JP2015052836A - Method for manufacturing transparent conductive laminate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a transparent conductive laminate for simplifying a flow of manufacturing processes.SOLUTION: The method for manufacturing a transparent conductive laminate includes: an exposure step of exposing a first resist 14a and a second resist 14b; a development step of developing the exposed first resist 14a and the second resist 14b; and an etching step of etching a first transparent conductive layer 13a by using the developed first resist 14a as a mask, and etching a second transparent conductive layer 13b by using the developed second resist 14b as a mask. The first resist 14a has a function of inhibiting exposure of the second resist 14b by the exposure light applied to the first resist 14a; and the second resist 14b has a function of inhibiting exposure of the first resist 14a by the exposure light applied to the second resist 14b.

Description

  The technique of this indication is related with the manufacturing method of the transparent conductive layered product used for a touch panel.

  In recent years, capacitive touch panels have been widely used as input devices for electronic devices. A projected capacitive touch panel includes two electrodes for detecting a change in capacitance. For example, as described in Patent Document 1, the two electrodes face each other with a single transparent substrate interposed therebetween. Each of these two electrodes is formed by patterning a transparent conductive film formed on the substrate.

JP 2011-194679 A

  By the way, as a method for patterning a conductive film formed on a substrate, a method using photolithography is widely used. In the method using photolithography, first, a resist formed on a conductive film is subjected to exposure and development, and then patterned into a shape covering an electrode. Next, the conductive film is etched using the patterned resist as a mask, whereby an electrode is formed from the conductive film.

  Here, when two conductive films facing each other are patterned into different shapes, a resist is first formed on one of the conductive films, and the resist is patterned. Next, another resist is formed on the other conductive film, and the other resist is patterned. In repeating such patterning, exposure and development, which are different processes, are alternately repeated, which increases the complexity of manufacturing the transparent conductive laminate.

  The technique of this indication aims at providing the manufacturing method of the transparent conductive laminated body which can simplify the flow of a manufacturing process.

  A method for producing a transparent conductive laminate for solving the above problems includes a substrate, and a first transparent conductive layer and a second transparent conductive layer, which are two transparent conductive layers facing each other across the substrate, A laminated body forming step of forming a laminated body including: a first resist is formed on the surface of the first transparent conductive layer; and a second resist is formed on the surface of the second transparent conductive layer A resist forming step, an exposure step of exposing the first resist and the second resist, a developing step of developing the exposed first resist and the second resist, and the developed first Etching the first transparent conductive layer using the resist as a mask, and etching the second transparent conductive layer using the developed second resist as a mask. The first resist has a function of suppressing exposure of the second resist by exposure light to the first resist, and the second resist is controlled by exposure light to the second resist. The first resist has a function of suppressing exposure to light.

  According to the above method, when two resists are exposed, it is possible to prevent exposure light for one resist from exposing the other resist. Therefore, even when different patterns are formed on the two transparent conductive layers, it is possible to suppress the pattern formed on one resist from affecting the pattern formed on the other resist. And, as a result of enabling the exposure of the two resists together before the development of the two resists, the production method of repeating the resist formation, exposure, and development in this order for each surface on which the transparent conductive layer is formed; In comparison, the flow of the manufacturing process of the transparent conductive laminate can be simplified.

  In the method for manufacturing a transparent conductive laminate, the first resist absorbs exposure light for the first resist, suppresses the exposure light from reaching the second resist, and It is preferable that the second resist absorbs exposure light for the second resist to prevent the exposure light from reaching the first resist.

  According to the above method, each of the two resists absorbs exposure light for the resist and suppresses the exposure light from reaching another resist. As a result, suppressing the exposure light for one resist from exposing the other resist is realized by the resist that directly receives the exposure light.

  In the manufacturing method of the transparent conductive laminate, in the exposure step, light having a wavelength in the ultraviolet region is irradiated as exposure light to the first resist and the second resist, and the first resist and the The second resist preferably absorbs light having a wavelength in the ultraviolet region, which is the exposure light.

  According to the above method, even if the exposure light for the first resist and the exposure light for the second resist are light having a wavelength in the ultraviolet region common to each other, the exposure light for one resist passes through the other resist. Exposure to light is suppressed.

In the method for producing a transparent conductive laminate, it is preferable that the first resist and the second resist include an ultraviolet absorber or a resin having an ultraviolet absorbing function.
According to the above method, since the resist includes an ultraviolet absorber different from the material having a photosensitive function or a resin having an ultraviolet absorbing function, the function adjustment is performed in the resist when absorbing light having a wavelength in the ultraviolet region. Easy.

  In the manufacturing method of the transparent conductive laminate, in the exposure step, the first resist and the second resist are irradiated with light having a wavelength in the ultraviolet region and light having a wavelength in the visible region as exposure light. Each of the first resist and the second resist absorbs light having a wavelength in the visible region included in the exposure light, and the stacked body has a wavelength in the ultraviolet region included in the exposure light. It is preferable that a functional layer that absorbs light is included between the first resist and the second resist.

  According to the above method, since the resist absorbs light having a wavelength in the visible region and the laminate absorbs light having a wavelength in the ultraviolet region, the exposure light includes light having a wavelength in the ultraviolet region and light having a wavelength in the visible region. When the resist is irradiated, it is possible to prevent exposure light for one resist from passing through the laminate and reaching the other resist. As a result, exposure light for one resist can be suppressed from exposing the other resist. Further, as exposure light, light including light having a wavelength in the visible region and light having a wavelength in the ultraviolet region can be used, so that the burden of adjusting the exposure light, such as selection of a light source and selection of exposure light by a filter, is reduced. .

  In the method for producing a transparent conductive laminate, each of the first resist and the second resist includes a visible light absorber or a resin having a visible light absorption function, and the laminate includes an ultraviolet ray. It is preferable that the functional layer contains an absorbent or a resin having an ultraviolet absorbing function.

According to the above method, a function of absorbing light having a wavelength in the visible region can be added to the resist, and a function of absorbing light having a wavelength in the ultraviolet region can be added to the laminate.
In the method for producing a transparent conductive laminate, it is preferable that the photosensitive wavelength of the first resist and the photosensitive wavelength of the second resist include wavelengths in different regions.

  According to the above method, since the photosensitive wavelengths of the two resists include wavelengths in different regions, even if light having a wavelength that sensitizes only one resist passes through the laminate and reaches the other resist, Exposure of the resist can be suppressed. Therefore, even if different patterns are formed on the two transparent conductive layers by adjusting the wavelength of the exposure light or the light transmitted through the laminate, the pattern formed on one resist is the other Affecting the pattern formed in the resist is suppressed. Both of the two resists can then be exposed together before development of both resists. As a result, compared with a manufacturing method in which formation, exposure, and development of resist are repeated in this order for each surface on which a transparent conductive layer is formed, the manufacturing process flow of the transparent conductive laminate can be simplified. it can.

  According to the technique of the present disclosure, the exposure for the first resist and the exposure for the second resist can be performed together before development of these resists, so the manufacturing process of the transparent conductive laminate is simple.

It is sectional drawing which shows the cross-section of the transparent conductive laminated body in each embodiment in the technique of this indication. It is a figure which shows the manufacturing process of the transparent conductive laminated body in 1st Embodiment in the technique of this indication, Comprising: It is a figure which shows the formation process of a transparent conductive layer. It is a figure which shows the manufacturing process of the transparent conductive laminated body in 1st Embodiment, Comprising: It is a figure which shows the formation process of a resist. It is a figure which shows the manufacturing process of the transparent conductive laminated body in 1st Embodiment, Comprising: It is a figure which shows an exposure process. It is a figure which shows the manufacturing process of the transparent conductive laminated body in 1st Embodiment, Comprising: It is a figure which shows the transparent conductive laminated body after exposure was performed. It is a figure which shows the manufacturing process of the transparent conductive laminated body in 1st Embodiment, Comprising: It is a figure which shows a image development process. It is a figure which shows the manufacturing process of the transparent conductive laminated body in 1st Embodiment, Comprising: It is a figure which shows an etching process. It is a figure which shows the manufacturing process of the transparent conductive laminated body in 1st Embodiment, Comprising: It is a figure which shows the removal process of a resist. It is sectional drawing which shows the cross-section of the transparent conductive laminated body in a modification. It is a figure which shows the manufacturing process of the transparent conductive laminated body in 2nd Embodiment in the technique of this indication, Comprising: It is a figure which shows an exposure process. It is a figure which shows the manufacturing process of the transparent conductive laminated body in 3rd Embodiment in the technique of this indication, Comprising: It is a figure which shows the formation process of a transparent conductive layer. It is a figure which shows the manufacturing process of the transparent conductive laminated body in 3rd Embodiment, Comprising: It is a figure which shows the formation process of a resist. It is a figure which shows the manufacturing process of the transparent conductive laminated body in 3rd Embodiment, Comprising: It is a figure which shows an exposure process. It is a figure which shows the manufacturing process of the transparent conductive laminated body in 3rd Embodiment, Comprising: It is a figure which shows the transparent conductive laminated body after exposure was performed. It is a figure which shows the manufacturing process of the transparent conductive laminated body in 3rd Embodiment, Comprising: It is a figure which shows a image development process. It is a figure which shows the manufacturing process of the transparent conductive laminated body in 3rd Embodiment, Comprising: It is a figure which shows an etching process. It is a figure which shows the manufacturing process of the transparent conductive laminated body in 3rd Embodiment, Comprising: It is a figure which shows the removal process of a resist.

(First embodiment)
With reference to FIGS. 1-8, 1st Embodiment of the manufacturing method of a transparent conductive laminated body is described.

[Configuration of transparent conductive laminate]
With reference to FIG. 1, the structure of the transparent conductive laminated body manufactured by the manufacturing method of 1st Embodiment is demonstrated. Hereinafter, an example in which the transparent conductive laminate is applied to one of the constituent members of the touch panel will be described.

  As shown in FIG. 1, the transparent conductive laminate 10 includes a transparent substrate 11, a first transparent electrode layer 12 a formed on the surface of the substrate 11, and a second transparent electrode formed on the back surface of the substrate 11. Layer 12b. The two transparent electrode layers 12a and 12b face each other with the substrate 11 in between.

  The substrate 11 is, for example, a glass plate or a resin film. The forming material of the glass plate and the forming material of the resin film are not particularly limited as long as the material satisfies the strength required for the substrate in the transparent electrode layer forming process and the subsequent process. The resin film forming material is, for example, at least one selected from the group consisting of polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polycarbonate, polyethersulfone, polysulfone, polyarylate, cyclic polyolefin, and polyimide. The thickness of the substrate 11 is preferably 10 μm or more and 200 μm or less. If the thickness of the substrate 11 is within such a range, the transparent conductive laminate 10 can be thinned and the flexibility of the substrate 11 can be obtained.

  The substrate 11 may contain various additives and stabilizers. Examples of the additives and stabilizers include antistatic agents, plasticizers, lubricants, and easy adhesives. The substrate 11 is subjected to corona treatment, low-temperature plasma treatment, ion bombardment treatment, chemical treatment, or the like as pretreatment in order to improve adhesion between the layer laminated on the substrate 11 and the substrate 11. Also good.

  As materials for the transparent electrode layers 12 a and 12 b, various materials can be used according to the characteristics and applications required for the transparent conductive laminate 10. For example, the material of the transparent electrode layers 12a and 12b includes any one of indium oxide, zinc oxide, and tin oxide, or a mixed oxide of two or three kinds thereof. Further, additives may be added to the above materials. For example, the transparent electrode layers 12a and 12b may be formed of a fibrous metal such as a metal nanowire. In addition, when the transparent electrode layers 12a and 12b contain a fibrous metal, the fibrous metal is preferably supported by a matrix such as a resin.

  The transparent electrode layers 12a and 12b are patterned into a predetermined shape. For example, the first transparent electrode layer 12a has a pattern in which a plurality of conductive regions extending in the X direction are arranged side by side in the Y direction perpendicular to the X direction. The second transparent electrode layer 12b facing the first transparent electrode layer 12a has a pattern in which a plurality of conductive regions extending in the Y direction are arranged side by side in the X direction. For example, the conductive region is formed in a linear shape or a shape in which a plurality of rhombuses are connected in one direction. A region between adjacent conductive regions becomes a non-conductive region insulated from the conductive region. Each of the conductive regions is connected to a circuit that detects a change in capacitance formed in the conductive region by a change in current. When a human finger or the like approaches the conductive region, the capacitance changes. Based on the detection of the change in capacitance, the contact position of a human finger or the like is determined.

  A cover layer made of glass or the like is laminated on the first transparent electrode layer 12a on the surface side of the substrate 11 through an adhesive layer to constitute a touch panel. Further, a display panel such as a liquid crystal panel is laminated on the second transparent electrode layer 12b on the back side of the substrate 11, and a display device is configured by the touch panel and the display panel.

  The transparent conductive laminate 10 may include another functional layer between the substrate 11 and the first transparent electrode layer 12a or between the substrate 11 and the second transparent electrode layer 12b. Other functional layers include, for example, an adhesion layer that enhances the adhesion between the substrate 11 and the transparent electrode layers 12a and 12b, a resin layer that reinforces the mechanical strength of the transparent conductive laminate, and the optical properties of the transparent conductive laminate. An optical adjustment layer or the like that adjusts general characteristics.

[Method for producing transparent conductive laminate]
With reference to FIGS. 2-8, the manufacturing method of a transparent conductive laminated body is demonstrated.
As shown in FIG. 2, first, as a stacked body forming step, the first transparent conductive layer 13 a is formed on the surface of the substrate 11, and the second transparent conductive layer 13 b is formed on the back surface of the substrate 11. The transparent conductive layers 13a and 13b are formed by a known film formation method. For example, when the transparent conductive layers 13a and 13b are formed of indium tin oxide (ITO), the transparent conductive layers 13a and 13b are formed by a chemical vapor deposition method such as a vacuum deposition method or sputtering, or a chemical method such as a CVD method. It is formed by a chemical vapor deposition method or the like. Moreover, when the transparent conductive layers 13a and 13b contain fibrous metal, the transparent conductive layers 13a and 13b are formed by applying a solution in which the fibrous metal is dispersed to the substrate 11 by a known coating method or printing method. It is formed.

  As shown in FIG. 3, next, as a resist forming step, a first resist 14 a is formed on the surface of the first transparent conductive layer 13 a on the front surface side of the substrate 11, and a second resist surface is formed on the back surface side of the substrate 11. A second resist 14b is formed on the surface of the transparent conductive layer 13b.

  The resists 14a and 14b may be negative resists or positive resists. The resists 14a and 14b are formed by a known coating method and are exposed to exposure light having a peak wavelength in the ultraviolet region.

Here, functions and constituent materials of the resists 14a and 14b will be described in detail.
Each of the resists 14a and 14b has a function of suppressing exposure of the exposure light to the other resist in addition to a function as a normal photoresist. Specifically, each of the resists 14a and 14b has a function of absorbing light irradiated for exposing the resist to such an extent that the light does not reach the other resist. The wavelength of light for exposing the resist varies depending on the type of resist and the type of light source, but at least one of the wavelength in the ultraviolet region (about 200 nm to about 380 nm) and the wavelength in the visible region (about 380 nm to about 780 nm) It is preferable that In particular, from the viewpoint of obtaining the accuracy of the processing shapes and processing dimensions of the resists 14a and 14b, in the resists 14a and 14b, the wavelength of the exposure light is preferably in the ultraviolet region, and the resists 14a and 14b are light having wavelengths in the ultraviolet region. Is preferably absorbed. Hereinafter, an example in which the resists 14a and 14b absorb light having a wavelength in the ultraviolet region will be described.

  In order to exhibit the above functions, the resists 14a and 14b include a light absorbing material. The light absorbing material absorbs part of the exposure light irradiated to the resists 14a and 14b, and converts the absorbed light into other energy such as heat and emits it. The light absorbing material used for absorbing light having a wavelength in the ultraviolet region is, for example, an ultraviolet absorbent or a resin having an ultraviolet absorbing function. The light absorbing material is contained in the resists 14a and 14b by mixing with a material having a photosensitive function or by copolymerization of a material having a photosensitive function and a light absorbing material.

  Examples of the ultraviolet absorber include benzophenone-based, benzotriazole-based, benzoate-based, salicylate-based, triazine-based, and cyanoacrylate-based ultraviolet absorbers. Specific examples include, for example, 2- (2H-benzotriazol-2-yl) -p-cresol and 2- (2H-benzotriazol-2-yl) -4-6 as benzotriazole-based UV absorbers. Bis (1-methyl-1-phenylethyl) phenol, 2- [5-chloro (2H) -benzotriazol-2-yl] -4-methyl-6- (tert-butyl) phenol, 2- (2H-benzo Triazol-yl) -4,6-di-tert-pentylphenol, 2- (2H-benzotriazol-2-yl) -4- (1,1,3,3-tetramethylbutyl) phenol and the like and mixtures thereof , Modified products, polymers, derivatives and the like. Further, for example, as a triazine-based ultraviolet absorber, 2- (4,6-diphenyl-1,3,5-triazin-2-yl) -5-[(hexyl) oxy] -phenol, 2- [4 -[(2-hydroxy-3-dodecyloxypropyl) oxy] -2-hydroxyphenyl] -4,6-bis (2,4-dimethylphenyl) -1,3,5-triazine, 2- [4- [ (2-Hydroxy-3-tridecyloxypropyl) oxy] -2-hydroxyphenyl] -4,6-bis (2,4dimethylphenyl) -1,3,5-triazine, 2,4-bis (2, 4-dimethylphenyl) -6- (2-hydroxy-4-iso-octyloxyphenyl) -s-triazine and the like, mixtures thereof, modified products, polymers, derivatives and the like. These ultraviolet absorbers may be used alone or in combination of two or more ultraviolet absorbers.

  Resins having an ultraviolet absorbing function include non-reactive ultraviolet absorbers such as benzophenone, benzotriazole, benzoate, salicylate, triazine, cyanoacrylate, and the like, vinyl groups, acryloyl groups, methacryloyl groups, etc. And a functional group having a polymerizable double bond, an alcoholic hydroxyl group, an amino group, a carboxyl group, an epoxy group, or an isocyanate group. The resin having an ultraviolet absorbing function is included in the resists 14a and 14b by copolymerization of a material having a photosensitive function and a resin having an ultraviolet absorbing function.

  A light absorption material may be used independently and may mix and use 2 or more types of materials. For example, when the resists 14a and 14b include a plurality of light absorbing materials having different wavelengths of light that can be absorbed, the resists 14a and 14b can expand the wavelength range of light that can be absorbed by the resists 14a and 14b.

  In each of the resists 14a and 14b, the content of the light absorbing material is such that a pattern is formed in the resist by exposure and development of the resist, and the exposure light for the resist passes through the laminate and the other resist. It is the amount that absorbs exposure light to the extent that it does not reach. As a specific example, it is preferable that the resists 14a and 14b include a light absorbing material in an amount such that the light transmittance of the resists 14a and 14b at a wavelength of 365 nm is 1% or less. The resists 14a and 14b may be patterned by forming steps corresponding to the desired patterns in the resists 14a and 14b. For example, the resists 14a and 14b may be left on the entire transparent conductive layers 13a and 13b.

  As shown in FIG. 4, next, as an exposure process, a laminate in which the resists 14a and 14b are formed is disposed between the two light sources 17a and 17b that irradiate the resists 14a and 14b with light. The light sources 17a and 17b emit light composed of light having a wavelength in the ultraviolet region and light having a wavelength in the visible region. A first mask 15a having a pattern corresponding to the pattern of the first transparent electrode layer 12a from the side closer to the first resist 14a between the first resist 14a and the first light source 17a on the surface side of the substrate 11; The first optical filter 16a that blocks light of a specific wavelength is arranged in this order. A second mask 15b having a pattern corresponding to the pattern of the second transparent electrode layer 12b from the side closer to the second resist 14b between the second resist 14b and the second light source 17b on the back side of the substrate 11; The second optical filter 16b that blocks light of a specific wavelength is arranged in this order. In the first embodiment, the optical filters 16a and 16b block light having a wavelength in the visible region.

  The first resist 14a is irradiated with light from the first light source 17a to expose the first resist 14a, and the second resist 14b is irradiated with light from the second light source 17b. Are exposed. The exposure of the first resist 14a and the exposure of the second resist 14b are performed simultaneously. Alternatively, the exposure of the first resist 14a and the exposure of the second resist 14b may be performed separately before the development of the first resist 14a and before the development of the second resist 14b. At this time, since light having a wavelength in the visible region is blocked by the optical filters 16a and 16b, the resists 14a and 14b are exposed to light having a wavelength in the ultraviolet region among the light emitted from the light sources 17a and 17b.

  Here, the first resist 14a is sensitized by exposure light which is light having a wavelength in the ultraviolet region irradiated to the first resist 14a from the first light source 17a through the first optical filter 16a, and the exposure light passes through the laminate. The exposure light is absorbed to such an extent that it does not reach the second resist 14b. Therefore, it is possible to suppress the light irradiated from the first light source 17a to the first resist 14a from passing through the stacked body and exposing the second resist 14b.

  The second resist 14b is sensitized by the exposure light applied to the second resist 14b from the second light source 17b through the second optical filter 16b, and the exposure light passes through the laminate and reaches the first resist 14a. The exposure light is absorbed to such an extent that it does not. Therefore, it is possible to suppress the light applied to the second resist 14b from the second light source 17b from passing through the stacked body and exposing the first resist 14a. Therefore, it is possible to suppress the light for exposing one resist from being transmitted through the laminate and exposing the other resist.

  Further, the wavelength of the light blocked by the optical filters 16a and 16b and the wavelength of the light absorbed by the resists 14a and 14b are adjusted so that the wavelengths of the exposure light and the light absorbed by the resists 14a and 14b are matched. Therefore, exposure of the resists 14a and 14b and absorption of unnecessary exposure light are performed accurately.

  As described above, when the optical filters 16a and 16b block light having a wavelength in the visible region and the resists 14a and 14b absorb light having a wavelength in the ultraviolet region, the light transmittance of the optical filters 16a and 16b at a wavelength of 365 nm is 80% or more is preferable. If the light transmittance of the optical filters 16a and 16b is in the above range, the resists 14a and 14b are exposed to light having a wavelength in the ultraviolet region. Accordingly, it is possible to prevent the exposure light irradiated to one resist from being appropriately absorbed by the resist and reaching the other resist.

  Further, due to the characteristics of the resists 14a and 14b, when the resists 14a and 14b are not sufficiently exposed to light that has passed through the optical filters 16a and 16b, the light transmittance at a wavelength of 400 nm of the optical filters 16a and 16b is 0.1. It is preferable to adjust in the range of not less than 30% and not more than 30%.

As shown in FIG. 5, by exposing the resists 14a and 14b, a part of the resists 14a and 14b is exposed.
As shown in FIG. 6, next, as a developing step, when the resists 14a and 14b are negative, the unexposed portions of the resists 14a and 14b are removed by the developer. Alternatively, when the resists 14a and 14b are positive, the exposed portions of the resists 14a and 14b are removed by the developer. Thereby, patterns corresponding to the masks 15a and 15b are formed on the resists 14a and 14b. That is, a pattern covering the conductive regions in the transparent electrode layers 12a and 12b is formed by the resists 14a and 14b.

  As shown in FIG. 7, next, as an etching process, the first transparent conductive layer 13a is etched using the patterned first resist 14a as a mask, and the second transparent conductive layer is used using the patterned second resist 14b as a mask. 13b is etched. A known method is used as the etching method. Thereby, the 1st transparent conductive layer 13a is patterned and the 1st transparent electrode layer 12a is formed. Further, the second transparent conductive layer 13b is patterned to form the second transparent electrode layer 12b. The remaining portions of the transparent conductive layers 13a and 13b become conductive regions in the transparent electrode layers 12a and 12b, and the removed portions of the transparent conductive layers 13a and 13b become non-conductive regions in the transparent electrode layers 12a and 12b.

Next, as shown in FIG. 8, the resists 14a and 14b are removed. Thereby, the transparent conductive laminated body 10 is obtained.
In addition, it is preferable that each said process is performed by a roll-to-roll system. According to this, since a transparent conductive laminated body can be manufactured efficiently, the time concerning manufacture of the transparent conductive laminated body 10 is shortened.

[Action]
The effect | action which the manufacturing method of the transparent conductive laminated body of 1st Embodiment brings about is demonstrated.
As described above, one resist absorbs the exposure light to such an extent that the exposure light with respect to the resist does not pass through the laminate and reach the other resist. Therefore, even when the two transparent electrode layers 12a and 12b have different patterns, both the two resists 14a and 14b facing each other can be exposed together before developing both of them. As a result, the flow of the manufacturing process of the transparent conductive laminate is simpler than the manufacturing method in which the resist formation, exposure, and development are repeated in this order for each surface on which the transparent conductive layers 13a and 13b are formed. is there.

  In addition, since the two resists 14a and 14b are exposed almost simultaneously, the pattern of the first resist 14a is aligned with the position of the exposure mask for the first resist 14a and the position of the exposure mask for the second resist 14b. Alignment with the pattern of the second resist 14b becomes possible. Therefore, for example, the position of a fine pattern of one resist formed in advance is detected, and compared with the alignment that aligns the detection result with the position of the exposure mask for the other resist. The alignment of the patterns formed on the two resists 14a and 14b is facilitated. Therefore, the transparent electrode layers 12a and 12b can be formed in a fine pattern, and as a result, the sensitivity and accuracy of detecting the contact position on the touch panel are improved. Moreover, since the transparent electrode layers 12a and 12b are formed in a fine pattern, the pattern shape becomes inconspicuous, so that the visibility of the touch panel is improved.

  In the first embodiment, not the constituent layers of the transparent conductive laminate 10 but the resists 14a and 14b finally removed in the production of the transparent conductive laminate 10 have a function of absorbing exposure light. doing. Accordingly, the influence on the configuration of the transparent conductive laminate 10 is suppressed.

  As shown in FIG. 9, the substrate 11 may have a plurality of layers. In the transparent conductive laminate 20 shown in FIG. 9, the substrate 11 includes two sub-substrates 11a and 11b and an adhesive layer 21 that bonds the sub-substrate 11a and the sub-substrate 11b together. Examples of the resin used for the adhesive layer 21 include acrylic resins, silicone resins, and rubber resins. For the adhesive layer 21, it is preferable to use a resin excellent in cushioning properties and transparency.

  In such a method for producing a transparent conductive laminate, the first transparent conductive layer 13a is formed on the surface of the sub-substrate 11a, and the second transparent conductive layer 13b is formed on the surface of the sub-substrate 11b. Then, the back surface of the sub substrate 11a and the back surface of the sub substrate 11b are bonded together by the adhesive layer 21. Thereafter, the transparent conductive laminate 20 is manufactured through the same steps as those shown in FIGS. That is, also in this case, both the two resists 14a and 14b facing each other can be exposed together before developing both of them, so that the flow of the manufacturing process is simple.

As described above, according to the first embodiment, the following effects can be obtained.
(1) Since each of the resists 14a and 14b has a function of suppressing exposure light for the resist from exposing the other resist, both the two resists can be exposed together before development of both. As a result, the manufacturing process flow can be simplified.

  (2) Each of the resists 14a and 14b absorbs the exposure light for the resist and suppresses the exposure light for the resist from passing through the laminate and reaching the other resist. As a result, suppressing the exposure light for one resist from exposing the other resist is realized by the resist that directly receives the exposure light.

  (3) A part of the light emitted from the light sources 17a and 17b is blocked by the optical filters 16a and 16b, whereby the resist is irradiated with light having a wavelength in the ultraviolet region as exposure light. The resists 14a and 14b absorb light having a wavelength in the ultraviolet region. Therefore, it is possible to suppress exposure light for one resist from passing through the laminate and reaching the other resist. As a result, exposure light for one resist can be appropriately suppressed from exposing the other resist.

  (4) Since the resists 14a and 14b include an ultraviolet absorber different from the material having a photosensitive function or a resin having an ultraviolet absorbing function, the function adjustment is performed when absorbing light having a wavelength in the ultraviolet region. , 14b.

(Second Embodiment)
With reference to FIG. 10, 2nd Embodiment of the manufacturing method of a transparent conductive laminated body is described. In the second embodiment, the constituent layer of the transparent conductive laminate has a functional layer that absorbs light having a wavelength in the ultraviolet region, and the resist used in the manufacturing process of the transparent conductive laminate is visible. The main difference from the first embodiment is that it has a function of absorbing light having a wavelength in the region. Below, it demonstrates centering on difference with 1st Embodiment, about the structure similar to 1st Embodiment, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

[Configuration of transparent conductive laminate]
Hereinafter, as an example in the technology of the present disclosure, a case where the substrate 11 has a function of absorbing light having a wavelength in the ultraviolet region (about 200 nm to about 380 nm) will be described.

  The substrate 11 that is an example of a functional layer includes an ultraviolet absorbing material. Examples of the ultraviolet absorbing material include the ultraviolet absorbent exemplified in the first embodiment and a resin having an ultraviolet absorbing function. The form of the ultraviolet absorbing material included in the substrate 11 is a mixture of a main material forming the substrate 11 and an ultraviolet absorbent, or a copolymerization of a resin forming the substrate 11 and a resin having an ultraviolet absorbing function.

  The content of the ultraviolet absorbing material is such that the absorption function of ultraviolet rays is such that the light in the ultraviolet region of the exposure light that has not been absorbed by one resist can be prevented from reaching the other resist. If it is the quantity provided to 11, it will not specifically limit. For example, the substrate 11 preferably contains an ultraviolet absorbing material within a range of 0.01 wt% or more and 20 wt% or less with respect to the resin constituting the substrate 11. If the content of the ultraviolet absorbing material is equal to or more than the lower limit value, the resist 14a and 14b are resisted to such an extent that light having a wavelength in the ultraviolet region that has not been absorbed by one resist can be prevented from reaching the other resist. Exposure light can be absorbed. When the content of the ultraviolet absorbing material is equal to or less than the upper limit value, a decrease in the transparency of the substrate 11 can be suppressed.

  The functional layer that absorbs light having a wavelength in the ultraviolet region is an adhesion layer or a resin layer located between the substrate 11 and the first transparent electrode layer 12a or between the substrate 11 and the second transparent electrode layer 12b. Or an optical adjustment layer, or a combination of these and the substrate 11. Further, as shown in FIG. 9, when the transparent conductive laminate 10 includes the adhesive layer 21 for bonding the sub-substrate 11a and the sub-substrate 11b, the adhesive layer 21 emits light having a wavelength in the ultraviolet region. It may have a function of absorbing. Further, when the transparent electrode layers 12a and 12b contain fibrous metal and a resin as a matrix is applied to the transparent electrode layers 12a and 12b, the resin portion applied to the transparent electrode layers 12a and 12b is in the ultraviolet region. It may have a function of absorbing light of a wavelength. In short, at least one of the constituent layers of the transparent conductive laminate 10 may be a functional layer that absorbs light having a wavelength in the ultraviolet region. Similar to the above-described embodiment in which the substrate 11 is a functional layer, these layers absorb light having a wavelength in the ultraviolet region by containing an ultraviolet absorbing material.

[Method for producing transparent conductive laminate]
First, the function and constituent materials of the resist used in the method for producing the transparent conductive laminate of the second embodiment will be described.

  In addition to the function as a normal photoresist, the resists 14a and 14b have a function of suppressing exposure light for one resist from exposing the other resist. Specifically, the resists 14a and 14b have a function of absorbing light having a wavelength in the visible region (about 380 nm to about 780 nm). In order to realize the above function, the resists 14a and 14b include a visible light absorbing material. Examples of the visible light absorbing material include a visible light absorbent and a resin having a visible light absorbing function.

  As the visible light absorber, a pigment or dye having a maximum absorption wavelength in the visible region, or an organic compound containing a conjugated double bond can be used. Two or more kinds of organic compounds may be mixed and used. In addition, metal oxides such as titanium oxide and metal complexes used as paints and dyes, black particles such as carbon, and the like can also be used as visible light absorbers.

As resin which has a visible light absorption function, resin containing said organic compound is mentioned, for example.
The visible light absorbing material content is such that the visible light absorption function is such that light in the visible region of the exposure light irradiated on the resist does not pass through the laminate and reach the other resist. It is preferable that it is the quantity provided to 14a, 14b.

The manufacturing method of the transparent conductive laminated body of 2nd Embodiment is demonstrated.
First, as in the first embodiment shown in FIGS. 2 and 3, the first transparent conductive layer 13a is formed on the surface of the substrate 11, and the second transparent conductive layer 13b is formed on the back surface of the substrate 11. The Then, the first resist 14a is formed on the surface of the first transparent conductive layer 13a, and the second resist 14b is formed on the surface of the second transparent conductive layer 13b.

  As shown in FIG. 10, next, a laminate in which the resists 14a and 14b are formed is disposed between the two light sources 17a and 17b that irradiate the resists 14a and 14b with light. On the front surface side of the substrate 11, a first mask 15a is disposed between the first resist 14a and the first light source 17a. On the back surface side of the substrate 11, the second resist 14b and the second light source 17b are arranged. A second mask 15b is disposed between them. In the second embodiment, no optical filter is used.

  The first resist 14a is irradiated with light from the first light source 17a to expose the first resist 14a, and the second resist 14b is irradiated with light from the second light source 17b. Are exposed. The exposure of the first resist 14a and the exposure of the second resist 14b may be performed at the same time, or if they are performed together before the development of both the first resist 14a and the second resist 14b, There may be. At this time, since the optical filter is omitted, the resists 14a and 14b are exposed to light including light having a wavelength in the ultraviolet region and light having a wavelength in the visible region emitted from the light sources 17a and 17b.

  Here, the first resist 14a is sensitized by the exposure light applied to the first resist 14a from the first light source 17a, and light having a wavelength in the visible region of the exposure light is transmitted through the laminate, and the second resist Absorbs light with a wavelength in the visible region to the extent that it does not reach 14b. The substrate 11 absorbs light having a wavelength in the ultraviolet region that is not absorbed by the first resist 14a in the exposure light. Therefore, it is possible to suppress the light irradiated from the first light source 17a to the first resist 14a from passing through the stacked body and exposing the second resist 14b.

  The second resist 14b is sensitized by the exposure light applied to the second resist 14b from the second light source 17b, and light having a wavelength in the visible region of the exposure light is transmitted through the laminate and the first resist 14a. Absorbs light with a wavelength in the visible region to the extent that it does not reach. Further, the substrate 11 absorbs light having a wavelength in the ultraviolet region that is not absorbed by the second resist 14b in the exposure light. Therefore, it is possible to suppress the light applied to the second resist 14b from the second light source 17b from passing through the stacked body and exposing the first resist 14a. Therefore, even if the exposure of the two resists is performed collectively before the development of the two resists, it is possible to suppress the light for exposing one resist from being transmitted through the laminate and exposing the other resist.

  After the exposure of the resists 14a and 14b, as in the first embodiment shown in FIGS. 5 to 8, the development of the resists 14a and 14b, the etching of the transparent conductive layers 13a and 13b, and the resist 14a. , 14b are sequentially removed, and the transparent conductive laminate 10 is manufactured.

[Action]
The effect | action which the manufacturing method of the transparent conductive laminated body of 2nd Embodiment brings is demonstrated.
In the second embodiment, the resists 14a and 14b absorb light in the visible region of the exposure light, and the functional layer of the transparent conductive laminate 10 emits light in the ultraviolet region of the exposure light. To absorb. Thereby, it is suppressed that the exposure light with respect to one resist reaches the other resist. Therefore, since both of the two resists 14a and 14b facing each other can be exposed together before development of both, the flow of the manufacturing process of the transparent conductive laminate 10 is simple.

  In addition, since exposure light composed of light having a wavelength in the ultraviolet region and light having a wavelength in the visible region is absorbed by the resists 14a and 14b and the functional layer of the transparent conductive laminate 10, the exposure light is selected. Some or all of the optical filters are unnecessary. Therefore, the structure of the apparatus for manufacturing the transparent conductive laminate 10 is simplified.

As described above, according to the second embodiment, in addition to the effects (1) and (2) of the first embodiment, the following effects can be obtained.
(5) According to the above method, the resists 14a and 14b absorb light having a wavelength in the visible region, and the functional layer of the transparent conductive laminate 10 absorbs light having a wavelength in the ultraviolet region. When the resist is irradiated with light having a wavelength in the ultraviolet region and light having a wavelength in the visible region, exposure light for one resist is prevented from passing through the laminate and reaching the other resist. As a result, exposure light for one resist can be appropriately suppressed from exposing the other resist. Further, as exposure light, light including light having a wavelength in the visible region and light having a wavelength in the ultraviolet region can be used, so that the burden of adjusting the exposure light, such as selection of a light source and selection of exposure light by a filter, is reduced. .

  (6) Since the resists 14a and 14b contain a visible light absorber or a resin having a visible light absorption function, a function of absorbing light having a wavelength in the visible region is added to the resists 14a and 14b. Moreover, the function layer of the transparent conductive laminate 10 contains an ultraviolet absorber or a resin having an ultraviolet absorbing function, so that the function of absorbing light having a wavelength in the ultraviolet region has the function of the transparent conductive laminate 10. Added to the functional layer.

(Third embodiment)
With reference to FIGS. 11-17, 3rd Embodiment of the manufacturing method of a transparent conductive laminated body is described. The third embodiment is mainly different from the first embodiment in that the photosensitive wavelengths of the two resists are different from each other. Below, it demonstrates centering on difference with 1st Embodiment, about the structure similar to 1st Embodiment, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

[Method for producing transparent conductive laminate]
As shown in FIG. 11, first, the first transparent conductive layer 13 a is formed on the surface of the substrate 11, and the second transparent conductive layer 13 b is formed on the back surface of the substrate 11.

  As shown in FIG. 12, next, on the surface side of the substrate 11, a first resist 14c is formed on the surface of the first transparent conductive layer 13a, and on the back side of the substrate 11, the second transparent conductive layer 13b A second resist 14d is formed on the surface.

  The resists 14c and 14d have a function of suppressing exposure light to one resist from exposing the other resist in addition to a function as a normal photoresist. Specifically, the photosensitive wavelength of the first resist 14c and the photosensitive wavelength of the second resist 14d include wavelengths in different regions. The photosensitive wavelength of the first resist 14c and the photosensitive wavelength of the second resist 14d may be completely different or may be partially different. That is, the photosensitive wavelength of the first resist 14c and the photosensitive wavelength of the second resist 14d may not have an overlapping region, or may have an overlapping region.

  Since the resist is a photosensitive resin, the photosensitive wavelength of the resist depends on the absorption wavelength of the polymerization initiator. Therefore, if the first resist 14c and the second resist 14d contain polymerization initiators having different absorption wavelengths, the photosensitive wavelengths of the first resist 14c and the second resist 14d are different from each other. The type of the polymerization initiator is not particularly limited. For example, polymerization initiators having an absorption wavelength on the lower wavelength side (300 nm or less) in the ultraviolet region include acetophenone-based, benzophenone-based, and thioxanthone-based polymerization initiators. It is done. Examples of the polymerization initiator having an absorption wavelength on the higher wavelength side (300 nm or more) include benzoin ether-based, oxime ester-based, acylphosphine oxide-based, and titanocene-based polymerization initiators.

  As shown in FIG. 13, next, a laminate in which resists 14c and 14d are formed is disposed between the two light sources 17a and 17b. On the surface side of the substrate 11, between the first resist 14c and the first light source 17a, the first mask 15a and the first optical filter 16c are arranged in this order from the side closer to the first resist 14c. On the back surface side of the substrate 11, between the second resist 14d and the second light source 17b, a second mask 15b and a second optical filter 16d are arranged in this order from the side closer to the second resist 14d.

  Here, the two optical filters 16c and 16d have different wavelengths of light to be blocked. The first optical filter 16c that blocks part of the light applied to the first resist 14c blocks at least the light having the photosensitive wavelength of the second resist 14d. The second optical filter 16d that blocks a part of the light applied to the second resist 14d blocks at least the light having the photosensitive wavelength of the first resist 14c.

  As described above, the cut wavelengths of the optical filters 16c and 16d are selected in accordance with the absorption wavelengths of the polymerization initiators contained in the first resist 14c and the second resist 14d. Examples of the optical filters 16c and 16d include an optical filter that selectively blocks i-line (365 nm), h-line (405 nm), and g-line (436 nm), and wavelengths in the ultraviolet region and the entire visible region that are longer than an arbitrary wavelength. An optical filter or the like that blocks the light is appropriately selected.

  Then, the first resist 14c is irradiated with light from the first light source 17a to expose the first resist 14c, and the second resist 14d is irradiated with light from the second light source 17b to the second resist 14d. Are exposed. The exposure of the first resist 14c and the exposure of the second resist 14d may be performed at the same time. If the first resist 14c and the second resist 14d are collectively developed before the development, both of them may be performed separately. There may be.

  At this time, light of the photosensitive wavelength of the second resist 14d is removed from the light irradiated to the first resist 14c by the first optical filter 16c. Therefore, even if exposure light for the first resist 14c passes through the stacked body and reaches the second resist 14d, the second resist 14d can be prevented from being exposed.

  Further, light having the photosensitive wavelength of the first resist 14c is removed from the light irradiated to the second resist 14d by the second optical filter 16d. Therefore, even if the exposure light for the second resist 14d passes through the stacked body and reaches the first resist 14c, the first resist 14c is suppressed from being exposed. As a result, even when the exposure of the two resists is performed together before the development of the two resists, the light for exposing one resist is suppressed from exposing the other resist.

As shown in FIG. 14, the resists 14c and 14d are exposed to expose a part of the resists 14c and 14d.
Subsequently, as shown in FIG. 15, the resists 14c and 14d are developed, and as shown in FIG. 16, the transparent conductive layers 13a and 13b are etched to form the transparent electrode layers 12a and 12b. Then, as shown in FIG. 17, next, the resists 14 c and 14 d are removed, and the transparent conductive laminate 10 is obtained.

  In addition to the selection of exposure light by the optical filters 16c and 16d, or in addition to the selection of exposure light by the optical filters 16c and 16d, as in the first and second embodiments, the resists 14c, 14d and the functional layer of the transparent conductive laminate 10 may absorb exposure light. In short, among the light emitted from the first light source 17a toward the first resist 14c, the light having the photosensitive wavelength of the second resist 14d is suppressed from reaching the second resist 14d, and the second light source 17b Of the light emitted toward the second resist 14d, it is only necessary to suppress the light having the photosensitive wavelength of the first resist 14c from reaching the first resist 14c. When the region where the photosensitive wavelength of the first resist 14c overlaps the photosensitive wavelength of the second resist 14d is large, the resists 14c and 14d and the transparent conductive laminate are not limited to the wavelength of the exposure light by the optical filters 16c and 16d. If the exposure light is absorbed by the functional layer of the body 10, the exposure light for the resists 14c and 14d can be suppressed from becoming too small.

[Action]
The effect | action which the manufacturing method of the transparent conductive laminated body of 3rd Embodiment brings is demonstrated.
Since the photosensitive wavelengths of the two resists 14c and 14d include wavelengths in different regions, even if light having a wavelength that exposes only one resist passes through the laminate and reaches the other resist, the other resist is exposed. Can be suppressed. Therefore, the optical filters 16c and 16d adjust the wavelength of the exposure light for the resists 14c and 14d, and the resists 14c and 14d and the functional layer of the transparent conductive laminate 10 absorb a part of the exposure light. As a result, both of the two resists 14c and 14d facing each other can be exposed together before developing both of them. As a result, the flow of the manufacturing process of the transparent conductive laminate 10 is simple.

As described above, according to the third embodiment, in addition to the effects (1) and (2) of the first embodiment, the following effects can be obtained.
(7) Among the light emitted from the first light source 17a, the light having the photosensitive wavelength of the second resist 14d reaches the second resist 14d including the wavelengths of the regions where the photosensitive wavelengths of the two resists 14c and 14d are different from each other. It is possible to prevent the light having the photosensitive wavelength of the first resist 14c from reaching the first resist 14c out of the light emitted from the second light source 17b. Therefore, it is possible to suppress exposure light for one resist from being transmitted through the laminate and exposing the other resist.

Each of the above embodiments can be implemented with the following modifications.
In the first embodiment and the third embodiment, a light source that emits light of a specific wavelength may be used instead of selecting the wavelength of the exposure light by the optical filter.

  In the second embodiment, the resists 14a and 14b may absorb light having a wavelength in the ultraviolet region in addition to light having a wavelength in the visible region. In this case, light having a wider wavelength can be absorbed by making the wavelength of the ultraviolet rays absorbed by the functional layer of the transparent conductive laminate 10 different from the wavelength of the ultraviolet rays absorbed by the resists 14a and 14b. When the resists 14a and 14b absorb light having a wavelength in the visible region and light having a wavelength in the ultraviolet region, the functional layer of the transparent conductive laminate 10 does not absorb light having a wavelength in the ultraviolet region. Also good.

  DESCRIPTION OF SYMBOLS 10,20 ... Transparent electroconductive laminated body, 11 ... Board | substrate, 11a, 11b ... Sub-board | substrate, 12a, 12b ... Transparent electrode layer, 13a, 13b ... Transparent conductive layer, 14a, 14b, 14c, 14d ... Resist, 15a, 15b ... Mask, 16a, 16b, 16c, 16d ... Optical filter, 17a, 17b ... Light source, 21 ... Adhesive layer.

Claims (7)

A laminated body forming step of forming a laminated body including a substrate and a first transparent conductive layer and a second transparent conductive layer which are two transparent conductive layers facing each other with the substrate interposed therebetween;
Forming a first resist on the surface of the first transparent conductive layer, and forming a second resist on the surface of the second transparent conductive layer;
An exposure step of exposing the first resist and the second resist;
A developing step of developing the exposed first resist and the second resist;
Etching the first transparent conductive layer using the developed first resist as a mask, and etching the second transparent conductive layer using the developed second resist as a mask, and
The first resist has a function of suppressing exposure of the second resist by exposure light to the first resist;
The method for producing a transparent conductive laminate, wherein the second resist has a function of suppressing exposure of the first resist by exposure light to the second resist. The first resist absorbs exposure light for the first resist and suppresses the exposure light from reaching the second resist;
The method for producing a transparent conductive laminate according to claim 1, wherein the second resist absorbs exposure light to the second resist and suppresses the exposure light from reaching the first resist. In the exposure step, the first resist and the second resist are irradiated with light having a wavelength in the ultraviolet region as exposure light,
The method for producing a transparent conductive laminate according to claim 2, wherein the first resist and the second resist absorb light having a wavelength in an ultraviolet region that is the exposure light. The method for producing a transparent conductive laminate according to claim 3, wherein the first resist and the second resist include an ultraviolet absorber or a resin having an ultraviolet absorbing function. In the exposure step, the first resist and the second resist are irradiated with light having a wavelength in the ultraviolet region and light having a wavelength in the visible region as exposure light,
Each of the first resist and the second resist absorbs light having a wavelength in the visible region included in the exposure light,
The transparent conductive laminate according to claim 2, wherein the laminate includes a functional layer that absorbs light having a wavelength in the ultraviolet region included in the exposure light, between the first resist and the second resist. Manufacturing method. Each of the first resist and the second resist includes a visible light absorber or a resin having a visible light absorption function,
The method for producing a transparent conductive laminate according to claim 5, wherein the laminate includes an ultraviolet absorber or a resin having an ultraviolet absorption function in the functional layer. The method for producing a transparent conductive laminate according to claim 1, wherein the photosensitive wavelength of the first resist and the photosensitive wavelength of the second resist include wavelengths in different regions.

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