the cover body (14) with respect to the step part (20) of the opening part of the prepared container main body (12), 300 degreeC (melting | fusing point of solder alloy) is used using a hot plate. After heating to a temperature of 1.58 times the temperature, a 400 kHz ultrasonic wave was applied to the gap in the fitting portion of the lid (14) using an iron trowel whose tip was heated to 400 ° C. While applying the solder wire, a spatula-shaped iron having a thickness of 0.7 mm is inserted to melt the solder wire and fill the gap while fitting the lid (14) into the container body (12). By joining and sealing the gap of the part, a rectangular box-shaped joined product was obtained.

  Then, using the inflow pipe (16) and the outflow pipe (18) provided in the obtained joined product, the cooling water is circulated, and the interior space of the joined product is filled with the cooling water and is in a watertight state. In this case, when a water pressure of 1 MPa is applied, there is no leakage of cooling water from the joint portion (joint portion) between the container body (12) and the lid body (14), and a good sealing is achieved. Was confirmed.

-Example 2-
In the same manner as in Example 1, a container body (12) and a lid (14) as shown in FIG. 1 were prepared, and a Sn—Zn solder wire was further prepared. In addition, the size of the lid (14) was set to a size such that a fitting structure in which a gap of 0.5 mm was generated in the stepped portion (20) of the container body (12).

  Then, in a form in which the lid (14) is fitted into the stepped portion (20) of the container body (12), the lid (14) is preheated to 200 ° C., which is 1.05 times the solder melting point, with a hot plate. After that, using an iron trowel whose tip is heated to 400 ° C. while applying an ultrasonic wave of 50 kHz, the solder wire is made of iron while abutting the solder wire on the joint portion of the fitting portion of the lid (14). The container body (12) and the lid (14) were joined by applying with melting with a trowel. Further, after such joining, the container body (12) and the lid body (14) are further heated to raise their temperature to 250 ° C., which is 1.32 times the solder melting point, so that the solder can be obtained. Re-melting was performed to cause bridging at the fitting portion between the container main body (12) and the lid (14), thereby further strengthening the sealing.

  About the joint product obtained in this manner, in the same manner as in Example 1, when the inside was filled with cooling water and the water pressure was 1 MPa in a watertight state, leakage occurred from those joint portions (joint portions). It was confirmed that good sealing was achieved.

Example 3
A rolled plate (thickness: 5 mm) made of an aluminum alloy material of JIS A3003 was heated to a temperature of 180 ° C. (0.79 times the melting point of the solder used), and then heated to 450 ° C. on one surface thereof. Using a spatula-like iron iron, while applying an ultrasonic wave having a frequency of 200 kHz, a solder wire made of Sn—Cu-based Sn—0.7% Cu alloy (melting point: 227 ° C.) was melted and applied. A solder coating layer having a thickness of 0.5 mm was formed on the entire surface of the plate. Then, the plate coated with the solder is cold-rolled to a thickness of 0.8 mm, further cut into a 300 mm square, press-molded so that the solder coating layer is on the inner surface side, and a hat-shaped A dish was used.

  Next, using two of these dish-shaped bodies, the soldered surfaces (inner surface side) are brought into contact with each other, and a 1 kN load is applied to the flat portion of the flange portion in the hat shape, The outer periphery of these flat parts is heated with a fiber laser from one side so that the interface becomes 400 ° C., and the solder of the heated part is melted to perform joint sealing, and a container with a flange A shaped bonded product was obtained.

  The joint product thus obtained is provided with a pipe serving as a blowing port at the top of the hat-shaped part, and when 2 MPa of air pressure is applied, it deforms into a balloon shape and any air leakage occurs. Admitted that there is no.

DESCRIPTION OF SYMBOLS 10 Container-shaped product 12 Container main body 14 Cover body 16 Inflow pipe 18 Outflow pipe 20 Stepped part 22 Solder

Claims (6)

  A method of performing bonding between aluminum materials or bonding between an aluminum material and other metal materials by soldering, wherein the bonding portion of the aluminum material is preliminarily 0.5 times the melting point of the solder used. A soldering method for an aluminum material, wherein soldering is performed by applying an ultrasonic wave to a bonding portion or a vicinity thereof in a state heated to 2.0 times the temperature.   2. The soldering of the two materials is performed after the solder is attached to the joining surface at the joining portion of the aluminum material under the conditions of the preheating temperature and the ultrasonic action described above. The soldering method of the aluminum material as described.   The solder is re-dissolved after the joining of the two materials by heating the joining portion to a temperature 1.0 to 2.0 times the melting point of the solder. The soldering method of the aluminum material of 2.   The method of soldering an aluminum material according to any one of claims 1 to 3, wherein the ultrasonic wave is applied at a frequency within a range of 10 to 500 kHz.   The aluminum material according to any one of claims 1 to 4, wherein a joining surface of the aluminum material is previously treated by any one of acid cleaning, alkali cleaning, and cutting. Soldering method. 5. The method according to claim 1, wherein the joining surface of the aluminum material is previously provided with fine irregularities by any one of chemical treatment, mechanical treatment, and anodizing treatment. The soldering method of the aluminum material of Claim 1.

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