JP2014170878A - Drawing pattern forming method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To shorten the evaporation time of ink dispersion fluid, improve production efficiency, and reduce cost.SOLUTION: As shown in Figure 1a), ink 14 made of nano-metal particles 12 and tetradecane dispersion fluid 13 is drawn on a polyimide film substrate 11 by an ink jet head. Then, as shown in Figures 1b) and c), an absorption member 15 made of silicone rubber is moved toward the substrate 11, and the absorption member 15 is made to come in contact with the ink 14. At this time, at the moment of contact, the dispersion fluid 13 of the ink 14 is absorbed in and dispersed to the absorption member 15 (part indicated by a code 10 in the figure). Because the silicone rubber forms a molecular structure, the nano-metal particles cannot penetrate between molecules. In addition, because the silicone rubber has large surface tension, it has low wettability, and when the absorption member 15 is broken away from the substrate, the nano-metal particles 12 can be kept behind on the substrate 11.

Description

  The present invention relates to a drawing pattern forming method in which a drawing material containing fine particles and a dispersion liquid is drawn from a discharge means to draw a pattern.

  Conventionally, wiring of an electric circuit has been formed by a replication technique including a plating and etching process using a mask. These processes require at least a plating process, mask production, photolithography, etching, cleaning, and drying processes. Because of the large number of processes, it is difficult to meet the needs of today's small variety of customers. It has become. As a technique replacing these conventional techniques, a technique capable of drawing at any time by an ink jet method using a metal nanoparticle material is expected and developed. However, in the ink jet method, it is necessary to use a low-viscosity ink in which metal nanoparticles are diluted thinly with a dispersion liquid, so that wetting and spreading, coffee stain phenomenon (= film thickness non-uniformity), bulge effect (= liquid There is a problem that electrical characteristics deteriorate due to occurrence of cracks or the like in which droplets spread unevenly). Further, it is necessary to dry the dispersion, and the drying time is a factor that hinders productivity improvement or cost reduction. Usually, when manufacturing a wiring board with metal nanoparticles, after drawing ink on the board, the dispersion is evaporated and the remaining particles are baked to form the wiring.

  Here, the application of image formation will be briefly described for comparison. In the image forming application, the recording medium is usually a material such as paper into which the liquid permeates, and the ink solvent or dispersion is absorbed by the paper, and the dye component remains on the paper surface. Thereafter, the dispersion liquid is dried from the ink surface or the recording paper back surface. Even in the use of a non-penetrating substrate such as OHP paper, the surface of the OHP paper is subjected to a surface treatment so as to penetrate a dispersion called a receiving layer, and the dispersion is dried through the surface treatment.

  However, in the production of a wiring board or the like on which metal nanoparticles are drawn by a method such as inkjet, the board is made of an ink non-penetrating material. Therefore, the ink immediately after drawing is in an undried state, and it is necessary to evaporate the dispersion for drying. In order to evaporate and dry the dispersion earlier, it is common to heat dry. However, if the temperature is raised above the boiling point of the dispersion, voids and cracks are generated between the dried particles, and the electrical characteristics are lowered, so that heating and drying at the boiling point or less are unavoidable. When a dispersion having a low boiling point is used, it is rarely used because the ink jet nozzle side is dried immediately and metal nanoparticles are deposited on the nozzle and affect drawing. When the heating temperature is high, there is a problem that mist is generated because the droplets are dried before landing. In addition, since the temperature of the nozzle portion is relatively low, the vaporized dispersion liquid is condensed on the nozzle, which adversely affects the flight speed and direction. Therefore, an appropriate temperature that does not affect the ink ejection is required, and as a result, there is a problem that the drying time becomes a long time of 5 to 10 minutes. Prolonged drying time does not increase production efficiency, and it is difficult to realize cost reduction.

  Patent Document 1 discloses an ink composition in which a desiccant is added to ink when a metal wiring is repeatedly formed to form a metal wiring. Thus, it is described that the drying rate can be adjusted to prevent cracks in the metal wiring and to improve the uniformity of the line width. However, it does not shorten the drying rate and increase the production efficiency.

  In Patent Document 2, irradiation with laser light immediately after landing of ink containing metal nanoparticles and / or metal oxide nanoparticles having different shapes causes a mixture of fine particles and enlarged particles. A circuit board manufacturing method is disclosed. Thus, it is described that a low resistance and fine wiring pattern is obtained. However, this method is not a solution for shortening the drying time because the dispersion is prevented from being dried as much as possible.

Patent Document 3 discloses the composition of the coating liquid for the receiving layer in the case where an ink receiving layer is provided on the substrate to form a conductive pattern. Thus, it is described that the adhesion between the conductive pattern and the substrate can be improved. However, it takes time to produce the receiving layer on the substrate each time, and the drying time is not shortened.
Although there is a method of absorbing the dispersion liquid in advance on a substrate having a receiving layer, this method is effective for forming only one layer of wiring pattern, but is not suitable for multilayering of wiring patterns.

  Moreover, although it is not a pattern formation method by drawing, in patent document 4, the pattern was expressed using the method of adjusting the bridge | crosslinking state of a silicone composition and controlling the permeation | transmission state of a dispersion liquid and a fine particle. A method is disclosed in which a permeable membrane made of a silicone composition is prepared, a metal nanoparticle solution is oozed from the permeable membrane, and a pattern is transferred onto a substrate. However, even in this method, no proposal for shortening the drying time has been made.

As described above, in order to prevent cracks in the drawing pattern forming method in which ink in which fine particles such as metal nanoparticles are dispersed in a dispersion is drawn on a substrate and the dispersion is evaporated to form a pattern, In order to make the line width uniform, proposals have been made to improve the adhesion of the wiring pattern when improved ink or a receiving layer is provided on the substrate side. There is no suggestion of how to shorten it.
A problem to be solved by the present invention is a drawing pattern forming method in which a drawing material containing fine particles and a dispersion liquid is drawn from a discharge means such as an ink jet head to form a pattern, and the discharge characteristics are adversely affected. An object of the present invention is to provide a drawing pattern forming method capable of shortening the drying time of the dispersion liquid and reducing the cost without giving any.

  In order to solve the above-described problems, the present invention absorbs a dispersion by drawing a drawing material containing fine particles and a dispersion on a substrate and bringing an absorbing member that absorbs the dispersion into contact with the drawing material. And a step of leaving fine particles on the substrate.

  According to the drawing pattern forming method of the present invention, since the absorbing member that absorbs the dispersion is brought into contact with the drawing material on the substrate to absorb the dispersion, the drying time for evaporating the dispersion can be greatly shortened. Production efficiency can be improved.

It is a schematic sectional drawing which shows the drawing pattern formation method of the 1st Embodiment of this invention. It is a schematic sectional drawing which shows the drawing pattern formation method of the 2nd Embodiment of this invention. It is a schematic sectional drawing which shows the drawing pattern formation method of the 3rd Embodiment of this invention. It is a schematic sectional drawing which shows the dispersion liquid absorption process in the drawing pattern formation method of the 4th Embodiment of this invention. It is a schematic sectional drawing which shows the dispersion liquid absorption process in the drawing pattern formation method of the 5th Embodiment of this invention.

  The drawing pattern forming method of the present invention comprises a step of drawing a drawing material containing fine particles and a dispersion liquid on a substrate, and an absorbing member that absorbs the dispersion liquid is brought into contact with the drawing material to absorb the dispersion liquid. And a step of leaving fine particles on the top.

  Embodiments of the present invention will be described below with reference to the drawings. It should be noted that the present invention is not limited to the embodiments of the examples shown below, and other embodiments, additions, modifications, deletions, and the like can be changed within a range that can be conceived by those skilled in the art. Any aspect is included in the scope of the present invention as long as the operations and effects of the present invention are exhibited.

(First embodiment)
A first embodiment of a drawing pattern forming method of the present invention will be described with reference to FIG. FIG. 1 is a schematic cross-sectional view of the drawing pattern forming method of this embodiment.
In the present embodiment, conductive nanometal particles 12 are used as fine particles, and a drawing material (ink 14) containing the nanometal particles 12 and the dispersion 13 is drawn from an inkjet head to draw on the substrate 11, and then In this method, the absorbent member 15 is brought into contact with the drawing portion so that only the dispersion liquid 13 is absorbed by the absorbent member 15, and then the absorbent member 15 is peeled off and only the fine particles remain on the substrate 11. In addition, the absorbing member 15 uses a material that absorbs the dispersion liquid 13 and does not absorb the nanometal particles 12.

First, as shown in FIG. 1a), the ink 14 is drawn on the substrate 11 (100 mm square) with an inkjet head (not shown). The ink particle size upon landing is about 50 μm and the height is about 10 μm.
A polyimide film (manufactured by Ube Industries) is used for the substrate 11.
The ink 14 is composed of nanometal particles 12 and a dispersion 13. Here, NSP-J made by Harima Chemicals is used. This is mainly composed of 65 wt% of nano silver particles (average particle size 12 nm) as nano metal particles 12 and tetradecane (boiling point 254 ° C., melting point 5.9 ° C., SP value 7.7) as dispersion 13. is there.

  Next, as shown in FIGS. 1 b) and c), the absorbing member 15 is moved toward the substrate 11 to bring the absorbing member 15 into contact with the ink 14. At this time, the dispersion 13 of the ink 14 is absorbed and diffused into the absorbing member 15 at the moment of contact (portion indicated by reference numeral 10 in the figure). Silicone rubber (Shin-Etsu silicone silicone rubber, SP maximum value 8, thickness 1 mm) is used for the absorbing member 15. The reason for using silicone rubber is that the SP value (solubility parameter) of tetradecane is close to the value. It is known that when the SP value is close, the swelling speed and amount of the silicone rubber increase. Further, since the silicone rubber has a molecular structure, the dispersion liquid is allowed to pass therethrough, but the nanometal particles 12 cannot enter between the molecules. Further, since the silicone rubber has a high surface tension, the wettability with the nanometal particles 12 is low, so that the nanometal particles 12 can remain on the substrate 11 when the absorbing member 15 is peeled from the substrate.

The absorbing member 15 approaches the substrate 11 at an arbitrary speed, but the speed is lower than the speed at which the absorbing member 15 absorbs the dispersion liquid 13. Since the speed at which the absorbing member 15 absorbs the dispersion liquid 13 is also the diffusion speed of the dispersion liquid 13, the ink 14 spreads sideways when approaching the substrate 11 faster than this speed. In order to avoid lateral spread, it is necessary to bring the absorbing member 15 closer to the substrate 11 at a moving speed slower than the diffusion speed of the dispersion liquid 13. That is, it is necessary that the speed is lower than the speed at which the silicone rubber absorbs the tetradecane that is the dispersion 13. In this embodiment, the moving speed of the absorbing member 15 to the substrate is 10 μm / sec. At this speed, the dispersion liquid 13 can be absorbed without spreading the ink 14.
The speed at which the absorbing member 15 absorbs the ink 14 depends on the distance that the fixed amount of ink 14 is dripped into the absorbing member 15 and the time that the ink 13 is immersed and the time from when the dispersion 13 is dripped until the absorption is completed. And calculated from

  Next, as shown in FIG. 1 d), the absorbing member 15 is pressed against the ink 14. The dispersion 13 is absorbed while being pressurized. The density of the pattern made of the nanometal particles 12 can be increased, and generation of pattern voids and cracks can be suppressed.

  Next, as shown in FIG. 1 e), after the dispersion member 13 is absorbed by the absorbing member 15, the absorbing member is peeled off from the substrate 11, and only the nanometal particles 12 remain on the substrate 11. The time from when the absorbing member 15 is brought into contact with the ink 14 until it is peeled off is about 2 to 10 seconds.

As the substrate 11, a polyimide film is used, but any material that does not allow the dispersion liquid to permeate may be used. Examples thereof include a polymer resin substrate, a ceramic substrate, a semiconductor silicon substrate, a metal substrate, and a glass substrate. . Examples of the polymer resin substrate include polyimide resin, phenol resin, melamine resin, polyolefin resin, polyamide resin, polyester resin, acrylic resin, acetal resin, polyether sulfone resin, cellulose resin, polyethylene terephthalate resin, polycarbonate resin, and the like. Can do.
Examples of the ceramic substrate include silicon carbide, silicon nitride, aluminum nitride, zirconium boride, aluminum titanate, silica, and alumina.

  Although tetradecane is used as the dispersion 13, it is sufficient that the nanometal particles 12 are dispersed, and the SP value of the dispersion 13 is desirably a value close to the SP value of the absorbing member. As the dispersion 13, in addition to tetradecane, as long as it is an organic solvent system, cyclohexane, carbon tetrachloride, toluene, benzene, methyl ethyl ketone, ethanol, acetone, acetonitrile, aniline, benzonitrile, butanol, chlorobenzene, chloroform, cyclohexane, dimethylformamide , Ether, isopropanol, methanol, nitrobenzene, pentane, phenol, propanol, α-terpineol, toluene, benzene, heptane, hexane, and octane. Preferred are toluene, hexane, octane, α-terpineol and the like. The dispersion may be water. Dispersions are mainly water-based, organic solvent-based, and alcohol-based, and their sizes are on the order of angstroms (0.1 nanometers).

With a fine particle, a fine particle shows a particle | grain of nanometer order. For example, particles having an average particle size of 100 nm or less are shown. Considering ease of low-temperature firing of fine particles and ink jetting, the practical range is 5 to 20 nm. In this embodiment, nano silver particles having an average particle diameter of 12 nm are used. However, as the nano metal particles 12 for forming a conductive pattern, not only nano silver particles but also nano gold particles, nano platinum particles, and nano aluminum. Particles, nano tungsten particles, nano copper particles, and the like can be used.
Further, not only conductive fine particles but also nonconductive fine particles can be used in the present invention. Examples thereof include fine particles such as inorganic pigments, organic pigments, and ceramics. Examples of inorganic pigments include titanium dioxide, zinc oxide, iron oxide, chromium oxide, iron black, and cobalt blue. Examples of organic pigments include azo pigments and phthalocyanine pigments. Examples of ceramics include alumina and zirconia.

The absorbing member 15 is made of a material that absorbs the dispersion liquid 13. In this embodiment, silicone rubber is used as the material. A rubber system having a high degree of swelling is desirable, and natural rubber, other polymers, organic polymer porous bodies, and the like can also be used. Examples of the organic polymer porous material include a polyester porous material, a polycarbonate porous material, and a polyurethane porous material.
If it is a water-based solvent, the absorbent member may be a polymer absorbent polymer having a high water absorption rate such as used in paper diapers, for example, polyacrylates such as sodium polyacrylate, starch-polyacrylonitrile hydrolysate Starch-polyacrylonitrile acetic acid cross-linked product, cross-linked carboxymethyl cellulose, vinyl acetate-methyl acrylate copolymer saponified product and the like are desirable.
The thickness of the absorbing member 15 is not limited to the thickness of the present embodiment, and can be appropriately selected depending on the type of the absorbing member 15, the type of the dispersion liquid 13, the patterning shape, and the like.

  The absorbent member 15 desirably has a solubility parameter (SP value) close to that of the dispersion 13. It is desirable to approximate the solubility parameter of the dispersion 13 within a range of ± 2 or even within a range of ± 1. When the SP value of the absorbent member 15 is close to the SP value of the dispersion 13, the swelling speed and amount of the dispersion 13 into the absorbent member 15 increase. In the case of silicone rubber (near SP value 8), n-octane, cyclohexane, carbon tetrachloride, toluene, benzene and the like as dispersion 13 are desirable because of their approximate SP values.

  The voids of the absorbing member 15 are sized so as to allow the dispersion liquid to pass therethrough but not allow fine particles to pass therethrough. The size of the gap of the silicone rubber used in this embodiment is statistically 2 nm or less. As the size of the gap of the absorbing member, for example, in the case of an organic polymer, a range of 100 nm or less is desirable and a range of 5 nm or less is more desirable because of the size of the fine particles. In the case of organic polymers, this size is determined by the size of the network of the crosslinked structure. The size of the network can be controlled by adjusting the molecular weight or structure of the monomer, the crosslinked structure, or the degree of polymerization. Furthermore, it is also possible to obtain a desired solubility parameter and swelling degree by performing control based on the crosslinked structure as described above. Although the fine particles are on the order of nanometers, the size of the dispersion liquid 13 is on the order of angstroms (0.1 nanometers). Therefore, the dispersion liquid 13 can be separated using the difference in size. Is possible.

  The absorbent member 15 desirably has a high surface tension in order to reduce the wettability with the fine particles to facilitate the peeling of the absorbent member 15 from the substrate 11 and to leave only the fine particles satisfactorily. The surface tension of the absorbing member 15 is preferably larger than the substrate.

  According to the present embodiment, unlike the conventional method, the absorbing member 15 is brought into contact with the ink 14 and absorbed, instead of the method of evaporating and drying the dispersion directly from the ink 14 using a heating mechanism or the like. The manufacturing time can be shortened by the time for evaporating the dispersion 13, the production efficiency can be increased, and the cost can be reduced.

Since the substrate 11 is not heated for a long time above the boiling point of the dispersion 13, there is no problem that voids and cracks occur between the particles after drying and the electrical characteristics are deteriorated, and the film quality of the pattern is uniform. In addition, the definition of the pattern can be increased.
In addition, conventionally, when the low boiling point dispersion 13 is used in order to avoid heating for a long time, there is a problem in that the ink jet nozzle side is dried immediately, and metal nanoparticles are deposited on the nozzle, thereby adversely affecting drawing. According to the present invention, since such a problem does not occur, it is also possible to use a low boiling point dispersion.

  Further, when the heating temperature of the substrate 11 is high, mist is generated because the droplets are dried before landing, and the vaporized dispersion liquid 13 is condensed on the nozzles, which adversely affects the flight speed and direction. Although there was a problem, according to the present invention, since it is not necessary to raise the heating temperature of the substrate 11 to the boiling point, good ink ejection characteristics can be obtained.

(Second Embodiment)
Next, a second embodiment of the drawing pattern forming method of the present invention will be described with reference to FIG. FIG. 2 shows a schematic cross-sectional view of the drawing pattern forming method of the present embodiment.
In addition to the method of the first embodiment, the drawing pattern forming method of the present embodiment uses the absorbing member 25 having a different shape, and the step of heating the substrate 11 and the heater 28 provided above the absorbing member 25. This includes a step of heating the absorbing member 25.

The apparatus used in the present embodiment includes a fixed base 30 having a temperature adjustment function, an absorption member 25, and a heater 28 that heats the absorption member. The same elements as those in the first embodiment will be described with the same reference numerals.
As shown in FIG. 2a), the substrate 11 is provided on a fixed base 30 having a temperature adjustment function. A pipe 29 is provided inside the fixed base 30, and the temperature of the substrate 11 is adjusted by circulating a temperature-controlled liquid medium inside the pipe 29.

As the material of the absorbing member 25, the same silicone rubber (Shin-Etsu silicone silicone rubber, SP maximum value 8) as in the first embodiment can be used. A cylindrical protrusion 26 is formed on the surface opposite to the side in contact with the ink 14. The thickness of the absorbing member 25 is 2 mm, the diameter of the cylinder is 0.3 mm, the height is 1 mm, and the pitch is 0.5 mm. The surface area on the side opposite to the side in contact with the ink 14 is larger than the surface area on the side in contact with the ink 14.
The absorbing member 25 is supported by the support body 27. The support 27 has a function of performing position control between the absorbing member 25 and the substrate 11 by position control means (not shown).

  The heater 28 is installed above the absorption member 25 so as to face the absorption member 25. The heater 28 has a size of 150 mm square and uses a mechanism that generates warm air by heating an electric heater. The heater 28 heats the surface of the absorbing member 25 opposite to the side in contact with the ink 14 to promote the evaporation of the dispersion 13 absorbed by the absorbing member 25.

Next, a method for forming a drawing pattern according to this embodiment will be described.
As shown in FIG. 2 a), the temperature of the fixing base 30 is set to a temperature lower than the boiling point of the dispersion liquid (tetradecane) 13. A high temperature that does not affect drawing with an ink jet or the like is desirable. In this case, the temperature is set to 50 ° C. The purpose of this is to evaporate the dispersion 13 to slightly increase the ink concentration and to reduce the viscosity. Further, warm air of 200 ° C. is generated from the heater 28, and the absorbing member 25 is heated to promote evaporation of the dispersion liquid 13. After drawing a wiring pattern on the substrate 11 by an inkjet head or the like (not shown), the fixing base 30 is moved to the lower part of the absorbing member 25.

  Next, as shown in FIG. 2 b), the absorbing member 25 is lowered by the support 27 to bring the absorbing member 25 into contact with the ink 14. Further, the ink 14 is lowered at a speed (10 μm / sec) that does not spread horizontally. During this time, warm air is generated from the heater 28.

  Next, as shown in FIG. 3 c), only the dispersion liquid 13 is absorbed by the absorbing member 25, and then the absorbing member 25 is raised to leave only the nanometal particles 12 on the substrate 11. The dispersion member 13 is further evaporated by the heater 28 in the absorbing member 25. The absorbing member 25 obtained by evaporating the dispersion 13 can be used again.

  The absorbing member 25 of this embodiment is provided with a columnar protrusion 26 on the surface opposite to the side in contact with the ink 14, and the surface area opposite to the side in contact with the ink 14 is on the side in contact with the ink 14. It has a shape larger than the surface area. By increasing the surface area, the effect of evaporating and drying the dispersion 13 absorbed by the absorbing member 25 can be obtained.

  Further, the ink 14 is drawn in a state in which the temperature of the substrate 11 is adjusted to 50 ° C., which is equal to or higher than the melting point of tetradecane as the dispersion 13 and lower than the boiling point. Therefore, there is no problem that mist is generated before the ink 14 is landed, which occurs when the temperature of the substrate 11 is higher than the boiling point, and the vaporized dispersion liquid 13 is condensed on the nozzles. Can be obtained.

  Further, the temperature of the absorbing member 25 is maintained at 200 ° C., which is higher than the melting point of tetradecane as the dispersion 13 and lower than the boiling point, and is brought into contact with the ink 14 on the substrate 11. It is possible to prevent occurrence, obtain a good film quality, and obtain good electrical characteristics.

  Furthermore, since the absorption member 25 that has absorbed the dispersion 13 is heated, the evaporation of the dispersion 13 can be promoted, and the drying time can be shortened.

(Third embodiment)
Next, a third embodiment of the drawing pattern forming method of the present invention will be described with reference to FIG. FIG. 3 is a schematic cross-sectional view of the drawing pattern forming method of the present embodiment.
The drawing pattern forming method of the present embodiment includes the step of heating the substrate 11, the step of heating the substrate 11, the use of the absorbing member 25 having protrusions, and the step of heating the absorbing member 25 with the heater 28. The inclusion is similar. This embodiment further includes a step of pressurizing the absorbing member with the pressurizing machine 31, and is a mode in which the drying time of the dispersion is further shortened by using the two absorbing members 25 and the absorbing member 35 that absorb the dispersion.

  The apparatus used in the present embodiment includes a fixing base 30 having a temperature adjusting function, absorbing members 25 and 35, a pressurizer 31, a heating device that heats the absorbing members 25 and 35, a fixing table 30, and a heating device. It is comprised with the conveyance means which enables an absorption member to move between. In addition, a heating apparatus is provided with the two heaters 28 which oppose, as shown in FIG.3 (f).

  As in the second embodiment, a pipe 29 is provided inside the fixed base 30, and the temperature of the substrate 11 is adjusted by circulating a temperature-controlled liquid medium inside the pipe 29.

As in the second embodiment, the absorbing members 25 and 35 are formed with cylindrical protrusions 26 and 36 on the surface opposite to the side in contact with the ink 14, respectively. The thickness of the absorbing members 25 and 35 is 2 mm, the diameter of the cylinder is 0.3 mm, the height is 1 mm, and the pitch is 0.5 mm. The surface area on the side opposite to the side in contact with the ink 14 is larger than the surface area on the side in contact with the ink 14.
As shown in FIGS. 3 a) and b), the support 27 controls the position of the absorbing member 25 and the substrate 11 by a position control means (not shown) and can move between the heating devices. In addition, a conveying means (not shown) is also provided. Similarly, as shown in FIGS. 3d) and e), the support 37 also controls the position of the absorbing member 35 and the substrate 11 and can move between the heating device and the transporting means ( (Not shown).

  As shown in FIG. 3f), the heating device is installed separately from the fixed base 30, and includes two heaters 28 facing each other, and the upper part of the absorbing member 25 or 35 that has absorbed the conveyed dispersion 13 and It is possible to heat from both directions of the lower part. The heater 28 has a size of 150 mm square, and uses a mechanism that generates warm air by heating with an electric heater.

  The pressurizer 31 is provided on the upper portion of the absorbing member 25. The pressurizer 31 includes a position control means (not shown), and has a function of controlling the position with the substrate 11 via the absorbing member 25 and controlling the pressure on the substrate 11.

Next, a method for forming a drawing pattern according to this embodiment will be described.
As shown in FIG. 3 a), the temperature of the fixing base 30 is set to a temperature lower than the boiling point of the dispersion liquid (tetradecane) 13. In the drawing section (not shown), after the wiring pattern is drawn on the substrate 11 by an inkjet head or the like, the fixed base 30 is moved to the lower part of the absorbing member 25. A high temperature that does not affect drawing with an ink jet or the like is desirable. In this case, the temperature is set to 50 ° C. This has the purpose of evaporating the dispersion 13 to increase the concentration of the ink 14 and lowering the viscosity.

  Next, as shown in FIG. 3b), the pressurizer 31 is lowered. At the same time, the absorbing member 25 is pressurized by the pressurizer 31 and comes into contact with the ink 14. From the point of contact with the ink 14, the ink is lowered at a speed of 10 μm / sec and pressurized in the range of 0.1 MPa to 1 MPa for 2 seconds. Note that the support member 27 does not need to be moved because the absorbing member 25 is a silicone rubber having contractibility.

  Next, as shown in FIG. 3c), only the dispersion liquid 13 is absorbed by the absorption member 25, and then the pressurizer 31 is raised and the absorption member 25 is raised simultaneously, leaving only the nanometal particles 12 on the substrate 11. .

  Next, the fixed base 30 is moved to the drawing apparatus, and the ink 14 is drawn over the nanometal particles 12 remaining on the substrate 11 by the drawing apparatus. Thereafter, as shown in FIG. 3D), the fixing base 30 is returned to the apparatus used in this embodiment, and a new absorbing member 35 is disposed on the ink 14 on the substrate 11. During this time, as shown in FIG. 3f), the absorbing member 25 is conveyed between the two heaters 28 of the heating device by the conveying means provided in the support 27, and generates 200 ° C. warm air from the heater 28 to produce the dispersion liquid. 13 is evaporated.

  Next, as shown in FIG. 3e), the pressurizer 31 is lowered under the same conditions as when the first absorbing member 25 is brought into contact, and the absorbing member 35 and the ink 14 are brought into contact with each other. At the same time when the pressurizer 31 is lowered, the absorbing member 35 is also lowered. The absorbing member 35 contacts the ink 14 and absorbs the dispersion liquid 13. Thereafter, the pressurizer 31 is raised. On the substrate 11, the nanometal particles 12 by the second drawing remain on the nanometal particles 12 by the first drawing, and a pattern comprising the nanometal particles 12 by the first drawing and the nanometal particles 12 by the second drawing is formed. Remains.

  Next, as shown in FIG. 3g), the absorbing member 35 is conveyed to the heating device by the conveying means provided in the support 37 and heated by the heater 28 to evaporate the dispersion liquid 13. At this time, the first absorbing member 25 is transported again onto the substrate 11 and absorbs the newly drawn dispersion liquid 13 of the ink 14.

In the present embodiment, the second drawing is described on the case where the drawing is performed on the nanometal particles 12 left in the first time. As a result, the method of providing the dispersion-receiving layer on the substrate as proposed in the prior art cannot be applied to overcoating, but according to the drawing pattern forming method of the present invention, the member that absorbs the dispersion 13 Is not provided on the substrate 11, which is an effective method when a thick film is required as in a wiring pattern.
In the present embodiment, the two absorbing members 25 and 35 are used alternately, and when one of them is a heating device and the dispersion 13 is evaporated, the other is used for absorption of the dispersion 13. It is possible to further shorten the drying time. Furthermore, in the case where the drawing is performed a plurality of times, the number of absorbing members is not limited to two, and three or more absorbing members may be used.

(Fourth embodiment)
Next, a fourth embodiment of the drawing pattern forming method of the present invention will be described with reference to FIG. FIG. 4 shows a schematic cross-sectional view of the dispersion absorbing step in the drawing pattern forming method of the present embodiment.
The drawing pattern forming method of the present embodiment is a method of absorbing the dispersion 13 while applying pressure by rotating a pressure roller on the absorbing member 45.

  The apparatus used in this embodiment includes a fixed base 30 having a temperature adjustment function, an absorption member 45 supported by a support body 47, a pressure roller 41, and a heater 48 for heating the absorption member 45. is there.

  As in the second embodiment, a pipe 29 is provided inside the fixed base 30, and the temperature of the substrate 11 is adjusted by circulating a temperature-controlled liquid medium inside the pipe 29. The substrate 11 is set to 50 ° C.

  As the absorbing member 45, the same silicone rubber (Shin-Etsu silicone silicone rubber, SP maximum value 8, thickness 1 mm) as in the first embodiment can be used. The absorbing member 45 is supported by a support body 47. The support 47 is controlled by a position control means (not shown) such that the position of the absorbing member 45 and the substrate 11 is controlled, and that the supporting body 47 can be moved up and down so as to be in contact with the absorbing member 45. As the ink 14, the same ink as in the first embodiment is used.

  The pressure roller 41 is disposed above the absorption member 45, moves while rotating from the right side to the left side of the paper, and pressurizes the absorption member 45.

  The heater 48 has a mechanism for generating warm air by heating the electric heater 48. For example, the size of the heater can be 50 mm wide and 150 mm deep.

The drawing pattern forming method of this embodiment will be described below.
The substrate 11 is placed on the temperature-adjusted fixed base 30, and a drawing pattern is drawn on the ink 14 by an inkjet head or the like in a drawing unit (not shown). Thereafter, as shown in FIG. 4, the fixing base 30 is moved to the lower part of the absorbing member 45 supported by the support body 47. The support 47 controls the position of the absorbing member 45 and the substrate 11 by position control means (not shown), and moves the absorbing member 45 to a position just before contact with the ink 14. The pressure roller 41 rotates and moves from the right side to the left side while pressing the upper part of the absorbing member 45 with a pressure of 0.05 MPa. The pressure of the pressure roller is preferably in the range of 0.01 MPa to 1 MPa. The absorbing member 45 contacts the ink 14 while being pressurized, and absorbs the dispersion liquid 13. The nanometal particles 12 remain on the substrate 11.

  At the same time, the heater 48 moves the upper part of the absorbing member 45 from the right side to the left side of the paper, while evaporating the dispersion 13 absorbed by the absorbing member 45, while emitting hot air of 200 ° C. Let The temperature and moving speed of the heater 48 can be set according to the type of the dispersion liquid 13.

  In the case of the present embodiment, the size of the heater 48 does not have to be the same size as the substrate 11 and can be reduced in size, so that the cost can be reduced. In addition, since a highly accurate positioning mechanism for the support 47 is not required, the apparatus can be simplified.

(Fifth embodiment)
Next, a fifth embodiment of the drawing pattern forming method of the present invention will be described with reference to FIG. FIG. 5 shows a schematic sectional view of the dispersion absorbing step in the drawing pattern forming method of the present embodiment.
The drawing pattern forming method of the present embodiment includes a step of absorbing the dispersion 13 using the absorbing member 55 integrated with the pressure roller, and a step of heating the absorbing member 55 with the heater 58.

As shown in FIG. 5, the apparatus used in this embodiment includes a fixed base 30 having a temperature adjustment function, an absorption member 55 integrated with a pressure roller, and a heater 58 that heats the absorption member 55. The
As in the second embodiment, a pipe 29 is provided inside the fixed base 30, and the temperature of the substrate 11 is adjusted by circulating a temperature-controlled liquid medium inside the pipe 29. The substrate 11 is set to 50 ° C. As the ink 14, the same ink as in the first embodiment is used.

  The absorbing member 55 has a structure in which silicone rubber is bonded to a columnar or cylindrical support. The absorbing member 55 moves while rotating on the substrate 11 and absorbs the dispersion 13 of the ink 14. The absorbing member 55 absorbs the dispersion liquid 13 and also has a pressurizing function, and rotates and moves while pressurizing the ink 14 drawn on the substrate 11.

  The heater 58 has a mechanism that generates warm air by heating the electric heater. For example, the heater 58 can have a width of 50 mm and a depth of 150 mm. The heater 58 is disposed behind the rotating absorption member 55 and moves in conjunction with the movement of the absorption member 55.

  A drawing pattern forming method of this embodiment will be described. As shown in FIG. 5, the substrate 11 is placed on the temperature-adjusted fixing base 30 and ink 14 is ejected by an ink jet head or the like to draw a drawing pattern. Thereafter, the absorbing member 55 moves while rotating on the substrate 11 and absorbs the dispersion liquid 13. The moving speed of the absorbing member 55 is preferably 10 mm / sec, and the pressure is preferably in the range of 0.01 MPa to 1 MPa. The nanometal particles 12 remain on the substrate 11.

  At the same time, the heater 58 moves in conjunction with the movement of the absorbing member 55. The portion of the absorbing member 55 that has absorbed the dispersion liquid moves from the right side surface to the upper right side by rotation. During this time, the absorbing member 55 is heated by hot air of 200 ° C. from the heater 58, and the dispersion 13 is evaporated. The portion where the dispersion liquid is evaporated by the heater 58 absorbs the dispersion liquid 13 of the ink 14 drawn forward in the moving direction again by rotation. The temperature and installation position of the heater 58 can be set according to the type of the dispersion liquid 13.

The absorbing member 55 has a belt-like structure, and unused areas are sequentially arranged on the upper part of the drawing material by the conveying means.
Although this embodiment requires time for the absorbing member 55 to rotate, there is an advantage that a drawing pattern can be formed at a low cost because a large-scale mechanism such as a conveying means is not required.

DESCRIPTION OF SYMBOLS 10 Part where dispersion liquid was absorbed 11 Substrate 12 Nano metal particle 13 Dispersion liquid 14 Drawing material 15, 25, 35, 45, 55 Absorbing member 26 Protrusion 27, 37, 47 Support body 28, 48, 58 Heater 29 Piping 30 Fixed Stand 31, 41 Pressurizer

JP 2012-007140 A JP 2011-198826 A JP 2010-284801 A JP 2007-62302 A

Claims (10)

Drawing a drawing material containing fine particles and a dispersion on a substrate;
A drawing pattern forming method comprising: bringing an absorbing member that absorbs the dispersion into contact with the drawing material to absorb the dispersion and leaving the fine particles on the substrate. The drawing pattern forming method according to claim 1, wherein the absorbing member is made of a material having fine voids, and allows the dispersion liquid to pass therethrough but does not allow the fine particles to pass therethrough.
Ru   The drawing pattern forming method according to claim 1, wherein the absorbing member absorbs the dispersion while pressurizing the drawing material.   4. The absorption member according to claim 1, wherein the absorption member absorbs the dispersion liquid by moving from the drawing surface to the substrate side at a speed equal to or less than a speed at which the absorption member absorbs the dispersion liquid. 5. Drawing pattern forming method.   The drawing pattern forming method according to claim 1, wherein the absorbing member has a surface area opposite to a side in contact with the drawing material larger than a surface area on the side in contact with the drawing material. .   The drawing pattern forming method according to claim 5, wherein the surface of the absorbing member opposite to the substrate has a shape having a plurality of protrusions.   The drawing pattern forming method according to claim 1, further comprising a step of evaporating the dispersion liquid absorbed by the absorbing member.   The drawing pattern forming method according to claim 7, wherein the absorbing member that has absorbed the dispersion is heated.   The drawing pattern forming method according to claim 1, wherein the temperature of the substrate is not lower than the melting point of the dispersion and lower than the boiling point.   The drawing pattern forming method according to claim 1, wherein a temperature of the absorbing member is maintained at a temperature equal to or higher than a melting point of the dispersion and lower than a boiling point, and is brought into contact with the drawing material on the substrate. .