JP2015038900A - Electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily connect a terminal of a component forming a part of an electric circuit including a wiring part disposed at a housing.SOLUTION: A circuit component module according to one embodiment includes: an attachment member; a component; and a conductive part. The attachment member is fixed to a housing of an electronic apparatus where a wiring part forming a part of an electric circuit is disposed on a surface of the housing. The component has a terminal and forms the part of the electric circuit. The conductive part is formed by a conductive adhesive, is disposed at the attachment member, and fixes the terminal to the attachment member. The conductive part is electrically connected with the wiring part.

Description

  Embodiments described herein relate generally to a circuit component module and an electronic apparatus.

  Conventionally, a wiring part is formed by applying a conductive adhesive to the inner surface of a casing as an insulator, and an electric circuit is formed by connecting a connector terminal to the conductive adhesive forming the wiring part. Technology is known.

JP 2005-268521 A

  However, in the prior art, since the terminal of the connector is directly connected to the conductive adhesive disposed on the inner surface of the housing, the connecting operation of the terminal becomes difficult if the structure in the housing is complicated.

  The present invention has been made in view of the above, and facilitates connection of terminals of components constituting a part of an electric circuit including a wiring portion arranged in a housing. With the goal.

  The circuit component module according to the embodiment includes an attachment member, a component, and a conductive portion. The mounting member is fixed to the casing of the electronic device in which a wiring portion that constitutes a part of the electric circuit is disposed on the surface of the casing. The component has a terminal and constitutes a part of the electric circuit. The conductive portion is made of a conductive adhesive and is disposed on the mounting member, and the terminal is fixed to the mounting member. The conductive portion is electrically connected to the wiring portion.

FIG. 1 is a perspective view of an electronic apparatus according to an embodiment. FIG. 2 is an exploded perspective view showing a part of an electric circuit provided in the housing of the electronic device according to the first embodiment. FIG. 3 is a cross-sectional view showing a part of the housing and the circuit component module of the electronic device according to the first embodiment. FIG. 4 is a cross-sectional view showing the circuit component module according to the first embodiment. FIG. 5 is a perspective view showing components of the circuit component module according to the first embodiment as viewed from the back side. FIG. 6 is a perspective view showing the mounting member of the circuit component module according to the first embodiment when viewed from the component mounting surface side. 7 is a cross-sectional view of the circuit component module taken along line F7-F7 in FIG. FIG. 8 is a perspective view showing the mounting member of the circuit component module according to the second embodiment when viewed from the component mounting surface side. FIG. 9 is a view showing a circuit component module according to the second embodiment and is a cross-sectional view corresponding to FIG. FIG. 10 is a perspective view showing the mounting member of the circuit component module according to the third embodiment as viewed from the component mounting surface side. FIG. 11 is a view showing a circuit component module according to the third embodiment and is a cross-sectional view corresponding to FIG. FIG. 12 is a perspective view showing the mounting member of the circuit component module according to the fourth embodiment when viewed from the component mounting surface side. FIG. 13 is a view showing a circuit component module according to the fourth embodiment and is a cross-sectional view corresponding to FIG. FIG. 14 is a cross-sectional view showing a part of a housing and a circuit component module of an electronic device according to the fourth embodiment. FIG. 15 is a cross-sectional view showing a part of a housing and a circuit component module of an electronic device according to a fifth embodiment. 16 is a view taken in the direction of arrow F16 in FIG. FIG. 17 is a diagram illustrating a circuit component module according to the fifth embodiment. FIG. 18 is a perspective view showing a part of the inside of the housing according to the fifth embodiment. FIG. 19 is a cross-sectional view showing a part of a housing of an electronic device and a circuit component module according to the sixth embodiment. 20 is a view taken in the direction of arrow F20 in FIG. FIG. 21 is a diagram illustrating a circuit component module according to the sixth embodiment. 22 is a view taken in the direction of arrow F22 in FIG.

  Hereinafter, a circuit component module and an electronic apparatus according to embodiments will be described in detail with reference to the drawings. Note that similar components are included in the following embodiments. Therefore, in the following, common reference numerals are given to those similar components, and redundant description is omitted.

<First Embodiment>
First, the first embodiment will be described with reference to FIGS. 1 to 7.

  As shown in FIG. 1, an electronic apparatus 1 according to the present embodiment is configured as a so-called notebook personal computer, and includes a rectangular flat first main body 2 and a rectangular flat second body. A main body 3. The first main body 2 and the second main body 3 are connected by a hinge mechanism 4 so as to be relatively rotatable between a deployed state shown in FIG. 1 and a folded state (not shown) around a rotation axis Ax. ing.

  A circuit board on which a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), and other electronic components are mounted inside the housing 2a of the first main body 2 (sometimes (Not shown), a hard disk, a cooling fan, and the like are accommodated. The first main body 2 is provided with a keyboard 5 as an input operation unit in a state of being exposed on the outer surface 2b side of the housing 2a. On the other hand, the second main body 3 is provided with a display (for example, an LCD (Liquid Crystal Display)) 6 as a display unit in a state of being exposed on the outer surface 3b side of the housing 3a. As shown in FIG. 1, in the unfolded state, the keyboard 5 and the display 6 are exposed, and the user can use them.

  The casing 2a of the first main body 2 is formed in a flat box shape. As shown in FIG. 2, the bottom wall 2c and the side wall 2d erected on the peripheral edge of the bottom wall 2c. And have. The housing 2a can be obtained, for example, by forming an insulating layer made of synthetic resin or the like on the surface of a molded metal member or molding an insulating material such as a synthetic resin material. Such a housing 2a has an insulating property.

  A plurality of wiring portions 11 are arranged on the inner surface 2e of the housing 2a, specifically on the inner surface 2e of the bottom wall portion 2c. A circuit component module 12 disposed inside the housing 2a is electrically connected to the wiring portion 11. The wiring part 11 constitutes an electric circuit 13 with the circuit component module 12 and the circuit board described above.

  Each wiring part 11 is formed in a linear shape. In the present embodiment, the wiring portion 11 is made of an insulating adhesive. The wiring part 11 is fixed to the inner surface 2e of the housing 2a by applying an insulating adhesive, for example, on the inner surface 2e of the housing 2a by using a dispenser or screen printing, and drying by heating. be able to. The wiring part 11 connects the circuit component module 12 and the circuit board described above. Here, the insulating property is ensured in the portion where the wiring portion 11 is disposed in the housing 2a. Thus, in the electronic device 1, the wiring part 11 which comprises a part of electric circuit 13 is arrange | positioned on the surface of the housing | casing 2a. In addition, the part by which the wiring part 11 is arrange | positioned in the housing | casing 2a may be the same plane as the surrounding part, and may comprise the concave shape.

  As shown in FIGS. 2 to 4, the circuit component module 12 includes a component (electrical component) 14, a mounting member 15 to which the component 14 is fixed, and a plurality of components connected to the component 14 and arranged on the mounting member 15. And a conductive portion 16.

  The component 14 is a connector such as a USB connector and constitutes a part of the electric circuit 13. The component 14 is not limited to a connector, and may be an electrical component such as a resistor or a capacitor. As shown in FIGS. 3 to 5, the component 14 includes a main body 14a and a plurality of terminals 14b protruding from the main body 14a. The main body portion 14a is formed with an inlet portion 14c into which a USB terminal (not shown) is inserted. The inlet portion 14c is inserted into an opening 2f provided in the side wall portion 2d of the housing 2a. Yes.

  As shown in FIGS. 3, 4, and 6, the attachment member 15 is formed in a substantially rectangular shape. The attachment member 15 connects the component arrangement surface 15a on which the component 14 is arranged, the overlapping surface 15b on the opposite side of the component arrangement surface 15a and superimposed on the housing 2a, and the component arrangement surface 15a and the overlapping surface 15b. Side surface 15e. The attachment member 15 is fixed to the housing 2a. Specifically, the overlapping surface 15b is fixed to the inner surface 2e of the bottom wall portion 2c of the housing 2a by a fixing portion 17 made of, for example, an adhesive. This fixing is not limited to using an adhesive, and may be, for example, screwing.

  The outer surface 15d of the attachment member 15 is provided with a recess 15c in which the conductive portion 16 is disposed. The recess 15 c is provided corresponding to each terminal 14 b of the component 14. The concave portion 15c is provided in a concave shape toward the overlapping surface 15b on the component arrangement surface 15a, and opens to the side of the component arrangement surface 15a.

  The conductive portion 16 is made of a conductive adhesive and forms a part of the electric circuit 13. As shown in FIGS. 3 and 4, the conductive portion 16 is disposed on the attachment member 15, and the terminal 14 b of the component 14 is fixed to the attachment member 15. The conductive portion 16 is disposed on the outer surface 15 d of the attachment member 15. Specifically, the conductive portion 16 is disposed in the concave portion 15c of the attachment member 15, and as illustrated in FIGS. 3 and 7, is linearly disposed on the side surface 15e from the concave portion 15c toward the overlapping surface 15b. The conductive portion 16 is disposed around the terminal 14b inserted into the recess 15c, and fixes the terminal 14b to the attachment member 15 by adhesion.

  The conductive portion 16 is electrically connected to the wiring portion 11 disposed in the housing 2a. For this connection, for example, the end portion (other end portion) 16b on the overlapping surface 15b side of the conductive portion 16 may protrude from the overlapping surface 15b and contact the wiring portion 11, or the overlapping surface 15b side of the conductive portion 16 may be contacted. The end portion (other end portion) 16b may be buried in the wiring portion 11 to connect them. Furthermore, you may connect the edge part 16b by the side of the overlapping surface 15b in the electroconductive part 16, and the wiring part 11 with a conductive adhesive. As described above, in the present embodiment, the end portion (one end portion) 16a on the component placement surface 15a side of the conductive portion 16 supports the terminal 14b, and the end portion (other end portion) 16b on the overlapping surface 15b side of the conductive portion 16 is supported. Is connected to the wiring portion 11.

  As described above, in the present embodiment, the component 14 is included in the circuit component module 12, and the terminal 14b of the component 14 is connected to the conductive portion 16 formed of a conductive adhesive. Therefore, the operation of connecting the terminal 14 b of the component 14 to the conductive portion 16 in the manufacturing process of the circuit component module 12 can be performed outside the housing 2 a of the electronic device 1. Therefore, according to the circuit component module 12 of the present embodiment, the connection of the terminal 14b of the component 14 that constitutes a part of the electric circuit 13 including the wiring portion 11 disposed in the housing 2a (connection to the conductive portion 16). ) Can be easily performed.

  Moreover, in this embodiment, since the attachment member 15 and the electroconductive part 16 are contained in the circuit component module 12, the application | coating operation | work (placement operation | work) of the electroconductive part 16 to the attachment member 15 is performed outside the housing | casing 2a. Can do. Therefore, according to the circuit component module 12 of the present embodiment, the application work of the conductive portion 16 to the mounting member 15 can be easily performed.

  Moreover, in this embodiment, since the component 14 is fixed to the housing | casing 2a via the attachment member 15, attachment of the component 14 can be stabilized comparatively. Further, in this embodiment, since the component 14 is fixed to the housing 2a via the mounting member 15, the force acting on the component 14 due to deformation of the housing 2a or the like is suppressed by the mounting member 15. Can do.

Second Embodiment
Next, a second embodiment will be described with reference to FIGS.

  The present embodiment is basically the same as the first embodiment, but the structure of the attachment member 15A of the circuit component module 12A is different from the first embodiment.

  The recess 15cA provided on the outer surface 15d of the mounting member 15A of the present embodiment is formed in a groove shape extending from the component placement surface 15a to the overlapping surface 15b, and extends from the component placement surface 15a to the side surface 15e. It is formed in a letter shape. The conductive portion 16 is disposed in the recess 15cA. An end 16a (not shown in FIGS. 8 and 9) on the component placement surface 15a side of the conductive portion 16 supports the terminal 14b (see FIG. 5), and an end 16b (on the overlapping surface 15b side of the conductive portion 16) ( 8 and 9 are connected to the wiring portion 11 (see FIG. 2).

  Also in the present embodiment described above, as in the first embodiment, the component 14 is included in the circuit component module 12A, and the terminal 14b of the component 14 is connected to the conductive portion 16 formed of a conductive adhesive. . Therefore, according to the circuit component module 12A of the present embodiment, as in the first embodiment, the terminal 14b of the component 14 constituting a part of the electric circuit 13 including the wiring portion 11 disposed in the housing 2a. Connection (connection to the conductive portion 16) can be easily performed.

<Third Embodiment>
Next, a third embodiment will be described with reference to FIGS.

  This embodiment is basically the same as the second embodiment, but the structure of the attachment member 15B of the circuit component module 12B is different from that of the second embodiment.

  The recess 15cB provided on the outer surface 15d of the mounting member 15B of this embodiment is formed in a linear groove shape extending from the component placement surface 15a to the overlapping surface 15b, and the conductive portion 16 is disposed in the recess 15cB. Has been. An end 16a (not shown in FIGS. 10 and 11) on the component placement surface 15a side of the conductive portion 16 supports the terminal 14b (see FIG. 5), and an end portion 16b (on the overlapping surface 15b side of the conductive portion 16) ( 10 and 11 are not connected to the wiring portion 11 (see FIG. 2).

  Also in the present embodiment described above, as in the second embodiment, the component 14 is included in the circuit component module 12B, and the terminal 14b of the component 14 is connected to the conductive portion 16 formed of a conductive adhesive. . Therefore, according to the circuit component module 12B of the present embodiment, as in the second embodiment, the terminal 14b of the component 14 constituting a part of the electric circuit 13 including the wiring portion 11 disposed in the housing 2a. Connection (connection to the conductive portion 16) can be easily performed.

<Fourth embodiment>
Next, a fourth embodiment will be described with reference to FIGS.

  This embodiment is basically the same as the first embodiment, but the structure of the attachment member 15C of the circuit component module 12C is different from that of the first embodiment.

  As shown in FIGS. 12 and 13, the attachment member 15 </ b> C of the present embodiment is provided with a through hole 15 m instead of the recess. The through hole 15m extends from the component placement surface 15a to the overlapping surface 15b, and the conductive portion 16 is placed (filled). The through hole 15m is provided corresponding to each terminal 14b of the component 14. The end 16a (not shown in FIGS. 12, 13, and 14) on the component placement surface 15a side of the conductive portion 16 supports the terminal 14b (see FIG. 5), and the end of the conductive portion 16 on the overlapping surface 15b side. 16b (FIG. 14) is connected to the wiring part 11 (FIG. 14). FIG. 14 shows an example in which the end portion 16b on the overlapping surface 15b side of the conductive portion 16 protrudes from the overlapping surface 15b and is brought into contact with the wiring portion 11. In this connection, for example, the end portion (other end portion) 16b on the overlapping surface 15b side of the conductive portion 16 may be buried in the wiring portion 11 and connected. Furthermore, you may connect the edge part 16b by the side of the overlapping surface 15b in the electroconductive part 16, and the wiring part 11 with a conductive adhesive.

  Also in the present embodiment described above, as in the first embodiment, the component 14 is included in the circuit component module 12C, and the terminal 14b of the component 14 is connected to the conductive portion 16 formed of a conductive adhesive. . Therefore, according to the circuit component module 12C of the present embodiment, as in the first embodiment, the terminal 14b of the component 14 constituting a part of the electric circuit 13 including the wiring portion 11 disposed in the housing 2a. Connection (connection to the conductive portion 16) can be easily performed.

<Fifth Embodiment>
Next, a fifth embodiment will be described with reference to FIGS.

  The present embodiment is basically the same as the first embodiment, but the structure of the attachment member 15D of the circuit component module 12D is different from the first embodiment.

  As shown in FIGS. 15, 16, and 17, the attachment member 15D of the present embodiment has a plate portion 15h and a support portion 15i fixed to the plate portion 15h by adhesion or the like, and is substantially L-shaped. I am doing.

  The plate portion 15h is provided with a pair of plate surfaces 15j and a side surface 15k connecting the pair of plate surfaces 15j. The component 14 is arranged on one plate surface 15j (the right plate surface 15j in FIGS. 16 and 17) of the plate portion 15h, and the side surface 15k of the plate portion 15h is overlapped with the inner surface 2e which is the surface of the housing 2a. . The side surface 15k of the plate portion 15h is fixed to the inner surface 2e of the bottom wall portion 2c of the housing 2a by adhesion by the fixing portion 17.

  The plate portion 15h is provided with a through hole 15m penetrating the pair of plate surfaces 15j. The through hole 15m is provided corresponding to each terminal 14b of the component 14. A terminal 14b is inserted into the through hole 15m.

  The support portion 15i is formed in a rectangular shape and is connected to one plate surface 15j of the plate portion 15h. The support portion 15i is fixed to the inner surface 2e of the bottom wall portion 2c of the housing 2a by adhesion by the fixing portion 17. The component 14 is fixed to the support portion 15i by bonding or the like. With this fixing structure, the support portion 15 i supports the component 14.

  In this embodiment, the conductive portion 16 is disposed in the through hole 15m of the plate portion 15h to fix the terminal 14b to the plate portion 15h, and the other plate surface 15j of the plate portion 15h (on the left side in FIGS. 16 and 17). It is arranged along the plate surface 15j). And the edge part by the side of the other board surface 15j of the board part 15h in the electroconductive part 16 is connected to the wiring part 11 (refer FIG. 16, 18) arrange | positioned at the housing | casing 2a. This connection may be performed by bringing the end portion of the conductive portion 16 into contact with the wiring portion 11, or the end portion of the conductive portion 16 may be buried in the wiring portion 11 to connect them. Furthermore, you may connect the edge part of the electroconductive part 16, and the wiring part 11 with a conductive adhesive.

  Also in the present embodiment described above, as in the first embodiment, the component 14 is included in the circuit component module 12D, and the terminal 14b of the component 14 is connected to the conductive portion 16 formed of a conductive adhesive. Yes. Therefore, according to the circuit component module 12D of the present embodiment, as in the first embodiment, the terminal 14b of the component 14 constituting a part of the electric circuit 13 including the wiring portion 11 disposed in the housing 2a. Connection (connection to the conductive portion 16) can be easily performed.

<Sixth Embodiment>
Next, a sixth embodiment will be described with reference to FIGS.

  The present embodiment is basically the same as the first embodiment, but the structure of the attachment member 15E of the circuit component module 12E is different from the first embodiment. Moreover, the component 14 of this embodiment is a reverse type connector with respect to the component 14 of 1st Embodiment.

  As shown in FIGS. 19 to 21, the mounting member 15E of the present embodiment includes a plate portion 15h and a support portion 15i that is spaced apart from the plate portion 15h. The plate portion 15h The component 14 is sandwiched between the support portion 15i. The structure of the plate part 15h and the support part 15i is the same as that of the fifth embodiment.

  The support portion 15 i is fixed to the inner surface 2 e of the bottom wall portion 2 c of the housing 2 a by the fixing portion 17. A component 14 sandwiched between the plate portions 15h is fixed to the support portion 15i. This fixing is performed by, for example, the connecting portion 18 made of an adhesive.

  The plate portion 15h is disposed away from the inner surface 2e of the bottom wall portion 2c of the housing. The side surface 15k of the plate portion 15h faces the inner surface 2e of the side wall portion 2d of the housing 2a. The component 14 is arranged on one plate surface 15j (the lower plate surface 15j in FIGS. 20 and 21) of the plate portion 15h of the plate portion 15h.

  In the plate portion 15h, the terminal 14b of the component 14 is fixed by the conductive portion 16 disposed in the through hole 15m.

  As shown in FIG. 22, the conductive portion 16 arranged on the plate portion 15h protrudes from the plate portion 15h as shown in FIG. 22, and this end portion is a side wall portion 2d of the housing 2a as shown in FIG. The conductive portion 16 and the wiring portion 11 are connected to each other by abutting against the wiring portion 11 disposed on the inner surface 2e. In this connection, the end portion of the conductive portion 16 may be buried in the wiring portion 11 and connected to each other. Furthermore, the end portion of the conductive portion 16 and the wiring portion 11 may be electrically bonded. You may connect by an agent.

  In the present embodiment described above, as in the first embodiment, the component 14 is included in the circuit component module 12E, and the terminal 14b of the component 14 is connected to the conductive portion 16 formed of a conductive adhesive. Yes. Therefore, according to the circuit component module 12E of the present embodiment, as in the first embodiment, the terminal 14b of the component 14 constituting a part of the electric circuit 13 including the wiring portion 11 disposed in the housing 2a. Connection (connection to the conductive portion 16) can be easily performed.

  Note that the present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. Moreover, various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the embodiment. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, the constituent elements over different embodiments may be appropriately combined.

  DESCRIPTION OF SYMBOLS 1 ... Electronic device, 2a ... Housing, 2e ... Inner surface (surface), 11 ... Wiring part, 12, 12A, 12B, 12C, 12D, 12E ... Circuit component module, 13 ... Electric circuit, 14 ... Component, 14b ... Terminal , 15, 15A, 15B, 15C, 15D, 15E ... mounting member, 15a ... component placement surface, 15b ... overlapping surface, 15c, 15cA, 15cB ... recess, 15d ... outer surface, 15m ... through hole, 15h ... plate part, 15i ... support portion, 15j ... plate surface, 15k ... side surface, 16 ... conductive portion.

Embodiments of the present invention relates to electronic devices.

Electronic apparatus embodiment is a housing, wherein the mounting member, and the component, further comprising: a. A wiring part is disposed on the inner surface of the casing. The attachment member includes a first surface provided with a recess and a second surface superimposed on the inner surface. The attachment member was provided with a conductive portion electrically connected to the wiring portion . A terminal that protrudes into the recess and is electrically connected to the conductive portion is projected from the component .

Claims (10)

An attachment member fixed to the housing of the electronic device in which a wiring portion constituting a part of the electric circuit is disposed on the surface of the housing;
A part having a terminal and constituting a part of the electric circuit;
A conductive portion configured by a conductive adhesive and disposed on the mounting member and fixing the terminal to the mounting member; electrically connected to the wiring portion;
A circuit component module comprising:   The circuit component module according to claim 1, wherein the conductive portion is disposed on an outer surface of the attachment member.   The circuit component module according to claim 1, wherein a concave portion in which the conductive portion is disposed is provided on an outer surface of the mounting member.   The circuit component module according to claim 3, wherein the terminal is inserted into the recess. The mounting member has a component arrangement surface on which the components are arranged, and an overlapping surface that is a surface opposite to the component arrangement surface and is overlapped with the housing.
The concave portion is formed in a groove shape from the component placement surface to the overlapping surface,
5. The end portion on the component placement surface side of the conductive portion supports the terminal, and the end portion on the overlapping surface side of the conductive portion is connected to the wiring portion. Circuit component module. The mounting member has a component arrangement surface on which the components are arranged, and an overlapping surface that is a surface opposite to the component arrangement surface and is overlapped with the housing.
The mounting member is provided with a through hole in which the conductive portion is arranged from the component arrangement surface to the overlapping surface,
2. The circuit component module according to claim 1, wherein an end portion on the component placement surface side of the conductive portion supports the terminal, and an end portion on the overlapping surface side of the conductive portion is connected to the wiring portion. The mounting member has a plate portion provided with a pair of plate surfaces and a side surface connecting the pair of plate surfaces.
The circuit component module according to claim 1, wherein the component is disposed on one plate surface of the plate portion, and a side surface of the plate portion is overlapped with a surface of the housing.   The circuit component module according to claim 7, wherein the attachment member includes a support portion that is connected to one plate surface of the plate portion, supports the component, and is fixed to the housing. The attachment member has a support portion fixed to the housing,
The circuit component module according to claim 7, wherein the component sandwiched between the plate portions is fixed to the support portion. A housing,
The circuit component module according to any one of claims 1 to 9 disposed in the housing,
An electronic device characterized by comprising:

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