JP2010093124A - Optical component, imaging apparatus, biological information acquisition device, and method of manufacturing optical component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To accomplish a light-shielding structure that has desired characteristics and is easily manufactured. <P>SOLUTION: An optical component has a structure where light-shielding layers 22, 33 having a plurality of openings corresponding to a plurality of lenses 32 are laminated on a transparent substrate 31 having the plurality of lenses 32. A transparent substrate 21 is provided which is pasted to the transparent substrate 31 via the light-shielding layer 33, and the transparent substrate 31, the light-shielding layer 33, the transparent substrate 21 and the light-shielding layer 22 are laminated in this order. The light-shielding structure having desired characteristics is easily manufactured by effectively utilizing normal semiconductor process techniques. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an optical component, an imaging device, a biological information acquisition device, and a method for manufacturing an optical component.

  In recent years, with the strengthening of information security protection, the development of technology related to biometric authentication has been remarkable. Biometric authentication is a technique for identifying a certain individual from other individuals based on the determination whether the biometric information acquired from the individual to be examined is equal to biometric information registered in advance. For example, there are a method for identifying an individual based on the iris of a human pupil, a method for identifying an individual based on a vein pattern such as a human finger, and a method for identifying an individual based on a fingerprint pattern of a finger.

  In biometric authentication, there are various advantages and disadvantages depending on biometric information used for authentication. For example, biometric authentication using a vein pattern has the advantage that it is more difficult to forge authentication than biometric authentication using a fingerprint pattern. The latter has the disadvantage that it is easier to forge authentication than the former.

In order to realize highly accurate biometric authentication, it is necessary to acquire a high-quality biometric image. In this case, it is particularly important to suppress the crosstalk of incident light. In this regard, Patent Document 1 discloses a technique in which a light shielding spacer is disposed between a lens array plate and a sensor. Patent Document 2 discloses a technique in which a light shielding layer is disposed between a microlens array and a light receiving portion.
Japanese Patent Laid-Open No. 3-157602 JP 2008-36058 A

  In order to suppress crosstalk, it is preferable to employ a light shielding structure that separates optical channels from each other. Such a light shielding structure can be manufactured with high accuracy by utilizing a normal semiconductor process technology. However, when the structure of the light shielding structure is complicated, the manufacturing process may be complicated. The complication of process steps may lead to an increase in product unit price, for example. Thus, it is strongly desired to manufacture a light shielding structure having desired characteristics more easily.

  The present invention has been made in order to solve such problems, and realizes a light-shielding structure having desired characteristics and can be easily manufactured, or a light-shielding structure having desired characteristics can be simplified. The purpose is to manufacture.

  An optical component according to the present invention is an optical component in which first and second light shielding layers having a plurality of openings corresponding to a plurality of lenses are laminated on a first substrate having a plurality of lenses, and at least the A second substrate bonded to the first substrate via the first light shielding layer, the first substrate, the first light shielding layer, the second substrate, and the second light shielding layer in this order; Are stacked.

  If such a configuration is adopted, a light shielding structure having desired characteristics can be easily manufactured by utilizing a normal semiconductor process technology.

  The first light shielding layer may be formed immediately above the main surface of the first or second substrate, and the second light shielding layer may be formed immediately above the main surface of the second substrate.

  The thicknesses of the first and second light shielding layers are preferably substantially constant in a plane. The substrate thickness of the second substrate is preferably substantially constant in a plane.

  The first and second light shielding layers preferably have a characteristic of absorbing at least infrared rays.

  An image pickup apparatus according to the present invention is an image pickup apparatus including any one of the optical components described above and an image pickup element having a plurality of pixels that receive light input through the lens. A third light shielding layer having a plurality of corresponding openings is further provided, and the third light shielding layer is formed in the wiring layer of the imaging element.

  The opening width of each opening formed in the first to third light shielding layers is 1/3 or less of the arrangement interval of the lenses, and the optical distance between the first light shielding layer and the second light shielding layer is The optical distance between the second light shielding layer and the third light shielding layer is preferably 1.5 times or more and 2.5 times or less.

  A biological information acquisition apparatus according to the present invention is a biological information acquisition apparatus including any one of the optical components described above and an imaging element having a plurality of pixels that receive light input through the lens. A third light shielding layer having a plurality of openings corresponding to the lens, and the third light shielding layer is formed in the wiring layer of the imaging element.

  The opening width of each opening formed in the first to third light shielding layers is 1/3 or less of the arrangement interval of the lenses, and the optical distance between the first light shielding layer and the second light shielding layer is The optical distance between the second light shielding layer and the third light shielding layer is preferably 1.5 times or more and 2.5 times or less.

  The method for manufacturing an optical component according to the present invention is a method for manufacturing an optical component in which first and second light shielding layers having a plurality of openings corresponding to the plurality of lenses are stacked on a first substrate having a plurality of lenses. A second substrate having the second light-shielding layer formed on the main surface is bonded to the first substrate through at least the first light-shielding layer, and the first substrate, the first light-shielding layer, The second substrate and the second light shielding layer are stacked in this order.

  The first light shielding layer may be formed directly on the main surface of the first or second substrate, and the second light shielding layer may be formed on the main surface of the second substrate.

  The second substrate is preferably bonded to the first substrate via an adhesive.

  ADVANTAGE OF THE INVENTION According to this invention, it can implement | achieve the light-shielding structure which has a desired characteristic and can be manufactured easily, or the light-shielding structure which has a desired characteristic can be manufactured easily.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. Each embodiment is simplified for convenience of explanation. Since the drawings are simple, the technical scope of the present invention should not be interpreted narrowly based on the drawings. The drawings are only for explaining the technical matters, and do not reflect the exact sizes or the like of the elements shown in the drawings. The same elements are denoted by the same reference numerals, and redundant description is omitted. Words indicating directions such as up, down, left, and right are used on the assumption that the drawing is viewed from the front.

[First Embodiment]
Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is an explanatory diagram showing a schematic configuration of the biometric authentication device 100. FIG. 2 is a schematic diagram illustrating a schematic cross-sectional configuration of the imaging apparatus. FIG. 3 is an explanatory diagram for explaining the arrangement relationship between the lens and the aperture. 4 to 7 are process diagrams showing a method for manufacturing the imaging device. FIG. 8 is an explanatory diagram showing a configuration of a mobile phone in which the biometric authentication device is incorporated. FIG. 9 is a top view of the cellular phone in a folded state. FIG. 10 is a schematic block diagram illustrating a system configuration of the biometric authentication apparatus. FIG. 11 is a flowchart for explaining the operation of the biometric authentication apparatus.

  As illustrated in FIG. 1, the biometric authentication device 100 includes a light source 110, a controller 120, and an imaging device 150. A light source 110 and an imaging device 150 are connected to the controller 120. As will be apparent from the description below, the imaging device 150 also functions as a biological information acquisition device.

  The light source 110 is a general semiconductor optical element such as an LED (Light Emitting Diode) or an LD (Laser Diode). The light source 110 outputs infrared rays (near infrared rays to far infrared rays) absorbed by the veins 201 of the human finger 200.

  The imaging device 150 receives light transmitted through the human finger 200, captures an image of the vein 201, and outputs the acquired vein image to the controller 120.

  The controller 120 is, for example, a normal computer. The controller 120 implements various functions by executing a program stored in the storage unit by the CPU. Specifically, the controller 120 drives the light source 110 to output infrared light from the light source 110. Further, the controller 120 drives the imaging device 150 to capture an image of the vein 201 of the finger 200 (hereinafter also referred to as a vein image).

  The controller 120 also performs biometric authentication. The controller 120 calculates the degree of approximation of the biometric information acquired this time with respect to biometric information registered in advance, and determines the current authentication result based on the calculation result. The configuration and operation of the biometric authentication device 100 will be described later with reference to FIGS. 10 and 11.

  FIG. 2 shows a schematic cross-sectional configuration of the imaging device 150. As shown in FIG. 2, the imaging device 150 is formed by laminating an image sensor (imaging device) 10, an intermediate substrate 20, and a lens array substrate 30 in this order. An adhesive layer 40 is formed between the image sensor 10 and the intermediate substrate 20. An adhesive layer 50 is formed between the intermediate substrate 20 and the lens array substrate 30. An optical component is formed by a laminate of the intermediate substrate 20 and the lens array substrate 30.

  This will be specifically described below.

  The image sensor 10 is a general imaging device (CMOS (Complementary Metal Oxide Semiconductor) sensor, CCD (Charge Coupled Device) sensor, etc.).

  The image sensor 10 includes a semiconductor substrate 11 and a wiring layer 12. The semiconductor substrate 11 is a normal silicon substrate. A plurality of pixels PX are two-dimensionally formed on the main surface (imaging surface) of the semiconductor substrate 11. The pixel PX is formed by diffusing impurities into the semiconductor substrate. In the pixel PX, an electric signal having a value corresponding to the incident light intensity is generated. The specific configuration of the semiconductor substrate 11 is arbitrary.

  The wiring layer 12 is formed by depositing an insulating layer such as a silicon oxide layer. A metal wiring functioning as a signal transmission path is embedded in the deposited insulating layer.

  In the present embodiment, a light shielding layer 12 a is formed in the wiring layer 12. In the light shielding layer 12a, an opening OP3 is formed corresponding to each optical axis. The light shielding layer 12a forms a light shielding structure for preventing crosstalk together with other light shielding layers 22 and 33 described later.

The light shielding layer 12a is a metal layer such as aluminum (Al). In the light shielding layer 12a, an opening OP3 corresponding to the lens 32 is formed. The opening OP3 is formed by partially removing the light shielding layer 12a formed on the insulating layer. The light shielding layer 12 a is formed in the process of forming the wiring layer 12 of the image sensor 10. Therefore, the opening OP3 is positioned with high accuracy with respect to the pixel PX. Compared with the case where a light shielding layer 12 a separate from the image sensor 10 is prepared, the light shielding layer 12 a can be positioned with high accuracy with respect to the image sensor 10. It is not necessary to embed the light shielding layer 12a in the wiring layer 12, and the light shielding layer 12a may be formed on the uppermost layer of the wiring layer 12.
The opening means an opening in an optical sense, and the opening may be filled with some substance. The same applies to the other openings OP1 and OP2. Thus, the technical meaning of the opening should be interpreted broadly technically.

  The intermediate substrate 20 is disposed between the image sensor 10 and the lens array substrate 30. The intermediate substrate 20 includes a transparent substrate (second substrate) 21 and a light shielding layer 22.

  The transparent substrate 21 is a plate-like member and is substantially transparent to the light emitted from the light source 110. The transparent substrate 21 is, for example, a glass plate.

  The light shielding layer 22 has a characteristic of absorbing light emitted from the light source 110. In other words, the light shielding layer 22 functions as an infrared absorption layer. The light shielding layer 22 is, for example, a black resin. The light shielding layer 22 has an opening OP2 on the optical axis AX. The opening OP2 is formed by partially removing the light shielding layer 22.

  The lens array substrate 30 includes a transparent substrate (first substrate) 31, a plurality of lenses 32, and a light shielding layer 33.

  The transparent substrate 31 is a plate-like member and is substantially transparent to the light emitted from the light source 110. The transparent substrate 31 is a glass plate, for example.

  The plurality of lenses 32 are two-dimensionally formed on the main surface of the transparent substrate 31. Incident light from the object side is subjected to a lens action on the lens surface of the lens 32 and travels along the optical axis AX while converging toward the pixel PX.

  The light shielding layer 33 has a characteristic of absorbing light emitted from the light source 110. In other words, the light shielding layer 33 functions as an infrared absorption layer. The light shielding layer 33 is, for example, a black resin. The light shielding layer 33 has an opening OP1 on the optical axis AX. The opening OP1 is formed by partially removing the light shielding layer 33.

  The above-mentioned adhesive layers 40 and 50 are formed of a normal thermosetting resin or energy ray curable resin (for example, an ultraviolet curable resin).

  The light transmitted through the lens 32 passes through the transparent substrate 31, the opening OP1 of the light shielding layer 33, the adhesive layer 50, the transparent substrate 21, the opening OP2 of the light shielding layer 22, the adhesive layer 40, and the opening OP3 of the light shielding layer 12a in this order. And input to the pixel PX. In each pixel PX, input light is photoelectrically converted, and an electric signal having a value corresponding to the intensity of the input light is generated. The electric signal generated in each pixel PX is connected to the external bus by the reading operation of the image sensor 10.

  In the present embodiment, the light shielding structure is formed by stacking three light shielding layers (the light shielding layer 33, the light shielding layer 22, and the light shielding layer 12a) along the optical axis AX. More specifically, the light shielding layer 33 is formed on the main surface of the transparent substrate 31 and the light shielding layer 22 is formed on the main surface of the transparent substrate 21 by utilizing a normal thin film forming technique. Further, the light shielding layer 12 a is formed in the wiring layer 12 by utilizing a normal semiconductor process technology.

  By forming the light shielding structure by stacking the light shielding layers having a substantially constant layer thickness in the plane, the thickness of each light shielding layer can be set sufficiently thin. Accordingly, the light shielding layer can be formed and the opening can be easily formed in the light shielding layer without increasing the process time. Moreover, since it is not necessary to form each light shielding layer thickly, it can suppress that the layer thickness of each light shielding layer varies in-plane. By suppressing the thickness of each light shielding layer from varying in the plane, it is possible to suppress the occurrence of partial brightness unevenness in the acquired image.

  As shown in FIG. 3, corresponding to the lens 32, an opening OP1, an opening OP2, an opening OP3, and a pixel PX are arranged on the same axis. The opening width of each opening OP1 to OP3 is opening OP1 ≧ opening OP2 ≧ opening OP3. That is, the opening widths of the openings OP <b> 1 to OP <b> 3 are reduced along the traveling direction of the light emitted from the lens 32. Thereby, the influence of stray light can be effectively reduced.

  2 and 3, the opening width of each of the openings OP1 to OP3 is set to 1/3 or less of the arrangement interval of the lenses 32 (the distance between the optical axes AX of the adjacent lenses 32). ing. In this case, as shown in FIG. 2, the distance along the optical axis AX between the light shielding layer 33 and the light shielding layer 22 is defined as an optical distance OL1, and the distance along the optical axis AX between the light shielding layer 22 and the light shielding layer 12a is optically defined. When the distance OL2 is set, the optical distance OL1 is preferably set to 1.5 to 2 times the optical distance OL2. More preferably, the arrangement interval of the respective light shielding layers is set so that the optical distance OL1 is substantially equal to the optical distance OL2 = 2: 1.

  The opening width of each of the openings OP1 to OP3 is set to 1/3 or less of the arrangement interval of the lenses 32 (the distance between the optical axes AX of the lenses 32 adjacent to each other), and the optical distance OL1 is set to 1.. By setting to 5 times to 2 times, it is possible to improve the characteristics of the light shielding structure formed by stacking three light shielding layers. Thereby, crosstalk can be more effectively suppressed.

  A method for manufacturing the imaging device 150 will be described with reference to FIGS.

  A method of manufacturing the lens array substrate 30 will be described with reference to FIG.

  First, as shown in FIG. 4A, the light shielding layer 33 is formed on the back surface (main surface) of the transparent substrate 31 having the lens 32 formed on the upper surface by a normal thin film forming technique (spin coating or the like). For example, the lens 32 is molded as follows. The lens 32 is molded by irradiating an energy ray curable resin layer (for example, an ultraviolet curable resin) applied to the transparent substrate 31 with an intensity-modulated energy ray and removing an uncured portion of the resin layer. .

  The thickness of the light shielding layer 33 is controlled so as to be substantially constant in the plane. The thickness of the light shielding layer 33 is set to about 0.5 to 5 μm. In general, as the layer thickness increases, it becomes difficult to control the layer thickness. By setting the thickness of the light shielding layer 33 to be thin, it is possible to effectively prevent the thickness of the light shielding layer 33 from being varied in a plane. In addition, the quality of the image finally acquired with the image sensor 10 can be improved by preventing the dispersion | variation in the thickness of the light shielding layer 33 in a plane. For example, the occurrence of partial luminance unevenness in the acquired image can be suppressed.

  Next, as shown in FIG. 4B, the light shielding layer 33 is irradiated with exposure light through a photomask 90.

  Next, as shown in FIG. 4C, the portion of the developer not irradiated with the exposure light is removed. The light shielding layer 33 is a negative resist. Accordingly, a portion that has been deteriorated by exposure to exposure light remains, and a portion that has not been exposed to exposure light is removed by the developer.

  The lens array substrate 30 is manufactured by such a procedure. The opening OP1 is formed by a photolithography process including an exposure process and a development process. Therefore, the arrangement interval of the openings OP1 can be set with high accuracy. In addition, the opening width of the opening OP1 can be set uniformly in the plane. Since the thickness of the light shielding layer 33 is thin, the steps of FIGS. 4A to 4C do not take a long time.

  With reference to FIG. 5, the manufacturing method of the intermediate substrate 20 will be described.

  First, as shown in FIG. 5A, the light shielding layer 22 is formed on the back surface (main surface) of the transparent substrate 21 by a normal thin film forming technique (spin coating or the like).

  The thickness of the light shielding layer 22 is controlled so as to be substantially constant in the plane. The thickness of the light shielding layer 22 is set to about 0.5 to 5 μm. In general, as the layer thickness increases, it becomes difficult to control the layer thickness. By setting the thickness of the light shielding layer 22 to be thin, the thickness of the light shielding layer 22 is effectively suppressed from varying in a plane. In addition, the quality of the image finally acquired with the image sensor 10 can be improved by preventing the dispersion | variation in the thickness of the light shielding layer 22 in a plane. For example, it is possible to suppress the occurrence of partial brightness unevenness in the acquired image.

  Next, as shown in FIG. 5B, the light shielding layer 22 is irradiated with exposure light through a photomask 91.

  Next, as shown in FIG.5 (c), the part which was not irradiated with exposure light with a developing solution is removed. The light shielding layer 22 is a negative resist. Accordingly, a portion that has been deteriorated by exposure to exposure light remains, and a portion that has not been exposed to exposure light is removed by the developer.

  The intermediate substrate 20 is manufactured by such a procedure. The opening OP2 is formed by a photolithography process including an exposure process and a development process. The arrangement interval of the openings OP2 can be set with high accuracy. Further, the opening width of the opening OP2 can be set uniformly in the plane. Since the thickness of the light shielding layer 22 is thin, the steps of FIGS. 5A to 5C do not take a long time.

  With reference to FIG. 6, the bonding process of the lens array substrate 30 to the intermediate substrate 20 will be described.

  First, as shown in FIG. 6A, the adhesive layer 50 is formed on the main surface of the transparent substrate 21 by a normal coating technique (spin coating or the like). The layer thickness of the adhesive layer 50 is about 10 to 30 μm.

  Next, as shown in FIG. 6B, the lens array substrate 30 is disposed on the adhesive layer 50. As a result, the intermediate substrate 20 and the lens array substrate 30 are bonded to each other via the adhesive layer 50.

  In order to suppress crosstalk, it is preferable to secure a sufficient optical distance OL1 between the light shielding layer 33 and the light shielding layer 22. When a thick resin layer is formed between the light shielding layer 33 and the light shielding layer 22 by a general coating method, the quality of an image acquired by the image sensor 10 due to the thickness variation in the surface of the thick resin layer. May deteriorate. For example, partial brightness and darkness may occur in an image due to in-plane luminance variations.

  In the present embodiment, the transparent substrate 21 is bonded to the transparent substrate 31 via the light shielding layer 33. The substrate thickness in the plane of the transparent substrate 21 is controlled to be substantially constant during the manufacturing process of the transparent substrate 21. The optical distance between the light shielding layer 33 and the light shielding layer 22 is ensured by the arrangement of the transparent substrate 31 whose substrate thickness is substantially constant in the plane. As a result, it is possible to suppress degradation of the quality of the image acquired by the image sensor 10.

  With reference to FIG. 7, the process of bonding the laminated body of the intermediate substrate 20 and the lens array substrate 30 to the image sensor 10 will be described.

  First, as shown in FIG. 7A, the adhesive layer 40 is applied on the image sensor 10 by a dispenser (application device) 92.

  Next, as illustrated in FIG. 7B, a stacked body of the intermediate substrate 20 and the lens array substrate 30 is disposed on the adhesive layer 40. As a result, a laminate (a laminate of the intermediate substrate 20 and the lens array substrate 30) is bonded to the image sensor 10. In this way, the imaging device 150 is manufactured.

  As is apparent from the above description, in this embodiment, the light shielding structure is formed by stacking three light shielding layers (the light shielding layer 33, the light shielding layer 22, and the light shielding layer 12a) along the optical axis AX. More specifically, the light shielding layer 33 is formed on the main surface of the transparent substrate 31 and the light shielding layer 22 is formed on the main surface of the transparent substrate 21 by utilizing a normal thin film forming technique. Further, the light shielding layer 12 a is formed in the wiring layer 12 by utilizing a normal semiconductor process technology.

  By forming the light shielding structure by stacking the light shielding layers having a substantially constant layer thickness in the plane, the thickness of each light shielding layer can be set sufficiently thin. Accordingly, the light shielding layer can be formed and the opening can be easily formed in the light shielding layer without increasing the process time. Moreover, since it is not necessary to form each light shielding layer thickly, it can suppress that the layer thickness of each light shielding layer varies in-plane. By suppressing the thickness of each light shielding layer from varying in the plane, it is possible to suppress the occurrence of partial brightness unevenness in the acquired image.

  In the present embodiment, the optical distance between the light shielding layer 33 and the light shielding layer 22 is ensured by disposing the transparent substrate 21 between the light shielding layer 33 and the light shielding layer 22. When the resin layer is formed between the light shielding layer 33 and the light shielding layer 22 by utilizing a normal thin film forming technique, the layer thickness of the resin layer may vary in the plane. If the layer thickness of the layers formed between the light shielding layers varies in the plane, the optical distance of the optical channel formed between each lens 32 and each pixel PX varies in the plane, and the quality of the image acquired by the image sensor 10 May deteriorate. In view of this point, in this embodiment, the transparent substrate 21 having a constant substrate thickness in a plane is disposed between the light shielding layer 33 and the light shielding layer 22. Thereby, it is possible to suppress the optical length between the light shielding layer 33 and the light shielding layer 22 from greatly varying in a plane.

  In the present embodiment, the intermediate substrate 20 is bonded to the lens array substrate 30 to laminate them. In addition, the intermediate substrate 20 is bonded to the image sensor 10 to laminate them. By utilizing the bonding technique, the imaging device 150 can be easily manufactured, and the manufacturing of the imaging device 150 can be prevented from taking a long time. Further, by employing the transparent substrate 21, the layer thickness of the adhesive layers 40 and 50 can be set thin. As a result, it is possible to effectively suppress the channel length of the above-described optical channel from greatly varying in a plane, and promote high-quality image acquisition.

  With reference to FIG.8 and FIG.9, the structure of the mobile telephone (electronic device) in which the biometrics apparatus 100 (imaging device 150) is integrated is demonstrated.

  FIG. 8 shows a mobile phone (mobile communication terminal) 60. The cellular phone 60 incorporates the above-described biometric authentication device (vein authentication device) 100.

  As shown in FIG. 8, the mobile phone 60 includes an upper body (first member) 61, a lower body (second member) 62, and a hinge 63. The upper main body 61 and the lower main body 62 are both plastic plate members and are connected via a hinge 63. The upper main body 61 and the lower main body 62 are configured to be freely opened and closed by a hinge 63. When the upper main body 61 and the lower main body 62 are closed, the mobile phone 60 is a flat plate member in which the upper main body 61 and the lower main body 62 are overlapped.

  The upper body 61 has a display unit 64 on the inner surface thereof. The display unit 64 displays information (name, telephone number) for identifying the called party, an address book stored in the storage unit of the mobile phone 60, and the like. A liquid crystal display device is incorporated under the display unit 64.

  The lower main body 62 has a plurality of buttons 65 on its inner surface. The operator of the mobile phone 60 operates the button 65 to open the address book, make a call, set the manner mode, and operate the mobile phone 60 as intended. The operator of the mobile phone 60 turns on or off the biometric authentication function of the biometric authentication device 100 in the mobile phone 60 based on the operation of the button 65.

  FIG. 9 shows the configuration of the front surface (upper surface) of the mobile phone 60. As shown in FIG. 9, a surface region R80 and a display region R90 are arranged on the front surface of the upper main body 61.

  On the surface region R80, as schematically shown in FIG. 9, a human (subject) finger 200 is placed. The imaging device 150 described above is incorporated under the surface region R80. In the display area R90, characters (time, operation state, destination name, etc.) are displayed. A liquid crystal display device is incorporated under the display region R90.

  Finally, the configuration and operation of the biometric authentication device 100 will be schematically described with reference to FIGS.

  As illustrated in FIG. 10, the biometric authentication device 100 includes a processing unit 81, an authentication execution unit 82, a storage unit 84, a light source 85, and a vein image acquisition unit 86. The light source 85 corresponds to the light source 110. The vein image acquisition unit 86 corresponds to the imaging device 150.

  The biometric authentication device 100 is formed including a normal computer in which a vein image acquisition unit 86 and a light source 85 are connected to an interface. The biometric authentication device 100 should not be limited to the configuration shown in FIG.

  The biometric authentication device 100 operates as shown in FIG.

  In the initial state, the mobile phone 60 in which the biometric authentication device 100 is incorporated is in a non-operating state.

  First, the biometric authentication function of the mobile phone 60 is activated (S11). A specific method for activating the biometric authentication function is arbitrary. For example, when the operator's finger is placed on the front surface of the cover plate, the capacitance sensor is caused to output a detection signal. The output signal of the capacitance sensor is connected to the processing unit 81 via a flexible wiring. The processing unit 81 drives the light source 85 based on the detection signal from the capacitance sensor, and causes the vein image acquisition unit 86 to acquire a vein image.

  Next, image reading is executed (S12). The processing unit 81 instructs the vein image acquisition unit 86 to output an acquired image. The vein image acquisition unit 86 outputs the acquired image data to the bus based on the readout instruction from the processing unit 81.

  Next, the processing unit 81 performs image processing on the acquired image data input via the bus (S13).

  Next, the authentication execution part 82 performs authentication (S14). The authentication execution unit 82 performs biometric authentication based on the authentication image output from the processing unit 81 and the vein image image registered in advance in the storage unit 84. For example, the authentication execution unit 82 determines that the authentication is successful if the branching mode of the veins between the two images matches at N (N: a natural number of 2 or more) or more, and the branching mode of the veins matches between the two images. If there are less than N locations, authentication failure is determined (S15). The specific method of authentication depends on the image processing method, and should not be limited to the above example.

  If the authentication is successful, the function of the mobile phone in which the biometric authentication device 100 is incorporated is activated (S16). Then, the mobile phone returns to a normal operation state. Note that in the case of authentication failure, the mobile phone in which the biometric authentication device 100 is incorporated maintains a non-operating state.

  In this way, by incorporating the biometric authentication device 100 into a mobile phone, the security performance of the mobile phone is dramatically improved.

[Second Embodiment]
Hereinafter, a second embodiment of the present invention will be described with reference to FIG. FIG. 12 is a schematic diagram illustrating a schematic cross-sectional configuration of the imaging apparatus.

  In the present embodiment, the light shielding layer 33 is formed on the upper surface (main surface) of the transparent substrate 21. Even in such a case, the same effect as the first embodiment can be obtained.

  The technical scope of the present invention is not limited to the above-described embodiment. The use of the optical component is not limited to the above-described embodiment. The use of the imaging device is not limited to the above-described embodiment. The present invention can also be applied to biological information other than vein images. Materials such as a substrate and a lens are arbitrary.

It is explanatory drawing which shows schematic structure of the biometrics apparatus 100 concerning the 1st Embodiment of this invention. 1 is a schematic diagram illustrating a schematic cross-sectional configuration of an imaging apparatus according to a first embodiment of the present invention. It is explanatory drawing for demonstrating the arrangement | positioning relationship between the lens concerning 1st Embodiment of this invention, and opening. It is process drawing which shows the manufacturing method of the imaging device concerning the 1st Embodiment of this invention. It is process drawing which shows the manufacturing method of the imaging device concerning the 1st Embodiment of this invention. It is process drawing which shows the manufacturing method of the imaging device concerning the 1st Embodiment of this invention. It is process drawing which shows the manufacturing method of the imaging device concerning the 1st Embodiment of this invention. It is explanatory drawing which shows the structure of the mobile telephone with which the biometrics apparatus concerning the 1st Embodiment of this invention is integrated. 1 is a top view of a cellular phone in a folded state according to a first embodiment of the present invention. It is a schematic block diagram which shows the system configuration | structure of the biometrics apparatus concerning the 1st Embodiment of this invention. It is a flowchart for demonstrating operation | movement of the biometrics apparatus concerning the 1st Embodiment of this invention. It is a schematic diagram which shows schematic sectional structure of the imaging device concerning the 2nd Embodiment of this invention.

Explanation of symbols

10 Image sensor 11 Semiconductor substrate 12 Wiring layer 12a Light shielding layer 20 Intermediate substrate 21 Transparent substrate 22 Light shielding layer 30 Lens array substrate 31 Transparent substrate 32 Lens 33 Light shielding layer 40 Adhesive layer 50 Adhesive layer 60 Mobile phone 61 Upper body 62 Lower body 63 Hinge 64 Display unit 65 Button 81 Processing unit 82 Authentication execution unit 84 Storage unit 85 Light source 86 Vein image acquisition unit 90 Photomask 91 Photomask

100 Biometric authentication device 110 Light source 120 Controller 150 Imaging device

200 finger 201 vein

AX Optical axis OL1 Optical distance OL2 Optical distance OP1 Opening OP2 Opening OP3 Opening PX Pixel R80 Surface area R90 Display area

Claims (12)

An optical component in which first and second light shielding layers having a plurality of openings corresponding to a plurality of lenses are laminated on a first substrate having a plurality of lenses,
A second substrate bonded to the first substrate through at least the first light shielding layer;
An optical component in which the first substrate, the first light shielding layer, the second substrate, and the second light shielding layer are laminated in this order. The first light shielding layer is formed directly on the main surface of the first or second substrate,
The optical component according to claim 1, wherein the second light shielding layer is formed immediately above the main surface of the second substrate.   3. The optical component according to claim 1, wherein the layer thicknesses of the first and second light shielding layers are substantially constant in a plane.   4. The optical component according to claim 1, wherein the substrate thickness of the second substrate is substantially constant in a plane. 5.   5. The optical component according to claim 1, wherein the first and second light shielding layers have characteristics of absorbing at least infrared rays. The optical component according to any one of claims 1 to 5,
An imaging device having a plurality of pixels that receive light input through the lens;
An imaging device comprising:
A third light-shielding layer having a plurality of openings corresponding to the plurality of lenses;
The imaging device, wherein the third light shielding layer is formed in a wiring layer of the imaging element. The opening width of each opening formed in the first to third light shielding layers is 1/3 or less of the arrangement interval of the lenses,
An optical distance between the first light shielding layer and the second light shielding layer is 1.5 times or more and 2.5 times or less of an optical distance between the second light shielding layer and the third light shielding layer. The imaging device according to claim 6. The optical component according to any one of claims 1 to 5,
An imaging device having a plurality of pixels that receive light input through the lens;
A biological information acquisition device comprising:
A third light-shielding layer having a plurality of openings corresponding to the plurality of lenses;
The third light shielding layer is a biological information acquisition device formed in a wiring layer of the imaging element. The opening width of each opening formed in the first to third light shielding layers is 1/3 or less of the arrangement interval of the lenses,
An optical distance between the first light shielding layer and the second light shielding layer is 1.5 times or more and 2.5 times or less of an optical distance between the second light shielding layer and the third light shielding layer. The biological information acquisition apparatus according to claim 8. A method of manufacturing an optical component in which first and second light shielding layers having a plurality of openings corresponding to a plurality of lenses are laminated on a first substrate having a plurality of lenses,
Bonding the second substrate having the second light-shielding layer formed on the main surface to the first substrate through at least the first light-shielding layer;
A method of manufacturing an optical component, wherein the first substrate, the first light shielding layer, the second substrate, and the second light shielding layer are laminated in this order. Forming the first light-shielding layer directly on the main surface of the first or second substrate;
The method of manufacturing an optical component according to claim 10, wherein the second light shielding layer is formed immediately above the main surface of the second substrate.   The method of manufacturing an optical component according to claim 10 or 11, wherein the second substrate is bonded to the first substrate via an adhesive.

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