JP2015034837A - Near infrared absorptive composition, near infrared cut filter using the same, and camera module and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a near infrared absorptive composition which suppresses unevenness in the state of a coating surface and variation in infrared absorptive performance of a film.SOLUTION: The near infrared absorptive composition contains a copper complex and a solvent, characterized in that a ratio of solid content of the composition ranges from 10 mass% to 90 mass%, and a boiling point of the solvent ranges from 90°C to 200°C.

Description

  The present invention relates to a near-infrared absorbing composition, a near-infrared cut filter using the same, a manufacturing method thereof, a camera module, and a manufacturing method thereof.

In recent years, CCDs and CMOS image sensors, which are solid-state image sensors for color images, have been used in video cameras, digital still cameras, mobile phones with camera functions, etc., but these solid-state image sensors are sensitive to near infrared rays in their light receiving parts. Therefore, it is necessary to perform visibility correction, and a near-infrared cut filter (hereinafter also referred to as an IR cut filter) is often used.
As a material for forming such a near-infrared cut filter, a near-infrared absorbing composition is known (Patent Documents 1 and 2). In Patent Document 1, such a near-infrared absorbing composition is layered by vapor deposition or the like to form a near-infrared cut layer. Moreover, in patent document 2, the infrared cut layer is formed by application | coating.

International Publication WO99 / 26952 Pamphlet Japanese Patent Laid-Open No. 11-52127

In recent years, a near-infrared cut filter used for a solid-state imaging device has been required to be thin. In order to reduce the film thickness, it is necessary to increase the ratio of the solid content (particularly, the copper complex that absorbs near infrared rays) in the near infrared absorbing composition. However, as the inventors of the present application have examined, when the solid content ratio of the copper complex or the like is increased, when the film is formed by coating the near-infrared absorbing composition, unevenness occurs in the coated surface, and the redness of the film It was found that the external absorption performance varies.
The present invention aims to solve the problems of the prior art, and suppresses unevenness of the coated surface when forming a film by coating a near infrared absorbing composition, and absorbs near infrared light. It aims at providing the near-infrared absorptive composition which can suppress the dispersion | variation in performance.

Under such circumstances, the inventor of the present application has intensively studied. As a result, in the near-infrared absorbing composition, by adopting a solvent having a boiling point of 90 to 220 ° C., the solid content concentration can be 10 to 90% by mass. In order to complete the present invention, the present inventors have found that it is possible to provide a near-infrared absorptive composition that maintains high near-infrared cut performance and further suppresses unevenness of the coating film surface and variation in near-infrared absorption performance. It came. Although this mechanism is not clear, when the near-infrared absorbing composition is dried as a film, the surface is microscopically removed by removing the solvent by drying or the like while ensuring uniformity in the thickness direction of the film as much as possible. Planarity, position dependency of reflectance, and position dependency of refraction angle are reduced. In order to achieve this, it is important to balance the drying speed and the viscosity change at the time of drying. However, depending on the combination of these, variations in the surface shape and the absorption performance may be good or bad. In the present invention, it is presumed that the drying speed and the viscosity change at the time of drying are well balanced by combining the solid content of the copper complex or the like which is the governing factor of viscosity and the boiling point of the solvent within a certain range.
Specifically, the above problem has been solved by the following means <1>, preferably by <2> to <16>.
<1> A near-infrared absorptive composition containing a copper complex and a solvent, wherein the ratio of the solid content of the near-infrared absorptive composition is 10 to 90% by mass, and the boiling point at 1 atm of the solvent is 90 to 90%. The near-infrared absorptive composition which is 200 degreeC.
<2> The near-infrared absorbing composition according to <1>, wherein the density of the solvent is 0.90 g / cm ³ or more.
<3> The near-infrared absorbing composition according to <1> or <2>, wherein the solvent has a boiling point of 110 to 180 ° C.
The near-infrared absorptive composition in any one of <1>-<3> whose ratio of a copper complex is 30-90 mass% with respect to solid content of a <4> near-infrared absorptive composition.
<5> The solvent according to any one of <1> to <4>, wherein the solvent is at least one selected from alcohols, ketones, esters, ethers, aromatic hydrocarbons, and halogenated hydrocarbons. Near-infrared absorbing composition.
<6> The near infrared ray according to any one of <1> to <5>, wherein the solvent is at least one of propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, cyclohexanone, and ethyl-3-ethoxypropionate. Absorbent composition.
<7> At least the solvent is selected from propylene glycol, propylene glycol monomethyl ether acetate, butoxypropanol, ethoxypropanol, ethyl lactate, dipropylene glycol monomethyl ether, butoxyethanol, dimethylformamide, dimethylsulfoxide, dimethylacetamide and methyldiglyme The near-infrared absorptive composition in any one of <1>-<5> which is 1 type.
<8> The near-infrared absorbing composition according to any one of <1> to <7>, further containing a polymerizable compound.
The near-infrared absorptive composition in any one of <1>-<8> whose compounding quantity of a solvent is 30-65 mass% in a <9> near-infrared absorptive composition.
The near-infrared absorptive composition in any one of <1>-<9> whose <10> copper complex is a phosphate ester copper compound.
The near-infrared absorptive composition in any one of <1>-<10> which has on a <11> image sensor for solid-state image sensors, and is used by forming a coating film.
<12> Near-infrared cut filter produced using the near-infrared absorptive composition in any one of <1>-<11>.
<13> A camera module having a solid-state image sensor substrate and the near-infrared cut filter according to <12> disposed on the light receiving side of the solid-state image sensor substrate.
<14> A method for manufacturing a camera module having a solid-state image sensor substrate and a near-infrared cut filter disposed on the light-receiving side of the solid-state image sensor substrate, wherein <1> to <11> The manufacturing method of a camera module which has the process of forming a film | membrane by apply | coating the near-infrared absorptive composition in any one of.
<15> The method for producing a camera module according to <14>, comprising curing the film formed by applying the near-infrared absorbing composition by light irradiation.
<16> A near-infrared absorptive composition containing a copper compound and a solvent, wherein the ratio of the solid content of the near-infrared absorptive composition is 10 to 90% by mass, and the boiling point of the solvent at 1 atm is 90%. The near-infrared absorptive composition which is -200 degreeC.

  According to the present invention, it is possible to provide a near-infrared absorptive composition in which unevenness on the coated surface and variations in the infrared absorption performance of the film are suppressed.

It is a schematic sectional drawing which shows the structure of the camera module provided with the solid-state image sensor which concerns on embodiment of this invention. It is a schematic sectional drawing of the solid-state image sensor board | substrate which concerns on embodiment of this invention.

  Hereinafter, the contents of the present invention will be described in detail. The description of the constituent elements described below may be made based on typical embodiments of the present invention, but the present invention is not limited to such embodiments. In the present specification, a numerical range represented by using “to” means a range including numerical values described before and after “to” as a lower limit value and an upper limit value.

In the present specification, “(meth) acrylate” represents acrylate and methacrylate, “(meth) acryl” represents acryl and methacryl, and “(meth) acryloyl” represents acryloyl and methacryloyl. In the present specification, “monomer” and “monomer” are synonymous. The monomer in the present invention is distinguished from an oligomer and a polymer and refers to a compound having a weight average molecular weight of 2,000 or less. In the present specification, the polymerizable compound means a compound having a polymerizable functional group, and may be a monomer or a polymer. The polymerizable functional group refers to a group that participates in a polymerization reaction. In addition, in the description of the group (atomic group) in this specification, the description which does not describe substitution and non-substitution includes what has a substituent with what does not have a substituent. For example, the “alkyl group” includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group).
The near infrared ray in the present invention refers to those having a wavelength region of 700 to 2500 nm.

  The near-infrared absorptive composition of the present invention, a near-infrared cut filter, a camera module having such a near-infrared cut filter and a solid-state image sensor substrate, and a method for producing the camera module will be described in detail. The description of the constituent elements described below may be made based on typical embodiments of the present invention, but the present invention is not limited to such embodiments.

The near-infrared absorbing composition of the present invention (hereinafter sometimes referred to as “the composition of the present invention”) contains a copper compound and a solvent, and the solid content of the near-infrared absorbing composition is 10 to 90. The solvent has a boiling point of 90 to 200 ° C.
The composition of the present invention is a near-infrared absorbing composition containing a copper complex and a solvent, and the solid content of the near-infrared absorbing composition is 10 to 90% by mass. The boiling point is 90 to 200 ° C.
Hereinafter, these contents will be described in detail.

<Copper compound>
The composition of the present invention contains a copper compound and is contained in a proportion of 30 to 90% by mass, preferably 60 to 90% by mass, more preferably 60 to 80% by mass, based on the solid content of the composition. To do. Only one type of copper compound may be used, or two or more types may be used, and in the case of two or more types, the total amount is in the above range.
The copper compound used in the present invention is not particularly limited as long as it is a copper compound having a maximum absorption wavelength in a wavelength range of 700 nm to 1000 nm (near infrared region).
The copper compound used in the present invention may be a copper complex or not a copper complex, but is preferably a copper complex.
When the copper compound used in the present invention is a copper complex, the ligand L coordinated to copper is not particularly limited as long as it can be coordinated to a copper ion, but sulfonic acid, phosphoric acid, phosphate ester, Examples thereof include compounds having phosphonic acid, phosphonic acid ester, phosphinic acid, phosphinic acid ester, carboxylic acid, carbonyl (ester, ketone), amine, amide, sulfonamide, urethane, urea, alcohol, thiol and the like. Among these, carboxylic acid, carbonyl (ester, ketone), sulfonic acid, phosphoric acid, amine, phosphoric acid ester, phosphonic acid, phosphonic acid ester, phosphinic acid, phosphinic acid ester are preferable, and sulfonic acid, phosphoric acid ester, phosphonic acid Acid esters and phosphinic acid esters are more preferable.
Specific examples of the copper compound used in the present invention are more preferably a phosphorus-containing copper compound, a sulfonic acid copper compound, a carboxylic acid copper compound, or a copper compound represented by the following general formula (1). As the phosphorus-containing compound, specifically, compounds described in WO2005 / 030898, page 5, line 27 to page 7, line 20 can be referred to, and the contents thereof are described in the present specification. Incorporated.

（一般式（１）中、Ｌは、銅に配位する配位子を表し、Ｘは、存在しないか、ハロゲン原子、Ｈ₂Ｏ、ＮＯ₃、ＣｌＯ₄、ＳＯ₄、ＣＮ、ＳＣＮ、ＢＦ₄、ＰＦ₆、ＢＰｈ₄（Ｐｈはフェニル基を表す）、アルコールを表す。ｎは、１〜４の整数を表す。） The copper compound used in the present invention is preferably represented by the following general formula (1).

(In the general formula (1), L represents a ligand coordinated to copper, and X does not exist or is a halogen atom, H ₂ O, NO ₃ , ClO ₄ , SO ₄ , CN, SCN, BF ₄ , PF ₆ , BPh ₄ (Ph represents a phenyl group) and alcohol. N represents an integer of 1 to 4.)

L represents a ligand coordinated to copper. The ligand is not particularly limited as long as it can coordinate with a copper ion, but preferably has a substituent containing C, N, O, S as an atom capable of coordinating to copper, and more preferably Those having a group having a lone electron pair such as N, O, and S are preferred.
The preferred ligand L has the same meaning as the ligand L described above. Moreover, the group which can be coordinated is not limited to 1 type in a molecule | numerator, 2 or more types may be included, and dissociation or non-dissociation may be sufficient. In the case of non-dissociation, X is not present.

X is preferably NO ₃ , ClO ₄ , SO ₄ , SCN, BF ₄ , PF ₆ , BPh ₄ .
n is preferably 1-2.

<< Phosphate ester copper compound >>
The phosphate ester copper compound which is an example of the copper compound used in the present invention is preferably formed using a phosphate ester compound, and more preferably formed using a compound represented by the following formula (A). preferable.
Formula (A)
_{(HO) n -P (= O} ) - (OR 2 _3-n
Wherein R ² represents an alkyl group having 1 to 18 carbon atoms, an aryl group having 6 to 18 carbon atoms, an aralkyl group having 1 to 18 carbon atoms, or an alkenyl group having 1 to 18 carbon atoms, or —OR ² Represents a polyoxyalkyl group having 4 to 100 carbon atoms, a (meth) acryloyloxyalkyl group having 4 to 100 carbon atoms, or a (meth) acryloyl polyoxyalkyl group having 4 to 100 carbon atoms, and n is 1 or 2)
When n is 1, R ² may be the same or different.

In the above formula, at least one of —OR ² preferably represents a (meth) acryloyloxyalkyl group having 4 to 100 carbon atoms or a (meth) acryloyl polyoxyalkyl group having 4 to 100 carbon atoms, It is more preferable to represent 4 to 100 (meth) acryloyloxyalkyl groups.
Carbon number of a C4-C100 polyoxyalkyl group, a C4-C100 (meth) acryloyloxyalkyl group, or a C4-C100 (meth) acryloyl polyoxyalkyl group is 4-4, respectively. It is preferably 20, and more preferably 4-10.
In formula (A), R ² is preferably an alkyl group having 1 to 18 carbon atoms or an aryl group having 6 to 18 carbon atoms, an alkyl group having 1 to 10 carbon atoms, or an aryl having 6 to 10 carbon atoms. It is more preferably a group, more preferably an aryl group having 6 to 10 carbon atoms, and particularly preferably a phenyl group.
In the present invention, when n is 1, one of R ² is —OR ² and is a (meth) acryloyloxyalkyl group having 4 to 100 carbon atoms or a (meth) acryloyl poly having 4 to 100 carbon atoms. It is preferable to represent an oxyalkyl group, and the other is preferably —OR ² or an alkyl group.
Examples of phosphoric acid ester compounds include phosphoric acid monoesters (n = 2 in the above formula (A)) and phosphoric acid diesters (n = 1 in the above formula (A)). From the viewpoint of solubility, phosphoric acid diester is preferred.

The phosphate ester copper compound is preferably in the form of a copper complex in which a phosphate ester is coordinated to copper as a central metal. Copper in the phosphate ester copper complex is divalent copper, and can be produced, for example, by a reaction between a copper salt and a phosphate ester. Therefore, if it is a near-infrared absorption composition containing copper and a phosphate ester compound, it is foreseen that the phosphate ester copper complex is formed in the composition.
The molecular weight of the phosphate ester copper compound used in the present invention is preferably 300 to 1500, and more preferably 320 to 900.

  Specific examples of the compound forming the ligand include the following exemplary compounds (A-1) to (A-219).

表中「＊」は、酸素分子との結合部位を表す。

In the table, “*” represents a binding site with an oxygen molecule.

表中「＊」は、酸素分子との結合部位を表す。

In the table, “*” represents a binding site with an oxygen molecule.

表中「＊」は、上記式との結合部位を表す。

In the table, “*” represents a binding site with the above formula.

表中「＊」は、ＣＯＯＨ基との結合部位を表す。

In the table, “*” represents a binding site with a COOH group.

表中「＊」は、上記一般式との結合部位を表す。

In the table, “*” represents a binding site with the above general formula.

表中「＊」は、窒素原子との結合部位を表す。

In the table, “*” represents a binding site with a nitrogen atom.

表中「＊」は、上記一般式との結合部位を表す。

In the table, “*” represents a binding site with the above general formula.

表中「＊」は、上記一般式との結合部位を表す。

In the table, “*” represents a binding site with the above general formula.

表中「＊」は、上記一般式との結合部位を表す。

In the table, “*” represents a binding site with the above general formula.

表中「＊」は、金属原子との結合部位を表す。

In the table, “*” represents a bonding site with a metal atom.

表中「＊」は、上記一般式との結合部位を表す。
表中「＊＊」は、金属原子との結合部位を表す。

In the table, “*” represents a binding site with the above general formula.
In the table, “**” represents a bonding site with a metal atom.

表中「＊」は、上記一般式との結合部位を表す。
表中「＊＊」は、金属原子との結合部位を表す。

In the table, “*” represents a binding site with the above general formula.
In the table, “**” represents a bonding site with a metal atom.

表中「＊」は、上記一般式との結合部位を表す。
表中「＊＊」は、金属原子との結合部位を表す。

In the table, “*” represents a binding site with the above general formula.
In the table, “**” represents a bonding site with a metal atom.

表中「＊」は、上記一般式との結合部位を表す。
表中「＊＊」は、金属原子との結合部位を表す。

In the table, “*” represents a binding site with the above general formula.
In the table, “**” represents a bonding site with a metal atom.

表中「＊」は、酸素分子との結合部位を表す。

In the table, “*” represents a binding site with an oxygen molecule.

As a method for synthesizing the compound forming the ligand, it can be synthesized with reference to a known method. For example, the following phosphate ester is obtained by adding triethylamine to a tetrahydrofuran (THF) solution of 2,4-dimethylpentanol and stirring at 0 ° C. for 5 minutes, dropping phosphorus oxychloride and then stirring at room temperature for 6 hours. The reaction is terminated. After the reaction is completed, the reaction solution is decanted with water so that the temperature does not increase by 30 ° C. or more, liquid separation is performed with chloroform / water, and the solvent in the organic layer is distilled off to obtain the following phosphate ester. it can.

Moreover, in the synthesis | combination of a phosphate ester copper compound, you may use phosphonic acids, such as phosmer M, phosmer PE, phosmer PP (made by Unichemical Co., Ltd.), as a commercial item, for example.
The copper salt used here is preferably divalent or trivalent copper, and more preferably divalent copper. Copper salts include copper acetate, copper chloride, copper formate, copper stearate, copper benzoate, copper ethyl acetoacetate, copper pyrophosphate, copper naphthenate, copper citrate, copper nitrate, copper sulfate, copper carbonate, copper chlorate Copper (meth) acrylate is more preferable, copper benzoate and copper (meth) acrylate are more preferable.

  Specific examples of the copper compound used in the present invention include the following exemplified compounds (Cu-1) to (Cu-219). Needless to say, the present invention is not limited to these examples.

<Solvent>
The composition of the present invention contains a solvent. The solvent may be one type or a mixture of two or more types.
The boiling point of the solvent is 90 to 200 ° C., preferably 110 to 180 ° C., more preferably 120 to 160 ° C. at 1 atmosphere. By setting the boiling point of the solvent within this range, it is possible to achieve both uniformization of the coating surface and suppression of variations due to repeated application of near infrared absorption.
In the case of a solvent mixture containing two or more kinds of solvents, the boiling point is a weighted average of the boiling points of the respective solvents with respect to the total solvent at the respective weight ratios.
The density of the solvent used in the composition of the present invention is preferably 0.90 g / cm ³ or more, more preferably 0.91 g / cm ³ or more, more preferably 0.94 g / cm ³ or more. By setting the density of the solvent within this range, both the uniformity of the coated surface and the variation due to repeated application of near infrared absorptivity tend to be further improved. The upper limit of the solvent density is not particularly limited, but is usually 1 g / cm ³ .
In this specification, unless otherwise indicated, the density represents the density when measured at 1 atm and 20 ° C. When two or more types of solvents are included, the density is a weighted average of the density of each solvent relative to the total solvent at each weight ratio.

As the solvent used in the present invention, when the solvent is one kind, a solvent having a boiling point of 90 to 200 ° C. at 1 atm as exemplified below can be selected. Moreover, in the case of a mixed solvent, the solvent illustrated below can be selected so that what carried out weighted average of the boiling point of each solvent with respect to all the solvents in each weight ratio may become 90-200 degreeC. In addition, when mixing and using 2 or more types of solvents, it is preferable to mix and use the thing whose boiling point in 1 atmosphere is 150 degrees C or less, and a boiling point of 151-200 degreeC.
Examples of alcohols include methanol, ethanol, n-propanol, isopropanol, n-butanol, sec-butanol, n-hexanol, propylene glycol, butoxypropanol, ethoxypropanol, butoxyethanol, and the like.
As ketones, for example, acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, cyclopentanone, 2-heptanone, 3-heptanone, and the like,
Examples of esters include ethyl acetate, n-butyl acetate, n-amyl acetate, isobutyl acetate, amyl formate, isoamyl acetate, isobutyl acetate, ethyl propionate, butyl propionate, isopropyl butyrate, ethyl butyrate, butyl butyrate, Methyl lactate, ethyl lactate, dimethyl phthalate, ethyl benzoate, methyl sulfate, alkyl oxyacetate (eg, methyl oxyacetate, ethyl oxyacetate, butyl oxyacetate (eg, methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, ethoxy Methyl acetate, ethyl ethoxyacetate, etc.), 3-oxypropionic acid alkyl esters (eg, methyl 3-oxypropionate, ethyl 3-oxypropionate, etc. (eg, methyl 3-methoxypropionate, 3-methoxypropionic acid) Ethyl, 3-etho Methyl cypropionate, ethyl 3-ethoxypropionate, etc.), 2-oxypropionic acid alkyl esters (eg, methyl 2-oxypropionate, ethyl 2-oxypropionate, propyl 2-oxypropionate, etc. (for example, Methyl 2-methoxypropionate, ethyl 2-methoxypropionate, propyl 2-methoxypropionate, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate)), methyl 2-oxy-2-methylpropionate and 2- Ethyl oxy-2-methylpropionate (eg, methyl 2-methoxy-2-methylpropionate, ethyl 2-ethoxy-2-methylpropionate, etc.), methyl pyruvate, ethyl pyruvate, propyl pyruvate, methyl acetoacetate , Ethyl acetoacetate, 2-oxobut Methyl phosphate, ethyl and 2-oxobutanoate, and,
Examples of ethers include diethylene glycol dimethyl ether (methyl diglyme), dipropylene glycol dimethyl ether, tetrahydrofuran, diethyl ether, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether acetate, methyl cellosolve acetate, ethyl cellosolve acetate, diethylene glycol Monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, propylene group Call mono -n- butyl ether, propylene glycol monobutyl -tert- butyl ether, dipropylene glycol monomethyl ether, and,
As aromatic hydrocarbons, for example, toluene, xylene, benzene, ethylbenzene, etc., and
Examples of halogenated hydrocarbons include carbon tetrachloride, trichloroethylene, chloroform, 1,1,1-trichloroethane, methylene chloride, monochlorobenzene, and the like, and
Preferable examples include dimethylformamide, dimethylacetamide, dimethyl sulfoxide, sulfolane and the like.

Among these, PGMEA (propylene glycol monomethyl ether acetate), PGME (propylene glycol monomethyl ether), cyclohexanone, ethyl 3-ethoxypropionate, and propylene glycol are preferable.
Also, it must be at least one selected from propylene glycol, propylene glycol monomethyl ether acetate, butoxypropanol, ethoxypropanol, ethyl lactate, dipropylene glycol monomethyl ether, butoxyethanol, dimethylformamide, dimethyl sulfoxide, dimethylacetamide and methyldiglyme. Is also preferable.

Two or more of these solvents may be mixed from the viewpoints of the solubility of the ultraviolet absorber and the alkali-soluble resin, the improvement of the coated surface, and the like. In this case, particularly preferably, the above-mentioned methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethyl cellosolve acetate, ethyl lactate, diethylene glycol dimethyl ether, butyl acetate, methyl 3-methoxypropionate, 2-heptanone, cyclohexanone, ethyl It is a mixed solution composed of two or more selected from carbitol acetate, butyl carbitol acetate, ethylene glycol monobutyl ether acetate, propylene glycol methyl ether, and propylene glycol methyl ether acetate.
Also, composed of two or more selected from propylene glycol, propylene glycol monomethyl ether acetate, butoxypropanol, ethoxypropanol, ethyl lactate, dipropylene glycol monomethyl ether, butoxyethanol, dimethylformamide, dimethyl sulfoxide, dimethylacetamide, and methyldiglyme Also preferred is a mixed solution.
In particular, a mixed solution of propylene glycol monomethyl ether acetate and butoxypropanol, ethoxypropanol, ethyl lactate, dipropylene glycol monomethyl ether, butoxyethanol, dimethylformamide, dimethyl sulfoxide, dimethylacetamide or methyldiglyme is more preferable, and propylene glycol monomethyl A mixed solution of ether acetate and dimethylformamide or dimethyl sulfoxide is more preferable. In this mixed solution, the weight ratio of propylene glycol monomethyl ether acetate and other solvent is preferably 99: 1 to 50:50, and more preferably 95: 5 to 80:20.

  The content of the solvent in the composition is preferably 30 to 65% by mass, more preferably 35 to 65% by mass, and more preferably 40 to 65% by mass from the viewpoint of applicability. Is particularly preferred. When two or more types of solvents are used, the total amount is in the above range.

<Polymerizable compound>
The composition of the present invention preferably contains a compound having a polymerizable group (hereinafter sometimes referred to as “polymerizable compound”). In the present invention, as a solid content (solid content other than the copper compound (copper complex)) of the composition of the present invention, by including a polymerizable compound, the thermosetting reaction proceeds in parallel when the solvent is dried. Uniform solidification is promoted, and variation due to repeated application of near-infrared absorption performance when thinned can be further suppressed.
Such a compound group is widely known in the industrial field, and these can be used without particular limitation in the present invention. These may be any of chemical forms such as a monomer, an oligomer, a prepolymer, and a polymer. The polymerizable compound used in the present invention may be photocurable, but is preferably thermosetting.
The polymerizable compound may be monofunctional or polyfunctional, but is preferably polyfunctional. By including a polyfunctional compound, the near-infrared shielding property and heat resistance can be further improved. The number of functional groups is not particularly defined, but 2 to 8 functional groups are preferable.

<< Polymerizable monomer and polymerizable oligomer >>
In the first preferred embodiment of the composition of the present invention, a polymerizable compound is a monomer having a polymerizable group (polymerizable monomer) or an oligomer having a polymerizable group (polymerizable oligomer) (hereinafter, polymerizable with a polymerizable monomer). In some embodiments, the polymerizable oligomers may be collectively referred to as “polymerizable monomers”.

Examples of the polymerizable monomer include unsaturated carboxylic acids (for example, acrylic acid, methacrylic acid, itaconic acid, crotonic acid, isocrotonic acid, maleic acid, etc.), esters thereof, and amides. These are esters of saturated carboxylic acids and aliphatic polyhydric alcohol compounds, and amides of unsaturated carboxylic acids and aliphatic polyvalent amine compounds. Also, addition reaction products of monofunctional or polyfunctional isocyanates or epoxies with unsaturated carboxylic acid esters or amides having a nucleophilic substituent such as hydroxyl group, amino group, mercapto group, monofunctional or polyfunctional. A dehydration condensation reaction product with a functional carboxylic acid is also preferably used. Further, an addition reaction product of an unsaturated carboxylic acid ester or amide having an electrophilic substituent such as an isocyanate group or an epoxy group with a monofunctional or polyfunctional alcohol, amine or thiol, and further a halogen group A substitution reaction product of an unsaturated carboxylic acid ester or amide having a detachable substituent such as a tosyloxy group and a monofunctional or polyfunctional alcohol, amine or thiol is also suitable. As another example, it is also possible to use a compound group in which an unsaturated phosphonic acid, a vinylbenzene derivative such as styrene, vinyl ether, allyl ether or the like is used instead of the unsaturated carboxylic acid.
As these specific compounds, the compounds described in paragraphs 0095 to 0108 of JP-A-2009-288705 can also be suitably used in the present invention.

The polymerizable monomer or the like is preferably a compound having at least one addition-polymerizable ethylene group and having an ethylenically unsaturated group having a boiling point of 100 ° C. or higher under normal pressure. Examples include monofunctional acrylates and methacrylates such as polyethylene glycol mono (meth) acrylate, polypropylene glycol mono (meth) acrylate, and phenoxyethyl (meth) acrylate; polyethylene glycol di (meth) acrylate, trimethylolethanetri (Meth) acrylate, neopentyl glycol di (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, hexanediol (Meth) acrylate, trimethylolpropane tri (acryloyloxypropyl) ether, tri (acryloyloxyethyl) iso (Meth) acrylate obtained by adding ethylene oxide or propylene oxide to polyfunctional alcohols such as anurate, glycerin and trimethylolethane, JP-B-48-41708, JP-B-50-6034, JP-A-51- Urethane (meth) acrylates as described in JP-B-37193, polyester acrylates described in JP-A-48-64183, JP-B-49-43191, JP-B-52-30490, Mention may be made of polyfunctional acrylates and methacrylates such as epoxy acrylates which are reaction products of epoxy polymers and (meth) acrylic acid, and mixtures thereof.
A polyfunctional (meth) acrylate obtained by reacting a polyfunctional carboxylic acid with a compound having a cyclic ether group such as glycidyl (meth) acrylate and an ethylenically unsaturated group can also be used.
Further, as other preferable polymerizable monomers, etc., compounds having a fluorene ring and having two or more functional ethylenic polymerizable groups described in JP 2010-160418 A, JP 2010-129825 A, Patent 4364216, etc. Polymers can also be used.
Further, compounds having a boiling point of 100 ° C. or higher under normal pressure and having at least one addition-polymerizable ethylenically unsaturated group are disclosed in paragraphs [0254] to [0257] of JP-A-2008-292970. The compounds described are also suitable.
In addition, a compound which has been (meth) acrylated after adding ethylene oxide or propylene oxide to the polyfunctional alcohol described in JP-A-10-62986 as general formulas (1) and (2) together with specific examples thereof. Can be used as a polymerizable monomer.

（式中、ｎは、それぞれ、０〜１４であり、ｍは、それぞれ、１〜８である。一分子内に複数存在するＲ、ＴおよびＺは、それぞれ、同一であっても、異なっていてもよい。Ｔがオキシアルキレン基の場合には、炭素原子側の末端がＲに結合する。Ｒのうち少なくとも１つは、重合性基である。） The polymerizable monomer used in the present invention is further preferably a polymerizable monomer represented by the following general formulas (MO-1) to (MO-6).

(In the formula, each of n is 0 to 14 and m is 1 to 8. Each of R, T and Z present in a molecule is the same or different. When T is an oxyalkylene group, the terminal on the carbon atom side is bonded to R. At least one of R is a polymerizable group.)

が好ましく、

がより好ましい。
上記一般式（ＭＯ−１）〜（ＭＯ−６）で表される、ラジカル重合性モノマーの具体例としては、特開２００７−２６９７７９号公報の段落番号０２４８〜段落番号０２５１に記載されている化合物を本発明においても好適に用いることができる。 n is preferably 0 to 5, and more preferably 1 to 3.
m is preferably 1 to 5, and more preferably 1 to 3.
R is

Is preferred,

Is more preferable.
Specific examples of the radical polymerizable monomer represented by the above general formulas (MO-1) to (MO-6) include compounds described in paragraph numbers 0248 to 0251 of JP-A-2007-2699779. Can also be suitably used in the present invention.

Among them, as the polymerizable monomer, pentaerythritol tetraacrylate (A-TMMT as a commercial product; manufactured by Shin-Nakamura Chemical Co., Ltd.), dipentaerythritol triacrylate (KAYARAD D-330 as a commercial product; manufactured by Nippon Kayaku Co., Ltd.) , Dipentaerythritol tetraacrylate (as a commercial product, KAYARAD D-320; manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol penta (meth) acrylate (as a commercially available product, KAYARAD D-310; manufactured by Nippon Kayaku Co., Ltd.), Dipentaerythritol hexa (meth) acrylate (as a commercial product, KAYARAD DPHA; manufactured by Nippon Kayaku Co., Ltd.) and a structure in which these (meth) acryloyl groups are mediated by ethylene glycol and propylene glycol residues, diglycerin E O (ethylene oxide) modified (meth) acrylate (Aronix M-460; manufactured by Toagosei Co., Ltd.) is preferable. These oligomer types can also be used.
For example, RP-1040 (made by Nippon Kayaku Co., Ltd.) etc. are mentioned.

  As a polymerizable monomer etc., it is a polyfunctional monomer, Comprising: You may have acid groups, such as a carboxyl group, a sulfonic acid group, and a phosphoric acid group. Therefore, if the ethylenic compound has an unreacted carboxyl group as in the case of a mixture as described above, this can be used as it is. The acid group may be introduced by reacting the group with a non-aromatic carboxylic acid anhydride. In this case, specific examples of the non-aromatic carboxylic acid anhydride used include tetrahydrophthalic anhydride, alkylated tetrahydrophthalic anhydride, hexahydrophthalic anhydride, alkylated hexahydrophthalic anhydride, succinic anhydride, anhydrous Maleic acid is mentioned.

In the present invention, the monomer having an acid group is an ester of an aliphatic polyhydroxy compound and an unsaturated carboxylic acid, and a non-aromatic carboxylic acid anhydride is reacted with an unreacted hydroxyl group of the aliphatic polyhydroxy compound. A polyfunctional monomer having an acid group is preferable, and in this ester, the aliphatic polyhydroxy compound is pentaerythritol and / or dipentaerythritol. Examples of commercially available products include Aronix series M-305, M-510, and M-520 as polybasic acid-modified acrylic oligomers manufactured by Toagosei Co., Ltd.
A preferable acid value of the polyfunctional monomer having an acid group is 0.1 to 40 mg-KOH / g, and particularly preferably 5 to 30 mg-KOH / g. If the acid value of the polyfunctional monomer is too low, the developing dissolution properties are lowered, and if it is too high, the production and handling are difficult, the photopolymerization performance is lowered, and the curability such as the surface smoothness of the pixel is deteriorated. Therefore, when two or more polyfunctional monomers having different acid groups are used in combination, or when a polyfunctional monomer having no acid group is used in combination, the acid value of the entire polyfunctional monomer should be adjusted so that it falls within the above range. Is essential.

Moreover, it is preferable to contain the polyfunctional monomer which has a caprolactone structure as a polymerizable monomer.
The polyfunctional monomer having a caprolactone structure is not particularly limited as long as it has a caprolactone structure in the molecule. For example, trimethylolethane, ditrimethylolethane, trimethylolpropane, ditrimethylolpropane, penta Ε-caprolactone modified polyfunctionality obtained by esterifying polyhydric alcohol such as erythritol, dipentaerythritol, tripentaerythritol, glycerin, diglycerol, trimethylolmelamine, (meth) acrylic acid and ε-caprolactone ( Mention may be made of (meth) acrylates. Among these, a polyfunctional monomer having a caprolactone structure represented by the following formula (1) is preferable.

（式中、６個のＲは全てが下記式（２）で表される基であるか、または６個のＲのうち１〜５個が下記式（２）で表される基であり、残余が下記式（３）で表される基である。）

(In the formula, all 6 Rs are groups represented by the following formula (2), or 1 to 5 of 6 Rs are groups represented by the following formula (2), The remainder is a group represented by the following formula (3).)

（式中、Ｒ¹は水素原子またはメチル基を示し、ｍは１または２の数を示し、「＊」は結合手であることを示す。）

(In the formula, R ¹ represents a hydrogen atom or a methyl group, m represents a number of 1 or 2, and “*” represents a bond.)

（式中、Ｒ¹は水素原子またはメチル基を示し、「＊」は結合手であることを示す。）

(In the formula, R ¹ represents a hydrogen atom or a methyl group, and “*” represents a bond.)

Such a polyfunctional monomer having a caprolactone structure is commercially available from Nippon Kayaku Co., Ltd. as KAYARAD DPCA series, and DPCA-20 (m = 1 in the above formulas (1) to (3)). , Number of groups represented by formula (2) = 2, compound in which R ¹ is all hydrogen atoms, DPCA-30 (same formula, m = 1, number of groups represented by formula (2) = 3 , Compounds in which R ¹ is all hydrogen atoms), DPCA-60 (same formula, m = 1, number of groups represented by formula (2) = 6, compounds in which R ¹ are all hydrogen atoms), DPCA- 120 (a compound in which m = 2 in the same formula, the number of groups represented by formula (2) = 6, and all R ¹ are hydrogen atoms).
In this invention, the polyfunctional monomer which has a caprolactone structure can be used individually or in mixture of 2 or more types.

  In addition, the polymerizable monomer or the like in the present invention is preferably at least one selected from the group of compounds represented by the following general formula (i) or (ii).

In the general formula (i) and (ii), E are each _{independently, - ((CH 2) yCH} 2 O) -, or _{- ((CH 2) y CH} (CH 3) O) - represents, Each y independently represents an integer of 0 to 10, and each X independently represents an acryloyl group, a methacryloyl group, a hydrogen atom, or a carboxyl group.
In said general formula (i), the sum total of an acryloyl group and a methacryloyl group is 3 or 4, m represents the integer of 0-10 each independently, and the sum of each m is an integer of 0-40. However, when the total of each m is 0, any one of X is a carboxyl group.
In said general formula (ii), the sum total of an acryloyl group and a methacryloyl group is 5 or 6, each n represents the integer of 0-10 each independently, and the sum total of each n is an integer of 0-60. However, when the total of each n is 0, any one of X is a carboxyl group.

In the general formula (i), m is preferably an integer of 0 to 6, and more preferably an integer of 0 to 4. Moreover, the integer of 2-40 is preferable, the integer of 2-16 is more preferable, and the integer of 4-8 is especially preferable as the sum total of each m.
In the general formula (ii), n is preferably an integer of 0 to 6, and more preferably an integer of 0 to 4. Further, the total of each n is preferably an integer of 3 to 60, more preferably an integer of 3 to 24, and particularly preferably an integer of 6 to 12.
In general formula (i) or formula (ii) in the _{- ((CH 2) y CH} 2 O) - or _{- ((CH 2) y CH} (CH 3) O) - , the oxygen atom side ends Is preferred in which X is bonded to X.

  The compounds represented by the general formula (i) or (ii) may be used alone or in combination of two or more. In particular, in the general formula (ii), a form in which all six Xs are acryloyl groups is preferable.

  The compound represented by the general formula (i) or (ii) is a conventionally known process, which is a ring-opening skeleton by a ring-opening addition reaction of ethylene oxide or propylene oxide with pentaerythritol or dipentaerythritol. And a step of reacting, for example, (meth) acryloyl chloride with the terminal hydroxyl group of the ring-opening skeleton to introduce a (meth) acryloyl group. Each step is a well-known step, and a person skilled in the art can easily synthesize a compound represented by the general formula (i) or (ii).

Among the compounds represented by the general formula (i) or (ii), a pentaerythritol derivative and / or a dipentaerythritol derivative is more preferable.
Specific examples include compounds represented by the following formulas (a) to (f) (hereinafter also referred to as “exemplary compounds (a) to (f)”), and among them, exemplary compounds (a) and ( b), (e) and (f) are preferred.

  Examples of commercially available products such as polymerizable monomers represented by general formulas (i) and (ii) include SR-494, a tetrafunctional acrylate having four ethyleneoxy chains manufactured by Sartomer, manufactured by Nippon Kayaku Co., Ltd. DPCA-60, which is a hexafunctional acrylate having 6 pentyleneoxy chains, and TPA-330, which is a trifunctional acrylate having 3 isobutyleneoxy chains.

Examples of polymerizable monomers include urethane acrylates as described in JP-B-48-41708, JP-A-51-37193, JP-B-2-32293, and JP-B-2-16765, Urethane compounds having an ethylene oxide skeleton described in JP-B-58-49860, JP-B-56-17654, JP-B-62-39417, and JP-B-62-39418 are also suitable. Furthermore, as polymerizable monomers, addition polymerizable monomers having an amino structure or a sulfide structure in the molecule described in JP-A-63-277653, JP-A-63-260909, JP-A-1-105238 Can be used to obtain a curable composition having a very high photosensitive speed.
Commercially available products such as polymerizable monomers include urethane oligomers UAS-10, UAB-140 (manufactured by Sanyo Kokusaku Pulp), UA-7200 "(manufactured by Shin-Nakamura Chemical Co., Ltd., DPHA-40H (manufactured by Nippon Kayaku Co., Ltd.), -306H, UA-306T, UA-306I, AH-600, T-600, AI-600 (manufactured by Kyoeisha) and the like.

  A polyfunctional thiol compound having two or more mercapto (SH) groups in the same molecule is also suitable as the polymerizable monomer. Particularly preferred are those represented by the following general formula (I).

（式中、Ｒ¹はアルキル基、Ｒ²は炭素以外の原子を含んでもよいｎ価の脂肪族基、Ｒ⁰はＨではないアルキル基、ｎは２〜４を表す。）

(In the formula, R ¹ is an alkyl group, R ² is an n-valent aliphatic group that may contain atoms other than carbon, R ⁰ is an alkyl group that is not H, and n represents 2 to 4).

  If the polyfunctional thiol compound represented by the general formula (I) is specifically exemplified, 1,4-bis (3-mercaptobutyryloxy) butane [formula (II)] having the following structural formula: 1,3,5-tris (3-mercaptobutyloxyethyl) -1,3,5-triasian-2,4,6 (1H, 3H5H) -trione [formula (III)] and pentaerythritol tetrakis (3 -Mercaptobutyrate) [formula (IV)] and the like. These polyfunctional thiols can be used alone or in combination.

  In the composition of the present invention, it is also preferable to use a polymerizable monomer or oligomer having two or more epoxy groups or oxetanyl groups in the molecule as the polymerizable monomer. Specific examples of these will be collectively described in the section of the polymer having an epoxy group or oxetanyl group in the side chain described later.

<< Polymer having polymerizable group in side chain >>
The 2nd preferable aspect of the composition of this invention is an aspect containing the polymer which has a polymeric group in a side chain as a polymeric compound.
Examples of the polymerizable group include an ethylenically unsaturated double bond group, an epoxy group, and an oxetanyl group.

<<< Polymer having ethylenically unsaturated bond in side chain >>>
The polymer having an ethylenically unsaturated bond in the side chain is a high polymer having at least one selected from functional groups represented by any one of the following general formulas (1) to (3) as an unsaturated double bond moiety. Molecular compounds are preferred.

In the general formula (1), R ^{1 to} R ³ each independently represent a hydrogen atom or a monovalent organic group, and R ¹ is preferably a hydrogen atom or an alkyl which may have a substituent. A hydrogen atom and a methyl group are preferable because of high radical reactivity. R ² and R ³ are each independently a hydrogen atom, a halogen atom, an amino group, a carboxyl group, an alkoxycarbonyl group, a sulfo group, a nitro group, a cyano group, an optionally substituted alkyl group, or a substituted group. An aryl group that may have a group, an alkoxy group that may have a substituent, an aryloxy group that may have a substituent, an alkylamino group that may have a substituent, and a substituent An arylamino group which may have a substituent, an alkylsulfonyl group which may have a substituent, an arylsulfonyl group which may have a substituent, and the like. Among them, a hydrogen atom, a carboxyl group, an alkoxycarbonyl group, a substituent An alkyl group which may have a substituent and an aryl group which may have a substituent are preferable because of high radical reactivity.

X represents an oxygen atom, a sulfur atom, or —N (R ¹² ) —, and R ¹² represents a hydrogen atom or a monovalent organic group. Here, examples of R ¹² include an alkyl group which may have a substituent. Among them, a hydrogen atom, a methyl group, an ethyl group, and an isopropyl group are preferable because of high radical reactivity.

  Here, examples of the substituent that can be introduced include an alkyl group, an alkenyl group, an alkynyl group, an aryl group, an alkoxy group, an aryloxy group, a halogen atom, an amino group, an alkylamino group, an arylamino group, a carboxyl group, an alkoxycarbonyl group, A sulfo group, a nitro group, a cyano group, an amide group, an alkylsulfonyl group, an arylsulfonyl group and the like can be mentioned.

In the general formula (2), R ^{4 to} R ⁸ each independently represents a hydrogen atom or a monovalent organic group, and R ^{4 to} R ⁸ are preferably a hydrogen atom, a halogen atom, an amino group, or a dialkyl. Amino group, carboxyl group, alkoxycarbonyl group, sulfo group, nitro group, cyano group, alkyl group which may have a substituent, aryl group which may have a substituent, alkoxy which may have a substituent A group, an aryloxy group which may have a substituent, an alkylamino group which may have a substituent, an arylamino group which may have a substituent, an alkylsulfonyl group which may have a substituent, Examples include an arylsulfonyl group which may have a substituent. Among them, a hydrogen atom, a carboxyl group, an alkoxycarbonyl group, an alkyl group which may have a substituent, and an aryl which may have a substituent Groups are preferred.

Examples of the substituent that can be introduced are the same as those in the general formula (1). Y represents an oxygen atom, a sulfur atom, or —N (R ¹² ) —. R ¹² has the same meaning as R ¹² in general formula (1), and preferred examples are also the same.

In the general formula (3), R ⁹ is preferably a hydrogen atom or an alkyl group which may have a substituent. Among them, a hydrogen atom or a methyl group has high radical reactivity. To preferred. R ¹⁰ and R ¹¹ are each independently a hydrogen atom, a halogen atom, an amino group, a dialkylamino group, a carboxyl group, an alkoxycarbonyl group, a sulfo group, a nitro group, a cyano group, or an alkyl group which may have a substituent. An aryl group which may have a substituent, an alkoxy group which may have a substituent, an aryloxy group which may have a substituent, an alkylamino group which may have a substituent, a substituent An arylamino group that may have, an alkylsulfonyl group that may have a substituent, an arylsulfonyl group that may have a substituent, and the like, among them, a hydrogen atom, a carboxyl group, an alkoxycarbonyl group, An alkyl group which may have a substituent and an aryl group which may have a substituent are preferable because of high radical reactivity.

Here, examples of the substituent that can be introduced are the same as those in the general formula (1). Further, Z is an oxygen atom, a sulfur atom, -N (R ¹³⁾ -, or a phenylene group which may have a substituent. Examples of R ¹³ include an alkyl group which may have a substituent. Among them, a methyl group, an ethyl group, and an isopropyl group are preferable because of high radical reactivity.

  As the polymer containing an ethylenically unsaturated bond in the side chain in the present invention, the structural unit containing the functional group represented by the general formulas (1) to (3) is contained in an amount of 20 mol% or more and 95 mol. It is preferable that it is a compound containing in less than%. More preferably, it is 25-90 mol%. More preferably, it is the range of 30 mol% or more and less than 85 mol%.

  The synthesis of the polymer compound having a structural unit containing a group represented by the general formulas (1) to (3) is a synthesis method described in paragraphs [0027] to [0057] of JP-A No. 2003-262958. Can be done on the basis of Among them, the synthesis method 1) in the same publication is preferable, and this is shown in the following (1).

(Polymer having ethylenically unsaturated bond and acid group in side chain)
The polymer having an ethylenically unsaturated bond used in the present invention is preferably a polymer having an acid group.
The acid group in the present application has a dissociable group having a pKa of 14 or less. Specifically, for example, —COOH, —SO ₃ H, —PO ₃ H ₂ , —OSO ₃ H, —OPO ₂ H _{2, -PhOH, -SO 2 H,} -SO 2 NH 2, -SO 2 NHCO -, - SO 2 NHSO 2 - and the like,
Of these, —COOH, —SO ₃ H, and —PO ₃ H ₂ are preferable, and —COOH is more preferable.

  A polymer containing an acid group and an ethylenically unsaturated bond in the side chain can be obtained, for example, by adding an ethylenically unsaturated group-containing epoxy compound to the carboxyl group of an alkali-soluble polymer having a carboxyl group.

  As a polymer having a carboxyl group, 1) a polymer obtained by radical polymerization or ion polymerization of a monomer having a carboxyl group, and 2) radical or ion polymerization of a monomer having an acid anhydride to hydrolyze or half-esterify an acid anhydride unit. 3) Epoxy acrylate obtained by modifying an epoxy polymer with an unsaturated monocarboxylic acid and an acid anhydride.

  Specific examples of vinyl polymers having a carboxyl group include (meth) acrylic acid, 2-succinoloyloxyethyl methacrylate, 2-malenoyloxyethyl methacrylate, and methacrylic acid 2 as monomers having a carboxyl group. -Polymers obtained by homopolymerizing unsaturated carboxylic acids such as phthaloyloxyethyl, 2-hexahydrophthaloyloxyethyl methacrylate, maleic acid, fumaric acid, itaconic acid, and crotonic acid, and these unsaturated carboxylic acids as styrene , Α-methylstyrene, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, isopropyl (meth) acrylate, butyl (meth) acrylate, vinyl acetate, acrylonitrile, (meth) acrylamide , Glycidyl (meth) acryl , Allyl glycidyl ether, glycidyl ethyl acrylate, glycidyl crotonic acid ether, (meth) acrylic acid chloride, benzyl (meth) acrylate, hydroxyethyl (meth) acrylate, N-methylolacrylamide, N, N-dimethylacrylamide, N -A polymer copolymerized with a vinyl monomer having no carboxyl group, such as methacryloylmorpholine, N, N-dimethylaminoethyl (meth) acrylate, and N, N-dimethylaminoethylacrylamide.

  In addition, maleic anhydride is copolymerized with styrene, α-methylstyrene, etc., and the maleic anhydride unit part is half-esterified with monohydric alcohol such as methanol, ethanol, propanol, butanol, hydroxyethyl (meth) acrylate, or water. Also included are hydrolyzed polymers.

  Among the above, a polymer having a carboxyl group, in particular, a (meth) acrylic acid (co) polymer containing (meth) acrylic acid is preferable. Specific examples of these copolymers include, for example, methacrylic acid. Benzyl acid / methacrylic acid copolymer, methyl methacrylate / methacrylic acid copolymer described in JP-A-60-208748, methyl methacrylate / methyl acrylate / methacrylic acid copolymer described in JP-A-60-214354 Polymer, benzyl methacrylate / methyl methacrylate / methacrylic acid / 2-ethylhexyl acrylate copolymer described in JP-A-5-36581, methyl methacrylate / n-butyl methacrylate described in JP-A-5-333542 / 2-ethylhexyl acrylate / methacrylic acid copolymer, JP-A-7-2614 No. 7 styrene / methyl methacrylate / methyl acrylate / methacrylic acid copolymer, Japanese Patent Application Laid-Open No. 10-110008 / methyl methacrylate / n-butyl acrylate / 2-ethylhexyl acrylate / methacrylic acid copolymer Examples thereof include methyl methacrylate / n-butyl acrylate / 2-ethylhexyl acrylate / styrene / methacrylic acid copolymer described in JP-A-10-198031.

  The polymer containing an acid group and a polymerizable group in the side chain in the present invention is a structural unit represented by any one of the following general formulas (1-1) to (3-1) as an unsaturated double bond moiety. A polymer compound having at least one selected is preferable.

In the general formulas (1-1) to (3-1), A ¹ , A ² , and A ³ each independently represent an oxygen atom, a sulfur atom, or —N (R ²¹ ) —, and R ²¹ Represents an alkyl group which may have a substituent. G ¹ , G ² , and G ³ each independently represent a divalent organic group. X and Z each independently represent an oxygen atom, a sulfur atom, or —N (R ²² ) —, and R ²² represents an alkyl group which may have a substituent. Y represents an oxygen atom, a sulfur atom, a phenylene group which may have a substituent, or —N (R ²³ ) —, and R ²³ represents an alkyl group which may have a substituent. R ^{1 to} R ²⁰ each independently represents a monovalent substituent.

In the general formula (1-1), R ^{1 to} R ³ each independently represents a monovalent substituent, and examples thereof include a hydrogen atom and an alkyl group which may further have a substituent. R ¹ and R ² are preferably a hydrogen atom, and R ³ is preferably a hydrogen atom or a methyl group.
R ^{4 to} R ⁶ each independently represents a monovalent substituent. Examples of R ⁴ include a hydrogen atom or an alkyl group which may further have a substituent. Among them, a hydrogen atom, a methyl group An ethyl group is preferred. R ⁵ and R ⁶ are each independently a hydrogen atom, a halogen atom, an alkoxycarbonyl group, a sulfo group, a nitro group, a cyano group, an alkyl group that may further have a substituent, or a substituent. An aryl group which may further have a substituent, an aryloxy group which may further have a substituent, an alkylsulfonyl group which may further have a substituent, and further having a substituent An arylsulfonyl group which may be substituted may be mentioned. Among them, a hydrogen atom, an alkoxycarbonyl group, an alkyl group which may further have a substituent, and an aryl group which may further have a substituent are preferable.
Here, examples of the substituent that can be introduced include a methoxycarbonyl group, an ethoxycarbonyl group, an isopropyloxycarbonyl group, a methyl group, an ethyl group, and a phenyl group.

A ¹ represents an oxygen atom, a sulfur atom, or —N (R ²¹ ) —, and X represents an oxygen atom, a sulfur atom, or —N (R ²² ) —. Here, examples of R ²¹ and R ²² include an alkyl group which may have a substituent.
G ¹ represents a divalent organic group, but an alkylene group which may have a substituent is preferable. More preferably, it has an alkylene group which may have a substituent having 1 to 20 carbon atoms, a cycloalkylene group which may have a substituent having 3 to 20 carbon atoms, or a substituent having 6 to 20 carbon atoms. An aromatic group that may be present may be mentioned. Among them, a linear or branched alkylene group having 1 to 10 carbon atoms that may have a substituent, or cyclo that may have a substituent having 3 to 10 carbon atoms. An alkylene group and an aromatic group which may have a substituent having 6 to 12 carbon atoms are preferable in terms of performance such as strength and developability.
Here, a hydroxyl group is preferable as a substituent in G ¹ .

In the general formula (2-1), R ^{7 to} R ⁹ each independently represents a monovalent substituent, and examples thereof include a hydrogen atom and an alkyl group which may further have a substituent. R ⁷ and R ⁸ are preferably a hydrogen atom, and R ⁹ is preferably a hydrogen atom or a methyl group.
R ^{10 to} R ¹² each independently represents a monovalent substituent. Specific examples of the substituent include a hydrogen atom, a halogen atom, a dialkylamino group, an alkoxycarbonyl group, a sulfo group, and a nitro group. , A cyano group, an alkyl group which may further have a substituent, an aryl group which may further have a substituent, an alkoxy group which may further have a substituent, and an aryl which may further have a substituent Examples thereof include an oxy group, an alkylsulfonyl group that may further have a substituent, and an arylsulfonyl group that may further have a substituent. Among them, a hydrogen atom, an alkoxycarbonyl group, and a substituent may be further included. A good alkyl group and an aryl group which may further have a substituent are preferred.
Here, examples of the substituent that can be introduced include those exemplified in the general formula (1-1).

A ² each independently represents an oxygen atom, a sulfur atom, or —N (R ²¹ ) —, wherein R ²¹ is a hydrogen atom, an alkyl group which may have a substituent, or the like. Can be mentioned.
G ² represents a divalent organic group, and an alkylene group which may have a substituent is preferable. Preferably, it has an alkylene group which may have a substituent having 1 to 20 carbon atoms, a cycloalkylene group which may have a substituent having 3 to 20 carbon atoms, and a substituent which has 6 to 20 carbon atoms. Aromatic group, etc. may be mentioned. Among them, a linear or branched alkylene group having 1 to 10 carbon atoms which may have a substituent, or a cycloalkylene which may have a substituent having 3 to 10 carbon atoms. Group, and an aromatic group which may have a substituent having 6 to 12 carbon atoms is preferable in terms of performance such as strength and developability.
Here, the substituent in G ² is preferably a hydroxyl group.

Y represents an oxygen atom, a sulfur atom, —N (R ²³ ) — or a phenylene group which may have a substituent. Here, examples of R ²³ include a hydrogen atom and an alkyl group which may have a substituent.

In the general formula (3-1), R ^{13 to} R ¹⁵ each independently represents a monovalent substituent, and examples thereof include a hydrogen atom and an alkyl group which may have a substituent. ¹³ and R ¹⁴ are preferably hydrogen atoms, and R ¹⁵ is preferably a hydrogen atom or a methyl group.
R ^{16 to} R ²⁰ each independently represents a monovalent substituent. R ^{16 to} R ²⁰ are, for example, a hydrogen atom, a halogen atom, a dialkylamino group, an alkoxycarbonyl group, a sulfo group, a nitro group, or a cyano group. , An alkyl group that may further have a substituent, an aryl group that may further have a substituent, an alkoxy group that may further have a substituent, an aryloxy group that may further have a substituent, Examples include an alkylsulfonyl group that may further have a substituent, an arylsulfonyl group that may further have a substituent, and the like. Among them, a hydrogen atom, an alkoxycarbonyl group, and an alkyl group that may further have a substituent An aryl group which may further have a substituent is preferable. Examples of the substituent that can be introduced include those listed in the general formula (1).
A ³ represents an oxygen atom, a sulfur atom, or —N (R ²¹ ) —, and Z represents an oxygen atom, a sulfur atom, or —N (R ²² ) —. Examples of R ²¹ and R ²² include the same as those in the general formula (1).

G ³ represents a divalent organic group, but an alkylene group which may have a substituent is preferable. Preferably, it has an alkylene group which may have a substituent having 1 to 20 carbon atoms, a cycloalkylene group which may have a substituent having 3 to 20 carbon atoms, and a substituent which has 6 to 20 carbon atoms. Aromatic group, etc. may be mentioned. Among them, a linear or branched alkylene group having 1 to 10 carbon atoms which may have a substituent, or a cycloalkylene which may have a substituent having 3 to 10 carbon atoms. Group, and an aromatic group which may have a substituent having 6 to 12 carbon atoms is preferable in terms of performance such as strength and developability.
Here, the substituent in G ³ is preferably a hydroxyl group.

  As a polymer containing an acid group and a polymerizable group in the side chain in the present invention, the structural units represented by the general formulas (1-1) to (3-1) are used in view of improving curability and reducing development residue. From the above, it is preferable that the compound be contained in the range of 20 mol% or more and less than 95 mol% in one molecule. More preferably, it is 25-90 mol%. More preferably, it is the range of 30 mol% or more and less than 85 mol%.

  Preferred examples of the structural unit having an ethylenically unsaturated bond and an acid group include the following polymer compounds 1 to 17.

The polymer containing an acid group and an ethylenically unsaturated bond in the side chain in the present invention needs to have a photopolymerizable unsaturated bond from the viewpoint of improving photosensitivity, and enables alkali development. Therefore, it is necessary to have an acid group such as COOH, SO ₃ H, PO ₃ H ₂ , OSO ₃ H, and OPO ₂ H ₂ . The polymer containing an acid group and an ethylenically unsaturated bond in the side chain in the present invention has an acid value of 20 to 300, preferably 40 to 200, from the viewpoint of dispersion stability, balance between developability and sensitivity. More preferably, it is in the range of 60-150.

(Polymer having ethylenically unsaturated bond and urethane group in side chain)
The polymer having a polymerizable group in the side chain used in the present invention is also preferably a polymer having an ethylenically unsaturated bond and a urethane group in the side chain (hereinafter sometimes referred to as “urethane polymer”).
The urethane polymer has a structural unit represented by a reaction product of at least one diisocyanate compound represented by the following general formula (4) and at least one diol compound represented by the general formula (5). A polyurethane polymer having a basic skeleton (hereinafter referred to as “specific polyurethane polymer” as appropriate).

OCN-X ⁰ -NCO General formula (4)
HO—Y ⁰ —OH Formula (5)

In general formulas (4) and (5), X ⁰ and Y ⁰ each independently represent a divalent organic residue.

  At least one of the diisocyanate compound represented by the general formula (4) or the diol compound represented by the general formula (5) represents the general formulas (1) to (3) indicating the unsaturated double bond portion. Group represented by the general formulas (1) to (3) in the side chain as a reaction product of the diisocyanate compound and the diol compound. A specific polyurethane polymer in which is introduced is produced. According to this method, the specific polyurethane polymer according to the present invention can be produced more easily than the substitution and introduction of a desired side chain after the reaction of the polyurethane polymer.

1) Diisocyanate compound The diisocyanate compound represented by the general formula (4) is obtained by, for example, subjecting a triisocyanate compound to 1 equivalent of a monofunctional alcohol or monofunctional amine compound having an unsaturated group. There are products that are produced.
Examples of the triisocyanate compound include those shown below, but are not limited thereto.

  Examples of the monofunctional alcohol or monofunctional amine compound having an unsaturated group include those shown below, but are not limited thereto.

  Here, as a method for introducing an unsaturated group into the side chain of the polyurethane polymer, a method using a diisocyanate compound containing an unsaturated group in the side chain as a raw material for producing the polyurethane polymer is suitable. Examples of the diisocyanate compound obtained by addition reaction of a triisocyanate compound and a monofunctional alcohol having an unsaturated group or 1 equivalent of a monofunctional amine compound having an unsaturated group in the side chain include, for example, Although the following are mentioned, it is not limited to this.

  The specific polyurethane polymer used in the present invention includes, for example, the above-mentioned diisocyanate compound containing an unsaturated group from the viewpoint of improving compatibility with other components in the polymerizable composition and improving storage stability. Other diisocyanate compounds can be copolymerized.

  Examples of the diisocyanate compound to be copolymerized include the following. Preferred is a diisocyanate compound represented by the following general formula (6).

OCN-L ¹ -NCO the general formula (6)

In General Formula (6), L ¹ represents a divalent aliphatic or aromatic hydrocarbon group which may have a substituent. If necessary, L ¹ may have another functional group that does not react with an isocyanate group, such as an ester, urethane, amide, or ureido group.

Specific examples of the diisocyanate compound represented by the general formula (6) include those shown below.
That is, 2,4-tolylene diisocyanate, dimer of 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, p-xylylene diisocyanate, m-xylylene diisocyanate, 4,4′-diphenylmethane diisocyanate Aromatic diisocyanate compounds such as 1,5-naphthylene diisocyanate, 3,3′-dimethylbiphenyl-4,4′-diisocyanate;
Aliphatic diisocyanate compounds such as hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, lysine diisocyanate, dimer acid diisocyanate and the like;
Alicyclic diisocyanate compounds such as isophorone diisocyanate, 4,4′-methylenebis (cyclohexyl isocyanate), methylcyclohexane-2,4 (or 2,6) diisocyanate, 1,3- (isocyanatomethyl) cyclohexane;
And a diisocyanate compound which is a reaction product of a diol and a diisocyanate such as an adduct of 1 mol of 1,3-butylene glycol and 2 mol of tolylene diisocyanate.

2) Diol Compound As the diol compound represented by the general formula (5), a polyether diol compound, a polyester diol compound, a polycarbonate diol compound, and the like are widely used.

  Here, as a method for introducing an unsaturated group into the side chain of the polyurethane polymer, in addition to the above-described method, a method using a diol compound containing an unsaturated group in the side chain as a raw material for producing the polyurethane polymer is also suitable. is there. Such a diol compound may be a commercially available one such as trimethylolpropane monoallyl ether, a halogenated diol compound, a triol compound, an aminodiol compound, a carboxylic acid containing an unsaturated group, and an acid. It may be a compound that is easily produced by a reaction with a chloride, isocyanate, alcohol, amine, thiol, or alkyl halide compound. Specific examples of these compounds include, but are not limited to, the compounds shown below.

  Further, as a more preferred polymer in the present invention, a polyurethane obtained by using a diol compound represented by the following general formula (G) as at least one diol compound having an ethylenically unsaturated bond group in the synthesis of polyurethane. Can be mentioned.

In the general formula (G), R ^{1 to} R ³ each independently represents a hydrogen atom or a monovalent organic group, A represents a divalent organic residue, and X represents an oxygen atom, a sulfur atom, or — N (R ¹² ) — is represented, and R ¹² represents a hydrogen atom or a monovalent organic group.
Incidentally, R ¹ to R ³ and X in the general formula (G) has the same meaning as R ¹ to R ³ and X in the general formula (1), is also similar to the preferred embodiment.
By using a polyurethane polymer derived from such a diol compound, it is considered that the coating strength of the layer can be improved by suppressing the excessive molecular motion of the polymer main chain caused by the secondary alcohol having a large steric hindrance. It is done.
Hereinafter, specific examples of the diol compound represented by the general formula (G) which are suitably used for the synthesis of the specific polyurethane polymer will be shown.

The specific polyurethane polymer used in the present invention is, for example, the above-mentioned diol compound containing an unsaturated group from the viewpoint of improving compatibility with other components in the polymerizable composition and improving storage stability. Diol compounds other than can be copolymerized.
Examples of such diol compounds include the polyether diol compounds, polyester diol compounds, and polycarbonate diol compounds described above.

  Examples of the polyether diol compound include compounds represented by the following formulas (7), (8), (9), (10), and (11), and random copolymerization of ethylene oxide and propylene oxide having a hydroxyl group at the terminal. Coalescence is mentioned.

In formulas (7) to (11), R ¹⁴ represents a hydrogen atom or a methyl group, and X ¹ represents the following group. Moreover, a, b, c, d, e, f, and g each represent an integer of 2 or more, and preferably an integer of 2 to 100.

Specific examples of the polyether diol compound represented by the above formulas (7) and (8) include the following.
That is, diethylene glycol, triethylene glycol, tetraethylene glycol, pentaethylene glycol, hexaethylene glycol, heptaethylene glycol, octaethylene glycol, di-1,2-propylene glycol, tri-1,2-propylene glycol, tetra-1, 2-propylene glycol, hexa-1,2-propylene glycol, di-1,3-propylene glycol, tri-1,3-propylene glycol, tetra-1,3-propylene glycol, di-1,3-butylene glycol, Tri-1,3-butylene glycol, hexa-1,3-butylene glycol, polyethylene glycol having a weight average molecular weight of 1000, polyethylene glycol having a weight average molecular weight of 1500, poly having a weight average molecular weight of 2000 Tylene glycol, polyethylene glycol with a weight average molecular weight of 3000, polyethylene glycol with a weight average molecular weight of 7500, polypropylene glycol with a weight average molecular weight of 400, polypropylene glycol with a weight average molecular weight of 700, polypropylene glycol with a weight average molecular weight of 1000, polypropylene glycol with a weight average molecular weight of 2000 , Polypropylene glycol having a weight average molecular weight of 3000, polypropylene glycol having a weight average molecular weight of 4000, and the like.

Specific examples of the polyether diol compound represented by the formula (9) include those shown below.
That is, Sanyo Chemical Industries, Ltd. (trade name) PTMG650, PTMG1000, PTMG2000, PTMG3000, and the like.

Specific examples of the polyether diol compound represented by the formula (10) include those shown below.
That is, Sanyo Chemical Industries, Ltd. (trade name) New Pole PE-61, New Pole PE-62, New Pole PE-64, New Pole PE-68, New Pole PE-71, New Pole PE-74, New Pole PE-75, New Pole PE-78, New Pole PE-108, New Pole PE-128, New Pole PE-61, and the like.

Specific examples of the polyether diol compound represented by the formula (11) include those shown below.
That is, Sanyo Chemical Industries, Ltd. (trade name) New Pole BPE-20, New Pole BPE-20F, New Pole BPE-20NK, New Pole BPE-20T, New Pole BPE-20G, New Pole BPE-40, New Pole BPE-60, New Pole BPE-100, New Pole BPE-180, New Pole BPE-2P, New Pole BPE-23P, New Pole BPE-3P, New Pole BPE-5P, and the like.

Specific examples of the random copolymer of ethylene oxide and propylene oxide having a hydroxyl group at the terminal include the following.
That is, Sanyo Chemical Industries, Ltd. (trade name) New Pole 50HB-100, New Pole 50HB-260, New Pole 50HB-400, New Pole 50HB-660, New Pole 50HB-2000, New Pole 50HB-5100, etc. It is.

  Examples of the polyester diol compound include compounds represented by formulas (12) and (13).

In formulas (12) and (13), L ² , L ³ and L ⁴ may be the same or different and each represents a divalent aliphatic or aromatic hydrocarbon group, and L ⁵ represents a divalent aliphatic carbonization. Represents a hydrogen group. Preferably, L ^{2 to} L ⁴ each represent an alkylene group, an alkenylene group, an alkynylene group, or an arylene group, and L ⁵ represents an alkylene group. In addition, other functional groups that do not react with the isocyanate group, such as ether, carbonyl, ester, cyano, olefin, urethane, amide, ureido group, or halogen atom may be present in L ^{2 to} L ⁵ . n1 and n2 are each an integer of 2 or more, preferably an integer of 2 to 100.
As the polycarbonate diol compound, there is a compound represented by the formula (14).

In the formula (14), L ⁶ may be the same or different and each represents a divalent aliphatic or aromatic hydrocarbon group. Preferably, L ⁶ represents an alkylene group, an alkenylene group, an alkynylene group or an arylene group. In addition, other functional groups that do not react with the isocyanate group, such as ether, carbonyl, ester, cyano, olefin, urethane, amide, ureido group or halogen atom may be present in L ⁶ . n3 is an integer of 2 or more, and preferably represents an integer of 2 to 100.

  Specific examples of the diol compound represented by the above formula (12), (13) or (14) include (Exemplary Compound No. 1) to (Exemplary Compound No. 18) shown below. N in the specific examples represents an integer of 2 or more.

  Moreover, in the synthesis | combination of a specific polyurethane polymer, the diol compound which has a substituent which does not react with an isocyanate group other than the said diol compound can also be used together. Examples of such diol compounds include those shown below.

^{HO-L 7 -O-CO-} L 8 -CO-O-L 7 -OH (15)
^{HO-L 8 -CO-O-} L 7 -OH (16)

In the formulas (15) and (16), L ⁷ and L ⁸ may be the same or different, and each may have a substituent (for example, an alkyl group, an aralkyl group, an aryl group, an alkoxy group, an aryloxy group, —F, — And a divalent aliphatic hydrocarbon group, aromatic hydrocarbon group or heterocyclic group which may have a halogen atom such as Cl, -Br and -I. If necessary, L ⁷ and L ⁸ may have another functional group that does not react with an isocyanate group, such as a carbonyl group, an ester group, a urethane group, an amide group, or a ureido group. Note that L ⁷ and L ⁸ may form a ring.

Furthermore, in the synthesis of the specific polyurethane polymer, a diol compound having a carboxyl group can be used in combination with the diol compound.
Examples of such diol compounds include those represented by the following formulas (17) to (19).

In the formulas (17) to (19), R ¹⁵ is a hydrogen atom, a substituent (for example, a halogen atom such as a cyano group, a nitro group, —F, —Cl, —Br, —I, etc.), —CONH ₂ , —COOR ^16. , -OR ¹⁶ , -NHCONHR ¹⁶ , -NHCONOR ¹⁶ , -NHCOR ¹⁶ , -OCONHR ¹⁶ (wherein R ¹⁶ represents an alkyl group having 1 to 10 carbon atoms and an aralkyl group having 7 to 15 carbon atoms). Represents an alkyl group, an aralkyl group, an aryl group, an alkoxy group, or an aryloxy group, which may have a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, or 6 to 6 carbon atoms. Represents 15 aryl groups. L ⁹ , L ¹⁰ and L ¹¹ may be the same or different from each other, and may have a single bond or a substituent (for example, alkyl, aralkyl, aryl, alkoxy and halogeno groups are preferred). Represents a divalent aliphatic or aromatic hydrocarbon group, preferably an alkylene group having 1 to 20 carbon atoms, an arylene group having 6 to 15 carbon atoms, more preferably an alkylene group having 1 to 8 carbon atoms. . If necessary, L ^{9 to} L ¹¹ may have other functional groups that do not react with isocyanate groups, such as carbonyl, ester, urethane, amide, ureido, and ether groups. A ring may be formed by 2 or 3 of R ¹⁵ , L ⁷ , L ⁸ and L ⁹ .
Ar represents a trivalent aromatic hydrocarbon group which may have a substituent, and preferably represents an aromatic group having 6 to 15 carbon atoms.

Specific examples of the diol compound having a carboxyl group represented by the above formulas (17) to (19) include those shown below.
3,5-dihydroxybenzoic acid, 2,2-bis (hydroxymethyl) propionic acid, 2,2-bis (2-hydroxyethyl) propionic acid, 2,2-bis (3-hydroxypropyl) propionic acid, Bis (hydroxymethyl) acetic acid, bis (4-hydroxyphenyl) acetic acid, 2,2-bis (hydroxymethyl) butyric acid, 4,4-bis (4-hydroxyphenyl) pentanoic acid, tartaric acid, N, N-dihydroxyethylglycine N, N-bis (2-hydroxyethyl) -3-carboxy-propionamide and the like.

  The presence of such a carboxyl group is preferable because the polyurethane polymer can be provided with properties such as hydrogen bonding properties and alkali solubility. More specifically, the polyurethane polymer having an ethylenically unsaturated bond group in the side chain is a polymer further having a carboxyl group in the side chain, and more specifically, an ethylenically unsaturated bond group in the side chain. A polyurethane polymer having 0.3 meq / g or more and having a carboxyl group in the side chain of 0.4 meq / g or more is particularly preferably used as the binder polymer.

  In addition to the diol, a compound obtained by ring-opening a tetracarboxylic dianhydride represented by the following formulas (20) to (22) with a diol compound may be used in combination with the synthesis of the specific polyurethane polymer. it can.

In formulas (20) to (22), L ¹² may have a single bond or a substituent (for example, alkyl, aralkyl, aryl, alkoxy, halogeno, ester, or amide groups are preferred). Represents an aliphatic or aromatic hydrocarbon group, —CO—, —SO—, —SO ₂ —, —O— or S—, preferably a single bond and a divalent aliphatic carbon having 1 to 15 carbon atoms. hydrogen _{group, -CO -, - SO 2 -} , - represents O- or S- to. R ¹⁷ and R ¹⁸ may be the same or different and each represents a hydrogen atom, an alkyl group, an aralkyl group, an aryl group, an alkoxy group, or a halogeno group, preferably a hydrogen atom or an alkyl having 1 to 8 carbon atoms. Group, an aryl group having 6 to 15 carbon atoms, an alkoxy group having 1 to 8 carbon atoms, or a halogeno group. Two of L ¹² , R ¹⁷ and R ¹⁸ may be bonded to form a ring.

R ¹⁹ and R ²⁰ may be the same or different and each represents a hydrogen atom, an alkyl group, an aralkyl group, an aryl group or a halogeno group, preferably a hydrogen atom, an alkyl having 1 to 8 carbon atoms, or a carbon number of 6 Represents ~ 15 aryl groups. Two of L ¹² , R ¹⁹ and R ²⁰ may be bonded to form a ring. L ¹³ and L ¹⁴ may be the same or different and each represents a single bond, a double bond, or a divalent aliphatic hydrocarbon group, and preferably represents a single bond, a double bond, or a methylene group. A represents a mononuclear or polynuclear aromatic ring. Preferably, it represents an aromatic ring having 6 to 18 carbon atoms.

Specific examples of the compound represented by the above formula (20), (21) or (22) include those shown below.
That is, pyromellitic dianhydride, 3,3 ′, 4,4′-benzophenone tetracarboxylic dianhydride, 3,3 ′, 4,4′-diphenyltetracarboxylic dianhydride, 2, 3,6,7-naphthalenetetracarboxylic dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride, 4,4′-sulfonyldiphthalic dianhydride, 2,2-bis (3 , 4-Dicarboxyphenyl) propane dianhydride, bis (3,4-dicarboxyphenyl) ether dianhydride, 4,4 ′-[3,3 ′-(alkylphosphoryldiphenylene) -bis (iminocarbonyl) ] Diphthalic dianhydride,

Aromatic tetracarboxylic dianhydrides such as adducts of hydroquinone diacetate and trimetic anhydride, diacetyldiamine and trimetic anhydride; 5- (2,5-dioxotetrahydrofuryl) -3-methyl- 3-cyclohexsi-1,2-dicarboxylic anhydride (Dainippon Ink Chemical Co., Ltd., Epicron B-4400), 1,2,3,4-cyclopentanetetracarboxylic dianhydride, 1,2 Alicyclic tetracarboxylic dianhydrides such as 1,4,5-cyclohexanetetracarboxylic dianhydride, tetrahydrofuran tetracarboxylic dianhydride, 1,2,3,4-butanetetracarboxylic dianhydride, 1, Aliphatic tetracarboxylic dianhydrides such as 2,4,5-pentanetetracarboxylic dianhydride may be mentioned.

Examples of a method for introducing a compound obtained by ring-opening these tetracarboxylic dianhydrides with a diol compound into a polyurethane polymer include the following methods.
a) A method of reacting an alcohol-terminated compound obtained by ring-opening tetracarboxylic dianhydride with a diol compound and a diisocyanate compound.
b) A method of reacting an alcohol-terminated urethane compound obtained by reacting a diisocyanate compound under an excess of a diol compound with tetracarboxylic dianhydride.

Specific examples of the diol compound used for the ring-opening reaction include those shown below.
That is, ethylene glycol, diethylene glycol, triethylene glycol, tetraethylene glycol, propylene glycol, dipropylene glycol, polyethylene glycol, polypropylene glycol, neopentyl glycol, 1,3-butylene glycol, 1,6-hexanediol, 2-butene- 1,4-diol, 2,2,4-trimethyl-1,3-pentanediol, 1,4-bis-β-hydroxyethoxycyclohexane, cyclohexanedimethanol, tricyclodecane dimethanol, hydrogenated bisphenol A, hydrogenated Bisphenol F, bisphenol A ethylene oxide adduct, bisphenol A propylene oxide adduct, bisphenol F ethylene oxide adduct, bisphenol F pro Renoxide adduct, hydrogenated bisphenol A ethylene oxide adduct, hydrogenated bisphenol A propylene oxide adduct, hydroquinone dihydroxyethyl ether, p-xylylene glycol, dihydroxyethyl sulfone, bis (2-hydroxyethyl) -2, Examples include 4-tolylene dicarbamate, 2,4-tolylene-bis (2-hydroxyethylcarbamide), bis (2-hydroxyethyl) -m-xylylenedicarbamate, and bis (2-hydroxyethyl) isophthalate.

The specific polyurethane polymer that can be used in the present invention is synthesized by adding the above-mentioned diisocyanate compound and diol compound to an aprotic solvent by adding a known catalyst having an activity corresponding to each reactivity and heating. The molar ratio (M _a : M _b ) of the diisocyanate and diol compound used in the synthesis is preferably 1: 1 to 1.2: 1, and the molecular weight or viscosity is desired by treating with alcohols or amines. The product having the physical properties is finally synthesized in a form in which no isocyanate group remains.

  As an introduction amount of the ethylenically unsaturated bond contained in the specific polyurethane polymer according to the present invention, in terms of equivalent, 0.3 meq / g or more of an ethylenically unsaturated bond group in the side chain, and further 0.35 to It is preferable to contain 1.50 meq / g. Furthermore, a polyurethane polymer containing a carboxyl group in the side chain of 0.4 meq / g or more, more preferably 0.45 to 1.00 meq / g together with an ethylenically unsaturated bond group is particularly preferable as the binder polymer of the present invention.

  The molecular weight of the specific polyurethane polymer according to the present invention is preferably 10,000 or more in terms of weight average molecular weight, and more preferably in the range of 40,000 to 200,000. In particular, when the polymerizable composition of the present invention is used for a recording layer of a lithographic printing plate precursor, the weight average molecular weight is within this range, the strength of the image area is excellent, and the developability of the non-image area with an alkaline developer is improved. Excellent.

  In addition, as the specific polyurethane polymer according to the present invention, those having an unsaturated group at the polymer terminal and main chain are also preferably used. By having an unsaturated group at the polymer terminal and main chain, cross-linking reactivity is further improved between the polymerizable compound and the specific polyurethane polymer, or between the specific polyurethane polymers, and the photocured product strength is increased. As a result, when a specific polyurethane polymer is used for a lithographic printing plate, a plate material having excellent printing durability can be provided. Here, as an unsaturated group, it is especially preferable to have a carbon-carbon double bond from the viewpoint of easy occurrence of a crosslinking reaction.

As a method for introducing an unsaturated group into the polymer terminal, there are the following methods. That is, in the step of treating with the residual isocyanate group at the polymer terminal and the alcohol or amine or the like in the aforementioned polyurethane polymer synthesis step, an alcohol or amine having an unsaturated group may be used. Specific examples of such a compound include the same compounds as those exemplified above as the monofunctional alcohol or monofunctional amine compound having an unsaturated group.
The unsaturated group is preferably introduced into the polymer side chain rather than the polymer terminal from the viewpoint that the introduction amount can be easily controlled and the introduction amount can be increased, and that the crosslinking reaction efficiency is improved.
The ethylenically unsaturated bond group to be introduced is preferably a methacryloyl group, an acryloyl group or a styryl group, more preferably a methacryloyl group or an acryloyl group, from the viewpoint of forming a crosslinked cured film. From the viewpoint of coexistence of the formability of the crosslinked cured film and the raw storage stability, a methacryloyl group is more preferable.
The amount of methacryloyl group introduced is preferably 0.30 meq / g or more, and more preferably in the range of 0.35 to 1.50 meq / g, as described above. That is, as the binder polymer of the present invention, a polyurethane polymer in which a methacryloyl group is introduced into the side chain in a range of 0.35 to 1.50 meq / g is the most preferable embodiment.

As a method for introducing an unsaturated group into the main chain, there is a method of using a diol compound having an unsaturated group in the main chain direction for the synthesis of a polyurethane polymer. Specific examples of the diol compound having an unsaturated group in the main chain direction include the following compounds.
That is, cis-2-butene-1,4-diol, trans-2-butene-1,4-diol, polybutadiene diol, and the like.

  The specific polyurethane polymer according to the present invention can be used in combination with an alkali-soluble polymer containing a polyurethane polymer having a structure different from that of the specific polyurethane polymer. For example, the specific polyurethane polymer can be used in combination with a polyurethane polymer containing an aromatic group in the main chain and / or side chain.

(Styrenic polymer having an ethylenically unsaturated bond in the side chain)
In the present invention, a styrene polymer having an ethylenically unsaturated bond in the side chain (hereinafter sometimes referred to as “styrene polymer”) is also preferable, and a styrenic double bond (styrene) represented by the following general formula (23): And α-methylstyrene-based double bond) and those having at least one of vinylpyridinium groups represented by the following general formula (24) are more preferable.

In the general formula (23), R ²¹ represents a hydrogen atom or a methyl group. R ²² represents any substitutable atom or atomic group. k represents an integer of 0 to 4.
In addition, the styrenic double bond represented by the general formula (23) is connected to the polymer main chain through a single bond or a connecting group consisting of an arbitrary atom or atomic group, and the way of bonding is particularly There is no limit.
Although the preferable example is shown as a repeating unit of the high molecular compound which has a functional group represented by General formula (23) below, this invention is not limited to these examples.

In the general formula (24), R ²³ represents a hydrogen atom or a methyl group. R ²⁴ represents any substitutable atom or atomic group. m represents an integer of 0 to 4. A ⁻ represents an anion. Further, the pyridinium ring may take the form of benzopyridinium fused with a benzene ring as a substituent, and in this case includes a quinolium group and an isoquinolium group.
The vinylpyridinium group represented by the general formula (24) is connected to the polymer main chain through a single bond or a connecting group consisting of an arbitrary atom or atomic group, and there is no particular limitation on the way of bonding. Absent.
Although the preferable example is shown below as a repeating unit of the high molecular compound which has a functional group represented by General formula (24) below, this invention is not limited to these examples.

  One of the methods for synthesizing the styrene polymer is a monomer having a functional group represented by the general formula (23) or (24) and having a functional group copolymerizable with another copolymer component. The method of copolymerizing each other using a well-known copolymerization method is mentioned. Here, the styrenic polymer may be a homopolymer having only one of the functional groups represented by the general formulas (23) and (24), or either one or A copolymer having two or more types of both functional groups may be used.

  Further, it may be a copolymer with other copolymerization monomers not containing these functional groups. In this case, as another copolymerization monomer, it is preferable to select a carboxy group-containing monomer, for example, for the purpose of imparting solubility to an aqueous alkali solution to the polymer. Acrylic acid, methacrylic acid, acrylic acid 2-carboxyethyl ester Examples thereof include 2-carboxyethyl methacrylate, crotonic acid, maleic acid, fumaric acid, maleic acid monoalkyl ester, fumaric acid monoalkyl ester, 4-carboxystyrene and the like.

  In addition to the monomer having a carboxy group, other monomer components may be introduced into the copolymer to be synthesized and used as a (multi-component) copolymer. In such cases, monomers that can be incorporated into the copolymer include styrene, 4-methylstyrene, 4-hydroxystyrene, 4-acetoxystyrene, 4-carboxystyrene, 4-aminostyrene, chloromethylstyrene, and 4-methoxystyrene. Styrene derivatives such as, vinylphosphonic acid, vinylsulfonic acid and salts thereof, styrenesulfonic acid and salts thereof, 4-vinylpyridine, 2-vinylpyridine, N-vinylimidazole, N-vinylcarbazole, 4-vinylbenzyltrimethylammonium chloride Quaternized product of N-vinylimidazole with methyl chloride, 4-vinylbenzylpyridinium chloride, acrylonitrile, methacrylonitrile, phenylmaleimide, hydroxyphenylmaleimide, vinyl acetate, Vinyl esters such as vinyl acetate, vinyl propionate, vinyl butyrate, vinyl stearate, vinyl benzoate, vinyl ethers such as methyl vinyl ether, butyl vinyl ether, N-vinylpyrrolidone, acryloylmorpholine, vinyl chloride, vinylidene chloride, allyl alcohol Various monomers such as vinyltrimethoxysilane are appropriately used as copolymerization monomers.

  When using the above-mentioned copolymer as the styrenic polymer, the proportion of the repeating unit having the functional group represented by the general formula (23) and / or the general formula (24) in the entire copolymer composition Is preferably 20% by mass or more, and more preferably 40% by mass or more. Within this range, the effect of the present invention is excellent and a highly sensitive crosslinking system is provided.

In addition, the styrenic polymer may be water-soluble by including a quaternary salt structure in the repeating unit. When the polymerizable composition of the present invention containing such a polymer is used as a recording layer of a lithographic printing plate precursor, it can be developed with water after exposure.
In particular, a quaternary salt structure is formed in the linking group that has the functional group represented by the general formula (23) in the repeating unit and connects the main chain and the functional group represented by the general formula (23). When it has (for example, the above specific examples P-6, P-23, and P-24), it may be a homopolymer having such a structure. It is preferable that it is a copolymer with the copolymerization monomer. For example, 4-vinylbenzyltrimethylammonium chloride, acryloyloxyethyltrimethylammonium chloride, methacryloyloxyethyltrimethylammonium chloride, quaternized product of dimethylaminopropylacrylamide with methyl chloride, quaternized product of N-vinylimidazole with methyl chloride, 4- Vinylbenzylpyridinium chloride and the like are preferably used.
Further, in the case where the functional group represented by the general formula (24) is contained in the repeating unit, it may be a homopolymer or a copolymer with the above other copolymerization monomer. .

  Alternatively, when a carboxyl group is introduced as a copolymer, development with an alkaline aqueous solution is also possible. In any case, the proportion of the repeating unit having the functional group represented by the general formula (23) and / or the general formula (24) is preferably 20% by mass or more. Can be freely selected according to the purpose.

  The molecular weight of the styrenic polymer is preferably in the range of 10,000 to 300,000 in terms of weight average molecular weight, more preferably in the range of 15,000 to 200,000, and most preferably in the range of 20000 to 150,000. In particular, when the polymerizable composition of the present invention is used for a recording layer of a lithographic printing plate precursor, the weight average molecular weight is within this range, the strength of the image area is excellent, and the developability of the non-image area with an alkaline developer is improved. Excellent.

(Polymers having ethylenically unsaturated bonds in other side chains)
As other polymers having an ethylenically unsaturated bond in the side chain, as novolak polymers having an ethylenically unsaturated group in the side chain, for example, the polymers described in JP-A-9-269596, Examples thereof include a polymer in which an ethylenically unsaturated bond is introduced into a side chain using the method described in Japanese Patent No. 62648.
Moreover, as an acetal polymer which has an ethylenically unsaturated bond in a side chain, the polymer etc. which are described in Unexamined-Japanese-Patent No. 2002-162741 are mentioned, for example.
Furthermore, as the polyamide-based polymer having an ethylenically unsaturated bond in the side chain, for example, the polymer described in Japanese Patent Application No. 2003-321022 or the polyamide polymer cited therein is disclosed in JP-A-2002-62648. Examples thereof include a polymer having an ethylenically unsaturated bond introduced into the side chain by the described method.
Examples of the polyimide polymer having an ethylenically unsaturated bond in the side chain include, for example, a polymer described in Japanese Patent Application No. 2003-339785, or a polyimide polymer cited therein, and a method described in JP-A-2002-62648. And polymers having an ethylenically unsaturated bond introduced in the side chain.

(Polymer having epoxy group or oxetanyl group in side chain)
In this invention, it is also preferable that the polymer which has an epoxy group or an oxetanyl group in a side chain is included. Specific examples of the polymer having an epoxy group in the side chain and the polymerizable monomer or oligomer having two or more epoxy groups in the molecule include bisphenol A type epoxy resin, bisphenol F type epoxy resin, and phenol novolac type epoxy. Examples thereof include a resin, a cresol novolac type epoxy resin, and an aliphatic epoxy resin.
These compounds may be used as commercial products or can be obtained by introducing an epoxy group into the side chain of the polymer.

  As a commercial product, for example, as bisphenol A type epoxy resin, JER827, JER828, JER834, JER1001, JER1002, JER1003, JER1055, JER1007, JER1009, JER1010 (above, Japan Epoxy Resin Co., Ltd.), EPICLON860, EPICLON1050, EPICLON1051, EPICLON1055 (manufactured by DIC Corporation), etc., and bisphenol F type epoxy resin is JER806, JER807, JER4004, JER4005, JER4007, JER4010 (above, Japan Epoxy Resin Co., Ltd.), EPICLON830, EPICLON835. (Above, manufactured by DIC Corporation), LCE-21, RE-602S (above, Nippon Kayaku) As a phenol novolac type epoxy resin, JER152, JER154, JER157S70, JER157S65 (manufactured by Japan Epoxy Resins Co., Ltd.), EPICLON N-740, EPICLON N-740, EPICLON N- 770, EPICLON N-775 (manufactured by DIC Corporation) and the like, and cresol novolac type epoxy resins include EPICLON N-660, EPICLON N-665, EPICLON N-670, EPICLON N-673, EPICLON N- 680, EPICLON N-690, EPICLON N-695 (manufactured by DIC Corporation), EOCN-1020 (manufactured by Nippon Kayaku Co., Ltd.), etc., and as an aliphatic epoxy resin, ADEK RESIN EP-4080S, EP-4085S, EP-4088S (above, manufactured by ADEKA) Celoxide 2021P, Celoxide 2081, Celoxide 2083, Celoxide 2085, EHPE3150, EPOLEEAD PB 3600, PB 4700 (above, Daicel Chemical Industries) (Manufactured by Nagase ChemteX Corporation), etc., Denacol EX-212L, EX-214L, EX-216L, EX-321L, EX-850L. In addition, ADEKA RESIN EP-4000S, EP-4003S, EP-4010S, EP-4010S, EP-4011S (above, manufactured by ADEKA Corporation), NC-2000, NC-3000, NC-7300, XD-1000, EPPN-501, EPPN-502 (above, manufactured by ADEKA Co., Ltd.), JER1031S (manufactured by Japan Epoxy Resin Co., Ltd.) and the like.

  Specific examples of the polymer having an oxetanyl group in the side chain and the polymerizable monomer or oligomer having two or more oxetanyl groups in the molecule include Aronoxetane OXT-121, OXT-221, OX-SQ, PNOX ( As described above, Toagosei Co., Ltd.) can be used.

In the case of synthesizing by introducing into a polymer side chain, for example, the introduction reaction includes tertiary amines such as triethylamine and benzylmethylamine, quaternary ammonium salts such as dodecyltrimethylammonium chloride, tetramethylammonium chloride, tetraethylammonium chloride, pyridine, The reaction can be carried out in an organic solvent at a reaction temperature of 50 to 150 ° C. for several to several tens of hours using triphenylphosphine or the like as a catalyst. The introduction amount of the alicyclic epoxy unsaturated compound is preferably controlled so that the acid value of the obtained polymer is in a range satisfying 5 to 200 KOH · mg / g. Further, the molecular weight is preferably 500 to 5000000, more preferably 1000 to 500000 in terms of weight average.
As the epoxy unsaturated compound, those having a glycidyl group as an epoxy group such as glycidyl (meth) acrylate and allyl glycidyl ether can be used, but preferred are unsaturated compounds having an alicyclic epoxy group. Examples of such compounds include the following compounds.

  About these polymeric compounds, the details of usage methods, such as the structure, single use or combined use, and addition amount, can be arbitrarily set according to the final performance design of a near-infrared absorptive composition. For example, from the viewpoint of sensitivity, a structure having a high unsaturated group content per molecule is preferable, and in many cases, a bifunctional or higher functionality is preferable. In addition, from the viewpoint of increasing the strength of the near infrared cut filter, those having three or more functionalities are preferable. Further, different functional numbers / different polymerizable groups (for example, acrylic acid esters, methacrylic acid esters, styrene compounds, vinyl ether compounds). A method of adjusting both sensitivity and intensity by using a combination of these materials is also effective. In addition, selection and use of polymerizable compounds are important for compatibility and dispersibility with other components (eg, metal oxides, dyes, polymerization initiators) contained in the near-infrared absorbing composition. For example, the compatibility may be improved by using a low-purity compound or using two or more kinds in combination. In addition, a specific structure may be selected from the viewpoint of improving adhesion to a hard surface such as a support.

The amount of the polymerizable compound added to the composition of the present invention is in the range of 1 to 80% by weight, more preferably 15 to 70% by weight, particularly preferably 20 to 60% by weight, based on the total solid content excluding the solvent. It is preferable to add.
Only one type of polymerizable compound or two or more types may be used, and in the case of two or more types, the total amount falls within the above range.

<Binder polymer>
The composition of the present invention may contain a binder polymer for the purpose of improving the film properties. As the binder polymer, an alkali-soluble resin is preferably used. By containing an alkali-soluble resin, there is an effect in improving heat resistance and fine adjustment of coating properness.

The alkali-soluble resin is a linear organic polymer, and promotes at least one alkali-solubility in a molecule (preferably a molecule having an acrylic copolymer or a styrene copolymer as a main chain). It can be suitably selected from alkali-soluble resins having a group. From the viewpoint of heat resistance, polyhydroxystyrene resins, polysiloxane resins, acrylic resins, acrylamide resins, and acryl / acrylamide copolymer resins are preferable. From the viewpoint of development control, acrylic resins and acrylamide resins are preferable. Resins and acrylic / acrylamide copolymer resins are preferred.
Examples of the group that promotes alkali solubility (hereinafter also referred to as an acid group) include a carboxyl group, a phosphoric acid group, a sulfonic acid group, and a phenolic hydroxyl group. The group is soluble in an organic solvent and developed with a weak alkaline aqueous solution. Possible are preferable, and (meth) acrylic acid is particularly preferable. These acid groups may be used alone or in combination of two or more.
Examples of the monomer capable of imparting an acid group after the polymerization include, for example, a monomer having a hydroxyl group such as 2-hydroxyethyl (meth) acrylate, a monomer having an epoxy group such as glycidyl (meth) acrylate, and 2-isocyanatoethyl (meta ) Monomers having an isocyanate group such as acrylate. These monomers for introducing an acid group may be only one type or two or more types. In order to introduce an acid group into an alkali-soluble binder, for example, a monomer having an acid group and / or a monomer capable of imparting an acid group after polymerization (hereinafter sometimes referred to as “monomer for introducing an acid group”) .) May be polymerized as a monomer component. In addition, when introducing an acid group using a monomer capable of imparting an acid group after polymerization as a monomer component, for example, a treatment for imparting an acid group as described later is required after the polymerization.

  For production of the alkali-soluble resin, for example, a known radical polymerization method can be applied. Polymerization conditions such as temperature, pressure, type and amount of radical initiator, type of solvent, etc. when producing an alkali-soluble resin by radical polymerization can be easily set by those skilled in the art, and experimental conditions are determined. It can also be done.

  As the linear organic polymer used as the alkali-soluble resin, a polymer having a carboxylic acid in the side chain is preferable, such as a methacrylic acid copolymer, an acrylic acid copolymer, an itaconic acid copolymer, and a crotonic acid copolymer. , Maleic acid copolymers, partially esterified maleic acid copolymers, alkali-soluble phenolic resins such as novolak resins, etc., acid cellulose derivatives having a carboxylic acid in the side chain, and acid anhydrides added to polymers having a hydroxyl group. Can be mentioned. In particular, a copolymer of (meth) acrylic acid and another monomer copolymerizable therewith is suitable as the alkali-soluble resin. Examples of other monomers copolymerizable with (meth) acrylic acid include alkyl (meth) acrylates, aryl (meth) acrylates, and vinyl compounds. As alkyl (meth) acrylate and aryl (meth) acrylate, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, pentyl (meth) acrylate, Examples of vinyl compounds such as hexyl (meth) acrylate, octyl (meth) acrylate, phenyl (meth) acrylate, benzyl (meth) acrylate, tolyl (meth) acrylate, naphthyl (meth) acrylate, cyclohexyl (meth) acrylate, styrene, α-methylstyrene, vinyltoluene, glycidyl methacrylate, acrylonitrile, vinyl acetate, N-vinylpyrrolidone, tetrahydrofurfuryl methacrylate, polystyrene macro Examples of N-substituted maleimide monomers described in JP-A-10-300922 such as monomers and polymethylmethacrylate macromonomers include N-phenylmaleimide and N-cyclohexylmaleimide. In addition, only 1 type may be sufficient as the other monomer copolymerizable with these (meth) acrylic acids, and 2 or more types may be sufficient as it.

（式（ＥＤ）中、Ｒ¹およびＲ²は、それぞれ独立して、水素原子または置換基を有していてもよい炭素数１〜２５の炭化水素基を表す。）で示される化合物（以下「エーテルダイマー」と称することもある。）を必須とする単量体成分を重合してなるポリマー（ａ）を、必須成分であるポリマー成分（Ａ）として含むことも好ましい。これにより、本発明の組成物は、耐熱性とともに透明性にも極めて優れた硬化塗膜を形成しうる。市販品としては、例えばアクリキュアＲＤ−Ｆ８（アクリル系樹脂）（日本触媒社製）などが挙げられる。
上記エーテルダイマーを示す上記一般式（１）中、Ｒ¹およびＲ²で表される置換基を有していてもよい炭素数１〜２５の炭化水素基としては、特に制限はないが、例えば、メチル、エチル、ｎ−プロピル、イソプロピル、ｎ−ブチル、イソブチル、ｔ−ブチル、ｔ−アミル、ステアリル、ラウリル、２−エチルヘキシル等の直鎖状または分岐状のアルキル基；フェニル等のアリール基；シクロヘキシル、ｔ−ブチルシクロヘキシル、ジシクロペンタジエニル、トリシクロデカニル、イソボルニル、アダマンチル、２−メチル−２−アダマンチル等の脂環式基；１−メトキシエチル、１−エトキシエチル等のアルコキシで置換されたアルキル基；ベンジル等のアリール基で置換されたアルキル基；等が挙げられる。これらの中でも特に、メチル、エチル、シクロヘキシル、ベンジル等のような酸や熱で脱離しにくい１級または２級炭素の置換基が耐熱性の点で好ましい。 As an alkali-soluble resin, the following general formula (ED)

(In formula (ED), R ¹ and R ² each independently represents a hydrogen atom or a hydrocarbon group having 1 to 25 carbon atoms which may have a substituent.) It is also preferable that the polymer (a) obtained by polymerizing the monomer component essential to “ether dimer”) is contained as the essential polymer component (A). Thereby, the composition of this invention can form the cured coating film which was very excellent also in heat resistance and transparency. Examples of commercially available products include ACRYCURE RD-F8 (acrylic resin) (manufactured by Nippon Shokubai Co., Ltd.).
In the general formula (1) showing the ether dimer, the hydrocarbon group having 1 to 25 carbon atoms which may have a substituent represented by R ¹ and R ² is not particularly limited. Linear or branched alkyl groups such as methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, t-butyl, t-amyl, stearyl, lauryl, 2-ethylhexyl; aryl groups such as phenyl; Alicyclic groups such as cyclohexyl, t-butylcyclohexyl, dicyclopentadienyl, tricyclodecanyl, isobornyl, adamantyl, 2-methyl-2-adamantyl; substituted with alkoxy such as 1-methoxyethyl, 1-ethoxyethyl An alkyl group substituted with an aryl group such as benzyl; and the like. Among these, an acid such as methyl, ethyl, cyclohexyl, benzyl or the like, or a primary or secondary carbon substituent which is difficult to be removed by heat is preferable from the viewpoint of heat resistance.

  Specific examples of the ether dimer include, for example, dimethyl-2,2 ′-[oxybis (methylene)] bis-2-propenoate, diethyl-2,2 ′-[oxybis (methylene)] bis-2-propenoate, (N-propyl) -2,2 ′-[oxybis (methylene)] bis-2-propenoate, di (isopropyl) -2,2 ′-[oxybis (methylene)] bis-2-propenoate, di (n-butyl) ) -2,2 ′-[oxybis (methylene)] bis-2-propenoate, di (isobutyl) -2,2 ′-[oxybis (methylene)] bis-2-propenoate, di (t-butyl) -2, 2 ′-[oxybis (methylene)] bis-2-propenoate, di (t-amyl) -2,2 ′-[oxybis (methylene)] bis-2-propenoate, di Stearyl) -2,2 ′-[oxybis (methylene)] bis-2-propenoate, di (lauryl) -2,2 ′-[oxybis (methylene)] bis-2-propenoate, di (2-ethylhexyl) -2 , 2 ′-[oxybis (methylene)] bis-2-propenoate, di (1-methoxyethyl) -2,2 ′-[oxybis (methylene)] bis-2-propenoate, di (1-ethoxyethyl) -2 , 2 ′-[oxybis (methylene)] bis-2-propenoate, dibenzyl-2,2 ′-[oxybis (methylene)] bis-2-propenoate, diphenyl-2,2 ′-[oxybis (methylene)] bis- 2-propenoate, dicyclohexyl-2,2 ′-[oxybis (methylene)] bis-2-propenoate, di (t-butylcyclohexyl) 2,2 ′-[oxybis (methylene)] bis-2-propenoate, di (dicyclopentadienyl) -2,2 ′-[oxybis (methylene)] bis-2-propenoate, di (tricyclodecanyl) -2,2 '-[oxybis (methylene)] bis-2-propenoate, di (isobornyl) -2,2'-[oxybis (methylene)] bis-2-propenoate, diadamantyl-2,2 '-[oxybis (Methylene)] bis-2-propenoate, di (2-methyl-2-adamantyl) -2,2 ′-[oxybis (methylene)] bis-2-propenoate, and the like. Among these, dimethyl-2,2 ′-[oxybis (methylene)] bis-2-propenoate, diethyl-2,2 ′-[oxybis (methylene)] bis-2-propenoate, dicyclohexyl-2,2′- [Oxybis (methylene)] bis-2-propenoate and dibenzyl-2,2 ′-[oxybis (methylene)] bis-2-propenoate are preferred. These ether dimers may be only one kind or two or more kinds. The structure derived from the compound represented by the general formula (ED) may be copolymerized with other monomers.

Examples of the novolac resin include those obtained by condensing phenols and aldehydes in the presence of an acid catalyst. Examples of the phenols include phenol, cresol, ethylphenol, butylphenol, xylenol, phenylphenol, catechol, resorcinol, pyrogallol, naphthol, and bisphenol A.
Examples of the aldehydes include formaldehyde, paraformaldehyde, acetaldehyde, propionaldehyde, and benzaldehyde.
The said phenols and aldehydes can be used individually or in combination of 2 or more types.

  Specific examples of the novolak resin include, for example, a condensation product of metacresol, paracresol or a mixture thereof and formalin.

  The novolak resin may be adjusted in molecular weight distribution by means of fractionation or the like. Moreover, you may mix the low molecular weight component which has phenolic hydroxyl groups, such as bisphenol C and bisphenol A, with the said novolak resin.

  As the alkali-soluble resin, a benzyl (meth) acrylate (BzMA) / (meth) acrylic acid (MAA) copolymer or a multi-component copolymer composed of these and other monomers is particularly suitable. In addition, a copolymer of 2-hydroxyethyl methacrylate, a 2-hydroxypropyl (meth) acrylate / polystyrene macromonomer / benzyl methacrylate / methacrylic acid copolymer described in JP-A-7-140654, 2-hydroxy -3-phenoxypropyl acrylate / polymethyl methacrylate macromonomer / benzyl methacrylate / methacrylic acid copolymer, 2-hydroxyethyl methacrylate / polystyrene macromonomer / methyl methacrylate / methacrylic acid copolymer, 2-hydroxyethyl methacrylate / polystyrene macromonomer / Benzyl methacrylate / methacrylic acid copolymer, and copolymers described in JP-A No. 2004-300204.

The acid value of the alkali-soluble resin is preferably 30 mgKOH / g to 200 mgKOH / g, more preferably 50 mgKOH / g to 150 mgKOH / g, and most preferably 70 to 120 mgKOH / g.
Further, the weight average molecular weight (Mw) of the alkali-soluble resin is preferably 2,000 to 50,000, more preferably 5,000 to 30,000, and most preferably 7,000 to 20,000.

  When the polymer binder is included, the content of the binder polymer in the composition of the present invention is preferably 1% by mass to 80% by mass with respect to the total solid content of the composition, and 10% by mass to 70% by mass. Is more preferable, and it is further more preferable that it is 20-60 mass%.

<Polymerization initiator>
The composition of the present invention may contain a polymerization initiator. Only one type of polymerization initiator may be used, or two or more types may be used, and in the case of two or more types, the total amount falls within the above range. 0.01 mass%-30 mass% are preferable, 0.1 mass%-20 mass% are more preferable, 0.1 mass%-15 mass% are especially preferable.
The polymerization initiator is not particularly limited as long as it has the ability to initiate polymerization of the polymerizable compound by light or heat, or both, and can be appropriately selected according to the purpose. It is preferable that When polymerization is initiated by light, those having photosensitivity to visible light from the ultraviolet region are preferred.
Moreover, when starting superposition | polymerization with a heat | fever, the polymerization initiator decomposed | disassembled at 150 to 250 degreeC is preferable.

The polymerization initiator that can be used in the present invention is preferably a compound having at least an aromatic group. For example, acylphosphine compounds, acetophenone compounds, α-aminoketone compounds, benzophenone compounds, benzoin ether compounds, ketal derivatives Compounds, thioxanthone compounds, oxime compounds, hexaarylbiimidazole compounds, trihalomethyl compounds, azo compounds, organic peroxides, diazonium compounds, iodonium compounds, sulfonium compounds, azinium compounds, benzoin ether compounds, ketal derivative compounds, metallocene compounds, etc. Onium salt compounds, organoboron salt compounds, disulfone compounds, and the like.
From the viewpoint of sensitivity, oxime compounds, acetophenone compounds, α-aminoketone compounds, trihalomethyl compounds, hexaarylbiimidazole compounds, and thiol compounds are preferred.
Examples of the polymerization initiator suitable for the present invention will be given below, but the present invention is not limited thereto.

  Specific examples of the acetophenone compound include 2,2-diethoxyacetophenone, p-dimethylaminoacetophenone, 2-hydroxy-2-methyl-1-phenyl-propan-1-one, and p-dimethylaminoacetophenone. 4′-isopropyl-2-hydroxy-2-methyl-propiophenone, 1-hydroxy-cyclohexyl-phenyl-ketone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1 2-tolyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1,2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropanone-1,2-methyl -1- (4-methylthiophenyl) -2-morpholinopropan-1-one, 2-benzyl 2-Dimethylamino-1- (4-morpholinophenyl) -butanone-1,2- (dimethylamino) -2-[(4-methylphenyl) methyl] -1- [4- (4-morpholinyl) phenyl] Examples include -1-butanone and 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropan-1-one.

  As the trihalomethyl compound, more preferably, an s-triazine derivative in which at least one mono-, di-, or trihalogen-substituted methyl group is bonded to the s-triazine ring, specifically, for example, 2,4,6-tris (Monochloromethyl) -s-triazine, 2,4,6-tris (dichloromethyl) -s-triazine, 2,4,6-tris (trichloromethyl) -s-triazine, 2-methyl-4,6-bis (Trichloromethyl) -s-triazine, 2-n-propyl-4,6-bis (trichloromethyl) -s-triazine, 2- (α, α, β-trichloroethyl) -4,6-bis (trichloromethyl) ) -S-triazine, 2-phenyl-4,6-bis (trichloromethyl) -s-triazine, 2- (p-methoxyphenyl) -4,6-bis (trichloro) Methyl) -s-triazine, 2- (3,4-epoxyphenyl) -4,6-bis (trichloromethyl) -s-triazine, 2- (p-chlorophenyl) -4,6-bis (trichloromethyl)- s-triazine, 2- [1- (p-methoxyphenyl) -2,4-butadienyl] -4,6-bis (trichloromethyl) -s-triazine, 2-styryl-4,6-bis (trichloromethyl) -S-triazine, 2- (p-methoxystyryl) -4,6-bis (trichloromethyl) -s-triazine, 2- (pi-propyloxystyryl) -4,6-bis (trichloromethyl)- s-triazine, 2- (p-tolyl) -4,6-bis (trichloromethyl) -s-triazine, 2- (4-natoxynaphthyl) -4,6-bis (trichloromethyl) s-triazine, 2-phenylthio-4,6-bis (trichloromethyl) -s-triazine, 2-benzylthio-4,6-bis (trichloromethyl) -s-triazine, 2,4,6-tris (dibromomethyl) ) -S-triazine, 2,4,6-tris (tribromomethyl) -s-triazine, 2-methyl-4,6-bis (tribromomethyl) -s-triazine, 2-methoxy-4,6- Bis (tribromomethyl) -s-triazine and the like can be mentioned.

  As the hexaarylbiimidazole compound, for example, JP-B-6-29285, US Pat. Nos. 3,479,185, 4,311,783, 4,622,286, etc. And, specifically, 2,2′-bis (o-chlorophenyl) -4,4 ′, 5,5′-tetraphenylbiimidazole, 2,2′-bis (o-bromophenyl) )) 4,4 ′, 5,5′-tetraphenylbiimidazole, 2,2′-bis (o, p-dichlorophenyl) -4,4 ′, 5,5′-tetraphenylbiimidazole, 2,2 ′ -Bis (o-chlorophenyl) -4,4 ', 5,5'-tetra (m-methoxyphenyl) biidazole, 2,2'-bis (o, o'-dichlorophenyl) -4,4', 5,5 '-Tetraphenylbi Dazole, 2,2′-bis (o-nitrophenyl) -4,4 ′, 5,5′-tetraphenylbiimidazole, 2,2′-bis (o-methylphenyl) -4,4 ′, 5 Examples include 5′-tetraphenylbiimidazole, 2,2′-bis (o-trifluorophenyl) -4,4 ′, 5,5′-tetraphenylbiimidazole, and the like.

Examples of oxime compounds include J.M. C. S. Perkin II (1979) 1653-1660, J. MoI. C. S. Perkin II (1979) 156-162, Journal of Photopolymer Science and Technology (1995) 202-232, Journal of Applied Polymer Science (2012) pp. 725-731, compounds described in JP-A No. 2000-66385, compounds described in JP-A No. 2000-80068, JP-T 2004-534797, IRGACURE OXE 01 (1.2-octanedione, 1 manufactured by BASF Japan Ltd.) -[4- (phenylthio)-, 2- (O-benzoyloxime)]), IRGACURE OXE 02 (ethanone, 1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl] -, 1- (O-acetyloxime)), 2- (acetyloxyiminomethyl) thioxanthen-9-one and the like.
Preferably, it can also be suitably used for the cyclic oxime compounds described in JP2007-231000A and JP2007-322744A.
In addition, an oxime compound having a specific substituent described in JP-A-2007-2699779 and an oxime compound having a thioaryl group described in JP-A-2009-191061 can be used.
Specifically, as the oxime compound, a compound represented by the following formula (1) is also preferable. The N—O bond of the oxime may be an (E) oxime compound, a (Z) oxime compound, or a mixture of (E) and (Z) isomers. .

(In formula (1), R and B each independently represent a monovalent substituent, A represents a divalent organic group, and Ar represents an aryl group.)
The monovalent substituent represented by R is preferably a monovalent nonmetallic atomic group. Examples of the monovalent nonmetallic atomic group include an alkyl group, an aryl group, an acyl group, an alkoxycarbonyl group, an aryloxycarbonyl group, a heterocyclic group, an alkylthiocarbonyl group, and an arylthiocarbonyl group. Moreover, these groups may have one or more substituents. Moreover, the substituent mentioned above may be further substituted by another substituent.
Examples of the substituent include a halogen atom, an aryloxy group, an alkoxycarbonyl group or an aryloxycarbonyl group, an acyloxy group, an acyl group, an alkyl group, and an aryl group.

  As the alkyl group which may have a substituent, an alkyl group having 1 to 30 carbon atoms is preferable, and specifically, a methyl group, an ethyl group, a propyl group, a butyl group, a hexyl group, an octyl group, a decyl group. , Dodecyl group, okdadecyl group, isopropyl group, isobutyl group, sec-butyl group, t-butyl group, 1-ethylpentyl group, cyclopentyl group, cyclohexyl group, trifluoromethyl group, 2-ethylhexyl group, phenacyl group, 1- Naphthoylmethyl group, 2-naphthoylmethyl group, 4-methylsulfanylphenacyl group, 4-phenylsulfanylphenacyl group, 4-dimethylaminophenacyl group, 4-cyanophenacyl group, 4-methylphenacyl group, 2- Methylphenacyl group, 3-fluorophenacyl group, 3-trifluoromethylphenacyl group, and , 3 Nitorofenashiru group can be exemplified.

  The aryl group which may have a substituent is preferably an aryl group having 6 to 30 carbon atoms, specifically, a phenyl group, a biphenyl group, a 1-naphthyl group, a 2-naphthyl group, or a 9-anthryl group. 9-phenanthryl group, 1-pyrenyl group, 5-naphthacenyl group, 1-indenyl group, 2-azurenyl group, 9-fluorenyl group, terphenyl group, quarterphenyl group, o-, m- and p-tolyl group, Xylyl group, o-, m- and p-cumenyl group, mesityl group, pentarenyl group, binaphthalenyl group, tarnaphthalenyl group, quarternaphthalenyl group, heptaenyl group, biphenylenyl group, indacenyl group, fluoranthenyl group, acenaphthylenyl group, ASEAN Trirenyl, phenalenyl, fluorenyl, anthryl, bianthracenyl, ter Nthracenyl group, quarteranthracenyl group, anthraquinolyl group, phenanthryl group, triphenylenyl group, pyrenyl group, chrysenyl group, naphthacenyl group, preadenyl group, picenyl group, perylenyl group, pentaphenyl group, pentacenyl group, tetraphenylenyl group, Examples include a hexaphenyl group, a hexacenyl group, a rubicenyl group, a coronenyl group, a trinaphthylenyl group, a heptaphenyl group, a heptacenyl group, a pyranthrenyl group, and an ovalenyl group.

  The acyl group which may have a substituent is preferably an acyl group having 2 to 20 carbon atoms, specifically, an acetyl group, a propanoyl group, a butanoyl group, a trifluoroacetyl group, a pentanoyl group, a benzoyl group, 1-naphthoyl group, 2-naphthoyl group, 4-methylsulfanylbenzoyl group, 4-phenylsulfanylbenzoyl group, 4-dimethylaminobenzoyl group, 4-diethylaminobenzoyl group, 2-chlorobenzoyl group, 2-methylbenzoyl group, 2 -Methoxybenzoyl group, 2-butoxybenzoyl group, 3-chlorobenzoyl group, 3-trifluoromethylbenzoyl group, 3-cyanobenzoyl group, 3-nitrobenzoyl group, 4-fluorobenzoyl group, 4-cyanobenzoyl group, and And 4-methoxybenzoyl group.

  The alkoxycarbonyl group which may have a substituent is preferably an alkoxycarbonyl group having 2 to 20 carbon atoms, specifically, a methoxycarbonyl group, an ethoxycarbonyl group, a propoxycarbonyl group, a butoxycarbonyl group, or a hexyloxy group. Examples thereof include a carbonyl group, an octyloxycarbonyl group, a decyloxycarbonyl group, an octadecyloxycarbonyl group, and a trifluoromethyloxycarbonyl group.

  Specific examples of the aryloxycarbonyl group which may have a substituent include phenoxycarbonyl group, 1-naphthyloxycarbonyl group, 2-naphthyloxycarbonyl group, 4-methylsulfanylphenyloxycarbonyl group, 4-phenylsulfanyl. Phenyloxycarbonyl group, 4-dimethylaminophenyloxycarbonyl group, 4-diethylaminophenyloxycarbonyl group, 2-chlorophenyloxycarbonyl group, 2-methylphenyloxycarbonyl group, 2-methoxyphenyloxycarbonyl group, 2-butoxyphenyloxy Carbonyl group, 3-chlorophenyloxycarbonyl group, 3-trifluoromethylphenyloxycarbonyl group, 3-cyanophenyloxycarbonyl group, 3-nitrophenyloxycarbonyl , 4-fluorophenyl oxycarbonyl group, 4-cyanophenyl oxycarbonyl group, and a 4-methoxy phenyloxy carbonyl group can be exemplified.

The heterocyclic group which may have a substituent is preferably an aromatic or aliphatic heterocyclic ring containing a nitrogen atom, an oxygen atom, a sulfur atom or a phosphorus atom.
Specifically, thienyl group, benzo [b] thienyl group, naphtho [2,3-b] thienyl group, thiantenyl group, furyl group, pyranyl group, isobenzofuranyl group, chromenyl group, xanthenyl group, phenoxathiyl Nyl group, 2H-pyrrolyl group, pyrrolyl group, imidazolyl group, pyrazolyl group, pyridyl group, pyrazinyl group, pyrimidinyl group, pyridazinyl group, indolizinyl group, isoindolyl group, 3H-indolyl group, indolyl group, 1H-indazolyl group, purinyl group 4H-quinolidinyl group, isoquinolyl group, quinolyl group, phthalazinyl group, naphthyridinyl group, quinoxanilyl group, quinazolinyl group, cinnolinyl group, pteridinyl group, 4aH-carbazolyl group, carbazolyl group, β-carbolinyl group, phenanthridinyl group, acridinyl Group Midinyl group, phenanthrolinyl group, phenazinyl group, phenalsadinyl group, isothiazolyl group, phenothiazinyl group, isoxazolyl group, furazanyl group, phenoxazinyl group, isochromanyl group, chromanyl group, pyrrolidinyl group, pyrrolinyl group, imidazolidinyl group, imidazolinyl group, pyrazolidinyl group, pyrazolidinyl group Examples include a group, pyrazolinyl group, piperidyl group, piperazinyl group, indolinyl group, isoindolinyl group, quinuclidinyl group, morpholinyl group, and thioxanthryl group.

  Specific examples of the alkylthiocarbonyl group which may have a substituent include a methylthiocarbonyl group, a propylthiocarbonyl group, a butylthiocarbonyl group, a hexylthiocarbonyl group, an octylthiocarbonyl group, a decylthiocarbonyl group, and an octadecylthiocarbonyl group. Examples thereof include a group and a trifluoromethylthiocarbonyl group.

  Specific examples of the arylthiocarbonyl group which may have a substituent include a 1-naphthylthiocarbonyl group, a 2-naphthylthiocarbonyl group, a 4-methylsulfanylphenylthiocarbonyl group, and a 4-phenylsulfanylphenylthiocarbonyl group. 4-dimethylaminophenylthiocarbonyl group, 4-diethylaminophenylthiocarbonyl group, 2-chlorophenylthiocarbonyl group, 2-methylphenylthiocarbonyl group, 2-methoxyphenylthiocarbonyl group, 2-butoxyphenylthiocarbonyl group, 3 -Chlorophenylthiocarbonyl group, 3-trifluoromethylphenylthiocarbonyl group, 3-cyanophenylthiocarbonyl group, 3-nitrophenylthiocarbonyl group, 4-fluorophenylthiocarbonyl group, 4-cyanophenyl Two thiocarbonyl group, and a and a 4-methoxyphenylthiocarbonyl group.

  The monovalent substituent represented by B represents an aryl group, a heterocyclic group, an arylcarbonyl group, or a heterocyclic carbonyl group. These groups may have one or more substituents. Examples of the substituent include the above-described substituents. Moreover, the substituent mentioned above may be further substituted by another substituent.

Among them, the structure shown below is particularly preferable.
In the following structure, Y, X, and n have the same meanings as Y, X, and n in formula (2) described later, and preferred examples are also the same.

Examples of the divalent organic group represented by A include an alkylene group having 1 to 12 carbon atoms, a cyclohexylene group, and an alkynylene group. These groups may have one or more substituents. Examples of the substituent include the above-described substituents. Moreover, the substituent mentioned above may be further substituted by another substituent.
Among them, A is an alkylene substituted with an unsubstituted alkylene group or an alkyl group (for example, a methyl group, an ethyl group, a tert-butyl group, or a dodecyl group) from the viewpoint of increasing sensitivity and suppressing coloration due to heating. Group, alkylene group substituted with alkenyl group (for example, vinyl group, allyl group), aryl group (for example, phenyl group, p-tolyl group, xylyl group, cumenyl group, naphthyl group, anthryl group, phenanthryl group, styryl group) An alkylene group substituted with

The aryl group represented by Ar is preferably an aryl group having 6 to 30 carbon atoms, and may have a substituent. Examples of the substituent include the same substituents as those introduced into the substituted aryl group mentioned above as specific examples of the aryl group which may have a substituent.
Of these, a substituted or unsubstituted phenyl group is preferable from the viewpoint of increasing sensitivity and suppressing coloring due to heating.

  In the formula (1), it is preferable from the viewpoint of sensitivity that the structure of “SAr” formed by Ar and adjacent S is the following structure. Me represents a methyl group, and Et represents an ethyl group.

  The oxime compound is also preferably a compound represented by the following formula (2).

(In formula (2), R and X each independently represent a monovalent substituent, A and Y each independently represent a divalent organic group, Ar represents an aryl group, and n represents 0-5. (It is an integer.)
R, A, and Ar in formula (2) have the same meanings as R, A, and Ar in formula (1), and preferred examples are also the same.

  Examples of the monovalent substituent represented by X include an alkyl group, an aryl group, an alkoxy group, an aryloxy group, an acyloxy group, an acyl group, an alkoxycarbonyl group, an amino group, a heterocyclic group, and a halogen atom. These groups may have one or more substituents. Examples of the substituent include the above-described substituents. Moreover, the substituent mentioned above may be further substituted by another substituent.

Among these, X is preferably an alkyl group from the viewpoints of solvent solubility and improvement in absorption efficiency in the long wavelength region.
Moreover, n in Formula (2) represents the integer of 0-5, and the integer of 0-2 is preferable.

  Examples of the divalent organic group represented by Y include the structures shown below. In the group shown below, * represents a bonding position between Y and an adjacent carbon atom in the above formula (2).

  Among these, from the viewpoint of increasing sensitivity, the following structures are preferable.

  Furthermore, the oxime compound is also preferably a compound represented by the following formula (3).

  R, X, A, Ar, and n in Formula (3) are respectively synonymous with R, X, A, Ar, and n in Formula (2), and preferred examples are also the same.

  Specific examples (PIox-1) to (PIox-13) of oxime compounds that can be suitably used are shown below, but the present invention is not limited thereto.

  The oxime compound preferably has a maximum absorption wavelength in a wavelength region of 350 nm to 500 nm, more preferably has an absorption wavelength in a wavelength region of 360 nm to 480 nm, and has a high absorbance at 365 nm and 455 nm. Particularly preferred.

From the viewpoint of sensitivity, the oxime compound preferably has a molar extinction coefficient at 365 nm or 405 nm of 3,000 to 300,000, more preferably 5,000 to 300,000, and 10,000 to 200. Is particularly preferred.
For the molar extinction coefficient of the compound, a known method can be used. Specifically, for example, 0.01 g of an ultraviolet-visible spectrophotometer (Vary Inc., Carry-5 spectrphotometer) using an ethyl acetate solvent is used. It is preferable to measure at a concentration of / L.

The photopolymerization initiator is more preferably a compound selected from the group consisting of oxime compounds, acetophenone compounds, and acylphosphine compounds. More specifically, for example, an aminoacetophenone initiator described in JP-A-10-291969, an acylphosphine oxide initiator described in Japanese Patent No. 4225898, and the oxime initiator described above, As the oxime initiator, compounds described in JP-A No. 2001-233842 can also be used.
As the acetophenone-based initiator, commercially available products IRGACURE-907, IRGACURE-369, and IRGACURE-379 (trade names: all manufactured by BASF Japan Ltd.) can be used. As the acylphosphine initiator, commercially available products such as IRGACURE-819 and DAROCUR-TPO (trade names: both manufactured by BASF Japan Ltd.) can be used.

<Surfactant>
The composition of the present invention may contain a surfactant. Only one type of surfactant may be used, or two or more types may be combined. The addition amount of the surfactant is preferably 0.001% by mass to 2.0% by mass and more preferably 0.005% by mass to 1.0% by mass with respect to the total mass of the composition of the present invention. More preferably, it is 0.01 to 0.1% by mass or less.
As the surfactant, various surfactants such as a fluorine-based surfactant, a nonionic surfactant, a cationic surfactant, an anionic surfactant, and a silicone-based surfactant can be used.

In particular, since the composition of the present invention contains a fluorosurfactant, the liquid properties (particularly fluidity) when prepared as a coating liquid are further improved. Sex can be improved more.
That is, when a film is formed using a coating liquid to which a composition containing a fluorosurfactant is applied, the wettability to the coated surface is reduced by reducing the interfacial tension between the coated surface and the coating liquid. Is improved, and the coating property to the coated surface is improved. For this reason, even when a thin film of about several μm is formed with a small amount of liquid, it is effective in that it is possible to more suitably form a film having a uniform thickness with small thickness unevenness.

  The fluorine content in the fluorosurfactant is preferably 3% by mass to 40% by mass, more preferably 5% by mass to 30% by mass, and particularly preferably 7% by mass to 25% by mass. A fluorosurfactant having a fluorine content within this range is effective in terms of uniformity of coating film thickness and liquid-saving properties, and has good solubility in near-infrared absorbing compositions. .

  Examples of the fluorosurfactant include Megafac F171, F172, F173, F176, F176, F177, F141, F142, F143, F144, R30, F437, F475, F479, F482, F554, F780, F780, F781 (above DIC Corporation), Florard FC430, FC431, FC171 (above, Sumitomo 3M Limited), Surflon S-382, SC-101, Same SC-103, Same SC-104, Same SC-105, Same SC1068, Same SC-381, Same SC-383, Same S393, Same KH-40 (manufactured by Asahi Glass Co., Ltd.), PF636, PF656, PF6320 PF6520, PF7002 (manufactured by OMNOVA), and the like.

  Specific examples of nonionic surfactants include glycerol, trimethylolpropane, trimethylolethane, and ethoxylates and propoxylates thereof (for example, glycerol propoxylate, glycerin ethoxylate, etc.), polyoxyethylene lauryl ether, polyoxyethylene Stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene nonylphenyl ether, polyethylene glycol dilaurate, polyethylene glycol distearate, sorbitan fatty acid ester (Pluronic L10, L31, L61, L62 manufactured by BASF, 10R5, 17R2, 25R2, Tetronic 304, 701, 704, 901, 904, 150R1, Sol Perth 20000 (manufactured by Nippon Lubrizol Corporation), and the like.

  Specific examples of the cationic surfactant include phthalocyanine derivatives (trade name: EFKA-745, manufactured by Morishita Sangyo Co., Ltd.), organosiloxane polymer KP341 (manufactured by Shin-Etsu Chemical Co., Ltd.), (meth) acrylic acid ( Co) polymer polyflow no. 75, no. 90, no. 95 (manufactured by Kyoeisha Chemical Co., Ltd.), W001 (manufactured by Yusho Co., Ltd.) and the like.

  Specific examples of the anionic surfactant include W004, W005, W017 (manufactured by Yusho Co., Ltd.) and the like.

  Examples of the silicone surfactant include “Toray Silicone DC3PA”, “Toray Silicone SH7PA”, “Toray Silicone DC11PA”, “Tore Silicone SH21PA”, “Tore Silicone SH28PA”, “Toray Silicone” manufactured by Toray Dow Corning Co., Ltd. “Silicone SH29PA”, “Toresilicone SH30PA”, “Toresilicone SH8400”, “TSF-4440”, “TSF-4300”, “TSF-4445”, “TSF-4460”, “TSF” manufactured by Momentive Performance Materials, Inc. -4552 "," KP341 "," KF6001 "," KF6002 "manufactured by Shin-Etsu Silicone Co., Ltd.," BYK307 "," BYK323 "," BYK330 "manufactured by Big Chemie.

<Other ingredients>
In the near-infrared absorbing composition of the present invention, in addition to the essential components and the preferred additives described above, other components may be appropriately selected according to the purpose as long as the effects of the present invention are not impaired.
Examples of other components that can be used in combination include a binder polymer, a dispersant, a sensitizer, a crosslinking agent, a curing accelerator, a filler, a thermosetting accelerator, a thermal polymerization inhibitor, and a plasticizer. Surface adhesion promoters and other auxiliaries (for example, conductive particles, fillers, antifoaming agents, flame retardants, leveling agents, peeling promoters, antioxidants, fragrances, surface tension modifiers, chain transfer agents Etc.) may be used in combination.
By appropriately containing these components, properties such as stability and film physical properties of the target near-infrared absorption filter can be adjusted.
These components include, for example, paragraph number 0183 of JP2012-003225A, paragraph number 0101-0102 of JP2008-250074, paragraph number 0103-0104 of JP2008-250074, The description of paragraph numbers 0107 to 0109 of 2008-250074 can be referred to, and the contents thereof are incorporated in the present specification.

  The composition of the present invention has a solid content of 10 to 90% by mass, more preferably 10 to 50% by mass, and still more preferably 10 to 30% by mass. By setting it as such a numerical value range, it becomes easy to perform an application | coating process and it can be set as a uniform film surface.

  Since the near-infrared absorbing composition of the present invention can be in a liquid state, for example, a near-infrared cut filter can be easily manufactured by a simple process of forming a film by spin coating, Insufficient production suitability in the near-infrared cut filter can be improved.

Although the use of the near-infrared absorptive composition of this invention is not specifically limited, For near-infrared cut filters in the light-receiving side of a solid-state image sensor substrate (for example, for near-infrared cut filters for wafer level lenses) For the near infrared cut filter on the back surface side (the side opposite to the light receiving side), and the like, and preferably for the light shielding film on the light receiving side of the solid-state imaging device substrate. In particular, in the present invention, it is provided on an image sensor for a solid-state image sensor and is preferably used after forming a coating film. Specifically, an embodiment in which a coating film is directly formed on the solid-state image sensor image sensor and an embodiment in which a coating film is formed on a solid-state image sensor image sensor via a glass substrate can be used.
Further, the viscosity of the near-infrared absorbing composition of the present invention is preferably in the range of 1 mPa · s to 3000 mPa · s, more preferably in the range of 10 mPa · s to 2000 mPa · s, and further preferably. Is in the range of 100 mPa · s to 1500 mPa · s.
When the near-infrared absorbing composition of the present invention is for a near-infrared cut filter on the light-receiving side of a solid-state imaging device substrate, a range of 10 mPa · s or more and 3000 mPa · s or less from the viewpoint of thick film formation and uniform coating properties. More preferably, it is in the range of 500 mPa · s to 1500 mPa · s, and most preferably in the range of 700 mPa · s to 1400 mPa · s.

The present invention also relates to a near-infrared cut filter obtained using the above-described near-infrared absorbing composition of the present invention. Since such a near-infrared cut filter is formed from the near-infrared absorbing composition of the present invention, it has a high light-shielding property (near-infrared shielding property) in the near-infrared region, and translucency (visible) in the visible-light region. It is a near-infrared cut filter having high light transmission) and excellent weather resistance such as light resistance and moisture resistance. In particular, the present invention is useful as a near-infrared cut filter having a wavelength region of 700 to 2500 nm.
Furthermore, the present invention includes a step of forming a film by applying (preferably coating, more preferably spin coating) the near-infrared absorbing composition of the present invention on the light-receiving side of the solid-state imaging device substrate. The present invention also relates to a method for manufacturing a cut filter.

  In order to form a near-infrared cut filter, first, a film is formed from the near-infrared absorbing composition of the present invention. If a film | membrane is a film | membrane formed including the said near-infrared absorptive composition, there will be no restriction | limiting in particular, About a film thickness, a laminated structure, etc., it can select suitably according to the objective.

  As a method for forming the film, the near-infrared absorbing composition of the present invention (coating liquid in which the solid content in the composition is dissolved, emulsified or dispersed) is directly applied (preferably coated) on the support. And a method of forming by drying.

The support is provided on the light receiving side of the solid-state imaging device substrate, whether it is a solid-state imaging device substrate or another substrate (for example, a glass substrate 30 described later) provided on the light-receiving side of the solid-state imaging device substrate. A layer such as a flattening layer may also be used.
The method of applying the near-infrared absorbing composition (coating liquid) on the support can be carried out by using, for example, a spin coater, a slit spin coater, or the like.
In addition, the drying conditions of the coating film vary depending on each component, the type of solvent, the use ratio, and the like, but are usually about 60 seconds to 150 ° C. for about 30 seconds to 15 minutes.

  The method for forming a near-infrared cut filter using the near-infrared absorbing composition of the present invention may include other steps.

  There is no restriction | limiting in particular as said other process, According to the objective, it can select suitably, For example, the surface treatment process of a base material, a preheating process (prebaking process), a hardening process process, a post-heating process (post-baking) Process).

<Pre-heating process / Post-heating process>
The heating temperature in the preheating step and the postheating step is usually 80 ° C to 200 ° C, and preferably 90 ° C to 150 ° C.
The heating time in the preheating step and the postheating step is usually 30 seconds to 240 seconds, and preferably 60 seconds to 180 seconds.

<Curing process>
The curing process is a process of curing the formed film as necessary, and the mechanical strength of the near-infrared cut filter is improved by performing this process.
There is no restriction | limiting in particular as said hardening process, Although it can select suitably according to the objective, For example, a whole surface exposure process, a whole surface heat processing, etc. are mentioned suitably. Here, in the present invention, “exposure” is used to include not only light of various wavelengths but also irradiation of radiation such as electron beams and X-rays.
The exposure is preferably performed by irradiation of radiation, and as the radiation that can be used for the exposure, ultraviolet rays such as electron beams, KrF, ArF, g rays, h rays, i rays and visible light are particularly preferably used. Preferably, KrF, g line, h line, and i line are preferable.
As an exposure method. Examples include stepper exposure and exposure with a high-pressure mercury lamp.
Exposure is more preferably 5mJ / cm ² ~3000mJ / cm ² is preferably ^{10mJ / cm 2 ~2000mJ / cm 2} , 50mJ / cm 2 ~1000mJ / cm 2 being most preferred.

Examples of the entire surface exposure processing method include a method of exposing the entire surface of the formed film. When the near-infrared absorbing composition contains a polymerizable compound, curing of the polymerization component in the film formed from the composition is promoted by overall exposure, the curing of the film further proceeds, mechanical strength, Durability is improved.
There is no restriction | limiting in particular as an apparatus which performs the said whole surface exposure, Although it can select suitably according to the objective, For example, UV exposure machines, such as an ultrahigh pressure mercury lamp, are mentioned suitably.

Moreover, as a method of the whole surface heat treatment, a method of heating the entire surface of the formed film can be given. By heating the entire surface, the film strength of the pattern is increased.
120 to 250 degreeC is preferable and the heating temperature in a whole surface heating has more preferable 120 to 250 degreeC. When the heating temperature is 120 ° C. or higher, the film strength is improved by the heat treatment, and when the heating temperature is 250 ° C. or lower, the components in the film are decomposed and the film quality is prevented from being weak and brittle.
The heating time in the entire surface heating is preferably 3 minutes to 180 minutes, and more preferably 5 minutes to 120 minutes.
There is no restriction | limiting in particular as an apparatus which performs whole surface heating, According to the objective, it can select suitably from well-known apparatuses, For example, a dry oven, a hot plate, IR heater etc. are mentioned.

  Moreover, this invention is a camera module which has a solid-state image sensor board | substrate and the near-infrared cut filter arrange | positioned at the light reception side of the said solid-state image sensor board | substrate, Comprising: The said near-infrared cut filter is a near-infrared cut filter of this invention. It also relates to the camera module.

Hereinafter, although the camera module which concerns on embodiment of this invention is demonstrated, referring FIG.1 and FIG.2, this invention is not limited by the following specific examples.
Throughout FIGS. 1 and 2, common portions are denoted by common reference numerals.
In the description, “upper”, “upper”, and “upper” refer to the side far from the silicon substrate 10, and “lower”, “lower”, and “lower” are the sides closer to the silicon substrate 10. Point to.

FIG. 1 is a schematic cross-sectional view illustrating a configuration of a camera module including a solid-state imaging device.
A camera module 200 shown in FIG. 1 is connected to a circuit board 70 that is a mounting board via solder balls 60 that are connection members.
Specifically, the camera module 200 is provided on the first main surface side (light receiving side) of the solid-state image sensor substrate 100 and the solid-state image sensor substrate 100 provided with an image sensor section on the first main surface of the silicon substrate. The planarizing layer 46, the near infrared cut filter 42 provided on the planarizing layer 46, the glass substrate 30 (light transmissive substrate) disposed above the near infrared cut filter 42, and the glass substrate 30. A lens holder 50 having an image pickup lens 40 disposed in an upper space and a light-shielding and electromagnetic shield 44 disposed so as to surround the solid-state image pickup device substrate 100 and the glass substrate 30 are configured. Each member is bonded by adhesives 20 and 45.
The present invention is a method of manufacturing a camera module having a solid-state image pickup device substrate and an infrared cut filter disposed on the light-receiving side of the solid-state image pickup device substrate. The present invention also relates to a step of forming a film by spin-coating an infrared absorbing liquid composition.
Therefore, in the camera module according to the present embodiment, for example, a film is formed on the planarizing layer 46 by spin-coating the infrared absorbing liquid composition of the present invention to form the infrared cut filter 42. . The method for forming an infrared cut filter by forming a film by spin coating is as described above.
In the camera module 200, incident light hν from the outside passes through the imaging lens 40, the glass substrate 30, the infrared cut filter 42, and the flattening layer 46 in order, and then reaches the imaging device portion of the solid-state imaging device substrate 100. It has become.
The camera module 200 is connected to the circuit board 70 via a solder ball 60 (connection material) on the second main surface side of the solid-state imaging device substrate 100.

FIG. 2 is an enlarged cross-sectional view of the solid-state imaging device substrate 100 in FIG.
The solid-state image sensor substrate 100 includes a silicon substrate 10 as a base, an image sensor 12, an interlayer insulating film 13, a base layer 14, a red color filter 15R, a green color filter 15G, a blue color filter 15B, an overcoat 16, a micro The lens 17, the light shielding film 18, the insulating film 22, the metal electrode 23, the solder resist layer 24, the internal electrode 26, and the element surface electrode 27 are configured.
However, the solder resist layer 24 may be omitted.

First, the configuration on the first main surface side of the solid-state imaging device substrate 100 will be mainly described.
As shown in FIG. 2, an imaging element unit in which a plurality of imaging elements 12 such as CCDs and CMOSs are two-dimensionally arranged is provided on the first main surface side of the silicon substrate 10 that is a base of the solid-state imaging element substrate 100. ing.
An interlayer insulating film 13 is formed on the image sensor 12 in the image sensor section, and a base layer 14 is formed on the interlayer insulating film 13. Furthermore, on the base layer 14, a red color filter 15 R, a green color filter 15 G, and a blue color filter 15 B (hereinafter collectively referred to as “color filter 15”) corresponding to the image sensor 12. ) Are arranged.
A light shielding film (not shown) may be provided around the boundary between the red color filter 15R, the green color filter 15G, and the blue color filter 15B, and the periphery of the imaging element unit. This light shielding film can be produced using, for example, a known black color resist.
An overcoat 16 is formed on the color filter 15, and a microlens 17 is formed on the overcoat 16 so as to correspond to the imaging element 12 (color filter 15).
The planarizing layer 46 is provided on the microlens 17.

In addition, a peripheral circuit (not shown) and an internal electrode 26 are provided in the periphery of the image sensor section on the first main surface side, and the internal electrode 26 is electrically connected to the image sensor 12 via the peripheral circuit. Has been.
Furthermore, an element surface electrode 27 is formed on the internal electrode 26 with the interlayer insulating film 13 interposed therebetween. In the interlayer insulating film 13 between the internal electrode 26 and the element surface electrode 27, a contact plug (not shown) for electrically connecting these electrodes is formed. The element surface electrode 27 is used for applying a voltage and reading a signal through the contact plug and the internal electrode 26.
A base layer 14 is formed on the element surface electrode 27. An overcoat 16 is formed on the base layer 14. The base layer 14 and the overcoat 16 formed on the element surface electrode 27 are opened to form a pad opening, and a part of the element surface electrode 27 is exposed.

The above is the configuration of the first main surface side of the solid-state imaging device substrate 100. Instead of providing the near-infrared cut filter 42 on the flattening layer 46, between the base layer 14 and the color filter 15, or A form in which a near-infrared cut filter is provided between the color filter 15 and the overcoat 16 may be employed.
On the first main surface side of the solid-state image sensor substrate 100, an adhesive 20 is provided around the image sensor section, and the solid-state image sensor substrate 100 and the glass substrate 30 are bonded via the adhesive 20.

  The silicon substrate 10 has a through hole that penetrates the silicon substrate 10, and a through electrode that is a part of the metal electrode 23 is provided in the through hole. The imaging element portion and the circuit board 70 are electrically connected by the through electrode.

Next, the configuration on the second main surface side of the solid-state imaging device substrate 100 will be mainly described.
On the second main surface side, an insulating film 22 is formed from the second main surface to the inner wall of the through hole.
On the insulating film 22, a metal electrode 23 patterned so as to extend from a region on the second main surface of the silicon substrate 10 to the inside of the through hole is provided. The metal electrode 23 is an electrode for connecting the image pickup element portion in the solid-state image pickup element substrate 100 and the circuit board 70.
The through electrode is a portion of the metal electrode 23 formed inside the through hole. The through electrode penetrates through the silicon substrate 10 and part of the interlayer insulating film, reaches the lower side of the internal electrode 26, and is electrically connected to the internal electrode 26.

Further, a solder resist layer 24 (protective layer) that covers the second main surface on which the metal electrode 23 is formed on the second main surface side and has an opening that exposes a portion of the metal electrode 23. Insulating film).
Further, on the second main surface side, a light shielding film 18 is provided which covers the second main surface on which the solder resist layer 24 is formed and has an opening through which a part of the metal electrode 23 is exposed. It has been.
In FIG. 2, the light shielding film 18 is patterned so as to cover a part of the metal electrode 23 and expose the remaining part, but may be patterned so as to expose the entire metal electrode 23. (The same applies to the patterning of the solder resist layer 24).
The solder resist layer 24 may be omitted, and the light shielding film 18 may be directly formed on the second main surface on which the metal electrode 23 is formed.

  A solder ball 60 as a connection member is provided on the exposed metal electrode 23, and the metal electrode 23 of the solid-state imaging device substrate 100 and a connection electrode (not shown) of the circuit board 70 are connected via the solder ball 60. , Are electrically connected.

As mentioned above, although the structure of the solid-state image sensor substrate 100 was demonstrated, the method as described in Paragraph 0033-0068 of Unexamined-Japanese-Patent No. 2009-158863, the method as described in Paragraph 0036-0065 of Unexamined-Japanese-Patent No. 2009-99951, etc. It can be formed by a known method.
The interlayer insulating film 13 is formed as a SiO ₂ film or a SiN film, for example, by sputtering, CVD (Chemical Vapor Deposition), or the like.
The color filter 15 is formed by photolithography using a known color resist, for example.
The overcoat 16 and the base layer 14 are formed, for example, by photolithography using a known organic interlayer film forming resist.
The microlens 17 is formed by photolithography or the like using, for example, a styrene polymer.
The solder resist layer 24 is preferably formed by photolithography using a known solder resist containing, for example, a phenolic polymer, a polyimide polymer, or an amine polymer.
The solder ball 60 is formed using, for example, Sn—Ag, Sn—Cu, Sn—Ag—Cu as Sn—Pb (eutectic), 95Pb—Sn (high lead high melting point solder), and Pb free solder. . The solder ball 60 is formed in a spherical shape having a diameter of 100 μm to 1000 μm (preferably a diameter of 150 μm to 700 μm), for example.
The internal electrode 26 and the element surface electrode 27 are formed as a metal electrode such as Cu by CMP (Chemical Mechanical Polishing) or photolithography and etching, for example.
The metal electrode 23 is formed as a metal electrode such as Cu, Au, Al, Ni, W, Pt, Mo, Cu compound, W compound, and Mo compound by sputtering, photolithography, etching, and electrolytic plating, for example. The metal electrode 23 may have a single layer configuration or a stacked configuration including two or more layers. The film thickness of the metal electrode 23 is, for example, 0.1 μm to 20 μm (preferably 0.1 μm to 10 μm). The silicon substrate 10 is not particularly limited, but a silicon substrate that is thinned by scraping the back surface of the substrate can be used. Although the thickness of the substrate is not limited, for example, a silicon wafer having a thickness of 20 μm to 200 μm (preferably 30 to 150 μm) is used.
The through hole of the silicon substrate 10 is formed by, for example, photolithography and RIE (Reactive Ion Etching).

  As mentioned above, although one Embodiment of the camera module was described with reference to FIG.1 and FIG.2, the said one embodiment is not restricted to the form of FIG.1 and FIG.2.

  The present invention will be described more specifically with reference to the following examples. The materials, amounts used, ratios, processing details, processing procedures, and the like shown in the following examples can be changed as appropriate without departing from the spirit of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below. Unless otherwise specified, “part” and “%” are based on mass.

(Copper complex A and its adjustment method)
5 g of anhydrous copper benzoate and 7 g of methacryloyloxyethyl phosphate (manufactured by Johoku Chemical Industry Co., Ltd.) were dissolved in 25 ml of acetone, and the reaction was allowed to proceed with stirring at room temperature for 4 hours. The obtained reaction product was dropped into a hexane solvent, and the precipitate was extracted by filtration and dried to obtain a copper complex A.

(Copper complex B and its adjustment method)
In the preparation method of copper complex A, bis (2-methacryloyloxyethyl) phosphate (manufactured by Johoku Chemical Industry Co., Ltd.) was used instead of methacryloyloxyethyl phosphate to obtain the desired product.

(Copper complex C and its adjustment method)
In the preparation method of the copper complex A, phosmer PP (manufactured by Unichemical Co., Ltd.) was used instead of methacryloyloxyethyl phosphate to obtain the desired product.

Example 1
The following compound was mixed and the near-infrared absorptive composition of Example 1 was prepared.
Copper complex B 30 parts by mass Binder (binder polymer) having the following structure 69.8 parts by mass F-781 (manufactured by DIC; surfactant) 0.2 parts by mass Propylene glycol monomethyl ether (PGME) (solvent ) 100 parts by mass

(Example 2)
The following compound was mixed and the near-infrared absorptive composition of Example 2 was prepared.
Copper complex B 30 parts by mass A-TMMT (made by Shin-Nakamura Chemical, pentaerythritol tetraacrylate) (polymerizable compound) 34.9 parts by mass JER157S65 (epoxy resin, manufactured by Japan Epoxy Resin Co., Ltd.) (polymerizable compound 34.9 parts by mass / F-781 (manufactured by DIC Corporation; surfactant) 0.2 parts by mass / 100 parts by mass of propylene glycol monomethyl ether (PGME) (solvent)

(Examples 3-13, 16-19, Comparative Examples 1-3)
The near-infrared absorptive composition of each Example and each comparative example was prepared by setting it as the composition similar to Example 2 except having made the kind of the copper complex and the solvent into the following table. The solid content was changed by adjusting the amount of solvent to be added, and A-TMMT and JER157S65 (the two mass ratios were always 1: 1) were adjusted. Example 19 was prepared so that the total solid content was 70%, and Example 20 was prepared so that the total solid content was 35%.

(Example 14)
In Example 7, the near-infrared absorptive composition of Example 14 was prepared like Example 7 except having changed the copper complex B into the copper complex A.

(Example 15)
In Example 7, the near-infrared absorbing composition of Example 15 was prepared in the same manner as Example 7 except that the copper complex B was changed to the copper complex C.

(Example 21)
In Example 1, the near-infrared absorbing composition of Example 19 was prepared in the same manner as in Example 1 except that the binder was changed to a binder having the following structure.

(Examples 22 and 23, Comparative Example 4)
A near-infrared absorbing composition was prepared in the same manner as in Example 2 except that the solvent (PGME) of Example 2 was a mixed solvent as shown in the table and the weight ratio was as shown in the table.
(Examples 101 to 120)
In Example 2, the solvent was changed as shown in the following table, and Examples 101 to 120 were prepared. The parentheses after the two solvent names represent the mixing ratio by weight.
(Examples 121 to 130)
In Example 13, the solvent was changed as shown in the following table, and Examples 121 to 130 were prepared. The parentheses after the two solvent names represent the mixing ratio by weight.

<Evaluation of near-infrared absorbing composition>
(Production of near-infrared cut filter)
Each of the near-infrared absorbing compositions of Examples and Comparative Examples was spin-coated on a 10 cm × 10 cm glass substrate using a spin coating method (using MIKASA SPINCOATER 1H-D7 manufactured by MIKASA Co., LTD; 300 rpm). It apply | coated and preheating (prebaking) for 120 second was performed at 100 degreeC. Thereafter, all samples were heated on a hot plate at 200 ° C. for 180 seconds, and near-infrared cut filters were prepared so that the final film thickness was 5 μm.

(Evaluation of near-infrared cut performance)
The transmittance at a wavelength of 900 nm in the color filter obtained as described above was measured using a spectrophotometer U-4100 (manufactured by Hitachi High-Technologies Corporation). In practical use, it is often used with a film thickness of 200 μm. Therefore, the infrared cut performance was evaluated based on the following criteria by recalculating the transmittance when the 5 μm film was 200 μm.
1: Near infrared transmittance is 25% or more. Infrared transmittance is quite high, which is problematic in practice.
2: Near infrared transmittance is 20% or more and less than 25%. The transmittance is still high and there are practical problems.
3: Near infrared transmittance is 12% or more and less than 20%. Practically acceptable level.
4: Near infrared transmittance is 5% or more and less than 12%. There is no problem in most practical cases.
5: Near infrared transmittance is 3% or more and less than 5%. There is almost no problem in practical use.
6: Near infrared transmittance is less than 3%. There is no problem at all.

(Evaluation of coated surface)
The entire surface of the 5 μm film produced as described above was observed with an optical microscope, and the number of unevenness (state where the surface shape was not uniform) that could be confirmed on the surface of 10 cm × 10 cm was counted and evaluated as follows. .
1: There is unevenness on the entire surface, and the number is over 100 and cannot be counted. There are practical problems.
2: There are 80 to 100 unevenness on the entire surface, which is a practical problem.
3: There is unevenness in the periphery, and the number is 30-50. Within practical tolerance.
4: There is unevenness in the periphery, the number is 15-29. Within tolerance.
5: There is unevenness in the periphery, and the number is 5 to 14. Within tolerance.
6: There are some unevenness in the periphery, the number is 1-4. Within tolerance.
7: Almost no unevenness. Within tolerance.

(Evaluation of dispersion by repeated application of near-infrared absorption performance)
The film thickness of 5 μm was applied by the above production method in each of the examples and comparative examples at N = 10, and the variation in transmittance when converted to the equivalent of 200 μm as performed in the evaluation of the near infrared transmittance. Evaluation was performed in terms of
1: Variation in near-infrared transmittance is ± 4% or more, which is problematic in practical use.
2: Variation in near-infrared transmittance is ± 2 to 4%, which is practically problematic.
3: Variation in near-infrared transmittance is acceptable within ± 1 to 2%.
4: Variation in near-infrared transmittance is acceptable within ± 0.5 to 1%.
5: Near-infrared transmittance variation is acceptable within ± 0.3-0.5%.
6: Variation in near-infrared transmittance is within an allowable range of ± 0.1 to 0.3%.
7: Variation in near-infrared transmittance is acceptable within ± 0.1%.

(Evaluation of coated surface after long-term liquid aging)
The samples of Examples 13, 127, and 128 were further subjected to the following evaluation of the coated surface after a long period of time.
The prepared sample was put into a glass sealed container and allowed to age 90 days at 25 ° C. A 5 μm film was prepared for the aged sample in the same manner as in the above-described evaluation of the coated surface, and the entire surface was observed with an optical microscope, and unevenness that could be confirmed on the surface of 10 cm × 10 cm (state where the surface was not uniform) ) Counted and evaluated as follows.
1: There is unevenness on the entire surface, and the number is over 100 and cannot be counted. There are practical problems.
2: There are 80 to 100 unevenness on the entire surface, which is a practical problem.
3: There is unevenness in the periphery, and the number is 30-50. Within practical tolerance.
4: There is unevenness in the periphery, the number is 15-29. Within tolerance.
5: There is unevenness in the periphery, and the number is 5 to 14. Within tolerance.
6: There are some unevenness in the periphery, the number is 1-4. Within tolerance.
7: Almost no unevenness. Within tolerance.

＊表中、ＥＥＰはエチル−３−エトキシプロピオネートを表し、ＰＧＭＥＡはプロピレングリコールモノメチルエーテルアセテートを表す。

* In the table, EEP represents ethyl-3-ethoxypropionate, and PGMEA represents propylene glycol monomethyl ether acetate.

  As is apparent from the above table, when the composition of the present invention is used, the near-infrared absorptive composition that is excellent in near-infrared cut performance and can suppress unevenness in the coated surface and variation in the near-infrared absorption performance of the film. Things were obtained.

  In the present invention, even if the solid content ratio of the composition is increased, unevenness in the coated surface and variations in the infrared absorption performance of the film are suppressed, so that the film thickness of the near infrared cut filter can be reduced. It becomes.

Claims (16)

A near-infrared absorbing composition containing a copper complex and a solvent, wherein the ratio of the solid content of the near-infrared absorbing composition is 10 to 90% by mass, and the boiling point of the solvent at 1 atm is 90 to 200 ° C. A near infrared ray absorbing composition. The near-infrared absorptive composition of Claim 1 whose density of a solvent is 0.90 g / cm < ³ > or more. The near-infrared absorptive composition of Claim 1 or 2 whose boiling point of a solvent is 110-180 degreeC. The near-infrared absorptive composition of any one of Claims 1-3 whose ratio of a copper complex is 30-90 mass% with respect to solid content of the said near-infrared absorptive composition. The near infrared ray according to any one of claims 1 to 4, wherein the solvent is at least one selected from alcohols, ketones, esters, ethers, aromatic hydrocarbons and halogenated hydrocarbons. Absorbent composition. The near-infrared absorbing composition according to any one of claims 1 to 5, wherein the solvent is at least one of propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, cyclohexanone, and ethyl-3-ethoxypropionate. object. The solvent is at least one selected from propylene glycol, propylene glycol monomethyl ether acetate, butoxypropanol, ethoxypropanol, ethyl lactate, dipropylene glycol monomethyl ether, butoxyethanol, dimethylformamide, dimethylsulfoxide, dimethylacetamide and methyldiglyme The near-infrared absorptive composition of any one of Claims 1-5. Furthermore, the near-infrared absorptive composition of any one of Claims 1-7 containing a polymeric compound. The near-infrared absorptive composition of any one of Claims 1-8 whose compounding quantity of a solvent is 30-65 mass% in the said near-infrared absorptive composition. The near-infrared absorptive composition of any one of Claims 1-9 whose said copper complex is a phosphate ester copper compound. The near-infrared absorptive composition of any one of Claims 1-10 which has on a solid-state image sensor image sensor, and uses it by forming a coating film. The near-infrared cut off filter produced using the near-infrared absorptive composition of any one of Claims 1-11. The camera module which has a solid-state image sensor board | substrate and the near-infrared cut off filter of Claim 12 arrange | positioned at the light-receiving side of the said solid-state image sensor board | substrate. It is a manufacturing method of the camera module which has a solid-state image sensor board | substrate and the near-infrared cut filter arrange | positioned at the light-receiving side of the said solid-state image sensor board | substrate, Comprising: In the light-receiving side of a solid-state image sensor board | substrate, A method for producing a camera module, comprising a step of forming a film by applying the near-infrared absorbing composition according to claim 1. The manufacturing method of the camera module of Claim 14 including light-irradiating and hardening | curing the film | membrane formed by apply | coating the said near-infrared absorptive composition. A near-infrared absorbing composition containing a copper compound and a solvent, wherein the ratio of the solid content of the near-infrared absorbing composition is 10 to 90% by mass, and the boiling point of the solvent at 1 atm is 90 to 200 ° C. A near infrared ray absorbing composition.

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