JP2015016444A - Drawing pattern formation method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a drawing pattern formation method in which thick wiring can be formed and dispersion liquid can be desiccated in a short time without imparting harmful effect on liquid flying etc. and without deteriorating an electric characteristic of wiring etc.SOLUTION: A drawing pattern formation method is the drawing pattern formation method in which a drawing pattern constituted of very fine particles is formed on a substrate by making drawing on the substrate with the use of drawing materials including the very fine particles and dispersion liquid, and comprises a first step in which drawing is made by using the drawing materials on the substrate which is cooled in advance below the melting point of the dispersion liquid, a second step in which an absorption member which is cooled in advance below the melting point of the dispersion liquid is contacted to the drawing materials applied to the substrate, and a third step in which the temperature of the absorption member is raised at or above the melting point of the dispersion liquid so that the dispersion liquid is absorbed by the absorption member, and, thereafter, the absorption member is separated from the substrate.

Description

  The present invention relates to a drawing pattern forming method in which a drawing material containing fine particles and a dispersion is drawn by a drawing apparatus such as an ink jet apparatus to form a drawing pattern.

  Conventionally, wiring of an electric circuit has been formed by a replication technique including a plating and etching process using a mask. These processes require at least a plating process, mask production, photolithography, etching, cleaning, and drying processes. Because of the large number of processes, it is difficult to meet the needs of today's small variety of customers. It has become. As a technique replacing these conventional techniques, a technique capable of drawing at any time by an ink jet method using a metal nanoparticle material is expected and developed.

  However, in the inkjet method, it is necessary to use a low-viscosity ink obtained by thinly diluting metal nanoparticles with a dispersion. As a result, the ink spreads and the coffee stain phenomenon (= film thickness non-uniformity) or the bulge effect (= non-uniform liquid droplet wetting and spreading) occurs, or cracks occur and the electrical characteristics deteriorate. There is. Further, since it is necessary to dry the dispersion, the drying time is a factor that hinders productivity improvement or cost reduction. Usually, when manufacturing a wiring board with metal nanoparticles, after drawing ink on the board, the dispersion is evaporated and the remaining particles are baked to form the wiring.

  Here, an image forming application will be briefly described for comparison. In the case of image formation, the recording medium is usually made of a material such as paper into which the liquid permeates, the ink solvent or dispersion is absorbed by the paper, and the dye component remains on the paper surface. Thereafter, the dispersion is dried from the ink surface or the recording paper back surface. Even in the use of a non-penetrating substrate such as OHP paper, the surface of the OHP paper is subjected to a surface treatment so as to penetrate a dispersion called a receiving layer, and the dispersion is dried through the surface treatment.

  However, in the production of a wiring board or the like on which metal nanoparticles are drawn by a method such as inkjet, the board is made of an ink non-penetrating material. Therefore, the ink immediately after drawing is in an undried state, and it is necessary to evaporate the dispersion for drying. In order to evaporate and dry the dispersion earlier, it is common to heat dry. However, if the temperature is raised above the boiling point of the dispersion, voids and cracks are generated between the dried particles, and the electrical characteristics are lowered, so that heating and drying at the boiling point or less are unavoidable.

  In addition, when the dispersion liquid with a low boiling point is used, since the inkjet nozzle side will dry immediately and a metal nanoparticle will precipitate on a nozzle and will affect drawing, it is rarely used. When the heating temperature is high, there is a problem that mist is generated because the droplets are dried before landing. In addition, since the temperature of the nozzle portion is relatively low, the vaporized dispersion liquid is condensed on the nozzle, which adversely affects the flight speed and direction. Therefore, an appropriate temperature that does not affect the ink ejection is required, and as a result, there is a problem that the drying time becomes a long time of 5 to 10 minutes. Prolonged drying time does not increase production efficiency and it is difficult to realize cost reduction.

  In Patent Document 1, it is disclosed that an ink composition to which a desiccant is added is used in a method of forming a metal wiring by repeatedly laminating a metal ink composition. Thus, it is described that the drying rate can be adjusted to prevent cracks in the metal wiring and to improve the uniformity of the line width. However, it does not shorten the drying rate and increase the production efficiency.

  Moreover, in patent document 2, laser light is irradiated immediately after landing the ink containing the metal nanoparticle and / or metal oxide nanoparticle from which a shape differs, and a micro diameter particle and the enlarged particle are mixed. A circuit board manufacturing method is disclosed. Thus, it is described that a low resistance and fine wiring pattern is obtained. However, this method is not a solution for shortening the drying time because the dispersion is prevented from being dried as much as possible.

Patent Document 3 discloses the composition of the coating liquid for the receiving layer in the case where an ink receiving layer is provided on the substrate to form a conductive pattern. Thus, it is described that the adhesion between the conductive pattern and the substrate can be improved. However, it takes time to produce the receiving layer on the substrate each time, and the drying time is not shortened.
Although there is a method of absorbing the dispersion liquid in advance on a substrate having a receiving layer, this method is effective when only one wiring pattern is formed, but is not suitable for multilayering of wiring patterns.

  Moreover, although it is not a pattern formation method by drawing, in patent document 4, the pattern was expressed using the method of adjusting the bridge | crosslinking state of a silicone composition and controlling the permeation | transmission state of a dispersion liquid and a fine particle. A method is disclosed in which a permeable membrane made of a silicone composition is prepared, a metal nanoparticle solution is oozed from the permeable membrane, and a pattern is transferred onto a substrate. However, even in this method, no proposal for shortening the drying time has been made.

  Another problem with wiring of electric circuits using metal nanoparticles is increasing the thickness of the wiring. The electric resistance of the wiring of the electric circuit using the metal nanoparticles has a problem that the resistance value is higher by about one to two digits than the metal wiring manufactured by plating. In order to lower the resistance value, it is conceivable to widen the wiring width, but there is a limit when considering contact with other wiring. For this reason, it is necessary to increase the thickness of the wiring, but the above-described conventional technology has not yet solved the problem.

  Patent Document 5 describes an invention relating to thickening, which is different from metal wiring. This is intended to fix a biological sample such as a biochip with a uniform film thickness on a substrate. This is a method in which a biological sample is discharged from a nozzle onto a substrate cooled below the freezing point of the biological sample, and the biological sample is cooled and solidified along with landing on the substrate, followed by vacuum freeze drying. However, there are problems in that it takes a very long time (several hours) to freeze-dry in vacuum and that a void is generated in the biological sample because only moisture evaporates while maintaining the shape. In particular, the metal wiring has a drawback that the gap increases the resistance value.

  The present invention has been made in view of the above circumstances. For example, in a drawing pattern forming method for drawing wiring of an electric circuit while flying ink by an inkjet method or the like, there is no adverse effect on the flying of the ink. An object of the present invention is to provide a drawing pattern forming method capable of forming a thick wiring and drying a dispersion in a short time without deteriorating the electrical characteristics of the wiring.

In order to solve the above problems and achieve the object, the present invention draws a drawing material containing fine particles and a dispersion on a substrate, and forms a drawing pattern made of the fine particles on the substrate. A forming method comprising:
A first step of drawing the drawing material on the substrate previously cooled to below the melting point of the dispersion;
A second step of bringing the absorbing member cooled in advance to a temperature lower than the melting point of the dispersion into contact with the drawing material drawn on the substrate;
And a third step of separating the absorbing member from the substrate after the temperature of the absorbing member is raised to the melting point of the dispersion or higher and the dispersion is absorbed by the absorbing member. It is what.

  According to the drawing pattern forming method of the present invention, since the drawing material is drawn on the substrate that has been cooled to below the melting point of the dispersion in advance, it is possible to prevent the drawing material from spreading and form a thick drawing pattern. . Also, with the absorbing member cooled below the melting point in contact with the drawing pattern on the substrate, the temperature of the absorbing member is raised to the melting point or higher to absorb the dispersion, so that the pattern drawn on the substrate gets wet. The drying time can be shortened while preventing the spread and maintaining the thickness.

It is the schematic which shows the 1st process of one Embodiment of the drawing pattern formation method. It is a schematic diagram which shows the structure of drawing material. It is the schematic which shows the 2nd process of one Embodiment of the drawing pattern formation method. It is the schematic which shows the 3rd process of one Embodiment of the drawing pattern formation method.

The drawing pattern forming method of the present invention will be described below.
The drawing pattern forming method of the present invention is a drawing pattern forming method for drawing a drawing material containing fine particles and a dispersion on a substrate, and forming a drawing pattern comprising the fine particles on the substrate,
A first step of drawing the drawing material on the substrate previously cooled to below the melting point of the dispersion;
A second step of bringing the absorbing member cooled in advance to a temperature lower than the melting point of the dispersion into contact with the drawing material drawn on the substrate;
And a third step of separating the absorbing member from the substrate after the temperature of the absorbing member is raised to the melting point of the dispersion or higher and the dispersion is absorbed by the absorbing member. The liquid is absorbed by the absorbing member, and the fine particles remain on the substrate.

  The temperature of “below the melting point” in the first step and the second step is preferably in the range from less than the melting point to a temperature 10 ° C. lower than the melting point. When the temperature is lower than the melting point by more than 10 ° C., the dispersion liquid partially existing in the liquid is absorbed by the absorbing member and solidifies (freezes) in the absorbing member, so that the elastic force of the absorbing member is lost and drawing on the substrate is performed. This is because adverse effects such as peeling of the pattern come out.

  Further, in the third step, the temperature “above the melting point” is preferably “a range from the melting point to a temperature higher by 1 ° C. The drawing material dispersion on the substrate is completely dissolved and is absorbed by the absorbing member. If the temperature is too high, the drawing pattern on the substrate spreads out and the film cannot be thickened. This is not preferable because the dispersion liquid boils, cracks and the like occur and the film quality of the pattern deteriorates.

-substrate-
The substrate is not particularly limited as long as it is made of a material that does not allow the dispersion to penetrate, and examples thereof include a polymer resin substrate, a ceramic substrate, a semiconductor silicon substrate, a metal substrate, and a glass substrate. Examples of the polymer resin substrate include polyimide resin, phenol resin, melamine resin, polyolefin resin, polyamide resin, polyester resin, acrylic resin, acetal resin, polyether sulfone resin, cellulose resin, polyethylene terephthalate resin, polycarbonate resin, and the like. Can do.
Examples of the ceramic substrate include silicon carbide, silicon nitride, aluminum nitride, zirconium boride, aluminum titanate, silica, and alumina.

  With a fine particle, a fine particle shows a particle | grain of nanometer order. For example, particles having an average particle size of 100 nm or less are shown. Considering ease of low-temperature firing of fine particles and ink jetting, the practical range is 5 to 20 nm. Nano silver particles (average particle size 12 nm), nano gold particles, nano platinum particles, nano aluminum particles, nano tungsten particles, nano copper particles, and the like can be used.

  Further, not only conductive fine particles but also nonconductive fine particles can be used in the present invention. Examples thereof include fine particles such as inorganic pigments, organic pigments, and ceramics. Examples of inorganic pigments include titanium dioxide, zinc oxide, iron oxide, chromium oxide, iron black, and cobalt blue. Examples of organic pigments include azo pigments and phthalocyanine pigments. Examples of ceramics include alumina and zirconia.

―Dispersion―
In addition, the dispersion liquid should just disperse | distribute a fine particle, and the value whose SP value is near the SP value of an absorption member is desirable. In the case of an organic solvent system, tetradecane, cyclohexane, carbon tetrachloride, toluene, benzene, methyl ethyl ketone and the like can be used. In particular, alkane tetradecane (boiling point 254 ° C., melting point 5.9 ° C.), pentadecane (boiling point 268-270 ° C., melting point 9.9 ° C.), hexadecane (boiling point 287 ° C., melting point 18 ° C.), heptadecane (boiling point). 302 ° C., melting point 21 ° C.) and the like are very preferable considering the equipment environment.

-Absorbing member-
The absorbing member is made of a material that absorbs the dispersion (ink), and is preferably a rubber system having a high degree of swelling. Silicone rubber, natural rubber, other polymers, organic polymer porous bodies, and the like can also be used. . Examples of the organic polymer porous material include a polyester porous material, a polycarbonate porous material, and a polyurethane porous material.
If it is a water-based solvent, the absorbent member may be a polymer absorbent polymer having a high water absorption rate such as used in paper diapers, for example, polyacrylates such as sodium polyacrylate, starch-polyacrylonitrile hydrolysate Starch-polyacrylonitrile acetic acid cross-linked product, cross-linked carboxymethyl cellulose, vinyl acetate-methyl acrylate copolymer saponified product and the like are desirable.

  The absorbent member preferably has a solubility parameter (SP value) close to that of the dispersion. It is desirable to approximate the dispersion parameter of the dispersion within a range of ± 2 or even within a range of ± 1. When the SP value of the absorbent member is close to the SP value of the dispersion, the swelling speed and amount of the dispersion into the absorbent member increase. In the case of silicone rubber (near SP value 8), n-octane, cyclohexane, carbon tetrachloride, toluene, benzene, and the like as dispersions are desirable because they have similar SP values.

It is desirable that the absorbent member has a high surface tension in order to reduce wettability with the fine particles, facilitate peeling of the absorbent member from the substrate, and leave only fine particles satisfactorily. The surface tension of the absorbing member is preferably larger than the substrate.
The thickness of the absorbing member can be appropriately selected depending on the type of absorbing member, the type of dispersion, the patterning shape, and the like.

  The voids of the absorbing member are sized so as to allow the dispersion liquid to pass therethrough but not allow fine particles to pass therethrough. The size of the voids in the silicone rubber is statistically 2 nm or less. From the size of the fine particles, for example, the organic polymer preferably has a range of 100 nm or less, and more preferably 5 nm or less, as the size of the gap of the absorbing member.

  In the case of organic polymers, this size is determined by the size of the network of the crosslinked structure. The size of the network can be controlled by adjusting the molecular weight or structure of the monomer, the crosslinked structure, or the degree of polymerization. Furthermore, it is also possible to obtain a desired solubility parameter and swelling degree by performing control based on the crosslinked structure as described above. Although the fine particles are on the order of nanometers, the size of the dispersion is on the order of angstroms (0.1 nanometer), so it is possible to separate the dispersion using the difference in size. is there.

EXAMPLES Hereinafter, although an Example is given and this invention is demonstrated further more concretely, this invention is not limited to these Examples at all. Any appropriate modification of these embodiments is within the scope of the present invention without departing from the gist of the present invention.
A method of drawing an electric circuit on a substrate, which is an embodiment of the present invention, will be described step by step with reference to FIGS.

[First step]
FIG. 1 shows a schematic diagram of the first step of the drawing pattern forming method of the present invention.
-Movement stage 11-
The moving stage 11 moves the substrate 14 relative to the ejection device 16 when forming a drawing pattern. In addition, the substrate 14 is also transferred to the drying apparatus in the second step and the third step. The moving stage 11 is controlled by movement control means (not shown).

-Temperature adjustment plate 12-
The temperature adjustment plate 12 is a device that adjusts the temperature of the substrate 14. A pipe 13 is provided inside the temperature adjustment plate 12, and the temperature of the substrate 14 is adjusted by circulating a liquid medium cooled by a cooling device (not shown) in the pipe 13. In this embodiment, the temperature adjustment plate 12 is made of copper, and ethylene glycol circulates inside the pipe 13.
―Substrate 14―
A substrate on which an electric circuit is formed by drawing. In this example, glass having a thickness of 1 mm was used.

-Drawing material (ink) 15-
It is a material that forms an electric circuit. In this example, as shown in FIG. 2, ink composed of fine particles (nanometal particles) and a dispersion was used. The ink used was NSP-J manufactured by Harima Chemicals. The fine particles 15a are nano silver particles (average particle size 12 nm) 65RH%, and the dispersion 15b is tetradecane (boiling point 254 ° C., melting point 5.9 ° C., SP value 7.7).
―Discharge device 16―
The apparatus includes a piezo-type inkjet head that discharges a drawing material, and deposits the drawing material on a substrate by the inkjet head.

―Operation―
(1) The substrate 14 is cooled by setting the temperature adjustment plate 12 to 0 ° C.
(2) The moving stage 11 is set to a stage speed of 50 mm / s.
(3) The temperature of the drawing material 15 in the discharge device 16 is 22 ° C. While moving the moving stage 11 in this state, the drawing material 15 was discharged onto the substrate 14 at a frequency of 1 kHz by the discharge device 16 to form a drawing pattern.

The manufacturing environment was set to an atmospheric temperature of 10 ° C. and a humidity of 5 RH% in order to suppress condensation. At least the first step and the second step are performed in a low humidity environment. Thereby, the dew condensation of the water | moisture content in air does not generate | occur | produce, but a drawing pattern can be formed. This is because condensation forms a water or ice layer between the substrate 14 and the drawing material 15, which decreases the adhesion and peels off the drawing pattern.
The drawing pattern width at the time of landing of the drawing pattern formed as described above was about 50 μm and the height was about 13 μm.
The “low humidity” is preferably 10 RH% or less. If it exceeds 10 RH%, condensation tends to occur, which is not preferable.
Further, the temperature of the substrate 14 is preferably in the range from less than the melting point to 10 ° C. lower than the melting point when the dispersion 14b is tetradecane.

  For comparison, when drawing was performed at room temperature (22 ° C.) by the same method as described above, the drawing pattern width spread to about 300 μm, and the height at that time was difficult to measure. When the temperature adjusting plate was set to 4 ° C., the drawing material solidified about 1 second after the landing of the drawing material on the substrate. Since the drawing material at the time of landing was in a liquid state, the drawing pattern at that time was in a wet and spread state as at room temperature (22 ° C.). The behavior of the drawing material at the time of landing was taken with a high-speed camera. Further, the height of the drawing material when the temperature adjustment plate 12 was discharged at a temperature of 0 ° C. and the stage speed was 0 was 10 μm. The height of each drop tended to decrease little by little as they overlapped.

As described above, when discharged onto a substrate having a melting point lower than that of the drawing material, the drawing material is drawn while being crushed to about 1/4 at the same time as being landed, and can be stacked on the drawing material. it can.
By lowering the temperature of the drawing material in the discharge device and the substrate temperature, the height of the drawing pattern upon landing can be further increased.
In this embodiment, the drawing pattern of only one layer has been described. However, a drawing pattern may be formed by discharging a drawing material a plurality of times. After the drawing material is overwritten in a plurality of layers, the thickness of the drawing material can be further increased by performing the second step and the third step. In addition, since the second step and the third step are performed only once, the time can be reduced.

[Second step]
FIG. 3 shows a schematic diagram of the second step of the drawing pattern forming method of the present invention.
―Drying device―
As shown in FIG. 3A, the drying apparatus includes a temperature adjustment plate 12 on which the substrate 14 is placed, an absorption member 22 supported by a support body 21, a temperature regulator 23, and an upper portion of the temperature regulator 23. And a height moving stage 24 located at the position. The height moving stage 24 controls the movement of the temperature regulator 23 in the height direction. The temperature regulator 23 is located at the upper part of the absorbing member and controls the temperature of the absorbing member 22. The support 21 performs support of the absorbing member 22 and position control with the substrate 14. A Peltier element was used for the temperature regulator 23.

-Absorbing member 22-
Silicone rubber (Shin-Etsu silicone silicone rubber, SP value (solubility parameter) maximum value: 8) was used as the absorbing member 22. The reason why silicone rubber is used is that the SP value (solubility parameter) of tetradecane used in the dispersion 15b is close to the value. It is known that when the SP value is close, the swelling speed and amount of the silicone rubber increase. Further, since the silicone rubber has a molecular structure, the nano silver particles cannot enter between the molecules. In addition, since the silicone rubber has a high surface tension, the wettability with the nano silver particles is low, so that the nano silver particles can remain on the substrate side when peeling from the substrate.
As illustrated in FIG. 3A, a columnar convex portion 22 a is provided on the opposite side of the absorbing member 22 from the substrate 14. By providing the convex portion 22a, the effect of increasing the surface area of the absorbing member 22 and increasing the drying speed is aimed. The thickness of the absorbing member 22 is 2 mm, the diameter of the cylinder is 0.3 mm, the height is 1 mm, and the pitch is 0.5 mm.

―Operation―
(1) First, as shown in FIG. 3A, the substrate 14 was maintained at 0 ° C. by the temperature adjusting plate 12 as in the first step. Although the drawing pattern of FIG. 1 shows only one layer, a drawing pattern laminated a plurality of times can be similarly formed by the following operation.
(2) The temperature of the absorbing member 22 was set to 0 ° C. with the temperature regulator 23.
(3) Next, as shown in FIG. 3B, the height moving stage 24 was moved downward to bring the absorbing member 22 together with the temperature regulator 23 into contact with the drawing material 15 on which the drawing pattern was formed.

  Switch to pressure control at the time of contact and set to 0.05 MPa. The pressure is preferably in the range of 0.01 to 0.1 MPa. Since the drawing material 15 is pressurized by the absorbing member 22, the drawing pattern can be flattened and the generation of voids can be suppressed. In addition, the adhesion between the drawing material 15 and the substrate 14 can be improved. The density of the drawing pattern composed of the nano silver particles 15a can be increased, and generation of pattern voids and cracks can be suppressed.

  In the second step (1) and (2), the temperature of the substrate 14 and the absorbing member 22 is 0 because the melting point of the dispersion 15b of the drawing material 15 is 5.9 ° C. It is set to ℃. If the temperature is lower than the melting point by 10 ° C., the dispersion 15b in the absorbing member 22 is solidified (or frozen), and the absorbing member 22 is warped, resulting in variations in the contact state with the drawing material 15. It is not desirable to occur. Although details are unknown, the present inventors have experimentally confirmed that the dispersion liquid 15b in the absorbing member 22 exists in a liquid state even below the melting point. Therefore, the contact portion between the drawing material 15 and the absorbing member 22 is in a liquid state even in the very vicinity below the melting point, and the dispersion liquid 15b tends to be absorbed by the absorbing member 22 to some extent.

  In an absorbent member made of silicone rubber, the dispersion in the absorbent member does not solidify (or freeze) up to a temperature lower by about 10 ° C. than its melting point, but solidifies (or freezes) when the temperature is lower than that and loses the elastic force of the silicone rubber. Adverse effects such as peeling and peeling. Therefore, the temperature of the substrate and the absorbing member in the first step and the second step is set to a range from less than the melting point of the drawing material to 10 ° C. lower than the melting point, thereby suppressing the influence of peeling and the like. it can.

  Prior to the second step (2), the gas inside the absorbing member 22 was extracted from the absorbing member 22 under vacuum (10 Pa). It is preferable to perform deaeration at 10 Pa to 1000 Pa. Thereby, the resistance when the dispersion liquid is absorbed in the absorbing member 22 is suppressed, and the absorption speed of the dispersion liquid 15b can be increased.

  Note that the pressurization in (3) causes the drawing pattern to be flattened in the height direction and to follow the decrease in the height of the drawing pattern when the dispersion liquid 15b is absorbed by the absorbing member 22 and the substrate 14. And the effect of increasing the adhesion of the drawing material 15.

[Third step]
FIG. 4 shows a schematic diagram of the third step of the drawing pattern forming method of the present invention. Since the drying apparatus is the same as in the second step, the same elements are denoted by the same reference numerals and the description thereof is omitted.

―Operation―
(1) First, as shown in FIG. 4A, in the state where the absorbing member 22 is in contact with the drawing material 15 of the drawing pattern formed in the second step, the temperature adjustment plate 12 and the temperature regulator 23 The temperature was raised. The temperature adjustment plate 12 was maintained at 5 ° C. The temperature regulator 23 was maintained at 7 ° C. The time to reach these set temperatures was about 30 seconds.
(2) Subsequently, the absorbing member 22 was kept in contact with the drawing material 15 for about 5 seconds after reaching the set temperature. Here, the dispersion is absorbed.
(3) Thereafter, as shown in FIG. 4B, the height moving stage 24 was moved upward to separate the absorbing member 22 from the drawing pattern together with the temperature regulator 23.
(4) The board | substrate 14 with which the drawing pattern was formed was taken out from the temperature control board 12 (not shown).
(5) Thereafter, the temperature of the temperature controller 23 was raised, and the dispersion liquid 15b of the absorbing member 22 was evaporated and dried.

Here, in (1) of the third step, a temperature difference is provided between the temperature adjustment plate 12 and the temperature adjuster 23. The temperature (7 ° C.) of the temperature adjuster 23 located above the absorbing member 22 was set higher than the temperature (5 ° C.) of the temperature adjustment plate 12 that adjusts the temperature of the substrate. This is because the dispersion liquid 15b of the drawing material 15 is melted from the absorption member 22 side, and the dispersion liquid 15b is reliably absorbed from the absorption member 22 side of the drawn pattern.
Thereby, in the third step, the temperature of the absorbing member 22 is higher in the absorbing member 22 than in the substrate 14, so that the dispersion liquid is melted from the absorbing member 22 side and the absorbing member 22 absorbs the dispersion liquid 15 b. Can do. On the other hand, the dispersion liquid starts to melt from the substrate 14 side and may spread on the substrate 14 before being absorbed by the absorbing member 22.

[Evaluation of drawing pattern]
The shape of the drawing pattern obtained through the above steps was a line width of 50 μm and a height of 8 μm. The film quality of the drawing pattern was good without voids.
For comparison, the first step was performed at room temperature, and then the state of the drawing pattern when the substrate on which the drawing pattern was formed was placed on a hot plate and dried was observed. The drawing pattern at this time was wavy with a line width of 170 to 340 μm, and also with a height of 0 (not measurable) to 2 μm (that is, a bulge phenomenon occurred).
Therefore, it was confirmed that the drawing pattern forming method of the present invention can form a thick wiring with a narrow line width.

In the present embodiment, the wiring pattern drawing pattern is described, but the drawing pattern forming method of the present invention is effective not only for the wiring shape but also for other patterns requiring thickening.
Further, in the present invention, since the substrate and the environmental temperature are not increased in drying the dispersion liquid, the ink flying is not adversely affected in drawing by ink jet or the like.

DESCRIPTION OF SYMBOLS 11 Movement stage 12 Temperature adjustment board 13 Piping 14 Board | substrate 15 Drawing material 16 Discharge device 21 Support body 22 Absorbing member 22a Convex part 23 Temperature controller 24 Height movement stage

JP 2012-007140 A JP 2011-198826 A JP 2010-284801 A JP 2007-063022 A Japanese Patent No. 4941719

Claims (10)

A drawing pattern forming method of drawing a drawing material containing fine particles and a dispersion on a substrate and forming a drawing pattern made of the fine particles on the substrate,
A first step of drawing the drawing material on the substrate previously cooled to below the melting point of the dispersion;
A second step of bringing the absorbing member cooled in advance to a temperature lower than the melting point of the dispersion into contact with the drawing material drawn on the substrate;
And a third step of separating the absorbing member from the substrate after the temperature of the absorbing member is raised to the melting point of the dispersion or higher and the dispersion is absorbed by the absorbing member. A drawing pattern forming method.   The temperature of the substrate and the absorbing member in the first step and the second step is in a range from less than the melting point of the dispersion to a temperature lower by 10 ° C. than the melting point. The drawing pattern formation method of description.   The drawing pattern forming method according to claim 1, wherein the absorbing member is made of a material having fine voids, and allows the dispersion liquid to pass therethrough but does not allow the fine particles to pass therethrough.   The drawing pattern forming method according to claim 1, wherein the absorbing member absorbs the dispersion while pressurizing the drawing material.   5. The drawing pattern forming method according to claim 1, wherein the absorbing member in the third step is vacuum degassed in advance.   The drawing pattern forming method according to claim 1, wherein in the third step, the temperature of the absorbing member is higher than that of the substrate.   The drawing according to any one of claims 1 to 6, wherein the second step and the third step are performed after the drawing material is overwritten in a plurality of layers in the first step. Pattern forming method.   The drawing pattern forming method according to claim 1, wherein the first step and the second step are performed in a low humidity environment.   The drawing pattern forming method according to claim 1, further comprising a step of evaporating the dispersion liquid absorbed by the absorbing member.   The drawing pattern forming method according to claim 9, wherein the absorbing member that has absorbed the dispersion is heated.