JP2015008252A - Substrate holding device and liquid droplet discharge device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To hold a substrate while correcting warping of the substrate.SOLUTION: A substrate holding device includes: a holding part which holds a peripheral edge of a substrate; a moving part which moves the holding part toward the outside of the substrate in a state of holding the substrate at the holding part; and an inclination part which causes the peripheral edge of the substrate to be inclined in a state of holding the substrate.

Description

  The present invention relates to a substrate holding device and a droplet discharge device.

  Conventionally, a substrate suction holding device that includes a plurality of pin-shaped convex portions that support the surface of the substrate, and that can adsorb the substrate while supporting the substrate with the support surface of the pin-shaped convex portion, and can correct the substrate to a flat surface shape. Is known (see, for example, Patent Document 1).

JP 2001-185607 A

  However, in the above-described substrate suction holding apparatus, the pin-shaped convex portions are installed in almost the entire area with respect to the substrate. Therefore, for example, the active surface side where the active portion such as the metal wiring of the wafer as the substrate is formed is arranged. When adsorbed, the support surface of the pin-shaped convex part comes into contact with the active part, and the active part is damaged. For this reason, there existed a subject that the wafer which has an active part cannot be adsorbed and held.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 A substrate holding apparatus according to this application example includes a holding unit that holds a peripheral portion of a substrate, and the holding unit that faces the outside of the substrate in a state where the substrate is held by the holding unit. A moving part to be moved, and an inclined part for inclining a peripheral part of the substrate while holding the substrate are provided.

  According to this configuration, for example, the peripheral portion of the substrate warped in a convex shape is held by the holding portion, and the holding portion is moved to the outside of the substrate while the substrate is held by the holding portion. If it does so, the board | substrate hold | maintained with the movement of a holding | maintenance part will be pulled toward the outer side of a board | substrate. Thereby, the convex curvature of a board | substrate is reduced. Further, by inclining the peripheral portion of the held substrate, stress is generated in the peripheral portion of the substrate, and the warpage of the entire substrate is corrected. Therefore, since the holding portion and the inclined portion are only in contact with the peripheral portion of the substrate, even a substrate having an active portion can be held in a flattened state without contacting the active portion.

  Application Example 2 The holding unit of the substrate holding apparatus according to the application example includes a suction port provided at a position corresponding to the peripheral edge of the substrate, a suction unit that sucks air through the suction port, It is provided with.

  According to this configuration, the substrate can be easily sucked and held by sucking air from the suction port. Further, the substrate can be easily removed from the holding portion.

  Application Example 3 The inclination angle of the inclined portion of the substrate holding device according to the application example described above is variable so that the peripheral edge portion of the substrate is inclined.

  According to this structure, the peripheral part of a board | substrate can be inclined according to a board | substrate form (size, thickness, etc.), the curvature direction of a board | substrate, the curvature amount, etc. Thereby, a board | substrate can be hold | maintained in the state which corrected the curvature of the board | substrate appropriately.

  Application Example 4 The holding unit of the substrate holding device according to the application example described above is characterized in that a peripheral portion of the substrate having an active part formed on one surface is held.

  According to this configuration, the substrate on which the active part is formed on one surface tends to have a higher shrinkage rate on the active part side than the material of the substrate. When placed, the substrate warps upwards in a convex shape. Therefore, the substrate is moved toward the outside of the substrate while the peripheral portion of the substrate is held, and the peripheral portion of the substrate is inclined. Thereby, the curvature of a board | substrate is corrected. And it can hold | maintain in the state which planarized the board | substrate, without contacting an active part.

  Application Example 5 A droplet discharge device according to this application example is a droplet discharge device that forms an image on a substrate, and faces the substrate holding device and the substrate held by the substrate holding device. And a discharge head that discharges the functional liquid as droplets.

  The substrate holding device corrects the warping of the substrate and holds the substrate flat. Thereby, the distance between the ejection head and the substrate is kept constant. Accordingly, the landing position accuracy of the functional liquid ejected from the ejection head with respect to the substrate is increased, and a high-quality image can be formed on the substrate surface.

Schematic which shows the structure of a board | substrate holding | maintenance apparatus. The partial enlarged view of a substrate holding device. The partial enlarged view of a substrate holding device. The operation | movement figure which shows operation | movement of a board | substrate holding apparatus. Schematic which shows the structure of a droplet discharge apparatus. FIG. 9 is a partially enlarged view showing a configuration of a substrate holding device according to Modification 1; FIG. 9 is a partially enlarged view showing a configuration of a substrate holding device according to Modification 2.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following drawings, the scale of each member or the like is shown differently from the actual scale so as to make each member or the like recognizable.

  First, the configuration of the substrate holding device will be described. The substrate holding device is a holding unit that holds the peripheral edge of the substrate, a moving unit that moves the holding unit toward the outside of the substrate in a state where the substrate is held by the holding unit, and a state that holds the substrate, An inclined portion that inclines the peripheral edge of the substrate is provided. The substrate of this embodiment will be described by taking as an example a wafer (integrated circuit forming substrate) having an active portion in which elements, metal wirings and the like are formed on one surface.

  FIG. 1 is a schematic view showing the configuration of the substrate holding device, FIG. 1 (a) is a plan view, and FIG. 1 (b) is a schematic side view taken along line AA in FIG. 1 (a). 2 and 3 are partially enlarged views of the substrate holding device. Specifically, FIG. 2 shows the configuration of the holding portion and the inclined portion of the substrate holding device (in the BB line of FIG. 1A). FIG. 3 shows the configuration of the moving part of the substrate holding device.

  As shown in FIGS. 1A and 1B, the substrate holding device 1 has a rectangular base 10, and supports 13 are arranged in the vicinity of each corner of the base 10. A rectangular support plate 14 is installed on the top of the column 13. The support plate 14 supports the holding portion 20 and the inclined portion 30. Further, a through hole 15 is provided in the central portion of the support plate 14 in plan view. The through-hole 15 is provided so that the surface portion (active portion) excluding the end portion (peripheral portion) of the wafer W does not contact the holding portion 20 or the like when the wafer W is placed on the holding portion 20. Is. The size of the through-hole 15 can be appropriately set according to the size of the wafer W to be mounted and the arrangement position of the holding unit 20 and the inclined unit 30. The substrate holding apparatus 1 further includes a moving unit 40 that moves the holding unit 20 toward the outside (radial direction) of the wafer W held by the holding unit 20.

  Next, the configuration of the holding unit 20 will be described. The holding unit 20 holds an end portion (peripheral portion) of the wafer W and has a substantially rectangular parallelepiped shape. A plurality of holding portions 20 are arranged along the peripheral surface of the through hole 15 of the support plate 14. In the present embodiment, eight holding portions 20 are arranged at equal intervals along the peripheral surface of the through hole 15. Further, as shown in FIG. 1B, groove portions 27 are formed on both side surfaces of the holding portion 20. The groove 27 is formed in the horizontal direction (X-axis direction). Further, the support plate 14 is formed with a cutout portion 16 following the outer shape of the holding portion 20. A convex portion 17 is formed on a part of the cutout portion 16 toward the groove portion 27 of the holding portion 20. Then, when the convex portion 17 of the support plate 14 is fitted into the groove portion 27 of the holding portion 20, the holding portion 20 is supported by the support plate 14. And the holding | maintenance part 20 and the convex part 17 (support plate 14) become relatively movable via the groove part 27. FIG. At this time, since the groove portion 27 is formed in the horizontal direction, the moving direction of the convex portion 17 with respect to the groove portion 27 is regulated in the horizontal direction.

  As shown in FIG. 2A, the holding unit 20 is provided with a suction port 21 at a position corresponding to the end (peripheral part) of the wafer W. A suction unit (not shown) for sucking air from the suction port 21 via the suction tube 22 is also provided. The suction unit is, for example, a pump, and is configured such that outside air is sucked from the suction port 21 toward the suction pipe 22 by driving the pump. Then, a negative pressure is generated by driving the pump while the wafer W is placed on the holding unit 20, and the wafer W placed on the holding unit 20 is attracted and fixed (held) to the holding unit 20. The

  Next, the configuration of the inclined portion 30 will be described. The inclined portion 30 is for tilting the peripheral edge of the wafer W while holding the wafer W. As shown in FIG. 2A, the inclined portion 30 is provided at a position corresponding to the suction port 21, that is, a position corresponding to the peripheral edge portion of the wafer W, which is a part of the holding portion 20. The inclination part 30 concerning this embodiment is comprised so that the inclination angle which inclines the peripheral part of the wafer W is variable. Specifically, an inclination driving unit 31 is provided in a part of the suction port 21. Further, a drive source (not shown) for driving the tilt drive unit 31 is connected. And the inclination angle of the inclined surface 33 where the peripheral part of the wafer W inclines can be arbitrarily changed by moving the inclination drive part 31 up and down. Then, when the pump is driven in a state where the wafer W is placed on the holding unit 20, the peripheral portion of the wafer W is attracted and fixed to the holding unit 20 in a state where it is inclined (deformed) following the inclined surface 33.

  FIG. 2B shows a state where the position of the tilt driving unit 31 in FIG. 2A is further raised. In the case of FIG. 2B, the inclination angle of the inclined surface 33a where the peripheral portion of the wafer W is inclined is smaller than the inclination angle of the inclined surface 33 shown in FIG. Thereby, the inclination degree of the peripheral part of the wafer W is also small. In addition, the position of the inclination drive part 31 can further be raised and the inclination angle can be set to be 0 °.

  Next, the configuration of the moving unit 40 will be described. The moving unit 40 moves the holding unit 20 toward the circumferential direction of the wafer W placed on the holding unit 20. As shown in FIG. 1B, the moving unit 40 includes an elevating unit 42 that can move the rod 43 up and down. A lift plate 44 is connected to the top of the rod 43. And the connection board 45 is provided in the peripheral part of the raising / lowering board 44 in side view. A guide hole 49 having a long hole shape is formed in the connection plate 45. On the other hand, a pin 29 is provided on the side surface of the holding portion 20, and the pin 29 and the guide hole 49 are engaged with each other. The guide hole 49 is formed in an oblique direction with respect to the upper surface of the elevating plate 44. Thereby, the movement part 40 and the holding | maintenance part 20 are connected so that a movement is possible. The movement direction and the movement distance of the pin 29 are regulated by the guide hole 49. Further, the moving distance of the holding portion 20 is regulated by the moving component in the horizontal direction of the guide hole 49 with respect to the pin 29.

  Next, an operation method of the moving unit 40 will be described. FIG. 1B and FIG. 3A show a state (initial state) in which the rod 43 of the elevating unit 42 is raised. When the rod 43 of the elevating part 42 is raised, the connecting plate 45 is raised together with the elevating plate 44. As a result, as shown in FIG. 3A, the guide hole 49 is in a state of being raised relative to the pin 29 (initial state).

  Subsequently, FIG. 3B shows a state where the rod 43 of the elevating unit 42 is lowered (moving state). When the rod 43 of the elevating part 42 is lowered, the connecting plate 45 is lowered together with the elevating plate 44. As a result, the pin 29 moves while being relatively restricted by the guide hole 49. At the same time, the holding portion 20 moves in the X-axis direction with respect to the convex portion 17 of the support plate 14. That is, the holding unit 20 moves toward the outside of the wafer W. When the rod 43 of the elevating part 42 is raised from this moving state, the connecting plate 45 rises together with the elevating plate 44, and the pin 29 moves while being regulated by the guide hole 49. At the same time, the holding part 20 moves in the −X axis direction with respect to the convex part 17 of the support plate 14. And as shown to Fig.3 (a), the holding | maintenance part 20 returns to an initial state.

  Next, an operation method of the substrate holding device will be described. FIG. 4 is a schematic diagram illustrating the operation of the substrate holding device. In FIG. 4, the movement unit 40 is omitted, and operations of the holding unit 20 and the inclined unit 30 are mainly illustrated.

  First, as shown in FIG. 4A, the wafer W is placed on the holding unit 20. In this embodiment, a wafer W having an active part formed on one surface is placed. In this case, the active surface Wa side on which the active portion is formed is placed so as to face the holding portion 20. Here, when an active part (for example, a metal wiring or an element) is formed on one surface of the wafer W, the active surface Wa side tends to have a higher shrinkage rate than the material of the wafer W. When the active surface Wa on which the portion is formed is placed on the lower side, the wafer W is placed in a state where the wafer W is warped upward.

  Subsequently, the inclination drive part 31 of the inclination part 30 is moved to a predetermined position. Thereby, the inclined surface 33 having a predetermined inclination angle is set. Note that the position of the tilt driving unit 31 can be set based on the warpage state of the wafer W to be placed.

  Next, as shown in FIG. 4B, the pump connected to the suction port 21 is driven to suck air from the suction port 21. As a result, the peripheral edge of the wafer W is attracted to the inclined surface 33 side, and the wafer W is convex toward the active surface Wa (downwardly convex in the figure). Then, the peripheral portion of the wafer W is sucked and fixed (held) to the holding portion 20 in a state where the peripheral portion of the wafer W is deformed following the inclined surface 33. By fixing the peripheral edge of the wafer W so as to be convex toward the active surface, a force opposite to the convex shape of the wafer W (upward convex shape in the drawing) is exerted on the entire wafer W. The warpage of the wafer W is reduced.

  Next, as illustrated in FIG. 4C, the moving unit 40 (see FIG. 1) is driven, and the holding unit 20 is directed toward the outside (radial direction) of the wafer W while the wafer W is held by the holding unit 20. Move. Then, the wafer W is pulled outward. Thereby, the warpage of the substrate is further reduced, and the substrate is held in a flattened state.

  Next, the configuration of the droplet discharge device will be described. FIG. 5 is a schematic diagram showing the configuration of the droplet discharge device. As shown in FIG. 5, the droplet discharge device 100 includes the discharge head 63 that discharges a functional liquid as droplets and the substrate holding device 1 described above. The droplet discharge device 100 according to the present embodiment has, for example, an identification mark such as a product number, a lot number, a manufacturing number, and a date as a substrate held by the substrate holding device 1 and a two-dimensional barcode. This is an apparatus for forming various marks such as reference numerals. In the present embodiment, a configuration in which a mark is formed on the wafer W by applying ultraviolet curable ink as a functional liquid to the wafer W will be described.

  As illustrated in FIG. 5, the droplet discharge device 100 according to the present embodiment includes a printing unit 64 and a guide member 61 including a guide rail 62 that guides the movement of the printing unit 64 in the main scanning direction (X-axis direction). And a main scanning means 60 for reciprocating the printing unit 64 along the guide rail 62 in the main scanning direction. Moreover, the ultraviolet irradiation part 67,68 which irradiates an ultraviolet-ray is provided. Further, a guide member 71 having a guide rail 72 for guiding the movement of the substrate holding device 1 holding the wafer W in the sub-scanning direction (Y-axis direction) and the substrate holding device 1 along the guide rail 72 are sub-scanned. Sub-scanning means 70 that reciprocates in the direction is provided. The droplet discharge device 100 includes a control unit (not shown) that controls the above members and the like.

  The printing unit 64 of this embodiment includes a carriage 65 and an ejection head 63 mounted on the carriage 65. The ejection head 63 is, for example, an ink jet head provided with a piezoelectric element as a pressure unit. In addition, ultraviolet irradiators 67 and 68 are installed at the peripheral portions of the carriage 65 in the X-axis direction.

  The main scanning means 60 includes a moving mechanism and a power source (not shown). As the moving mechanism, for example, a mechanism combining a ball screw and a ball nut, a linear guide mechanism, or the like may be employed. In the present embodiment, for example, a motor is employed as a power source for moving the carriage 65 along the X-axis direction. Various motors such as a stepping motor, a servo motor, and a linear motor can be adopted as the motor. The power from the motor is transmitted to the carriage 65 through the moving mechanism. Accordingly, the carriage 65 (the ejection head 63 and the ultraviolet irradiation units 67 and 68) can reciprocate along the guide rail 62, that is, along the main scanning direction (X-axis direction).

  The sub-scanning means 70 includes a moving mechanism and a power source (not shown). As the moving mechanism, for example, a mechanism combining a ball screw and a ball nut, a linear guide mechanism, or the like may be employed. In the present embodiment, a motor is employed as a power source for moving the substrate holding device 1 along the Y-axis direction. Various motors such as a stepping motor, a servo motor, and a linear motor can be adopted as the motor. The power from the motor is transmitted to the substrate holding device 1 through the moving mechanism. Thereby, the board | substrate holding | maintenance apparatus 1 can reciprocate along the guide rail 72, ie, along a subscanning direction (Y-axis direction).

  The substrate holding device 1 holds the wafer W. And the wafer W is mounted in the board | substrate holding | maintenance apparatus 1, and the wafer W is hold | maintained in the state which corrected the curvature (refer FIGS. 1-4). Then, the sub-scanning means 70 is driven to move the wafer W placed on the substrate holding device 1 to a predetermined position. Then, the main scanning means 60 is driven to discharge the ultraviolet curable ink from the discharge head 63 while reciprocating the carriage 65 to apply the ultraviolet curable ink to the wafer W surface. Then, the ultraviolet irradiation units 67 and 68 are driven to irradiate the applied ultraviolet curable ink with ultraviolet rays. Thereby, a desired mark is formed on the wafer W.

  As mentioned above, according to the said embodiment, the following effects can be acquired.

  The wafer W warped upward is deformed in a direction opposite to the upward convex warping direction of the wafer W because the peripheral edge of the wafer W is attracted and fixed (held) following the inclined surface 33. Then, the wafer W is pulled in the radial direction of the wafer W while being held. Thereby, the wafer W can be held in a smooth state.

  By using the substrate holding device 1 for the droplet discharge device 100, the distance between the discharge head 63 and the wafer W is kept constant, so that the droplet landing position accuracy is improved and a high-definition image is obtained. Can be formed.

  Note that the present invention is not limited to the above-described embodiment, and various modifications and improvements can be added to the above-described embodiment. A modification will be described below.

  (Modification 1) In the said embodiment, although the inclination drive part 31 was provided in the inclination part 30, and it was set as the structure which can change the inclination angle of the inclined surface 33 arbitrarily, it is not limited to this. FIG. 6 is a partially enlarged view showing the configuration of the substrate holding device according to the first modification. As shown in FIG. 6, the inclined portion 30 has a wall portion 38 whose top portion is inclined. Specifically, the top portion of the wall portion 38 is formed so as to be lowered toward the through hole 15. And the inclined surface 33b in which the peripheral part of the wafer W inclines is set. Even in such a configuration, by driving the pump while the wafer W is placed on the holding unit 20, the peripheral edge of the wafer W is inclined (deformed) following the inclined surface 33b, and the warp of the wafer W is performed. Can be held in a reduced state. In addition, the apparatus configuration can be simplified.

  (Modification 2) In the above embodiment, the inclined surface 33 set by the holding portion 20 and the inclined portion 30 is set so as to become lower toward the through hole 15, but is not limited to this configuration. FIG. 7 is a partially enlarged view showing the configuration of the substrate holding device according to the second modification. As shown in FIG. 7, the inclined part 30 has a wall part 39 whose top part is inclined. Specifically, the top portion of the wall portion 39 is formed so as to become higher toward the through hole 15. And the inclined surface 33c in which the peripheral part of the wafer W inclines is formed (set). With such a configuration, when the peripheral portion of the wafer W is held on the inclined surface 33 with respect to the wafer W warped downwardly, the warp can be reduced by causing upward deformation.

  (Modification 3) In the above embodiment, the inclined portion 30 and the moving portion 40 are driven and held while correcting the warp of the wafer W. However, the present invention is not limited to this. For example, the wafer W may be held by the holding unit 20 while only the inclined portion 30 is driven and the warpage of the wafer W is corrected. That is, the moving unit 40 may not be driven. In this way, if the warp of the wafer W can be corrected and held only by the inclined part 30 and the holding part 20, the driving method can be simplified.

  (Modification 4) In the substrate holding device 1 of the above-described embodiment, the configuration for holding the wafer W of one size has been described. However, the configuration is not limited to this configuration. For example, it is good also as a structure which can change the arrangement position of the support | pillar 13 according to the size of the wafer W. FIG. In this way, a wafer W having an arbitrary size can be easily held.

  DESCRIPTION OF SYMBOLS 1, 1a, 1b ... Substrate holding device, 14 ... Support plate, 17 ... Convex part, 20 ... Holding part, 21 ... Suction port, 27 ... Groove part, 29 ... Pin, 30 ... Inclination part, 31 ... Inclination drive part, 33 , 33a, 33b, 33c ... inclined surface, 38, 39 ... wall, 40 ... moving part, 42 ... elevating part, 43 ... rod, 44 ... elevating plate, 45 ... connecting plate, 49 ... guide hole, 63 ... discharge head , 100 ... droplet discharge device.

Claims (5)

A holding part for holding the peripheral edge of the substrate;
In a state where the substrate is held by the holding unit, a moving unit that moves the holding unit toward the outside of the substrate;
A substrate holding apparatus comprising: an inclined portion that inclines the peripheral edge of the substrate in a state where the substrate is held. The substrate holding apparatus according to claim 1,
The holding part is
A suction port provided at a position corresponding to the peripheral edge of the substrate;
And a suction part for sucking air through the suction port. The substrate holding apparatus according to claim 1 or 2,
The substrate holding apparatus, wherein an inclination angle of the inclined portion for inclining the peripheral portion of the substrate is variable. In the substrate holding device according to any one of claims 1 to 3,
In the holding part,
A substrate holding apparatus that holds a peripheral portion of the substrate having an active portion formed on one surface. A droplet discharge device for forming an image on a substrate,
A substrate holding device according to any one of claims 1 to 4,
A droplet discharge device comprising: a discharge head that discharges a functional liquid as droplets facing the substrate held by the substrate holding device.

Images