JP2015034258A - Composition, film, and method for producing the film - Google Patents
Composition, film, and method for producing the film Download PDFInfo
- Publication number
- JP2015034258A JP2015034258A JP2013166660A JP2013166660A JP2015034258A JP 2015034258 A JP2015034258 A JP 2015034258A JP 2013166660 A JP2013166660 A JP 2013166660A JP 2013166660 A JP2013166660 A JP 2013166660A JP 2015034258 A JP2015034258 A JP 2015034258A
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- JP
- Japan
- Prior art keywords
- copolymer
- film
- composition
- solvent
- methyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 116
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 229920001577 copolymer Polymers 0.000 claims abstract description 130
- 239000002904 solvent Substances 0.000 claims abstract description 89
- WSSSPWUEQFSQQG-UHFFFAOYSA-N dimethylbutene Natural products CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 claims abstract description 71
- 238000002844 melting Methods 0.000 claims abstract description 42
- 230000008018 melting Effects 0.000 claims abstract description 42
- NNBZCPXTIHJBJL-UHFFFAOYSA-N decalin Chemical compound C1CCCC2CCCCC21 NNBZCPXTIHJBJL-UHFFFAOYSA-N 0.000 claims abstract description 30
- 239000004711 α-olefin Substances 0.000 claims abstract description 25
- LDTAOIUHUHHCMU-UHFFFAOYSA-N 3-methylpent-1-ene Chemical compound CCC(C)C=C LDTAOIUHUHHCMU-UHFFFAOYSA-N 0.000 claims abstract description 23
- PXXNTAGJWPJAGM-UHFFFAOYSA-N vertaline Natural products C1C2C=3C=C(OC)C(OC)=CC=3OC(C=C3)=CC=C3CCC(=O)OC1CC1N2CCCC1 PXXNTAGJWPJAGM-UHFFFAOYSA-N 0.000 claims abstract description 15
- 238000005227 gel permeation chromatography Methods 0.000 claims abstract description 14
- 238000009826 distribution Methods 0.000 claims abstract description 13
- 239000011248 coating agent Substances 0.000 claims description 26
- 229920005989 resin Polymers 0.000 claims description 24
- 239000011347 resin Substances 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 21
- 125000000524 functional group Chemical group 0.000 claims description 20
- 150000001336 alkenes Chemical class 0.000 claims description 19
- 125000004432 carbon atom Chemical group C* 0.000 claims description 19
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 17
- 239000005977 Ethylene Substances 0.000 claims description 17
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims description 16
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 12
- 239000001257 hydrogen Substances 0.000 claims description 12
- 229910052739 hydrogen Inorganic materials 0.000 claims description 12
- 125000003700 epoxy group Chemical group 0.000 claims description 10
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 claims description 9
- 125000004018 acid anhydride group Chemical group 0.000 claims description 9
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 8
- 239000003990 capacitor Substances 0.000 claims description 6
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 claims description 6
- 239000003849 aromatic solvent Substances 0.000 claims description 5
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims description 4
- 238000010292 electrical insulation Methods 0.000 abstract description 14
- 238000003860 storage Methods 0.000 abstract description 9
- 230000001747 exhibiting effect Effects 0.000 abstract 1
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 36
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 30
- 150000001875 compounds Chemical class 0.000 description 28
- 229920000642 polymer Polymers 0.000 description 25
- 238000006116 polymerization reaction Methods 0.000 description 25
- 239000000243 solution Substances 0.000 description 19
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 18
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 17
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 16
- -1 fluororesin Polymers 0.000 description 15
- 239000010410 layer Substances 0.000 description 15
- 229910052757 nitrogen Inorganic materials 0.000 description 15
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 15
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 15
- 230000015556 catabolic process Effects 0.000 description 14
- 229920000098 polyolefin Polymers 0.000 description 14
- 239000003795 chemical substances by application Substances 0.000 description 12
- 239000000853 adhesive Substances 0.000 description 11
- 230000001070 adhesive effect Effects 0.000 description 11
- 238000003756 stirring Methods 0.000 description 11
- 239000000126 substance Substances 0.000 description 11
- 239000000758 substrate Substances 0.000 description 11
- 238000005259 measurement Methods 0.000 description 10
- MCULRUJILOGHCJ-UHFFFAOYSA-N triisobutylaluminium Chemical compound CC(C)C[Al](CC(C)C)CC(C)C MCULRUJILOGHCJ-UHFFFAOYSA-N 0.000 description 10
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 9
- RFFLAFLAYFXFSW-UHFFFAOYSA-N 1,2-dichlorobenzene Chemical compound ClC1=CC=CC=C1Cl RFFLAFLAYFXFSW-UHFFFAOYSA-N 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 8
- 230000000704 physical effect Effects 0.000 description 8
- 239000000843 powder Substances 0.000 description 8
- 238000003786 synthesis reaction Methods 0.000 description 8
- 229920005992 thermoplastic resin Polymers 0.000 description 8
- 239000004840 adhesive resin Substances 0.000 description 7
- 229920006223 adhesive resin Polymers 0.000 description 7
- 239000003963 antioxidant agent Substances 0.000 description 7
- 230000003078 antioxidant effect Effects 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- 238000002425 crystallisation Methods 0.000 description 7
- 230000008025 crystallization Effects 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 6
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- 239000004793 Polystyrene Substances 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 239000003921 oil Substances 0.000 description 6
- 229920002223 polystyrene Polymers 0.000 description 6
- NQQCMQZWDCOJJV-UHFFFAOYSA-N C1(=CC=CC=C1)C(C1=CC=CC=C1)=[Zr](C1=C(C=CC=2C3=CC=C(C=C3CC1=2)C(C)(C)C)C(C)(C)C)C1C=C(C=C1CC)C(C)(C)C Chemical compound C1(=CC=CC=C1)C(C1=CC=CC=C1)=[Zr](C1=C(C=CC=2C3=CC=C(C=C3CC1=2)C(C)(C)C)C(C)(C)C)C1C=C(C=C1CC)C(C)(C)C NQQCMQZWDCOJJV-UHFFFAOYSA-N 0.000 description 5
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 5
- 229920001400 block copolymer Polymers 0.000 description 5
- 239000011247 coating layer Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 238000000354 decomposition reaction Methods 0.000 description 5
- 229920001971 elastomer Polymers 0.000 description 5
- 239000000806 elastomer Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000003999 initiator Substances 0.000 description 5
- 239000000314 lubricant Substances 0.000 description 5
- CPOFMOWDMVWCLF-UHFFFAOYSA-N methyl(oxo)alumane Chemical compound C[Al]=O CPOFMOWDMVWCLF-UHFFFAOYSA-N 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 150000003254 radicals Chemical class 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 229920001169 thermoplastic Polymers 0.000 description 5
- 229920002725 thermoplastic elastomer Polymers 0.000 description 5
- 239000004416 thermosoftening plastic Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000009835 boiling Methods 0.000 description 4
- 150000001735 carboxylic acids Chemical class 0.000 description 4
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 4
- 239000012968 metallocene catalyst Substances 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- 239000011241 protective layer Substances 0.000 description 4
- 239000012748 slip agent Substances 0.000 description 4
- 239000003381 stabilizer Substances 0.000 description 4
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 3
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000002216 antistatic agent Substances 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 239000000975 dye Substances 0.000 description 3
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 3
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 3
- 239000012760 heat stabilizer Substances 0.000 description 3
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 3
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 150000003961 organosilicon compounds Chemical class 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 239000012744 reinforcing agent Substances 0.000 description 3
- 229920006395 saturated elastomer Polymers 0.000 description 3
- 235000003441 saturated fatty acids Nutrition 0.000 description 3
- 150000004671 saturated fatty acids Chemical class 0.000 description 3
- 229920006132 styrene block copolymer Polymers 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 3
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 2
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 2
- GQEZCXVZFLOKMC-UHFFFAOYSA-N 1-hexadecene Chemical compound CCCCCCCCCCCCCCC=C GQEZCXVZFLOKMC-UHFFFAOYSA-N 0.000 description 2
- 238000001644 13C nuclear magnetic resonance spectroscopy Methods 0.000 description 2
- SDJHPPZKZZWAKF-UHFFFAOYSA-N 2,3-dimethylbuta-1,3-diene Chemical compound CC(=C)C(C)=C SDJHPPZKZZWAKF-UHFFFAOYSA-N 0.000 description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 2
- RYPKRALMXUUNKS-UHFFFAOYSA-N 2-Hexene Natural products CCCC=CC RYPKRALMXUUNKS-UHFFFAOYSA-N 0.000 description 2
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 2
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- WTQBISBWKRKLIJ-UHFFFAOYSA-N 5-methylidenebicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(=C)CC1C=C2 WTQBISBWKRKLIJ-UHFFFAOYSA-N 0.000 description 2
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- 239000005639 Lauric acid Substances 0.000 description 2
- 238000005481 NMR spectroscopy Methods 0.000 description 2
- 239000005642 Oleic acid Substances 0.000 description 2
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 2
- 235000021314 Palmitic acid Nutrition 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 235000021355 Stearic acid Nutrition 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- NIDNOXCRFUCAKQ-UHFFFAOYSA-N bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic acid Chemical compound C1C2C=CC1C(C(=O)O)C2C(O)=O NIDNOXCRFUCAKQ-UHFFFAOYSA-N 0.000 description 2
- 239000002981 blocking agent Substances 0.000 description 2
- 125000002843 carboxylic acid group Chemical group 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000012986 chain transfer agent Substances 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- MGNZXYYWBUKAII-UHFFFAOYSA-N cyclohexa-1,3-diene Chemical compound C1CC=CC=C1 MGNZXYYWBUKAII-UHFFFAOYSA-N 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 2
- 150000001993 dienes Chemical class 0.000 description 2
- 238000007865 diluting Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 2
- IIEWJVIFRVWJOD-UHFFFAOYSA-N ethylcyclohexane Chemical compound CCC1CCCCC1 IIEWJVIFRVWJOD-UHFFFAOYSA-N 0.000 description 2
- 229920001038 ethylene copolymer Polymers 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000005187 foaming Methods 0.000 description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000004573 interface analysis Methods 0.000 description 2
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 2
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000113 methacrylic resin Substances 0.000 description 2
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 2
- 238000006011 modification reaction Methods 0.000 description 2
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 2
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 2
- 235000021313 oleic acid Nutrition 0.000 description 2
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000002685 polymerization catalyst Substances 0.000 description 2
- 229920005672 polyolefin resin Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000008117 stearic acid Substances 0.000 description 2
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 2
- 229920001567 vinyl ester resin Polymers 0.000 description 2
- 239000003643 water by type Substances 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- OJOWICOBYCXEKR-APPZFPTMSA-N (1S,4R)-5-ethylidenebicyclo[2.2.1]hept-2-ene Chemical compound CC=C1C[C@@H]2C[C@@H]1C=C2 OJOWICOBYCXEKR-APPZFPTMSA-N 0.000 description 1
- LTQBNYCMVZQRSD-UHFFFAOYSA-N (4-ethenylphenyl)-trimethoxysilane Chemical compound CO[Si](OC)(OC)C1=CC=C(C=C)C=C1 LTQBNYCMVZQRSD-UHFFFAOYSA-N 0.000 description 1
- PRBHEGAFLDMLAL-GQCTYLIASA-N (4e)-hexa-1,4-diene Chemical compound C\C=C\CC=C PRBHEGAFLDMLAL-GQCTYLIASA-N 0.000 description 1
- RJUCIROUEDJQIB-GQCTYLIASA-N (6e)-octa-1,6-diene Chemical compound C\C=C\CCCC=C RJUCIROUEDJQIB-GQCTYLIASA-N 0.000 description 1
- PMJHHCWVYXUKFD-SNAWJCMRSA-N (E)-1,3-pentadiene Chemical compound C\C=C\C=C PMJHHCWVYXUKFD-SNAWJCMRSA-N 0.000 description 1
- WLQXEFXDBYHMRG-UPHRSURJSA-N (z)-4-(oxiran-2-ylmethoxy)-4-oxobut-2-enoic acid Chemical compound OC(=O)\C=C/C(=O)OCC1CO1 WLQXEFXDBYHMRG-UPHRSURJSA-N 0.000 description 1
- ISSYTHPTTMFJKL-UHFFFAOYSA-N 1-ethenylcyclopentene Chemical compound C=CC1=CCCC1 ISSYTHPTTMFJKL-UHFFFAOYSA-N 0.000 description 1
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- FEEIOCGOXYNQIM-UHFFFAOYSA-N 2,3-di(propan-2-ylidene)bicyclo[2.2.1]hept-5-ene Chemical compound C1C2C=CC1C(=C(C)C)C2=C(C)C FEEIOCGOXYNQIM-UHFFFAOYSA-N 0.000 description 1
- JPSKCQCQZUGWNM-UHFFFAOYSA-N 2,7-Oxepanedione Chemical compound O=C1CCCCC(=O)O1 JPSKCQCQZUGWNM-UHFFFAOYSA-N 0.000 description 1
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 description 1
- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 description 1
- IOHAVGDJBFVWGE-UHFFFAOYSA-N 2-ethylidene-3-propan-2-ylidenebicyclo[2.2.1]hept-5-ene Chemical compound C1C2C=CC1C(=CC)C2=C(C)C IOHAVGDJBFVWGE-UHFFFAOYSA-N 0.000 description 1
- WGRZHLPEQDVPET-UHFFFAOYSA-N 2-methoxyethoxysilane Chemical compound COCCO[SiH3] WGRZHLPEQDVPET-UHFFFAOYSA-N 0.000 description 1
- VSKJLJHPAFKHBX-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical compound CC(=C)C=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 VSKJLJHPAFKHBX-UHFFFAOYSA-N 0.000 description 1
- SLQMKNPIYMOEGB-UHFFFAOYSA-N 2-methylhexa-1,5-diene Chemical compound CC(=C)CCC=C SLQMKNPIYMOEGB-UHFFFAOYSA-N 0.000 description 1
- DOYKFSOCSXVQAN-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CCO[Si](C)(OCC)CCCOC(=O)C(C)=C DOYKFSOCSXVQAN-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 1
- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UNUVUYPEOAILGM-UHFFFAOYSA-N 4-ethenylbicyclo[2.2.1]heptane Chemical compound C1CC2CCC1(C=C)C2 UNUVUYPEOAILGM-UHFFFAOYSA-N 0.000 description 1
- PRKPGWQEKNEVEU-UHFFFAOYSA-N 4-methyl-n-(3-triethoxysilylpropyl)pentan-2-imine Chemical compound CCO[Si](OCC)(OCC)CCCN=C(C)CC(C)C PRKPGWQEKNEVEU-UHFFFAOYSA-N 0.000 description 1
- RGYYNNJKBSMMDL-UHFFFAOYSA-N 4-trimethylsilyloxybutyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCO[Si](C)(C)C RGYYNNJKBSMMDL-UHFFFAOYSA-N 0.000 description 1
- INYHZQLKOKTDAI-UHFFFAOYSA-N 5-ethenylbicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(C=C)CC1C=C2 INYHZQLKOKTDAI-UHFFFAOYSA-N 0.000 description 1
- KUFDSEQTHICIIF-UHFFFAOYSA-N 6-methylhepta-1,5-diene Chemical compound CC(C)=CCCC=C KUFDSEQTHICIIF-UHFFFAOYSA-N 0.000 description 1
- UCKITPBQPGXDHV-UHFFFAOYSA-N 7-methylocta-1,6-diene Chemical compound CC(C)=CCCCC=C UCKITPBQPGXDHV-UHFFFAOYSA-N 0.000 description 1
- DPUOLQHDNGRHBS-UHFFFAOYSA-N Brassidinsaeure Natural products CCCCCCCCC=CCCCCCCCCCCCC(O)=O DPUOLQHDNGRHBS-UHFFFAOYSA-N 0.000 description 1
- GLDDVZPZOFCMTE-UHFFFAOYSA-N CCO[SiH](C)CCCOCC1CO1 Chemical compound CCO[SiH](C)CCCOCC1CO1 GLDDVZPZOFCMTE-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- URXZXNYJPAJJOQ-UHFFFAOYSA-N Erucic acid Natural products CCCCCCC=CCCCCCCCCCCCC(O)=O URXZXNYJPAJJOQ-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- 229920003354 Modic® Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 229920011250 Polypropylene Block Copolymer Polymers 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000005233 alkylalcohol group Chemical group 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 229920006125 amorphous polymer Polymers 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical class C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 150000001718 carbodiimides Chemical class 0.000 description 1
- 238000001460 carbon-13 nuclear magnetic resonance spectrum Methods 0.000 description 1
- 150000001244 carboxylic acid anhydrides Chemical group 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000002734 clay mineral Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000001739 density measurement Methods 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- LDCRTTXIJACKKU-ARJAWSKDSA-N dimethyl maleate Chemical compound COC(=O)\C=C/C(=O)OC LDCRTTXIJACKKU-ARJAWSKDSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- UAUDZVJPLUQNMU-KTKRTIGZSA-N erucamide Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCC(N)=O UAUDZVJPLUQNMU-KTKRTIGZSA-N 0.000 description 1
- DPUOLQHDNGRHBS-KTKRTIGZSA-N erucic acid Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCC(O)=O DPUOLQHDNGRHBS-KTKRTIGZSA-N 0.000 description 1
- LDLDYFCCDKENPD-UHFFFAOYSA-N ethenylcyclohexane Chemical compound C=CC1CCCCC1 LDLDYFCCDKENPD-UHFFFAOYSA-N 0.000 description 1
- 125000005678 ethenylene group Chemical group [H]C([*:1])=C([H])[*:2] 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- NKHAVTQWNUWKEO-UHFFFAOYSA-N fumaric acid monomethyl ester Natural products COC(=O)C=CC(O)=O NKHAVTQWNUWKEO-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- VANNPISTIUFMLH-UHFFFAOYSA-N glutaric anhydride Chemical compound O=C1CCCC(=O)O1 VANNPISTIUFMLH-UHFFFAOYSA-N 0.000 description 1
- 238000010559 graft polymerization reaction Methods 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- LDHQCZJRKDOVOX-IHWYPQMZSA-N isocrotonic acid Chemical compound C\C=C/C(O)=O LDHQCZJRKDOVOX-IHWYPQMZSA-N 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
- 229920000092 linear low density polyethylene Polymers 0.000 description 1
- 239000004707 linear low-density polyethylene Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 159000000003 magnesium salts Chemical class 0.000 description 1
- 229920001179 medium density polyethylene Polymers 0.000 description 1
- 239000004701 medium-density polyethylene Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- NKHAVTQWNUWKEO-IHWYPQMZSA-N methyl hydrogen fumarate Chemical compound COC(=O)\C=C/C(O)=O NKHAVTQWNUWKEO-IHWYPQMZSA-N 0.000 description 1
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- INJVFBCDVXYHGQ-UHFFFAOYSA-N n'-(3-triethoxysilylpropyl)ethane-1,2-diamine Chemical compound CCO[Si](OCC)(OCC)CCCNCCN INJVFBCDVXYHGQ-UHFFFAOYSA-N 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- RKISUIUJZGSLEV-UHFFFAOYSA-N n-[2-(octadecanoylamino)ethyl]octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(=O)NCCNC(=O)CCCCCCCCCCCCCCCCC RKISUIUJZGSLEV-UHFFFAOYSA-N 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- CCCMONHAUSKTEQ-UHFFFAOYSA-N octadecene Natural products CCCCCCCCCCCCCCCCC=C CCCMONHAUSKTEQ-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 238000006864 oxidative decomposition reaction Methods 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 150000004291 polyenes Chemical class 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920005606 polypropylene copolymer Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002742 polystyrene-block-poly(ethylene/propylene) -block-polystyrene Polymers 0.000 description 1
- 238000004663 powder metallurgy Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011877 solvent mixture Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- FRGPKMWIYVTFIQ-UHFFFAOYSA-N triethoxy(3-isocyanatopropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCN=C=O FRGPKMWIYVTFIQ-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- AZSKHRTUXHLAHS-UHFFFAOYSA-N tris(2,4-di-tert-butylphenyl) phosphate Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(=O)(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C AZSKHRTUXHLAHS-UHFFFAOYSA-N 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Landscapes
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
Description
本発明は、電気絶縁性が高いフィルムを製造することができ、かつ保存安定性が高い組成物、前記組成物を用いて製造され得るフィルム、前記フィルムの製造方法などに関する。 The present invention relates to a composition that can produce a film having high electrical insulation and high storage stability, a film that can be produced using the composition, a method for producing the film, and the like.
表示デバイス、半導体デバイス、光学部材、プリント回路基板などには、保護用、絶縁用、平坦化用、耐熱用、耐光用、耐候用などの各種コーティング剤が用いられる。これらのコーティング剤を用いて作成されたフィルムには、用途に応じて透明性、電気絶縁性などの特性が要求される。特にキャパシタの電極表面にコーティング剤を用いて形成されたフィルムには、蓄積された電気の漏洩や電圧降下を防ぐため高い電気絶縁性が要求される。 Various coating agents for protection, insulation, planarization, heat resistance, light resistance, weather resistance, etc. are used for display devices, semiconductor devices, optical members, printed circuit boards, and the like. Films made using these coating agents are required to have properties such as transparency and electrical insulation depending on the application. In particular, a film formed by using a coating agent on the electrode surface of a capacitor is required to have high electrical insulation in order to prevent leakage of accumulated electricity and voltage drop.
またプリント配線基板、フレキシブルプリント配線基板、多層プリント配線基板等の回路基板のプレス工程では、当て板に回路基板が付着するのを防止するために離型フィルムが用いられている。例えばフレキシブルプリント配線基板の場合、所定の回路部を有する基材(ポリイミドフィルムなど)の回路部を保護するために、回路部を接着剤付き樹脂フィルムで被覆して、さらに離型フィルムを積層してプレスすることが行なわれている(例えば、特許文献1)。 In the pressing process of circuit boards such as printed wiring boards, flexible printed wiring boards, and multilayer printed wiring boards, a release film is used to prevent the circuit board from adhering to the backing plate. For example, in the case of a flexible printed circuit board, in order to protect the circuit part of a base material (polyimide film etc.) having a predetermined circuit part, the circuit part is covered with a resin film with an adhesive, and a release film is further laminated. Pressing is performed (for example, Patent Document 1).
このような背景から離型フィルムなどに用いることができる電気絶縁性を有するフィルムを形成しうるコーティング剤が求められている。このような要望に対して、アクリル樹脂、ポリカーボネート樹脂、フッ素樹脂、ポリアセタール樹脂、ポリエステル樹脂、シリコーン樹脂、ポリエーテルスルホン樹脂、ポリイミド樹脂、ポリアリレート樹脂、環状オレフィン系樹脂などを含むコーティング剤が提案されているが、高い電気絶縁性を有するフィルムを形成することはできていなかった。 From such a background, a coating agent capable of forming an electrically insulating film that can be used for a release film is demanded. In response to such demands, coating agents containing acrylic resin, polycarbonate resin, fluororesin, polyacetal resin, polyester resin, silicone resin, polyethersulfone resin, polyimide resin, polyarylate resin, cyclic olefin resin, etc. have been proposed. However, a film having high electrical insulation could not be formed.
本発明は、コーティングなどにより良好な電気絶縁性を示すフィルムを形成することができ、かつ保存安定性に優れる組成物を提供することを目的とする。 An object of this invention is to provide the composition which can form the film which shows favorable electrical insulation by coating etc., and is excellent in storage stability.
本発明者らは、上記課題を解決すべく鋭意検討した結果、特定の物性を有する4−メチル−1−ペンテンおよび/または3−メチル−1−ペンテンに由来する構成単位を含む共重合体Aと、溶媒と、を含む組成物によって上記課題を解決できることを見出し、本発明を完成するに至った。 As a result of intensive studies to solve the above-mentioned problems, the present inventors have found that copolymer A containing a structural unit derived from 4-methyl-1-pentene and / or 3-methyl-1-pentene having specific physical properties. And the present invention has been completed by finding that the above-mentioned problems can be solved by a composition containing a solvent.
すなわち、本願の第一の発明は以下の組成物に関する。
[1]下記の(i)〜(v)の要件を満たす共重合体(A)と、溶媒と、を含む、組成物。(i)4−メチル−1−ペンテンおよび/または3−メチル−1−ペンテンに由来する構成単位を50〜95モル%含み、炭素原子数2〜4のαーオレフィンに由来する構成単位を5〜50モル%含む共重合体である(ii)135℃デカリン中で測定した極限粘度[η]が0.5〜5.0(dl/g)である(iii)DSCで測定した融点(Tm)が200℃以下、もしくは本質的に融点が存在しない(iv)密度が820〜850(kg/m3)である(v)ゲルパーミエーションクロマトグラフィー(GPC)で測定する重量平均分子量(Mw)と数平均分子量(Mn)との比である分子量分布(Mw/Mn)が1.0〜3.5である
[2]前記共重合体(A)が、4−メチル−1−ペンテンおよび/または3−メチル−1−ペンテンに由来する構成単位を50〜95モル%含み、炭素原子数3のαーオレフィンに由来する構成単位を5〜50モル%含む共重合体である、[1]に記載の組成物。
[3]共重合体(A)を、組成物100重量%に対して0.1〜95重量%含む、[1]または[2]に記載の組成物。
[4]前記溶媒が25℃における比誘電率が5以下の溶媒である、[1]〜[3]のいずれか一項に記載の組成物
[5]前記溶媒が、n−ヘキサン、n−ヘプタン、n−オクタン、ナフテン系溶剤、イソパラフィン系溶剤及び芳香族系溶剤からなる群より選択される少なくとも1種の溶媒である[1]〜[4]のいずれか一項に記載の組成物。
[6]前記共重合体(A)が活性水素含有官能基、酸無水物基及びエポキシ基からなる群から選ばれる官能基を少なくとも1つ以上有する[1]〜[5]記載のいずれか一項に記載の組成物。
[7]前記共重合体(A)と、活性水素含有官能基、酸無水物基及びエポキシ基からなる群から選ばれた官能基を有する樹脂(B)と、を含んでなる、[1]〜[6]記載の組成物。
[8][1]〜[7]のいずれか一項に記載の組成物を含む、コーティング剤。
That is, the first invention of the present application relates to the following composition.
[1] A composition comprising a copolymer (A) that satisfies the following requirements (i) to (v) and a solvent. (I) 50 to 95 mol% of structural units derived from 4-methyl-1-pentene and / or 3-methyl-1-pentene, and 5 to 5 structural units derived from an α-olefin having 2 to 4 carbon atoms (Ii) the intrinsic viscosity [η] measured in 135 ° C. decalin is 0.5 to 5.0 (dl / g) (iii) melting point (Tm) measured by DSC Is not more than 200 ° C. or has essentially no melting point (iv) Density is 820 to 850 (kg / m 3) (v) Weight average molecular weight (Mw) and number measured by gel permeation chromatography (GPC) The molecular weight distribution (Mw / Mn), which is a ratio to the average molecular weight (Mn), is 1.0 to 3.5.
[2] The copolymer (A) contains 50 to 95 mol% of a structural unit derived from 4-methyl-1-pentene and / or 3-methyl-1-pentene, and is an α-olefin having 3 carbon atoms. The composition according to [1], which is a copolymer containing 5 to 50 mol% of a derived structural unit.
[3] The composition according to [1] or [2], comprising 0.1 to 95% by weight of the copolymer (A) with respect to 100% by weight of the composition.
[4] The composition according to any one of [1] to [3], wherein the solvent is a solvent having a relative dielectric constant of 5 or less at 25 ° C.
[5] The solvent is at least one solvent selected from the group consisting of n-hexane, n-heptane, n-octane, naphthene solvents, isoparaffin solvents and aromatic solvents [1] to [ [4] The composition according to any one of [4].
[6] Any one of [1] to [5], wherein the copolymer (A) has at least one functional group selected from the group consisting of an active hydrogen-containing functional group, an acid anhydride group, and an epoxy group. The composition according to item.
[7] The copolymer (A), and a resin (B) having a functional group selected from the group consisting of an active hydrogen-containing functional group, an acid anhydride group, and an epoxy group, [1] -Composition of [6] description.
[8] A coating agent comprising the composition according to any one of [1] to [7].
本願の第二の発明は以下の製造方法に関する。
[9][1]〜[8]のいずれか一項に記載の組成物またはコーティング剤を塗布する第一の工程と、前記組成物中の溶媒を除去する第二の工程と、を含む、フィルムの製造方法。
The second invention of the present application relates to the following manufacturing method.
[9] A first step of applying the composition or coating agent according to any one of [1] to [8], and a second step of removing the solvent in the composition, A method for producing a film.
本願の第三の発明は以下のフィルム等に関する。
[10]下記の(i)〜(v)の要件を満たす共重合体(A)と、溶媒と、を含む、フィルムであって、前記フィルム100重量%に対して前記溶媒を0.001〜0.5重量%含むフィルム。(i)4−メチル−1−ペンテンおよび/または3−メチル−1−ペンテンに由来する構成単位を50〜95モル%含み、エチレン及び炭素原子数3〜4のαーオレフィンからなる群から選ばれる少なくとも1種類のオレフィンに由来する構成単位を5〜50モル%含む共重合体である(ii)135℃デカリン中で測定した極限粘度[η]が0.5〜5.0(dl/g)である(iii)DSCで測定した融点(Tm)が200℃以下もしくは本質的に融点が存在しない(iv)密度が820〜850(kg/m3)である(v)ゲルパーミエーションクロマトグラフィー(GPC)で測定する重量平均分子量(Mw)と数平均分子量(Mn)との比である分子量分布(Mw/Mn)は1.0〜3.5である[11][10]に記載のフィルムからなる層(X)と、活性水素含有官能基、酸無水物基及びエポキシ基からなる群から選ばれる官能基を有する樹脂(B)を含む層(Y)の積層フィルム。
[12][10]に記載のフィルムを備えた、キャパシタ。
[13][10]または[11]に記載のフィルムを最表面の少なくとも一部に備えた離型フィルム。
The third invention of the present application relates to the following films and the like.
[10] A film comprising a copolymer (A) that satisfies the following requirements (i) to (v) and a solvent, wherein the solvent is added to 0.001 to 100% by weight of the film. Film containing 0.5% by weight. (I) 50 to 95 mol% of a structural unit derived from 4-methyl-1-pentene and / or 3-methyl-1-pentene is selected from the group consisting of ethylene and an α-olefin having 3 to 4 carbon atoms. (Ii) an intrinsic viscosity [η] measured in decalin at 135 ° C. of 0.5 to 5.0 (dl / g), which is a copolymer containing 5 to 50 mol% of a structural unit derived from at least one olefin (Iii) Melting point (Tm) measured by DSC is 200 ° C. or lower or essentially no melting point (iv) Density is 820 to 850 (kg / m 3) (v) Gel permeation chromatography (GPC) The molecular weight distribution (Mw / Mn), which is the ratio of the weight average molecular weight (Mw) to the number average molecular weight (Mn) measured in (1), is 1.0 to 3.5. [11] From the film according to [10] Layer (X When the laminated film of the layer containing the resin (B) having a functional group selected from the group consisting of active hydrogen-containing functional group, an acid anhydride group and an epoxy group (Y).
[12] A capacitor comprising the film according to [10].
[13] A release film comprising the film according to [10] or [11] on at least a part of the outermost surface.
本発明の組成物は、一定期間の保管を経た後でも良好な電気絶縁性を有するフィルムを容易に製造することができる。 The composition of the present invention can easily produce a film having good electrical insulation even after storage for a certain period.
1.組成物
本発明の組成物は、共重合体(A)と、溶媒と、を含む組成物である。以下で、本願発明の組成物について詳細に説明する。なお、本願発明において、「〜」を使用して数値範囲を規定するが、本願発明の「〜」は境界値を含む。例えば、「1〜100」とは10以上100以下を意味する。また、本願では共重合のことを重合と記載する場合があり、共重合体のことを重合体と記載する場合がある。
1. Composition The composition of the present invention is a composition comprising a copolymer (A) and a solvent. Below, the composition of this invention is demonstrated in detail. In the present invention, a numerical range is defined using “to”, but “to” in the present invention includes a boundary value. For example, “1 to 100” means 10 or more and 100 or less. Moreover, in this application, a copolymer may be described as a polymerization and a copolymer may be described as a polymer.
(1)共重合体(A)
本発明の共重合体(A)は、(i)4−メチル−1−ペンテンおよび/または3−メチル−1−ペンテンに由来する構成単位を50〜95モル%含み、エチレン及び炭素原子数3〜4のαーオレフィンからなる群から選ばれる少なくとも1種類のオレフィンに由来する構成単位を5〜50モル%含む共重合体であり、(ii)135℃デカリン中で測定した極限粘度[η]が0.5〜5.0(dl/g)であり、(iii)DSCで測定した融点(Tm)が200℃以下または実質的に融点が存在せず、(iv)密度が820〜850(kg/m3)であり、(v)ゲルパーミエーションクロマトグラフィー(GPC)で測定する重量平均分子量(Mw)と数平均分子量(Mn)との比である分子量分布(Mw/Mn)は1.0〜3.5であるとの(i)〜(v)の要件を同時に満たす。以下で各要件について説明する。
(1) Copolymer (A)
The copolymer (A) of the present invention comprises (i) 50 to 95 mol% of a structural unit derived from 4-methyl-1-pentene and / or 3-methyl-1-pentene, and contains ethylene and 3 carbon atoms. A copolymer containing 5 to 50 mol% of a structural unit derived from at least one olefin selected from the group consisting of α-olefins of ˜4, and (ii) an intrinsic viscosity [η] measured in decalin at 135 ° C. 0.5 to 5.0 (dl / g), (iii) melting point (Tm) measured by DSC is 200 ° C. or lower or substantially no melting point, and (iv) density is 820 to 850 (kg) Molecular weight distribution (Mw / Mn), which is the ratio of the weight average molecular weight (Mw) and the number average molecular weight (Mn) measured by gel permeation chromatography (GPC). (I) ~ 3.5 v) meet the requirements of at the same time. Each requirement will be described below.
(1−1)要件(i)
本願発明の共重合体(A)は、4−メチル−1−ペンテンおよび/または3−メチル−1−ペンテンに由来する構成単位を50〜95モル%含み、エチレン及び炭素原子数3〜4のαーオレフィンからなる群から選ばれる少なくとも1種類のオレフィンに由来する構成単位を5〜50モル%含む共重合体である。
(1-1) Requirements (i)
The copolymer (A) of the present invention contains 50 to 95 mol% of structural units derived from 4-methyl-1-pentene and / or 3-methyl-1-pentene, and has ethylene and 3 to 4 carbon atoms. It is a copolymer containing 5 to 50 mol% of structural units derived from at least one olefin selected from the group consisting of α-olefins.
ここで、4−メチル−1−ペンテンおよび/または3−メチル−1−ペンテンから導かれる構成単位の上限は好ましくは95モル%、より好ましくは90モル%であり、下限は好ましくは50モル%、より好ましくは70モル%である。なお4−メチル−1−ペンテンおよび/または3−メチル−1−ペンテンから導かれる構成単位のモル%とは、4−メチル−1−ペンテンのみに由来する構成単位のモル%と3−メチル−1−ペンテンのみに由来する構成単位のモル%を合計したものである。 Here, the upper limit of the structural unit derived from 4-methyl-1-pentene and / or 3-methyl-1-pentene is preferably 95 mol%, more preferably 90 mol%, and the lower limit is preferably 50 mol%. More preferably, it is 70 mol%. The mol% of the structural unit derived from 4-methyl-1-pentene and / or 3-methyl-1-pentene means the mol% of the structural unit derived only from 4-methyl-1-pentene and 3-methyl- This is the sum of mol% of structural units derived only from 1-pentene.
共重合体(A)中には、4−メチル−1−ペンテンに由来する構成単位か3−メチル−1−ペンテンに由来する構成単位のいずれか一方が含まれていてもよく、両方が含まれていてもよい。4−メチル−1−ペンテンに由来する構成単位と3−メチル−1−ペンテンに由来する構成単位の比率などは特に限定されないが、好ましくは4−メチル−1−ペンテンに由来する構成単位が、3−メチル−1−ペンテンと4−メチル−1−ペンテンに由来する構成単位の合計100モル%に対して80〜100モル%の比率であることが好ましい。 The copolymer (A) may contain either one of a structural unit derived from 4-methyl-1-pentene or a structural unit derived from 3-methyl-1-pentene, and both are included. It may be. The ratio of the structural unit derived from 4-methyl-1-pentene and the structural unit derived from 3-methyl-1-pentene is not particularly limited, but the structural unit derived from 4-methyl-1-pentene is preferably, It is preferable that it is a ratio of 80-100 mol% with respect to a total of 100 mol% of the structural unit derived from 3-methyl-1-pentene and 4-methyl-1-pentene.
エチレン及び炭素原子数3〜4のαーオレフィンからなる群から選ばれる少なくとも1種類のオレフィンから導かれる構成単位の上限は好ましくは50モル%、より好ましくは30モル%、さらに好ましくは13モル%であり、下限は好ましくは5モル%、より好ましくは10モル%である。 The upper limit of the structural unit derived from at least one olefin selected from the group consisting of ethylene and an α-olefin having 3 to 4 carbon atoms is preferably 50 mol%, more preferably 30 mol%, still more preferably 13 mol%. The lower limit is preferably 5 mol%, more preferably 10 mol%.
ここで、4−メチル−1−ペンテンおよび/または3−メチル−1−ペンテンから導かれる構成単位が100モル%(エチレン及び炭素原子数3〜4のαーオレフィンからなる群から選ばれる少なくとも1種類のオレフィンから導かれる構成単位が0モル%)とは、共重合体(A)が、4−メチル−1−ペンテンおよび/または3−メチル−1−ペンテンのみの重合体であることを示すものである。 Here, the structural unit derived from 4-methyl-1-pentene and / or 3-methyl-1-pentene is 100 mol% (at least one selected from the group consisting of ethylene and an α-olefin having 3 to 4 carbon atoms) The constituent unit derived from the olefin of 0 mol%) indicates that the copolymer (A) is a polymer of 4-methyl-1-pentene and / or 3-methyl-1-pentene only. It is.
各構成単位が上記範囲にあると、共重合体(A)を含む組成物から作成したフィルムの離型性と電気絶縁性が良好になる。さらに後述する溶媒との親和性が向上し、本発明の組成物の安定性が向上する傾向にある。これは嵩高い構成単位である4−メチル−1−ペンテンおよび/または3−メチル−ペンテンが、結晶化しやすいプロピレン、ヘキサデセン、オクタデセン、ヘキセンのようなオレフィンに対して一定含まれることで共重合体(A)が結晶化しにくくなり、溶媒に展開し均一に分散しやすくなるためと考えられる。なお本願発明でいう組成物の安定性とは、共重合体(A)が後述する溶媒に均一に溶解し、前記共重合体(A)の著しい沈殿が見られないことを意味する。 When each structural unit is in the above range, the release property and electrical insulation of a film prepared from the composition containing the copolymer (A) are improved. Furthermore, the affinity with the solvent described later is improved, and the stability of the composition of the present invention tends to be improved. This is because a bulky constituent unit of 4-methyl-1-pentene and / or 3-methyl-pentene is contained in a certain amount with respect to olefins such as propylene, hexadecene, octadecene and hexene which are easily crystallized. It is considered that (A) is difficult to crystallize and is easily developed and uniformly dispersed in a solvent. In addition, the stability of the composition as used in this invention means that a copolymer (A) melt | dissolves uniformly in the solvent mentioned later, and the remarkable precipitation of the said copolymer (A) is not seen.
炭素原子数3〜4のα−オレフィンとしては、プロピレン、1−ブテンなどが好適な例として挙げられる。これらのうち、共重合性および得られる共重合体の物性の観点からは、プロピレンが好ましい。これらのエチレン及び炭素原子数3〜4のα−オレフィンは、単独で、あるいは2種以上組み合わせて用いることができる。 Suitable examples of the α-olefin having 3 to 4 carbon atoms include propylene and 1-butene. Of these, propylene is preferred from the viewpoints of copolymerizability and physical properties of the resulting copolymer. These ethylene and α-olefin having 3 to 4 carbon atoms can be used alone or in combination of two or more.
なお、共重合体(A)は、本発明の目的を損なわない範囲で、その他の重合性化合物由来の構造単位を含んでいてもよい。このような他の重合性化合物としては、例えばスチレン、ビニルシクロペンテン、ビニルシクロヘキサン、ビニルノルボルナン等の環状構造を有するビニル化合物;酢酸ビニル等のビニルエステル類;メタクリル酸、アクリル酸、無水マレイン酸等の不飽和有機酸またはその誘導体;ブタジエン、イソプレン、ペンタジエン、2,3−ジメチルブタジエン等の共役ジエン類;1,4−ヘキサジエン、1,6−オクタジエン、2−メチル−1,5−ヘキサジエン、6−メチル−1,5−ヘプタジエン、7−メチル−1,6−オクタジエン、ジシクロペンタジエン、シクロヘキサジエン、ジシクロオクタジエン、メチレンノルボルネン、5−ビニルノルボルネン、5−エチリデン−2−ノルボルネン、5−メチレン−2−ノルボルネン、5−イソプロピリデン−2−ノルボルネン、6−クロロメチル−5−イソプロペンル−2−ノルボルネン、2,3−ジイソプロピリデン−5−ノルボルネン、2−エチリデン−3−イソプロピリデン−5−ノルボルネン、2−プロペニル−2,2−ノルボルナジエン等の非共役ポリエン類などが挙げられる。 The copolymer (A) may contain structural units derived from other polymerizable compounds as long as the object of the present invention is not impaired. Examples of such other polymerizable compounds include vinyl compounds having a cyclic structure such as styrene, vinylcyclopentene, vinylcyclohexane, and vinylnorbornane; vinyl esters such as vinyl acetate; methacrylic acid, acrylic acid, maleic anhydride, and the like. Unsaturated organic acids or derivatives thereof; conjugated dienes such as butadiene, isoprene, pentadiene, 2,3-dimethylbutadiene; 1,4-hexadiene, 1,6-octadiene, 2-methyl-1,5-hexadiene, 6- Methyl-1,5-heptadiene, 7-methyl-1,6-octadiene, dicyclopentadiene, cyclohexadiene, dicyclooctadiene, methylenenorbornene, 5-vinylnorbornene, 5-ethylidene-2-norbornene, 5-methylene- 2-norbornene, 5-iso Ropyridene-2-norbornene, 6-chloromethyl-5-isopropylene-2-norbornene, 2,3-diisopropylidene-5-norbornene, 2-ethylidene-3-isopropylidene-5-norbornene, 2-propenyl-2, Non-conjugated polyenes such as 2-norbornadiene are exemplified.
本発明における共重合体(A)は、このような他の重合性化合物から導かれる単位を、共重合体(A)に含まれる全ての重合性化合物に由来する構造単位の合計100モル%に対して、10モル%以下、好ましくは5モル%以下、より好ましくは3モル%以下の量で含有していてもよい。 In the copolymer (A) in the present invention, the units derived from such other polymerizable compounds are added to a total of 100 mol% of structural units derived from all the polymerizable compounds contained in the copolymer (A). On the other hand, it may be contained in an amount of 10 mol% or less, preferably 5 mol% or less, more preferably 3 mol% or less.
共重合体(A)中の4−メチル−1−ペンテン、3−メチル−1−ペンテン、エチレンやα−オレフィンなどの含量は、以下の装置および条件により13C−NMRにより測定により行うことができる。具体的には、日本電子(株)製ECP500型核磁気共鳴装置を用い、溶媒としてオルトジクロロベンゼン/重ベンゼン(80/20容量%)混合溶媒,試料(共重合体(A))濃度55mg/0.6mL、測定温度120℃、観測核は13C(125MHz)、シーケンスはシングルパルスプロトンデカップリング、パルス幅は4.7μ秒(45°パルス)、繰り返し時間は5.5秒、積算回数は1万回以上、27.50ppmをケミカルシフトの基準値として測定することができる。 The content of 4-methyl-1-pentene, 3-methyl-1-pentene, ethylene, α-olefin, and the like in the copolymer (A) can be measured by 13C-NMR using the following apparatus and conditions. . Specifically, using an ECP500 type nuclear magnetic resonance apparatus manufactured by JEOL Ltd., a solvent mixture of orthodichlorobenzene / heavy benzene (80/20% by volume), sample (copolymer (A)) concentration of 55 mg / 0.6 mL, measurement temperature 120 ° C., observation nucleus 13 C (125 MHz), sequence single pulse proton decoupling, pulse width 4.7 μsec (45 ° pulse), repeat time 5.5 seconds, integration count 1 More than 10,000 times, 27.50 ppm can be measured as a reference value for chemical shift.
(1−2)要件(ii)
本願発明の共重合体(A)の135℃デカリン中で測定した極限粘度[η]は0.5〜5.0(dl/g)である。ここで本発明の組成物の安定性と言う観点からは、極限粘度[η]の上限値は、4.0以下が好ましく、2.5以下がさらに好ましい。また、本発明の組成物を用いて作成したフィルムの形状安定性という観点からは極限粘度[η]の下限値が0.6以上であるのがより好ましい。上記極限粘度[η]の値は、共重合体(A)を製造する際の、重合工程における水素の添加量により調整することが可能である。
(1-2) Requirements (ii)
The intrinsic viscosity [η] measured in 135 ° C. decalin of the copolymer (A) of the present invention is 0.5 to 5.0 (dl / g). Here, from the viewpoint of the stability of the composition of the present invention, the upper limit of the intrinsic viscosity [η] is preferably 4.0 or less, and more preferably 2.5 or less. Moreover, it is more preferable that the lower limit of intrinsic viscosity [η] is 0.6 or more from the viewpoint of the shape stability of a film prepared using the composition of the present invention. The value of the intrinsic viscosity [η] can be adjusted by the amount of hydrogen added in the polymerization step when the copolymer (A) is produced.
また極限粘度[η]はデカリン溶媒を用いて、135℃で測定した値である。具体的には、共重合体(A)約20mgをデカリン15mlに溶解し、135℃のオイルバス中で比粘度ηspを測定することができる。このデカリン溶液にデカリン溶媒を5ml追加して希釈後、同様にして比粘度ηspを測定し、濃度(C)を0に外挿することで、ηsp/Cの値を極限粘度として求めることができる。 The intrinsic viscosity [η] is a value measured at 135 ° C. using a decalin solvent. Specifically, about 20 mg of the copolymer (A) can be dissolved in 15 ml of decalin, and the specific viscosity ηsp can be measured in an oil bath at 135 ° C. After adding 5 ml of decalin solvent to the decalin solution and diluting, the specific viscosity ηsp is measured in the same manner, and the value of ηsp / C can be obtained as the limiting viscosity by extrapolating the concentration (C) to 0. .
(1−3)要件(iii)
本願発明の共重合体(A)DSCで測定した融点(Tm)が200℃以下または実質的に融点がなく、好ましくは実質的に融点がないか110〜180℃の範囲が好ましく、さらに好ましくは実質的に融点がないか160℃未満が好ましい。前記、融点(Tm)の値は、重合体の立体規則性ならびにエチレン及び炭素原子数3〜4のα−オレフィン構造単位の含有率に依存する傾向がある。このため後述するオレフィン重合用触媒を用い、さらにはエチレンや炭素原子数3〜4のα−オレフィン構造単位の含有率を制御することにより、融点(Tm)を調整することができる。
(1-3) Requirements (iii)
The copolymer (A) of the present invention has a melting point (Tm) measured by DSC of 200 ° C. or less or substantially no melting point, preferably substantially no melting point or a range of 110 to 180 ° C., more preferably Substantially no melting point or less than 160 ° C. is preferred. The value of the melting point (Tm) tends to depend on the stereoregularity of the polymer and the content of ethylene and an α-olefin structural unit having 3 to 4 carbon atoms. For this reason, melting | fusing point (Tm) can be adjusted by using the catalyst for olefin polymerization mentioned later, and also controlling the content rate of a C3-C4 alpha olefin structural unit.
また融点(Tm)は、以下のような方法で測定することができる。セイコーインスツルメンツ社製DSC測定装置(DSC220C)を用い、測定用アルミパンに約5mgの試料(共重合体(A))をつめて、10℃/minで290℃まで昇温し、290℃で5分間保持した後、10℃/minで−50℃まで降温させる。この時の結晶化溶融ピークのピーク頂点から融点(Tm)を算出することができる。なお後述する結晶化温度(Tc)は、Tmと同様の方法で測定した結晶化ピークのピーク頂点の温度から求めることができ
る。
The melting point (Tm) can be measured by the following method. Using a DSC measuring apparatus (DSC220C) manufactured by Seiko Instruments Inc., about 5 mg of the sample (copolymer (A)) is filled in an aluminum pan for measurement, the temperature is raised to 290 ° C. at 10 ° C./min, and 5 at 290 ° C. After holding for a minute, the temperature is lowered to −50 ° C. at 10 ° C./min. The melting point (Tm) can be calculated from the peak apex of the crystallization melting peak at this time. In addition, the crystallization temperature (Tc) mentioned later can be calculated | required from the temperature of the peak vertex of the crystallization peak measured by the method similar to Tm.
なお実質的に融点が存在しないとは、示差走査熱量計(DSC)で測定される融点(Tm)の融解エンタルピー(ΔH)が、実質的に観測されない熱可塑性樹脂をいう。融解エンタルピー(ΔH)が実質的に観測されないとは、ΔHが好ましくは10J/g以下、更に好ましくは5J/g以下であることをいう。融点(Tm)の値が上記範囲にある共重合体(A)を用いることで、組成物の保存安定性が向上し、かつフィルムの性状も均一なものが得られる傾向にある。 Note that substantially no melting point means a thermoplastic resin in which the melting enthalpy (ΔH) of the melting point (Tm) measured by a differential scanning calorimeter (DSC) is not substantially observed. The fact that the melting enthalpy (ΔH) is not substantially observed means that ΔH is preferably 10 J / g or less, more preferably 5 J / g or less. By using the copolymer (A) having a melting point (Tm) in the above range, the storage stability of the composition is improved and a uniform film property tends to be obtained.
(1−4)要件(iv)
本願発明の共重合体(A)の密度は820〜850(kg/m3)である。好ましくは825〜850kg/m3であり、より好ましくは825〜845kg/m3、さらに好ましくは825〜840kg/m3である。共重合体(A)の密度の値は、4−メチル−1−ペンテンおよび/または3−メチル−1−ペンテンと共に重合する他のオレフィンの種類や含有率を選択することにより、調整することが可能である。また密度は、JIS K6268に準拠して測定することができる。密度の値が上記範囲にある共重合体(A)は、耐熱性の観点から好ましいため、これを含む組成物から得られるフィルムも耐熱性が高いものが得られる傾向にある。
(1-4) Requirements (iv)
The density of the copolymer (A) of the present invention is 820 to 850 (kg / m3). Preferably it is 825-850 kg / m3, More preferably, it is 825-845 kg / m3, More preferably, it is 825-840 kg / m3. The value of the density of the copolymer (A) can be adjusted by selecting the type and content of other olefins polymerized with 4-methyl-1-pentene and / or 3-methyl-1-pentene. Is possible. The density can be measured according to JIS K6268. Since the copolymer (A) having a density value in the above range is preferable from the viewpoint of heat resistance, a film obtained from a composition containing the copolymer (A) tends to have high heat resistance.
(1−5)要件(v)
本願発明の共重合体(A)のゲルパーミエーションクロマトグラフィー(GPC)で測定する重量平均分子量(Mw)と数平均分子量(Mn)との比である分子量分布(Mw/Mn)は1.0〜3.5であり、好ましくは1.3〜3.0、さらに好ましくは1.5〜2.5である。
(1-5) Requirements (v)
The molecular weight distribution (Mw / Mn), which is the ratio of the weight average molecular weight (Mw) and the number average molecular weight (Mn) measured by gel permeation chromatography (GPC) of the copolymer (A) of the present invention, is 1.0. It is -3.5, Preferably it is 1.3-3.0, More preferably, it is 1.5-2.5.
前記分子量分布(Mw/Mn)の値は、後述するオレフィン重合用触媒、特にメタロセン触媒の種類によって調整することが可能である。また分子量分布(Mw/Mn)は、Waters社製ゲル浸透クロマトグラフAlliance GPC−2000型を用いて測定することができる。例えば、分離カラムは、TSKgel GNH6−HTを2本およびTSKgel GNH6−HTLの2本を用いることができる(カラムサイズはいずれも直径7.5mm、長さ300mm)。カラム温度を140℃とし、移動相にはo−ジクロロベンゼン(和光純薬工業株式会社製)および酸化防止剤としてBHT(武田薬品工業株式会社製)0.025重量%を用い、1.0ml/分で移動させる。次に、共重合体(A)の濃度を15mg/10mLに調整し、試料注入量は500マイクロリットルにして検出器(示差屈折計)で測定することができる。標準ポリスチレンは、分子量がMw<1000またはMw>4×106の範囲ついては東ソー株式会社製を用い、1000≦Mw≦4×106の範囲ついてはプレッシャーケミカル社製を用いて測定することができる。 The value of the molecular weight distribution (Mw / Mn) can be adjusted according to the type of olefin polymerization catalyst, particularly a metallocene catalyst described later. The molecular weight distribution (Mw / Mn) can be measured by using a gel permeation chromatograph Alliance GPC-2000 manufactured by Waters. For example, as the separation column, two TSKgel GNH6-HT and two TSKgel GNH6-HTL can be used (both column sizes are 7.5 mm in diameter and 300 mm in length). The column temperature is 140 ° C., o-dichlorobenzene (manufactured by Wako Pure Chemical Industries, Ltd.) is used as the mobile phase, and 0.025% by weight of BHT (manufactured by Takeda Pharmaceutical Company Limited) is used as the antioxidant, and 1.0 ml / Move in minutes. Next, the concentration of the copolymer (A) can be adjusted to 15 mg / 10 mL, and the sample injection amount can be 500 microliters and measured with a detector (differential refractometer). The standard polystyrene can be measured by using Tosoh Corp. for a molecular weight range of Mw <1000 or Mw> 4 × 10 6 and by using Pressure Chemical Co. for a range of 1000 ≦ Mw ≦ 4 × 10 6.
分子量分布(Mw/Mn)の値が前記範囲にある共重合体(A)は、透明性、機械特性の観点から好ましいため、これを含む組成物から得られるフィルムも透明性に優れたものが得られる傾向にある。また共重合体(A)の分子量分布が前記範囲内にあると、後述する溶媒との親和性が高まり、本発明の組成物の安定性が向上する。さらには本発明の組成物を用いて製造したフィルムの表面平滑性や均一性が向上し、タック性が低下する傾向がある。 The copolymer (A) having a molecular weight distribution (Mw / Mn) in the above range is preferable from the viewpoints of transparency and mechanical properties, and therefore a film obtained from a composition containing the copolymer (A) is also excellent in transparency. It tends to be obtained. Moreover, when the molecular weight distribution of the copolymer (A) is within the above range, the affinity with the solvent described later is increased, and the stability of the composition of the present invention is improved. Furthermore, the surface smoothness and uniformity of a film produced using the composition of the present invention tend to be improved, and the tackiness tends to be reduced.
(1−6)結晶化温度(Tc)
本発明における、共重合体(A)のDSCで測定した結晶化温度(Tc)は110〜220℃であることが好ましく、さらに好ましくは120〜210℃である。上記、結晶化温度(Tc)の値は、重合体の立体規則性ならびにエチレンや炭素原子数3〜4のα−オレフィン構造単位の含有率に依存する傾向があり、後述するオレフィン重合用触媒を用い、さらにはエチレンや炭素原子数3〜4のα−オレフィン構造単位の含有率を制御することにより調整することができる。 結晶化温度(Tc)の値が上記範囲にある共重合体(A)は、成形性の観点から好ましいため、これを含む組成物から得られるフィルムも成形性に優れたものが得られる傾向にある。
(1-6) Crystallization temperature (Tc)
In the present invention, the crystallization temperature (Tc) measured by DSC of the copolymer (A) is preferably 110 to 220 ° C, more preferably 120 to 210 ° C. The value of the crystallization temperature (Tc) tends to depend on the stereoregularity of the polymer and the content of ethylene or an α-olefin structural unit having 3 to 4 carbon atoms. Further, it can be adjusted by controlling the content of ethylene or an α-olefin structural unit having 3 to 4 carbon atoms. Since the copolymer (A) having a crystallization temperature (Tc) in the above range is preferable from the viewpoint of moldability, a film obtained from a composition containing the copolymer (A) tends to have excellent moldability. is there.
(1−7)変性
本発明における共重合体(A)は、活性水素含有基、酸無水物基、エポキシ基からなる群から選ばれる1種類以上の官能基を有するのもまた好ましい態様である。これらの官能基は、共重合体(A)中に、0.1〜10.0当量含まれていることが好ましい。またこれらの官能基の共重合体(A)への導入(変性)は公知の方法で行うことができ、特に限定されない。共重合体(A)に官能基を導入することで、PET、ABS、PMMA、PEN等の極性を有するフィルムや金属、ガラス、セラミックス等の無機素材に対する密着性を付与する事ができる。活性水素含有基としては、具体的にはメタクリル酸、アクリル酸、イタコン酸が挙げられる。酸無水物基としては、無水マレイン酸、無水 コハク酸、 無水グルタル酸、無水アジピン酸、無水シトラエン酸等が挙げられる。エポキシ基としては、グリシジルメタクリレート、グリシジルアクリレートが挙げられる。
(1-7) Modification The copolymer (A) in the present invention is also a preferred embodiment having one or more functional groups selected from the group consisting of an active hydrogen-containing group, an acid anhydride group, and an epoxy group. . These functional groups are preferably contained in the copolymer (A) in an amount of 0.1 to 10.0 equivalents. The introduction (modification) of these functional groups into the copolymer (A) can be carried out by a known method and is not particularly limited. By introducing a functional group into the copolymer (A), it is possible to impart adhesiveness to polar materials such as PET, ABS, PMMA, PEN, and inorganic materials such as metal, glass, and ceramics. Specific examples of the active hydrogen-containing group include methacrylic acid, acrylic acid, and itaconic acid. Examples of the acid anhydride group include maleic anhydride, succinic anhydride, glutaric anhydride, adipic anhydride, citrate anhydride, and the like. Examples of the epoxy group include glycidyl methacrylate and glycidyl acrylate.
(1−8)共重合体(A)の製造方法
本発明における共重合体(A)は、オレフィン重合用触媒の存在下、4−メチル−1−ペンテンおよび/または3−メチル−1−ペンテンと上述した特定のオレフィン、さらに必要に応じて前記その他の重合性化合物と重合することにより得ることができる。
(1-8) Method for Producing Copolymer (A) The copolymer (A) in the present invention comprises 4-methyl-1-pentene and / or 3-methyl-1-pentene in the presence of an olefin polymerization catalyst. And the above-mentioned specific olefin and, if necessary, the other polymerizable compound can be used for polymerization.
前述のオレフィン重合用触媒のうち、共重合体(A)を製造するに当たり、好ましい触媒の態様として、メタロセン触媒を挙げることができる。好ましいメタロセン触媒としては、国際公開第01/53369号パンフレット、国際公開第01/27124号パンフレット、特開平3−193796号公報、特開平02−41303号公報中あるいは国際公開第06/025540号パンフレット中に記載のメタロセン触媒が挙げられる。 Among the above-mentioned catalysts for olefin polymerization, a metallocene catalyst can be mentioned as a preferred embodiment of the catalyst for producing the copolymer (A). Preferred metallocene catalysts include those described in WO 01/53369, WO 01/27124, JP-A-3-19396, JP-A-02-41303, or WO 06/025540. And metallocene catalysts described in the above.
本願発明の組成物の共重合体(A)含有量は、前記組成物100重量%に対して、0.1〜95重量%が好ましく、0.1〜80重量%がより好ましく、0.1〜35重量%がさらに好ましく、0.1〜15重量%が特に好ましい。溶媒の含有量が前記範囲にあると、本願発明の組成物をコーティング剤などとして用いた際の組成物のハンドリング性と組成物からフィルムを製造する際の溶媒の除去のしやすさのバランスが良好となり、コーティング剤から製造されるフィルムの膜厚を調整しやすくなる。 The copolymer (A) content of the composition of the present invention is preferably 0.1 to 95% by weight, more preferably 0.1 to 80% by weight, with respect to 100% by weight of the composition. -35 wt% is more preferable, and 0.1-15 wt% is particularly preferable. When the content of the solvent is within the above range, there is a balance between the handleability of the composition when the composition of the present invention is used as a coating agent and the like and the ease of removal of the solvent when producing a film from the composition. It becomes good and it becomes easy to adjust the film thickness of the film manufactured from a coating agent.
(2)溶媒
本願発明の組成物は、溶媒を含む。また特に25℃における比誘電率が5以下の溶媒を含むのが好ましい。本願発明の溶媒とは、共重合体(A)が一部でも可溶な液状の物質ならばよく、特に限定されない。また25℃における比誘電率が5以下の溶媒とは、具体的には、n−ヘキサン、n−ヘプタン、n−オクタン、ナフテン系溶剤、イソパラフィン系溶剤等の脂肪族炭化水素系溶剤、芳香族系溶剤等が挙げられる。なお、ここで言うナフテン系溶剤とは、1分子内にナフテンに由来する構造を含む化合物である。具体的には、シクロヘキサン、メチルシクロヘキサン、エチルシクロヘキサン、エクソールD(登録商標、エクソンモービル社製)が挙げられる。また、イソパラフィン系溶剤とは1分子内にイソパラフィンに由来する構造を含む化合物である。具体的にはIPソルベント(登録商標、出光興産社製)、シェルゾール(登録商標、シェル社製)、アイソパー(登録商標、エクソンモービル社製)が挙げられ、同様に、芳香族系溶剤とは、1分子内にベンゼン環など芳香族に由来する構造を含む化合物である。具体的には、トルエン、キシレン以外に、ソルベッソ(登録商標、エクソンモービル社製)、イプゾール(登録商標、出光興産社製)、ミネラルスピリット等が挙げられる。本発明の組成物に比誘電率を5以下の溶媒を添加することで、前記共重合体(A)が均一に展開し、本発明の組成物を用いてフィルムを作成すると、フィルムの表面平滑性や均一性が向上する傾向がある。
(2) Solvent The composition of the present invention contains a solvent. In particular, a solvent having a relative dielectric constant of 5 or less at 25 ° C. is preferably included. The solvent of the present invention may be any liquid substance in which the copolymer (A) is partly soluble, and is not particularly limited. Specific examples of the solvent having a relative dielectric constant of 5 or less at 25 ° C. include aliphatic hydrocarbon solvents such as n-hexane, n-heptane, n-octane, naphthene solvents, isoparaffin solvents, and aromatics. System solvents and the like. The naphthenic solvent referred to here is a compound containing a structure derived from naphthene in one molecule. Specific examples include cyclohexane, methylcyclohexane, ethylcyclohexane, and Exol D (registered trademark, manufactured by ExxonMobil). The isoparaffinic solvent is a compound containing a structure derived from isoparaffin in one molecule. Specific examples include IP solvent (registered trademark, manufactured by Idemitsu Kosan Co., Ltd.), shell sol (registered trademark, manufactured by Shell Company), and ISOPAR (registered trademark, manufactured by ExxonMobil Corp.). Similarly, with aromatic solvents A compound containing a structure derived from an aromatic group such as a benzene ring in one molecule. Specifically, in addition to toluene and xylene, Solvesso (registered trademark, manufactured by ExxonMobil Corp.), ipsol (registered trademark, manufactured by Idemitsu Kosan Co., Ltd.), mineral spirit, and the like can be given. By adding a solvent having a relative dielectric constant of 5 or less to the composition of the present invention, the copolymer (A) is uniformly developed, and when a film is produced using the composition of the present invention, the surface of the film is smoothed. There is a tendency to improve the uniformity and uniformity.
また本願発明の組成物が含む溶媒の沸点は、10〜300℃であることが好ましく、20〜250℃がより好ましく、さらに好ましくは、70〜200℃が好ましい。この範囲に沸点があると、組成物のハンドリング性と組成物を用いてフィルムを製造した場合の製造効率のバランスが良好となる。また、上記脂肪族炭化水素系溶剤、芳香族系溶剤に加えて、アセトン、メチルエチルケトン、メチルイソブチルケトン、ジイソブチルケトン、ダイアセトンアルコール、イソホロン、γ―ブチロラクトン等のケトン系溶剤を含む事ができる。このケトン系溶剤は、これらのケトン系溶剤と脂肪族炭化水素系溶剤、芳香族系溶剤からなる溶剤100重量%に対して0.5〜40重量%であることが好ましく、5〜30重量%がより好ましく、さらに好ましくは10〜20重量%である事が好ましい。 Moreover, it is preferable that the boiling point of the solvent which the composition of this invention contains is 10-300 degreeC, 20-250 degreeC is more preferable, More preferably, 70-200 degreeC is preferable. When there is a boiling point in this range, the balance between the handleability of the composition and the production efficiency when a film is produced using the composition is good. In addition to the above aliphatic hydrocarbon solvents and aromatic solvents, ketone solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, diisobutyl ketone, diacetone alcohol, isophorone, and γ-butyrolactone can be included. The ketone solvent is preferably 0.5 to 40% by weight with respect to 100% by weight of the solvent comprising these ketone solvent, aliphatic hydrocarbon solvent and aromatic solvent, and 5 to 30% by weight. Is more preferable, and further preferably 10 to 20% by weight.
(3)その他の成分
本発明の組成物には、本発明の目的を損なわない範囲で、さらに必要に応じて、耐熱安定剤、耐候安定剤、帯電防止剤、スリップ剤、レベリング剤、強化剤、アンチブロッキング剤、防曇剤、滑剤、染料、顔料、天然油、合成油、ワックス、充填剤などを配合することができる。また本願発明の組成物を用いて作成したフィルムと、後述する基材フィルムや前記組成物を塗布する回路基板などとの間の密着力、接着力を高める必要がある場合は、本願発明の組成物に、a)熱可塑性の接着性樹脂、b)粘着成分を有する樹脂、c)共重合体(A)を極性化合物でグラフト変性した成分(以下では、グラフト変性共重合体(A)ともいう)を配合することもできる。特に、本発明の組成物が、活性水素含有官能基、酸無水物基及びエポキシ基からなる群から選ばれた官能基を有する前記a)〜c)のいずれかの樹脂である樹脂(B)を含む態様は好ましい。樹脂(B)を含むことで、本発明の組成物をガラス板などの基材にコートし溶媒を除去し作成したコート層と、前記基材の間の密着力や接着力を高めることができる。また、塗布法などにより樹脂(B)を含む層(Y)を基材などの上に形成し、前記樹脂(B)を含む層の上に、本発明の組成物を配置し、前記組成物中の溶媒を除去することで、(i)〜(v)の要件を満たす共重合体(A)を含む層(X)を形成することで得られる層(X)と層(Y)の積層フィルムも、層(X)と層(Y)と基材の間の密着力や接着力を高めることもできる。
(3) Other components In the composition of the present invention, the heat stabilizer, the weather stabilizer, the antistatic agent, the slip agent, the leveling agent, and the reinforcing agent are further added as necessary without departing from the object of the present invention. Antiblocking agents, antifogging agents, lubricants, dyes, pigments, natural oils, synthetic oils, waxes, fillers and the like can be blended. In addition, when it is necessary to increase the adhesion and adhesion between a film prepared using the composition of the present invention and a base film described later or a circuit board to which the composition is applied, the composition of the present invention is used. A) a thermoplastic adhesive resin, b) a resin having an adhesive component, c) a component obtained by graft-modifying the copolymer (A) with a polar compound (hereinafter also referred to as a graft-modified copolymer (A)) ) Can also be blended. In particular, the resin (B) in which the composition of the present invention is a resin of any one of the above a) to c) having a functional group selected from the group consisting of an active hydrogen-containing functional group, an acid anhydride group, and an epoxy group The embodiment containing is preferred. By including the resin (B), it is possible to enhance the adhesion and adhesion between the substrate and the coating layer prepared by coating the substrate of the present invention on a substrate such as a glass plate and removing the solvent. . Further, a layer (Y) containing the resin (B) is formed on a substrate or the like by a coating method or the like, the composition of the present invention is placed on the layer containing the resin (B), and the composition The layer (X) and the layer (Y) obtained by forming the layer (X) containing the copolymer (A) that satisfies the requirements (i) to (v) by removing the solvent therein A film can also raise the adhesive force and adhesive force between a layer (X), a layer (Y), and a base material.
a)熱可塑性の接着性樹脂
a)熱可塑性の接着性樹脂としては、公知の熱可塑性接着剤を挙げることができるが、極性官能基が導入されたポリオレフィン、アイオノマー樹脂、エチレン又はエチレンを含むモノマーとグリシジルメタクリレートとの共重合体から選ばれるものを用いるのが好ましい。極性官能基が導入されたポリオレフィンとしては、例えば、市販の熱可塑性樹脂「アドマー」(登録商標)(三井化学(株)製又は三井化学東セロ(株)製)、ポリオレフィン系接着性樹脂(商品名モディック;三菱化学(株)製)を用いることができる。また、同様に溶剤に溶解もしくは、分散した液状の様態として用いる事が出来る物として液状ポリオレフィン系接着剤(三井化学(株)製ユニストール(R))、塩素化ポリオレフィンワニス(日本製紙(株)製スーパークロン(R))が挙げられ、前記接着性樹脂の添加量は、組成物中の共重合体(A)100重量%に対して0.1〜30重量%が好ましく、0.1〜15重量%がさらに好ましい。
a) Thermoplastic adhesive resin a) Thermoplastic adhesive resin may be a known thermoplastic adhesive, but a polyolefin, ionomer resin, ethylene or ethylene-containing monomer having a polar functional group introduced It is preferable to use one selected from a copolymer of glycidyl methacrylate. Examples of the polyolefin having a polar functional group introduced include, for example, a commercially available thermoplastic resin “Admer” (registered trademark) (manufactured by Mitsui Chemicals or Mitsui Chemicals Tosero Co., Ltd.), polyolefin adhesive resin (trade name) Modic; manufactured by Mitsubishi Chemical Corporation) can be used. Similarly, liquid polyolefin adhesives (Mitsui Chemicals Co., Ltd. Unistal (R)), chlorinated polyolefin varnishes (Nippon Paper Industries Co., Ltd.) can be used as liquid forms dissolved or dispersed in solvents. Supercron (R)) can be used, and the addition amount of the adhesive resin is preferably 0.1 to 30% by weight with respect to 100% by weight of the copolymer (A) in the composition. 15% by weight is more preferred.
b)粘着成分を有する樹脂
b)粘着成分を有する樹脂は、粘着性がある樹脂であるならば、特に制限はないが、例えばDSCで測定した融点(Tm)が110℃未満の熱可塑性樹脂、および従来公知である熱可塑性エラストマーを挙げることができる。具体的にはポリオレフィン系熱可塑性樹脂あるいはポリオレフィン系熱可塑性エラストマーが好ましく、ポリオレフィン系熱可塑性樹脂あるいはポリオレフィン系熱可塑性エラストマーの例として、具体的には、エチレン系重合体、プロピレン系共重合体、ブテン系共重合体が挙げられる。より具体的には、エチレンと炭素数3〜20のα−オレフィンとの共重合体、エチレンと炭素数3〜20のα−オレフィンと環状オレフィンとの共重合体、スチレン、酢酸ビニル、(メタ)アクリル酸、(メタ)アクリル酸エステル等の各種ビニル化合物をコモノマーとするエチレン系共重合体、プロピレンと炭素数4〜20のα−オレフィンとの共重合体、プロピレンと炭素数4〜20のα−オレフィンと環状オレフィンとの共重合体、スチレン、酢酸ビニル、(メタ)アクリル酸、(メタ)アクリル酸エステル等の各種ビニル化合物をコモノマーとするエチレン系共重合体等が挙げられる。
b) Resin having an adhesive component b) The resin having an adhesive component is not particularly limited as long as it is an adhesive resin. For example, a thermoplastic resin having a melting point (Tm) measured by DSC of less than 110 ° C., And conventionally known thermoplastic elastomers. Specifically, a polyolefin-based thermoplastic resin or a polyolefin-based thermoplastic elastomer is preferable. Specific examples of the polyolefin-based thermoplastic resin or the polyolefin-based thermoplastic elastomer include an ethylene-based polymer, a propylene-based copolymer, and a butene. Examples thereof include a system copolymer. More specifically, a copolymer of ethylene and an α-olefin having 3 to 20 carbon atoms, a copolymer of ethylene, an α-olefin having 3 to 20 carbon atoms and a cyclic olefin, styrene, vinyl acetate, (meta ) Ethylene copolymer having various vinyl compounds such as acrylic acid and (meth) acrylic acid ester as a comonomer, copolymer of propylene and α-olefin having 4 to 20 carbon atoms, propylene and having 4 to 20 carbon atoms Examples include copolymers of α-olefins and cyclic olefins, and ethylene copolymers having various vinyl compounds such as styrene, vinyl acetate, (meth) acrylic acid, and (meth) acrylic acid esters as comonomers.
また、熱可塑性エラストマーとしてはポリスチレン系エラストマーを挙げることもできる。ポリスチレン系エラストマーとしては、硬質部(結晶部)となるポリスチレンブロックと、軟質部となるジエン系モノマーブロックとのブロック共重合体(SBS)、水添スチレン・ブタジエン・スチレンブロック(HSBR)、スチレン・エチレン・プロピレン・スチレンブロック共重合体(SEBS)、スチレン・イソブチレン・スチレン共重合体(SIBS)、スチレン・イソブチレン共重合体(SIB)などを例示することができる。ポリスチレン系エラストマーは、単独または2種類以上を組み合せて用いられる。 In addition, examples of the thermoplastic elastomer include a polystyrene-based elastomer. Polystyrene elastomers include block copolymers (SBS) of polystyrene blocks that become hard parts (crystal parts) and diene monomer blocks that become soft parts, hydrogenated styrene / butadiene / styrene blocks (HSBR), styrene / Examples thereof include an ethylene / propylene / styrene block copolymer (SEBS), a styrene / isobutylene / styrene copolymer (SIBS), and a styrene / isobutylene copolymer (SIB). Polystyrene elastomers are used alone or in combination of two or more.
スチレン・エチレン・プロピレン・スチレンブロック共重合体は、スチレン・イソプレン・スチレンブロック共重合体(SIS)を水素添加してなるものである。SISの具体例としては、JSR株式会社から商品名:JSR SIS(登録商標)として、株式会社クラレから商品名:ハイブラー(登録商標)、またはシェル株式会社から商品名:クレイトンD(登録商標)として市販されているものなどが挙げられる。 The styrene / ethylene / propylene / styrene block copolymer is obtained by hydrogenating a styrene / isoprene / styrene block copolymer (SIS). Specific examples of SIS include: JSR Corporation as trade name: JSR SIS (registered trademark), Kuraray Co., Ltd. as trade name: Hibler (registered trademark), or Shell Corporation as trade name: Clayton D (registered trademark) The thing marketed etc. are mentioned.
また、SEPSの具体例としては、株式会社クラレから商品名:セプトン(登録商標)として市販されているものなどが挙げられる。また、SIBSの具体例としては、株式会社カネカから商品名:シブスター(登録商標)として市販されているものなどが挙げられる。 Specific examples of SEPS include those commercially available from Kuraray Co., Ltd. under the trade name: Septon (registered trademark). Specific examples of SIBS include those commercially available from Kaneka Corporation under the trade name: Shibustar (registered trademark).
さらには、熱可塑性樹脂または熱可塑性エラストマーの例として、オレフィン系ブロック共重合体からなるエラストマーも使用することができる。ポリオレフィン系ブロック共重合体からなるエラストマーとして、例えば硬質部となるポリプロピレン等の結晶性の高いポリマーを形成するポリオレフィンブロックと、軟質部となる非晶性を示すモノマー共重合体とのブロック共重合体が挙げられ、具体的には、オレフィン(結晶性)・エチレン・ブチレン・オレフィンブロック共重合体、ポリプロピレン・ポリオレフィン(非晶性)・ポリプロピレンブロック共重合体等を例示することができる。具体例としては、JSR株式会社から商品名DYNARONとして市販されているものが挙げられる。前記、b)粘着成分を有する樹脂の添加量は、組成物中の共重合体(A)100重量%に対して0〜50重量%が好ましく、0.1〜20重量%がさらに好ましい。 Furthermore, an elastomer made of an olefin block copolymer can be used as an example of the thermoplastic resin or the thermoplastic elastomer. As an elastomer made of a polyolefin block copolymer, for example, a block copolymer of a polyolefin block that forms a polymer with high crystallinity such as polypropylene that becomes a hard part, and a monomer copolymer that shows amorphousness that becomes a soft part Specifically, olefin (crystalline) / ethylene / butylene / olefin block copolymer, polypropylene / polyolefin (amorphous) / polypropylene block copolymer and the like can be exemplified. Specific examples include those commercially available from JSR Corporation under the trade name DYNARON. The addition amount of the resin having the adhesive component b) is preferably 0 to 50% by weight, more preferably 0.1 to 20% by weight with respect to 100% by weight of the copolymer (A) in the composition.
c)グラフト変性共重合体(A)
共重合体(A)を極性樹脂と混合する場合や、本願発明のフィルムと本願フィルムが接する基材フィルムなどとの間の接着力を高める必要がある場合など、共重合体(A)の少なくとも一部が極性化合物によりグラフト変性されているグラフト変性共重合体(A)を、本願発明の組成物に添加するのが好ましい。
c) Graft-modified copolymer (A)
When the copolymer (A) is mixed with a polar resin, or when it is necessary to increase the adhesive force between the film of the present invention and the base film in contact with the film of the present application, at least the copolymer (A) It is preferable to add the graft-modified copolymer (A) partially graft-modified with a polar compound to the composition of the present invention.
グラフト変性に用いる極性化合物としては、水酸基含有エチレン性不飽和化合物、アミノ基含有エチレン性不飽和化合物、エポキシ基含有エチレン性不飽和化合物、芳香族ビニル化合物、不飽和カルボン酸またはその誘導体、ビニルエステル化合物、塩化ビニル、ビニル基含有有機ケイ素化合物、カルボジイミド化合物などが挙げられる。これらのうち、不飽和カルボン酸またはその誘導体およびビニル基含有有機ケイ素化合物が特に好ましい。 Examples of polar compounds used for graft modification include hydroxyl group-containing ethylenically unsaturated compounds, amino group-containing ethylenically unsaturated compounds, epoxy group-containing ethylenically unsaturated compounds, aromatic vinyl compounds, unsaturated carboxylic acids or their derivatives, and vinyl esters. Compounds, vinyl chloride, vinyl group-containing organosilicon compounds, carbodiimide compounds and the like can be mentioned. Of these, unsaturated carboxylic acids or derivatives thereof and vinyl group-containing organosilicon compounds are particularly preferred.
不飽和カルボン酸またはその誘導体としては、カルボン酸基を1以上有する不飽和化合物、カルボン酸基を有する化合物とアルキルアルコールとのエステル、無水カルボン酸基を1以上有する不飽和化合物等を挙げることができ、不飽和基としては、ビニル基、ビニレン基、不飽和環状炭化水素基などを挙げることができる。これらの化合物は従来公知のものが使用でき、特に制限はないが具体的な化合物としては、例えばアクリル酸、マレイン酸、フマル酸、テトラヒドロフタル酸、イタコン酸、シトラコン酸、クロトン酸、イソクロトン酸、ナジック酸〔登録商標〕(エンドシス−ビシクロ[2.2.1]ヘプト−5−エン−2,3−ジカルボン酸)等の不飽和カルボン酸;またはその誘導体、例えば酸ハライド、アミド、イミド、無水物、エステル等が挙げられる。かかる誘導体の具体例としては、例えば塩化マレニル、マレイミド、無水マレイン酸、無水シトラコン酸、マレイン酸モノメチル、マレイン酸ジメチル、グリシジルマレエート等が挙げられる。これらの不飽和カルボン酸および/またはその誘導体は、1種単独で使用することもできるし、2種以上を組み合せて使用することもできる。これらの中では、不飽和ジカルボン酸またはその酸無水物が好適であり、特にマレイン酸、ナジック酸〔登録商標〕またはこれらの酸無水物が好ましく用いられる。 Examples of the unsaturated carboxylic acid or a derivative thereof include an unsaturated compound having one or more carboxylic acid groups, an ester of a compound having a carboxylic acid group and an alkyl alcohol, and an unsaturated compound having one or more carboxylic anhydride groups. Examples of the unsaturated group include a vinyl group, a vinylene group, and an unsaturated cyclic hydrocarbon group. Conventionally known compounds can be used, and there are no particular limitations, but specific compounds include, for example, acrylic acid, maleic acid, fumaric acid, tetrahydrophthalic acid, itaconic acid, citraconic acid, crotonic acid, isocrotonic acid, Unsaturated carboxylic acids such as nadic acid [registered trademark] (endocis-bicyclo [2.2.1] hept-5-ene-2,3-dicarboxylic acid); or derivatives thereof such as acid halides, amides, imides, anhydrous Products, esters and the like. Specific examples of such derivatives include maleyl chloride, maleimide, maleic anhydride, citraconic anhydride, monomethyl maleate, dimethyl maleate, glycidyl maleate and the like. These unsaturated carboxylic acids and / or derivatives thereof can be used singly or in combination of two or more. Among these, unsaturated dicarboxylic acids or acid anhydrides thereof are suitable, and maleic acid, nadic acid [registered trademark] or acid anhydrides thereof are particularly preferably used.
ビニル基含有有機ケイ素化合物としては、従来公知のものが使用でき、特に制限はないが具体的には、ビニルトリエトキシシラン、ビニルトリメトキシシラン、ビニルトリス(β−メトキシーエトキシシラン)、γ−グリシドキシプロピルートリピルトリーメトキシシラン、γ−アミノプロピルトリエトキシシラン、γ−メタクリロキシプロピルトリメトキシシラン、2−(3,4−エポキシシクロヘキシル)エチルトリメトキシシラン、3−グリシドキシプロピルトリメトキシシラン、3−グリシドキシプロピルメチルエトキシシラン、p−スチリルトリメトキシシラン、3−メタクロキシプロピルメチルジメメトキシシラン、3−メタクロキシプロピルメチルジエトキシシラン、3−メタクロキシプロピルトリエトキシシラン、3−アクロキシプロピルトリメトキシシラン、N−2−(アミノエチル)−3−アミノプロピルメチルジメトキシシラン、N−2−(アミノエチル)−3−アミノプロピルトリメトキシシラン、N−2−(アミノエチル)−3−アミノプロピルトリエトキシシラン、3−アミノプロピルトリメトキシシラン、3−トリエトキシシリル−N−(1,3−ジメチル−ブチリデン)プロピルアミン、N−フェニル−3−アミノプロピルトリメトキシシラン、3−ウレイドプロピルトリエトキシシラン、3−イソシアネートプロピルトリエトキシシランなどが使用できる。好ましくは、γ−グリシドキシプロピルトリピルトリメトキシシラン、γ−アミノプロピルトリエトキシシラン、γ−メタクリロキシプロピルトリメトキシシラン、ビニルトリエトキシシラン、ビニルトリメトキシシラン、3−アクロキシプロピルトリメトキシシラン、さらに好ましくは、立体障害が小さくグラフト変性効率の高いビニルトリエトキシシラン、ビニルトリメトキシシラン、3−アクロキシプロピルトリメトキシシランが挙げられる。 As the vinyl group-containing organosilicon compound, conventionally known compounds can be used, and there is no particular limitation, but specific examples include vinyltriethoxysilane, vinyltrimethoxysilane, vinyltris (β-methoxyethoxysilane), γ-glycol. Sidoxypropyl-tripirtrimethoxysilane, γ-aminopropyltriethoxysilane, γ-methacryloxypropyltrimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxy Silane, 3-glycidoxypropylmethylethoxysilane, p-styryltrimethoxysilane, 3-methacryloxypropylmethyldimethylmethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, 3- Acro Cypropyltrimethoxysilane, N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane, N-2- (aminoethyl) -3-aminopropyltrimethoxysilane, N-2- (aminoethyl) -3 -Aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-triethoxysilyl-N- (1,3-dimethyl-butylidene) propylamine, N-phenyl-3-aminopropyltrimethoxysilane, 3-ureido Propyltriethoxysilane, 3-isocyanatopropyltriethoxysilane, etc. can be used. Preferably, γ-glycidoxypropyltripyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-methacryloxypropyltrimethoxysilane, vinyltriethoxysilane, vinyltrimethoxysilane, 3-acryloxypropyltrimethoxysilane More preferably, vinyltriethoxysilane, vinyltrimethoxysilane, and 3-acryloxypropyltrimethoxysilane having small steric hindrance and high graft modification efficiency can be used.
本願発明でグラフト変性共重合体(A)は、共重合体(A)100重量部に対して、前記極性化合物を通常1〜100重量部、好ましくは5〜80重量部の量でグラフト反応させることにより得ることができる。このグラフト反応は、通常ラジカル開始剤の存在下に行なわれる。 In the present invention, the graft-modified copolymer (A) is graft-reacted in an amount of usually 1 to 100 parts by weight, preferably 5 to 80 parts by weight with respect to 100 parts by weight of the copolymer (A). Can be obtained. This grafting reaction is usually performed in the presence of a radical initiator.
グラフト重合に用いられるラジカル開始剤としては、有機過酸化物あるいはアゾ化合物などが挙げられる。ラジカル開始剤は、共重合体(A)、および極性化合物にそのまま混合して使用することもできるが、少量の有機溶媒に溶解してから使用することもできる。この有機溶媒としては、ラジカル開始剤を溶解し得る有機溶媒であれば特に限定することなく用いることができる。 Examples of the radical initiator used for graft polymerization include organic peroxides and azo compounds. The radical initiator can be used as it is mixed with the copolymer (A) and the polar compound, but can also be used after being dissolved in a small amount of an organic solvent. Any organic solvent that can dissolve the radical initiator can be used without particular limitation.
また共重合体(A)に極性化合物をグラフト反応させる際には、還元性物質を用いてもよい。還元性物質を用いると、極性化合物のグラフト量を向上させることができる場合がある。 共重合体(A)の極性化合物によるグラフト変性反応は、従来公知の方法で行うことができる。例えば共重合体(A)を有機溶媒に溶解し、次いで極性化合物およびラジカル開始剤などを溶液に加え、70〜200℃、好ましくは80〜190℃の温度で、0.5〜15時間、好ましくは1〜10時間反応させる方法を挙げることができる。 Further, when the polar compound is grafted to the copolymer (A), a reducing substance may be used. If a reducing substance is used, the graft amount of the polar compound may be improved. The graft modification reaction of the copolymer (A) with the polar compound can be performed by a conventionally known method. For example, the copolymer (A) is dissolved in an organic solvent, then a polar compound and a radical initiator are added to the solution, and a temperature of 70 to 200 ° C., preferably 80 to 190 ° C., for 0.5 to 15 hours, preferably Can mention the method of making it react for 1 to 10 hours.
また、押出機などを用いて、無溶媒で、共重合体(A)と極性化合物とを反応させることもできる。この反応は、通常共重合体(A)の融点(Tm)以上、具体的には160〜290℃の温度で、通常0.5〜10分間行なわれることが望ましい。 Moreover, a copolymer (A) and a polar compound can also be made to react by solvent-free using an extruder. This reaction is usually preferably performed at a temperature equal to or higher than the melting point (Tm) of the copolymer (A), specifically at a temperature of 160 to 290 ° C., usually for 0.5 to 10 minutes.
このようにして得られるグラフト変性共重合体(A)の変性量(極性化合物のグラフト量)は、通常、グラフト変性反応を行った共重合体(A)100重量%に対して0.1〜50重量%、好ましくは0.2〜30重量%、さらに好ましくは0.2〜10重量%である。 The modification amount of the graft-modified copolymer (A) thus obtained (the graft amount of the polar compound) is usually 0.1 to 100% by weight of the copolymer (A) subjected to the graft modification reaction. 50% by weight, preferably 0.2-30% by weight, more preferably 0.2-10% by weight.
酸化防止剤としては、公知の酸化防止剤が使用可能である。具体的には、ヒンダードフェノール化合物、イオウ系酸化防止剤、ラクトーン系酸化防止剤、有機ホスファイト化合物、有機ホスフォナイト化合物、あるいはこれらを数種類組み合わせたものが使用できる。 A known antioxidant can be used as the antioxidant. Specifically, a hindered phenol compound, a sulfur-based antioxidant, a lactone-based antioxidant, an organic phosphite compound, an organic phosphonite compound, or a combination of these can be used.
滑剤としては、例えばラウリル酸、パルミチン酸、オレイン酸、ステアリン酸などの飽和または不飽和脂肪酸のナトリウム、カルシウム、マグネシウム塩などがあげられ、これらは単独でまたは2種以上を混合して用いることができる。またかかる滑剤の配合量は本発明の組成物100重量部に対して通常0.1〜3重量部、好ましくは0.1〜2重量部程度であることが望ましい。 Examples of the lubricant include sodium, calcium and magnesium salts of saturated or unsaturated fatty acids such as lauric acid, palmitic acid, oleic acid and stearic acid, and these may be used alone or in combination of two or more. it can. The amount of the lubricant is usually 0.1 to 3 parts by weight, preferably about 0.1 to 2 parts by weight, based on 100 parts by weight of the composition of the present invention.
スリップ剤としては、ラウリル酸、パルミチン酸、オレイン酸、ステアリン酸、エルカ酸、ヘベニン酸などの飽和または不飽和脂肪酸のアミド、あるいはこれらの飽和または不飽和脂肪酸のビスアマイドを用いることが好ましい。これらのうちでは、エルカ酸アミドおよびエチレンビスステアロアマイドが特に好ましい。これらの脂肪酸アミドは本発明の組成物中の共重合体(A)100重量部に対して0.01〜5重量部の範囲で配合することが好ましい。 As the slip agent, it is preferable to use amides of saturated or unsaturated fatty acids such as lauric acid, palmitic acid, oleic acid, stearic acid, erucic acid and hebenic acid, or bisamides of these saturated or unsaturated fatty acids. Of these, erucic acid amide and ethylene bisstearamide are particularly preferred. These fatty acid amides are preferably blended in the range of 0.01 to 5 parts by weight with respect to 100 parts by weight of the copolymer (A) in the composition of the present invention.
アンチブロッキング剤としては、微粉末シリカ、微粉末酸化アルミニウム、微粉末クレー、粉末状、もしくは液状のシリコン樹脂、テトラフロロエチレン樹脂、微粉末架橋樹脂、例えば架橋されたアクリル、メタクリル樹脂粉末等をあげることができる。これらのうちでは、微粉末シリカおよび架橋されたアクリル、メタクリル樹脂粉末が好ましい。 Examples of the anti-blocking agent include fine powder silica, fine powder aluminum oxide, fine powder clay, powdered or liquid silicon resin, tetrafluoroethylene resin, fine powder cross-linked resin such as cross-linked acrylic and methacrylic resin powder. be able to. Of these, fine powder silica and crosslinked acrylic and methacrylic resin powders are preferred.
また後述するように本願発明の組成物をコーティング剤として用いる場合には、本願発明の組成物にレベリング剤を添加するのも好ましい態様である。本願発明の組成物で作成したフィルムの表面粗さを小さくするためのレベリング剤としてはフッ素系ノニオン界面活性剤、特殊アクリル樹脂系レベリング剤、シリコーン系レベリング剤など用いることができ、溶媒と相溶性が良いものが好ましく、添加量は組成物中の共重合体(A)に対して1〜50,000ppmの範囲で用いられる。また、本発明の目的を損なわない範囲で、公知の架橋剤を併用することもできる。例えば、ウレタンプレポリマー、ウレア樹脂、ガボジイミド類等耕地の架橋剤が挙げられる。添加量は組成物中の共重合体(A)に対して5,000〜500,000ppmの範囲で用いられる。 Moreover, when using the composition of this invention as a coating agent so that it may mention later, it is also a preferable aspect to add a leveling agent to the composition of this invention. As a leveling agent for reducing the surface roughness of a film prepared from the composition of the present invention, a fluorine-based nonionic surfactant, a special acrylic resin leveling agent, a silicone leveling agent, and the like can be used, and are compatible with a solvent. Are preferable, and the amount added is in the range of 1 to 50,000 ppm relative to the copolymer (A) in the composition. Moreover, a well-known crosslinking agent can also be used together in the range which does not impair the objective of this invention. For example, cross-linking agents for cultivated land such as urethane prepolymers, urea resins, and carbodiimides. The amount added is in the range of 5,000 to 500,000 ppm with respect to the copolymer (A) in the composition.
強化剤としては、ケイ素、チタン、アルミニウム、ジルコニウムなどの金属の酸化物、多官能アルコキシ化合物あるいはそのオリゴマー、粘土鉱物を組成物中の共重合体(A)100重量部に対して、5〜50重量部を配合することもでき、本願発明の組成物をコーティング剤として用いて作成したフィルム(この場合はコート層ともいう)の硬度や弾性率を高めることができる。添加量が5重量部未満では効果が低すぎ、50重量部を超えるとコート層の透明性や機械強度が損なわれることがある。 Examples of the reinforcing agent include metal oxides such as silicon, titanium, aluminum, and zirconium, polyfunctional alkoxy compounds or oligomers thereof, and clay minerals in an amount of 5 to 50 with respect to 100 parts by weight of the copolymer (A) in the composition. A weight part can also be mix | blended and the hardness and elasticity modulus of the film (in this case also called a coating layer) created using the composition of this invention as a coating agent can be raised. If the addition amount is less than 5 parts by weight, the effect is too low, and if it exceeds 50 parts by weight, the transparency and mechanical strength of the coat layer may be impaired.
(4)組成物の製造方法
本願発明の組成物の製造方法は特に限定されず、通常用いられる方法で製造することができる。例えば、前記溶媒に、前記共重合体(A)を添加し、前記溶媒の沸点以下の温度で、所定の時間攪拌することで製造することができる。
(4) Manufacturing method of composition The manufacturing method of the composition of this invention is not specifically limited, It can manufacture by the method used normally. For example, it can be produced by adding the copolymer (A) to the solvent and stirring for a predetermined time at a temperature not higher than the boiling point of the solvent.
(5)組成物の用途
本願発明の組成物は、前記組成物を用いて電気絶縁性が高いフィルムを製造することができるため、コーティング剤、特に液晶表示素子やエレクトロルミネッセンス表示素子などの各種表示デバイス;半導体デバイス;導光板、偏光フィルム、光拡散フィルム、位相差フィルム、反射防止フィルムなどの光学部材;プリント回路基板などに対する、表面保護用、絶縁用、平坦化用、耐熱用、耐光用、耐候用などの各種コーティング剤として好適に用いることができる。また、本発明の組成物は、オレフィン系の重合体を主に含むことから、本発明の組成物は加熱により分解させやすい。このため、粉末冶金やセラミックス製造時の金属、、合金、無機物の粘結助剤として好適に用いる事もできる。
(5) Use of composition Since the composition of the present invention can produce a film having high electrical insulation using the composition, various displays such as a coating agent, particularly a liquid crystal display element and an electroluminescence display element. Device; Semiconductor device; Optical member such as light guide plate, polarizing film, light diffusion film, retardation film, antireflection film; surface protection, insulation, flattening, heat resistance, light resistance for printed circuit boards, etc. It can be suitably used as various coating agents for weathering and the like. Moreover, since the composition of the present invention mainly contains an olefin polymer, the composition of the present invention is easily decomposed by heating. For this reason, it can also be suitably used as a caking aid for metals, alloys, and inorganic substances during powder metallurgy and ceramic production.
特に、本願発明の組成物は複雑な形状を有する基板への保護層を形成することができるため、プリント配線基板やキャパシタの電極表面の保護層形成用のコーティング剤として好適に用いることできる。また本願発明の組成物を、他のフィルムの上に塗布し、溶媒を除去することで、前記他のフィルムを離型フィルムにすることもできる。 In particular, since the composition of the present invention can form a protective layer on a substrate having a complicated shape, it can be suitably used as a coating agent for forming a protective layer on the electrode surface of a printed wiring board or capacitor. Moreover, the said other film can also be made into a mold release film by apply | coating the composition of this invention on another film, and removing a solvent.
2.フィルム
(1)フィルム
本発明のフィルムは、前記の共重合体(A)と、溶媒と、を含む、フィルムである。以下で、本願発明のフィルムについて詳細に説明する。なお、本願でいう「フィルム」とは、便宜上の名称であって、平面状の成形物の総称であり、これにはフィルムの他、シート、膜、テープ、基板上に形成される層などを含む概念である。また「フィルム」とは、平面が連続している成形物に限定されない。
2. Film (1) Film The film of the present invention is a film containing the copolymer (A) and a solvent. Below, the film of this invention is demonstrated in detail. The term “film” as used in the present application is a name for convenience and is a general term for a planar molded product. In addition to a film, this includes a sheet, a film, a tape, a layer formed on a substrate, and the like. It is a concept that includes. The “film” is not limited to a molded product having a continuous plane.
本願発明のフィルムは、前記フィルム全体を100重量%とした場合に、溶媒の含有量が0.001〜0.5重量%であるのが通常である。この範囲にあると、フィルムとしての形状を保持しやすく、またフィルムの柔軟性が高くなる。このため、例えば回路基板の離型フィルムとして用いた場合に、プレス加工等でフィルムが破損し、電気絶縁性が低下することを防ぐことができる。また本願発明のフィルムの絶縁破壊電圧(BDV)をフィルムの厚さで除した規格化絶縁破壊電圧(kV/μm)は、0.05以上であることが好ましい。 As for the film of this invention, when the said whole film is 100 weight%, it is normal that content of a solvent is 0.001-0.5 weight%. When it is in this range, it is easy to maintain the shape as a film, and the flexibility of the film is increased. For this reason, when it uses as a release film of a circuit board, for example, it can prevent that a film is damaged by press work etc. and electrical insulation property falls. The normalized breakdown voltage (kV / μm) obtained by dividing the breakdown voltage (BDV) of the film of the present invention by the thickness of the film is preferably 0.05 or more.
また、共重合体(A)を押出法などで成形する場合は、共重合体(A)をその融点(Tm)以上の温度に加熱し溶融する必要があるが、本願発明の組成物を用いてコーティングでフィルムを製造する場合は融点(Tm)より低い温度でフィルムを製造できるため、共重合体の熱劣化などによる分解物が少なくなり、離型性が高くなる場合がある。分解物としては、例えば共重合体(A)が高温で分解したことにより得られる共重合体(A)を構成するモノマー成分の2量体〜5量体などの低分子量成分や、上記のその他の成分として例示した、耐熱安定剤、耐候安定剤、帯電防止剤、スリップ剤、レベリング剤、強化剤、アンチブロッキング剤、防曇剤、滑剤、染料、顔料、天然油、合成油、ワックス、充填剤などの酸化物、および酸化分解した成分の一部、などが挙げられる。 When the copolymer (A) is molded by an extrusion method or the like, the copolymer (A) needs to be heated and melted at a temperature equal to or higher than its melting point (Tm), but the composition of the present invention is used. In the case of producing a film by coating, the film can be produced at a temperature lower than the melting point (Tm). Therefore, decomposition products due to thermal degradation of the copolymer are reduced, and the releasability may be improved. Examples of the decomposition products include low molecular weight components such as dimers to pentamers of monomer components constituting the copolymer (A) obtained by decomposing the copolymer (A) at high temperatures, Heat stabilizer, weather stabilizer, antistatic agent, slip agent, leveling agent, reinforcing agent, antiblocking agent, antifogging agent, lubricant, dye, pigment, natural oil, synthetic oil, wax, filling And oxides such as agents, and some of the components that have undergone oxidative decomposition.
(2)フィルムの製造方法
本願発明のフィルムは、本願発明の組成物を用いて製造することができる。具体的には、本願発明の組成物を、所定の基板上に塗布し、前記組成物の沸点に近い温度に加熱することで組成物中の溶媒をある程度、除去し、フィルムを製造することができる。本願発明のフィルムを基板から分離して自立したフィルムとして用いる場合は、本願発明の組成物を塗布する基板は離型性が高い材質で構成されているのが好ましい。
(2) Manufacturing method of film The film of this invention can be manufactured using the composition of this invention. Specifically, by applying the composition of the present invention on a predetermined substrate and heating to a temperature close to the boiling point of the composition, the solvent in the composition is removed to some extent to produce a film. it can. When the film of the present invention is used as a self-supporting film separated from the substrate, the substrate to which the composition of the present invention is applied is preferably composed of a material having high releasability.
また本願発明のフィルムを、積層フィルム中の特定の層として用いたい場合は、積層したいフィルムに本願発明の組成物をコーティング剤として塗布し、前記組成物中の溶媒をある程度、除去することで、本願発明のフィルムを層として含む積層フィルムを得ることもできる。本願発明の組成物を塗布する方法は、特に限定されないが、はけやブラシを用いた塗布、スプレーによる吹き付け、スクリーン印刷法、フローコーティング、スピンコート、ディッピングによる方法や、バーコーター、Tダイ、バー付きTダイ、ドクターナイフ、ロールコート、ダイコートなどを用いてロールや平板に塗布する方法など挙げられる。 When the film of the present invention is used as a specific layer in a laminated film, the composition of the present invention is applied to the film to be laminated as a coating agent, and the solvent in the composition is removed to some extent. A laminated film including the film of the present invention as a layer can also be obtained. The method for applying the composition of the present invention is not particularly limited, but application using a brush or brush, spraying by spraying, screen printing method, flow coating, spin coating, dipping method, bar coater, T die, Examples thereof include a method of applying to a roll or flat plate using a T-die with a bar, a doctor knife, a roll coat, a die coat, or the like.
なお本願でいう溶媒の除去とは、本願発明の組成物中から溶媒を完全に取り去ることのみを意味するものではなく、本願発明の組成物をフィルム状に成形しえる程度に溶媒を取り去ることをいう。具体的には、本願発明の組成物を用いて作成したフィルムの重量100%に対して、溶媒が0.001〜0.5重量%程度になるまで、溶媒を取り去ることをいう。溶媒を除去する方法は特に限定されず、放置することで乾燥してもよいが、一般的には30〜220℃で加熱し乾燥することで除去される。また共重合体(A)の熱劣化や熱分解を防ぐために共重合体(A)の融点(Tm)以下の温度で溶媒を除去するのが好ましい。一方、乾燥温度が低すぎると乾燥時間が長くなるため生産性が悪化し、高すぎると発泡や劣化などの問題が生じる。発泡を防ぎながら短時間で乾燥させるために、2段階以上もしくは連続的に温度を上昇させながら乾燥してもよい。また、乾燥工程の後に水、メタノール、エタノール、アセトン、塩化メチレンなど共重合体(A)が溶解しにくい溶媒に浸漬する工程、あるいはその溶媒の蒸気雰囲気下に曝す工程を経ることによってコート層に残留する溶媒を低減することもできる。乾燥後のコート層中に残留する溶媒は、0.5重量%以下、好ましくは0.05重量%以下さらに好ましくは0.01重量%以下である。 The removal of the solvent in the present application does not only mean that the solvent is completely removed from the composition of the present invention, but that the solvent is removed to such an extent that the composition of the present invention can be formed into a film. Say. Specifically, it means that the solvent is removed until the solvent becomes about 0.001 to 0.5% by weight with respect to 100% by weight of the film prepared using the composition of the present invention. A method for removing the solvent is not particularly limited, and the solvent may be dried by allowing it to stand, but is generally removed by heating at 30 to 220 ° C. and drying. In order to prevent thermal deterioration and thermal decomposition of the copolymer (A), it is preferable to remove the solvent at a temperature not higher than the melting point (Tm) of the copolymer (A). On the other hand, if the drying temperature is too low, the drying time becomes long and productivity is deteriorated. If it is too high, problems such as foaming and deterioration occur. In order to dry in a short time while preventing foaming, drying may be performed while increasing the temperature in two or more steps or continuously. Further, after the drying step, the coating layer is subjected to a step of immersing in a solvent in which the copolymer (A) is difficult to dissolve, such as water, methanol, ethanol, acetone, methylene chloride, or a step of exposing to a vapor atmosphere of the solvent. The remaining solvent can also be reduced. The solvent remaining in the coating layer after drying is 0.5% by weight or less, preferably 0.05% by weight or less, more preferably 0.01% by weight or less.
また各種表示デバイス、半導体デバイス、光学部材、プリント回路基板、キャパシタなどの保護層として本願発明のフィルムを用いる場合には、前記デバイスや回路の所定の位置に、本願発明の組成物を塗布し、前記デバイスなどが劣化しない温度で加熱し組成物中の溶媒をある程度、除去することで、フィルム(この場合はコート層ともいう)を形成することもできる。 When using the film of the present invention as a protective layer for various display devices, semiconductor devices, optical members, printed circuit boards, capacitors, etc., the composition of the present invention is applied to a predetermined position of the device or circuit, A film (in this case, also referred to as a coating layer) can be formed by heating at a temperature at which the device or the like does not deteriorate and removing a certain amount of the solvent in the composition.
(3)フィルムの用途
本願発明のフィルムは、前述のように耐熱性・電気絶縁性に優れるため、各種表示デバイス、半導体デバイス、光学部材、プリント回路基板、キャパシタなどの保護層として特に好適に用いることができる。また本願発明のフィルムは離型フィルムまたは離型フィルムの離型層として好適に用いられる。以下で離型フィルムの離型層に本願発明のフィルムを用いた例について説明する。
(3) Use of film Since the film of the present invention is excellent in heat resistance and electrical insulation as described above, it is particularly suitably used as a protective layer for various display devices, semiconductor devices, optical members, printed circuit boards, capacitors and the like. be able to. The film of the present invention is suitably used as a release film or a release layer for a release film. Hereinafter, an example in which the film of the present invention is used for the release layer of the release film will be described.
本願発明のフィルムを後述する基材フィルムと積層させることで離型フィルムを作成することができる。基材フィルムは、材質は特に限定されず、また単層体であっても複層体であってもよく、厚さも特に限定されないが、フィルム成形が容易な熱可塑性樹脂を含むのが好ましい。熱可塑性樹脂としては、例えばポリエチレンテレフタレート、ポリエチレンナフタレートなどのポリエステル樹脂、高密度ポリエチレン、中密度ポリエチレン、低密度ポリエチレン、エチレン−α-オレフィン共重合体などの線状低密度ポリエチレン、ポリプロピレン、4―メチル−1−ペンテン系ポリマー、ポリブテンなどのポリオレフィン樹脂などが挙げられる。また基材フィルムの成形方法は、押出、一軸あるいは二軸延伸など一般的な方法でよく、特に限定されない。 A release film can be produced by laminating the film of the present invention with a base film described later. The material of the base film is not particularly limited, and may be a single layer or a multilayer, and the thickness is not particularly limited, but preferably includes a thermoplastic resin that can be easily formed into a film. Examples of the thermoplastic resin include polyester resins such as polyethylene terephthalate and polyethylene naphthalate, linear low density polyethylene such as high density polyethylene, medium density polyethylene, low density polyethylene, and ethylene-α-olefin copolymer, polypropylene, 4- Examples thereof include polyolefin resins such as methyl-1-pentene polymer and polybutene. Moreover, the shaping | molding method of a base film may be general methods, such as extrusion, uniaxial or biaxial stretching, and is not specifically limited.
またこれらの基材フィルムに、耐熱安定剤、耐候安定剤、紫外線吸収剤、滑剤、スリップ剤、核剤、ブロッキング防止剤、帯電防止剤、防曇剤、顔料、染料、無機または有機の充填剤等の通常、ポリオレフィンに用いる各種添加剤を本発明の目的を損なわない範囲で添加しておいてもよい。これらの基材フィルムの厚さは通常10〜100μmであるが、特に限定されない。 In addition, heat-resistant stabilizers, weather-resistant stabilizers, ultraviolet absorbers, lubricants, slip agents, nucleating agents, anti-blocking agents, antistatic agents, antifogging agents, pigments, dyes, inorganic or organic fillers are added to these base films. In general, various additives used for polyolefin may be added within a range not impairing the object of the present invention. Although the thickness of these base film is 10-100 micrometers normally, it is not specifically limited.
前記基材フィルムの表面に、本願発明の組成物を塗布し、前記組成物の溶媒を除去することで本願発明のフィルムを前記基材フィルムの表面に積層させることで離型フィルムを作成することができる。なお、前記離型フィルムの最表面の少なくとも一部に、本願発明のフィルムが配置されていればよいので、基材フィルムの表面全体に本願発明の組成物を塗布しなくてもよい。 Applying the composition of the present invention to the surface of the base film and removing the solvent of the composition to create a release film by laminating the film of the present invention on the surface of the base film Can do. In addition, since the film of this invention should just be arrange | positioned to at least one part of the outermost surface of the said release film, it is not necessary to apply | coat the composition of this invention to the whole surface of a base film.
また基材フィルムと本願発明のフィルムとの間の密着力や接着力を高める必要がある場合は、本願発明のフィルムに、前述のa)熱可塑性の接着性樹脂、b)粘着成分を有する樹脂、c)グラフト変性共重合体(A)を適宜選択して添加するのが好ましい。これらの成分a〜cは一種類だけ本願発明のフィルムに添加してもよいし、それぞれを組み合わせて添加してもよい。これらの成分を本願発明のフィルムに添加する方法は限定されないが、具体的には、本願発明の組成物に前記a〜c成分を添加・混合した組成物を用いて前記方法でフィルムを形成する方法で添加することもできる。 When it is necessary to increase the adhesion or adhesion between the base film and the film of the present invention, the above-mentioned film a) is a) a thermoplastic adhesive resin, and b) a resin having an adhesive component. C) The graft-modified copolymer (A) is preferably selected and added as appropriate. Only one kind of these components a to c may be added to the film of the present invention, or may be added in combination. Although the method of adding these components to the film of the present invention is not limited, specifically, the film is formed by the above method using a composition obtained by adding and mixing the components a to c to the composition of the present invention. It can also be added by the method.
以下、実施例に基づいて本発明をさらに具体的に説明するが、本発明はこれら実施例に限定されるものではない。なお、実施例において各物性の測定及び評価は以下の条件で行なった。 EXAMPLES Hereinafter, although this invention is demonstrated further more concretely based on an Example, this invention is not limited to these Examples. In the examples, each physical property was measured and evaluated under the following conditions.
[極限粘度[η]]
デカリン溶媒を用いて、135℃で測定した。すなわち重合パウダー、ペレットまたは樹脂塊約20mgをデカリン15mlに溶解し、135℃のオイルバス中で比粘度ηspを測定した。このデカリン溶液にデカリン溶媒を5ml追加して希釈後、同様にして比粘度ηspを測定した。この希釈操作をさらに2回繰り返し、濃度(C)を0に外挿した時のηsp/Cの値を極限粘度として求めた。計算式を以下に示す。
「式1」
[η]=lim(ηsp/C) (C→0)
[Intrinsic viscosity [η]]
It measured at 135 degreeC using the decalin solvent. That is, about 20 mg of polymer powder, pellets or resin mass was dissolved in 15 ml of decalin, and the specific viscosity ηsp was measured in an oil bath at 135 ° C. After diluting the decalin solution with 5 ml of decalin solvent, the specific viscosity ηsp was measured in the same manner. This dilution operation was further repeated twice, and the value of ηsp / C when the concentration (C) was extrapolated to 0 was determined as the intrinsic viscosity. The calculation formula is shown below.
"Formula 1"
[Η] = lim (ηsp / C) (C → 0)
[MFR]
共重合体(A)のMFRは、JIS K7210に準拠して、230℃、2.16kgの荷重にて測定した。
[MFR]
The MFR of the copolymer (A) was measured at 230 ° C. and a load of 2.16 kg in accordance with JIS K7210.
[数平均分子量(Mn)、重量平均分子量(Mw)、分子量分布(Mw/Mn)]
数平均分子量(Mn)、重量平均分子量(Mw)、分子量分布(Mw/Mn)は、Waters社製ゲル浸透クロマトグラフAlliance GPC−2000型を用い、以下のようにして測定した。分離カラムは、TSKgel GNH6−HTを2本およびTSKgel GNH6−HTLの2本を用いた。これらのカラムのサイズはいずれも直径7.5mm、長さ300mmである。カラム温度を140℃とし、移動相にはo−ジクロロベンゼン(和光純薬工業株式会社)および酸化防止剤としてBHT(武田薬品工業株式会社)0.025重量%を用い、1.0ml/分で移動させた。試料(被測定体:共重合体(A))の濃度を15mg/10mLに調整し、500マイクロリットル注入し、示差屈折計を用いて検出した。標準ポリスチレンは、分子量がMw<1000やMw>4×106の試料ついては東ソー株式会社製のものを用い、1000≦Mw≦4×106についてはプレッシャーケミカル社製のものを用いた。
[Number average molecular weight (Mn), weight average molecular weight (Mw), molecular weight distribution (Mw / Mn)]
The number average molecular weight (Mn), weight average molecular weight (Mw), and molecular weight distribution (Mw / Mn) were measured as follows using a gel permeation chromatograph Alliance GPC-2000 manufactured by Waters. As the separation column, two TSKgel GNH6-HT and two TSKgel GNH6-HTL were used. Each of these columns has a diameter of 7.5 mm and a length of 300 mm. The column temperature is 140 ° C., o-dichlorobenzene (Wako Pure Chemical Industries, Ltd.) is used as the mobile phase, and 0.025% by weight of BHT (Takeda Pharmaceutical Co., Ltd.) is used as the antioxidant, at 1.0 ml / min. Moved. The concentration of the sample (measuring object: copolymer (A)) was adjusted to 15 mg / 10 mL, 500 microliters were injected, and detection was performed using a differential refractometer. As the standard polystyrene, those manufactured by Tosoh Corporation were used for samples having a molecular weight of Mw <1000 or Mw> 4 × 106, and those manufactured by Pressure Chemical Co. were used for 1000 ≦ Mw ≦ 4 × 106.
[共重合(A)中のオレフィン等の含量]
共重合体中の4−メチル−1−ペンテン、3−メチル−1−ペンテンおよびα−オレフィン含量は、以下の装置および条件により13C−NMRにより測定した。日本電子(株)製ECP500型核磁気共鳴装置を用い、溶媒としてオルトジクロロベンゼン/重ベンゼン(80/20容量%)混合溶媒,試料濃度55mg/0.6mL、測定温度120℃、観測核は13C(125MHz)、シーケンスはシングルパルスプロトンデカップリング、パルス幅は4.7μ秒(45°パルス)、繰り返し時間は5.5秒、積算回数は1万回以上、27.50ppmをケミカルシフトの基準値として測定した。得られた13C−NMRスペクトルにより、4−メチル−1−ペンテン、3−メチル−1−ペンテン、α−オレフィンの組成を定量化した。
[Content of olefin and the like in copolymerization (A)]
The contents of 4-methyl-1-pentene, 3-methyl-1-pentene and α-olefin in the copolymer were measured by 13C-NMR using the following apparatus and conditions. Using an ECP500 type nuclear magnetic resonance apparatus manufactured by JEOL Ltd., a mixed solvent of orthodichlorobenzene / heavy benzene (80/20 vol%) as a solvent, sample concentration 55 mg / 0.6 mL, measurement temperature 120 ° C., observation nucleus 13C (125 MHz), sequence is single pulse proton decoupling, pulse width is 4.7 μs (45 ° pulse), repetition time is 5.5 seconds, integration number is 10,000 times or more, and 27.50 ppm is the reference value for chemical shift As measured. From the obtained 13C-NMR spectrum, the compositions of 4-methyl-1-pentene, 3-methyl-1-pentene and α-olefin were quantified.
[融点(Tm)]
セイコーインスツルメンツ社製DSC測定装置(DSC220C)を用い、測定用アルミパンに約5mgの試料をつめて、100℃/minで290℃まで昇温し、290℃で5分間保持した後、10℃/minで−100℃まで降温させた時の結晶溶融ピークのピーク頂点から融点(Tm)を算出した。融点(Tm)が高いほど、耐熱性が高いことを意味する。
[Melting point (Tm)]
Using a DSC measuring device (DSC220C) manufactured by Seiko Instruments Inc., a sample of about 5 mg was put in an aluminum pan for measurement, heated to 290 ° C. at 100 ° C./min, held at 290 ° C. for 5 minutes, 10 ° C. / The melting point (Tm) was calculated from the peak apex of the crystal melting peak when the temperature was decreased to −100 ° C. in min. A higher melting point (Tm) means higher heat resistance.
[密度]
密度測定は、上記の方法で得られた1mm厚プレスシートを30mm角に切り取り、JIS K6268に準拠して、電子比重計を用いて水中置換方法で測定した。
[density]
For the density measurement, the 1 mm-thick press sheet obtained by the above method was cut into 30 mm square, and was measured by an underwater substitution method using an electronic hydrometer according to JIS K6268.
[保存安定性(組成物安定性)]
後述する本願発明の組成物の合成において、共重合体(A)と溶媒とを攪拌機付き容器に入れ80℃、1時間、200rpmで攪拌し組成物を合成した後に、24時間、室温で保管した後、前記組成物が可視光線下、目視で透明な場合は○、白濁して見えたが流動性が見られた場合は△、白濁しかつ流動性が見られなかった場合は、×として評価した。
[Storage stability (composition stability)]
In the synthesis of the composition of the present invention, which will be described later, the copolymer (A) and the solvent were placed in a container equipped with a stirrer and stirred at 80 ° C. for 1 hour at 200 rpm, and then the composition was synthesized, and then stored at room temperature for 24 hours. Later, when the composition was transparent under visible light, it was evaluated as ◯, when it appeared cloudy but when fluidity was observed, Δ, when it was cloudy and fluidity was not observed, evaluated as x. did.
[フィルム塗工性]
本願発明の組成物を、24時間、室温で保管した後、25℃でガラス基板上に塗布してアプリケーターで均一に伸ばした後、25℃で30分、さらに80℃で1時間乾燥し、フィルムを得た場合、前記フィルムの表面の凹凸が0.02mm以下の場合を○、0.02mm超の凹凸があった場合を×、フィルムを指で押した場合、指に前記フィルムの成分が目視できる程度に付着した場合をタック性ありとして△として評価した。ここで凹凸には溶け残りによるブツもカウントした。
[Film coatability]
The composition of the present invention was stored at room temperature for 24 hours, then applied on a glass substrate at 25 ° C. and uniformly stretched with an applicator, and then dried at 25 ° C. for 30 minutes and further at 80 ° C. for 1 hour to form a film. When the film surface unevenness is 0.02 mm or less, ○, when there is an unevenness greater than 0.02 mm, when the film is pressed with a finger, the components of the film are visually observed on the finger The case where it adhered to the extent possible was evaluated as Δ with the tackiness. Here, irregularities were counted as a result of unmelted residue.
[絶縁破壊電圧(BDV)]
絶縁破壊電圧(V/μm)測定は、ASTM−D149に準じ、ヤマヨ試験器有限会社製絶縁破壊試験機を用いた。上記の方法で得られたフィルムを昇圧速度500V/secにて電圧を印加して破壊耐電圧を測定し、耐圧特性を求めた。また絶縁破壊電圧を求めたフィルムの部位の厚さを測定し、前記厚さで絶縁破壊電圧(BDV)を除したものを規格化絶縁破壊電圧kV(/μm)とした。この規格化絶縁破壊電圧が大きいほど、電気絶縁性が高いことを表す。
[Dielectric breakdown voltage (BDV)]
The dielectric breakdown voltage (V / μm) was measured using a dielectric breakdown tester manufactured by Yamayo Tester Co., Ltd. according to ASTM-D149. A voltage was applied to the film obtained by the above method at a boosting rate of 500 V / sec to measure a breakdown voltage, and a breakdown voltage characteristic was obtained. Moreover, the thickness of the part of the film for which the breakdown voltage was obtained was measured, and the value obtained by dividing the breakdown voltage (BDV) by the thickness was defined as the normalized breakdown voltage kV (/ μm). The larger the normalized breakdown voltage, the higher the electrical insulation.
[水の接触角測定]
水の接触角測定は、DropMaster500画像処理式、固液界面解析システムを用いて、得られたフィルムに水滴を落としたときの接触角値を測定した。接触角値が大きいほど、極性が高い材料に対する離型性が高いことを意味する。
[Measurement of water contact angle]
The contact angle of water was measured by using a DropMaster 500 image processing system and a solid-liquid interface analysis system to measure a contact angle value when a water droplet was dropped on the obtained film. The larger the contact angle value, the higher the releasability for a material with higher polarity.
[臨界界面張力]
臨界界面張力測定は、DropMaster500画像処理式、固液界面解析システムを用いて、試験液にぬれ張力試薬用混合液(和光純薬工業株式会社製)を用いて、23℃、湿度50%の環境下で、実施例で得られたフィルムの接触角を測定し、それを元に臨界界面張力を算出した。臨界界面張力が小さいほど、極性が高い材料に対する離型性が高いことを意味する。
[Critical interfacial tension]
The critical interfacial tension is measured by using a DropMaster500 image processing type, solid-liquid interface analysis system, and using a liquid mixture for a wetting tension reagent (manufactured by Wako Pure Chemical Industries, Ltd.) in an environment of 23 ° C. and 50% humidity. Below, the contact angle of the film obtained in the Example was measured, and the critical interfacial tension was calculated based on it. It means that the smaller the critical interfacial tension, the higher the releasability for a material with higher polarity.
[溶媒含有量 分解物含有量]
フィルム中に含まれる溶媒や共重合体(A)の分解物などは、特開2011−88352号公報、特開2007−224311号公報等の試験方法を参考にして実施した。具体的には、厚み50μmのフィルムを、20×2mmの短冊状にカットし、そのうち10mg分を精秤後、ヘリウム気流下にて180℃で30分加熱した。前記加熱時に発生するガス成分を動的ヘッドスペース法で捕集し、熱脱着GC/MSスペクトル分析装置(アジレントテクノロジー社製HP6890/HP5975)にて測定した。次に、得られたMSスペクトルを、デカンを標準試料とした換算定量値に換算し、溶媒に由来するピークを溶媒量、前記溶媒に由来しないピークを分解物量とした。
[Solvent content, decomposition product content]
The solvent contained in the film, the decomposition product of the copolymer (A), and the like were carried out with reference to test methods such as JP2011-88352A and JP2007-224311A. Specifically, a film having a thickness of 50 μm was cut into a 20 × 2 mm strip, 10 mg of which was precisely weighed, and then heated at 180 ° C. for 30 minutes in a helium stream. Gas components generated during the heating were collected by a dynamic headspace method and measured with a thermal desorption GC / MS spectrum analyzer (HP6890 / HP5975 manufactured by Agilent Technologies). Next, the obtained MS spectrum was converted into a converted quantitative value using decane as a standard sample, and the peak derived from the solvent was defined as the amount of solvent, and the peak not derived from the solvent was defined as the amount of decomposition product.
以下の合成例で実施例や比較例で用いた共重合体の合成方法について説明する。なお合
成例1〜4は本願発明でいう共重合体(A)である。
The synthesis method of the copolymer used by the Example and the comparative example by the following synthesis examples is demonstrated. Synthesis examples 1 to 4 are copolymers (A) as used in the present invention.
(合成例1)共重合体(A)−1の調製
充分窒素置換した容量1.5リットルの攪拌翼付SUS製オートクレーブに、23℃でノルマルヘキサン300ml(乾燥窒素雰囲気、活性アルミナ上で乾燥したもの)、4−メチル−1−ペンテンを450ml装入した。このオートクレーブに、トリイソブチルアルミニウム(TIBAL)の1.0mmol/mlトルエン溶液を0.75ml装入し攪拌機を回した。次に、オートクレーブを内温60℃まで加熱し、全圧が0.19MPa(ゲージ圧)となるようにプロピレンで加圧した。続いて、予め調製しておいた、メチルアルミノキサンをAl換算で1mmol、ジフェニルメチレン(1−エチル−3−t−ブチル−シクロペンタジエニル)(2,7−ジ−t−ブチル−フルオレニル)ジルコニウムジクロリドを0.01mmolを含むトルエン溶液0.34mlを窒素でオートクレーブに圧入し、重合を開始した。重合反応中、オートクレーブ内温が60℃になるように温度調整した。重合開始60分後、オートクレーブにメタノール5mlを窒素で圧入し重合を停止し、オートクレーブを大気圧まで脱圧した。反応溶液にアセトンを攪拌しながら注いだ。得られた溶媒を含むパウダー状の重合体を100℃、減圧下で12時間乾燥した。得られたポリマーは44.0gで、ポリマー中の4−メチル−1−ペンテン含量は85mol%、プロピレン含量は15mol%であった。各種物性について測定した結果を表1に示す。
(Synthesis example 1) Preparation of copolymer (A) -1
A SUS autoclave with a stirring blade having a capacity of 1.5 liters sufficiently purged with nitrogen was charged with 300 ml of normal hexane at 23 ° C. (dried in a dry nitrogen atmosphere and activated alumina) and 450 ml of 4-methyl-1-pentene. . The autoclave was charged with 0.75 ml of a 1.0 mmol / ml toluene solution of triisobutylaluminum (TIBAL), and the stirrer was rotated. Next, the autoclave was heated to an internal temperature of 60 ° C. and pressurized with propylene so that the total pressure was 0.19 MPa (gauge pressure). Subsequently, 1 mmol of methylaluminoxane prepared in advance, diphenylmethylene (1-ethyl-3-tert-butyl-cyclopentadienyl) (2,7-di-tert-butyl-fluorenyl) zirconium in terms of Al Polymerization was initiated by injecting 0.34 ml of a toluene solution containing 0.01 mmol of dichloride into the autoclave with nitrogen. During the polymerization reaction, the temperature was adjusted so that the internal temperature of the autoclave was 60 ° C. Sixty minutes after the start of polymerization, 5 ml of methanol was injected into the autoclave with nitrogen to stop the polymerization, and the autoclave was depressurized to atmospheric pressure. Acetone was poured into the reaction solution with stirring. The obtained powdered polymer containing the solvent was dried at 100 ° C. under reduced pressure for 12 hours. The obtained polymer was 44.0 g, and the 4-methyl-1-pentene content in the polymer was 85 mol% and the propylene content was 15 mol%. Table 1 shows the measurement results of various physical properties.
(合成例2)共重合体(A)−2の調製
充分窒素置換した容量1.5リットルの攪拌翼付SUS製オートクレーブに、23℃でノルマルヘキサン300ml(乾燥窒素雰囲気、活性アルミナ上で乾燥したもの)、4−メチル−1−ペンテンを450ml装入した。このオートクレーブに、トリイソブチルアルミニウム(TIBAL)の1.0mmol/mlトルエン溶液を0.75ml装入し攪拌機を回した。次に、オートクレーブを内温60℃まで加熱し、全圧が0.15MPa(ゲージ圧)となるようにプロピレンで加圧し、連鎖移動剤として水素を12ml加えた。続いて、予め調製しておいた、メチルアルミノキサンをAl換算で1mmol、ジフェニルメチレン(1−エチル−3−t−ブチル−シクロペンタジエニル)(2,7−ジ−t−ブチル−フルオレニル)ジルコニウムジクロリドを0.01mmolを含むトルエン溶液0.34mlを窒素でオートクレーブに圧入し、重合を開始した。重合反応中、オートクレーブ内温が60℃になるように温度調整した。重合開始20分後、オートクレーブにメタノール5mlを窒素で圧入し重合を停止し、オートクレーブを大気圧まで脱圧した。反応溶液にアセトンを攪拌しながら注いだ。得られた溶媒を含むパウダー状の重合体を100℃、減圧下で12時間乾燥した。得られたポリマーは72.5gで、ポリマー中の4−メチル−1−ペンテン含量は87.9mol%、プロピレン含量は12.1mol%であった。各種物性について測定した結果を表1に示す。
(Synthesis example 2) Preparation of copolymer (A) -2
A SUS autoclave with a stirring blade having a capacity of 1.5 liters sufficiently purged with nitrogen was charged with 300 ml of normal hexane at 23 ° C. (dried in a dry nitrogen atmosphere and activated alumina) and 450 ml of 4-methyl-1-pentene. . The autoclave was charged with 0.75 ml of a 1.0 mmol / ml toluene solution of triisobutylaluminum (TIBAL), and the stirrer was rotated. Next, the autoclave was heated to an internal temperature of 60 ° C., pressurized with propylene so that the total pressure became 0.15 MPa (gauge pressure), and 12 ml of hydrogen was added as a chain transfer agent. Subsequently, 1 mmol of methylaluminoxane prepared in advance, diphenylmethylene (1-ethyl-3-tert-butyl-cyclopentadienyl) (2,7-di-tert-butyl-fluorenyl) zirconium in terms of Al Polymerization was initiated by injecting 0.34 ml of a toluene solution containing 0.01 mmol of dichloride into the autoclave with nitrogen. During the polymerization reaction, the temperature was adjusted so that the internal temperature of the autoclave was 60 ° C. 20 minutes after the start of the polymerization, 5 ml of methanol was pressed into the autoclave with nitrogen to stop the polymerization, and the autoclave was depressurized to the atmospheric pressure. Acetone was poured into the reaction solution with stirring. The obtained powdered polymer containing the solvent was dried at 100 ° C. under reduced pressure for 12 hours. The obtained polymer was 72.5 g, and the 4-methyl-1-pentene content in the polymer was 87.9 mol% and the propylene content was 12.1 mol%. Table 1 shows the measurement results of various physical properties.
(合成例3)共重合体(A)−3の調製
充分窒素置換した容量1.5リットルの攪拌翼付SUS製オートクレーブに、23℃でノルマルヘキサン300ml(乾燥窒素雰囲気、活性アルミナ上で乾燥したもの)、4−メチル−1−ペンテンを450ml装入した。このオートクレーブに、トリイソブチルアルミニウム(TIBAL)の1.0mmol/mlトルエン溶液を0.75ml装入し攪拌機を回した。次に、オートクレーブを内温60℃まで加熱し、全圧が0.40MPa(ゲージ圧)となるようにプロピレンで加圧した。続いて、予め調製しておいた、メチルアルミノキサンをAl換算で1mmol、ジフェニルメチレン(1−エチル−3−t−ブチル−シクロペンタジエニル)(2,7−ジ−t−ブチル−フルオレニル)ジルコニウムジクロリドを0.01mmolを含むトルエン溶液0.34mlを窒素でオートクレーブに圧入し、重合を開始した。重合反応中、オートクレーブ内温が60℃になるように温度調整した。重合開始60分後、オートクレーブにメタノール5mlを窒素で圧入し重合を停止し、オートクレーブを大気圧まで脱圧した。反応溶液にアセトンを攪拌しながら注いだ。得られた溶媒を含むパウダー状の重合体を100℃、減圧下で12時間乾燥した。得られたポリマーは36.9gで、ポリマー中の4−メチル−1−ペンテン含量は72mol%、プロピレン含量は28mol%であった。各種物性について測定した結果を表1に示す。
(Synthesis Example 3) Preparation of Copolymer (A) -3
A SUS autoclave with a stirring blade having a capacity of 1.5 liters sufficiently purged with nitrogen was charged with 300 ml of normal hexane at 23 ° C. (dried in a dry nitrogen atmosphere and activated alumina) and 450 ml of 4-methyl-1-pentene. . The autoclave was charged with 0.75 ml of a 1.0 mmol / ml toluene solution of triisobutylaluminum (TIBAL), and the stirrer was rotated. Next, the autoclave was heated to an internal temperature of 60 ° C. and pressurized with propylene so that the total pressure was 0.40 MPa (gauge pressure). Subsequently, 1 mmol of methylaluminoxane prepared in advance, diphenylmethylene (1-ethyl-3-tert-butyl-cyclopentadienyl) (2,7-di-tert-butyl-fluorenyl) zirconium in terms of Al Polymerization was initiated by injecting 0.34 ml of a toluene solution containing 0.01 mmol of dichloride into the autoclave with nitrogen. During the polymerization reaction, the temperature was adjusted so that the internal temperature of the autoclave was 60 ° C. Sixty minutes after the start of polymerization, 5 ml of methanol was injected into the autoclave with nitrogen to stop the polymerization, and the autoclave was depressurized to atmospheric pressure. Acetone was poured into the reaction solution with stirring. The obtained powdered polymer containing the solvent was dried at 100 ° C. under reduced pressure for 12 hours. The obtained polymer was 36.9 g, and the 4-methyl-1-pentene content in the polymer was 72 mol% and the propylene content was 28 mol%. Table 1 shows the measurement results of various physical properties.
(合成例4)共重合体(A)−4の調製
充分窒素置換した容量1.5リットルの攪拌翼付SUS製オートクレーブに、23℃で
4−メチル−1−ペンテンを750ml装入した。このオートクレーブに、トリイソブチ
ルアルミニウム(TIBAL)の1.0mmol/mlトルエン溶液を0.75ml装入
し攪拌機を回した。次に、オートクレーブを内温60℃まで加熱し、全圧が0.12MPa(ゲージ圧)となるようにプロピレンで加圧した。続いて、予め調製しておいた、メチルアルミノキサンをAl換算で1mmol、ジフェニルメチレン(1−エチル−3−t−ブチル−シクロペンタジエニル)(2,7−ジ−t−ブチル−フルオレニル)ジルコニウムジクロリドを0.005mmolを含むトルエン溶液0.34mlを窒素でオートクレーブに圧入し、重合を開始した。重合反応中、オートクレーブ内温が60℃になるように温度調整した。重合開始60分後、オートクレーブにメタノール5mlを窒素で圧入し重合を停止し、オートクレーブを大気圧まで脱圧した。反応溶液にアセトンを攪拌しながら注いだ。得られた溶媒を含むパウダー状の重合体を130℃、減圧下で12時間乾燥した。得られたポリマーは34.7gで、ポリマー中の4−メチル−1−ペンテン含量は94mol%、プロピレン含量は6mol%であった。ポリマーの融点(Tm)は200℃であり、極限粘度[η]は1.6dl/gであった。各種物性について測定した結果を表1に示す。
(Synthesis Example 4) Preparation of Copolymer (A) -4
750 ml of 4-methyl-1-pentene was charged at 23 ° C. into a SUS autoclave with a stirring blade having a capacity of 1.5 liters sufficiently purged with nitrogen. The autoclave was charged with 0.75 ml of a 1.0 mmol / ml toluene solution of triisobutylaluminum (TIBAL), and the stirrer was rotated. Next, the autoclave was heated to an internal temperature of 60 ° C. and pressurized with propylene so that the total pressure was 0.12 MPa (gauge pressure). Subsequently, 1 mmol of methylaluminoxane prepared in advance, diphenylmethylene (1-ethyl-3-tert-butyl-cyclopentadienyl) (2,7-di-tert-butyl-fluorenyl) zirconium in terms of Al Polymerization was initiated by injecting 0.34 ml of a toluene solution containing 0.005 mmol of dichloride into an autoclave with nitrogen. During the polymerization reaction, the temperature was adjusted so that the internal temperature of the autoclave was 60 ° C. Sixty minutes after the start of polymerization, 5 ml of methanol was injected into the autoclave with nitrogen to stop the polymerization, and the autoclave was depressurized to atmospheric pressure. Acetone was poured into the reaction solution with stirring. The obtained powdery polymer containing the solvent was dried at 130 ° C. under reduced pressure for 12 hours. The obtained polymer was 34.7 g, and the 4-methyl-1-pentene content in the polymer was 94 mol% and the propylene content was 6 mol%. The melting point (Tm) of the polymer was 200 ° C., and the intrinsic viscosity [η] was 1.6 dl / g. Table 1 shows the measurement results of various physical properties.
(合成例5)共重合体(A)−5の調製
充分窒素置換した容量1.5リットルの攪拌翼付SUS製オートクレーブに、23℃で
4−メチル−1−ペンテンを750ml装入した。このオートクレーブに、トリイソブチ
ルアルミニウム(TIBAL)の1.0mmol/mlトルエン溶液を0.75ml装入
し攪拌機を回した。次に、オートクレーブを内温60℃まで加熱し、全圧が0.11MPa(ゲージ圧)となるようにプロピレンで加圧し、連鎖移動剤として水素を50ml添加した。続いて、予め調製しておいた、メチルアルミノキサンをAl換算で1mmol、ジフェニルメチレン(1−エチル−3−t−ブチル−シクロペンタジエニル)(2,7−ジ−t−ブチル−フルオレニル)ジルコニウムジクロリドを0.01mmolを含むトルエン溶液0.34mlを窒素でオートクレーブに圧入し、重合を開始した。重合反応中、オートクレーブ内温が60℃になるように温度調整した。重合開始20分後、オートクレーブにメタノール5mlを窒素で圧入し重合を停止し、オートクレーブを大気圧まで脱圧した。反応溶液にアセトンを攪拌しながら注いだ。得られた溶媒を含むパウダー状の重合体を130℃、減圧下で12時間乾燥した。得られたポリマーは31.2gで、ポリマー中の4−メチル−1−ペンテン含量は99mol%、プロピレン含量は1mol%であった。ポリマーの融点(Tm)は224℃であり、極限粘度[η]は1.5dl/gであった。各種物性について測定した結果を表1に示す。なおJIS K7210に準拠して、260℃で5kgの荷重で測定したMFRは60であった。
(Synthesis example 5) Preparation of copolymer (A) -5
750 ml of 4-methyl-1-pentene was charged at 23 ° C. into a SUS autoclave with a stirring blade having a capacity of 1.5 liters sufficiently purged with nitrogen. The autoclave was charged with 0.75 ml of a 1.0 mmol / ml toluene solution of triisobutylaluminum (TIBAL), and the stirrer was rotated. Next, the autoclave was heated to an internal temperature of 60 ° C., pressurized with propylene so that the total pressure was 0.11 MPa (gauge pressure), and 50 ml of hydrogen was added as a chain transfer agent. Subsequently, methylaluminoxane prepared in advance, 1 mmol in terms of Al, diphenylmethylene (1-ethyl-3-t-butyl-cyclopentadienyl) (2,7-di-t-butyl-fluorenyl) zirconium Polymerization was initiated by injecting 0.34 ml of a toluene solution containing 0.01 mmol of dichloride into the autoclave with nitrogen. During the polymerization reaction, the temperature was adjusted so that the internal temperature of the autoclave was 60 ° C. 20 minutes after the start of the polymerization, 5 ml of methanol was pressed into the autoclave with nitrogen to stop the polymerization, and the autoclave was depressurized to the atmospheric pressure. Acetone was poured into the reaction solution with stirring. The obtained powdery polymer containing the solvent was dried at 130 ° C. under reduced pressure for 12 hours. The obtained polymer was 31.2 g, and the 4-methyl-1-pentene content in the polymer was 99 mol% and the propylene content was 1 mol%. The melting point (Tm) of the polymer was 224 ° C., and the intrinsic viscosity [η] was 1.5 dl / g. Table 1 shows the measurement results of various physical properties. According to JIS K7210, the MFR measured at 260 ° C. with a load of 5 kg was 60.
(実施例1)
共重合体(A)−1 10gに対して、酸化防止剤としてのトリ(2,4−ジ−t−ブチルフェニル)フォスフェートを0.1重量%、耐熱安定剤としてのn−オクタデシル−3−(4’−ヒドロキシ−3’,5’−ジ−t−ブチルフェニル)プロピネートを0.1重量%添加し、固形分濃度が5重量%になるようにトルエン(和光純薬工業株式会社製)を添加して、40℃、1時間、200rpmで攪拌して共重合体(A)−1を含む組成物を製造した。この溶液を25℃でガラス基板上に塗布してアプリケーターで均一に伸ばした後、25℃で30分、さらに80℃で1時間乾燥し、フィルムを得た。
(実施例2)
共重合体(A)−2を用いた以外は実施例1と同様の作業を行い、フィルムを得た。
(実施例3)
共重合体(A)−3を用いた以外は実施例1と同様の作業を行い、フィルムを得た。
(実施例4)
共重合体(A)−4を用いた以外は実施例1と同様の作業を行い、フィルムを得た。
(比較例1)
共重合体(A)−5を用いた以外は実施例1と同様の作業を行い、フィルムを得た。
Example 1
0.1% by weight of tri (2,4-di-tert-butylphenyl) phosphate as an antioxidant and n-octadecyl-3 as a heat stabilizer for 10 g of copolymer (A) -1 -(4′-hydroxy-3 ′, 5′-di-t-butylphenyl) propionate was added in an amount of 0.1% by weight, and toluene (manufactured by Wako Pure Chemical Industries Ltd. ) Was added and stirred at 200 rpm for 1 hour at 40 ° C. to prepare a composition containing the copolymer (A) -1. This solution was applied onto a glass substrate at 25 ° C. and uniformly stretched with an applicator, and then dried at 25 ° C. for 30 minutes and further at 80 ° C. for 1 hour to obtain a film.
(Example 2)
A film was obtained in the same manner as in Example 1 except that the copolymer (A) -2 was used.
Example 3
A film was obtained in the same manner as in Example 1 except that the copolymer (A) -3 was used.
Example 4
A film was obtained in the same manner as in Example 1 except that the copolymer (A) -4 was used.
(Comparative Example 1)
A film was obtained in the same manner as in Example 1 except that the copolymer (A) -5 was used.
表2に実施例1〜4、比較例1の組成物の組成、塗布性、および前記組成物を用いて作成したフィルムについて、前述の方法で測定した厚さ、絶縁破壊電圧(BDV),フィルムの厚さでBDVを除した規格化絶縁破壊電圧(BDV)、水の接触角、臨界界面張力(mN/m)を示した。なお、実施例1〜4、比較例1で得られたフィルムに含まれる溶媒の量は、前記フィルムを100重量%としたときに、0.001〜0.2重量%であった。 Table 2 shows the compositions of Examples 1 to 4 and Comparative Example 1, the coating properties, and the thickness, dielectric breakdown voltage (BDV), and film measured by the methods described above for the films prepared using the compositions. The normalized breakdown voltage (BDV), the contact angle of water, and the critical interfacial tension (mN / m) obtained by dividing BDV by the thickness of In addition, the quantity of the solvent contained in the film obtained in Examples 1-4 and the comparative example 1 was 0.001-0.2 weight% when the said film was 100 weight%.
表2の結果から明らかなように、共重合体(A)の融点(Tm)が200℃以下または融点(Tm)が実質的に観測されない実施例1〜4については組成物の保存安定性が高いのに対して、共重合体(A)の融点(Tm)が224℃と高い比較例1では保存安定性が低いことがわかる。また共重合体(A)の融点が160℃未満または融点(Tm)が実質的に観測されない実施例1〜3は、特に保存安定性に優れることが分かる。 As is clear from the results in Table 2, the storage stability of the composition is about Examples 1 to 4 where the melting point (Tm) of the copolymer (A) is 200 ° C. or lower or the melting point (Tm) is not substantially observed. On the other hand, in Comparative Example 1 where the melting point (Tm) of the copolymer (A) is as high as 224 ° C., the storage stability is low. Moreover, it turns out that Examples 1-3 which the melting point of a copolymer (A) is less than 160 degreeC, or melting | fusing point (Tm) is not substantially observed are especially excellent in storage stability.
本発明の組成物を特にコーティング剤として用いることで、良好な電気絶縁性を有するフィルムを、前記コーティング剤を一定期間保管後でも容易に製造することができる。前記フィルムは製造工程などで電気絶縁性が要求される各種表示デバイス、半導体デバイス、光学部材、プリント回路基板の保護フィルムとして、特に産業上の利用可能性が高い。 By using the composition of the present invention as a coating agent, a film having good electrical insulation can be easily produced even after the coating agent is stored for a certain period. The film has a particularly high industrial applicability as a protective film for various display devices, semiconductor devices, optical members, and printed circuit boards that require electrical insulation in the manufacturing process.
Claims (13)
溶媒と、
を含む、組成物。
(i)4−メチル−1−ペンテンおよび/または3−メチル−1−ペンテンに由来する構成単位を50〜95モル%含み、炭素原子数2〜4のαーオレフィンに由来する構成単位を5〜50モル%含む共重合体である
(ii)135℃デカリン中で測定した極限粘度[η]が0.5〜5.0(dl/g)である
(iii)DSCで測定した融点(Tm)が200℃以下、もしくは本質的に融点が存在しない
(iv)密度が820〜850(kg/m3)である
(v)ゲルパーミエーションクロマトグラフィー(GPC)で測定する重量平均分子量(Mw)と数平均分子量(Mn)との比である分子量分布(Mw/Mn)が1.0〜3.5である A copolymer (A) that satisfies the following requirements (i) to (v);
A solvent,
A composition comprising:
(I) 50 to 95 mol% of structural units derived from 4-methyl-1-pentene and / or 3-methyl-1-pentene, and 5 to 5 structural units derived from an α-olefin having 2 to 4 carbon atoms (Ii) the intrinsic viscosity [η] measured in 135 ° C. decalin is 0.5 to 5.0 (dl / g) (iii) melting point (Tm) measured by DSC Is not more than 200 ° C. or has essentially no melting point (iv) Density is 820 to 850 (kg / m 3) (v) Weight average molecular weight (Mw) and number measured by gel permeation chromatography (GPC) The molecular weight distribution (Mw / Mn), which is a ratio to the average molecular weight (Mn), is 1.0 to 3.5.
The manufacturing method of a film including the 1st process of apply | coating the composition or coating agent as described in any one of Claims 1-8, and the 2nd process of removing the solvent in the said composition.
溶媒と、を含む、フィルムであって、前記フィルム100重量%に対して前記溶媒を0.001〜0.5重量%含むフィルム。
(i)4−メチル−1−ペンテンおよび/または3−メチル−1−ペンテンに由来する構成単位を50〜95モル%含み、エチレン及び炭素原子数3〜4のαーオレフィンからなる群から選ばれる少なくとも1種類のオレフィンに由来する構成単位を5〜50モル%含む共重合体である
(ii)135℃デカリン中で測定した極限粘度[η]が0.5〜5.0(dl/g)である
(iii)DSCで測定した融点(Tm)が200℃以下もしくは本質的に融点が存在しない
(iv)密度が820〜850(kg/m3)である
(v)ゲルパーミエーションクロマトグラフィー(GPC)で測定する重量平均分子量(
Mw)と数平均分子量(Mn)との比である分子量分布(Mw/Mn)は1.0〜3.5
である A copolymer (A) that satisfies the following requirements (i) to (v);
A film containing 0.001 to 0.5% by weight of the solvent with respect to 100% by weight of the film.
(I) 50 to 95 mol% of a structural unit derived from 4-methyl-1-pentene and / or 3-methyl-1-pentene is selected from the group consisting of ethylene and an α-olefin having 3 to 4 carbon atoms. (Ii) an intrinsic viscosity [η] measured in decalin at 135 ° C. of 0.5 to 5.0 (dl / g), which is a copolymer containing 5 to 50 mol% of a structural unit derived from at least one olefin (Iii) Melting point (Tm) measured by DSC is 200 ° C. or lower or essentially no melting point (iv) Density is 820 to 850 (kg / m 3 ) (v) Gel permeation chromatography ( Weight average molecular weight (GPC)
The molecular weight distribution (Mw / Mn), which is the ratio of Mw) to the number average molecular weight (Mn), is 1.0 to 3.5.
Is
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