JP2015038991A - Semiconductor device manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technology of fixing an optical component to a sensor chip at high accuracy.SOLUTION: A semiconductor device manufacturing method comprises: after mounting a sensor chip 3 provided with a surface 3a having a sensor surface on which a plurality of light receiving elements are formed, face up on a wiring board 2, arranging adhesive materials at a plurality of places on the surface 3a of the sensor chip 3 to form a plurality of adhesive spacers SP1 by curing the adhesive materials; arranging paste adhesive materials 11a on the surface 3a of the sensor chip 3; arranging an optical component 5 held by a bonding tool 23 on the surface 3a of the sensor chip 3 via the spacers SP1 and the adhesive materials 11a; and subsequently, fixing the optical component 5 by removing the bonding tool 23 from the optical component 5 and curing the adhesive materials 11a without applying a load to the optical component 5.

Description

  The present invention relates to a method for manufacturing a semiconductor device, and more particularly to a technique effective when applied to a method for manufacturing a semiconductor device as a sensor module.

  Among sensor modules, there is a sensor module that uses a photoelectric conversion device that converts an optical signal into an electrical signal. This sensor module is used for various applications, for example, a vein authentication sensor that reads a vein pattern.

  Japanese Patent Application Laid-Open No. 2007-117397 (Patent Document 1) describes a technique related to an optical ecological sensor capable of reading a fingerprint or a vein pattern.

JP 2007-117397 A

  In the configuration of the conventional sensor module (here, the vein authentication sensor module is taken as an example), the optical component (lens) is arranged on the sensor chip (CMOS sensor chip) with a certain distance therebetween. The height (mounting height) was large.

  On the other hand, in recent years, since the sensor module has been required to be thin, a thin sensor module in which an optical component (protective layer) is directly bonded onto a sensor chip as described in Patent Document 1 has been studied.

  However, when the inventor of the present application examined the manufacture of such a thin sensor module, the following problems were discovered.

  That is, the positional deviation of the optical component with respect to the sensor chip.

  More specifically, when an optical component is fixed (arranged) on the sensor chip, a paste-like adhesive (fluid adhesive) is used. Even if it is arranged, it has been found that the optical component arranged on the sensor chip moves before the adhesive is cured.

  Therefore, the present inventor applied a method of curing the adhesive by applying heat to the adhesive while holding the optical component with a bonding tool so that the optical component does not move even if a paste-like adhesive is used. investigated. As a result, the positional displacement of the optical component in the horizontal direction with respect to the sensor chip could be suppressed, but the transmittance of the cured adhesive was reduced (interference fringe generation).

  When the cause was examined, it was found that the load of the bonding tool was applied to the adhesive until the adhesive was cured. Thereby, the thickness of the adhesive varied, and interference fringes were formed on the cured adhesive.

  As described above, when the optical component is bonded and fixed to the sensor chip, it is necessary to consider not only the measure against positional deviation in the horizontal direction but also the arrangement accuracy in the vertical direction (thickness direction).

  The technique disclosed in Patent Document 1 discloses disposing the protective film (13b) on the semiconductor layer (7) via the spacer (14), but the protective layer (13a) made of resin is cured. There is a possibility that the position of the arranged protective film (13b) is shifted before it is completely cut (the reference numerals in parentheses described here correspond to the reference numerals of Patent Document 1).

  An object of the present invention is to provide a technique capable of arranging (fixing) an optical component on a sensor chip with high accuracy.

  Another object of the present invention is to provide a technique capable of improving the performance of a semiconductor device.

  The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

  A method of manufacturing a semiconductor device according to a representative embodiment includes mounting a sensor chip having a surface having a sensor region in which a plurality of pixels are formed on a top surface of a wiring substrate, and then mounting the surface of the sensor chip. A plurality of first adhesives are disposed on the surface of the sensor chip by disposing the first adhesive at a plurality of locations and curing the first adhesive. Then, after placing the paste-like second adhesive material on the surface of the sensor chip, the first optical component having the light shielding layer in which the plurality of optical regions are formed is applied to the first optical component while applying a load. It arrange | positions on the surface of a sensor chip via a 1st spacer and a 2nd adhesive material. Thereafter, the first optical component is fixed by curing the second adhesive without applying a load to the first optical component.

  Among the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows.

  According to a typical embodiment, an optical component can be arranged (fixed) on a sensor chip with high accuracy.

  In addition, the performance of the semiconductor device can be improved.

It is a top view of the sensor module which is one embodiment of the present invention. It is a plane perspective view of the sensor module which is one embodiment of the present invention. It is sectional drawing (A1-A1 sectional drawing) of the sensor module which is one embodiment of this invention. It is sectional drawing (B1-B1 sectional drawing) of the sensor module which is one embodiment of this invention. It is sectional drawing (C1-C1 sectional drawing) of the sensor module which is one embodiment of this invention. It is a partial expanded sectional view of the sensor module which is one embodiment of this invention. It is a top view of the sensor chip used for the sensor module which is one embodiment of the present invention. It is a top view of the optical component used for the sensor module which is one embodiment of this invention. It is a top view of the optical component used for the sensor module which is one embodiment of this invention. It is a partial expanded sectional view of the sensor chip and optical component which are used for the sensor module which is one embodiment of the present invention. It is explanatory drawing which shows the planar positional relationship of the light receiving element of a sensor chip, the opening part of the light shielding layer of an optical component, and the lens part of an optical component. It is a manufacturing process flowchart which shows the manufacturing process of the sensor module which is one embodiment of this invention. It is a process flow figure which shows the detail of the spacer formation process of step S5 among the manufacturing processes of the sensor module which is one embodiment of this invention. It is a process flow figure which shows the detail of the optical component mounting process of step S6 among the manufacturing processes of the sensor module which is one embodiment of this invention. It is a process flow figure which shows the detail of the spacer formation process of step S7 among the manufacturing processes of the sensor module which is one embodiment of this invention. It is a process flow figure which shows the detail of the optical component mounting process of step S8 among the manufacturing processes of the sensor module which is one embodiment of this invention. It is a top view of the wiring board used for manufacture of the sensor module which is one embodiment of the present invention. It is sectional drawing (A1-A1 sectional drawing) of the wiring board used for manufacture of the sensor module which is one embodiment of this invention. It is sectional drawing (B1-B1 sectional drawing) of the wiring board used for manufacture of the sensor module which is one embodiment of this invention. It is sectional drawing (C1-C1 sectional drawing) of the wiring board used for manufacture of the sensor module which is one embodiment of this invention. It is a top view (top view) in the manufacturing process of the sensor module which is one embodiment of this invention. FIG. 22 is a cross-sectional view (A1-A1 cross-sectional view) of the same sensor module as that of FIG. 21 in the manufacturing process. FIG. 22 is a cross-sectional view (B1-B1 cross-sectional view) of the same sensor module as that of FIG. 21 in the manufacturing process. FIG. 22 is a cross-sectional view (C1-C1 cross-sectional view) of the same sensor module as that of FIG. 21 in the manufacturing process. FIG. 22 is a plan view (top view) of the sensor module during a manufacturing step following that of FIG. 21; FIG. 26 is a cross-sectional view (A1-A1 cross-sectional view) of the same sensor module as that of FIG. 25 in the manufacturing process. FIG. 26 is a cross-sectional view (B1-B1 cross-sectional view) of the same sensor module as that of FIG. 25 in the manufacturing process. FIG. 26 is a cross-sectional view (C1-C1 cross-sectional view) of the same sensor module as that of FIG. 25 in the manufacturing process. FIG. 26 is a plan view (top view) of the sensor module during a manufacturing step following that of FIG. 25; FIG. 30 is a cross-sectional view (A1-A1 cross-sectional view) of the same sensor module as that of FIG. 29 in the manufacturing process. FIG. 30 is a cross-sectional view (B1-B1 cross-sectional view) of the same sensor module as that of FIG. 29 in the manufacturing process. FIG. 30 is a cross-sectional view (C1-C1 cross-sectional view) of the same sensor module as that of FIG. 29 in the manufacturing process. FIG. 30 is a plan view (top view) of the sensor module during a manufacturing step following that of FIG. 29; It is sectional drawing (A1-A1 sectional drawing) in the manufacturing process of the same sensor module as FIG. FIG. 34 is a cross-sectional view (B1-B1 cross-sectional view) of the same sensor module as that of FIG. 33 in the manufacturing process. FIG. 34 is a cross-sectional view (C1-C1 cross-sectional view) of the same sensor module as that of FIG. 33 in the manufacturing process. FIG. 37 is a plan view showing a sensor chip in the same process step as in FIGS. 33 to 36. FIG. 34 is a plan view (top view) of the sensor module during the manufacturing process following FIG. 33; FIG. 39 is a cross-sectional view (A1-A1 cross-sectional view) of the same sensor module as in FIG. 38 in the manufacturing process. It is sectional drawing (B1-B1 sectional drawing) in the manufacturing process of the same sensor module as FIG. It is sectional drawing (C1-C1 sectional drawing) in the manufacturing process of the same sensor module as FIG. FIG. 39 is a plan view (top view) of the sensor module in manufacturing process following FIG. 38. FIG. 43 is a cross-sectional view (A1-A1 cross-sectional view) of the same sensor module as that of FIG. 42 in the manufacturing process. FIG. 44 is a cross-sectional view (B1-B1 cross-sectional view) of the same sensor module as that of FIG. 42 in the manufacturing process. FIG. 43 is a cross-sectional view (C1-C1 cross-sectional view) of the same sensor module as that of FIG. 42 in the manufacturing process. FIG. 46 is a plan view (top view) showing the sensor chip and the optical components on the sensor chip in the same process step as FIGS. 42 to 45. FIG. 46 is a partial enlarged cross-sectional view of a laminated structure of a sensor chip and an optical component on the sensor chip in the same process step as in FIGS. 42 to 45. It is explanatory drawing of the optical component arrangement | positioning process of step S6b, and the adhesive material hardening process of step S6c. It is explanatory drawing of the optical component arrangement | positioning process of step S6b, and the adhesive material hardening process of step S6c. It is explanatory drawing of the optical component arrangement | positioning process of step S6b, and the adhesive material hardening process of step S6c. It is explanatory drawing of the optical component arrangement | positioning process of step S6b, and the adhesive material hardening process of step S6c. FIG. 43 is a plan view (top view) of the sensor module during a manufacturing step following that of FIG. 42; FIG. 53 is a cross-sectional view (A1-A1 cross-sectional view) of the same sensor module as that of FIG. 52 in the manufacturing process. FIG. 53 is a cross-sectional view (B1-B1 cross-sectional view) of the same sensor module as that of FIG. 52 in the manufacturing process. FIG. 53 is a cross-sectional view (C1-C1 cross-sectional view) of the same sensor module as that of FIG. 52 in the manufacturing process. FIG. 56 is a plan view plan view showing a sensor chip and optical components on the sensor chip in the same process step as in FIGS. 52 to 55. FIG. 53 is a plan view (top view) of the sensor module during a manufacturing step following FIG. 52; FIG. 58 is a cross-sectional view (A1-A1 cross-sectional view) of the same sensor module as that of FIG. 57 in the manufacturing process. FIG. 58 is a cross-sectional view (B1-B1 cross-sectional view) of the same sensor module as that of FIG. 57 in the manufacturing process. FIG. 58 is a cross-sectional view (C1-C1 cross-sectional view) of the same sensor module as that of FIG. 57 in the manufacturing process. FIG. 58 is a plan view (top view) of the sensor module in manufacturing process subsequent to FIG. 57; FIG. 62 is a cross-sectional view (A1-A1 cross-sectional view) of the same sensor module as that of FIG. 61 in the manufacturing process. FIG. 62 is a cross-sectional view (B1-B1 cross-sectional view) of the same sensor module as that of FIG. 61 in the manufacturing process. FIG. 62 is a cross-sectional view (C1-C1 cross-sectional view) of the same sensor module as in FIG. 61 in manufacturing process. FIG. 67 is a plan view (top view) showing a sensor chip and optical components on the sensor chip in the same process step as FIGS. 61 to 64; FIG. 65 is a partial enlarged cross-sectional view of a stacked structure of a sensor chip and an optical component on the sensor chip in the same process step as that of FIGS. 61 to 64. It is explanatory drawing of the optical component arrangement | positioning process of step S8b, and the adhesive material hardening process of step S8c. It is explanatory drawing of the optical component arrangement | positioning process of step S8b, and the adhesive material hardening process of step S8c. It is explanatory drawing of the optical component arrangement | positioning process of step S8b, and the adhesive material hardening process of step S8c. It is explanatory drawing of the optical component arrangement | positioning process of step S8b, and the adhesive material hardening process of step S8c. It is explanatory drawing of the finger vein authentication apparatus using the sensor module which is one embodiment of this invention. It is a top view of the sensor chip in which the alignment mark is formed. It is a top view of the optical component in which the alignment mark is formed. It is a top view of the optical component in which the alignment mark is formed.

  In the following embodiments, when it is necessary for the sake of convenience, the description will be divided into a plurality of sections or embodiments. However, unless otherwise specified, they are not irrelevant to each other. There are some or all of the modifications, details, supplementary explanations, and the like. Further, in the following embodiments, when referring to the number of elements (including the number, numerical value, quantity, range, etc.), especially when clearly indicated and when clearly limited to a specific number in principle, etc. Except, it is not limited to the specific number, and may be more or less than the specific number. Further, in the following embodiments, the constituent elements (including element steps and the like) are not necessarily indispensable unless otherwise specified and apparently essential in principle. Needless to say. Similarly, in the following embodiments, when referring to the shapes, positional relationships, etc. of the components, etc., the shapes are substantially the same unless otherwise specified, or otherwise apparent in principle. And the like are included. The same applies to the above numerical values and ranges.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiments, and the repetitive description thereof will be omitted. In the following embodiments, the description of the same or similar parts will not be repeated in principle unless particularly necessary.

  In the drawings used in the embodiments, hatching may be omitted even in a cross-sectional view so as to make the drawings easy to see. Further, even a plan view may be hatched to make the drawing easy to see.

  A sensor module (semiconductor device) of the present embodiment and a manufacturing process thereof will be described with reference to the drawings. The sensor module of the present embodiment is a sensor module used as a sensor module for vein authentication (for example, finger vein authentication). It can also be used for uses other than vein authentication, for example, for fingerprint recognition.

<About the structure of the sensor module>
FIG. 1 is a plan view of a sensor module (semiconductor device, electronic device) MJ1 according to an embodiment of the present invention, FIG. 2 is a plan perspective view of the sensor module MJ1, and FIGS. 3 to 5 are sensor modules. FIG. 6 is a sectional view (side sectional view) of MJ1, and FIG. 6 is a partially enlarged sectional view (essential sectional view) of sensor module MJ1. FIG. 7 is a plan view (top view) of the sensor chip 3 used in the sensor module MJ1, and FIG. 8 is a plan view (top view) of the optical component 5 used in the sensor module MJ1. FIG. 9 is a plan view (top view) of the optical component 6 used in the sensor module MJ1. FIG. 10 is a partially enlarged sectional view (main part sectional view) of the sensor chip 3, the optical component 5, and the optical component 6 used in the sensor module MJ1. FIG. 11 is an explanatory diagram (plan view) showing a planar positional relationship among the light receiving element PH of the sensor chip 3, the opening 16 of the light shielding layer 15 of the optical component 5, and the lens portion 13 of the optical component 5. . FIG. 2 shows a plan view of the sensor module MJ1 in a state where the optical components 5 and 6 and the sealing portion 7 are seen through (removed). 3 corresponds to a cross-sectional view taken along the line A1-A1 in FIGS. 1 and 2, and FIG. 4 corresponds to a cross-sectional view taken along the line B1-B1 in FIGS. FIG. 5 corresponds to a cross-sectional view taken along line C1-C1 in FIGS. 6 is a partially enlarged cross-sectional view of FIG. 3, and an enlarged view of a region RG1 surrounded by a dotted line in FIG. 3 is shown. FIG. 6 is a cross-sectional view taken along the line D4-D4 of FIG. It also corresponds to the figure. Further, FIG. 7 shows an overall plan view (top view) of the sensor chip 3, and an enlarged view of the region RG2 is also shown. Further, FIG. 8 shows an overall plan view (top view) of the optical component 5, and an enlarged view of the region RG3 is also shown. FIG. 9 shows an overall plan view (top view) of the optical component 6, and an enlarged view of the region RG4 is also shown. FIG. 10C shows a partial enlarged cross-sectional view (main part cross-sectional view) of the sensor chip 3, and FIG. 10B shows a partial enlarged cross-sectional view (main part cross-sectional view) of the optical component 5. , (A) shows a partially enlarged sectional view (main part sectional view) of the optical component 6. 10C corresponds to the cross-sectional view at the position of the line D1-D1 in FIG. 7, and FIG. 10B corresponds to the cross-sectional view at the position of the line D2-D2 in FIG. FIG. 10A corresponds to a cross-sectional view taken along the line D3-D3 in FIG. 10 is also a cross-section corresponding to FIG. 8 is a plan view, but in order to facilitate understanding, the area where the light shielding layer 15 is formed is hatched with dots.

  As shown in FIGS. 1 to 10, the sensor module MJ <b> 1 of the present embodiment includes a wiring board 2, a sensor chip 3 and an electronic component 4 mounted on the upper surface 2 a of the wiring board 2, and the sensor chip 3. It has mounted optical parts 5 and 6. Further, the sensor module MJ1 of the present embodiment includes a plurality of bonding wires BW that electrically connect a plurality of pad electrodes PD of the sensor chip 3 and a plurality of bonding leads BL of the wiring board 2, and the plurality of bonding wires. It has the sealing part 7 which covers BW, and the connector CNT mounted on the upper surface 2a of the wiring board 2.

  The wiring board (base material) 2 has an upper surface (main surface, front surface, sensor chip mounting surface) 2a and a lower surface (back surface) 2b which are two main surfaces located on opposite sides, and the upper surface 2a side is The main surface (sensor chip mounting surface) on the sensor chip 3 and electronic component 4 mounting side. The wiring substrate 2 is, for example, a glass epoxy resin substrate, and is a multilayer in which insulating layers made of resin material layers (for example, glass epoxy resin material layers) and wiring layers (conductor layers, conductor pattern layers) are alternately stacked. A wiring structure (that is, a multilayer wiring board) can also be used. On the upper surface 2a of the wiring board 2, a plurality of bonding leads (electrodes, terminals) BL and a plurality of terminals (electrodes, conductive lands, bonding leads) TE1 and TE2 are formed (arranged) as electrodes. The pad electrodes (bonding pads, electrodes, terminals) PD of the sensor chip 3 mounted on the upper surface 2a of the wiring board 2 are connected to the bonding leads BL formed on the upper surface 2a of the wiring board 2 via the bonding wires BW. Electrically connected. The bonding wire BW is made of a thin metal wire such as a gold (Au) wire.

  One or a plurality of electronic components 4 are mounted (mounted) on the upper surface 2a of the wiring board 2. The electronic components 4 are, for example, passive components (chip components) such as chip resistors and chip capacitors, or EEPROMs. A memory chip (semiconductor chip for memory) in which a nonvolatile memory circuit such as (Electrically Erasable Programmable Read-Only Memory) is formed. Among the electronic components 4, passive components such as chip resistors and chip capacitors are solder-mounted on the upper surface 2 a of the wiring substrate 2, and the memory chip is mounted on the upper surface 2 a of the wiring substrate 2 via solder bumps (bump electrodes). Flip chip mounted. That is, each electrode of the electronic component 4 is mechanically and electrically connected to each terminal TE1 of the upper surface 2a of the wiring board 2 respectively. 1, FIG. 2 and FIG. 4 show a state in which a passive component such as a chip resistor or a chip capacitor is connected as an electronic component 4 to a terminal TE1 on the upper surface 2a of the wiring board 2 via a bonding material 10b such as solder. Has been. The type and number of electronic components 4 mounted on the upper surface 2a of the wiring board 2 can be variously changed as necessary. A plurality of terminals TE1 which are terminals for connecting the electronic component 4 are formed on the upper surface 2a of the wiring board 2. Each terminal TE1 is in the same layer as the bonding lead BL formed on the upper surface 2a of the wiring board 2. The conductor pattern (wiring pattern) is used.

  A sensor chip (image sensor, solid-state image sensor, semiconductor image sensor) 3 is a semiconductor chip for an optical sensor, and a sensor circuit (light receiving element circuit) such as a CMOS image sensor circuit is formed, and the sensor circuit is formed. The surface (light receiving surface, light receiving element forming surface) 3a which is the principal surface on the side formed, and the back surface 3b which is the principal surface opposite to the surface 3a. Then, the sensor chip 3 is bonded to the upper surface 2a of the wiring board 2 so that the back surface 3b of the sensor chip 3 faces (mounts or adheres) to the wiring board 2 (a bonding material (die bonding material) 10a). Is mounted (placement, mounting, face-up bonding). Since the sensor chip 3 is a semiconductor chip, the sensor module MJ1 can be regarded as a semiconductor device.

  The CMOS image sensor circuit formed on the sensor chip 3 is formed by a CMOS process that is typically used in the manufacturing process of a semiconductor device, and has a sensor array (light receiving element region). The surface 3a of the sensor chip 3 is provided with a sensor surface (sensor region, light receiving unit, sensor array region) SE, which is a region (sensor region) where a sensor array is formed, as a light receiving unit. The sensor surface SE can be regarded as a sensor region. The planar shape of the sensor chip 3 is a quadrangle (more specifically, a rectangle), and the planar shape of the sensor surface SE is also a quadrangle (more specifically, a rectangle).

  A plurality of light receiving elements PH are formed as a plurality of pixels on the sensor surface SE of the sensor chip 3. Specifically, as can be seen from FIG. 7 and FIG. 10C, a plurality of light receiving elements (pixels) PH are arranged in the vertical and horizontal directions along the main surface of the sensor chip 3 on the sensor surface SE of the sensor chip 3. They are regularly arranged (that is, in an array). Each light receiving element PH is a part for forming a pixel of the CMOS image sensor circuit, and has a photoelectric conversion function for converting an incident optical signal into an electric signal. For this reason, the light receiving element PH can be regarded as a pixel. For example, a photodiode or a phototransistor can be used as the light receiving element PH. The sensor chip 3 may further include an analog circuit that processes an electrical signal obtained on the sensor surface SE, a DSP (Digital Signal Processor) circuit, and the like.

  On the sensor surface SE of the sensor chip 3, for example, 15000 light receiving elements PH are arranged (arranged) in an array of 100 rows × 150 columns. The number of rows and the number of columns of the light receiving elements PH on the sensor surface SE of the sensor chip 3 can be changed as necessary.

  Although not shown, a surface protective film (protective insulating film) is formed on the surface 3 a of the sensor chip 3 as the uppermost insulating film of the sensor chip 3. In this surface protective film, an opening for the light receiving element PH and an opening for the pad electrode PD are formed. The opening for the light receiving element PH in the surface protective film is formed on the top of each light receiving element PH so as to expose the light receiving element PH, and light enters the light receiving element PH through the opening for the light receiving element PH. It can be done. In addition, the opening for the pad electrode PD in the surface protective film is formed on the top of each pad electrode PD so as to expose the pad electrode PD, and the bonding wire BW can be connected to the pad electrode PD.

  On the surface 3a of the sensor chip 3, a plurality of pad electrodes PD are formed (arranged) in a region other than the sensor surface SE. The pad electrodes PD are lead electrodes for the CMOS image sensor circuit of the sensor chip 3 and the like. The wire is electrically connected to the bonding lead BL of the wiring board 2 through the bonding wire BW. The pad electrodes PD are arranged on the outer peripheral portion of the surface 3a of the sensor chip 3, and in FIG. 2 and FIG. 7, a plurality of pad electrodes PD are arranged (arranged) along the side SD1 of the surface 3a of the sensor chip 3. ing.

  On the upper surface 2a of the wiring board 2, a connector (connector portion) CNT that functions as an external terminal (external connection terminal) of the sensor module MJ1 is mounted (mounted or disposed) via a bonding material 10c. The connector CNT functions as an external terminal for electrically connecting the sensor module MJ1 (a circuit built therein) to an external device. Specifically, a plurality of terminals TE2 which are terminals for connecting the connector CNT are formed at positions along the side SD2 on the upper surface 2a of the wiring board 2, and the connector CNT is electrically connected to the plurality of terminals TE2. It is connected to the. Each terminal TE2 on the upper surface 2a of the wiring board 2 is formed by the bonding lead BL formed on the upper surface 2a of the wiring board 2 and a conductor pattern (wiring pattern) in the same layer as the terminal TE1.

  The plurality of bonding leads BL, the plurality of terminals TE1, and the plurality of terminals TE2 on the upper surface 2a of the wiring board 2 are the wirings of the wiring board 2 (the wiring pattern in the same layer as the bonding leads BL and the terminals TE1 and TE2 and the wiring board 2). (Including internal wiring patterns and vias of the wiring board 2) as necessary.

  The connector CNT has a plurality of terminals TE3, and each terminal TE3 of the connector CNT is electrically connected to each terminal TE2 of the wiring board 2. Therefore, each terminal TE3 of the connector CNT is electrically connected to a circuit (each electrode of the sensor chip 3 or the electronic component 4) in the sensor module MJ1 through the wiring of the wiring board 2 or the like. Each terminal TE3 of the connector CNT is electrically connected to each terminal TE2 on the upper surface 2a of the wiring board 2, and further via the wiring of the wiring board 2, the bonding wire BW, solder, etc. It is electrically connected to the electrodes of the electronic component 4.

  A sealing portion 7 is formed on the upper surface 2a of the wiring board 2 so as to cover the plurality of bonding wires BW. The sealing part 7 consists of resin materials, such as a thermosetting resin material, for example, and can also contain a filler etc. For example, an epoxy resin or a silicone resin can be used as the resin material for the sealing portion 7. The connecting portion between the pad electrode PD of the sensor chip 3 and the bonding wire BW, the connecting portion between the bonding lead BL and the bonding wire BW of the wiring substrate 2, and the bonding wire BW itself are sealed and protected by the sealing portion 7. The

  The sealing portion 7 is formed so as to cover the bonding wire BW (that is, the bonding wire BW is not exposed). On the sensor surface SE of the sensor chip 3, the resin for the sealing portion 7 is formed. It is preferable that the material is not disposed, thereby preventing the incidence of light on the sensor surface SE of the sensor chip 3 from being hindered (obstructed) by the resin material for the sealing portion 7. it can.

  Optical components 5 and 6 are mounted on the surface 3 a of the sensor chip 3. Among these, the optical component 5 is mounted (arranged) on the surface 3 a of the sensor chip 3 via an adhesive (adhesive layer, adhesive, adhesive layer) 11 and fixed, and the optical component 5 is optically mounted on the optical component 5. The component 6 is mounted (arranged) and fixed via an adhesive (adhesive layer, adhesive, adhesive layer) 12. The adhesive 11 and the adhesive 12 are light-transmitting adhesives (so-called transparent adhesives) that transmit light, and are in a cured state. Since the adhesives 11 and 12 are translucent adhesives (transparent adhesives), the incidence of light on the sensor surface SE of the sensor chip 3 is inhibited (obstructed) by the adhesives 11 and 12. Can be prevented. Adhesives 11 and 12 and adhesives 11a and 12a described later are almost transparent because they have translucency (light transmissivity).

  Of the optical components 5 and 6, the optical component (microlens) 6 on the upper side (the side far from the surface 3a of the sensor chip 3) is an optical component that functions as a lens. However, the optical component 6 in the present embodiment does not function as a single lens as a whole but has a plurality of lens portions 13. The optical component 6 has a front surface (lens portion forming surface) 6a which is a main surface on the side where the plurality of lens portions 13 are formed, and a back surface which is a main surface opposite to the front surface 6a. The back surface of the component 6 is bonded to the optical component 5 via the adhesive 12.

The optical component 6 is formed of a translucent material (transparent material) that transmits light. As can be seen from FIG. 9 and FIG. 10A, a plurality of lens portions 13 are regularly arranged on the surface 6 a of the optical component 6 in the vertical and horizontal directions (that is, in an array) along the main surface of the optical component 6. They are formed (arranged) side by side. The plurality of lens portions 13 arranged in an array on the surface 6a of the optical component 6 correspond (a one-to-one correspondence) with the plurality of light receiving elements PH arranged in an array on the sensor surface SE of the sensor chip 3. The arrangement pitch (arrangement interval) P ₁ of the light receiving elements PH on the sensor surface SE of the sensor chip 3 and the arrangement pitch (arrangement interval) P ₃ of the lens portion 13 on the surface 6a of the optical component 6 are the same (that is, P ₁ = P ₃ ).

  Each of the plurality of lens portions 13 formed on the surface 6a of the optical component 6 functions as one lens. That is, the plurality of lens portions 13 formed on the surface 6a of the optical component 6 each function as a separate lens. Each lens portion 13 is formed by processing a translucent material (transparent material) such as acrylic resin into a convex lens shape.

  The optical component 6 includes, for example, a flat glass member (glass base material, glass plate) as a base layer (base material layer) 14, and the surface and the back surface of the base layer 14 having translucency (the front surface and the back surface are mutually connected). The plurality of lens portions 13 may be formed of an acrylic resin or the like on the surface (the surface of the base layer 14) of the main surface on the opposite side. In this case, for example, the thickness of the base layer 14 can be about 0.25 mm, and the thickness of the lens portion 13 (the thickness of the central portion of the lens portion 13) can be about 40 μm. As another form, the base layer 14 may be replaced with an acrylic resin, and the entire optical component 6 including the base layer 14 and the lens portion 13 may be formed of the acrylic resin. By making the lens part 13 into an acrylic resin, the processing of the lens part 13 becomes easy. Acrylic resin is suitable as a material for the lens portion 13, but has a relatively low heat-resistant temperature and is about 90 ° C.

  Of the optical components 5 and 6, the lower optical component (light shielding material) 5 (side closer to the surface 3 a of the sensor chip 3) is not necessary for the plurality of light receiving elements PH formed on the sensor surface SE of the sensor chip 3. It is an optical component that functions as a light shielding material that prevents (shields) incident light. The optical component 5 has a surface (light-shielding film forming surface) 5a which is a main surface on the side where the light-shielding layer (light-shielding film) 15 is formed, and a back surface which is a main surface opposite to the surface 5a. The back surface of the optical component 5 is bonded to the front surface 3a of the sensor chip 3 through the adhesive material 11, and the front surface 5a of the optical component 5 is bonded to the back surface of the optical component 6 through the adhesive material 12.

  A light shielding layer 15 is formed on the surface 5a of the optical component 5. The light shielding layer 15 is formed on the entire surface 5a of the optical component 5, and the light shielding layer 15 includes a plurality of optical regions. The opening (optical region) 16 is provided. In the optical component 5, the portion other than the light shielding layer 15 (that is, the base layer 17) is formed of a light transmissive material (transparent material) that transmits light, while the light shielding layer 15 does not transmit light ( That is, it is made of a light-shielding material that prevents transmission of light or reflects light. For this reason, each opening part 16 functions as an optical area | region, and can function as an area | region which permeate | transmits light. The optical component 5 including the light shielding layer 15 having a plurality of openings 16 as an optical region can function to prevent light from an oblique direction from entering the light receiving element PH.

  Specifically, the optical component 5 includes, for example, a flat glass member (glass base material, glass plate) as a base layer (base material layer) 17, and the front and back surfaces of the base layer 17 having translucency (this The light shielding layer 15 may be formed of a metal film such as a chromium (Cr) film on the front surface (the surface of the base layer 17) of the front surface and the back surface. In this case, for example, the thickness of the base layer 17 can be about 150 μm, and the thickness of the light shielding layer 15 can be about several μm.

  Each of the optical components 5 and 6 has a slightly larger planar shape and planar dimensions than the sensor surface SE, and the optical components 5 and 6 are mounted on the sensor chip 3 in order from the bottom. , 6 enclose the sensor surface SE in plan view and expose the pad electrode PD. That is, the entire sensor surface SE is covered with the optical component 5 in plan view, and the entire sensor surface SE is covered with the optical component 6 in plan view, while the pad electrode PD overlaps with the optical components 5 and 6 in plan view. (Not covered by the optical components 5 and 6).

  The optical component 5 and the optical component 6 can have substantially the same planar shape and planar dimensions. In addition, the planar shape of each of the sensor chip 3 and the sensor surface SE is, for example, a quadrangle (more specifically, a rectangle), and in this case, the optical components 5 and 6 are slightly larger than the sensor surface SE (more specific). Can be rectangular). Each of the optical components 5 and 6 has three sides (three sides other than the side on the pad electrode PD side) of the optical component, and three sides (three sides other than the side on the pad electrode PD side) of the sensor chip 3. It is possible to obtain a planar shape and a planar dimension that substantially match the side), which is advantageous in reducing the area of the sensor module while securing the arrangement area of the spacers SP1 and SP2.

  In the sensor module MJ1, the optical component 5 is mounted on the surface 3a of the sensor chip 3 via the adhesive 11, and the optical component 6 is mounted on the optical component 5 via the adhesive 12. As can be seen from FIG. 11, each light receiving element PH of the sensor surface SE of the sensor chip 3, each opening 16 of the light shielding layer 15 of the optical component 5, and each lens portion 13 of the optical component 6 are planar. The optical components 5 and 6 are mounted so as to overlap each other (that is, in plan view). For this reason, the light condensed by each lens portion 13 of the optical component 6 passes (passes) through each opening portion 16 of the light shielding layer 15 of the optical component 5 and passes through (opens) the sensor surface SE of the surface 3 a of the sensor chip 3. The light is incident on each light receiving element PH.

  The openings 16 of the light shielding layer 15 of the optical component 5 allow the light collected by the lens portions 13 of the optical component 6 to pass through and enter the light receiving elements PH on the sensor surface SE of the surface 3 a of the sensor chip 3. Can function. On the other hand, the light shielding layer 15 itself of the optical component 5 is inclined with respect to each light receiving element PH on the sensor surface SE of the surface 3a of the semiconductor chip 3 (inclined by a predetermined angle or more from the direction perpendicular to the surface 3a of the sensor chip 3). It can function to prevent light from entering in the direction). For this reason, the light that has passed through the arbitrary lens portion 13 of the optical component 6 passes through the opening portion 16 located immediately below the lens portion 13 and enters the light receiving element PH located directly below the lens portion 13. However, it cannot enter the light receiving element PH that is not directly below the lens unit 13. Thereby, only the light condensed by one lens part 13 can be incident on one light receiving element PH.

The arrangement (how to arrange) the light receiving elements PH on the sensor surface SE of the sensor chip 3, the arrangement (how to arrange) the openings 16 of the light shielding layer 15 on the surface 5 a of the optical component 5, and the surface 6 a of the optical component 6. The arrangement (how to arrange) of the lens portions 13 is basically the same. That is, the arrangement pitch (the arrangement interval) _{P 1} of the light receiving element PH in the sensor plane SE of the sensor chip 3, the arrangement pitch (the arrangement interval) _{P 2} of the openings 16 of the light shielding layer 15 on the surface 5a of the optical component 5, optical the arrangement pitch (the arrangement interval) _{P 3} of the lens unit 13 in the surface 6a of the part 6, is the same (i.e. _{P 1 = P 2 = P 3} ). These arrangement pitches P ₁ , P ₂ , and P ₃ can be, for example, about 100 μm (in this case, P ₁ = P ₂ = P ₃ = 100 μm). When a total of 15000 light receiving elements PH of 100 rows × 150 columns are arranged (arranged) on the sensor surface SE of the sensor chip 3, the light shielding layer 15 on the surface 5a of the optical component 5 is correspondingly arranged. Are provided with a total of 15000 openings 16 of 100 rows × 150 columns, and the surface 6 a of the optical component 6 is provided with a total of 15000 lens portions 13 of 100 rows × 150 columns.

  Therefore, in the sensor module MJ1 in which the sensor chip 3 is mounted on the wiring board 2, the optical component 5 is mounted on the sensor chip 3, and the optical component 6 is mounted on the optical component 5, the sensor chip 3 Each light receiving element PH on the sensor surface SE, each opening 16 of the light shielding layer 15 of the optical component 5, and the lens portion 13 of the optical component 6 are aligned in the vertical direction (direction perpendicular to the surface 3a of the sensor chip 3). It is out. The center line of each light receiving element PH on the sensor surface SE of the sensor chip 3, the center line of each opening 16 of the light shielding layer 15 of the optical component 5, and the center line of the lens portion 13 of the optical component 6 are preferably It almost matches. By doing so, the light collected by each lens portion 13 of the optical component 6 passes through each opening 16 of the light shielding layer 15 of the optical component 5, and each sensor surface SE of the surface 3 a of the sensor chip 3. The light enters the light receiving element PH accurately.

  Further, in the sensor module MJ1 in which the optical component 5 is mounted on the sensor chip 3, each light receiving element PH on the sensor surface SE of the sensor chip 3 is shielded from the optical component 5 as shown in FIGS. Each opening 16 of the layer 15 is preferably included in a plan view (that is, in a plan view). This is to prevent the light to be incident on each light receiving element PH from being blocked by the light shielding layer 15. For this reason, the dimension of each opening 16 of the light shielding layer 15 on the surface 5a of the optical component 5 is such that each opening for the light receiving element PH in the surface protective film on the surface 3a of the sensor chip 3 (on the surface protective film of the sensor chip 3). It is preferable that the size of the formed opening is larger than the dimension of the opening formed above the light receiving element PH and allowing light to enter the light receiving element PH. Here, the dimension of the opening corresponds to the length of one side when the opening is square, and corresponds to the diameter when the opening is circular. For example, each opening 16 of the light shielding layer 15 on the surface 5a of the optical component 5 is formed into a circle or a rectangle having a diameter or a side of about 27 μm, and each opening for the light receiving element PH in the surface protective film of the sensor chip 3 is formed with a diameter. Alternatively, it may be a circle or a rectangle having a side of about 10 μm.

  Further, in the sensor module MJ1 in which the optical components 5 and 6 are mounted on the sensor chip 3, as shown in FIGS. 6 and 11, the light receiving elements PH on the sensor surface SE of the sensor chip 3 and the optical components 5 Each opening 16 of the light shielding layer 15 is preferably included in each lens portion 13 of the optical component 6 in plan view (that is, in plan view).

  Further, in the sensor module MJ1 of the present embodiment, the optical component 5 is bonded to the surface 3a of the sensor chip 3 via the adhesive material 11, but the surface 3a of the sensor chip 3 and the back surface of the optical component 5 are Between them, not only the adhesive 11 but also a plurality of spacers SP1 are interposed. In addition, the optical component 6 is bonded to the surface 5a of the optical component 5 via the adhesive 12, but not only the adhesive 12 between the surface 5a of the optical component 5 and the back surface of the optical component 6, A plurality of spacers SP2 are also interposed.

  As will be described later, the spacer SP1 is provided to define the distance between the front surface 3a of the sensor chip 3 and the back surface of the optical component 5 and to temporarily fix the optical component 5 during manufacturing. Although it consists of a hardened adhesive, it is formed in a separate process from the adhesive 11. The spacer SP2 is provided to define the distance between the front surface 5a of the optical component 5 and the back surface of the optical component 6 and to temporarily fix the optical component 6 during manufacturing. Although made of a material, it is formed in a separate process from the adhesive 12.

<About sensor module manufacturing process>
Next, the manufacturing process of the sensor module MJ1 of the present embodiment will be described.

  FIG. 12 is a manufacturing process flowchart showing the manufacturing process of the sensor module MJ1 of the present embodiment. FIG. 13 is a process flow diagram showing details of the spacer SP1 formation process in step S5 in the manufacturing process of the sensor module MJ1. FIG. 14 is a process flow diagram showing details of the optical component mounting step of step S6 in the manufacturing process of the sensor module MJ1. FIG. 15 is a process flow diagram showing details of the spacer SP2 formation step of Step S7 in the manufacturing process of the sensor module MJ1. FIG. 16 is a process flow diagram showing details of the optical component mounting step of Step S8 in the manufacturing process of the sensor module MJ1. FIG. 17 is a top view of the wiring board 2 used for manufacturing the sensor module MJ1, and FIGS. 18 to 20 are cross-sectional views thereof. 17 corresponds substantially to FIG. 18 (A1-A1 cross-sectional view), and the cross-section taken along line B1-B1 of FIG. 17 corresponds to FIG. 19 (B1-B1 cross-sectional view). The section taken along line C1-C1 substantially corresponds to FIG. 20 (C1-C1 sectional view). Note that the positions of the A1-A1, B1-B1 and C1-C1 lines in FIG. 17 correspond to the positions of the A1-A1, B1-B1 and C1-C1 lines in FIG. 21 to 70 are plan views, cross-sectional views, or explanatory views during the manufacturing process of the sensor module MJ1 of the present embodiment.

  In order to manufacture the sensor module MJ1, first, the wiring board 2 as shown in FIGS. 17 to 20 is prepared (step S1 in FIG. 12). Since the basic configuration of the wiring board 2 has been described above, a detailed description thereof is omitted here.

  Briefly described, as shown in FIGS. 17 to 20, the wiring board 2 has an upper surface 2a and a lower surface 2b opposite to the upper surface 2a. As shown, a plurality of bonding leads BL for wire bonding, a plurality of terminals TE1 for connecting the electronic component 4, and a plurality of terminals TE2 for connecting the connector CNT are formed.

  After preparing (preparing) the wiring board 2 as shown in FIGS. 17 to 20, the sensor chip 3, the electronic component 4 and the connector CNT are formed on the upper surface 2a of the wiring board 2 as shown in FIGS. Is mounted (mounted) (step S2 in FIG. 12). Since the specific configuration of the sensor chip 3 has already been described above, the repeated description thereof will be omitted here.

  Here, FIG. 21 (top view), FIG. 22 (A1-A1 cross-sectional view), FIG. 23 (B1-B1 cross-sectional view) and FIG. 24 (C1-C1 cross-sectional view) are the same as FIGS. FIG. 21 is a top view, a cross-sectional view, a cross-sectional view, and a cross-sectional view corresponding to FIGS. 20A and 20B, respectively, showing a stage (state) where step S2 (mounting process) is performed.

  A specific example of the mounting process of various components (sensor chip 3, electronic component 4 and connector CNT) in step S2 can be described as follows.

  First, a region on which the sensor chip 3, the electronic component 4, and the connector CNT are to be mounted on the upper surface 2a of the wiring board 2 (more specifically, a region facing the back surface 3b of the sensor chip 3 when the sensor chip 3 is mounted, and a terminal TE1. , The region on TE2) is applied or printed with a bonding material (solder or the like). Then, the sensor chip 3, the electronic component 4, and the connector CNT are mounted on the upper surface 2a of the wiring board 2. At this time, the sensor chip 3 is mounted on the upper surface 2a of the wiring substrate 2 (face-up bonding) so that the back surface 3b side faces downward (wiring substrate 2 side) and the front surface 3a side faces upward. That is, in step S2, the sensor chip 3 is mounted on the upper surface 2a of the wiring board 2 so that the back surface 3b of the sensor chip 3 faces the upper surface 2a of the wiring board 2. When the electronic component 4 includes a semiconductor chip such as a memory chip, the semiconductor chip is placed on the upper surface 2a of the wiring board 2 so that the solder bump (bump electrode) of the semiconductor chip faces the terminal TE1. To place. Then, a solder reflow process or the like is performed, and the sensor chip 3, the electronic component 4, and the connector CNT are fixed (fixed) to the wiring board 2 via a bonding material such as solder. In this way, the sensor chip 3, the electronic component 4, and the connector CNT can be mounted (mounted) on the upper surface 2a of the wiring board 2.

  Also, the mounting process of the sensor chip 3 (die bonding process) and the mounting process of the electronic component 4 can be made separate processes. In this case, the bonding material (die bonding material) for mounting the sensor chip 3 and the electronic Different types of bonding materials can be used as the bonding material for mounting the component 4 and the connector CNT. For example, as a die bonding material for the sensor chip 3, a thermosetting paste material such as a conductive paste adhesive (for example, silver paste) or an insulating paste adhesive is used to bond the electronic component 4 and the connector CNT. Solder can be used as the material.

  Through the mounting process in step S2, the sensor chip 3 is fixed (fixed) to the wiring board 2 (the upper surface 2a thereof) with a bonding material (die bonding material) 10a. In addition, the passive component (chip component) of the electronic component 4 has the electrode of the passive component (chip component) electrically connected to the terminal TE1 of the wiring board 2 via the bonding material 10b (for example, solder). And mechanically connected (fixed). Further, if there is a semiconductor chip such as a memory chip as the electronic component 4, the solder bump of the semiconductor chip is electrically connected to the terminal TE1 of the wiring board 2 and mechanically connected (fixed). Further, the connector CNT is electrically connected to the terminal TE2 of the wiring board 2 via a bonding material 10c (for example, solder) and mechanically connected (fixed).

  In this way, the sensor chip 3, the electronic component 4 and the connector CNT are mounted and fixed on the upper surface 2a of the wiring board 2, and each electrode of each electronic component 4 is connected to the upper surface 2a of the wiring board 2 to be connected thereto. The terminals TE3 of the connector CNT are electrically connected to the terminals TE2 of the wiring board 2, respectively.

  After the mounting process of various components (sensor chip 3, electronic component 4 and connector CNT) in step S2, a wire bonding process is performed as shown in FIGS. The pad electrode PD and the plurality of bonding leads BL on the upper surface 2a of the wiring board 2 are electrically connected to each other through the plurality of bonding wires BW (step S3 in FIG. 12). At this time, each bonding wire BW has one end connected to the pad electrode PD of the sensor chip 3 and the other end connected to the bonding lead BL of the wiring board 2.

  Here, FIG. 25 (top view), FIG. 26 (A1-A1 cross-sectional view), FIG. 27 (B1-B1 cross-sectional view) and FIG. 28 (C1-C1 cross-sectional view) are shown in FIGS. FIG. 21 is a top view, a cross-sectional view, a cross-sectional view, and a cross-sectional view corresponding to FIGS. 20A and 20B, respectively, showing a stage (state) in which step S3 (wire bonding step) is performed.

  After the wire bonding process in step S3, as shown in FIGS. 29 to 32, the sealing portion 7 is formed on the upper surface 2a of the wiring board 2 (step S4 in FIG. 12).

  Here, FIG. 29 (top view), FIG. 30 (A1-A1 cross-sectional view), FIG. 31 (B1-B1 cross-sectional view) and FIG. 32 (C1-C1 cross-sectional view) are the same as FIGS. FIG. 21 is a top view, a cross-sectional view, a cross-sectional view, and a cross-sectional view corresponding to FIGS.

  The sealing part 7 formation process of step S4 can be performed as follows, for example. First, a material (resin material) for forming the sealing portion 7 is supplied (arranged) on the upper surface 2a of the wiring board 2 so as to cover the plurality of bonding wires BW. The material (resin material) for forming the sealing portion 7 is made of a resin material such as a thermosetting resin material, and can contain a filler or the like. For example, an epoxy resin or a silicone resin can be used as a material (resin material) for forming the sealing portion 7. Then, the material (resin material) for forming the sealing portion 7 is cured. When the material (resin material) for forming the sealing portion 7 is a thermosetting resin, the material (resin material) for forming the sealing portion 7 can be cured by performing heat treatment (heat treatment). Thereby, the sealing part 7 made of a cured resin material (resin material for forming the sealing part 7) is formed.

  In step S4, the sealing portion 7 is formed so as to cover the bonding wire BW (that is, the bonding wire BW is not exposed). Thereby, the connection portion between the pad electrode PD of the sensor chip 3 and the bonding wire BW, the connection portion between the bonding lead BL and the bonding wire BW of the wiring substrate 2, and the bonding wire BW itself are sealed by the sealing portion 7. Protected.

  The sealing portion 7 is formed so as to cover the bonding wire BW (that is, the bonding wire BW is not exposed). On the sensor surface SE of the sensor chip 3, the resin for the sealing portion 7 is formed. It is preferable that the material is not disposed, thereby preventing the incidence of light on the sensor surface SE of the sensor chip 3 from being hindered (obstructed) by the resin material for the sealing portion 7. it can.

  After the sealing part 7 formation step in step S4, as shown in FIGS. 33 to 37, a spacer SP1 is formed on the surface 3a of the sensor chip 3 (step S5 in FIG. 12).

  Here, FIG. 33 (top view), FIG. 34 (A1-A1 cross-sectional view), FIG. 35 (B1-B1 cross-sectional view) and FIG. 36 (C1-C1 cross-sectional view) are the same as FIGS. FIG. 21 is a top view, a cross-sectional view, a cross-sectional view, and a cross-sectional view corresponding to FIG. 20 and shows a stage (state) in which step S5 (spacer SP1 forming step) is performed. FIG. 37 is a plan view (top view) showing the sensor chip 3 in the same process step as FIGS. 33 to 36, and corresponds to FIG. In FIG. 37, the sealing portion 7 and the bonding wire BW are seen through.

  The step of forming the spacer SP1 in step S5 can be performed as follows. First, the adhesive (adhesive) 21 for forming the spacer SP1 is arranged (supplied and applied) at a plurality of locations on the surface 3a of the sensor chip 3 (step S5a in FIG. 13). Then, the adhesive 21 is cured to form a plurality of spacers SP1 on the surface 3a of the sensor chip 3 (step S5b in FIG. 13). The spacer SP1 is obtained by curing the adhesive material 21. The spacers SP1 are formed at a plurality of locations in the region where the optical component 5 is to be mounted on the surface 3a of the sensor chip 3.

  The spacer SP1 temporarily defines the distance between the back surface of the optical component 5 to be mounted on the sensor chip 3 and the front surface 3a of the sensor chip 3 and temporarily holds the optical component 5 until the adhesive 11a described later is cured. It is provided for fixing. For this reason, the spacer SP1 needs to have adhesiveness (viscosity, tackiness) for temporarily fixing the optical component 5.

The adhesive 21 has a higher viscosity due to the curing process in step S5b. For this reason, the adhesive 21 curing step in step S5b can be regarded as a process for increasing the viscosity of the adhesive 21. That is, when the adhesive 21 is placed in the step S5a in the plurality of locations of the surface 3a of the sensor chip 3, and the viscosity of the adhesive 21 to the viscosity (first viscosity) V _1, adhesion after curing in step S5b the viscosity of the wood 21, i.e. the viscosity of the spacer SP1, when a viscosity (second viscosity) _{V 2,} viscosity (second viscosity) _{V 2} is higher than the viscosity (the first viscosity) _{V 1} (i.e. _{V 2} > V ₁ ). Therefore, the spacer SP1 formed (i.e. adhesive 21 was cured by step S5b) step S5b, higher viscosity than the viscosity _{V 1} of the adhesive material 21 of the stage disposed on the surface 3a of the sensor chip 3 in step S5a It consists V _2, and those having an adhesiveness (viscosity, tackiness).

  The adhesive 21 to be disposed on the surface 3a of the sensor chip 3 in step S5a is preferably an ultraviolet curable adhesive. In this case, in step S5b, the adhesive 21 on the surface 3a of the sensor chip 3 is irradiated with ultraviolet rays. Thus, the adhesive 21 is cured to form the spacer SP1.

  In addition, UV-curing adhesives do not harden completely when exposed to air (touched), and they become sticky (viscous, tacky). Cheap. Therefore, an ultraviolet curable adhesive is used as the adhesive 21 for forming the spacer SP1, and in step S5b, the surface of the adhesive 21 disposed on the surface 3a of the sensor chip 3 has come into contact with the air (the air It is preferable that the adhesive material 21 is cured by irradiating the adhesive material 21 with ultraviolet rays in the exposed state to form the spacer SP1. Thereby, spacer SP1 which has adhesiveness (viscosity, tackiness) required for temporary fixation of the optical component 5 can be formed easily and exactly.

  In addition, it is preferable that the adhesive 21 to be disposed on the surface 3a of the sensor chip 3 in step S5a is an adhesive having a certain degree of high viscosity (higher viscosity than the adhesives 11a and 12a described later). The adhesive 21 arranged on the surface 3a of the substrate can be prevented from spreading in the lateral direction (planar direction, direction parallel to the surface 3a of the sensor chip 3) after the arrangement, and the spacer SP1 having a predetermined shape (height) is formed. It becomes easy to do.

  The spacer SP1 is preferably formed on the surface 3a of the sensor chip 3 at a position avoiding the sensor surface (sensor region) SE (outside the sensor surface SE). In step S5a, this can be realized by setting the position of the adhesive 21 to a position where the sensor surface SE is avoided on the surface 3a of the sensor chip 3 (outside the sensor surface SE). By doing so, the spacer SP1 does not affect the incidence of light on the light receiving element PH on the sensor surface SE. Therefore, the spacer SP1 is accurately formed without worrying about translucency. An easy-to-use adhesive can be used for the adhesive 21.

  The spacer SP1 is more preferably formed around the sensor surface SE (more preferably along each side (four sides)) of the sensor chip 3 on the surface 3a of the sensor chip 3 in plan view. Thereby, when the optical component 5 is disposed later on the surface 3a of the sensor chip 3, the distance between the surface 3a of the sensor chip 3 and the back surface of the optical component 5 can be accurately defined by the spacer SP1. The thickness of the layer of the adhesive 11 can be accurately defined by the height of the spacer SP1.

  In addition, when a plurality of spacers SP1 are connected (integrated) in a planar manner on the surface 3a of the sensor chip 3 and formed as an integrated body that completely surrounds the sensor surface SE, in step S6b described later, There is a possibility that it becomes impossible to secure a flow path (path) for discharging the air entrained when the optical component 5 is disposed from between the sensor chip 3 and the optical component 5 to the outside. For this reason, a plurality of spacers SP1 are formed on the surface 3a of the sensor chip 3. Preferably, a plurality of spacers SP1 are formed on each side (each of the four sides) of the sensor surface SE having a square planar shape. At this time, the individual spacers SP1 are preferably formed locally. As a result, not only the corners of the sensor surface SE but also each side can secure a flow path (path) for discharging air or the like from between the sensor chip 3 and the optical component 5 to the outside. It is possible to suppress or prevent the generation of a void between 3 and the optical component 5.

  After the spacer SP1 formation step in step S5, the optical component 5 is mounted on the surface 3a of the sensor chip 3 (step S6 in FIG. 12). Since the specific configuration of the optical component 5 has already been described above, repeated description thereof is omitted here.

  Here, FIG. 38 (top view), FIG. 39 (A1-A1 cross-sectional view), FIG. 40 (B1-B1 cross-sectional view) and FIG. 41 (C1-C1 cross-sectional view) are the same as FIGS. FIG. 21 is a top view, a cross-sectional view, a cross-sectional view, and a cross-sectional view corresponding to FIG. 20 and shows a stage (state) where step S6a (adhesive 11a placement step) is performed. 42 (top view), FIG. 43 (A1-A1 cross-sectional view), FIG. 44 (B1-B1 cross-sectional view), and FIG. 45 (C1-C1 cross-sectional view) are the same as FIG. 17, FIG. 18, FIG. FIG. 21 is a top view, a cross-sectional view, a cross-sectional view, and a cross-sectional view corresponding to FIG. 20, respectively, showing a stage (state) where step S <b> 6 b (optical component 5 arranging step) is performed. 46 is a plan view (top view) showing the sensor chip 3 and the optical component 5 on the sensor chip 3 in the same process steps as those in FIGS. 42 to 45, and corresponds to FIG. In FIG. 46, the sealing portion 7 and the bonding wire BW are seen through. 47 is a partial enlarged cross-sectional view (main cross-sectional view) of the laminated structure of the sensor chip 3 and the optical component 5 on the sensor chip 3 in the same process steps as those in FIGS. 42 to 45. FIG. This corresponds to a cross-sectional view taken along the line D2-D2 in RG3.

  The optical component 5 mounting step in step S6 can be performed as follows. First, as shown in FIGS. 38 to 41, an adhesive (adhesive) 11a for bonding the optical component 5 is disposed (supplied and applied) in the region where the optical component 5 is to be mounted on the surface 3a of the sensor chip 3 ( Step S6a) in FIG. At this time, if foreign matter has accumulated or adhered to the surface 3a of the sensor chip 3, the wettability of the adhesive 11a to be arranged may be reduced (the sensor surface SE does not spread over almost the entire area). Before placing the adhesive 11a, it is preferable that the sensor surface SE be irradiated with plasma to clean the sensor surface SE. However, if the plasma is irradiated more than necessary, the sensor surface SE may be damaged, and it is needless to say that this plasma cleaning step is unnecessary if foreign matter does not accumulate or adhere. . The adhesive 11a is a paste-like (fluid) adhesive. Then, as shown in FIGS. 42 to 47, the optical component 5 is arranged (mounted) on the surface 3a of the sensor chip 3 via the spacer SP1 and the adhesive 11a (step S6b in FIG. 14). In step S6b, the optical component 5 is disposed (mounted) on the front surface 3a of the sensor chip 3 via the spacer SP1 and the adhesive 11a so that the back surface of the optical component 5 faces the front surface 3a of the sensor chip 3. . Then, the optical component 5 is fixed (fixed) to the sensor chip 3 by curing the adhesive 11a (step S6c in FIG. 14). The adhesive 11 is cured by the adhesive 11a.

  As can be seen from FIGS. 46 and 47, in step S6b, the plurality of openings 16 of the light shielding layer 15 of the optical component 5 respectively overlap the plurality of light receiving elements PH on the surface 3a (sensor surface SE) of the sensor chip 3. The optical component 5 is arranged on the surface 3a of the sensor chip 3 via the plurality of spacers SP1 and the adhesive material 11a so as to overlap (in plan view).

  The optical component 5 placement step in step S6b and the adhesive 11a curing step in step S6c will be described more specifically with reference to FIGS. 48 to 51 are explanatory diagrams of the optical component 5 arrangement step in step S6b and the adhesive material 11a curing step in step S6c, and correspond to FIG. 39 and FIG. 43 (that is, A1-A1 cross-sectional view). A cross section is shown.

  As shown in FIG. 48, the wiring board 2 that has been subjected to the adhesive material 11a placement process of step S6a is placed (placed) on the stage (mounting table) 22 in the stage of performing step S6b. Even if the adhesive material 11a placement process of step S6a is performed in a state where the wiring board 2 is placed (arranged) on the stage 22, or after the adhesive material 11a placement process of step S6a is performed, the wiring board 2 is placed on the stage 22. May be placed (arranged). The wiring substrate 2 is placed (arranged) on the upper surface 22a of the stage 22 with the upper surface 2a side of the wiring substrate 2 facing upward so that the lower surface 2b of the wiring substrate 2 faces the upper surface 22a of the stage 22. .

  In order to perform step S6b, as shown in FIG. 48, the optical component 5 is held by the bonding tool 23 (for example, held by suction), and the optical component 5 held by the bonding tool 23 is attached to the sensor chip 3 (this sensor chip). 3 is fixed to the wiring board 2 by the bonding material 10a) and is lowered toward the surface 3a of the sensor chip 3. Then, as shown in FIG. 49, the optical component 5 held by the bonding tool 23 is disposed on the surface 3 a of the sensor chip 3. As a result, the adhesive 11a disposed on the sensor surface SE spreads over almost the entire area of the sensor surface SE. Then, the holding (for example, holding by suction) of the optical component 5 by the bonding tool 23 is stopped (stopped), and only the bonding tool 23 is raised as shown in FIG. 50 (that is, the optical component 5 is moved together with the bonding tool 23). The optical component 5 remains disposed on the sensor chip 3. After that, as shown in FIG. 51, the curing process of the adhesive 11a in step S6c is performed, so that the adhesive 11a is a cured adhesive 11.

  In the present embodiment, in step S6b, the optical component 5 is placed on the surface 3a of the sensor chip 3 while applying a load to the optical component 5. On the other hand, in step S6c, no load is applied to the optical component 5. The adhesive 11a is cured in the state. Specifically, in step S6b, the optical component 5 held by the bonding tool 23 is disposed on the surface 3a of the sensor chip 3 via the plurality of spacers SP1 and the adhesive 11a. Therefore, in step S6b, bonding is performed. The optical component 5 is placed on the surface 3 a of the sensor chip 3 while applying a load by the tool 23 to the optical component 5. On the other hand, in step S6c, the bonding material 11a is cured in a state where the bonding tool 23 is separated from the optical component 5. Therefore, in step S6c, the adhesive material 11a is cured without applying a load to the optical component 5. Become.

  Since the spacer SP1 formed in step S5 has adhesiveness, the optical component 5 arranged on the surface 3a of the sensor chip 3 in step S6b is temporarily fixed by the spacer SP1 (adhesiveness of the spacer SP1). In this temporarily fixed state, the curing step of the adhesive 11a in step S6c is performed. For this reason, it is possible to prevent the optical component 5 from moving in the horizontal direction without pressing (holding) the optical component 5 with the bonding tool 23 or the like in the step of curing the adhesive material 11a in step S6c. In step S6c, the adhesive 11a is cured without pressing (holding) the optical component 5 with the bonding tool 23 or the like without applying a load to the optical component 5, thereby causing interference fringes on the cured adhesive 11. Generation | occurrence | production can be suppressed or prevented, and it can suppress or prevent that the transmittance | permeability of the adhesive material 11 falls.

  As described above, the adhesive material 11 needs to have translucency (light transmission property, light transmission property), and by doing so, the light to the light receiving element PH of the sensor chip 3 is transmitted. Incidence can be prevented from being blocked (obstructed) by the adhesive 11. For this reason, it is necessary to use a translucent adhesive as the adhesive 11a to be disposed (supplied) on the surface 3a of the sensor chip 3 in step S6a. Since the ultraviolet curable adhesive has translucency, an ultraviolet curable adhesive can be suitably used as the adhesive 11a placed on the surface 3a of the sensor chip 3 in step S6a. A thermosetting adhesive may be used as long as the light property can be secured.

  As a process for curing the adhesive 11a in step S6c, a heat treatment (when the adhesive 11a has thermosetting properties) or an ultraviolet irradiation process (when the adhesive 11a has ultraviolet curing properties) is performed. be able to. Further, as the adhesive 11a, an adhesive having both ultraviolet curable properties and thermosetting properties can also be used. In this case, the treatment for curing the adhesive 11a in step S6c includes heat treatment or ultraviolet irradiation. Any of the processing may be performed.

  As an example, in Step S6c, the adhesive 11a can be cured by heating at a temperature of about 120 ° C. for about 30 minutes. This can be performed by placing and heating the wiring board 2 that has been performed up to step S6b in a heating furnace (baking furnace).

In step S6a, the adhesive 11a is preferably disposed on the surface 3a of the sensor chip 3 so as to protrude from the spacer SP1 in a side view. That is, the high _{H 2} of adhesive material 11a disposed on the surface 3a of the sensor chip 3 in step S6a, it is preferable to be higher than the height _{H 1} of the spacer SP1 (i.e. _{H 2> H} 1) . Here, the height H ₂ of the height H ₁ and the adhesive material 11a of the spacer SP1 is also shown in Figure 39, it corresponds to the height of the direction perpendicular to the surface 3a of the sensor chip 3. By doing so, in step S6b (optical component 5 placement step), the adhesive material 11a is spread by the back surface of the optical component 5, and the adhesive material 11a is placed between the front surface 3a of the sensor chip 3 and the back surface of the optical component 5. It can be evenly distributed. The height _{H 1} of the spacer SP1 may be, for example 20~40μm about. The difference between the height _{H 1} of the adhesive 11a of the height _{H 2} and a spacer SP1 (i.e., _"H 2 -H _1") may be, for example 100~200μm about.

  In step S6a, the adhesive 11a is disposed at the center of the sensor surface SE of the surface 3a of the sensor chip 3, and in step S6b (optical component 5 placement step), the adhesive 11a is pressed by the back surface of the optical component 5. It is more preferable that it is spread. At this time, the adhesive material 11a is arranged not in the entire surface of the sensor surface SE but in an area (region) smaller than the area of the sensor surface SE, and the arrangement region of the adhesive material 11a is included in the sensor surface SE (however, The arrangement area of the adhesive material 11a is smaller than the sensor surface SE). Then, by limiting the arrangement area of the adhesive material 11a in step S6a to the central portion, the time required for step S6a (adhesive material 11a arrangement process) can be shortened, and the supply amount of the adhesive material 11a can be easily controlled. In addition, when the optical component 5 is arranged in step S6b, the adhesive material 11a is spread, so that the adhesive material 11a can be evenly distributed between the front surface 3a of the sensor chip 3 and the back surface of the optical component 5. it can.

  Further, in step S6b (optical component 5 placement step), the adhesive material 11a is spread out by the back surface of the optical component 5 so that the adhesive material 11a can be distributed evenly between the front surface 3a of the sensor chip 3 and the back surface of the optical component 5. Therefore, it is preferable to use an adhesive having a relatively low viscosity as the adhesive 11a. On the other hand, as described above, it is preferable to use a relatively high-viscosity adhesive for the spacer SP1 forming adhesive 21 so that it does not easily flow until the curing process in step S5b is performed. For this reason, it is preferable that the viscosity of the adhesive 11a disposed on the surface 3a of the sensor chip 3 in step S6a is lower than the viscosity of the adhesive 21 disposed on the surface 3a of the sensor chip 3 in step S5a. Thereby, it is possible to achieve both the ease of flow of the adhesive 11a in step S6b and the difficulty of flow of the adhesive 21 after step S5a and before the curing process of step S5b.

  The viscosity of the adhesive 11a disposed on the surface 3a of the sensor chip 3 in step S6a can be set to, for example, about 3000 millipascal / second (mPa / second), while being disposed on the surface 3a of the sensor chip 3 in step S5a. The viscosity of the adhesive 21 to be performed can be, for example, about 30000 millipascal / second (mPa / second). This viscosity value is measured with a rotational viscometer.

  In step S6b, when the optical component 5 held by the bonding tool 23 is placed on the surface 3a of the sensor chip 3, the tip of the bonding tool 23 (in contact with the optical component 5 in the bonding tool 23) is seen in plan view. It is preferable to form the spacer SP1 at a position that does not overlap the portion (the portion holding the optical component 5 in the bonding tool 23) 23a. In FIG. 46, the position of the tip 23a of the bonding tool 23 that holds the optical component 5 is indicated by a one-dot chain line. As a result, the load due to the bonding tool 23 is not easily transmitted to the spacer SP1, so that the deformation of the spacer SP1 in step S6b (optical component 5 placement step) can be prevented more accurately. For this reason, the space between the front surface 3a of the sensor chip 3 and the back surface of the optical component 5 when the adhesive material 11a is cured in step S6c can be accurately defined by the spacer SP1, and the layer of the adhesive material 11 having a desired thickness. Can be formed more accurately.

  After the optical component 5 mounting step in step S6, as shown in FIGS. 52 to 56, a spacer SP2 is formed on the surface 5a of the optical component 5 (step S7 in FIG. 12). The spacer SP2 formation process in step S7 is basically the same as the spacer SP1 formation process in step S5 except that the spacer SP2 is formed on the surface 5a of the optical component 5.

  52 (top view), FIG. 53 (A1-A1 cross-sectional view), FIG. 54 (B1-B1 cross-sectional view) and FIG. 55 (C1-C1 cross-sectional view) are the same as FIGS. FIG. 21 is a top view, a cross-sectional view, a cross-sectional view, and a cross-sectional view corresponding to FIG. 20 and shows a stage (state) in which step S7 (spacer SP2 forming step) is performed. 56 is a plan view (top view) showing the sensor chip 3 and the optical component 5 on the sensor chip 3 in the same process steps as those in FIGS. 52 to 55, and corresponds to FIGS. 37 and 46 described above. Yes. In FIG. 56, the sealing portion 7 and the bonding wire BW are seen through.

  The step of forming the spacer SP2 in step S7 can be performed as follows. First, an adhesive (adhesive) 24 for forming the spacer SP2 is disposed (supplied and applied) at a plurality of locations on the surface 5a of the optical component 5 (step S7a in FIG. 15). Then, by curing the adhesive 24, a plurality of spacers SP2 are formed on the surface 5a of the optical component 5 (step S7b in FIG. 15). The spacer SP2 is obtained by curing the adhesive 24. The spacers SP2 are formed at a plurality of locations in the region where the optical component 6 is to be mounted on the surface 5a of the optical component 5.

  The spacer SP2 temporarily defines the distance between the back surface of the optical component 6 to be mounted on the optical component 5 and the front surface 5a of the optical component 5, and temporarily holds the optical component 6 until the adhesive 12a described later is cured. It is provided for fixing. For this reason, the spacer SP2 needs to have adhesiveness (viscosity, tackiness) for temporarily fixing the optical component 6.

The viscosity of the adhesive 24 is increased by the curing process in step S7b. For this reason, the adhesive 24 curing step in step S7b can be regarded as a process for increasing the viscosity of the adhesive 24. That is, when the adhesive 24 is arranged at a plurality of locations of the surface 5a of the optical component 5 in step S7a, the viscosity of the adhesive 24 and the viscosity (Third viscosity) V _3, adhesion after curing in step S7b the viscosity of the wood 24, i.e. the viscosity of the spacer SP2, when the viscosity (4th viscosity) _{V 4,} becomes higher than the viscosity (4th viscosity) _{V 4} viscosity (No. 3 viscosity) _{V 3} (i.e. _{V 4} > V ₃ ). Therefore, spacer SP2 formed of (i.e. adhesive 24 was cured by step S7b) step S7b, higher viscosity than the viscosity _{V 3} of the adhesive 24 of the stage disposed on the surface 5a of the optical component 5 in step S7a It consists V _4, and those having an adhesiveness (viscosity, tackiness).

  As the adhesive 24 to be disposed on the surface 5a of the optical component 5 in step S7a, an ultraviolet curable adhesive is preferable like the adhesive 21. In this case, in step S7b, the adhesive on the surface 5a of the optical component 5 is used. By irradiating 24 with ultraviolet rays, the adhesive 24 is cured to form the spacer SP2.

  In addition, the UV curable adhesive is exposed to air (touched) and does not completely harden even when irradiated with UV light, and has a sticky (viscous, tacky) state. . For this reason, an ultraviolet curable adhesive is used as the spacer 24 for forming the spacer SP2, and in step S7b, the surface of the adhesive 24 arranged on the surface 5a of the optical component 5 has come into contact with the air. It is preferable to cure the adhesive 24 by irradiating the adhesive 24 with ultraviolet rays in the exposed state to form the spacer SP2. Thereby, spacer SP2 which has adhesiveness (viscosity, tackiness) required for temporary fixation of the optical component 6 can be formed easily and exactly.

  Further, as the adhesive 24 to be arranged on the surface 5a of the optical component 5 in step S7a, it is preferable to use an adhesive having a certain degree of high viscosity (viscosity higher than that of the adhesives 11a and 12a), similar to the adhesive 21. Thereby, the adhesive 24 arranged on the surface 5a of the optical component 5 can be prevented from spreading in the lateral direction (planar direction, direction parallel to the surface 5a of the optical component 5) after the arrangement, and a predetermined shape (height) ) Spacer SP2 is easy to form.

  The spacer SP2 is formed on the surface 5a of the optical component 5, but is formed at a position that does not overlap with the sensor surface (sensor region) SE in plan view (that is, the spacer SP2 does not overlap with the sensor surface SE in a plane). Is preferable). This can be realized by setting the position of the adhesive 24 in step S7a so that it does not overlap the sensor surface (sensor region) SE in plan view. By doing so, the spacer SP2 does not affect the incidence of light on the light receiving element PH on the sensor surface SE. Therefore, the spacer SP2 is accurately formed without worrying about translucency. An easy-to-use adhesive can be used for the adhesive 24. In FIG. 56, the position of the sensor surface SE of the sensor chip 3 existing under the optical component 5 is indicated by a two-dot chain line.

  The spacer SP2 is preferably formed along the outer periphery of the surface 5a of the optical component 5 (more preferably along each side (each of four sides) of the surface 5a of the optical component 5) in plan view. The spacer SP2 can be prevented from overlapping with the sensor surface SE in a planar manner, and the above effect can be enjoyed accurately. In addition, when the optical component 6 is disposed later on the surface 5a of the optical component 5, the distance between the surface 5a of the optical component 5 and the back surface of the optical component 6 can be accurately defined by the spacer SP2. The thickness of the layer of the adhesive material 12 can be accurately defined by the height of the spacer SP2.

  Further, on the surface 5a of the optical component 5, when a plurality of spacers SP2 are connected in a plane (integrated) and formed as an integrated object that completely surrounds the outer periphery of the surface 5a of the optical component 5, There is a possibility that a flow path (path) for discharging the air entrained when the optical component 6 is arranged in step S8b described later from the space between the optical component 5 and the optical component 6 to the outside cannot be secured. For this reason, a plurality of spacers SP2 are formed on the surface 5a of the optical component 5, but preferably a plurality of spacers SP2 are formed on each side (each of the four sides) of the optical component 5 having a square planar shape. At this time, the individual spacers SP2 are preferably formed locally. Thereby, not only the corners of the optical component 5 but also each side can secure a flow path (path) for discharging air or the like from between the optical component 5 and the optical component 6 to the outside. It is possible to suppress or prevent the generation of a void between 5 and the optical component 6.

  After the spacer SP2 formation step in step S7, the optical component 6 is mounted on the surface 5a of the optical component 5 (step S8 in FIG. 12). Since the specific configuration of the optical component 6 has already been described above, repeated description thereof is omitted here.

  57 (top view), FIG. 58 (A1-A1 cross-sectional view), FIG. 59 (B1-B1 cross-sectional view) and FIG. 60 (C1-C1 cross-sectional view) are the same as FIGS. FIG. 21 is a top view, a cross-sectional view, a cross-sectional view, and a cross-sectional view corresponding to FIG. 20 and shows a stage (state) in which step S8a (adhesive 12a placement step) is performed. 61 (top view), FIG. 62 (A1-A1 cross-sectional view), FIG. 63 (B1-B1 cross-sectional view), and FIG. 64 (C1-C1 cross-sectional view) are the same as FIG. 17, FIG. 18, FIG. FIG. 21 is a top view, a cross-sectional view, a cross-sectional view, and a cross-sectional view corresponding to FIG. 20, respectively, showing a stage (state) where step S <b> 8 b (optical component 6 placement step) is performed. FIG. 65 is a plan view (top view) showing the sensor chip 3 and the optical components 5 and 6 on the sensor chip 3 in the same process steps as those in FIGS. 61 to 64. FIGS. 37, 46 and FIG. 56. In FIG. 65, the sealing portion 7 and the bonding wire BW are seen through. 66 is a partially enlarged cross-sectional view of the laminated structure of the sensor chip 3, the optical component 5 on the sensor chip 3, and the optical component 6 on the optical component 5 in the same process steps as in FIGS. And corresponds to a cross-sectional view taken along line D3-D3 in region RG4 of FIG.

  The optical component 6 mounting step in step S8 can be performed as follows. First, as shown in FIGS. 57 to 60, an adhesive (adhesive) 12a for bonding the optical component 6 is disposed (supplied and applied) in a region where the optical component 6 is to be mounted on the surface 5a of the optical component 5 (see FIG. 57). Step S8a in FIG. At this time, if foreign matter is deposited or adhered to the surface 5a of the optical component 5, the wettability of the adhesive 12a to be disposed may be reduced (the surface 5a of the optical component 5 does not spread over almost the entire area). For this reason, it is preferable to clean the surface 5a of the optical component 5 by irradiating the surface 5a of the optical component 5 with plasma before placing the adhesive 12a. However, if the plasma is irradiated more than necessary, the surface 5a of the optical component 5 may be damaged, so that this plasma cleaning step is not necessary if foreign matter does not accumulate or adhere. Needless to say. The adhesive material 12a is a paste-like (fluid) adhesive material. Then, as shown in FIGS. 61 to 66, the optical component 6 is arranged (mounted) on the surface 5a of the optical component 5 via the spacer SP2 and the adhesive 12a (step S8b in FIG. 16). In step S8b, the optical component 6 is disposed (mounted) on the surface 5a of the optical component 5 via the spacer SP2 and the adhesive 12a so that the back surface of the optical component 6 faces the surface 5a of the optical component 5. . Then, the adhesive 12a is cured to fix (fix) the optical component 6 to the optical component 5 (step S8c in FIG. 16). The adhesive 12 is cured from the adhesive 12a.

  As can be seen from FIGS. 65 and 66, in step S8b, the plurality of lens portions 13 of the optical component 6 overlap with the plurality of openings 16 of the light shielding layer 15 of the optical component 5, respectively (overlapping in plan view). The optical component 6 is arrange | positioned on the surface 5a of the optical component 5 through several spacer SP2 and the adhesive material 12a. Since the plurality of openings 16 of the light shielding layer 15 of the optical component 5 overlap with the plurality of light receiving elements PH on the surface 3a (sensor surface SE) of the sensor chip 3 (overlap in plan view), the optical component The plurality of lens units 13 of the 6 overlaps with the plurality of light receiving elements PH on the surface 3a (sensor surface SE) of the sensor chip 3 (overlap in plan view).

  The optical component 6 placement step in step S8b and the adhesive 12a curing step in step S8c will be described more specifically with reference to FIGS. Here, FIGS. 67 to 70 are explanatory diagrams of the optical component 6 placement step in step S6b and the adhesive 12a curing step in step S6c, and correspond to FIG. 58 and FIG. 62 (that is, the A1-A1 cross-sectional view). A cross section is shown.

  As shown in FIG. 67, the wiring board 2 that has been subjected to the adhesive material 12a placement process of step S8a is placed (placed) on the stage (mounting table) 22 in the stage of performing step S8b. The stage 22 used in step S8 may be the same as or different from the stage 22 used in step S6. Further, the wiring material 2 is placed (arranged) on the stage 22 and the adhesive 12a placement process in step S8a is performed, or the wiring material 2 is placed on the stage 22 after the adhesive 12a placement process in step S8a. The substrate 2 may be placed (arranged). The wiring substrate 2 is placed (arranged) on the upper surface 22a of the stage 22 with the upper surface 2a side of the wiring substrate 2 facing upward so that the lower surface 2b of the wiring substrate 2 faces the upper surface 22a of the stage 22. .

  In order to perform step S8b, as shown in FIG. 67, the optical component 6 is held (for example, held by suction) by the bonding tool 23, and the optical component 6 held by the bonding tool 23 is optical component 5 (this optical component). 5 is fixed to the sensor chip 3 by the adhesive 11) and is lowered toward the surface 5 a of the optical component 5. Then, as shown in FIG. 68, the optical component 6 held by the bonding tool 23 is disposed on the surface 5 a of the optical component 5. Thereby, the adhesive 12a arranged on the surface 5a of the optical component 5 spreads over almost the entire surface 5a of the optical component 5. Then, the holding (for example, holding by suction) of the optical component 6 by the bonding tool 23 is stopped (stopped), and only the bonding tool 23 is raised as shown in FIG. 69 (that is, the optical component 6 is moved together with the bonding tool 23). The optical component 6 remains disposed on the optical component 5. Thereafter, as shown in FIG. 70, the curing step of the adhesive 12a in step S8c is performed, so that the adhesive 12a is a cured adhesive 12.

  In the present embodiment, in step S8b, the optical component 6 is placed on the surface 5a of the optical component 5 while applying a load to the optical component 6. On the other hand, in step S8c, no load is applied to the optical component 6. The adhesive 12a is cured in the state. Specifically, in step S8b, the optical component 6 held by the bonding tool 23 is disposed on the surface 5a of the optical component 5 via the plurality of spacers SP2 and the adhesive 12a. Therefore, in step S8b, bonding is performed. The optical component 6 is placed on the surface 5 a of the optical component 5 while applying a load by the tool 23 to the optical component 6. On the other hand, in step S8c, the bonding material 12a is cured with the bonding tool 23 away from the optical component 6. Therefore, in step S8c, the adhesive 12a is cured without applying a load to the optical component 6. Become.

  Since the spacer SP2 formed in step S7 has adhesiveness, the optical component 6 disposed on the surface 5a of the optical component 5 in step S8b is temporarily fixed by the spacer SP2 (adhesiveness of the spacer SP2). In this temporarily fixed state, the curing step of the adhesive material 12a in step S8c is performed. For this reason, it is possible to prevent the optical component 6 from moving in the horizontal direction without pressing (holding) the optical component 6 with the bonding tool 23 or the like in the step of curing the adhesive material 12a in step S8c. In step S8c, the adhesive 12a is cured without pressing (holding) the optical component 6 with the bonding tool 23 or the like without applying a load to the optical component 6, thereby causing interference fringes on the cured adhesive 12. Generation | occurrence | production can be suppressed or prevented, and it can suppress or prevent that the transmittance | permeability of the adhesive material 12 falls.

  As described above, the adhesive material 12 is required to have a light transmitting property (light transmitting property, light transmitting property), and by doing so, the light to the light receiving element PH of the sensor chip 3 is transmitted. Incidence can be prevented from being blocked (obstructed) by the adhesive 12. For this reason, it is necessary to use a translucent adhesive as the adhesive 12a disposed (supplied) on the surface 5a of the optical component 5 in step S8a. Since the ultraviolet curable adhesive has translucency, an ultraviolet curable adhesive can be suitably used as the adhesive 12a placed on the surface 5a of the optical component 5 in step S8a. A thermosetting adhesive may be used as long as the light property can be secured.

  As a process for curing the adhesive 12a in step S8c, a heat treatment (when the adhesive 12a has thermosetting properties) or an ultraviolet irradiation process (when the adhesive 12a has ultraviolet curing properties) is performed. be able to. However, when at least a part of the optical component 6 (for example, the lens portion 13) is formed of a resin material (transparent resin) such as acrylic resin, from the viewpoint of avoiding the heating effect on the optical component 6, step S8c. As the process for curing the adhesive 12a, it is more preferable to perform an ultraviolet irradiation process instead of a heat treatment. This is because the adhesive 12a is not sufficiently cured by heat treatment at a temperature lower than the heat-resistant temperature of the optical component 6 (about 90 ° C. when an acrylic resin is used for the lens portion 13 or the like). This is because it is better to cure 12a. For this reason, it is more possible to use an ultraviolet curable adhesive as the adhesive 12a placed on the surface 5a of the optical component 5 in step S8a, and to perform an ultraviolet irradiation process as a process of curing the adhesive 12a in step S8c. preferable.

  On the other hand, even when at least a part of the optical component 6 (for example, the lens portion 13) is formed of a resin material (transparent resin) such as acrylic resin, the optical component 6 is still mounted at the step S6c. Therefore, in step S6c, the adhesive 11a can be cured by heat treatment higher than the heat resistant temperature of the optical component 6. In addition, when the adhesive 11a is cured by heat treatment in step S6c, there is an advantage that there is no portion where the ultraviolet light is not irradiated (does not hit) in the adhesive 11a, in other words, a stable curing process is possible. .

  For this reason, it is more preferable that the adhesive 11a is cured by heat treatment in step S6c, while the adhesive 12a is cured by ultraviolet irradiation processing in step S8c in consideration of the heat resistant temperature of the optical component 6. In this case, the heat resistant temperature of the optical component 6 may be lower than the temperature of the heat treatment in Step S6c (heating temperature for curing the adhesive 11a). Thereby, step S6c (adhesive material 11a hardening process) and step S8c (adhesive material 12a hardening process) can be performed without being influenced by the low heat-resistant temperature of the optical component 6.

  Further, if the same (same kind) adhesive is used for the adhesive 11a used in step S6a and the adhesive 12a used in step S8a, a common adhesive can be used for the adhesive 11a and the adhesive 12a. , Manufacturing (assembly) labor can be reduced. Moreover, since the adhesive 11a arrangement | positioning process of step S6a and the adhesive 12a arrangement | positioning process of step S8a can be performed using the same manufacturing apparatus (adhesive material coating apparatus), a manufacturing process (manufacturing line) is simplified. And manufacturing costs can be reduced. Further, if a common adhesive material having both ultraviolet curable properties and thermosetting properties is used for the adhesive material 11a and the adhesive material 12a, heat treatment is performed as a process for curing the adhesive material 11a in step S6c. In step S8c, an ultraviolet irradiation process can be performed as a process for curing the adhesive 12a.

In step S8a, the adhesive 12a is preferably disposed on the surface 5a of the optical component 5 so as to protrude from the spacer SP2 in a side view. That is, the adhesive 12a of the height _{H 4,} which is disposed on the surface 5a of the optical component 5 in step S8a, it is preferable to be higher than the height _{H 3} of the spacer SP2 (i.e. _{H 4> H} 3) . Here, the height H ₃ of the spacer SP ₂ and the height H ₄ of the adhesive 12 a are also shown in FIG. 58, and correspond to the height in the direction perpendicular to the surface 5 a of the optical component 5. By doing so, in step S8b (optical component 6 placement step), the adhesive 12a is spread by the back surface of the optical component 6, and the adhesive material 12a is placed between the front surface 5a of the optical component 5 and the back surface of the optical component 6. It can be evenly distributed. The height _{H 3} of the spacer SP2 may be, for example 20~40μm about. The difference between the height _{H 3} of the height _{H 4} and the spacer SP2 adhesive 12a (i.e., _"H 4 -H _3") may be, for example 100~200μm about.

  In step S8a, the adhesive material 12a is disposed at the center of the surface 5a of the optical component 5, and in step S8b (optical component 6 placement step), the adhesive material 12a is pushed and spread by the back surface of the optical component 6. It is more preferable to do. At this time, the adhesive material 12a is not disposed on the entire surface 5a of the optical component 5, but in an area (region) smaller than the area of the surface 5a of the optical component 5. Then, by limiting the arrangement region of the adhesive material 12a in step S8a to the central portion, the time required for step S8a (adhesive material 12a arrangement process) can be shortened, and the supply amount of the adhesive material 12a can be easily controlled. At the same time, when the optical component 6 is arranged in step S8b, the adhesive 12a is pushed and spread, so that the adhesive 12a can be evenly distributed between the front surface 5a of the optical component 5 and the back surface of the optical component 6. it can.

  Also, in step S8b (optical component 6 placement step), the adhesive 12a is spread out by the back surface of the optical component 6 so that the adhesive material 12a can be distributed evenly between the front surface 5a of the optical component 5 and the back surface of the optical component 6. Therefore, it is preferable to use a relatively low viscosity adhesive for the adhesive 12a. On the other hand, as described above, it is preferable to use a relatively high-viscosity adhesive for the spacer SP2 forming adhesive 24 so that it does not easily flow until the curing process in step S7b is performed. For this reason, it is preferable that the viscosity of the adhesive 12a disposed on the surface 5a of the optical component 5 in step S8a is lower than the viscosity of the adhesive 24 disposed on the surface 5a of the optical component 5 in step S7a. Thereby, it is possible to achieve both the ease of flow of the adhesive 12a in step S8b and the difficulty of flow of the adhesive 24 after step S7a and before the curing process of step S7b.

  The viscosity of the adhesive 21a disposed on the surface 5a of the optical component 5 in step S8a can be set to, for example, about 3000 millipascal / second (mPa / second), while being disposed on the surface 5a of the optical component 5 in step S7a. The viscosity of the adhesive 24 to be applied can be, for example, about 30000 millipascal / second (mPa / second). This viscosity value is measured with a rotational viscometer.

  In step S8b, when the optical component 6 held by the bonding tool 23 is placed on the surface 5a of the optical component 5, the tip of the bonding tool 23 (in contact with the optical component 6 in the bonding tool 23) in plan view. It is preferable to form the spacer SP2 at a position that does not overlap the portion 23a. In FIG. 65, the position of the tip 23a of the bonding tool 23 that holds the optical component 6 is indicated by a one-dot chain line. Thereby, since the load by the bonding tool 23 is not easily transmitted to the spacer SP2, it is possible to more accurately prevent the spacer SP2 from being deformed in step S8b (optical component 6 placement step). For this reason, the distance between the front surface 5a of the optical component 5 and the back surface of the optical component 6 when the adhesive material 12a is cured in step S8c can be accurately defined by the spacer SP2, and the layer of the adhesive material 12 having a desired thickness can be obtained. Can be formed more accurately.

  In this way, the sensor module MJ1 of the present embodiment as described with reference to FIGS. 1 to 11 is manufactured (assembled).

<Examples of sensor module usage>
FIG. 71 is an explanatory diagram of a finger vein authentication device (vein authentication sensor) 31 using the sensor module MJ1.

  The finger vein authentication device 31 shown in FIG. 71 includes the sensor module MJ1, the container 32 that houses the sensor module MJ1, and the infrared filter 33 that is attached to the container 32 so as to be positioned on the sensor module MJ1. And a light source 34 attached to the container 32.

  The usage principle of the finger vein authentication device 31 will be briefly described. A finger 36 is placed on (placed on) the finger vein authentication device 31, and the finger 36 is irradiated with infrared light from the light source 34, and the reflected light is reflected on the sensor module MJ1. The light received by the plurality of lens portions 13 of the optical component 6 and collected by the lens portions 13 is detected by the light receiving elements PH of the sensor chip 3. Thereby, the pattern of the vein 37 of the finger 36 can be read.

<Main features and effects of sensor module>
Unlike this embodiment, instead of providing the optical components 5 and 6 on the sensor chip, only one lens is arranged above the sensor chip at a certain distance from the sensor chip, and the light is collected by this one lens. In the case of a sensor module configuration in which light is received by the sensor chip, the thickness of the sensor module increases due to the thicker lens and the longer focal length of the lens. If you try to make it thinner, it may cause image distortion.

  On the other hand, the sensor module MJ1 of the present embodiment does not receive the light collected by one lens by the sensor chip 3, but the light collected by the plurality of lens portions 13 of the optical component 6 respectively. The sensor chip 3 (light receiving element PH) receives the light. For this reason, compared with the case where the light collected by one lens is received by the sensor chip 3, in this embodiment, the thickness and focal length of the lens (corresponding to the lens portion 13 in this embodiment) are reduced. The distance from the surface of the lens (corresponding to the lens portion 13 in the present embodiment) to the sensor chip 3 can be shortened. For this reason, the sensor module MJ1 of the present embodiment has a configuration in which the optical component 5 is bonded to the sensor chip 3 (and the optical component 6 is bonded to the optical component 5), and the thickness of the sensor module MJ1 is reduced. Therefore, the sensor module MJ1 can be thinned.

  In the sensor module MJ1 of the present embodiment, the optical component 5 is disposed on the sensor chip 3, and the optical component 5 includes a plurality of openings 16 corresponding to the plurality of light receiving elements PH of the sensor chip 3. Since the layer 15 is provided, each of the plurality of light receiving elements PH of the sensor chip 3 can receive only local light from directly above. Thereby, unnecessary light can be prevented from entering the light receiving element PH of the sensor chip 3, and the sensitivity can be increased.

  The sensor module MJ1 of the present embodiment can be suitably used for a vein authentication (vein recognition) sensor such as the finger vein authentication device 31, but various other sensors, for example, for fingerprint recognition. It can also be used for sensors.

<Main features and effects of sensor module manufacturing process>
In the sensor module having a configuration in which an optical component is bonded to the sensor chip with an adhesive, the thickness of the entire sensor module can be reduced. However, the optical region of the light shielding layer (corresponding to the opening 16) or the lens unit for each pixel of the sensor chip. (Corresponding to the lens unit 13) must be provided. Therefore, also in the sensor module MJ1 of the present embodiment, each opening 16 of the light shielding layer 15 of the optical component 5 and each lens of the optical component 6 are aligned with each pixel (each light receiving element PH) of the sensor chip 3. Since it is necessary to arrange the part 13, the tolerance of the positional deviation of the optical components 5 and 6 with respect to the sensor chip 3 is reduced. Therefore, when manufacturing the sensor module MJ1, it is desirable to mount the optical components 5 and 6 on the sensor chip 3 with high accuracy.

  Therefore, in this embodiment, after a plurality of adhesive spacers SP1 are formed on the surface 3a of the sensor chip 3 in step S5, the paste-like adhesive 11a is disposed on the surface 3a of the sensor chip 3 in step S6a. In step S6b, the optical component 5 is disposed on the surface 3a of the sensor chip 3 via the plurality of spacers SP1 and the adhesive material 11a, and the adhesive material 11a is cured in step S6c.

  The spacer SP1 formed in step S5 has adhesiveness, and in step S6b, the optical component 5 is disposed on the surface 3a of the sensor chip 3 via the plurality of spacers SP1 and the adhesive 11a. The optical component 5 arranged on the surface 3a of the sensor chip 3 is temporarily fixed by the spacer SP1 (adhesiveness of the spacer SP1), and in this temporarily fixed state, the curing step of the adhesive 11a in step S6c is performed. For this reason, since the optical component 5 can be temporarily fixed by the spacer SP1 until the adhesive 11a is cured in step S6c, the optical component 5 is placed on the sensor chip 3 in step S6b and then step S6c. Thus, it is possible to suppress or prevent the optical component 5 from moving with respect to the sensor chip 3 (moving in the horizontal direction) until the curing of the adhesive 11a is completed.

  In this embodiment, in step S6b, the optical component 5 is placed on the surface 3a of the sensor chip 3 while applying a load to the optical component 5, but in step S6c, no load is applied to the optical component 5. To cure the adhesive 11a.

  Unlike this embodiment, when the step of forming the spacer SP1 in step S5 is omitted, there is no spacer SP1 for temporarily fixing the optical component 5 after the optical component 5 is arranged on the surface 3a of the sensor chip 3 in step S6b. For this reason, there is a possibility that the optical component 5 may move before the end of the curing process of the adhesive material 11a in step S6c. As described above, since the tolerance of the positional deviation of the optical component 5 with respect to the sensor chip 3 is small, the optical component 5 after the placement step of the optical component 5 in step S6b and before the end of the curing step of the adhesive 11a in step S6c. It is necessary to prevent the phenomenon that the component 5 moves. For this reason, unlike this embodiment, when the spacer SP1 formation step in step S5 is omitted, after the optical component 5 is arranged on the surface 3a of the sensor chip 3 in step S6b, the adhesive 11a in step S6c It is conceivable to prevent the optical component 5 from moving by pressing the optical component 5 with the bonding tool 23 or the like until the end of the curing process. However, when the optical component 5 is placed on the surface 3a of the sensor chip 3 in step S6b and then the optical component 5 is pressed by the bonding tool 23 or the like until the curing process of the adhesive 11a in step S6c is completed, the optical component The thickness of the adhesive 11 between the optical component 5 and the sensor chip 3 varies due to the load on the optical component 5, interference fringes occur in the cured adhesive 11, and the transmittance of the adhesive 11 decreases. The phenomenon will occur.

  In contrast, in this embodiment, in step S6c, the adhesive 11a is cured without applying a load to the optical component 5 without pressing (holding) the optical component 5 with the bonding tool 23 or the like. After the optical component 5 is arranged on the surface 3a of the sensor chip 3 in step S6b, the optical component 5 can be temporarily fixed by the spacer SP1, so that the optical component 5 is bonded to the bonding tool 23 or the like in the curing process of the adhesive 11a in step S6c. Even without pressing (without holding), it is possible to prevent the optical component 5 from moving in the horizontal direction. In step S6c, the adhesive 11a is cured without pressing (holding) the optical component 5 with the bonding tool 23 or the like without applying a load to the optical component 5, thereby causing interference fringes on the cured adhesive 11. Generation | occurrence | production can be suppressed or prevented, and it can suppress or prevent that the transmittance | permeability of the adhesive material 11 falls.

  The reason why it is possible to prevent interference fringes from being generated in the adhesive 11 and prevent the transmittance of the adhesive 11 from decreasing will be described in more detail. When the optical component 5 is arranged on the sensor chip 3a in step S6a, the load of the bonding tool 23 is applied to the optical component 5 and is transmitted to the adhesive 11a via the optical component 5, but at this stage, the adhesive 11a Curing has not started, and the load applied to the optical component 5 is eliminated by separating the bonding tool 23 from the optical component 5, and the load transmitted to the adhesive 11 a through the optical component 5 is eliminated. The unevenness (interference fringes) that had been made disappears. In step S6c, the optical component 5 is not already held by the bonding tool 23 at the stage of applying the treatment for curing the adhesive 11a (ultraviolet irradiation treatment or heat treatment) to the adhesive 11a. Since no load is applied and no load is transmitted to the adhesive 11a via the optical component 5, the adhesive 11a is cured in a state where there is no unevenness (interference fringes) in the adhesive 11a. Thereby, it is possible to suppress or prevent unevenness (interference fringes) from occurring in the cured adhesive material 11 and to suppress or prevent a decrease in light transmittance of the adhesive material 11.

  Further, when the optical component 5 is arranged on the front surface 3a of the sensor chip 3 in step S6b, the distance between the front surface 3a of the sensor chip 3 and the back surface of the optical component 5 is defined by the height of the spacer SP1. In step S6c, the adhesive 11a is cured without applying a load to the optical component 5 without pressing (holding) the optical component 5 with the bonding tool 23 or the like. For this reason, in Step S6c, since the adhesive 11a is cured in a state where the optical component 5 is not bent, the thickness of the cured adhesive 11 is substantially the same as the height of the spacer SP1. The height of the spacer SP1 can be controlled by adjusting the amount and viscosity of the adhesive material 21 disposed at the position where each spacer SP1 is to be formed on the surface 3a of the sensor chip 3 in step S5a. That is, spacers SP1 having substantially the same height can be formed by disposing the same amount of adhesive having the same viscosity at the position where each spacer SP1 is to be formed. Thereby, the thickness of the adhesive material 11 for every sensor module MJ1 can also be made more uniform.

  Further, unlike the present embodiment, when the spacer SP1 is formed without performing the curing step of step S5b (the adhesive 21 is disposed on the surface 3a of the sensor chip 3, and this is used as the spacer SP1 without curing) In this case, the spacer SP1 has a low viscosity, and it may be difficult to secure the space between the front surface 3a of the sensor chip 3 and the back surface of the optical component 5 with the spacer SP1.

On the other hand, in the present embodiment, the spacer SP1 is formed by step S5a (adhesive 21 arranging step) and step S5b (adhesive 21 curing step). At the time of supply (when supplying to the surface 3a of the sensor chip 3 in step S5a), the viscosity of the adhesive 21 arranged on the surface 3a of the sensor chip 3 in step S5a is increased by step S5b (adhesive 21 curing step). The spacer SP1 having a viscosity higher than that of the adhesive 21 can be formed. For this reason, the space between the front surface 3a of the sensor chip 3 and the back surface of the optical component 5 can be accurately secured by the spacer SP1, and the layer of the adhesive 11 having the same thickness as the spacer SP1 can be accurately obtained. Can be formed. Moreover, it is only necessary to supply to the surface 3a of the sensor chip 3 an adhesive 21 of low viscosity _{V 1} than the viscosity _{V 2} of the spacer SP1 in step S5a (arrangement), the supply of the adhesive material 21 in step S5a (arrangement) is It becomes easier to do.

  Thus, according to the present embodiment, the optical component 5 can be arranged (fixed) on the sensor chip 3 with high accuracy. Therefore, the performance of the manufactured sensor module MJ1 (semiconductor device) can be improved.

  Here, the characteristics and effects of step S5 (spacer SP1 forming step) and step S6 (optical component 5 mounting step) have been described, but step S7 (spacer SP2 forming step) and step S8 (optical component 6 mounting step) are described. Is basically the same.

  Briefly, after a plurality of adhesive spacers SP2 are formed on the surface 5a of the optical component 5 in step S7, a paste-like adhesive 12a is disposed on the surface 5a of the optical component 5 in step S8a. In S8b, the optical component 6 is disposed on the surface 5a of the optical component 5 via the plurality of spacers SP2 and the adhesive material 12a, and the adhesive material 12a is cured in Step S8c. In step S8b, the optical component 6 is placed on the surface 5a of the optical component 5 while applying a load to the optical component 6. In step S8c, the adhesive 12a is cured without applying a load to the optical component 6. Let Therefore, similarly to the optical component 5 in step S6, the optical component 6 can be temporarily fixed by the spacer SP2. Therefore, the optical component 6 is not held (held) by the bonding tool 23 or the like in the curing process of the adhesive 12a in step S8c. If not, the optical component 6 can be prevented from moving in the horizontal direction. In step S8c, the adhesive 12a is cured without pressing (holding) the optical component 6 with the bonding tool 23 or the like without applying a load to the optical component 6, thereby causing interference fringes on the cured adhesive 12. Generation | occurrence | production can be suppressed or prevented, and it can suppress or prevent that the transmittance | permeability of the adhesive material 12 falls. The reason why no interference fringes are generated in the adhesive 12 is basically the same as the reason that no interference fringes are generated in the adhesive 11. Further, since the spacer SP2 is formed by step S7a (adhesive 24 arranging step) and step S7b (adhesive 24 curing step), the surface 5a of the optical component 5 and the optical component 6 are formed similarly to the case of the spacer SP1. The space SP2 can be accurately secured by the spacer SP2, and a layer of the adhesive material 12 having the same thickness as the spacer SP2 can be accurately formed, and the bonding in step S7a can be performed. The material 24 can be easily supplied.

  Thus, according to the present embodiment, the optical component 6 can be arranged (fixed) on the optical component 5 with high accuracy. Therefore, the performance of the manufactured sensor module MJ1 (semiconductor device) can be improved.

<About modification>
In the above embodiment, the case where the spacer SP1 is formed outside the sensor surface (sensor region) SE on the surface 3a of the sensor chip 3 has been described. However, as another form (modified example), the spacer SP1 is replaced with the sensor chip. 3 can be formed on the sensor surface SE, and the spacer SP2 can be formed on the surface 5a of the optical component 5 at a position overlapping the sensor surface SE in a plane (overlapping in plan view). You can also. However, when the spacer SP1 is formed on the sensor surface SE, if the spacer SP1 to be formed is not translucent, a part of the pixel is not irradiated with light, so that the performance of the sensor is deteriorated. When formed in a position overlapping with the surface SE in a planar manner, if the spacer SP2 to be formed does not have translucency, light is not irradiated to a part of the pixel, so that the performance of the sensor is deteriorated. For this reason, when it is desired to suppress degradation of the sensor performance, the spacer SP1 is preferably formed on the surface 3a of the sensor chip 3 at a position avoiding the sensor surface SE (outside the sensor surface SE). The SP 2 is preferably formed at a position on the surface 5a of the optical component 5 that does not overlap the sensor surface SE in a plane (does not overlap in a plan view).

  As another form (modification), the viscosity of the adhesives 11a and 12a used in steps S6a and S8a is the same as that of the spacer forming adhesives 21 and 24 used in steps S5a and S7a. ). However, in this case, since the wettability of the adhesives 11a and 12a is reduced, for example, the adhesive 11a needs to be disposed (applied) in step S6a on almost the entire sensor surface SE. The time for arranging the material 11a becomes long, and it becomes difficult to control the amount of the adhesive 11a applied (protrusions easily), and the same applies to the adhesive 12a. For this reason, as described in the above embodiment, the adhesives 11a and 12a used in steps S6a and S8a are preferably those having a low viscosity. Therefore, the adhesives used in steps S6a and S8a are used. The viscosity of 11a, 12a is more preferably lower than the viscosity of the spacer forming adhesives 21, 24 used in steps S5a, S7a.

  In steps S6b and S8b, mounting using alignment marks can also be performed. That is, in step S6b, the optical component 5 is aligned with the sensor chip 3 based on the alignment marks formed on the sensor chip 3 and the optical component 5, respectively, and then the optical component 5 is attached to the surface 3a of the sensor chip 3. It is preferable to arrange on top. In step S8b, the optical component 6 is aligned with the optical component 5 based on the alignment marks formed on the sensor chip 5 and the optical component 6, and then the optical component 6 is placed on the surface 5a of the optical component 5. It is preferable to arrange on top. This will be specifically described below.

  72 is a plan view (top view) of the sensor chip 3, FIG. 73 is a plan view (top view) of the optical component 5, and FIG. 74 is a plan view (top view) of the optical component 6. FIGS. 8 and FIG. 9 (corresponding to the enlarged views shown in FIGS. 7 to 9 are omitted in FIGS. 72 to 74). The sensor chip 3 in FIG. 72 has an alignment mark AL1 formed on the surface 3a thereof, the optical component 5 in FIG. 73 has an alignment mark AL2 formed on the surface 5a, and the optical component 6 in FIG. An alignment mark AL3 is formed.

  In step S6b, the optical component 5 is aligned with the sensor chip 3 based on the alignment mark AL1 formed on the sensor chip 3 and the alignment mark AL2 formed on the optical component 5, and then the optical component 5 is detected by the sensor. By disposing on the surface 3 a of the chip 3, the horizontal positional accuracy of the optical component 5 with respect to the sensor chip 3 can be improved. After the optical component 5 is arranged on the sensor chip 3 based on the alignment marks AL1 and AL2, the optical component 5 is temporarily fixed by the spacer SP1 as described above, and in this state, the adhesive 11a is cured in step S6c. Therefore, it is possible to manufacture the sensor module MJ1 that directly reflects the high positional accuracy (the accuracy of the position of the optical component 5 with respect to the sensor chip 3) based on the alignment marks AL1 and AL2 in step S6b. Further, it is more preferable that the spacer SP1 is formed on the surface 3a of the sensor chip 3 at a position that does not overlap with the alignment mark AL1 in a plan view, thereby eliminating the influence of the spacer SP1 on the recognition of the alignment mark AL1. it can.

  Similarly, after the alignment of the optical component 6 with respect to the optical component 5 is performed based on the alignment mark AL2 formed on the optical component 5 and the alignment mark AL3 formed on the optical component 6 in step S8b, the optical component By disposing 6 on the surface 5 a of the optical component 5, the horizontal position accuracy of the optical component 6 with respect to the optical component 5 can be improved. After arranging the optical component 6 on the optical component 5 based on the alignment marks AL2 and AL3, the optical component 6 is temporarily fixed by the spacer SP2 as described above, and in this state, the adhesive 12a is cured in step S8c. Therefore, it is possible to manufacture the sensor module MJ1 that directly reflects the high positional accuracy (the positional accuracy of the optical component 6 with respect to the optical component 5) based on the alignment marks AL2 and AL3 in step S8b. Further, it is more preferable that the spacer SP2 is formed on the surface 5a of the optical component 5 at a position that does not overlap with the alignment mark AL2, so that the influence of the spacer SP2 on the recognition of the alignment mark AL2 can be eliminated. it can.

  As mentioned above, the invention made by the present inventor has been specifically described based on the embodiment. However, the invention is not limited to the embodiment, and various modifications can be made without departing from the scope of the invention. Needless to say.

  The present invention is effective when applied to semiconductor device manufacturing technology.

DESCRIPTION OF SYMBOLS 2 Wiring board 2a Upper surface 2b Lower surface 3 Sensor chip 3a Front surface 3b Back surface 4 Electronic component 5 Optical component 5a Surface 6 Optical component 6a Surface 7 Sealing part 10a, 10b, 10c Bonding material 11, 11a, 12, 12a Adhesive material 13 Lens part 14 Base layer 15 Light-shielding layer 16 Opening 17 Base layer 21 Adhesive material 22 Stage 22a Upper surface 23 Bonding tool 23a Tip part 24 Adhesive material 31 Finger vein authentication device 32 Container 33 Infrared filter 34 Light source 36 Finger 37 Veins AL1, AL2, AL3 Alignment mark BL Bonding lead BW Bonding wire CNT Connector MJ1 Sensor module P ₁ , P ₂ , P ₃ pitch PD Pad electrode PH Light receiving element RG1, RG2, RG3, RG4 Area SD1, SD2 Side SE Sensor surface SP1, SP2 Spacer TE1, T E2, TE3 terminal

Claims (15)

A method for manufacturing a semiconductor device comprising the following steps:
(A) preparing a wiring board having an upper surface and a lower surface opposite to the upper surface;
(B) A sensor chip having a first main surface, a sensor region formed on the first main surface, a plurality of pixels formed on the sensor region, and a first back surface opposite to the first main surface. Mounting on the upper surface of the wiring board such that the first back surface faces the upper surface of the wiring board;
(C) The process of arrange | positioning a 1st adhesive material in the multiple places in the said 1st main surface of the said sensor chip;
(D) A step of forming a plurality of first spacers on the first main surface of the sensor chip by curing the first adhesive after the step (c);
(E) after the step (d), placing a paste-like second adhesive on the first main surface of the sensor chip;
(F) After the step (e), the first optical component having a light-shielding layer in which a plurality of optical regions are formed is attached to the first of the sensor chip via the plurality of first spacers and the second adhesive. Placing on one principal surface;
(G) A step of curing the second adhesive after the step (f);
here,
In the step (e), the height of the second adhesive material from the first main surface is higher than the height of the first spacer from the first main surface in a side view. And
In the step (f), the first optical component is disposed on the first main surface of the sensor chip while applying a load to the first optical component,
In the step (g), the second adhesive is cured without applying a load to the first optical component. In the manufacturing method of the semiconductor device according to claim 1,
In the step (f), the first optical component is placed on the sensor chip via the plurality of first spacers and the second adhesive so that the plurality of optical regions respectively overlap the plurality of pixels. A method for manufacturing a semiconductor device, comprising: disposing on a first main surface. The method of manufacturing a semiconductor device according to claim 2.
The method of manufacturing a semiconductor device, wherein the optical region is a region where an opening is formed in the light shielding layer. In the manufacturing method of the semiconductor device according to claim 3,
The first adhesive is an ultraviolet curable adhesive,
In the step (d), the first spacer is formed by irradiating the first adhesive with ultraviolet rays to form the first spacer. In the manufacturing method of the semiconductor device according to claim 3,
In the step (d), the first adhesive material is irradiated with ultraviolet rays while the surface of the first adhesive material disposed on the first main surface of the sensor chip is in contact with air. A method of manufacturing a semiconductor device, comprising: curing one adhesive to form the first spacer. In the manufacturing method of the semiconductor device according to claim 5,
The first optical component has a second main surface and a second back surface opposite to the second main surface,
In the step (f), the first optical component is placed in the plurality of first spacers and the second so that the second back surface of the first optical component faces the first main surface of the sensor chip. Arranged on the first main surface of the sensor chip via an adhesive,
After the step (g),
(H) a step of disposing a third adhesive at a plurality of locations on the second main surface of the first optical component;
(I) A step of forming a plurality of second spacers on the second main surface of the first optical component by curing the third adhesive after the step (h);
(J) After the step (i), placing a paste-like fourth adhesive on the second main surface of the first optical component;
(K) After the step (j), the second optical component having a plurality of lens portions is placed on the second main surface of the first optical component via the plurality of second spacers and the fourth adhesive. Placing on;
(L) A step of curing the fourth adhesive after the step (k);
Have
In the step (j), in a side view, each height of the fourth adhesive from the second main surface is higher than each height of the second spacer from the second main surface. A method for manufacturing a semiconductor device, comprising: The method of manufacturing a semiconductor device according to claim 6.
In the step (k), the second optical component is disposed on the second main surface of the first optical component while applying a load to the second optical component,
In the step (l), the fourth adhesive is cured in a state in which no load is applied to the second optical component. The method of manufacturing a semiconductor device according to claim 7.
The third adhesive is an ultraviolet curable adhesive,
In the step (i), the third spacer is formed by irradiating the third adhesive with ultraviolet rays to form the second spacer. The method of manufacturing a semiconductor device according to claim 8.
In the step (i), by irradiating the third adhesive with ultraviolet rays in a state where the surface of the third adhesive disposed on the second main surface of the first optical component is in contact with air. A method of manufacturing a semiconductor device, comprising: curing the third adhesive material to form the second spacer. In the manufacturing method of the semiconductor device according to claim 9,
In the step (g), the second adhesive is cured by heating,
In the step (l), the fourth adhesive material is cured by ultraviolet rays. The method of manufacturing a semiconductor device according to claim 10.
A method for manufacturing a semiconductor device, wherein the same adhesive is used for the second adhesive and the fourth adhesive. The method of manufacturing a semiconductor device according to claim 11.
The method for manufacturing a semiconductor device, wherein a heat-resistant temperature of the second optical component is lower than a heating temperature for curing the second adhesive in the step (g). In the manufacturing method of the semiconductor device according to claim 12,
In the step (d), the plurality of first spacers are formed at positions avoiding the sensor region on the first main surface of the sensor chip. 14. The method of manufacturing a semiconductor device according to claim 13,
In the step (d), the plurality of first spacers are formed around the sensor region on the first main surface of the sensor chip in plan view. 15. The method of manufacturing a semiconductor device according to claim 14,
In the step (i), the plurality of second spacers are formed at positions that do not overlap the sensor region in plan view.

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