JP2015001486A - Wire evaluation device and manufacturing method of wire - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a wire having a desired surface state.SOLUTION: A wire evaluation device 1 evaluates the surface state of a wire 90 subjected to surface treatment in real time, and includes an imaging unit 3 that photographs the surface of the wire 90 traveling in a predetermined direction, a glossiness calculation unit (image processing device 4) that calculates the glossiness of the surface of the wire on the basis of image data output from the imaging unit 3, and a surface state evaluation unit (image processing device 4) that evaluates the surface state of the wire 90 on the basis of a threshold determined according to the method of the surface treatment and the material of the wire 90 and the calculated glossiness.

Description

  The present invention relates to a wire rod evaluation apparatus and a wire rod manufacturing method for evaluating the surface state of a wire rod.

  For example, the wire material is often subjected to surface treatment such as blasting or plating in order to improve the strength at the time of adhesive bonding (see, for example, Patent Documents 1 to 3). At this time, if the wire rods are uncovered due to the projection of the abrasive, the processing state becomes unstable.For example, the holding plate with an opening formed so that the blast can pass is arranged at a predetermined angle with respect to the injection direction. The processing method etc. which do are disclosed (for example, refer to patent documents 3).

JP 2000-198312 A (paragraphs 0026 to 0028, FIG. 4) JP 2008-30084 (paragraphs 0031, 0041, 0075) JP 2011-115886 A (paragraphs 0047 to 0084, FIGS. 2 to 4)

  However, it is not possible to guarantee that a desired surface state can be obtained only by preventing the wire rod from being ramped up. Therefore, when some surface treatments are insufficient, for example, a film that reduces the adhesive force on the surface of the wire, i.e., an inactive film on the outer surface, remains, and the adhesive force and adhesion are sufficient. It may not be obtained and may cause a problem such as adhesion peeling. Therefore, it is necessary to check whether the surface treatment has been performed reliably. However, the conventional surface treatment apparatus does not have a mechanism for discriminating even if the surface state is different due to processing variations, and cannot determine whether or not sufficient processing has been performed.

  The present invention has been made to solve the above-described problems, and an object thereof is to obtain a wire having a desired surface state.

  A wire rod evaluation apparatus according to the present invention is a wire rod evaluation device that evaluates the surface state of a wire subjected to a surface treatment in real time, an imaging unit that captures the surface of the wire traveling in a predetermined direction, and the imaging unit A glossiness calculating section for calculating the glossiness of the surface based on the image data output from the image processing apparatus, a threshold value determined according to the surface treatment method and the material of the wire, and the calculated glossiness And a surface state evaluating unit for evaluating the surface state of the wire.

  The method for producing a wire according to the present invention includes a surface treatment process for performing a predetermined surface treatment on a wire, and a surface condition evaluation process for evaluating the surface condition of the wire subjected to the surface treatment using the above-described wire rod evaluation apparatus. And a reprocessing step of performing the surface treatment again on the portion when the surface state is evaluated to be defective in the surface state evaluation step.

  According to this invention, since the surface state of the wire can be evaluated in real time during production, a wire having a desired surface state can be easily obtained.

It is a schematic diagram for demonstrating the structure of the wire rod evaluation apparatus concerning Embodiment 1 of this invention. It is a flowchart for demonstrating operation | movement of the wire evaluation apparatus concerning Embodiment 1 of this invention. It is a figure which shows the result of the evaluation example 1 in the wire rod evaluation apparatus concerning Embodiment 1 of this invention. It is a wire rod evaluation apparatus concerning Embodiment 1 of the present invention, and is a figure showing a result of evaluation example 2. It is a schematic diagram for demonstrating the structure of the vibration suppression mechanism part of the wire rod evaluation apparatus concerning Embodiment 1 of this invention. It is a schematic diagram for demonstrating the structure of the wire rod evaluation apparatus concerning Embodiment 2 of this invention. It is a schematic diagram for demonstrating the structure of the wire rod evaluation apparatus concerning Embodiment 4 of this invention. It is a schematic diagram for demonstrating the structure of the wire rod evaluation apparatus concerning Embodiment 5 of this invention. It is a schematic diagram for demonstrating the structure of the wire rod evaluation apparatus concerning Embodiment 6 of this invention.

  The wire rod evaluation apparatus according to each embodiment of the present invention is a device for evaluating the surface state of a wire rod, for example, the presence or absence of a remaining film on the outer surface or the presence or absence of a coating defect. And, as the wire material, for example, a long object with a non-uniform surface state such as a deformed single wire or a twisted wire obtained by twisting a circle or a deformed single wire, and the material is glossy such as steel, light alloy, resin, etc. It refers to what you have. Examples of the surface treatment include chemical conversion treatment, blast treatment, and plating treatment.

Embodiment 1 FIG.
1-5 is a figure for demonstrating the wire rod evaluation apparatus concerning Embodiment 1 of this invention. FIG. 1 is a diagram for explaining the configuration of a wire rod evaluation apparatus, FIG. 1 (a) is a schematic diagram showing the overall configuration of the wire rod evaluation apparatus, and FIG. 1 (b) is a configuration of an imaging unit that images the surface state of the wire rod. FIG. 2 is a flowchart for explaining the operation of the wire rod evaluation apparatus, FIG. 3 is a diagram for explaining the operation of the wire rod evaluation apparatus according to the present embodiment, The figure which shows the result of having evaluated the surface state of the wire which performed the blast process as the evaluation example 1, FIG. 4 is the surface state of the wire which performed the plating process as the evaluation example 2 using the wire evaluation apparatus concerning this Embodiment It is a figure which shows the result of having evaluated. FIG. 5 is a schematic diagram for explaining the configuration of the vibration suppressing unit for suppressing the vibration of the wire in the wire evaluation apparatus.

  As shown in FIG. 1A, the wire rod evaluation apparatus 1 according to the first embodiment of the present invention has an image pickup unit 3 for picking up an image of a surface state of a running wire 90, and an image picked up by the image pickup unit 3. The image processing apparatus 4 which evaluates the surface state of the wire 90 based on data is provided. The camera 31 and the two illuminations 32 constituting the imaging unit 3 are arranged so as to have a predetermined positional relationship as will be described later by a column 34 fixed to the housing 2.

  Further, before and after the imaging unit 3 in the traveling direction (x direction) of the wire 90, a vibration suppressing unit for restraining the wire 90 from restraining vibration so that the wire 90 does not deviate from the imaging range of the camera 31. 6 is provided. In addition, a monitor 5 for displaying an evaluation result by the image processing device 4 is provided.

  The present inventor has found that the surface 90 of the wire 90 can be evaluated by the glossiness (ratio of glossy portions) because the surface 90 of the wire 90 changes its surface unevenness, and therefore the light reflection state changes. Therefore, in the wire rod evaluation apparatus 1 according to the first embodiment, the image processing apparatus 4 is configured to evaluate the ratio of the glossy part based on the luminance (gradation) of the image data. Therefore, the imaging unit 3 is arranged so that only the light reflected by the wire 90 out of the light emitted from the two illuminations 32 enters the camera 31. Specifically, as shown in FIG. 1B, the optical axis Xs of each of the two illuminations 32 is the optical axis Xc of the camera 31 within a plane (yz plane) perpendicular to the traveling direction of the wire 90. Are arranged so as to form a fixed angle (A1, A2).

  For example, the unevenness size of the surface of the wire 90 is about 0.5 mm ± 0.1 mm, the distance between the camera 31 and the wire 90 is 60 ± 10 mm, the distance between the illumination 32 and the wire 90 is 40 ± 10 mm, and the illumination 32 is white light. Is used, the angles A1 and A2 formed by the illumination 32 and the camera 31 (strictly, the optical axes Xs and Xc) are preferably 60 ± 5 °. By defining the angle between the illumination 32 and the camera 31 in the above range, even with the wire 90 whose target surface state is not uniform, a single camera 31 can capture a surface state in a range of about 120 ° with respect to the circumferential direction. . The illumination light emitted from the illumination 32 is incident obliquely and illuminates the surface of the wire 90. Each of the illuminations 32 is connected to a dimmer 33, and the brightness can be adjusted by the dimmer 33.

  The illumination 32 that makes the illumination light incident on the wire 90 is preferably in a line shape or a spot shape, and is set so as to irradiate a wider range than the imaging range of the camera 31 as described later. For example, when a line shape is used as the illumination 32, it is desirable that the longitudinal direction of the wire 90 (traveling direction) and the longitudinal direction of the illumination 32 be parallel. Moreover, it is desirable that the imaging range of the camera 31 is larger than the diameter of the wire 90 to be evaluated. Furthermore, if the depth of field is made deeper than the radius of the wire 90 by reducing the aperture of the camera 31, the surface of the wire 90 can be stably imaged.

  The illumination light emitted from the illumination 32 is scattered and reflected by the surface of the wire 90 and is incident on the camera 31. However, the background in the imaging range of the camera 31 is blackened so that it is difficult to transmit or reflect light. 2 or the like. By being shielded from light by the housing 2, it is possible to perform accurate evaluation without being affected by light from the outside.

  At this time, the wire 90 is stretched in a straight line and travels in the longitudinal direction thereof, but vibration accompanying the movement of the wire 90 occurs. It is assumed that the imaging range of the camera 31 captures an area wider than the diameter of the wire 90 so that measurement variation does not occur even if some vibration occurs in the wire 90. Note that the illumination 32 and the camera 31 are fixed by a high-strength support column 34, and have a structure in which no shift occurs in the imaging range due to the influence of vibration associated with the travel of the wire 90.

Next, the operation of the wire rod evaluation apparatus 1 according to the first embodiment or the wire rod evaluation method will be described with reference to the flowchart of FIG.
First, the type of wire 90 to be evaluated (material such as metal / resin, stranded wire / single wire, etc., particularly material), surface treatment method, arrangement of the imaging unit 3 and the like are selected (step SP010). ). This selection may be made, for example, by direct input by an input / output function or the like provided in the monitor 5, or by selecting (reading) from pre-stored conditions. Depending on the selected (input) conditions, Processing conditions such as a threshold value in processing to be described later are set.

  When the image data is acquired by the camera 31 while the wire 90 is traveling (step SP020), the acquired image data is output to the image processing device 4, and the image processing device 4 performs image data according to the set conditions. Is binarized, for example, for each pixel or each frame (step SP030). For example, when binarization processing is performed for each pixel, the data within the frame, or when binarization processing is performed for each frame, the data per unit time is statistically processed, so that the ratio of the glossy portion in the wire 90 ( (Glossiness) is calculated (step SP040).

  Next, the image processing apparatus 4 compares the calculated gloss level with a set threshold value, and if the gloss level is within a predetermined range (“Y” in step SP050), a display indicating “OK” is displayed. Alternatively, while keeping the display (step SP070), the process proceeds to step SP020. On the other hand, if the glossiness is not within the predetermined range (“N” in step SP050), for example, “NG” is displayed (step SP060), and the process proceeds to step SP020. In the figure, the action of the third to sixth embodiments to be described later is reflected, and before proceeding to step SP020, for example, a corresponding process such as marking a defective part or processing the position again (step) The part to perform SP200) is also described.

  Even if such automatic processing is not performed, for example, the wire 90 that has been determined to be inadequate is identified, for example, based on the determined time and traveling speed. What is necessary is just to repair the part to do. In any case, in the manufacturing method of the wire including surface treatment, when it is found that there is a problem in the processing based on the evaluation result of the wire evaluation device 1, the manufacturing process of the wire so that the defective part can be repaired Should be switched.

  The binarization at step SP030 is to select whether the target part is glossy or not. In the case where the surface treatment is a treatment for removing the surface coating of the wire rod 90, for example, a blast treatment, since the unevenness increases in the treated portion, the light reflection state changes and the gloss is lowered. Therefore, the luminance of the image data set so that the reflected light from the wire 90 is incident is binarized based on the threshold value set according to the blasting process, so that the gloss of the part matches the condition. It can be determined whether or not. Therefore, the glossiness can be calculated by counting the areas of the glossy portions that meet the conditions in the statistical processing in step SP040.

  In step SP050, whether or not the glossiness is within the range, specifically, if there is a remaining film if the glossiness is greater than the set threshold, and if there is no remaining film if the glossiness is less than the threshold, Determine presence or absence. That is, it is possible to determine whether a desired surface state has been obtained.

  Although the threshold value for binarization differs depending on the processing method, for example, compared to the plating process, the blasting process has deep irregularities, and the captured image tends to be bright and dark, so the binarization threshold value is large. When detecting the remaining film, the size of the remaining film that can be detected depends on the number of pixels of the camera used. For example, when the surface state of the wire 90 to be measured is not uniform, the reflected light intensity varies in the circumferential direction. Even in such a case, in order to achieve stable detection, the glossy area of the captured image is calculated using a value obtained by averaging the circumferential direction, that is, the diameter of the wire 90. The length in the longitudinal direction to be averaged can be set to an arbitrary value. However, as the range increases, detection becomes impossible when the distance of the unprocessed portion is short, but false detection can be suppressed. By adjusting the averaging range, various measurement objects and processing methods can be handled.

<Evaluation Example 1>
In this evaluation example 1, an example in which a wire material that has undergone chemical conversion treatment or blast treatment as surface treatment is evaluated will be described. When the surface is subjected to chemical conversion treatment or blast treatment, irregularities on the surface of the wire become large. Therefore, as described above, when the processing is performed and the unevenness of the surface of the wire becomes large, light is easily scattered, and the image of the region in the desired surface state becomes black after the binarization processing. For this reason, the glossiness obtained when processing is stably performed is a lower value than the set threshold value. As shown in FIG. 3, here, among the lots A to D, the glossiness of A and B is lower than the threshold value, so that it is determined to be a non-defective product, and the glossiness of C and D is higher than the threshold value.

<Evaluation Example 2>
In this evaluation example 2, an example will be described in which a wire that has been plated as a surface treatment is evaluated. When the surface is plated, irregularities on the surface of the wire are reduced. Therefore, when the processing is performed and the unevenness on the surface of the wire becomes small, the light is not scattered and becomes white after the binarization processing. For this reason, the glossiness obtained when processing is performed stably is higher than the set threshold value. As shown in FIG. 4, here, among the lots A to D, the glossiness of A and B is higher than the threshold value, so that the non-defective product is determined, and the glossiness of C and D is lower than the threshold value.

  That is, in any process, the surface of the wire 90 that is a long object is obtained by binarizing the image that is captured by the camera and read, and the ratio of the area of white and black (gloss area). The state of processing can be determined. Since the evaluation of the surface state based on the glossiness can be performed in real time by image processing, the surface state change in the longitudinal direction can be quantitatively evaluated in a short time in-line. Therefore, even a long object such as the wire rod 90 can be continuously inspected (evaluated) reliably without decreasing the line speed. Thereby, for example, problems such as adhesion peeling due to the remaining outer surface film can be prevented.

  Moreover, the vibration suppression method of the wire 90 by the vibration suppression part 6 is demonstrated. As shown in FIG. 5, in order to restrain the wire 90 within the imaging range of the camera 31, the vibration suppressing unit 6 has a mechanism that suppresses the positional deviation between the y axis and the z axis. Further, by using the rotating body 61 positioned through the elastic body 62 for the vibration suppressing portion 6, it is possible to suppress the consumption of the wire 90 due to friction with the rotating body 61 as much as possible and to continuously manufacture a long object. Is provided. The larger the diameter of the rotating body 61 is, the more the wear can be prevented.

  For example, when evaluating the wire 90 to be blasted as in Evaluation Example 1, it is expected that the vibration will intensify because the blast treatment injects hard fine particles onto the wire 90 and performs surface treatment. However, by providing the vibration suppression unit 6 described above, the vibration of the wire can be suppressed and the surface state can be evaluated stably.

  In addition, since the surface of the wire 90 after the surface treatment that removes the film is activated, the film reattaches to the outer surface when the time after the treatment elapses. Often a protective agent is applied. It is desirable to evaluate the surface condition between the surface treatment process and the surface protective agent application process. However, since vibration occurs in these processes and the wire rod 90 also vibrates, the wire rod 90 does not fit in the captured image. there's a possibility that. However, by providing the vibration suppression unit 6 described above, stable surface state evaluation can be expected. Further, since the rotating body 61 is used for the vibration suppressing unit 6, the rotating body 61 also serves as a feeding mechanism, and a long object such as the wire 90 can be continuously inspected (evaluated) and manufactured.

  As described above, according to the wire rod evaluation device 1 according to the first exemplary embodiment of the present invention, the wire rod evaluation device 1 that evaluates the surface state of the wire rod 90 subjected to the surface treatment in real time, in a predetermined direction (x The image processing unit 4 in which the imaging unit 3 that images the surface of the wire 90 that travels on the surface and the glossiness calculation unit that calculates the glossiness of the surface of the wire based on the image data output from the imaging unit 3 is constructed. ), A surface treatment method (for example, type of blasting, plating, etc.), a threshold value determined according to the material of the wire rod 90, and the calculated glossiness, a surface state for evaluating the surface state of the wire rod 90 Since the evaluation unit (the image processing device 4 constructed) is provided, the surface state of the surface of the wire (for example, the presence or absence of a remaining film) can be obtained even in the long wire 90 whose surface state is not uniform. Can be evaluated. Since the evaluation of the surface state based on the glossiness can be performed by the image processing apparatus 4, the surface state change in the longitudinal direction can be quantitatively inspected in a short time in-line. Therefore, even a long object such as the wire 90 can be continuously inspected reliably without reducing the line speed. Thereby, the wire of a desired surface state can be obtained easily, for example, malfunctions, such as adhesion peeling by the outer surface film | membrane remaining, can be prevented.

  In particular, the imaging unit 3 has a camera 31 that images the surface of the wire 90 and an optical axis Xc that connects the camera 31 and the wire 90 in a plane (yz plane) perpendicular to a predetermined direction (the traveling direction of the wire 90: x). On the other hand, since the two illuminations 32 are arranged so as to illuminate the wire 90 from symmetrical positions, the surface 90 in a wide range with respect to the circumferential direction can be obtained even in the wire 90 having a non-uniform surface state. Can be evaluated.

  In addition, since the vibration suppressing unit 6 that suppresses the vibration of the imaging range portion of the imaging unit 3 of the wire rod 90 is provided, it is possible to accurately evaluate the surface treatment state such as blasting that easily generates vibration. .

Embodiment 2. FIG.
In the wire rod evaluation apparatus according to the second embodiment, a plurality of imaging units are arranged at different positions in the circumferential direction of the wire rod so that the entire circumference of the wire rod can be imaged. 6A and 6B are diagrams for explaining the configuration of the wire rod evaluation apparatus according to the second embodiment. FIG. 6A is a schematic diagram illustrating the entire configuration of the wire rod evaluation apparatus, and FIG. 6B is a traveling direction of the wire rod. FIG. 6 is a diagram for explaining the arrangement of a plurality of imaging units arranged along the wire with respect to the wire rods, in a plane perpendicular to the traveling direction of the wire rods of the three imaging units. In the second embodiment, the description of the same parts as those of the first embodiment will be omitted, and FIGS.

  As illustrated in FIG. 6A, in the wire rod evaluation apparatus 1 according to the second embodiment, a plurality of (three) image capturing units 3 (the image capturing unit 3 </ b> A, the image capturing unit 3 </ b> B, and the image capturing unit 3 </ b> C) are connected to the wire 90. They are lined up along the direction of travel. 6B, the position of the optical axis Xc of the camera 31 in each imaging unit 3 in the circumferential direction of the wire 90 (the angle of the optical axis Xc on the yz plane with the wire 90 as the center). Are different from each other. However, the angle (relative position) of the illumination 32 (its optical axis Xs) with respect to the camera 31 (its optical axis Xc) is the same in any imaging unit. That is, in order to arrange | position the 2 illumination 32 with respect to the one camera 31, in this Embodiment 2, the illumination 32 of the number of cameras x2 will be installed.

  Thereby, for example, when the wire 90 is like a rope having a circular cross-sectional shape, the range of the evaluation target can be increased. For example, in FIG. 6B, the cameras 31 of the imaging units 3A to 3C have positions at which the optical axis Xc is 0, 4 and 8 o'clock so as to change at intervals of 120 ° around the wire 90, respectively. The case where it is installed as shown is shown. As described in the first embodiment, since the imaging range of the camera 31 arranged so as to be able to perform suitable imaging is equivalent to 120 ° in the circumferential direction of the wire rod 90, three sets of the imaging units 3 are used in this way. The entire circumference of the wire rod 90 can be imaged and evaluated. In addition, in order to avoid the reflection of the background in each imaging | photography range of the three cameras 31, it is desirable to arrange | position the camera 31 mutually spaced along the traveling direction of the wire 90. FIG.

  For the vibration suppression unit 6 as well, for example, when the rigidity of the wire 90 is low, it is desirable to arrange a total of four locations between the cameras 31 in order to restrain the wire 90 within the imaging range of each camera 31.

  As described above, according to the wire rod evaluation apparatus 1 according to the second embodiment, a plurality of imaging units having different angles of the optical axis Xc on the plane (yz plane) perpendicular to the traveling direction (x) of the wire rod 90 are provided. For example, even when the wire 90 is like a rope having a circular cross-sectional shape, the range of the evaluation target can be increased.

Embodiment 3 FIG.
The third embodiment is characterized in that the wire 90 has a rotation mechanism so that the wire 90 itself passes through the wire evaluation device 1 while rotating. By rotating the wire 90, the evaluation range of one camera 31 can be widened. However, as described in Embodiment 2, the present invention may be applied when a plurality of imaging units are arranged.

  As described above, according to the wire rod evaluation apparatus 1 according to the third embodiment, since the rotation mechanism that rotates the wire rod 90 about the axis of the wire rod 90 is provided, the evaluation range of one camera 31 is widened. be able to.

Embodiment 4 FIG.
In the second and third embodiments, the configuration for expanding the evaluation range of the wire has been described with respect to the first embodiment. In the fourth embodiment, a configuration for specifying a part where a defect is found in the surface treatment will be described. FIG. 7 is a schematic diagram showing the overall configuration of the wire rod evaluation apparatus according to the fourth embodiment. FIG. 7 basically shows a configuration in which a defective portion is marked in the wire rod evaluation apparatus of FIG. 1 described in the first embodiment. Therefore, in this Embodiment 4, description is abbreviate | omitted about the part similar to Embodiment 1, and FIG.

  As shown in FIG. 7, the wire rod evaluation apparatus 1 according to the fourth embodiment is provided with a marking portion 71 that marks a defective portion on the downstream side of the wire rod evaluation apparatus 1 when the surface state is insufficient. Is. As the marking method, a method capable of instantaneously discriminating a defective portion by visual observation is desirable thereafter, and includes spraying of color spray, pasting of a tag or a seal, and the like. By adding such a mechanism, not only during the surface treatment, but also after the surface treatment, the defective portion can be identified visually, and repair can be easily performed.

  Alternatively, it is possible to use only the wire 90 having a desired surface state through a selection process for excluding the marked portion after the surface treatment.

  In the fourth embodiment, the example in which the marking function is added to the wire rod evaluation apparatus described in the first embodiment has been described. However, the present invention is not limited to this example. For example, the second, third, or a combination thereof is possible. You may make it add to a thing.

  As described above, according to the wire rod evaluation apparatus 1 according to the fourth embodiment, since the wire rod 90 is configured to include the marking portion 71 that marks a portion of the wire rod 90 where the surface state is evaluated to be defective, Not only, but also after manufacturing, a defective part can be identified visually and repair can be performed easily.

  As described above, according to the surface treatment method for a wire according to the fourth embodiment, using the surface treatment process for performing a predetermined surface treatment on the wire 90 and the wire rod evaluation apparatus 1 according to the fourth embodiment, A surface state evaluation step of evaluating a surface state of the wire rod 90 subjected to the surface treatment and marking a portion where the surface state is evaluated to be defective. The marked portion of the wire rod 90 is again included. Since it comprised so that the reprocessing process to repair or the selection process to exclude may be included, the wire of a desired surface state can be obtained easily.

Embodiment 5 FIG.
The wire rod evaluation apparatus according to the fourth embodiment has been described with respect to the configuration for displaying (marking) the portion where the defect has been detected on the wire rod itself. In the wire rod evaluation apparatus according to the fifth embodiment, a configuration for the apparatus itself to recognize a portion where a defect in the wire is detected will be described. FIG. 8 is a schematic diagram showing the overall configuration of the wire rod evaluation apparatus according to the fifth embodiment. FIG. 8 basically shows a configuration in which a marked portion is added to the wire rod evaluation apparatus of FIG. 7 described in the fourth embodiment. Therefore, in this Embodiment 5, description is abbreviate | omitted about the part similar to Embodiment 4, and FIG. 2-5 used by description of Embodiment 1 is also used.

  As shown in FIG. 8, the wire rod evaluation apparatus 1 according to the fifth embodiment includes the marking unit 71 used in the fourth embodiment and a position for reading the marked position, which is arranged downstream of the marking unit 71. A defective position recognition unit 7 including a reading unit 72 is provided.

  The position reading unit 72 reads the marking on the surface of the wire rod 90 and recognizes it as, for example, the position of the wire rod 90 in the long (running) direction (for example, the distance from the winding start portion of the wire rod 90). The reading method can be appropriately changed according to the type of marking, such as optical reading, magnetic reading, or a physical shape such as unevenness. Thereby, it can finish in a product with a sufficient yield, without using a defective location.

  In the above example, the position reading unit 72 recognizes the position based on the marking attached to the wire 90, but is not limited thereto. For example, it may be constructed on software so that the position is calculated based on the time from passing through the imaging unit 3 until it is determined to be defective and the traveling speed of the wire 90.

  At that time, if a reprocessing device capable of performing reprocessing for repairing a defective portion is arranged downstream of the wire rod evaluation device 1, only the portion recognized as defective can be reprocessed.

  Or you may arrange | position the apparatus which classify | selects so that a defective part may be deleted based on the positional information.

Embodiment 6 FIG.
The wire rod evaluation apparatus according to the sixth embodiment is configured to have a function of sending back to the surface treatment apparatus during the manufacturing process in order to reprocess the portion where the defect is detected. FIG. 9 is a schematic diagram showing the overall configuration of the wire rod evaluation apparatus according to the sixth embodiment. FIG. 9 basically includes a drive device and a surface treatment device added to the wire rod evaluation device of FIG. 8 described in the fifth embodiment. Therefore, in this Embodiment 6, description is abbreviate | omitted about the part similar to Embodiment 5, and FIG. 2-5 used by description of Embodiment 1 is also used.

  As shown in FIG. 9, the wire rod evaluation apparatus 1 according to the sixth embodiment includes a surface treatment device 100 between a winding drum 8 </ b> F and a winding drum 8 </ b> W that constitute a drive system 8 that drives a wire rod 90. It is arranged to be linked. If it is determined that the image processing is defective, the drive system 8 returns the portion recognized by the defect position recognition unit 7 to the surface processing apparatus 100 again, and the defective portion is subjected to surface treatment again. By adding such a mechanism, all of the wire rods 90 wound around the winding drum 8W become non-defective products. In the drawing, reference numeral 90r denotes a wire before surface treatment by the surface treatment apparatus 100.

  When returning the defective portion to the surface treatment apparatus 100, for example, a control unit (not shown) that controls the drive system 8 is linked with the defect position recognition unit 7 and the defective portion and the surface treatment apparatus 100 when the defect is recognized. The wire 90 is controlled to be rewound according to the distance up to.

  As described above, according to the wire rod evaluation apparatus 1 according to the sixth embodiment, the drive system 8 of the wire rod 90 is configured to send the defective portion back to the surface treatment apparatus 100 when a defect is found. The surface state wire 90 can be easily obtained.

  That is, a surface treatment process for performing a predetermined surface treatment on the wire 90 and a surface condition evaluation process for evaluating the surface condition of the wire 90 subjected to the surface treatment using the wire rod evaluation apparatus 1 according to the first to fifth embodiments. And a reprocessing step in which the surface treatment is performed again on the portion when the surface state is evaluated to be defective in the surface state evaluation step, the desired surface without the defective portion The wire 90 in a state can be easily obtained.

  1: wire rod evaluation device, 2: casing, 3: imaging unit, 4: image processing device (gloss degree calculation unit, surface state evaluation unit), 5: image display unit, 6: drive system, 6F: unwinding drum, 6: Vibration suppression unit, 6W: Winding drum, 7: Position detection unit, 8: Surface treatment device, 31: Camera, 32: Illumination, 33: Dimmer, 61: Rotating body, 71: Marking unit, 72: Position reading unit, 90: wire rod, Xc: optical axis of camera, Xs: optical axis of illumination.

Claims (8)

A wire rod evaluation apparatus that evaluates in real time the surface state of a wire rod subjected to surface treatment,
An imaging unit that images the surface of the wire traveling in a predetermined direction;
Based on image data output from the imaging unit, a glossiness calculating unit that calculates the glossiness of the surface;
A surface condition evaluation unit that evaluates the surface condition of the wire based on the threshold value determined according to the surface treatment method and the material of the wire, and the calculated glossiness;
A wire rod evaluation apparatus comprising: The imaging unit
A camera that images the surface of the wire;
Two lights arranged to illuminate the wire from a symmetrical position with respect to an optical axis connecting the camera and the wire on a plane perpendicular to the predetermined direction;
The wire rod evaluation apparatus according to claim 1, comprising:   The wire rod evaluation apparatus according to claim 2, further comprising a plurality of imaging units having different angles of the optical axis on a plane perpendicular to the predetermined direction.   The wire rod evaluation apparatus according to claim 1, further comprising a vibration suppressing unit that suppresses vibration of an imaging range portion of the imaging unit of the wire rod.   The wire rod evaluation apparatus according to any one of claims 1 to 4, further comprising a rotation mechanism that rotates the wire rod around an axis of the wire rod.   The wire rod evaluation apparatus according to any one of claims 1 to 5, further comprising a marking portion that marks a portion of the wire rod that is evaluated as having a poor surface condition. A surface treatment process for performing a predetermined surface treatment on the wire;
Using the wire rod evaluation apparatus according to any one of claims 1 to 6, a surface state evaluation step for evaluating a surface state of the wire subjected to the surface treatment;
When there is a portion where the surface state is evaluated as poor in the surface state evaluation step, a reprocessing step for performing the surface treatment again on the portion;
A surface treatment method for a wire, characterized by comprising: A surface treatment process for performing a predetermined surface treatment on the wire;
Using the wire rod evaluation apparatus according to claim 6, the surface state of the wire that has been subjected to the surface treatment is evaluated, and a surface state evaluation step that marks a portion where the surface state is evaluated as defective,
A screening step of excluding the marked part of the wire,
A surface treatment method for a wire, characterized by comprising:

Images