JP2015000920A - Filler for encapsulant and encapsulant using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a filler for an encapsulant, which can realize an encapsulant capable of exhibiting high performance.SOLUTION: Provided is a particulate material which comprises an inorganic material and charges positively, and is used contained in an encapsulant for encapsulating a part where dissimilar metals join or contact. When dissimilar metals join or contact, due to a difference in ionization tendencies, one metal having a higher ionization tendency becomes dissolved and the dissimilar metals as a whole charge negatively. Therefore, when a material which charges positively is employed as a particulate material contained in an encapsulant, it is attracted by a negative charge on the dissimilar metal surface, enabling distribution thereof in a neighborhood of the dissimilar metal surface. On the contrary, when a negatively charged material is employed, it repels the charge on the dissimilar metal surface, and there have been cases where density of the particulate material on the dissimilar metal surface becomes smaller.

Description

  The present invention relates to a sealing material and a filler for sealing material constituting the sealing material.

  Conventionally, an integrated circuit has been sealed with a sealing material in order to reduce external influences. By sealing with a sealing material, the influence from moisture, oxygen, etc. existing in the environment can be reduced, and protection from external stress is also provided. The sealant is also important for the purpose of transferring the heat generated from the inside to the outside.

  Therefore, it is desired that the sealing material is chemically stable as well as high mechanical performance. Therefore, what dispersed inorganic substances, such as a silica and an alumina, in the resin composition is used widely. An inorganic material is excellent in mechanical strength and has high chemical stability, and when it is contained in a sealing material, high performance can be expressed (see Patent Document 1).

  In recent years, miniaturization is progressing in integrated circuits, and it is more susceptible to external influences than in the past. Therefore, provision of the sealing material which can express performance higher than before is calculated | required.

JP 2012-206870 A

  The present invention has been completed in view of the above circumstances, and a problem to be solved to provide a sealing material capable of exhibiting higher performance than before, and a sealing material filler capable of realizing such a sealing material. To do.

(1) A filler for a sealing material that solves the above problems is a positively charged particle material made of an inorganic material, and is used by being included in a sealing material that seals a portion where a dissimilar metal is bonded or contacted. is there.

  When dissimilar metals are joined or contacted, one metal having a high ionization tendency is melted due to the difference in ionization tendency, and the entire dissimilar metal is negatively charged. Therefore, when a positively charged particle material is used as the particle material included in the sealing material, it is attracted by the negative charge on the surface of the dissimilar metal and can be distributed near the surface of the dissimilar metal. On the other hand, when a negatively charged particle material is employed, the charge on the surface of the dissimilar metal is repelled, and the density of the particle material on the surface of the dissimilar metal may be reduced.

When adopting the above-described configuration (1), one or more of the following configurations (2) to (4), (7), and (8) can be added. When the configuration (4) is employed, the configuration (5) can be employed. Moreover, when employ | adopting the structure of (3)-(5), the structure of (6) is employable.
(2) The surface potential of the particulate material is 30 mV or more. (3) It has a residue selected from amine, phosphine, ammonium, and phosphonium on the surface. (4) The inorganic substance is a metal oxide, and the particle material is treated with a surface treatment agent having a positively charged residue. (5) The surface treatment agent is a silane coupling agent having the residue selected from amine, phosphine, ammonium, and phosphonium. (6) The residue is a tertiary amine or a tertiary phosphine. (7) The particle material has a particle size of 3 μm or less. (8) The sealing material contains an epoxy resin in which the particulate material is dispersed.
(9) The sealing material which solves the said subject has the above-mentioned filler for sealing materials, and the resin composition which disperse | distributes the said filler for sealing materials.

  When the filler for a sealing material of the present invention is used for a sealing material, the filler is more evenly dispersed and can provide a sealing material having high performance.

It is a graph which shows the surface potential of the test sample of Test Examples 9a-9h. It is a graph which shows the surface potential of the test sample of Test Examples 10a-10g. It is a graph which shows the surface potential of the test sample of Test Examples 11a-11g.

  The filler for sealing material and the sealing material of this invention are demonstrated in detail based on the following embodiment. The sealing material of this embodiment is composed of a filler for sealing material, a resin composition in which the filler for sealing material is dispersed, and other materials selected as necessary. The mixing ratio of the filler for sealing material and the resin composition is not particularly limited, and the mixing ratio can be set so that necessary performance can be exhibited. The greater the amount of filler for sealing material, the lower the linear expansion coefficient, and the easier it is to adjust to the mechanical properties of the silicon wafer. Moreover, physical properties such as heat resistance tend to improve as the amount of filler increases, and flexibility tends to improve as the amount of the resin composition increases. For example, the content of the filler for sealing material can be 50% or more based on the total mass.

This sealing material is a material that seals a portion where a different metal contacts or joins. Different metals have different ionization tendency. For example, a combination of copper and tin can be mentioned. Copper and copper alloys are widely used as materials constituting wirings and vias, and tin and tin alloys are widely used as solder for joining the wirings and vias. Here, “the dissimilar metals are in contact with or joined to each other” means that it is sufficient that the dissimilar metals are adjacent to each other, and it does not matter what state the two metals are in. When a different kind of metal contacts or joins (hereinafter abbreviated as “joining” as appropriate), the metal with the higher ionization tendency elutes and the different kind of metal is joined negatively.
-Filler for encapsulant The filler for encapsulant is a particle material that is composed of an inorganic material and is positively charged.

It does not specifically limit as an inorganic material, An inorganic oxide, an inorganic nitride, an inorganic carbide etc. are illustrated. Examples of the inorganic material include silica, alumina, titania, zirconia, tin oxide, zinc oxide, antimony pentoxide, indium oxide, and composite oxides thereof. Silica and alumina are particularly desirable. The form of the particulate material is not particularly limited, but it is desirable that the sphericity is high. When the sphericity is high, the fluidity is improved when the encapsulant is prepared by being dispersed in the resin composition, and the filling rate of the encapsulant filler in the encapsulant can be improved. The sphericity is preferably 0.8 or more, more preferably 0.9 or more, and more preferably 0.95 or more. The sphericity is taken as a value calculated by (Sphericality) = {4π × (Area) ÷ (Ambient length) ² } from the observed area and circumference of the particle by SEM. The closer to 1, the closer to a true sphere. Specifically, an average value measured for 100 particles using an image processing apparatus (Spectris Co., Ltd .: FPIA-3000) is employed.

  The production method of the particulate material is not particularly limited. For example, the inorganic material constituting the particulate material is pulverized to obtain the required particle size, and the obtained particulate material is poured into a flame having a temperature equal to or higher than the melting point of the inorganic material constituting the particulate material and melted. And a method of obtaining a particulate material having a high sphericity by cooling and a method of using a chemical reaction such as hydrolysis using a metal, a metal alkoxide, a metal halide or the like as a raw material. Further, when an inorganic oxide is adopted as the inorganic material, the material before oxidation constituting the inorganic oxide (if the inorganic oxide is a metal oxide, the metal itself, for example, silica, metal silicon, alumina In this case, aluminum and metal zirconium in the case of zirconia) are formed into particles, and the particles are put into an oxygen-containing atmosphere and ignited to ignite, whereby an inorganic oxide having a high sphericity can be obtained.

  The particle size of the particulate material is not particularly limited. It is desirable that the particle size be smaller than the size of the gap to be entered in the object using the sealing material. For example, the particle size is desirably 5 μm or less, more desirably 3 μm or less, and further desirably 1 μm or less. In addition, it is desirable that the abundance of coarse particles having a certain particle size or more is limited. For example, the lower limit of the grain size of the coarse particles is desirably 20 μm, more desirably 10 μm, and even more desirably 5 μm. The content of the coarse particles is desirably 1000 ppm or less, more desirably 100 ppm or less, and further desirably 10 ppm or less, based on the mass of the entire particulate material.

  The method for positively charging the particulate material is not particularly limited. The particulate material is positively charged at least when it is dispersed in the resin composition constituting the sealing material. The surface of the particle material can be positively charged by introducing a residue having a positive charge on the surface of the particle material or coating with a positively charged material.

  Residues introduced to positively charge the surface of the particle material have a positive charge, or a component constituting a sealant (having a positive charge or can generate a positive charge) It is sufficient to be able to introduce a positive charge by associating with an ion) or to be able to introduce a positive charge by associating with an ion present in the use atmosphere. For example, a residue selected from ammonium and phosphonium that are in a charged state can be exemplified. Amine and phosphine can have a positive charge by taking an association state of ammonium or phosphonium type in the use atmosphere by associating with components constituting the sealant or ionic molecules present in the use atmosphere. In other words, primary, secondary, and tertiary ammonium (or phosphonium) that are positively charged are introduced by introducing the corresponding primary, secondary, and tertiary amine (or phosphine) into the particle material surface. It may occur in. In particular, tertiary or quaternary ammonium (or phosphonium) is desirable, and tertiary ammonium (or phosphonium) is more desirable. In particular, when an epoxy resin is employed as a resin composition to be described later, it is desirable to employ a tertiary resin because the progress of undesired curing can be suppressed.

  A method for introducing these residues into the surface of the particulate material is illustrated. For example, the residue is introduced by treating the surface of the particle material with a surface treatment agent such as a silane coupling agent. The surface treatment agent is a compound that binds to the surface of the particle material and has the above-mentioned residue in the molecule, or it does not have the above-mentioned residue in the molecule as it is but reacts with the surface of the particle material. Can give compounds that produce the aforementioned residues. Specific examples include silane coupling agents having the above-described residues. Furthermore, treatments other than positively charging the surface of the particulate material can be performed. For example, the hydrophobicity can be improved, the hydrophilicity can be improved, and a highly reactive functional group such as a vinyl group or an epoxy group can be introduced.

Preferable silane coupling agents include general formula (1): (R ₂ N—R—) _n SiZ _4-n , general formula (2): nX ⁻ · (R ₃ N ⁺ —R—) _n SiZ _4-n , General formula (3): (R ₂ P—R—) _n SiZ _4-n , general formula (4): nX ⁻ · (R ₃ P ⁺ —R—) _n SiZ _4-n can be exemplified (R is In each of the same molecule and between different molecules, hydrogen, a hydrocarbon group, and a part of carbon and / or hydrogen of the hydrocarbon group, which can be independently selected, are substituted with oxygen and / or nitrogen, Two or three or more Rs may be combined to form a cyclic structure, and it is desirable that R be a smaller number of hydrogen atoms, for example, secondary or tertiary amines (ammonium, phosphine, or Select R to be phosphonium) Preferably, R is selected so as to be a tertiary amine (ammonium, phosphine, or phosphonium), and Z can be independently selected in the same molecule or between different molecules. A functional group, which can be selected from halogen, alkoxy group, alkyl group, hydrogen, X is a counter ion of N ⁺ , P ⁺ , n is one of 1, 2, 3 and in particular 1 It is desirable.) In particular, it is desirable to employ a silane coupling agent of the general formulas (1) and (3) that does not contain counter ions. Furthermore, other silane coupling agents can be used in combination.

  Examples of desirable silane coupling agents include N, N-bis (hydroxyethyl) aminopropyltrialkoxysilane, 3- (2-imidazolin-1-yl) propyltrialkoxysilane, 2- (diphenylphosphino) ethyltrialkoxy. Examples include silane, 3-aminopropyltrialkoxysilane, a salt of trialkyl (3-trialkoxysilylpropyl) ammonium, and a salt of octadecyldimethyl (3-trialkoxysilylpropyl) ammonium. Examples of the salt include a halogen salt.

  The amount of the surface of the particulate material to be treated with the silane coupling agent is preferably such that the surface potential of the surface of the particulate material after the treatment is 0 mV or more. Since it is impossible to measure the surface potential in a scientifically strict sense, the surface potential was defined as the zeta potential obtained by dynamic light scattering electrophoresis. Specifically, the measurement was performed using a zeta potential measurement system ELSZ-1 manufactured by Otsuka Electronics Co., Ltd. For example, when the surface potential of the particulate material in isopropyl alcohol is about -50 mV, the surface potential of the surface of the particulate material after treatment is more preferably -20 mV or more, and further preferably +30 mV or more. . If the surface potential can be set to around 0 mV, it can be a filler that does not segregate even if the reverse phenomenon of segregation, which is a problem in this case, occurs. In addition, since the electrostatic repulsion between particle | grains can be anticipated when an electric charge exists on the surface, the dispersibility of the amount of particle materials improves and the cohesiveness of particle material can be reduced.

  The method for treating the particulate material with a silane coupling agent is not particularly limited. For example, a method of bringing a silane coupling agent into contact with the surface of a dried particulate material, and a method of bringing a silane coupling agent into contact in some liquid dispersion medium can be mentioned. Although it does not specifically limit as a dispersion medium, Water and / or an organic solvent can be illustrated.

  Examples of the organic solvent include hydrophilic solvents including alcohols such as methanol, ethanol, propanol and 2-propanol (IPA), esters such as methyl acetate, ethyl acetate and isopropyl acetate, propylene glycol monomethyl ether, ethyl when ethylene glycol is used. Examples include ethers such as ether, ketones such as acetone and methyl ethyl ketone, and hydrophobic solvents such as toluene. These may be used singly or in combination of two or more.

  The particle material is preferably in the range of 1 to 80 mass%, more preferably 10 to 60 mass% in the dispersion medium based on the total mass. When the amount of the particle material is equal to or higher than the above lower limit, productivity is increased, and when the amount of the particle material is equal to or lower than the above upper limit, aggregation between particles can be suppressed.

The surface-treated particle material is obtained as a solid (powder) when prepared by contacting the particle surface with a silane coupling agent, so it may be used as it is or dispersed in some dispersion medium. It may be used later. In addition, when a dispersion medium is used during the treatment, the surface-treated particle material may be used while leaving all or part of the dispersion medium used during the treatment. The dispersion medium may be used additionally, or may be used as a dried solid (powder) state by removing the dispersion medium by an appropriate method, and the obtained solid is dispersed again in the dispersion medium. It may be used later.
-Resin composition A resin composition disperse | distributes the above-mentioned filler for sealing materials. The resin composition includes those before curing. That is, the meaning of the composition which produces | generates resin is also included besides the composition containing resin. In the case of being uncured, those in which the polymerization reaction proceeds by heat, light or the like can be mentioned. Examples of the resin composition include an organic resin composition and a silicone resin composition. In particular, a thermosetting resin can be exemplified as a desirable one.

  When mixing the filler for sealing materials described above with the resin composition, the filler may be added to the resin composition in a dry solid (powder) state, or may be added in a state dispersed in a dispersion medium. The resin composition to which the filler is added may or may not contain a solvent or a dispersion medium. When it is desirable that the resin composition does not contain a solvent or dispersion medium, these components can be removed by an appropriate method so that the resin composition does not contain a solvent or dispersion medium.

  Further, the resin composition may contain a solvent or a dispersion medium contained for the purpose of adjusting the viscosity and reactivity of the resin composition. When a solvent or a dispersion medium is used at the time of mixing, it is preferable to obtain the same effect by leaving all or a part of these, and a solvent or a dispersion medium may be further added.

  The organic resin composition includes epoxy resin, urethane resin, melamine resin, silicon resin, butyral resin, reactive silicone resin, phenol resin, unsaturated polyester resin, thermosetting acrylic resin, UV curable acrylic resin, etc. And thermoplastic resins such as an adhesive resin, polyester resin, polycarbonate resin, polyamide resin, polyphenylene oxide resin, thermoplastic acrylic resin, vinyl chloride resin, fluororesin, vinyl acetate resin, and silicone rubber. In particular, a thermosetting resin is preferable, and an epoxy resin is preferable among them.

  Hereinafter, the sealing material and the filler for sealing material of the present invention will be described in detail based on examples.

(experimental method)
-Wet surface treatment 1000 parts by mass of particulate material was suspended in isopropyl alcohol (IPA) as a dispersion medium of 1000 parts by mass to obtain a 50% slurry. A predetermined amount of the surface treatment agent was added thereto and mixed well. Then, it heated at 120 degreeC, the reaction was completed, a dispersion medium was removed, and it was set as the filler for sealing materials by grind | pulverizing the obtained solid substance with a mixer.
-Dry surface treatment 1000 parts by mass of the particulate material was placed in a mixer, and a predetermined amount of the surface treatment agent was added while stirring and mixed well. Then, it was set as the filler for sealing materials by sealing at room temperature for 24 hours, and completing reaction.
-Measurement of surface potential 0.5 parts by mass of filler for sealing material was suspended in 1000 parts by mass of IPA to form a 0.05% slurry. Using this as a test sample, the zeta potential was measured by dynamic light scattering electrophoresis (manufactured by Otsuka Electronics Co., Ltd., zeta potential measurement system, ELSZ-1), and this value was taken as the surface potential of the filler for sealing material.
・ Measurement of sealing material viscosity 6 parts by weight of filler for sealing material and 4 parts by weight of BisA / BisF epoxy mixture (corresponding to resin composition: manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., ZX-1059) were mixed well. A sealing material containing 60% by mass of a filler was obtained. The viscosity was measured using a rotary rheometer (TA Instruments, ARES-G2).
-Measurement of other physical properties The average particle diameter was measured by the light scattering method. The specific surface area was measured by the BET method using nitrogen. The amount of carbon was measured by a combustion method in an oxygen stream. The electrical conductivity and hydrogen ion concentration were measured for a solution obtained by immersing 1 g of a solidified product obtained by solidifying the sealing material in 10 mL of water at 25 ° C. for 1 hour. The amount of chlorine was measured by atomic absorption spectrometry.

(Test Example 1)
N, N-bis (hydroxyethyl) aminopropyltriethoxysilane (manufactured by Gelest (USA), SIB1140.0) is used as a surface treatment agent, and silica as a particle material (average particle size 0.5 μm, manufactured by Admatechs Co., Ltd.) ) With respect to 1% by mass. The obtained sample was used as a filler for sealing material of this test example.

(Test Example 2)
Test example, except that 3- (2-imidazolin-1-yl) propyltriethoxysilane (manufactured by Gelest (USA), SIT8187.5) was used as the surface treatment agent and dry surface treatment was adopted as the treatment method 1 was performed. The obtained sample was used as a filler for sealing material of this test example.

(Test Example 3)
Similar to Test Example 1 except that 2- (diphenylphosphino) ethyltriethoxysilane (manufactured by Gelest (USA), SID4558.0) was used as the surface treatment agent, and dry surface treatment was adopted as the treatment method. Processed. The obtained sample was used as a filler for sealing material of this test example.

(Test Example 4)
The same treatment as in Test Example 1 was performed, except that 3-aminopropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., KBM-903) was used as the surface treatment agent and dry surface treatment was adopted as the treatment method. The obtained sample was used as a filler for sealing material of this test example.

(Test Example 5)
The same treatment as in Test Example 1 was performed except that trimethyl (3-trimethoxysilylpropyl) ammonium chloride (Gerest (USA), SIT8415.0) was used as the surface treating agent. The obtained sample was used as a filler for sealing material of this test example.

(Test Example 6)
The same treatment as in Test Example 1 was performed except that octadecyldimethyl (3-trimethoxysilylpropyl) ammonium chloride (Gerest (USA), SIO6620.0) was used as the surface treating agent. The obtained sample was used as a filler for sealing material of this test example.

(Test Example 7)
The particulate material before being treated with the surface treating agent used in Test Example 1 was directly used as the filler for sealing material in this Test Example.

(Test Example 8)
Similar to Test Example 1 except that 3- (2,3-epoxypropoxy) propyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., KBM-403) was used as the surface treatment agent, and dry surface treatment was adopted as the treatment method. Was processed. The obtained sample was used as a filler for sealing material of this test example.

(Test Examples 9a to 9h)
A predetermined amount of N, N-bis (hydroxyethyl) aminopropyltriethoxysilane (manufactured by Gelest (USA), SIB1140.0) is used as a surface treatment agent, and silica as an average particle material (average particle size 0.5 μm, Inc. Wet treatment was performed on Admatechs).

  Thereafter, dry processing was performed using a predetermined amount of 3- (2,3-epoxypropoxy) propyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., KBM-403). The obtained sample was used as a filler for sealing material of this test example.

  The respective treatment amounts of (N, N-bis (hydroxyethyl) aminopropyltriethoxysilane) and (3- (2,3-epoxypropoxy) propyltrimethoxysilane) are described for each test example.

  Test Example 9a (0.0%, 1.0%), Test Example 9b (0.05%, 0.95%), Test Example 9c (0.10%, 0.90%), Test Example 9d (0 .20%, 0.80%), Test Example 9e (0.30%, 0.70%), Test Example 9f (0.50%, 0.50%), Test Example 9g (0.70%, 0) .30%), Test Example 9h (1.0%, 0.0%). Here, Test Example 9a is the same test sample as Test Example 8, and Test Example 9h is the same as the test sample of Test Example 1.

(Test Examples 10a to 10g)
A predetermined amount of 3- (2-imidazolin-1-yl) propyltriethoxysilane (Gerest (USA), SIT 8187.5) was used as a surface treatment agent, and silica as a particulate material (average particle size 0.5 μm, stock) Wet treatment was performed on the product manufactured by Admatechs.

  Thereafter, dry processing was performed using a predetermined amount of 3- (2,3-epoxypropoxy) propyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., KBM-403). The obtained sample was used as a filler for sealing material of this test example.

  Hereinafter, the respective treatment amounts of (3- (2-imidazolin-1-yl) propyltriethoxysilane) and (3- (2,3-epoxypropoxy) propyltrimethoxysilane) are described for each test example.

  Test Example 10a (0.0%, 1.0%), Test Example 10b (0.10%, 0.90%), Test Example 10c (0.20%, 0.80%), Test Example 10d (0 .30%, 0.70%), Test Example 10e (0.40%, 0.60%), Test Example 10f (0.60%, 0.40%), Test Example 10g (1.0%, 0 0.0%). Here, Test Example 10a is the same test sample as Test Example 8, and Test Example 10g is the same as the test sample of Test Example 2.

(Test Examples 11a to 11g)
A predetermined amount of octadecyldimethyl (3-trimethoxysilylpropyl) ammonium chloride (Gerest (USA), SIO6620.0) was used as a surface treatment agent, and silica as a particle material (average particle size 0.5 μm, Admatechs Co., Ltd.) Wet treatment was carried out.

  Thereafter, dry processing was performed using a predetermined amount of 3- (2,3-epoxypropoxy) propyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., KBM-403). The obtained sample was used as a filler for sealing material of this test example.

  The respective treatment amounts of (octadecyldimethyl (3-trimethoxysilylpropyl) ammonium chloride) and (3- (2,3-epoxypropoxy) propyltrimethoxysilane) are described for each test example.

  Test Example 11a (0.0%, 1.0%), Test Example 11b (0.10%, 0.90%), Test Example 11c (0.20%, 0.80%), Test Example 11d (0 .30%, 0.70%), Test Example 11e (0.40%, 0.60%), Test Example 11f (0.60%, 0.40%), Test Example 11g (1.0%, 0 0.0%). Here, Test Example 11a is the same test sample as Test Example 8, and Test Example 11g is the same as the test sample of Test Example 6.

(result)
-About the test samples 1-8, each of the surface potential, the volume average particle diameter, the specific surface area, the carbon content, the electrical conductivity, the chlorine content, and the sealing material viscosity was measured. The results are shown in Table 1.

As is apparent from the table, it was possible to charge the sealing material filler positively by using a positively chargeable compound as the silane coupling agent. In this test example, an epoxy resin was used as the resin composition, so that the viscosity increased as the amount of chlorine increased with Test Example 1 and Test Example 6; It has been found that the progress of the viscosity, that is, the lower the amount of chlorine, can suppress the increase in viscosity in combination with the epoxy resin.
-The surface potential of the filler for sealing materials obtained for Test Examples 9a to 9h was measured. The results are shown in FIG.

As is apparent from FIG. 1, the surface potential increases as the proportion of the specific treatment agent (N, N-bis (hydroxyethyl) aminopropyltriethoxysilane) increases.
-The surface potential of the filler for sealing materials obtained for Test Examples 10a to 10g was measured. The results are shown in FIG.

As apparent from FIG. 2, it became clear that the surface potential increased as the proportion of the specific treatment agent (3- (2-imidazolin-1-yl) propyltriethoxysilane) increased.
-The surface potential of the filler for sealing materials obtained for Test Examples 11a to 11g was measured. The results are shown in FIG.

As apparent from FIG. 3, it became clear that the surface potential increased as the proportion of the specific treatment agent (octadecyldimethyl (3-trimethoxysilylpropyl) ammonium chloride) increased.
-From the above result, it became clear that the surface potential of the filler for sealing materials can be controlled by controlling the type and amount of the surface treatment agent.

Claims (9)

It is a particle material that is composed of inorganic substances and is positively charged.
It is used by being included in a sealing material that seals a site where a dissimilar metal is bonded or contacted.
Sealant filler.   The filler for sealing materials according to claim 1 whose surface potential of said particulate material is 30mV or more.   The filler for sealing materials according to claim 1 or 2 which has on the surface a residue selected from amine, phosphine, ammonium and phosphonium. The inorganic substance is a metal oxide;
The particulate material is treated with a surface treatment agent having a positively charged residue,
The filler for sealing materials in any one of Claims 1-3. The surface treatment agent is a silane coupling agent having the residue selected from amine, phosphine, ammonium, and phosphonium.
The filler for sealing materials according to claim 4.   The filler for a sealing material according to any one of claims 3 to 5, wherein the residue is a tertiary amine or a tertiary phosphine.   The filler for sealing materials according to any one of claims 1 to 6, wherein the particle material has a particle size of 3 µm or less.   The filler for sealing material according to any one of claims 1 to 7, wherein the sealing material contains an epoxy resin in which the particulate material is dispersed.   The sealing material which has the filler for sealing materials of any one of Claims 1-8, and the resin composition which disperse | distributes the said filler for sealing materials.

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