JP2015015460A - Electronic component module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component module which enables downsizing, space saving, and easy connection and soldering between other electronic components and a lead wire etc. of a piezoelectric element.SOLUTION: An electronic component module includes: a piezoelectric element 12; an electronic component 16 connected with the piezoelectric element 12 through a lead wire; and a case 30 housing other electronic components 17, 18, 19, 20. The case 30 includes: a first partition part 30A that positions and houses the piezoelectric element 12; and a second partition part 30B that positions and houses the electronic components 16, 17, 18, 19, 20. A lead wire locking part, in which the lead wire 14 formed by a tinsel wire and extending from the piezoelectric element is locked, is provided in a connection region 30D of the case 30.

Description

  The present invention relates to an electronic component module in which a piezoelectric element and other electronic components are housed in a case, and more particularly, to a high voltage component module in which the piezoelectric element and other electronic components are arranged and connected in a housing case without using a substrate. .

Conventionally, a piezoelectric transformer component having a structure in which a piezoelectric element is housed in a case and connected to a terminal extending from the case is used. For example, the piezoelectric transformer component is connected to another electronic component on a power supply board of an electronic device. Used (for example, see Patent Document 1).

In the conventional piezoelectric transformer component described in Patent Document 1, when a piezoelectric element is fixed inside a thin case, the width of the flexible case is widened to accommodate the piezoelectric element in the case, and the piezoelectric element is By temporarily fixing between two protrusions facing each other in the case width direction, and filling the adhesive with elastic properties after curing into a plurality of locations that become nodes of vibration of the piezoelectric element in the gap between the case and the case, After fixing the piezoelectric element, the temporary fixing protrusion is separated.

JP 2001-196654 A

However, the conventional piezoelectric transformer component described in Patent Document 1 or the like has a structure in which only a piezoelectric element is accommodated in a case, and is used by being interconnected with other electronic components on a power supply substrate of an electronic device. It needs a lot of space above. In addition, when a high voltage circuit is constituted by a piezoelectric transformer and other electronic components, it is sometimes insufficient in terms of pressure resistance performance, dust resistance, and dust resistance if they are simply connected to each other on a power supply board. Therefore, recently, for example, a high voltage component module in which a high voltage circuit of 3 kV or more is formed as a high voltage pack by a piezoelectric element and other electronic components has been proposed. In such a high voltage component module, for example, a diode or other electronic component is mounted on a printed circuit board, and the printed circuit board is assembled in a case containing a separate piezoelectric element, and the diode or the like is placed on the secondary side of the piezoelectric transformer in the case. After connecting the electronic components of the case, and connecting the case terminal and the lead wire of the piezoelectric element, etc., the resin is filled in the case to improve the pressure resistance performance and the dust tightness so as to increase the safety. I have to.

In recent years, electronic devices themselves have become smaller and thinner, and electronic components and modules used in such electronic devices are required to be further reduced in size and space. However, in a high voltage component module having a structure in which a printed circuit board on which other electronic components are mounted and a piezoelectric element are accommodated in a case, the use of the printed circuit board is inevitable for miniaturization and space saving. In addition, it is troublesome to connect the electronic components on the printed circuit board to the lead wires of the piezoelectric elements and to perform soldering work in the case.
Therefore, it is desired to develop an electronic component module that can be further reduced in size and space-saving and can be easily connected to other electronic components and lead wires of piezoelectric elements and soldered.

An object of the present invention is to provide an electronic component module that can be reduced in size and space-saving and can be easily connected and soldered with other electronic components and lead wires of piezoelectric elements.

As a result of various studies on the structure of an electronic component module that can be further reduced in size and space-saving and has excellent workability in assembly, the present inventor has made piezoelectricity by applying structural ingenuity to various parts of the case. In addition to the elements, other electronic components can be positioned and arranged in the case without using a printed circuit board, and the connection and soldering work between the lead wires of the piezoelectric element and other electronic components can be easily performed in the case. The casing structure of the electronic component module that can be performed has been found.

That is, in order to achieve the above object, an electronic component module of the present invention is a case that accommodates a piezoelectric element, an electronic component that is connected to at least the piezoelectric element via a lead wire, and the piezoelectric element and the electronic component. A case including a first partition portion for positioning and storing the piezoelectric element and a second partition portion for positioning and storing the electronic component, and a lead wire extending from the piezoelectric element is engaged in the case. A lead wire locking portion to be stopped is provided. According to such a configuration, the electronic component can be positioned and accommodated by the second partition portion, so that the electronic component module can be reduced in size and thickness without using a printed circuit board.

In addition to the electronic component connected to the piezoelectric element via the lead wire, the electronic component further includes another electronic component, and the second partition portion is a small compartment that positions and accommodates each electronic component. A plurality of may be formed. According to such a configuration, each electronic component can be positioned and accommodated by the small compartment, so that the electronic component module including two or more electronic components in addition to the piezoelectric element can be reduced in size and thickness without using the printed circuit board. Can be realized.

The small section is preferably formed by a convex part or a concave part formed in the second partition part. According to this configuration, other electronic components can be easily positioned and accommodated in the second partition without using a printed circuit board.

Furthermore, the lead wire locking portion may be provided in a connection region in which the first partition portion and the second partition portion are substantially partitioned. According to such a configuration, since the piezoelectric element and the electronic component can be connected and soldered in a connection region substantially partitioned from the piezoelectric element and the electronic component, the spatial workability is excellent, and the connection and soldering are excellent. Work efficiency can be improved.

Furthermore, the lead wire locking portion may be provided in the second partition portion. According to such a configuration, there is no need to provide a dedicated connection region for the lead wire locking portion, so that the space can be reduced, the case can be downsized, and the electronic component module can be further downsized.

The lead wire extending from the piezoelectric element may be made of a gold thread wire, and the lead wire locking portion may have a structure that prevents the lead wire made of the gold thread wire from being lifted. According to such a configuration, it is very easy to connect and solder the lead wire made of a gold thread wire, and the workability is greatly improved.

Further, the lead wire locking portion may be constituted by a metal terminal. According to this configuration, the reliability of electrical connection between the piezoelectric element and the electronic component can be improved.

According to the present invention, it is possible to provide an electronic component module that can be reduced in size and space-saving and can be easily connected to other electronic components and lead wires of piezoelectric elements and soldered.

(A), (b), (c), (d) is a perspective view which shows the electronic component module to which the 1st Embodiment of this invention was applied, (a), (b) is filled with resin The perspective view seen from the surface side to be performed, (c), (d) is the perspective view seen from the back surface side. (A), (b), (c), (d), (e), (f) are a plan view, a bottom view, and an electronic component module to which the first embodiment of the present invention is applied, respectively. It is a left side view, a right side view, a front view, and a rear view. (A), (b) is the perspective view and top view which show the state which filled the electronic component module shown to Fig.1 (a) and FIG.2 (a), respectively, with resin. 1 is a perspective view showing a case of an electronic component module to which a first embodiment of the present invention is applied. FIG. 2 is a perspective view showing an enlarged main part of the electronic component module according to the first embodiment shown in FIG. 1. FIG. 2 is an enlarged perspective view showing a wiring form of lead wires of a piezoelectric element in the electronic component module of the first embodiment shown in FIG. 1. FIG. 2 is an enlarged perspective view showing a lead wire locking portion of the electronic component module of the first embodiment shown in FIG. 1. It is a perspective view which expands and shows the lead wire latching | locking part of the electronic component module to which the 2nd Embodiment of this invention was applied. It is a perspective view which expands and shows the lead wire latching | locking part of the electronic component module to which the 3rd Embodiment of this invention was applied. It is a perspective view which shows the state which filled the resin to the electronic component module to which the 4th Embodiment of this invention was applied. It is a top view which shows the state which does not fill resin with the electronic component module to which the 4th Embodiment of this invention was applied. In FIG. 11, it is the figure which expanded the lead wire latching | locking part of the 2nd division part.

An electronic component module to which a first embodiment of the present invention is applied will be described in detail with reference to the drawings. 1 (a), (b), (c), and (d) are perspective views showing an electronic component module to which the first embodiment of the present invention is applied, and (a) and (b) are resins. (C), (d) is a perspective view seen from the back side. 2 (a), (b), (c), (d), (e), and (f) are a plan view, a bottom view, a left side view, and a right side view of the electronic component module shown in FIG. It is a front view and a rear view.

The electronic component module 10 of the present embodiment includes the components shown in FIGS. 1 (a), (b), (c), (d) and FIGS. 2 (a), (b), (c), (d), (e), As shown to (f), it has the piezoelectric element 12, the electronic component 16 connected via the piezoelectric element 12 and the lead wire 14, and the case 30 which accommodates the piezoelectric element 12 and the electronic component 16. FIG. The case 30 includes a first partition part 30A for positioning and storing the piezoelectric element 12, and a second partition part 30B for positioning and storing the electronic component 16. In addition to the electronic component 16, the electronic component module 10 of the present embodiment further includes other electronic components 17, 18, 19, and 20, and the second partition portion 30B of the case 30 includes these other components. The electronic components 17, 18, 19, and 20 are also positioned and stored. That is, a small section (see FIG. 4 described later) substantially corresponding to the planar shape of each electronic component 16, 17, 18, 19, 20 is formed at the bottom of the second partition section 30B. Each electronic component 16, 17, 18, 19, 20 is positioned in each small section and is accommodated by being fitted. Thus, in this embodiment, since the electronic components 16, 17, 18, 19, and 20 can be positioned and accommodated by the second partition portion 30B, the electronic component module can be used without using a conventional printed circuit board. 10 can be reduced in size and thickness. That is, the electronic components 16, 17, 18, 19, and 20 can be accommodated in the second partition portion 30B by positioning and fitting into the respective small partitions, so that other than the piezoelectric element 12 without using the printed circuit board. Since the electronic component including the five electronic components 16, 17, 18, 19, and 20 can be formed into a pack, the electronic component module 10 can be easily reduced in size and thickness.

Here, the case 30, the first partition part 30A, and the piezoelectric element 12 housed in the first partition part 30A, the second partition part 30B, and the second partition part 30B of the electronic component module 10 of the present embodiment. The first to fifth electronic components 16, 17, 18, 19, and 20 housed in the device and the connection relationship between these components will be described. First, as shown in FIG. 4, the case 30 is formed in a substantially rectangular box shape having a deformed portion 30 </ b> C at one corner as a whole, along one side surface side (left side surface in FIG. 4). A vertically long (elongated) first partition portion 30A configured to include the deformed portion 30C, and a second rectangular configuration including substantially all other regions and having a larger rectangular shape than the first partition portion 30A. The partition part 30B is provided. In the other corner of the case 30, a connection region 30 </ b> D between the first partition part 30 </ b> A and the second partition part 30 </ b> B is provided. Within the connection region 30D, as will be described later, the lead wires of the piezoelectric element 12 housed in the first partition portion 30A and the lead wires of the electronic component 16 housed in the second partition portion 30B are locked and mutually connected. A connection is made.

Now, as shown in FIGS. 4 and 5, the first partition 30 </ b> A is partitioned into a shape that accommodates the piezoelectric element 12 in a so-called vertical orientation, including the deformed portion 30 </ b> C described above. That is, in the first partition portion 30A, partition walls 30A1 and 30A2 are erected corresponding to the shape of the piezoelectric element 12 accommodated vertically, and the piezoelectric element 12 is simply fitted into the partition walls 30A1 and 30A2. Can be stored. A cutout groove 30A2G for drawing out the lead wire 14L of the piezoelectric element 12 is formed in the partition wall 30A2, and the lead wire 14L of the piezoelectric element 12 is linear in the cutout groove 30A2G toward the connection region 30D. After being pulled out, the lead wire latching portion 40, which will be described later, is latched in the connection region 30D and connected to the lead wire 16L1 of the electronic component 16. The first partition portion 30A is provided with a rib 30A8 at a position corresponding to the vibration node of the piezoelectric element 12. The other lead wire 14L2 of the piezoelectric element 12 is pulled out of the case 30 near the deformed portion 30C and connected to a terminal (not shown) on the back surface of the case 30. As described above, since the piezoelectric element 12 is a piezoelectric transformer of a type that is housed and mounted vertically in the case 30, a space on the plane is required in the case 30 as compared with the case of horizontal placement. However, since it is advantageous in terms of the layout of other electronic components in the case, there is an advantage that it is easy to use when a certain height is allowed.

Next, as shown in FIGS. 4 and 5, the second partition part 30B includes first, second, third, fourth, and fifth electronic components by walls 30B1, 30B2, 30B3, and 30B4, respectively. 16, 17, 18, 19, 20 are roughly divided into small sections 160, 170, 180, 190, and 200, and the small sections 160, 170, 180, 190, and 200 are respectively divided into first and second sections. The third, fourth, and fifth electronic components 16, 17, 18, 19, and 20 can be positioned and stored as shown in FIG. The small section 190 is formed by a rectangular recess that is recessed from the bottom surface of the second partition section 30B, and the fourth electronic component 19 is fitted into the rectangular recess so that the fourth section 19 The electronic component 19 can be positioned and stored. Further, each of the small sections 160, 170, 180, 190, 200 or the walls 30B1, 30B2, 30B3, 30B4, etc. has the first, second, third, fourth, fifth electronic components 16, 17, 18, Lead wire locking portions 301, 302, 303, 304, 305, and 306 are provided for connecting 19 and 20 to each other or to connect to a metal terminal outside the case.

Furthermore, a lead wire locking portion 40 is provided in the connection region 30D. That is, the electronic component module 10 of the present embodiment extends from the piezoelectric element 12 into the case 30 as shown in FIGS. 1A, 1B, 2A, 4, 5, and 7. The main feature is that a lead wire locking portion 40 for locking the lead wire 14L is provided, and the lead wire locking portion 40 is provided in the connection region 30D. Here, the electronic component module 10 of the present embodiment uses gold thread wires as the lead wires 14L and 14L2 extending from the piezoelectric element 12 (hereinafter, the lead wire 14L may be referred to as a gold thread wire 14L). That is, the lead wires 14L and 14L2 extending from the piezoelectric element 12 are made of gold thread wires, and the lead wire locking portions 40 to which the extra length portions of the lead wires (gold thread wires) 14L extending from the piezoelectric elements 12 are locked are connected to the case 30. It is provided in the region 30D. That is, since the core of the gold thread wire is loose, even if it is entangled with the terminal, it will fray immediately from the terminal. Therefore, the lead wire locking portion 40 is pulled and locked until the soldering is completed. If it can be fixed, the workability of the lead wire and the soldering can be remarkably improved. Here, with reference to FIG. 6, the wiring form of the lead wire (gold thread wire) 14L of the piezoelectric element 12 in the electronic component module of the present embodiment will be described. As shown in FIG. 6, from one end side (secondary side) of the vertically placed piezoelectric element 12, first, a lead wire (gold wire) 14 </ b> L is vertically extended toward the upper surface of the piezoelectric element 12, and then substantially horizontally. The first electronic component 16 is connected to the lead wire 16 </ b> L <b> 1 by being bent by 90 degrees and extending, being engaged with the lead wire engaging portion 40. Here, since the gold thread wire is stiff in the core wire, the lead wire (gold thread wire) 14L has a property that it tends to float upward even if it is bent approximately 90 degrees in the horizontal direction as described above. Therefore, the lead of the first electronic component 16 is locked in a locking groove 40M1 (see FIG. 7) formed by cutting a lead wire locking portion 40, which will be described later, in the horizontal direction and prevented from rising. Connect to line 16L1.

The lead wire locking portion 40, which is a major feature of this embodiment, will be described in more detail. As shown in FIGS. 4, 5, and 7, a recess 30 </ b> DG is formed in the connection region 30 </ b> D, and a metal terminal 40 </ b> M is fitted into the recess 30 </ b> DG to form a lead wire locking portion 40. . The metal terminal 40M has an enlarged shape as shown in the figure, and a locking groove 40M1 in which one lead wire 14L of the piezoelectric element 12 is locked is cut out in a horizontal direction from a common cutout. In addition to being formed, a locking groove 40M2 in which one lead wire 16L1 of the first electronic component 16 is locked is cut out in the vertical direction.

Now, as described above, the lead wire 14L made of the gold thread wire of the piezoelectric element 12 is likely to float in the case 30 because the gold wire is stiff in the core wire, and the lead wire 16L1 of the first electronic component 16 Will be difficult to connect. However, as shown in FIGS. 4, 5 and 7, in the lead wire locking portion 40, the locking groove 40M1 is formed by cutting out in the horizontal direction, and the locking groove 40M1 is made of a gold thread wire. Since the lead wire 14L can be engaged and temporarily fixed, the floating of the lead wire 14L can be effectively prevented. Therefore, the connection work with the lead wire 16L1 of the first electronic component 16 is remarkably facilitated. Note that the lead wire 16L1 of the first electronic component 16 has a larger wire diameter than the lead wire 14L of the piezoelectric element 12 and is not a gold thread wire, so there is no problem of lifting or the like. It is cut out in the direction. The lead wire 16L1 of the first electronic component 16 is once inserted through the lead wire locking portion 301 formed on the wall surface of the small section 160, bent into an L shape, and locked from the front side of the case 30. It is inserted into the groove 40M2 and temporarily fixed. Then, the soldering operation is performed in a state where the lead wire 14L of the piezoelectric element 12 and the lead wire 16L1 of the first electronic component 16 are both locked to the lead wire locking portion 40. As described above, the lead wire locking portion 40 is provided in the connection region 30 </ b> D substantially partitioned from the piezoelectric element 12 and the main body portion 16 </ b> B of the first electronic component 16. Since the 12 lead wires 14L and the lead wires 16L1 of the first electronic component 16 can be connected and soldered, the spatial workability is excellent and the connection and soldering work efficiency can be improved. Further, as described above, in the present embodiment, the lead wire locking portion 40 is configured by the metal terminal 40M in which the lead wire 14L of the piezoelectric element 12 and the lead wire 16L1 of the first electronic component 16 are locked in common. Therefore, the reliability of electrical connection between the piezoelectric element 12 and the first electronic component 16 can be improved.

The first, second, third, fourth, and fifth electronic components 16, 17, 18, 19, and 20 are connected to the small sections 160, 170, 180, 190, and 200 of the second section 30B. After the fitting, the lead wire engaging portions 302, 303, 304, 305, and 306 are used to connect the lead wires to each other, and a necessary soldering operation is performed. In this way, the first, second, third, fourth, and fifth electronic components 16, 17, 18, 19, and 20 are connected to each other in the second partition 30B, and soldering work is performed. Therefore, there is no need to use a substrate as in the prior art. Therefore, the electronic component module 10 including the case 30 can be reduced in size and height. As described above, after the piezoelectric element 12 and the first, second, third, fourth, and fifth electronic components 16, 17, 18, 19, and 20 are accommodated and lead wires are connected to each other, In the present embodiment, the case 30 is filled with resin, and the piezoelectric element 12 and the first, second, third, fourth, and fifth electronic components 16, 17, 18, 19, 20 and their connection portions are provided. As shown in FIG. 3, the resin is sealed. In the present embodiment, since the electronic component module 10 including the case 30 is reduced in size and height, the resin filling amount can be significantly reduced. The manufacturing cost of the component module 10 can be reduced.

Next, a second embodiment of the present invention will be described. In the second embodiment, as shown in FIG. 8, the basic configuration other than the lead wire locking portion between the piezoelectric element 12 and the first electronic component 16 is substantially the same as that of the first embodiment. Therefore, the description thereof will be omitted, and the lead wire locking portion 240 that is a feature of the present embodiment will be described. As shown in FIG. 8, a wall-shaped lead wire locking portion 240 is formed integrally with the case 30 in the connection region 30 </ b> D, and from the central portion of the wall-shaped lead wire locking portion 240. On the lower side, a common locking groove 240M is formed in the case 30 so as to be slightly wider and notched in the horizontal direction. In this common locking groove 240M, the lead wire 14L of the piezoelectric element 12 and the lead wire 16L1 of the first electronic component 16 are commonly engaged and temporarily fixed. At this time, the lead wire 14L made of a gold thread wire of the piezoelectric element 12 is easily lifted, but is restrained from being lifted by the wall surface on the upper side of the common locking groove 240M, so that the lead wire 14L is engaged below the common locking groove 240M. The first electronic component 16 can be locked in alignment with the lead wire 16L1 of the first electronic component 16. The lead wire locking portion 240 of the present embodiment is formed integrally with the resin case 30 and is not made of metal, but soldered in the state of being aligned and locked as described above. Therefore, the lead wire 14L of the piezoelectric element 12 and the lead wire 16L1 of the first electronic component 16 can be connected with high reliability, and the soldering workability is also excellent. Of course, the lead wire locking portion 240 may be made of metal. That is, the lead wire locking portion 240 is formed as a metal having the same shape as the present embodiment (separate from the resin case 30) and is fixed to the same portion of the case 30. good.

Subsequently, a third embodiment of the present invention will be described. As shown in FIG. 9, the third embodiment is basically the same as the first and second embodiments except for the lead wire locking portion between the piezoelectric element 12 and the first electronic component 16. Since it is the same, the description is abbreviate | omitted and the lead wire latching | locking part 340 which is the characteristics of this embodiment is demonstrated. In FIG. 9, although the wiring form of the lead wire 16L1 of the first electronic component 16 is partly difficult to see, it is the same as in the first and second embodiments. In the third embodiment, as shown in FIG. 9, a recess 30DG2 is formed in the connection region 30D, and a metal terminal 340M is fitted into the recess 30DG2 to form a lead wire locking portion 340. ing. The metal terminal 340M has a shape as shown in the figure, and a circular insertion hole 340H through which the lead wire 14L of the piezoelectric element 12 and the lead wire 16L1 of the first electronic component 16 are inserted is formed. A metal bowl-shaped solder receiver 340U is provided below the insertion hole 340H. The lead wire 14L of the piezoelectric element 12 and the lead wire 16L1 of the first electronic component 16 are inserted into the insertion hole 340H so as to be placed on the bowl-shaped solder receiver 340U. In this embodiment as well, the lead wire 14L made of the gold thread wire of the piezoelectric element 12 is easily lifted, but the lifting operation is restricted in the circular insertion hole 340H, thereby facilitating the soldering operation and the like. Furthermore, in this embodiment, since the lead wire 14L of the piezoelectric element 12 and the lead wire 16L1 of the first electronic component 16 are connected via the metal terminal 340M, the reliability of electrical connection is improved. Since the metal bowl-shaped solder receiver 340U is provided, the soldering operation of the lead wire 14L of the piezoelectric element 12 and the lead wire 16L1 of the first electronic component 16 is further facilitated.

Subsequently, a fourth embodiment of the present invention will be described. This embodiment is different from the first embodiment in that the shape of the case, the layout of the piezoelectric elements accommodated in the case, and the lead wire locking portions are different. Since the other basic configuration is substantially the same as that of the first embodiment, description thereof is omitted. The difference will be described with reference to FIGS.

FIG. 10 is a perspective view showing an electronic component module to which the fourth embodiment of the present invention is applied, and is a perspective view seen from the surface side filled with resin. FIG. 11 is a plan view of the electronic component module shown in FIG. 10 that is not filled with resin.

As shown in FIG. 11, the piezoelectric element 12 is disposed horizontally in the first partition 30 </ b> A. The piezoelectric element 12 is placed horizontally and the lead wire (gold thread wire) 14L is extended in the horizontal direction toward the second partition portion 30B, whereby the lead wire 14L is extended in the lower direction of the piezoelectric element 12. Therefore, the length of the electronic component module 10 in the vertical direction can be further reduced.

Next, how to connect the lead wire 14L of the piezoelectric element 12 and the lead wire of the electronic component arranged in the second partition part 30B will be described. The lead wire 14L passes through the notch 50 of the wall that separates the first partition 30A and the second partition 30B from the first partition 30A and leads to the lead wire locking portion of the second partition 30B. 440 is locked. The lead wire 14L that has passed through the notch 50 is bent upward about 90 degrees and is locked to the lead wire locking portion 440. Here, the gold thread wire is stiff in the core wire and tends to return to a straight line, so that it tries to return in the direction opposite to the piezoelectric element 12. Therefore, as shown in FIG. 12, the lead wire locking portion 440 is locked in the locking groove 440M1 formed by cutting out in the horizontal direction.

In this way, the lead wire 14L locked in the locking groove 440M1 prevents the gold thread wire from returning to a straight line, and the lead wires 16L1, 17L1 of the electronic components 16 and 17 locked in the locking grooves 440M2, 440M3. And connected by soldering or the like. The lead wire locking portion 440 is preferably made of a conductive metal.

Since the notch 50 is hollow, the lead wire 14L in this portion is fixed using an adhesive having a high viscosity. As this adhesive, a silicon-based adhesive can be used. Thereafter, the second partition portion 30B is filled with a resin such as urethane, but before the second partition portion 30B is filled with resin, the resin is prevented from flowing into the first partition portion 30A. Therefore, it is preferable to fix the notch 50 with an adhesive or the like. The lead wire 14L may be fixed with the adhesive at the notch 50 before the lead wire 14L is connected to the lead wire of the electronic component, or may be fixed after the connection.

As described above, according to the first to fourth embodiments of the present invention, the electronic components 16, 17, 18, 19, and 20 can be positioned and accommodated by the second partition portion 30B. The electronic component module can be reduced in size and thickness without using such a printed circuit board. In addition, since the electronic component module 10 including the case 30 is reduced in size and height, the case after the piezoelectric element 12 and the electronic components 16, 17, 18, 19, 20 are accommodated and connected to each other, etc. The amount of resin filled in 30 can be greatly reduced, and the manufacturing cost of the electronic component module 10 can be reduced accordingly. Furthermore, the lead wire locking portions 40, 240, and 340 are provided in a connection region 30D that is substantially partitioned from the piezoelectric element 12 and the main body portion 16B of the first electronic component 16, and the lead wire locking portions 40, In 240 and 340, the lead wire 14L of the piezoelectric element 12 and the lead wire 16L1 of the first electronic component 16 can be connected and soldered, so that the spatial workability is excellent and the working efficiency of the connection and soldering is improved. be able to. Further, in the lead wire locking part 440 provided in the second partition part 30B, since the connection area is provided in the second partition part, there is no need to provide a dedicated connection area for the lead wire locking part. Therefore, space can be reduced, the case can be downsized, and the electronic component module can be further downsized. In particular, since the lead wire locking portions 40, 240, 340, and 440 have a structure that prevents the lead wire 14L made of the gold thread wire of the piezoelectric element 12 from being lifted, the handling and soldering of the lead wire 14L has been difficult. The connection and soldering of the lead wire 14L made of a gold thread wire are very easy, and the workability is greatly improved.

While the present invention has been described based on the embodiments, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the claims. For example, a plurality of small sections for positioning and storing each electronic component are formed in the second partition section by standing wall surfaces (convex portions), and each electronic component is positioned and stored by these small sections. However, a plurality of recesses (indentations on the bottom surface of the case) for positioning and housing each electronic component may be formed in the second partition part. Furthermore, the lead wire engaging portion is not limited to the shape of the above embodiment as long as the lead wire of the piezoelectric element can be temporarily fixed and the lead wire of the piezoelectric element and the electronic component can be easily soldered. Moreover, the lead wire latching part may be provided in the first partition part in addition to the connection region and the second partition part. In addition, the present invention is not limited to a place other than the place of the embodiment and the first partition part as long as the work efficiency of lead wire connection and soldering can be improved or the space can be reduced.

The present invention is not limited to the electronic component module in the above-described embodiment, and can be widely applied to other electronic components as long as the piezoelectric element and at least one electronic component are packaged.

12: Piezoelectric element 16, 17, 18, 19, 20: Electronic component 30, 300: Case, 30A: First partition part, 30B: Second partition part, 30D: Connection region, 14L, 14L2: Gold thread Wire (lead wire), 40, 240, 340, 440: lead wire locking portion, 160, 170, 180, 190, 200: small section

Claims (7)

A piezoelectric element, at least an electronic component connected to the piezoelectric element via a lead wire, and a case for storing the piezoelectric element and the electronic component, the case positioning and storing the piezoelectric element And a second partition portion for positioning and storing the electronic component, and a lead wire locking portion for locking a lead wire extending from the piezoelectric element is provided in the case. Electronic component module. In addition to the electronic component connected to the piezoelectric element via the lead wire, the electronic component further includes another electronic component, and the second partition portion has a plurality of small sections for positioning and accommodating the electronic components. The electronic component module according to claim 1, wherein the electronic component module is formed. The electronic component module according to claim 2, wherein the small section is formed by a convex portion or a concave portion formed in the second partition portion. 4. The lead wire locking portion is provided in a connection region in which the first partition portion and the second partition portion are substantially partitioned. 5. The electronic component module described in 1. 4. The electronic component module according to claim 1, wherein the lead wire locking portion is provided in the second partition portion. 5. 6. The lead wire extending from the piezoelectric element is made of a gold thread wire, and the lead wire engaging portion has a structure for preventing the lead wire made of the gold thread wire from being lifted. The electronic component module according to one item. The electronic component module according to any one of claims 1 to 6, wherein the lead wire locking portion is configured by a metal terminal fixed to a case.