JP2015043382A - Substrate jig and substrate piece manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate jig which can pick up substrate pieces after separation by cutting with high efficiency and which can be used in a state where the substrate is held in a vertical direction.SOLUTION: A substrate jig used for supporting via an adhesive layer, at least one lateral face of a substrate on which protection films are provided on both surfaces in a manner such that outlines of a plurality of substrate pieces are exposed when the plurality of substrate pieces are cut and separated form one substrate in a matrix shape by etching and used for continuing to support the plurality of substrate pieces after separation by cutting by the adhesive layer comprises a plurality of one-side inner frames which extend in a lateral direction or a longitudinal direction of a matrix-shaped arrangement of the plurality of substrate pieces on one lateral face of the substrate correspondingly to the matrix-shaped arrangement. The one-side inner frame includes a plurality of joint area projections provided to project toward the substrate corresponding to respective substrate pieces.

Description

  The present invention relates to a substrate jig used to hold a substrate when a substrate piece is cut and separated from a single substrate by etching.

  In recent years, substrate pieces of glass substrates have been used for liquid crystal displays and touch panels. As a method for manufacturing such a glass substrate piece, there is a method of cutting and separating a plurality of glass substrate pieces from a single large glass substrate by etching. In this method, a hydrofluoric acid-based solution is usually used as an etching solution.

  By the way, if the cut and separated glass substrate piece falls into the etching solution, it is not easy to take it out. Accordingly, so-called half-etching is used in which a single glass substrate is etched by half the thickness sequentially from each side.

  Hereinafter, a method of cutting and separating glass substrate pieces using half etching will be described with reference to FIGS. 15 to 17 are views for explaining a method of cutting and separating a glass substrate piece using half etching.

  First, as shown in FIG. 15, a protective film 503 is provided on both surfaces of a single large rectangular glass substrate 501 so that the outlines 505 of four rectangular glass substrate pieces in total, two vertically and horizontally, are exposed. . As the protective film 503, for example, polyethylene, polypropylene, or the like can be used, and the protective film 503 is attached to the glass substrate 501 via an adhesive or a pressure-sensitive adhesive.

  Alternatively, for example, a photosensitive resist solution is applied to both surfaces of the glass substrate 501 to form a resist film, and the other portions are irradiated with ultraviolet rays through the mask except for the outline of the four glass substrate pieces, and then developed. The protective film 503 can be provided by removing the resist film with the contour using a liquid.

  Next, etching (half etching) is performed from one surface side of the glass substrate 501 in a state where the glass substrate 501 is held in the vertical direction.

  Subsequently, the glass substrate 501 is cleaned. And as shown in FIG. 16, in order to prevent the glass substrate piece 502 to be cut and separated from falling, a glass substrate cut and separated from the glass substrate 501 on one surface side of the half-etched glass substrate 501 Adhesive tape 504 is attached so as to suspend the piece 502.

  Subsequently, the glass substrate 501 is etched again from the other surface side of the glass substrate 501 (the remaining half-etching) while the glass substrate 501 is held in the vertical direction again.

  When the adhesive tape 504 is peeled off from the glass substrate 501 after the glass substrate 501 is cleaned, four glass substrate pieces 502 as shown in FIG. 17 are obtained.

  A substrate jig used when cutting and separating a plurality of substrate pieces by etching while holding the substrate in a horizontal direction is already known (see Patent Documents 1 to 3).

  In addition, as another method for manufacturing a glass substrate piece, there is a method of cutting and separating a plurality of glass substrate pieces from a glass substrate by laser processing, and a method of cutting and separating a plurality of glass substrate pieces from a glass substrate by cutting with an end mill or the like. Are known. However, in these processing methods, the surface roughness of the end face of the glass substrate piece, that is, the cut surface, becomes rough, and the glass substrate piece is cut in comparison with the glass substrate piece cut and separated using the etching as described above. Scratches and cracks are likely to enter the board pieces.

JP 2010-103394 A JP 09-246365 A JP 2007-134391 A

  As described above, when a glass substrate piece is cut and separated using half etching, it is necessary to perform etching (half etching) of the glass substrate twice and cleaning operation of the glass substrate twice, which is inefficient. .

  The present invention has been devised to pay attention to the above problems and to effectively solve them. An object of the present invention is a substrate jig that can cut and separate a substrate piece from a single substrate by etching, and can efficiently take out the cut and separated substrate piece. It is to provide a substrate jig that can be used even in a state where is held in a vertical direction.

  The present invention provides at least one side surface of a substrate provided with a protective film on both sides so that the outlines of the plurality of substrate pieces are exposed when the plurality of substrate pieces are cut and separated in a matrix from a single substrate by etching. An outer frame for supporting a peripheral portion of a substrate, which is used for supporting a plurality of substrate pieces after being cut and separated by the adhesive layer and supporting the peripheral portion of the substrate while supporting the substrate through the adhesive layer A frame and a plurality of one-side inner frame frames parallel to each other extending in a horizontal direction or a vertical direction of the matrix-like arrangement corresponding to the matrix-like arrangement of the plurality of board pieces on one side surface of the substrate; The one-side inner frame frame has a plurality of bonding surface protruding portions provided to protrude toward the substrate corresponding to each substrate piece, and each bonding surface protruding portion and each substrate piece The protective film is That Te is adapted to be adhered to each other is a substrate jig according to claim.

  According to the present invention, each adhesive surface protrusion of the one side inner frame frame and the protective film of each substrate piece are bonded to each other by the adhesive layer, so that the plurality of substrate pieces after being separated by cutting are separated by the adhesive layer. It will continue to be supported reliably. Therefore, etching can be performed even when the substrate is held in the vertical direction, and the substrate piece after being cut and separated can be efficiently taken out. Moreover, since each board | substrate piece is supported by the adhesion layer, it can hold | maintain, without damaging each board | substrate piece. Further, since the adhesive surface protrusion is provided on the one-side inner frame frame, a gap is secured between the one-side inner frame frame and the substrate in a region other than the adhesive surface protrusion. As a result, the etchant enters between the inner frame frame on one side and the substrate, and etching can be performed efficiently from both sides of the substrate. Therefore, there is no need to perform the substrate etching and cleaning operations a plurality of times. The production efficiency of the piece is improved.

  Preferably, the protrusion height of each bonding surface protrusion is 3 mm or more. In this case, it is effectively prevented that the distance between the one side inner frame frame and the substrate is too narrow and the flow of the etching solution is inhibited.

  Preferably, the dimension in the width direction of the one-side inner frame frame of each bonding surface protrusion is smaller than the dimension of each substrate piece in the width direction, and the length of the one-side inner frame frame in each bonding surface protrusion. The dimension in the vertical direction is smaller than the dimension of each substrate piece in the length direction. In this case, it is prevented that the adhesive surface protrusion is arranged on the outline of each substrate piece and the flow of the etching solution on the outline is hindered, and the substrate piece having a desired shape is cut and separated. Is promoted.

  Preferably, the shape of the outer peripheral edge of each adhesive surface protrusion is a shape having a convex streamline portion on the outer side when viewed in the protruding direction of each adhesive surface protrusion. In this case, it is facilitated that the etching solution flows into the downstream region in the flow direction of the etching solution with respect to each bonding surface protrusion. For this reason, it is suppressed that each adhesion surface protrusion interferes with the formation of a region where the etchant stays and the etching effect is reduced.

  Preferably, the substrate jig includes a plurality of parallel jigs extending in a horizontal direction or a vertical direction of the matrix-like arrangement on the other side surface of the substrate, corresponding to the matrix-like arrangement of the plurality of substrate pieces. The other inner frame frame further includes a book, and the other inner frame frame has a plurality of substrate piece pressing portions provided so as to protrude toward the substrate corresponding to each substrate piece. In this case, since the undulating movement of each substrate piece in the flowing etching solution is suppressed by the substrate piece pressing portion, the substrate piece is prevented from being destroyed during the etching. Further, by providing the protruding portion on the other side inner frame frame, a gap is secured between the other side inner frame frame and the substrate in a region other than the protruding portion. Thereby, the etching solution enters between the other side inner frame frame and the substrate, and the etching can be efficiently performed from both sides of the substrate. Further, if the substrate piece pressing portion and the protective film of each substrate piece are also bonded to each other by the adhesive layer, each substrate piece can be supported from both sides. Furthermore, since the strength of the outer frame can be increased to a desired level or more even when the one-side inner frame is removed from the outer frame, the outer frame can be handled easily.

  Preferably, the protruding height of each substrate piece pressing portion is 3 mm or more. In this case, it is effectively prevented that the distance between the other inner frame and the substrate is too narrow and the flow of the etching solution is hindered.

  Preferably, the dimension of the other side inner frame frame of each board piece pressing part is smaller than the dimension of each board piece in the width direction, and the length of the other side inner frame frame of each board piece holding part. The dimension in the vertical direction is smaller than the dimension of each substrate piece in the length direction. In this case, it is prevented that the substrate piece pressing portion is arranged on the outline of each substrate piece and the flow of the etching solution on the outline is hindered, and the substrate piece having a desired shape is cut and separated. Is promoted.

  Preferably, when viewed in the protruding direction of each substrate piece pressing portion, the shape of the outer peripheral edge of each substrate piece pressing portion is a shape having a convex streamline portion on the outside. In this case, it is promoted that the etching solution also flows into the downstream region in the flow direction of the etching solution with respect to each substrate piece pressing portion. For this reason, it is suppressed that each board | substrate piece holding | suppressing part obstructs and the area | region where an etching liquid stays is formed, and an etching effect falls.

  Alternatively, according to the present invention, when a plurality of substrate pieces are cut and separated in a matrix form from a single substrate by etching, at least one of the substrates provided with protective films on both sides so that the outlines of the plurality of substrate pieces are exposed. A substrate jig used for supporting a side surface via an adhesive layer and continuing to support a plurality of substrate pieces after being separated by the adhesive layer, for supporting a peripheral portion of the substrate An outer frame frame, and a plurality of one-side inner frame frames parallel to each other extending in a horizontal direction or a vertical direction of the matrix-like arrangement on one side surface of the board corresponding to the matrix-like arrangement of the plurality of board pieces The one-side inner frame frame has a plurality of adhesive surface protrusions provided so as to protrude toward the substrate corresponding to each substrate piece. One piece using tools A substrate piece manufacturing method for cutting and separating a plurality of substrate pieces from a substrate by etching, and preparing a substrate provided with protective films on both sides so that the outlines of the plurality of substrate pieces are exposed in a matrix form; The step of supporting the peripheral edge portion of the substrate by the outer frame frame and the one side surface of the substrate corresponding to the matrix arrangement of the plurality of substrate pieces so as to extend in the horizontal direction or the vertical direction of the matrix arrangement. And a step of assembling a plurality of one-side inner frame frames parallel to each other so that the bonding surface protrusions of the one-side inner frame frame face each substrate piece; And in the step of assembling the plurality of one-side inner frame frames to the outer frame frame, each adhesive surface protrusion and the protective film of each substrate piece are bonded to each other by an adhesive layer. A method for producing a substrate piece to symptoms.

  According to the present invention, each adhesive surface protrusion of the one side inner frame frame and the protective film of each substrate piece are bonded to each other by the adhesive layer, so that the plurality of substrate pieces after being separated by cutting are separated by the adhesive layer. Continue to be supported. Therefore, etching can be performed even when the substrate is held in the vertical direction, and the substrate piece after being cut and separated can be efficiently taken out. Moreover, since each board | substrate piece is supported by the adhesion layer, it can hold | maintain, without damaging each board | substrate piece. Further, since the adhesive surface protrusion is provided on the one-side inner frame frame, a gap is secured between the one-side inner frame frame and the substrate in a region other than the adhesive surface protrusion. As a result, the etchant enters between the inner frame frame on one side and the substrate, and etching can be performed efficiently from both sides of the substrate. Therefore, there is no need to perform the substrate etching and cleaning operations a plurality of times. The production efficiency of the piece is improved.

  Preferably, the substrate jig corresponds to the matrix arrangement of the plurality of substrate pieces on the other side surface of the substrate, and a plurality of parallel jigs extending in the horizontal direction or the vertical direction of the matrix arrangement. The other side inner frame frame further includes a plurality of board piece pressing portions provided so as to protrude toward the board corresponding to each board piece. The method for manufacturing a piece includes the other side inner frame extending in a horizontal direction or a vertical direction of the matrix-like arrangement on the other side surface of the substrate, corresponding to the matrix-like arrangement of the plurality of board pieces. The method further includes the step of assembling a plurality of other inner frame frames parallel to each other to the outer frame frame so that the substrate piece pressing portions of the frame face each other. In this case, the undulating movement of each substrate piece in the flowing etching solution is suppressed by the substrate piece pressing portion, and as a result, the substrate piece is prevented from being destroyed (stress destruction) during the etching. Moreover, since the gap is secured between the other side inner frame frame and the substrate by providing the projecting portion on the other side inner frame frame, an etching solution enters between the both sides and from both sides of the substrate. Etching can be performed efficiently. Furthermore, since the strength of the outer frame can be increased to a desired level or more even when the one-side inner frame is removed from the outer frame, the outer frame can be handled easily.

  Preferably, in the step of assembling a plurality of other inner frame frames to the outer frame frame, each substrate piece pressing portion and the protective film of each substrate piece are bonded to each other by the adhesive layer. In this case, each substrate piece can be held from both sides.

  According to the present invention, each adhesive surface protrusion of the one side inner frame frame and the protective film of each substrate piece are bonded to each other by the adhesive layer, so that the plurality of substrate pieces after being separated by cutting are separated by the adhesive layer. It will continue to be supported reliably. Therefore, etching can be performed even when the substrate is held in the vertical direction, and the substrate piece after being cut and separated can be efficiently taken out. Moreover, since each board | substrate piece is supported by the adhesion layer, it can hold | maintain, without damaging each board | substrate piece. Further, since the adhesive surface protrusion is provided on the one-side inner frame frame, a gap is secured between the one-side inner frame frame and the substrate in a region other than the adhesive surface protrusion. As a result, the etchant enters between the inner frame frame on one side and the substrate, and etching can be performed efficiently from both sides of the substrate. Therefore, there is no need to perform the substrate etching and cleaning operations a plurality of times. The production efficiency of the piece is improved.

1 is a one-side perspective view schematically showing a substrate jig in a state where a substrate is held according to a first embodiment of the present invention. The other side perspective view which shows schematically the jig | tool for board | substrates of the state holding the board | substrate shown in FIG. The other side perspective view which shows the outer frame frame and 1 side inner frame frame of the jig | tool for board | substrates shown in FIG. The one side perspective view which shows the other side inner frame frame of the jig | tool for board | substrates shown in FIG. The figure for demonstrating the dimension of an adhesion surface protrusion part and a board | substrate piece pressing part. Specifically, FIG. 5A is a one-side front view showing the relationship between the protective film of each substrate piece and the bonding surface protrusion of the one-side inner frame frame, and FIG. It is the other side front view which shows the relationship between a protective film and the board | substrate piece pressing part of the other side inner frame frame. The figure for demonstrating the dimension and protrusion height of an adhesion surface protrusion part and a board | substrate piece pressing part. Specifically, FIG. 6A is a sectional view taken along line VIa-VIa in FIG. 5A, and FIG. 6B is a sectional view taken along line VIb-VIb in FIG. The perspective view which shows the board | substrate with which the protective film was provided. The figure for demonstrating a mode that the board | substrate piece after cutting-separating is continued being supported by the adhesive. The other side perspective view which shows the outer frame frame and the one side inner frame frame of the jig | tool for a board | substrate by the 2nd Embodiment of this invention. The one side perspective view which shows the other side inner frame frame by embodiment shown in FIG. The one side front view which shows the relationship between the adhesion surface protrusion part of the one side inner frame flame | frame shown in FIG. 9, and the protective film of each board | substrate piece. The other side front view which shows the relationship between the board | substrate piece pressing part of the other side inner frame frame shown in FIG. 10 assembled | attached to the outer frame frame shown in FIG. 9, and the protective film of each board | substrate piece. The figure which shows the example of the shape which has an outward convex streamline part. Specifically, FIG. 13A is a diagram showing a circular shape, and FIG. 13B is a diagram showing a shape composed of two arc portions. The figure for demonstrating a mode that the some adhesion surface protrusion part thru | or board piece holding | suppressing part are arrange | positioned with respect to each board | substrate piece. The figure for demonstrating the method of cut-separating a glass substrate piece using half etching. The figure for demonstrating the method of cut-separating a glass substrate piece using half etching. The figure for demonstrating the method of cut-separating a glass substrate piece using half etching.

  The first embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a one-side perspective view schematically showing a substrate jig holding a substrate according to a first embodiment of the present invention. FIG. 2 is a perspective view of the other side schematically showing the substrate jig in a state where the substrate shown in FIG. 1 is held. FIG. 3 is a perspective view of the other side showing the outer frame frame and the one side inner frame frame of the substrate jig shown in FIG. 1. 4 is a one-side perspective view showing the other inner frame of the substrate jig shown in FIG. FIG. 5 is a diagram for explaining the dimensions of the bonding surface protrusion and the substrate piece pressing portion. Specifically, FIG. 5A is a one-side front view showing the relationship between the protective film of each substrate piece and the bonding surface protrusion of the one-side inner frame frame, and FIG. It is the other side front view which shows the relationship between a protective film and the board | substrate piece pressing part of the other side inner frame frame. Moreover, FIG. 6 is a figure for demonstrating the dimension and protrusion height of an adhesion surface protrusion part and a board | substrate piece pressing part. Specifically, FIG. 6A is a sectional view taken along line VIa-VIa in FIG. 5A, and FIG. 6B is a sectional view taken along line VIb-VIb in FIG.

  As shown in FIGS. 1, 2, and 6, the substrate jig 1 according to the present embodiment includes a plurality of substrate pieces 3 that are separated from each other by a plurality of substrate pieces 3 in a matrix form by etching. At least one side surface of the substrate 2 provided with the protective film 4 on both sides is supported via the adhesive layer 6 so that the outline 5 of the substrate piece 3 is exposed, and the plurality of substrate pieces 3 after being cut and separated are adhered. It is used to continue to be supported by the layer 6. In the present embodiment, a glass substrate is used as the substrate 2 and a hydrofluoric acid-based solution is used as an etching solution.

  As shown in FIGS. 1 and 3, the substrate jig 1 of the present embodiment includes an outer frame frame 7 for supporting the peripheral edge of the substrate 2, and a plurality of substrate pieces 3 on one side surface of the substrate 2. Corresponding to the 3 × 5 matrix arrangement of 15 substrate pieces 3 arranged in the horizontal direction and 5 in the vertical direction, specifically the horizontal direction of the matrix arrangement. Alternatively, a plurality of (three in the present embodiment) one-side inner frame 10 extending in the vertical direction (vertical direction in the present embodiment) are provided. As shown in FIG. 3, the one-side inner frame frame 10 has a plurality of bonding surface protrusions 10 a provided so as to protrude toward the substrate 2 corresponding to each substrate piece 3. 6 (a) and 6 (b), each adhesive surface protrusion 10a and the protective film 4 of each substrate piece 3 are bonded to each other by the adhesive layer 6.

  As shown in FIG. 2 and FIG. 4, the substrate jig 1 of the present embodiment further corresponds to the matrix-like arrangement of the plurality of substrate pieces 3 on the other side of the substrate 2. A plurality of (in the present embodiment, five) other inner frame frames 8 extending in the horizontal direction or the vertical direction (in the present embodiment, the horizontal direction) of the arrangement are provided. The other inner frame 8 has a plurality of substrate piece pressing portions 8 a provided so as to protrude toward the substrate 2 corresponding to each substrate piece 3.

  The outer frame 7 will be described in detail with reference to FIG. In the present embodiment, the outer frame 7 has a rectangular shape as a whole as shown in FIG. A groove 9 that accommodates at least a part of the peripheral edge of the substrate 2 is formed in the inner peripheral portion of the outer frame frame 7. The outer frame 7 is made of an etching-resistant material, for example, vinyl chloride having excellent resistance to a hydrofluoric acid solution. However, the outer frame 7 may be made of polytetrafluoroethylene or polyethylene.

  In the present embodiment, as shown in FIG. 3, the outer frame frame 7 has three one-side inner frame frames 10 corresponding to the 3 × 5 matrix arrangement of the plurality of substrate pieces 3. They are assembled in parallel to each other so as to extend in the vertical direction of the matrix arrangement, and in the case of the present embodiment, they are non-detachable. Thus, the strength of the outer frame 7 is increased to a desired level or more, and the outer frame 7 is easy to handle. But the one side inner frame frame 10 may be comprised integrally with the outer frame frame 7, and may be detachably assembled | attached with respect to the outer frame frame 7 with the volt | bolt, for example.

  The one-side inner frame 10 is also made of an etching-resistant material, for example, vinyl chloride having excellent resistance to a hydrofluoric acid solution. However, the one-side inner frame 10 may also be made of polytetrafluoroethylene or polyethylene.

  In the present embodiment, the one-side inner frame frame 10 is an elongated plate-like member having a rectangular shape as a whole, as shown in FIGS. In the case of the present embodiment, each of the one-side inner frame frame 10 has five bonding surface protrusions so that a plurality of bonding surface protrusions 10a protruding on one side of the one-side inner frame frame 10 are formed. It is bent so that the portion 10a is formed.

  When the one inner frame 10 is assembled to the outer frame 7 so as to correspond to the matrix-like arrangement of the plurality of substrate pieces 3, the plurality of adhesion surface protrusions 10 a correspond to each substrate piece. It is positioned so that every three can be arranged correspondingly.

  In the present embodiment, as shown in FIG. 1, each adhesive surface protruding portion 10 a has one side inner frame frame 10 assembled to the outer frame frame 7 so as to correspond to the matrix-like arrangement of the plurality of substrate pieces 3. Sometimes, the dimension is determined such that each adhesive surface protrusion 10 a is disposed inside the outline 5 of each substrate piece 3 when viewed in the protruding direction of the adhesive surface protrusion 10 a. Specifically, as shown in FIG. 5A, the dimension f in the width direction of the inner frame 10 on one side of each bonding surface protrusion 10a is smaller than the dimension b of each substrate piece 3 in the width direction. Moreover, as shown to Fig.6 (a), the dimension g of the length direction of the one side inner frame 10 of each adhesion surface protrusion part 10a is smaller than the dimension a of each board | substrate piece 3 in the said length direction.

  Moreover, the protrusion height j of each adhesion surface protrusion part 10a is 3 mm or more in this Embodiment, More preferably, it is 5 mm or more.

  As shown in FIG. 2, in the present embodiment, the outer frame frame 7 includes five other inner frame frames 8 corresponding to the 3 × 5 matrix arrangement of the plurality of substrate pieces 3. They are assembled in parallel with each other so as to extend in the lateral direction of the matrix-like arrangement, for example, detachably by bolts.

  The other side inner frame 8 is also made of an etching-resistant material, for example, vinyl chloride having excellent resistance to a hydrofluoric acid solution. However, the other inner frame 8 may be made of polytetrafluoroethylene or polyethylene.

  In the present embodiment, the other inner frame 8 is an elongated rectangular plate-like member as shown in FIG. In the case of the present embodiment, each of the other inner frame frames 8 has three substrate pressing portions 8a so that a plurality of substrate pressing portions 8a protruding on one side of the other inner frame frame 8 are formed. Is bent so that is formed. When the other inner frame frame 8 is assembled to the outer frame frame 7 so as to correspond to the matrix arrangement of the plurality of substrate pieces 3, each of the substrate holders 8 a is provided for each substrate piece 3. It is positioned so that it can be arranged corresponding to.

  In the present embodiment, as shown in FIG. 2, each substrate piece pressing portion 8 a is assembled with the other inner frame frame 8 on the outer frame frame 7 corresponding to the matrix arrangement of the plurality of substrate pieces 3. Sometimes, each substrate piece pressing portion 8a is dimensioned so as to be disposed inside the outline 5 of each substrate piece 3 when viewed in the protruding direction of the substrate piece pressing portion 8a. Specifically, as shown in FIG. 5B, the dimension i in the width direction of the other inner frame 8 of each board piece pressing portion 8a is smaller than the dimension a of each board piece 3 in the width direction. Further, as shown in FIG. 6B, the dimension h in the length direction of the other inner frame 8 of each substrate piece pressing portion 8a is smaller than the dimension of each substrate piece b in the length direction.

  The protrusion height k of each substrate piece pressing portion 8a is 3 mm or more, more preferably 5 mm or more in the present embodiment. In the example shown in FIG. 6B, the substrate piece pressing portion 8a is in contact with the opposing protective film 4 in the state where it is assembled to the outer frame 7 on which the substrate 2 is supported. As long as it is close enough to the protective film 4 to suppress the undulating movement of each substrate piece 3 by the flowing etching solution, it does not need to be in contact with the protective film 4.

  The pressure-sensitive adhesive layer 6 is made of an etching-resistant material, and protrudes between the adhesive surfaces between the adhesive surface protrusions 10a of the inner frame frame 10 on one side and the protective film 4 on each side of the substrate pieces 3. It is arranged in a plane facing each substrate piece 3 of the portion 10a. Specifically, in the present embodiment, as shown in FIG. 6A, the adhesive layer 6 has a longitudinal dimension m in the length direction of the one-side inner frame 10 of the bonding surface protrusion 10a. It is smaller than the dimension g, and is formed so that the dimension n in the horizontal direction is smaller than the dimension f in the width direction of the inner frame 10 on one side of the bonding surface protrusion 10a. As the pressure-sensitive adhesive layer 6, for example, a double-sided tape in which an acrylic pressure-sensitive adhesive is applied to both surfaces of a tape base material can be employed. The adhesive force of the adhesive layer 6 is such that the substrate 2 can continue to be supported even in a flowing etching solution, and each substrate piece 3 that is cut and separated during etching does not fall into the etching solution. It is determined appropriately in consideration of the weight of each substrate piece 3 and the like. For example, the adhesive layer 6 having an adhesive force of 30 N / 25 mm and having a length of about 10 mm is applied to the substrate 2 having a size of 365 mm × 450 mm in a plan view and a weight of about 250 g. May be provided at a total of 15 locations for each substrate piece 3. Furthermore, the adhesive strength of the adhesive layer 6 is appropriately determined in consideration of the ease of removal of the substrate pieces 3 when the substrate pieces 3 are removed from the bonding surface protrusions 10a after etching.

  Further, in the present embodiment, as shown in FIG. 6, the adhesive layer 6 is disposed between each of the adhesive surface protrusions 10a and the protective film 4 facing the adhesive layer 6, but holds each substrate piece 3 from both sides. In order to obtain it, you may arrange | position also between each protective film 4 which opposes each board | substrate piece pressing part 8a.

  Next, the operation of the present embodiment configured as described above will be described with reference to FIGS. FIG. 7 is a perspective view showing the substrate 2 provided with the protective film 4. FIG. 8 is a diagram for explaining a state in which the substrate piece 3 after being cut and separated by etching is continuously supported by the adhesive layer 6 in the substrate jig 1 of FIG.

  First, as shown in FIG. 7, the protective film 4 is formed on a single substrate 2 so that the outlines 5 of 15 rectangular substrate pieces 3 are exposed in total, three in the horizontal direction and five in the vertical direction. Affixed on both sides.

  Next, as the adhesive layer 6, a double-sided tape in which an acrylic adhesive is applied to both sides of the tape base material is prepared. As shown in FIG. 3, each adhesive surface protrusion 10a of the one-side inner frame frame 10 is prepared. In addition, one side surface of the adhesive layer 6 is adhered. Thereafter, the peripheral edge of the substrate 2 is supported by the outer frame frame 7. At this time, as shown in FIG. 6, the other side surface of each adhesive layer 6 on each adhesive surface protrusion 10 a of the one side inner frame frame 10 assembled to the outer frame frame 7 is opposed to the adhesive surface protrusion 10 a. One side surface of the protective film 4 to be bonded is adhered to each other.

  Next, on the other side of the substrate 2, the five other inner frame frames 8 extend in the lateral direction of the arrangement of the substrate pieces 3 in correspondence with the 3 × 5 matrix arrangement of the substrate pieces 3. And each board | substrate piece holding | suppressing part 8a is assembled | attached to the outer frame frame 7 so that it may be arrange | positioned facing each board | substrate piece 3. FIG.

  As described above, the substrate 2 supported by the substrate jig 1 is immersed, for example, in the etching solution tank in the vertical direction. At this time, since a sufficiently large gap is secured between the protective film 4 and the one-side inner frame 10 and the other-side inner frame 8 at least on the outline 5 of each substrate piece 3, The etching solution is also supplied to the region between the film 4 and the one inner frame frame 10 and the other inner frame frame 8.

  By supplying the etching solution, a plurality of substrate pieces 3 are cut and separated from the substrate 2 by etching. As shown in FIG. 8, the cut and separated substrate piece 3 is continuously supported by the adhesive layer 6. For this reason, there is no possibility that the cut and separated substrate pieces 3 come into contact with other substrate pieces 3 and the outer frame frame 7 and are damaged.

  As described above, according to the present embodiment, the adhesive surface protrusions 10a of the one-side inner frame frame 10 and the protective film 4 of the substrate pieces 3 are bonded to each other by the adhesive layer 6, so that they are cut and separated. The plurality of subsequent substrate pieces 3 are reliably supported by the adhesive layer 6. Therefore, etching can be performed even when the substrate 2 is held in the vertical direction, and the substrate piece 3 after being cut and separated can be efficiently taken out. Moreover, since each board piece 3 is supported by the adhesion layer 6, it can hold | maintain, without damaging each board piece 3. FIG. Further, since the bonding surface protruding portion 10a is provided on the one-side inner frame frame 10, a gap is secured between the one-side inner frame frame 10 and the substrate 2 in a region other than the bonding surface protruding portion 10a. . As a result, the etchant enters between the one side inner frame 10 and the substrate 2 so that the etching can be efficiently performed from both sides of the substrate 2, and therefore the substrate 2 needs to be etched and cleaned a plurality of times. The manufacturing efficiency of the substrate piece 3 is improved.

  In addition, since the protruding height j of each bonding surface protruding portion 10a is 3 mm or more, the distance between the one-side inner frame frame 10 and the substrate 2 is too narrow and the flow of the etching solution is hindered. Is prevented.

  Further, the dimension f in the width direction of the inner frame frame 10 on one side of each bonding surface protrusion 10a is smaller than the dimension b of each substrate piece 3 in the width direction, and the inner frame frame 10 on one side of each bonding surface protrusion 10a. The dimension g in the length direction is smaller than the dimension a of each substrate piece in the length direction. For this reason, it is prevented that the adhesion surface protrusion part 10a is arrange | positioned on the outline 5 of each board | substrate piece 3, and the flow of the etching liquid on the outline 5 is prevented, and the board | substrate piece 3 of a desired shape is cut | disconnected. Separation is promoted.

  Further, the substrate jig 1 corresponds to the matrix-like arrangement of the plurality of substrate pieces 3 on the other side surface of the substrate 2, and a plurality of parallel jigs extending in the horizontal direction or the vertical direction of the matrix-like arrangement are provided. The other side inner frame frame 8 further includes a plurality of substrate piece pressing portions 8 a provided so as to protrude toward the substrate 2 corresponding to each substrate piece 3. Yes. Thereby, since the undulating movement of each substrate piece 3 in the flowing etching solution is suppressed by the substrate piece pressing portion 8a, the substrate piece 3 is prevented from being broken during the etching. Further, by providing the protruding portion on the other side inner frame frame 8, a gap is secured between the other side inner frame frame 8 and the substrate 2 in a region other than the protruding portion. As a result, the etchant enters between the other side inner frame 8 and the substrate 2, so that the etching can be efficiently performed from both sides of the substrate 2. Moreover, if the board | substrate piece holding | suppressing part 8a and the protective film 4 of each board | substrate piece 3 are also mutually adhere | attached by the adhesion layer 6, each board | substrate piece 3 can be supported from both sides. Furthermore, since the strength of the outer frame 7 can be increased to a desired level or more even when the one-side inner frame 10 is detached from the outer frame 7, the handling of the outer frame 7 is easy.

  Moreover, the protrusion height of each board | substrate piece pressing part 8a is 3 mm or more. For this reason, it is effectively prevented that the distance between the other inner frame 8 and the substrate 2 is too narrow and the flow of the etching solution is inhibited.

  In addition, the dimension i in the width direction of the other inner frame frame 8 of each substrate piece pressing portion 8a is smaller than the dimension a of each substrate piece 3 in the width direction, and the other inner frame frame 8 of each substrate piece pressing portion 8a. The dimension h in the length direction is smaller than the dimension b of each substrate piece in the length direction. For this reason, it is prevented that the board | substrate piece holding | suppressing part 8a is arrange | positioned on the outline 5 of each board | substrate piece 3, and the flow of the etching liquid on the outline 5 is prevented, and the board | substrate piece 3 of a desired shape is cut | disconnected. Separation is promoted.

  Next, a second embodiment of the substrate jig according to the present invention will be described with reference to FIGS.

  FIG. 9 is a perspective view of the other side showing the outer frame frame and one side inner frame frame of the substrate jig according to the second embodiment of the present invention, and FIG. 10 is according to the embodiment shown in FIG. It is the one side perspective view which shows an other side inner frame frame. 11 is a one-side front view showing the relationship between the adhesive surface protrusion of the one-side inner frame frame shown in FIG. 9 and the protective film of each substrate piece, and FIG. 12 is the outer-frame frame shown in FIG. It is the other side front view which shows the relationship between the board | substrate piece holding | suppressing part of the other side inner frame frame shown in FIG.

  The substrate jig 1 ′ of the present embodiment has a shape in which the shape of the outer peripheral edge of the bonding surface protrusion 10 a ′ has a convex streamline portion on the outside as viewed in the protruding direction of each bonding surface protrusion 10 a ′. Is different. Further, in the substrate jig 1 ′ of the present embodiment, the shape of the outer peripheral edge of each substrate piece pressing portion 8 a ′ is a streamline portion protruding outward as viewed in the protruding direction of each substrate piece pressing portion 8 a ′. It is different in that it has a shape having. Other configurations of the substrate jig 1 ′ of the present embodiment are substantially the same as those of the substrate jig of the first embodiment shown in FIGS. In the embodiment shown in FIGS. 9 to 14, the same parts as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the present embodiment, the plurality of bonding surface protrusions 10a ′ are plate-like members that are separate from the one-side inner frame 10 ′, and as shown in FIGS. It is fixed to the inner frame 10 ′ with screws or the like. The adhesive surface protrusion 10a ′ is made of an etching resistant material, for example, vinyl chloride having excellent resistance to a hydrofluoric acid solution. However, the adhesion surface protruding portion 10a ′ may be made of polytetrafluoroethylene or polyethylene.

  When one side inner frame frame 10 ′ is assembled to the outer frame frame 7 so as to correspond to the matrix arrangement of the plurality of substrate pieces 3, the plurality of adhesion surface protrusions 10a ′ Each substrate piece 3 is positioned so as to be arranged correspondingly.

  In the present embodiment, the shape of the outer peripheral edge of each bonding surface protrusion 10a ′ is a circular shape as a whole as shown in FIG. 13A when viewed in the protruding direction of each bonding surface protrusion 10a ′. Any other shape can be adopted as long as the shape allows the etchant to circulate to the downstream region in the flow direction of the etchant with respect to each bonding surface protrusion 10a ′ during the etching. For example, FIG. The shape which consists of two circular arc parts as shown in FIG.

  In the present embodiment, as shown in FIG. 11, each bonding surface protruding portion 10 a is assembled such that one side inner frame frame 10 ′ is attached to the outer frame frame 7 corresponding to the matrix arrangement of the plurality of substrate pieces 3. The adhesive surface protrusions 10a ′ are dimensioned so as to be disposed inside the contour 5 of each substrate piece 3 when viewed in the protruding direction of the adhesive surface protrusions 10a ′. Specifically, as shown in FIG. 11, the dimension f in the width direction of one inner frame 10 ′ of each bonding surface protrusion 10a ′ is smaller than the dimension b of each substrate piece 3 in the width direction. Further, the dimension g in the length direction of the inner frame 10 on one side of each bonding surface protrusion 10a is smaller than the dimension a of each substrate piece 3 in the length direction.

  The thickness of each bonding surface protrusion 10a ′ corresponds to the protrusion height j of each bonding surface protrusion 10a ′ shown in FIG. 6A, and in this embodiment is 3 mm or more, more preferably 5 mm or more. .

  In the present embodiment, the plurality of substrate piece pressing portions 8a ′ are plate-like members that are separate from the other side inner frame 8 ′, and as shown in FIGS. 10 and 12, the other side is straight as a whole. It is fixed to the inner frame 8 'with screws or the like. The substrate piece pressing portion 8a ′ is also made of an etching-resistant material, for example, vinyl chloride having excellent resistance to a hydrofluoric acid-based solution. However, the substrate piece pressing portion 8a ′ may also be made of polytetrafluoroethylene or polyethylene.

  When the other inner frame frame 8 ′ is assembled to the outer frame frame 7 so as to correspond to the matrix-like arrangement of the plurality of substrate pieces 3, the plurality of substrate piece holders 8a ′ Each substrate piece 3 is positioned so as to be arranged correspondingly.

  In the present embodiment, the shape of the outer peripheral edge of each substrate piece pressing portion 8a ′ is a circular shape as a whole as shown in FIG. 13A when viewed in the protruding direction of each substrate piece pressing portion 8a ′. Other shapes can be adopted as long as the shape allows the etching solution to flow around the downstream region in the flow direction of the etching solution with respect to each substrate piece pressing portion 8a ′ during the etching. For example, FIG. The shape which consists of two circular arc parts as shown in FIG.

  In this embodiment, each substrate piece pressing portion 8a ′ is assembled with the other inner frame frame 8 ′ corresponding to the matrix arrangement of the plurality of substrate pieces 3 on the outer frame frame 7, as shown in FIG. When squeezed, the size is determined such that each substrate piece pressing portion 8 a ′ is disposed inside the outline 5 of each substrate piece 3 when viewed in the protruding direction of the substrate piece pressing portion 8 a ′. Specifically, as shown in FIG. 12, the dimension i in the width direction of the other inner frame 8 ′ of each board piece pressing portion 8 a ′ is smaller than the dimension a of each board piece 3 in the width direction. Further, as shown in FIG. 12, the dimension h in the length direction of the other inner frame 8 'of each board piece pressing portion 8a' is smaller than the dimension of each board piece b in the length direction.

  The thickness of each substrate piece pressing portion 8a ′ corresponds to the protruding height k of each substrate piece pressing portion 8a ′ shown in FIG. 6B, and in this embodiment is 3 mm or more, more preferably 5 mm or more. .

  In the present embodiment, one adhesive surface protruding portion 10a ′ and one substrate piece pressing portion 8a ′ are arranged on one side with respect to each substrate piece 3 as shown in FIGS. Although provided in the inner frame 10 ′ or the other inner frame 8 ′, a plurality may be provided in parallel according to the shape of each substrate piece 3, as shown in FIG. In this case, it is preferable that the plurality of adhesive surface protrusions 10a ′ to the plurality of substrate piece pressing portions 8a ′ provided for one substrate piece 3 are arranged apart from each other, and adjacent adhesive surface protrusions. The interval w of 10a ′ or the interval w of adjacent substrate piece pressing portions 8a ′ is preferably 1 mm or more, more preferably 3 mm or more, and most preferably 5 mm or more. Further, as shown in FIG. 14, one side inner frame 10 ′ or other side inner frame of the plurality of bonding surface protruding portions 10 a ′ or the plurality of substrate piece pressing portions 8 a ′ provided for one substrate piece 3. The distance g ′ (h ′) between the two outermost points in the length direction of the frame 8 ′ is smaller than the dimension of each substrate piece b in the length direction.

  Next, the operation of the present embodiment configured as described above will be described.

  In the present embodiment, during etching of the substrate piece 3, the etching solution is guided along the outer peripheral edge of each adhesion surface protrusion 10 ′ and each substrate piece pressing portion 8 a ′. It is promoted that the substrate piece pressing portion 8a ′ also wraps around the downstream region in the flow direction of the etching solution. Other operations are substantially the same as those of the first embodiment.

  As described above, according to the present embodiment, the shape of the outer peripheral edge of each bonding surface protrusion 10a ′ has a streamline portion protruding outward as viewed in the protruding direction of each bonding surface protrusion 10a ′. Shape. In this case, it is promoted that the etching solution also wraps around the downstream region in the flow direction of the etching solution with respect to each bonding surface protrusion 10a ′. For this reason, it is suppressed that each adhesion surface protrusion part 10a 'gets in the way and the area | region where an etching stays is formed, and an etching effect falls.

  Further, when viewed in the protruding direction of each substrate piece pressing portion 8a ′, the shape of the outer peripheral edge of each substrate piece pressing portion 8a ′ is a shape having a streamline portion protruding outward. For this reason, it is promoted that the etching solution also enters the downstream region in the flow direction of the etching solution with respect to each substrate piece pressing portion 8a ′. For this reason, it is suppressed that each board | substrate piece holding | suppressing part 8a 'gets in the way and the area | region where an etching stays is formed, and an etching effect falls.

DESCRIPTION OF SYMBOLS 1 Substrate jig 2 Substrate 3 Substrate piece 4 Protective film 5 Outline 6 Adhesive layer 7 Outer frame frame 8 One side inner frame frame 9 Groove 10 Other side inner frame frame 501 Glass substrate 502 Glass substrate piece 503 Protective film 504 Double-sided tape 505 Contour

Claims (11)

When a plurality of substrate pieces are cut and separated in a matrix form from a single substrate by etching, at least one side of the substrate provided with a protective film on both sides is exposed via an adhesive layer so that the outline of the plurality of substrate pieces is exposed. And a substrate jig used to continue supporting the plurality of substrate pieces after being separated by the adhesive layer,
An outer frame frame for supporting the peripheral edge of the substrate;
In one side surface of the substrate, corresponding to the matrix arrangement of the plurality of substrate pieces, a plurality of one-side inner frame frames parallel to each other extending in the horizontal direction or the vertical direction of the matrix arrangement,
With
The one side inner frame frame has a plurality of adhesive surface protrusions provided so as to protrude toward the substrate corresponding to each substrate piece,
A jig for a substrate, characterized in that each adhesive surface protrusion and a protective film of each substrate piece are bonded to each other by an adhesive layer. The substrate jig according to claim 1, wherein the protruding height of each bonding surface protruding portion is 3 mm or more. The dimension in the width direction of the one side inner frame frame of each bonding surface protrusion is smaller than the dimension of each substrate piece in the width direction,
3. The substrate jig according to claim 1, wherein a dimension in a length direction of the one-side inner frame frame of each adhesion surface protruding portion is smaller than a dimension of each substrate piece in the length direction. 4. The shape of the outer peripheral edge of each adhesive surface protrusion when viewed in the protruding direction of each adhesive surface protrusion is a shape having a streamlined portion protruding outward. The jig for substrates as described. The substrate jig is
In the other side surface of the substrate, corresponding to the matrix-like arrangement of the plurality of substrate pieces, further comprising a plurality of other inner frame frames parallel to each other extending in the horizontal direction or the vertical direction of the matrix-like arrangement,
The said other side inner frame frame has the some board | substrate piece holding | suppressing part provided so that it might protrude toward the board | substrate corresponding to each board | substrate piece, Any one of Claim 1 thru | or 4 characterized by the above-mentioned. A jig for a substrate according to any one of the above. 6. The substrate jig according to claim 5, wherein the protruding height of each substrate piece pressing portion is 3 mm or more. The dimension in the width direction of the other inner frame frame of each board piece pressing part is smaller than the dimension of each board piece in the width direction,
The substrate jig according to claim 5 or 6, wherein a dimension of the other inner frame frame of each substrate piece pressing portion in a length direction is smaller than a dimension of each substrate piece in the length direction. The shape of the outer peripheral edge of each substrate piece pressing portion when viewed in the protruding direction of each substrate piece pressing portion is a shape having a convex streamline portion on the outside. The jig for substrates as described. When a plurality of substrate pieces are cut and separated in a matrix form from a single substrate by etching, at least one side of the substrate provided with a protective film on both sides is exposed via an adhesive layer so that the outline of the plurality of substrate pieces is exposed. And a substrate jig used to continue supporting the plurality of substrate pieces after being separated by the adhesive layer,
An outer frame frame for supporting the peripheral edge of the substrate;
In one side surface of the substrate, corresponding to the matrix arrangement of the plurality of substrate pieces, a plurality of one-side inner frame frames parallel to each other extending in the horizontal direction or the vertical direction of the matrix arrangement,
With
The one-side inner frame frame has a plurality of bonding surface protruding portions provided so as to protrude toward the substrate corresponding to each substrate piece, using a substrate jig A method of manufacturing a substrate piece by cutting and separating a plurality of substrate pieces from a single substrate by etching,
Preparing a substrate provided with protective films on both sides so that the outlines of a plurality of substrate pieces are exposed in a matrix;
Supporting the peripheral edge of the substrate by an outer frame frame;
In one side surface of the substrate, corresponding to the matrix arrangement of the plurality of substrate pieces, the adhesive surface protrusions of the inner frame frame extend in the horizontal direction or the vertical direction of the matrix arrangement. Assembling a plurality of one-side inner frame frames parallel to each other to the outer frame frame such that the portions face each other for each substrate piece;
In the step of assembling the plurality of one-side inner frame frames to the outer frame frame, each adhesive surface protrusion and a protective film of each substrate piece are bonded to each other by an adhesive layer A manufacturing method of a piece. The substrate jig is
In the other side surface of the substrate, corresponding to the matrix-like arrangement of the plurality of substrate pieces, further comprising a plurality of other inner frame frames parallel to each other extending in the horizontal direction or the vertical direction of the matrix-like arrangement,
The other side inner frame frame has a plurality of substrate piece pressing portions provided to protrude toward the substrate corresponding to each substrate piece,
The manufacturing method of the substrate piece is as follows:
On the other side of the substrate, corresponding to the matrix arrangement of the plurality of substrate pieces, each substrate piece presser of the other inner frame frame extends in the horizontal direction or the vertical direction of the matrix arrangement. The board piece according to claim 9, further comprising a step of assembling a plurality of parallel inner side inner frame frames to the outer frame frame so that the portions face each other on each board piece. Production method. 11. The step of assembling a plurality of other inner frame frames to the outer frame frame, wherein each substrate piece pressing portion and the protective film of each substrate piece are bonded to each other by an adhesive layer. Method for manufacturing a substrate piece.

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