JP2015060927A - Substrate division method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate division method which can inhibit breakage of a dicing blade and a defect caused by cut deviation.SOLUTION: A substrate division method comprises the steps of: preparing a substrate 20 which has a substrate body and a resin layer covering the substrate body, and which is partitioned into a rectangular individual-piece region 28 including a plurality of individual-piece parts which are planned to be divided along boundary lines in a matrix shape, and a peripheral region 29 adjacent to the individual-piece region 28 when viewed from a direction perpendicular to a principal surface; and firstly dividing every three rows of the individual-piece parts adjacent to sides 28a-28d of the individual-piece region 28 other than the individual-piece part 28p-28s in a state where the substrate is fixed in an adherent manner by attachment of a dicing tape to a resin layer of the substrate 20, and subsequently dividing every three rows of the individual-piece parts 28p-28s adjacent to the sides 28a-28d of the individual-piece region 28 thereby to divide the substrate 20 into individual pieces 27.

Description

  The present invention relates to a method for dividing a substrate, and more particularly, to a method for dividing a substrate having a resin layer into a plurality of pieces.

  Conventionally, a dicing method is known as a method of dividing a plurality of pieces from a substrate (see, for example, Patent Documents 1 to 4).

JP 2012-43889 A JP 2002-75919 A JP-A-5-90406 JP-A-9-1542

  For example, when manufacturing an electronic component having a CSP (chip size package) structure, if a sealing resin is formed on a substrate on which the component is mounted, the sealing resin is not mounted as shown in the photograph of FIG. Since the resin flows in the direction of the peripheral region 29, the sealing resin may have an inclined shape. As shown in the photograph of the side surface of the substrate in FIG. 9, the inclination is prominently seen in the A portion near the outer periphery of the peripheral region 29 and the B portion of the individual piece portion 27k in the outermost row.

  In order to dice the substrate on which the inclined sealing resin is formed, when the dicing tape is attached and fixed to the sealing resin, as shown in the photograph showing the contact state of FIG. For this reason, a portion having a poor adhesion state between the dicing tape and the sealing resin occurs. In the photograph of FIG. 10, the black part is a part where the dicing tape is adhered and adhered. The peripheral area 29 and the individual piece portion 27k in the outermost row have a small area ratio where the dicing tape is adhered, and have poor adhesion strength.

  When cutting is performed in a state in which the peripheral region with poor adhesion is connected to the individual pieces of the outermost row, the object to be cut is rotated, and as shown in the photograph of the individual pieces in FIG. May be divided into trapezoidal shapes, resulting in cut misalignment that is cut into a shape different from the regular rectangular shape.

  As a countermeasure against this, there may be considered a method in which a peripheral region that is in poor contact with the dicing tape is first divided to eliminate the state in which the peripheral region is connected to the individual pieces of the outermost row.

  However, in this method, strip-like portions (for example, hatched portions 84 and 86 in FIG. 8 described later) in the peripheral region may be peeled off by cutting water or cutting resistance during dicing. If the flying portion hits the side surface of the dicing blade or is bitten between the dicing blade and the substrate, the load on the dicing blade may increase, and the dicing blade may be damaged or cut misalignment may occur.

  In view of such circumstances, the present invention intends to provide a method for dividing a substrate that can suppress the occurrence of breakage of a dicing blade and the occurrence of defective cutting deviation.

  In order to solve the above problems, the present invention provides a substrate dividing method configured as follows.

  The substrate dividing method includes (i) a substrate main body and a resin layer covering the main surface of the substrate main body, and is to be divided in a lattice shape along a boundary line when viewed from a direction perpendicular to the main surface. A first step of preparing a substrate partitioned into a rectangular piece region including a plurality of piece portions and a peripheral region adjacent to the piece region; and (ii) dicing the resin layer of the substrate. A second step of dividing the piece portion from the substrate in a state in which the substrate is adhered and fixed by applying a tape. The second step is (a) parallel to the pair of sides of the boundary lines other than the boundary lines of the two individual pieces adjacent to the pair of parallel sides of the piece region. The other pair of the boundary lines other than the boundary line of the individual piece portions in two rows adjacent to the boundary line and its extension line and another pair of parallel sides of the individual piece region. A first step of cutting the substrate along the boundary line parallel to the side and an extension line thereof; and (b) after the first step, a pair of sides parallel to each other in the piece region. Of the boundary lines of the two adjacent pieces, the boundary line parallel to the pair of sides and its extension line are adjacent to another pair of sides of the piece region that are parallel to each other. Of the boundary lines of the individual piece portions of the two rows, the other And a second step of cutting the substrate along a pair of sides parallel to the boundary line and its extension.

  According to the above method, in the second step, in the first step, the piece parts other than the three pieces of pieces adjacent to the sides of the piece region are divided, and then in the second step. Then, each of the three rows of individual pieces adjacent to the sides of the piece area is divided.

  According to the above method, in the first step of the second step, the individual pieces in the first row adjacent to the sides of the peripheral area and the individual areas that are easily peeled away from the sides of the individual areas to the inside of the substrate. Since they are cut in a state where they are connected to the individual parts of the second and third rows arranged side by side, they are not peeled off when the substrate is cut. In the second step of the second step, most of the peripheral region is cut in a state where the minimum unit when the peripheral region is cut and the three individual pieces arranged toward the inside of the substrate are connected. In addition, since the portion that may be peeled off when the substrate is cut is made small, even if it is peeled off, the adverse effect on the dicing blade or the like is small. Therefore, it is possible to suppress the breakage of the dicing blade and the occurrence of cut misalignment.

  Preferably, in the second step, along the boundary line parallel to the side and the extension line thereof among the boundary lines of the two rows of individual piece portions adjacent to the side of the piece region, The substrate is cut sequentially from the side to the inside of the substrate.

  In this case, by cutting first from the outer peripheral region side, a portion that may be peeled can be made smaller. As a result, it is possible to further suppress the occurrence of breakage of the dicing blade and defective cutting deviation.

  Preferably, in the first step, first, the one boundary line parallel to the pair of sides of the piece region passing through the center of the piece region and its extension line, and the piece region The substrate is cut in a cross shape along one boundary line parallel to the other pair of sides of the piece region passing through the center and an extension line thereof.

  In this case, in the first step, first, the substrate is cut into a cross shape to relieve the warping stress of the substrate, thereby strengthening the adhesion and fixing of the four divided portions of the substrate, and the cut portion is peeled off. The possibility can be reduced. As a result, it is possible to further suppress the occurrence of breakage of the dicing blade and defective cutting deviation.

  According to the substrate dividing method of the present invention, it is possible to reduce a portion that may be peeled off when dividing the substrate, and to prevent the dicing blade from being damaged and the occurrence of cut misalignment.

It is (a) principal part sectional drawing of a board | substrate, (b) It is a top view. (Example 1) It is explanatory drawing which shows the procedure which divides | segments a board | substrate. (Example 1) It is explanatory drawing which shows the procedure which divides | segments a board | substrate. (Example 1) It is explanatory drawing which shows a state when cut | disconnecting. (Explanation example 1, 2, Example 1) It is explanatory drawing of cut shift. (Explanation example 1) It is explanatory drawing which shows a board | substrate division | segmentation procedure. (Example 2) It is explanatory drawing which shows a board | substrate division | segmentation procedure. (Example 3) It is explanatory drawing which shows a board | substrate division | segmentation procedure. (Comparative Example 1) It is a photograph of the substrate side. (Explanation example 3) It is a photograph which shows a close_contact | adherence state. (Explanation example 3) It is a photograph of an individual piece. (Explanation example 3)

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

  <Example 1> A method of dividing the substrate 20 of Example 1 will be described with reference to FIGS.

  FIG. 1A is a cross-sectional view of the main part of the substrate 20. FIG. 1B is a plan view of the substrate 20. As shown in FIG. 1A, the substrate 20 includes a substrate body 22 having a component 24 mounted on a main surface 22 a and a resin layer 26 that covers the component 24 and the main surface 22 a of the substrate body 22. As shown in FIG. 1B, the substrate 20 is partitioned into a rectangular individual area 28 and a peripheral area 29 adjacent to the individual area 28. The piece region 28 includes a piece portion 27 surrounded by grid-like boundary lines 28x and 28y. When the board | substrate 20 is cut | disconnected along the boundary lines 28x and 28y, the piece part 27 will be divided | segmented. The piece portion 27 includes a component 24 mounted on the main surface 22a of the board body 22 of FIG.

  In a state where a dicing tape is applied to the resin layer 26 of the substrate 20 and is closely fixed, the piece portion 27 is divided from the substrate 20. For example, the resin layer 26 of the substrate 20 is closely fixed to a jig (not shown), and the jig with the resin layer 26 of the substrate 20 closely fixed is attached to the stage of the dicing apparatus, or the substrate 20 The substrate layer 20 is cut (diced) using the dicing apparatus in a state where the resin layer 26 is directly adhered and fixed to the stage of the dicing apparatus, and the individual pieces 27 are divided from the substrate 20.

  Next, a procedure for dividing the substrate 20 will be described with reference to FIGS. 2 and 3 are explanatory views showing a procedure for dividing the substrate, in which a broken line indicates a boundary line to be cut and an extension line thereof, and a thick solid line indicates a part that has already been cut.

  (Procedure 1) The board | substrate 20 is cut | disconnected in the shape of a cross as shown by the arrow in order of the numbers 1 and 2 shown to Fig.2 (a). That is, as indicated by the arrow with the number 1, one boundary line passing through the center of the individual region 28 and parallel to the short sides 28a and 28b that are a pair of parallel sides of the individual region 28 and its extension line The substrate 20 is cut along the line. Next, as indicated by an arrow with a number 2, the substrate 20 passes along one boundary line passing through the center of the individual region 28 and parallel to the other pair of long sides 28c and 28d and its extended line. Disconnect.

  (Procedure 2) Next, as shown by solid line arrows corresponding to numbers 3 and 4 in FIG. 2B, three rows of individual pieces 28p and 28q adjacent to the short sides 28a and 28b of the individual areas are excluded. With respect to the other individual pieces, the substrates are arranged in the order of broken-line arrows corresponding to the numbers 3 and 4 along the boundary lines parallel to the short sides 28a and 28b and the extended lines between the adjacent individual pieces. 20 is cut.

  (Procedure 3) Next, as shown by solid line arrows corresponding to numbers 5 and 6 in FIG. 2C, three rows of individual pieces 28r and 28s adjacent to the long sides 28c and 28d of the individual areas are excluded. For the other individual pieces, between the other adjacent individual pieces, along the boundary line parallel to the long sides 28c and 28d and the extended line thereof, in the order of the dashed arrows corresponding to the numbers 5 and 6, The substrate 20 is cut.

  (Procedure 4) Next, as shown by solid line arrows corresponding to numbers 7 and 8 in FIG. 2 (d), three rows of individual pieces 28r and 28s adjacent to the long sides 28c and 28d of the piece area, respectively, and the periphery For the region 29, the substrate 20 is cut in the order of broken-line arrows corresponding to the numbers 7 and 8 along the boundary lines parallel to the long sides 28c and 28d and the extended lines thereof.

  That is, the long side 28c along the boundary line parallel to the long side 28c and the extension line thereof among the boundary lines of the three individual pieces 28r adjacent to the side 28c, as indicated by the dashed arrow corresponding to the number 7. Cut sequentially from the side to the inside of the substrate 20. Next, the long side 28d extends along the boundary line parallel to the long side 28d and the extension line among the boundary lines of the three individual pieces adjacent to the long side 28d, as indicated by the dashed arrow corresponding to the number 8. Cut sequentially from the side to the inside of the substrate 20.

  As shown in FIG. 2D, the portion 80 that may be peeled off in the procedure 4 is composed of only the minimum unit when the peripheral region 29 is cut. The adverse effect is small.

  (Procedure 5) Next, as shown by solid line arrows corresponding to numbers 9 and 10 in FIG. 3 (e), three rows of individual pieces 28p and 28q adjacent to the short sides 28a and 28b of the individual areas, respectively, and the periphery For the region 29, the substrate 20 is cut in the order of broken-line arrows corresponding to the numbers 9, 10 along the boundary lines parallel to the short sides 28a, 28b and the extended lines thereof.

  That is, as indicated by the broken-line arrow corresponding to the number 9, among the boundary lines of the three individual pieces 28p adjacent to the short side 28a, the 0-short side along the boundary line parallel to the short side 28a and its extension line Cut sequentially from the 28a side to the inside of the substrate 20. Next, as indicated by a broken-line arrow corresponding to the number 10, the short side 28b extends along the boundary line parallel to the short side 28b and the extension line among the boundary lines of the three individual pieces adjacent to the short side 28b. Cut sequentially from the side to the inside of the substrate 20.

  As shown by a hatched line in FIG. 3E, the portion 82 that may be peeled off in the procedure 5 is composed of only the minimum unit when the peripheral region 29 is cut. The adverse effect is small.

  By dividing the substrate 20 according to the above steps 1 to 5, in steps 1 to 3 (that is, the first step of the second step), the peripheral region 29 and the individual region 28 are easily peeled off from the jig. Since the individual pieces in the first row adjacent to each other are cut in a state of being connected to the pieces in the second row and the third row arranged from the sides 28a to 28d of the piece region 28 toward the inside of the substrate 20, Does not peel from the jig. In the procedures 4 and 5 (that is, the second step of the second step), most of the peripheral region 29 is composed of a minimum unit when the peripheral region 29 is cut and three pieces aligned toward the inside of the substrate 20. Since the portion that may be cut and peeled off in a state where the individual pieces 28p to 28s are connected to each other is made small, even if it is peeled off, the adverse effect on the dicing blade or the like is small. Therefore, it is possible to suppress the breakage of the dicing blade and the occurrence of cut misalignment.

  In the procedure 1, first, the substrate 20 is cut into a cross shape to relieve the warping stress of the substrate 20, thereby strengthening the adhesion and fixing of the four divided portions of the substrate 20, and the cut portions are peeled off. The possibility can be reduced. As a result, it is possible to further suppress the occurrence of breakage of the dicing blade and defective cutting deviation.

  Next, the reason why the three rows of pieces adjacent to the sides of the piece area are cut later will be described with reference to the explanatory views of FIGS.

  FIG. 4 is an explanatory diagram showing a state when cutting. The adhesion strength between the peripheral region side portion 29p included in the peripheral region and the individual piece portion 28u in the first row adjacent to the side of the individual piece region is likely to decrease. Adhesion strength is sufficient for the individual piece portion 28v in the second row and the individual piece portion 28w in the third row that are adjacent to the sides of the individual region with hatching. FIG. 5 is an explanatory diagram of cut deviation.

  As shown in FIG. 4A, the cutting target 27a cut to a state where the peripheral region side portion 29p and the first row of individual pieces 28u adjacent to the sides of the individual regions are connected is indicated by an arrow 90. In the case of cutting as shown by, the posture is inclined by hitting the dicing blade, and the individual part 28u in the first row is easily cut into a trapezoidal shape.

  That is, as shown in FIGS. 5A-1 and 5B-1, the cutting target 27a in which the peripheral region side portion 29p and the individual portion 28u in the first row adjacent to the side of the individual region are connected. If the dicing blade hits the blade 90 as indicated by the arrow 90, the cutting strength 27a rotates in the directions of the arrows 90a and 90b as shown in FIGS. 5 (a-2) and (b-2) due to insufficient adhesion strength. And tilted. Therefore, as shown in FIGS. 5 (a-2) and (b-2), the cutting object 27a is cut obliquely by a dicing blade that proceeds in the direction of the arrow 91, and the individual part side 28m, 28n in the first row. And the peripheral region sides 29m and 29n are divided into trapezoidal shapes.

  As shown in FIG. 4B, the cutting target 27b in which the peripheral region side portion 29p, the first row piece portion 28u adjacent to the edge of the piece region, and the second row piece portion 28v are connected. The first piece is cut as indicated by arrow 90, and the second is cut as indicated by arrow 92. In this case, since the individual piece portion 28u in the first row is supported by only one of the portion 28v in the second row when the second piece is cut, the individual piece portion 28u in the first row is cut into a trapezoidal shape. Concerns remain.

  As shown in FIG. 4 (c), the peripheral region side portion 29p, the first row of individual portions 28u, the second row of individual portions 28v, and the third row of individual portions adjacent to the sides of the individual regions. The cutting target 27c connected to 28w is cut as indicated by the arrow 90 after the first one and then cut as indicated by the arrow 92 after the second one. In this case, at the time of cutting the second row, the individual piece portion 28u in the first row is supported by the individual piece portion 28v in the second row and the individual piece portion 28w in the third row. The concern that the piece portion 28u is cut into a trapezoidal shape is eliminated. Therefore, it is preferable that the individual piece portions to be cut into individual pieces later are for three rows adjacent to the side of the individual piece region.

  <Example 2> FIG. 6 is an explanatory diagram illustrating a procedure for dividing the substrate 20 of Example 2. In FIG. As shown in FIG. 6, the second embodiment is substantially the same as the first embodiment. In the following description, the same reference numerals are used for the same parts as those in the first embodiment, and differences from the first embodiment will be mainly described.

  In the first embodiment, among the steps 1 to 5 of the first embodiment, the procedure 1 for dividing the substrate into crosses first is omitted.

  In other words, as shown by solid line arrows corresponding to number 1 in FIG. 6 (a), other individual parts excluding three rows of individual parts 28p and 28q adjacent to the short sides 28a and 28b of the individual areas, respectively. The substrate 20 is cut in the order of the broken-line arrows corresponding to the number 1 along the boundary lines parallel to the short sides 28a and 28b and the extended lines between the other individual piece portions adjacent to each other.

  Next, as shown by solid line arrows corresponding to number 2 in FIG. 6B, other individual pieces excluding the three rows of individual pieces 28r and 28s adjacent to the long sides 28c and 28d of the individual areas, respectively. The substrate 20 is cut in the order of the broken-line arrows corresponding to the number 2 along the boundary lines parallel to the long sides 28c and 28d and the extended lines between the other individual piece portions adjacent to each other.

  Next, as shown by solid line arrows corresponding to numbers 3 and 4 in FIG. 6C, for the three rows of individual portions 28r and 28s and the peripheral region 29 adjacent to the long sides 28c and 28d of the individual regions, respectively. The board | substrate 20 is cut | disconnected in the order of the dashed-line arrow corresponding to the numbers 3 and 4 along the boundary line parallel to the long sides 28c and 28d, and its extension line.

  At this time, as shown by a hatched line in FIG. 6C, the portion 80 that may be peeled is composed of only the minimum unit when the peripheral region 29 is cut. The adverse effect is small.

  Next, as shown by solid line arrows corresponding to numbers 5 and 6 in FIG. 6D, for the three rows of pieces 28p and 28q and the peripheral area 29 adjacent to the short sides 28a and 28b of the pieces, respectively, The board | substrate 20 is cut | disconnected in the order of the arrow of the broken line corresponding to the numbers 5 and 6 along the boundary line parallel to the short sides 28a and 28b, and its extension line.

  At this time, as shown by a hatched line in FIG. 6 (d), the portion 82 that may be peeled is composed of only the minimum unit when the peripheral region 29 is cut. The adverse effect is small.

  Also in the second embodiment, the three rows of individual portions adjacent to the sides of the individual regions are divided later. When the three rows of individual portions adjacent to the sides of the individual regions are divided, similarly to the first embodiment, cutting is performed sequentially from the sides of the individual regions to the inside of the substrate. Therefore, the portion that can be peeled off can be minimized, so that the breakage of the blade and the occurrence of cut deviation failure can be suppressed.

  <Example 3> FIG. 7 is an explanatory diagram illustrating a procedure for dividing a substrate in Example 3. FIG. As shown in FIG. 7, the third embodiment is substantially the same as the second embodiment, but the procedure for dividing the three rows of individual portions adjacent to the sides of the individual regions is different from the second embodiment.

  That is, as shown in FIG. 7C, when cutting the three rows of individual portions 28r, 28s adjacent to the long sides 28c, 28d of the individual regions and the peripheral region, the long sides 28c, 28d are parallel to the long sides 28c, 28d. Cut along the boundary line and its extension line in order from one long side 28c side to the other long side 28d side.

  Next, as shown in FIG. 7 (d), when cutting the three rows of individual portions 28p, 28q adjacent to the short sides 28a, 28b of the individual regions and the peripheral region, the parallel portions to the short sides 28a, 28b are obtained. Cut along the boundary line and its extension line in order from one short side 28a side to the other short side 28b side.

  In this case, by cutting as indicated by the arrows with the numbers 3; 5, the hatched portions 80 and 82 become only the minimum unit for cutting the peripheral region. The occurrence of breakage and cut misalignment can be suppressed. In addition, since the portion that may be peeled off when cutting as indicated by the arrows with the numbers 4 and 6 is reduced to a certain extent, even if it is peeled off, the blade breakage and the occurrence of cut misalignment, It can be suppressed to a certain extent.

  Comparative Example 1 FIG. 8 is an explanatory diagram showing a procedure for dividing a substrate in Comparative Example 1.

  First, as shown in FIG. 8A, the substrate 20 is cut in a cross shape in the direction of the arrow in the order of numbers 1 and 2.

  Next, as shown in FIG. 8B, the substrate 20 is cut in the order of numbers 3 to 6 in the direction of the arrow along the boundary line between the peripheral area 29 and the piece area 28 and its extension line.

  Next, as shown in FIG. 8C, in the order of numbers 7 and 8, the individual regions 28 are arranged in the direction of the arrow along the boundary lines parallel to the short sides 28a and 28b of the individual region 28 and the extended lines thereof. Disconnect. In the peripheral region 29 that is easily peeled off from the jig, for example, a strip-shaped portion 84 in which a plurality of minimum units are connected to each other as indicated by diagonal lines is peeled off by diving water or cutting resistance during dicing, and the dicing grade is reduced. May give a large load.

  Next, as shown in FIG. 8D, the individual regions 28 are cut in the order of the numbers 9 and 10 in the direction of the arrow along the boundary lines parallel to the long sides 28c and 28d of the peripheral region and the extension lines thereof. To do. In the peripheral region 29 that is easily peeled off from the jig, for example, a strip-shaped portion 86 in which a plurality of minimum units are connected as indicated by diagonal lines is peeled off by cutting water or cutting resistance during dicing, and the dicing grade is reduced. May give a large load.

<Experimental example> Individual pieces other than the three individual pieces that are adjacent to the sides of the individual areas are divided, and then the individual pieces of the three rows that are adjacent to the sides of the individual areas are divided. Regarding Example 1 and Comparative Example 1 in which the peripheral area is divided and then the individual area is divided, the average number of sheets in which the dicing blade is broken and the result of examining the occurrence rate of cut deviation defects in the individual pieces are as follows. Table 1 shows.

  From Table 1, it can be seen that, compared to Comparative Example 1, Example 1, which can reduce the portion that may be peeled off, can suppress breakage of the dicing blade and defective cut deviation.

  <Summary> As described above, each of the pieces other than the three pieces of pieces adjacent to each side of the piece region is divided, and then each of the three rows adjacent to the sides of the piece region is divided. When the piece portion is divided, the portion that may be peeled off when the substrate is divided can be reduced, and the occurrence of breakage of the dicing blade and defective cut deviation can be suppressed.

  The present invention is not limited to the above embodiment, and can be implemented with various modifications.

  For example, in steps 1 to 5 of the first embodiment, the short side and the long side may be interchanged.

  It is also possible to execute procedure 2 and procedure 3 of the embodiment in parallel, and to execute procedure 4 and procedure 5 in parallel. For example, a plurality of cuts parallel to a pair of parallel sides of the individual region and a plurality of cuts parallel to another pair of parallel sides of the piece region are alternately performed for each predetermined number. It doesn't matter.

20 substrate 22 substrate body 22a main surface 24 component 26 resin layer 27, 27k piece part 27a, 27b, 27c cut object 28 piece region 28a, 28b short side (pair of sides)
28c, 28d long side (other pair of sides)
28m, 28n piece part side 28p to 28s 3 pieces piece part 28u 1st piece piece part 28v 2nd piece piece part 28w 3rd row piece part 28x, 28y boundary line 29 peripheral area 29m, 29n peripheral area side 29p peripheral area side part

Claims (3)

A rectangle including a substrate body and a resin layer covering the main surface of the substrate body, and including a plurality of individual portions that are to be divided into a lattice shape along a boundary line when viewed from a direction perpendicular to the main surface A first step of preparing a substrate partitioned into a piece region and a peripheral region adjacent to the piece region;
A second step of dividing the piece portion from the substrate in a state in which the substrate is fixedly adhered by attaching a dicing tape to the resin layer of the substrate;
In a method for dividing a substrate comprising:
The second step includes
The boundary lines parallel to the pair of sides and the extension lines thereof among the boundary lines other than the boundary lines of the individual piece portions of two rows adjacent to the pair of parallel sides of the piece region, respectively,
The boundary line parallel to the other pair of sides among the boundary lines other than the boundary line of the individual piece portions in two rows each adjacent to the other pair of sides parallel to each other of the piece region, and Extension line,
A first step of cutting the substrate along:
After the first step,
The boundary line parallel to the pair of sides and the extension thereof among the boundary lines of the two pieces of the piece portions adjacent to the pair of sides parallel to each other of the piece region, and
The boundary line parallel to the other pair of sides and the extension line thereof among the boundary lines of the two pieces of the piece portions adjacent to each other pair of sides parallel to each other of the piece region; and
A second step of cutting the substrate along
A method of dividing a substrate, comprising: In the second step,
From the side to the inside of the substrate along the boundary line parallel to the side and the extension line thereof among the boundary lines of the two rows of piece parts adjacent to the side of the piece region. The substrate cutting method according to claim 1, wherein the substrate is cut sequentially. In the first step,
First, one boundary line parallel to the pair of sides of the piece region passing through the center of the piece region and its extension line, and the other of the piece region passing through the center of the piece region. The substrate dividing method according to claim 1, wherein the substrate is cut into a cross shape along one boundary line parallel to the pair of sides and an extended line thereof.